TWI857227B - 生成可用於檢查半導體樣本的訓練資料 - Google Patents

生成可用於檢查半導體樣本的訓練資料 Download PDF

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TWI857227B
TWI857227B TW110116729A TW110116729A TWI857227B TW I857227 B TWI857227 B TW I857227B TW 110116729 A TW110116729 A TW 110116729A TW 110116729 A TW110116729 A TW 110116729A TW I857227 B TWI857227 B TW I857227B
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TW110116729A
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TW202221536A (zh
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馬旦 史坦曼
薛隆 艾卡彥
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以色列商應用材料以色列公司
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    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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    • G06V10/774—Generating sets of training patterns; Bootstrap methods, e.g. bagging or boosting
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    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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TW110116729A 2020-07-29 2021-05-10 生成可用於檢查半導體樣本的訓練資料 TWI857227B (zh)

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Application Number Priority Date Filing Date Title
US16/942,677 US11449977B2 (en) 2020-07-29 2020-07-29 Generating training data usable for examination of a semiconductor specimen
US16/942,677 2020-07-29

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TW202221536A TW202221536A (zh) 2022-06-01
TWI857227B true TWI857227B (zh) 2024-10-01

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US (2) US11449977B2 (https=)
JP (1) JP7579756B2 (https=)
KR (1) KR102745059B1 (https=)
CN (2) CN114092387B (https=)
TW (1) TWI857227B (https=)

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US11630958B2 (en) * 2021-06-02 2023-04-18 Microsoft Technology Licensing, Llc Determining topic labels for communication transcripts based on a trained generative summarization model
US20230011569A1 (en) * 2021-07-09 2023-01-12 Changxin Memory Technologies, Inc. Method and apparatus for detecting defect, device, and storage medium
US12266174B2 (en) * 2021-07-12 2025-04-01 Nec Corporation Few-shot action recognition
WO2023097637A1 (zh) * 2021-12-03 2023-06-08 宁德时代新能源科技股份有限公司 一种用于缺陷检测的方法和系统
US12244936B2 (en) * 2022-01-26 2025-03-04 Meta Platforms Technologies, Llc On-sensor image processor utilizing contextual data
JP7821013B2 (ja) * 2022-03-24 2026-02-26 株式会社Ｓｃｒｅｅｎホールディングス 検査システム、教師データ生成装置、教師データ生成方法およびプログラム
CN115331005B (zh) * 2022-08-10 2025-10-03 杭州电子科技大学 一种基于深监督融合和特征平滑的指向性物体分割方法
CN117593505A (zh) * 2022-08-18 2024-02-23 豪夫迈·罗氏有限公司 数字pcr泄漏检测和校正方法及系统
US12489020B2 (en) * 2022-09-19 2025-12-02 Applied Materials Israel Ltd. End-to-end measurement for semiconductor specimens
TWI836708B (zh) * 2022-11-08 2024-03-21 環球晶圓股份有限公司 訊號處理的方法及異音檢測系統
US20240177286A1 (en) * 2022-11-29 2024-05-30 Applied Materials, Inc. Modeling for indexing and semiconductor defect image retrieval
CN117292228A (zh) * 2023-10-09 2023-12-26 京东方科技集团股份有限公司 一种屏幕缺陷样本的数据增强方法、装置和训练方法
CN117274879A (zh) * 2023-10-10 2023-12-22 扬州大自然网络信息有限公司 一种工业网络安全智能防御系统及其方法
CN117788589B (zh) * 2023-12-29 2024-08-16 深圳市安信达存储技术有限公司 半导体芯片的加固封装方法及装置
NL2037113B1 (en) * 2024-02-23 2025-09-04 Nearfield Instr B V Method of performing feature detection of image features, scanning probe microscopy system and machine learning model.

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CN114092387A (zh) 2022-02-25
CN114092387B (zh) 2024-04-05
JP2022027473A (ja) 2022-02-10
JP7579756B2 (ja) 2024-11-08
CN118196555B (zh) 2024-12-31
US20220036538A1 (en) 2022-02-03
KR102745059B1 (ko) 2024-12-23
TW202221536A (zh) 2022-06-01
US11449977B2 (en) 2022-09-20
CN118196555A (zh) 2024-06-14
US11915406B2 (en) 2024-02-27
US20220383488A1 (en) 2022-12-01
KR20220014805A (ko) 2022-02-07

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