JP2022016435A - Luminaire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a luminaire in the embodiment of this invention capable of suppressing grainy feelings due to the brightness of light-emitting devices.

SOLUTION: A diffusion member 3 is a lens member which enables the improvement of the irradiation light uniformity ratio of light emitted from a plurality of light-emitting elements 22, and furthermore suppresses grainy feelings due to the brightness of the light-emitting elements 22. The diffusion member 3 is formed with a flat part 33 to cover the whole surface of a base plate 21, and so a charging part is covered with the diffusion member 3 and protected.

SELECTED DRAWING: Figure 3

COPYRIGHT: (C)2022,JPO&INPIT

Description

An embodiment of the present invention relates to a light emitting device and a lighting fixture using a light emitting element such as an LED.

Recently, with the increase in output, efficiency and widespread use of LEDs, lighting fixtures that use LEDs as a light source and are expected to have a long life indoors or outdoors have been developed. In such a lighting fixture, a plurality of LEDs are mounted on a substrate so as to obtain a predetermined amount of light.

When the temperature of a light emitting element such as a peak or an LED rises, the light output decreases and the service life of the light emitting element becomes shorter. For this reason, for lighting equipment that uses a solid-state light-emitting element such as an LED or EL element as a light source, the temperature of the light-emitting element is suppressed from rising in order to extend the service life and improve characteristics such as luminous efficiency. It is necessary.

Japanese Unexamined Patent Publication No. 2008-12408

However, in the above-mentioned conventional lighting equipment, the manufacturing process may be complicated.

An object of the luminaire according to the embodiment of the present invention is to provide a luminaire capable of suppressing a grainy feeling due to the brightness of a light emitting element.

The luminaire according to the embodiment of the present invention is a luminaire in which the central portion on the back side is mounted on the ceiling, and the luminaire body formed in a circular shape; a plurality of light emitting elements and the plurality of light emitting elements are connected in series. It has a plurality of arcuate substrates having a line and an end of the line, and is attached to the front side of the instrument body so that the plurality of boards are joined together and surrounds the central portion of the instrument body. A light emitting device formed in a circle as a whole; a diffuser member integrally covered from the front side of the plurality of substrates and attached to the front side of the fixture body; A cover member attached to the front surface side; and a cover receiving member arranged on the outer peripheral side of the lighting fixture main body from the position where the light emitting device is attached and to which the cover member can be detachably attached; The end of the line is connected to the end of the line of another adjacent substrate and is integrally covered with the diffusion member.

According to the embodiment of the present invention, it is possible to provide a lighting fixture capable of suppressing a feeling of graininess due to the brightness of the light emitting element.

It is a perspective view which shows the lighting equipment which concerns on embodiment of this invention. It is an exploded perspective view which shows the lighting fixture. It is a schematic plan view which shows from the lower side by removing a cover member and a lighting device cover in the luminaire. It is sectional drawing which shows the lighting fixture. FIG. 4 is an enlarged view showing a range surrounded by a dotted line in FIG. It is a top view which shows the substrate in the lighting fixture. It is a top view which shows the same one substrate. It is a top view which shows the wiring pattern layer of the substrate. It is a top view which shows the state which formed the reflective layer on the substrate. 9 is a plan view showing the positional relationship of the light emitting elements in FIG. 9. It is a partial enlarged view in FIG. 11 is a plan view showing the positional relationship of the light emitting elements in FIG. 11. It is a wiring diagram which shows the connection state of a light emitting element. It is sectional drawing which shows the installation completion state to the ceiling surface of the luminaire.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 14. In each figure, the wiring connection relationship by the lead wire or the like may be omitted. The same parts are designated by the same reference numerals, and duplicated explanations will be omitted.

The lighting fixture of the present embodiment is for a general house used by being attached to a hook sealing body as a wiring fixture installed on the fixture mounting surface, and has a plurality of light emitting elements mounted on a substrate. The room is illuminated by the light emitted from the device.

In FIGS. 1 to 4, the lighting fixture includes a fixture main body 1, a light emitting device 2, a diffusion member 3, a lighting device 4, a lighting device cover 5, a mounting portion 6, and a cover member 7. .. Further, the adapter A is electrically and mechanically connected to the hook ceiling body Cb installed on the ceiling surface C as the fixture mounting surface. Such a luminaire is formed in a round circular appearance, and the front side is a light irradiation surface and the back side is a mounting surface to the ceiling surface C.

As shown in FIGS. 2 to 5, the main body 1 is a chassis formed in a circular shape from a flat plate of a metal material such as a cold-rolled steel plate, and a mounting portion 6 to be described later is arranged in a substantially central portion thereof. Circular opening 11 is formed. Further, on the outer peripheral side of the flat portion 12 on the inner surface side to which the light emitting device 2 is attached, a stepped portion 13 toward the back surface side is formed to form a gutter-shaped recess 14. A cover receiving member to which the cover member 7 is detachably attached is arranged on the step portion 13. More specifically, the cover receiving member is a cover receiving metal fitting 75, and is arranged in a recess 14 formed by the step portion 13. Further, spring members 15 for mounting lighting fixtures are provided at four locations on the back surface side of the main body 1. The spring member 15 is made of a metal such as stainless steel, and is formed by bending a substantially rectangular leaf spring.

As shown in FIGS. 2 to 6, the light emitting device 2 includes a substrate 21 and a plurality of light emitting elements 22 mounted on the substrate 21 (in FIG. 2, the light emitting element 22 is not shown). Yes). The substrate 21 is arranged so that four arc-shaped substrates 21 having a predetermined width dimension are joined together, and is formed in a substantially circular shape as a whole. That is, the substrate 21 formed in a substantially circular shape as a whole is composed of four divided substrates 21.

By using the substrate 21 divided in this way, it is possible to absorb the thermal shrinkage at the divided portion of the substrate 21 and suppress the deformation of the substrate 21. It is preferable to use the substrate 21 divided into a plurality of parts, but it is also possible to use a single substrate integrally formed in a substantially circle shape.

The substrate 21 is made of a flat plate of glass epoxy resin which is an insulating material, and a wiring pattern is formed by copper foil on the surface side. Further, a white resist layer acting as a reflective layer is applied on the wiring pattern, that is, on the surface of the substrate 21. When the material of the substrate 21 is an insulating material, a ceramic material or a synthetic resin material can be applied. Further, in the case of being made of metal, a metal base substrate in which an insulating layer is laminated on one surface of a base plate having good thermal conductivity and excellent heat dissipation such as aluminum can be applied.

The light emitting element 22 is an LED, which is a surface mount type LED package. The LED packages are arranged in a plurality of rows along the circumferential direction of the plurality of circle-shaped substrates 21, that is, on a substantially circumferential circumference centered on the mounting portion 6, and in the present embodiment, in two rows on the inner peripheral side and the outer peripheral side. It has been implemented throughout. Further, as the LED package, one having a neutral white color N and one having a light bulb color L are used, and these are arranged alternately or in a mixed manner, and the adjacent light emitting elements 22 in each row are predetermined. Are arranged at intervals.

The specific substrate 21a (on the right side in FIGS. 3 and 6) has a light emitting element 22a for a nightlight.

It is implemented. For the light emitting element 22a, an LED package having the same specifications as that of the light bulb color in the main light source mounted in a circle is used. As a result, the members are standardized.

The light emitting elements 22 do not necessarily have to be mounted in a plurality of rows. For example, it may be mounted in one row along the circumferential direction. The number and number of rows of the light emitting elements 22 can be appropriately set according to the desired output.

The LED package is roughly composed of an LED chip arranged in a main body made of ceramics or synthetic resin, and a translucent resin for molding such as an epoxy resin or a silicone resin that seals the LED chip. It is configured. The LED chip is a blue LED chip that emits blue light. A phosphor is mixed in the translucent resin so that light of neutral white or light bulb color can be emitted. Further, the main body is provided with an anode-side electrode and a cathode-side electrode connected to the LED chip.

Next, the configuration of the light emitting device 2 will be described in detail with reference to FIGS. 7 to 13. 7 to 10 show one of the divided substrates 21, and FIGS. 11 and 12 show a partially enlarged state.

First, in FIG. 7, the substrate 21 is formed by laminating a wiring pattern layer 21a on an insulating surface and further laminating a reflective layer 21b on the wiring pattern layer 21a. A plurality of surface mount type LED packages, which are light emitting elements 22, are mounted on the substrate 21 in two rows. The LED package has a substantially rectangular parallelepiped shape in appearance, and the anode side electrode Ae is provided on one short side, and the cathode side electrode Ce is provided on the other short side. .. For the sake of explanation, the short side of the electrode Ce on the cathode side is shown by a thick line.

FIG. 8 shows the wiring pattern layer 21a on the substrate 21. The wiring pattern layer 21a is formed so that the pattern of the copper foil is formed by etching and covers the surface of the substrate 21 over substantially the entire surface.

The wiring pattern layer 21a is divided into a plurality of blocks by a linear insulating region i corresponding to the number of mounted light emitting elements 22, and the electrodes Ae on the anode side and the electrodes Ce on the cathode side of the light emitting element 22 are between the blocks. It is designed to be connected across a relatively narrow linear insulating region i.

The wiring pattern layer 21a is an electrical conduction path that supplies electric power to the light emitting element 22, and also has a function as a heat spreader that diffuses heat generated from the light emitting element 22.

FIG. 9 shows a state in which the reflective layer 21b is formed on the wiring pattern layer 21a on the substrate 21. The reflective layer 21b is formed over substantially the entire surface except for a portion on which each light emitting element 22 is mounted and a portion to which the electrodes Ae and Ce are connected and a portion to which the connector is connected. That is, the wiring pattern layer 21a is exposed on the surface of the portion where each light emitting element 22 is mounted and the electrodes Ae and Ce are connected and the portion where the connector is connected.

Specifically, the reflective layer 21b is formed by using a white photosolder type resist ink material, and is a white resist layer having a good light reflectance. This resist layer is formed to have a film thickness dimension of about 40 μm.

FIG. 10 shows the wiring pattern layer 21a corresponding to a state in which the reflection layer 21b is formed on the wiring pattern layer 21a, that is, a portion to which the electrode Ae on the anode side and the electrode Ce on the cathode side of the light emitting element 22 are connected. In order to show the positional relationship with the light emitting element 22 in the state where is exposed on the surface, the case where only a part (two) of the light emitting elements 22 is mounted is shown for the sake of explanation.

Subsequently, FIG. 11 shows an enlarged part of the wiring pattern layer 21a, and FIG. 12 shows the positional relationship when the light emitting element 22 (shown by the dotted line) is mounted on the wiring pattern layer 21a. ing.

As shown in FIG. 12, among a plurality of blocks partitioned by the linear insulating region i, the anode side electrode Ae and the cathode side electrode Ce of the light emitting element 22 straddle a relatively narrow linear insulating region i. Is soldered and connected to the wiring pattern layer 21a.

More specifically, the area of the region Sc on the wiring pattern layer 21a side to which the cathode side electrode Ce is connected is larger than the area Sa on the wiring pattern layer 21a side to which the electrode Ae on the anode side of the light emitting element 22 is connected. It is formed like this. That is, it is formed so that the relationship is Sa <Sc.

When the light emitting element 22 emits light, heat is mainly generated on the cathode side, and the temperature of the electrode Ce on the cathode side becomes high. Therefore, by widening the region Sc on the wiring pattern layer 21a side to which the electrode Ce on the cathode side is connected, the generated heat is effectively diffused over a wide area and dissipated to suppress the temperature rise of the light emitting element 22. It becomes possible to do.

The region Sc is wider between the region Sa on the wiring pattern layer 21a side to which the electrode Ae on the anode side of the light emitting element 22 is connected and the region Sc on the wiring pattern layer 21a side to which the electrode Ce on the cathode side is connected. If it can be formed in this way, its shape and the like are not particularly limited.

FIG. 13 shows the connection state of each light emitting element 22 on one substrate 21. Specifically, a series circuit in which six light emitting elements 22 are connected in series is composed of two lines in which four are connected in parallel. Therefore, a total of 48 light emitting elements 22 are connected. Further, these series circuits are divided into a group of light emitting elements having a neutral white emission color and a group of light emitting elements having a light bulb color, and are connected to each other. That is, the neutral white and light bulb-colored light emitting elements 22 do not coexist in one series circuit. Further, the ends of the two lines are connected to the connector Cn so that they can be connected to the connector of the adjacent board 21 or the connector on the power supply side.

The diffusion member 3 is a lens member, and as represented by FIG. 5, is made of a transparent synthetic resin having an insulating property such as polycarbonate or acrylic resin, and has a substantially circular shape along the arrangement of the light emitting element 22. It is integrally formed in the substrate 21 and is arranged so as to cover the entire surface of the substrate 21 including the light emitting element 22.

Further, the lens member has two chevrons in the circumferential direction facing the light emitting element 22 on the inner peripheral side portion and the outer peripheral side portion having a substantially circular shape, and the ridge portions 31 having a constant cross-sectional shape are continuous. Is formed. Inside the ridge portion 31, a U-shaped groove 32 is continuously formed along the circumferential direction. Therefore, the U-shaped groove 32 is arranged to face the plurality of light emitting elements 22, and the plurality of light emitting elements 22 are housed and covered in the U-shaped groove 32. It is in a state.

Further, a flat portion 33 extending in the width direction is formed from these ridge portions 31, thereby covering the entire surface of the substrate 21.

According to the lens member configured in this way, the light emitted from the plurality of light emitting elements 22 is diffused and radiated mainly in the inner peripheral direction and the outer peripheral direction on the circumference by the ridge portion 31.

That is, the light emitted from the light emitting element 22 is mainly diffused and radiated in the radial direction with the circle-shaped center where the light emitting element 22 is arranged as the origin.

Therefore, it is possible to improve the uniformity of the irradiation light by the light emitted from the plurality of light emitting elements 22 by the lens member. Further, it is possible to suppress the feeling of graininess due to the brightness of each light emitting element 22.

Further, since the flat portion 33 is formed on the diffusion member 3 to cover the entire surface of the substrate 21, the charging portion is covered and protected by the diffusion member 3.

The diffusion member 3 does not have to be integrally formed in a substantially circular shape. For example, corresponding to the divided substrates 21, each of these substrates 21 may be divided and formed. In this case, each of the plurality of light emitting elements 22 mounted on one substrate 21 is continuously covered with the diffusion member 3.

Further, the diffusion member 3 is not limited to the lens member, and a diffusion sheet or the like may be applied.

In the light emitting device 2 configured as described above, as represented by FIGS. 4 and 5, the substrate 21 is located around the mounting portion 6, and the mounting surface of the light emitting element 22 is on the front side, that is, on the front side. It is arranged so as to face the lower irradiation direction. Further, the back surface side of the substrate 21 is attached in surface contact with the flat portion 12 on the inner surface side of the main body 1. Specifically, the diffusion member 3 is overlapped from the front surface side of the substrate 21, and the diffusion member 3 is attached to the main body 1 by a fixing means such as a screw S, so that the substrate 21 becomes the main body 1 and the diffusion member 3. It is sandwiched between the two and pressed and fixed. That is, the substrate 21 and the diffusion member 3 are fastened together by one screw S.

Therefore, the substrate 21 is thermally coupled to the main body 1, and the heat from the substrate 21 is conducted to the main body 1 from the back surface side and dissipated. The surface contact between the substrate 21 and the main body 1 is not limited to the case where the entire surface of the substrate 21 comes into contact with the main body 1. It may be a partial surface contact.

In addition, since the flat portion 33 of the diffusion member 3 is in surface contact with the mounting surface side of the substrate 21, heat is transferred to the diffusion member 3 from the mounting surface side of the substrate 21 and passes through the diffusion member 3. It becomes possible to dissipate heat. That is, heat can be dissipated from the front side of the substrate 21 as well.

As shown in FIGS. 2 to 4, the lighting device 4 includes a circuit board 41 and circuit components 42 such as a control IC, a transformer, and a capacitor mounted on the circuit board 41. The circuit board 41 is formed in a substantially arc shape so as to surround the periphery of the mounting portion 6, and the adapter A side is electrically connected to the commercial AC power supply via the adapter A. Therefore, the lighting device 4 receives this AC power source to generate a DC output, supplies the DC output to the light emitting element 22 via a lead wire, and controls the lighting of the light emitting element 22.

Such a lighting device 4 is arranged between the mounting portion 6 and the light emitting device 2, that is, the substrate 21.

As shown in FIGS. 2 and 4, the lighting device cover 5 is formed in a substantially short cylindrical shape by a metal material such as a cold rolled steel plate, and is attached to the main body 1 so as to cover the lighting device 4. The side wall 51 is inclined so as to expand toward the back surface side, and the front wall 52 is formed with an opening 53 corresponding to the mounting portion 6. Therefore, a part of the light emitted from the light emitting element 22 is reflected to the front side by the side wall 51 and is effectively used. Further, an arc-shaped guide recess 54 that is concave toward the back surface is formed on the peripheral edge of the opening 53.

The mounting portion 6 is an adapter guide formed in a substantially cylindrical shape, and an engaging port 61 through which the adapter A is inserted and engaged is provided in the central portion of the adapter guide. This adapter guide is arranged corresponding to the opening 11 formed in the central portion of the main body 1. A base is formed on the outer peripheral portion of the adapter guide so as to protrude from the outer peripheral portion, and an electric auxiliary component 62 such as an infrared remote control signal receiving unit and an illuminance sensor is arranged on the base. ..

The mounting portion 6 does not necessarily have to be a member designated as an adapter guide or the like. For example, it may be an opening formed in the main body 1 or the like, and in essence, it means a member or a portion facing the hook sealing body Cb as a wiring device and to which the adapter A is engaged.

The cover member 7 is formed in a substantially circular shape from a material having a translucent property such as acrylic resin and having a milky white color, and has a non-transmissive circular decorative cover 71 in the central portion. Is installed. Further, the decorative cover 71 is formed with a light receiving window 72 having a substantially triangular shape and translucency so as to face the electrical auxiliary component 62. Further, a protruding pin 73 projecting in the inner surface direction is formed near the center of the cover member 7 on the inner surface side.

The cover member 7 is detachably attached to the outer peripheral edge of the main body 1 so as to cover the front surface side of the main body 1 including the light emitting device 2. Specifically, by rotating the cover member 7, the cover mounting bracket 74 provided on the cover member 7 is engaged with the cover receiving bracket 75 arranged in the recess 14 in the stepped portion 13 on the outer peripheral portion of the main body 1. It is attached by matching. Further, when the cover member 7 is removed, the cover member 7 can be removed by rotating the cover member 7 in the direction opposite to that at the time of mounting and disengaging the engagement between the cover mounting bracket 74 and the cover receiving bracket 75.

In the state where the cover member 7 is attached to the main body 1 in this way, the inner surface side of the cover member 7 comes into surface contact with the front wall 52 of the lighting device cover 5, mainly as shown in FIG. Therefore, it is possible to conduct heat generated from the lighting device 4 and the like to the lighting device cover 5 and further to the cover member 7 to promote heat dissipation.

Here, the cover member 7 is rotated and attached to the main body 1, but it is necessary to align the position of the light receiving window 72 so as to face the electrical auxiliary component 62. Therefore, in the present embodiment, although detailed description is omitted, the position regulating means is configured by the protruding pin 73 formed on the cover member 7 side and the guide recess 54 formed in the lighting device cover 5. .. By this position limiting means, the light receiving window 72 is positioned so as to face the electrical auxiliary component 62, and for example, the infrared remote control signal receiving unit can receive the control signal from the infrared remote control transmitter.

The adapter A is electrically and mechanically connected to the hook ceiling body Cb installed on the ceiling surface C by a hook blade provided on the upper surface side, has a substantially cylindrical shape, and has a pair on both sides of the peripheral wall. The locking portion A1 of the above is provided so as to always project toward the outer peripheral side by a built-in spring. The locking portion A1 is immersive by operating a lever provided on the lower surface side. Further, a power cord connected to the lighting device 4 is derived from the adapter A, and is connected to the lighting device 4 via a connector (see FIG. 3).

Next, the mounting state of the lighting fixture on the ceiling surface C will be described with reference to FIG. First, the adapter A is electrically and mechanically connected to the hook ceiling body Cb installed on the ceiling surface C in advance. From this state, while aligning the engaging port 61 of the adapter guide as the mounting portion 6 with the adapter A, the fixture body 1 is used for mounting the lighting fixture until the locking portion A1 of the adapter A is securely engaged with the engaging port 61 of the adapter guide. The attachment operation is performed by pushing up by hand from below against the elastic force of the spring member 15.

Next, the cover member 7 is attached to the main body 1. This is attached by rotating the cover member 7 and engaging the cover mounting bracket 74 provided on the cover member 7 with the cover receiving bracket 75 of the main body 1.

Further, when removing the lighting fixture, the cover member 7 can be removed, and the cover member 7 can be removed by operating the lever provided on the adapter A to disengage the locking portion A1 of the adapter A.

When power is supplied to the lighting device 4 in the state of being mounted on the ceiling surface C of the luminaire, the electrodes Ae on the anode side and the electrodes Ce on the cathode side of each light emitting element 22 are energized through the wiring pattern layer 21a of the substrate 21. , Each light emitting element 22 lights up. The light emitted from the light emitting element 22 is diffused in the radial direction by the diffusion member 3 that continuously covers the plurality of light emitting elements 22, and is also radiated to the front side. The light radiated to the front side is diffused and transmitted by the cover member 7 and radiated to the outside. Therefore, it is possible to improve the uniformity of the irradiation light and suppress the graininess due to the brightness of each light emitting element 22.

Further, a part of the light toward the inner peripheral side in the radial direction is reflected to the front side by the inclined side wall 51 in the lighting device cover 5, and is effectively used.

On the other hand, the heat generated from the light emitting element 22 is diffused and dissipated by the region Sc formed in a wide area on the wiring pattern layer 21a side to which the electrode Ce on the cathode side is connected.

Further, since the back surface side of the substrate 21 is thermally coupled to the main body 1, it is effectively conducted to the main body 1 and heat is dissipated over a wide area of the main body 1. Further, since the step portion 13 is located along the outer periphery of the substrate 21 in the vicinity of the outer peripheral side of the substrate 21, the heat dissipation area can be increased by the step portion 13, and the heat dissipation effect on the outer peripheral portion of the main body 1 can be increased. Can be increased.

Since the lighting device 4 is arranged between the mounting portion 6 and the substrate 21, the lighting device 4 is less susceptible to thermal influence from the substrate 21. This is because the heat of the substrate 21 is conducted toward the outer peripheral direction of the main body 1 and tends to be dissipated.

Further, since the cover member 7 is in surface contact with the lighting device cover 5, heat generated from the lighting device 4 is conducted to the lighting device cover 5 and further conducted to the cover member 7 to dissipate heat. Can be done.

In addition, since the flat portion 33 of the diffusion member 3 is in surface contact with the mounting surface side of the substrate 21, it is possible to dissipate heat from the mounting surface side of the substrate 21 via the diffusion member 3 and also from the front side. Become. Further, in this case, since the diffusion member 3 covers the entire surface of the substrate 21, the charging portion is protected.

As described above, according to the present embodiment, it is possible to provide a light emitting device and a lighting fixture capable of suppressing a temperature rise of a light emitting element by effectively utilizing the wiring pattern layer.

The present invention is not limited to the configuration of each of the above embodiments, and various modifications can be made without departing from the gist of the invention. For example, as the light emitting element, a solid light emitting element such as an LED or an organic EL can be applied, and in this case, the number of light emitting elements is not particularly limited. Further, as the lighting fixture, it can be applied to various lighting fixtures, display devices and the like used indoors or outdoors.

1 ... Instrument body, 2 ... Light emitting device, 3 ... Diffusing member (lens member), 4 ... Lighting device, 5 ... Lighting device cover, 6 ... Mounting part (adapter guide) , 7 ... Cover member, 21 ... Substrate, 21a ... Wiring pattern layer, 22 ... Light emitting element (LED), Ae ... Electrode on the anode side, Sa ... Electrode on the anode side Area to be connected, Ce ... cathode side electrode, Sc ... region to which cathode side electrode is connected, A ... adapter, C ... appliance mounting surface (ceiling surface), Cb ... Wiring equipment (hanging sealing body)

Claims (1)

The central part on the back side is a lighting fixture that is mounted on the ceiling.
With the instrument body formed in a circular shape;
It has a plurality of light emitting elements, a line in which the plurality of light emitting elements are connected in series, and a plurality of arcuate substrates having an end of the line, so that the plurality of substrates are joined together and the device main body. With a light emitting device attached to the front side of the instrument body so as to surround the central portion and formed in a circle as a whole;
With a diffusion member that is integrally covered from the front side of the plurality of substrates and attached to the front side of the instrument body;
With a cover member attached to the front side of the luminaire body so as to cover the diffusion member;
With a cover receiving member that is arranged on the outer peripheral side of the lighting fixture main body from the position where the light emitting device is attached and to which the cover member is detachably attached;
Equipped with
A luminaire characterized in that the end of a line of the substrate is connected to the end of a line of another adjacent substrate and is integrally covered with the diffusion member.

Images