JP2021501227A - 樹脂組成物及び樹脂注入プロセス - Google Patents
樹脂組成物及び樹脂注入プロセス Download PDFInfo
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- JP2021501227A JP2021501227A JP2020522375A JP2020522375A JP2021501227A JP 2021501227 A JP2021501227 A JP 2021501227A JP 2020522375 A JP2020522375 A JP 2020522375A JP 2020522375 A JP2020522375 A JP 2020522375A JP 2021501227 A JP2021501227 A JP 2021501227A
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- resin composition
- epoxy resin
- curable epoxy
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- 229920005989 resin Polymers 0.000 title claims abstract description 40
- 239000011347 resin Substances 0.000 title claims abstract description 40
- 238000002347 injection Methods 0.000 title claims abstract description 14
- 239000007924 injection Substances 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000011342 resin composition Substances 0.000 title abstract description 25
- 239000000203 mixture Substances 0.000 claims abstract description 53
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 53
- 239000003822 epoxy resin Substances 0.000 claims abstract description 37
- 239000002245 particle Substances 0.000 claims abstract description 23
- 150000004982 aromatic amines Chemical class 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 229920001971 elastomer Polymers 0.000 claims abstract description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000011258 core-shell material Substances 0.000 claims abstract description 11
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims abstract description 11
- GUJZISPOCRVAMW-UHFFFAOYSA-N 2-[1-(2-hydroxyphenyl)-9h-fluoren-2-yl]phenol Chemical compound OC1=CC=CC=C1C1=CC=C(C=2C(=CC=CC=2)C2)C2=C1C1=CC=CC=C1O GUJZISPOCRVAMW-UHFFFAOYSA-N 0.000 claims abstract description 5
- LJBWJFWNFUKAGS-UHFFFAOYSA-N 2-[bis(2-hydroxyphenyl)methyl]phenol Chemical compound OC1=CC=CC=C1C(C=1C(=CC=CC=1)O)C1=CC=CC=C1O LJBWJFWNFUKAGS-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000004593 Epoxy Substances 0.000 claims description 22
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 22
- 150000002118 epoxides Chemical class 0.000 claims description 11
- 230000001588 bifunctional effect Effects 0.000 claims description 10
- 229920003986 novolac Polymers 0.000 claims description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 125000001624 naphthyl group Chemical group 0.000 claims description 4
- CIZUMWWHWPJAAK-UHFFFAOYSA-N 4-[9-(4-amino-3-chlorophenyl)fluoren-9-yl]-2-chloroaniline Chemical group C1=C(Cl)C(N)=CC=C1C1(C=2C=C(Cl)C(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 CIZUMWWHWPJAAK-UHFFFAOYSA-N 0.000 claims description 3
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 claims description 3
- 125000003277 amino group Chemical group 0.000 claims description 3
- 229910052794 bromium Inorganic materials 0.000 claims description 3
- 229910052801 chlorine Inorganic materials 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 229910052736 halogen Chemical group 0.000 claims description 3
- 150000002367 halogens Chemical group 0.000 claims description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 claims description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 2
- 229930003836 cresol Natural products 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 claims description 2
- XOOMNEFVDUTJPP-UHFFFAOYSA-N naphthalene-1,3-diol Chemical compound C1=CC=CC2=CC(O)=CC(O)=C21 XOOMNEFVDUTJPP-UHFFFAOYSA-N 0.000 claims description 2
- PCILLCXFKWDRMK-UHFFFAOYSA-N naphthalene-1,4-diol Chemical compound C1=CC=C2C(O)=CC=C(O)C2=C1 PCILLCXFKWDRMK-UHFFFAOYSA-N 0.000 claims description 2
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical group OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 claims description 2
- ZUVBIBLYOCVYJU-UHFFFAOYSA-N naphthalene-1,7-diol Chemical compound C1=CC=C(O)C2=CC(O)=CC=C21 ZUVBIBLYOCVYJU-UHFFFAOYSA-N 0.000 claims description 2
- JRNGUTKWMSBIBF-UHFFFAOYSA-N naphthalene-2,3-diol Chemical compound C1=CC=C2C=C(O)C(O)=CC2=C1 JRNGUTKWMSBIBF-UHFFFAOYSA-N 0.000 claims description 2
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 4
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- 239000011159 matrix material Substances 0.000 description 5
- 239000003733 fiber-reinforced composite Substances 0.000 description 4
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- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical group C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
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- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- VIOMIGLBMQVNLY-UHFFFAOYSA-N 4-[(4-amino-2-chloro-3,5-diethylphenyl)methyl]-3-chloro-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C(=C(CC)C(N)=C(CC)C=2)Cl)=C1Cl VIOMIGLBMQVNLY-UHFFFAOYSA-N 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 2
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- 239000010954 inorganic particle Substances 0.000 description 2
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- 229920000090 poly(aryl ether) Polymers 0.000 description 2
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- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- 0 *c(cc(Cc(cc1N)cc(*)c1I)cc1N)c1N Chemical compound *c(cc(Cc(cc1N)cc(*)c1I)cc1N)c1N 0.000 description 1
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- HPILSDOMLLYBQF-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical class C1OC1COC(CCC)OCC1CO1 HPILSDOMLLYBQF-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- AHIPJALLQVEEQF-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1COC(C=C1)=CC=C1N(CC1OC1)CC1CO1 AHIPJALLQVEEQF-UHFFFAOYSA-N 0.000 description 1
- FLNVGZMDLLIECD-UHFFFAOYSA-N 4-[(4-amino-3-methyl-5-propan-2-ylphenyl)methyl]-2-methyl-6-propan-2-ylaniline Chemical compound CC1=C(N)C(C(C)C)=CC(CC=2C=C(C(N)=C(C)C=2)C(C)C)=C1 FLNVGZMDLLIECD-UHFFFAOYSA-N 0.000 description 1
- RKGBYYYYPJDQBJ-UHFFFAOYSA-N 4-[2-chloro-9-[4-(ethylamino)phenyl]fluoren-9-yl]-n-ethylaniline Chemical compound C1=CC(NCC)=CC=C1C1(C=2C=CC(NCC)=CC=2)C2=CC(Cl)=CC=C2C2=CC=CC=C21 RKGBYYYYPJDQBJ-UHFFFAOYSA-N 0.000 description 1
- RLJFPYAQWNGEGN-UHFFFAOYSA-N 4-[2-tert-butyl-9-[4-(methylamino)phenyl]fluoren-9-yl]-n-methylaniline Chemical compound C1=CC(NC)=CC=C1C1(C=2C=CC(NC)=CC=2)C2=CC(C(C)(C)C)=CC=C2C2=CC=CC=C21 RLJFPYAQWNGEGN-UHFFFAOYSA-N 0.000 description 1
- IACPVWZKWFQNPK-UHFFFAOYSA-N 4-[9-(4-aminophenyl)-1,2,3,4,5,6,7,8-octafluorofluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C(C(F)=C(F)C(F)=C2F)=C2C2=C1C(F)=C(F)C(F)=C2F IACPVWZKWFQNPK-UHFFFAOYSA-N 0.000 description 1
- AUWWIUNEUPZESF-UHFFFAOYSA-N 4-[9-(4-aminophenyl)-1,5-dimethylfluoren-9-yl]aniline Chemical compound CC1=CC=CC2=C1C1=CC=CC(C)=C1C2(C=1C=CC(N)=CC=1)C1=CC=C(N)C=C1 AUWWIUNEUPZESF-UHFFFAOYSA-N 0.000 description 1
- IWRAVODFRBEXME-UHFFFAOYSA-N 4-[9-(4-aminophenyl)-1-chlorofluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=C(Cl)C=CC=C2C2=CC=CC=C21 IWRAVODFRBEXME-UHFFFAOYSA-N 0.000 description 1
- YIIYKJRTZIJAJW-UHFFFAOYSA-N 4-[9-(4-aminophenyl)-2,6-dimethylfluoren-9-yl]aniline Chemical compound C=1C(C)=CC=C2C=1C1=CC=C(C)C=C1C2(C=1C=CC(N)=CC=1)C1=CC=C(N)C=C1 YIIYKJRTZIJAJW-UHFFFAOYSA-N 0.000 description 1
- QGRDPVZBEAGAQT-UHFFFAOYSA-N 4-[9-(4-aminophenyl)-2,7-dichlorofluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC(Cl)=CC=C2C2=CC=C(Cl)C=C21 QGRDPVZBEAGAQT-UHFFFAOYSA-N 0.000 description 1
- AMRHANGJBYPGKE-UHFFFAOYSA-N 4-[9-(4-aminophenyl)-2,7-dinitrofluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC([N+]([O-])=O)=CC=C2C2=CC=C([N+]([O-])=O)C=C21 AMRHANGJBYPGKE-UHFFFAOYSA-N 0.000 description 1
- UTJKHWKMYHOCCL-UHFFFAOYSA-N 4-[9-(4-aminophenyl)-2-chloro-4-methylfluoren-9-yl]aniline Chemical compound CC1=CC(Cl)=CC2=C1C1=CC=CC=C1C2(C=1C=CC(N)=CC=1)C1=CC=C(N)C=C1 UTJKHWKMYHOCCL-UHFFFAOYSA-N 0.000 description 1
- PBZLWMSBVHQLHN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)-2-ethylfluoren-9-yl]aniline Chemical compound C12=CC(CC)=CC=C2C2=CC=CC=C2C1(C=1C=CC(N)=CC=1)C1=CC=C(N)C=C1 PBZLWMSBVHQLHN-UHFFFAOYSA-N 0.000 description 1
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- XLCCSOUCJJGGKM-UHFFFAOYSA-N 4-[9-(4-aminophenyl)-3-bromofluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=C(Br)C=C2C2=CC=CC=C21 XLCCSOUCJJGGKM-UHFFFAOYSA-N 0.000 description 1
- PHXKKHVBLDSVKR-UHFFFAOYSA-N 4-[9-(4-aminophenyl)-4-chlorofluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C(C=CC=C2Cl)=C2C2=CC=CC=C21 PHXKKHVBLDSVKR-UHFFFAOYSA-N 0.000 description 1
- PJBLZPUJWNTDPL-UHFFFAOYSA-N 4-[9-(4-aminophenyl)-4-methylfluoren-9-yl]aniline Chemical compound CC1=CC=CC2=C1C1=CC=CC=C1C2(C=1C=CC(N)=CC=1)C1=CC=C(N)C=C1 PJBLZPUJWNTDPL-UHFFFAOYSA-N 0.000 description 1
- WRIQVHHYPAKIFD-UHFFFAOYSA-N 4-[9-[4-(ethylamino)phenyl]fluoren-9-yl]-n-methylaniline Chemical compound C1=CC(NCC)=CC=C1C1(C=2C=CC(NC)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 WRIQVHHYPAKIFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- GYPOSIZREIGVCF-UHFFFAOYSA-N C(C1CO1)C1=C(C=CC=C1)C(C1=CC=CC=C1)(N)N Chemical compound C(C1CO1)C1=C(C=CC=C1)C(C1=CC=CC=C1)(N)N GYPOSIZREIGVCF-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
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- 239000007795 chemical reaction product Substances 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
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- 238000002296 dynamic light scattering Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- DPNISTOAESHQJF-UHFFFAOYSA-N n-methyl-4-[2-methyl-9-[4-(methylamino)phenyl]fluoren-9-yl]aniline Chemical compound C1=CC(NC)=CC=C1C1(C=2C=CC(NC)=CC=2)C2=CC(C)=CC=C2C2=CC=CC=C21 DPNISTOAESHQJF-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/42—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
- B29C70/46—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs
- B29C70/48—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs and impregnating the reinforcements in the closed mould, e.g. resin transfer moulding [RTM], e.g. by vacuum
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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Abstract
Description
(A)少なくとも2種のポリエポキシド(そのうちの一方は、二官能性エポキシドであり、他方は、式I:
によって表されるトリス(ヒドロキシフェニル)メタンのトリグリシジルエーテルである)
(B)式II:
(式中、Aは、-NHRによって表されるアミン基であり、Rは、水素、1〜6個の炭素原子(C1〜C6)を有する直鎖及び分岐アルキル基から独立して選択され、好ましくはAは、NH2であり;
Bは、
から選択され、
Cは、C1〜C6アルキル基及びイソプロピル基から選択され;及びXは、Cl、Br、F、Iから選択されるハロゲン、又は水素(H)である)
によって表される少なくとも1種の芳香族アミン硬化剤;及び
(C)コア−シェルゴム粒子
を含有する。
が挙げられる。
4−メチル−9,9−ビス(4−アミノフェニル)フルオレン、
4−クロロ−9,9−ビス(4−アミノフェニル)フルオレン、
2−エチル−9,9−ビス(4−アミノフェニル)フルオレン、
2−ヨード−9,9−ビス(4−アミノフェニル)フルオレン、
3−ブロモ−9,9−ビス(4−アミノフェニル)フルオレン、
9−(4−メチルアミノフェニル)−9−(4−エチルアミノフェニル)フルオレン、
1−クロロ−9,9−ビス(4−アミノフェニル)フルオレン、
2−メチル−9,9−ビス(4−アミノフェニル)フルオレン、
2,6−ジメチル−9,9−ビス(4−アミノフェニル)フルオレン、
1,5−ジメチル−9,9−ビス(4−アミノフェニル)フルオレン、
2−フルオロ−9,9−ビス(4−アミノフェニル)フルオレン、
1,2,3,4,5,6,7,8−オクタフルオロ−9,9−ビス(4−アミノフェニル)フルオレン、
2,7−ジニトロ−9,9−ビス(4−アミノフェニル)フルオレン、
2−クロロ−4−メチル−9,9−ビス(4−アミノフェニル)フルオレン、
2,7−ジクロロ−9,9−ビス(4−アミノフェニル)フルオレン、
2−アセチル−9,9−ビス(4−アミノフェニル)フルオレン、
2−メチル−9,9−ビス(4−メチルアミノフェニル)フルオレン、
2−クロロ−9,9−ビス(4−エチルアミノフェニル)フルオレン、
2−t−ブチル−9,9−ビス(4−メチルアミノフェニル)フルオレン
が挙げられる。
によって表される、4,4’−ジアミノジフェニルスルホン(4,4’−DDS)及び3,3’−ジアミノジフェニルスルホン(3,3’−DDS)が挙げられる。
24%〜38%の量で存在してもよい。
によって表されるビス(ヒドロキシフェニル)フルオレンのジグリシジルエーテルをさらに含んでもよい。
存在する場合、フルオレニルエポキシは、組成物の全重量に基づく重量で、0%超で20%まで、例えば、4%〜18%の量で存在してもよい。
(A)少なくとも2種のポリエポキシド(そのうちの一方は、フルオレニルエポキシ、特に、上に開示された式IVによって表される化合物であり、他方は、ナフタレン系エポキシである);
(B)上に開示された式IIによって表される芳香族アミン硬化剤;及び
(C)コア−シェルゴム粒子
を含有する。
コア−シェルゴム(CSR)粒子は、エポキシ系樹脂組成物中で強靭化剤として機能する。好ましくは、コア−シェルゴム粒子は、800nm未満、例えば、100nm〜200nmの粒子サイズ(d90)を有する。樹脂組成物中のCSR粒子の相対量は、組成物の全重量に基づく重量で、1%〜20%、一部の実施形態では、0.3%〜10%であってもよい。
硬化性樹脂組成物は、任意選択の添加剤、例えば、シリカなどのナノサイズ無機粒子を含んでもよい。無機粒子は、約2.0nm〜約800nm、好ましくは500nm以下、一部の実施形態では、100nm以下の範囲の粒子サイズを有する。このような任意選択の添加剤の量は、硬化性樹脂組成物の重量で5.0%以下である。
本開示の硬化性エポキシ系樹脂組成物は、RTM及びVaRTMを含めて、液体樹脂注入に適する。成形物品は、繊維状予備成形物を提供し、繊維状予備成形物に本明細書に開示される硬化性エポキシ樹脂組成物を注入し、樹脂注入予備成形物を硬化させることによって生成され得る。繊維状予備成形物は、多孔質で、液体樹脂組成物に対して透過性である。予備成形物を形成するために、テキスタイル材料の複数プライが所望の厚さにレイアップされる。
粒子サイズ
本開示では、粒子サイズは、例えば、Malvern Zetasizer 2000を使用して、動的光散乱によって測定される。粒子サイズ(d90)は、粒子の90%がこの値未満の粒子サイズを有するような粒子サイズ分布(体積ベース)を規定する。
粘度測定は、ASTM標準D2196に従ってブルックフィールド粘度計を使用して定常条件においてである。
本開示では、ガラス転移温度(Tg)は、5℃/分の傾斜速度で示差走査熱量測定(DSC)によって決定される。
Claims (25)
- 液体樹脂注入に適した硬化性エポキシ樹脂組成物であって、
(A)少なくとも2種のポリエポキシド(そのうちの一方は、二官能性エポキシドであり、他方は、式I:
によって表されるトリス(ヒドロキシフェニル)メタンのトリグリシジルエーテルである)
(B)式II:
(式中、Aは、-NHRによって表されるアミン基であり、Rは、水素、1〜6個の炭素原子を有する直鎖及び分岐アルキル基から独立して選択され、好ましくは、Aは、NH2であり;
Bは、
から選択され;
Cは、1〜6個の炭素原子を有するアルキル基及びイソプロピル基から選択され;Xは、水素、又はCl、Br、F、及びIから選択されるハロゲンである)
によって表される少なくとも1種の芳香族アミン硬化剤;及び
(C)コア−シェルゴム粒子
を含む、硬化性エポキシ樹脂組成物。 - 前記硬化性エポキシ樹脂組成物が、90℃〜160℃の範囲内の温度で、10ポイズ未満、好ましくは5ポイズ未満の粘度を有する、請求項1に記載の硬化性エポキシ樹脂組成物。
- 前記二官能性エポキシドが、ビスフェノールF又はビスフェノールAのジグリシジルエーテルであり、及び前記組成物の全重量に基づく重量で、50%まで、好ましくは24%〜38%の量で存在する、請求項1又は2に記載の硬化性エポキシ樹脂組成物。
- 前記芳香族アミン硬化剤が、9,9−ビス(4−アミノ−3−クロロフェニル)フルオレン又は9,9−ビス(4−アミノフェニル)フルオレンである、請求項1〜4のいずれか一項に記載の硬化性エポキシ樹脂組成物。
- 前記トリス(ヒドロキシフェニル)メタンのトリグリシジルエーテルが、前記組成物の全重量に基づく重量で、0%超で18%まで、好ましくは2%〜10%の量で存在する、請求項1〜5のいずれか一項に記載の硬化性エポキシ樹脂組成物。
- 前記エポキシノボラック樹脂が、前記組成物の全重量に基づく重量で、0%超で18%まで、好ましくは1%〜7%の量で存在する、請求項7又は8に記載の硬化性エポキシ樹脂組成物。
- ビス(ヒドロキシフェニル)フルオレンのジグリシジルエーテルが、前記組成物の全重量に基づく重量で、0%超で20%まで、好ましくは4%〜18%の量で存在する、請求項10に記載の硬化性エポキシ樹脂組成物。
- 前記組成物が、その式中に1つ以上のナフタレン環を有するいかなるナフタレン系エポキシも欠いている、請求項1〜11のいずれか一項に記載の硬化性エポキシ樹脂組成物。
- 液体樹脂注入に適した硬化性エポキシ樹脂組成物であって、
(A)少なくとも2種のポリエポキシド(そのうちの一方は、式IV:
によって表されるビス(ヒドロキシフェニル)フルオレンのジグリシジルエーテルであり、他方のポリエポキシドは、その式中に少なくとも1つのナフタレン環を有するナフタレン系エポキシである);
(B)式II:
(式中、Aは、-NHRによって表されるアミン基であり、Rは、水素、1〜6個の炭素原子を有する直鎖及び分岐アルキル基から独立して選択され、好ましくは、Aは、NH2であり;Bは、
から選択され;
Cは、1〜6個の炭素原子を有するアルキル基及びイソプロピル基から選択され;Xは、水素、又はCl、Br、F、及びIから選択されるハロゲンである)
によって表される芳香族アミン硬化剤;及び
(C)コア−シェルゴム粒子
を含む、硬化性エポキシ樹脂組成物。 - ナフタレン系エポキシが、1,6−ジヒドロキシナフタレンのジグリシジルエーテル;1,7−ジヒドロキシナフタレン;1ナフタレンクレゾールグリシジルエーテル;1,2−ジヒドロキシナフタレン;1,3−ジヒドロキシナフタレン;1,4−ジヒドロキシナフタレン;1,5−ジヒドロキシナフタレン;2,3−ジヒドロキシナフタレン;2,7−ジヒドロキシナフタレン;及び
それらの組合せから選択される、請求項13に記載の硬化性エポキシ樹脂組成物。 - ナフタレン系エポキシが、前記組成物の全重量に基づく重量で、0%超で30%までの量で存在する、請求項13又は14に記載の硬化性エポキシ樹脂組成物。
- ビスフェノールF又はビスフェノールAのジグリシジルエーテルを、前記組成物の全重量に基づく重量で、30%まで、好ましくは17%〜28%の量でさらに含む、請求項13〜15のいずれか一項に記載の硬化性エポキシ樹脂組成物。
- 前記芳香族アミン硬化剤が、
9,9−ビス(4−アミノ−3−クロロフェニル)フルオレン又は9,9−ビス(4−アミノフェニル)フルオレンである、請求項13〜17のいずれか一項に記載の硬化性エポキシ樹脂組成物。 - 前記硬化性エポキシ樹脂組成物が、90℃〜160℃の範囲内の温度で、10ポイズ未満、好ましくは5ポイズ未満の粘度を有する、請求項13〜18のいずれか一項に記載の硬化性エポキシ樹脂組成物。
- 前記コア−シェルゴム粒子が、前記組成物の全重量に基づく重量で、1%〜20%、好ましくは0.3%〜10%の量で存在する、請求項1〜19のいずれか一項に記載の硬化性エポキシ樹脂組成物。
- 前記コア−シェルゴム粒子が、800nm未満、好ましくは100nm〜200nmの粒子サイズ(d90)を有する、請求項1〜20のいずれか一項に記載の硬化性エポキシ樹脂組成物。
- 前記組成物が、いかなる熱可塑性ポリマーも欠いている、請求項1〜21のいずれか一項に記載の硬化性エポキシ樹脂組成物。
- 前記組成物が、前記式IIの芳香族アミン硬化剤以外のいかなる硬化剤も含まない、請求項1〜22のいずれか一項に記載の硬化性エポキシ樹脂組成物。
- 液体樹脂を受けるように構成された繊維状予備成形物を提供するステップと、前記繊維状予備成形物に請求項1〜23のいずれか一項に記載の硬化性エポキシ樹脂組成物を注入するステップと、前記注入予備成形物を硬化温度(Tc)で硬化させるステップとを含む、成形物品を生成させるための液体樹脂注入(LRI)製造方法。
- a.前記繊維状予備成形物を密閉型内に置くステップと;
b.前記型を初期温度に加熱するステップと;
c.前記硬化性エポキシ樹脂組成物を前記型中に射出して、前記繊維状予備成形物に前記エポキシ樹脂組成物を注入するステップと;
d.前記樹脂注入予備成形物を、前記初期温度より高い硬化温度(Tc)で、硬化物品を形成するために十分な期間硬化させるステップと
をさらに含む、請求項24に記載の方法。
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US4684678A (en) * | 1985-05-30 | 1987-08-04 | Minnesota Mining And Manufacturing Company | Epoxy resin curing agent, process, and composition |
KR940001169B1 (ko) * | 1988-11-30 | 1994-02-16 | 미쓰비시레이욘 가부시끼가이샤 | 에폭시 수지 조성물 |
GB9222698D0 (en) * | 1992-10-29 | 1992-12-09 | Ciba Geigy Ag | Expoxides |
JP2000344870A (ja) * | 1999-06-02 | 2000-12-12 | Toray Ind Inc | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
GB2460050A (en) * | 2008-05-14 | 2009-11-18 | Hexcel Composites Ltd | Epoxy composite |
CN104119645B (zh) * | 2008-09-29 | 2016-10-26 | 东丽株式会社 | 环氧树脂组合物、预浸料坯及纤维增强复合材料 |
GB201217226D0 (en) * | 2012-09-26 | 2012-11-07 | Hexcel Composites Ltd | Resin composition and composite structure containing resin |
US10465037B2 (en) * | 2014-07-22 | 2019-11-05 | Sabic Global Technologies B.V. | High heat monomers and methods of use thereof |
BR112017012644B1 (pt) * | 2014-12-18 | 2022-04-19 | Cytec Industries Inc | Processo de fabricação para produzir um artigo moldado por infusão de resina líquida, composição curável, artigo moldado curado, e, uso de uma composição curável |
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JPH09501714A (ja) * | 1993-08-17 | 1997-02-18 | ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー | エポキシ‐芳香族アミン樹脂用潜伏性熱硬化促進剤 |
JP2013515806A (ja) * | 2009-12-23 | 2013-05-09 | サイテク・テクノロジー・コーポレーシヨン | 液状樹脂注入用途のための改質樹脂系及びそれに関連する加工方法 |
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US20160152763A1 (en) * | 2014-12-02 | 2016-06-02 | Cytec Industries Inc. | Modified amine curing agents, their preparation and use in curable compositions |
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JP7240394B2 (ja) | 2023-03-15 |
KR20200071120A (ko) | 2020-06-18 |
CN111295407A (zh) | 2020-06-16 |
BR112020008045A2 (pt) | 2020-10-06 |
US20190127514A1 (en) | 2019-05-02 |
CA3080246A1 (en) | 2019-05-02 |
WO2019083921A2 (en) | 2019-05-02 |
WO2019083921A3 (en) | 2019-06-20 |
EP3700957A2 (en) | 2020-09-02 |
US11111333B2 (en) | 2021-09-07 |
CN111295407B (zh) | 2023-06-27 |
AU2018354115A1 (en) | 2020-04-23 |
GB201717639D0 (en) | 2017-12-13 |
US20210363289A1 (en) | 2021-11-25 |
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