JP2022035061A - Cell manufacturing method - Google Patents

Abstract

To provide a method of manufacturing a plurality of cells by cutting a substrate in which a filament-like electrode pattern is formed on one face, without stripping the electrode pattern.SOLUTION: A cell manufacturing method of forming cells by cutting a workpiece including a substrate and a filament-like electrode pattern 3 formed on one face 1a of the substrate along a predetermined dividing line by a cutting device comprising an annular cutting blade and a chuck table, comprises: a strip preventive member disposing step of disposing a strip preventive member at a position including a region 9 where the filament-like electrode pattern 3 on the one face 1a of the substrate crosses the predetermined dividing line; a holding step of sucking and holding another face 1b of the substrate with the chuck table of the cutting device, and exposing the one face side of the substrate upward; a dividing step of cutting the substrate along the predetermined dividing line with the chuck table and dividing the substrate into a plurality of cells; and a strip preventive member removing step of removing the strip preventive member from the cells.SELECTED DRAWING: Figure 4

Description

The present invention relates to a cell manufacturing method for manufacturing a plurality of cells by cutting a substrate having a thin wire-shaped electrode formed on one surface with a cutting blade.

Solar cells are widely used as photoelectric conversion devices that convert light energy such as sunlight into electric power for household and industrial use. As a high-performance solar cell, a silicon single crystal solar cell is known (see, for example, Patent Document 1).

In the method for manufacturing a cell constituting a silicon single crystal solar cell, for example, after creating a cylindrical silicon single crystal ingot, a part of the ingot is cut off and shaped into a prismatic shape. Then, the prismatic ingot is sliced to form a plurality of square substrates. Then, a plurality of photoelectric conversion elements are formed on the substrate, and a fine wire-shaped electrode pattern is formed on one surface of the substrate. Then, the substrate is cut by a cutting device provided with an annular cutting blade, and the substrate is divided into elements to form a plurality of cells (see, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 11-298023 Japanese Unexamined Patent Publication No. 2013-80784

The cutting blade cuts the substrate in a straight line to divide the substrate. At this time, the cutting blade cuts the fine wire-shaped electrode pattern together with the substrate. Here, depending on the compatibility between the material of the substrate and the electrode pattern, the flatness of the one surface of the substrate, and the shape of the electrode pattern, the adhesion force of the electrode pattern to the one surface may be reduced.

Therefore, when a substrate having an electrode pattern formed on one surface is used as a workpiece and the workpiece is cut with a cutting device, a part of the electrode pattern may be peeled off from the substrate without being able to withstand the cutting load. be. In particular, when the traveling direction of the cutting blade and the extending direction of the electrode pattern are orthogonal to each other in the region cut into the cutting blade, the electrode pattern is likely to be peeled off. A cell in which the electrode pattern is peeled off is a defective product.

The present invention has been made in view of such a problem, and an object of the present invention is to cut a substrate in which a fine line-shaped electrode pattern is formed on one surface without causing peeling of the electrode pattern. It is to provide the manufacturing method of the cell which manufactures a plurality of cells.

According to one aspect of the present invention, a cutting apparatus comprising an annular cutting blade and a chuck table, comprising a substrate and a fine linear electrode pattern formed on one surface of the substrate. A method for manufacturing a cell in which an object is cut along a planned division line to form a cell, in which a region where the fine linear electrode pattern on one surface of the substrate intersects with the planned division line is formed. The peeling prevention member disposing step for disposing the peeling prevention member at the including portion and the chuck table of the cutting device suck and hold the other surface side of the substrate, and the one surface side of the substrate is upwardly held. A holding step to be exposed, a dividing step in which the substrate is cut along the planned division line by the cutting blade and divided into a plurality of cells, and a peeling prevention member removing step for removing the peeling prevention member from the cells. A method for manufacturing a cell is provided.

Preferably, in the peeling prevention member disposing step, a resin material is supplied to the portion on one surface of the substrate to solidify the resin material, and a water-soluble resin is provided at the location as the peeling prevention member. In the peeling prevention member removing step, the water-soluble resin is removed by supplying water to the cell.

Alternatively, preferably, in the peeling prevention member disposing step, the portion of the one surface of the substrate is covered with a resin sheet that functions as the peeling prevention member, and the resin sheet is placed at a temperature equal to or lower than the melting point of the resin sheet. The resin sheet is brought into close contact with the portion by heating and softening, and in the peeling prevention member removing step, the resin sheet in close contact with the cell is peeled from the cell.

Preferably, the substrate is a silicon single crystal substrate, and the fine wire-shaped electrode pattern is a metal material containing copper as a main component.

Further, preferably, the substrate is provided with a photoelectric conversion element in each region partitioned by the planned division line, and the cell formed in the division step is a solar cell.

In the cell manufacturing method according to one aspect of the present invention, a peeling prevention member such as a water-soluble resin or a resin sheet is arranged on one surface provided with an electrode pattern of the substrate before cutting and dividing the substrate. Set up. When the substrate is cut with a cutting blade in this state, the load applied to the electrode pattern from the cutting blade is relaxed by the peeling prevention member, or the electrode pattern is pressed against the substrate by the peeling prevention member, so that the electrode pattern is peeled off. Is suppressed. Then, the peeling prevention member is removed from the obtained plurality of cells to obtain a desired cell.

Therefore, according to the present invention, there is provided a cell manufacturing method for manufacturing a plurality of cells by cutting a substrate having a fine line-shaped electrode pattern formed on one surface without causing peeling of the electrode pattern.

FIG. 1A is a plan view schematically showing a substrate, and FIG. 1B is a cross-sectional view schematically showing a substrate. It is a top view which shows the part of one surface of a substrate enlarged and schematically. It is a top view schematically showing the place where the peeling prevention member of a substrate is arranged. It is sectional drawing which shows an example of the peeling prevention member arrangement step schematically. It is a perspective view which shows typically the frame unit. It is a perspective view which shows the division step schematically. It is a perspective view which shows an example of the peeling prevention member removal step schematically. It is a perspective view which shows the other example of the peeling prevention member arrangement step schematically. It is a flowchart explaining the flow of each step of the cell manufacturing method.

An embodiment of the present invention will be described with reference to the accompanying drawings. First, a substrate processed by the cell manufacturing method according to the present embodiment will be described. 1 (A) is a plan view schematically showing the substrate 1, and FIG. 1 (B) schematically shows a cross section obtained by cutting the substrate 1 in the cross section A shown in FIG. 1 (A). There is. Further, FIG. 2 is an enlarged plan view schematically showing a part of one surface 1a of the substrate 1. A fine wire-shaped electrode pattern 3 is provided on one surface 1a of the substrate 1.

The substrate 1 is, for example, a substrate made of silicon (Si), silicon carbide (SiC), gallium nitride (GaN), or other semiconductor material. The substrate 1 is, for example, a single crystal substrate. The substrate 1 is, for example, square in shape and is formed by cutting out from a prismatic ingot.

Alternatively, the substrate 1 is a substantially disk-shaped substrate made of a material such as sapphire, glass, or quartz. The glass is, for example, alkaline glass, non-alkali glass, soda-lime glass, lead glass, borosilicate glass, quartz glass and the like.

A planned division line is set on the substrate 1, and an element such as a photoelectric conversion element or an IC is provided in each region of one surface 1a of the substrate 1 partitioned by the scheduled division line. Then, when the substrate 1 is divided along the planned division line, individual cells, IC chips, and the like that can be used for the solar cell are formed.

The electrode pattern 3 is a layer containing, for example, a highly conductive metal material such as gold, silver, copper, and aluminum as a main component, and tin, tungsten, or the like may be added. The thickness of the electrode pattern 3 is, for example, about 40 μm, and functions as an electrode of a photoelectric conversion element provided on the substrate 1.

For example, the electrode pattern 3 is formed by disposing a metal film on one surface 1a of the substrate 1 and patterning the metal film into a predetermined shape by a method such as photolithography. FIG. 2 is an enlarged plan view schematically showing one surface 1a of the substrate 1 on which the electrode pattern 3 is arranged. In FIG. 2, the electrode pattern 3 is hatched for easy understanding. The electrode pattern 3 is formed by being patterned so as to be divided into two regions having a comb tooth shape that mesh with each other so as to be adjacent to each other with a long length, for example. The electrode pattern 3 is composed of a large number of fine line-shaped regions constituting the comb tooth shape.

Next, a cutting device that cuts and divides the substrate 1 will be described. FIG. 6 includes a perspective view schematically showing a partial configuration of the cutting device 2. The cutting device 2 includes a chuck table 4 that sucks and holds the workpiece, and a cutting unit 6 that is equipped with an annular cutting blade 12 that cuts the workpiece held by the chuck table 4.

The chuck table 4 includes a porous member exposed on the upper surface, a suction path having one end connected to the porous member, and a suction source connected to the other end of the suction path. When the substrate 1 to be a workpiece is placed on the upper surface of the chuck table 4 and the suction source is operated, the substrate 1 is suction-held by the chuck table 4. Further, the chuck table 4 and the cutting unit 6 are relatively movable in a direction parallel to the upper surface of the chuck table 4 (for example, in the X-axis direction). Also, the chuck table 4 is rotatable around an axis perpendicular to the top surface.

The cutting unit 6 includes a spindle 10 along the Y-axis direction and a spindle housing 8 that rotatably accommodates the proximal end side of the spindle 10. A cutting blade 12 is fixed to the tip of the spindle 10 by a flange mechanism (not shown).

The spindle housing 8 is supported by an elevating mechanism (not shown), and can be elevated by the elevating mechanism. Further, inside the spindle housing 8, a rotation drive source such as a motor (not shown) for rotating the spindle 10 is provided. When the rotary drive source is operated, the cutting blade 12 mounted on the tip of the spindle 10 rotates.

The cutting blade 12 includes, for example, an annular base 14 made of a material such as aluminum, and a cutting blade 16 fixed to a peripheral portion of the base 14. The cutting edge 16 includes diamond abrasive grains and a binder formed of a material such as resin, metal, or ceramics to disperse and fix the diamond abrasive grains.

When the rotating cutting blade 12 is cut into the workpiece, the diamond abrasive grains exposed from the binder come into contact with the workpiece, and the workpiece is cut. The diamond abrasive grains are consumed while the workpiece is being cut, but the binder is also consumed and new diamond abrasive grains are exposed, so that the cutting ability of the cutting blade 12 is maintained.

When the substrate 1 is cut along the scheduled division line 7, a load is applied to the electrode pattern 3 formed on one surface 1a of the substrate 1, and the electrode pattern 3 may be peeled off from the substrate 1. In particular, the electrode pattern 3 is likely to be peeled off in the region where the planned division line 7 and the extension direction of the thin line-shaped electrode pattern 3 intersect. When the electrode pattern 3 is peeled off, the cell produced by dividing the substrate 1 becomes a defective product.

Therefore, in the cell manufacturing method according to the present embodiment, the substrate 1 is cut and divided while suppressing the peeling of the electrode pattern 3. Next, each step of the cell manufacturing method according to the present embodiment will be described. FIG. 9 is a flowchart illustrating a flow of each step of the cell manufacturing method according to the present embodiment.

In the cell manufacturing method according to the present embodiment, first, a peeling prevention member is arranged at a position including a region where the thin line-shaped electrode pattern 3 on one surface 1a of the substrate 1 and the planned division line 7 intersect. The peeling prevention member arrangement step S10 is carried out. For example, the peeling prevention member is a water-soluble resin or a resin sheet.

FIG. 3 is a plan view schematically showing a portion where the peeling prevention member is arranged. As shown in FIG. 3, the wiring pattern 3 tends to extend so as to intersect the planned division line 7 at the outer peripheral portion 3a of one surface 1a of the substrate 1. The peeling prevention member is arranged at a position including a region 9 where the planned division line 7 and the extension direction of the fine line-shaped electrode pattern 3 intersect. In the region 9, when the substrate 1 is cut by the cutting blade 12, the electrode pattern 3 is particularly likely to be peeled off, and the arrangement of the peeling prevention member is particularly desired.

However, the place where the peeling prevention member is arranged is not limited to this, and the peeling prevention member overlaps the entire length of the planned division line 7 along the planned division line 7 so that the peeling prevention member overlaps the one surface 1a of the substrate 1. It may be arranged in. In this case, the peeling of the electrode pattern 3 is suppressed over the entire length of the planned division line 7.

First, a method for manufacturing a cell according to the present embodiment will be described by taking the case where the peeling prevention member is a water-soluble resin as an example. In this case, in the peeling prevention member disposing step S10, the resin material that is the raw material of the water-soluble resin is supplied to the portion of one surface 1a of the substrate 1 including the region 9. FIG. 4 is a cross-sectional view schematically showing an example of the peeling prevention member arrangement step S10.

Here, as the liquid resin material 11, a material that solidifies when dried in air to become a water-soluble resin can be used. For example, as the liquid resin material 11, polyvinyl alcohol, polyvinylpyrrolidone, the "HOGOMAX (registered trademark)" series manufactured by DISCO Corporation, and the like can be used.

In the peeling prevention member arrangement step S10, the nozzle 18 is positioned above the region 9. Then, the liquid resin material 11 is dropped from the nozzle 18 onto the region 9 of one surface 1a of the substrate 1. This is done in each of the regions 9 of the one surface 1a. Then, the substrate 1 is left in the air for 10 minutes or more and 30 minutes or less to solidify the resin material 11, and a water-soluble resin is used as a peeling prevention member 15 at a portion of one surface 1a of the substrate 1 including the region 9. 13 is provided.

When the liquid resin material 11 is supplied to the substrate 1, the liquid resin material 11 enters the recess 5 between the electrode patterns 3 and spreads along the electrode pattern 3 due to the capillary phenomenon. Then, the bottom of the recess 5 between the fine line-shaped electrode patterns 3 is filled with the resin material 11 in the vicinity of the region 9. Further, the part of the resin material 11 also enters a slight gap between the electrode pattern 3 and the substrate 1.

Here, it is not always necessary for the resin material 11 to cover the upper surface of the electrode pattern 3, and it is sufficient to supply a few drops of the resin material 11 to the substrate 1 from the nozzle 18. Even if the upper surface of the electrode pattern 3 is not covered with the water-soluble resin 13, the peeling of the electrode pattern 3 can be sufficiently suppressed in the division step S30 as described later.

In the cell manufacturing method according to the present embodiment, next, the other surface 1b side of the substrate 1 is sucked and held by the chuck table 4 of the cutting device 2, and the one surface 1a side of the substrate 1 is exposed upward. Hold step S20 is carried out. Before mounting the substrate 1 on the chuck table 4, as shown in FIG. 5, a ring frame 19 having an opening 19a having a diameter larger than that of the substrate 1, a dicing tape 17 having a diameter larger than the opening 19a, and the substrate 1 may be integrated to form the frame unit 21.

FIG. 5 is a perspective view schematically showing the frame unit 21. The frame unit 21 includes a dicing tape 17 attached to the other surface 1b of the substrate 1 and a ring frame 19 made of metal or the like attached to the outer peripheral portion of the dicing tape 17. If the substrate 1 is handled in the state of the frame unit 21, the substrate 1 can be easily handled.

Further, the individual cells formed by dividing the substrate 1 are continuously stably supported by the dicing tape 17. Then, when the dicing tape 17 is expanded radially outward inside the opening 19a of the ring frame 19 after the cells are formed, a gap is formed between the individual cells, and the pick-up of each cell becomes easy. FIG. 6 includes a perspective view schematically showing the substrate 1 placed on the chuck table 4 via the dicing tape 17 and sucked and held by the chuck table 4.

Next, the substrate 1 is cut along the scheduled division line 7 by the cutting blade 12, and the division step S30 for dividing into a plurality of cells is performed. FIG. 6 is a perspective view schematically showing the division step S30.

In the division step S30, first, the cutting edge 16 of the cutting blade 12 and one scheduled division line 7 are arranged along the machining feed direction (X-axis direction). Then, by rotating the spindle 10, the cutting blade 12 is rotated at a rotation speed of about 30,000 rotations per minute. After that, the substrate 1 and the cutting blade 12 are relatively moved in the machining feed direction, and the cutting blade 16 is cut into the substrate 1. Then, the substrate 1 is cut and a cutting groove 7a along the scheduled division line 7 is formed on the substrate 1.

After cutting the substrate 1 along one scheduled division line 7, the substrate 1 and the cutting blade 12 are relatively moved along the indexing feed direction (Y-axis direction) to move to the other scheduled division line 7. The substrate 1 is cut along the line. In this way, when the substrate 1 is cut along all the scheduled division lines 7, the substrate 1 is divided by the cutting groove 7a to form individual cells 23.

Here, the cutting blade 12 that cuts into the substrate 1 also cuts into the electrode pattern 3 formed on one surface 1a of the substrate 1. Depending on the material of the one surface 1a of the substrate 1 and the shape and material of the electrode pattern 3, the adhesion of the electrode pattern 3 to the substrate 1 may be weak. In this case, if the peeling prevention member 15 is not arranged on one surface 1a of the substrate 1, the electrode pattern 3 may be peeled off due to the load when the cutting blade 12 cuts. In particular, peeling is likely to occur in the region 9 where the planned division line 7 and the extension direction of the fine line-shaped electrode pattern 3 intersect.

However, in the cell manufacturing method according to the present embodiment, the peeling prevention member arrangement step S10 is carried out before the division step S30 is carried out, and the water-soluble resin 13 is provided as the peeling prevention member 15 on one surface 1a of the substrate 1. It is provided. The water-soluble resin 13 has a function of assisting the adhesion of the electrode pattern 3 to the one surface 1a of the substrate 1, and the peeling of the electrode pattern 3 is suppressed.

In particular, when the water-soluble resin 13 is contained in a slight gap between the electrode pattern 3 and one surface 1a, the water-soluble resin 13 functions as an adhesive for adhering the electrode pattern 3 to the one surface 1a. However, the peeling of the electrode pattern 3 is strongly suppressed. Then, when the water-soluble resin 13 functioning as the peeling prevention member 15 is provided at the portion where the peeling is likely to occur including the region 9 where the scheduled division line 7 and the extension direction of the fine line-shaped electrode pattern 3 intersect. Peeling of the electrode pattern 3 is efficiently suppressed.

Next, the peeling prevention member removing step S40 for removing the peeling prevention member 15 from the individual cells 23 formed by dividing the substrate 1 is performed. FIG. 7 is a perspective view schematically showing an example of the peeling prevention member removing step S40. In the peeling prevention member removing step S40, the peeling prevention member 15 is removed from the cell 23 by a method suitable for the material and form of the peeling prevention member 15.

For example, when the peeling prevention member 15 is a water-soluble resin 13, the frame unit 21 is moved to the cleaning device 20, and the cleaning device 20 cleans each cell 23 included in the frame unit 21. When the substrate 1 is cut, cutting chips are generated from the substrate 1 and the cutting blade 12 and diffused onto the frame unit 21. The cleaning device 20 is mainly used to remove cutting chips from the frame unit 21.

The cleaning device 20 includes a spinner table 24 that can rotate while holding the frame unit 21, and a cleaning nozzle 26 that injects cleaning liquid 26a onto the frame unit 21 held by the spinner table 24 from above. For example, pure water or the like can be used as the cleaning liquid 26a, and a surfactant may be mixed with the cleaning liquid 26a. Further, a high-pressure gas may be mixed with the cleaning liquid 26a, and two high-pressure fluids may be injected from the cleaning nozzle 26.

In the peeling prevention member removing step S40, first, the frame unit 21 is held by the spinner table 24, and the spinner table 24 is rotated at high speed. Next, the cleaning nozzle 26 is reciprocated in the horizontal plane above the frame unit 21 while ejecting the cleaning liquid 26a from the cleaning nozzle 26. Then, the frame unit 21 is washed with the cleaning liquid 26a, and the peeling prevention member 15 (water-soluble resin 13) remaining in the cell 23 is removed.

After that, the supply of the cleaning liquid 26a from the cleaning nozzle 26 is stopped, the frame unit 21 is dried, the dicing tape 17 is expanded radially outward, the distance between the plurality of cells 23 is widened, and the cells 23 are picked up from the dicing tape 17. Then, individual cells 23 are obtained. The cell 23 is, for example, a silicon single crystal solar cell.

As described above, in the cell manufacturing method according to the present embodiment, the peeling of the electrode pattern 3 is suppressed when the substrate 1 is cut and divided, so that the cell is a good product in which the peeling of the electrode pattern 3 does not occur. 23 is obtained.

The peeling prevention member 15 disposed at a predetermined position on one surface 1a of the substrate 1 is not limited to the water-soluble resin. For example, the peeling prevention member 15 may be a resin sheet. Next, a method of manufacturing a cell according to a modified example when a resin sheet is used as the peeling prevention member 15 will be described. In the cell manufacturing method according to the modification, there is no change other than using a resin sheet for the peeling prevention member 15, and there is no change in the holding step S20 and the dividing step S30. Therefore, in the holding step S20 and the dividing step S30. The explanation is omitted.

FIG. 8 is a plan view schematically showing the peeling prevention member arrangement step S10 in the cell manufacturing method according to the modified example. Here, the resin sheet 25 used as the peeling prevention member 15 will be described. The resin sheet 25 is, for example, a polyolefin-based sheet, a polyethylene-based sheet, or the like, and may be a single layer or laminated. Here, the adhesive layer is not formed on the resin sheet 25, and it cannot be arranged on one surface 1a of the substrate 1 as it is.

In the peeling prevention member arrangement step S10 in the cell manufacturing method according to the modified example, first, the region 9 where the planned division line 7 of one surface 1a of the substrate 1 and the extension direction of the fine line-shaped electrode pattern 3 intersect. Place the resin sheet 25 on the place including. Then, the resin sheet 25 is heated at a temperature equal to or higher than the softening point and lower than the melting point to soften the resin sheet 25.

The heating of the resin sheet 25 is carried out, for example, by heating the substrate 1 with which the resin sheet 25 comes into contact. Alternatively, a heated plate is placed on the upper surface of the resin sheet 25 to heat the resin sheet 25. Further, in the peeling prevention member disposing step S10, the resin sheet 25 may be heated by supplying hot air to the resin sheet 25 or irradiating the resin sheet 25 with infrared rays.

When the resin sheet 25 is heated and softened, the resin sheet 25 is deformed following the shape of the electrode pattern 3. Then, when the heating of the resin sheet 25 is stopped, the resin sheet 25 comes into close contact with the electrode pattern 3. Here, when the resin sheet 25 is pressed from above while heating the resin sheet 25, the resin sheet 25 enters the recesses 5 between the fine line-shaped electrode patterns 3, and the resin sheet 25 is more firmly adhered to the electrode pattern 3. can.

As described above, in the peeling prevention member disposing step S10, the resin sheet 25 functioning as the peeling prevention member 15 covers the portion of one surface 1a of the substrate 1, and the resin sheet is at a temperature equal to or lower than the melting point of the resin sheet 25. 25 is heated to soften it, and the resin sheet 25 is brought into close contact with the portion. When the resin sheet 25 is in close contact with the electrode pattern 3, when the substrate 1 is cut by the cutting blade 12 in the division step S30, the electrode pattern 3 is pressed from above by the resin sheet 25, so that the electrode pattern 3 is peeled off. It is suppressed.

Next, the peeling prevention member removing step S40 in the cell manufacturing method according to the modified example will be described. In the peeling prevention member removing step S40, the resin sheet 25 in close contact with the cell 23 formed by dividing the substrate 1 is peeled from the cell 23. The peeling of the resin sheet 25 can be carried out, for example, by pulling up the resin sheet 25 from the end portion. Here, the resin sheet 25 does not have an adhesive layer and is not attached to the substrate 1 by the adhesive layer. Therefore, the resin sheet 25 can be easily removed from the substrate 1 as compared with the case where the tape is attached to the substrate 1 with the adhesive layer.

In the peeling prevention member removing step S40, for example, the resin sheet 25 may be heated again at a temperature equal to or higher than the softening point and lower than the melting point to soften the resin sheet 25, and the softened resin sheet 25 may be peeled from the substrate 1. .. When the resin sheet 25 is heated and softened, the adhesion of the resin sheet 25 to the substrate 1 may be reduced, and the resin sheet 25 can be removed relatively easily.

As described above, even if the resin sheet 25 is used instead of the water-soluble resin 13 as the peeling prevention member 15, the peeling of the electrode pattern 3 can be prevented when the substrate 1 is cut. Therefore, a non-defective cell 23 in which the electrode pattern 3 is not peeled off can be obtained.

The present invention is not limited to the description of the above embodiment, and can be modified in various ways. For example, in the above embodiment, when the water-soluble resin 13 is used as the peeling prevention member 15, it has been mainly described that the recess 5 between the fine line-shaped electrode patterns 3 is filled with the water-soluble resin 13. One aspect of the invention is not limited to this.

For example, in the peeling prevention member disposing step S10, the water-soluble resin 13 may be provided on the entire surface of one surface 1a of the substrate 1 by a method such as a spin coating method. In this case, it is possible to prevent the electrode pattern 3 from peeling off at a location other than the region 9 where the planned division line 7 and the extension direction of the thin line-shaped electrode pattern 3 intersect. Moreover, since the cutting chips generated by cutting diffuse on the water-soluble resin 13 and do not directly adhere to the one surface 1a of the substrate 1, the cutting chips can be easily removed when the water-soluble resin 13 is removed. ..

The structure, method and the like according to the above embodiment can be appropriately modified and carried out as long as they do not deviate from the scope of the object of the present invention.

1 Substrate 1a One side 1b The other side 3 Electrode pattern 3a Outer circumference 5 Concave part 7 Scheduled division line 7a Cutting groove 9 Area 11 Resin material 13 Water-soluble resin 15 Peeling prevention member 17 Dying tape 19 Ring frame 19a Opening 21 Frame unit 23 Cell 25 Resin sheet 2 Cutting device 4 Chuck table 6 Cutting unit 8 Spindle housing 10 Spindle 12 Cutting blade 14 Base 16 Cutting blade 18 Nozzle 20 Cleaning device 24 Spinner table 26 Cleaning nozzle 26a Cleaning liquid

Claims (5)

A cutting device including an annular cutting blade and a chuck table cuts a work piece including a substrate and a fine line-shaped electrode pattern formed on one surface of the substrate along a planned division line. It is a method of manufacturing a cell to form a cell.
A peeling prevention member disposing step for disposing a peeling prevention member at a position including a region where the fine line-shaped electrode pattern on one surface of the substrate and the planned division line intersect.
A holding step of sucking and holding the other side of the substrate with the chuck table of the cutting device and exposing the one side of the board upward.
A division step of cutting the substrate along the planned division line by the cutting blade and dividing the substrate into a plurality of cells.
A peeling prevention member removing step for removing the peeling prevention member from the cell,
A method for manufacturing a cell, which comprises. In the peeling prevention member disposing step, a resin material is supplied to the portion on one surface of the substrate to solidify the resin material, and a water-soluble resin is provided at the location as the peeling prevention member.
The cell manufacturing method according to claim 1, wherein in the peeling prevention member removing step, the water-soluble resin is removed by supplying water to the cell. In the peeling prevention member disposing step, the resin sheet functioning as the peeling prevention member covers the portion on one surface of the substrate, and the resin sheet is heated and softened at a temperature equal to or lower than the melting point of the resin sheet. , The resin sheet is brought into close contact with the place,
The cell manufacturing method according to claim 1, wherein in the peeling prevention member removing step, the resin sheet in close contact with the cell is peeled from the cell. The substrate is a silicon single crystal substrate.
The cell manufacturing method according to any one of claims 1 to 3, wherein the fine wire-shaped electrode pattern is a metal material containing copper as a main component. The substrate is provided with photoelectric conversion elements in each region partitioned by the planned division line.
The cell manufacturing method according to any one of claims 1 to 4, wherein the cell formed in the division step is a solar cell.

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