JP2022029980A - Wiring board - Google Patents

Abstract

To provide a configuration that allows an increased number of resistors per unit area to be arranged on a wiring board having resistors with a trimming groove formed thereon.SOLUTION: An inspection wiring board 1 as one example of a wiring boards includes an insulation board 11, a first resistor 20R which is arranged on a surface (a first surface) 11a of the insulation board 11 and extends along a first direction, and a second resistor 30R which is arranged adjacent to the first resistor 20R in a second direction Y crossing the first direction X. The first resistor 20R has a first large width section 21 with a trimming groove 25, and a first small width section 22 having a narrower width than the first large width section 21. The second resistor 30R has a second large width section 31 with a trimming groove 35 and a second small width section 32 having a narrower width than the second large width section 31. The large width section 21 and the second small width section 32 are arranged adjacent to each other, and the second large width section 31 and the first small section 22 are arranged adjacent to each other.SELECTED DRAWING: Figure 1

Description

The present invention relates to a wiring board having a resistor.

The electric circuit is provided with a resistor for the purpose of adjusting the current value and the like. The resistor is used as an element of an electronic component such as a chip resistor. A trimming groove is formed on the resistor in order to set the target resistance value.

For example, Patent Document 1 discloses a chip resistor whose resistance value is adjusted by forming a trimming groove in a resistor provided on an insulating substrate. The chip resistor 1 disclosed in Patent Document 1 has a resistor 5 formed by printing so that the first meandering portion 6 and the second meandering portion 7 are continuous with the rectangular adjusting portion 8 interposed therebetween. By forming the first trimming groove 9 in the adjusting portion 8, the current path of the resistor 5 is lengthened to improve the surge characteristics, and then the resistance value of the resistor 5 approaches the target resistance value. It has been roughly adjusted. Further, by forming the second trimming groove 10 in the region where the current distribution is small in the second meandering portion 7, the resistance value of the resistor 5 matches the target resistance value according to the depth of cut of the second trimming groove 10. It has been fine-tuned to.

Japanese Unexamined Patent Publication No. 2019-20142

As described above, in order to adjust the resistance value by trimming, it is necessary to secure a region for forming a trimming groove in the resistor. On the other hand, in the technical field of wiring boards in recent years, there is an increasing demand for arranging patterns of various circuit elements on a board at high density. Therefore, when arranging a plurality of resistors on a substrate, it is desired to make the distance between adjacent resistors as small as possible.

Therefore, it is an object of the present invention to provide a configuration in which a larger number of resistors per unit area can be arranged in a wiring board having a resistor in which a trimming groove is formed.

The wiring board according to one aspect of the present invention includes an insulating substrate, a first resistor provided on the first surface of the insulating substrate and extending along the first direction on the first surface, and the above-mentioned. A second resistor extending along the first direction on the first surface and arranged adjacent to the first resistor in a second direction intersecting the first direction is provided. ing. The first resistor has a first wide portion having a trimming groove and a first narrow width portion narrower than the first wide portion. The second resistor has a second wide portion having a trimming groove and a second narrow width portion narrower than the second wide portion. In this wiring board, the first wide portion and the second narrow width portion are arranged adjacent to each other on the first surface, and the second wide width portion and the first narrow width portion are adjacent to each other. Are arranged.

According to the above configuration, when a plurality of resistors having trimming grooves are arranged on the first surface of the insulating substrate, a gap formed between the first resistor and the second resistor arranged adjacent to each other. Can be made smaller. As a result, the occupied area required for arranging the plurality of resistors on the first surface of the insulating substrate can be reduced. Further, by providing the trimming groove in the wide portion of each resistor, it is possible to secure the formation region of the trimming groove. Therefore, in a wiring board having a resistor in which a trimming groove is formed, more resistors can be arranged within a predetermined area of the first surface.

In the wiring board according to one aspect of the present invention, the trimming groove of the first wide portion is formed with a notch from the end on the side opposite to the side adjacent to the second resistor. The trimming groove of the second wide portion may have a notch formed from an end portion on the side opposite to the side adjacent to the first resistor.

According to the above configuration, when a trimming groove is formed in one of the first resistor and the second resistor arranged adjacent to each other, the laser beam used for forming the groove is applied to the other resistor. Accidental irradiation can be suppressed. Therefore, the distance between the first resistor and the second resistor arranged adjacent to each other can be further narrowed.

The wiring board according to one aspect of the present invention has the end portion of the first wide portion and the first narrow width portion of the first resistor on the side opposite to the side adjacent to the second resistor. The end portion of the portion is arranged on one straight line, and in the second resistor, on the side opposite to the side adjacent to the first resistor, the end portion of the second wide portion and the second resistance portion are arranged. 2 The end portion of the narrow width portion may be arranged on one straight line.

According to the above configuration, since the shape of each resistor is linear on the side opposite to the side where the first resistor and the second resistor face each other, this region (1 resistance) on the first surface of the insulating substrate. It is possible to facilitate the placement of other elements in the region on the side opposite to the side where the body and the second resistor face each other). Further, when a larger number of resistors (for example, three or more) are arranged on the insulating substrate, each resistor can be efficiently arranged.

In the wiring board according to one aspect of the present invention, the first resistor has the first wide width portion to the first narrow width portion between the first wide width portion and the first narrow width portion. The second inclined portion further has a first inclined portion whose width gradually narrows toward the portion, and the second resistor has the second thick portion between the second wide portion and the second narrow portion. It may further have a second inclined portion whose width gradually narrows from the width portion toward the second narrow width portion.

According to the above configuration, when the resistor is formed of a metal layer having the same area, the trimming groove formed from the wide portion of the resistor can be extended to the first inclined portion or the second inclined portion. Then, the distance from the tip of the trimming groove to the end of the resistor can be increased. Therefore, it is possible to reduce the possibility of cracks in the metal layer that may occur from the tip of the trimming groove.

According to one aspect of the present invention, it is possible to provide a configuration in which a larger number of resistors per unit area can be arranged in a wiring board having a resistor in which a trimming groove is formed.

It is a top view which shows the structure of a part of the inspection wiring board which concerns on 1st Embodiment. It is sectional drawing which shows the internal structure of the wiring board shown in FIG. It is a top view which shows the configuration example in which more resistors are arranged on the surface of a wiring board for inspection. It is a top view which shows the structure of a part of the inspection wiring board which concerns on 2nd Embodiment. It is a top view which shows the structure of a part of the inspection wiring board which concerns on 3rd Embodiment. It is a top view which shows the structure of a part of the inspection wiring board which concerns on 4th Embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same parts are designated by the same reference numerals. Their names and functions are the same. Therefore, the detailed description of them will not be repeated.

[First Embodiment]
In the present embodiment, as an example of the wiring board according to the present invention, the inspection wiring board 1 used for inspecting the electrical characteristics of electronic components will be described as an example. The inspection wiring board 1 is used as a component of a test jig such as a probe card for collectively performing an electrical inspection of a wafer on which a plurality of semiconductor elements are formed.

The wiring board according to the present invention is not limited to the inspection wiring board. The present invention can be applied to, for example, a wiring board having a high resistance conductive pattern (that is, a resistor) formed by a thin film forming method such as photolithography.

(Rough configuration of inspection wiring board)
FIG. 1 shows a configuration on the surface 11a (first surface) of a part of the inspection wiring board 1. In the present embodiment, for convenience, the surface on the side of the substantially flat plate-shaped inspection wiring board 1 on which the probe pad (not shown) or the like is formed is the front surface 11a, and the surface on the opposite side is the back surface (second surface). It is set to 11b. However, the definitions of the front surface and the back surface of the inspection wiring board 1 are not limited to this, and can be arbitrarily determined.

The inspection wiring board 1 has an insulating board 11. The insulating substrate 11 is formed by laminating a plurality of ceramic sheets. The ceramic sheet can be formed of, for example, a high temperature fired ceramic containing alumina (Al ₂ O ₃ ) as a main component. In another aspect, the ceramic sheet may be formed of a medium temperature fired ceramic (MTCC) such as glass-ceramic and a low temperature fired ceramic (LTCC).

On the surface 11a of the insulating substrate 11, for example, a probe pad (not shown), a capacitor pad (not shown), a cover pad (not shown), and a resistor R (for example, a first resistor 20R and a second resistor) are formed. Body 30R) and the like are provided. These are the components of the electronic circuit included in the inspection wiring board 1. Each of these components is electrically connected by a conductive wiring 12.

The probe pad is a conductive pad that abuts an inspection probe of an electronic component such as a semiconductor wafer to be inspected at the time of electrical property inspection. Usually, the inspection wiring board 1 is provided with a plurality of probe pads. The number and placement positions of the probe pads on the surface 11a of the inspection wiring board 1 are determined according to the configuration of the inspection probe of the electronic component to be inspected. The probe pad is electrically connected to another element such as a cover pad via the wiring 12.

The capacitor pad is a conductive pad for connecting a capacitor (capacitor). A chip capacitor is connected on the capacitor pad. The connection of the chip capacitor to the capacitor pad is done by soldering.

Usually, the inspection wiring board 1 is provided with a plurality of capacitor pads. The capacitor pad is electrically connected to another element such as a probe pad via the wiring 12. Further, the capacitor pad is electrically connected to the back surface side pad (not shown) provided on the back surface 11b side of the insulating substrate 11 via some connection vias penetrating the inside of the insulating substrate 11. ..

The cover pad is electrically connected to the probe pad and the capacitor pad via the wiring 12. Usually, the inspection wiring board 1 is provided with a plurality of cover pads.

Further, the cover pad is electrically connected to the back surface side pad provided on the back surface 11b side of the insulating substrate 11 via some connection vias penetrating the inside of the insulating substrate 11. The cover pad is used as a place where the inspection pin is brought into contact with the inspection wiring board 1 at the time of continuity inspection before shipment. The cover pad is also called a capture pad. In another embodiment, the inspection wiring board 1 does not have to have a cover pad.

The resistor R is one of the elements included in the electronic circuit in the inspection wiring board 1. The resistor R is provided to adjust the value of the current flowing in the electronic circuit. The resistor R is electrically connected to other elements such as a probe pad, a capacitor pad, and a cover pad via the wiring 12. Normally, a plurality of resistors R are provided on the surface 11a of the inspection wiring board 1.

In the wiring 12, each element such as a probe pad, a capacitor pad, a cover pad, and a resistor R is electrically connected on the surface 11a of the insulating substrate 11.

The probe pad, the capacitor pad, the cover pad, and the wiring 12 are mainly made of a material having high conductivity (conductive material). Examples of such conductive materials include copper (Cu), titanium (Ti), tungsten (W), silver (Ag), palladium (Pd), gold (Au), platinum (Pt), and molybdenum (Mo). , Nickel (Ni), or a metal material such as manganese (Mn), or an alloy material containing these metal materials as a main component.

The resistor R is made of a material (also referred to as a resistant material) having a lower conductivity than the conductive material. Examples of such a resistant material include tantalum nitride (Ta 2N, TaN, etc.), ruthenium oxide, Cu _— Ni alloy, and the like.

The rough resistance value of the resistor R is defined by the area of the metal layer (for example, Ta ₂ N layer 41) forming the resistor R. Further, the resistor R is formed with a trimming groove (for example, a trimming groove 25 or 35) for finely adjusting the resistance value. By specifying the amount (length) of the trimming groove, the resistance value of the resistor R can be finely adjusted. For example, if the length of the trimming groove is increased, the resistance value increases. The trimming groove is formed by making a notch in the metal layer forming the resistor R.

The probe pad, the capacitor pad, the cover pad, the wiring 12, and the resistor R are formed by patterning the above-mentioned conductive material or resistance material in a predetermined shape on the insulating substrate 11. The pattern formation of each element includes, for example, a thin film forming method (for example, photolithography), a metallizing method using a print paste, a method of etching and patterning a metal layer, a method of transferring a patterned metal layer, and the like. Conventionally known methods are used. Among these methods, it is preferable to use, for example, a thin film forming method such as photolithography. This makes it possible to form a finer element pattern.

Further, the surfaces of the probe pad, the capacitor pad, the cover pad, and the wiring 12 are covered with a plating layer.

FIG. 2 shows a cross-sectional configuration of a region where the resistor R is formed in the inspection wiring board 1. FIG. 2 is a diagram showing a cross-sectional configuration of an AA line portion of the inspection wiring board 1 shown in FIG. _The resistor R is formed of a Ta 2N layer 41 formed on the surface 11a of the insulating substrate 11.

Further, the wiring 12 has a laminated structure in which a plurality of layers of conductive materials _are laminated on the Ta 2N layer 41 formed on the surface 11a. Specifically, the wiring 12 has a laminated structure in which a Ti layer 42, a Cu layer 43, a Cu plating layer 44, a Ni plating layer 45, and an Au plating layer 46 are sequentially laminated on a Ta ₂ N layer 41. ing. Although not shown in FIG. 2, the internal configuration of each element such as the probe pad, the capacitor pad, and the cover pad is substantially the same as the internal configuration of the wiring 12.

When forming such a resistor R, wiring 12, or the like, _first , a Ta 2N layer 41, a Ti layer 42, and a Cu layer 43 are sequentially formed by sputtering on the surface 11a of the insulating substrate 11. .. Next, after forming a resist layer (not shown) made of a photosensitive resin _on the Cu layer 43, the Ta 2N layer 41, the Ti layer 42, and the Cu layer 43 have a predetermined shape using photolithography technology. Patterning.

Then, for example, a plating layer is formed so as to cover the Cu layer 43 by using a conventionally known electrolytic plating method or the like. The plating layer may be composed of a single plating layer, or as shown in FIG. 2, a plurality of plating layers (specifically, Cu plating layer 44, Ni plating layer 45, and Au plating layer 46). It may be composed of.

As described above, the resistor R, the wiring 12, and the like are formed on the surface 11a of the inspection wiring board 1. As shown in FIG. 2, the wiring 12 is formed by laminating a plurality of metal layers, whereas the resistor R is formed only by the Ta ₂ N layer 41. With such a configuration, the resistor R can have a high resistance value as compared with other elements included in the wiring 12 and the inspection wiring board 1.

Although not shown in FIG. 2, a resin coat layer may be provided on the surface of the resistor R so as to cover the resistor. The resin coat layer is formed of an insulating resin material such as a polyimide resin. Since the surface of the resistor R is covered with the resin coat layer, it is possible to suppress the oxidation of the resistor R and protect the resistor R. The resin coat layer is formed up to about 100 μm outside the end of the resistor R.

The inspection wiring board 1 according to the present embodiment has a plurality of circuit structures composed of elements such as a probe pad, a capacitor pad, a cover pad, and a resistor R. Each of these elements is connected to each other by wiring 12. As a result, a plurality of inspection probes can be brought into contact with the inspection wiring board 1 at the same time to inspect the electrical characteristics of electronic components such as semiconductor wafers.

(Structure around the resistor)
Subsequently, a more detailed configuration around the resistor R in the inspection wiring board 1 will be described with reference to FIG.

As shown in FIG. 1, two resistors (that is, a first resistor 20R and a second resistor 30R) arranged adjacent to each other are arranged on the surface 11a of the inspection wiring board 1 according to the present embodiment. It is formed. These two resistors are one of the components of the electronic circuit provided on the inspection wiring board 1.

One of these two resistors (ie, the first resistor 20R) is located between the wirings 12a extending along the first direction X (lateral in FIG. 1) and is located in the first direction X. Extends along. The other of these two resistors (ie, the second resistor 30R) is located between the wires 12b arranged substantially parallel to the wires 12a and extends along the first direction X. There is. The first resistor 20R and the second resistor 30R are arranged adjacent to each other in the second direction Y (longitudinal direction in FIG. 1) that intersects (more specifically, orthogonally) the first direction X. Has been done.

The first resistor 20R has a first wide portion 21 and a first narrow width portion 22. The first wide portion 21 has a substantially rectangular shape in a plan view. A trimming groove 25 is formed in the first wide portion 21. Further, the first narrow width portion 22 has a substantially rectangular shape having a width narrower than that of the first wide width portion 21 in a plan view. Here, the width of the first wide portion 21 and the first narrow width portion 22 means the dimension of the first wide width portion 21 and the first narrow width portion 22 in the second direction Y.

The second resistor 30R has a second wide portion 31 and a second narrow width portion 32. The second wide portion 31 has a substantially rectangular shape in a plan view. A trimming groove 35 is formed in the second wide portion 31. Further, the second narrow width portion 32 has a substantially rectangular shape having a width narrower than that of the second wide width portion 31 in a plan view. Here, the width of the second wide portion 31 and the second narrow width portion 32 means the dimension of the second wide width portion 31 and the second narrow width portion 32 in the second direction Y.

In the inspection wiring board 1 according to the present embodiment, the first wide portion 21 of the first resistor 20R and the second wide portion 31 of the second resistor 30R have the same shape and the same dimensions. .. Further, in the inspection wiring board 1 according to the present embodiment, the first narrow width portion 22 of the first resistor 20R and the second narrow width portion 32 of the second resistor 30R have the same shape and the same dimensions. ing.

Then, as shown in FIG. 1, on the surface 11a of the insulating substrate 11, the first wide portion 21 of the first resistor 20R and the second narrow portion 32 of the second resistor 30R are in the second direction Y. The second wide portion 31 of the second resistor 30R and the first narrow width portion 22 of the first resistor 20R are arranged adjacent to each other in the second direction Y. That is, it can be said that the first resistor 20R and the second resistor 30R have the same shape and are arranged in a positional relationship that is point-symmetrical to each other.

By arranging the first resistor 20R and the second resistor 30R in the above-mentioned shape and in the above-mentioned positional relationship, the insulating substrate can be arranged when a plurality of resistors are arranged on the insulating substrate 11. The area occupied for the arrangement of the plurality of resistors on the surface 11a of 11 can be reduced.

Subsequently, the trimming groove provided in each resistor R will be described more specifically.

The trimming groove 25 is a notch formed in the metal layer (for example, Ta 2N layer 41) forming the _first resistor 20R. Further, the trimming groove 35 is a notch formed in the metal layer (for example, Ta 2N layer 41) forming the _second resistor 30R.

By adjusting the notch lengths of the trimming grooves 25 and 35, the resistance values of the first resistor 20R and the second resistor 30R can be finely adjusted. These trimming grooves 25 and 35 are formed by irradiating a metal layer ₍ for example, Ta 2N layer 41) forming a resistor with laser light.

In the inspection wiring board 1 according to the present embodiment, the trimming groove 25 provided in the first wide portion 21 is opposite to the end portion (that is, the end portion 21b) on the side adjacent to the second resistor 30R. A notch is formed from the side end (ie, end 21a). Further, in the inspection wiring board 1 according to the present embodiment, the trimming groove 35 provided in the second wide portion 31 is the end portion (that is, the end portion 31b) on the side adjacent to the first resistor 20R. Is formed from the opposite end (ie, end 31a).

Thus, the notches in the trimming grooves 25 and 35 are adjacent ends (ie, ends) in two adjacent resistors (eg, first resistor 20R and second resistor 30R). It is preferable that the portions 21b and 31b) are formed on the opposite end portion (that is, the end portions 21a and 31a) instead of the portions 21b and 31b).

This prevents the laser beam used for forming the groove from being erroneously irradiated to the other resistor when the trimming groove is formed in one of the two resistors arranged adjacent to each other. be able to. Therefore, it is possible to narrow the distance between the two resistors arranged adjacent to each other (for example, the first resistor 20R and the second resistor 30R). By narrowing the gap between the first resistor 20R and the second resistor 30R, the area of the resin coat layer provided so as to cover these two resistors can also be reduced.

In the inspection wiring board 1 according to the present embodiment, in the first resistor 20R, on the side opposite to the side adjacent to the second resistor 30R (Y2 side in FIG. 1) (Y1 side in FIG. 1), The end portion 21a of the first wide width portion 21 and the end portion 22a of the first narrow width portion 22 are arranged on one straight line.

Further, in the inspection wiring board 1 according to the present embodiment, in the second resistor 30R, the side opposite to the side adjacent to the first resistor 20R (Y1 side in FIG. 1) (Y2 side in FIG. 1). Then, the end portion 31a of the second wide width portion 31 and the end portion 32a of the second narrow width portion 32 are arranged on one straight line.

As described above, both the first resistor 20R and the second resistor 30R are formed by a pattern of a metal layer (for example, Ta 2N layer 41) having a substantially L _- shape when viewed from above. Then, the two substantially L-shaped patterns are arranged in a positional relationship that is point-symmetrical to each other.

As a result, the width of the other resistor is wide in the vacant space created on the side (side in the Y direction in FIG. 1) of the narrow portions 22 and 32 of the first resistor 20R and the second resistor 30R. Overhanging portions of portions 31 and 21 can be arranged. Therefore, two resistors (for example, the first resistor 20R and the second resistor 30R) can be efficiently arranged on the surface 11a of the insulating substrate 11.

The above configuration is more preferably applied to the inspection wiring board 1 in which a large number of resistors R are arranged on the surface 11a. This point will be described with reference to FIG.

FIG. 3 shows the configuration of the inspection wiring board 1 in which more resistors are arranged on the insulating substrate 11. In the example shown in FIG. 3, four resistors R (that is, a first resistor 20R-1, a second resistor 30R-1, a first resistor 20R-2, and a first resistor 20R-2) are formed on the surface 11a of the inspection wiring board 1. The second resistors 30R-2) are arranged side by side substantially in parallel.

Two of the four resistors R on the Y1 side (ie, first resistor 20R-1 and second resistor 30R-1) are on two wires 12a and 12b that are placed closer together. Have been placed. Here, the distance between the two wires 12a and 12b is G1. The shapes and arrangements of the first resistor 20R-1 and the second resistor 30R-1 are the same as those of the first resistor 20R and the second resistor 30R shown in FIG.

Two of the four resistors R on the Y2 side (ie, first resistor 20R-2 and second resistor 30R-2) are on two wires 12c and 12d that are placed closer together. Have been placed. Here, the distance between the two wires 12c and 12d is G1. The shapes and arrangements of the first resistor 20R-2 and the second resistor 30R-2 are the same as those of the first resistor 20R and the second resistor 30R shown in FIG.

Further, the distance G2 between the two wirings (that is, the wiring 12b and the wiring 12c) closer to the center among the four wirings is larger than the distance G1 (G1 <G2).

In the inspection wiring board 1 shown in FIG. 3, each resistor (that is, the second resistor 30R-1 and the second resistor 30R-1 and the second resistor) formed on the wiring 12b and the wiring 12c arranged side by side with a larger interval G2 is spaced apart from each other. Notches in the trimming grooves 35 and 25 are formed from the ends (that is, the ends 31a and 21a) of the wide portion of the resistor 20R-2).

Therefore, when a trimming groove is formed in one of two resistors arranged closer to each other among a large number of resistors, it is possible to prevent the laser beam from being erroneously irradiated to the other resistor. Therefore, two resistors arranged closer to each other (for example, the first resistor 20R-1 and the second resistor 30R-1, or the first resistor 20R-2 and the second resistor 30R-2). It is possible to narrow the distance between each other. As a result, more resistors can be arranged by effectively utilizing the region of the surface 11a of the insulating substrate 11.

Further, in the inspection wiring board 1 shown in FIG. 3, the ends of the resistors on the side where the cuts of the trimming grooves 25 and 35 are formed (that is, the ends 31a and the ends 32a of the second resistor 30R-1). , And the end 21a and the end 22a) of the first resistor 20R-2 are linear. As a result, the distance between the end 31a of the second resistor 30R-1 located so as to face each other and the end 22a of the first resistor 20R-2, and the second resistor 30R- located so as to face each other. A wider area can be secured between the end portion 32a of 1 and the end portion 21a of the first resistor 20R-2.

Therefore, when the laser beam is applied to the end portion 31a of the second resistor 30R-1 or the end portion 21a of the first resistor 20R-2, it is difficult for the laser beam to erroneously hit the resistor located on the opposite side. be able to.

(Summary of the first embodiment)
As described above, the inspection wiring board 1 according to the present embodiment includes the insulating substrate 11 and the first resistor 20R extending along the first direction X on the surface (first surface) 11a of the insulating substrate 11. , A second resistor 30R arranged adjacent to the first resistor 20R is provided in the second direction Y intersecting the first direction X. The first resistor 20R has a first wide portion 21 having a trimming groove 25 and a first narrow width portion 22 having a width narrower than that of the first wide portion 21. The second resistor 30R has a second wide portion 31 having a trimming groove 35 and a second narrow width portion 32 having a width narrower than that of the second wide portion 31.

In the inspection wiring board 1, the first wide portion 21 and the second narrow width portion 32 are arranged adjacent to each other in the second direction Y, and the second wide portion 31 and the first narrow width portion 22 are arranged. Are arranged adjacent to each other in the second direction Y.

According to this configuration, when a plurality of resistors having trimming grooves are arranged on the surface 11a of the insulating substrate 11, they can be formed between the first resistor 20R and the second resistor 30R arranged adjacent to each other. The gap can be reduced. As a result, the occupied area required when arranging a plurality of resistors on the surface 11a of the insulating substrate 11 can be reduced. Further, by providing the trimming groove 25 or 35 in the first wide portion 21 of the first resistor 20R and the second wide portion 31 of the second resistor 30R, a region for forming the trimming groove can be secured.

Therefore, according to the configuration according to the present embodiment, in a wiring board having a plurality of resistors in which trimming grooves are formed, each resistor can be efficiently arranged on the surface 11a of the insulating substrate 11, and the unit is The number of resistors placed per area can be increased.

If the distance between two resistors arranged next to each other is narrowed, when one resistor is irradiated with laser light to form a trimming groove, the other resistor is also erroneously irradiated with laser light. There is a possibility that it will be done. Therefore, in the present embodiment, the notches of the trimming grooves 25 and 35 formed in the first resistor 20R and the second resistor 30R are the end portions on the adjacent sides of the two resistors arranged adjacent to each other. That is, it is preferably formed not at the ends 21b and 31b) but at the opposite end (that is, the ends 21a and 31a).

This prevents the laser beam used for forming the groove from being erroneously irradiated to the other resistor when the trimming groove is formed in one of the two resistors arranged adjacent to each other. be able to. Therefore, the distance between the two resistors arranged adjacent to each other can be further narrowed.

[Second Embodiment]
Subsequently, the inspection wiring board 1 according to the second embodiment will be described with reference to FIG. FIG. 4 shows a configuration on the surface 11a (first surface) of a part of the inspection wiring board 1 according to the second embodiment.

Similar to the first embodiment, the inspection wiring board 1 has an insulating board 11. The surface 11a of the insulating substrate 11 is provided with, for example, a probe pad (not shown), a capacitor pad (not shown), a cover pad (not shown), a resistor R, and the like.

FIG. 4 shows the configuration around the resistor R in the electronic circuit included in the inspection wiring board 1. In the present embodiment, the pattern shape of the metal layer (for example, Ta 2N layer 41) constituting _each resistor R is different from that of the first embodiment. For other configurations, the same configuration as in the first embodiment can be applied. Hereinafter, a configuration different from that of the inspection wiring board 1 according to the first embodiment will be mainly described.

As shown in FIG. 4, two resistors (that is, a first resistor 120R and a second resistor 130R) arranged adjacent to each other are formed on the surface 11a of the inspection wiring board 1. One of these two resistors (ie, the first resistor 120R) is located between the wirings 12a extending along the first direction X (lateral in FIG. 4) and is located in the first direction X. Extends along. The other of these two resistors (ie, the second resistor 130R) is located between the wires 12b arranged substantially parallel to the wires 12a and extends along the first direction X. There is. The first resistor 120R and the second resistor 130R are arranged adjacent to each other in the second direction Y (longitudinal direction in FIG. 1) that intersects (more specifically, orthogonally) the first direction X. Has been done.

The first resistor 120R has a first wide portion 21, a first narrow width portion 22, and a first trapezoidal portion (first inclined portion) 123. The first wide portion 21 has a substantially rectangular shape in a plan view. A trimming groove 25 is formed in the first wide portion 21. Further, the first narrow width portion 22 has a substantially rectangular shape having a width narrower than that of the first wide width portion 21 in a plan view.

The first trapezoidal portion 123 is located between the first wide width portion 21 and the first narrow width portion 22. The first trapezoidal portion 123 has a trapezoidal shape in which the width gradually narrows from the first wide width portion 21 toward the first narrow width portion 22. The first trapezoidal portion 123 has a first inclined end portion 123b.

The second resistor 130R has a second wide portion 31, a second narrow width portion 32, and a second trapezoidal portion (second inclined portion) 133. The second wide portion 31 has a substantially rectangular shape in a plan view. A trimming groove 35 is formed in the second wide portion 31. Further, the second narrow width portion 32 has a substantially rectangular shape having a width narrower than that of the second wide width portion 31 in a plan view.

The second trapezoidal portion 133 is located between the second wide width portion 31 and the second narrow width portion 32. The second trapezoidal portion 133 has a trapezoidal shape in which the width gradually narrows from the second wide width portion 31 toward the second narrow width portion 32. The second trapezoidal portion 133 has a second inclined end portion 133b.

In the inspection wiring board 1 according to the present embodiment, the first wide portion 21 of the first resistor 120R and the second wide portion 31 of the second resistor 130R have the same shape and the same dimensions. .. Further, in the inspection wiring board 1 according to the present embodiment, the first narrow width portion 22 of the first resistor 120R and the second narrow width portion 32 of the second resistor 130R have the same shape and the same dimensions. ing. Further, in the inspection wiring board 1 according to the present embodiment, the first trapezoidal portion 123 of the first resistor 120R and the second trapezoidal portion 133 of the second resistor 130R have the same shape and the same dimensions. ..

Then, as shown in FIG. 4, on the surface 11a of the insulating substrate 11, the first wide portion 21 of the first resistor 120R and the second narrow portion 32 of the second resistor 130R are in the second direction Y. The second wide portion 31 of the second resistor 130R and the first narrow width portion 22 of the first resistor 20R are arranged adjacent to each other in the second direction Y. Further, the first inclined end portion 123b of the first resistor 120R and the second inclined end portion 133b of the second resistor 130R are arranged so as to face each other.

In the inspection wiring board 1 according to the present embodiment, in the first resistor 120R, on the side opposite to the side adjacent to the second resistor 130R (Y2 side in FIG. 4) (Y1 side in FIG. 4), The end portion 21a of the first wide width portion 21, the end portion 123a of the first trapezoidal portion 123, and the end portion 22a of the first narrow width portion 22 are arranged on one straight line.

Further, in the inspection wiring board 1 according to the present embodiment, in the second resistor 130R, the side opposite to the side adjacent to the first resistor 120R (Y1 side in FIG. 4) (Y2 side in FIG. 4). Then, the end portion 31a of the second wide width portion 31, the end portion 133a of the second trapezoidal portion 133, and the end portion 32a of the second narrow width portion 32 are arranged on one straight line.

Further, in the inspection wiring board 1 according to the present embodiment, the trimming groove 25 provided in the first wide portion 21 is the end on the side adjacent to the second resistor 130R, as in the first embodiment. A notch is formed from the end (ie, end 21a) opposite to the portion (ie, end 21b). Further, the trimming groove 35 provided in the second wide portion 31 has an end portion (that is, an end portion 31a) opposite to the end portion (that is, the end portion 31b) on the side adjacent to the first resistor 120R. ), A notch is formed.

As shown in FIG. 4, the trimming grooves 25 and 35 are mainly formed in the wide portion of each resistor. However, depending on the length of the trimming groove, a part (tip portion) thereof may reach the trapezoidal portion (that is, the first trapezoidal portion 123 and the second trapezoidal portion 133).

As described above, in the inspection wiring board 1 according to the present embodiment, the first resistor 120R has the first trapezoidal portion 123 between the first wide width portion 21 and the first narrow width portion 22. There is. Similarly, the second resistor 130R has a second trapezoidal portion 133 between the second wide width portion 31 and the second narrow width portion 32.

According to such a configuration, when the resistor R is formed by a metal layer having the same area (for example, Ta 2N layer 41), the tip portion of _each trimming groove 25 or 35 to the end portion of the resistor R is formed. The distance (for example, the distance L in FIG. 4) can be increased. Therefore, it is possible to reduce the possibility of cracks in the metal layer that may occur from the tip of the trimming groove.

[Third Embodiment]
Subsequently, the inspection wiring board 1 according to the third embodiment will be described with reference to FIG. FIG. 5 shows a configuration on the surface 11a (first surface) of a part of the inspection wiring board 1 according to the third embodiment.

Similar to the first embodiment, the inspection wiring board 1 has an insulating board 11. The surface 11a of the insulating substrate 11 is provided with, for example, a probe pad (not shown), a capacitor pad (not shown), a cover pad 15, a resistor R, and the like.

FIG. 5 shows the configuration around the resistor R in the electronic circuit included in the inspection wiring board 1. The present embodiment is different from the first embodiment in that the cover pad 15 is provided adjacent to the resistor R. For other configurations, the same configuration as in the first embodiment can be applied.

As shown in FIG. 5, two cover pads 15 are provided on the wiring 12a. The cover pad 15 is formed of a laminated structure of the same metal layer as the wiring 12a. The cover pad 15 has a width larger than that of the wiring 12a (that is, the width in the Y direction in FIG. 5). One of the two cover pads 15 is provided between the first narrow width portion 22 of the first resistor 20R and the wiring 12a. Another one of the two cover pads 15 is provided between the first wide portion 21 of the first resistor 20R and the wiring 12a.

Further, two cover pads 15 are provided on the wiring 12b. The cover pad 15 is formed of a laminated structure of the same metal layer as the wiring 12b. The cover pad 15 has a width larger than that of the wiring 12b (that is, the width in the Y direction in FIG. 5). One of the two cover pads 15 is provided between the second narrow width portion 32 of the second resistor 30R and the wiring 12b. Another one of the two cover pads 15 is provided between the second wide portion 31 of the second resistor 30R and the wiring 12b.

The cover pad 15 is used as a place where the inspection pin is brought into contact with the inspection wiring board 1 at the time of continuity inspection before shipment.

In the example shown in FIG. 5, cover pads 15 are provided on both sides of the first resistor 20R extending along the wiring 12a, but in another configuration example, the first resistor extending along the wiring 12a is provided. The cover pad 15 may be provided only on either side of the 20R. Similarly, the cover pad 15 may be provided only on one side of the second resistor 30R extending along the wiring 12b.

[Fourth Embodiment]
Subsequently, the inspection wiring board 1 according to the fourth embodiment will be described with reference to FIG. FIG. 6 shows a configuration on the surface 11a (first surface) of a part of the inspection wiring board 1 according to the fourth embodiment.

Similar to the first embodiment, the inspection wiring board 1 has an insulating board 11. The surface 11a of the insulating substrate 11 is provided with, for example, a probe pad (not shown), a capacitor pad (not shown), a cover pad (not shown), a resistor R, and the like.

FIG. 6 shows the configuration around the resistor R in the electronic circuit included in the inspection wiring board 1. In the present embodiment, the arrangement of the metal layer (for example, Ta ₂ N layer 41) constituting each resistor R is different from that of the first embodiment. For other configurations, the same configuration as in the first embodiment can be applied. Hereinafter, a configuration different from that of the inspection wiring board 1 according to the first embodiment will be mainly described.

As shown in FIG. 6, two resistors (that is, a first resistor 220R and a second resistor 230R) arranged adjacent to each other are formed on the surface 11a of the inspection wiring board 1. One of these two resistors (ie, the first resistor 220R) is located between the wirings 12a extending along the first direction X (lateral in FIG. 6) and is located in the first direction X. Extends along. The other of these two resistors (ie, the second resistor 230R) is located between the wires 12b arranged substantially parallel to the wires 12a and extends along the first direction X. There is.

Similar to the first resistor 20R of the first embodiment, the first resistor 220R has a first wide width portion 21 and a first narrow width portion 22. Further, similarly to the second resistor 30R of the first embodiment, the second resistor 230R has a second wide portion 31 and a second narrow width portion 32.

In the first embodiment, the first wide portion 21 of the first resistor 20R and the second narrow width portion 32 of the second resistor 30R are arranged adjacent to each other in the second direction Y, and the second resistor is formed. The second wide portion 31 of the 30R and the first narrow width portion 22 of the first resistor 20R are arranged adjacent to each other in the second direction Y.

On the other hand, in the present embodiment, the first wide portion 21 of the first resistor 220R and the second narrow width portion 32 of the second resistor 230R are arranged adjacent to each other in the first direction X. That is, the end portion 21c on the X2 side of the first wide portion 21 of the first resistor 220R and the end portion 32c on the X1 side of the second narrow width portion 32 of the second resistor 230R are arranged next to each other. ing.

Further, in the present embodiment, the second wide portion 31 of the second resistor 230R and the first narrow width portion 22 of the first resistor 220R are arranged adjacent to each other in the first direction X. That is, the end 31c on the X1 side of the second wide portion 31 of the second resistor 230R and the end 22c on the X2 side of the first narrow width portion 22 of the first resistor 220R are arranged next to each other. ing.

According to the above configuration, the first wide portion 21 of the first resistor 220R and the second wide portion 31 of the second resistor 230R are prevented from being adjacent to each other in the second direction Y. Two resistors can be efficiently arranged on the surface 11a of the insulating substrate 11. Further, the distance between the two resistors (first resistor 220R and second resistor 230R) arranged adjacent to each other can be narrowed.

It should be considered that the embodiments disclosed this time are exemplary in all respects and not restrictive. The scope of the present invention is shown by the scope of claims rather than the above description, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims. Further, a configuration obtained by combining the configurations of different embodiments described in the present specification with each other is also included in the scope of the present invention.

1: Wiring board for inspection (wiring board)
11: Insulated substrate 11a: Surface (first surface) (of inspection wiring board or insulated substrate)
12: Wiring 15: Cover pad 20R: 1st resistor 21: 1st wide portion 22: 1st narrow width portion 25: Trimming groove 30R: 2nd resistor 31: 2nd wide portion 32: 2nd narrow width Part 35: Trimming groove 120R: First resistor 123: First trapezoidal part (first inclined part)
130R: 2nd resistor 133: 2nd trapezoidal part (2nd inclined part)
220R: 1st resistor 230R: 2nd resistor

Claims (4)

Insulated board and
A first resistor provided on the first surface of the insulating substrate and extending along the first direction on the first surface.
A second resistor extending along the first direction on the first surface and arranged adjacent to the first resistor in a second direction intersecting the first direction. It is a wiring board that is equipped
The first resistor has a first wide portion having a trimming groove and a first narrow width portion narrower than the first wide portion.
The second resistor has a second wide portion having a trimming groove and a second narrow width portion narrower than the second wide portion.
On the first surface, the first wide portion and the second narrow width portion are arranged next to each other, and the second wide width portion and the first narrow width portion are arranged next to each other. , Wiring board. The trimming groove of the first wide portion is formed with a notch from the end on the side opposite to the side adjacent to the second resistor.
The trimming groove of the second wide portion is formed with a notch from the end on the side opposite to the side adjacent to the first resistor.
The wiring board according to claim 1. In the first resistor, on the side opposite to the side adjacent to the second resistor, the end portion of the first wide width portion and the end portion of the first narrow width portion are arranged on one straight line. And
In the second resistor, on the side opposite to the side adjacent to the first resistor, the end portion of the second wide width portion and the end portion of the second narrow width portion are arranged on one straight line. ing,
The wiring board according to claim 1 or 2. The first resistance has a first inclination in which the width gradually narrows from the first wide portion toward the first narrow width portion between the first wide portion and the first narrow width portion. Has more parts,
The second resistance has a second inclination in which the width gradually narrows from the second wide portion toward the second narrow portion between the second wide portion and the second narrow portion. Has more parts,
The wiring board according to any one of claims 1 to 3.

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