JP2022033923A - Mask frame having optimized length - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mask frame capable of reducing an interval between substrates continuously carried into a chamber in an in-line vapor deposition system.

SOLUTION: In a mask frame 200 for fixing a mask attached to a substrate, one side has a recessed shape formed on the inner side having the substrate at an end of the mask flame, and a side facing the side having the recessed part 210 includes a block part 220 projected to the outside. The block part of a first mask frame at the end of the mask frame attached to the substrate continuously arranged to each other maintains a state entered into the recessed part of a second mask frame adjacent to the first mask frame to reduce an interval between the substrates not so as to touch each other; the scattering of an evaporant toward a ceiling of a chamber is blocked by the block part of the mask frame; although the recessed part and the block part are formed at a predetermined height of an end body of the mask frame side, respectively, the block part entered so as to engage the recessed part maintains a state without touching each other.

SELECTED DRAWING: Figure 2

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to the field of tire manufacturing, and particularly to a molding apparatus and a tire molding method. The present invention relates to a mask frame used in the manufacturing process of an organic light emitting element used for display and lighting, and more specifically, to provide a space between substrates continuously transferred in an in-line horizontal and vertical vapor deposition system. It concerns mask frames designed to be reduced.

The organic light emitting device is manufactured by bonding a mask to a substrate such as glass and depositing an organic substance at an evaporation source. At this time, the mask is used by attaching a mask sheet to a mask frame provided with an opening. The mask frame is shown in FIG. 1 in a perspective view and a side sectional view. Such a vapor deposition process is carried out in an in-line system. In the in-line vapor deposition system, the process chambers are arranged linearly, and the substrate is continuously carried into the chambers so that the process proceeds rapidly. Since the evaporation material is continuously ejected from the evaporation source arranged in the chamber where the substance is deposited, the narrower the distance between the substrates carried into the vapor deposition chamber from the in-line system, the better. This prevents expensive substances from being wasted and further reduces takt time.

On the other hand, the mask frame end of the mask on which the substrate is mounted is configured in a size larger than that of the substrate, so that the substrate can be safely settled. Evaporates ejected from the evaporation source have a Cosine distribution and are ejected radially. At this time, in order for the evaporation material ejected from the above-mentioned evaporation source to be vapor-deposited on the glass substrate in the direction of the mask frame approaching the fixed evaporation source without being disturbed by the end of the above-mentioned mask frame, the mask frame It is required that the end portion of the surface secures a considerable margin portion, and the inside of the portion forming the margin portion is formed so as to have an inclination angle that matches the incident angle of the evaporator. Therefore, there is inevitably a gap between the substrates due to the end of the mask frame.

The gap between the substrate / mask and the mask frame that is continuously carried into the vapor deposition chamber becomes a passage for the evaporation material ejected from the evaporation source to contaminate the ceiling and wall surface of the chamber. However, the protruding parts formed at the front end and the rear end are formed while maintaining a height difference from each other, and are positioned so as to mesh with each other and interfere with each other when moving. It acts as a blocking part that blocks the gap so that the evaporation does not hit the ceiling of the chamber. However, the protrusions as described above also have the reverse function of increasing the spacing between the substrates, wasting more expensive substances, and increasing the takt time, in addition to the pure function of blocking evaporation. That is, since the evaporator ejected from the evaporation source has an oblique angle, vapor deposition to the end of the substrate cannot be performed unless the end of the mask frame secures a considerable margin, and therefore, between the substrates. The spacing between the substrates is inevitably required to have a predetermined length, and the spacing between the substrates is further increased by the protrusion of the blocking portion for preventing the evaporation from scattering from the ceiling.

In addition to Published Patent No. 10-2018-0047594, many publications describe masks, and the above publications describe mask production with ultra-precision, but for the above-mentioned problems. Does not have another recognition.

Korean Published Patent No. 10-2018-0047594

An object of the present invention is to provide a mask frame capable of shortening the distance between substrates continuously carried into a chamber in an in-line vapor deposition system.

It should be noted that the present invention also has a configuration for configuring a mask frame that prevents the obliquely incident evaporator from being blocked by the injection angle of the evaporator, and at the same time, a configuration for preventing the bending phenomenon that occurs when the mask frame is enlarged together with the substrate. The purpose is to provide.

It is an object of the present invention to construct a mask frame capable of shortening the distance between substrates as described above, and at the same time, to provide a configuration in which existing equipment can be applied as it is in the process of pulling and welding the mask stick.

For the above purpose, in the present invention, one side of the mask frame has the shape of an inwardly recessed portion of the substrate, and the opposite side has the shape of a blocking portion protruding outward, and is mutually continuous. The blocking part of the first mask frame (the one on the front surface) at the end of the mask frame joined to the substrate arranged in the above position was pulled into the recess of the second mask frame (the one on the back surface) at intervals. By maintaining the state, the distance between the substrates is shortened, and at the same time, the scattering of the evaporation to the ceiling side is blocked by the blocking portion of the mask frame.

In the present invention, the concave portion and the blocking portion formed on the mask frame side are formed on the protruding portion protruding upward from the mask frame side, and the mask frame is flexed by strengthening the rigidity and tension due to the weight. Prevent the phenomenon.
In the above, the recess can be replaced with a flat portion, and the blocking portion can be shaped like a wing extending outward on a protruding portion that protrudes upward.

In the present invention, all four sides of the mask frame are formed so as to protrude upward, and the thickness of the mask frame excluding the protrusions is reduced to reduce the height of the frame surface on which the substrate is placed. This makes it possible to reduce the distance between the substrate and the evaporation source.
That is, the present invention
In the mask frame where the mask to be bonded to the substrate is fixed
One side with a concave shape made inside with a flat part or substrate at its end;
The side facing the side on which the flat portion or the concave portion is formed has a blocking portion protruding outward; and the two sides of the mask frame in which the concave portion and the blocking portion are formed have an upward protruding portion; do,

The blocking part of the first mask frame (on the front side) at the end of the mask frame bonded to the mutually continuously arranged substrates is above the flat part or recess of the second mask frame (on the back side). The state of entry into the chamber is maintained, but each is prevented from hitting, the distance between the substrates is shortened, and at the same time, the scattering of the evaporation toward the ceiling of the chamber is blocked by the blocking part of the mask frame.

The two sides of the mask frame in which the concave portion and the blocking portion are formed provide a mask frame characterized in that an upward protruding portion is formed following each side to perform a bending prevention function of the mask frame.

In the above, the present invention provides a mask frame characterized in that the remaining two sides of the mask frame in which the concave portion and the blocking portion are not formed also have upward protrusions formed following the respective sides.
It should be noted that the present invention is described in this invention.
In the mask frame where the mask to be bonded to the substrate is fixed
One side having a flat portion or an inwardly formed concave portion having a substrate at its end; and a blocking portion having a flat portion or a side facing the side on which the concave portion is formed and projecting outward; ,

The blocking part of the first mask frame (on the front side) at the end of the mask frame bonded to the mutually continuously arranged substrates is above the flat part or recess of the second mask frame (on the back side). The space between the substrates is shortened so that they do not hit each other, and at the same time, the evaporation of the evaporation toward the ceiling of the chamber is blocked by the blocking part of the mask frame. A featured mask frame is provided.

In the above, the end of one side on which the flat portion or the recess is formed and the end of the opposite side on which the blocking portion is formed are provided with an upward protrusion following the side, and the flat portion is described above. Provided is a mask frame characterized in that a portion or a recess and a blocking portion are each formed on a protrusion.

In the above, there is provided a mask frame comprising a mask frame in which a cutoff portion is formed at a predetermined height of the protrusion and a recess is formed by digging the outer end portion of the protrusion inward so that the cutoff portion can enter. ..

In the above, the recess and the cutoff portion are each formed at a predetermined height of the end body on the side of the mask frame, but the cutoff portion enters so as to mesh with the recess and maintains a state in which they do not hit each other. Provides a mask frame characterized by.
In the above, there is provided a mask frame characterized by further including an upward protrusion of an end portion of a mask frame side on which a recess and a blocking portion are not formed.
In the above, the protrusions provide a mask frame comprising an opening so that the mask stick can pass through and be fixed to the mask frame.

In the above, there is provided a mask frame characterized in that the portion forming the inner width and thickness of the end body of the mask frame is processed so as to have an oblique shape following the inclination of the material beam.

In the above, one end in the end of one side on which the flat portion or the recess is formed and the end of the opposite side on which the blocking portion is formed is a portion protruding upward along the side. Provided is a mask frame characterized by being provided with.

In the above, the present invention provides a mask frame characterized in that a substrate fixing device including one or more clamps is provided on a flat portion of a mask frame end portion to fix the substrate.
The above mask frame; and

Evaporation characterized by being configured so that a substance can be vapor-deposited on the substrate while moving in a predetermined direction, including a substrate fixed by a substrate fixing device rested on a flat portion of the mask frame. Provide the system.
In the above, the substrate provides a vapor deposition system characterized by being chucked into a chuck plate.
It should be noted that the present invention is described in this invention.
In the mask frame where the mask to be bonded to the substrate is fixed
One side having an inwardly formed concave portion with a substrate at its end; and a blocking portion protruding outward from the side facing the side on which the above concave portion is formed;

A state in which the blocking portion of the first mask frame (the one on the front surface) at the end of the mask frame bonded to the mutually continuously arranged substrates has entered the recess of the second mask frame (the one on the back surface). While maintaining, the distance between the substrates is shortened so that they do not hit each other, and at the same time, the scattering of evaporation toward the ceiling of the chamber is blocked by the mask frame blocking part.
The inner wall of the above mask frame is
It is provided with a first step portion protruding inward of the mask frame; and a second step portion continuous from the first step portion to the lower step.
The first step portion described above functions as a rail resting portion on which the rail for transfer to the end of the chuck plate mounted on the mask plate is rested.
The above-mentioned second step portion functions as an anti-slip pad attachment portion for supporting the anti-slip pad provided on the chuck plate.

The lower surface of the above mask frame is characterized in that the mask stick is positioned and the mask stick is inserted for welding to the mask frame-the mask frame is provided with a large number of concave stepped portions on four sides of the mask frame as welded portions. I will provide a.
It should be noted that the present invention is described in this invention.
In the mask frame where the mask to be bonded to the substrate is fixed
One side having an inwardly formed concave portion with a substrate at its end; and a blocking portion protruding outward from the side facing the side on which the above concave portion is formed;

A state in which the blocking portion of the first mask frame (the one on the front surface) at the end of the mask frame bonded to the mutually continuously arranged substrates has entered the recess of the second mask frame (the one on the back surface). While maintaining, the distance between the substrates is shortened so that they do not hit each other, and at the same time, the scattering of evaporation toward the ceiling of the chamber is blocked by the mask frame blocking part.
The inner wall of the above mask frame is
It is provided with a first step portion protruding inward of the mask frame; and a second step portion continuous from the first step portion to the lower step.
A board fixing device including a clamp is arranged in the above first step portion, and the board fixing device is arranged.
The above-mentioned second step portion serves as a support surface for supporting the substrate.

The lower surface of the mask frame is arranged with the mask stick welded to the mask frame, and the substrate support surface is formed so that the mask stick is in close contact with the substrate in the portion of the substrate support surface of the second step portion through which the mask stick passes. Provides a mask frame characterized by not being.
In the above, a large number of clamp insertion grooves formed at predetermined intervals in the anti-slip pad anchoring portion corresponding to the second step portion;
The clamp insertion groove provides a mask frame characterized by being a space for receiving a clamp which is an auxiliary means for fixing a substrate of a chuck plate.

In the above, the two sides of the mask frame in which the concave portion and the blocking portion are formed provide a mask frame characterized in that an upward protruding portion is formed following each side to perform a bending prevention function of the mask frame. do.
In the above,

At the end of the outermost outer part of the lower surface of both opposite sides of the mask frame, a roller support surface to which the roller for mask transfer hits is formed, and the roller support surface is the outermost part avoiding the insertion-welding part of the mask stick. Provided is a mask frame characterized by being formed as a recessed step portion.

In the above, the distance g between the ends of the mask frame is designed to be 10 mm to 50 mm, and the distance W from the inner wall of the first step portion to the end of the mask frame is designed to be 10 mm to 100 mm. Provided is a mask frame characterized by an interval of 100 to 300 mm.

In the thickness of each side of the above mask frame, the thickness t1 from the lower surface of the mask frame to the rail anchoring part is the same on the four sides of the mask frame, and the total thickness to the upper surface of the mask frame is for each side. We provide mask frames characterized by being able to be configured with different thicknesses.
The above mask frame; and

It is characterized by being configured so that substances can be deposited on the substrate while moving in a predetermined vertical or horizontal direction, including the chuck plate in which the substrate is chucked on the first step portion and the second step portion of the above mask frame. To provide a vapor deposition system.
The above mask frame; and

Provided is a vapor deposition system characterized by being configured so that a substance can be vapor-deposited on a substrate while moving in a predetermined direction including a substrate arranged on a substrate support surface of the mask frame.

According to the present invention, by reducing the distance between the substrates that are continuously carried in / out of the process chamber, material waste is reduced, takt time is reduced, and the overall system size including the chamber is reduced. The effect is obtained, which does not affect the vapor deposition direction and can be applied to the in-line vapor deposition equipment of the vertical vapor deposition or the horizontal vapor deposition method in the same manner.
In addition, since the weight is reduced by reducing the size of the mask frame to be manufactured, there are also advantages such as materials and transportation.
In the present invention, the bending phenomenon of the mask frame can be prevented by shortening the distance between the substrates as described above and at the same time strengthening the rigidity and tension by the protruding portion.

In the present invention, not only the distance between the substrates is shortened, but also the distance between the substrates and the evaporation source is reduced, so that the efficiency of using the vapor-deposited material is further improved and the deflection is reduced. offer.

In the present invention, as described above, the space between the substrates is shortened, and at the same time, a large number of mask stick insertion welds are formed in the recessed step portions on the lower surface of the mask frame, so that the mask stick tensioning and welding steps can be performed. It can be easily carried out with equipment.

In the present invention, a step portion for attaching the chuck plate is formed on the inner wall of the mask frame like two stairs, and each rail and the anti-slip pad are attached to the mask frame according to the respective heights. I can wear it.

It is a perspective view which shows the structure of the mask frame currently used. FIG. 5 is a cross-sectional view showing an end configuration of a mask frame having a recess on one side and a blocking portion projecting on the other side in order to reduce the spacing between substrates according to an embodiment of the present invention. 2 is a perspective view, a side view, and a cross-sectional view showing the mask frame of FIG. 2. It is a drawing which shows the simulation result with respect to the degree which the mask frame of FIG. 3 causes a bending phenomenon in a vapor deposition process environment. It is sectional drawing which shows the edge structure of the mask frame which formed the recess and the cutoff part on the upward protrusion for reducing the space between substrates according to another embodiment of this invention. It is almost the same as FIG. 5, but is a perspective view, a side view, and a cross-sectional view showing that the shapes of the concave portion and the blocking portion of the mask frame of FIG. 5 are slightly deformed. FIG. 6 is a drawing showing a simulation result for the degree to which the mask frame of FIG. 6 causes a bending phenomenon in a vapor deposition process environment. 2 is a side view and a cross-sectional view showing a mask frame designed to reduce the amount of deflection at the expense of slightly increasing the spacing between the substrates in the configuration of FIG. 2 of the present invention. It is a figure which shows the simulation result with respect to the degree which a mask frame of FIG. 8 causes a bending phenomenon in a vapor deposition process environment. As another embodiment of the present invention, it is a side view and a cross-sectional view showing an end configuration of a mask frame in which a recess and a blocking portion are formed on an end body of the mask frame. FIG. 10 is a drawing showing a simulation result for the degree to which the mask frame of FIG. 10 causes a bending phenomenon in a vapor deposition process environment. As another embodiment of the present invention, the end configuration of the mask frame is shown in which the recess and the blocking portion are formed on the end body of the mask frame, and the upward protrusions are provided on the two opposite sides of the mask frame. It is a side view and a sectional view. FIG. 12 is a drawing showing a simulation result for the degree to which the mask frame of FIG. 12 causes a bending phenomenon in a vapor deposition process environment. FIG. 3 is a perspective view of the mask frame showing that an opening for passing the mask stick is formed in the protruding portion body at the end of the mask frame of FIG. 12. It is a front view, a side view, and a cross-sectional view which shows that all the upward protrusions were installed on the four sides of a mask frame as an embodiment of modification with respect to FIGS. 12 to 13. It is a perspective view of the mask frame of FIG. FIG. 15 is a drawing showing a simulation result for the degree to which the mask frame of FIG. 15 causes a bending phenomenon in a vapor deposition process environment. Although the structure is the same as that of the mask frame of FIG. 15, it is a drawing showing the simulation result when the size is deformed to slightly widen the space between the substrates and at the same time the length of the frame portion is increased to reduce the amount of deflection. .. Although the structure is the same as that of the mask frame of FIG. 12, the case where the size is deformed to shorten the space between the substrates and the amount of deflection is also shown. It is a figure which shows the simulation result with respect to the mask frame of FIG. As a modification of FIG. 15, a case is shown in which the detailed dimensions of each part constituting the mask frame are adjusted to shorten the space between the substrates and the amount of deflection is also minimized. It is a figure which shows the simulation result with respect to the mask frame of FIG. This is an example showing an asymmetric structure in which a protrusion is formed on only one side. This is an example showing an asymmetric structure in which a protrusion is formed on only one side. It is sectional drawing which shows the Example which pulls and welds a mask stick to the lower part of a mask frame. It is an enlarged cross-sectional view which shows the overlapping part of the concave part of the mask and the cutoff part arranged in the front and back in the vapor deposition system in an enlarged manner. It is a 3D drawing for the mask frame of an embodiment in which a mask stick is pulled and welded to the lower part of the mask frame. It is a front view seen from the traveling direction when a mask frame is placed on a roller (600) during a horizontal vapor deposition process. It is a front view seen from the traveling direction when a mask frame is placed on a roller (600) during a vertical vapor deposition process. It is a perspective view which shows the thing which changed the thickness for each side of a mask frame as a modification of the present invention. It is a perspective view which shows the shape which the mask stick (450) is welded and fixed to the mask frame of this Example. When the substrate is fixed to the mask frame only by a substrate fixing device such as a clamp and used in the vapor deposition process, the embodiment shown in FIG. 27 is modified.

Hereinafter, desirable embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a perspective view and a cross-sectional view showing the configuration of a mask frame currently used.

By arranging a blocking part (20) protruding from one end of the mask frame and a different height at the other end, the protruding blocking can be placed so that it does not collide and is superimposed on the top and bottom. The part (30) is formed. As described above, such a blocking portion serves to block the evaporation so as not to contaminate the ceiling of the chamber. The path through which the evaporator reaches the edge of the substrate is indicated by a red line, and the edge of the mask frame is taken into consideration so that the material beam is not blocked by the inside of the end fuselage of the mask frame in consideration of such an inclination diagram. The inner profile of the fuselage follows the yellow line (215, 225). That is, the end fuselage of the mask frame is composed of a size whose width w and thickness t are limited by the inclination angle of the material beam, and is the length of the margin width L (from the end of the substrate to the start point of the blocking portion). The length is required to be a predetermined level depending on the inclination angle of the material beam. For example, w and t are 50 mm or more, and L is 150 mm or more. Here, due to the presence of the protruding blocking portions (20, 30) for blocking the substance, the distance between the substrates is inevitably longer than the length of the 2L + blocking portion. For 8th generation vapor deposition equipment, the spacing D between the boards may be 400 mm or more. The problems of material waste, delay in takt time, and increase in chamber size due to the spacing between substrates have already been explained. However, the presence of a protruding cutoff is essential for the continuous process of an inline system.

FIG. 2 is an attempt to improve the configuration of the blocking portion of FIG. 1 to reduce the distance between the substrates. FIG. 3 is a perspective view, a side view, and a cross-sectional view that make it easier to understand the mask frame of FIG.

A recess (210) is formed on one side of the mask frame (200), and a wing-like protruding cutoff portion (220) is formed on the other side, and the end portion of the protruding cutoff portion (220) is described above. Even if they enter the recess (210), they are still separated from each other so that they do not come into contact with each other. The end of the mask frame shortens the margin width extended from the end of the substrate, and the part forming the inner width and thickness of the end body of the mask frame has an oblique shape according to the inclination of the material beam. Is processed into. With such a mask frame configuration, the distance between the substrates continuously carried into the chamber is shortened by 40% or more as compared with that in FIG. 1, so that the amount of substance used is reduced by about 5%. Also, the takt time will be reduced by 5-6%.

On the other hand, the mask frame may be deformed by its own weight in the vapor deposition process environment. For example, if the longer side of the mask frame is placed and supported on a roller during the process, it will cause a deflection phenomenon including the center of the side of the shorter mask frame. do. FIG. 4 is a drawing showing a simulation result for the degree to which the mask frame of FIG. 3 causes a bending phenomenon in a vapor deposition process environment. According to the simulation in the case of the mask frame as shown in Fig. 1, the amount of deflection appears at about 1.87, and in Fig. 2, the amount of deflection increases to 3.57. This reduces the weight and rigidity of the sides that make up the frame by carving the inner thickness and width of the end fuselage (250) into a diagonal cross section (300) instead of reducing the margin width to shorten the length. It can be inferred that this is the cause. As a result, the present invention provides yet another embodiment so that the weight and rigidity of the end of the mask frame can be enhanced.

FIG. 5 shows the configuration of an end of a mask frame in which a recess and a barrier for reducing the spacing between substrates are formed on an upward protrusion (230) according to another embodiment of the present invention. It is a cross-sectional view. The protrusion (230) is formed like a staircase following the mask frame side. FIG. 6 has almost the same configuration as the mask frame of FIG. 5, but is a perspective view, a side view, and a cross-sectional view showing that the shapes of the recess and the blocking portion are slightly deformed. That is, the inclined shape inside the end body of the mask frame in FIG. 2 is maintained as it is, and the concave portion (210) and the protruding cutoff portion (220) formed at the end are not formed on the end plane of the mask frame and are above. FIG. 5 shows the protrusions (230, 235) formed on the protrusions. Such a protrusion configuration can restore the weight and stiffness reduction due to the carved portion to form an oblique cross section (300) inside the end fuselage (250). Even if the recess (210) in FIG. 5 is deformed into a flat portion, the same effect can be obtained as long as the end portion of the blocking portion (220) is inserted into the end portion of the flat portion.

As shown in FIG. 6, a cutoff portion (220) is formed at a constant height of the protrusion, and the outer end of the protrusion is dug inward to form a recess (210) through which the cutoff portion (220) can enter. You can also do it.

FIG. 7 is a drawing showing a simulation result for the degree to which the mask frame of FIG. 6 causes a bending phenomenon in a vapor deposition process environment. In Fig. 5, almost the same results were obtained by this simulation. As a result of the simulation, the amount of deflection is 1.01, which is much smaller than that of FIGS. 1 and 2. While maintaining the distance between the boards at 215 mm, the amount of deflection is further reduced, which is advantageous in various aspects. However, since the mask stick cannot be attached to the mask frame as in the existing case due to the protruding portion, an opening (270) through which the mask stick can pass must be formed in the protruding portion. The opening (270) can be formed in the same manner as in FIG.

FIG. 8 is a side view and a cross-sectional view showing a mask frame designed to reduce the amount of deflection at the expense of slightly increasing the spacing between the substrates in the configuration of FIG. 2 of the present invention. That is, the bending phenomenon is prevented by slightly lengthening the margin at the end of the mask frame to strengthen the weight and rigidity of the frame itself. In the case of this embodiment, the distance between the substrates is 255 mm, which is slightly longer than that in FIG.

FIG. 9 is a drawing showing a simulation result for the degree to which the mask frame of FIG. 8 causes a bending phenomenon in the vapor deposition process environment. The amount of deflection is 2.45, which is less than that in Fig. 2 (3.57).

In FIG. 10, the distance between the substrate and that in FIG. 8 can be the same or smaller, and the end portion of the mask frame is formed with a recess (210) and a blocking portion (220) on the end body of the mask frame in order to reduce the amount of deflection. It is a side view and a cross-sectional view which show the structure. A recess (210) is formed on the vertical surface of the fuselage at one end of the mask frame, and a protrusion blocking portion (220) that enters the recess (210) is formed on the vertical surface at the end of the opposite side. Form. The cutoff (220) is anchored as if it meshes with the recess (210) to reduce the spacing between the substrates and maintains a gap so that the cutoff and the recess do not touch each other.

FIG. 11 is a drawing showing a simulation result for the degree to which the mask frame of FIG. 10 causes a bending phenomenon in a vapor deposition process environment. The amount of deflection is 2.21, which is less than that in Fig. 8.

FIG. 12 is a front view and a side view showing the end configuration of the mask frame of FIG. 10, which is provided with more upward protrusions in order to reduce the amount of deflection and the spacing between the substrates is further shortened. It is a figure and a sectional view. Since the upward protrusion (230, 235) makes it difficult to attach the mask stick to the mask frame, an opening (270) is formed in the protrusion (230, 235). Here, the distance between the substrates is 215 mm, which is the same as in FIG.

FIG. 13 is a perspective view showing that an opening (270) for passing the mask stick is formed in the body of the protruding portion at the end of the mask frame of FIG. 12.

FIG. 14 is a drawing showing the simulation results for the degree to which the mask frame of FIG. 12 causes a bending phenomenon in the vapor deposition process environment. The amount of deflection is reduced to 1.64 due to the protrusion.

FIG. 15 is a front view, a side view, and a cross-sectional view showing that all the upward protrusions are installed on the four sides of the mask frame as a modification of FIGS. 12 to 13, and FIG. 16 is a cross-sectional view thereof. In the perspective view, it is easier to understand the state in which the protrusions are formed on the four sides. By forming protrusions not only on the upper part of the side where the concave portion (210) and the cutoff portion (220) are formed, but also on other sides in this way, the thickness of the mask frame is further reduced while suppressing the deflection. The spacing between the substrates can be further reduced. In this example, the thickness was 40 mm and the distance between the substrates was 165 mm. The thickness t of the existing mask frame in FIG. 1 is usually 50 mm or more, and the thickness of this embodiment is reduced by 10 mm or more. When the thickness of the mask frame excluding the protrusions is reduced, the distance between the substrate settled on the upper surface of the frame and the evaporation source is shortened, which has the effect of increasing the efficiency of using the vapor-deposited raw material. You can expect it. Applying such a structure can also significantly reduce the weight.

That is, the protrusions protruding upward from the mask frame side are formed on all four sides, and the thickness of the mask frame excluding the protrusions is reduced by about 10 to 30% as compared with the case without the protrusions to reduce the substrate. The height of the placed frame surface can be reduced to reduce the distance between the substrate and the evaporation source. By reducing the distance between the substrate and the evaporation source, as described above, the material efficiency is increased and the shadow effect of the evaporation beam is also reduced, which is advantageous.

FIG. 17 is a drawing showing a simulation result for the degree to which the mask frame of FIG. 15 causes a bending phenomenon in the vapor deposition process environment. In this case, the spacing between the substrates is narrowed, but the amount of deflection is expected to increase slightly to 3.83. Since the space between the substrates is narrow, effects such as reduction of wasted substances, tact time, and reduction of space can be obtained.

It is shown in FIG. 18 that the detailed dimensions have been adjusted in FIG. 15 to further reduce the amount of deflection. That is, although the structure of FIG. 18 is the same as that of the mask frame of FIG. 15, the simulation result is obtained when the length of the frame portion is extended and the amount of deflection is reduced by deforming the size and slightly widening the space between the substrates. It is a drawing which shows. The dimensional adjustment slightly increases the spacing between the boards to 215 mm, but reduces the amount of deflection to 2.7.
It is shown in FIG. 19 that the detailed dimensions are adjusted by returning to the one in which the protrusions are formed only on two sides for optimization.

FIG. 19 has the same structure as the mask frame of FIG. 12 (protrusions are formed on two sides), but the height (h) of the protrusions is increased and the distance between the substrates is reduced to 165 mm. Is.
FIG. 20 shows the simulation results for the mask frame of FIG. 19, and the amount of deflection is expected to be further reduced to 1.59.
An attempt was made to optimize the detailed dimensions in order to obtain better results even when all the protrusions were formed on all four sides according to the results shown in FIG.

In FIG. 21, as a modification of FIG. 15, the height (h) of the protrusions formed on the four sides is extended to complement the thickness of the thinned mask frame, and each part constituting the mask frame is shown. An example is shown in which the detailed dimensions are adjusted to shorten the space between the substrates and the amount of deflection is also minimized. That is, the height (h) of the upward protrusion is made higher, the width (w1) is shortened a little, the length of the horizontal component of the cutoff part is also shortened a little, and the distance between the substrates is closer. The dimensions were adjusted so that The thickness of the mask frame is 40 mm, which is thin, and the distance between the substrates is 165 mm.

FIG. 22 shows the simulation results for the mask frame of FIG. 21, and the amount of deflection is expected to be minimized to 1.09. By applying such a structure, the efficiency of use of the vapor-deposited material is improved by the effect of reducing the space between the substrates and the space between the substrate and the evaporation source, and the efficiency of the entire system is improved while the deformation of the mask frame is suppressed. can.

FIG. 23 is a perspective view of a modified embodiment in which an upward protrusion is formed on only one side on which a recess or a blocking portion is formed, and FIG. 24 is a cross-sectional view thereof. Since the upward protrusion is asymmetrically formed, FIG. 23 shows that the protrusion is formed on the side with the recess. Such a configuration shortens the distance between the substrates and reduces the amount of deflection of the mask frame, so that the configuration can be simplified a little more. The above asymmetric structure is applicable to all the above embodiments.
FIG. 25 shows an example in which a mask stick is pulled to the lower part of a mask frame for welding.

It is a drawing seen from the side surface of the mask frame in the traveling direction during the vapor deposition process, and the concave portion (210) at the right end and the protruding blocking portion (220) at the left end are cut off from the concave portion of another mask in contact as described above. The passage of the vapor-deposited material is blocked by overlapping the parts so as to mesh with each other.

A stepped anchoring portion (400, 410) is formed inscribed on the inside of the mask frame so as to mount the chuck plate shown in the cross-sectional view of the left half of FIG. 25. The first step is the rail rest (400) resting on the transfer rail (520) at the end of the chuck plate, and the second step is on the inner frame of the chuck plate rail. It is an anti-slip pad attachment portion (410) for supporting the anti-slip pads (510) formed at regular intervals.

It is the same as the above embodiment that the distance between the substrates can be shortened and the material utilization efficiency of the vapor deposition system can be improved by shortening and optimizing the length of the front and rear ends of the mask frame by the above structure. Is.

Since the chuck plate is attached to the anchoring part (400, 410) that is dug in the inside of the mask frame, the distance between the substrate and the evaporation source is shorter than the existing mass production method, and the vapor deposition efficiency of the material is reduced. You can get an additional effect of increasing.

The mask stick will be welded by inserting the stick into the underside of the frame-pulling it to the weld (280, only the right half of the drawing is shown for convenience), but flip the mask frame over and the underside of the mask frame is up. When the tensioning and welding processes are carried out so as to face each other, there is an advantage that the same tensioner equipment and manufacturing method used in the existing mask manufacturing process can be applied. That is, in the structure in which the protrusion is applied on the mask frame shown in FIGS. 12 to 24, the stick must be welded to the upper surface of the mask frame while avoiding the protrusion, which is used in the existing mask manufacturing process. The stick tensioning process cannot be performed with the tensioning device equipment, and a tensioning device with a modified stick loading and tensioning process is required, but this embodiment does not have such a problem.
A roller support surface (420) that contacts and supports a drive unit such as a roller to transfer the mask from the vapor deposition system is at the end of the mask frame.
FIG. 26 is an enlarged cross-sectional view showing an enlarged portion where the concave portions (210) and the blocking portions (220) of the masks arranged in the front and rear are overlapped in the vapor deposition system.

Chuck plates (500) placed on the anchoring parts (400, 410) are also shown. A substrate (100) is attached to the lower part of the chuck plate, and the lower surface of the substrate can be adjusted to match the position of the mask stick by adjusting the height of the anti-slip pad (510). The mask stick (450) is welded to the surface of the insertion-weld portion (280) of the mask stick as illustrated in FIG.

In this embodiment, the distance (GtoG) between the substrates is the distance W from the inner wall of the rail anchoring portion (400) to the end of the mask frame, or the distance between the ends of the front and back mask frames g, and then L ( It is possible to optimize by adjusting the dimensions such as the distance from the end of the board to the end of the original mask frame excluding the blocking part) and reducing it from the existing one. By adjusting roughly W to 10 to 100 mm and g to 10 to 50 mm, the board-to-board distance (GtoG) should be optimized between 100 and 300 mm. The frame thicknesses t1 and t2 should be used within a range of about several tens of mm and within a range where the weight of the mask frame does not increase significantly in order to ensure rigidity.

Mask frame thickness t1 (thickness from the bottom of the mask frame to the rail attachment part (400)) and t2 (total thickness from the bottom to the top of the mask frame) ensure rigidity and do not significantly increase the weight. Design with a predetermined value within the range.
FIG. 27 is a 3D drawing for the mask frame of this embodiment.

The above-mentioned anchoring portion (400, 410) of the chuck plate is described in detail in the drawing showing a partially enlarged upper surface of the mask frame. The clamp insertion groove (430) formed in a part of the anti-slip pad anchoring portion (410) is received by the clamp when the chuck plate is anchored when the chuck plate has a clamp which is an auxiliary means for fixing the substrate. It can also be removed depending on whether the clamp can be used or not by securing a space that can be created.

In the above mask frame, there is no welded part of the mask stick on the upper surface, and a large number of mask stick insertion-welded parts (280) for positioning the mask stick on the lower surface and welding to the frame are formed over four sides. ing.

In the case of this embodiment, the mask stick insertion-welded portion (280) is formed in a total of 24 places. Inserting the mask stick-The welded part (280) is a stepped surface dug into a concave surface with a predetermined thickness, and the mask stick is fixed by welding using a part of the back surface (lower surface) of the mask frame. ..

A roller support surface (420) that can support and pass the roller for mask transfer can be formed at the end portion that is the outermost portion of the lower surface of the mask frame. The roller support surface (420) is located on the outermost side, avoiding the mask stick insertion-weld (280).

FIG. 28a is a front view seen from the traveling direction when the mask frame is placed on the roller (600) during the horizontal deposition process. The roller (600) comes into contact with the roller support surface (420) of the mask frame to support the mask frame and transfer the mask frame.

The thickness t1 from the lower surface of the mask frame to the rail anchoring part (400) is the same on the four sides of the mask frame, but the overall thickness t2 of the mask frame is above the rail anchoring part (400). The protruding height can be set individually for each side of the mask frame.

FIG. 28b is a front view seen from the traveling direction when the mask frame is placed on the roller (600) during the vertical deposition process. The diagonally arranged mask frame is transferred by the rollers (600) placed following the upper and lower sides thereof, and even in such a case, the blocking portion is formed on the mask frame side that does not contact the roller, and the adjacent mask frame. It can be used to show effects such as preventing material waste between the two.
FIG. 29 is a perspective view showing that the thickness is different for each side of the mask frame.

In the drawings of the above embodiment, the front-rear blocking portion and the recess in the traveling direction of the mask frame overlap with the total thickness (t1 + B) of each of the two sides supported by the drive portion such as a roller in the mask frame. The case where the thickness is smaller than the total thickness (t1 + A) of each of the two sides is illustrated. Here, A is the thickness from the rail anchoring portion (400) on the side where the barrier or the recess is formed to the upper surface of the mask frame, and B is the rail anchoring on the side without the barrier or the recess. It is the thickness from the portion (400) to the upper surface of the mask frame.

In this case, the total thickness of each of the two overlapping sides is thicker by (AB) than the total thickness of each of the two sides supported by the roller, and the deflection of the mask frame is reduced during the vapor deposition process at the same time. It is possible to make the thickness of the two sides supported by the roller that does not bend relatively thin so that the weight of the mask frame can be reduced.
In addition to the above embodiment, the thickness of each side of the mask frame can be set in various combinations.

FIG. 30 is a perspective view showing a shape in which a mask stick (450) is welded and fixed to the mask frame of this embodiment. Insertion of mask stick on the underside of the mask frame-Indicates that the end of the mask stick (450) is attached to the weld (280) by welding.

The arrangement of the mask sticks shown in FIG. 30 above is only one example, and it is clear that the mask sticks can be arranged in various configurations with different numbers and attachment positions depending on the vapor deposition model. It should be noted that FIG. 2 is not limited to the examples shown in the drawings in the recesses (210) and the blocking portions (220) in the structural drawing for blocking the vapor-filmed substances of the examples shown in FIGS. 25 to 31. , FIG. 5, FIG. 7 and the like in the first part of the present invention can be applied in the same manner as the blocking structure of the vapor-deposited material of the embodiment. (For example, a barrier structure of a vapor-deposited material that combines a flat portion and a barrier portion)

The mask developed by the present invention can be used for both the case of depositing glass on the Chuck Plate and the case of vapor deposition using only the glass substrate, and the case of using only the glass substrate is glass. A device for fixing the substrate can be used by fixing it to the upper surface of the mask (in the case of the examples shown in FIGS. 2 to 24). In the case of the embodiments shown in FIGS. 25 to 30, it is possible to install the device for fixing the glass substrate at the anchoring portion (400, 410) and fix the substrate, but the substrate is not firmly fixed. Therefore, the support surface (521) that supports the substrate can be configured in the mask frame and fixed more stably. One embodiment for this is shown in FIG. 31 with a schematic plan view and a cross-sectional view corresponding to A-A'. There are two indented steps inside the mask frame in a manner similar to using a chuck plate. The first step portion (first step portion) located on the outer side is a step portion (501) for installing a board fixing device such as a clamp, and the second step portion (second step portion) on the inner side is a step portion (501). It is a stepped portion that becomes a support surface (521) for supporting the substrate. There is a clamp (511) on the first step (501) to fix the board (100), and the end of the board is stably fixed by the clamp (511) while being supported by the board support surface (521). Will be done. Since the mask stick (450) must be in close contact with the substrate at the portion through which the mask stick (450) passes, the support surface (521) of the substrate is not formed. In the above, the mask stick is welded to the mask frame, and for convenience, concave steps may be formed on the four sides of the mask frame, and it may be welded to the end of the mask frame without the concave steps. be.

On the other hand, in the above, on the flat end portion (in the case of the examples shown in FIGS. 2 to 24) on the upper surface of the mask frame of the embodiment of the mask frame, or on the step portion (501) inside the mask frame (FIG. 25). -In the case of the embodiment shown in FIG. 30) One or more clamps for fixing the glass substrate can be installed. That is, such as a flat surface on which one or more clamps are placed, the upper part of the upward protrusion or the inside of the fuselage of the protrusion, or a step (501) for installing a board fixing device. Can be placed in.

This makes it possible to realize a thin-film deposition system in which a glass substrate placed on the flat end of the mask frame or on the inner stepped surface dug inscribed is clamped to the mask frame and moved.

In the above, it is also possible to attach the glass substrate to another means outside the chuck plate, and fix the glass substrate outside the clamp with another fixing device so as to restrict the movement of the glass substrate on one side. A linear vapor deposition system that can vaporize while moving in the direction can also be configured.

According to the present invention, the amount of vaporized substances such as organic substances and metals can be reduced by 3 to 7%, the tact time is reduced by 5 to 7%, the weight and size of the mask frame are reduced, and the material and handling are reduced by reducing the chamber size. It provides direct / indirect spillover effects such as cost savings and reduced footprint.

The rights of the invention are not limited to the embodiments described above, but are defined in the claims as described in the claims by a person having ordinary knowledge in the field of the present invention. It is clear that various transformations and adaptations are possible within the scope of the rights granted.

20, 30, 220: Block
200: Mask frame
210: Concave
230, 235: Overhang
250: End torso
270: opening
280: Stick insertion weld
300: Diagonal cross section
400, 410: Safety section
450: Mask stick
500: Chuck plate
510: Anti-slip pad
520: Rail
501: Step
511: Clamp
521: Board support surface

Claims (13)

In the mask frame where the mask to be bonded to the substrate is fixed
One side with an inwardly shaped recess with a substrate at its end; and
The side facing the side on which the recess is formed is provided with a blocking portion protruding outward;
The blocking portion of the first mask frame at the end of the mask frame joined to the mutually continuously arranged substrates is maintained in the recess of the second mask frame adjacent to the first mask frame, but each of them is maintained. At the same time as shortening the distance between the substrates so that they do not hit, the scattering of evaporation toward the ceiling of the chamber is blocked by the blocking part of the mask frame.
The above recesses and cutoffs are each formed at a predetermined height on the end body of the mask frame side, but the cutouts are inserted so as to mesh with the recesses to maintain a state in which they do not hit each other. Mask frame to do. In the mask frame where the mask to be bonded to the substrate is fixed
One side with an inwardly shaped recess with a flat part or substrate at its end; and
The side facing the side on which the flat portion or the recess is formed is provided with a blocking portion protruding outward;
The blocking portion of the first mask frame at the end of the mask frame joined to the mutually continuously arranged substrates is maintained in the recess of the second mask frame adjacent to the first mask frame, but each of them is maintained. At the same time as shortening the distance between the substrates so that they do not hit, the scattering of evaporation toward the ceiling of the chamber is blocked by the blocking part of the mask frame.
A mask frame characterized in that the end of the side on which the blocking portion is formed is provided with an upward protrusion along the side. In the mask frame where the mask to be bonded to the substrate is fixed
One side with an inwardly shaped recess with a flat part or substrate at its end; and
The side facing the side on which the flat portion or the recess is formed is provided with a blocking portion protruding outward;
The blocking portion of the first mask frame at the end of the mask frame joined to the mutually continuously arranged substrates is maintained in the recess of the second mask frame adjacent to the first mask frame, but each of them is maintained. At the same time as shortening the distance between the substrates so that they do not hit, the scattering of evaporation toward the ceiling of the chamber is blocked by the blocking part of the mask frame.
A mask frame characterized in that a substrate fixing device including one or more clamps is provided on a flat portion at the end of the mask frame to fix the substrate. A substance on a substrate while moving in a predetermined horizontal or vertical direction, including the mask frame of claim 3 ; and a substrate fixed by a substrate fixing device anchored on a flat portion of the mask frame. A vapor deposition system characterized by being configured so that it can be vapor-deposited. The vapor deposition system according to claim 4 , wherein the substrate is chucked to a chuck plate. In the mask frame where the mask to be bonded to the substrate is fixed
One side having an inwardly formed concave portion with a substrate at its end; and a blocking portion protruding outward from the side facing the side on which the above concave portion is formed;
Each of them maintains a state in which the blocking portion of the first mask frame at the end of the mask frame joined to the mutually continuously arranged substrates has entered the recess of the second mask frame adjacent to the first mask frame. The distance between the substrates is shortened so that they do not hit, and at the same time, the scattering of evaporation toward the ceiling of the chamber is blocked by the blocking part of the mask frame.
The inner wall of the above mask frame is
A first step portion protruding inward of the mask frame; and a second step portion continuous from the first step portion to the lower step;
The first step portion described above functions as a rail anchoring portion on which the rail for transferring the end portion of the chuck plate mounted on the mask plate is anchored.
The above-mentioned second step portion functions as a resting portion of the anti-slip pad for supporting the anti-slip pad provided on the chuck plate.
The lower surface of the mask frame is characterized by having a large number of concave stepped portions on four sides of the mask frame as an insertion-welding portion of the mask stick for positioning the mask stick and welding to the mask frame. .. In the mask frame where the mask to be bonded to the substrate is fixed
One side having an inwardly formed concave portion with a substrate at its end; and a blocking portion protruding outward from the side facing the side on which the above concave portion is formed;
Each of them maintains a state in which the blocking portion of the first mask frame at the end of the mask frame joined to the mutually continuously arranged substrates has entered the recess of the second mask frame adjacent to the first mask frame. The distance between the substrates is shortened so that they do not hit, and at the same time, the scattering of evaporation toward the ceiling of the chamber is blocked by the blocking part of the mask frame.
The inner wall of the above mask frame is
A first step portion protruding inward of the mask frame; and a second step portion continuous from the first step portion to the lower step;
A board fixing device including a clamp is arranged in the above first step portion, and the board fixing device is arranged.
The above-mentioned second step portion serves as a support surface for supporting the substrate.
On the lower surface of the mask frame, the mask stick is arranged by welding to the mask frame, and the substrate support surface is formed so that the mask stick is in close contact with the substrate in the portion where the mask stick passes in the substrate support surface of the second step portion. A mask frame characterized by not being. In claim 6 , a large number of clamp insertion grooves formed at predetermined intervals in the anti-slip pad anchoring portion corresponding to the second step portion;
The above-mentioned clamp insertion groove is a mask frame characterized by being a space for receiving a clamp which is an auxiliary means for fixing a substrate of a chuck plate. In claim 6 ,
At the end of the outermost outer part of the lower surface of both opposite sides of the mask frame, a roller support surface to which the roller for mask transfer hits is formed, but the roller support surface is the most avoiding the insertion-welding part of the mask stick. A mask frame characterized by being formed as a concave step on the outside. In claim 6 or 7 , the distance g between the ends of the mask frame is designed to be 10 mm to 50 mm, and the distance W from the inner wall of the first step portion to the end of the mask frame is designed to be 10 mm to 100 mm. A mask frame characterized in that the distance between the substrates is 100 to 300 mm. In the thickness of each side of the mask frame according to claim 6 or 7 , the thickness t1 from the lower surface of the mask frame to the rail anchoring portion is the same on the four sides of the mask frame, but reaches the upper surface of the mask frame. The mask frame is characterized in that the total thickness up to is composed of a different thickness for each side. The substance is deposited on the substrate while moving in a predetermined horizontal or vertical direction including the mask frame of claim 6 ; and the chuck plate in which the substrate is chucked at the first step portion and the second step portion of the mask frame. A vapor deposition system characterized by being configured to be capable. The mask frame according to claim 7 ; and the substrate arranged on the substrate support surface of the mask frame; Deposition system.

Images