JP2022034604A - Wireless communication module - Google Patents

Abstract

To provide a wireless communication module capable of suppressing a transmission loss of a high-frequency signal at signal terminals that connect a through hole of a mounting substrate with an antenna substrate and an RFIC.SOLUTION: A wireless communication module 1 comprises: a mounting substrate 10 that has a through hole 11 penetrating from a first surface 10a to a second surface 10b; an antenna substrate 20 mounted on the first surface side; an RFIC 30 mounted on the second surface side; a first signal terminal 25 that connects between the through hole and the antenna substrate; a second signal terminal 35 that connects between the through hole and the RFIC; a plurality of first ground terminals 26 provided around the first signal terminal, between the first surface and the antenna substrate; and a plurality of second ground terminals 36 provided around the second signal terminal, between the second surface and the RFIC. In a thickness direction of the mounting substrate, the first signal terminal and the second signal terminal are overlapped with each other, and the plurality of first ground terminals and the plurality of second ground terminals are overlapped with each other, respectively.SELECTED DRAWING: Figure 1

Description

The present invention relates to a wireless communication module.

Some wireless communication modules have an antenna board and radio frequency integrated circuits (RFICs) mounted on both sides of the mounting board and electrically connected to each other via a through hole in the mounting board. In this wireless communication module, the antenna substrate and the high frequency integrated circuit are each electrically connected to the through hole via metal terminals provided at both ends of the through hole. High-frequency signals such as millimeter waves are transmitted to through-holes and metal terminals that connect the antenna board and high-frequency integrated circuits. Patent Document 1 discloses a substrate (multilayer printed wiring board) having a through hole having a coaxial structure in order to reduce the transmission loss of a high frequency signal transmitted to the through hole as much as possible.

Japanese Unexamined Patent Publication No. 2002-305377

However, even if the substrate of Patent Document 1 is applied as the mounting substrate of the wireless communication module, the reflection of the high frequency signal based on the impedance mismatch in the metal terminals connected to both ends of the through hole (coaxial through hole) of the coaxial structure. Therefore, there is a problem that the transmission loss of the high frequency signal in the metal terminal increases.

The present invention has been made in view of the above circumstances, and is a wireless communication module capable of suppressing transmission loss of a high frequency signal at a metal terminal connecting a through hole of a mounting board and an antenna board or a high frequency integrated circuit. The purpose is to provide.

The wireless communication module according to one aspect of the present invention includes a mounting board having a signal through hole through which a high-frequency signal is transmitted through from a first surface to a second surface which is a surface opposite to the first surface, and the above-mentioned. The antenna board mounted on the first surface side, the high frequency integrated circuit mounted on the second surface side, and the first end of the signal through hole located on the first surface side and the antenna board are connected to each other. Between the first signal metal terminal, the second signal metal terminal connecting the second end of the signal through hole located on the second surface side and the high frequency integrated circuit, and the first surface and the antenna substrate. In the plan view of the mounting substrate from the thickness direction, a plurality of first ground metal terminals provided at different positions in the circumferential direction around the first signal metal terminal and used as ground potentials, and the first ground metal terminal. Between the two surfaces and the high-frequency integrated circuit, a plurality of second ground metal terminals provided at different positions in the circumferential direction around the second signal metal terminal in the plan view and used as ground potentials. Be prepared. In the thickness direction of the mounting substrate, the first signal metal terminal and the second signal metal terminal overlap each other, and the plurality of the first ground metal terminals and the plurality of the second ground metal terminals overlap each other.

In the above wireless communication module, the first signal metal terminal is surrounded by a plurality of first ground metal terminals between the mounting board and the antenna board. Similarly, the second signal metal terminal is surrounded by a plurality of second ground metal terminals between the mounting board and the high frequency integrated circuit. Further, in the thickness direction of the mounting board, the first signal metal terminal and the second signal metal terminal overlap each other, and the plurality of first ground metal terminals and the plurality of second ground metal terminals overlap each other. As a result, impedance matching at the first and second signal metal terminals can be achieved, and reflection of high-frequency signals at the first and second signal metal terminals can be reduced. Therefore, it is possible to suppress the transmission loss of the high frequency signal at the first and second signal metal terminals.

In the wireless communication module, the first signal metal terminal and the first ground metal terminal are arranged so as to have a pseudo coaxial structure of impedance matching, and the second signal metal terminal and the second ground metal terminal are arranged. May be arranged so as to be an impedance-matched pseudo-coaxial structure.

In the wireless communication module, the mounting board has a plurality of ground through holes having a ground potential penetrating from the first surface to the second surface, and the plurality of ground through holes are said in the plan view. It may be provided at different positions in the circumferential direction around the signal through hole.

In the wireless communication module, the signal through hole and the ground through hole may be arranged so as to have a pseudo coaxial structure of impedance matching.

In the wireless communication module, the mounting board has two signal through holes, the first signal metal terminal is provided at each of the first ends of the two signal through holes, and the two first signals are provided. A portion of the first ground metal terminal arranged in the region between the metal terminals is a plurality of said firsts arranged around the first signal metal terminal of one of the two first signal metal terminals. The ground metal terminal and the plurality of first ground metal terminals arranged around the other first signal metal terminal are also used, and the second signal metal is provided at each of the second ends of the two signal through holes. A part of the second ground metal terminal provided with a terminal and arranged in the area between the two second signal metal terminals is one of the two second signal metal terminals. The plurality of the second ground metal terminals arranged around the second ground metal terminal and the plurality of the second ground metal terminals arranged around the other second signal metal terminal may be used in combination.

In the wireless communication module, the first ground metal terminal may be connected to only one of the first surface and the antenna board facing the first surface.

In the wireless communication module, the second ground metal terminal may be connected to only one of the second surface and the high frequency integrated circuit facing the second surface.

According to the present invention, it is possible to suppress the transmission loss of a high frequency signal at the first and second signal metal terminals connecting the signal through hole of the mounting board and the antenna board or the high frequency integrated circuit.

It is a side sectional view which shows the main part structure of the wireless communication module which concerns on one Embodiment of this invention. It is sectional drawing along the line II-II of FIG. It is a plan sectional view which shows the wireless communication module which concerns on a modification. It is a top view for demonstrating the area between signal through holes. It is a side sectional view which shows the wireless communication module which concerns on other embodiment of this invention. It is a plan sectional view which shows the wireless communication module which concerns on other embodiment of this invention. It is a side sectional view which shows the wireless communication module which concerns on other embodiment of this invention.

Hereinafter, the wireless communication module according to the embodiment of the present invention will be described in detail with reference to the drawings. In addition, in the drawings used in the following description, in order to make the features easy to understand, the featured parts may be enlarged and shown, and the dimensional ratios of each component are the same as the actual ones. Not exclusively. Further, the present invention is not limited to the following embodiments.

<Main part configuration of antenna module>
FIG. 1 is a side sectional view showing a main configuration of a wireless communication module according to an embodiment of the present invention. As shown in FIG. 1, the wireless communication module 1 includes a mounting board 10, an antenna board 20, and an RFIC 30 (high frequency integrated circuit). The wireless communication module 1 transmits and receives high-frequency signals such as millimeter waves having a frequency of, for example, about 50 to 70 [GHz]. The wireless communication module 1 may be one that only transmits a high frequency signal or one that only receives a high frequency signal.

<Mounting board>
The mounting board 10 is a board on which components such as the antenna board 20 and the RFIC 30 are mounted. The mounting substrate 10 may be formed of a material having a larger dielectric loss tangent than the antenna substrate 20. Examples of such a material include inexpensive materials (eg, epoxy, polyimide, etc.) that have been generally used conventionally as materials for rigid substrates and flexible substrates.

The mounting board 10 has a signal through hole 11 and a ground through hole 12. The signal through hole 11 and the ground through hole 12 penetrate from the first surface 10a of the mounting substrate 10 to the second surface 10b, which is the surface opposite to the first surface 10a, respectively.

The signal through hole 11 is a through hole for transmitting a high frequency signal. Although only one signal through hole 11 is shown in FIG. 1 for simplification of illustration, a plurality of signal through holes 11 may be provided on the mounting board 10.

The ground through holes 12 are through holes having a ground potential, and are provided in plurality for the same signal through hole 11 (see FIG. 2). As shown in FIG. 2, the plurality of ground through holes 12 are provided at different positions in the circumferential direction with respect to the signal through holes 11 in a plan view seen from the thickness direction of the mounting substrate 10. The plurality of ground through holes 12 may be arranged at equal intervals in the circumferential direction centered on, for example, the signal through holes 11. In the present embodiment, the number of ground through holes 12 corresponding to the same signal through hole 11 is four. These four ground through holes 12 are positioned so as to be offset by 90 degrees in the circumferential direction centered on the signal through hole 11.

The signal through holes 11 and the ground through holes 12 are arranged so as to have a pseudo coaxial structure of impedance matching. Here, the impedance-matched pseudo-coaxial structure means a coaxial structure having a signal through hole 11 as a central conductor, on or near a virtual circle in which a ground conductor surrounding the central conductor should be originally arranged. A structure in which a ground through hole 12 is arranged. The displacement of the ground through hole 12 from the virtual circle is allowed if, for example, the impedance error is in the range of about ± 10 [Ω].

The signal through hole 11 and the ground through hole 12 are preferably formed by any of conductor pins, conductor wires, metal plating, conductive paste, and the like, but are not limited thereto. Examples of the conductor used in the signal through hole 11 and the ground through hole 12 include metals such as copper, silver, gold, and alloys, and carbon. The shapes of the signal through holes 11 and the ground through holes 12 are not particularly limited, and examples thereof include pin-like, linear, layered, particle-like, scaly, fibrous, and nanotubes. As shown in FIG. 1, electrode pads 11P and 12P are formed at both ends of the signal through hole 11 and the ground through hole 12. That is, the signal through hole 11 and the ground through hole 12 have a so-called pad-on-via structure.

A ground pattern 13 is formed on the mounting substrate 10. The ground pattern 13 is an inner layer pattern of the mounting substrate 10, and is formed in a plate shape or a film shape extending in a direction along the first surface 10a and the second surface 10b of the mounting substrate 10. The ground pattern 13 is electrically connected to the ground through hole 12 to reinforce the ground through hole 12. An opening 13a penetrating in the thickness direction of the ground pattern 13 is formed, and a signal through hole 11 is located inside the opening 13a. As a result, the ground pattern 13 and the signal through hole 11 are electrically isolated. A plurality of layers of the above ground pattern 13 may be formed on the mounting substrate 10.

It is desirable that the thickness of the mounting substrate 10 is, for example, about 1.6 [mm] or less. However, in order to form fine through holes in the mounting substrate 10, it is advantageous that the thickness of the mounting substrate 10 is small. For example, when forming a fine through hole having a diameter of about 0.1 [mm], it is desirable that the thickness of the mounting substrate 10 is about 0.8 [mm] or less.

<Antenna board>
The antenna substrate 20 is a substrate on which an antenna (not shown) is formed on the first surface 20a or inside thereof. The material used for the antenna substrate 20 may be arbitrary, but it is more preferable that the material has a small dielectric loss tangent (small loss of high frequency signal) and good transmission characteristics of high frequency signal. Examples of such a material include fluororesin, liquid crystal polymer (LCP), polyphenylene ether (PPE) resin, low-temperature fired ceramics, and the like.

The antenna of the antenna substrate 20 may be, for example, an array antenna in which a plurality of radiating elements (not shown) are two-dimensionally arranged on the first surface 20a of the antenna substrate 20. Further, the antenna may be any antenna such as a linear antenna, a planar antenna, a microstrip antenna, or a patch antenna. The antenna is not particularly limited as long as it has a structure that can be formed on the first surface 20a of the antenna substrate 20 or inside.

The antenna board 20 is mounted on the first surface 10a side of the mounting board 10. In this state, the second surface 20b of the antenna board 20 faces the first surface 10a of the mounting board 10. A first signal metal terminal 25 and a first ground metal terminal 26 are provided between the first surface 10a of the mounting board 10 and the antenna board 20. As the material of the first signal metal terminal 25 and the first ground metal terminal 26, metals such as solder (SnAgCu solder and the like), gold, silver, and copper can be used.

The first signal metal terminal 25 electrically connects the first end of the signal through hole 11 located on the first surface 10a side of the mounting board 10 and the antenna board 20. The first signal metal terminal 25 is joined to the first end (electrode pad 11P) of the signal through hole 11 and is arranged at a position overlapping the signal through hole 11 in the thickness direction of the mounting substrate 10. As a result, the transmission distance of the high frequency signal from the signal through hole 11 to the antenna substrate 20 is reduced as compared with the case where the first signal metal terminal 25 is arranged at a position where it does not overlap with the signal through hole 11. Transmission loss can be suppressed.
In FIG. 1, only one first signal metal terminal 25 is shown for simplification of illustration, but a plurality of first signal metal terminals 25 are provided on the first surface 10a of the mounting board 10. good.

The first ground metal terminal 26 is a metal terminal having a ground potential, and is provided in plurality with respect to the same first signal metal terminal 25 (see FIG. 2). As shown in FIG. 2, the plurality of first ground metal terminals 26 are provided at different positions in the circumferential direction with respect to the first signal metal terminal 25 in a plan view seen from the thickness direction of the mounting substrate 10. The plurality of first ground metal terminals 26 may be arranged at equal intervals in the circumferential direction centered on, for example, the first signal metal terminal 25. In the present embodiment, the number of the first ground metal terminals 26 corresponding to the same first signal metal terminal 25 is four. These four first ground metal terminals 26 are positioned so as to be offset by 90 degrees in the circumferential direction about the first signal metal terminal 25.

In this embodiment, each first ground metal terminal 26 is electrically connected to both the mounting board 10 and the antenna board 20. That is, the first ground metal terminal 26 electrically connects the mounting board 10 and the antenna board 20. Further, each first ground metal terminal 26 is electrically connected to the first end of the ground through hole 12 located on the first surface 10a side of the mounting board 10. Specifically, the first ground metal terminal 26 is joined to the first end (electrode pad 12P) of the ground through hole 12 and is arranged at a position overlapping the ground through hole 12 in the thickness direction of the mounting substrate 10.

The first signal metal terminal 25 and the first ground metal terminal 26 are arranged so as to have a pseudo coaxial structure of impedance matching, similarly to the signal through hole 11 and the ground through hole 12 described above.

As shown in FIG. 1, in a state where the antenna board 20 is mounted on the first surface 10a side of the mounting board 10, it is desirable that the first signal metal terminal 25 is not covered with a resin or the like, and the first ground metal terminal 26 Should be covered with resin. Since the first signal metal terminal 25 is not covered with the resin or the like, the transmission loss of the high frequency signal can be reduced. By covering the first ground metal terminal 26 with the resin, the connection portion between the antenna board 20 and the mounting board 10 can be reinforced.

It is desirable that no other component is mounted (mounted) on the antenna board 20. As a result, the area and thickness of the antenna board 20 can be reduced as much as possible, and the reliability of the antenna board 20 can be ensured. However, if necessary, other components may be mounted on the antenna board 20.

<RFIC>
The RFIC 30 is an integrated circuit that processes high-frequency signals, and is mounted on the second surface 10b side of the mounting board 10. The IC package applied to the RFIC 30 may be, for example, BGA (Ball Grid Alley), CSP (Chip Size Package), FOWLP (Fan Out Wafer Level Package), or the like. The RFIC 30 is electrically connected to the antenna board 20 via the second signal metal terminal 35, which will be described later, the signal through hole 11 of the mounting board 10, and the first signal metal terminal 25. The RFIC 30 performs reception processing of a high frequency signal output from the antenna board 20, for example, and outputs a reception signal having a frequency lower than that of the high frequency signal from an output terminal (not shown). Further, the RFIC 30 performs transmission processing of a transmission signal input from an input terminal (not shown), and outputs a high frequency signal having a frequency higher than that of the transmission signal to the antenna substrate 20.

A second signal metal terminal 35 and a second ground metal terminal 36 are provided between the mounting board 10 and the RFIC 30. As the material of the second signal metal terminal 35 and the second ground metal terminal 36, metals such as solder (SnAgCu solder and the like), gold, silver, and copper can be used.

The second signal metal terminal 35 electrically connects the second end of the signal through hole 11 located on the second surface 10b side of the mounting board 10 with the RFIC 30. The second signal metal terminal 35 is joined to the second end (electrode pad 11P) of the signal through hole 11 and is arranged at a position overlapping the signal through hole 11 in the thickness direction of the mounting substrate 10. As a result, the transmission distance of the high frequency signal from the signal through hole 11 to the RFIC 30 is reduced and the transmission loss of the high frequency signal is reduced as compared with the case where the second signal metal terminal 35 is arranged at a position where it does not overlap with the signal through hole 11. Can be suppressed.
In FIG. 1, only one second signal metal terminal 35 is shown for simplification of illustration, but a plurality of second signal metal terminals 35 are provided on the second surface 10b of the mounting board 10. good.

The second ground metal terminal 36 is a metal terminal having a ground potential, and is provided in plurality with respect to the same second signal metal terminal 35 (see FIG. 2). Like the plurality of first ground metal terminals 26, the plurality of second ground metal terminals 36 are provided at positions different from each other in the circumferential direction with respect to the second signal metal terminal 35 in a plan view. The plurality of second ground metal terminals 36 may be arranged at equal intervals in the circumferential direction centered on, for example, the second signal metal terminal 35. In the present embodiment, the number of the second ground metal terminals 36 corresponding to the same second signal metal terminal 35 is four. These four second ground metal terminals 36 are positioned so as to be offset by 90 degrees in the circumferential direction about the second signal metal terminal 35.

In this embodiment, each second ground metal terminal 36 is electrically connected to both the mounting board 10 and the RFIC 30. That is, the second ground metal terminal 36 electrically connects the mounting board 10 and the RFIC 30. Further, each second ground metal terminal 36 is electrically connected to the second end of the ground through hole 12 located on the second surface 10b side of the mounting board 10. Specifically, the second ground metal terminal 36 is joined to the second end (electrode pad 12P) of the ground through hole 12 and is arranged at a position overlapping the ground through hole 12 in the thickness direction of the mounting substrate 10.

The second signal metal terminal 35 and the second ground metal terminal 36 are arranged so as to have a pseudo coaxial structure of impedance matching, similarly to the signal through hole 11 and the ground through hole 12 described above.

It is desirable that the second signal metal terminal 35 is not covered with a resin or the like in a state where the RFIC 30 is mounted on the second surface 10b side of the mounting substrate 10. For example, it is desirable that the space between the RFIC 30 and the second surface 10b of the mounting substrate 10 is not sealed with a resin such as underfill. Since the second signal metal terminal 35 is not covered with the resin or the like, the transmission loss of the high frequency signal can be reduced. The portion between the RFIC 30 and the second surface 10b of the mounting substrate 10 other than the second signal metal terminal 35 may be sealed with a resin such as underfill.

In the wireless communication module 1, as shown in FIGS. 1 and 2, the first signal metal terminal 25 and the second signal metal terminal 35 overlap each other in the thickness direction of the mounting board 10. Further, the four first ground metal terminals 26 and the four second ground metal terminals 36 overlap each other in the thickness direction of the mounting substrate 10. The first signal metal terminal 25 and the second signal metal terminal 35 may completely overlap or may only partially overlap. Similarly, the first gland metal terminal 26 and the second gland metal terminal 36 may completely overlap or may only partially overlap.

As described above, in the wireless communication module 1 of the present embodiment, the first signal metal terminal 25 is surrounded by the plurality of first ground metal terminals 26 between the mounting board 10 and the antenna board 20. Similarly, the second signal metal terminal 35 is surrounded by the plurality of second ground metal terminals 36 between the mounting board 10 and the RFIC 30. Further, in the thickness direction of the mounting board 10, the first signal metal terminal 25 and the second signal metal terminal 35 overlap each other, and the plurality of first ground metal terminals 26 and the plurality of second ground metal terminals 36 are respectively. Overlap. As a result, impedance matching at the first and second signal metal terminals 25 and 35 can be achieved, and reflection of high frequency signals at the first and second signal metal terminals 25 and 35 can be reduced. Therefore, it is possible to suppress the transmission loss of the high frequency signal at the first and second signal metal terminals 25 and 35.

Further, since the first signal metal terminal 25 is surrounded by the plurality of first ground metal terminals 26, it is possible to suppress the influence of disturbance on the high frequency signal passing through the first signal metal terminal 25. Similarly, since the second signal metal terminal 35 is surrounded by the plurality of second ground metal terminals 36, it is possible to suppress the influence of disturbance on the high frequency signal passing through the second signal metal terminal 35.

Further, since the first signal metal terminal 25 is surrounded by the plurality of first ground metal terminals 26, even if there are a plurality of first signal metal terminals 25 on the first surface 10a of the mounting board 10, the first signal metal terminals 25 are adjacent to each other. It is possible to suppress the transition of a high frequency signal between the one signal metal terminals 25. Similarly, since the second signal metal terminal 35 is surrounded by the plurality of second ground metal terminals 36, even if there are a plurality of second signal metal terminals 35 on the second surface 10b of the mounting board 10, they are adjacent to each other. It is possible to suppress the transition of the high frequency signal between the second signal metal terminals 35.

Further, in the wireless communication module 1 of the present embodiment, the signal through holes 11 of the mounting board 10 are surrounded by a plurality of ground through holes 12. Therefore, it is possible to reduce the reflection of the high frequency signal in the signal through hole 11 by achieving impedance matching of the signal through hole 11. Thereby, the transmission loss of the high frequency signal in the signal through hole 11 can be suppressed.
Further, since the signal through hole 11 of the mounting board 10 is surrounded by the plurality of ground through holes 12, the wireless communication module 1 is compared with the case of forming a through hole having a completely coaxial structure as in Patent Document 1. The lead time of (particularly the mounting board 10) can be shortened and the cost can be reduced.

Further, in the wireless communication module 1 of the present embodiment, the first signal metal terminal 25 and the first ground metal terminal 26 are arranged so as to have a pseudo coaxial structure of impedance matching. Further, the second signal metal terminal 35 and the second ground metal terminal 36 are arranged so as to have a pseudo coaxial structure of impedance matching. Further, the signal through holes 11 and the ground through holes 12 of the mounting board 10 are arranged so as to have a pseudo coaxial structure of impedance matching. As a result, the reflection of the high frequency signal due to the impedance mismatch can be further reduced, and the transmission loss of the high frequency signal in the signal through hole 11 and the first and second signal metal terminals 25 and 35 can be further suppressed.

Further, in the wireless communication module 1 of the present embodiment, the first ground metal terminal 26 connects the mounting board 10 and the antenna board 20. As a result, it is possible to more effectively suppress the transition of the high frequency signal between the first signal metal terminals 25 and the influence of the disturbance on the high frequency signal passing through the first signal metal terminal 25. Similarly, when the second ground metal terminal 36 connects the mounting board 10 and the RFIC 30, a high frequency signal transitions between the second signal metal terminals 35 or a high frequency signal passes through the second signal metal terminal 35. Can be more effectively suppressed from being affected by disturbances.

<Modification example>
Next, the wireless communication module according to the modified example will be described with reference to FIGS. 3 and 4. The plan sectional view shown in FIG. 3 corresponds to a sectional view taken along the line II-II of FIG. In FIG. 3, the same reference numerals are given to the same configurations as those shown in FIG. 2.
As shown in FIG. 3, in the modified wireless communication module, the mounting board 10 has two signal through holes 11, and each first end of the two adjacent signal through holes 11 (the first end of the mounting board 10). The first signal metal terminal 25 is provided on one side (10a side). Then, the first ground metal terminal 26A arranged in the region between the two first signal metal terminals 25 is arranged around the first signal metal terminal 25 of one of the two first signal metal terminals 25. One of the four first ground metal terminals 26 and one of the four first ground metal terminals 26 arranged around the other first signal metal terminal 25 are also used. The first ground metal that also serves as the first ground metal terminal 26 arranged around one first signal metal terminal 25 and the first ground metal terminal 26 arranged around the other first signal metal terminal 25. The number of terminals 26A is not limited to one, and may be plural.

The region between one first signal metal terminal 25 and the other first signal metal terminal 25 is, for example, the region R1 shown by a line segment in FIG. This region R1 is a region orthogonal to the straight line L1 connecting the centers of the two first signal metal terminals 25 and partitioned by two parallel straight lines L11 and L12 circumscribing the two circular CRs. Here, the two circle CRs are circles centered on each of the two first signal metal terminals 25, and the diameter dimensions of these two circle CRs are equal to each other. In FIG. 4, the first ground metal terminal 26 arranged in the region between the two first signal metal terminals 25 is located in the portion of the region R1 that intersects the straight line L1, but is not limited to this. do not have. Further, the four first ground metal terminals 26 surrounding each first signal metal terminal 25 are arranged so that their centers are located on the circular CR, but the present invention is not limited to this.

As shown in FIG. 3, the second ground metal terminal 36A arranged in the region between the two second signal metal terminals 35, as in the case of the first signal metal terminal 25 and the first ground metal terminal 26 described above. Is arranged around four second ground metal terminals 36 arranged around one of the second signal metal terminals 35 of the two second signal metal terminals 35 and around the other second signal metal terminal 35. Also used as the four second ground metal terminals 36.

In the configuration exemplified in FIGS. 3 and 4, in the region between the two first signal metal terminals 25, the first ground metal terminal 26 for surrounding the first signal metal terminal 25 and the other first signal metal The two first signal metal terminals 25 can be brought closer to each other as compared to the case where the first ground metal terminal 26 for surrounding the terminal 25 is arranged separately. Similarly, the two second signal metal terminals 35 can be brought close to each other. This makes it possible to arrange the plurality of first and second signal metal terminals 25 and 35 at a higher density.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and can be freely changed within the scope of the present invention.

In the wireless communication module of the present invention, the first and second ground metal terminals 26 and 36 do not have to be joined to both ends of the ground through hole 12 of the mounting board 10, as shown in FIGS. 5 and 6, for example. As shown in FIG. 5, for example, the first and second ground metal terminals 26 and 36 have a diameter centered on the signal through hole 11 and the first and second signal metal terminals 25 and 35 with respect to the ground through hole 12. It may be positioned so as to be displaced in the direction (left-right direction in FIG. 5). Further, the first and second ground metal terminals 26 and 36 are centered on the signal through hole 11 and the first and second signal metal terminals 25 and 35 with respect to the ground through hole 12, for example, as shown in FIG. It may be positioned so as to be offset in the circumferential direction. When the first and second ground metal terminals 26 and 36 are positioned offset from the ground through hole 12 of the mounting board 10, the first and second ground metal terminals 26 and 36 are directly connected to, for example, the ground through hole 12. It may or may not be connected by wiring. However, it is preferable that the first and second ground metal terminals 26 and 36 are connected as closely as possible to the ground through holes 12.

In the wireless communication module of the present invention, the first and second ground metal terminals 26 and 36 are connected only to the mounting board 10 and may not be connected to the antenna board 20 or the RFIC 30 as shown in FIG. 7, for example. Further, the first ground metal terminal 26 may be connected only to, for example, the antenna board 20 and may not be connected to the mounting board 10. Similarly, the second ground metal terminal 36 may be connected only to the RFIC 30, for example, and may not be connected to the mounting board 10. Further, a part of the first and second ground metal terminals 26 and 36 connects the mounting board 10 to the antenna board 20 and RFIC 30, and the rest of them are connected to the mounting board 10 and the antenna board 20 and RFIC 30. May be provided so as not to connect.

Even with such a configuration, it is possible to suppress the transmission loss and transition of the high frequency signal and suppress the influence of the disturbance on the high frequency signal, as in the above-described embodiment. However, when the first and second ground metal terminals 26 and 36 are connected to both the mounting board 10 and the antenna board 20 and the RFIC 30 as in the above embodiment, the high frequency signal transitions or the high frequency signal is disturbed. It is possible to more effectively suppress the influence of.

Further, in the configuration in which the first ground metal terminal 26 is connected to only one of the mounting board 10 and the antenna board 20, a pad for joining the first ground metal terminal 26 (the electrode pad 12P in the example of FIG. 7) is provided. It suffices to be provided only on one of the mounting board 10 and the antenna board 20. In this case, since it is not necessary to provide a pad for joining the first ground metal terminal 26 on the other side of the mounting board 10 and the antenna board 20, wiring for another purpose (for example, high frequency signal is transmitted) instead of the pad. Wiring for this) and the like can be formed. Similarly, in a configuration in which the second ground metal terminal 36 is connected to only one of the mounting board 10 and the RFIC 30, it is necessary to provide a pad for joining the second ground metal terminal 36 to the other of the mounting board 10 and the RFIC 30. Instead of the pad, wiring for another purpose (for example, wiring for transmitting a high frequency signal) or the like can be formed. This makes it possible to arrange wiring for another purpose at a higher density in the mounting board 10, the antenna board 20, and the RFIC 30.

In FIG. 7, the first and second ground metal terminals 26 and 36 connected only to the mounting board 10 are formed in a hemispherical shape. The hemispherical first and second ground metal terminals 26 and 36 can be formed, for example, by printing solder paste on the electrode pad 12P of the mounting substrate 10 and melting it by reflow. The first and second ground metal terminals 26 and 36 connected only to the antenna substrate 20 and the RFIC 30 can also be formed in a hemispherical shape in the same manner.

In the wireless communication module of the present invention, the number of ground through holes 12 corresponding to the same signal through hole 11 may be two or more. If at least two ground through holes 12 are provided corresponding to the same signal through hole 11, the effect of confining the electric field of the high frequency signal can be sufficiently obtained, that is, the transmission loss of the high frequency signal can be suppressed. Can be done. However, if the number of ground through holes 12 is excessively large, it is not suitable for narrowing the pitch of the signal through holes 11. In addition, as the cost increases, the distance between the ground through holes 12 becomes narrower, and problems such as damage are likely to occur. Therefore, it is desirable that the number of ground through holes 12 be appropriately designed in consideration of a plurality of parameters.

In the wireless communication module of the present invention, the number of the first and second ground metal terminals 26 and 36 corresponding to the same first and second signal metal terminals 25 and 35, respectively, may be two or more. If at least two first and second ground metal terminals 26 and 36 are provided corresponding to the same first and second signal metal terminals 25 and 35, transmission loss of a high frequency signal can be suppressed. Considering the influence of disturbance on the high frequency signal passing through the first and second signal metal terminals 25 and 35, it is more desirable that the number of the first and second signal metal terminals 25 and 35 is large. On the other hand, in consideration of narrowing the pitch and cost, it is desirable that the number of the first and second signal metal terminals 25 and 35 is as small as possible (two or more).

In the wireless communication module of the present invention, the mounting board 10 may have at least a signal through hole 11, and may not have a ground through hole 12 corresponding to the signal through hole 11.

1 ... wireless communication module, 10 ... mounting board, 10a ... first surface, 10b ... second surface, 11 ... signal through hole, 12 ... ground through hole, 20 ... antenna board, 25 ... first signal metal terminal, 26, 26A ... 1st ground metal terminal, 30 ... RFIC (high frequency integrated circuit), 35 ... 2nd signal metal terminal, 36, 36A ... 2nd ground metal terminal

Claims (7)

A mounting board having a signal through hole through which a high-frequency signal is transmitted from the first surface to the second surface, which is the surface opposite to the first surface, and
The antenna board mounted on the first surface side and
The high-frequency integrated circuit mounted on the second surface side and
The first signal metal terminal connecting the first end of the signal through hole located on the first surface side and the antenna board, and the first signal metal terminal.
A second signal metal terminal connecting the second end of the signal through hole located on the second surface side and the high frequency integrated circuit, and
Between the first surface and the antenna board, they are provided at different positions in the circumferential direction around the first signal metal terminal in a plan view from the thickness direction of the mounting board to obtain a ground potential. With multiple first ground metal terminals,
Between the second surface and the high-frequency integrated circuit, a plurality of second ground metal terminals provided at different positions in the circumferential direction around the second signal metal terminal in the plan view and used as ground potentials. ,
Equipped with
A radio in which the first signal metal terminal and the second signal metal terminal overlap each other in the thickness direction of the mounting board, and the plurality of the first ground metal terminals and the plurality of the second ground metal terminals overlap each other. Communication module. The first signal metal terminal and the first ground metal terminal are arranged so as to have a pseudo coaxial structure of impedance matching.
The wireless communication module according to claim 1, wherein the second signal metal terminal and the second ground metal terminal are arranged so as to have a pseudo coaxial structure of impedance matching. The mounting board has a plurality of ground through holes having a ground potential penetrating from the first surface to the second surface.
The wireless communication module according to claim 1 or 2, wherein the plurality of ground through holes are provided at positions different from each other in the circumferential direction with respect to the signal through holes in the plan view. The wireless communication module according to claim 3, wherein the signal through hole and the ground through hole are arranged so as to have a pseudo coaxial structure of impedance matching. The mounting board has the two signal through holes.
The first signal metal terminal is provided at each of the first ends of the two signal through holes.
A portion of the first ground metal terminal arranged in the region between the two first signal metal terminals is arranged around the first signal metal terminal of one of the two first signal metal terminals. The plurality of first ground metal terminals and the plurality of first ground metal terminals arranged around the other first signal metal terminal are also used.
The second signal metal terminal is provided at each of the second ends of the two signal through holes.
A portion of the second ground metal terminal arranged in the region between the two second signal metal terminals is arranged around the second signal metal terminal of one of the two second signal metal terminals. The present invention according to any one of claims 1 to 4, wherein the plurality of the second ground metal terminals and the plurality of the second ground metal terminals arranged around the other second signal metal terminal are used in combination. The described wireless communication module. The first gland metal terminal according to any one of claims 1 to 5, wherein the first ground metal terminal is connected to only one of the first surface and the antenna board facing the first surface. Wireless communication module. The second ground metal terminal is connected to only one of the second surface and the high frequency integrated circuit facing the second surface, according to any one of claims 1 to 6. The described wireless communication module.

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