JP2022037304A - Machine component with sensor and manufacturing method for machine component with sensor - Google Patents

Abstract

To join a sensor and a machine component together with greater strength while preventing the breakage of the sensor.SOLUTION: Provided is a machine component with a sensor, comprising: a machine component including a metal detection object; a sensor for detecting strain; and a metal plate for propagating the strain of the detection object to the sensor. The sensor includes a metal joint on the surface on the metal plate side, and the metal plate is in the state of being fixed to the detection object by welding, solid phase bonding or soldering material. The joint is in the state of being solid phase bonded to the metal plate, and the solid phase bondable temperature of the metal plate and the joint is lower than the solid phase bondable temperature when the detection object and the joint are solid phase bonded.SELECTED DRAWING: Figure 1

Description

The present invention relates to a mechanical part with a sensor and a method for manufacturing a mechanical part with a sensor.

A technique is known in which a strain sensor is attached to a mechanical component (for example, a rolling bearing) to detect the state of the mechanical component. For example, Patent Document 1 discloses a strain gauge disposed on an outer ring of a rolling bearing. The strain gauge of Patent Document 1 is fixed to the bottom surface of the notch formed on the outer peripheral surface of the outer ring directly or by adhering it via a base material.

Patent Document 2 discloses a sensor unit provided on an outer member of a wheel bearing. The sensor unit of Patent Document 2 has a strain sensor and a sensor mounting member. The strain sensor is attached to the sensor mounting member by adhesive (paragraph 0028) or printing and firing. The sensor mounting member is mounted on the outer circumference of the outer member by adhesive, bolt or welding.

As the strain sensor, for example, a strain gauge using a metal thin film and a semiconductor strain gauge obtained by doping a semiconductor (for example, silicon) with impurities are known. For example, Patent Document 3 discloses a technique in which a semiconductor strain sensor chip and a base plate are joined by metal solder, and the base plate and an object to be measured are fixed by spot welding or bolts.

Japanese Unexamined Patent Publication No. 2018-145998 Japanese Unexamined Patent Publication No. 2007-239848 Japanese Unexamined Patent Publication No. 2009-264976

When detecting the strain generated in a machine part by a sensor, as a method for detecting the strain of the machine part with high sensitivity, the sensor is joined to the part of the machine part where a large load is applied (that is, the part where a large stress is generated). It is conceivable to do. However, with such a configuration, the stress generated in the joint region between the mechanical component and the sensor also increases, so that the joint region is required to have high strength.

Here, examples of the conventional method for joining a sensor and a mechanical component include bonding with an adhesive (for example, Patent Document 1), mechanical joining with bolts, and welding (for example, Patent Document 2). However, in the case of bonding with an adhesive, the bonding strength is weak, and if a large stress is generated in the bonded portion, the bonded portion may be deteriorated or damaged in a short time. Even if the strain generated in the machine part is constant, if the bonded portion is altered, the value detected by the sensor will change, which hinders accurate detection.

Further, in mechanical joining, it is necessary to secure a space for inserting bolts, and mechanical parts with sensors become large and heavy. Further, when the bolt is tightened, an unbalanced pressure is applied to the sensor, which may damage the sensor. Welding is a more preferable joining method in order to join with higher strength, but since the joint portion becomes higher than the melting temperature of the metal constituting the machine part at the time of welding, the sensor may be damaged in a high temperature environment.

Therefore, the inventors focused on a joining method called solid-phase joining. When the solid phase bonding method is used, unlike welding, the sensor and the machine component can be bonded in a temperature environment lower than the melting temperature of the metal constituting the machine component. However, when the melting temperature of the metal constituting the mechanical component is relatively high (for example, steel such as carbon steel or chrome steel), the lowest temperature at which the sensor and the mechanical component can be solid-phase bonded (solid-phase bonding temperature). Is still hot, so solid-phase bonding can also damage the sensor.

Therefore, it is an object of the present invention to provide a method for manufacturing a mechanical component with a sensor and a mechanical component with a sensor in which the sensor and the mechanical component are joined with higher strength while preventing the sensor from being damaged.

(1) The mechanical component with a sensor according to the present invention includes a mechanical component including a metal detection target, a sensor for detecting strain, and a metal plate for transmitting the strain of the detection target to the sensor. The sensor has a metal joint on the surface on the metal plate side, and the metal plate is in a state of being fixed to the detection target by welding, solid phase bonding, or a brazing material, and the joint is said. It is in a state of being solid-phase bonded to a metal plate, and the solid-phase bonding possible temperature between the metal plate and the bonding portion is higher than the solid-phase bonding possible temperature when the detection target and the bonding portion are solid-phase bonded. Low, mechanical parts with sensors.

With such a configuration, it is possible to indirectly join the sensor and the detection target with higher strength while preventing the sensor from being damaged.

(2) Preferably, the solid-phase bonding temperature between the metal plate and the joint portion is the weldable temperature between the metal plate and the detection target when the metal plate is welded to the detection target. When the metal plate is solid-phase bonded to the detection target, the temperature is lower than the solid-phase bonding possible temperature between the metal plate and the detection target, and the metal plate is the detection target. When fixed by a material, it is lower than the melting point of the brazing material.

With this configuration, the sensor can be heated to a high temperature even when the metal plate and the detection target are joined by a joining method with higher joining strength (welding, solid phase joining, or brazing with a high melting point brazing material). Since it is possible to prevent the sensor from becoming damaged, it is possible to prevent the sensor from being damaged.

(3) Preferably, the reaction layer formed at the contact portion between the metal plate and the joint portion is a total solid solution type or a two-phase separation type. With such a configuration, it is possible to prevent the reaction layer from containing the metal compound, and it is possible to further increase the bonding strength between the metal plate and the bonding portion.

(4) Preferably, the sensor has a single crystal semiconductor substrate in which a plurality of resistors are formed on a predetermined surface by diffusing impurities. By adopting a single crystal semiconductor diffusion type strain sensor as a sensor in this way, it is possible to increase the strain detection sensitivity as compared with the case of using a metal strain gauge or a polycrystalline semiconductor strain gauge. .. On the other hand, the sensor has a problem that it is easily damaged by heat as compared with the case where a strain gauge or the like is used. On the other hand, in the present invention, the problem can be solved by joining the sensor and the detection target with a metal plate interposed therebetween.

(5) Preferably, the single crystal semiconductor is silicon, the predetermined surface is the (110) surface of the silicon, and the plurality of resistors are separated from each other in the crystal orientation <001> direction. The sensor extends in the crystal orientation <110> direction, and the sensor points the crystal orientation <110> direction toward the target direction for detecting the strain of the detection target. With this configuration, strain in the target direction can be detected with higher sensitivity.

(6) Preferably, the single crystal semiconductor is silicon, the predetermined surface is the (110) surface of the silicon, and the plurality of resistors are separated from each other in the crystal orientation <110> direction. The sensor extends in the direction of the crystal orientation <110>, and the sensor directs the direction of the crystal orientation <110> toward the target direction for detecting the strain of the detection target. With this configuration, strain in the target direction can be detected with higher sensitivity.

(7) Preferably, when the joint portion is viewed in a plan view from the predetermined surface side, at least two positions of the substrate sandwiching the plurality of resistors are fixed to the metal plate, and the opposite of the predetermined surface. A predetermined region of the side corresponding to the opposite side of the plurality of resistors is in a non-fixed state with the metal plate. With such a configuration, it is possible to efficiently transmit the strain transmitted from the detection target to a plurality of resistors via the metal plate while extending the durable life of the joint portion.

(8) The method for manufacturing a mechanical component with a sensor according to the present invention is a method for manufacturing a mechanical component with a sensor in which a sensor for detecting strain is attached to a metal component including a metal detection target, and is one side of the sensor. A step of solid-phase joining a metal joint provided on the surface of the surface and a metal plate that transmits the strain of the detection target to the sensor, and welding the metal plate and the detection target. The step of solid-phase bonding or fixing with a brazing material is provided, and the solid-phase bonding possible temperature between the metal plate and the bonding portion is the solid-phase bonding when the detection target and the bonding portion are solid-phase bonded. It is a method of manufacturing mechanical parts with sensors, which is lower than the temperature.

With such a configuration, it is possible to indirectly join the sensor and the detection target with higher strength while preventing the sensor from being damaged.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a method for manufacturing a mechanical component with a sensor and a mechanical component with a sensor in which the sensor and the mechanical component are joined with higher strength while preventing damage to the sensor.

It is a side view of the machine part with a sensor which concerns on embodiment. It is a top view which shows the mechanical part with a sensor partially as seen from the arrow II of FIG. It is sectional drawing which shows the cross section partially cut by the cutting line shown by the arrow III of FIG. FIG. 3 is a cross-sectional view partially showing a cross section cut by a cutting line indicated by an arrow IV in FIG. 2. It is explanatory drawing which shows the state of manufacturing the sensor unit which concerns on embodiment. It is explanatory drawing which shows the state of manufacturing the sensor unit which concerns on embodiment. It is explanatory drawing of the machine part with a sensor which concerns on the modification. It is explanatory drawing of the machine part with a sensor which concerns on the modification. It is explanatory drawing of the machine part with a sensor which concerns on the modification. It is explanatory drawing of the machine part with a sensor which concerns on the modification.

<Embodiment>
Hereinafter, the mechanical parts with sensors according to the embodiment of the present invention will be described with reference to the drawings. The drawings also show the XYZ coordinate system as appropriate. In this embodiment, the mechanical component is a rolling bearing. The mechanical component may be a sliding bearing, or may be another component that mechanically operates in various devices such as a link mechanism, a belt mechanism, a shaft, a screw, a spring, and a gear.

<Overall configuration of machine parts with sensors>
FIG. 1 is a side view of a mechanical component 1 with a sensor according to an embodiment. The mechanical component 1 with a sensor includes a rolling bearing 2 and a sensor unit 3. The rolling bearing 2 has an outer ring 21, an inner ring 22, a plurality of rolling elements 23, and a cage (not shown) for holding the rolling elements 23.

In the present disclosure, the direction along the center line C1 of the rolling bearing 2 (hereinafter referred to as "bearing center line C1") is the axial direction of the rolling bearing 2, and is simply referred to as "axial direction". The axial direction also includes a direction parallel to the bearing center line C1 (X direction). The direction orthogonal to the bearing center line C1 is the radial direction of the rolling bearing 2, and is simply referred to as the "diameter direction". The direction in which the rolling bearing 2 (inner ring 22 in the first embodiment) rotates about the bearing center line C1 is the circumferential direction of the rolling bearing 2, and is simply referred to as the "circumferential direction".

The outer ring 21 is an annular fixed ring formed of bearing steel. In the present embodiment, the bearing steel is a high carbon chromium bearing steel (for example, SUJ2 or SUJ3 specified in JIS standard), but other steels may be used. For example, carburized bearing steel, carbon steel, chrome steel, or stainless steel may be used.

The outer ring 21 has an inner peripheral surface 21a and an outer peripheral surface 21b. An outer ring track that is concave outward in the radial direction is formed on the inner peripheral surface 21a of the outer ring 21. The outer peripheral surface 21b side of the outer ring 21 is fixed to a housing (not shown). Further, a sensor unit 3 is attached to the outer peripheral surface 21b of the outer ring 21.

The inner ring 22 is an annular rotating ring formed of bearing steel. The inner ring 22 has an inner peripheral surface 22a and an outer peripheral surface 22b. The inner peripheral surface 22a side of the inner ring 22 is fixed to a rotation shaft (not shown). An inner ring track recessed inward in the radial direction is formed on the outer peripheral surface 22b of the inner ring 22. The plurality of rolling elements 23 are balls formed of bearing steel. The plurality of rolling elements 23 roll on the outer ring track and the inner ring track in a state where the outer ring track of the outer ring 21 and the inner ring track of the inner ring 22 are in point contact with each other. That is, the outer ring track and the inner ring track are runways on which a plurality of rolling elements 23 roll.

The bearing steel forming the inner ring 22 and the rolling element 23 may be the same steel as the outer ring 21, or may be different from the outer ring 21. The shape of the inner ring 22 is not limited to an annular shape, and may be, for example, an inner shaft having a solid structure (for example, a hub shaft). The outer ring 21 may be a rotating wheel and the inner ring 22 may be a fixed ring. The plurality of rolling elements 23 may be "rollers". The rolling bearing 2 of the present embodiment is a single row type, but may be a double row type.

The sensor unit 3 according to the present embodiment is attached to a metal detection target and detects the strain of the detection target. In the present embodiment, the detection target made of metal is the outer ring 21 made of bearing steel. More specifically, the sensor unit 3 is attached to the outer peripheral surface 21b of the outer ring 21. The sensor unit 3 may be attached to the inner peripheral surface 22a of the inner ring 22. In this case, the detection target made of metal is the inner ring 22 made of bearing steel.

Further, in the present embodiment, the entire outer ring 21 is made of bearing steel, but a part of the outer ring 21 may be made of a material other than the bearing steel (for example, resin). The region of the outer ring 21 to which the sensor unit 3 is attached may be formed of bearing steel, and the outer ring 21 having the region is referred to as "bearing steel outer ring 21" in the present disclosure.

<Sensor unit configuration>
FIG. 2 is a plan view partially showing the mechanical component 1 with a sensor as seen from the arrow II of FIG. FIG. 3 is a cross-sectional view partially showing a cross section cut by a cutting line indicated by an arrow III in FIG. FIG. 4 is a cross-sectional view partially showing a cross section cut by the cutting line indicated by the arrow IV of FIG. In FIGS. 2 to 4, the X direction corresponds to the axial direction, the Y direction corresponds to the circumferential direction, and the Z direction corresponds to the radial direction. The sensor unit 3 has a sensor 4 for detecting the strain, and a metal intermediate member 5 for transmitting the strain of the outer ring 21 (detection target) to the sensor 4.

See FIG. The sensor 4 is a strain sensor that utilizes the piezoresistive effect of a semiconductor. The sensor 4 has a single crystal semiconductor substrate 41 and a plurality of junctions 44. In the present embodiment, the single crystal semiconductor forming the substrate 41 is silicon. The single crystal semiconductor may be germanium or a compound semiconductor (for example, a gallium compound or an indium compound).

In the substrate 41, the (110) surface of silicon is the surface 41a, and as shown in FIG. 3, the back surface 41b on the opposite side of the surface 41a is directed toward the intermediate member 5. A plurality of resistors 42 are formed on the surface 41a of the substrate 41 by diffusing impurities. The resistor 42 of the present embodiment is p-type silicon, but may be n-type silicon. Further, the surface 41a is provided with an electrode 43 for measuring a change in the resistance value of the resistor 42. The electrode 43 is connected to a wiring (not shown), and the wiring is connected to an external measuring device of the mechanical component 1 with a sensor. As a result, the change in the resistance value of the resistor 42 is detected by an external measuring device.

The plurality of resistors 42 extend in the crystal orientation <110> direction in a state of being separated from each other in the crystal orientation <001> direction. Here, the resistor 42 formed on the (110) plane of silicon has a maximum piezoresistive effect (strain transmission sensitivity) in the <110> direction, and has a piezoresistive effect in the <100> direction perpendicular to the <110> direction. The effect is minimal. Therefore, by matching the <110> direction in which the resistor 42 extends with the target direction for detecting the strain, the strain in the target direction can be detected more sensitively.

Since the substrate 41 of the present embodiment matches the <110> direction with the axial direction of the rolling bearing 2, the strain in the axial direction of the rolling bearing 2 can be detected more sensitively. When the target direction is, for example, the circumferential direction, the <110> direction of the substrate 41 may be aligned with the circumferential direction of the rolling bearing 2.

See FIG. A plurality of (for example, four) joints 44 are provided on the back surface 41b of the substrate 41. The joint portion 44 is a thin film formed on the back surface 41b of the substrate 41 by sputtering. The thin film material constituting the joint portion 44 of the present embodiment is a metal, and more specifically, gold. The joint portion 44 may be formed on the back surface 41b of the substrate 41 by thin film deposition, but is preferably formed by sputtering in order to further strengthen the bonding force between the substrate 41 and the joint portion 44.

The joint portion 44 is solid-phase bonded to the intermediate member 5. More specifically, the joint portion 44 is fixed to the intermediate member 5 by solid phase diffusion bonding. The solid phase diffusion bonding between the bonding portion 44 and the intermediate member 5 will be described later.

The joint portion 44 is provided at a position where it does not overlap with the resistor 42 and the electrode 43 when viewed in a plan view in the radial direction (that is, the direction in which the substrate 41 is directed from the front surface 41a to the back surface 41b) as shown in FIG. With such a configuration, it is possible to prevent the resistor 42 and the electrode 43 from being damaged when solid-phase bonding is performed with the intermediate member 5.

Further, when viewed in a plan view in the radial direction, the joint portion 44 fixes at least two locations (four locations in the present embodiment) of the substrate 41 located across the resistor 42 to the intermediate member 5. Further, as shown in FIGS. 3 and 4, the predetermined region R1 corresponding to the opposite side of the resistor 42 in the back surface 41b of the substrate 41 is in a non-fixed state with respect to the intermediate member 5.

Here, the "non-fixed state" means a state in which the predetermined region R1 is not directly fixed to the intermediate member 5 by the joint portion 44. As shown in FIGS. 3 and 4, the state in which the predetermined region R1 and the intermediate member 5 have a radial gap is a non-fixed state. If the substrate 41 is fixed to the intermediate member 5 at a position where the joint portion 44 avoids the predetermined region R1, the predetermined region R1 may be in contact with the intermediate member 5. In this case, when the outer ring 21 is distorted in at least one of the axial direction and the circumferential direction, the intermediate member 5 expands or contracts while sliding in contact with the predetermined region R1. Such a state is also referred to as a "non-fixed state" with respect to the intermediate member 5 in the predetermined region R1. That is, in the "non-fixed state", the predetermined region R1 and the intermediate member 5 are separated from each other with a gap, and the predetermined region R1 and the intermediate member 5 are not joined even though there is no gap. And include. In the present embodiment, the predetermined region R1 and the intermediate member 5 are separated from each other with a gap.

Further, the joint portion 44 has a circular shape, an elliptical shape, an oval shape, or an oval shape when viewed in a plan view in the radial direction. In other words, the joint portion 44 is non-polygonal and has no corners when viewed in a radial direction. Therefore, it is possible to prevent the stress generated in the joint portion 44 when the intermediate member 5 is distorted from concentrating on one point (for example, a corner). This makes it possible to prevent the joint portion 44 from peeling off from the intermediate member 5.

<Details of intermediate members>
The intermediate member 5 has a metal plate 51 and a weld bead 52. The metal plate 51 is a thin plate made of copper, and has a thickness of, for example, several hundreds to several tens of um (micrometers). Of the metal plate 51, the surface facing outward in the radial direction is referred to as the front surface 51a, and the surface facing the outer peripheral surface 21b is referred to as the back surface 51b. The bonding portion 44 of the sensor 4 is fixed to the surface 51a of the metal plate 51 by solid phase bonding.

The axial side surface 51c of the metal plate 51 is fixed to the outer peripheral surface 21b of the outer ring 21 by welding (for example, laser welding). At the time of welding, the metal plate 51 and the outer ring 21 are melted to form a weld bead 52, and the metal plate 51 and the outer ring 21 are fixed by the weld bead 52. The metal plate 51 has elasticity in a direction parallel to the outer peripheral surface 21b (axial direction or circumferential direction), and when the outer ring 21 is distorted in the axial direction or the circumferential direction, the metal plate 51 is also distorted in the same manner as the outer ring 21. .. As a result, the metal plate 51 can transmit the strain of the outer ring 21 to the sensor 4.

Here, the intermediate member 5 has two functions. One is a function of transmitting the strain of the outer ring 21 to the sensor 4 as described above. The other is a function as a buffer for joining the sensor 4 to the outer ring 21 with higher strength while preventing the sensor 4 from being damaged. The sensor 4 may be joined to a portion of the detection target where a large load is applied in order to detect the strain of the detection target with high sensitivity. With such a configuration, the stress generated in the joint region between the detection target and the sensor 4 also increases, so that the joint region is required to have high strength.

Here, examples of the joining method having a relatively high joining strength include welding, solid phase joining, and brazing with a high melting point brazing material. Solid-phase bonding is a bonding method in which a bonding region is bonded in a solid state by heating while applying pressure to the bonding region. Examples thereof include solid-phase diffusion welding, friction stir welding, and ultrasonic pressure welding. Be done.

For example, in order to join the joint portion 44 of the sensor 4 to the outer peripheral surface 21b of the outer ring 21 by welding, the temperature is equal to or higher than the minimum temperature (weldable temperature) at which the bearing steel constituting the outer ring 21 melts (for example, 1400 degrees Celsius). It is necessary to work in the above), and the sensor 4 may not be able to withstand the high temperature and may be damaged at the time of joining.

Further, if the material constituting the outer ring 21 is a metal material having a weldable temperature lower than that of the bearing steel (for example, copper or the like), the heat given to the sensor 4 at the time of joining is also low, so that the sensor 4 is less likely to be damaged. .. However, when the outer ring 21 is made of a metal material having a low weldable temperature as described above, the mechanical strength of the outer ring 21 itself is lowered, and the performance of the rolling bearing 2 is lowered. Therefore, in order to maintain the performance of the rolling bearing 2 (mechanical component), the metal material constituting the outer ring 21 (detection target) must be a metal material having a weldable temperature high to some extent (for example, 1400 degrees Celsius or higher). There is.

When the joining portion 44 of the sensor 4 is joined to the outer peripheral surface 21b of the outer ring 21 by brazing, if the melting point of the brazing material is high, the joining strength can be increased, but the sensor 4 cannot withstand the high temperature and is damaged at the time of joining. There is a risk. Further, when the melting point of the brazing material is low (for example, solder or the like), damage to the sensor 4 at the time of joining can be prevented, but the joining strength is weakened. Therefore, in brazing, it is difficult to achieve both high bonding strength and prevention of damage to the sensor 4. Further, since the brazing material having a low melting point has a relatively low Young's modulus, the brazing material is deformed according to the strain of the outer ring 21, so that the strain of the outer ring 21 is less likely to be transmitted to the resistor 42 of the sensor 4, and the sensor 4 has a relatively low Young's modulus. The detection sensitivity may decrease.

When the joint portion 44 of the sensor 4 is joined to the outer peripheral surface 21b of the outer ring 21 by solid phase joining, the work can be performed at a temperature about half of the melting temperature (weldable temperature) of the bearing steel constituting the outer ring 21. However, since the melting temperature of the bearing steel constituting the outer ring 21 is high, the minimum temperature (solid phase bonding possible temperature) required for solid phase bonding between the joint portion 44 and the outer peripheral surface 21b is still high (for example,). (700 degrees Celsius or higher), and the sensor 4 may be damaged during joining.

Therefore, in the sensor unit 3 according to the present embodiment, the temperature at which the outer ring 21 (detection target) and the joint portion 44 can be solid-phase bonded is set between the sensor 4 and the outer ring 21 at a temperature at which the joint portion 44 can be solid-phase bonded. A metal plate 51 having a temperature lower than the solid phase bonding temperature in the case is interposed. Then, the joint portion 44 and the metal plate 51 are solid-phase bonded, and the metal plate 51 and the outer ring 21 (detection target) are welded. As a result, the sensor 4 can be joined to the outer ring 21 with higher strength via the metal plate 51 while preventing the sensor 4 from being damaged.

In other words, the combination of the material of the joint portion 44 and the material of the metal plate 51 is the case where the joint portion 44 is solid-phase bonded to the metal plate 51 rather than the case where the joint portion 44 is solid-phase bonded to the outer ring 21. This is a specific combination that makes it possible to lower the temperature at which solid phase bonding is possible.

In the present embodiment, the joint portion 44 is a thin film of gold, the metal plate 51 is a copper plate, and the joint portion 44 and the metal plate 51 are joined by solid-phase diffusion bonding. In this case, the solid-phase bonding temperature when the bonding portion 44 and the outer ring 21 are solid-phase bonded is about 700 degrees Celsius, and the solid-phase bonding temperature between the bonding portion 44 and the metal plate 51 is about 200 degrees Celsius. be. Therefore, the bonding portion 44 and the metal plate 51 can be bonded by solid-phase bonding having high bonding strength while preventing the sensor 4 from being damaged by high temperature.

The types of materials constituting the joint portion 44 and the metal plate 51 are not limited to the above combinations. Other combinations may be used as long as the temperature at which the metal plate 51 and the bonding portion 44 can be solid-phase bonded is lower than the temperature at which the outer ring 21 and the bonding portion 44 can be solid-phase bonded. For example, the joint 44 may be a thin film of silver, copper, nickel, tin or aluminum. Further, the metal plate 51 may be a plate of gold, silver, nickel, tin or aluminum, or the surface of the copper plate may be plated with any of these metals.

Further, the bonding portion 44 and the metal plate 51 may be bonded by a solid phase bonding method other than solid phase diffusion bonding. For example, the joint portion 44 and the metal plate 51 may be joined by friction stir welding or by ultrasonic pressure welding.

In addition to the metal plate 51 and the outer ring 21, the weld bead 52 may contain a metal material that is a base material of the weld bead 52. For example, in a state where the metal material to be the base material of the welding bead 52 is positioned between the metal plate 51 and the outer ring 21, laser irradiation is performed to melt the metal plate 51, the outer ring 21, and the base material for welding. The bead 52 may be formed.

When viewed in a plan view as shown in FIG. 2, the widths of the metal plate 51 in the axial direction (X direction) and the circumferential direction (Y direction) are larger than the widths of the substrate 41 in the same direction. Then, in the metal plate 51, at least two locations where the substrate 41 is sandwiched between the target direction (in the present embodiment, the axial direction) are fixed to the outer ring 21. Further, as shown in FIGS. 3 and 4, the predetermined region R2 corresponding to the opposite side of the resistor 42 and the joint portion 44 of the back surface 51b of the metal plate 51 is not fixed to the outer peripheral surface 21b of the outer ring 21. It is in a state.

Here, the predetermined region R2 can distort the metal plate 51 more greatly by facing the portion of the outer ring 21 where the strain is more strongly generated. However, since a larger stress is generated in the portion, if the weld bead 52 is located in the portion, the durable life of the intermediate member 5 may be shortened.

In the present embodiment, the weld bead 52 is located so as to avoid the portion. That is, the predetermined region R2 is not fixed to the outer peripheral surface 21b of the outer ring 21. Therefore, the weld bead 52 itself is less likely to be distorted by stress, and the durable life of the intermediate member 5 can be further extended. Further, when the metal plate 51 is viewed in a plan view from the surface 51a side, at least two positions sandwiching the substrate 41 in the target direction are fixed to the outer peripheral surface 21b by the welding beads 52. Therefore, the metal plate 51 can more preferably follow and deform the strain of the outer ring 21 in the target direction, and efficiently transmit the strain transmitted from the outer peripheral surface 21b of the outer ring 21 to the sensor 4.

In the present embodiment, although there is almost no gap between the predetermined region R2 and the outer peripheral surface 21b, the weld bead 52 is formed so as to avoid the predetermined region R2, so that the predetermined region R2 and the outer peripheral surface 21b are directly connected to each other. Not joined.

<Manufacturing method of sensor unit>
An example of a method for manufacturing the sensor unit 3 will be described with reference to FIGS. 5 and 6. 5 and 6 are explanatory views showing how the sensor unit 3 according to the present embodiment is manufactured. 5 (a), (b) and FIG. 6 show the sensor 4 and the metal plate 51 in the same cross section as in FIG.

First, as shown in FIG. 5A, the resistor 42 is formed by diffusing p-type impurities on the surface 41a of the substrate 41. Next, a gold thin film (for example, a thickness of several tens to several hundreds um (micrometers)) is formed on the back surface 41b of the substrate 41 by a sputtering method to form a joint portion 44. In the sputtering method, the material particles (gold in the present embodiment) are made to collide with the back surface 41b of the substrate 41 at high speed and high energy, so that the back surface 41b of the substrate 41 is slightly destroyed and the gold bites into the back surface 41b. Become. Therefore, according to the sputtering method, the joint portion 44 can be formed on the back surface 41b of the substrate 41 with a high adhesion force. The joint portion 44 may be formed on the back surface 41b of the substrate 41 by an ion plating method or by a thin-film deposition method as long as a desired adhesion force can be obtained.

Subsequently, as shown in FIG. 5B, the joint portion 44 and the surface 51a of the metal plate 51 are brought into contact with each other, and the contact portion between the joint portion 44 and the surface 51a of the metal plate 51 is heated and pressurized. As a result, the joint portion 44 and the metal plate 51 are fixed by solid phase diffusion bonding (also referred to as “thermocompression bonding”). That is, at a temperature lower than the melting point of the metal constituting each of the joint portion 44 and the metal plate 51, the metal diffuses between the joint portion 44 and the metal plate 51, thereby causing the joint portion 44 and the metal plate 51 to diffuse. And join.

5 (c) is an enlarged view of the region R3 including the contact portion between the joint portion 44 and the surface 51 a of the metal plate 51 in FIG. 5 (b). A reaction layer 6 is formed at the contact portion by solid phase diffusion bonding. The reaction layer 6 is a total rate solid-dissolved type or two-phase separated type layer. That is, an intermetallic compound is not formed or, if any, is formed between the metal constituting the joint portion 44 and the metal constituting the metal plate 51, and most of the reaction layer 6 is completely solid-solved. It is formed by a mold or a two-phase separated type layer.

Here, what type of layer the reaction layer 6 becomes is determined by the combination of the material constituting the joint portion 44 and the material constituting the metal plate 51. In the present embodiment, since the joint portion 44 is gold and the metal plate 51 is copper, it is difficult for an intermetallic compound to be formed between gold and copper, and the reaction layer 6 is a solid-state type or a two-phase separation type. Become. Since the intermetallic compound is more fragile than the solid solution of metal, when the intermetallic compound is formed in the reaction layer 6, the reaction layer 6 becomes a solid solution type or a two-phase separation type as compared with the case where the reaction layer 6 becomes a solid solution type or a two-phase separation type. The joint strength between the joint portion 44 and the metal plate 51 is lowered. Therefore, in the metal constituting the joint portion 44 and the metal plate 51, in order to prevent the reaction layer 6 from containing the metal compound, a combination in which the reaction layer 6 is a total solid solution type or a two-phase separation type is used. adopt.

For example, when gold is used as the joint portion 44, a copper plate, a copper plate plated with nickel, a gold plate, or a nickel plate can be used as the metal plate 51. When copper is used as the joint portion 44, a copper plate or a metal plate plated with copper can be used as the metal plate 51. When nickel is used as the joint portion 44, a nickel plate or a metal plate plated with nickel can be used as the metal plate 51. In any combination of these, the reaction layer 6 is either a solid-soluble type or a two-phase separated type.

Next, a method of solid-phase bonding between the bonding portion 44 and the metal plate 51 will be described more specifically.
FIG. 6 shows a state in which the sensor 4 and the metal plate 51 are housed in the solid phase bonding device 7. The solid phase bonding device 7 is a device for performing solid phase bonding (more specifically, solid phase diffusion bonding). The solid phase bonding apparatus 7 has a first plate 71, a second plate 72, and a laser irradiation unit 73.

The first plate 71 and the second plate 72 face each other with a gap Gp1. Then, the sensor 4 and the metal plate 51 are stored in the gap Gp1 in a state where the back surface 51b of the metal plate 51 is in contact with the first plate 71 and the surface 41a of the substrate 41 is in contact with the second plate 72. .. The second plate 72 is fixed to a fixed plate (not shown), and the first plate 71 is fixed to a movable plate (not shown) that can move in a direction in which the second plate 72 is separated from and detached from the second plate 72. The solid phase bonding apparatus 7 presses the first plate 71 in a direction closer to the second plate 72 by a movable plate, thereby pressurizing the contact portion between the bonding portion 44 and the metal plate 51 stored in the gap Gp1. Can be done.

The laser irradiation unit 73 irradiates the heating laser L1 toward the gap Gp1. The first plate 71 has transparency with respect to the wavelength of the laser L1 (for example, the transmittance is 90% or more). Therefore, the laser irradiation unit 73 can irradiate the metal plate 51 with the laser L1 via the first plate 71. Since the laser L1 is absorbed by the metal plate 51 and converted into heat energy, the metal plate 51 can be heated by irradiation with the laser L1. Then, the contact portion between the joint portion 44 and the metal plate 51 can be heated by heat conduction from the metal plate 51.

That is, in the solid phase bonding apparatus 7, the contact portion between the joint portion 44 and the metal plate 51 is pressurized by the first plate 71 and the second plate 72, and the contact portion is heated by the laser irradiation portion 73. can do. The contact portion is subjected to solid phase diffusion bonding by pressurizing and heating with the solid phase bonding device 7.

The wavelength of the laser L1 is appropriately selected according to the wavelength characteristic of the absorptivity of the metal plate 51. For example, the wavelength of the laser L1 is in the near infrared region (780 nm or more and 2500 nm). As a result, the light energy of the laser L1 can be efficiently absorbed by the metal plate 51 to heat the metal plate 51. More specifically, the wavelength of the laser L1 is 1000 nm.

The back surface 51b of the metal plate 51 is preferably plated with a metal having a higher absorption rate with respect to the wavelength of the laser L1. When the wavelength of the laser L1 is 1000 nm, the metal plate 51 is preferably a copper plate whose back surface 51b is plated with nickel. With this configuration, the metal plate 51 can be heated more efficiently. Further, since the melting point of nickel (1455 degrees Celsius) is closer to the melting point of bearing steel (about 1400 to 1500 degrees Celsius) than the melting point of copper (1085 degrees Celsius), the entire surface of the metal plate 51 (at least the back surface 51b and the back surface 51b) By using a copper plate whose side surface 51c) is plated with nickel, the bonding strength between the metal plate 51 and the outer ring 21 can be further increased.

Here, since high pressure is applied from the solid phase bonding device 7 to the portion of the substrate 41 where the junction 44 is formed during solid phase diffusion bonding, a plurality of resistors 42 and electrodes are applied to the portion. If a structure (pattern) that contributes to the function of the sensor 4 such as 43 is formed, the structure may be damaged. In the present embodiment, the joint portion 44 is formed at a position where it does not overlap with the plurality of resistors 42 and the electrodes 43 when viewed in a plan view in the pressure application direction (that is, the direction from the front surface 41a to the back surface 41b). Therefore, the joint portion 44 and the metal plate 51 can be solid-phase bonded while preventing damage to the plurality of resistors 42 and the electrodes 43.

After the joint portion 44 and the metal plate 51 are fixed by solid phase diffusion bonding, the metal plate 51 is fixed to the outer peripheral surface 21b of the outer ring 21 by welding. As described above, the sensor unit 3 is manufactured.

<Effects of machine parts with sensors>
The mechanical component 1 with a sensor according to the present embodiment transmits the rolling bearing 2 (mechanical component) including the outer ring 21 (detection target) made of bearing steel, the sensor 4 for detecting strain, and the strain of the outer ring 21 to the sensor 4. A metal plate 51 and a metal plate 51 are provided. The sensor 4 has a metal (gold in this embodiment) joint 44 on the back surface 41b (the surface on the metal plate 51 side). The metal plate 51 is welded to the outer ring 21, the joint portion 44 is solid-phase bonded to the metal plate 51, and the temperature at which the metal plate 51 and the joint portion 44 can be solid-phase-bonded is such that the outer ring 21 and the joint portion 44 are solidified. It is lower than the temperature at which solid-phase bonding is possible when phase bonding is performed.

By interposing the metal plate 51 between the sensor 4 and the outer ring 21, the sensor 4 and the outer ring 21 can be indirectly joined with higher strength while preventing the sensor 4 from being damaged.

Further, in the present embodiment, the temperature at which the metal plate 51 and the joint portion 44 can be joined in a solid phase is lower than the temperature at which the metal plate 51 and the outer ring 21 can be welded. With this configuration, even when the metal plate 51 and the outer ring 21 are joined by a joining method (welding) having a higher joining strength, it is possible to prevent the sensor 4 from becoming hot. It is possible to prevent the sensor 4 from being damaged.

Further, in the present embodiment, the reaction layer 6 formed at the contact portion between the metal plate 51 and the joint portion 44 is a total solid solution type or a two-phase separation type. With such a configuration, it is possible to prevent the reaction layer 6 from containing the metal compound, and it is possible to further increase the bonding strength between the metal plate 51 and the bonding portion 44.

Further, in the present embodiment, the sensor 4 has a single crystal semiconductor substrate 41 in which a plurality of resistors 42 are formed on the surface 41a (predetermined surface) by diffusing impurities. By adopting the single crystal semiconductor diffusion type strain sensor as the sensor 4 in this way, the strain detection sensitivity can be increased as compared with the case of using a metal strain gauge or a polycrystalline semiconductor strain gauge. can. On the other hand, the sensor 4 has a problem that it is easily damaged by heat as compared with the case where a strain gauge or the like is used. On the other hand, in the present embodiment, the problem can be solved by joining the sensor 4 and the outer ring 21 with a metal plate 51 interposed therebetween.

Further, in the present embodiment, the single crystal semiconductor is silicon, the surface 41a (predetermined surface) is the (110) surface of silicon, and the plurality of resistors 42 are separated from each other in the crystal orientation <001> direction. In the state, it extends in the crystal orientation <110> direction, and the sensor 4 directs the crystal orientation <110> direction to the target direction (axial direction in the present embodiment) for detecting the strain of the outer ring 21. With this configuration, strain in the target direction can be detected with higher sensitivity.

Here, the predetermined region R1 corresponding to the opposite side of the plurality of resistors 42 in the back surface 41b (opposite side of the predetermined surface) is opposed to the portion of the metal plate 51 where the strain is stronger, so that the strain is further increased. It can be detected with good sensitivity. However, since a larger stress is generated in the portion, if the joint 44 is located in the portion as in a configuration in which the joint 44 is provided on the entire surface of the back surface 41b, the durable life of the joint 44 may be shortened. There is.

In the present embodiment, the joint portion 44 is located so as to avoid the portion. That is, the predetermined region R1 is not fixed to the metal plate 51. Therefore, the joint portion 44 itself is less likely to be distorted by stress, and the durable life of the joint portion 44 can be further extended. Further, when viewed in a plan view from the surface 41a (predetermined surface) side, the joint portion 44 fixes at least two positions of the substrate 41 sandwiching the plurality of resistors 42 to the metal plate 51. Therefore, the strain transmitted from the outer peripheral surface 21b of the outer ring 21 can be efficiently transmitted to the plurality of resistors 42 via the metal plate 51.

<Modification example>
The mechanical component 1 with a sensor according to the embodiment of the present invention has been described above. However, the implementation of the present invention is not limited to this, and various modifications can be made. Hereinafter, a modified example according to the embodiment of the present invention will be described. In the following description, the same reference numerals will be given to the parts that are not changed from the embodiments, and the description thereof will be omitted.

<Modified example of joining method between metal plate and outer ring>
The metal plate 51 according to the embodiment is fixed to the outer peripheral surface 21b of the outer ring 21 by welding. However, the metal plate may be fixed to the outer peripheral surface by another joining method.

FIG. 7 is an explanatory diagram of a mechanical component with a sensor according to a modified example. 7 (a) and 7 (b) both show a mechanical component with a sensor in the same cross section as in FIG. FIG. 7A shows a mechanical component 1a with a sensor in which the metal plate 53 and the outer ring 21 are solid-phase bonded. FIG. 7B shows a mechanical component 1b with a sensor in which the metal plate 55 and the outer ring 21 are brazed to each other.

See FIG. 7 (a). The mechanical component 1a with a sensor includes a rolling bearing 2 and a sensor unit 3a. The sensor unit 3a includes a sensor 4 and an intermediate member 5a. The intermediate member 5a is a metal plate 53 having a plurality of pads 54 on the outer peripheral surface 21b side. The pad 54 is formed, for example, on the side portions of the metal plate 53 located on both outer sides in the axial direction. The metal plate 53 is a thin copper plate.

The pad 54 is seamlessly and integrally formed with the metal plate 53 by scraping a portion of the metal plate 53 other than the pad 54. The pad 54 may be formed on the metal plate 53 by a thin film forming method such as sputtering. The pad 54 is fixed to the outer peripheral surface 21b of the outer ring 21 by solid phase bonding (for example, solid phase diffusion welding, friction stir welding or ultrasonic pressure welding). The temperature at which the metal plate 53 (copper plate) and the outer ring 21 (bearing steel) can be solid-phase bonded is about 700 degrees Celsius.

In the mechanical component 1a with a sensor, the temperature at which the metal plate 53 and the joint portion 44 can be joined in a solid phase (for example, about 200 degrees Celsius) is the solid phase between the metal plate 53 (specifically, the pad 54) and the outer ring 21. It is lower than the joinable temperature (about 700 degrees Celsius). With this configuration, it is possible to prevent the sensor 4 from becoming hot even when the metal plate 53 and the outer ring 21 are joined by a joining method (solid phase joining) having a higher joining strength. Therefore, it is possible to prevent the sensor 4 from being damaged.

See FIG. 7 (b). The mechanical component 1b with a sensor includes a rolling bearing 2 and a sensor unit 3b. The sensor unit 3b includes a sensor 4 and an intermediate member 5b. The intermediate member 5b includes a metal plate 55 and a brazing material 56. Two sides of the metal plate 55 located on both outer sides in the axial direction are brazed to the outer peripheral surface 21b of the outer ring 21 by the brazing filler metal 56, respectively. The metal plate 55 is a thin copper plate.

The brazing filler metal 56 has a high melting point (for example, a melting point of 450 degrees Celsius or higher) such as gold brazing, silver brazing, copper brazing, and aluminum brazing, in order to fix the metal plate 55 to the outer peripheral surface 21b with higher strength. Use brazing material. Therefore, the solid-phase bonding temperature (for example, about 200 degrees Celsius) between the metal plate 55 and the bonding portion 44 is lower than the melting point of the brazing filler metal 56. With this configuration, even when the metal plate 55 and the outer ring 21 are joined by a joining method with higher joining strength (high melting point brazing), it is possible to prevent the sensor 4 from becoming hot. Therefore, it is possible to prevent the sensor 4 from being damaged.

<Deformation example of outer ring>
FIG. 8 is an explanatory diagram of the mechanical component 1c with a sensor according to the modified example. FIG. 8 shows the mechanical component 1c with a sensor having the same cross section as that of FIG. In the above embodiment, the sensor unit 3 is fixed to the outer side in the radial direction of the outer peripheral surface 21b. On the other hand, in the rolling bearing 2a according to the present modification, the groove portion 24 is provided on the outer peripheral surface 21b of the outer ring 21, and the sensor unit 3 is fixed to the bottom surface of the groove portion 24. Specifically, the metal plate 51 is welded to the bottom surface of the groove portion 24. The groove portion 24 may be provided over the entire circumference of the outer peripheral surface 21b, or may be provided only in a portion where the sensor unit 3 is fixed.

The sensor unit 3 is completely housed in the groove 24 and does not project radially outward from the outer peripheral surface 21b. With such a configuration, it is possible to prevent the sensor unit 3 from interfering with the housing when the outer ring 21 of the rolling bearing 2a is fixed to the housing (not shown). Therefore, it is possible to secure the same level of assembling property as that of a rolling bearing in which the sensor unit 3 is not provided.

<Modification example of sensor unit>
FIG. 9 is an explanatory diagram of the mechanical component 1d with a sensor according to the modified example. FIG. 9 shows the mechanical component 1d with a sensor having the same cross section as that of FIG. The mechanical component 1d with a sensor includes a rolling bearing 2 and a sensor unit 3c. The sensor unit 3c includes a sensor 4 and an intermediate member 5c. The intermediate member 5c has a metal plate 51 and a weld bead 52a.

In the above embodiment, the side surface 51c of the metal plate 51 is welded to the outer peripheral surface 21b of the outer ring 21, and the weld bead 52 is formed on the side surface 51c of the metal plate 51. The back surface 51b (the surface on the outer ring 21 side) of the metal plate 51 and the outer peripheral surface 21b face each other with almost no gap. Further, the sensor 4 is fixed to the surface 51a (the outer surface in the radial direction) of the metal plate 51. That is, the sensor 4, the metal plate 51, and the outer ring 21 are arranged in this order from the outside in the radial direction.

On the other hand, in this modification, the back surface 51b of the metal plate 51 facing the outer peripheral surface 21b is welded to the outer peripheral surface 21b, and the weld bead 52a is formed between the back surface 51b and the outer peripheral surface 21b. .. And there is a gap Gp2 between the back surface 51b and the outer peripheral surface 21b. The sensor 4 is fixed to the back surface 51b of the metal plate 51 and is located in the gap Gp2. That is, the metal plate 51, the sensor 4, and the outer ring 21 are arranged in this order from the outside in the radial direction. The radial width of the gap Gp2 is larger than the thickness of the sensor 4. Therefore, the surface 41a of the substrate 41 of the sensor 4 is located with a gap from the outer peripheral surface 21b.

In this modification, since the sensor 4 is located in the gap Gp2 between the metal plate 51 and the outer peripheral surface 21b, the sensor 4 is exposed to air containing foreign matter such as dust and iron powder on the radial outer side of the outer peripheral surface 21b. However, foreign matter is unlikely to adhere to the sensor 4 (particularly, the resistor 42 and the electrode 43). Therefore, it is possible to prevent the sensitivity of the sensor 4 from being changed or the sensor 4 from being damaged due to the adhesion of foreign matter.

<Modification example of sensor unit>
FIG. 10 is an explanatory diagram of the mechanical component 1e with a sensor according to the modified example. FIG. 10 shows the mechanical component 1e with a sensor by the same plane as that of FIG. The mechanical component 1e with a sensor includes a rolling bearing 2 and a sensor unit 3d. The sensor unit 3d includes a sensor 4a and an intermediate member 5. The sensor 4a has a substrate 41 and a plurality of joints 44. A plurality of resistors 42a and electrodes 43 are formed on the surface 41a of the substrate 41.

In the above embodiment, as shown in FIG. 2, the plurality of resistors 42 extend in the crystal orientation <110> direction in a state of being separated from each other in the crystal orientation <001> direction. On the other hand, the plurality of resistors 42a according to the present modification extend in the crystal orientation <110> direction in a state of being separated in the crystal orientation <110> direction. Even in such a configuration, by matching the <110> direction in which the resistor 42a extends with the target direction for detecting the strain, the strain in the target direction can be detected more sensitively.

<Others>
As shown in FIG. 1, in the present embodiment, the mechanical component 1 with a sensor includes one sensor unit 3, but the present invention is not limited to this, and one rolling bearing (mechanical component) is used. A plurality of sensor units 3 may be provided.

In the above embodiment, the case where the rolling bearing 2 is a ball bearing of radial contact has been described. However, the rolling bearing 2 may be an axial contact ball bearing, an angular contact radial ball bearing, or an angular contact thrust ball bearing.

The embodiments and modifications disclosed as described above are exemplary in all respects and are not restrictive. That is, the mechanical component with a sensor of the present invention is not limited to the illustrated form, and may be another form within the scope of the present invention.

1, 1a, 1b, 1c, 1d, 1e: Mechanical parts with sensors 2, 2a: Rolling bearing 21: Outer ring 21a: Inner peripheral surface 21b: Outer peripheral surface 22: Inner ring 22a: Inner peripheral surface 22b: Outer peripheral surface 23: Rolling element 24: Grooves 3, 3a, 3b, 3c, 3d: Sensor unit 4, 4a: Sensor 41: Substrate 41a: Front surface 41b: Back surface 42, 42a: Resistor 43: Electrode 44: Joint portion 5, 5a, 5b: Intermediate member 51, 53, 55: Metal plate 51a: Front surface 51b: Back surface 51c: Side surface 52, 52a: Weld bead 54: Pad 56: Wax material 6: Reaction layer 7: Solid phase bonding device 71: First plate 72: Second plate 73: Laser irradiation unit C1: Center line R1: Predetermined area R2: Predetermined area R3: Area Gp1: Gap Gp2: Gap L1: Laser

Claims (8)

Machine parts including metal detection targets and
A sensor that detects strain and
A metal plate that transmits the strain to be detected to the sensor,
Equipped with
The sensor has a metal joint on the surface on the metal plate side.
The metal plate is in a state of being fixed to the detection target by welding, solid phase bonding, or a brazing material.
The joint portion is in a state of being fixed to the metal plate by solid phase bonding.
The solid-phase bonding temperature between the metal plate and the bonding portion is lower than the solid-phase bonding temperature when the detection target and the bonding portion are solid-phase bonded.
Machine parts with sensors. The temperature at which a solid phase bond can be formed between the metal plate and the joint portion is
When the metal plate is welded to the detection target, the temperature is lower than the weldable temperature between the metal plate and the detection target.
When the metal plate is solid-phase bonded to the detection target, the temperature is lower than the temperature at which the metal plate and the detection target can be solid-phase bonded.
When the metal plate is fixed to the detection target by the brazing material, it is lower than the melting point of the brazing material.
The mechanical component with a sensor according to claim 1. The reaction layer formed at the contact portion between the metal plate and the joint portion is a total solid solution type or a two-phase separation type.
The mechanical component with a sensor according to claim 1 or 2. The sensor has a single crystal semiconductor substrate in which a plurality of resistors are formed on a predetermined surface by diffusing impurities.
The mechanical component with a sensor according to any one of claims 1 to 3. The single crystal semiconductor is silicon, and the single crystal semiconductor is silicon.
The predetermined surface is the (110) surface of the silicon.
The plurality of resistors extend in the crystal orientation <110> direction while being separated from each other in the crystal orientation <001> direction.
The sensor directs the crystal orientation <110> direction to a target direction for detecting the strain of the detection target.
The mechanical component with a sensor according to claim 4. The single crystal semiconductor is silicon, and the single crystal semiconductor is silicon.
The predetermined surface is the (110) surface of the silicon.
The plurality of resistors extend in the crystal orientation <110> direction while being separated from each other in the crystal orientation <110> direction.
The sensor directs the crystal orientation <110> direction to a target direction for detecting the strain of the detection target.
The mechanical component with a sensor according to claim 4. When the joint portion is viewed in a plan view from the predetermined surface side, at least two positions of the substrate sandwiching the plurality of resistors are fixed to the metal plate.
Of the opposite sides of the predetermined surface, the predetermined regions corresponding to the opposite sides of the plurality of resistors are in a non-fixed state with the metal plate.
The mechanical component with a sensor according to any one of claims 4 to 6. It is a method of manufacturing a mechanical part with a sensor that attaches a sensor to detect strain to a metal part including a metal detection target.
A step of solid-phase joining a metal joint provided on one surface of the sensor and a metal plate that transmits the strain to be detected to the sensor.
A step of fixing the metal plate and the detection target by welding, solid phase bonding, or brazing material.
Equipped with
The solid-phase bonding temperature between the metal plate and the bonding portion is lower than the solid-phase bonding temperature when the detection target and the bonding portion are solid-phase bonded.
How to manufacture machine parts with sensors.

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