JP2022014498A - Semiconductor manufacturing device and manufacturing method therefor - Google Patents

Abstract

To provide a technique which can suppress the occurrence of a defective lead frame by adjusting the height position of a die pad, if the shape of the lead frame is miniaturized.SOLUTION: A semiconductor manufacturing device 100 includes: a conveyance rail 3 on the top face of which a lead frame 1, having a die pad 2 on which a semiconductor element is loaded, can slide; a conveyance claw 4 which holds the lead frame 1 and conveys the lead frame 1 along the conveyance rail 3; a detector unit which is provided either below or on the side of the conveyance rail 3 and detects the height position of the die pad 2; a pair of movable pins 6 each provided on the conveyance rail 3 in the vertical directions to enable pressing the bottom face of the die pad 2 from the vertical directions, through an opening 7 which can expose the top face of the die pad 2 and the bottom face of the die pad 2 formed on the conveyance rail 3. Based on the detection result of the detector unit, the pair of movable pins 6 presses the die pad 2 from the vertical directions to thereby adjust the height position of the die pad 2.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to a semiconductor manufacturing apparatus capable of adjusting the height position of a die pad and a method for manufacturing a semiconductor apparatus using the same.

In a semiconductor device, if the height position of the die pad varies, the sealing resin varies, and there is a problem that the insulation characteristics and the heat dissipation property deteriorate. Conventionally, in order to ensure insulation characteristics and heat dissipation, the height position of the die pad is adjusted by moving a movable pin provided in the mold (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2015-225874

In recent years, in order to improve productivity, the number of products manufactured in one lead frame has increased, and the shape of the lead frame has become finer. Therefore, it is difficult to provide the mold with movable pins for adjusting the height positions of all the die pads existing in the lead frame.

Therefore, the height position of the die pad is detected by the laser displacement sensor when the lead frame is conveyed before the die bond, and the lead frame whose height position of the die pad is determined to be out of the standard value is removed as a defective product.

Therefore, an object of the present disclosure is to provide a technique capable of suppressing the occurrence of defective lead frames by adjusting the height position of the die pad even when the shape of the lead frame is miniaturized.

The semiconductor manufacturing apparatus according to the present disclosure holds a transport rail on which a lead frame having a die pad on which a semiconductor element is mounted can slide on an upper surface, and the lead frame, and transports the lead frame along the transport rail. A claw, a detection unit provided below or to the side of the transfer rail to detect the height position of the die pad, and a detection unit provided in the vertical direction of the transfer rail, respectively, formed on the upper surface of the die pad and the transfer rail. A pair of movable pins that can be pressed from above and below against the lower surface of the die pad via an opening that allows the lower surface of the die pad to be exposed are provided, and a pair of the movable pins are provided based on the detection result of the detection unit. Is to adjust the height position of the die pad by pressing it against the die pad from above and below.

According to the present disclosure, even when the shape of the lead frame is miniaturized, it is possible to suppress the occurrence of defective lead frames by adjusting the height position of the die pad when the lead frame is conveyed.

It is sectional drawing of the semiconductor manufacturing apparatus which concerns on Embodiment 1. FIG. It is a front view of the semiconductor manufacturing apparatus which concerns on Embodiment 1. FIG. It is a top view of the transport rail. It is a side view around the die pad in a lead frame. It is a side view which shows the state just before a pair of movable pins are pressed against a die pad. It is a side view which shows the state after a pair of movable pins are pressed against a die pad. It is a flowchart of the height position adjustment operation of the die pad in Embodiment 1. It is sectional drawing of the semiconductor manufacturing apparatus which concerns on Embodiment 2. FIG. It is a front view of the semiconductor manufacturing apparatus which concerns on Embodiment 2. FIG. It is a top view which shows the state which the camera is arranged on the side of a transport rail. It is sectional drawing of the semiconductor manufacturing apparatus which concerns on Embodiment 3. FIG. It is a front view of the semiconductor manufacturing apparatus which concerns on Embodiment 3. FIG. It is a top view of the transport rail. It is a side view which shows the state just before a pair of movable pins and a pair of clamp pins are pressed against a die pad. It is a side view which shows the state after a pair of movable pins and a pair of clamp pins are pressed against a die pad. It is a flowchart of the height position adjustment operation of the die pad in Embodiment 3. FIG.

<Embodiment 1>
The first embodiment will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of the semiconductor manufacturing apparatus 100 according to the first embodiment, and is a cross-sectional view cut along the longitudinal direction on one end side in the width direction of the transport rail 3. FIG. 2 is a front view of the semiconductor manufacturing apparatus 100. FIG. 3 is a plan view of the transport rail 3.

As shown in FIGS. 1 and 2, the semiconductor manufacturing apparatus 100 is an apparatus that constitutes a part of the transfer molding apparatus, and includes a transfer rail 3, a transfer claw 4, a laser displacement sensor 5 as a detection unit, and a pair of movable pins. 6. A pair of motors 9 and a pair of ball screws 10.

The transport rail 3 is formed in a concave shape when viewed from the front. The transport rail 3 includes a pair of rail portions 3a arranged so as to face each other at a distance from each other, and a bottom surface portion 3b for connecting the lower end portions of the pair of rail portions 3a.

The lead frame 1 is placed along the upper surfaces of the pair of rail portions 3a and can slide on the upper surfaces of the pair of rail portions 3a. Specifically, both ends in the width direction of the lead frame 1 are placed on the upper surface of the pair of rail portions 3a, and the central portion in the width direction of the lead frame 1 faces the bottom surface portion 3b. The lead frame 1 slides in a state where both ends in the width direction are in contact with the upper surfaces of the pair of rail portions 3a. Further, in the central portion of the lead frame 1 in the width direction, a plurality of die pads 2 on which a plurality of semiconductor elements are mounted are formed along the longitudinal direction of the lead frame 1.

The lead frame 1 has, for example, a length of about 232 mm in the longitudinal direction, a length of about 75 mm in the width direction, and a thickness of about 0.4 mm, and has a plate shape whose main component is copper so that an internal circuit can be configured. Is formed in. Further, the lead frame 1 is a multi-row type, and the plurality of die pads 2 are provided at intervals along the longitudinal direction of the lead frame 1 and have a shape extending in the longitudinal direction with a step of about 1.38 mm. ing.

Further, as shown in FIGS. 1 and 3, an opening 7 is formed in the middle of the bottom surface portion 3b so that a part of the lower surface of the lead frame 1, specifically, the lower surface of the die pad 2 can be exposed. .. The opening 7 is formed in such a size that the lower surfaces of the two die pads 2 arranged in the width direction of the lead frame 1 can be exposed.

As shown in FIG. 1, the transport claw 4 holds one end in the longitudinal direction of the lead frame 1 and is driven by a drive mechanism (not shown) to transport the lead frame 1 along the transport rail 3. The lead frame 1 is placed on the transfer rail 3 at the magazine distribution section of the transfer mold device, and is transferred to the lead frame preheating area of the transfer mold device along the transfer rail 3 by the transfer claw 4. In the first embodiment, the height position of the die pad 2 is adjusted by using the laser displacement sensor 5 and the pair of movable pins 6 when the lead frame 1 is conveyed.

Next, the laser displacement sensor 5 and the pair of movable pins 6 will be described. As shown in FIG. 1, the laser displacement sensor 5 is provided below the opening 7 of the transport rail 3 and detects the height position of the die pad 2 provided in the lead frame 1 through the opening 7.

As shown in FIGS. 1 and 2, the pair of movable pins 6 are provided in the vertical direction of the transport rail 3 so as to face each other through the opening 7 of the transport rail 3. A laser displacement sensor 5 is provided around the movable pin 6 provided below. Two die pads 2 are provided in the width direction of the lead frame 1, and two sets of a pair of movable pins 6 are also provided in the width direction of the transport rail 3 in accordance with the two die pads 2. The pair of movable pins 6 has a φ of 1 mm or more and 3 mm or less, and the material is SUS or the like. Therefore, the pair of movable pins 6 have a higher rigidity than the lead frame 1.

The pair of movable pins 6 are connected to the pair of ball screws 10 via the pair of plate portions 10a, and are further connected to the pair of motors 9 via the pair of ball screws 10. Two movable pins 6 are provided on each plate portion 10a at intervals in the width direction of the transport rail 3.

Further, the semiconductor manufacturing apparatus 100 includes a CPU (not shown), and the CPU controls each part of the semiconductor manufacturing apparatus 100.

Next, the height position adjusting operation of the die pad 2 by the semiconductor manufacturing apparatus 100 will be described with reference to FIGS. 1 to 7. FIG. 4 is a side view of the periphery of the die pad 2 in the lead frame 1. FIG. 5 is a side view showing a state immediately before the pair of movable pins 6 are pressed against the die pad 2. FIG. 6 is a side view showing a state after the pair of movable pins 6 are pressed against the die pad 2. FIG. 7 is a flowchart of the height position adjusting operation of the die pad 2 in the first embodiment.

First, the lead frame 1 is mounted on the transport rail 3. Next, as shown in FIG. 7, the CPU controls the transport claw 4 to start the transport operation (step S1). The CPU determines whether or not the die pad 2 has reached the opening 7 (step S2). Specifically, the laser displacement sensor 5 irradiates the lower surface of the lead frame 1 with the laser 8 while the transport operation is being performed, and detects the height position of the lead frame 1. The CPU determines whether or not the die pad 2 has reached the opening 7 based on the detected height position of the lead frame 1.

When the die pad 2 reaches the opening 7 (Yes in step S2), the CPU controls the transport claw 4 to suspend the transport operation (step S3), and the laser displacement sensor 5 detects the height position of the die pad 2. (Step S4). As shown in FIG. 4, the laser displacement sensor 5 irradiates the lower surface of the die pad 2 with the laser 8 and detects the height position of the die pad 2 with reference to the height position of the end portion in the width direction of the lead frame 1. However, if the die pad 2 has not reached the opening 7 (No in step S2), the process returns to step S2.

Next, the CPU determines whether or not the detection result is within the range of the predetermined standard value (step S5). When the detection result is not within the range of the predetermined standard value (No in step S5), the CPU operates the pair of motors 9 and operates the pair of movable pins 6 by the preset stroke amount. .. The pair of movable pins 6 operate from the position shown in FIG. 5 to the position shown in FIG. 6, and are pressed against the die pad 2 from above and below to adjust the height position of the die pad 2 (step S6).

The range of the standard value is a set value of ± 0.2 mm, and is the height position of the die pad in which the lead frame 1 is judged to be a non-defective product.

On the other hand, when the detection result is within the range of the predetermined standard value (Yes in step S5), the process proceeds to step S9.

After the height position of the die pad 2 is adjusted, the CPU causes the laser displacement sensor 5 to detect the height position of the adjusted die pad 2 (step S7). The CPU determines whether or not the detection result is within the range of the predetermined standard value (step S8). If the detection result is within the range of the predetermined standard value (Yes in step S8), the CPU has detected whether or not the height positions of all the die pads 2 existing in the lead frame 1 being conveyed have been detected. Determination (step S9).

For example, the number of all die pads 2 existing in the lead frame 1 being conveyed by the operator is set in advance, and the set number is compared with the number of detected die pads 2 to perform the process of step S9. .. When the height positions of all the die pads 2 are not detected (No in step S9), the CPU controls the transport claw 4 to restart the transport operation (step S10), and then proceeds to step S2.

When the height positions of all the die pads 2 are detected (Yes in step S9), the CPU ends the height position adjustment operation of the die pads. Then, the CPU controls the transport claw 4 to transport the lead frame 1 to the lead frame preheating area.

On the other hand, if the detection result is not within the range of the predetermined standard value (No in step S8), the process returns to step S6, and the height position of the die pad 2 is adjusted again.

As described above, in the semiconductor manufacturing apparatus 100 according to the first embodiment, the lead frame 1 having the die pad 2 on which the semiconductor element is mounted holds the transfer rail 3 on which the lead frame 1 can slide on the upper surface and the lead frame 1 and holds the transfer rail. A transport claw 4 for transporting the lead frame 1 along the transport rail 3, a detection unit provided below the transport rail 3 for detecting the height position of the die pad 2, and a die pad 2 provided in the vertical direction of the transport rail 3 respectively. A pair of movable pins 6 formed on the transport rail 3 and capable of pressing the lower surface of the die pad 2 against the lower surface of the die pad 2 from above and below via an exposed opening 7, respectively. Based on the detection result, the pair of movable pins 6 adjust the height position of the die pad 2 by pressing the pair of movable pins 6 against the die pad 2 from above and below.

Therefore, even when the shape of the lead frame 1 is miniaturized, it is possible to suppress the occurrence of defective products of the lead frame 1 by adjusting the height position of the die pad 2 when the lead frame 1 is conveyed. This makes it possible to improve the yield of the semiconductor device.

Further, since it is not necessary to adjust the height position of the die pad 2 in the mold, it is possible to adopt a mold having no movable pin when manufacturing a semiconductor device.

Further, the detection unit is a laser displacement sensor 5 provided below the transport rail 3, and the laser displacement sensor 5 detects the height position of the die pad 2 through the opening 7. Since the laser displacement sensor 5 can irradiate the laser from below the lead frame 1 in the width direction of the lead frame 1, it is suitable for adjusting the height position of the die pad 2 of the multi-row lead frame 1.

<Embodiment 2>
Next, the semiconductor manufacturing apparatus 100A according to the second embodiment will be described. FIG. 8 is a cross-sectional view of the semiconductor manufacturing apparatus 100A according to the second embodiment, which is a cross-sectional view cut along the longitudinal direction on one end side in the width direction of the transport rail 3. FIG. 9 is a front view of the semiconductor manufacturing apparatus 100A. FIG. 10 is a plan view showing a state in which the camera 11 is arranged on the side of the transport rail 3. In the second embodiment, the same components as those described in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIGS. 8 and 9, in the second embodiment, the dimensions of the lead frame 1 are different from those of the first embodiment, and the configurations of the semiconductor manufacturing apparatus 100A are also different correspondingly. There is.

The lead frame 1 has, for example, a length of about 212 mm in the longitudinal direction, a length of about 62 mm in the width direction, and a thickness of about 0.4 mm, and has a plate shape whose main component is copper so that an internal circuit can be configured. Is formed in. Further, unlike the case of the first embodiment, the lead frame 1 is a single row type. The single-row lead frame 1 is a lead frame suitable for a larger current than the case of the first embodiment, and a plurality of die pads 2 are provided at intervals along the longitudinal direction of the lead frame 1 and have a size of about 1.25 mm. It has a shape that extends in the width direction of the lead frame 1 with a step. One die pad 2 is provided at the center of the lead frame 1 in the width direction, and one set of a pair of movable pins 6 is also provided accordingly.

Further, as shown in FIGS. 9 and 10, the semiconductor manufacturing apparatus 100A includes a camera 11 as a detection unit instead of the laser displacement sensor 5. The camera 11 is provided on the side of the transport rail 3.

As shown in FIGS. 8 and 10, an opening 12 is formed in place of the opening 7 in the middle portion of the bottom surface portion 3b of the transport rail 3. The opening 12 is formed from the bottom surface portion 3b to one rail portion 3a, and can expose a part of the lower surface and the side surface of the lead frame 1, that is, the lower surface and the tip end portion of the die pad 2. The opening 12 is formed in such a size that the lower surface and the tip end portion of one die pad 2 provided at the central portion in the width direction of the lead frame 1 can be exposed.

Next, the height position adjusting operation of the die pad 2 by the semiconductor manufacturing apparatus 100A will be described with reference to FIG. 7. In the second embodiment, the processes of step S2, step S4, and step S7 are different from those of the first embodiment, but the other processes are the same. Therefore, only different processes will be described.

As shown in FIG. 7, in step S2, the CPU determines whether or not the die pad 2 has reached the opening 12. Specifically, the camera 11 detects the height position of the lower surface of the lead frame 1 based on the shape of the lower surface of the lead frame 1 photographed through the opening 12 while the transport operation is being performed. The CPU determines whether or not the die pad 2 has reached the opening 7 based on the height position of the lower surface of the lead frame 1.

In steps S4 and S7, the CPU causes the camera 11 to detect the height position of the die pad 2. The camera 11 detects the height position of the die pad 2 based on the shape of the lower surface of the die pad 2 photographed through the opening 12. Specifically, the camera 11 detects the height position of the die pad 2 with reference to the height position of the end portion in the width direction in the lead frame 1.

As described above, in the semiconductor manufacturing apparatus 100A according to the second embodiment, the lead frame 1 having the die pad 2 on which the semiconductor element is mounted holds the transfer rail 3 on which the lead frame 1 can slide on the upper surface and the lead frame 1 and holds the transfer rail. A transport claw 4 for transporting the lead frame 1 along the transport rail 3, a detection unit provided on the side of the transport rail 3 for detecting the height position of the die pad 2, and a die pad provided in the vertical direction of the transport rail 3 respectively. A detection unit is provided with a pair of movable pins 6 formed on the transport rail 3 and capable of pressing the lower surface of the die pad 2 against the lower surface of the die pad 2 from above and below via an exposed opening 12. Based on the detection result of, the pair of movable pins 6 adjust the height position of the die pad 2 by pressing the pair of movable pins 6 against the die pad 2 from above and below.

Therefore, even when the shape of the lead frame 1 is miniaturized, it is possible to suppress the occurrence of defective products of the lead frame 1 by adjusting the height position of the die pad 2 when the lead frame 1 is conveyed. This makes it possible to improve the yield of the semiconductor device.

Further, since it is not necessary to adjust the height position of the die pad 2 in the mold, it is possible to adopt a mold having no movable pin when manufacturing a semiconductor device.

Further, the detection unit is a camera 11 provided on the side of the transport rail 3. Since the camera 11 can continuously detect the height position of the die pad 2 from the side of the lead frame 1 along the longitudinal direction of the lead frame 1, the height position of the die pad 2 of the single-row lead frame 1 can be detected. Suitable for adjustment.

<Embodiment 3>
Next, the semiconductor manufacturing apparatus 100B according to the third embodiment will be described. FIG. 11 is a cross-sectional view of the semiconductor manufacturing apparatus 100B according to the third embodiment, which is a cross-sectional view cut along the longitudinal direction on one end side in the width direction of the transport rail 3. FIG. 12 is a front view of the semiconductor manufacturing apparatus 100B. FIG. 13 is a plan view of the transport rail 3. FIG. 14 is a side view showing a state immediately before the pair of movable pins 6 and the pair of clamp pins 13 are pressed against the die pad 2. FIG. 15 is a side view showing a state after the pair of movable pins 6 and the pair of clamp pins 13 are pressed against the die pad 2. FIG. 16 is a flowchart of the height position adjusting operation of the die pad 2. In the third embodiment, the same components as those described in the first and second embodiments are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIGS. 11 and 12, in the third embodiment, the dimensions of the lead frame 1 are different from those of the first embodiment, and the configurations of the semiconductor manufacturing apparatus 100B are also different correspondingly. There is.

The lead frame 1 has, for example, a length of about 232 mm in the longitudinal direction, a length of about 75 mm in the width direction, and a thickness of about 0.7 mm, and has a plate shape whose main component is copper so that an internal circuit can be configured. Is formed in. As described above, the thickness of the lead frame 1 is thicker than that in the case of the first embodiment. Further, the lead frame 1 is a multi-row type, and the plurality of die pads 2 are provided at intervals along the longitudinal direction of the lead frame 1 and have a shape extending in the longitudinal direction with a step of about 1.38 mm. ing.

Further, as shown in FIGS. 14 and 15, the lead frame 1 is subjected to a coining process.

Further, the semiconductor manufacturing apparatus 100B includes a laser displacement sensor 5 as a detection unit, and further includes a pair of clamp pins 13. The pair of clamp pins 13 are provided around the pair of movable pins 6. Specifically, the pair of clamp pins 13 are connected to the pair of ball screws 10 via the pair of plate portions 10a, respectively, and further via the pair of ball screws 10, respectively, as in the case of the pair of movable pins 6. Is connected to a pair of motors 9. As a result, both the pair of movable pins 6 and the pair of clamp pins 13 are operated by the operation of the pair of motors 9.

The pair of clamp pins 13 operate at the same timing as the pair of movable pins 6, and by pressing the upper surface of the lead frame 1 and the lower surface of the lead frame 1 through the opening 7 from above and below, the pair of movable pins The lead frame 1 can be clamped around the portion of the die pad 2 pressed by 6. Since the length of the pair of clamp pins 13 is set according to the height position of the portion of the lead frame 1 to be clamped, the length of the pair of clamp pins 13 is different from the length of the pair of movable pins 6.

Next, the height position adjusting operation of the die pad 2 by the semiconductor manufacturing apparatus 100B will be described with reference to FIGS. 14 to 16.

As shown in FIG. 16, the processes of steps S1 to S5 are performed as in the case of the first embodiment. Next, the CPU operates the pair of motors 9 to operate the pair of movable pins 6 and the pair of clamp pins 13 by a preset stroke amount. The pair of movable pins 6 and the pair of clamp pins 13 operate from the positions shown in FIG. 14 to the positions shown in FIG.

The pair of clamp pins 13 clamp the lead frame 1 by pressing the upper surface of the lead frame 1 and the lower surface of the lead frame 1 through the opening 7 from the vertical direction. The pair of movable pins 6 are pressed against the die pad 2 from above and below to adjust the height position of the die pad 2 with the lead frame 1 clamped (step S16). After the height position of the die pad 2 is adjusted, the processes of steps S7 to S10 are performed as in the case of the first embodiment.

In the third embodiment, the thickness of the lead frame 1 is thicker than that of the first embodiment, and springback is likely to occur. Therefore, the lead frame 1 is clamped, and the height position of the die pad 2 is adjusted while suppressing the deformation of the lead frame 1. As a result, the amount of springback of the lead frame 1 can be suppressed, and a predetermined deformation can be given to the die pad 2.

Further, as shown in FIGS. 14 and 15, by adopting the lead frame 1 subjected to the coining process, it becomes easy to bend the lead frame 1, and the lead generated by the thick lead frame 1 is generated. The amount of springback of the frame 1 can be reduced.

In the third embodiment, the semiconductor manufacturing apparatus 100B has been described as having a laser displacement sensor 5 as a detection unit, but in the case of the single-row read frame 1, the camera 11 may be provided as a detection unit. good.

As described above, the semiconductor manufacturing apparatus 100B according to the third embodiment is provided around the pair of movable pins 6, and the upper surface of the lead frame 1 and the lower surface of the lead frame 1 via the opening 7 are viewed from above and below, respectively. Further, a pair of clamp pins 13 capable of clamping the lead frame 1 by pressing the lead frame 1 are further provided.

Therefore, when the thickness of the lead frame 1 is thick, the amount of springback of the lead frame 1 generated when adjusting the height position of the die pad 2 can be reduced, so that the deformation of the entire lead frame 1 can be suppressed. Become. Further, by adopting the lead frame 1 that has been subjected to the coining process, even a thick lead frame 1 can be easily bent and the height position of the die pad 2 can be easily adjusted. As described above, the semiconductor manufacturing apparatus 100B is suitable for a large variety having a thick lead frame 1.

It is possible to freely combine the embodiments and to modify or omit the embodiments as appropriate.

1 Lead frame, 2 Die pads, 3 Conveyance rails, 4 Conveyance claws, 5 Laser displacement sensors, 6 Movable pins, 7 openings, 11 cameras, 12 openings, 13 clamp pins, 100, 100A, 100B semiconductor manufacturing equipment.

Claims (5)

A transport rail on which a lead frame with a die pad on which a semiconductor element is mounted can slide on the upper surface,
A transport claw that holds the lead frame and transports the lead frame along the transport rail.
A detection unit provided below or to the side of the transport rail to detect the height position of the die pad.
The upper surface of the die pad and the lower surface of the die pad formed on the transfer rail can be pressed against the lower surface of the die pad from above and below through an open opening which is provided in each of the vertical directions of the transfer rail. With a pair of movable pins,
A semiconductor manufacturing apparatus that adjusts the height position of the die pad by pressing the pair of movable pins against the die pad from above and below based on the detection result of the detection unit. The detection unit is a laser displacement sensor provided below the transport rail.
The semiconductor manufacturing apparatus according to claim 1, wherein the laser displacement sensor detects the height position of the die pad through the opening. The semiconductor manufacturing apparatus according to claim 1, wherein the detection unit is a camera provided on the side of the transport rail. Further, a pair of clamp pins provided around the pair of movable pins and capable of clamping the lead frame by pressing the upper surface of the lead frame and the lower surface of the lead frame through the openings from the vertical direction. The semiconductor manufacturing apparatus according to any one of claims 1 to 3, which is provided. A method for manufacturing a semiconductor device using the semiconductor manufacturing device according to any one of claims 1 to 4.
(A) When the die pad reaches the opening during the transfer operation of the lead frame, the transfer operation is temporarily stopped, and the detection unit detects the height position of the die pad.
(B) When the detection result of the detection unit is not within the range of the predetermined standard value, the pair of the movable pins are vertically connected to the upper surface of the die pad and the lower surface of the die pad via the opening. The process of adjusting the height position of the die pad by pressing it against
(C) Again, the step of detecting the height position of the die pad by the detection unit, and
(D) When the detection result of the detection unit in the step (c) is within the range of the predetermined standard value, the step of restarting the transport operation and the step of restarting the transport operation.
A method for manufacturing a semiconductor device.

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