JP2022034807A - Connection structure of inkjet head and control substrate and printing device using the same - Google Patents

Abstract

To make it possible to prevent damage during connection, not to inhibit the control substrate from being downsized and suppress cost increase, regardless of a working condition.SOLUTION: A connector 15 is slid along a surface of a guide plate 29, and when the connector 15 reaches a position of a guide opening 49, the connector 15 can be pushed into the guide opening 49. This can prevent the connector 15 and a connector 35 from being damaged during connection, even under an unclear working condition under which a worker cannot visually observe the connector 35. Further, it is enough just to attach the guide plate 29 to the control substrate 27, which prevents an outer shape of the connector 35 from enlarging. Therefore, the control substrate 27 is not inhibited from being downsized. Further, it is not necessary to remodel the control substrate 27 and the connectors 15 and 35, so that cost increase can be suppressed.SELECTED DRAWING: Figure 4

Description

The present invention has a connection structure between an inkjet head and a control board that electrically connects an inkjet head that ejects ink droplets and a control board that outputs an electric signal for operating the inkjet head, and a printing device using the same. Regarding.

The inkjet printing device includes an inkjet head. The inkjet head ejects ink droplets to print on a printing medium. The inkjet head ejects ink droplets. Therefore, in the inkjet head, an electric signal is given from the control board. The inkjet head and the control board adopt a configuration in case one of them fails and replacement work is required. Specifically, the inkjet head and the control board are detachably connected by a connector.

The connector is composed of a plug (so-called male connector) and a socket (so-called female connector). The plug and socket each have a contact inside the housing. The contacts are made of conductive metal to carry electrical signals. For example, in the above example, the plug is attached to the control board side. Further, the socket is attached to the inkjet head side. When making an electrical connection between the inkjet head and the control board, the socket of the inkjet head and the plug of the control board are connected.

However, the inkjet head and the control substrate are generally arranged in a narrow space. This is due to the fact that there are many requests for miniaturization of the housing of the inkjet printing device. Therefore, it is difficult for the operator to visually check the plug of the control board, and the socket of the inkjet head is connected to the plug of the control board by fumbling. At that time, the socket is groped on the control board so that the socket and the plug are in a facing position. Therefore, the socket housing may damage the plug contacts and the circuit of the control board.

In order to eliminate such inconvenience, various connection structures have been conventionally proposed so that the connector can be easily connected.

As a first device, there is a device in which a guide pin is provided on one of a plug or a socket of a connector and a guide hole is provided in a member to which the other is attached (see, for example, Patent Document 1).

As a second device, a guide pin is provided on one of the members to which the plug or socket of the connector is attached, and a guide hole is provided on the member to which the other is attached (see, for example, Patent Document 2).

As a third device, there is a connector connection auxiliary tool that improves the connection workability between the plug of the connector and the socket (see, for example, Patent Document 3). In this third device, the plug to be connected and the socket are placed on the auxiliary tool for connecting the connector. Then slide one of the sockets or plugs towards the other. As a result, the socket and the plug can be connected on the auxiliary tool for connecting the connector.

Japanese Unexamined Patent Publication No. 2008-01592 Japanese Unexamined Patent Publication No. 2002-329535 Japanese Unexamined Patent Publication No. 2014-4063706

However, in the case of the conventional example having such a configuration, there are the following problems.
That is, in the conventional first device and second device, there is a problem when the guide pin and the guide hole can be aligned almost accurately and good working conditions are established so that the guide pin can be smoothly inserted into the guide hole. There is no. However, in a printing apparatus that is forced to connect in a narrow space where it is difficult to see visually, it is not possible to perform the work under such good working conditions. Therefore, the guide pin may erroneously contact the contact or circuit of the connector, damaging the contact or circuit of the connector. Further, in the first device, since it is necessary to modify the connector by adding a guide pin, the size of the connector becomes large. Therefore, it is disadvantageous for miniaturization and high density. Moreover, the cost of the connector is high because it is a special connector different from the standard connector on the market.

In the second device, it is necessary to form a guide pin or a guide hole in the control board. Therefore, the design of the control board is changed. In addition, it becomes necessary to increase the size of the control board in order to arrange the same number of parts. Therefore, the cost of the control board becomes high.

Further, in the third device, when performing the work, it is necessary to prepare a connector connection auxiliary tool having a special guide shape corresponding to the shape of the connector. Further, at the time of work, in order to place the plug and the socket on the connector connection auxiliary tool, it is necessary for the operator to directly visually observe the work. Therefore, there is a problem that it is not realistic to work in a narrow space.

The present invention has been made in view of such circumstances, and is an inkjet head and a control that can prevent damage at the time of connection, do not hinder the miniaturization of the control board, and suppress the cost increase regardless of the working conditions. It is an object of the present invention to provide a connection structure with a substrate and a printing apparatus using the same.

The present invention has the following configuration in order to achieve such an object.
That is, the invention according to claim 1 is a connection between an inkjet head and a control board that electrically connects an inkjet head that ejects ink droplets and a control board that outputs an electric signal for operating the inkjet head. In the structure, the board connector attached to the control board and the head connector connectable to the board connector and attached to the inkjet head are plate-shaped and attached along the surface of the control board. The guide plate is formed so as to surround the outer shape of the board connector when viewed from the insertion / removal direction which is moved when the head connector is connected to the board connector. It is characterized by having a guide opening that allows the head connector to be connected to the board connector.

[Action / Effect] According to the invention of claim 1, the operator slides the head connector along the surface of the guide plate. When the head connector comes to the position of the guide opening, the head connector can be pushed into the guide opening. Therefore, it is possible to prevent damage to the board connector and the head connector at the time of connection even under a fumbling work condition in which the operator cannot visually check the board connector. Moreover, the guide plate is simply attached to the control board. Therefore, the outer shape of the board connector does not become large. Therefore, it does not hinder the miniaturization of the control board. Furthermore, there is no need to modify the control board or connector. Therefore, the cost increase can be suppressed.

Further, in the present invention, when the guide plate is attached to the control board, the height of the surface around the guide opening on the side opposite to the control board is higher than the height of the board connector. Higher is preferable (claim 2).

The board connector does not protrude from the guide plate. Therefore, even if the operator slides the head connector along the surface of the guide plate, the head connector and the board connector do not come into contact with each other. Therefore, damage to the head connector and the board connector can be prevented.

Further, in the present invention, the guide opening is configured so that when the head connector advances and retreats from the guide opening, the head connector allows the substrate connector to advance and retreat only along the insertion / removal direction. (Claim 3).

A guide opening is configured so that the head connector can move forward and backward only along the insertion / removal direction with respect to the board connector. Therefore, the head connector can be prevented from being separated from the insertion / removal direction. As a result, the head connector is not inserted and removed diagonally with respect to the board connector. Therefore, the head connector and the board connector do not deviate from the normal insertion / extraction direction and come into contact with each other, so that damage can be prevented.

Further, in the present invention, the guide plate is formed so that only the edge portion of the guide opening is projected toward the substrate connector side, and when the head connector is advanced or retracted in the insertion / removal direction at the guide opening. It is preferable to provide a guide portion for suppressing an inclination in a direction orthogonal to the insertion / extraction direction (claim 4).

The guide portion can prevent the head connector from tilting in a direction orthogonal to the insertion / removal direction. As a result, damage to the board connector and the head connector due to tilting at the time of insertion and removal can be suppressed. Further, since the guide plate excluding the guide portion can be made thin, the weight can be reduced.

Further, in the present invention, the guide plate has a thickness capable of suppressing inclination in a direction orthogonal to the insertion / extraction direction when the head connector is advanced / retracted in the insertion / removal direction at the guide opening. Preferred (claim 5).

The thickness of the guide plate can prevent the head connector from tilting in a direction orthogonal to the insertion / removal direction. As a result, damage to the board connector and the head connector due to tilting at the time of insertion and removal can be suppressed.

Further, in the present invention, the control board includes a plurality of alignment pins erected along the insertion / removal direction, and the guide plate has a plurality of inner diameters corresponding to the outer diameters of the plurality of alignment pins. It is preferable that the guide plate is provided with a plurality of alignment holes, and the guide plate is arranged so as to face the control board by inserting the plurality of alignment pins into the plurality of alignment holes (claim 6).

The guide plate is placed facing the control board by the alignment pin and the alignment hole. Therefore, the positions of the guide opening and the board connector can be accurately aligned. As a result, it is possible to prevent a connection failure due to a positional deviation between the guide opening and the board connector.

Further, in the present invention, it is preferable that the guide plate is made of a heat-conducting material (claim 7).

The control board generates heat with the electrical operation of operating the inkjet head. However, if the guide plate is made of a heat transfer material, it is possible to promote the release of heat generated in the control substrate through the guide plate.

Further, in the present invention, it is preferable that the guide plate is provided with a heat dissipation block made of a heat-conducting and insulating material on the surface facing the control substrate (claim 8).

The heat dissipation block can promote heat dissipation from the control board. Since the heat dissipation block is insulating, it does not adversely affect the circuit of the control board.

Further, in the present invention, the inkjet head includes an inkjet head main body and wiring having one end connected to the inkjet head main body and extended, and the head connector is connected to the other end side of the wiring. (Claim 9).

The degree of freedom can be increased when sliding the other end side of the wiring extending from the inkjet body along the guide plate. Therefore, workability can be improved when the head connector is slid along the surface of the guide plate.

Further, in the present invention, it is preferable that the guide plate is provided with a connection disconnecting mechanism for removing the head connector from the control board so as to be separated from the control board in the insertion / removal direction (claim 10).

When the head connector is connected to the board connector, the head connector is buried in the guide opening of the guide plate. Therefore, it is not easy to remove the head connector. Therefore, the head connector embedded in the guide opening can be easily removed by the connection disconnection mechanism.

Further, in the present invention, the inkjet head for ejecting ink droplets and the control substrate for outputting an electric signal for operating the inkjet head are the inkjet head and the control substrate according to any one of claims 1 to 10. A print head configured by being connected by a connection structure, a transport mechanism for transporting a print medium, and a frame to which the print head is attached so that the print head can print on the print medium are provided. The frame is preferably characterized in that the print head is attached in a state where the guide opening is difficult to see at the time of maintenance work (claim 11).

The print head for printing on the print medium conveyed by the transfer mechanism is attached to the frame in a state where the guide opening is difficult to see during maintenance work. The operator can slide the head connector along the surface of the guide plate, and when the head connector comes to the position of the guide opening, the head connector can be pushed into the guide opening. Therefore, even under working conditions in which the operator cannot see the guide opening visually, it is possible to prevent damage to the board connector and the head connector during connection. Moreover, the guide plate is simply attached to the control board. Therefore, the outer shape of the board connector does not become large. Therefore, it does not hinder the miniaturization of the control board. Furthermore, there is no need to modify the control board or connector. Therefore, the cost increase can be suppressed.

According to the connection structure between the inkjet head and the control board according to the present invention, the operator slides the head connector along the surface of the guide plate. When the head connector comes to the position of the guide opening, the head connector can be pushed into the guide opening. Therefore, it is possible to prevent damage to the board connector and the head connector at the time of connection even under a fumbling work condition in which the operator cannot visually check the board connector. Moreover, the guide plate is simply attached to the control board. Therefore, the outer shape of the board connector does not become large. Therefore, it does not hinder the miniaturization of the control board. Furthermore, there is no need to modify the control board or connector. Therefore, the cost increase can be suppressed.

It is a front view which shows the schematic structure of the connection structure of the inkjet head and the control board which concerns on embodiment. It is a top view which shows an example of a guide plate. It is a 100-100 arrow cross-sectional view which shows the state before attaching a guide plate to a control board. FIG. 3 is a cross-sectional view taken along the line 100-100 showing a state in which the guide plate is attached to the control board. It is the figure which looked at the state which the plug of the connector and the socket are arranged facing each other from the side. FIG. 10 is a cross-sectional view taken along the arrow 101-101 for explaining the operation of connecting the connector. FIG. 10 is a cross-sectional view taken along the arrow 101-101 for explaining the operation of connecting the connector. FIG. 10 is a cross-sectional view taken along the arrow 101-101 for explaining the operation of connecting the connector. FIG. 10 is a cross-sectional view taken along the arrow 101-101 for explaining the operation of connecting the connector. It is sectional drawing which shows the modification of the guide plate. It is a figure which shows the 1st example of the connection disconnection mechanism. It is a figure which shows the 2nd example of the connection disconnection mechanism. It is a figure which shows the 3rd example of the connection disconnection mechanism. It is a figure which shows the whole structure of the inkjet printing apparatus, and a partially enlarged view thereof.

<Connection structure>

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a front view showing a schematic configuration of a connection structure between an inkjet head and a control substrate according to an embodiment. FIG. 2 is a plan view showing an example of a guide plate. FIG. 3 is a cross-sectional view taken along the line 100-100 showing a state before the guide plate is attached to the control board. FIG. 4 is a cross-sectional view taken along the line 100-100 showing a state in which the guide plate is attached to the control board. FIG. 5 is a side view of a state in which the plug of the connector and the socket are arranged facing each other.

The print head 1 ejects ink droplets and prints on a printing medium (for example, paper or film) (not shown). The print head 1 includes an inkjet head 3 and a control box 5. The inkjet head 3 ejects ink droplets for printing. The control box 5 outputs an electric signal for operating the inkjet head 3 to the inkjet head 3. The control box 5 is given an electric signal according to the print data from a control unit (not shown). The control box 5 converts the electric signal according to the inkjet head 3 and outputs an electric signal for operating the inkjet head 3. In the following description, the longitudinal direction of the control board 27 is the Z direction, the direction orthogonal to the Z direction is the Y direction, and the front direction of the drawing orthogonal to the Z direction and the Y direction is the X direction.

The inkjet head 3 includes an inkjet head main body 9 and wiring 11. The inkjet head main body 9 includes a frame (not shown), and a head module 13 is provided on the lower surface of the frame. The inkjet head main body 9 is attached so that the head module 13 is exposed on the lower surface, and the head module 13 and the inkjet head main body 9 are electrically connected to each other. The head module 13 is formed with a plurality of ejection holes on the lower surface thereof for ejecting ink droplets. One end side of the wiring 11 is electrically connected to the inkjet head main body 9. The other end of the wiring 11 is electrically connected to the control box 5. In this embodiment, it is preferable that the wiring 11 is composed of, for example, a flexible substrate (also referred to as a flexible printed wiring board). The wiring 11 generally includes a plurality of signal lines for transmitting an electric signal. Therefore, it is easy to handle if a plurality of signal lines are grouped into the same member and have flexibility as in a flexible substrate.

As shown in FIG. 3, for example, the socket 17 of the connector 15 is connected to the other end side of the wiring 11. The socket 17 includes a socket housing 19. The socket housing 19 is provided with a recess. The socket housing 19 is provided with a contact 21 in its recess. The contact 21 is an electrode.

The connector 15 described above corresponds to the "head connector" in the present invention.

The control box 5 includes a case 23, a cooling jacket 25, a control board 27, and a guide plate 29.

The case 23 is a bottomed container. The case 23 is made of, for example, a metal (for example, aluminum) in consideration of heat dissipation. The cooling jacket 25 cools the control board 27. The cooling jacket 25 is injected with a cooling medium from, for example, an inlet (not shown). The cooling jacket 25 includes, for example, a meandering pipe (not shown) having one end communicating with an inlet. The meandering pipe has an outlet connected to the other end side. A cooling medium that has absorbed the heat of the control board 27 is discharged from the outlet. In the case 23, a plurality of (for example, four) substrate spacers 31 are attached to the bottom surface. A screw hole (not shown) is formed at the tip of the substrate spacer 31. The substrate spacer 31 fixes the position of the control substrate 27 in the height direction (X direction in FIG. 4).

A control board 27 is arranged on the upper part of the cooling jacket 25. An electronic circuit 33 is formed on the control board 27. The electronic circuit 33 generates an electric signal for operating the inkjet head 3. The plug 37 of the connector 35 is attached to the electronic circuit 33. The plug 37 includes a plug housing 39. The plug housing 39 can be inserted into the socket housing 19 described above. The plug housing 39 has a convex portion corresponding to the concave portion of the socket housing 19. The plug housing 39 is provided with a contact 41 on its convex portion. The contact 41 is an electrode.

The connector 35 described above corresponds to the "board connector" in the present invention.

An alignment pin 43 is erected on the control board 27. In this embodiment, for example, four alignment pins 43 are provided. The alignment pin 43 positions the guide plate 29 with respect to the surface direction of the control board 27 (the Y direction in FIGS. 3 and 4). Therefore, at least two alignment pins 43 may be provided. The alignment pin 43 is formed to be longer in the height direction (X direction in FIGS. 3 and 4) than the substrate spacer 31.

As shown in FIG. 2, the guide plate 29 has a tap hole 45 formed at a position corresponding to the substrate spacer 31. The guide plate 29 is preferably made of a heat conductive (heat conductive) material. Specifically, the guide plate 29 is made of, for example, a stainless steel plate (SUS). The position where the board spacer 31 is attached is on the outside near the edge of the case 23. As a result, the control board 27 can be firmly attached to the case 23 rather than providing the board spacer 31 near the center far from the edge of the case 23. The guide plate 29 has an alignment hole 47 formed at a position corresponding to the alignment pin 43. The alignment hole 47 has an inner diameter corresponding to the outer diameter of the alignment pin 43. Specifically, the alignment hole 47 has an inner diameter slightly larger than the outer diameter of the alignment pin 43. As a result, the guide plate 29 can be prevented from moving in the plane direction at all when the guide plate 29 is attached. The guide plate 29 has a guide opening 49 formed in the center thereof. The guide opening 49 is formed at a position corresponding to the connector 35 of the control board 27.

The alignment pin 43 is used to precisely determine the horizontal relative position of the connector 35 and the guide opening 49. When the horizontal position of the guide plate 29 is determined with high accuracy by the substrate spacer 31, the alignment pin 43 is unnecessary. However, although the substrate spacer 31 can generally fix the position of the control board 27 with high accuracy, it cannot fix the horizontal position of the control board 27 with high accuracy although it is attached to the upper portion thereof. Therefore, the guide plate 29 can be fixed with high accuracy by the alignment pin 43 and the alignment hole 47.

The guide opening 49 is the connector 15 and 35 when viewed from the insertion / removal direction (X direction in FIGS. 1 and 3 to 5) in which the connector 15 is moved when the connector 15 is connected to the connector 35. It is formed so as to surround the outer shape. That is, the guide opening 49 is formed so that the side wall of the guide opening 49 is located slightly outside the socket housing 19 of the connector 15. The guide opening 49 is formed so as to allow the connector 15 to be connected to the connector 35. Preferably, the guide opening 49 is configured such that the connector 15 is allowed to move forward and backward only in the insertion / removal direction thereof. That is, it is preferable that the guide opening 49 is formed so that the connector 15 does not deviate as much as possible from the insertion / removal direction toward the surface direction of the guide plate 29 when the connector 15 is inserted / removed from the connector 35. Specifically, as shown in FIGS. 4 and 5, the thickness of the guide plate 29 is preferably 1/3 or more of the height of the socket housing 19 of the connector 15. With this thickness, it is possible to prevent the connector 15 from being greatly tilted in the direction orthogonal to the insertion / removal direction when the connector 15 is inserted / removed.

When the guide plate 29 is screwed to the substrate spacer 31 with screws 31a, the height of the upper surface thereof (the surface opposite to the surface on which the control board 27 is arranged) is the height of the plug housing 39 of the connector 35. The thickness and the height of the substrate spacer 31 are specified so as to be higher than the height. As a result, the connector 35 does not protrude upward from the upper surface of the guide plate 29. Therefore, even if the operator slides the connector 15 along the surface of the guide plate 29, the connector 15 and the connector 35 do not come into contact with each other except when the connection operation is started. Therefore, it is possible to prevent damage between the connector 15 and the connector 35 when the connector 15 is fumbling along the guide plate 29.

As shown in FIGS. 3 and 4, the guide plate 29 is provided with a heat dissipation block 51 at a portion on the lower surface thereof (the surface on which the control board 27 is arranged). The heat dissipation block 51 is composed of, for example, an upper layer 53 on the guide plate 29 side and a lower layer 55 on the control board 27 side. Specifically, the upper layer 53 is made of, for example, a heat-conducting and conductive material. Specifically, the upper layer 53 is made of the same material as, for example, the guide plate 29. The lower layer 55 is made of, for example, a heat-conducting and insulating material.

Specifically, the lower layer 55 is preferably a material containing, for example, a silicon resin having thermal conductivity, insulating property, and flexibility as a main component. More specifically, a sheet-shaped heat conductive gel is exemplified. It is preferable that the heat radiating block 51 has a thickness such that the lower layer 55 encloses the electronic circuit 33 of the control board 27 with the guide plate 29 attached. When the guide plate 29 is attached to the case 23, the exposed surface of the control board 27 is reduced. Therefore, heat dissipation from the control board 27 via air may deteriorate. However, the heat of a part of the electronic circuit 33 can be transferred to the guide plate 29 via the heat dissipation block 51. Therefore, by providing the guide plate 29, it is possible to suppress a decrease in heat dissipation efficiency. Since the heat dissipation block 51 has a two-layer structure of the upper layer 53 and the lower layer 55 in this way, there is an advantage that it is easy to cope with a design change of the electronic circuit 33 in the control board 27. That is, as a result of the design change of the electronic circuit 33, the arrangement of the electronic components constituting the electronic circuit 33 is significantly changed, the electronic circuit 33 may not come into contact with the heat dissipation block 51. In such a case, heat dissipation can be ensured by increasing only the thickness of the lower layer 55. Therefore, even if the design of the control board 27 is changed, it is possible to provide flexibility that can ensure heat dissipation.

In addition, it is preferable to attach an insulating material to the region of the surface of the guide plate 29 on the control board 27 side excluding the portion of the heat dissipation block 51. As a result, it is possible to avoid a situation in which the electronic circuit 33 of the control board 27 is short-circuited when the guide plate 29 is attached.

First, the guide plate 29 is placed with the substrate spacer 31 corresponding to the tap hole 35 and the alignment pin 43 corresponding to the alignment hole 47. Then, the guide plate 29 is fixed to the case 23 by screwing the screw 31a into the tap hole 45. At this time, the alignment pin 43 is inserted into the alignment hole 47, and the position in the horizontal direction is precisely fixed. As a result, the guide plates 29 are arranged to face the control board 27 at predetermined intervals.

Here, reference is made to FIGS. 6 to 9. 6 to 9 are cross-sectional views taken along the line 101-101 for explaining the operation of connecting the connector.

For example, the operation when the inkjet head 3 fails, is replaced with a new inkjet head 3, and the connector 15 of the inkjet head 3 is connected to the connector 35 of the control board 27 will be described. The operator at this time shall not be able to directly see the connector 35 and the guide opening 49.

First, although the operator cannot directly see the guide opening 49, he / she can grasp the approximate position of the guide opening 49 by groping. Therefore, it is preferable to start the work with the connector 15 fumbling and positioned near the guide opening 49. As shown in FIG. 6, the operator brings the connector 15 into contact with the upper surface of the guide plate 29. In that state, the operator fumbling to move the connector 15 along the surface of the guide plate 29 while urging the connector 15 on the upper surface of the guide plate 29 (two-dot chain line with arrows in FIG. 6). ). At this time, the socket 17 of the connector 15 has the contact 21 mounted inside the socket housing 19 and is not exposed to the outside. Therefore, this operation does not damage the connector 15. When the socket housing 19 of the connector 15 is located in the guide opening 49, the lower portion of the socket housing 19 of the connector 15 enters the guide opening 49. The worker can know that this state has occurred with the sensation of his hand. After that, the operator pushes the connector 15 strongly toward the connector 35 side. As a result, as shown in FIG. 7, the connector 15 can be connected to the connector 35.

During the above-mentioned work, for example, as shown in FIG. 8, it is assumed that the connector 15 enters the guide opening 49 in an inclined posture while the connector 15 is being moved. In this case, the thickness of the guide plate 29 is set as described above. Therefore, the guide plate 29 can prevent the connector 15 from being pushed into the guide opening 49 while being tilted. That is, it is assumed that the connector 15 in the posture shown in FIG. 8 is pushed into the guide opening 49. Then, as shown in FIG. 9, the connector 15 is corrected so that the posture is linear with respect to the connector 35 due to the thickness of the guide opening 49 of the guide plate 29. Therefore, it is possible to prevent the contacts 21 and 41 from being damaged when the connector 15 tries to be connected to the connector 35 in an inclined posture.

According to this embodiment, the operator slides the connector 15 along the surface of the guide plate 29. When the connector 15 comes to the position of the guide opening 49, the connector 15 can be pushed into the guide opening 49. Therefore, it is possible to prevent damage to the connectors 15 and 35 at the time of connection even under the working conditions in which the operator cannot see the connector 35 visually. Moreover, the guide plate 29 is only attached to the control board 27. Therefore, the outer shape of the connector 35 does not become large. Therefore, the miniaturization of the control board 27 is not hindered. Further, the control board 27 and the connectors 15 and 35 do not need to be modified. Therefore, the cost increase can be suppressed.

<Modification example of connection structure>

An example of modification of the connection structure described above will be described with reference to FIG. 10. FIG. 10 is a cross-sectional view showing a modified example of the guide plate.

The guide plate 29A is formed to be thinner in overall thickness than the guide plate 29 described above. However, in the guide plate 29A, only the edge portion of the guide opening 49 on the control board 27 side protrudes toward the control board 27 side to form the guide portion 61. The guide portion 61 has the same effect as the thickness of the guide plate 29. That is, the guide portion 61 suppresses the inclination of the connector 15 in the direction orthogonal to the insertion / removal direction of the connector 15. As a result, the connector 15 is not inserted and removed diagonally with respect to the connector 35. Therefore, the connector 15 and the connector 35 do not come into contact with each other in a direction deviated from the normal insertion / extraction direction, and damage to the connectors 15 and 35 can be prevented.

Further, since the thickness of the guide plate 29A excluding the guide portion 61 can be reduced, the weight can be reduced.

<Disconnection mechanism>

Next, the connection disconnection mechanism will be described. Here, reference is made to FIGS. 11 to 13. FIG. 11 is a diagram showing a first example of the connection disconnection mechanism. FIG. 12 is a diagram showing a second example of the connection disconnection mechanism. FIG. 13 is a diagram showing a third example of the connection disconnection mechanism.

In the connection structure described above, the connector 15 is buried in the guide plate 29 when the connectors 15 and 35 are connected. Then, when the connector 15 is removed from the connector 35, the work becomes difficult. Therefore, the problem can be solved by the following configuration.

<First example>

As shown in FIG. 11, the connection disconnection mechanism 71 includes two through-holes 73 and two release pins 75. The through hole 73 is formed in the guide plate 29 at a position adjacent to the guide opening 49. The formed position is a position facing the lower surface of the flange portion of the connector 15. That is, it is a position of the connector 15 that faces the flange portion that projects laterally in the insertion / extraction direction. The release pin 75 has a length extending from the upper surface of the guide plate 29 to the lower surface of the case 23. The release pin 75 has a pin head 77 formed on the top of the connector 15 side. The pin head 77 has a diameter larger than that of the through hole 73 in a plan view. Therefore, the release pin 75 does not fall off from the through port 73 toward the case 23.

The connection disconnection mechanism 71 configured in this way is operated by the operator as follows. That is, with the connector 15 connected to the connector 35, the end of the release pin 75 opposite to the pin head 77 is pushed toward the case 23. Then, the pin head 77 of the release pin 75 pushes up the flange portion of the connector 15. As a result, the connector 15 is moved from the connector 35 and the connection is disconnected. Since the operator only needs to push the release pin 75, the connector 15 and 35 can be easily disconnected.

<Second example>

As shown in FIG. 12, the connection disconnection mechanism 81 includes two release levers 83. The release lever 83 has a width in the Z direction of FIG. The width is, for example, about the same as the width of the flange portion of the connector 15 when viewed from the insertion / removal direction. The release lever 83 has a bent portion between the long side portion and the short side portion. The release lever 83 is swingably attached to its bent portion by a fulcrum portion 85. The fulcrum portion 85 is fixed to the upper surface of the guide plate 29. The short side portion of the release lever 83 is sandwiched between the flange portion of the connector 15 and the guide plate 29.

The connection disconnection mechanism 81 configured in this way is operated by the operator as follows. That is, the long side portion of the release lever 83 is pushed toward the guide plate 29. Then, the short side portion of the release lever 83 swings around the fulcrum portion 85, and the short side portion of the release lever 83 moves so as to separate from the guide plate 29 surface. As a result, the connector 15 is moved from the connector 35 and the connection is disconnected. Since the operator only needs to push the release lever 83, the connection of the connectors 15 and 35 can be easily released.

<Third example>

As shown in FIG. 13, the connection disconnection mechanism 91 includes two leaf springs 93. The leaf spring 93 has a width in the Z direction of FIG. The width is, for example, about the same as the width of the flange portion of the connector 15 when viewed from the insertion / removal direction. The leaf spring 93 has two bent portions. One end of the leaf spring portion 93 far from the connector 15 is fixed to the guide plate 29 by a fixing portion 95. A guide hole 97 is formed on the upper surface of the guide plate 29 near the guide opening 49. The guide hole 97 prevents the connector 15 side of the leaf spring 93 from coming off. The guide hole 97 guides the other end of the leaf spring 93 on the connector 15 side to push up the flange of the connector 15 when the leaf spring 93 is extended.

The connection disconnection mechanism 91 configured in this way is operated as follows. That is, of the two bent portions of the leaf spring 93, the fixed portion 95 side is pushed toward the guide plate 29 side. Then, the other end of the leaf spring 93 pushes up the flange portion of the connector 15. As a result, the connector 15 is moved from the connector 35 and the connection is disconnected. Since the operator only needs to push the leaf spring 93, the connection of the connectors 15 and 35 can be easily disconnected.

<Printing equipment>

Here, a printing apparatus using the above-mentioned connection structure will be described. FIG. 14 is a diagram showing an overall configuration of the inkjet printing apparatus and a partially enlarged view thereof.

The inkjet printing apparatus 101 according to the embodiment includes a paper feeding unit 103, a conveying unit 105, a printing unit 107, a drying unit 109, and a paper ejection unit 111.

The inkjet printing device 101 corresponds to the "printing device" in the present invention.

The paper feed unit 103 supplies a print medium, for example, a continuous film WF to the transport unit 105. The transport unit 105 conveys the continuous film WF to the printing unit 107 while pretreating the continuous film WF. The printing unit 107 performs a printing process on the continuous film WF. The drying unit 109 performs a drying process on the continuous film WF printed by the printing unit 107. The paper ejection unit 111 winds up the dried continuous film WF.

The printing unit 107 includes a printing mechanism 113. The printing mechanism 113 includes a frame 115. The frame 115 is mounted on a slide mechanism 117 provided in the printing unit 107. The frame 115 includes, for example, six print heads 1. The slide mechanism 117 movably holds the frame 115 in the Y direction of FIG. The printing mechanism 113 is attached to the transport mechanism 119. The transport mechanism 119 transports the continuous film WF so that the print head 1 can print on the continuous film WF. The printing mechanism 113 includes six print heads 1, but is mounted on the frame 115 at narrow intervals in the transport direction of the continuous film WF in order to reduce the size. Therefore, the print head 1 is attached to the frame 115 in a state where the connector 35 and the guide opening 49 described above are difficult to see from the side. Specifically, for example, the print head 1 is mounted on the frame 115 so that the right end portion of the print head 1 in FIG. 1 is located on the back side in the Y direction in FIG. Therefore, even if the frame 115 is pulled out toward the front side, the space between the print heads 1 is only narrow enough for the operator's hand to enter. Therefore, it is difficult for the operator to directly visually check the connector 35 and the guide opening 49 of the print head 1.

However, as described above, the print head 1 includes a guide plate 29. The operator can slide the connector 15 along the surface of the guide plate 29, and when the connector 15 comes to the position of the guide opening 49, the connector 15 can be pushed into the guide opening 49. Therefore, even under working conditions in which the operator cannot visually recognize the guide opening 49, damage to the connector 15 and the connector 35 can be prevented at the time of connection. The inkjet printing apparatus 101 can quickly complete the electrical connection even if the inkjet head 3 is replaced in this way. Therefore, the downtime of the inkjet printing apparatus 101 can be shortened. As a result, the operating rate of the inkjet printing apparatus 101 can be improved.

The present invention is not limited to the above embodiment, and can be modified as follows.

(1) In the above-described embodiment, the height of the surface around the guide opening 49 is higher than the height of the connector 35. However, the present invention does not require such a configuration. For example, the height of the surface around the guide opening 49 may be matched with the height of the connector 35.

(2) In the above-described embodiment, the thickness of the guide plate 29 is set to a thickness equal to or higher than a predetermined value, which suppresses the inclination of the connector 15. However, if the connector 15 can be inserted and removed from the guide opening 49 so that the connector 15 does not tilt, the guide plate 29 does not need to have a thickness equal to or larger than a predetermined value.

(3) In the above-described embodiment, the guide plate 29 is provided with an alignment hole 47. However, if the guide plate 29 can be accurately aligned and attached to the control board 27, it is not necessary to provide the alignment hole 47. As a result, the configuration of the guide plate 29 can be simplified and the cost can be suppressed.

(4) In the above-described embodiment, the guide plate 29 is made of a heat-conducting material. However, the present invention does not require a heat transferable material.

(5) In the above-described embodiment, the guide plate 29 includes a heat dissipation block 51. However, the present invention does not necessarily have to include the heat dissipation block 51. As a result, the configuration of the guide plate 29 can be simplified and the cost can be suppressed.

(6) In the above-described embodiment, the inkjet head main body 9 is provided with a wiring 11 having one end connected to it and extending, and the connector 15 is connected to the other end side of the wiring 11. However, the present invention does not require the wiring 11. For example, the connector 15 may be directly attached to the inkjet head main body 9 without providing the wiring 11.

As described above, the present invention is suitable for a structure for connecting an inkjet head and a control substrate.

1 ... Print head 3 ... Inkjet head 5 ... Control box 9 ... Inkjet head body 11 ... Wiring 15 ... Connector (head connector)
17 ... Socket 19 ... Socket housing 21 ... Contact 23 ... Case 27 ... Control board 29 ... Guide plate 31 ... Board spacer 35 ... Connector (board connector)
37… Plug 39… Plug housing 41… Contact 43… Alignment pin 45… Tap hole 47… Alignment hole 49… Guide opening

Claims (11)

In a connection structure between an inkjet head and a control board that electrically connects an inkjet head that ejects ink droplets and a control board that outputs an electric signal for operating the inkjet head.
The board connector attached to the control board and
A head connector that can be connected to the board connector and is attached to the inkjet head,
A guide plate that has a plate shape and is attached along the surface of the control board,
Equipped with
The guide plate is formed so as to surround the outer shape of the board connector when viewed from the insertion / removal direction in which the head connector is moved when the head connector is connected to the board connector, and the head connector is formed of the board connector. A connection structure between an inkjet head and a control board, characterized in that it has a guide opening that allows it to be connected to the control board. In the connection structure between the inkjet head and the control board according to claim 1,
The guide plate is characterized in that, in a state of being attached to the control board, the height of the surface around the guide opening and opposite to the control board is higher than the height of the board connector. Connection structure between the inkjet head and the control board. In the connection structure between the inkjet head and the control substrate according to claim 1 or 2.
The guide opening is characterized in that, when the head connector advances and retreats from the guide opening, the head connector allows the substrate connector to advance and retreat only along the insertion / removal direction. Connection structure between the inkjet head and the control board. In the connection structure between the inkjet head and the control board according to claim 3,
The guide plate is formed by projecting only the edge of the guide opening toward the substrate connector, and is orthogonal to the insertion / removal direction when the head connector is advanced / retracted in the insertion / removal direction at the guide opening. A connection structure between an inkjet head and a control board, which is characterized by having a guide portion that suppresses tilting in the direction of tilting. In the connection structure between the inkjet head and the control board according to claim 3,
The guide plate is characterized by having a thickness capable of suppressing inclination in a direction orthogonal to the insertion / extraction direction when the head connector is advanced / retracted in the insertion / removal direction at the guide opening. Control board connection structure. In the connection structure between the inkjet head and the control substrate according to any one of claims 1 to 5.
The control board includes a plurality of alignment pins erected along the insertion / removal direction.
The guide plate includes a plurality of alignment holes having an inner diameter corresponding to the outer diameter of the plurality of alignment pins.
The guide plate has a connection structure between an inkjet head and a control board, characterized in that the plurality of alignment pins are inserted into the plurality of alignment holes and arranged so as to face the control board. In the connection structure between the inkjet head and the control board according to any one of claims 1 to 6.
The guide plate has a connection structure between an inkjet head and a control board, characterized in that the guide plate is made of a heat-conducting material. In the connection structure between the inkjet head and the control board according to claim 7.
The guide plate has a connection structure between an inkjet head and a control board, which comprises a heat-dissipating block made of a heat-conducting and insulating material on a surface facing the control board. In the connection structure between the inkjet head and the control board according to any one of claims 1 to 8.
The inkjet head includes an inkjet head main body and wiring having one end connected to the inkjet head main body and extended.
The head connector is a connection structure between an inkjet head and a control board, characterized in that the head connector is connected to the other end side of the wiring. In the connection structure between the inkjet head and the control board according to any one of claims 1 to 9.
The guide plate has a connection structure between an inkjet head and a control board, which comprises a connection disconnection mechanism for removing the head connector from the control board so as to be separated from the control board in the insertion / removal direction. The inkjet head that ejects ink droplets and the control board that outputs an electric signal for operating the inkjet head are connected by the connection structure of the inkjet head and the control board according to any one of claims 1 to 10. With the configured print head,
A transport mechanism that transports print media and
A frame to which the print head is attached so that the print head can print on the print medium.
Equipped with
The frame is an inkjet printing apparatus to which the print head is attached in a state where the guide opening is difficult to see at the time of maintenance work.

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