JP2022026676A - Resin composition and method for producing resin composition - Google Patents

Abstract

To provide a resin composition containing a semi-aromatic polyamide and being capable of forming a molded article excellent in impact resistance and toughness.SOLUTION: The resin composition according to the present disclosure contains (A) a semi-aromatic polyamide and (B) a polymer having an epoxy group. The content of the polymer (B) having an epoxy group is 0.1-50 mass% based on the total amount of the resin composition. The semi-aromatic polyamide (A) satisfies one of the following requirements: (1) the amount of amino groups of the semi-aromatic polyamide (A) is 15 mmol/kg or more and 80 mmol/kg or less; and (2) the mass ratio of carboxy groups of the semi-aromatic polyamide (A) to amide bonds determined by infrared spectroscopy is 1.0 or more and 4.0 or less.SELECTED DRAWING: None

Description

The present invention relates to a resin composition and a method for producing the resin composition.

Polyamide resins have excellent mechanical properties, electrical properties, heat resistance, chemical resistance, and the like, and are therefore used in various applications as molding materials for engineering plastics. As the polyamide, an aliphatic polyamide, a semi-aromatic polyamide, and a total aromatic polyamide are known. Further, in order to improve the characteristics of the molding material containing polyamide, it has been studied to add an acid-modified resin such as an acid-modified olefin resin (see, for example, Patent Documents 1 and 2).

Japanese Unexamined Patent Publication No. 2008-179753 International Publication No. 2015/093060

It is desired for the semi-aromatic polyamide resin composition used in the field of automobiles and the like to form a molded product having higher impact resistance and toughness. An object of one aspect of the present invention is to provide a resin composition containing a semi-aromatic polyamide and capable of forming a molded product having excellent impact resistance and toughness, and a method for producing the same.

One aspect of the present invention is a resin composition containing (A) a semi-aromatic polyamide and (B) a polymer having an epoxy group, wherein the content of the polymer having (B) an epoxy group is high. A resin composition is provided which is 0.1 to 50% by mass based on the total amount of the resin composition, and (A) the semi-aromatic polyamide satisfies any one of the following requirements.
(1) (A) The amount of amino groups contained in the semi-aromatic polyamide is 15 mmol / kg or more and 80 mmol / kg or less.
(2) The mass ratio of the carboxy group of the semi-aromatic polyamide (A) to the amide bond, which is determined by infrared spectroscopy, is 1.0 or more and 4.0 or less.

The present invention can provide a resin composition containing a semi-aromatic polyamide and capable of forming a molded product having excellent impact resistance and toughness, and a method for producing the same.

FIG. 1 is an example of the infrared absorption spectrum of polyamide.

Hereinafter, some embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments.

[Resin composition]
The resin composition according to one embodiment includes (A) a semi-aromatic polyamide (hereinafter, sometimes referred to as “(A) component”) and (B) a polymer having an epoxy group (hereinafter, sometimes “(B) component”). The content of the polymer (B) having an epoxy group is 0.1 to 50% by mass based on the total amount of the resin composition. (A) The semi-aromatic polyamide satisfies one of the following requirements.
(1) (A) The amount of amino groups contained in the semi-aromatic polyamide is 15 mmol / kg or more and 80 mmol / kg or less.
(2) The mass ratio of the carboxy group of the semi-aromatic polyamide (A) to the amide bond, which is determined by infrared spectroscopy, is 1.0 or more and 4.0 or less.

The resin composition according to the present embodiment can form a molded body having excellent impact resistance and toughness by containing a component (A) satisfying a specific requirement and a predetermined amount of the component (B). can. The resin composition according to the present embodiment may further contain a polyamide other than the component (A). The polyamide other than the component (A) may be at least one selected from (C) semi-aromatic polyamide and (D) aliphatic polyamide, which are different from (A) semi-aromatic polyamide.

Hereinafter, details of each component constituting the resin composition according to the present embodiment will be described.

((A) component)
The resin composition according to the present embodiment is a semi-aromatic polyamide resin composition containing a semi-aromatic polyamide as a main component.

A general polyamide will be described. Polyamide has a structure based on a condensate of a monomer diamine and a dicarboxylic acid.

Examples of the diamine include 1,4-butanediamine, 1,5-pentanediamine, 2-methyl-1,5-pentanediamine, 1,6-hexanediamine, 1,7-heptanediamine, and 1,8-octane. Diamine, 1,9-nonanediamine, 2-methyl-1,8-octanediamine, 2,2,4-trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, 5-methyl-1,9-nonane -Diamine, 1,10-decanediamine, 1,11-undecanediamine, 2-butyl-2-ethyl-1,5-pentanediamine, 1,12-dodecanediamine, 1,13-tridecanediamine, 1,14 -Adiamine diamines such as tetradecanediamine, 1,16-hexadecanediamine, 1,18-octadecanediamine; 1,3-bis (aminomethyl) cyclohexane, 1,4-bis (aminomethyl) cyclohexane, 1-amino-3 -Aminomethyl-3,5,5-trimethylcyclohexane, bis (4-aminocyclohexyl) methane, bis (3-methyl-4-aminocyclohexyl) methane, 2,2-bis (4-aminocyclohexyl) propane, bis ( Alicyclic diamines such as aminopropyl) piperazine and N- (2-aminoethyl) piperazine; diamines having an aromatic ring such as phenylenediamine, diaminodiphenyl ether, metaxylenediamine and paraxylenediamine can be mentioned.

Examples of the dicarboxylic acid include isophthalic acid, terephthalic acid, 2-chloroterephthalic acid, 2-methylterephthalic acid, 5-methylisophthalic acid, hexahydroterephthalic acid, hexahydroisophthalic acid, naphthalenedicarboxylic acid, 4,4'-. Aromatic dicarboxylic acids such as biphenylenedicarboxylic acid and 2,2-bis (4-carboxyphenyl) methane; and aliphatic dicarboxylic acids such as adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid and dodecanedioic acid can be mentioned. ..

Polyamide further has a structure based on lactams such as ε-caprolactam, ω-laurolactam; or aminocarboxylic acids such as 6-aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, paraaminomethylbenzoic acid. May be good.

The semi-aromatic polyamide has a structure based on a diamine having an aromatic ring or a dicarboxylic acid having an aromatic ring. Examples of the semi-aromatic polyamide include PA6T (polyamide based on 1,6-hexanediamine and terephthalic acid), PA9T (polyamide based on 1,9-nonanediamine and terephthalic acid), and PA10T (1,10-deforce). Polyamides based on diamine and terephthalic acid), PA11T (polyamides based on 1,11-undecanediamine and terephthalic acid), and PA12T (polyamides based on 1,12-dodecanediamine and terephthalic acid).

The resin composition according to the present embodiment contains, as the component (A), a semi-aromatic polyamide that satisfies the requirement of either (1) or (2) above. The component (A) is preferably a semi-aromatic polyamide that satisfies the requirements of (1) and (2).

The amount of amino groups contained in the component (A) is 15 mmol / kg or more and 60 mmol / kg or less, 15 mmol / kg or more and 45 mmol / kg or less, or 20 mmol / kg or more, from the viewpoint of further enhancing the impact resistance and toughness of the molded product. It may be 45 mmol / kg or less. The amount of amino groups can be measured by neutralization titration of polyamide.

The mass ratio of the carboxy group of the component (A) to the amide bond is 1.0 or more and 3.0 or less, 1.0 or more and 2.0 or less, or 1.0 or more and 2.0 or less, from the viewpoint of further enhancing the impact resistance and toughness of the molded product. It may be 1.2 or more and 1.9 or less. The mass ratio of the carboxy group to the amide bond can be calculated from the infrared absorption spectrum of the polyamide by infrared spectroscopy.

(Component (B): Polymer having an epoxy group)
(B) The polymer having an epoxy group is generally a thermoplastic resin, and may be, for example, a copolymer containing a monomer unit derived from a monomer having an epoxy group. Examples of monomers having an epoxy group include α, β-unsaturated carboxylic acid glycidyl ester, and glycidyl ether having an unsaturated group.

The unsaturated carboxylic acid glycidyl ester may be a compound represented by the following formula (1). In formula (1), R ¹ represents an alkenyl group having 2 to 18 carbon atoms which may have one or more substituents. Examples of the compound represented by the formula (1) include glycidyl acrylate, glycidyl methacrylate, and itaconic acid glycidyl ester.

The glycidyl ether having an unsaturated group may be a compound represented by the following formula (2). In formula (2), R ² represents an alkenyl group having 2 to 18 carbon atoms which may have one or more substituents, and X is CH ₂ -O (CH ₂ is bonded to R ² ). ) Or indicates an oxygen atom. Examples of the compound represented by the formula (2) include allyl glycidyl ether, 2-methylallyl glycidyl ether, and styrene-p-glycidyl ether.

The copolymerization monomer copolymerized with the monomer having an epoxy group is, for example, ethylene, α-olefin, styrene, acrylonitrile, unsaturated carboxylic acid ester (ethyl acrylate, methyl methacrylate, butyl acrylate, etc.), acrylic acid. , Unsaturated vinyl ester (vinyl acetate, vinyl propionate, etc.), or a combination thereof.

The polymer having an epoxy group may be an olefin-based copolymer containing a monomer unit having an epoxy group and a monomer unit derived from ethylene or α-olefin (propylene or the like). The proportion of the monomer unit derived from ethylene or α-olefin (the total proportion of the monomer unit derived from ethylene and the monomer unit derived from α-olefin) is based on the mass of the polymer having an epoxy group. It may be 50 to 99.9% by mass.

Polymers with epoxy groups are derived from monomer units having epoxy groups and monomers other than ethylene and α-olefins (eg, styrene, acrylonitrile, unsaturated carboxylic acid esters, acrylic acids, unsaturated vinyl esters, etc.). It may be an olefin-based copolymer containing a monomer unit. The proportion of the monomer unit derived from the monomers other than ethylene and α-olefin may be 50 to 99.9% by mass based on the mass of the polymer having an epoxy group.

Examples of olefin-based copolymers having an epoxy group include ethylene-glycidyl (meth) acrylate copolymers, ethylene-glycidyl (meth) acrylate-methyl (meth) acrylate copolymers, and ethylene-glycidyl (meth) acrylate-. Ethyl (meth) acrylate copolymer, ethylene-glycidyl (meth) acrylate-normal propyl (meth) acrylate copolymer, ethylene-glycidyl (meth) acrylate-isopropyl (meth) acrylate copolymer, ethylene-glycidyl (meth) Acrylate-normal butyl (meth) acrylate copolymer, ethylene-glycidyl (meth) acrylate-isobutyl (meth) acrylate copolymer, ethylene-glycidyl (meth) acrylate-2-ethylhexyl (meth) acrylate copolymer, And ethylene-glycidyl (meth) acrylate-vinyl acetate copolymers. The component (B) preferably contains an ethylene-glycidyl (meth) acrylate copolymer. As an example of a commercially available ethylene-glycidyl (meth) acrylate copolymer, there is "Bond First" (trade name) manufactured by Sumitomo Chemical Co., Ltd.

Other examples of copolymers containing monomer units having an epoxy group include glycidyl methacrylate-styrene copolymers, glycidyl methacrylate-acrylonitrile-styrene copolymers, and glycidyl methacrylate-propylene copolymers. Be done.

The polymer having an epoxy group is a polymer chain composed of polyethylene, polypropylene, polystyrene, ethylene-α-olefin copolymer, or hydrogenated or non-hydrogenated styrene-conjugated diene polymer, and the polymer chain. It may have a graft chain containing a bonded monomer having an epoxy group. The monomer having an epoxy group can be graft-polymerized by, for example, a solution or melt-kneading.

The proportion of the monomer unit having an epoxy group in the polymer having an epoxy group is 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, or 3 based on the mass of the polymer having an epoxy group. It may be mass% or more. The ratio of the monomer unit having an epoxy group may be 30% by mass or less, 20% by mass or less, 15% by mass or less, or 10% by mass or less based on the mass of the polymer having an epoxy group, and may be 6% by mass. May be more. When the proportion of the monomer unit having an epoxy group is high, the hydrolysis resistance of the semi-aromatic polyamide resin composition and the molded product tends to be further improved.

As a method for producing a polymer having an epoxy group, for example, a method of copolymerizing a monomer having an epoxy group with another monomer by a high pressure radical polymerization method, a solution polymerization method, an emulsion polymerization method or the like, ethylene. Examples thereof include a method of graft-polymerizing a monomer having an epoxy group on a system polymer or the like.

The content of the component (B) in the resin composition is 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, or 2% by mass or more from the viewpoint of improving impact resistance. It may be 50% by mass or less, and may be 40% by mass or less, 35% by mass or less, or 30% by mass or less from the viewpoint of improving toughness.

((C) component)
The resin composition according to the present embodiment can further contain a semi-aromatic polyamide different from the component (A) as the component (C) as the polyamide other than the component (A). The amount of the amino group contained in the component (C) may be less than 15 mmol / kg, and the mass ratio of the carboxy group contained in the component (C) to the amide bond may be less than 1.0.

((D) component)
The resin composition according to the present embodiment can further contain an aliphatic polyamide as a component (D) as a polyamide other than the component (A). The component (D) may have a structure based on a condensate of an aliphatic diamine and an aliphatic dicarboxylic acid, or a structure based on lactam. The amount of the amino group contained in the component (D) may be less than 15 mmol / kg, and the mass ratio of the carboxy group contained in the component (D) to the amide bond may exceed 4.0.

The content of the polyamide (at least one polyamide selected from the component (C) and the component (D)) other than the component (A) in the resin composition is 10 to 60% by mass from the viewpoint of further improving the toughness. It may be 15 to 55% by mass, or 20 to 50% by mass.

(Other ingredients)
The resin composition according to one embodiment further contains, in addition to the component (A), the component (B), the component (C) and the component (D), other components within a range not deviating from the gist of the present invention. be able to. Examples of other components include various additives such as heat stabilizers, antioxidants, colorants, mold release agents, softeners, antistatic agents, impact resistance improvers, fillers, lubricants, dyes, and flame retardants. Can be mentioned.

[Manufacturing method of resin composition]
The resin composition according to the present embodiment can be obtained, for example, by a method including melt-kneading each component. The method for producing a resin composition according to an embodiment includes a step (1) of kneading the component (A) and the component (B) to obtain a kneaded product. The method for producing the resin composition may further include a step (2) of further kneading the kneaded product obtained in the step (1) with at least one polyamide selected from the component (C) and the component (D). good.

By using such a production method, a semi-aromatic polyamide resin composition capable of forming a molded product having excellent impact resistance and toughness can be obtained.

In the step (1), a resin composition containing the component (A) and the component (B) can be obtained. The kneading temperature in the step (1) may be, for example, 230 to 350 ° C. In the step (2), a resin composition containing the component (A), the component (B), and the component (C) or the component (D) can be obtained. The kneading temperature in the step (2) may be, for example, 230 to 350 ° C. For kneading of each component, for example, a twin-screw kneading extruder can be used.

The resin composition may be in the form of pellets. The molded body made of the resin composition according to the present embodiment can be produced, for example, by a method including molding a pellet-shaped resin composition into a desired shape by ordinary means such as injection molding. The shape of the molded product is not particularly limited. The molded body can be used, for example, in applications such as electric / electronic equipment, communication equipment, precision machinery, and automobile parts.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

1. 1. Raw Materials The following were prepared as raw materials for preparing the resin composition.
(A) Ingredients-PPA-1: VESTAMID HTplus M1000 (trade name, manufactured by Daisel Ebonic Co., Ltd., PA6T, amino group amount: 43 mmol / kg, mass ratio of carboxy group / amide group: 1.8)
PPA-2: VESTAMID HTplus M3000 (trade name, manufactured by Daicel Ebonic Co., Ltd., PA10T, amino group amount: 23 mmol / kg, mass ratio of carboxy group / amide group: 1.3)
(B) Ingredients-E-GMA-1: Bond First E (trade name, manufactured by Sumitomo Chemical Co., Ltd., a copolymer of 88 parts by mass of ethylene and 12 parts by mass of glycidyl methacrylate)
E-GMA-2: Bond First 7M (trade name, manufactured by Sumitomo Chemical Co., Ltd., a copolymer of 67 parts by mass of ethylene, 6 parts by mass of glycidyl methacrylate and 27 parts by mass of methyl acrylate)
E-GMA-3: Bond First 7L (trade name, manufactured by Sumitomo Chemical Co., Ltd., a copolymer of 70 parts by mass of ethylene, 3 parts by mass of glycidyl methacrylate and 27 parts by mass of methyl acrylate)
E-GMA-4: Bond First 2C (trade name, manufactured by Sumitomo Chemical Co., Ltd., a copolymer of 94 parts by mass of ethylene and 6 parts by mass of glycidyl methacrylate)
(C) Component-PPA-3: XecoT XP300 (trade name, manufactured by Unitica Co., Ltd., PA10T, amino group amount: 13 mmol / kg, mass ratio of carboxy group / amide group: 0.7)
(D) Component-PA: Diamide L1600 (trade name, manufactured by Daicel Ebonic Co., Ltd., PA12, amino group amount: 1 mmol / kg, mass ratio of carboxy group / amide group: 4.8)
(E) Acid-modified polyolefin / acid-modified resin-1: Admar NF518 (trade name, manufactured by Mitsui Chemicals, Inc.)
-Acid-modified resin-2: LOTADER 4210 (trade name, manufactured by Arkema Co., Ltd.)

(Amount of amino group)
1 g of polyamide was dissolved in 45 mL of phenol by heating, and 5 mL of methanol was mixed to prepare a sample solution. The sample solution was titrated using a 0.01N aqueous hydrochloric acid solution using thymol blue as an indicator. The amount of amino groups (μmol / g) contained in the polyamide was measured from the amount of the aqueous hydrochloric acid solution used for the titration.

(Mass ratio of carboxy group / amide bond)
The infrared absorption spectrum of polyamide was measured by infrared spectroscopy using a measuring device "JASCO FT / IR 6200" under the conditions of measurement mode: ATR, prism: germanium, and wavelength range: 600 to 4000 cm ^-1 .

As a baseline correction, a baseline was drawn in the wavelength range of 900 cm ^-1 to 1800 cm ^-1 , and the baseline value at each wavelength was set to 0. Using the maximum absorbance _IA in the wavelength range PA (1690-1700 cm ^-1 ) after the baseline correction process and the maximum absorbance IB in the wavelength range _{P B ( 1600-1690} cm ^-1 ), the carboxy group from the following formula The concentration parameter α _COOH was calculated. FIG. 1 shows an example of the infrared absorption spectrum of polyamide.
α _COOH = 0.43 × _IB × 100 / (1.4 × I _A + 0.43 × _IB )

2. 2. Resin composition (Example 1)
A co-directional twin-screw kneading extruder (KZW20TW, manufactured by Technobel Co., Ltd.) having a main feeder and a sub-feeder and a nozzle head provided on the extruder side was prepared. This twin-screw kneading extruder has nine barrels C1 to C9 provided along the extrusion direction from the hopper side. The temperature of each barrel was set as follows.
C1: 100 ° C
C2: 230 ° C
C3 to C9: 310 ° C
90 parts by mass of PPA-1 was charged from the main feeder and 10 parts by mass of E-GMA-1 was charged from the secondary feeder into the hopper opening provided in the barrel C1 of the twin-screw kneading extruder. The temperature of the nozzle head was set to 310 ° C., the rotation speed of the screw was set to 300 rpm, the discharge rate was set to 5 kg / hour, and PPA-1 and E-GMA-1 were melt-kneaded. The melt-kneaded product discharged from the twin-screw extruder was cut with a pelletizer to obtain a pellet-shaped resin composition.

The pellet-shaped resin composition is injection-molded using an injection molding machine (J150EV-C5, manufactured by Japan Steel Works, Ltd.) under the conditions of a mold temperature of 135 ° C., a cylinder temperature of 310 ° C., and an injection speed of 40 mm / sec. , A molded product having a thickness of 3.2 mm was produced.

(Examples 2 to 4)
Under the same conditions as in Example 1 except that E-GMA-1 was changed to E-GMA-2 and the compounding amount ratio of PPA-1 and E-GMA-2 was changed as shown in Table 1. , Resin composition and molded body were prepared.

(Example 5)
Under the same conditions as in Example 1 except that E-GMA-1 was changed to E-GMA-3 and the compounding amount ratio of PPA-1 and E-GMA-3 was changed as shown in Table 1. , Resin composition and molded body were prepared.

(Example 6)
The temperature of each barrel was set as follows, and the same as in Example 1 except that 90 parts by mass of PPA-2 was charged from the main feeder and 10 parts by mass of E-GMA-2 was charged from the secondary feeder. A pellet-shaped resin composition was prepared under the conditions of.
C1: 100 ° C
C2: 310 ° C
C3 to C9: 320 ° C

A molded product was produced by injection molding a pellet-shaped resin composition under the same conditions as in Example 1 except that the cylinder temperature was changed to 320 ° C.

(Example 7)
The pellet-shaped resin composition obtained in Example 5 and PPA-3 are melt-kneaded under the same conditions as in Example 1 to prepare a pellet-shaped resin composition, and injection-molded to prepare a molded product. did.

(Example 8)
A pellet-shaped resin composition under the same conditions as in Example 1 except that 63 parts by mass of PPA-1 and 27 parts by mass of PA were charged from the main feeder and 10 parts by mass of E-GMA-4 was charged from the secondary feeder. And a molded body was produced.

(Example 9)
A resin composition and a molded product were prepared under the same conditions as in Example 8 except that E-GMA-4 was changed to E-GMA-2.

(Comparative Example 1)
PPA-1 was molded under the same conditions as in Example 1 to prepare a molded product.

(Comparative Example 2)
A resin composition and a molded product were produced under the same conditions as in Example 2 except that E-GMA-1 was changed to acid-modified resin-1.

(Comparative Example 3)
A resin composition and a molded product were prepared under the same conditions as in Example 2 except that E-GMA-1 was changed to the acid-modified resin-2.

(Comparative Example 4)
PPA-2 was molded under the same conditions as in Example 6 to prepare a molded product.

(Comparative Example 5)
PPA-3 was molded under the same conditions as in Example 1 to prepare a molded product.

(Comparative Example 6)
A resin composition and a molded product were produced under the same conditions as in Example 3 except that PPA-1 was changed to PPA-3.

(Comparative Example 7)
A resin composition and a molded product were prepared under the same conditions as in Example 5 except that E-GMA-3 was changed to PA.

3. 3. Evaluation Tables 1 and 2 show the compounding amount ratio (parts by mass) of each resin composition and the evaluation results.

(Izod impact test)
From each molded body, a notched test piece having a length of 63.5 mm, a width of 12.7 mm, and a thickness of 3.2 mm was produced. Using this test piece, the Izod impact strength (kJ / m ² ) was measured by the Izod impact test according to ASTM D-256. The Izod impact test was performed in an atmosphere of 23 ° C.

(Tensile test)
From each molded body, a test piece for a tensile test according to ASTM-D638 Type 1 was prepared. A tensile test using this test piece was carried out in an atmosphere of 23 ° C. at a tensile speed of 50 mm / min, and the breaking elongation (%) and breaking strength (MPa) were measured.

(Chemical resistance test)
From the molded products of Example 4 and Comparative Example 1, a test piece for a tensile test according to ASTM-D638 Type 1 was prepared. The obtained test piece was immersed in an aqueous solution of coolant oil diluted 2-fold with water at 130 ° C. for 5 days. A tensile test was performed on the test piece after immersion, and the elongation at break and the strength at break were measured. The rate of change (%) with respect to the breaking elongation and breaking strength of the test piece before immersion was used as an index of chemical resistance.

Claims (10)

A resin composition containing (A) a semi-aromatic polyamide and (B) a polymer having an epoxy group.
(B) The content of the polymer having an epoxy group is 0.1 to 50% by mass based on the total amount of the resin composition.
(A) A resin composition in which the semi-aromatic polyamide satisfies one of the following requirements.
(1) (A) The amount of amino groups contained in the semi-aromatic polyamide is 15 mmol / kg or more and 80 mmol / kg or less.
(2) The mass ratio of the carboxy group of the semi-aromatic polyamide (A) to the amide bond, which is determined by infrared spectroscopy, is 1.0 or more and 4.0 or less. The resin composition according to claim 1, wherein the amount of the amino group is 15 mmol / kg or more and 60 mmol / kg or less. The resin composition according to claim 1, wherein the amount of the amino group is 15 mmol / kg or more and 45 mmol / kg or less. The resin composition according to any one of claims 1 to 3, wherein the mass ratio of the carboxy group to the amide bond is 1.0 or more and 3.0 or less. The resin composition according to any one of claims 1 to 3, wherein the mass ratio of the carboxy group to the amide bond is 1.0 or more and 2.0 or less. (B) The resin composition according to any one of claims 1 to 5, wherein the content of the polymer having an epoxy group is 0.1 to 30% by mass. The invention according to any one of claims 1 to 6, further comprising (A) at least one polyamide selected from (C) semi-aromatic polyamide and (D) aliphatic polyamide, which is different from semi-aromatic polyamide. Resin composition. The seventh aspect of claim 7, wherein the content of at least one polyamide selected from (C) semi-aromatic polyamide and (D) aliphatic polyamide is 10 to 60% by mass based on the total amount of the resin composition. Resin composition. The method for producing a resin composition according to any one of claims 1 to 8, which comprises a step of kneading (A) a semi-aromatic polyamide and (B) a polymer having an epoxy group to obtain a kneaded product. .. The method for producing a resin composition according to claim 9, further comprising a step of further kneading the kneaded product with at least one polyamide selected from (C) semi-aromatic polyamide and (D) aliphatic polyamide.

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