JP2022020332A - Carrier plate removal method - Google Patents

Abstract

To provide a carrier plate removal method with which a carrier plate can be easily removed from a workpiece.SOLUTION: There is provided a carrier plate removal method for removing a carrier plate from a workpiece provided on a front face of the carrier plate with a temporary adhesive layer therebetween, and the method includes: a step part forming step of processing an outer peripheral part of the carrier plate from the front face on which the workpiece is provided along an outer peripheral edge of the carrier plate to form a step part in which a rear face of the carrier plate laterally projects beyond the front face of the carrier plate; an attachment step of attaching an adhesive tape to a surface of the workpiece exposed on the opposite side of the carrier plate and attaching an outer peripheral part of the adhesive tape to an annular frame; a holding step of, in a state in which the workpiece is located above the carrier plate, holding the workpiece from above with a holding unit with the adhesive tape therebetween; and a carrier plate removal step of applying a downward force to the step part with a push member and moving the carrier plate in a direction separating from the workpiece to remove the carrier plate from the workpiece.SELECTED DRAWING: Figure 3

Description

The present invention relates to a method for removing a carrier plate from a workpiece provided on the surface of the carrier plate via a temporary adhesive layer.

In electronic devices such as mobile phones and personal computers, device chips equipped with devices such as electronic circuits are indispensable components. For device chips, for example, the surface of a wafer made of a semiconductor material such as silicon is divided into a plurality of regions by a planned division line (street), devices are formed in each region, and then the wafer is divided by this planned division line. Obtained by

The device chip obtained by the above method is fixed to, for example, a mother substrate for CSP (Chip Size Package), and after being electrically connected to terminals or the like of the mother substrate by a method such as wire bonding, the device chip is then electrically connected. Sealed with mold resin. By sealing the device chip with the mold resin to form the package device in this way, the device chip can be protected from external factors such as impact, light, heat, and water.

In recent years, a package technology called FOWLP (Fan-Out Wafer Level Package), which forms a package terminal outside the region of the device chip by using a wafer level rewiring technology, has begun to be adopted (see, for example, Patent Document 1). We also propose a packaging technology called FOPLP (Fan-Out Panel Level Package) that collectively manufactures package devices at the level of panels larger than wafers (typically glass substrates used in the manufacture of liquid crystal panels). Has been done.

In FOPLP, for example, a wiring layer (RDL: Redistribution Layer) is formed on the surface of a carrier plate to be a temporary substrate via a temporary adhesive layer, and a device chip is bonded to this wiring layer. Next, the device chip is sealed with a mold resin to obtain a package panel. After that, the package panel is thinned by a method such as grinding, and then the package panel is divided to complete the package device.

Japanese Unexamined Patent Publication No. 2016-201519

In the above-mentioned FOPLP, for example, after the package panel is divided into package devices, the carrier plate is removed from the package devices. Specifically, each package device is picked up from the carrier plate. However, if the size of the package device is small, it is difficult to pick up this package device from the carrier board.

On the other hand, it is also conceivable to peel off and remove the carrier plate from the package panel before dividing the package panel into package devices. However, since the adhesive strength of the temporary adhesive layer is strong to some extent, it is difficult to peel the carrier plate from the package panel without damaging the package panel or the carrier plate.

The present invention has been made in view of such problems, and an object of the present invention is to provide a method for removing a carrier plate which can easily remove a carrier plate from a workpiece such as a package panel. ..

According to one aspect of the present invention, there is a method for removing a carrier plate from a workpiece provided on the surface of the carrier plate via a temporary adhesive layer, wherein the surface on which the workpiece is provided is provided. The outer peripheral portion of the carrier plate is processed from the side along the outer peripheral edge of the carrier plate, and a step portion is formed in which the back surface side of the carrier plate projects laterally as compared with the front surface side of the carrier plate. After performing the step and the step forming step, the adhesive tape is attached to the exposed surface of the workpiece on the opposite side of the carrier plate, and the outer peripheral portion of the adhesive tape is attached to the annular frame. A holding step of holding the work piece from above with a holding unit via the adhesive tape in a state where the work piece is positioned above the carrier plate after carrying out the step and the sticking step, and the holding step. After that, the carrier plate removing step of removing the carrier plate from the work piece by applying a downward force to the step portion with the push member and moving the carrier plate in a direction away from the work piece. A method for removing the carrier plate including the carrier plate is provided.

In one aspect of the present invention described above, the adhesive tape is provided with a through hole through which the push member is passed, and in the carrier plate removing step, the push member inserted into the through hole is used in the step portion. It is preferable to apply a downward force to remove the carrier plate from the workpiece.

Further, in one aspect of the present invention described above, in the carrier plate removing step, after spraying a fluid between the workpiece and the carrier plate, or after spraying the fluid between the workpiece and the carrier plate, the fluid is sprayed. However, it is preferable to apply a downward force to the stepped portion to remove the carrier plate from the workpiece.

Further, in one aspect of the present invention described above, in the carrier plate removing step, it is preferable to apply a downward force to the step portion while the workpiece and the carrier plate are submerged in a liquid. Further, the liquid may contain a surfactant.

Further, in one aspect of the present invention described above, in the carrier plate removing step, the work piece and the carrier plate are submerged in the liquid, and the push member is subjected to vibration while being downwardly directed to the step portion. It is preferable to apply force.

Further, in one aspect of the present invention described above, in the carrier plate removing step, a downward force is applied to the step portion while applying vibration to the liquid in a state where the workpiece and the carrier plate are submerged in the liquid. Is preferable to add.

In the method for removing a carrier plate according to one aspect of the present invention, the outer peripheral portion of the carrier plate is processed from the surface side of the carrier plate provided with the workpiece along the outer peripheral edge of the carrier plate, as compared with the surface side of the carrier plate. The back surface side of the carrier plate forms a stepped portion protruding laterally. Therefore, the carrier plate can be easily removed from the workpiece by applying a downward force to the stepped portion while the workpiece is being held by the holding unit from above.

Further, in the method for removing the carrier plate according to one aspect of the present invention, since the gravity acting on the carrier plate can be used together with the downward force applied to the step portion, the work piece can be used even when the downward force applied to the step portion is small. The carrier plate can be removed from. Further, in the method for removing the carrier plate according to one aspect of the present invention, before removing the carrier plate from the workpiece, an adhesive tape is attached to the workpiece so that the workpiece is held by the annular frame. Therefore, after removing the carrier plate from the workpiece, the workpiece is less likely to warp.

FIG. 1A is a cross-sectional view showing a configuration example of a composite substrate including a carrier plate and a workpiece, and FIG. 1B shows a state in which the carrier plate side of the composite substrate is held in a step portion forming step. It is sectional drawing which shows. FIG. 2A is a cross-sectional view showing how a stepped portion is formed on the carrier plate in the stepped portion forming step, and FIG. 2B shows a stepped portion formed on the entire outer peripheral portion of the carrier plate. It is sectional drawing which shows the state. FIG. 3 is a cross-sectional view showing a state in which the adhesive tape is attached to the workpiece in the attaching step. 4 (A) is a cross-sectional view showing a holding process, FIG. 4 (B) is a cross-sectional view showing a carrier plate removing step, and FIG. 4 (C) shows a carrier plate removed from the workpiece. It is sectional drawing which shows the state. FIG. 5A is a cross-sectional view showing a carrier plate removing step of the first modification, and FIG. 5B is a cross-sectional view showing a carrier plate removing step of the second modification.

An embodiment of the present invention will be described with reference to the accompanying drawings. The method for removing the carrier plate according to the present embodiment is used when removing the carrier plate from a workpiece provided on the surface of the carrier plate via a temporary adhesive layer, and is used in a step portion forming step (FIG. 1 (B), FIG. 2 (A) and 2 (B)), pasting step (see FIG. 3), holding step (see FIG. 4 (A)) and carrier plate removing step (see FIGS. 4 (B) and 4 (C)). )including.

In the step forming step, a cutting blade is cut into the outer peripheral portion of the carrier plate along the outer peripheral edge of the carrier plate from the surface side of the carrier plate provided with the workpiece, and the step portion is formed in the carrier plate. In the sticking step, the adhesive tape is stuck on the exposed surface of the workpiece, and the outer peripheral portion of the adhesive tape is stuck on the annular frame.

In the holding step, the workpiece is positioned above the carrier plate, and the workpiece side is held from above via the adhesive tape. In the carrier plate removing step, the carrier plate is removed from the workpiece by applying a downward force to the stepped portion with the push member to move the carrier plate away from the workpiece. Hereinafter, the method for removing the carrier plate according to the present embodiment will be described in detail.

FIG. 1A is a cross-sectional view showing a configuration example of the composite substrate 1 used in the carrier plate removing method according to the present embodiment. The composite substrate 1 includes a carrier plate 3 made of an insulating material such as soda glass, borosilicate glass, or quartz glass. The carrier plate 3 has, for example, a substantially flat first surface (front surface) 3a and a second surface (back surface) 3b opposite to the first surface 3a, and has a first surface 3a side or a second surface. It is configured in a rectangular shape in a plan view seen from the 3b side. The thickness of the carrier plate 3 is, for example, 2 mm or less, typically 1.1 mm.

In the present embodiment, the carrier plate 3 made of an insulating material such as soda glass, borosilicate glass, and quartz glass is used, but there are no particular restrictions on the material, shape, structure, size, etc. of the carrier plate 3. do not have. For example, a plate or the like made of a material such as a semiconductor, ceramics, resin, or metal can be used as the carrier plate 3. A disk-shaped semiconductor wafer or the like may be used as the carrier plate 3.

A work piece 7 is provided on the first surface 3a side of the carrier plate 3 via a temporary adhesive layer 5. The temporary adhesive layer 5 is formed on substantially the entire surface of the first surface 3a by, for example, laminating a metal film, an insulator film, or the like, and has a function of adhering the carrier plate 3 and the workpiece 7. Further, the temporary adhesive layer 5 may be formed of a resin film or the like that functions as an adhesive.

The thickness of the temporary adhesive layer 5 is, for example, 20 μm or less, typically 5 μm. When the carrier plate 3 is peeled off from the workpiece 7 and removed in the carrier plate removing step described later, the temporary adhesive layer 5 is in close contact with the carrier plate 3 side in the first portion 5a (see FIG. 4C). And the second portion 5b (see FIG. 4C) which is in close contact with the workpiece 7 side.

The work piece 7 is also called, for example, a package panel, a package wafer, or the like, and has a wiring layer (RDL) (not shown) in contact with the temporary adhesive layer 5, a plurality of device chips 9 bonded to the wiring layer, and each device chip. Includes a mold resin layer 11 that seals 9. The work piece 7 is configured, for example, in a plan view having substantially the same size and shape as the carrier plate 3. The thickness of the workpiece 7 is, for example, 1.5 mm or less, typically 0.6 mm.

The first surface (surface) 7a side of the workpiece 7 may be processed by a method such as grinding. Further, a planned division line (scheduled cutting line) is set in the area between the adjacent device chips 9 in the workpiece 7. By cutting the workpiece 7 along an arbitrary scheduled division line, the workpiece 7 is divided into a plurality of workpiece pieces each including one or a plurality of device chips 9.

By cutting the workpiece 7 (or the workpiece piece) along all the planned division lines, a plurality of package devices corresponding to each device chip 9 can be obtained. However, there are no particular restrictions on the material, shape, structure, size, etc. of the workpiece 7. For example, the workpiece 7 is mainly composed of a wiring layer and may not include a device chip 9, a mold resin layer 11, or the like.

In the method for removing the carrier plate according to the present embodiment, first, a step portion forming step of forming a step portion on the outer peripheral portion of the carrier plate 3 constituting the composite substrate 1 described above is performed. Specifically, first, the carrier plate 3 side of the composite substrate 1 is held and the workpiece 7 side is exposed upward. FIG. 1B is a cross-sectional view showing how the carrier plate 3 side of the composite substrate 1 is held in the step portion forming step. In addition, in FIG. 1B, some components are shown by functional blocks.

This step portion forming step is performed using the cutting device 2 shown in FIG. 1 (B) and the like. The cutting device 2 includes a chuck table 4 for holding the composite substrate 1. The chuck table 4 includes, for example, a cylindrical frame 6 made of a metal material typified by stainless steel, and a holding plate 8 made of a porous material and arranged on the upper part of the frame 6.

The upper surface of the holding plate 8 is a holding surface 8a for sucking and holding the carrier plate 3 side of the composite substrate 1. The lower surface side of the holding plate 8 is connected to the suction source 12 via a flow path 6a provided inside the frame body 6, a valve 10, or the like. Therefore, if the valve 10 is opened, the negative pressure of the suction source 12 can be applied to the holding surface 8a.

The chuck table 4 (frame body 6) is connected to a rotation drive source (not shown) such as a motor, and the force generated by this rotation drive source causes the chuck table 4 (frame body 6) to be around a rotation axis substantially perpendicular to the holding surface 8a described above. Rotate to. Further, the chuck table 4 (frame body 6) is supported by a machining feed mechanism (not shown), and moves in a machining feed direction substantially parallel to the holding surface 8a described above.

When holding the carrier plate 3 side of the composite substrate 1 and exposing the workpiece 7 side upward, for example, as shown in FIG. 1B, for example, the second surface 3b of the carrier plate 3 is attached to the chuck table 4. It is brought into contact with the holding surface 8a. Then, the valve 10 is opened to apply the negative pressure of the suction source 12 to the holding surface 8a. As a result, the carrier plate 3 side of the composite substrate 1 is held by the chuck table 4, and the workpiece 7 side is exposed upward.

After holding the carrier plate 3 side of the composite substrate 1 and exposing the workpiece 7 side upward, a step portion is formed along the outer peripheral edge of the carrier plate 3. FIG. 2A is a cross-sectional view showing how the stepped portion 3c is formed on the carrier plate 3 in the stepped portion forming step. In addition, in FIG. 2A, some components are shown by functional blocks.

As shown in FIG. 2A, a cutting unit 14 is arranged above the chuck table 4. The cutting unit 14 includes a spindle 16 that is a rotation axis substantially parallel to the holding surface 8a. An annular cutting blade 18 in which abrasive grains are dispersed in a binder is mounted on one end side of the spindle 16.

A rotary drive source (not shown) such as a motor is connected to the other end side of the spindle 16, and the cutting blade 18 mounted on one end side of the spindle 16 rotates by the force generated by the rotary drive source. The cutting unit 14 is supported by, for example, an elevating mechanism (not shown) and an indexing feed mechanism (not shown), and is supported in a vertical direction substantially perpendicular to the holding surface 8a, and with respect to the vertical direction and the machining feed direction. It moves in the direction of indexing and feeding that is almost vertical.

When forming the stepped portion 3c on the carrier plate 3, first, the chuck table 4 holding the composite substrate 1 is rotated to partially rotate the outer peripheral edge of the carrier plate 3 to be processed (rectangular in a plan view). The part corresponding to one side) should be approximately parallel to the machining feed direction. Next, the chuck table 4 and the cutting unit 14 are relatively moved to position the cutting blade 18 above the extension line of a part of the outer peripheral edge described above.

Further, the lower end of the cutting blade 18 is positioned lower than the first surface 3a of the carrier plate 3 and higher than the second surface 3b. After that, the chuck table 4 is moved in the machining feed direction while rotating the cutting blade 18. As a result, as shown in FIG. 2A, the cutting blade 18 is cut along a part of the outer peripheral edge of the carrier plate 3 from the first surface 3a side, and the carrier plate corresponding to a part of the outer peripheral edge is cut. A part of the outer peripheral portion of 3 can be processed.

Here, the cutting blade 18 is cut to a depth that does not reach the second surface 3b of the carrier plate 3. Therefore, a part of the outer peripheral portion has a stepped shape in which the second surface 3b side protrudes sideways (outward in a direction parallel to the first surface 3a or the second surface 3b) as compared with the first surface 3a side. Step portion 3c is formed.

The width of the overlap between the carrier plate 3 (outer peripheral portion) and the cutting blade 18 (that is, the width of the formed step portion 3c or the amount of protrusion) is within a range that does not affect the package device or the like cut out from the workpiece 7. Set in. For example, when the width of the surplus region (peripheral surplus region) set in the outer peripheral portion of the workpiece 7 is wide, the width of the overlap between the carrier plate 3 (outer peripheral portion) and the cutting blade 18 (width of the step portion 3c). Can be set widely. Considering the ease of removal of the carrier plate 3, the width of the stepped portion 3c is preferably set to, for example, 0.2 mm or more and 5 mm or less.

As described above, the temporary adhesive layer 5 and the workpiece 7 are configured to have substantially the same size and shape as the carrier plate 3 in a plan view. Therefore, when the cutting blade 18 is cut into a part of the outer peripheral portion of the carrier plate 3 from the side of the first surface 3a where the workpiece 7 is provided, the corresponding regions of the temporary adhesive layer 5 and the workpiece 7 are also removed at the same time. Will be done.

After forming the stepped portion 3c on a part of the outer peripheral portion of the carrier plate 3 by the procedure as described above, the stepped portion 3c is also formed on the other portion of the outer peripheral portion of the carrier plate 3 by the same procedure. When the stepped portion 3c is formed on the entire outer peripheral portion of the carrier plate 3, the stepped portion forming step is completed. FIG. 2B is a cross-sectional view showing a state in which a step portion 3c is formed on the entire outer peripheral portion of the carrier plate 3.

In this embodiment, as shown in FIG. 2B, the stepped portion 3c is formed on the entire outer peripheral portion of the carrier plate 3, but the stepped portion 3c is at least arbitrary on the outer peripheral portion of the carrier plate 3. It suffices if it is formed in a part of. When the carrier plate or workpiece is circular (that is, disk-shaped) in a plan view, for example, the carrier plate is rotated by rotating the chuck table 4 while cutting the cutting blade 18 into the outer peripheral portion of the carrier plate. A stepped portion can be formed on the surface.

After the step forming step, the adhesive tape is attached to the exposed first surface 7a of the workpiece 7, and the outer peripheral portion of the adhesive tape is attached to the annular frame. FIG. 3 is a cross-sectional view showing a state in which the adhesive tape 21 is attached to the workpiece 7 in the attaching step. The adhesive tape 21 includes, for example, a base material formed in a circular film shape larger than the workpiece 7 (diagonal line of the first surface 7a), an adhesive layer (glue layer) provided on one surface of the base material, and the like. including.

The base material of the adhesive tape 21 is formed by using a material such as polyolefin, vinyl chloride, or polyethylene terephthalate, and the adhesive layer of the adhesive tape 21 is formed by using, for example, an acrylic material or a rubber material. In the sticking step, for example, the central portion side of the adhesive layer of the adhesive tape 21 is brought into close contact with the first surface 7a of the workpiece 7. As a result, the central portion of the adhesive tape 21 is attached to the first surface 7a of the workpiece 7.

Further, in the sticking step, the outer peripheral side of the adhesive layer of the adhesive tape 21 is brought into close contact with the annular frame 23 made of a metal such as stainless steel (SUS) or aluminum. Here, the annular frame 23 is arranged at a position surrounding the work piece 7 so that the work piece 7 is accommodated in the opening thereof. As a result, the outer peripheral portion of the adhesive tape 21 is attached to the annular frame 23, and the workpiece 7 is in a state of being supported by the annular frame 23 via the adhesive tape 21.

In this attaching step, the adhesive tape 21 may be attached to the work piece 7 and then the adhesive tape 21 may be attached to the frame 23, or the adhesive tape 21 may be attached to the frame 23 and then attached to the work piece 7. Adhesive tape 21 may be attached. Of course, the adhesive tape 21 may be attached to the workpiece 7 and the adhesive tape 21 may be attached to the frame 23 at the same time. Further, in the present embodiment, a through hole 21a that penetrates the adhesive tape 21 in the thickness direction is provided in the region between the portion of the adhesive tape 21 attached to the workpiece 7 and the portion attached to the frame 23. Adhesive tape 21 is used.

After the sticking step, a holding step of holding the workpiece 7 side of the composite substrate 1 from above via the adhesive tape 21 is performed. FIG. 4A is a cross-sectional view showing the holding process. The holding step is performed using the peeling device 22 shown in FIG. 4A and the like. The peeling device 22 includes a holding unit 24 for holding the workpiece 7 side of the composite substrate 1 from above.

At the lower part of the holding unit 24, a holding surface 24a having the same size as the first surface 7a of the workpiece 7 is formed. A suction source (not shown) is connected to the holding surface 24a via a flow path (not shown), a valve (not shown), or the like. Therefore, if the valve is opened, the negative pressure of the suction source can be applied to the holding surface 24a. Further, the holding unit 24 is supported by an elevating mechanism (not shown) and moves in the vertical direction.

In the holding step, as shown in FIG. 4A, for example, with the work piece 7 positioned above the carrier plate 3, the holding surface 24a of the holding unit 24 is attached to the adhesive tape 21 attached to the work piece 7. To contact. That is, the holding surface 24a of the holding unit 24 is brought into contact with the first surface 7a of the workpiece 7 via the adhesive tape 21. Then, the valve is opened to apply the negative pressure of the suction source to the holding surface 24a. As a result, the workpiece 7 side of the composite substrate 1 is held by the holding unit 24 from above via the adhesive tape 21.

After the holding step, a carrier plate removing step of removing the carrier plate 3 from the workpiece 7 is performed. FIG. 4B is a cross-sectional view showing a carrier plate removing step, and FIG. 4C is a cross-sectional view showing a state in which the carrier plate 3 is removed from the workpiece 7. This carrier plate removing step is subsequently performed using the peeling device 22.

As shown in FIG. 4B, on the side of the holding unit 24, a rod shape is formed at a position corresponding to the step portion 3c of the composite substrate 1 held by the holding unit 24 and the through hole 21a of the adhesive tape 21. The push member 26 of the above is arranged. The push member 26 is supported by, for example, an elevating mechanism (not shown) different from the elevating mechanism for moving the holding unit 24, and moves in the vertical direction independently of the holding unit 24.

In the carrier plate removing step, first, both the holding unit 24 and the push member 26 are moved upward to lift the composite substrate 1 held by the holding unit 24. That is, the second surface 3b side of the carrier plate 3 is exposed downward. Next, the push member 26 is moved downward so that the lower end of the push member 26 passes through the through hole 21a while maintaining the position of the holding unit 24, and the lower end of the push member 26 is brought into contact with the step portion 3c. That is, the push member 26 inserted into the through hole 21a applies a downward force to the stepped portion 3c of the carrier plate 3.

As described above, the workpiece 7 side of the composite substrate 1 is held from above by the holding unit 24 via the adhesive tape 21. Therefore, when a downward force is applied to the stepped portion 3c of the carrier plate 3 by the push member 26, the carrier plate 3 is peeled off from the work piece 7 with the temporary adhesive layer 5 as a boundary and falls. That is, the carrier plate 3 moves away from the workpiece 7. When the entire carrier plate 3 is separated from the workpiece 7 and the carrier plate 3 is removed from the workpiece 7, the carrier plate removing step is completed.

As described above, in the method for removing the carrier plate according to the present embodiment, the carrier plate 3 is provided along the outer peripheral edge of the carrier plate 3 from the first surface (surface) 3a side of the carrier plate 3 provided with the workpiece 7. The outer peripheral portion is processed to form a stepped portion 3c in which the second surface (back surface) 3b side of the carrier plate 3 projects laterally as compared with the first surface 3a side of the carrier plate 3. Therefore, the carrier plate 3 can be easily removed from the work piece 7 by applying a downward force to the stepped portion 3c while the work piece 7 is held by the holding unit 24 from above.

Further, since the gravity acting on the carrier plate 3 can be used together with the downward force applied to the step portion 3c, the carrier plate 3 can be removed from the workpiece 7 even when the downward force applied to the step portion 3c is small. Further, before removing the carrier plate 3 from the work piece 7, the adhesive tape 21 is attached to the work piece 7 to keep the work piece 7 held by the annular frame 23, so that the carrier plate is held from the work piece 7. After removing 3, the workpiece 7 becomes less likely to warp.

The present invention is not limited to the description of the above-described embodiment, and can be modified in various ways. For example, the push member 26 of the above-described embodiment is configured to be able to move in the vertical direction independently of the holding unit 24, but if the push member 26 can move at least relative to the holding unit 24. good.

For example, the push member 26 may be moved relative to the holding unit 24 by fixing the push member 26 to a housing (not shown) of the peeling device 22 and moving only the holding unit 24. Further, in the above-described embodiment, one push member 26 is used, but a plurality of push members 26 can also be used.

Further, in the above-described embodiment, the stepped portion 3c is formed by cutting the cutting blade 18 from the workpiece 7 side along the outer peripheral edge of the carrier plate 3, but for example, the carrier plate is formed from the workpiece 7 side. A step portion 3c may be formed by irradiating a laser beam along the outer peripheral edge of 3. In this case, instead of the cutting device 2 (cutting unit 14), a laser processing device (laser processing unit) capable of irradiating a laser beam having a wavelength absorbed by at least the carrier plate 3 is used.

Further, when the carrier plate 3 is removed in the carrier plate removing step, a fluid can be sprayed between the carrier plate 3 and the workpiece 7 (the region corresponding to the temporary adhesive layer 5). FIG. 5A is a cross-sectional view showing a carrier plate removing step of the first modification. As shown in FIG. 5A, a nozzle 32 is arranged on the side of the holding unit 24 of the peeling device 22 used in this first modification. A supply source (not shown) of the fluid 34 is connected to the nozzle 32 via a flow path (not shown), a valve (not shown), or the like.

After spraying the fluid 34 between the carrier plate 3 and the work piece 7 from this nozzle 32, or while spraying the fluid 34 between the carrier plate 3 and the workpiece 7, the push member 26 is used to blow the fluid 34 onto the step portion 3c. By applying a downward force, the carrier plate 3 can be more easily peeled off from the workpiece 7. As the fluid 34 to be sprayed between the carrier plate 3 and the workpiece 7, for example, air, water, or the like can be used. However, there are no particular restrictions on the type of fluid 34 or the like.

Further, when the carrier plate 3 is removed in the carrier plate removing step, the carrier plate 3 and the workpiece 7 may be submerged in a liquid. FIG. 5B is a cross-sectional view showing a carrier plate removing step of the second modification. As shown in FIG. 5B, a tank 42 having a size capable of accommodating the carrier plate 3 and the workpiece 7 is arranged below the holding unit 24 of the peeling device 22 used in the second modification. ing. A liquid 44 such as water is stored in the tank 42.

With the carrier plate 3 and the workpiece 7 submerged in the liquid 44 in the tank 42, a downward force is applied to the stepped portion 3c by the push member 26 to peel the carrier plate 3 from the workpiece 7, and the carrier plate 3 is peeled off from the workpiece 7. The peeled carrier plate 3 falls in the liquid 44. As a result, the impact due to the drop is smaller than when the carrier plate 3 is dropped in the air, and damage to the carrier plate 3 and vibration of the peeling device 22 can be prevented.

The liquid 44 may contain a surfactant. As the surfactant to be contained in the liquid 44, an anionic surfactant, a cationic surfactant, or the like that easily penetrates into the temporary adhesive layer 5 can be used. By including the surfactant that easily penetrates into the temporary adhesive layer 5 in the liquid 44 in this way, the temporary adhesive layer 5 can be easily separated from the region where the surfactant has penetrated, and the work piece 7 to the carrier plate 3 can be easily separated. Can be peeled off more easily.

Further, in the second modification, after the carrier plate 3 and the workpiece 7 are submerged in the liquid 44, when a downward force is applied to the step portion 3c by the push member 26, vibration such as ultrasonic waves is applied to the push member 26. May be given. Specifically, while applying vibration such as ultrasonic waves to the push member 26, a downward force is applied to the step portion 3c by the push member 26. In this case, the carrier plate 3 can be more easily peeled from the workpiece 7 by the action of the vibration transmitted from the push member 26.

Similarly, after the carrier plate 3 and the workpiece 7 are submerged in the liquid 44, vibration such as ultrasonic waves may be applied to the liquid 44 when a downward force is applied to the step portion 3c by the push member 26. Specifically, while applying vibration such as ultrasonic waves to the liquid 44, a downward force is applied to the step portion 3c by the push member 26. In this case, the carrier plate 3 can be more easily peeled from the workpiece 7 by the action of the vibration transmitted from the liquid 44.

Further, the first modification may be further combined with the second modification. That is, after the carrier plate 3 and the work piece 7 are submerged in the liquid 44, the fluid can be sprayed between the carrier plate 3 and the work piece 7 (the region corresponding to the temporary adhesive layer 5). For example, after spraying the fluid 34 between the carrier plate 3 and the workpiece 7, or while spraying the fluid 34 between the carrier plate 3 and the workpiece 7, a downward force is applied to the step portion 3c by the push member 26. By adding the above, the carrier plate 3 can be more easily peeled off from the workpiece 7.

In addition, the structures, methods, and the like according to the above-described embodiments and modifications can be appropriately modified and implemented as long as they do not deviate from the scope of the object of the present invention.

1 Composite substrate 3 Carrier plate 3a First surface (surface)
3b 2nd side (back side)
3c Step 5 Temporary adhesive layer 7 Workpiece 7a First surface (surface)
9 Device chip 11 Mold resin layer 21 Adhesive tape 21a Through hole 23 Frame 2 Cutting device 4 Chuck table 6 Frame body 6a Flow path 8 Holding plate 8a Holding surface 10 Valve 12 Suction source 14 Cutting unit 16 Spindle 18 Cutting blade 22 Peeling device 24 Holding unit 24a Holding surface 26 Push member 32 Nozzle 34 Fluid 42 Tank 44 Liquid

Claims (7)

A method for removing a carrier plate from a workpiece provided on the surface of the carrier plate via a temporary adhesive layer.
The outer peripheral portion of the carrier plate is processed from the front surface side on which the workpiece is provided along the outer peripheral edge of the carrier plate, and the back surface side of the carrier plate protrudes sideways as compared with the front surface side of the carrier plate. The step portion forming process for forming the stepped portion and the step portion forming process
After performing the step portion forming step, an adhesive tape is attached to the surface of the work piece exposed on the opposite side of the carrier plate, and the outer peripheral portion of the adhesive tape is attached to the annular frame.
After performing the pasting step, a holding step of holding the work piece from above with a holding unit via the adhesive tape in a state where the work piece is positioned above the carrier plate,
After performing the holding step, a carrier plate removing step of removing the carrier plate from the workpiece by applying a downward force to the step portion with a push member and moving the carrier plate in a direction away from the workpiece. A method for removing a carrier plate, which comprises. The adhesive tape is provided with a through hole through which the push member is passed.
The carrier according to claim 1, wherein in the carrier plate removing step, the carrier plate is removed from the workpiece by applying a downward force to the stepped portion by the push member inserted into the through hole. How to remove the board. In the carrier plate removing step, a downward force is applied to the step portion after spraying a fluid between the work piece and the carrier plate, or while spraying the fluid between the work piece and the carrier plate. The method for removing a carrier plate according to claim 1 or 2, wherein the carrier plate is removed from the work piece. The method according to any one of claims 1 to 3, wherein in the carrier plate removing step, a downward force is applied to the stepped portion in a state where the workpiece and the carrier plate are submerged in a liquid. How to remove the carrier plate. The method for removing a carrier plate according to claim 4, wherein the liquid contains a surfactant. 4. The carrier plate removing step is characterized in that, in a state where the workpiece and the carrier plate are submerged in the liquid, a downward force is applied to the step portion while applying vibration to the push member. Alternatively, the method for removing the carrier plate according to claim 5. 4. The carrier plate removing step is characterized in that, in a state where the workpiece and the carrier plate are submerged in the liquid, a downward force is applied to the step portion while applying vibration to the liquid. The method for removing a carrier plate according to claim 5.

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