JP2021521479A - Surface texturing without bead blasting - Google Patents

Abstract

A system for providing a texture to the surface of a component for use in a semiconductor processing chamber is provided. The system includes an enclosure containing a processing area, a support located in the processing area, a photon light source to generate a photon flow, an optical module operably coupled to the photon light source, and a lens. The optical module includes a beam modulator for generating a photon beam from a flow of photons generated from a photon light source and a beam scanner for scanning the photon beam on the surface of a component. A lens is used to receive a beam of photons from a beam scanner and distribute a beam of photons with wavelengths in the range of about 345 nm to about 1100 nm on the surface of the component to form multiple features on the component. [Selection diagram] FIG. 12

Description

[0001] Embodiments of the present disclosure generally relate to methods and systems and devices for texturing the surface of components for use in semiconductor processing chambers.

As integrated circuit devices continue to be manufactured in reduced dimensions, the manufacture of these devices becomes increasingly susceptible to reduced yields due to contamination. As a result, the production of integrated circuit devices, especially those with smaller physical sizes, requires significant pollution control than previously thought to be necessary.

Contamination of integrated circuit devices can result from contamination sources such as thin film deposition, etching, or unwanted suspended particles that collide with the substrate during other semiconductor manufacturing processes. In general, the manufacture of integrated circuit devices includes the use of chambers including, but not limited to, physical vapor deposition (PVD) sputtering chambers, chemical vapor deposition (CVD) chambers, and plasma etching chambers. During the deposition and etching process, the material often condenses from the vapor phase onto the various internal surfaces of the chamber and on the surface of the chamber components located within the chamber. When the material condenses from the gas phase, the material forms a solid mass present on the surface of the chamber and components. This condensed foreign matter accumulates on the surface and tends to exfoliate or exfoliate from the surface during or during the wafer process sequence. This exfoliated foreign matter can collide with the wafer and the devices formed on it and contaminate it. Contaminated devices often need to be discarded, which reduces the manufacturing yield of the process.

In order to prevent exfoliation of the formed foreign matter, the inner surface of the chamber and the surface of the chamber component disposed within the chamber can be provided with a specific surface texture. The surface texture is configured such that foreign matter formed on these surfaces enhances the adhesion to the surface and reduces the possibility of peeling and contaminating the wafer. An important parameter of surface texture is surface roughness.

One of the common texturing processes is bead blasting. In the bead blasting process, solid blast beads are propelled towards the surface to be textured. One way a solid blast bead can be propelled towards a surface to be textured is by pressurized gas. Solid blast beads are made of suitable materials such as aluminum oxide, glass, silica, or hard plastic. Depending on the desired surface roughness, the blast beads can be of various sizes and shapes.

However, it can be difficult to control the uniformity and reproducibility of the bead blasting process. In addition, during the bead blasting process, the textured surface becomes sharply jagged and the impact of the solid blast bead breaks the tip of the surface, which can introduce a source of contamination. In addition, blast beads can be trapped or embedded within the surface during the bead blasting process. For example, if the textured surface contains small through-holes of various widths (eg, gas distribution showerheads), the blast beads can be trapped inside the through-holes. In such a situation, the blast bead not only prevents the through hole from functioning as a gas passage, for example, but also becomes a potential source of contamination of the wafer.

The surface of the chamber can also be textured using an electromagnetic beam. Texturing the chamber surface with an electromagnetic beam may overcome some of the above problems associated with bead blasting. However, the electromagnetic beam needs to be operated under vacuum to prevent scattering. Scattering can occur when the electrons in the electromagnetic beam interact with air or other gas molecules. Therefore, the electromagnetic beam needs to be operated in a vacuum chamber. The need for a vacuum chamber limits the size of the component that can be textured, as the component must fit within the vacuum chamber. In addition, the cost of capital associated with operating the electromagnetic beam is significantly higher than the cost of capital associated with the bead blasting process. For example, the need for a vacuum chamber increases the costs associated with texturing the surface with an electromagnetic beam.

Therefore, there is a need for an improved texturing process that overcomes the problems associated with bead blasting while avoiding the cost of capital and size constraints associated with the use of electromagnetic beams.

One embodiment of the present disclosure relates to a method of providing a texture on the surface of a component for use in a semiconductor processing chamber. This method directs a beam of photons to the surface of the component through ambient air or nitrogen and scans the beam of photons into a first region of the surface of the component to scan multiple features on the surface within the first region. The features that are formed, including forming, are depressions, ridges, or a combination thereof.

Another embodiment of the present disclosure relates to a method of providing a texture on the surface of a component for use in a semiconductor processing chamber. This method directs the photon beam to the surface of the component in an atmosphere with a pressure approximately equal to atmospheric pressure, and scans the photon beam to the first region of the component surface within the first region. The features that are formed, including the formation of multiple features on the surface of the, are indentations, ridges, or a combination thereof.

Another embodiment of the present disclosure is a component for use in a semiconductor processing chamber. A component comprises a plurality of features on a surface within a first region, the features formed being indentations, ridges, or a combination thereof. Features are formed by scanning a beam of photons onto the surface of a component.

Another embodiment of the present disclosure is a system for providing a texture on the surface of a component for use in a semiconductor processing chamber. The system is located in an enclosure that includes a processing area, a support that includes a support surface, a photon light source to generate a photon flow, and a photon light source that can operate to receive a photon flow from a photon light source. Includes combined optical modules and lenses. The optical module includes a beam modulator for generating a photon beam from a flow of photons generated from a photon light source and a beam scanner for scanning the photon beam on the surface of a component. A lens is used to receive a beam of photons from a beam scanner and distribute a beam of photons with wavelengths in the range of about 345 nm to about 1100 nm on the surface of the component to form multiple features on the component.

Another embodiment of the present disclosure is a method of providing a texture on the surface of a component for use in a semiconductor processing chamber. This method creates a flow of photons, shapes the flow of photons into a beam, and directs the photons toward the surface of the component through a processing area containing a gas concentration of ambient air or nitrogen at a pressure approximately equal to atmospheric pressure. It involves scanning the beam and distributing the beam of photons to the surface of the component to form multiple features on the surface.

Yet another embodiment of the present disclosure is a system for providing a texture on the surface of a component for use in a semiconductor processing chamber. This system includes an enclosure containing a processing area maintained as a Class 1 environment with a pressure approximately equal to atmospheric pressure, a support located in the processing area, including a support surface, a photon light source for generating photon flow, Includes an optical module operably coupled to the photon light source to receive the flow of photons from the photon light source, and a lens. The optical module includes a beam modulator for generating a photon beam from a flow of photons generated from a photon light source and a beam scanner for scanning the photon beam on the surface of a component. The lens receives a beam of photons from the beam scanner and distributes a beam of photons with wavelengths in the range of about 345 nm to about 1100 nm on the surface of the component and places it in the processing area to form multiple features on the component. Will be done.

A more specific description of the present disclosure briefly summarized above can be made by reference to embodiments so that the above features of the present disclosure can be understood in detail. Is shown in the attached drawing. However, it should be noted that the accompanying drawings show only exemplary embodiments and should therefore not be considered to limit their scope.

A schematic diagram of a laser machine and a support system according to the present disclosure is shown. An alternative schematic of the laser machine and support system according to the present disclosure is shown. FIG. 3 shows a top view of a gas-distributed shower head according to the present disclosure, in which the area to be textured is marked by a border. The process sequence of the method of operating the laser machine and the support system according to the present disclosure is shown. 5 and 6 show repetitive, random-shaped surface morphologies created by a laser machine in accordance with the present disclosure. FIG. 5 shows a perspective view showing the surface morphology. 5 and 6 show repetitive, random-shaped surface morphologies created by a laser machine in accordance with the present disclosure. FIG. 6 shows a top view showing the surface morphology. 7 and 8 show repetitive wavy surface morphologies created by a laser machine in accordance with the present disclosure. FIG. 7 shows a perspective view showing the surface morphology. 7 and 8 show repetitive wavy surface morphologies created by a laser machine in accordance with the present disclosure. FIG. 8 shows a top view and a side view showing the surface morphology. 9 and 10 show repetitive square-shaped surface morphologies created by a laser machine in accordance with the present disclosure. FIG. 9 shows a perspective view showing the surface morphology. 9 and 10 show repetitive square-shaped surface morphologies created by a laser machine in accordance with the present disclosure. FIG. 10 shows a top view and a side view showing the surface morphology. A schematic diagram of a laser machine and a laser device according to the present disclosure is shown. An alternative schematic of a laser machine and a laser device according to the present disclosure is shown. Shown is a graph comparing the results of textured components using the bead blasting process and the process according to the present disclosure.

For ease of understanding, the same elements common to the drawings are shown using the same reference numbers, if possible. It is contemplated that the elements and features of one embodiment may be beneficially incorporated into another embodiment without further enumeration.

The patent or application file contains at least one drawing executed in color. A copy of this patent or publication of the patent application with color drawings will be provided by the Office upon request and payment of the required fee.

The embodiments described herein utilize a beam of photons generated by a laser to perform a texturing process on the surface of a component for use in a semiconductor processing chamber. The beam of photons is directed at the surface of the component and scanned into the area of the surface to form multiple features. Features formed on the surface include indentations, ridges, and / or combinations thereof. The photon beam can be reduced in intensity, defocused, and / or scanned at a particular rate of movement to form the desired surface morphology.

FIG. 1 shows a schematic view of a laser machine 100 and a support system 102 that can be used to texture the surface 103 of a component 104. The component 104 can be, for example, a gas distribution shower head, a chamber wall, or an electrostatic chuck. The laser machine 100 includes a power supply 106, a controller 108, and a laser device 116. The laser device 116 outputs a beam of photons 112. The controller 108 may include a modulator and / or scanner for modulating and scanning the beam of photons 112. The laser machine may further include a pulse supply unit for pulsing the beam of photons 112. Pulsating the beam of photons 112 can help minimize the amount of heat applied to the surface 103 of the component 104. In addition, pulsing the beam of photons 112 can help reduce the problems that result from the reflectivity of the surface 103 of the component 104. The embodiments disclosed herein can be used to texture the surface 103 of the component 104 to have an arithmetic mean (Ra) of a roughness profile of about 60 μin to about 360 μin.

Component 104 may include materials such as metals or metal alloys, ceramic materials, polymeric materials, composite materials, or combinations thereof. In one embodiment, the component 104 is steel, stainless steel, tantalum, tungsten, titanium, copper, aluminum, nickel, gold, silver, aluminum oxide, aluminum nitride, silicon, silicon nitride, silicon oxide, silicon carbide, sapphire (Al). ₂ O ₃ ), silicon nitride, itria, ittrium oxide, and materials selected from the group including combinations thereof. In one embodiment, the component 104 is an austenite stainless steel, iron-nickel-chromium alloy (eg, Inconel ™ alloy), nickel-chromium-molybdenum-tungsten alloy (eg, Hastelloy®). )), Copper-zinc alloys, chromium-copper alloys (eg, 5% or 10% Cr and remaining Cu) and other metal alloys. In another embodiment, the component comprises quartz. Component 104 may also include polymers such as polyimide (Vespel ™), polyetheretherketone (PEEK), polyarylate (Ardel ™). In yet another embodiment, the component 104 is composed of gold, silver, silicon aluminum, germanium, germanium silicon, boron nitride, aluminum oxide, aluminum nitride, silicon, silicon nitride, silicon oxide, silicon carbide, itria, yttrium oxide, non-polymer. , And materials such as combinations thereof.

The support system 102 can be located downstream of the laser machine 100. The support system 102 includes a support 122 for supporting the component 104, similar to, for example, the substrate support in one or more embodiments. The support system 102 and the laser machine 100 are arranged relative to each other so that the beam of photons 112 output by the laser device 116 is directed at the surface 103 of the component 104. In one embodiment of the present disclosure shown in FIG. 1, the laser machine 100 may further include actuating means 124 for adjusting the position of the output of the laser device 116. In such an embodiment, the support 122 remains stationary and the actuating means 124 adjusts the position of the output of the laser device 116, whereby the beam of photons 112 output by the laser device 116 is exposed to the surface 103. Can be scanned into. In an alternative embodiment of the present disclosure shown in FIG. 2, the support system 102 may include actuating means 124 for moving the support 122. In such an embodiment, the output of the laser device 116 remains stationary and the actuating means 124 adjusts the position of the support 122, whereby the beam of photons 112 output by the laser device 116 is surfaced. It can be scanned by 103. The actuating means 124 for adjusting the position of either the laser device 116 or the support 122 may include, for example, an XY stage, an extension arm and / or a rotating shaft capable of translational and / or rotational movement.

A controller 108 may be connected to the laser device 116 so that it can control various parameters associated with the beam of the photon 112 output by the laser device 116. Specifically, the controller 108 can be connected to the laser device 116 to control at least the following parameters related to the beam of the photon 112: wavelength, pulse width, repetition rate, moving speed, output level, and beam. size. By being able to control these various parameters associated with the beam of the photon 112, the controller 108 can define the surface morphology formed on the surface 103 of the component 104. The "moving velocity" incorporates an embodiment in which the beam of the photon 112 is moving and the component 104 is stationary, and an embodiment in which the beam of the photon 112 is stationary and the component is moving. I want to be understood. As shown in FIG. 2, the controller 108 may also be connected to the support system 102 so that it can control the actuating means 124 connected to the support 122. Alternatively, a secondary controller may be connected to the support system 102 to control the actuating means 124 connected to the support 122.

The controller 108 may be one of any form of general purpose computer processor (CPU) that can be used in an industrial environment. The computer can use suitable memory such as random access memory, read-only memory, floppy disk drives, hard disks, or other forms of local or remote digital storage. Various support circuits can be coupled to the CPU to support the processor in the conventional way. If desired, software routines can be stored in memory or run on a second CPU located remotely. When a software routine is executed, it transforms a general-purpose computer into a specific process computer that controls its operation so that a chamber process is performed. Alternatively, the embodiments described herein may be performed in hardware as a purpose-built integrated circuit or other type of hardware implementation, or may be performed in software or a combination of hardware. ..

The laser device 116 of the laser machine 100 may have an output in the range of about 3W to about 30W. Alternatively, the laser machine may have an output in the range of about 1 W to about 150 W. The laser device 116 may also be able to pulse and change the parameters associated with the beam of the photon 112 (eg, wavelength, pulse width, pulse frequency, repetition rate, moving speed, output level, and beam size). .. The laser device 116 of the laser machine 100 can be a commercially available laser. An example of a commercially available laser machine that can follow this disclosure is the IPG YLPP laser from Spectra Physics' Quanta-Ray laser.

Since the output of the laser device 116 is a beam of photons 112, the laser machine 100 and the support system 102 do not require a vacuum environment to perform the texturing process. Therefore, the output of the laser device 116 is different from conventional electromagnetic beam generation systems that use electron beams to perform texturing processes. Electromagnetic beam systems typically require a vacuum environment (eg, a vacuum chamber) for the interaction and scattering of electrons with surrounding gas atoms, so that the vacuum environment maintains precise control of the electron beam. is necessary. As mentioned above, the requirements of the vacuum environment impose a physical constraint on the size of the component that can be textured using the electromagnetic beam system, as the component must fit within the vacuum chamber. In addition, the vacuum chamber must include special equipment (pumps, sensors, seals, etc.), which adds to the complexity of the electromagnetic system due to the requirements of the vacuum environment. As a result, the electromagnetic beam system has a significantly higher cost of capital than would be incurred when using the laser machine 100 and support system 102 discussed in this disclosure to perform the texturing process.

Therefore, the laser machine 100 and the support system 102 can be used in an ambient air environment in which the air through which the beam of photons 112 passes is about 78% nitrogen and about 21% oxygen. However, in some circumstances it may be desirable to place the laser machine 100 and the support system 102 in an oxygen-depleted environment. In such situations, the laser machine 100 and support system 102 can be placed in a chamber where nitrogen gas is used instead of ambient air. Since no vacuum is required, the pressure inside the chamber can be maintained at atmospheric pressure. It should be understood that "atmospheric pressure" may vary from place to place. In some embodiments, the pressure in the area where the component 104 is located may not be adjusted during the process.

FIG. 4 shows a process sequence 200 starting with 201 and ending with 209 for how to operate the laser machine 100 and the support system 102. In the box 202, the component 104 is placed on the support 122. In box 204, a first region 126 is defined on the surface 103 of component 104. As shown in FIG. 3, the component 104 is a gas distribution showerhead 133 having a plurality of through holes 135, and the first region 126 is a first outer boundary line 127 that defines the outer boundary of the first region. Has. The first outer boundary line 127 defines the first surface area. The ratio of the first surface area to the second surface area of the component 104 can be at least 0.6. The second surface area of the component 104 is defined by the second outer border 132 of the textured surface 103. Therefore, the first surface area located within the second surface area can be at least 60% of the second surface area. It should be understood that the size of the first and second surface areas will vary depending on the shape and size of the textured component 104. Alternatively, the ratio of the first surface area to the second surface area may be greater than 0.7, 0.8, and / or 0.9.

In box 206, the laser machine 100 is powered by a power source 106 such that the laser device 116 outputs a beam of photons 112. As discussed above, the controller 108 of the laser machine 100 can vary the parameters associated with the beam of the photon 112, depending on the desired texture on the surface 103. In one embodiment, the beam of photon 112 may have wavelengths in the range of about 345 nm to about 1100 nm. In another embodiment, the photon beam may have wavelengths in the ultraviolet range (about 170 nm to about 400 nm). In yet another embodiment, the photon beam may have wavelengths in the infrared range (about 700 nm to about 1.1 mm). The beam of photons 112 output by the laser device 116 is directed towards the surface 103 of the component 104 at a position within the first region 126. The beam of the photon 112 may have a beam diameter in the range of about 7 μm to about 75 μm on the surface 103 of the component 104. Alternatively, the beam of photons 112 may have a beam diameter in the range of about 2.5 μm to about 100 μm on the surface 103 of the component 104. In one embodiment, the working distance traveled by the beam of photon 112 is from about 50 millimeters to about 1,000 millimeters. In another embodiment, the working distance traveled by the beam of photon 112 is between about 200 mm and about 350 mm. Since the laser device 116 of the laser machine 100 can have an output in the range of about 1 W to about 150 W, the beam of the photon 112 has a pulse output in the range of ^{about 10 × 10-6} J to about 400 × ^{10-6 J.} Can have. The beam of photon 112 can have a pulse width in the range of about 10 ps to about 30 ns. Further, the beam of the photon 112 has a pulse repetition rate in the range of about 10 KHz to about 200 KHz in one embodiment, and more specifically, a pulse repetition rate in the range of about 10 KHz to about 3 MHz in another embodiment. Can have. Controller 108 can be used to control the pulse width and / or pulse repetition rate of the laser device 116.

In box 208, the beam of photons 112 is scanned into the first region 126 of the surface 103, thereby forming a plurality of features on the surface. The beam of the photon 112 can be scanned into the first region 126 of the surface 103 at a moving speed in the range of about 0.1 m / sec to about 30 m / sec, for example, while being pulsed from the laser device 116. As seen in FIGS. 5-10, the features formed as a result of the beam of photons 112 being scanned into the first region 126 of the surface 103 include indentations, ridges, or a combination thereof. Controller 108 can be programmed to change certain parameters associated with the beam of photons 112 as the beam is scanned into the first region 126. For example, the controller 108 can pulse the beam of photons 112 while the beam is being scanned into the first region 126. In one embodiment, the controller 108 can control the laser device 116 to have a pulse width in the range of about 0.2 ns to about 100 ns. In one embodiment, the controller 108 can control the laser device 116 to have a pulse width in the range of about 400 fs to about 200 ns.

In this way, the laser machine 100 can be used to form the overall surface morphology of the first region.

Depending on the situation, the laser machine 100 can be used to form three different types of surface morphology in the first region 126. As shown in FIGS. 5 and 6, the first surface morphology is a repeating random shape that produces a combination of ridges and depressions. It should be understood that multiple ridges can have, for example, a flat surface and a convex surface. In FIGS. 5 and 6, the maximum variation in height from the lowest depression to the highest ridge is in the range of about 4,000 nm to about 4,500 nm. Since the surface morphology is a repeating random shape, the ridges and depressions do not form periodic waves.

By synchronizing the pulse frequency and the scanning speed, a repetitive shape can be realized. When the pulsed laser and the substrate are moving relative to each other, the laser emits radiation, which collides with the surface of the substrate at repeating intervals, resulting in a repeating shape. The exact shape of the repeating shape can be adjusted by adjusting the time profile of the laser pulse to the scanning speed. When a laser pulse with a very fast output ramp time compared to the scan speed is used, the repeating shape tends towards a substantially rectangular profile, as the substrate does not move far during ramp-up or ramp-down. Tend. If the ramp time is very small compared to the pulse duration, then the repeated shape tends towards a substantially rectangular profile as well, since the time profile of the laser pulse is substantially flat. When the scanning speed is low compared to the pulse duration or ramp time, the photons delivered by each laser pulse are concentrated in a smaller area of the substrate, so that the repeating shape is also substantially rectangular. Tends towards the profile of. Increasing the ramp time and / or scan speed relative to the pulse duration causes the corners of the formed features to be more rounded or more tapered. The laser pulse itself can also be modulated by coupling a waveform generator to a laser power source. In this way, more tapered ramp velocity pulses, and even sinusoidal time profile pulses can be generated. Such means result in features that tend towards a wavy shape. The feature pitch is determined by the relationship between the pulse frequency and the scanning speed. Therefore, the feature pitch can be adjusted independently by adjusting the pulse frequency, and the pulse frequency is limited by the pulse duration.

An example of the repeating random shape Ra shown in FIGS. 5 and 6 is at about 60 μin when the output of the laser machine 100 is 30 W, the component 104 is aluminum and the beam diameter is about 7 μm. be. It should be understood that the Ra value will vary depending on the output of the laser machine 100 and the various variables associated with the beam of the photon 112. The repetitive random shapes achieved using the laser machine 100 are achieved using the bead blasting process, except that the use of the laser machine 100 avoids some of the problems inherent in the bead blasting process. It may have the same surface morphology and Ra value as it can. For example, if component 104 is a gas distribution showerhead 133 (schematically shown in FIG. 3), there will be multiple tapered through holes 135. As mentioned above, the bead blasting process involves fast blasting multiple beads onto the surface to be textured. As a result, there is an inherent lack of control and precision regarding the bead blasting process.

The beads used in the bead blasting process can also be trapped or embedded within the through hole 135. In addition, the beads may hit the corners or edges of the through hole 135 and change the profile of the through hole in an undesired manner rather than texture the surface 103. Texturing the gas-distributed showerhead 133 with a repeating, random-shaped surface morphology using the laser machine 100 uses the through-hole 135 of the showerhead 133 for higher precision that can be achieved through this texturing process. Does not change the boundary profile of. The laser machine 100 can texture the surface 103 in the first region 126 so that the repeating random shape is continuously repeated within the first outer boundary line 127.

As shown in FIGS. 7 and 8, the second surface morphology is a repeating wave shape that produces a combination of ridges and depressions. It should be understood that multiple ridges can have, for example, a nearly convex surface. In FIGS. 7 and 8, the maximum variation in height from the lowest depression to the highest ridge is in the range of about 4,000 nm to about 4,500 nm. Since the surface morphology is a repetitive wavy shape, the ridges and depressions form a periodic profile, with each of the ridges coming to a nearly convex pointed portion. The periodic profile associated with the repeating wave shape is repeated across the first region 126 of the surface 103 along both the x-axis of the surface and the y-axis of the surface.

An example of the arithmetic mean (Ra) of the repeated wave-shaped roughness profile shown in FIGS. 7 and 8 is that the laser machine 100 has an output of 30 W, the component 104 is aluminum, and the beam diameter is about. When it is 7 μm, it is about 108 μin. It should be understood that the Ra value will vary depending on the output of the laser machine 100 and the various variables associated with the beam of the photon 112. Unlike the repeating random shape, the repeating wave shape is different from the surface morphology normally achieved using the bead blasting process. The laser machine 100 can texture the surface 103 in the first region 126 so that the repeating wave shape is continuously repeated within the first outer boundary line 127.

As shown in FIGS. 9 and 10, the third surface morphology is a repeating square shape that produces a combination of ridges and depressions. It should be understood that multiple ridges can have, for example, a nearly flat surface. In FIGS. 9 and 10, the maximum variation in height from the lowest depression to the highest ridge is in the range of about 4,000 nm to about 4,500 nm. Since the surface morphology is a repeating square shape, the ridges and depressions form a periodic profile, with each of the ridges coming to a nearly flat portion. The periodic profile associated with the repeating square shape is repeated across the first region 126 of the surface 103 along both the x-axis of the surface and the y-axis of the surface.

An example of the arithmetic mean (Ra) of the repeating square roughness profile shown in FIGS. 9 and 10 is that the laser machine 100 has an output of 30 W, the component 104 is aluminum, and the beam diameter is about. When it is 25 μm, it is about 357 μin. It should be understood that the Ra value will vary depending on the output of the laser machine 100 and the various variables associated with the beam of the photon 112. The repeating square shape may be particularly applicable when the component 104 is an electrostatic chuck. As most often seen in FIG. 9, the repeated ridges and depressions in the square shape provide multiple passages. The plurality of passages allows the gas to pass through, for example, a passage under the silicon wafer located above the electrostatic chuck during wafer processing.

Subsequent polishing processes are performed after the texturing process to facilitate flattening of the top surface of the ridge, thereby facilitating the adhesion of the silicon wafer to the electrostatic chuck during wafer processing. Can be done. The portion of component 104 that was not flattened during the polishing process retains surface roughness, which helps prevent delamination of foreign matter that has condensed into multiple passages during wafer processing. The laser machine 100 can texture the surface 103 in the first region 126 so that the repeating square shape is continuously repeated within the first outer boundary line 127.

Another advantage associated with the use of the laser machine 100 is that the surface 103 of the textured component 104 does not need to undergo a precise pre-cleaning process prior to the process box 202. Instead, all that is needed is a rough pre-cleaning process to degreas the surface 103 of the component 104. This is different from electromagnetic beam systems, which generally require a precise pre-cleaning process due to the high reactivity of the electron beam.

Yet another advantage associated with the use of the laser machine 100 to texture the surface 103 of the component 104 is in the vacuum chamber, as in the case where an electromagnetic beam system is used after the box 202. There is no additional step to pump down the pressure. As discussed above, the electromagnetic beam system is operated in a vacuum environment, which requires pumping down the pressure of the environment. The laser machine 100 and the support system 102 may be placed in a chamber intended to create an oxygen-depleted environment, but the environmental pressure need not be pumped down. Since this pump downstep is eliminated, the time required to texture the surface 103 of the component 104 with the laser machine 100 is less than the time required to texture the surface of the component with the electron beam. This helps to improve the throughput associated with texturing the surface of the component using the laser machine 100 as compared to texturing the surface of the component using an electromagnetic beam system. The throughput associated with the laser machine 100 is also such that the moving speed at which the electron beam can be scanned onto the surface to form multiple features is greater than the moving speed at which the beam of photon 112 can be scanned onto the surface. It is significantly slower than the throughput associated with using an electromagnetic beam system. For example, the moving speed of the electron beam is in the range of about 0.02 M / sec to about 0.03 M / sec when the surface is textured. As discussed above, the moving speed of the beam of photons 112 ranges from about 0.1 M / s to about 300 M / s when textured on the surface.

Another advantage associated with texturing the surface 103 of component 104 using the beam of photons 112 output by the laser device 116 is that it is cleaner than using, for example, bead blasting or electron beams. It is possible to create a new process. Depending on the wavelength of the beam of the photon 112, the material of the surface 103 to which the beam of photons is directed can mainly receive radiation or thermal energy of light to modify the surface. The emission of light melts the surface 103 of the component 104 at the position where the beam of photons is directed, thereby producing a melted material or slag, which, when resolidified, forms either a depression or a ridge. do. Since the kinetic energy associated with the melted material can be minimized, the melted material is less likely to be knocked out of the remaining surface 103 and redeposited elsewhere. This reduces the amount of redeposition that could otherwise have occurred. Conversely, when using an electromagnetic beam system, the textured components often have electrons embedded in them that interact with the electron beam to generate significant energy, resulting in significant energy. At least a portion of the melted material is knocked out of the remaining surface, thereby increasing the likelihood of redeposition. As a result, texturing the surface with a beam of photons 112 can result in a cleaner process than texturing the surface with an electron beam.

Note that the beam of photons 112 delivered by the laser device 116 to the surface 103 of component 104 is not intended to cause significant or large distortion of component 104 (eg, melting, warping, cracking, etc.). I want to be. Significant or large distortion of component 104 can generally be defined as a condition in which component 104 cannot be used for its intended purpose by applying a texturing process.

11 and 12 show a schematic representation of a laser machine 100 that can be used to texture the surface 103 of the component 104. In detail, FIGS. 11 and 12 show different arrangements, parts, and elements of the laser machine 100 and / or the laser device 116. As shown in FIG. 11, the laser machine 100 may have a direction perpendicular to the component 104, or as shown in FIG. 12, the laser device 116 has a horizontal direction with respect to the component 104. You may. As discussed above, component 104 is used within the semiconductor processing chamber. The component 104 can be, for example, a gas distribution shower head, a shield, a chamber liner, a covering, a clamp ring, a substrate support pedestal, and / or an electrostatic chuck. Therefore, after texturing with the laser machine 100, the component 104 is used as a component of the semiconductor processing chamber, where semiconductors such as wafers are processed in the semiconductor processing chamber.

As discussed above, the laser device 116 is used to output a beam of photons. The laser devices 116 of FIGS. 11 and 12 are shown to include a light source 142 such as a photon light source, an optical module 144, and a lens 146, each operably coupled to each other. However, in other embodiments, the laser device 116 is shown to include a light source 142, an optical module 144, and a lens 146, but the present disclosure is not so limited. For example, in one or more other embodiments, the power supply 106 and / or controller 108 shown in FIGS. 1 and 2 additionally or alternatively, without departing from the scope of the present disclosure, the light source 142, optics. Module 144 and / or lens 146 can be included.

The light source 142 is used to generate a source of light, more specifically, in this embodiment, a flow of photons. The optical module 144 operably coupled to the light source 142 receives the photon flow from the light source 142 and shapes, directs, or otherwise modulates the photon flow from the light source 142. The optical module 144 includes a beam modulator and a beam scanner, which is located downstream of the beam modulator (relative to the light source 142). The beam modulator receives a photon stream from the light source 142 and produces a photon beam from the photon stream. For example, a beam modulator can be used to generate a beam of photons with a single focal point by shaping the flow of photons from the light source 142. A beam scanner is used to receive a beam of photons from a beam modulator and scan the beam of photons onto the surface 103 of component 104. As such, beam scanners are used to direct, deflect, and otherwise control the beam of photons, such as through the use of electromechanical actuators.

[0057] Lens 146 is used to receive a beam of photons from the optical module 144, more specifically from a beam scanner, and distribute the beam of photons to the surface 103 of component 104. The lens 146 defocuses the photon beam because the beam modulator of the optical module 144 is used to focus the photon flow into a photon beam, such as a photon single focus beam. , Used to evenly distribute over a given area or area. For example, a lens 146 can be used to distribute a ^{beam of photons over an area of about 355 mm 2.} A beam of photons distributed across the surface 103 of the component 104 to form one or more textured features on the surface 103 of the component 104, such as depressions and / or ridges on the surface 103 of the component 104. Used for.

The laser device 116 is used to control the output, velocity, frequency, direction, distribution, and / or pulse of a beam of photons emitted from the laser device 116 and scanned onto the surface 103 of the component 104. .. For example, the light source 142 and / or the optical module 144 can be used to pulse the photon beam while it is being scanned onto the surface 103 of the component 104. In addition, the beam scanner of the optical module 144 can be used to direct the beam of photons or scan the surface 103 of the component 104 in one or more predetermined patterns. In one embodiment, a beam scanner can be used to scan a beam of photons using line-by-line patterns, sparrow patterns, and / or random patterns. The sparrow pattern scans the beam of photons in an out-to-in or in-to-out pattern with respect to the central or central region of the surface 103 of the component 104 and therefore operates in a radial pattern as opposed to a line-by-line pattern. Including that.

The laser device 116 is also used to distribute and scan a beam of photons vertically or horizontally from the lens 146 towards the surface 103 of the component 104. The support 122, including the support surface 190, has been shown to be used with the laser machine 100, with the component 104 disposed between the lens 146 and the support 122. In the arrangement shown in FIG. 11, where the beam of photons is distributed perpendicularly to the surface 103 of the component 104, the support surface 190 is used to support the component 104 on the support 122, thus the component 104 , Is arranged on the support surface 190 of the support 122. In the arrangement shown in FIG. 12, where the beam of photons is distributed horizontally towards the surface 103 of the component 104, the support surface 190 of the support 122 is used as a barrier behind the component 104. The advantage of the horizontal arrangement shown in FIG. 12 is that gravity can be used to pull the material away from the surface 103 of the component 104, such as when the material melts. This allows the process to be cleaner than if the material could be redeposited or formed on the surface.

Further referring to FIGS. 11 and 12, a clean enclosure 150 or clean compartment for use with the laser machine 100 is included. The clean enclosure 150 generally includes a processing area 151 in which the support 122 is located. For example, the component 104 is placed in the clean enclosure 150 during the texturing process, and the processing area 151 of the clean enclosure 150 can maintain the processing area as a class 1 environment according to the classification parameters from ISO 14644-1. including. In addition, at least a portion of the laser device 116, such as the support 122 and the lens 146, is located within the clean enclosure 150. Since the laser machine 100 is used in an unpressurized (eg, atmospheric pressure) environment, the pressure in the clean enclosure 150 can be approximately equal to or approximately atmospheric pressure, or the pressure is high. It does not have to be adjusted. Clean enclosure 150, oxygen, water, and / or to remove other process contaminants, alternatively and / or additionally, an inert gas (e.g., N ₂₎ may be purged with. In addition, a conveyor can be used to introduce the component 104 into the clean enclosure 150 and onto the support 122, and / or a conveyor can be used to remove the component 104 from the support 122 and out of the clean enclosure 150. be able to. For example, the support 122 may include a conveyor in such an embodiment. Alternatively, a separate robot arm or similar mechanism can be used to facilitate the removal of the component 104 from the conveyor and / or the placement of the component 104 on the conveyor.

FIG. 13 shows a component textured using the bead blast process 302, a component textured using the laser process 304 according to the embodiments described herein, and used in a semiconductor processing chamber. Shown is a graphical representation comparing the results of the average elements of specification 306 commonly required for the components to be made. The x-axis provides the various elements tested on each component (such as trace metals) and the y-axis provides the amount of elements on the surface of the component in units of ^{atoms / cm 2.} As shown, components textured using the laser process 304 generally have less elements or trace metals than those required by specification 306 and generally use the bead blast process 302. Had less elements or trace metals than those textured. For example, the beads used in the bead blasting process 302 generally contain sodium (Na), so in contrast to the bead blasting process 302, the components textured using the laser process 304 have a higher amount of sodium. It decreased significantly. Components textured using the laser process 304 may generally have a higher amount of magnesium (Mg), but these components are then then diluted acid and high purity water (eg, high temperature). It can be washed with deionized water) to remove excess magnesium. Therefore, a component textured using the laser process 304 will be compared to a component textured using the bead blast process 302 (yield is expected to be about 50%) and subsequent semiconductors. During the process, it resulted in higher yields such as about 95%.

Although the above is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope of the present disclosure. The scope is determined by the following claims.

Claims (15)

A system for providing texture to the surface of components for use in semiconductor processing chambers.
Enclosure containing processing area,
A support arranged in the processing area and having a support surface,
Photon light source for generating photon flow,
An optical module operably coupled to the photon light source so as to receive the flow of photons from the photon light source.
A beam modulator for generating a beam of photons from the flow of photons generated from the photon light source, and a beam scanner for scanning the beam of photons on the surface of the component.
The beam of photons is received from the beam scanner and the beam of photons having a wavelength in the range of about 345 nm to about 1100 nm is distributed to the surface of the component to generate a plurality of features on the component. Lens to form,
System with. The system of claim 1, wherein the lens is configured to horizontally distribute the beam of photons towards the surface of the component. The system of claim 1, wherein the lens is configured to vertically distribute the beam of photons towards the surface of the component. The component is placed between the lens and the support, the processing area is maintained as a class 1 environment, and the support surface of the support and the lens are placed in the class 1 environment. Claim that the processing area has a pressure approximately equal to atmospheric pressure, and the system further comprises a conveyor for introducing the component into the class 1 environment or removing the component from the class 1 environment. The system according to 1. The system of claim 1, wherein the beam scanner is configured to scan the beam of photons onto the surface of the component using a line-by-line pattern or a sparrow pattern. The system of claim 1, wherein the optical module is configured to pulse the beam of photons while scanning the beam of photons on the surface of the component. The beam of photons
Beam diameter in the range of about 7 μm to about 100 μm,
Pulse widths in the range of about 10 ps to about 30 ns, and pulse repetition rates in the range of about 10 KHz to about 200 KHz,
The system according to claim 6. The system of claim 1, wherein the features formed include indentations, ridges, or a combination thereof. A method of providing a texture to the surface of a component for use in a semiconductor processing chamber.
Generating a flow of photons,
Forming the flow of photons into a beam,
Scanning the beam of photons toward the surface of the component through a processing area containing a gas concentration of ambient air or nitrogen having a pressure approximately equal to atmospheric pressure, and the beam of photon on the surface of the component. To form multiple features on the surface,
How to include. 9. The method of claim 9, further comprising assembling the semiconductor processing chamber with the components and processing semiconductors within the semiconductor processing chamber. 9. The provision further comprises placing the component in an enclosure maintained as a Class 1 environment, the placement comprising transporting the component into the Class 1 environment using a conveyor. The method described. 9. The method of claim 9, wherein the distribution comprises distributing the beam of photons horizontally towards the surface of the component. Further comprising pulsing the beam of photons while scanning the beam of photons on the surface of the component, the beam of photons comprising wavelengths in the range of about 345 nm to about 1100 nm and formed. 9. The method of claim 9, wherein the features to be made include indentations, ridges, or a combination thereof. A system for providing texture to the surface of components for use in semiconductor processing chambers.
An enclosure containing a processing area maintained as a Class 1 environment with a pressure approximately equal to atmospheric pressure,
A support arranged in the processing area and having a support surface,
Photon light source for generating photon flow,
An optical module operably coupled to the photon light source so as to receive the flow of photons from the photon light source.
A beam modulator for generating a beam of photons from the flow of photons generated from the photon light source, and a beam scanner for scanning the beam of photons on the surface of the component.
The beam of photons is received from the beam scanner, and the beam of photons having a wavelength in the range of about 345 nm to about 1100 nm is distributed to the surface of the component to generate a plurality of features on the component. Lenses arranged in the processing area to form,
System with. 14. The system of claim 14, wherein the lens is configured to horizontally distribute the beam of photons towards the surface of the component.

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