JP2022019634A - Members for manufacturing vapor chamber, vapor chamber, and vapor chamber manufacturing method - Google Patents

Abstract

To provide members for manufacturing a vapor chamber, which are superior in flexibility and have a specially excellent heat transfer ability, and to provide a vapor chamber superior in flexibility and having a specifically excellent heat transfer ability, and a manufacturing method thereof.SOLUTION: Members for manufacturing a vapor chamber of the present invention are members used in manufacturing a vapor chamber and are characterized to include a fiber base material made of fibers and resin materials in a non-hardened state impregnated with the fiber base material. A thickness of the fiber base material is preferably 10 μm or more and 1,000 μm or less.SELECTED DRAWING: None

Description

The present invention relates to a member for manufacturing a vapor chamber, a vapor chamber, and a method for manufacturing the vapor chamber.

For example, heat generating members such as central processing units (CPUs), light emitting diodes (LEDs), and power semiconductors used in mobile terminals such as mobile terminals and tablet terminals are cooled by heat pipes (for example, Patent Document 1). reference).

In recent years, in order to make mobile terminals thinner, the development of vapor chambers that can be made thinner than heat pipes has been promoted.

A hydraulic fluid is sealed in the vapor chamber, and the hydraulic fluid absorbs the heat of the heat generating member and transfers the heat to cool the heat generating member.

More specifically, the working liquid in the vapor chamber receives heat from the heat generating member at a portion close to the heat generating member (evaporation part) and evaporates to become steam, and then the steam is moved to a position away from the evaporating part. It moves, cools, condenses and becomes liquid.

A liquid flow path portion as a capillary structure (wick) is provided in the vapor chamber, and the liquefied hydraulic fluid is transported to the evaporation section through this liquid flow path portion and evaporates again. It receives heat in the part and evaporates.

In this way, the hydraulic fluid transfers the heat of the device by circulating in the vapor chamber while repeating the phase change, that is, evaporation and condensation, and the heat dissipation efficiency is improved.

However, the conventional vapor chamber lacks flexibility (flexibility), and depending on the shape of the heat generating member or the like, it may not be possible to sufficiently improve the adhesion to the heat generating member. Further, in the vapor chamber, further improvement of the heat transport capacity is required.

Japanese Unexamined Patent Publication No. 2016-205693

An object of the present invention is to provide a member for manufacturing a vapor chamber which is excellent in flexibility (flexibility) and can be suitably used for manufacturing a vapor chamber having particularly excellent heat transporting ability, and also, flexibility ( It is an object of the present invention to provide a vapor chamber having excellent flexibility) and particularly excellent heat transport capacity, and a method for manufacturing the same.

Such an object is achieved by the present invention of the following (1) to (12).
(1) A member for manufacturing a vapor chamber used for manufacturing a vapor chamber.
A member for manufacturing a vapor chamber, which comprises a fiber and an uncured resin material.

(2) A member for manufacturing a vapor chamber used for manufacturing a vapor chamber.
A member for manufacturing a vapor chamber, which comprises a fiber base material composed of fibers and an uncured resin material invading the fiber base material.

(3) The member for manufacturing a vapor chamber according to (2) above, wherein the thickness of the fiber base material is 10 μm or more and 1000 μm or less.

(4) The member for manufacturing a vapor chamber according to (2) or (3) above, wherein the thickness of the member for manufacturing a vapor chamber is 10 μm or more and 2000 μm or less.

(5) The member for manufacturing a vapor chamber according to any one of (1) to (4) above, wherein the fiber is composed of an aromatic resin containing a heterocycle in the molecule.

(6) When the content of the fiber in the vapor chamber manufacturing member is Xf [mass%] and the content of the resin material is Xr [mass%], 0.01 ≦ Xf / Xr ≦ 8.0. The member for manufacturing a vapor chamber according to any one of (1) to (5) above, which satisfies the above relationship.

(7) The member for manufacturing a vapor chamber according to any one of (1) to (6) above, wherein the resin material contains an alkali-soluble resin and a photopolymerizable resin.

(8) The member for manufacturing a vapor chamber according to (7) above, wherein the alkali-soluble resin contains a (meth) acrylic group and a phenolic hydroxyl group.

(9) The member for manufacturing a vapor chamber according to (7) or (8) above, wherein the resin material further contains a thermosetting resin different from the alkali-soluble resin.

(10) A container with a hollow inside and
The wick structure arranged in the cavity and
A vapor chamber having a hydraulic fluid arranged in the cavity.
The wick structure is made of a material containing a cured resin product and fibers, and the fibers are arranged in a part of a flow path portion of the working liquid to which the cured resin product is not arranged. A vapor chamber characterized by that.

(11) The vapor chamber according to (10) above, wherein the wick structure is formed by using the member for manufacturing a vapor chamber according to any one of (1) to (9) above.

(12) The step of preparing the member for manufacturing the vapor chamber according to any one of (1) to (9) above, and the process of preparing the member for manufacturing the vapor chamber.
The first joining step of joining the vapor chamber manufacturing member to the first sheet material on the first surface, which is one of the surfaces,
An exposure step of irradiating the vapor chamber manufacturing member joined to the first sheet material with light in a predetermined pattern.
A developing step of removing the uncured resin material at a portion not irradiated with the light in the exposure step, and a developing step of removing the uncured resin material.
A second joining step of joining the vapor chamber manufacturing member that has undergone the developing step to a second sheet material on a second surface that is a surface opposite to the first surface.
A method for manufacturing a vapor chamber, which comprises injecting a hydraulic fluid into a space between the first sheet material and the second sheet material, and having a hydraulic fluid supply / sealing step for sealing the space. ..

According to the present invention, it is possible to provide a member for manufacturing a vapor chamber which is excellent in flexibility (flexibility) and can be suitably used for manufacturing a vapor chamber having particularly excellent heat transporting ability, and also, flexibility ( It is possible to provide a vapor chamber having excellent flexibility) and particularly excellent heat transport capacity and a method for manufacturing the same.

It is a perspective view which shows typically an example of the member for manufacturing a vapor chamber of this invention. It is a vertical sectional view schematically showing an example of the member for manufacturing a vapor chamber of this invention. It is a vertical sectional view schematically showing another example of the member for manufacturing a vapor chamber of this invention. It is a vertical sectional view schematically showing another example of the member for manufacturing a vapor chamber of this invention. It is a vertical sectional view schematically showing an example of the vapor chamber of this invention. It is a vertical sectional view schematically showing another example of the vapor chamber of this invention. It is a vertical sectional view schematically showing another example of the vapor chamber of this invention. It is a vertical sectional view schematically showing another example of the vapor chamber of this invention. It is a top view schematically showing the wick structure provided in the vapor chamber of this invention. It is a vertical sectional view schematically showing an example of the manufacturing method of the vapor chamber of this invention. It is a vertical sectional view schematically showing an example of the manufacturing method of the vapor chamber of this invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
[1] Vapor Chamber Manufacturing Member First, the vapor chamber manufacturing member of the present invention will be described.
FIG. 1 is a perspective view schematically showing an example of a member for manufacturing a vapor chamber of the present invention. FIG. 2 is a vertical sectional view schematically showing an example of a member for manufacturing a vapor chamber of the present invention. 3 and 4 are vertical cross-sectional views schematically showing another example of the member for manufacturing the vapor chamber of the present invention, respectively.

The member 10'for manufacturing the vapor chamber is used for manufacturing the vapor chamber 100 described later. More specifically, the vapor chamber manufacturing member 10'is a wick structure manufacturing member as a molded body manufacturing member used for manufacturing the wick structure 10 as a molded body included in the vapor chamber 100.

The vapor chamber manufacturing member 10'contains the fiber 131 and the uncured resin material 14'.

Thereby, it is possible to provide a member 10'for manufacturing a vapor chamber, which is excellent in flexibility (flexibility) and can be suitably used for manufacturing a vapor chamber 100 having a particularly excellent heat transport capacity. Further, since the flexibility of the vapor chamber 100 can be made excellent, the state of close contact between the vapor chamber 100 and the member is good regardless of the member or arrangement to which the vapor chamber 100 is applied. It can be made more reliable and the excellent heat transport capacity can be exhibited more reliably.

It is considered that the reason why such an excellent effect is obtained is as follows. That is, since the vapor chamber manufacturing member 10'contains the fiber 131 and the uncured resin material 14', the wick structure 10 formed by using the vapor chamber manufacturing member 10'is referred to the fiber 131. It can be made of a material containing the cured resin product 14, and can exhibit excellent flexibility (flexibility) as a whole of the vapor chamber 100. Further, by including the resin material 14'in an uncured state in the member 10'for manufacturing the vapor chamber, for example, by irradiating light (exposure light) in a predetermined pattern in a method as described later, the vapor chamber 100 is used. In particular, the flow path portion 15 of the hydraulic fluid 30 in the above, particularly the flow path portion of the gaseous hydraulic fluid 30 (the portion of the flow path portion 15 in which the fiber 131 does not exist or the portion where the density of the fiber 131 is low) and the liquid. A flow path portion of the hydraulic fluid 30 (a portion of the flow path portion 15 in which the fiber 131 is present or a portion having a high density of the fiber 131) can be suitably formed. More specifically, a structure for moving the gaseous hydraulic fluid 30 and a structure for moving the liquid hydraulic fluid 30 by capillarity can be formed in a suitable arrangement. As a result, the evaporation / condensation cycle of the hydraulic fluid 30 can be accelerated, and the heat transport capacity of the vapor chamber 100 as a whole can be made particularly excellent. However, a part of the liquid hydraulic fluid 30 flows in the flow path portion of the gaseous hydraulic fluid 30 (the portion of the flow path portion 15 in which the fiber 131 does not exist or the portion where the density of the fiber 131 is low). Alternatively, in the flow path portion of the liquid hydraulic fluid 30 (the portion of the flow path portion 15 in which the fiber 131 is present or the portion where the density of the fiber 131 is high), a part of the gaseous state may be used. The hydraulic fluid 30 may be distributed.

Further, the shape of the flow path portion 15 and the flow path wall 16 provided in the vapor chamber 100 (wick structure 10) manufactured by using the member 10'for manufacturing the vapor chamber can be applied to the application, application site, etc. of the vapor chamber 100. It can be appropriately adjusted accordingly. In other words, it is excellent in on-demand performance. Further, the vapor chamber 100 (wick structure 10) can be suitably manufactured by general treatment such as light irradiation and heat treatment, and has excellent characteristics as described above without complicated metal processing. The vapor chamber 100 can be manufactured. Further, since the flow path portion of the gaseous hydraulic fluid 30 and the flow path portion of the liquid hydraulic fluid 30 can be formed by a common process and the alignment of these portions is unnecessary, the vapor It is possible to realize high productivity and high yield in the manufacture of the chamber 100.

The uncured resin material 14'may be a curable resin material that has not completed the curing reaction, and may be a partially cured resin material, for example, a B-stage resin material. You may.

In particular, in the illustrated configuration, the vapor chamber manufacturing member 10'contains the fiber base material 13 made of the fiber 131 and the uncured resin material 14' impregnated with the fiber base material 13.

As a result, the above-mentioned effects are more prominently exhibited. For example, by including the fiber base material 13 in which a plurality of fibers 131 are entangled with each other, for example, the gaps between the fibers 131 in the vapor chamber manufacturing member 10'are not included only in the independent state. It is easy to adjust the liquid hydraulic fluid 30 to a state in which a capillary phenomenon is likely to occur, and it is easy to adjust the arrangement portion of the fiber 131 in the vapor chamber manufacturing member 10'. Therefore, in the wick structure 10 formed by using the vapor chamber manufacturing member 10', the flow path portion of the gaseous hydraulic fluid 30 and the flow path portion of the liquid hydraulic fluid 30 are more preferably formed. It is possible to more reliably exert the above-mentioned effect. Further, the manufacturing of the vapor chamber manufacturing member 10'is facilitated, and the arrangement state and distribution of the fibers 131 in the vapor chamber manufacturing member 10' can be easily adjusted. For example, in each part of the vapor chamber manufacturing member 10'. Unintentional uneven distribution of the fibers 131 (for example, the fiber 131 is not sufficiently present in the portion to be the flow path portion 15) can be suitably prevented.

In the illustrated configuration, the fiber base material 13 has a sheet shape, but the shape of the fiber base material 13 is not particularly limited.

Further, in the illustrated configuration, the vapor chamber manufacturing member 10'has a sheet-like shape, particularly a shape corresponding to the sheet-shaped fiber base material 13, but the vapor chamber manufacturing member 10' The shape is not particularly limited.

[1-1] The fiber vapor chamber manufacturing member 10'contains the fiber 131.

The fiber 131 may be made of any material, and the constituent material of the fiber 131 includes, for example, cotton, linen, wool, polyester resin, polyamide resin, acrylic resin, and a heterocycle in the molecule. Examples thereof include aromatic resins, glass, carbon, iron, silver, copper and the like, and one or a combination of two or more selected from these can be used.

In particular, when the fiber 131 is made of an aromatic resin containing a heterocycle in the molecule, the long-term durability of the vapor chamber 100 is improved.

Examples of the aromatic resin containing a heterocycle in the molecule include polyimide, polyamide-imide, polyesterimide, polybenzoxazole and the like, and among them, polyphenylene benzobisoxazole is preferable. Examples of commercially available products of fibers composed of polyparaphenylene benzobisoxazole include Zylon manufactured by Toyobo Co., Ltd.

The thickness of the fiber 131 is not particularly limited, but is preferably 1 μm or more and 100 μm or less, more preferably 4 μm or more and 30 μm or less, and further preferably 5 μm or more and 15 μm or less.

As a result, it is possible to secure a gap between the fibers 131 in a more suitable state while preventing the member 10'for manufacturing the vapor chamber from becoming thicker than necessary, and it is possible to secure a liquid state due to the capillary phenomenon in the vapor chamber 100. The transport capacity of the hydraulic fluid 30 can be improved. As a result, the heat transport capacity of the vapor chamber 100 can be further improved.

In the vapor chamber manufacturing member 10'and the vapor chamber 100, the fiber 131 may be included, for example, in a state in which a plurality of fibers 131 are bundled together, that is, as a fiber bundle. Examples of the fiber bundle include forms such as various twisted yarns, single twisted yarns, rung twisted yarns, and braided yarns.

As a result, it is possible to secure a gap between the fibers 131 in a more suitable state while preventing the member 10'for manufacturing the vapor chamber from becoming thicker than necessary, and it is possible to secure a liquid state due to the capillary phenomenon in the vapor chamber 100. The transport capacity of the hydraulic fluid 30 can be improved. As a result, the heat transport capacity of the vapor chamber 100 can be further improved.

In the illustrated configuration, the fiber 131 constitutes a sheet-shaped fiber base material (fiber sheet) 13.

As a result, the effect of including the fiber base material 13 as described above is exhibited. Further, since the fiber base material 13 is in the form of a sheet, it is possible to suitably prevent the member 10'for manufacturing the vapor chamber from becoming thicker than necessary, and the vapor chamber 100 (wick structure 10). It is possible to more preferably prevent the unintentional deformation of the fiber base material 13 during manufacturing and the unintentional movement of the fiber 131 in the vapor chamber manufacturing member 10'(wick structure 10).

The fiber base material 13 may be, for example, a non-woven fabric or a woven fabric.
When the fiber base material 13 is a woven fabric, examples of the woven fabric include plain weave, twill weave, satin weave, entwined weave, imitation weave, diagonal pattern weave, and double weave.

The thickness of the fiber base material 13 is preferably 10 μm or more and 1000 μm or less, more preferably 20 μm or more and 500 μm or less, and further preferably 30 μm or more and 200 μm or less.

As a result, it is possible to secure a gap between the fibers 131 in a more suitable state while preventing the member 10'for manufacturing the vapor chamber from becoming thicker than necessary, and it is possible to secure a liquid state due to the capillary phenomenon in the vapor chamber 100. The transport capacity of the hydraulic fluid 30 can be further improved. As a result, the heat transport capacity of the vapor chamber 100 can be further improved.

The fiber base material 13 may have portions having different fiber densities. For example, the fiber base material 13 may have portions having different fiber densities in the thickness direction thereof.

The member 10'for manufacturing the vapor chamber may include a plurality of fiber base materials 13. In this case, these fiber base materials 13 may have the same conditions or different conditions. When the vapor chamber manufacturing member 10'contains a plurality of fiber base materials 13, for example, the plurality of fiber base materials 13 may be laminated in the thickness direction of the vapor chamber manufacturing member 10'.

The member 10'for manufacturing the vapor chamber may contain the fiber base material 13, or may further contain the fiber 131 independent of the fiber base material 13.

The content of the fiber 131 in the vapor chamber manufacturing member 10'is preferably 1% by mass or more and 80% by mass or less, more preferably 3% by mass or more and 75% by mass or less, and 5% by mass or more and 70% by mass. It is more preferably mass% or less.

In particular, when the fiber 131 is made of an inorganic material, the content of the fiber 131 in the vapor chamber manufacturing member 10'is preferably 40% by mass or more and 80% by mass or less, preferably 45% by mass or more. It is more preferably 75% by mass or less, and further preferably 50% by mass or more and 70% by mass or less.

Further, when the fiber 131 is made of an organic material, the content of the fiber 131 in the vapor chamber manufacturing member 10'is preferably 1% by mass or more and 40% by mass or less, preferably 3% by mass or more. It is more preferably 35% by mass or less, and further preferably 5% by mass or more and 30% by mass or less.

By satisfying the above-mentioned content rate conditions, the flow path portion of the gaseous hydraulic fluid 30 in the vapor chamber 100 (wick structure 10) manufactured by using the vapor chamber manufacturing member 10', and the flow path portion. The ratio of the liquid hydraulic fluid 30 to the flow path portion can be made more suitable.

[1-2] Resin material The member 10'for manufacturing a vapor chamber contains a resin material 14'in an uncured state.

The resin material 14'may contain a curable resin in an uncured state, may be a partially cured reaction (for example, a B-stage resin), or may be in an uncured state. In addition to the curable resin, it may contain a thermoplastic resin.

Above all, the resin material 14'preferably contains an alkali-soluble resin and a photopolymerizable resin.

As a result, in a method as described later, a predetermined pattern can be suitably formed by an exposure step and a developing step, and in the developing step, an environmental load is applied instead of an organic solvent widely used as a developing solution. Less alkaline aqueous solution can be preferably used.

Hereinafter, the alkali-soluble resin will be described.
Examples of the alkali-soluble resin include novolak resins such as cresol type, phenol type, bisphenol A type, bisphenol F type, catechol type, resorcinol type and pyrogallol type, phenol aralkyl resin, hydroxystyrene resin, methacrylic acid resin and methacrylic acid ester. Acrylic resin such as resin, cyclic olefin resin containing hydroxyl group, carboxyl group, etc., polyamide resin (specifically, having at least one of polybenzoxazole structure and polyimide structure, and hydroxyl group in main chain or side chain , A resin having a carboxyl group, an ether group or an ester group, a resin having a polybenzoxazole precursor structure, a resin having a polyimide precursor structure, a resin having a polyamic acid ester structure, etc.) and the like.

As the alkali-soluble resin, for example, a resin having an alkali-soluble group and a double bond can be preferably used.

Examples of the resin having an alkali-soluble group and a double bond include a curable resin that can be cured by both light and heat.

Examples of the alkali-soluble group include a hydroxyl group and a carboxyl group. This alkali-soluble group can also contribute to the thermosetting reaction.

Examples of such a resin include a thermosetting resin having a photoreactive group such as an acryloyl group, a methacryloyl group, and a vinyl group, and a thermal reaction group such as a phenolic hydroxyl group, an alcoholic hydroxyl group, a carboxyl group, and an acid anhydride group. Examples thereof include a photocurable resin having the above. The photocurable resin may further have a thermal reaction group such as an epoxy group, an amino group, or a cyanate group. Specific examples thereof include (meth) acrylic-modified phenolic resin, (meth) acryloyl group-containing acrylic acid polymer, and carboxyl group-containing (epoxy) acrylate.
Among these, the alkali-soluble resin preferably contains a (meth) acrylic group and a phenolic hydroxyl group, and more preferably a (meth) acrylic-modified phenol resin.

By using a resin containing an alkali-soluble group, when removing a resin having an unreacted double bond during the development process, an alkaline aqueous solution with less environmental load is used instead of the organic solvent normally used as a developer. Since it can be applied and the double bond portion contributes to the curing reaction, the heat resistance of the cured resin product 14 described later can be maintained.

Here, when a thermosetting resin having a photoreactive group is used, the modification rate (substitution rate) of the photoreactive group is not particularly limited, but the entire reactive group of the alkali-soluble group and the resin having a double bond is used. It is preferably 20 mol% or more and 80 mol% or less, and more preferably 30 mol% or more and 70 mol% or less.

As a result, the resolution of the resin material 14'in the method for manufacturing the vapor chamber 100, which will be described later, that is, the reproducibility of the pattern in the exposure process can be further improved. As a result, it can be more preferably applied to the production of the vapor chamber 100 provided with the wick structure 10 having a fine pattern.

On the other hand, when a photocurable resin having a thermal reactive group is used, the modification rate (substitution rate) of the thermal reactive group is not particularly limited, but 20 mol of the entire reactive group of the resin having an alkali-soluble group and a double bond. It is preferably% or more and 80 mol% or less, and more preferably 30 mol% or more and 70 mol% or less.

As a result, the resolution of the resin material 14'in the method for manufacturing the vapor chamber 100, which will be described later, that is, the reproducibility of the pattern in the exposure process can be further improved. As a result, it can be more preferably applied to the production of the vapor chamber 100 provided with the wick structure 10 having a fine pattern.

The weight average molecular weight of the resin having an alkali-soluble group and a double bond is not particularly limited, but is preferably 300,000 or less, and more preferably 5,000 or more and 150,000 or less.

This makes it possible to more preferably remove the resin material 14'in the developing process while making the shape stability of the resin material 14' in the vapor chamber manufacturing member 10' sufficiently excellent.

The weight average molecular weight is, for example, G.I. P. C. The weight average molecular weight can be calculated from a calibration curve prepared in advance using a styrene standard substance. In particular, tetrahydrofuran (THF) is used as the measurement solvent, and the measurement can be performed under a temperature condition of 40 ° C. Also in the examples described later, the values obtained by the measurement under these conditions are shown as the weight average molecular weight.

The content of the alkali-soluble resin in the resin material 14'is not particularly limited, but is preferably 10% by mass or more and 80% by mass or less, and more preferably 15% by mass or more and 70% by mass or less.

As a result, the stability of the shape of the resin material 14'in the vapor chamber manufacturing member 10'is sufficiently excellent, and the resolution in the exposure process and the developability in the developing process are further improved. be able to. Further, by heat treatment in the manufacturing process of the vapor chamber 100, the bonding strength and adhesion between the wick structure 10 and the container 20 (first sheet material 21, second sheet material 22) are further improved. Can be done.

Next, the photopolymerizable resin will be described.
When the resin material 14'contains a photopolymerizable resin together with the above-mentioned alkali-soluble resin, the patterning property can be improved.

Examples of the photopolymerizable resin include acrylic compounds having at least one unsaturated polyester, acryloyl group or methacryloyl group in one molecule, acrylic compounds such as oligomers, and vinyl compounds such as styrene. , One kind selected from these, or two or more kinds can be used in combination.

Among these, an ultraviolet curable resin containing an acrylic compound as a main component is preferable. The acrylic compound has a high curing rate when irradiated with light (exposure light), and can suitably pattern the resin material 14'with a relatively small amount of exposure.

Examples of acrylic compounds include monomers of acrylic acid ester and methacrylic acid ester, and more specifically, ethylene glycol diacrylic acid, ethylene glycol dimethacrylate, 1,6-hexanediol diacrylic acid, and dimethacrylic acid. Bifunctional acrylates such as acid 1,6-hexanediol, glycerin diacrylate, glycerin dimethacrylic acid, 1,10-decanediol diacrylic acid, 1,10-decanediol dimethacrylic acid, trimethylolpropane triacrylate, trimethacrylic Examples thereof include polyfunctional acrylates such as trimethylolpropane acid acid, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexaacrylate, and dipentaerythritol hexamethacrylate.

Of these, (meth) acrylic acid esters are preferable, and acrylic acid esters and methacrylic acid alkyl esters having an ester moiety having 1 or more and 15 or less carbon atoms are more preferable.
As a result, the reactivity can be improved and the sensitivity in the exposure process is improved.

The photopolymerizable resin is not particularly limited, but is preferably liquid at room temperature (23 ° C.).

Thereby, the curing reactivity by the exposure light (particularly, ultraviolet rays) can be improved. In addition, the mixing operation with other compounding components (for example, alkali-soluble resin) can be facilitated. Examples of the photopolymerizable resin liquid at room temperature include the above-mentioned ultraviolet curable resin containing an acrylic compound as a main component.

The weight average molecular weight of the photopolymerizable resin is not particularly limited, but is preferably 5,000 or less, and more preferably 150 or more and 3,000 or less.

As a result, the reactivity of the resin material 14'can be improved, the sensitivity in the exposure process can be improved, and the resolution of the resin material 14'can be improved.

The content of the photopolymerizable resin in the resin material 14'is not particularly limited, but is preferably 9% by mass or more and 40% by mass or less, and more preferably 13% by mass or more and 30% by mass or less.

This makes it possible to achieve both heat resistance and flexibility of the cured resin product 14, which will be described later, at a higher level. In addition, the resolution of the resin material 14'in the method for manufacturing the vapor chamber 100, which will be described later, that is, the reproducibility of the pattern in the exposure process can be further improved. As a result, it can be more preferably applied to the production of the vapor chamber 100 provided with the wick structure 10 having a fine pattern.

When the content of the alkali-soluble resin in the resin material 14'is XA [mass%] and the content of the photopolymerizable resin in the resin material 14'is XP [mass%], 0.15 ≦ XP / XA ≦ It is preferable to satisfy the relationship of 0.90, more preferably the relationship of 0.19 ≦ XP / XA ≦ 0.87, and further preferably the relationship of 0.22 ≦ XP / XA ≦ 0.33. ..

As a result, the stability of the shape of the resin material 14'in the vapor chamber manufacturing member 10', the resolution in the exposure process, the developability in the developing process, the wick structure 10 and the container 20 (first sheet material). The balance between the bonding strength with the 21 and the second sheet material 22), the adhesiveness, the heat resistance of the cured resin product 14, the flexibility, and the like can be further improved.

When the resin material 14'contains an alkali-soluble resin and a photopolymerizable resin, the resin material 14'preferably further contains a thermosetting resin different from the alkali-soluble resin.

Thereby, the heat resistance of the vapor chamber 100 (wick structure 10) can be made more excellent. Further, suitable adhesiveness can be exhibited in the manufacturing process of the vapor chamber 100 described later, and the bonding strength and adhesion between the wick structure 10 and the container 20 (first sheet material 21, second sheet material 22) can be exhibited. The sex can be made better.

Examples of the thermosetting resin include novolak-type phenolic resins such as phenol novolac resin, cresol novolak resin, and bisphenol A novolak resin, phenolic resins such as resolphenol resin, bisphenol A epoxy resin, and bisphenol F epoxy resin. Novolac type epoxy resin such as epoxy resin, novolak epoxy resin, cresol novolak epoxy resin, biphenyl type epoxy resin, stilben type epoxy resin, triphenol methane type epoxy resin, alkyl modified triphenol methane type epoxy resin, triazine nucleus containing epoxy resin, Epoxy resin such as dicyclopentadiene-modified phenol type epoxy resin, resin having triazine ring such as urea resin, melamine resin, unsaturated polyester resin, bismaleimide resin, polyurethane resin, diallyl phthalate resin, silicone resin, benzoxazine Examples thereof include a resin having a ring, a cyanate ester resin, and the like, and one kind or two or more kinds selected from these can be used in combination. Among them, the epoxy resin is particularly preferable as the thermosetting resin. As a result, the heat resistance of the cured resin product 14, which will be described later, and the adhesion of the cured resin product 14 to the fibers 131, the first sheet material 21, and the second sheet material 22 can be further improved.

In particular, as the epoxy resin, it is preferable to use a silicone-modified epoxy resin, which is a solid epoxy resin at room temperature (particularly a bisphenol type epoxy resin) and an epoxy resin liquid at room temperature (particularly, a silicone-modified epoxy resin liquid at room temperature). It is more preferable to use it in combination with resin).

As a result, the heat resistance and flexibility of the cured resin product 14, which will be described later, can be achieved at a higher level. Further, the resolution of the resin material 14'in the method for manufacturing the vapor chamber 100, which will be described later, that is, the reproducibility of the pattern in the exposure process can be further improved. As a result, it can be more preferably applied to the production of the vapor chamber 100 provided with the wick structure 10 having a fine pattern.

The content of the thermosetting resin in the resin material 14'is not particularly limited, but is preferably 10% by mass or more and 60% by mass or less, and more preferably 15% by mass or more and 55% by mass or less.

As a result, the heat resistance and toughness of the cured resin product 14, which will be described later, can be achieved at a higher level.

When the content of the alkali-soluble resin in the resin material 14'is XA [mass%] and the content of the thermosetting resin in the resin material 14'is XT [mass%], 0.20 ≦ XT / XA. It is preferable to satisfy the relationship of ≤1.5, more preferably the relationship of 0.30≤XT / XA≤1.2, and further satisfy the relationship of 0.55≤XT / XA≤0.80. preferable.

As a result, the shape stability of the resin material 14'in the vapor chamber manufacturing member 10', the resolution in the exposure process, the developability in the developing process, the heat resistance and toughness of the cured resin material 14, and the wick structure 10 The balance between the joint strength and the container 20 (first sheet material 21, second sheet material 22), adhesion, and the like can be further improved.

The content of the resin material 14'in the vapor chamber manufacturing member 10'is preferably 10% by mass or more and 95% by mass or less, more preferably 15% by mass or more and 90% by mass or less, and 20% by mass. It is more preferably 85% by mass or less.

In particular, when the fiber 131 is made of an inorganic material, the content of the resin material 14'in the vapor chamber manufacturing member 10'is preferably 10% by mass or more and 50% by mass or less, preferably 15% by mass. It is more preferably% or more and 45% by mass or less, and further preferably 20% by mass or more and 40% by mass or less.

Further, when the fiber 131 is made of an organic material, the content of the resin material 14'in the vapor chamber manufacturing member 10'is preferably 50% by mass or more and 95% by mass or less, preferably 55% by mass. It is more preferably% or more and 90% by mass or less, and further preferably 60% by mass or more and 85% by mass or less.

By satisfying the above-mentioned content rate conditions, the flow path portion of the gaseous hydraulic fluid 30 in the vapor chamber 100 (wick structure 10) manufactured by using the vapor chamber manufacturing member 10', and the flow path portion. The ratio of the liquid hydraulic fluid 30 to the flow path portion can be made more suitable.

When the content of the fiber 131 in the vapor chamber manufacturing member 10'is Xf [mass%] and the content of the resin material 14'is Xr [mass%], 0.01 ≤ Xf / Xr ≤ 8.0. It is preferable to satisfy the relationship of 0.1 ≦ Xf / Xr ≦ 5.0, more preferably to satisfy the relationship of 0.3 ≦ Xf / Xr ≦ 3.0.

In particular, when the fiber 131 is made of an inorganic material, it is preferable that the relationship of 0.8 ≦ Xf / Xr ≦ 8.0 is satisfied, and the relationship of 1.0 ≦ Xf / Xr ≦ 7.0 is satisfied. Is more preferable, and it is further preferable to satisfy the relationship of 2.0 ≦ Xf / Xr ≦ 6.0.

When the fiber 131 is made of an organic material, it is preferable to satisfy the relationship of 0.01 ≦ Xf / Xr ≦ 0.8, and satisfy the relationship of 0.05 ≦ Xf / Xr ≦ 0.6. Is more preferable, and it is further preferable to satisfy the relationship of 0.10 ≦ Xf / Xr ≦ 0.4.

By satisfying the above-mentioned content ratio relationship, the flow path portion of the gaseous hydraulic fluid 30 in the vapor chamber 100 (wick structure 10) manufactured by using the vapor chamber manufacturing member 10', and the flow path portion. The ratio of the liquid hydraulic fluid 30 to the flow path portion can be made more suitable.

[1-3] Filler The member 10'for manufacturing a vapor chamber may further contain a filler in addition to the fiber 131 and the resin material 14'.

This makes it possible to improve the shape retention of the cured resin 14 described later and improve the durability of the vapor chamber 100.

The shape of the filler may be any shape, and examples thereof include a spherical shape, a spindle shape, a needle shape, a rod shape, a fibrous shape, and a scale shape.

Examples of the filler include organic fillers such as fine particles such as phenol resin, acrylic resin, polyamide, polysulfone, polystyrene and fluororesin, talc, calcined clay, unfired clay, silicate such as mica and glass, and titanium oxide. , Alumina, fused silica (molten spherical silica, fused crushed silica), oxides such as silica such as crystalline silica, carbonates such as calcium carbonate, magnesium carbonate, hydrotalcite, aluminum hydroxide, magnesium hydroxide, calcium hydroxide. Hydroxides such as barium sulfate, calcium sulfate, sulfates such as calcium sulfite or sulfites, zinc borate, barium metaborate, aluminum borate, calcium borate, borates such as sodium borate, aluminum nitride, etc. Examples thereof include nitrides such as boron nitride and silicon nitride, carbon-based materials such as graphite and diamond, and metal materials such as copper and aluminum, and one or a combination of two or more selected from these can be used. can.

When the filler is spherical, the average particle size is preferably 0.05 μm or more and 0.35 μm or less, more preferably 0.10 μm or more and 0.30 μm or less, and 0.10 μm or more. It is more preferably 0.25 μm or less.

As a result, it is possible to more effectively suppress the generation of residues after the development step in the method for manufacturing the vapor chamber 100 as described later, and to further improve the shape retention of the cured resin product 14 described later. be able to.

In the present specification, the average particle size refers to a number-based average particle size unless otherwise specified. For example, a laser diffraction type particle size distribution measuring device with a filler dispersed in water (a laser diffraction type particle size distribution measuring device). It can be obtained by measurement using SALD-7000). Further, in the measurement, for example, the above dispersion may be subjected to ultrasonic treatment and then the measurement. In the examples described later, after adding and stirring the filler in water, ultrasonic treatment is performed for 1 minute, and then measurement is performed using a laser diffraction type particle size distribution measuring device (SALD-7000). The particle size was determined.

The content of the filler in the vapor chamber manufacturing member 10'is preferably 1% by mass or more and 50% by mass or less, more preferably 3% by mass or more and 45% by mass or less, and 5% by mass or more and 40. It is more preferably mass% or less.

As a result, it is possible to more effectively suppress the generation of residues after the development step in the method for manufacturing the vapor chamber 100 as described later, and further improve the shape retention of the cured resin 14 described later. be able to.

[1-4] Hardener The member 10'for manufacturing a vapor chamber may further contain a hardener in addition to the fiber 131 and the resin material 14'.

The curing agent (photosensitizer) is not particularly limited as long as it cures the resin material 14', and for example, benzophenone, acetophenone, benzoin, benzoin isobutyl ether, methyl benzoin benzoate, benzoin benzoic acid, benzoin methyl ether, etc. Benzilphenyl sulfide, benzyl, dibenzyl, diacetyl and the like can be mentioned, and one or a combination of two or more selected from these can be used.

The content of the curing agent (photosensitive agent) in the vapor chamber manufacturing member 10'is not particularly limited, but is preferably 0.1% by mass or more and 50% by mass or less, and 0.5% by mass or more and 40% by mass or less. It is more preferably 1.0% by mass or more and 30% by mass or less.

As a result, the storage stability of the vapor chamber manufacturing member 10'is sufficiently excellent, and the photopolymerization reaction can be more preferably started and proceeded at the time of manufacturing the vapor chamber 100, which will be described later.

[1-5] Other components The vapor chamber manufacturing member 10'may contain components other than the above-mentioned components (hereinafter, also referred to as "other components"). Examples of such a component include an ultraviolet absorber, a leveling agent, a coupling agent, a flame retardant, an antioxidant and the like, and one or a combination of two or more selected from these can be used.

However, the content of other components in the vapor chamber manufacturing member 10'is preferably 7.0% by mass or less, more preferably 5.0% by mass or less, and more preferably 3.0% by mass or less. Is more preferable.

[1-6] Overall Configuration of Vapor Chamber Manufacturing Member The shape of the vapor chamber manufacturing member 10'is not particularly limited, but in the illustrated configuration, it is in the form of a sheet.

Thereby, the sheet-shaped vapor chamber 100 (wick structure 10) can be suitably manufactured. In addition, unintentional deformation of the vapor chamber manufacturing member 10'during manufacturing of the vapor chamber 100 (wick structure 10) and unintentional movement of the fiber 131 in the vapor chamber manufacturing member 10' (wick structure 10). Can be more preferably prevented.

When the vapor chamber manufacturing member 10'is in the form of a sheet, the sheet-shaped fiber base material 13 (fiber 131) is substantially in the thickness direction of the vapor chamber manufacturing member 10'as shown in FIG. It may be present throughout, or as shown in FIG. 3, it may be unevenly distributed near the center of the vapor chamber manufacturing member 10'in the thickness direction, or as shown in FIG. , The vapor chamber manufacturing member 10'may be unevenly distributed on one surface side. Further, the sheet-shaped fiber base material 13 (fiber 131) is unevenly distributed on both sides of the vapor chamber manufacturing member 10', and is in the thickness direction of the vapor chamber manufacturing member 10'compared to these parts. The content of the fiber 131 near the center may be low.

The thickness of the vapor chamber manufacturing member 10'is preferably 10 μm or more and 2000 μm or less, more preferably 20 μm or more and 1000 μm or less, and further preferably 30 μm or more and 500 μm or less.

As a result, the flow path portion of the gaseous hydraulic fluid 30 and the liquid hydraulic fluid 30 are prevented from becoming thicker than necessary in the vapor chamber 100 manufactured by using the vapor chamber manufacturing member 10'. It is possible to more preferably form the flow path portion of the above.

[2] Vapor Chamber Next, the vapor chamber of the present invention will be described.
FIG. 5 is a vertical sectional view schematically showing an example of the vapor chamber of the present invention. 6 to 8 are vertical cross-sectional views schematically showing another example of the vapor chamber of the present invention, respectively. FIG. 9 is a plan view schematically showing a wick structure included in the vapor chamber of the present invention. In FIG. 9, the fiber 131 is not shown. In the following description, when the vapor chamber 100 comes into contact with a member (heating member) to which the vapor chamber 100 is applied on the lower surface (the surface of the first sheet material 21) in FIGS. 5 to 8. Although it will be mainly described, the vapor chamber 100 may be used so as to be in contact with the member (heating member) to which the vapor chamber 100 is applied on the upper surface in FIGS. 5 to 8. Further, FIGS. 5 to 8 show a state in which the first sheet material 21 faces downward, but the orientation of the vapor chamber 100 when the vapor chamber 100 is used is not particularly limited, and for example, the first one. The sheet material 21 may be used in a state of facing upward.

The vapor chamber 100 has a container 20 having a cavity inside, a wick structure 10 arranged in the cavity, and a hydraulic fluid 30 arranged in the cavity.

The wick structure 10 is made of a material containing the cured resin material 14 and the fibers 131, and the fibers 131 are arranged in a part of the flow path portion 15 of the hydraulic fluid 30 to which the cured resin material 14 is not arranged. Has been done.

Thereby, it is possible to provide a vapor chamber having excellent flexibility (flexibility) and particularly excellent heat transport capacity. Further, since the flexibility of the vapor chamber 100 can be made excellent, the state of close contact between the vapor chamber 100 and the member is good regardless of the member or arrangement to which the vapor chamber 100 is applied. It can be made more reliable and the excellent heat transport capacity can be exhibited more reliably.

[2-1] Container The container 20 houses the wick structure 10 and the hydraulic fluid 30, and mainly in the evaporating part, the container 20 comes into contact with a member to be cooled such as a heat generating member. It exerts a function of transferring heat to the working liquid 30 housed inside the above, and has a function of dissipating heat received from the working liquid 30 that undergoes a phase transition from a gas state to a liquid state in the condensing portion.

The container 20 is formed by using the first sheet material 21 and the second sheet material 22.

Both the first sheet material 21 and the second sheet material 22 are made of a material having high thermal conductivity. Examples of such a material include metal materials such as copper, aluminum, magnesium, zinc, and alloys containing at least one of them.

The first sheet material 21 and the second sheet material 22 may be made of the same material or may be made of different materials.

The thickness of the first sheet material 21 and the second sheet material 22 is not particularly limited, but both are preferably 12 μm or more and 70 μm or less, and more preferably 18 μm or more and 35 μm or less.

The first sheet material 21 and the second sheet material 22 are sealed by a sealing portion 23 at their outer peripheral portions. As a result, the hollow portion in which the wick structure 10 and the hydraulic fluid 30 are housed is sealed, and the liquidtight state and the airtight state are maintained.

The sealing portion 23 may be made of the same material as the first sheet material 21 or the second sheet material 22, or may be different from the first sheet material 21 and the second sheet material 22. It may be composed of.

The sealing portion 23 can be formed by, for example, plating up, laser welding, seam welding, cold pressure welding, diffusion bonding, brazing, and adhesion.

[2-2] Wick structure The wick structure 10 has a flow of the working liquid 30 accompanying heat transport, particularly a flow of the working liquid 30 vaporized by receiving heat in the evaporation part of the container 20, and a condensed part of the container 20. It is a member in which the condensed hydraulic fluid 30 flows due to the heat reception of the above.

The wick structure 10 is made of a material containing the cured resin material 14 and the fibers 131, and the fibers 131 are arranged in a part of the flow path portion 15 of the hydraulic fluid 30 to which the cured resin material 14 is not arranged. Has been done. In particular, the flow path portion 15 is a flow path portion of the gaseous hydraulic fluid 30 (a portion of the flow path portion 15 in which the fiber 131 does not exist or a portion where the density of the fiber 131 is low) and the liquid hydraulic fluid 30. It has a flow path portion (a portion of the flow path portion 15 in which the fiber 131 is present or a portion in which the density of the fiber 131 is high).

Such a wick structure 10 may be formed by any method, but it is preferably formed by using the above-mentioned vapor chamber manufacturing member 10'of the present invention.

Thereby, for example, the vapor chamber 100 can be manufactured with high productivity and high yield by a method as described later, and the reliability of the vapor chamber 100 can be further improved.

When the wick structure 10 is formed by using the above-mentioned vapor chamber manufacturing member 10'of the present invention, the wick structure 10 is manufactured by using one vapor chamber manufacturing member 10'. It may be a thing, or it may be manufactured by using a plurality of vapor chamber manufacturing members 10'. When a plurality of vapor chamber manufacturing members 10'are used, these vapor chamber manufacturing members 10'may be arranged and used in the plane direction of the wick structure 10 or in the thickness direction of the wick structure 10. You may use it by arranging (stacking) it in.

In the following description, when the wick structure 10 is manufactured by using the above-mentioned vapor chamber manufacturing member 10', in particular, it is manufactured by using the vapor chamber manufacturing member 10'including the fiber base material 13. The case where it has been done will be mainly explained.

The wick structure 10 is in contact with the inner surface of the container 20 on both sides thereof. More specifically, the wick structure 10 is in contact with the first sheet material 21 on one surface, the first surface 11, and on the other surface, the second surface 12. Is in contact with the sheet material 22 of.

It is preferable that the fibers 131 and the fiber base material 13 constituting the wick structure 10 satisfy the same conditions as described in the item of the vapor chamber manufacturing member 10'.

As shown in FIG. 5, the sheet-shaped fiber base material 13 (fiber 131) may be present almost entirely in the thickness direction of the wick structure 10, or as shown in FIG. 6, the wick. The structure 10 may be unevenly distributed near the center in the thickness direction, or may be unevenly distributed on the second surface 12 side of the wick structure 10 as shown in FIG. 7. As shown in FIG. 8, the wick structure 10 may be unevenly distributed on the first surface 11 side. Further, the sheet-shaped fiber base material 13 (fiber 131) is unevenly distributed on both side surfaces (first surface 11 side and second surface 12 side) of the wick structure 10, and is unevenly distributed as compared with these parts. The content of the fiber 131 near the center in the thickness direction of the wick structure 10 may be low.

The cured resin product 14 is suitably obtained by curing the above-mentioned resin material 14'.
The wick structure 10 extends in the longitudinal direction thereof, is made of a material containing the cured resin product 14, and has a plurality of portions that function as the flow path wall 16 of the hydraulic fluid 30.

The distance S between the adjacent flow path walls 16 (that is, the width of the flow path portion 15) is not particularly limited, but is preferably 100 μm or more and 1000 μm or less, more preferably 200 μm or more and 800 μm or less, and 300 μm or more and 700 μm. The following is more preferable.

As a result, the hydraulic fluid 30 (the gaseous hydraulic fluid 30 and the liquid hydraulic fluid 30) can be moved more smoothly while suppressing the enlargement of the wick structure 10 and the vapor chamber 100. Further, when the pressure is reduced in the flow path portion 15 in which the fiber 131 does not exist in order to lower the boiling point of the hydraulic fluid 30, the flow path wall 16 is present between the first sheet material 21 and the second sheet material 22. Therefore, it is possible to prevent the first sheet material 21 and the second sheet material 22 from being deformed. As a result, the heat transport capacity of the vapor chamber 100 can be made particularly excellent.

The ratio (L / S) of the width L [μm] of the flow path wall 16 to the width S [μm] of the flow path portion 15 is not particularly limited, but is preferably 0.05 or more and 0.50 or less, and is 0. It is more preferably .08 or more and 0.40 or less, and further preferably 0.10 or more and 0.35 or less.

As a result, the heat transport capacity of the vapor chamber 100, the durability of the vapor chamber 100, and the like can be further improved while suppressing the increase in size of the wick structure 10 and the vapor chamber 100. On the other hand, when the L / S value is less than the lower limit value, the first sheet material 21 or the second sheet material 22 is likely to be deformed when the flow path portion 15 is depressurized. Further, when the L / S value exceeds the upper limit value, the heat transport efficiency is lowered.

In the illustrated configuration, the flow path portion 15 and the flow path wall 16 have a certain width, but they may have parts having different widths.

Further, in the illustrated configuration, the flow path portion 15 and the flow path wall 16 are provided linearly in one direction, but they may have a curved portion or a bent portion.

[2-3] The hydraulic fluid 30 is arranged together with the wick structure 10 in the cavity of the hydraulic fluid container 20.

The hydraulic fluid 30 mainly has a function of transporting heat in the cavity inside the container 20.

Examples of the working fluid 30 include water, hydrochlorofluorocarbons such as HCFC-22, hydrofluorocarbons such as HFCR134a, HFCR407C, HFCR410A, and HFC32, hydrofluoroolefins such as HFO1234yf, alcohols such as hydrofluoroethers, ethanol, and methanol, and acetone. , Carbon dioxide, ammonia, propane and the like are examples.

[2-4] Overall Configuration of Vapor Chamber The thickness of the vapor chamber 100 is preferably 150 μm or more and 3000 μm or less, more preferably 200 μm or more and 2000 μm or less, and further preferably 250 μm or more and 1000 μm or less.

This makes it possible to move the hydraulic fluid 30 (the gaseous hydraulic fluid 30 and the liquid hydraulic fluid 30) more smoothly while preventing the vapor chamber 100 from becoming thicker. As a result, the heat transport capacity of the vapor chamber 100 can be made particularly excellent. In addition, the durability of the vapor chamber 100 can be made more excellent.

[2-5] Usage of Vapor Chamber Next, an example of usage of the vapor chamber of the present invention will be described.

The vapor chamber of the present invention may be used, for example, for the purpose of transferring the heat of the heat generating member to a predetermined place, or for the purpose of equalizing the heat of the local high temperature portion of the heat generating member. There may be.

Hereinafter, the case where the vapor chamber of the present invention is used for the purpose of transferring the heat of a predetermined member (heating member) will be mainly described.

When used for the purpose of cooling a heat generating member (for example, CPU, etc.), the vapor chamber is a member (for example, a member) in which a part (evaporation part) of the surface thereof is made of the heat generating member itself or a high heat conductive material in contact with the heat generating member itself. It is used in contact with a heat conductive sheet, etc. (hereinafter, these are collectively referred to as "heat generating member, etc.").

At this time, the vapor chamber is composed of a heat radiating member (for example, a heat sink) and a high heat conductive material in contact with the heat radiating member in the condensing part, that is, the part where heat received from the heat generating member is radiated, which is a part different from the evaporating part. It may be in contact with a member (for example, a heat conductive sheet or the like) (hereinafter, these are collectively referred to as “heat dissipation member or the like”).

As described above, the vapor chamber of the present invention is excellent in flexibility.

Therefore, if there is a step between the part where the heat generating member is installed and the part where the heat dissipation member should be installed, and if a conventional heat pipe or vapor chamber that is inferior in flexibility (flexibility) is used, the above-mentioned It is necessary to install a spacer (for example, a metal spacer) to eliminate or alleviate the step difference, which causes problems such as cost increase due to the increase in parts and weight increase of the entire device. On the other hand, the vapor chamber of the present invention is excellent in flexibility (flexibility), and for example, bending can be suitably performed. Therefore, even if the spacer is omitted, the condensed portion and evaporation are performed. It is possible to secure a good adhesion state with other members (heat generating member, heat radiating member, etc.) in the portion. Therefore, good heat dissipation performance can be exhibited while suitably solving the above-mentioned problems.

Further, when the vapor chamber of the present invention is used, interference with other members can be suitably avoided by bending or bending the vapor chamber, so that the layout of each component for the device including the heat generating member can be laid out. More freedom.

Further, in the present invention, by using the above-mentioned method, the shape of the flow path portion and the flow path wall provided in the vapor chamber (wick structure) can be suitably adjusted. Therefore, according to the present invention, it has not only a simple shape such as a rectangle but also a complicated shape such as a shape having a notch, and has a flow path portion and a flow path wall corresponding to the shape. Even a vapor chamber can be suitably manufactured. Therefore, for example, it is possible to preferably eliminate the interference with other members while increasing the contact area with the heat generating member or the like and the heat radiating member or the like. As a result, better heat dissipation performance can be exhibited.

Further, for example, in a housing (for example, a joint portion of an articulated robot) in which a motor as a heat generating member is housed, heat generated from the motor is released to the outside through the housing. In some cases, an aluminum molded body and a heat conductive sheet are used in combination, but in this case, there is a problem that the housing becomes large. On the other hand, when the vapor chamber of the present invention is used, it is not necessary to use an aluminum molded body, which is advantageous from the viewpoint of miniaturization of the housing and reduction of the number of parts.

[3] Method for manufacturing a vapor chamber Next, a method for manufacturing a vapor chamber of the present invention will be described.
10 and 11 are vertical cross-sectional views schematically showing an example of the method for manufacturing a vapor chamber of the present invention.

In the method for manufacturing the vapor chamber 100 of the present embodiment, one surface of the vapor chamber manufacturing member preparation step (1a) for preparing the vapor chamber manufacturing member 10'of the present invention and the vapor chamber manufacturing member 10'. On the first surface 11, the first joining step (1b) joined to the first sheet material 21 and the vapor chamber manufacturing member 10'joined to the first sheet material 21 are predetermined. The exposure step (1c) of irradiating the light (exposure light) E with the pattern of the above, the development step (1d) of removing the uncured resin material 14'of the portion not irradiated with the light E in the exposure step, and the development. The second joining step (1e) of joining the vapor chamber manufacturing member 10'that has undergone the process to the second sheet material 22 on the second surface 12 that is the surface opposite to the first surface 11. , The working liquid 30 is injected into the space between the first sheet material 21 and the second sheet material 22, and the working liquid supply / sealing step (1f) for sealing the space is provided. ..

This makes it possible to provide a method for manufacturing a vapor chamber, which is excellent in flexibility (flexibility) and can suitably manufacture a vapor chamber having a particularly excellent heat transport capacity. Further, since the flexibility of the manufactured vapor chamber 100 can be made excellent, the vapor chamber 100 and the member are in close contact with each other regardless of the member or arrangement to which the vapor chamber 100 is applied. The condition can be improved and the excellent heat transport capacity can be more reliably exhibited.

[3-1] Vapor Chamber Manufacturing Member Preparation Step In the vapor chamber manufacturing member preparation step, the vapor chamber manufacturing member 10'of the present invention described above is prepared (1a).

The vapor chamber manufacturing member 10'can be obtained, for example, by impregnating the fiber base material 13 with a composition containing an uncured resin material 14'.

The composition may contain, for example, the above-mentioned other components in addition to the resin material 14'. Further, the composition may contain a solvent. When the composition contains a solvent, the vapor chamber manufacturing member 10'can be obtained by impregnating the fiber base material 13 with the composition and then volatilizing the solvent.

The composition may be applied, for example, from the surface side corresponding to the first surface 11 of the fiber base material 13 or from the surface side corresponding to the second surface 12 of the fiber base material 13. Alternatively, the fiber base material 13 may be applied from both sides of the surface corresponding to the first surface 11 and the surface corresponding to the second surface 12.

Examples of the method of applying the composition to the fiber base material 13 include a coating method, a spraying method, and a dipping method.

[3-2] First Joining Step In the first joining step, the vapor chamber manufacturing member 10'is joined to the first sheet material 21 on the first surface 11 which is one of the surfaces (1b). ).

The uncured resin material 14'constituting the vapor chamber manufacturing member 10'is brought into contact with the first sheet material 21 and further pressure is applied so that the resin material 14'can be suitably joined. By heating in addition to pressure, more suitable bonding can be achieved.

[3-3] Exposure Step In the exposure step, the vapor chamber manufacturing member 10'bonded to the first sheet material 21 is irradiated with light E in a predetermined pattern (1c).

As a result, the portion of the resin material 14'that is irradiated with the light E is selectively cured to become the resin cured product 14. That is, it is possible to form a cured portion corresponding to a portion to be a flow path wall 16 made of the cured resin product 14 with a pattern corresponding to the irradiation pattern of light E.

The curing reaction in this step may be allowed to proceed to the extent that the uncured resin material 14'can be removed while the cured resin material 14 remains in the subsequent developing step, and the curing reaction can be completely advanced. It does not have to be.

The type of light E to be irradiated in this step is determined according to the type of the resin material 14', but is preferably ultraviolet light.

As a result, the resin material 14'can be suitably cured by an exposure treatment in a relatively short time, and the productivity of the vapor chamber 100 can be further improved.

The exposure step may be performed by scanning light such as laser light in a predetermined pattern, but it can be preferably performed by using a photomask.

[3-4] Development Step In the development step, the uncured resin material 14'of the portion not irradiated with the light E in the exposure step is removed (1d).

As a result, the resin material 14'can be removed while leaving the cured resin product 14 and the fiber 131. As a result, a predetermined pattern, that is, a portion to be the flow path wall 16 of the pattern corresponding to the irradiation pattern of the light E can appear.

The developing step can be preferably performed by using a developing solution that selectively dissolves the resin material 14'and does not dissolve the cured resin material 14.

The composition of the developer differs depending on the resin material 14', the cured resin material 14, etc., but for example, when the resin material 14'contains the alkali-soluble resin as described above, sodium hydroxide, tetramethylammonium hydroxide, etc. An alkaline aqueous solution such as the above can be preferably used.

[3-5] Second Joining Step In the second joining step, the vapor chamber manufacturing member 10'that has undergone the developing step is placed on the second surface 12 that is the surface opposite to the first surface 11. It is joined to the second sheet material 22 (1e).

The second sheet material 22 and the vapor chamber manufacturing member 10'may be joined to each other, for example, by applying an adhesive to the second sheet material 22 or the vapor chamber manufacturing member 10', but the resin material. When a material satisfying the above-mentioned conditions as 14'(especially a material containing an alkali-soluble resin and a photopolymerizable resin and a thermosetting resin different from the alkali-soluble resin) is used, the vapor chamber manufacturing member 10'and the first By heating after contacting the sheet material 22 of 2, the thermosetting resin develops adhesiveness in the process of thermosetting, and the second sheet material 22 and the member 10'(wick structure) for manufacturing a vapor chamber are exhibited. The bonding strength with the body 10) can be made particularly excellent. Similarly, the joint strength between the first sheet material 21 and the vapor chamber manufacturing member 10'(wick structure 10) can be particularly excellent.

In this case, the heating temperature in this step is preferably 80 ° C. or higher and 250 ° C. or lower, more preferably 90 ° C. or higher and 220 ° C. or lower, and further preferably 100 ° C. or higher and 200 ° C. or lower.

As a result, the above-mentioned effects are more remarkably exhibited while more effectively preventing unintentional deterioration and the like of the constituent materials of the vapor chamber 100. In addition, the productivity of the vapor chamber 100 can be further improved.

Further, in this step, heating under different conditions may be combined. Specifically, for example, a heat treatment in a pressurized state (thermocompression bonding) and a subsequent heat treatment in a state where the pressurized state is released (post-cure) may be performed in combination.

The heating time in this step is preferably 0.1 minutes or more and 600 minutes or less.
As a result, the above-mentioned effects are more remarkably exhibited while more effectively preventing unintentional deterioration and the like of the constituent materials of the vapor chamber 100. In addition, the productivity of the vapor chamber 100 can be further improved.

As described above, when the heat treatment in the pressurized state (thermocompression bonding) and the subsequent heat treatment in the state where the pressurized state is released (post-cure) are performed in combination, the heat treatment in the pressurized state (heat crimping). The treatment time for thermocompression bonding) is preferably 0.1 minutes or more and 10 minutes or less, and the treatment time for heat treatment (post-cure) in a state where the pressurized state is released is 20 minutes or more and 480 minutes or less. It is preferable to have it.

[3-6] Hydraulic fluid supply / sealing step In the hydraulic fluid supply / sealing step, the hydraulic fluid 30 is injected into the space between the first sheet material 21 and the second sheet material 22, and the space is sealed. (1f).

The hydraulic fluid 30 can be suitably injected, for example, in a state where the space between the first sheet material 21 and the second sheet material 22 is depressurized by evacuation.

By reducing the pressure in the space between the first sheet material 21 and the second sheet material 22, the boiling point of the hydraulic fluid 30 can be lowered, and the evaporation and condensation cycles of the hydraulic fluid 30 can be performed more efficiently. Therefore, the heat transport effect and the soaking effect can be further enhanced.

After the injection of the hydraulic fluid 30, the injection portion of the hydraulic fluid 30 is sealed, and the space in which the wick structure 10 and the hydraulic fluid 30 are housed is hermetically and airtightly sealed.

The space in which the wick structure 10 and the hydraulic fluid 30 are housed is sealed by forming the sealing portion 23.

Examples of the method for forming the sealing portion 23 include plating up, laser welding, seam welding, cold pressure welding, diffusion bonding, brazing, and bonding.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-mentioned ones, and modifications, improvements, etc. within the range in which the object of the present invention can be achieved are included in the present invention. Is.

For example, the method for manufacturing a vapor chamber of the present invention may further include other steps in addition to the above-mentioned steps.

Further, the vapor chamber of the present invention is not limited to the one manufactured by the above-mentioned method, and may be manufactured by any method.

Further, in the above-described embodiment, the case where the member for manufacturing the vapor chamber of the present invention and the wick structure constituting the vapor chamber of the present invention contain fibers in the form of a sheet-shaped fiber base material (fiber sheet) is central. As described above, the member for manufacturing the vapor chamber of the present invention and the wick structure constituting the vapor chamber of the present invention may contain fibers in any form, and include the fibers in a form other than the sheet-shaped fiber base material. May be.

Further, in the above-described embodiment, the case where the vapor chamber is used for the purpose of transferring the heat of the heat generating member to a predetermined place has been mainly described, but the vapor chamber is, for example, local to the heat generating member. It may be used for the purpose of equalizing the heat of the high temperature portion.

Hereinafter, the present invention will be described in detail based on examples, but the present invention is not limited thereto.

[4] Manufacture of a member for manufacturing a vapor chamber and a vapor chamber (Example 1)
1. 1. Alkali-soluble resin (synthesis of a resin having an alkali-soluble group and a double bond (curable resin curable by both light and heat: methacryl-modified bisphenol A novolak resin: MPN))

A 60% solid content methyl ethyl ketone (MEK) solution of bisphenol A novolak resin (Phenolite LF-4871, manufactured by Dainippon Ink and Chemicals Co., Ltd.) was placed in a 2 L flask, and tributylamine as a catalyst: 1.5 g. , And 0.15 g of hydroquinone as a polymerization inhibitor was added and heated to 100 ° C.

Then, 180.9 g of glycidyl methacrylate was added dropwise to the above mixture over 30 minutes, and the mixture was stirred and reacted at 100 ° C. for 5 hours to obtain a methacryl-modified bisphenol A novolak resin having a non-volatile content of 74%. The modification rate of the methacryl-modified bisphenol A novolak resin (alkali-soluble resin) thus obtained was 50%.

2. 2. Preparation of resin varnish Methyl-modified bisphenol A novolak resin (MPN) synthesized as described above as an alkali-soluble resin (curable resin curable by both light and heat): 31.74 parts by mass, photopolymerizable resin Acrylic resin monomer liquid at room temperature (manufactured by Shin-Nakamura Chemical Co., Ltd., NK ester 3G): 9.83 parts by mass, bisphenol A novolak type epoxy resin as a thermosetting resin (manufactured by Dainippon Ink and Chemicals Co., Ltd., Epicron N) -865): 19.84 parts by mass, silicone epoxy resin (manufactured by Toray Dow Corning Silicone, BY16-115): 3.63 parts by mass, and silica as a particulate filler (manufactured by Nippon Catalyst Co., Ltd., KE-P30, average particle size: 0.28 μm, maximum particle size: 0.9 μm): 33.71 parts by mass is weighed, and methyl ethyl ketone (MEK) is further added so that the resin component concentration becomes 71% by mass. Prepared. Then, the mixture was stirred until the bisphenol A novolak type epoxy resin (N-865) was dissolved.

Next, silica was dispersed using a bead mill (bead diameter 400 μm, processing speed 6 g / s, 5 passes).

Then, a curing agent (photosensitizer) (Ciba Specialty Chemicals, Inc., Irgacure 651): 1.25 parts by mass was further added, and the mixture was stirred with a stirring blade (450 rpm) for 1 hour to obtain a resin varnish. rice field.

3. 3. Manufacture of adhesive film A part of the resin varnish prepared in "2. Preparation of resin varnish" is applied to a support base polyester film (manufactured by Mitsubishi Polyester Film Co., Ltd., T100G, thickness 25 μm) with a comma coater and at 80 ° C. It was dried for 10 minutes to form a film, and an adhesive film having a thickness of 65 μm was obtained.

4. Manufacture of parts for manufacturing vapor chamber A part of the resin varnish prepared in "2. Preparation of resin varnish" is impregnated with glass woven cloth (Unitika Ltd., # 1078, thickness 46 μm) and heated in a heating furnace at 100 ° C. Drying for 3 minutes gave a prepreg with a thickness of 50 μm.

Next, two prepregs thus obtained are laminated, and a photosensitive adhesive film having a thickness of 65 μm manufactured in the above “3. Production of adhesive film” is laminated on both sides thereof, and a laminating roll at 80 ° C. A member for manufacturing a vapor chamber having a thickness of 230 μm (first photosensitive adhesive film layer: 65 μm, prepreg: 100 μm, second photosensitive adhesive film layer: 65 μm) was obtained (see FIG. 1). Further, after that, the member for manufacturing the vapor chamber was cut into a size of outer dimensions of 15 mm × 100 mm.

The vapor chamber manufacturing member thus obtained is in the form of a sheet having a thickness of 230 μm, contains an uncured resin material, and is centered in the thickness direction as shown in FIG. There was a fiber substrate in the vicinity, and no fibers were present on both sides of the vapor chamber manufacturing member.

5. Manufacture of Vapor Chamber First, a member for manufacturing a vapor chamber (outer dimensions: 15 mm × 100 mm) obtained as described above is prepared (a process for preparing a member for manufacturing a vapor chamber), and one surface thereof is a first surface. In, using the adhesiveness of the uncured resin material constituting the member for manufacturing the vapor chamber, it is joined to a copper sheet material (outer dimensions: 15 mm × 100 mm, thickness: 35 μm) as the first sheet material. (First joining step).

Next, light is applied to the vapor chamber manufacturing member joined to the first sheet material by using a photomask provided with an opening (light transmitting portion) in a pattern corresponding to the flow path wall to be formed. Irradiation (exposure) was performed (exposure step). The exposure was carried out using a mercury lamp having a main wavelength of 365 nm under the condition of an exposure amount of 500 mJ / cm ² .

Next, a 3% by mass tetramethylammonium hydroxide (TMAH) aqueous solution, which is an alkaline aqueous solution, was used as a developing solution, and treatment was performed under the conditions of a developing solution pressure: 0.2 MPa and a developing time: 300 seconds. The uncured resin material in the portion not irradiated with light was removed (development step).

Next, the member for manufacturing the vapor chamber that has undergone the developing step is formed into a copper sheet material (thickness: 35 μm) as the second sheet material on the second surface, which is the surface opposite to the first surface. They were brought into contact and pressed with a pressure of 0.3 MPa. In this state, thermocompression bonding is performed at 185 ° C. for 60 minutes, and then heat treatment (post-cure) at 180 ° C. for 1 hour is performed in an oven to strengthen the vapor chamber manufacturing member and the second sheet material. After that, the wick structure formed by using the member for manufacturing the vapor chamber is firmly bonded to the first sheet material on the first surface, and the second sheet material is firmly bonded to the wick structure. A bonded body firmly bonded to the second sheet material on the surface was obtained (second bonding step).

The peripheral edge of the first sheet material and the second sheet material (excluding the hydraulic fluid injection port) is sealed by solder bonding, and then, in the space between the first sheet material and the second sheet material, 80 mg of pure water as the hydraulic fluid was injected, and the hydraulic fluid injection port was sealed with solder (hydraulic fluid supply / sealing step). As a result, a vapor chamber as shown in FIG. 6 was obtained.

The wick structure provided in the vapor chamber thus obtained has a thickness of 230 μm, has a structure as shown in FIG. 9, extends in the longitudinal direction thereof, and is made of a material containing a cured resin product. It is configured and has a plurality of parts that function as a flow path wall of the hydraulic fluid, and the distance between adjacent flow path walls (that is, the width of the flow path portion) is 500 μm, and the width of the flow path wall is 100 μm. rice field.

(Example 2)
Methacrylate-modified bisphenol A novolak resin (MPN) synthesized in the same manner as described in Example 1: 50 parts by mass, acrylic resin monomer liquid at room temperature as a photopolymerizable resin (light ester TMP manufactured by Kyoeisha Chemical Co., Ltd.) ): 15.5 parts by mass, bisphenol A novolak type epoxy resin as a thermosetting resin (manufactured by Mitsubishi Chemical Co., Ltd., 1032H60): 18 parts by mass, bisphenol F type epoxy resin (manufactured by DIC, EPICLON 830): 5 parts by mass , Phenol novolak resin (Sumitomo Bakelite Co., Ltd., PR-53647): 9 parts by mass, curing agent (photosensitive agent) (Ciba Specialty Chemicals Co., Ltd., Irgacure 651): 2.5 parts by mass, and further methyl ethyl ketone (manufactured by Ciba Specialty Chemicals Co., Ltd., Irgacure 651). MEK) was added to prepare a resin varnish so that the concentration of the resin component was 50% by mass.

An adhesive film, a member for manufacturing a vapor chamber, and a vapor chamber were manufactured in the same manner as in Example 1 except that the resin varnish thus obtained was used.

(Example 3)
A vapor chamber was manufactured in the same manner as in Example 2 except that the injection amount of pure water as a hydraulic fluid was changed from 80 mg to 160 mg.

(Example 4)
A vapor chamber was manufactured in the same manner as in Example 2 except that the injection amount of pure water as a hydraulic fluid was changed from 80 mg to 40 mg.

(Example 5)
First, an adhesive film was produced in the same manner as in Example 2 except that the thickness was set to 40 μm.

Then, the number of prepregs used for laminating in the production of the vapor chamber manufacturing member is changed from two to three, and the thickness of the adhesive film (first photosensitive adhesive film layer and second photosensitive adhesive film layer) is as described above. A member for manufacturing a vapor chamber and a vapor chamber were manufactured in the same manner as in Example 2 except that an adhesive film having a size of 40 μm was used.

(Example 6)
First, an adhesive film was produced in the same manner as in Example 2 except that the thickness was set to 100 μm.

Further, a part of the resin varnish prepared in Example 2 was impregnated into a glass woven cloth (manufactured by Unitika Ltd., # 1037, thickness 27 μm) and dried in a heating furnace at 100 ° C. for 3 minutes to a thickness of 30 μm. I got a prepreg.

Then, the above-mentioned 100 μm-thick adhesive film was laminated on both sides of one 30 μm-thick prepreg and bonded using a laminating roll at 80 ° C. to have a thickness of 230 μm (first photosensitive adhesive film layer: 100 μm). , Prepreg: 30 μm, second photosensitive adhesive film layer: 100 μm) to obtain a member for manufacturing a vapor chamber. Further, after that, the member for manufacturing the vapor chamber was cut into a size of outer dimensions of 15 mm × 100 mm.

After that, the vapor chamber was manufactured in the same manner as in Example 1 except that the member for manufacturing the vapor chamber was used.

(Example 7)
First, an adhesive film was produced in the same manner as in Example 2 except that the thickness was set to 90 μm.

Further, a part of the resin varnish prepared in Example 2 was impregnated into a glass woven cloth (manufactured by Unitika Ltd., # 1078, thickness 46 μm) and dried in a heating furnace at 100 ° C. for 3 minutes to a thickness of 50 μm. I got a prepreg.

Then, the above-mentioned 90 μm-thick adhesive film was laminated on both sides of one 50 μm-thick prepreg and bonded using a laminating roll at 80 ° C. to have a thickness of 230 μm (first photosensitive adhesive film layer: 90 μm). , Prepreg: 50 μm, second photosensitive adhesive film layer: 90 μm) to obtain a member for manufacturing a vapor chamber. Further, after that, the member for manufacturing the vapor chamber was cut into a size of outer dimensions of 15 mm × 100 mm.

After that, the vapor chamber was manufactured in the same manner as in Example 1 except that the member for manufacturing the vapor chamber was used.

(Example 8)
Except for the fact that the first photosensitive adhesive film layer manufactured to have a thickness of 40 μm was used and the second photosensitive adhesive film layer manufactured to have a thickness of 90 μm was used. A vapor chamber was manufactured in the same manner as in Example 2.

(Example 9)
The first photosensitive adhesive film layer manufactured to have a thickness of 40 μm was used, and the second photosensitive adhesive film layer manufactured to have a thickness of 40 μm was used, and the pure hydraulic solution was used. A vapor chamber was manufactured in the same manner as in Example 2 except that the injection amount of water was changed from 80 mg to 40 mg.

(Example 10)
A vapor chamber was manufactured in the same manner as in Example 9 except that one of the prepregs manufactured in Example 7 was used.

(Example 11)
The first sheet material was manufactured by using a first photosensitive adhesive film layer having a thickness of 88 μm and using a second photosensitive adhesive film layer having a thickness of 88 μm. A vapor chamber was manufactured in the same manner as in Example 2 except that GTS-MP (12 μm thickness) manufactured by Furukawa Electric Co., Ltd. was used as the second sheet material.

(Example 12)
Methacrylate-modified bisphenol A novolak resin (MPN) synthesized in the same manner as described in Example 1: 60 parts by mass, acrylic resin monomer liquid at room temperature as a photopolymerizable resin (light ester TMP manufactured by Kyoeisha Chemical Co., Ltd.) ): 10.5 parts by mass, bisphenol A novolak type epoxy resin as a thermosetting resin (manufactured by Mitsubishi Chemical Co., Ltd., 1032H60): 18 parts by mass, phenol novolac resin (manufactured by Sumitomo Bakelite Co., Ltd., PR-53647): 9 parts by mass. , Hardener (photosensitive agent) (manufactured by Ciba Specialty Chemicals, Irgacure 651): Weigh 2.5 parts by mass, and add methyl ethyl ketone (MEK) to make the resin component concentration 50% by mass. A varnish was prepared.

An adhesive film, a member for manufacturing a vapor chamber, and a vapor chamber were manufactured in the same manner as in Example 1 except that the resin varnish thus obtained was used.

(Example 13)
Cyclomer P (manufactured by Dycel Ornex) as an alkali-soluble resin (curable resin that can be cured by both light and heat): 69 parts by mass, acrylic resin monomer liquid at room temperature as a photopolymerizable resin (Shin-Nakamura Kagaku) NK ester 3G): 16 parts by mass, bisphenol A novolak type epoxy resin as a thermosetting resin (Epicron N-865, manufactured by Dainippon Ink and Chemicals, Inc.): 5 parts by mass, bisphenol F type epoxy resin (DIC) EPICLON 830): 3 parts by mass, phenol novolac resin (Sumitomo Bakelite, PR-53647): 5 parts by mass, curing agent (photosensitizer) (Ciba Specialty Chemicals, Irgacure 651): 2. 0 parts by mass was weighed, and methyl ethyl ketone (MEK) was further added to prepare a resin varnish so that the resin component concentration was 50% by mass.

An adhesive film, a member for manufacturing a vapor chamber, and a vapor chamber were manufactured in the same manner as in Example 1 except that the resin varnish thus obtained was used.

(Comparative Example 1)
The first photosensitive adhesive film layer manufactured to have a thickness of 115 μm was used, and the second photosensitive adhesive film layer manufactured to have a thickness of 115 μm was used without using a prepreg. A vapor chamber was manufactured in the same manner as in Example 2 except that the first photosensitive adhesive film layer and the second photosensitive adhesive film layer were directly bonded.

The configurations of the vapor chambers of the above-mentioned Examples and Comparative Examples are summarized in Tables 1 and 2. In the table, the constituent material of the adhesive film of the member for manufacturing the vapor chamber in Example 1 is "C-1", and the constituent material of the adhesive film of the member for manufacturing the vapor chamber in Example 2 is "C-2". The constituent material of the adhesive film of the member for manufacturing the vapor chamber in Example 12 is shown as "C-12", and the constituent material of the adhesive film of the member for manufacturing the vapor chamber in Example 13 is shown as "C-13". Further, in Tables 1 and 2, the values of Xf / Xr when the fiber content in the vapor chamber manufacturing member is Xf [mass%] and the resin material content is Xr [mass%]. Also shown.

[5] Evaluation We prepared a ceramic heater (manufactured by Sakaguchi Electric Heat Co., Ltd., product number: Ultramic, heater unit 12 mm square, 2.5 mm thickness) whose output of the heater unit can be changed and the temperature inside the heater can be measured.

When the ceramic heater was output to 4 W and 7 W, the heater internal temperature was 225 ° C and 310 ° C, respectively.

Next, the ceramic heater was output to 4W and 7W, respectively, and the end portion of the vapor chamber manufactured in each of the above Examples and Comparative Examples was placed on the heater section, and the temperature when the temperature inside the heater became stable was measured. ..
These results are summarized in Tables 3 and 4.

As is clear from Tables 3 and 4, in Comparative Example 1 in which the fiber base material was not used for the vapor chamber manufacturing member, the temperature of the ceramic heater decreased by 30 ° C. at both 4W and 7W outputs. In the vapor chambers of each of the above-mentioned examples, the temperature decrease was much larger than that, and good heat transport capacity was shown.

Further, it was confirmed that all of the vapor chambers according to the above-mentioned Examples were excellent in flexibility (flexibility).

Further, the thickness of the fiber base material constituting the member for manufacturing the vapor chamber is variously changed within the range of 10 μm or more and 1000 μm or less, and the thickness of the member for manufacturing the vapor chamber is variously changed within the range of 10 μm or more and 2000 μm or less. However, the value of Xf / Xr in the vapor chamber manufacturing member when the fiber content is Xf [mass%] and the resin material content is Xr [mass%] is 0.01 or more and 8.0 or less. A vapor chamber was manufactured in the same manner as described above except that various changes were made within the above range, and evaluation was performed in the same manner as described above. As a result, an excellent effect as described above was obtained.

Further, by changing the method of applying the resin varnish to the fiber base material, the vapor chamber manufacturing member is manufactured as shown in FIGS. 2 and 4, and these vapor chamber manufacturing members are used. A vapor chamber was manufactured in the same manner as described above except that the cross-sectional structure was as shown in FIGS. 5, 7, and 8, and the evaluation was performed in the same manner as described above. was gotten.

Further, in the same manner as above, except that a woven fabric composed of fibers composed of paraphenylene benzobisoxazole, which is an aromatic resin containing a heterocyclic ring in the molecule, was used instead of the glass woven fabric. When a vapor chamber was manufactured and evaluated in the same manner as described above, an excellent effect as described above was obtained.

100: Vapor chamber 10: Wick structure 10': Vapor chamber manufacturing member 11: First surface 12: Second surface 13: Fiber base material (fiber sheet)
131: Fiber 14': Resin material 14: Resin cured product 15: Flow path part 16: Flow path wall 20: Container 21: First sheet material 22: Second sheet material 23: Sealing part 30: Hydraulic liquid S : Interval L: Width E: Light (exposure light)

Claims (12)

It is a member for manufacturing a vapor chamber used for manufacturing a vapor chamber.
A member for manufacturing a vapor chamber, which comprises a fiber and an uncured resin material. It is a member for manufacturing a vapor chamber used for manufacturing a vapor chamber.
A member for manufacturing a vapor chamber, which comprises a fiber base material composed of fibers and an uncured resin material invading the fiber base material. The member for manufacturing a vapor chamber according to claim 2, wherein the thickness of the fiber base material is 10 μm or more and 1000 μm or less. The member for manufacturing a vapor chamber according to claim 2 or 3, wherein the member for manufacturing a vapor chamber has a thickness of 10 μm or more and 2000 μm or less. The member for manufacturing a vapor chamber according to any one of claims 1 to 4, wherein the fiber is composed of an aromatic resin containing a heterocycle in the molecule. When the content of the fiber in the vapor chamber manufacturing member is Xf [mass%] and the content of the resin material is Xr [mass%], the relationship of 0.01≤Xf / Xr≤8.0 is established. The member for manufacturing a vapor chamber according to any one of claims 1 to 5. The member for manufacturing a vapor chamber according to any one of claims 1 to 6, wherein the resin material contains an alkali-soluble resin and a photopolymerizable resin. The member for manufacturing a vapor chamber according to claim 7, wherein the alkali-soluble resin contains a (meth) acrylic group and a phenolic hydroxyl group. The member for manufacturing a vapor chamber according to claim 7 or 8, wherein the resin material further contains a thermosetting resin different from the alkali-soluble resin. A container with a hollow inside and
The wick structure arranged in the cavity and
A vapor chamber having a hydraulic fluid arranged in the cavity.
The wick structure is made of a material containing a cured resin product and fibers, and the fibers are arranged in a part of a flow path portion of the working liquid to which the cured resin product is not arranged. A vapor chamber characterized by that. The vapor chamber according to claim 10, wherein the wick structure is formed by using the member for manufacturing the vapor chamber according to any one of claims 1 to 9. A step of preparing a member for manufacturing a vapor chamber, which prepares the member for manufacturing a vapor chamber according to any one of claims 1 to 9.
The first joining step of joining the vapor chamber manufacturing member to the first sheet material on the first surface, which is one of the surfaces,
An exposure step of irradiating the vapor chamber manufacturing member joined to the first sheet material with light in a predetermined pattern.
A developing step of removing the uncured resin material at a portion not irradiated with the light in the exposure step, and a developing step of removing the uncured resin material.
A second joining step of joining the vapor chamber manufacturing member that has undergone the developing step to a second sheet material on a second surface that is a surface opposite to the first surface.
A method for manufacturing a vapor chamber, which comprises injecting a hydraulic fluid into a space between the first sheet material and the second sheet material, and having a hydraulic fluid supply / sealing step for sealing the space. ..

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