CN113964074A - Method for removing carrier plate - Google Patents

Method for removing carrier plate Download PDF

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Publication number
CN113964074A
CN113964074A CN202110812287.8A CN202110812287A CN113964074A CN 113964074 A CN113964074 A CN 113964074A CN 202110812287 A CN202110812287 A CN 202110812287A CN 113964074 A CN113964074 A CN 113964074A
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CN
China
Prior art keywords
carrier plate
workpiece
step portion
holding
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110812287.8A
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Chinese (zh)
Inventor
木内逸人
大室喜洋
樱井孝寿
堀真一郎
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Disco Corp
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Disco Corp
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Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN113964074A publication Critical patent/CN113964074A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Abstract

The invention provides a method for removing a carrier plate, which can easily remove the carrier plate from a workpiece. A method of removing a carrier plate from a workpiece provided on a front surface of the carrier plate via a temporary bonding layer, the method comprising the steps of: a step portion forming step of forming a step portion in which the outer peripheral portion of the carrier plate is processed along the outer peripheral edge of the carrier plate from the front side on which the workpiece is provided, and the rear side of the carrier plate protrudes laterally beyond the front side of the carrier plate; a sticking step of sticking an adhesive tape to a front surface of the workpiece exposed on a side opposite to the carrier plate, and sticking an outer peripheral portion of the adhesive tape to the annular frame; a holding step of holding the workpiece from above with the holding means via the adhesive tape in a state where the workpiece is positioned above the carrier plate; and a carrier plate removing step of removing the carrier plate from the workpiece by moving the carrier plate in a direction away from the workpiece by applying a downward force to the stepped portion by the pressing member.

Description

Method for removing carrier plate
Technical Field
The invention relates to a method for removing a carrier plate, which removes the carrier plate from a workpiece arranged on the front surface of the carrier plate through a temporary bonding layer.
Background
In electronic devices such as mobile phones and personal computers, device chips each including a device such as an electronic circuit are essential components. The device chip is obtained, for example, as follows: a front surface of a wafer made of a semiconductor material such as silicon is divided into a plurality of regions by planned dividing lines (streets), devices are formed in each region, and the wafer is divided along the planned dividing lines to obtain device chips.
The device Chip obtained by the above-described method is fixed to a mother substrate for CSP (Chip Size Package), for example, and is electrically connected to a terminal or the like of the mother substrate by a method such as wire bonding, and then sealed with a mold resin. In this way, the device chip is sealed with the mold resin to form the packaged device, and the device chip can be protected from external factors such as impact, light, heat, and water.
In recent years, a packaging technique called FOWLP (Fan-Out Wafer Level Package) has been adopted: a package terminal is formed outside the region of the device chip using a re-wiring technique at a wafer level (see, for example, patent document 1). Further, a packaging technique called FOPLP (Fan-Out Panel Level Package) has been proposed as follows: the packaged devices are collectively manufactured at the level of a panel (typically, a glass substrate used in manufacturing a liquid crystal panel) having a size larger than that of a wafer.
In the FOPLP, for example, a wiring Layer (RDL: Redistribution Layer) is formed on the front surface of a carrier plate as a temporary substrate via a temporary adhesive Layer, and a device chip is bonded to the wiring Layer. Next, the device chip is sealed with a mold resin to obtain a package panel. Then, after the package panel is thinned by grinding or the like, the package panel is divided, thereby completing a packaged device.
Patent document 1: japanese patent laid-open publication No. 2016-201519
In the above FOPLP, for example, after the package panel is divided into the packaged devices, the carrier plate is removed from the packaged devices. In particular, the individual packaged devices are picked up from the carrier board. However, when the size of the packaged device is small, it is difficult to pick up the packaged device from the carrier board.
On the other hand, it is also contemplated that the carrier plate is peeled and removed from the package panel before the package panel is divided into packaged devices. However, since the temporary adhesive layer has a strong adhesive force to some extent, it is difficult to peel the carrier plate from the package panel without damaging the package panel and the carrier plate.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a method for removing a carrier plate, which can easily remove the carrier plate from a work such as a package panel.
According to one aspect of the present invention, a method for removing a carrier plate from a workpiece provided on a front side of the carrier plate by means of a temporary adhesive layer is provided, wherein the method for removing the carrier plate comprises the following steps: a step portion forming step of forming a step portion in which the outer peripheral portion of the carrier plate is processed along the outer peripheral edge of the carrier plate from the front surface side on which the workpiece is provided, and the rear surface side of the carrier plate is protruded laterally from the front surface side of the carrier plate; a step of attaching an adhesive tape to the front surface of the workpiece exposed on the side opposite to the carrier plate and attaching an outer peripheral portion of the adhesive tape to an annular frame after the step portion forming step is performed; a holding step of holding the work from above via the adhesive tape by a holding unit in a state where the work is positioned above the carrier plate after the applying step is performed; and a carrier plate removing step of removing the carrier plate from the workpiece by applying a downward force to the step portion by a pressing member to move the carrier plate in a direction away from the workpiece after the holding step is performed.
In the above-described aspect of the present invention, it is preferable that the adhesive tape is provided with a through hole through which the pressing member passes, and in the carrier plate removing step, the carrier plate is removed from the workpiece by applying a downward force to the stepped portion by the pressing member inserted into the through hole.
In the above-described aspect of the present invention, it is preferable that in the carrier plate removing step, the carrier plate is removed from the workpiece by applying a downward force to the step portion after the fluid is blown between the workpiece and the carrier plate, or by applying a downward force to the step portion while the fluid is blown between the workpiece and the carrier plate.
In the above-described aspect of the present invention, it is preferable that, in the carrier plate removing step, a downward force is applied to the step portion in a state where the workpiece and the carrier plate are immersed in a liquid. In addition, a surfactant may be contained in the liquid.
In the above-described aspect of the present invention, it is preferable that, in the carrier plate removing step, a downward force is applied to the step portion while applying vibration to the pressing member in a state where the workpiece and the carrier plate are immersed in the liquid.
In the above-described aspect of the present invention, it is preferable that, in the carrier plate removing step, a downward force is applied to the step portion while applying vibration to the liquid in a state where the workpiece and the carrier plate are immersed in the liquid.
In the method of removing the carrier plate according to the aspect of the present invention, the outer peripheral portion of the carrier plate is processed along the outer peripheral edge of the carrier plate from the front surface side of the carrier plate on which the workpiece is provided, and the step portion is formed so that the back surface side of the carrier plate protrudes laterally from the front surface side of the carrier plate. Thus, the carrier plate can be easily removed from the workpiece by applying a downward force to the step portion in a state where the workpiece is held from above by the holding means.
In the method for removing the carrier plate according to the aspect of the present invention, since the downward force applied to the step portion and the gravity acting on the carrier plate can be utilized, the carrier plate can be removed from the workpiece even when the downward force applied to the step portion is small. In the method of removing the carrier plate according to the aspect of the present invention, the adhesive tape is attached to the workpiece before the carrier plate is removed from the workpiece, and the workpiece is held by the annular frame.
Drawings
Fig. 1 (a) is a cross-sectional view showing a structural example of the composite substrate including the carrier plate and the workpiece, and fig. 1 (B) is a cross-sectional view showing a state where the carrier plate side of the composite substrate is held in the step portion forming step.
Fig. 2 (a) is a cross-sectional view showing a state where a step portion is formed on the carrier plate in the step portion forming step, and fig. 2 (B) is a cross-sectional view showing a state where the step portion is formed on the entire outer peripheral portion of the carrier plate.
Fig. 3 is a cross-sectional view showing a state in which an adhesive tape is attached to a work in an attaching step.
Fig. 4 (a) is a sectional view showing a holding process, fig. 4 (B) is a sectional view showing a carrier plate removing process, and fig. 4 (C) is a sectional view showing a state where the carrier plate is removed from the workpiece.
Fig. 5 (a) is a cross-sectional view showing a carrier plate removing process of modification 1, and fig. 5 (B) is a cross-sectional view showing a carrier plate removing process of modification 2.
Description of the reference symbols
1: a composite substrate; 3: a carrier plate; 3 a: 1 st face (front face); 3 b: the 2 nd surface (back surface); 3 c: a step difference portion; 5: a temporary bonding layer; 7: a workpiece; 7 a: 1 st face (front face); 9: a device chip; 11: a molding resin layer; 21: an adhesive tape; 21 a: a through hole; 23: a frame; 2: a cutting device; 4: a chuck table; 6: a frame body; 6 a: a flow path; 8: a holding plate; 8 a: a holding surface; 10: a valve; 12: an attraction source; 14: a cutting unit; 16: a main shaft; 18: a cutting tool; 22: a peeling device; 24: a holding unit; 24 a: a holding surface; 26: a pushing component; 32: a nozzle; 34: a fluid; 42: a groove; 44: a liquid.
Detailed Description
An embodiment of an aspect of the present invention is explained with reference to the drawings. The method for removing the carrier plate according to the present embodiment is used when removing the carrier plate from the workpiece provided on the front surface of the carrier plate via the temporary bonding layer, and includes a step portion forming step (see fig. 1B, 2 a, and 2B), a bonding step (see fig. 3), a holding step (see fig. 4 a), and a carrier plate removing step (see fig. 4B and 4C).
In the step portion forming step, a cutting tool is cut into an outer peripheral portion of the carrier plate along an outer peripheral edge of the carrier plate from a front surface side of the carrier plate on which the work is set, and a step portion is formed on the carrier plate. In the attaching step, an adhesive tape is attached to the exposed front surface of the workpiece, and the outer peripheral portion of the standing tape is attached to the annular frame.
In the holding step, the workpiece is held from above via the adhesive tape in a state where the workpiece is positioned above the carrier plate. In the carrier plate removing step, the carrier plate is removed from the workpiece by moving the carrier plate in a direction away from the workpiece by applying a downward force to the step portion by the pressing member. The method of removing the carrier plate according to the present embodiment will be described in detail below.
Fig. 1 (a) is a cross-sectional view showing a configuration example of the composite substrate 1 used in the removal method of the carrier plate according to the present embodiment. The composite substrate 1 includes a carrier plate 3 made of an insulator material such as soda-lime glass, borosilicate glass, or quartz glass. The carrier plate 3 has, for example, a substantially flat 1 st surface (front surface) 3a and a 2 nd surface (back surface) 3b on the opposite side of the 1 st surface 3a, and is configured to have a rectangular shape in a plan view viewed from the 1 st surface 3a side or the 2 nd surface 3b side. The thickness of the carrier plate 3 is, for example, 2mm or less, typically 1.1 mm.
In the present embodiment, the carrier plate 3 made of an insulator material such as soda-lime glass, borosilicate glass, or quartz glass is used, but the material, shape, structure, size, and the like of the carrier plate 3 are not particularly limited. For example, a plate made of a material such as a semiconductor, ceramic, resin, or metal may be used as the carrier plate 3. A disc-shaped semiconductor wafer or the like may be used as the carrier plate 3.
A workpiece 7 is provided on the first surface 3a side of the carrier plate 3 via the temporary bonding layer 5. The temporary bonding layer 5 is formed on substantially the entire 1 st surface 3a by, for example, overlapping a metal film, an insulator film, or the like, and has a function of bonding the carrier plate 3 and the workpiece 7. The temporary adhesive layer 5 may be formed of a resin film or the like that functions as an adhesive.
The thickness of the temporary bonding layer 5 is, for example, 20 μm or less, typically 5 μm. When the carrier plate 3 is peeled off from the workpiece 7 and removed in a carrier plate removing step described later, the temporary bonding layer 5 is separated into a 1 st part 5a (see fig. 4C) which is in close contact with the carrier plate 3 and a 2 nd part 5b (see fig. 4C) which is in close contact with the workpiece 7.
The workpiece 7, which is also referred to as a package panel or a package wafer, for example, includes: a wiring layer (RDL) (not shown) in contact with the temporary adhesion layer 5; a plurality of device chips 9 bonded to the wiring layer; and a molding resin layer 11 that seals each device chip 9. The workpiece 7 is formed in substantially the same size and shape as the carrier plate 3 in plan view, for example. The thickness of the work 7 is, for example, 1.5mm or less, typically 0.6 mm.
The 1 st surface (front surface) 7a side of the workpiece 7 may be processed by a method such as grinding. In addition, lines to divide (lines to cut) are set in regions between adjacent device chips 9 in the workpiece 7. The work 7 is cut along an arbitrary line to divide the work 7 into a plurality of pieces each including one or more device chips 9.
When the work 7 (or the work piece) is cut along all the planned dividing lines, a plurality of packaged devices corresponding to the device chips 9 are obtained. However, the material, shape, structure, size, and the like of the workpiece 7 are not particularly limited. For example, the work 7 may be mainly composed of a wiring layer and may not include the device chip 9, the mold resin layer 11, and the like.
In the method of removing the carrier plate according to the present embodiment, first, a step portion forming step is performed to form a step portion on the outer peripheral portion of the carrier plate 3 constituting the composite substrate 1. Specifically, the carrier plate 3 side of the composite substrate 1 is first held so that the workpiece 7 side is exposed upward. Fig. 1 (B) is a cross-sectional view showing a state where the carrier plate 3 side of the composite substrate 1 is held in the step portion forming step. In fig. 1 (B), some of the components are represented by functional blocks.
The step portion forming step is performed using the cutting apparatus 2 shown in fig. 1 (B) and the like. The cutting apparatus 2 has a chuck table 4 for holding the composite substrate 1. The chuck table 4 includes, for example: a cylindrical frame 6 made of a metal material typified by stainless steel; and a holding plate 8 made of a porous material and disposed on the upper portion of the frame 6.
The upper surface of the holding plate 8 serves as a holding surface 8a for suction-holding the carrier plate 3 side of the composite substrate 1. The lower surface side of the holding plate 8 is connected to a suction source 12 via a flow path 6a provided inside the housing 6, a valve 10, and the like. Therefore, when the valve 10 is opened, the negative pressure of the suction source 12 can be applied to the holding surface 8 a.
The chuck table 4 (the frame 6) is connected to a rotation driving source (not shown) such as a motor, and is rotated about a rotation axis substantially perpendicular to the holding surface 8a by a force generated by the rotation driving source. The chuck table 4 (the frame 6) is supported by a machining feed mechanism (not shown) and moves in a machining feed direction substantially parallel to the holding surface 8 a.
When the carrier plate 3 side of the composite substrate 1 is held and the workpiece 7 side is exposed upward, for example, the 2 nd surface 3B of the carrier plate 3 is brought into contact with the holding surface 8a of the chuck table 4 as shown in fig. 1 (B). Then, the valve 10 is opened to apply the negative pressure of the suction source 12 to the holding surface 8 a. Thereby, the carrier plate 3 side of the composite substrate 1 is held by the chuck table 4, and the workpiece 7 side is exposed upward.
After the carrier plate 3 side of the composite substrate 1 is held and the work 7 side is exposed upward, a step portion is formed along the outer peripheral edge of the carrier plate 3. Fig. 2 (a) is a cross-sectional view showing a case where the step portion 3c is formed on the carrier plate 3 in the step portion forming step. In fig. 2 (a), some of the components are represented by functional blocks.
As shown in fig. 2 (a), a cutting unit 14 is disposed above the chuck table 4. The cutting unit 14 has a spindle 16 as a rotation axis substantially parallel to the holding surface 8 a. An annular cutting tool 18 in which abrasive grains are dispersed in a binder is attached to one end side of the spindle 16.
A rotary drive source (not shown) such as a motor is connected to the other end side of the spindle 16, and the cutting tool 18 attached to one end side of the spindle 16 is rotated by a force generated by the rotary drive source. The cutting unit 14 is supported by, for example, an elevating mechanism (not shown) and an indexing mechanism (not shown), and moves in a vertical direction substantially perpendicular to the holding surface 8a and an indexing direction substantially perpendicular to the vertical direction and the machining feed direction.
When the step portion 3c is formed on the carrier plate 3, first, the chuck table 4 holding the composite substrate 1 is rotated so that a part of the outer peripheral edge of the carrier plate 3 to be processed (a part corresponding to one side of a rectangle in a plan view) is substantially parallel to the processing feed direction. Next, the chuck table 4 and the cutting unit 14 are relatively moved to position the cutting tool 18 above an extension of a part of the outer peripheral edge.
The lower end of the cutting insert 18 is positioned lower than the 1 st surface 3a and higher than the 2 nd surface 3b of the carrier plate 3. Then, the chuck table 4 is moved in the machining feed direction while rotating the cutting tool 18. As a result, as shown in fig. 2 (a), the cutting tool 18 can be cut along a part of the outer peripheral edge of the carrier plate 3 from the 1 st surface 3a side, and a part of the outer peripheral portion of the carrier plate 3 corresponding to the part of the outer peripheral edge can be removed.
Here, the cutting tool 18 is cut into the carrier plate 3 to a depth not reaching the 2 nd surface 3 b. Therefore, a stepped step portion 3c is formed in a part of the outer peripheral portion so as to protrude laterally (outward in a direction parallel to the 1 st surface 3a or the 2 nd surface 3 b) from the 2 nd surface 3b side than the 1 st surface 3 a.
The width of the carrier plate 3 (outer peripheral portion) overlapping the cutting blade 18 (i.e., the width or the amount of projection of the step portion 3c formed) is set within a range that does not affect the packaged devices or the like cut out from the workpiece 7. For example, when the width of the extra region (outer peripheral extra region) set in the outer peripheral portion of the workpiece 7 is wide, the width (the width of the stepped portion 3 c) at which the carrier plate 3 (outer peripheral portion) and the cutting tool 18 overlap can be set wide. In consideration of the ease of removal of the carrier plate 3, the width of the step portion 3c is preferably set to 0.2mm or more and 5mm or less, for example.
As described above, the temporary bonding layer 5 and the work 7 are configured to have substantially the same size and shape as the carrier plate 3 in a plan view. Therefore, when the cutting tool 18 is cut into a part of the outer peripheral portion of the carrier plate 3 from the 1 st surface 3a side where the work 7 is provided, the temporary bonding layer 5 and the corresponding region of the work 7 are also removed at the same time.
After the step 3c is formed in a part of the outer peripheral portion of the carrier plate 3 in the above-described procedure, the step 3c is formed in the same procedure in the other part of the outer peripheral portion of the carrier plate 3. When the step portion 3c is formed on the entire outer peripheral portion of the carrier plate 3, the step portion forming step is completed. Fig. 2 (B) is a cross-sectional view showing a state in which a step portion 3c is formed on the entire outer peripheral portion of the carrier plate 3.
In the present embodiment, as shown in fig. 2 (B), the step portion 3c is formed on the entire outer peripheral portion of the carrier plate 3, but the step portion 3c may be formed at least on any part of the outer peripheral portion of the carrier plate 3. In the case where the carrier plate or the workpiece has a circular shape (i.e., a disk shape) in a plan view, for example, the step portion can be formed on the carrier plate by rotating the chuck table 4 while cutting the cutting tool 18 into the outer peripheral portion of the carrier plate.
After the step portion forming step, a bonding step is performed in which an adhesive tape is bonded to the exposed 1 st surface 7a of the workpiece 7, and the outer peripheral portion of the adhesive tape is bonded to the annular frame. Fig. 3 is a cross-sectional view showing a state where the adhesive tape 21 is attached to the work 7 in the attaching step. The adhesive tape 21 includes, for example: a base material configured in a circular film shape larger than the work 7 (diagonal line of the 1 st surface 7 a); and an adhesive layer (paste layer) provided on one surface of the base material.
The base material of the adhesive tape 21 is formed of a material such as polyolefin, vinyl chloride, or polyethylene terephthalate, for example, and the adhesive layer of the adhesive tape 21 is formed of an acrylic or rubber material, for example. In the sticking step, for example, the center portion side of the adhesive layer of the adhesive tape 21 is brought into close contact with the 1 st surface 7a of the workpiece 7. Thereby, the central portion of the adhesive tape 21 is stuck to the 1 st surface 7a of the workpiece 7. In the sticking step, the outer peripheral side of the adhesive layer of the adhesive tape 21 is brought into close contact with an annular frame 23 made of metal such as stainless steel (SUS) or aluminum. Here, the ring-shaped frame 23 is disposed at a position surrounding the workpiece 7 so as to accommodate the workpiece 7 in the opening portion. Thereby, the outer peripheral portion of the adhesive tape 21 is adhered to the annular frame 23, and the workpiece 7 is supported by the annular frame 23 via the adhesive tape 21.
In this attaching step, the adhesive tape 21 may be attached to the frame 23 after the adhesive tape 21 is attached to the workpiece 7, or the adhesive tape 21 may be attached to the workpiece 7 after the adhesive tape 21 is attached to the frame 23. Of course, the adhesive tape 21 may be attached to the workpiece 7 and the adhesive tape 21 may be attached to the frame 23 at the same time. In the present embodiment, the adhesive tape 21 provided with the through hole 21a is used, and the through hole 21a penetrating the adhesive tape 21 in the thickness direction is provided in the region between the portion of the adhesive tape 21 attached to the workpiece 7 and the portion attached to the frame 23.
After the bonding step, a holding step of holding the workpiece 7 side of the composite substrate 1 from above via the adhesive tape 21 is performed. Fig. 4 (a) is a cross-sectional view showing the holding step. The holding step is performed using the peeling device 22 shown in fig. 4 (a) and the like. The peeling device 22 has a holding unit 24 for holding the workpiece 7 side of the composite substrate 1 from above.
A holding surface 24a is formed at a lower portion of the holding unit 24, and the holding surface 24a has substantially the same size as the 1 st surface 7a of the workpiece 7. The holding surface 24a is connected to a suction source (not shown) via a flow path (not shown), a valve (not shown), and the like. Therefore, when the valve is opened, the negative pressure of the suction source can be applied to the holding surface 24 a. The holding unit 24 is supported by an elevating mechanism (not shown) and moves in the vertical direction.
In the holding step, as shown in fig. 4 (a), for example, the holding surface 24a of the holding unit 24 is brought into contact with the adhesive tape 21 attached to the workpiece 7 in a state where the workpiece 7 is positioned above the carrier plate 3. That is, the holding surface 24a of the holding unit 24 is brought into contact with the 1 st surface 7a of the workpiece 7 via the adhesive tape 21. Then, the valve is opened to apply the negative pressure of the suction source to the holding surface 24 a. Thus, the workpiece 7 side of the composite substrate 1 is held from above by the holding means 24 via the adhesive tape 21.
After the holding step, a carrier plate removing step of removing the carrier plate 3 from the workpiece 7 is performed. Fig. 4 (B) is a cross-sectional view showing the carrier plate removing process, and fig. 4 (C) is a cross-sectional view showing a state where the carrier plate 3 is removed from the workpiece 7. The carrier plate removal process continues with the use of the peeling device 22.
As shown in fig. 4 (B), a rod-shaped pressing member 26 is disposed on a side of the holding means 24 at a position corresponding to the stepped portion 3c of the composite substrate 1 held by the holding means 24 and the through hole 21a of the adhesive tape 21. The pressing member 26 is supported by, for example, a lifting mechanism (not shown) different from the lifting mechanism that moves the holding unit 24, and moves in the vertical direction independently of the holding unit 24.
In the carrier plate removing step, first, both the holding unit 24 and the pressing member 26 are moved upward to lift the composite substrate 1 held by the holding unit 24. That is, the second surface 3b of the carrier plate 3 is exposed downward. Next, with the position of the holding unit 24 held, the pressing member 26 is moved downward so that the lower end of the pressing member 26 passes through the through hole 21a, and the lower end of the pressing member 26 is brought into contact with the stepped portion 3 c. That is, the pressing member 26 inserted into the through hole 21a applies a downward force to the stepped portion 3c of the carrier plate 3.
As described above, the composite substrate 1 is held from above by the holding means 24 via the adhesive tape 21 on the workpiece 7 side. Therefore, when the pressing member 26 applies a downward force to the step portion 3c of the carrier plate 3, the carrier plate 3 is peeled from the workpiece 7 and falls with the temporary bonding layer 5 as a boundary. I.e. the carrier plate 3 is moved away from the workpiece 7. When the entire carrier plate 3 is separated from the workpiece 7 and the carrier plate 3 is removed from the workpiece 7, the carrier plate removal process is ended.
As described above, in the method of removing the carrier plate according to the present embodiment, the outer peripheral portion of the carrier plate 3 is processed along the outer peripheral edge of the carrier plate 3 from the 1 st surface (front surface) 3a side of the carrier plate 3 on which the workpiece 7 is provided, and the step portion 3c protruding laterally from the 2 nd surface (rear surface) 3b side of the carrier plate 3 is formed. Thus, in a state where the workpiece 7 is held from above by the holding means 24, the carrier plate 3 can be easily removed from the workpiece 7 by applying a downward force to the step portion 3 c.
Further, since the downward force applied to the step portion 3c and the gravity acting on the carrier plate 3 can be utilized, even when the downward force applied to the step portion 3c is small, the carrier plate 3 can be removed from the workpiece 7. Further, since the adhesive tape 21 is attached to the workpiece 7 before the carrier plate 3 is removed from the workpiece 7, and the workpiece 7 is held by the annular frame 23, the workpiece 7 is less likely to warp after the carrier plate 3 is removed from the workpiece 7.
The present invention is not limited to the above-described embodiments, and can be implemented by various modifications. For example, although the pressing member 26 of the above-described embodiment is configured to be movable in the vertical direction independently of the holding unit 24, the pressing member 26 may be movable at least relative to the holding unit 24.
For example, the pressing member 26 may be fixed to a housing (not shown) of the peeling device 22, and the pressing member 26 may be moved relative to the holding unit 24 by moving only the holding unit 24. In the above embodiment, 1 pressing member 26 is used, but a plurality of pressing members 26 may be used.
In the above-described embodiment, the stepped portion 3c is formed by cutting the cutting tool 18 along the outer peripheral edge of the carrier plate 3 from the workpiece 7 side, but the stepped portion 3c may be formed by irradiating a laser beam along the outer peripheral edge of the carrier plate 3 from the workpiece 7 side, for example. In this case, a laser processing apparatus (laser processing means) capable of irradiating at least a laser beam having a wavelength absorbed by the carrier plate 3 is used instead of the cutting apparatus 2 (cutting means 14).
In addition, when the carrier plate 3 is removed in the carrier plate removing step, it is also possible to blow a fluid between the carrier plate 3 and the workpiece 7 (a region corresponding to the temporary bonding layer 5). Fig. 5 (a) is a cross-sectional view showing a carrier plate removing step of modification 1. As shown in fig. 5 (a), a nozzle 32 is disposed on a side of the holding unit 24 of the peeling apparatus 22 used in the modification 1. The nozzle 32 is connected to a supply source (not shown) of the fluid 34 via a flow path (not shown), a valve (not shown), and the like.
After the fluid 34 is blown between the carrier plate 3 and the workpiece 7 from the nozzle 32, the step portion 3c is applied with a downward force by the pressing member 26, or the step portion 3c is applied with a downward force by the pressing member 26 while the fluid 34 is blown between the carrier plate 3 and the workpiece 7, whereby the carrier plate 3 can be more easily peeled from the workpiece 7. As the fluid 34 to be blown between the carrier plate 3 and the workpiece 7, for example, air, water, or the like can be used. However, the kind of the fluid 34 and the like are not particularly limited.
When the carrier plate 3 is removed in the carrier plate removing step, the carrier plate 3 and the workpiece 7 may be immersed in a liquid. Fig. 5 (B) is a cross-sectional view showing the carrier plate removing step of modification 2. As shown in fig. 5 (B), a groove 42 having a size capable of accommodating the carrier plate 3 and the workpiece 7 is disposed below the holding unit 24 of the peeling apparatus 22 used in the modification 2. A liquid 44 such as water is accumulated in the groove 42.
When the carrier plate 3 is peeled off from the workpiece 7 by applying a downward force to the stepped portion 3c by the pressing member 26 in a state where the carrier plate 3 and the workpiece 7 are immersed in the liquid 44 in the bath 42, the carrier plate 3 peeled off from the workpiece 7 falls in the liquid 44. As a result, compared with the case where the carrier plate 3 is dropped in the air, the impact accompanying the dropping is reduced, and damage to the carrier plate 3, vibration of the peeling device 22, and the like can be prevented.
The liquid 44 may contain a surfactant. As the surfactant contained in the liquid 44, an anionic surfactant, a cationic surfactant, or the like that easily intrudes into the temporary adhesive layer 5 can be used. In this way, by including the surfactant that easily intrudes into the temporary bonding layer 5 in the liquid 44, the temporary bonding layer 5 is easily separated from the region where the surfactant intrudes, and the carrier plate 3 can be more easily peeled from the work 7.
In the modification 2, after the carrier plate 3 and the workpiece 7 are immersed in the liquid 44, when a downward force is applied to the stepped portion 3c by the pressing member 26, vibration such as ultrasonic waves may be applied to the pressing member 26. Specifically, while applying vibration such as ultrasonic waves to the pressing member 26, a downward force is applied to the stepped portion 3c by the pressing member 26. In this case, the carrier plate 3 can be more easily peeled from the workpiece 7 by the action of the vibration transmitted from the pressing member 26.
Similarly, after the carrier plate 3 and the workpiece 7 are immersed in the liquid 44, when a downward force is applied to the stepped portion 3c by the pressing member 26, vibration such as ultrasonic waves may be applied to the liquid 44. Specifically, the stepped portion 3c is urged downward by the pressing member 26 while applying vibration such as ultrasonic waves to the liquid 44. In this case, the carrier plate 3 can be more easily peeled off from the workpiece 7 by the action of the vibration transmitted from the liquid 44.
Further, modification 2 may be combined with modification 1. That is, after the carrier plate 3 and the workpiece 7 are immersed in the liquid 44, the fluid can be blown between the carrier plate 3 and the workpiece 7 (the region corresponding to the temporary bonding layer 5). For example, the carrier plate 3 can be more easily peeled from the workpiece 7 by applying a downward force to the step portion 3c by the pressing member 26 after the fluid 34 is blown between the carrier plate 3 and the workpiece 7, or by applying a downward force to the step portion 3c by the pressing member 26 while the fluid 34 is blown between the carrier plate 3 and the workpiece 7.
The configurations, methods, and the like according to the above-described embodiments and modifications can be appropriately modified and implemented without departing from the scope of the object of the present invention.

Claims (7)

1. A method of removing a carrier plate from a workpiece arranged on a front side of the carrier plate by means of a temporary adhesive layer, characterized in that,
the method for removing the carrier plate comprises the following steps:
a step portion forming step of forming a step portion in which the outer peripheral portion of the carrier plate is processed along the outer peripheral edge of the carrier plate from the front surface side on which the workpiece is provided, and the rear surface side of the carrier plate is protruded laterally from the front surface side of the carrier plate;
a step of attaching an adhesive tape to the front surface of the workpiece exposed on the side opposite to the carrier plate and attaching an outer peripheral portion of the adhesive tape to an annular frame after the step portion forming step is performed;
a holding step of holding the work from above via the adhesive tape by a holding unit in a state where the work is positioned above the carrier plate after the applying step is performed; and
and a carrier plate removing step of removing the carrier plate from the workpiece by applying a downward force to the step portion by a pressing member and moving the carrier plate in a direction away from the workpiece after the holding step is performed.
2. The method of removing a carrier plate according to claim 1,
the adhesive tape is provided with a through hole for the pushing component to pass through,
in the carrier plate removing step, the carrier plate is removed from the workpiece by applying a downward force to the step portion by the pressing member inserted into the through hole.
3. Method of removing a carrier plate according to claim 1 or 2,
in the carrier plate removing step, the carrier plate is removed from the workpiece by applying a downward force to the step portion after blowing the fluid between the workpiece and the carrier plate, or by applying a downward force to the step portion while blowing the fluid between the workpiece and the carrier plate.
4. Method of removing a carrier plate according to any of claims 1 to 3,
in the carrier plate removing step, a downward force is applied to the step portion in a state where the workpiece and the carrier plate are immersed in a liquid.
5. The method of removing a carrier plate according to claim 4,
the liquid is caused to contain a surfactant.
6. Method of removing a carrier plate according to claim 4 or 5,
in the carrier plate removing step, a downward force is applied to the step portion while applying vibration to the pressing member in a state where the workpiece and the carrier plate are immersed in the liquid.
7. Method of removing a carrier plate according to claim 4 or 5,
in the carrier plate removing step, a downward force is applied to the step portion while applying vibration to the liquid in a state where the workpiece and the carrier plate are immersed in the liquid.
CN202110812287.8A 2020-07-20 2021-07-19 Method for removing carrier plate Pending CN113964074A (en)

Applications Claiming Priority (2)

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JP2020-123764 2020-07-20
JP2020123764A JP2022020332A (en) 2020-07-20 2020-07-20 Carrier plate removal method

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