JP2022014357A - Imprint apparatus, control method thereof, and article manufacturing method - Google Patents

Abstract

To provide an advantageous technique for improving superposition accuracy between a pattern region of a mold and a shot region of a substrate.SOLUTION: An imprint apparatus 100, configured to form a pattern of imprint material IM on a substrate S using a mold M having a pattern region P, includes: a holding unit MC having a ring-shaped contact surface in contact with the mold M and holding the mold M; a pressurizing unit MAG pressurizing a side surface of the mold M; and a control unit CNT controlling first processing of deforming the pattern region P into a target shape by pressurizing the side surface of the mold M by the pressurizing unit MAG and a second processing of reducing ununiformity of a distorted distribution generated in the mold M due to the first processing. The control unit CNT controls the second processing by temporarily applying a moment along the ring-shaped contact surface between the mold M and the contact surface to displace a relative position between the mold M and the contact surface.SELECTED DRAWING: Figure 1

Description

The present invention relates to an imprint device, a control method thereof, and a method for manufacturing an article.

An imprint device that forms a pattern of an imprint material on a substrate by using a mold having a pattern region is attracting attention as one of mass production lithography devices such as semiconductor devices. The imprint device cures the imprint material in a state where the imprint material supplied on the shot region of the substrate and the mold are in contact with each other, thereby forming a pattern composed of the cured product of the imprint material in the shot region of the substrate. Can be formed on top. Further, the imprint device may be provided with a deformation mechanism that deforms the pattern region of the mold by applying a force to the side surface of the mold in order to reduce the superposition error between the shot region and the pattern region of the mold (Patent Document). 1).

Japanese Unexamined Patent Publication No. 2019-121694

In a configuration in which a force is applied to the side surface of the mold by the deformation mechanism while the mold is held by the holding mechanism, the strain distribution in the mold may become uneven due to the friction loss between the mold and the holding mechanism. .. In this case, it becomes difficult to deform the pattern region of the mold into a desired shape, and the overlay accuracy of the pattern region of the mold and the shot region of the substrate may be lowered.

Therefore, an object of the present invention is to provide an advantageous technique for improving the superposition accuracy between the pattern region of the mold and the shot region of the substrate.

In order to achieve the above object, the imprint device as one aspect of the present invention is an imprint device that forms a pattern of an imprint material on a substrate by using a mold having a pattern region, and is in contact with the mold. A holding portion that has a ring-shaped contact surface to hold the mold, a pressurizing portion that pressurizes the side surface of the mold, and a pressurizing portion that pressurizes the side surface of the mold to target the pattern region. The control unit includes a control unit that controls a first process of transforming into a shape and a second process of reducing the non-uniformity of strain distribution caused in the mold by the first process, and the control unit has a ring shape. The second process is controlled by temporarily applying a moment along the contact surface between the mold and the contact surface to shift the relative position between the mold and the contact surface. And.

Further objects or other aspects of the invention will be manifested in the preferred embodiments described below with reference to the accompanying drawings.

According to the present invention, for example, it is possible to provide an advantageous technique for improving the overlay accuracy of the pattern region of the mold and the shot region of the substrate.

The figure which shows the configuration example of the imprint apparatus Flowchart showing imprint processing The figure which shows the arrangement example of a plurality of shot regions in a substrate The figure which shows the structural example of the mold chuck The figure which shows the structural example of the deformation mechanism The figure which shows the mold held by the mold chuck Diagram to explain the reason for giving a moment Diagram to explain the reason for giving a moment The figure which shows an example of the method of giving a moment The figure which shows an example of the method of giving a moment The figure which shows an example of the method of giving a moment The figure which shows the direction of the moment in the reduction process in a plurality of shot regions. Diagram for explaining how to manufacture an article

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiment, not all of the plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the attached drawings, the same or similar configurations are given the same reference numbers, and duplicate explanations are omitted.

In the present specification and the accompanying drawings, the direction is shown in the XYZ coordinate system in which the direction parallel to the surface of the substrate is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X-direction, Y-direction, and Z-direction, and the rotation around the X-axis, the rotation around the Y-axis, and the rotation around the Z-axis are θX and θY, respectively. , ΘZ. Control or drive with respect to the X-axis, Y-axis, and Z-axis means control or drive with respect to a direction parallel to the X-axis, a direction parallel to the Y-axis, and a direction parallel to the Z-axis, respectively. Further, the control or drive regarding the θX axis, the θY axis, and the θZ axis is related to the rotation around the axis parallel to the X axis, the rotation around the axis parallel to the Y axis, and the rotation around the axis parallel to the Z axis, respectively. Means control or drive. Further, the position is information that can be specified based on the coordinates of the X-axis, the Y-axis, and the Z-axis, and the posture is the information that can be specified by the values of the θX-axis, the θY-axis, and the θZ-axis. Positioning means controlling position and / or posture. Alignment may include control of the position and / or orientation of at least one of the substrate and mold.

<First Embodiment>
The first embodiment according to the present invention will be described. FIG. 1 shows a configuration example of the imprint device 100 of the present embodiment. The imprint device 100 performs an imprint process for forming a pattern made of a cured product of the imprint material IM on the substrate S for each of the plurality of shot regions SR in the substrate S.

As shown in the flowchart of FIG. 2, the imprint process includes a supply process (S1), a contact process (S2), a deformation process (S3), an alignment process (S4), a curing process (S5), and a separation process (S6). Can include. The supply process (S1) is a process of supplying the imprint material IM on the shot region SR of the substrate S. The contact process (S2) is a process of bringing the pattern region P of the mold M into contact with the imprint material IM on the shot region SR of the substrate S. A concave-convex pattern (concave-convex pattern) is formed in the pattern region P of the mold M. In the deformation process (S3), the side surface of the mold M is pressed to form the pattern region P of the mold M into a desired shape so that the overlay error between the shot region SR of the substrate S and the pattern region P of the mold M is reduced. It is a process (first process) of transforming into. The deformation process (S3) may be performed before the contact process (S2). The alignment process (S4) is a process for aligning the pattern region P of the mold M with the shot region SR of the substrate S. As the alignment, the relative position (XY direction) and the relative posture (θX, θY, θZ direction) between the pattern region P of the mold M and the shot region SR of the substrate S can be controlled. Further, the curing treatment (S5) is a processing for curing the imprint material IM. The separation process (S6) is a process (release process) for separating the pattern made of the cured product of the imprint material IM and the pattern region P of the mold M.

FIG. 3 shows an arrangement example of a plurality of shot regions SR on the substrate S. In FIG. 3, the numbers assigned to each shot area SR are numbers (shot numbers) given to mutually identify a plurality of shot area SRs, and represent, for example, the order in which imprint processing is performed. The imprint process for the plurality of shot area SRs can be executed in a predetermined order.

Here, as the imprint material, a curable composition (sometimes referred to as an uncured resin) that is cured by being applied with energy for curing is used. As the energy for curing, electromagnetic waves, heat and the like can be used. The electromagnetic wave may be, for example, light selected from a wavelength range of 10 nm or more and 1 mm or less, for example, infrared rays, visible rays, ultraviolet rays, and the like. The curable composition can be a composition that cures by irradiation with light or by heating. Of these, the photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent, if necessary. The non-polymerizable compound is at least one selected from the group of sensitizers, hydrogen donors, internal release mold release agents, surfactants, antioxidants, polymer components and the like. The imprint material can be arranged on the substrate in the form of droplets or islands or films formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25 ° C.) can be, for example, 1 mPa · s or more and 100 mPa · s or less. As the material of the substrate, for example, glass, ceramics, metal, semiconductor, resin and the like can be used. If necessary, a member made of a material different from the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

The imprint device 100 supports a substrate drive mechanism SDM that holds and drives the substrate S, a base frame BF that supports the substrate drive mechanism SDM, a mold drive mechanism MDM that holds and drives the mold M, and a mold drive mechanism MDM. It may be equipped with a structure ST. The substrate drive mechanism SDM may include a substrate stage SS including a substrate chuck SC for holding the substrate S, and a substrate positioning mechanism SA for positioning the substrate S by positioning the substrate stage SA. The mold drive mechanism MDM may include a mold chuck MC (holding portion) that attracts and holds the mold M, and a mold positioning mechanism MA that positions the mold M by positioning the mold chuck MC.

FIG. 4 shows a configuration example of the mold chuck MC of the mold drive mechanism MDM. Although the mold M is also shown in FIG. 4, the mold M and the mold chuck MC are shown in a separated state in order to make it easy to understand the configuration of the mold chuck MC and the positional relationship between the mold M and the mold chuck MC. ing. The mold chuck MC has, for example, a ring-shaped (ring band-shaped) contact surface CS (holding surface) that contacts the back surface of the mold M (the surface opposite to the surface on which the pattern region P is provided), and is subjected to vacuum suction or the like. The mold M is held by the contact surface CS. The contact surface CS is preferably formed in the shape of a circular ring, but may be formed in the shape of a polygon (for example, a shape close to a circle (such as a decagon)). An opening is formed inside the contact surface CS so that energy (light such as ultraviolet rays) from the cured portion CU can pass through.

Further, the mold drive mechanism MDM may include a load cell LC that detects a force applied to the mold M in the contact process and / or the separation process. Further, in the contact process, the mold drive mechanism MDM applies pressure to the back surface of the mold M so as to deform the pattern region P of the mold M so that the pattern region P of the mold M becomes convex toward the substrate S. It may be provided with a mechanism.

The substrate drive mechanism SDM and the mold drive mechanism MDM constitute a drive mechanism DM that drives at least one of the substrate S and the mold M so that the relative positions of the substrate S and the mold M are changed. The change of the relative position by the drive mechanism DM is a drive for contact of the pattern region P of the mold M with respect to the imprint material on the substrate S and separation of the mold from the cured imprint material (cured material pattern). including. In other words, the change of the relative position by the drive mechanism DM includes changing the relative position between the substrate S and the mold M so that the contact process and the separation process are performed. The substrate drive mechanism SDM has the substrate S on a plurality of axes (for example, three axes of X-axis, Y-axis, and θZ-axis, preferably six axes of X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis). ) Can be configured to drive. The mold drive mechanism MDM has a mold M on a plurality of axes (for example, three axes of Z axis, θX axis, and θY axis, preferably six axes of X axis, Y axis, Z axis, θX axis, θY axis, and θZ axis). ) Can be configured to drive.

The imprint device 100 further includes a pressurizing mechanism MAG (pressurizing section) that pressurizes the side surface of the mold M. For example, in the deformation process, the pressurizing mechanism MAG changes the shape (including the size) of the pattern region P in the plane parallel to the XY plane by applying a force to the four side surfaces of the mold M, and the pattern region. P is transformed into a desired shape (target shape). As an example, the pressurizing mechanism MAG can correct the magnification component of the pattern region P by applying a force to the side surface of the mold M.

FIG. 5 shows a configuration example of the deformation mechanism MAG. The deformation mechanism MAG shown in FIG. 5 is configured to deform the pattern region P of the mold M by applying a force to the four side surface MSs of the mold M. The components of the shape (including the size) of the pattern region P that can be controlled by the deformation mechanism MAG include, for example, a magnification component and a distortion component (for example, a rhombus, a trapezoidal component, or a higher-order component). Can include. The deformation mechanism MAG may include a plurality of units 20. Each unit 20 may include a contact portion 21 that contacts the side surface MS of the mold M and an actuator 22 that drives the contact portion 21. The actuator 22 may include, for example, a piezo element, but may include other elements.

The imprint device 100 may further include a dispenser DSP. The dispenser DSP supplies (arranges) the imprint material IM on the shot region SR of the substrate S in the supply process. The supply of the imprint material IM onto the shot region SR of the substrate S is, for example, in a state where the substrate S is driven by the substrate drive mechanism SDM, and the dispenser DSP drops the imprint material IM in synchronization with the drive. It can be done by discharging as. Here, each time the dispenser DSP supplies the imprint material IM on one shot region SR of the substrate S, a contact process, a deformation process, an alignment process, a curing process, and a separation process can be executed. Alternatively, after the dispenser DSP supplies the imprint material IM on the plurality of shot region SRs of the substrate S, the contact treatment, the deformation treatment, the alignment treatment, the curing treatment, and the separation treatment are performed on each of the plurality of shot region SRs. It may be executed. In the present embodiment, the dispenser DSP is a component of the imprint device 100, but may be configured as an external device of the imprint device 100.

The imprint device 100 may further include a hardened portion CU. In the curing process, the cured portion CU irradiates the imprint material IM with energy for curing (for example, ultraviolet rays) in a state where the imprint material IM on the substrate S and the pattern region P of the mold M are in contact with each other. The printing material IM is cured. As a result, a pattern made of a cured product of the imprint material IM is formed on the substrate S.

The imprint device 100 further detects (measures) the position of the mark SMK of the substrate S, the position of the mark MMK of the mold M, the relative position of the mark SMK of the shot area SR of the substrate S and the mark MMK of the mold M, and the like. It may be equipped with an alignment scope (measuring instrument) AS. The imprint device 100 may further include an off-axis scope OAS that detects (measures) the position of the mark SMK in the shot region SR of the substrate S. Alignment (alignment processing) between the pattern region P of the mold M and the shot region SR of the substrate S can be executed based on the detection results of the alignment scope AS and / the off-axis scope OAS.

The imprint device 100 may further include a control unit CNT. The control unit CNT controls the drive mechanism DM, the deformation mechanism MAG, the dispenser DSP, the curing unit CU, the alignment scope AS, and the off-axis scope OAS. That is, the control unit CNT controls the imprint process (contact process, deformation process, alignment process, hardening process, separation process, and reduction process described later). The control unit CNT is, for example, a PLD (abbreviation for Programmable Logic Device) such as FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), or a general-purpose program. It may consist of a computer or a combination of all or part of these.

As a result of being detected by the alignment scope AS, the control unit CNT can calculate the shape of the shot area SR based on the position of the mark SMK of the shot area SR of the substrate S, for example. Further, the control unit CNT can calculate the shape of the pattern region P of the mold M based on the position of the mark MMK of the mold M, for example, as a result of being detected by the alignment scope AS. The control unit CNT can calculate the overlay error between the shot region SR of the substrate S and the pattern region P of the mold M based on the shape of the shot region SR and the shape of the pattern region P thus obtained. .. Alternatively, the control unit CNT, as a result of being detected by the alignment scope AS, for example, based on the relative position between the mark SMK of the substrate S and the mark MMK of the mold M, the shot region SR of the substrate S and the pattern region P of the mold M. The superposition error with can be calculated. In other words, the control unit CNT can calculate the superposition error between the shot region SR of the substrate S and the pattern region P of the mold M based on the output of the alignment scope AS. The superposition error may include, for example, a magnification component and a distortion component (for example, a rhombus, a trapezoidal component, or a higher-order component).

[Processing to reduce the non-uniformity of strain distribution that occurs in the mold]
In the deformation process in the imprint device 100 described above, in a state where the mold M is held by the mold chuck MC (mold drive mechanism MDM), a force is applied to the side surface of the mold M by the pressurizing mechanism MAG to apply a force to the pattern region P of the mold M. Is transformed into the target shape. At this time, due to the friction loss between the mold M and the mold chuck MC, the strain distribution generated by the force applied to the side surface of the mold M by the pressurizing mechanism MAG may become non-uniform inside the mold M. In this case, since unintended distortion occurs inside the mold M, it becomes difficult to deform the pattern region P of the mold M into the target shape, and the pattern region P of the mold M and the shot region SR of the substrate S become Overlapping accuracy can be reduced. The strain distribution of the mold M can also be regarded as the force distribution generated inside the mold M by the force applied to the side surface of the mold M by the pressurizing mechanism MAG.

FIG. 6 shows the mold M held by the mold chuck MC. In FIG. 6, the line attached to the mold M represents the strain distribution generated in the mold M. Further, FIG. 6A shows a state in which the force F is not applied to the side surface of the mold M by the pressurizing mechanism MAG, and FIG. 6B shows a state in which the force F is applied to the side surface of the mold M by the pressurizing mechanism MAG. Shows the state. As shown in FIG. 6B, the strain distribution inside the mold M due to the force F applied to the side surface of the mold M is inside the mold M due to the friction loss between the mold M and the mold chuck MC (contact surface CS). The distortion becomes smaller by the time it reaches. Therefore, a non-uniform strain distribution may be formed in the mold M. That is, even if a force F calculated so that the pattern region P becomes the target shape is applied to the side surface of the mold M, a simple enlargement / reduction magnification change cannot be obtained in the pattern region P, and an error with respect to the target shape is obtained. Can occur. Since this error includes a high-order magnification component and / or other high-order components, it may be difficult to reduce the error simply by changing the force F applied to the side surface of the mold M.

Therefore, in the present embodiment, in addition to the deformation process (first process) in which the side surface of the mold M is pressed by the pressurizing mechanism MAG so as to deform the pattern region P to the target shape, the strain distribution generated in the mold M by the deformation process. A reduction process (second process) is performed to reduce the non-uniformity of the above. Specifically, as shown in FIG. 4, the control unit CNT temporarily applies (generates) a moment Fm along the ring-shaped contact surface CS between the mold M and the contact surface CS, and the mold M. The reduction process is controlled by shifting the relative position between the contact surface CS and the contact surface CS. By performing such a reduction process, the friction between the mold M and the contact surface CS can be changed from static friction to dynamic friction, and the holding of the mold M by the mold chuck MC can be temporarily released. That is, the friction loss between the mold M and the contact surface CS can be reduced, and the non-uniformity of the strain distribution generated in the mold M due to the deformation process can be reduced (relaxed). The "relative position between the mold M and the contact surface CS (mold chuck MC)" described in the present specification includes the relative posture (θZ direction) between the mold M and the contact surface CS (mold chuck MC). ..

Here, the reason why the moment Fm along the ring-shaped contact surface CS is applied between the mold M and the contact surface CS in the reduction process will be described with reference to FIG. 7. FIG. 7 is a view of the mold M viewed from below (board side), and the position of the ring-shaped contact surface CS in the mold chuck MC is shown in the figure. FIG. 7A is a diagram when a force Fx in a direction parallel to the XY plane (-X direction in the drawing) is applied between the mold M and the mold chuck MC. FIG. 7B is a diagram when a force (moment Fm) in the direction along the ring-shaped contact surface CS is applied between the mold M and the mold chuck MC.

As shown in FIG. 7A, when the force Fx is applied by the reduction process, the width W ₁ at which the friction between the mold M and the contact surface CS occurs is the same as the diameter of the ring-shaped contact surface CS, so that it is extremely difficult. Becomes widespread. In this case, since friction between the mold M and the contact surface CS occurs over a wide range (width W ₁ ), it is difficult to reduce the non-uniformity of the strain distribution in the mold M by applying the force Fx, and rather the force. The non-uniformity of distribution can be further increased. On the other hand, as shown in FIG. 7B, when the moment Fm along the ring-shaped contact surface CS is applied by the reduction process, the width W ₂ at which friction between the mold M and the contact surface CS occurs is ring-shaped. Since it is the same as the width of the contact surface CS, it is very small as compared with the width _W1 . That is, when the moment Fm is applied, the range in which friction between the mold M and the contact surface CS (for example, dynamic friction) occurs can be reduced, so that the non-uniformity of the strain distribution in the mold M can be efficiently reduced. ..

Further, the reason why the moment Fm is applied between the mold M and the contact surface CS in the reduction process will be described from a viewpoint different from the above. For example, as shown in FIG. 8A, the mold M may be required to have a uniform force F'formed throughout. When the continuous force F'arranged in one dimension is rounded along the ring-shaped contact surface CS so as to connect both ends thereof, the moment Fm (θZ direction) as shown in FIG. 8B is obtained. be able to. By applying such a moment Fm between the mold M and the contact surface CS, the non-uniformity of the strain distribution generated in the mold M due to the deformation process can be reduced.

[Method of applying moment]
Next, a method of applying a moment Fm along the ring-shaped contact surface CS between the mold M and the contact surface CS will be described. For example, in the reduction process, the control unit CNT molds the rotation center A of the moment Fm and the center of gravity B (center of the ring) of the ring-shaped contact surface CS so as to coincide in the XY directions in the reduction process. It is advisable to apply a moment Fm between M and the contact surface CS. By applying the moment Fm in this way, it is possible to reduce the possibility that the mold M will fall off from the mold chuck MC due to an unintended stress generated between the mold M and the contact surface CS. Further, the magnitude (strength) of the moment Fm is such that the friction between the mold M and the contact surface CS changes from static friction to dynamic friction, for example, if the mold M and the contact surface CS are slightly displaced. good. The magnitude of the moment Fm can be preset by experiments, simulations, or the like according to the magnitude of friction between the mold M and the contact surface CS (for example, the coefficient of friction).

The control unit CNT may apply a preset moment Fm, but may stop applying the moment Fm at the start timing of the deviation of the relative positions between the mold M and the mold chuck MC. The start timing is the detection of the transition from static friction to dynamic friction (that is, the detection of the change in the driving force for applying the moment Fm) and the deviation of the relative position between the mold M and the mold chuck MC by the alignment scope AS or the like. It can be obtained based on detection or the like. Further, as a method of applying the moment Fm, for example, a method of applying a moment Fm by applying a force to the side surface of the mold M by the pressurizing mechanism MAG, and a method of rotationally driving the mold chuck MC with respect to the mold M to drive the moment. A method of imparting Fm can be mentioned.

FIG. 9 shows a method of applying a moment Fm by applying a force to the side surface of the mold M by the pressurizing mechanism MAG. FIG. 9 is a view of the mold M viewed from below (the substrate side), and shows the force applied to the side surface of the mold M by the pressurizing mechanism MAG. For example, as shown in FIG. 9A, the control unit CNT generates a _first force F1 for deforming the pattern region P into a target shape in the pressurizing mechanism MAG to perform a deformation process (first process). ) Is controlled. Then, as shown in FIG. 9B, the control unit CNT generates a second force F ₂ for applying the moment Fm in the pressurizing mechanism MAG in addition to the first force F ₁ . The reduction process (second process) is controlled. In this case, the control unit CNT generates a second force F ₂ in the pressurizing mechanism MAG so that their vectors are linearly independent and the resultant force in the X direction and the resultant force in the Y direction are balanced. good. By making the vector of the second force F ₂ linearly independent in this way, it is possible to reduce unintended deformation of the mold M due to the force of the vector that is not linearly independent. Further, with respect to the second force F ₂ , by balancing the resultant force in the X direction and the resultant force in the Y direction, it is possible to reduce the unintended translational movement of the mold M in the XY direction.

FIG. 10 shows a modified example of a method of applying a moment Fm by applying a force to the side surface of the mold M by the pressurizing mechanism MAG. FIG. 10A shows an example in which a _first force F1 for deforming the pattern region P into a target shape is generated in the pressurizing mechanism MAG. Further, FIG. 10B shows an example in which a second force F ₂ for applying a moment Fm is generated in the pressurizing mechanism MAG in addition to the first force F ₁ . As shown in FIG. 10B, when a second force F ₂ is applied at two or more points on one side surface (one side) of the mold M, the vectors are not linearly independent. In this case, if the composite vector for each side surface of the mold M is linearly independent, unintended deformation of the mold M can be reduced.

FIG. 11 shows a method of applying a moment Fm by rotationally driving the mold chuck MC with respect to the mold M. For example, the mold drive mechanism MDM (mold positioning mechanism MA) is provided with a rotation drive mechanism ROT (drive unit) that rotationally drives the mold chuck MC in the θZ direction. By this rotation drive mechanism ROT, the mold M and the mold chuck MC (contact surface CS) are relatively rotationally driven in the direction along the ring-shaped contact surface CS, so that a moment Fm can be applied. Specifically, the control unit CNT is in a state where a force is applied to the side surface of the mold M by the pressurizing mechanism MAG (that is, a state in which the posture (θZ direction) of the mold M is maintained by the pressurizing mechanism MAG). , The mold chuck MC is rotationally driven by the rotary drive mechanism ROT. As a result, the mold chuck MC can be rotated with respect to the mold M, and a moment Fm can be applied between the mold M and the contact surface CS. The moment Fm may be applied in combination with the pressurization to the side surface of the mold M by the pressurizing mechanism MAG and the rotational drive of the mold chuck MC by the rotary drive mechanism ROT.

[Implementation timing of reduction processing]
Next, the execution timing of the reduction process (second process) for applying the moment Fm will be described. The deformation process (first process) for deforming the pattern region P of the mold M by the pressurizing mechanism MAG can be executed (controlled) in a state where the mold M and the imprint material IM on the substrate are in contact with each other, for example. In this case, the reduction process may be executed (controlled) after the deformation process in a state where the mold M and the imprint material IM on the substrate are in contact with each other. Further, the reduction process is for reducing the non-uniformity of the strain distribution caused in the mold M by the deformation process, and does not contribute to the deformation of the pattern region P of the mold M, and therefore imprints on the substrate. It is preferable to finish the material IM before starting the curing (before the curing process). For example, the reduction process may be completed before the alignment between the pattern region P of the mold M and the shot region SR of the substrate S is started (before the alignment process). That is, after controlling the reduction process, the control unit CNT controls the relative position (XY direction) and the relative posture (θX, θY, θZ direction) between the mold M and the substrate S as the alignment process. Here, the deformation treatment can be continued even after the curing of the imprint material IM on the substrate is started (during the curing treatment). This is because it is necessary to maintain the pattern region P of the mold M in a state of being deformed to the target shape even during the curing of the imprint material IM.

As described above, in the imprint device 100 of the present embodiment, in addition to the deformation process of pressurizing the side surface of the mold M by the pressurizing mechanism MAG to deform the pattern region P into the target shape, the imprint device 100 is generated in the mold M by the deformation process. A reduction process is performed to reduce the non-uniformity of the strain distribution. The reduction process is controlled so as to temporarily apply a moment Fm along the ring-shaped contact surface CS between the mold M and the contact surface CS to shift the relative position between the mold M and the contact surface CS. .. As a result, the holding of the mold M by the mold chuck MC can be temporarily released, and the non-uniformity of the strain distribution generated in the mold M due to the deformation process can be reduced (relaxed). That is, the pattern region P of the mold M can be accurately transformed into the target shape, and the overlay accuracy of the pattern region P of the mold M and the shot region SR of the substrate S can be improved.

<Second Embodiment>
A second embodiment according to the present invention will be described. In this embodiment, an example of setting the direction (rotational direction) of the moment Fm with respect to each of the plurality of shot regions SR on the substrate S will be described. As described in the first embodiment, in the reduction process, a moment Fm is applied between the contact surface CS of the mold M and the mold chuck MC, and the relative position between the mold M and the mold chuck MC (contact surface CS) is set. It is shifted in the θZ direction. Therefore, if moments Fm in the same direction are applied to a plurality of shot region SRs, deviations in relative positions between the mold M and the mold chuck MC are accumulated in the same direction, and the mold M and the substrate S in the subsequent alignment process Alignment can be difficult. Therefore, the control unit CNT of the present embodiment changes the direction of the moment Fm in the reduction process for each predetermined number of shot region SRs. It should be noted that this embodiment basically inherits the first embodiment, and the configuration and processing of the imprint device 100 are the same as those of the first embodiment unless otherwise specified below.

FIG. 12 is a diagram additionally showing the direction of the moment Fm in the reduction process with respect to the arrangement example of the plurality of shot regions SR shown in FIG. The numbers assigned to each shot area SR in FIG. 12 indicate the order in which the imprint processing is performed. In the example shown in FIG. 12, a moment Fm (first moment Fm ₁ ) in the −θZ direction (first rotation direction) is set for the shot region SR assigned an odd number. On the other hand, a moment Fm (second moment Fm ₂ ) in the + θZ direction (second rotation direction opposite to the first rotation direction) is set for the shot region SR assigned an even number. That is, in the example shown in FIG. 12, the direction of the moment Fm in the reduction process is changed for each shot region SR. Further, the direction of the moment Fm in the reduction process may be set so that the direction of the moment Fm is opposite between the two shot regions adjacent to each other. By setting the direction of the moment Fm with respect to each shot region SR in this way, it is possible to prevent the deviation of the relative positions of the mold M and the mold chuck MC from accumulating in the same direction.

Here, in the example shown in FIG. 12, the direction of the moment Fm is changed for each shot region SR, but the direction is not limited to this, and the moment Fm is changed for each shot region SR of a predetermined number (for example, 2 or 5). You may change the direction of. Further, the control unit CNT causes the alignment scope AS to detect the deviation amount (the deviation amount from the target relative position) of the relative position between the mold M and the mold chuck MC, and the deviation amount sets the threshold value based on the detection result. If it exceeds, the direction of the moment Fm may be changed. The amount of deviation in the relative position between the mold M and the mold chuck MC can also be detected from the drive amount of the pressurizing mechanism MAG and / or the drive amount of the rotary drive mechanism R.

<Embodiment of manufacturing method of goods>
The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article of the present embodiment includes a step of forming a pattern on an imprint material supplied (coated) on a substrate by using the above-mentioned imprint device, and a process of processing the substrate on which the pattern is formed in such a step. Including the process. Further, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, flattening, etching, resist peeling, dicing, bonding, packaging, etc.). The method for manufacturing an article of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

The pattern of the cured product formed by using the imprint device is used permanently for at least a part of various articles or temporarily when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

The pattern of the cured product is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. After etching or ion implantation in the substrate processing step, the resist mask is removed.

Next, a specific manufacturing method of the article will be described. As shown in FIG. 13 (a), a substrate 1z such as a silicon wafer on which a work material 2z such as an insulator is formed on the surface is prepared, and subsequently, the substrate 1z such as a silicon wafer is injected into the surface of the work material 2z by an inkjet method or the like. The printing material 3z is applied. Here, a state in which a plurality of droplet-shaped imprint materials 3z are applied onto the substrate is shown.

As shown in FIG. 13B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side on which the uneven pattern is formed facing. As shown in FIG. 13 (c), the substrate 1z to which the imprint material 3z is applied is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the work material 2z. When light is irradiated through the mold 4z as energy for curing in this state, the imprint material 3z is cured.

As shown in FIG. 13D, when the imprint material 3z is cured and then the mold 4z and the substrate 1z are separated from each other, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. The pattern of the cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the convex portion of the mold corresponds to the concave portion of the cured product, that is, the uneven pattern of the mold 4z is transferred to the imprint material 3z. It will be done.

As shown in FIG. 13 (e), when etching is performed using the pattern of the cured product as an etching resistant mask, the portion of the surface of the work material 2z where the cured product is absent or remains thin is removed, and the groove 5z is formed. Become. As shown in FIG. 13 (f), by removing the pattern of the cured product, it is possible to obtain an article in which the groove 5z is formed on the surface of the workpiece 2z. Here, the pattern of the cured product is removed, but it may not be removed even after processing, and may be used, for example, as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article.

The invention is not limited to the above embodiment, and various modifications and modifications can be made without departing from the spirit and scope of the invention. Therefore, a claim is attached to publicize the scope of the invention.

100: Imprint device, S: Substrate, M: Mold, MAG: Pressurizing mechanism, MC: Mold chuck (holding part), CS: Contact surface, CNT: Control part

Claims (14)

An imprint device that forms a pattern of imprint material on a substrate using a mold having a pattern region.
A holding portion having a ring-shaped contact surface that contacts the mold and holding the mold,
A pressurizing part that pressurizes the side surface of the mold,
A first process of deforming the pattern region into a target shape by pressurizing the side surface of the mold with the pressurizing portion, and a second process of reducing the non-uniformity of strain distribution generated in the mold by the first process. And the control unit that controls
Equipped with
The control unit temporarily applies a ring-shaped moment along the contact surface between the mold and the contact surface to shift the relative position between the mold and the contact surface, thereby causing the first. 2 An imprint device characterized by controlling processing. The imprint device according to claim 1, wherein the control unit controls a relative position and a relative posture between the mold and the substrate after controlling the second process. The control unit controls the first process by generating a first force for deforming the pattern region into the target shape in the pressurizing unit, and a second force for generating the moment. The imprint device according to claim 1 or 2, wherein the second process is controlled by further generating the pressure in the pressurizing unit. Further provided is a drive unit that rotationally drives the mold and the holding portion relative to each other along the ring-shaped contact surface.
The imprint device according to any one of claims 1 to 3, wherein the control unit controls the second process by generating the moment by using the drive unit. The first aspect of claim 1 to 4, wherein the control unit controls the second process so that the center of rotation of the moment and the center of gravity of the ring-shaped contact surface coincide with each other. Imprint device. The imprint device according to any one of claims 1 to 5, wherein the control unit controls the first process so as to correct the magnification component of the pattern region. The imprint device according to any one of claims 1 to 6, wherein the contact surface is formed in a circular ring shape. One of claims 1 to 7, wherein the control unit controls the first process and the second process in a state where the mold and the imprint material on the substrate are in contact with each other. The imprint device described in. The imprint device according to claim 8, wherein the control unit terminates the second process before starting the curing of the imprint material. The imprint device according to claim 9, wherein the control unit continues the first process even after the imprint material has started to be cured. The substrate has a plurality of shot regions, each of which forms a pattern of an imprint material using the mold.
The imprint device according to any one of claims 1 to 10, wherein the control unit changes the rotation direction of the moment in the second process for each predetermined number of shot regions. 11. The control unit is characterized in that the second process is controlled for each of the plurality of shot regions so that the rotation directions of the moments are opposite to each other between two shot regions adjacent to each other. The imprint device described in. A forming step of forming a pattern on a substrate by using the imprinting apparatus according to any one of claims 1 to 12.
Including a processing step of processing the substrate on which a pattern is formed in the forming step.
A method for manufacturing an article, which comprises manufacturing an article from the substrate processed in the processing step. It is a control method of an imprint device that forms a pattern of an imprint material on a substrate by using a mold having a pattern region.
The imprint device includes a holding portion for holding the mold, and the holding portion has a ring-shaped contact surface in contact with the mold.
The control method is
The first step of deforming the pattern region into a target shape by pressurizing the side surface of the mold, and
By temporarily applying a ring-shaped moment along the contact surface between the mold and the contact surface to shift the relative position between the mold and the contact surface, the mold is formed in the first step. A method for controlling an imprinting apparatus, which comprises a second step of reducing the non-uniformity of the strain distribution that occurs in the imprinting apparatus.

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