JP2022027473A5 - - Google Patents
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- JP2022027473A5 JP2022027473A5 JP2021095076A JP2021095076A JP2022027473A5 JP 2022027473 A5 JP2022027473 A5 JP 2022027473A5 JP 2021095076 A JP2021095076 A JP 2021095076A JP 2021095076 A JP2021095076 A JP 2021095076A JP 2022027473 A5 JP2022027473 A5 JP 2022027473A5
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- 230000011218 segmentation Effects 0.000 claims 16
- 238000000034 method Methods 0.000 claims 12
- 238000010801 machine learning Methods 0.000 claims 10
- 238000005070 sampling Methods 0.000 claims 8
- 230000004044 response Effects 0.000 claims 6
- 239000004065 semiconductor Substances 0.000 claims 6
- 239000013598 vector Substances 0.000 claims 6
- 238000013528 artificial neural network Methods 0.000 claims 4
- 238000007689 inspection Methods 0.000 claims 4
- 230000007547 defect Effects 0.000 claims 3
- 238000003709 image segmentation Methods 0.000 claims 3
- 238000000605 extraction Methods 0.000 claims 2
- 238000010200 validation analysis Methods 0.000 claims 2
- 238000001514 detection method Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/942,677 US11449977B2 (en) | 2020-07-29 | 2020-07-29 | Generating training data usable for examination of a semiconductor specimen |
| US16/942,677 | 2020-07-29 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022027473A JP2022027473A (ja) | 2022-02-10 |
| JP2022027473A5 true JP2022027473A5 (https=) | 2024-06-12 |
| JP7579756B2 JP7579756B2 (ja) | 2024-11-08 |
Family
ID=80003167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021095076A Active JP7579756B2 (ja) | 2020-07-29 | 2021-06-07 | 半導体試料の検査に使用可能な訓練データの生成 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US11449977B2 (https=) |
| JP (1) | JP7579756B2 (https=) |
| KR (1) | KR102745059B1 (https=) |
| CN (2) | CN114092387B (https=) |
| TW (1) | TWI857227B (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11501105B2 (en) * | 2018-03-02 | 2022-11-15 | Zoox, Inc. | Automatic creation and updating of maps |
| US11630958B2 (en) * | 2021-06-02 | 2023-04-18 | Microsoft Technology Licensing, Llc | Determining topic labels for communication transcripts based on a trained generative summarization model |
| US20230011569A1 (en) * | 2021-07-09 | 2023-01-12 | Changxin Memory Technologies, Inc. | Method and apparatus for detecting defect, device, and storage medium |
| US12266174B2 (en) * | 2021-07-12 | 2025-04-01 | Nec Corporation | Few-shot action recognition |
| WO2023097637A1 (zh) * | 2021-12-03 | 2023-06-08 | 宁德时代新能源科技股份有限公司 | 一种用于缺陷检测的方法和系统 |
| US12244936B2 (en) * | 2022-01-26 | 2025-03-04 | Meta Platforms Technologies, Llc | On-sensor image processor utilizing contextual data |
| JP7821013B2 (ja) * | 2022-03-24 | 2026-02-26 | 株式会社Ｓｃｒｅｅｎホールディングス | 検査システム、教師データ生成装置、教師データ生成方法およびプログラム |
| CN115331005B (zh) * | 2022-08-10 | 2025-10-03 | 杭州电子科技大学 | 一种基于深监督融合和特征平滑的指向性物体分割方法 |
| CN117593505A (zh) * | 2022-08-18 | 2024-02-23 | 豪夫迈·罗氏有限公司 | 数字pcr泄漏检测和校正方法及系统 |
| US12489020B2 (en) * | 2022-09-19 | 2025-12-02 | Applied Materials Israel Ltd. | End-to-end measurement for semiconductor specimens |
| TWI836708B (zh) * | 2022-11-08 | 2024-03-21 | 環球晶圓股份有限公司 | 訊號處理的方法及異音檢測系統 |
| US20240177286A1 (en) * | 2022-11-29 | 2024-05-30 | Applied Materials, Inc. | Modeling for indexing and semiconductor defect image retrieval |
| CN117292228A (zh) * | 2023-10-09 | 2023-12-26 | 京东方科技集团股份有限公司 | 一种屏幕缺陷样本的数据增强方法、装置和训练方法 |
| CN117274879A (zh) * | 2023-10-10 | 2023-12-22 | 扬州大自然网络信息有限公司 | 一种工业网络安全智能防御系统及其方法 |
| CN117788589B (zh) * | 2023-12-29 | 2024-08-16 | 深圳市安信达存储技术有限公司 | 半导体芯片的加固封装方法及装置 |
| NL2037113B1 (en) * | 2024-02-23 | 2025-09-04 | Nearfield Instr B V | Method of performing feature detection of image features, scanning probe microscopy system and machine learning model. |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI797699B (zh) * | 2015-12-22 | 2023-04-01 | 以色列商應用材料以色列公司 | 半導體試樣的基於深度學習之檢查的方法及其系統 |
| JP6442746B2 (ja) | 2015-12-24 | 2018-12-26 | キヤノンマーケティングジャパン株式会社 | 情報処理装置、制御方法、プログラム |
| CN106529475A (zh) * | 2016-11-09 | 2017-03-22 | 济南大学 | 一种基于优化手势库分布的dnn群手势识别方法 |
| US10922566B2 (en) * | 2017-05-09 | 2021-02-16 | Affectiva, Inc. | Cognitive state evaluation for vehicle navigation |
| CN110574050A (zh) * | 2017-05-31 | 2019-12-13 | 英特尔公司 | 用于基于四元数的机器学习系统的基于梯度的训练引擎 |
| US11199506B2 (en) * | 2018-02-21 | 2021-12-14 | Applied Materials Israel Ltd. | Generating a training set usable for examination of a semiconductor specimen |
-
2020
- 2020-07-29 US US16/942,677 patent/US11449977B2/en active Active
-
2021
- 2021-05-06 CN CN202110491730.6A patent/CN114092387B/zh active Active
- 2021-05-06 CN CN202410321005.8A patent/CN118196555B/zh active Active
- 2021-05-10 TW TW110116729A patent/TWI857227B/zh active
- 2021-05-13 KR KR1020210061755A patent/KR102745059B1/ko active Active
- 2021-06-07 JP JP2021095076A patent/JP7579756B2/ja active Active
-
2022
- 2022-08-11 US US17/886,191 patent/US11915406B2/en active Active
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