JP2021178966A - Resin composition, prepreg, resin sheet, laminated resin sheet, laminate, metal foil-clad laminate, and printed wiring board - Google Patents
Resin composition, prepreg, resin sheet, laminated resin sheet, laminate, metal foil-clad laminate, and printed wiring board Download PDFInfo
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- JP2021178966A JP2021178966A JP2021115454A JP2021115454A JP2021178966A JP 2021178966 A JP2021178966 A JP 2021178966A JP 2021115454 A JP2021115454 A JP 2021115454A JP 2021115454 A JP2021115454 A JP 2021115454A JP 2021178966 A JP2021178966 A JP 2021178966A
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- resin composition
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- mass
- resin
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- -1 prepreg Substances 0.000 title claims abstract description 104
- 229920005989 resin Polymers 0.000 title claims abstract description 87
- 239000011347 resin Substances 0.000 title claims abstract description 87
- 239000011342 resin composition Substances 0.000 title claims abstract description 84
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 48
- 239000002184 metal Substances 0.000 title claims abstract description 48
- 150000001875 compounds Chemical class 0.000 claims abstract description 75
- 239000004643 cyanate ester Substances 0.000 claims abstract description 58
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims abstract description 41
- 125000004185 ester group Chemical group 0.000 claims abstract description 35
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 claims description 56
- 239000000463 material Substances 0.000 claims description 30
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- 239000011256 inorganic filler Substances 0.000 claims description 22
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 22
- 125000004432 carbon atom Chemical group C* 0.000 claims description 20
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 20
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 20
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- 239000007787 solid Substances 0.000 claims description 13
- 239000011888 foil Substances 0.000 claims description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 12
- 239000000377 silicon dioxide Substances 0.000 claims description 11
- 125000003700 epoxy group Chemical group 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 8
- 125000001424 substituent group Chemical group 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 claims description 4
- 229910001593 boehmite Inorganic materials 0.000 claims description 4
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 45
- 239000011889 copper foil Substances 0.000 abstract description 38
- 238000007747 plating Methods 0.000 abstract description 27
- 239000010410 layer Substances 0.000 description 45
- 239000011521 glass Substances 0.000 description 38
- 239000003822 epoxy resin Substances 0.000 description 31
- 229920000647 polyepoxide Polymers 0.000 description 31
- 239000000047 product Substances 0.000 description 30
- 230000009477 glass transition Effects 0.000 description 25
- 238000000034 method Methods 0.000 description 25
- 238000012423 maintenance Methods 0.000 description 23
- 239000002585 base Substances 0.000 description 21
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- 125000000524 functional group Chemical group 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 13
- 239000000243 solution Substances 0.000 description 13
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 12
- 239000002904 solvent Substances 0.000 description 11
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
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- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 7
- 239000006087 Silane Coupling Agent Substances 0.000 description 7
- 238000005452 bending Methods 0.000 description 7
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- 238000004519 manufacturing process Methods 0.000 description 7
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
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- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 5
- RNIPJYFZGXJSDD-UHFFFAOYSA-N 2,4,5-triphenyl-1h-imidazole Chemical compound C1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 RNIPJYFZGXJSDD-UHFFFAOYSA-N 0.000 description 5
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- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
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- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 3
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
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- 239000003365 glass fiber Substances 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
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- 150000003839 salts Chemical class 0.000 description 3
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- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
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- 229910052582 BN Inorganic materials 0.000 description 2
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- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
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- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 125000000732 arylene group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
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- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
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- 239000003960 organic solvent Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
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- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/07—Parts immersed or impregnated in a matrix
- B32B2305/076—Prepregs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
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- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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Abstract
Description
本発明は、樹脂組成物、プリプレグ、樹脂シート、積層樹脂シート、積層板、金属箔張積層板、及びプリント配線板に関する。 The present invention relates to a resin composition, a prepreg, a resin sheet, a laminated resin sheet, a laminated board, a metal foil-clad laminated board, and a printed wiring board.
近年、電子機器や通信機、パーソナルコンピューター等に広く用いられている半導体パッケージの高機能化、小型化が進むに従い、半導体パッケージ用の各部品の高集積化や高密度実装化が近年益々加速している。それに伴い、半導体素子と半導体プラスチックパッケージ用プリント配線板との熱膨張率の差によって生じる半導体プラスチックパッケージの反りが問題となっており、様々な対策が講じられてきている。 In recent years, as semiconductor packages widely used in electronic devices, communication devices, personal computers, etc. have become more sophisticated and smaller, the high integration and high-density mounting of each component for semiconductor packages has accelerated in recent years. ing. Along with this, the warp of the semiconductor plastic package caused by the difference in the coefficient of thermal expansion between the semiconductor element and the printed wiring board for the semiconductor plastic package has become a problem, and various measures have been taken.
その対策の一つとして、プリント配線板に用いられる絶縁層の低熱膨張化が挙げられる。これは、プリント配線板の熱膨張率を半導体素子の熱膨張率に近づけることで反りを抑制する手法であり、現在盛んに取り組まれている(例えば、特許文献1〜3参照)。 One of the countermeasures is to reduce the thermal expansion of the insulating layer used for the printed wiring board. This is a method of suppressing warpage by bringing the coefficient of thermal expansion of a printed wiring board close to the coefficient of thermal expansion of a semiconductor element, and is currently being actively pursued (see, for example, Patent Documents 1 to 3).
半導体プラスチックパッケージの反りを抑制する手法としては、プリント配線板の低熱膨張化以外にも、積層板の剛性を高くすること(高剛性化)や積層板のガラス転移温度を高くすること(高Tg化)が検討されている(例えば、特許文献4及び5参照)。 As a method for suppressing the warp of the semiconductor plastic package, in addition to the low thermal expansion of the printed wiring board, the rigidity of the laminated board is increased (high rigidity) and the glass transition temperature of the laminated board is increased (high Tg). (See, for example, Patent Documents 4 and 5).
しかしながら、特許文献1〜3に記載の従来の手法によるプリント配線板の低熱膨張化は既に限界が近づいており、さらなる低熱膨張化が困難となっている。 However, the limit of low thermal expansion of the printed wiring board by the conventional method described in Patent Documents 1 to 3 has already approached, and further low thermal expansion is difficult.
積層板の高剛性化は積層板に使用する樹脂組成物中にフィラーを高充填させることや、アルミナなどの高弾性率の無機充填材を使用することで達成される。しかしながら、フィラーの高充填化は積層板の成形性を悪化させ、アルミナなどの無機充填材の使用は積層板の熱膨張率を悪化させてしまう問題がある。したがって、積層板の高剛性化は半導体プラスチックパッケージの反りの抑制を十分に達成できていない。 High rigidity of the laminated board is achieved by highly filling the resin composition used for the laminated board with a filler or by using an inorganic filler having a high elastic modulus such as alumina. However, there is a problem that the high filling of the filler deteriorates the moldability of the laminated board, and the use of an inorganic filler such as alumina deteriorates the coefficient of thermal expansion of the laminated board. Therefore, increasing the rigidity of the laminated board has not sufficiently achieved the suppression of warpage of the semiconductor plastic package.
また、積層板の高Tg化による手法はリフロー時の弾性率を向上させることから、半導体プラスチックパッケージの反り低減に効果を示す。しかしながら、高Tg化による手法は、架橋密度の上昇による吸湿耐熱性の悪化や、成形性の悪化によるボイドの発生を引き起こすことから、非常に高い信頼性が必要とされる電子材料分野では実用上問題となることが多い。したがって、これらの問題を解決する手法が望まれている。 In addition, the method of increasing the Tg of the laminated board improves the elastic modulus at the time of reflow, and is therefore effective in reducing the warp of the semiconductor plastic package. However, the method using high Tg causes deterioration of moisture absorption and heat resistance due to an increase in crosslink density and generation of voids due to deterioration of moldability. Therefore, it is practically used in the field of electronic materials where extremely high reliability is required. Often a problem. Therefore, a method for solving these problems is desired.
またさらに、プリント配線板の絶縁層には、高い弾性率維持率、高い銅箔ピール強度及びめっきピール強度に優れることが同時に求められる。しかし、これらすべての課題を満足し得るような硬化物を与える樹脂組成物は報告されていない。 Further, the insulating layer of the printed wiring board is required to have a high elastic modulus maintenance rate, a high copper foil peel strength and a plating peel strength at the same time. However, no resin composition has been reported that provides a cured product that can satisfy all of these problems.
本発明は、上記問題点に鑑みてなされたものであり、銅箔ピール強度及びめっきピール強度に優れる硬化物を与える樹脂組成物、並びに、該樹脂組成物を用いた、プリプレグ、樹脂シート、積層樹脂シート、積層板、金属箔張積層板、及びプリント配線板を提供することを目的とする。 The present invention has been made in view of the above problems, and is a resin composition that gives a cured product having excellent copper foil peel strength and plating peel strength, and a prepreg, a resin sheet, and a laminate using the resin composition. It is an object of the present invention to provide a resin sheet, a laminated board, a metal foil-clad laminated board, and a printed wiring board.
本発明者らは、上記課題を解決するため、鋭意検討を行った。その結果、シアン酸エステル化合物(A)とマレイミド化合物(B)を所定量用いることにより、上記問題点を解決できることを見出し、本発明を完成するに至った。 The present inventors have conducted diligent studies in order to solve the above problems. As a result, they have found that the above problems can be solved by using a predetermined amount of the cyanic acid ester compound (A) and the maleimide compound (B), and have completed the present invention.
すなわち、本発明は、以下のとおりである。
〔1〕
シアン酸エステル化合物(A)と、マレイミド化合物(B)と、を含有し、
該マレイミド化合物(B)のマレイミド基量(β)に対する前記シアン酸エステル化合物(A)のシアン酸エステル基量(α)の比(〔α/β〕)が、0.30以上である、
樹脂組成物。
〔2〕
前記シアン酸エステル化合物(A)が、下記一般式(1)及び/又は下記一般式(2)で表される化合物を含む、
〔1〕に記載の樹脂組成物。
〔3〕
シアン酸エステル化合物(A)のシアン酸エステル基当量が、100〜220g/eq.である、
〔1〕又は〔2〕に記載の樹脂組成物。
〔4〕
前記シアン酸エステル化合物(A)が、下記一般式(1’’)で表される化合物を含む、
〔1〕〜〔3〕のいずれかに記載の樹脂組成物。
〔5〕
前記シアン酸エステル化合物(A)が、下記一般式(3)で表される化合物を含む、
〔1〕〜〔4〕のいずれかに記載の樹脂組成物。
前記マレイミド化合物(B)が、ビス(4−マレイミドフェニル)メタン、2,2−ビス{4−(4−マレイミドフェノキシ)−フェニル}プロパン、ビス(3−エチル−5−メチル−4−マレイミドフェニル)メタン、及び下記式(4)で表されるマレイミド化合物からなる群より選ばれる少なくとも1種を含む、
〔1〕〜〔5〕のいずれかに記載の樹脂組成物。
〔7〕
前記比(〔α/β〕)が、0.45〜1.0である、
〔1〕〜〔6〕のいずれかに記載の樹脂組成物。
〔8〕
無機充填材(C)をさらに含む、
〔1〕〜〔7〕のいずれかに記載の樹脂組成物。
〔9〕
前記無機充填材(C)の含有量が、樹脂固形分100質量部に対して、25〜700質量部である、
〔8〕に記載の樹脂組成物。
〔10〕
前記無機充填材(C)が、シリカ、ベーマイト、及びアルミナからなる群より選択される少なくとも1種類を含む、
〔8〕又は〔9〕に記載の樹脂組成物。
〔11〕
基材と、
該基材に含浸又は塗布された〔1〕〜〔10〕のいずれか一項に記載の樹脂組成物と、を有する、
プリプレグ。
〔12〕
〔1〕〜〔10〕のいずれか一項に記載の樹脂組成物をシート状に形成してなる、
樹脂シート。
〔13〕
シート基材と、該シート基材の片面又は両面に配された〔1〕〜〔10〕のいずれか一項に記載の樹脂組成物と、を有する、
積層樹脂シート。
〔14〕
〔11〕に記載のプリプレグ、〔12〕に記載の樹脂シート、及び〔13〕に記載の積層樹脂シートからなる群より選択される少なくとも1種を1枚以上有する、
積層板。
〔15〕
〔11〕に記載のプリプレグ、〔12〕に記載の樹脂シート、及び〔13〕に記載の積層樹脂シートからなる群より選択される少なくとも1種と、
前記プリプレグ、前記樹脂シート、及び前記積層樹脂シートの片面又は両面に配された金属箔と、を有する、
金属箔張積層板。
〔16〕
絶縁層と、該絶縁層の片面又は両面に形成された導体層と、を有し、
前記絶縁層が、〔1〕〜〔10〕のいずれか一項に記載の樹脂組成物を含む、
プリント配線板。
That is, the present invention is as follows.
[1]
It contains a cyanide ester compound (A) and a maleimide compound (B).
The ratio ([α / β]) of the cyanic acid ester group amount (α) of the cyanic acid ester compound (A) to the maleimide group amount (β) of the maleimide compound (B) is 0.30 or more.
Resin composition.
[2]
The cyanide ester compound (A) contains a compound represented by the following general formula (1) and / or the following general formula (2).
The resin composition according to [1].
[3]
The cyanate ester group equivalent of the cyanate ester compound (A) is 100 to 220 g / eq. Is,
The resin composition according to [1] or [2].
[4]
The cyanide ester compound (A) contains a compound represented by the following general formula (1 ″).
The resin composition according to any one of [1] to [3].
[5]
The cyanide ester compound (A) contains a compound represented by the following general formula (3).
The resin composition according to any one of [1] to [4].
The maleimide compound (B) is bis (4-maleimidephenyl) methane, 2,2-bis {4- (4-maleimidephenoxy) -phenyl} propane, bis (3-ethyl-5-methyl-4-maleimidephenyl). ) Containing at least one selected from the group consisting of methane and a maleimide compound represented by the following formula (4).
The resin composition according to any one of [1] to [5].
[7]
The ratio ([α / β]) is 0.45 to 1.0.
The resin composition according to any one of [1] to [6].
[8]
Further containing the inorganic filler (C),
The resin composition according to any one of [1] to [7].
[9]
The content of the inorganic filler (C) is 25 to 700 parts by mass with respect to 100 parts by mass of the resin solid content.
The resin composition according to [8].
[10]
The inorganic filler (C) comprises at least one selected from the group consisting of silica, boehmite, and alumina.
The resin composition according to [8] or [9].
[11]
With the base material
The resin composition according to any one of [1] to [10] impregnated or applied to the substrate.
Pre-preg.
[12]
The resin composition according to any one of [1] to [10] is formed in the form of a sheet.
Resin sheet.
[13]
It has a sheet base material and the resin composition according to any one of [1] to [10] arranged on one side or both sides of the sheet base material.
Laminated resin sheet.
[14]
It has at least one selected from the group consisting of the prepreg according to [11], the resin sheet according to [12], and the laminated resin sheet according to [13].
Laminated board.
[15]
At least one selected from the group consisting of the prepreg according to [11], the resin sheet according to [12], and the laminated resin sheet according to [13].
It has the prepreg, the resin sheet, and a metal foil arranged on one side or both sides of the laminated resin sheet.
Metal foil-clad laminate.
[16]
It has an insulating layer and a conductor layer formed on one side or both sides of the insulating layer.
The insulating layer contains the resin composition according to any one of [1] to [10].
Printed wiring board.
本発明によれば、銅箔ピール強度及びめっきピール強度に優れる硬化物を与える樹脂組成物、並びに、該樹脂組成物を用いた、プリプレグ、樹脂シート、積層樹脂シート、積層板、金属箔張積層板、及びプリント配線板を提供することができる。 According to the present invention, a resin composition that gives a cured product having excellent copper foil peel strength and plating peel strength, and a prepreg, a resin sheet, a laminated resin sheet, a laminated plate, and a metal foil-clad laminate using the resin composition. A board and a printed wiring board can be provided.
以下、本発明を実施するための形態(以下、「本実施形態」という。)について詳細に説明するが、本発明はこれに限定されるものではなく、その要旨を逸脱しない範囲で様々な変形が可能である。 Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as “the present embodiment”) will be described in detail, but the present invention is not limited thereto, and various modifications are made without departing from the gist thereof. Is possible.
〔樹脂組成物〕
本実施形態の樹脂組成物は、シアン酸エステル化合物(A)と、マレイミド化合物(B)と、を含有し、該マレイミド化合物(B)のマレイミド基量(β)に対する前記シアン酸エステル化合物(A)のシアン酸エステル基量(α)の比(〔α/β〕)が、0.30以上である。
[Resin composition]
The resin composition of the present embodiment contains the cyanic acid ester compound (A) and the maleimide compound (B), and the cyanic acid ester compound (A) with respect to the maleimide group amount (β) of the maleimide compound (B). ), The ratio of the amount of cyanate ester groups (α) ([α / β]) is 0.30 or more.
〔シアン酸エステル化合物(A)〕
シアン酸エステル化合物(A)としては、シアン酸エステル基を少なくとも1つ有する化合物であれば特に限定されない。シアン酸エステル化合物(A)はシアン酸エステル基以外の反応性官能基を有していてもよく、有していなくてもよい。
[Cyanide ester compound (A)]
The cyanic acid ester compound (A) is not particularly limited as long as it is a compound having at least one cyanic acid ester group. The cyanate ester compound (A) may or may not have a reactive functional group other than the cyanate ester group.
シアン酸エステル基以外の反応性官能基としては、特に限定されないが、例えば、アリル基、ヒドロキシル基、エポキシ基、アミノ基、イソシアネート基、グリシジル基及びリン酸基が挙げられる。このなかでも、アリル基、ヒドロキシル基及びエポキシ基からなる群より選ばれる少なくとも1つが好ましく、アリル基がより好ましい。このような反応性官能基を有することにより、樹脂組成物の曲げ強度及び曲げ弾性率、ガラス転移温度、熱膨張率がより向上する傾向にある。 The reactive functional group other than the cyanate ester group is not particularly limited, and examples thereof include an allyl group, a hydroxyl group, an epoxy group, an amino group, an isocyanate group, a glycidyl group and a phosphoric acid group. Among these, at least one selected from the group consisting of an allyl group, a hydroxyl group and an epoxy group is preferable, and an allyl group is more preferable. By having such a reactive functional group, the bending strength and bending elastic modulus, the glass transition temperature, and the coefficient of thermal expansion of the resin composition tend to be further improved.
シアン酸エステル化合物(A)は、1種類を単独で用いてもよく、2種類以上を併用してもよい。2種類以上を併用する場合、シアン酸エステル以外の反応性官能基を有しているものと有していないものを併用してもよく、2種類以上のシアン酸エステル基以外の反応性置換基を有するものを併用してもよい。その際、シアン酸エステル基以外の反応性官能基は同一であってもよく、異なっていてもよい。このなかでも、シアン酸エステル化合物(A)が、少なくともシアン酸エステル基以外の反応性官能基を有するシアン酸エステル化合物を含むことが好ましい。このようなシアン酸エステル化合物(A)を用いることにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率がより向上する傾向にある。 As the cyanide ester compound (A), one type may be used alone, or two or more types may be used in combination. When two or more kinds are used in combination, one having a reactive functional group other than the cyanate ester and one not having it may be used in combination, and two or more kinds of reactive substituents other than the cyanate ester group may be used in combination. May be used in combination. At that time, the reactive functional groups other than the cyanide ester group may be the same or different. Among these, it is preferable that the cyanic acid ester compound (A) contains at least a cyanic acid ester compound having a reactive functional group other than the cyanic acid ester group. By using such a cyanate ester compound (A), the copper foil peel strength, the plating peel strength, the glass transition temperature, and the elastic modulus maintenance rate of the obtained cured product tend to be further improved.
上記のようなシアン酸エステル化合物(A)としては、特に限定されないが、例えば、下記一般式(1)で表される化合物、下記一般式(2)で表される化合物(ナフトールアラルキル型シアン酸エステル)、ノボラック型シアン酸エステル、ビフェニルアラルキル型シアン酸エステル、ビス(3,5−ジメチル4−シアナトフェニル)メタン、ビス(4−シアナトフェニル)メタン、1,3−ジシアナトベンゼン、1,4−ジシアナトベンゼン、1,3,5−トリシアナトベンゼン、1,3−ジシアナトナフタレン、1,4−ジシアナトナフタレン、1,6−ジシアナトナフタレン、1,8−ジシアナトナフタレン、2,6−ジシアナトナフタレン、2、7−ジシアナトナフタレン、1,3,6−トリシアナトナフタレン、4、4’−ジシアナトビフェニル、ビス(4−シアナトフェニル)エーテル、ビス(4−シアナトフェニル)チオエーテル、ビス(4−シアナトフェニル)スルホン、及び2、2’−ビス(4−シアナトフェニル)プロパン;これらシアン酸エステルのプレポリマーが挙げられる。これらは、1種類を単独で用いてもよく、2種類以上を併用してもよい。なかでも、下記一般式(1)で表される化合物、下記一般式(2)で表される化合物がより好ましい。 The above-mentioned cyanate ester compound (A) is not particularly limited, but for example, a compound represented by the following general formula (1) and a compound represented by the following general formula (2) (naphtholaralkyl-type cyanic acid). Ester), novolak type cyanate ester, biphenyl aralkyl type cyanate ester, bis (3,5-dimethyl4-cyanatophenyl) methane, bis (4-cyanatophenyl) methane, 1,3-disyanatobenzene, 1 , 4-disyanatobenzene, 1,3,5-trisianatobenzene, 1,3-disyanatonaphthalene, 1,4-disyanatnaphthalene, 1,6-disyanatnaphthalene, 1,8-disyanatonaphthalene, 2 , 6-Disianatonaphthalene, 2,7-Disyanatnaphthalene, 1,3,6-Trisianatonaphthalene, 4,4'-Disyanatobiphenyl, Bis (4-Cyanatophenyl) ether, Bis (4-Cyanato) Phenyl) thioethers, bis (4-cyanatophenyl) compounds, and 2,2'-bis (4-cyanatophenyl) propane; prepolymers of these cyanate esters can be mentioned. These may be used alone or in combination of two or more. Among them, the compound represented by the following general formula (1) and the compound represented by the following general formula (2) are more preferable.
上記シアン酸エステル化合物(A)のなかでもシアン酸エステル基以外の反応性官能基を有する化合物としては、特に限定されないが、例えば、下記一般式(1)で表される化合物が好ましく、下記一般式(1’)で表される化合物がより好ましく、下記一般式(1’’)で表される化合物がさらに好ましい。このようなシアン酸エステル化合物(A)を含むことにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率がより向上する傾向にある。
式(1)中、R1は、各々独立して、水素原子又は炭素数1〜4のアルキル基を表し、好ましくは水素原子、メチル基を表し、より好ましくはメチル基を表す。また、R2は、各々独立して、置換基としてシアン酸エステル基、ヒドロキシル基及びアリル基からなる群より選ばれる少なくとも1つを有してもよいフェニル基、水素原子、アリル基、シアン酸エステル基、又は、エポキシ基を表し、好ましくは水素原子又はアリル基を表す。さらに、n1は1以上の整数であり、好ましくは1〜10の整数であり、より好ましくは1〜5の整数である。また、mは1〜4の整数であり、好ましくは1〜2の整数である。 In the formula (1), R 1 independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom and a methyl group, and more preferably a methyl group. Further , each of R 2 may independently have at least one selected from the group consisting of a cyanate ester group, a hydroxyl group and an allyl group as a substituent, a phenyl group, a hydrogen atom, an allyl group and a cyanic acid. It represents an ester group or an epoxy group, preferably a hydrogen atom or an allyl group. Further, n1 is an integer of 1 or more, preferably an integer of 1 to 10, and more preferably an integer of 1 to 5. Further, m is an integer of 1 to 4, preferably an integer of 1 to 2.
式(1’)及び(1’’)中、R1は、各々独立して、水素原子又は炭素数1〜4のアルキル基を表し、好ましくは水素原子、メチル基を表し、より好ましくはメチル基を表す。R1がメチル基であるビスフェノールA骨格を有する化合物を用いることにより、銅箔ピール、めっきピール強度、ガラス転移温度がより向上する傾向にある。また、アリル基をさらに有することにより、可撓性と成形性もより向上する傾向にある。さらに、式(1’)及び(1’’)中、n1は1以上の整数であり、好ましくは1〜10の整数であり、より好ましくは1〜5の整数であり、さらに好ましくは1である。 In the formulas (1') and (1 ″), R 1 independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom and a methyl group, and more preferably methyl. Represents a group. By using a compound having a bisphenol A skeleton in which R 1 is a methyl group, the copper foil peel, the plating peel strength, and the glass transition temperature tend to be further improved. Further, by further having an allyl group, flexibility and moldability tend to be further improved. Further, in the formulas (1') and (1 ″), n1 is an integer of 1 or more, preferably an integer of 1 to 10, more preferably an integer of 1 to 5, and even more preferably 1. be.
一般式(1’’)で表される化合物としては、特に限定されないが、例えば、下記式(3)で表される化合物がより好ましい。このようなシアン酸エステル化合物(A)を含むことにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率、可撓性、成形性がより向上する傾向にある。
一方、上記シアン酸エステル化合物(A)のなかでもシアン酸エステル基以外の反応性官能基を有しない化合物としては、特に限定されないが、例えば、下記一般式(2)で表される化合物が好ましい。このようなシアン酸エステル化合物(A)を含むことにより、得られる硬化物の銅箔ピール強度及びめっきピール強度がより向上する傾向にある。
(式(2)中、R3は、各々独立して、水素原子又は炭素数1〜4のアルキル基を表し、n2は1以上の整数である。)
On the other hand, among the cyanic acid ester compounds (A), the compound having no reactive functional group other than the cyanic acid ester group is not particularly limited, but for example, the compound represented by the following general formula (2) is preferable. .. By including such a cyanic acid ester compound (A), the copper foil peel strength and the plating peel strength of the obtained cured product tend to be further improved.
(In the formula (2), R 3 independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and n 2 is an integer of 1 or more.)
式(2)中、R3は、各々独立して、水素原子又は炭素数1〜4のアルキル基を表し、好ましくは水素原子を表す。また、n2は1以上の整数であり、好ましくは1〜10の整数であり、より好ましくは1〜5の整数である。 In the formula (2), R 3 independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and preferably represents a hydrogen atom. Further, n2 is an integer of 1 or more, preferably an integer of 1 to 10, and more preferably an integer of 1 to 5.
シアン酸エステル化合物(A)1分子中のシアン酸エステル基の数は、特に限定されないが、好ましくは1〜50であり、より好ましくは2〜12であり、さらに好ましくは2〜6である。シアン酸エステル化合物(A)1分子中のシアン酸エステル基の数が上記範囲内であることにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率がより向上する傾向にある。 The number of cyanic acid ester groups in one molecule of the cyanic acid ester compound (A) is not particularly limited, but is preferably 1 to 50, more preferably 2 to 12, and even more preferably 2 to 6. When the number of cyanic acid ester groups in one molecule of the cyanic acid ester compound (A) is within the above range, the copper foil peel strength, the plating peel strength, the glass transition temperature, and the elastic modulus maintenance rate of the obtained cured product can be obtained. It tends to improve.
また、シアン酸エステル化合物(A)1分子中のシアン酸エステル基以外の反応性官能基の数は、特に限定されないが、好ましくは1〜50であり、より好ましくは2〜12であり、さらに好ましくは2〜6である。シアン酸エステル化合物(A)1分子中のシアン酸エステル基以外の反応性官能基の数が上記範囲内であることにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率がより向上する傾向にある。 The number of reactive functional groups other than the cyanate ester group in one molecule of the cyanate ester compound (A) is not particularly limited, but is preferably 1 to 50, more preferably 2 to 12, and further. It is preferably 2 to 6. Cyanic acid ester compound (A) When the number of reactive functional groups other than the cyanic acid ester group in one molecule is within the above range, the copper foil peel strength, plating peel strength, glass transition temperature of the obtained cured product, And the elastic modulus maintenance rate tends to be further improved.
シアン酸エステル化合物(A)のシアン酸エステル基量(α)は、特に限定されないが、好ましくは0.075〜0.5であり、より好ましくは0.085〜0.4であり、さらに好ましくは0.095〜0.3である。シアン酸エステル化合物(A)のシアン酸エステル基量(α)が上記範囲内であることにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率がより向上する傾向にある。シアン酸エステル基量(α)は、樹脂固形分100質量部に対するシアン酸エステル化合物(A)の含有量(質量部)を、シアン酸エステル化合物(A)のシアン酸エステル基当量で除して求めることができる。なお、本願明細書において、「樹脂固形分」とは、特に断りのない限り、樹脂組成物における、溶剤、及び無機充填材(C)を除いた成分をいい、「樹脂固形分100質量部」とは、樹脂組成物における溶剤、及び無機充填材(C)を除いた成分の合計が100質量部であることをいうものとする。 The amount of cyanic acid ester group (α) of the cyanic acid ester compound (A) is not particularly limited, but is preferably 0.075 to 0.5, more preferably 0.085 to 0.4, and even more preferably. Is 0.095 to 0.3. When the amount of cyanate ester group (α) of the cyanate ester compound (A) is within the above range, the copper foil peel strength, plating peel strength, glass transition temperature, and elastic modulus maintenance rate of the obtained cured product are more favorable. It tends to improve. The cyanate ester group amount (α) is obtained by dividing the content (parts by mass) of the cyanate ester compound (A) with respect to 100 parts by mass of the resin solid content by the cyanate ester group equivalent of the cyanate ester compound (A). You can ask. In the specification of the present application, the "resin solid content" refers to a component of the resin composition excluding the solvent and the inorganic filler (C), unless otherwise specified, and is "100 parts by mass of the resin solid content". It means that the total of the components excluding the solvent and the inorganic filler (C) in the resin composition is 100 parts by mass.
シアン酸エステル化合物(A)の含有量は、特に限定されないが、樹脂固形分100質量部に対して、好ましくは10〜65質量部であり、より好ましくは15〜60質量部であり、さらに好ましくは15〜55質量部である。シアン酸エステル化合物(A)の含有量が上記範囲内であることにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率がより向上する傾向にある。 The content of the cyanic acid ester compound (A) is not particularly limited, but is preferably 10 to 65 parts by mass, more preferably 15 to 60 parts by mass, and further preferably with respect to 100 parts by mass of the resin solid content. Is 15 to 55 parts by mass. When the content of the cyanic acid ester compound (A) is within the above range, the copper foil peel strength, the plating peel strength, the glass transition temperature, and the elastic modulus maintenance rate of the obtained cured product tend to be further improved.
シアン酸エステル化合物(A)のシアン酸エステル基当量は、好ましくは100〜290g/eq.であり、より好ましくは120〜270g/eq.であり、更に好ましくは150〜220g/eq.である。シアン酸エステル化合物(A)ののシアン酸エステル基当量が上記範囲内であることにより、得られる硬化物の銅箔ピール強度、めっきピール強度がより向上する傾向にある。 The cyanate ester group equivalent of the cyanate ester compound (A) is preferably 100 to 290 g / eq. More preferably, 120 to 270 g / eq. More preferably, 150 to 220 g / eq. Is. When the cyanic acid ester group equivalent of the cyanic acid ester compound (A) is within the above range, the copper foil peel strength and the plating peel strength of the obtained cured product tend to be further improved.
〔マレイミド化合物(B)〕
マレイミド化合物(B)としては、分子中に1個以上のマレイミド基を有する化合物であれば特に限定されないが、例えば、N−フェニルマレイミド、N−ヒドロキシフェニルマレイミド、ビス(4−マレイミドフェニル)メタン、2,2−ビス{4−(4−マレイミドフェノキシ)−フェニル}プロパン、ビス(3,5−ジメチル−4−マレイミドフェニル)メタン、ビス(3−エチル−5−メチル−4−マレイミドフェニル)メタン、ビス(3,5−ジエチル−4−マレイミドフェニル)メタン、下記式(4)で表されるマレイミド化合物、これらマレイミド化合物のプレポリマー、若しくはマレイミド化合物とアミン化合物のプレポリマーが挙げられる。このなかでも、ビス(4−マレイミドフェニル)メタン、2,2−ビス{4−(4−マレイミドフェノキシ)−フェニル}プロパン、ビス(3−エチル−5−メチル−4−マレイミドフェニル)メタン、及び下記式(4)で表されるマレイミド化合物からなる群より選ばれる少なくとも1種が好ましい。このようなマレイミド化合物(B)を含むことにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率がより向上する傾向にある。また、上述したなかで、高ガラス転移温度(高Tg)の観点から、下記式(4)で表されるマレイミド化合物が、より好ましい。
The maleimide compound (B) is not particularly limited as long as it is a compound having one or more maleimide groups in the molecule, and for example, N-phenylmaleimide, N-hydroxyphenylmaleimide, bis (4-maleimidephenyl) methane, and the like. 2,2-Bis {4- (4-maleimidephenoxy) -phenyl} propane, bis (3,5-dimethyl-4-maleimidephenyl) methane, bis (3-ethyl-5-methyl-4-maleimidephenyl) methane , Bis (3,5-diethyl-4-maleimidephenyl) methane, maleimide compounds represented by the following formula (4), prepolymers of these maleimide compounds, or prepolymers of maleimide compounds and amine compounds. Among these, bis (4-maleimidephenyl) methane, 2,2-bis {4- (4-maleimidephenoxy) -phenyl} propane, bis (3-ethyl-5-methyl-4-maleimidephenyl) methane, and At least one selected from the group consisting of the maleimide compound represented by the following formula (4) is preferable. By including such a maleimide compound (B), the copper foil peel strength, the plating peel strength, the glass transition temperature, and the elastic modulus maintenance rate of the obtained cured product tend to be further improved. Further, among the above, the maleimide compound represented by the following formula (4) is more preferable from the viewpoint of high glass transition temperature (high Tg).
式(4)中、R4は、水素原子又はメチル基を表し、好ましくは水素原子を示す。また、式(4)中、n3は1以上の整数を表す。n3は、好ましくは10以下であり、より好ましくは7以下である。 In formula (4), R 4 represents a hydrogen atom or a methyl group, preferably a hydrogen atom. Further, in the equation (4), n3 represents an integer of 1 or more. n3 is preferably 10 or less, more preferably 7 or less.
マレイミド化合物(B)のマレイミド基量(β)は、特に限定されないが、好ましくは0.175〜0.6であり、より好ましくは0.185〜0.5であり、更に好ましくは0.195〜0.4である。マレイミド化合物(B)のマレイミド基量(β)が上記範囲内であることにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率がより向上する傾向にある。マレイミド基量(β)は、樹脂固形分100質量部に対するマレイミド化合物(B)の含有量(質量部)を、マレイミド化合物(B)のマレイミド基当量で除して求めることができる。 The amount of maleimide group (β) of the maleimide compound (B) is not particularly limited, but is preferably 0.175 to 0.6, more preferably 0.185 to 0.5, and even more preferably 0.195. ~ 0.4. When the maleimide group amount (β) of the maleimide compound (B) is within the above range, the copper foil peel strength, the plating peel strength, the glass transition temperature, and the elastic modulus maintenance rate of the obtained cured product tend to be further improved. be. The maleimide group amount (β) can be determined by dividing the content (parts by mass) of the maleimide compound (B) with respect to 100 parts by mass of the resin solid content by the maleimide group equivalent of the maleimide compound (B).
マレイミド化合物(B)の含有量は、特に限定されないが、樹脂固形分100質量部に対して、好ましくは30〜80質量部であり、より好ましくは35〜75質量部であり、さらに好ましくは40〜72質量部である。マレイミド化合物(B)の含有量が上記範囲内であることにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率がより向上する傾向にある。 The content of the maleimide compound (B) is not particularly limited, but is preferably 30 to 80 parts by mass, more preferably 35 to 75 parts by mass, and further preferably 40 parts by mass with respect to 100 parts by mass of the resin solid content. ~ 72 parts by mass. When the content of the maleimide compound (B) is within the above range, the copper foil peel strength, the plating peel strength, the glass transition temperature, and the elastic modulus maintenance rate of the obtained cured product tend to be further improved.
マレイミド化合物(B)のマレイミド基当量は、好ましくは100〜350g/eq.であり、より好ましくは150〜300g/eq.である。マレイミド化合物(B)のマレイミド基当量が上記範囲内であることにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率がより向上する傾向にある。 The maleimide group equivalent of the maleimide compound (B) is preferably 100 to 350 g / eq. More preferably, 150 to 300 g / eq. Is. When the maleimide group equivalent of the maleimide compound (B) is within the above range, the copper foil peel strength, the plating peel strength, the glass transition temperature, and the elastic modulus maintenance rate of the obtained cured product tend to be further improved.
本実施形態の樹脂組成物において、マレイミド化合物(B)のマレイミド基量(β)に対するシアン酸エステル化合物(A)のシアン酸エステル基量(α)の比(〔α/β〕)は、0.30以上であり、好ましくは0.30〜2.0であり、より好ましくは0.40〜1.1であり、特に好ましくは0.45〜1.0である。比(〔α/β〕)が上記範囲内であることにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率がより向上する傾向にある。 In the resin composition of the present embodiment, the ratio ([α / β]) of the cyanic acid ester group amount (α) of the cyanate ester compound (A) to the maleimide group amount (β) of the maleimide compound (B) is 0. It is .30 or more, preferably 0.30 to 2.0, more preferably 0.40 to 1.1, and particularly preferably 0.45 to 1.0. When the ratio ([α / β]) is within the above range, the copper foil peel strength, the plating peel strength, the glass transition temperature, and the elastic modulus maintenance rate of the obtained cured product tend to be further improved.
〔無機充填材(C)〕
本実施形態の樹脂組成物は、無機充填材(C)をさらに含んでもよい。無機充填材(C)としては、特に限定されないが、例えば、天然シリカ、溶融シリカ、合成シリカ、アモルファスシリカ、アエロジル、中空シリカなどのシリカ類;ホワイトカーボンなどのケイ素化合物;チタンホワイト、酸化亜鉛、酸化マグネシウム、酸化ジルコニウムなどの金属酸化物;窒化ホウ素、凝集窒化ホウ素、窒化ケイ素、窒化アルミニウムなどの金属窒化物;硫酸バリウムなどの金属硫酸化物;水酸化アルミニウム、水酸化アルミニウム加熱処理品(水酸化アルミニウムを加熱処理し、結晶水の一部を減じたもの)、ベーマイト、水酸化マグネシウムなどの金属水和物;酸化モリブデン、モリブデン酸亜鉛などのモリブデン化合物;ホウ酸亜鉛、錫酸亜鉛などの亜鉛化合物;アルミナ、クレー、カオリン、タルク、焼成クレー、焼成カオリン、焼成タルク、マイカ、E−ガラス、A−ガラス、NE−ガラス、C−ガラス、L−ガラス、D−ガラス、S−ガラス、M−ガラスG20、ガラス短繊維(Eガラス、Tガラス、Dガラス、Sガラス、Qガラスなどのガラス微粉末類を含む。)、中空ガラス、球状ガラスなどが挙げられる。無機充填材(C)は、1種を単独で用いても、2種以上を併用してもよい。
[Inorganic filler (C)]
The resin composition of the present embodiment may further contain an inorganic filler (C). The inorganic filler (C) is not particularly limited, and for example, silicas such as natural silica, molten silica, synthetic silica, amorphous silica, aerodil, and hollow silica; silicon compounds such as white carbon; titanium white, zinc oxide, and the like. Metal oxides such as magnesium oxide and zirconium oxide; Metal nitrides such as boron nitride, coagulated boron nitride, silicon nitride and aluminum nitride; Metal sulfates such as barium sulfate; Aluminum hydroxide and aluminum hydroxide heat-treated products (hydroxide) Aluminum is heat-treated to reduce a part of crystalline water), metal hydrates such as boehmite and magnesium hydroxide; molybdenum compounds such as molybdenum oxide and zinc molybdenum; zinc borate and zinc tintate. Compounds: Alumina, clay, kaolin, talc, calcined clay, calcined kaolin, calcined talc, mica, E-glass, A-glass, NE-glass, C-glass, L-glass, D-glass, S-glass, M. -Glass G20, short glass fibers (including fine glass powders such as E glass, T glass, D glass, S glass and Q glass), hollow glass, spherical glass and the like can be mentioned. As the inorganic filler (C), one type may be used alone, or two or more types may be used in combination.
このなかでも、シリカ、ベーマイト、及びアルミナからなる群より選択される少なくとも1種を含むことが好ましい。このような無機充填材(C)を用いることにより、曲げ強度及び曲げ弾性率、熱膨張率がより向上する傾向にある。 Among these, it is preferable to contain at least one selected from the group consisting of silica, boehmite, and alumina. By using such an inorganic filler (C), the bending strength, the bending elastic modulus, and the coefficient of thermal expansion tend to be further improved.
無機充填材(C)の含有量は、樹脂固形分100質量部に対して、好ましくは25〜700質量部であり、より好ましくは50〜500質量部であり、さらに好ましくは75〜300質量部である。無機充填材(C)の含有量が上記範囲内であることにより、得られる硬化物の銅箔ピール強度、めっきピール強度がより向上する傾向にある。 The content of the inorganic filler (C) is preferably 25 to 700 parts by mass, more preferably 50 to 500 parts by mass, and further preferably 75 to 300 parts by mass with respect to 100 parts by mass of the resin solid content. Is. When the content of the inorganic filler (C) is within the above range, the copper foil peel strength and the plating peel strength of the obtained cured product tend to be further improved.
〔シランカップリング剤及び湿潤分散剤〕
本実施形態の樹脂組成物は、シランカップリング剤や湿潤分散剤をさらに含んでもよい。シランカップリング剤や湿潤分散剤を含むことにより、上記無機充填材(C)の分散性、樹脂成分、無機充填材(C)、及び後述する基材の接着強度がより向上する傾向にある。
[Silane coupling agent and wet dispersant]
The resin composition of the present embodiment may further contain a silane coupling agent and a wet dispersant. By including the silane coupling agent and the wet dispersant, the dispersibility of the inorganic filler (C), the resin component, the inorganic filler (C), and the adhesive strength of the base material described later tend to be further improved.
シランカップリング剤としては、一般に無機物の表面処理に使用されているシランカップリング剤であれば、特に限定されないが、例えば、γ−アミノプロピルトリエトキシシラン、N−β−(アミノエチル)−γ−アミノプロピルトリメトキシシランなどのアミノシラン系化合物;γ−グリシドキシプロピルトリメトキシシランなどのエポキシシラン系化合物;γ−アクリロキシプロピルトリメトキシシランなどのアクリルシラン系化合物;N−β−(N−ビニルベンジルアミノエチル)−γ−アミノプロピルトリメトキシシラン塩酸塩などのカチオニックシラン系化合物;フェニルシラン系化合物などが挙げられる。シランカップリング剤は、1種を単独で用いても、2種以上を併用してもよい。 The silane coupling agent is not particularly limited as long as it is a silane coupling agent generally used for surface treatment of inorganic substances, but for example, γ-aminopropyltriethoxysilane and N-β- (aminoethyl) -γ. -Aminosilane compounds such as aminopropyltrimethoxysilane; epoxysilane compounds such as γ-glycidoxypropyltrimethoxysilane; acrylicsilane compounds such as γ-acryloxypropyltrimethoxysilane; N-β- (N-). Vinyl benzylaminoethyl) -γ-aminopropyltrimethoxysilane Hydrochloride and other cationic silane compounds; phenylsilane compounds and the like can be mentioned. The silane coupling agent may be used alone or in combination of two or more.
湿潤分散剤としては、塗料用に使用されている分散安定剤であれば、特に限定されないが、例えば、ビッグケミー・ジャパン(株)製のDISPER−110、111、118、180、161、BYK−W996、W9010、W903等が挙げられる。 The wet dispersant is not particularly limited as long as it is a dispersion stabilizer used for paints, but for example, DISPER-110, 111, 118, 180, 161 and BYK-W996 manufactured by Big Chemie Japan Co., Ltd. , W9010, W903 and the like.
〔その他の樹脂等〕
本実施形態の樹脂組成物は、必要に応じて、エポキシ樹脂(D)、アルケニル置換ナジイミド化合物(E)、アミン変性シリコーン化合物(F)をさらに含有してもよい。このようなその他の樹脂等を含むことにより、銅箔ピール強度、曲げ強度、曲げ弾性率がより向上し、線熱膨脹率が低下する傾向にある。
[Other resins, etc.]
The resin composition of the present embodiment may further contain an epoxy resin (D), an alkenyl-substituted nadiimide compound (E), and an amine-modified silicone compound (F), if necessary. By including such other resins and the like, the copper foil peel strength, bending strength, and bending elastic modulus tend to be further improved, and the linear thermal expansion coefficient tends to decrease.
〔エポキシ樹脂(D)〕
本実施形態の樹脂組成物は、エポキシ樹脂(D)をさらに含んでもよい。エポキシ樹脂(D)をさらに含むことにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率がより向上する傾向にある。なお、シアン酸エステル化合物(A)がエポキシ基を有する場合において、エポキシ樹脂(D)を用いる場合には、エポキシ樹脂(D)は、エポキシ基を有するシアン酸エステル化合物(A)以外の化合物を言うものとする。
[Epoxy resin (D)]
The resin composition of the present embodiment may further contain an epoxy resin (D). By further containing the epoxy resin (D), the copper foil peel strength, the plating peel strength, the glass transition temperature, and the elastic modulus maintenance rate of the obtained cured product tend to be further improved. When the cyanic acid ester compound (A) has an epoxy group and the epoxy resin (D) is used, the epoxy resin (D) is a compound other than the cyanic acid ester compound (A) having an epoxy group. I will say.
エポキシ樹脂(D)としては、1分子中に2つ以上のエポキシ基を有する化合物であれば特に限定されないが、例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールE型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビスフェノールAノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、ナフタレン型エポキシ樹脂、3官能フェノール型エポキシ樹脂、4官能フェノール型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂、ビフェニルアラルキル型エポキシ樹脂、アラルキルノボラック型エポキシ樹脂、ナフトールアラルキル型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ポリオール型エポキシ樹脂、イソシアヌレート環含有エポキシ樹脂、或いはこれらのハロゲン化物が挙げられる。なかでも、ナフトールアラルキル型エポキシ樹脂、ビフェニルアラルキル型エポキシ樹脂及びナフタレン型エポキシ樹脂からなる群より選ばれる少なくとも1つが好ましい。 The epoxy resin (D) is not particularly limited as long as it is a compound having two or more epoxy groups in one molecule, and for example, a bisphenol A type epoxy resin, a bisphenol E type epoxy resin, a bisphenol F type epoxy resin, and a bisphenol. S-type epoxy resin, phenol novolac type epoxy resin, bisphenol A novolak type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, trifunctional phenol type epoxy resin, tetrafunctional phenol type epoxy resin, glycidyl ester Type epoxy resin, phenol aralkyl type epoxy resin, biphenyl aralkyl type epoxy resin, aralkyl novolak type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene type epoxy resin, polyol type epoxy resin, isocyanurate ring-containing epoxy resin, or these Epoxy can be mentioned. Among them, at least one selected from the group consisting of a naphthol aralkyl type epoxy resin, a biphenyl aralkyl type epoxy resin and a naphthalene type epoxy resin is preferable.
エポキシ樹脂(D)の含有量は、樹脂固形分100質量部に対して、好ましくは2.5〜20質量部であり、より好ましくは5.0〜17.5質量部であり、さらに好ましくは7.5〜15質量部である。エポキシ樹脂(D)の含有量が上記範囲内であることにより、得られる硬化物の柔軟性、銅箔ピール強度、耐薬品性、及び耐デスミア性がより向上する傾向にある。 The content of the epoxy resin (D) is preferably 2.5 to 20 parts by mass, more preferably 5.0 to 17.5 parts by mass, still more preferably, with respect to 100 parts by mass of the resin solid content. 7.5 to 15 parts by mass. When the content of the epoxy resin (D) is within the above range, the flexibility of the obtained cured product, the copper foil peel strength, the chemical resistance, and the desmear resistance tend to be further improved.
〔アルケニル置換ナジイミド化合物(E)〕
アルケニル置換ナジイミド化合物(E)は、分子中に1個以上のアルケニル置換ナジイミド基を有する化合物であれば特に限定されない。このなかでも、下記式(5)で表される化合物が好ましい。このようなアルケニル置換ナジイミド化合物(E)を用いることにより、得られる硬化物の銅箔ピール強度、めっきピール強度、ガラス転移温度、及び弾性率維持率がより向上する傾向にある。
The alkenyl-substituted nadiimide compound (E) is not particularly limited as long as it is a compound having one or more alkenyl-substituted nadiimide groups in the molecule. Among these, the compound represented by the following formula (5) is preferable. By using such an alkenyl-substituted nadiimide compound (E), the copper foil peel strength, the plating peel strength, the glass transition temperature, and the elastic modulus maintenance rate of the obtained cured product tend to be further improved.
アルケニル置換ナジイミド化合物(E)は、下記式(9)及び/又は(10)で表される化合物が好ましい。このようなアルケニル置換ナジイミド化合物(E)を用いることにより、得られる硬化物の熱膨張率がより低下し、耐熱性がより向上する傾向にある。
その他、アルケニル置換ナジイミド化合物(E)は、市販のものを用いることもできる。市販されているものとしては、特に限定されないが、例えば、BANI−M(丸善石油化学(株)製、式(9)で表される化合物)、BANI−X(丸善石油化学(株)製、式(10)で表される化合物)などが挙げられる。これらは1種又は2種以上を組み合わせて使用してもよい。 In addition, as the alkenyl-substituted nadiimide compound (E), a commercially available product can also be used. Commercially available products are not particularly limited, but for example, BANI-M (manufactured by Maruzen Petrochemical Co., Ltd., a compound represented by the formula (9)), BANI-X (manufactured by Maruzen Petrochemical Co., Ltd.), The compound represented by the formula (10)) and the like can be mentioned. These may be used alone or in combination of two or more.
アルケニル置換ナジイミド化合物(E)の含有量は、特に限定されないが、樹脂固形分100質量部に対して、好ましくは20〜45質量部であり、より好ましくは25〜40質量部であり、さらに好ましくは30〜35質量部である。アルケニル置換ナジイミド化合物(E)の含有量が上記範囲内であることにより、得られる硬化物の銅箔ピール強度及びめっきピール強度がより向上する傾向にある。 The content of the alkenyl-substituted nadiimide compound (E) is not particularly limited, but is preferably 20 to 45 parts by mass, more preferably 25 to 40 parts by mass, still more preferably, with respect to 100 parts by mass of the resin solid content. Is 30 to 35 parts by mass. When the content of the alkenyl-substituted nadiimide compound (E) is within the above range, the copper foil peel strength and the plating peel strength of the obtained cured product tend to be further improved.
〔アミン変性シリコーン化合物(F)〕
アミン変性シリコーン化合物(F)は、分子中に1個以上のアミノ基を有する化合物であれば、特に限定されるものではない。その具体例としては下記一般式(11)で表される化合物が挙げられる。
The amine-modified silicone compound (F) is not particularly limited as long as it is a compound having one or more amino groups in the molecule. Specific examples thereof include a compound represented by the following general formula (11).
式(11)中、R8は各々独立に水素原子、メチル基又はフェニル基を表し、中でもメチル基が好ましい。R9は各々独立に単結合、炭素数1〜8のアルキレン基及び/又はアリーレン基を表す。R9としては、炭素数1〜8のアルキレン基とアリーレン基が連結して2価の基を形成するものであってもよい。このなかでも、R9は炭素数2〜4のアルキレン基が好ましい。式(11)中、n4は各々独立に1以上の整数を表す。 In formula (11), R 8 independently represents a hydrogen atom, a methyl group or a phenyl group, and a methyl group is preferable. R 9 independently represents a single bond, an alkylene group having 1 to 8 carbon atoms and / or an arylene group. As R 9 , an alkylene group having 1 to 8 carbon atoms and an arylene group may be linked to form a divalent group. Among these, R 9 is preferably an alkylene group having 2 to 4 carbon atoms. In equation (11), n 4 independently represent an integer of 1 or more.
アミン変性シリコーン化合物(F)のアミノ基当量として、130〜6000が好ましく、400〜3000がより好ましく、600〜2500がさらに好ましい。このようなアミン変性シリコーン化合物(F)を用いることにより、弾性率維持率が良好で、熱膨張率がより低い樹脂組成物を得ることができる。 The amino group equivalent of the amine-modified silicone compound (F) is preferably 130 to 6000, more preferably 400 to 3000, and even more preferably 600 to 2500. By using such an amine-modified silicone compound (F), it is possible to obtain a resin composition having a good elastic modulus maintenance rate and a lower thermal expansion rate.
アミン変性シリコーン化合物(F)の含有量は、特に限定されるものではないが、樹脂固形分100質量部に対して、好ましくは1〜40質量部であり、より好ましくは3〜30質量部であり、さらに好ましくは5〜20質量部である。アミン変性シリコーン化合物(F)の含有量が上記範囲内であることにより、得られる硬化物の弾性率維持率、熱膨張率がより向上する傾向にある。 The content of the amine-modified silicone compound (F) is not particularly limited, but is preferably 1 to 40 parts by mass, and more preferably 3 to 30 parts by mass with respect to 100 parts by mass of the resin solid content. Yes, more preferably 5 to 20 parts by mass. When the content of the amine-modified silicone compound (F) is within the above range, the elastic modulus maintenance rate and the thermal expansion rate of the obtained cured product tend to be further improved.
〔硬化促進剤〕
本実施形態の樹脂組成物は、硬化促進剤をさらに含んでもよい。硬化促進剤としては、特に限定されないが、例えば、トリフェニルイミダゾール、過酸化ベンゾイル、ラウロイルパーオキサイド、アセチルパーオキサイド、パラクロロベンゾイルパーオキサイド、ジ−tert−ブチル−ジ−パーフタレートなどの有機過酸化物;アゾビスニトリルなどのアゾ化合物;N,N−ジメチルベンジルアミン、N,N−ジメチルアニリン、N,N−ジメチルトルイジン、2−N−エチルアニリノエタノール、トリ−n−ブチルアミン、ピリジン、キノリン、N−メチルモルホリン、トリエタノールアミン、トリエチレンジアミン、テトラメチルブタンジアミン、N−メチルピペリジンなどの第3級アミン類;フェノール、キシレノール、クレゾール、レゾルシン、カテコールなどのフェノール類;ナフテン酸鉛、ステアリン酸鉛、ナフテン酸亜鉛、オクチル酸亜鉛、オレイン酸錫、ジブチル錫マレート、ナフテン酸マンガン、ナフテン酸コバルト、アセチルアセトン鉄などの有機金属塩;これら有機金属塩をフェノール、ビスフェノールなどの水酸基含有化合物に溶解してなるもの;塩化錫、塩化亜鉛、塩化アルミニウムなどの無機金属塩;ジオクチル錫オキサイド、その他のアルキル錫、アルキル錫オキサイドなどの有機錫化合物などが挙げられる。これらのなかでも、トリフェニルイミダゾールが硬化反応を促進し、ガラス転移温度、熱膨張率が優れる傾向にあるため、特に好ましい。
[Hardening accelerator]
The resin composition of the present embodiment may further contain a curing accelerator. The curing accelerator is not particularly limited, but is, for example, organic peroxides such as triphenylimidazole, benzoyl peroxide, lauroyl peroxide, acetyl peroxide, parachlorobenzoyl peroxide, and di-tert-butyl-di-perphthalate. Azo compounds such as azobisnitrile; N, N-dimethylbenzylamine, N, N-dimethylaniline, N, N-dimethyltoluidine, 2-N-ethylanilinoethanol, tri-n-butylamine, pyridine, quinoline. , N-Methylmorpholin, triethanolamine, triethylenediamine, tetramethylbutanediamine, N-methylpiperidine and other tertiary amines; phenols, xylenol, cresol, resorcin, catechol and other phenols; lead naphthenate, stearic acid Organic metal salts such as lead, zinc naphthenate, zinc octylate, tin oleate, dibutyltin malate, manganese naphthenate, cobalt naphthenate, iron acetylacetone; these organic metal salts are dissolved in hydroxyl group-containing compounds such as phenol and bisphenol. Examples thereof include inorganic metal salts such as tin chloride, zinc chloride, and aluminum chloride; dioctyl tin oxide, and other organic tin compounds such as alkyl tin and alkyl tin oxide. Among these, triphenylimidazole is particularly preferable because it promotes the curing reaction and tends to have excellent glass transition temperature and coefficient of thermal expansion.
〔溶剤〕
本実施形態の樹脂組成物は、溶剤をさらに含んでもよい。溶剤を含むことにより、樹脂組成物の調製時における粘度が下がり、ハンドリング性がより向上するとともに後述する基材への含浸性がより向上する傾向にある。
〔solvent〕
The resin composition of the present embodiment may further contain a solvent. By containing the solvent, the viscosity of the resin composition at the time of preparation is lowered, the handleability is further improved, and the impregnation property into the substrate, which will be described later, tends to be further improved.
溶剤としては、樹脂組成物中の樹脂成分の一部又は全部を溶解可能なものであれば、特に限定されないが、例えば、アセトン、メチルエチルケトン、メチルセルソルブなどのケトン類;トルエン、キシレンなどの芳香族炭化水素類;ジメチルホルムアミドなどのアミド類;プロピレングリコールモノメチルエーテル及びそのアセテートなどが挙げられる。溶剤は、1種を単独で用いても、2種以上を併用してもよい。 The solvent is not particularly limited as long as it can dissolve a part or all of the resin component in the resin composition, but for example, ketones such as acetone, methyl ethyl ketone and methyl cell solve; aromatics such as toluene and xylene. Group hydrocarbons; amides such as dimethylformamide; propylene glycol monomethyl ethers and acetates thereof and the like. As the solvent, one type may be used alone, or two or more types may be used in combination.
〔ガラス転移温度(Tg)〕
本実施形態の樹脂組成物のガラス転移温度は、好ましくは270〜360℃であり、より好ましくは290〜355℃であり、さらに好ましくは310〜350℃である。ガラス転移温度は、実施例に記載の方法により測定することができる。
[Glass transition temperature (Tg)]
The glass transition temperature of the resin composition of the present embodiment is preferably 270 to 360 ° C, more preferably 290 to 355 ° C, and even more preferably 310 to 350 ° C. The glass transition temperature can be measured by the method described in Examples.
〔弾性率維持率〕
本実施形態の樹脂組成物の弾性率維持率は、好ましくは75〜99%であり、より好ましくは80〜95%であり、さらに好ましくは85〜95%である。「弾性率維持率」とは、JIS規格C6481に準じて、27℃及び260℃の曲げ弾性率を測定し、得られた27℃の曲げ弾性率(a)と260℃の熱時曲げ弾性率の弾性率(b)との差を下記式によって算出したものをいう。なお、弾性率維持率に優れるとは、例えば27℃における曲げ弾性率と260℃における曲げ弾性率(熱時弾性率)の差が小さいことをいう。
弾性率維持率=[(b)/(a)]×100
[Elastic modulus maintenance rate]
The elastic modulus retention rate of the resin composition of the present embodiment is preferably 75 to 99%, more preferably 80 to 95%, and further preferably 85 to 95%. The "modulus modulus maintenance rate" is the flexural modulus (a) at 27 ° C. and the flexural modulus during heat at 260 ° C. obtained by measuring the flexural modulus at 27 ° C. and 260 ° C. according to JIS standard C6481. The difference from the elastic modulus (b) of is calculated by the following formula. The excellent elastic modulus maintenance rate means that, for example, the difference between the flexural modulus at 27 ° C. and the flexural modulus at 260 ° C. (thermal modulus) is small.
Elastic modulus maintenance rate = [(b) / (a)] × 100
〔樹脂組成物の製造方法〕
本実施形態の樹脂組成物の製造方法は、特に限定されないが、例えば、各成分を順次溶剤に配合し、十分に攪拌する方法が挙げられる。この際、各成分を均一に溶解或いは分散させるため、攪拌、混合、混練処理などの公知の処理を行うことができる。具体的には、適切な攪拌能力を有する攪拌機を付設した攪拌槽を用いて攪拌分散処理を行うことで、樹脂組成物に対する無機充填材(C)の分散性を向上させることができる。上記の攪拌、混合、混練処理は、例えば、ボールミル、ビーズミルなどの混合を目的とした装置、又は、公転又は自転型の混合装置などの公知の装置を用いて適宜行うことができる。
[Manufacturing method of resin composition]
The method for producing the resin composition of the present embodiment is not particularly limited, and examples thereof include a method in which each component is sequentially added to a solvent and sufficiently stirred. At this time, in order to uniformly dissolve or disperse each component, known treatments such as stirring, mixing, and kneading can be performed. Specifically, the dispersibility of the inorganic filler (C) in the resin composition can be improved by performing the stirring and dispersing treatment using a stirring tank equipped with a stirring machine having an appropriate stirring ability. The above-mentioned stirring, mixing, and kneading treatment can be appropriately performed using, for example, an apparatus for mixing such as a ball mill or a bead mill, or a known apparatus such as a revolving or rotating type mixing apparatus.
また、本実施形態の樹脂組成物の調製時においては、必要に応じて有機溶剤を使用することができる。有機溶剤の種類は、樹脂組成物中の樹脂を溶解可能なものであれば、特に限定されない。その具体例は、上述したとおりである。 Further, when preparing the resin composition of the present embodiment, an organic solvent can be used if necessary. The type of the organic solvent is not particularly limited as long as it can dissolve the resin in the resin composition. Specific examples thereof are as described above.
〔用途〕
本実施形態の樹脂組成物は、プリプレグ、樹脂シート、積層樹脂シート、積層板、金属箔張積層板、又はプリント配線板として好適に用いることができる。以下、プリプレグ、樹脂シート、積層樹脂シート、積層板、金属箔張積層板、又はプリント配線板について説明する。
[Use]
The resin composition of the present embodiment can be suitably used as a prepreg, a resin sheet, a laminated resin sheet, a laminated board, a metal foil-clad laminated board, or a printed wiring board. Hereinafter, a prepreg, a resin sheet, a laminated resin sheet, a laminated board, a metal foil-clad laminated board, or a printed wiring board will be described.
〔プリプレグ〕
本実施形態のプリプレグは、基材と、該基材に含浸又は塗布された、上記樹脂組成物と、を有する。プリプレグの製造方法は、常法にしたがって行うことができ、特に限定されない。例えば、本実施形態における樹脂成分を基材に含浸又は塗布させた後、100〜200℃の乾燥機中で1〜30分加熱するなどして半硬化(Bステ−ジ化)させることで、本実施形態のプリプレグを作製することができる。
[Prepreg]
The prepreg of the present embodiment has a base material and the above-mentioned resin composition impregnated or coated on the base material. The method for producing the prepreg can be carried out according to a conventional method, and is not particularly limited. For example, after impregnating or coating the base material with the resin component in the present embodiment, the substrate is semi-cured (B-staged) by heating in a dryer at 100 to 200 ° C. for 1 to 30 minutes. The prepreg of the present embodiment can be produced.
樹脂組成物(無機充填材(C)を含む。)の含有量は、プリプレグの総量に対して、好ましくは30〜90質量%であり、より好ましくは35〜85質量%であり、好ましくは40〜80質量%である。樹脂組成物の含有量が上記範囲内であることにより、成形性がより向上する傾向にある。 The content of the resin composition (including the inorganic filler (C)) is preferably 30 to 90% by mass, more preferably 35 to 85% by mass, and preferably 40, based on the total amount of the prepreg. ~ 80% by mass. When the content of the resin composition is within the above range, the moldability tends to be further improved.
基材としては、特に限定されず、各種プリント配線板材料に用いられている公知のものを、目的とする用途や性能により適宜選択して使用することができる。基材を構成する繊維の具体例としては、特に限定されないが、例えば、Eガラス、Dガラス、Sガラス、Qガラス、球状ガラス、NEガラス、Lガラス、Tガラスなどのガラス繊維;クォーツなどのガラス以外の無機繊維;ポリパラフェニレンテレフタラミド(ケブラー(登録商標)、デュポン株式会社製)、コポリパラフェニレン・3,4’オキシジフェニレン・テレフタラミド(テクノーラ(登録商標)、帝人テクノプロダクツ株式会社製)などの全芳香族ポリアミド;2,6−ヒドロキシナフトエ酸・パラヒドロキシ安息香酸(ベクトラン(登録商標)、株式会社クラレ製)、ゼクシオン(登録商標、KBセーレン製)などのポリエステル;ポリパラフェニレンベンズオキサゾール(ザイロン(登録商標)、東洋紡績株式会社製)、ポリイミドなどの有機繊維が挙げられる。これらのなかでも低熱膨張率の観点から、Eガラスクロス、Tガラスクロス、Sガラスクロス、Qガラスクロス、及び有機繊維からなる群より選ばれる少なくとも1種が好ましい。これら基材は、1種を単独で用いても、2種以上を併用してもよい。 The base material is not particularly limited, and known materials used for various printed wiring board materials can be appropriately selected and used depending on the intended use and performance. Specific examples of the fibers constituting the base material are not particularly limited, but for example, glass fibers such as E glass, D glass, S glass, Q glass, spherical glass, NE glass, L glass, and T glass; quartz and the like. Inorganic fibers other than glass; polyparaphenylene terephthalamide (Kevlar (registered trademark), manufactured by DuPont Co., Ltd.), copolyparaphenylene 3,4'oxydiphenylene terephthalamide (Technora (registered trademark), Teijin Techno Products Co., Ltd.) Total aromatic polyamide such as 2,6-hydroxynaphthoic acid / parahydroxybenzoic acid (Vectran (registered trademark), manufactured by Claret Co., Ltd.), polyester such as Zexion (registered trademark, manufactured by KB Salen); polyparaphenylene. Examples thereof include organic fibers such as benzoxazole (Zylon (registered trademark), manufactured by Toyo Spinning Co., Ltd.) and polyimide. Among these, at least one selected from the group consisting of E glass cloth, T glass cloth, S glass cloth, Q glass cloth, and organic fiber is preferable from the viewpoint of low coefficient of thermal expansion. These base materials may be used alone or in combination of two or more.
基材の形状としては、特に限定されないが、例えば、織布、不織布、ロービング、チョップドストランドマット、サーフェシングマットなどが挙げられる。織布の織り方としては、特に限定されないが、例えば、平織り、ななこ織り、綾織り等が知られており、これら公知のものから目的とする用途や性能により適宜選択して使用することができる。また、これらを開繊処理したものやシランカップリング剤などで表面処理したガラス織布が好適に使用される。基材の厚さや質量は、特に限定されないが、通常は0.01〜0.3mm程度のものが好適に用いられる。とりわけ、強度と吸水性との観点から、基材は、厚み200μm以下、質量250g/m2以下のガラス織布が好ましく、Eガラス、Sガラス、及びTガラスのガラス繊維からなるガラス織布がより好ましい。 The shape of the base material is not particularly limited, and examples thereof include woven fabrics, non-woven fabrics, rovings, chopped strand mats, and surfaced mats. The weaving method of the woven fabric is not particularly limited, but for example, plain weave, Nanako weave, twill weave and the like are known, and can be appropriately selected from these known ones according to the intended use and performance. .. Further, a glass woven fabric obtained by opening the fibers or surface-treating with a silane coupling agent or the like is preferably used. The thickness and mass of the base material are not particularly limited, but usually, those having a thickness of about 0.01 to 0.3 mm are preferably used. In particular, from the viewpoint of strength and water absorption, the base material is preferably a glass woven fabric having a thickness of 200 μm or less and a mass of 250 g / m 2 or less, and a glass woven fabric made of glass fibers of E glass, S glass, and T glass is preferable. More preferred.
〔樹脂シート〕
本実施形態の樹脂シートは、上記樹脂組成物をシート状に成形してなるものである。樹脂シートの製造方法は、常法にしたがって行うことができ、特に限定されない。例えば、下記積層樹脂シートの製法において、本実施形態の樹脂組成物を溶剤に溶解させた溶液をシート基材上に塗布して乾燥させた後に、積層樹脂シートからシート基材を剥離又はエッチングする方法が挙げられる。なお、上記の本実施形態の樹脂組成物を溶剤に溶解させた溶液を、シート状のキャビティを有する金型内に供給し乾燥する等してシート状に成形することで、シート基材を用いることなく単層樹脂シート(樹脂シート)を得ることもできる。
[Resin sheet]
The resin sheet of the present embodiment is formed by molding the above resin composition into a sheet shape. The method for producing the resin sheet can be carried out according to a conventional method, and is not particularly limited. For example, in the following method for producing a laminated resin sheet, a solution obtained by dissolving the resin composition of the present embodiment in a solvent is applied onto the sheet substrate and dried, and then the sheet substrate is peeled off or etched from the laminated resin sheet. The method can be mentioned. A sheet base material is used by supplying a solution obtained by dissolving the resin composition of the present embodiment in a solvent into a mold having a sheet-shaped cavity and drying the resin composition to form a sheet. It is also possible to obtain a single-layer resin sheet (resin sheet) without this.
〔積層樹脂シート〕
本実施形態の積層樹脂シートは、シート基材と、該シート基材の片面または両面に積層された、上記樹脂組成物と、を有する。積層樹脂シートとは、薄葉化の1つの手段として用いられるもので、例えば、金属箔やフィルムなどの支持体に、直接、プリプレグ等に用いられる熱硬化性樹脂(無機充填材(C)を含む)を塗布及び乾燥して製造することができる。
[Laminated resin sheet]
The laminated resin sheet of the present embodiment has a sheet base material and the above-mentioned resin composition laminated on one side or both sides of the sheet base material. The laminated resin sheet is used as one means of thinning leaves. For example, a support such as a metal foil or a film contains a thermosetting resin (inorganic filler (C)) used for a prepreg or the like directly on a support. ) Can be applied and dried to produce.
シート基材としては、特に限定されないが、各種プリント配線板材料に用いられている公知の物もの使用することができる。例えばポリイミドフィルム、ポリアミドフィルム、ポリエステルフィルム、ポリエチレンテレフタレート(PET)フィルム、ポリブチレンテレフタレート(PBT)フィルム、ポリプロピレン(PP)フィルム、ポリエチレン(PE)フィルム、アルミニウム箔、銅箔、金箔など挙げられる。その中でも電解銅箔、PETフィルムが好ましい。 The sheet base material is not particularly limited, but known materials used for various printed wiring board materials can be used. Examples thereof include a polyimide film, a polyamide film, a polyester film, a polyethylene terephthalate (PET) film, a polybutylene terephthalate (PBT) film, a polypropylene (PP) film, a polyethylene (PE) film, an aluminum foil, a copper foil, and a gold foil. Among them, electrolytic copper foil and PET film are preferable.
塗布方法としては、例えば、本実施形態の樹脂組成物を溶剤に溶解させた溶液を、バーコーター、ダイコーター、ドクターブレード、ベーカーアプリケーター等でシート基材上に塗布する方法が挙げられる。 Examples of the coating method include a method of applying a solution of the resin composition of the present embodiment in a solvent onto a sheet substrate with a bar coater, a die coater, a doctor blade, a baker applicator, or the like.
積層樹脂シートは、上記樹脂組成物をシート基材に塗布後、半硬化(Bステージ化)させたものであることが好ましい。具体的には、例えば、上記樹脂組成物を銅箔などのシート基材に塗布した後、100〜200℃の乾燥機中で、1〜60分加熱させる方法などにより半硬化させ、積層樹脂シートを製造する方法などが挙げられる。シート基材に対する樹脂組成物の付着量は、積層樹脂シートの樹脂厚で1〜300μmの範囲が好ましい。 The laminated resin sheet is preferably one in which the above resin composition is applied to a sheet base material and then semi-cured (B-staged). Specifically, for example, after applying the above resin composition to a sheet base material such as copper foil, it is semi-cured by a method of heating in a dryer at 100 to 200 ° C. for 1 to 60 minutes, and then a laminated resin sheet. Examples include a method of manufacturing. The amount of the resin composition adhered to the sheet substrate is preferably in the range of 1 to 300 μm in terms of the resin thickness of the laminated resin sheet.
〔積層板〕
本実施形態の積層板は、上記プリプレグ、上記樹脂シート、及び上記積層樹脂シートからなる群より選択される少なくとも1種を1枚以上有する。
[Laminate board]
The laminated board of this embodiment has at least one selected from the group consisting of the prepreg, the resin sheet, and the laminated resin sheet.
〔金属箔張積層板〕
本実施形態の金属箔張積層板は、上記プリプレグ、上記樹脂シート、及び上記積層樹脂シートからなる群より選択される少なくとも1種と、上記プリプレグ、上記樹脂シート、及び上記積層樹脂シートの片面又は両面に配された金属箔と、を有する。すなわち、本実施形態の金属箔張積層板は、上記プリプレグ、上記樹脂シート、及び上記積層樹脂シートからなる群より選択される少なくとも1種と、金属箔とを積層して硬化して得られるものである。
[Metal foil-clad laminate]
The metal foil-covered laminated board of the present embodiment includes at least one selected from the group consisting of the prepreg, the resin sheet, and the laminated resin sheet, and one side of the prepreg, the resin sheet, and the laminated resin sheet, or It has metal foils arranged on both sides. That is, the metal foil-clad laminate of the present embodiment is obtained by laminating and curing a metal foil with at least one selected from the group consisting of the prepreg, the resin sheet, and the laminated resin sheet. Is.
絶縁層は、上記樹脂組成物、1層のプリプレグ、樹脂シート、又は積層樹脂シートであっても、上記樹脂組成物、プリプレグ、樹脂シート、又は積層樹脂シートを2層以上積層したものであってもよい。 The insulating layer is the above resin composition, one layer of prepreg, resin sheet, or even if it is a laminated resin sheet, the above resin composition, prepreg, resin sheet, or laminated resin sheet is laminated with two or more layers. May be good.
導体層は、銅やアルミニウムなどの金属箔とすることができる。ここで使用する金属箔は、プリント配線板材料に用いられるものであれば、特に限定されないが、圧延銅箔や電解銅箔などの公知の銅箔が好ましい。また、導体層の厚みは、特に限定されないが、1〜70μmが好ましく、より好ましくは1.5〜35μmである。 The conductor layer can be a metal foil such as copper or aluminum. The metal foil used here is not particularly limited as long as it is used as a material for a printed wiring board, but a known copper foil such as a rolled copper foil or an electrolytic copper foil is preferable. The thickness of the conductor layer is not particularly limited, but is preferably 1 to 70 μm, more preferably 1.5 to 35 μm.
金属箔張積層板の成形方法及びその成形条件は、特に限定されず、一般的なプリント配線板用積層板及び多層板の手法及び条件を適用することができる。例えば、金属箔張積層板の成形時には多段プレス機、多段真空プレス機、連続成形機、オートクレーブ成形機などを用いることができる。また、金属箔張積層板の成形において、温度は100〜300℃、圧力は面圧2〜100kgf/cm2、加熱時間は0.05〜5時間の範囲が一般的である。さらに、必要に応じて、150〜300℃の温度で後硬化を行うこともできる。また、上述のプリプレグと、別途作成した内層用の配線板とを組み合わせて積層成形することにより、多層板とすることも可能である。 The molding method of the metal foil-covered laminated board and the molding conditions thereof are not particularly limited, and general methods and conditions of the laminated board for printed wiring boards and the multilayer board can be applied. For example, a multi-stage press machine, a multi-stage vacuum press machine, a continuous forming machine, an autoclave forming machine, or the like can be used when forming a metal foil-clad laminate. Further, in molding a metal foil-clad laminate, the temperature is generally in the range of 100 to 300 ° C., the pressure is generally in the range of 2 to 100 kgf / cm 2, and the heating time is in the range of 0.05 to 5 hours. Further, if necessary, post-curing can be performed at a temperature of 150 to 300 ° C. Further, it is also possible to form a multilayer board by laminating and molding the above-mentioned prepreg in combination with a separately prepared wiring board for an inner layer.
〔プリント配線板〕
本実施形態のプリント配線板は、絶縁層と、前記絶縁層の表面に形成された導体層とを含むプリント配線板であって、前記絶縁層が、上記樹脂組成物を含む。上記の金属箔張積層板は、所定の配線パターンを形成することにより、プリント配線板として好適に用いることができる。そして、上記の金属箔張積層板は、低い熱膨張率、良好な成形性及び耐薬品性を有し、そのような性能が要求される半導体パッケージ用プリント配線板として、殊に有効に用いることができる。
[Printed circuit board]
The printed wiring board of the present embodiment is a printed wiring board including an insulating layer and a conductor layer formed on the surface of the insulating layer, and the insulating layer contains the resin composition. The metal foil-clad laminate can be suitably used as a printed wiring board by forming a predetermined wiring pattern. The metal foil-clad laminate has a low coefficient of thermal expansion, good moldability and chemical resistance, and is particularly effectively used as a printed wiring board for a semiconductor package in which such performance is required. Can be done.
本実施形態のプリント配線板は、具体的には、例えば、以下の方法により製造することができる。まず、上述の金属箔張積層板(金属箔張積層板等)を用意する。金属箔張積層板の表面にエッチング処理を施して内層回路の形成を行い、内層基板を作成する。この内層基板の内層回路表面に、必要に応じて接着強度を高めるための表面処理を行い、次いでその内層回路表面に上述のプリプレグを所要枚数重ね、更にその外側に外層回路用の金属箔を積層し、加熱加圧して一体成形する。このようにして、内層回路と外層回路用の金属箔との間に、基材及び熱硬化性樹脂組成物の硬化物からなる絶縁層が形成された多層の積層板が製造される。次いで、この多層の積層板にスルーホールやバイアホール用の穴あけ加工を施した後、硬化物層に含まれている樹脂成分に由来する樹脂の残渣であるスミアを除去するためデスミア処理が行われる。その後この穴の壁面に内層回路と外層回路用の金属箔とを導通させるめっき金属皮膜を形成し、更に外層回路用の金属箔にエッチング処理を施して外層回路を形成し、プリント配線板が製造される。 Specifically, the printed wiring board of the present embodiment can be manufactured by, for example, the following method. First, the above-mentioned metal foil-clad laminate (metal foil-clad laminate, etc.) is prepared. The surface of the metal foil-clad laminate is etched to form an inner layer circuit, and an inner layer substrate is created. The inner layer circuit surface of this inner layer substrate is surface-treated to increase the adhesive strength as necessary, then the required number of the above-mentioned prepregs is laminated on the inner layer circuit surface, and the metal foil for the outer layer circuit is laminated on the outer side thereof. Then, heat and pressurize to integrally mold. In this way, a multi-layer laminated board in which an insulating layer made of a base material and a cured product of a thermosetting resin composition is formed between an inner layer circuit and a metal foil for an outer layer circuit is manufactured. Next, after drilling holes for through holes and via holes in this multilayer laminated board, desmear treatment is performed to remove smear, which is a resin residue derived from the resin component contained in the cured product layer. .. After that, a plated metal film that conducts the inner layer circuit and the metal foil for the outer layer circuit is formed on the wall surface of this hole, and the metal foil for the outer layer circuit is further etched to form the outer layer circuit, and the printed wiring board is manufactured. Will be done.
例えば、上述のプリプレグ(基材及びこれに添着された上述の樹脂組成物)、金属箔張積層板の樹脂組成物層(上述の樹脂組成物からなる層)が、上述の樹脂組成物を含む絶縁層を構成することになる。 For example, the above-mentioned prepreg (the base material and the above-mentioned resin composition attached thereto) and the resin composition layer of the metal foil-clad laminate (the above-mentioned layer composed of the above-mentioned resin composition) include the above-mentioned resin composition. It will form an insulating layer.
また、金属箔張積層板を用いない場合には、上記プリプレグ、上記積層樹脂シート、又は上記樹脂組成物からなるものに、回路となる導体層を形成しプリント配線板を作製してもよい。この際、導体層の形成に無電解めっきの手法を用いることもできる。 When the metal foil-covered laminated board is not used, a conductor layer to be a circuit may be formed on the prepreg, the laminated resin sheet, or the resin composition to produce a printed wiring board. At this time, an electroless plating method can also be used to form the conductor layer.
本実施形態のプリント配線板は、上述の絶縁層が半導体実装時のリフロー温度下においても優れた弾性率を維持することで、半導体プラスチックパッケージの反りを効果的に抑制することから、半導体パッケージ用プリント配線板として、殊に有効に用いることができる。 The printed wiring board of the present embodiment is used for semiconductor packages because the above-mentioned insulating layer maintains an excellent elastic modulus even under the reflow temperature at the time of semiconductor mounting, thereby effectively suppressing the warp of the semiconductor plastic package. It can be particularly effectively used as a printed wiring board.
以下、本発明を実施例及び比較例を用いてより具体的に説明する。本発明は、以下の実施例によって何ら限定されるものではない。 Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples. The present invention is not limited to the following examples.
〔合成例1:ジアリルビスフェノールA型シアン酸エステル化合物の合成〕
ジアリルビスフェノールA700g(ヒドロキシル基当量154.2g/eq.)(OH基換算4.54mol)(DABPA、大和化成工業(株)製)及びトリエチルアミン459.4g(4.54mol)(ヒドロキシル基1モルに対して1.0モル)をジクロロメタン2100gに溶解させ、これを溶液1とした。
[Synthesis Example 1: Synthesis of diallyl bisphenol A type cyanide ester compound]
Dialyl bisphenol A 700 g (hydroxyl group equivalent 154.2 g / eq.) (OH group equivalent 4.54 mol) (DABPA, manufactured by Daiwa Kasei Kogyo Co., Ltd.) and triethylamine 459.4 g (4.54 mol) (for 1 mol of hydroxyl group) 1.0 mol) was dissolved in 2100 g of dichloromethane, and this was used as solution 1.
塩化シアン474.4g(7.72mol)(ヒドロキシル基1モルに対して1.7モル)、ジクロロメタン1106.9g、36%塩酸735.6g(7.26mol)(ヒドロキシル基1モルに対して1.6モル)、水4560.7gを、撹拌下、液温−2〜−0.5℃に保ちながら、溶液1を90分かけて注下した。溶液1注下終了後、同温度にて30分撹拌した後、トリエチルアミン459.4g(4.54mol)(ヒドロキシル基1モルに対して1.0モル)をジクロロメタン459.4gに溶解させた溶液(溶液2)を25分かけて注下した。溶液2注下終了後、同温度にて30分撹拌して反応を完結させた。 474.4 g (7.72 mol) of cyan chloride (1.7 mol per 1 mol of hydroxyl group), 1106.9 g of dichloromethane, 735.6 g (7.26 mol) of 36% hydrochloric acid (1 mol per 1 mol of hydroxyl group). 6 mol), 4560.7 g of water was poured over 90 minutes with stirring while keeping the liquid temperature at −2 to −0.5 ° C. After pouring 1 solution, the mixture was stirred at the same temperature for 30 minutes, and then a solution in which 459.4 g (4.54 mol) of triethylamine (1.0 mol with respect to 1 mol of hydroxyl group) was dissolved in 459.4 g of dichloromethane ( Solution 2) was poured over 25 minutes. After pouring 2 of the solution, the reaction was completed by stirring at the same temperature for 30 minutes.
その後反応液を静置して有機相と水相を分離した。得られた有機相を、0.1N塩酸 2Lにより洗浄した後、水2000gで6回洗浄した。水洗6回目の廃水の電気伝導度は20μS/cmであり、水による洗浄により、除けるイオン性化合物は十分に除けられたことを確認した。 After that, the reaction solution was allowed to stand to separate the organic phase and the aqueous phase. The obtained organic phase was washed with 2 L of 0.1N hydrochloric acid and then washed 6 times with 2000 g of water. The electrical conductivity of the wastewater after the sixth washing with water was 20 μS / cm, and it was confirmed that the ionic compounds that could be removed were sufficiently removed by washing with water.
水洗後の有機相を減圧下で濃縮し、最終的に90℃で1時間濃縮乾固させて、目的とするジアリルビスフェノールA型シアン酸エステル化合物(DABPA−CN、シアン酸エステル基当量:179g/eq.)を薄黄色液状物として805g得た。得られたDABPA−CNのIRスペクトルは2264cm-1(シアン酸エステル基)の吸収を示し、且つ、ヒドロキシル基の吸収は示さなかった。 The organic phase after washing with water is concentrated under reduced pressure, and finally concentrated to dryness at 90 ° C. for 1 hour to obtain the desired diallyl bisphenol A type cyanate ester compound (DABPA-CN, cyanate ester group equivalent: 179 g /). eq.) Was obtained as a pale yellow liquid substance in an amount of 805 g. The IR spectrum of the obtained DABPA-CN showed absorption of 2264 cm -1 (cyanide ester group) and no absorption of hydroxyl group.
〔合成例2:α−ナフトールアラルキル型シアン酸エステル化合物の合成〕
反応器内で、α−ナフトールアラルキル樹脂(SN495V、OH基当量:236g/eq.、新日鐵化学(株)製:ナフトールアラルキルの繰り返し単位数nは1〜5のものが含まれる。)0.47mol(OH基換算)を、クロロホルム500mLに溶解させ、この溶液にトリエチルアミン0.7molを添加した。温度を−10℃に保ちながら反応器内に0.93molの塩化シアンのクロロホルム溶液300gを1.5時間かけて滴下し、滴下終了後、30分撹拌した。その後さらに、0.1molのトリエチルアミンとクロロホルム30gの混合溶液を反応器内に滴下し、30分撹拌して反応を完結させた。副生したトリエチルアミンの塩酸塩を反応液から濾別した後、得られた濾液を0.1N塩酸500mLで洗浄した後、水500mLでの洗浄を4回繰り返した。これを硫酸ナトリウムにより乾燥した後、75℃でエバポレートし、さらに90℃で減圧脱気することにより、褐色固形のα−ナフトールアラルキル型シアン酸エステル樹脂(SNCN)を得た。得られたα−ナフトールアラルキル型シアン酸エステル樹脂(SN495−V−CN、シアン酸エステル基当量:261g/eq.)を赤外吸収スペクトルにより分析したところ、2264cm-1付近のシアン酸エステル基の吸収が確認された。
[Synthesis Example 2: Synthesis of α-naphthol aralkyl-type cyanide ester compound]
In the reactor, α-naphthol aralkyl resin (SN495V, OH group equivalent: 236 g / eq., Manufactured by Nippon Steel Chemical Co., Ltd .: The number of repeating units n of naphthol aralkyl includes 1 to 5) 0. .47 mol (OH group equivalent) was dissolved in 500 mL of chloroform, and 0.7 mol of triethylamine was added to this solution. While maintaining the temperature at −10 ° C., 300 g of a 0.93 mol cyanogen chloride chloroform solution was added dropwise over 1.5 hours, and the mixture was stirred for 30 minutes after the addition was completed. After that, a mixed solution of 0.1 mol of triethylamine and 30 g of chloroform was further added dropwise to the reactor, and the mixture was stirred for 30 minutes to complete the reaction. The by-produced triethylamine hydrochloride was filtered off from the reaction solution, the obtained filtrate was washed with 500 mL of 0.1N hydrochloric acid, and then washed with 500 mL of water was repeated 4 times. This was dried over sodium sulfate, evaporated at 75 ° C., and degassed under reduced pressure at 90 ° C. to obtain a brown solid α-naphthol aralkyl type cyanate ester resin (SNCN). When the obtained α-naphthol aralkyl type cyanide ester resin (SN495-V-CN, cyanide ester group equivalent: 261 g / eq.) Was analyzed by an infrared absorption spectrum, the cyanide ester group near 2264 cm -1 was analyzed. Absorption was confirmed.
〔実施例1〕
合成例1で得られたDABPA−CNを48.3質量部、ノボラック型マレイミド化合物(BMI−2300、大和化成工業(株)製、マレイミド基当量:186g/eq.)を27質量部、ビスマレイミド化合物(BMI−80、大和化成工業(株)製、マレイミド基当量:285g/eq.)を14.7質量部、アミン変性シリコーン化合物(X−22−161B、信越化学工業(株)製、官能基当量:1500g/eq.)を10質量部、スラリーシリカ(SC−5050MOB、平均粒子径1.5μm、アドマテックス(株)製)を100質量部、湿潤分散剤(DISPERBYK−161、ビックケミー・ジャパン(株)製)を1質量部、レベリング剤(ビックケミー・ジャパン(株)製、「BYK−310」)を0.05質量部、硬化促進剤(2,4,5−トリフェニルイミダゾール、東京化成工業(株)製)を0.5質量部混合してワニスを得た。このワニスをメチルエチルケトンで希釈し、厚さ0.1mmのTガラス織布に含浸塗工し、140℃で3分間加熱乾燥して、樹脂含有量44質量%のプリプレグを得た。なお、シアン酸エステル化合物(A)のシアン酸エステル基量(α)(質量部/シアン酸エステル基当量)は0.270であり、マレイミド化合物(B)のマレイミド基量(β)(質量部/マレイミド基当量)は0.197であり、比(〔α/β〕)は1.37であった。
[Example 1]
48.3 parts by mass of DABPA-CN obtained in Synthesis Example 1, 27 parts by mass of a novolak-type maleimide compound (BMI-2300, manufactured by Daiwa Kasei Kogyo Co., Ltd., maleimide group equivalent: 186 g / eq.), Bismaleimide. Compound (BMI-80, manufactured by Daiwa Kasei Kogyo Co., Ltd., maleimide group equivalent: 285 g / eq.) By 14.7 parts by mass, amine-modified silicone compound (X-22-161B, manufactured by Shin-Etsu Chemical Industry Co., Ltd.), functional Base equivalent: 1500 g / eq.) In 10 parts by mass, slurry silica (SC-5050MOB, average particle size 1.5 μm, manufactured by Admatex Co., Ltd.) in 100 parts by mass, wet dispersant (DISPERBYK-161, Big Chemie Japan) 1 part by mass of a leveling agent (manufactured by Big Chemy Japan Co., Ltd., "BYK-310"), 0.05 part by mass of a curing accelerator (2,4,5-triphenylimidazole, Tokyo Kasei) (Manufactured by Kogyo Co., Ltd.) was mixed in an amount of 0.5 parts by mass to obtain a varnish. This varnish was diluted with methyl ethyl ketone, impregnated and coated on a T glass woven cloth having a thickness of 0.1 mm, and dried by heating at 140 ° C. for 3 minutes to obtain a prepreg having a resin content of 44% by mass. The amount of cyanic acid ester group (α) (part by mass / equivalent of cyanate ester group) of the cyanic acid ester compound (A) is 0.270, and the amount of maleimide group (β) (part by mass) of the maleimide compound (B). / Maleimide group equivalent) was 0.197 and the ratio ([α / β]) was 1.37.
〔実施例2〕
DABPA−CNの使用量を40.3質量部とし、BMI−2300の使用量を35質量部としたこと以外は、実施例1と同様の方法により、プリプレグを得た。なお、シアン酸エステル化合物(A)のシアン酸エステル基量(α)(質量部/シアン酸エステル基当量)は0.225であり、マレイミド化合物(B)のマレイミド基量(β)(質量部/マレイミド基当量)は0.240であり、比(〔α/β〕)は0.94であった。
[Example 2]
A prepreg was obtained by the same method as in Example 1 except that the amount of DABPA-CN used was 40.3 parts by mass and the amount of BMI-2300 used was 35 parts by mass. The amount of cyanic acid ester group (α) (part by mass / equivalent of cyanate ester group) of the cyanic acid ester compound (A) is 0.225, and the amount of maleimide group (β) (part by mass) of the maleimide compound (B). / Maleimide group equivalent) was 0.240 and the ratio ([α / β]) was 0.94.
〔実施例3〕
DABPA−CNの使用量を27.3質量部とし、BMI−2300の使用量を48質量部としたこと以外は、実施例1と同様の方法により、プリプレグを得た。なお、シアン酸エステル化合物(A)のシアン酸エステル基量(α)(質量部/シアン酸エステル基当量)は0.153であり、マレイミド化合物(B)のマレイミド基量(β)(質量部/マレイミド基当量)は0.310であり、比(〔α/β〕)は0.49であった。
[Example 3]
A prepreg was obtained by the same method as in Example 1 except that the amount of DABPA-CN used was 27.3 parts by mass and the amount of BMI-2300 used was 48 parts by mass. The amount of cyanic acid ester group (α) (part by mass / equivalent of cyanate ester group) of the cyanic acid ester compound (A) is 0.153, and the amount of maleimide group (β) (part by mass) of the maleimide compound (B). / Maleimide group equivalent) was 0.310 and the ratio ([α / β]) was 0.49.
〔実施例4〕
DABPA−CNの使用量を19.3質量部とし、BMI−2300の使用量を56質量部としたこと以外は、実施例1と同様の方法により、プリプレグを得た。なお、シアン酸エステル化合物(A)のシアン酸エステル基量(α)(質量部/シアン酸エステル基当量)は0.108であり、マレイミド化合物(B)のマレイミド基量(β)(質量部/マレイミド基当量)は0.353であり、比(〔α/β〕)は0.31であった。
[Example 4]
A prepreg was obtained by the same method as in Example 1 except that the amount of DABPA-CN used was 19.3 parts by mass and the amount of BMI-2300 used was 56 parts by mass. The amount of cyanic acid ester group (α) (part by mass / equivalent of cyanate ester group) of the cyanic acid ester compound (A) is 0.108, and the amount of maleimide group (β) (part by mass) of the maleimide compound (B). / Maleimide group equivalent) was 0.353, and the ratio ([α / β]) was 0.31.
〔比較例1〕
DABPA−CNの使用量を14.3質量部とし、BMI−2300の使用量を61質量部としたこと以外は、実施例1と同様の方法により、プリプレグを得た。なお、シアン酸エステル化合物(A)のシアン酸エステル基量(α)(質量部/シアン酸エステル基当量)は0.080であり、マレイミド化合物(B)のマレイミド基量(β)(質量部/マレイミド基当量)は0.380であり、比(〔α/β〕)は0.21であった。
[Comparative Example 1]
A prepreg was obtained by the same method as in Example 1 except that the amount of DABPA-CN used was 14.3 parts by mass and the amount of BMI-2300 used was 61 parts by mass. The amount of cyanic acid ester group (α) (part by mass / equivalent of cyanate ester group) of the cyanic acid ester compound (A) is 0.080, and the amount of maleimide group (β) (part by mass) of the maleimide compound (B). / Maleimide group equivalent) was 0.380 and the ratio ([α / β]) was 0.21.
〔実施例5〕
合成例2で得られたSN495−V−CNを52.7質量部、ノボラック型マレイミド化合物(BMI−2300、大和化成工業(株)製、マレイミド基当量:186g/eq.)を37.3質量部、ビフェニルアラルキル型エポキシ化合物(NC−3000H、日本化薬(株)製、官能基当量:290g/eq.)を10質量部、スラリーシリカ(SC−5050MOB、平均粒子径1.5μm、アドマテックス(株)製)を100質量部、湿潤分散剤(DISPERBYK−161、ビックケミー・ジャパン(株)製)を1質量部、レベリング剤(ビックケミー・ジャパン(株)製、「BYK−310」)を0.05質量部、硬化促進剤(2,4,5−トリフェニルイミダゾール、東京化成工業(株)製)を0.5質量部混合してワニスを得た。このワニスをメチルエチルケトンで希釈し、厚さ0.1mmのTガラス織布に含浸塗工し、140℃で3分間加熱乾燥して、樹脂含有量48質量%のプリプレグを得た。なお、シアン酸エステル化合物(A)のシアン酸エステル基量(α)(質量部/シアン酸エステル基当量)は0.202であり、マレイミド化合物(B)のマレイミド基量(β)(質量部/マレイミド基当量)は0.201であり、比(〔α/β〕)は1.01であった。
[Example 5]
52.7 parts by mass of SN495-V-CN obtained in Synthesis Example 2, and 37.3 parts by mass of a novolak-type maleimide compound (BMI-2300, manufactured by Daiwa Kasei Kogyo Co., Ltd., maleimide group equivalent: 186 g / eq.). Part, 10 parts by mass of biphenyl aralkyl type epoxy compound (NC-3000H, manufactured by Nippon Kayaku Co., Ltd., functional group equivalent: 290 g / eq.), Slurry silica (SC-5050MOB, average particle size 1.5 μm, Admatex 100 parts by mass of (manufactured by BIC Chemie Japan Co., Ltd.), 1 part by mass of wet dispersant (DISPERBYK-161, manufactured by BIC Chemie Japan Co., Ltd.), 0 parts of leveling agent (manufactured by BIC Chemie Japan Co., Ltd., "BYK-310") A varnish was obtained by mixing 0.05 parts by mass and 0.5 parts by mass of a curing accelerator (2,4,5-triphenylimidazole, manufactured by Tokyo Kasei Kogyo Co., Ltd.). This varnish was diluted with methyl ethyl ketone, impregnated and coated on a T glass woven cloth having a thickness of 0.1 mm, and dried by heating at 140 ° C. for 3 minutes to obtain a prepreg having a resin content of 48% by mass. The amount of cyanic acid ester group (α) (part by mass / equivalent of cyanate ester group) of the cyanic acid ester compound (A) is 0.202, and the amount of maleimide group (β) (part by mass) of the maleimide compound (B). / Maleimide group equivalent) was 0.201 and the ratio ([α / β]) was 1.01.
〔比較例2〕
SN495−V−CNの使用量を25.3質量部とし、BMI−2300の使用量を64.7質量部としたこと以外は、実施例5と同様の方法により、プリプレグを得た。なお、シアン酸エステル化合物(A)のシアン酸エステル基量(α)(質量部/シアン酸エステル基当量)は0.097であり、マレイミド化合物(B)のマレイミド基量(β)(質量部/マレイミド基当量)は0.348であり、比(〔α/β〕)は0.28であった。
[Comparative Example 2]
A prepreg was obtained by the same method as in Example 5 except that the amount of SN495-V-CN used was 25.3 parts by mass and the amount of BMI-2300 used was 64.7 parts by mass. The amount of cyanic acid ester group (α) (part by mass / equivalent of cyanate ester group) of the cyanic acid ester compound (A) is 0.097, and the amount of maleimide group (β) (part by mass) of the maleimide compound (B). / Maleimide group equivalent) was 0.348 and the ratio ([α / β]) was 0.28.
〔実施例6〕
合成例2で得られたSN495−V−CNを24.9質量部、ノボラック型マレイミド化合物(BMI−2300、大和化成工業(株)製、マレイミド基当量:186g/eq.)を43.3質量部、ビスアリルナジイミド(丸善石油化学社製、「BANI−M」)を31.8質量部、スラリーシリカ(SC−5050MOB、平均粒子径1.5μm、アドマテックス(株)製)を200質量部、湿潤分散剤(DISPERBYK−161、ビックケミー・ジャパン(株)製)を1質量部、レベリング剤(ビックケミー・ジャパン(株)製、「BYK−310」)を0.05質量部、硬化促進剤(2,4,5−トリフェニルイミダゾール、東京化成工業(株)製)を0.5質量部混合してワニスを得た。このワニスをメチルエチルケトンで希釈し、厚さ0.1mmのTガラス織布に含浸塗工し、140℃で3分間加熱乾燥して、樹脂含有量48質量%のプリプレグを得た。なお、シアン酸エステル化合物(A)のシアン酸エステル基量(α)(質量部/シアン酸エステル基当量)は0.095であり、マレイミド化合物(B)のマレイミド基量(β)(質量部/マレイミド基当量)は0.233であり、比(〔α/β〕)は0.41であった。
[Example 6]
24.9 parts by mass of SN495-V-CN obtained in Synthesis Example 2, and 43.3 parts by mass of a novolak-type maleimide compound (BMI-2300, manufactured by Daiwa Kasei Kogyo Co., Ltd., maleimide group equivalent: 186 g / eq.). 31.8 parts by mass of bisallyl nadiimide (manufactured by Maruzen Petrochemical Co., Ltd., "BANI-M"), 200 parts by mass of slurry silica (SC-5050MOB, average particle size 1.5 μm, manufactured by Admatex Co., Ltd.) 1 part by mass of wet dispersant (DISPERBYK-161, manufactured by Big Chemie Japan Co., Ltd.), 0.05 part by mass of leveling agent (manufactured by Big Chemie Japan Co., Ltd., "BYK-310"), curing accelerator (2,4,5-Triphenylimidazole, manufactured by Tokyo Kasei Kogyo Co., Ltd.) was mixed in an amount of 0.5 parts by mass to obtain a varnish. This varnish was diluted with methyl ethyl ketone, impregnated and coated on a T glass woven cloth having a thickness of 0.1 mm, and dried by heating at 140 ° C. for 3 minutes to obtain a prepreg having a resin content of 48% by mass. The amount of cyanic acid ester group (α) (part by mass / equivalent of cyanate ester group) of the cyanic acid ester compound (A) is 0.095, and the amount of maleimide group (β) (part by mass) of the maleimide compound (B). / Maleimide group equivalent) was 0.233 and the ratio ([α / β]) was 0.41.
〔比較例3〕
SN495−V−CNの使用量を5質量部とし、BMI−2300の使用量を49質量部とし、BANI−Mの使用量を36質量部とし、ビフェニルアラルキル型エポキシ化合物(NC−3000H、日本化薬(株)製、官能基当量:290g/eq.)を10質量部用いたこと以外は、実施例6と同様の方法により、プリプレグを得た。なお、シアン酸エステル化合物(A)のシアン酸エステル基量(α)(質量部/シアン酸エステル基当量)は0.019であり、マレイミド化合物(B)のマレイミド基量(β)(質量部/マレイミド基当量)は0.263であり、比(〔α/β〕)は0.07であった。
[Comparative Example 3]
The amount of SN495-V-CN used is 5 parts by mass, the amount of BMI-2300 used is 49 parts by mass, and the amount of BANI-M used is 36 parts by mass. A prepreg was obtained by the same method as in Example 6 except that 10 parts by mass of a functional group equivalent (290 g / eq.) Manufactured by Yakuhin Co., Ltd. was used. The amount of cyanic acid ester group (α) (part by mass / equivalent of cyanate ester group) of the cyanic acid ester compound (A) is 0.019, and the amount of maleimide group (β) (part by mass) of the maleimide compound (B). / Maleimide group equivalent) was 0.263, and the ratio ([α / β]) was 0.07.
〔実施例7〕
ビスフェノールA型シアン酸エステル化合物(CA210、三菱ガス化学(株)製、シアネート当量:139g/eq.)40.5質量部、マレイミド化合物(BMI−70、マレイミド基当量221g/eq、ケイ・アイ化成(株)製)29.8質量部、ビフェニルアラルキル型エポキシ化合物(NC−3000H、日本化薬(株)製、官能基当量:290g/eq.)15質量部、ビスマレイミド化合物(BMI−80、大和化成工業(株)製、マレイミド基当量:285g/eq.)14.7質量部、スラリーシリカ(SC−5050MOB、平均粒子径1.5μm、アドマテックス(株)製)を100質量部、湿潤分散剤(DISPERBYK−161、ビックケミー・ジャパン(株)製)を1質量部、レベリング剤(ビックケミー・ジャパン(株)製、「BYK−310」)を0.05質量部、硬化促進剤(2,4,5−トリフェニルイミダゾール、東京化成工業(株)製)を0.5質量部混合してワニスを得た。このワニスをメチルエチルケトンで希釈し、厚さ0.1mmのTガラス織布に含浸塗工し、140℃で3分間加熱乾燥して、樹脂含有量44質量%のプリプレグを得た。なお、シアン酸エステル化合物(A)のシアン酸エステル基量(α)(質量部/シアン酸エステル基当量)は0.291であり、マレイミド化合物(B)のマレイミド基量(β)(質量部/マレイミド基当量)は0.186であり、比(〔α/β〕)は1.56であった。
[Example 7]
Bisphenol A type cyanate ester compound (CA210, manufactured by Mitsubishi Gas Chemicals, Inc., cyanate equivalent: 139 g / eq.) 40.5 parts by mass, maleimide compound (BMI-70, maleimide group equivalent 221 g / eq, Keiai Kasei) 29.8 parts by mass, biphenyl aralkyl type epoxy compound (NC-3000H, manufactured by Nippon Kayaku Co., Ltd., functional group equivalent: 290 g / eq.) 15 parts by mass, bisphenolid compound (BMI-80, Made by Daiwa Kasei Kogyo Co., Ltd., Maleimide group equivalent: 285 g / eq.) 14.7 parts by mass, slurry silica (SC-5050MOB, average particle size 1.5 μm, manufactured by Admatex Co., Ltd.) by 100 parts by mass, wet Dispersant (DISPERBYK-161, manufactured by Big Chemie Japan Co., Ltd.) by 1 part by mass, leveling agent (manufactured by Big Chemie Japan Co., Ltd., "BYK-310") by 0.05 parts by mass, curing accelerator (2, A varnish was obtained by mixing 4.5 parts by mass of 4,5-triphenylimidazole and manufactured by Tokyo Kasei Kogyo Co., Ltd. This varnish was diluted with methyl ethyl ketone, impregnated and coated on a T glass woven cloth having a thickness of 0.1 mm, and heated and dried at 140 ° C. for 3 minutes to obtain a prepreg having a resin content of 44% by mass. The amount of cyanic acid ester group (α) (part by mass / equivalent of cyanate ester group) of the cyanic acid ester compound (A) is 0.291, and the amount of maleimide group (β) (part by mass) of the maleimide compound (B). / Maleimide group equivalent) was 0.186 and the ratio ([α / β]) was 1.56.
〔比較例4〕
ビスフェノールA型シアン酸エステル化合物(CA210、三菱ガス化学(株)製、シアネート当量:139g/eq.)の使用量を12質量部とし、マレイミド化合物(BMI−70、マレイミド基当量221g/eq、ケイ・アイ化成(株)製)の使用量を58.3質量部としたこと以外は、実施例7と同様の方法により、プリプレグを得た。なお、シアン酸エステル化合物(A)のシアン酸エステル基量(α)(質量部/シアン酸エステル基当量)は0.086であり、マレイミド化合物(B)のマレイミド基量(β)(質量部/マレイミド基当量)は0.315であり、比(〔α/β〕)は0.27であった。
[Comparative Example 4]
The amount of the bisphenol A type cyanate ester compound (CA210, manufactured by Mitsubishi Gas Chemical Company, Inc., cyanate equivalent: 139 g / eq.) Was 12 parts by mass, and the maleimide compound (BMI-70, maleimide group equivalent 221 g / eq, Kay). A prepreg was obtained by the same method as in Example 7 except that the amount of (manufactured by Ai Kasei Co., Ltd.) used was 58.3 parts by mass. The amount of cyanic acid ester group (α) (part by mass / equivalent of cyanate ester group) of the cyanic acid ester compound (A) is 0.086, and the amount of maleimide group (β) (part by mass) of the maleimide compound (B). / Maleimide group equivalent) was 0.315 and the ratio ([α / β]) was 0.27.
〔金属箔張積層板の作製〕
得られたプリプレグを、それぞれ4枚または8枚重ねて12μm厚の電解銅箔(3EC−VLP、三井金属鉱業(株)製)を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.4mm及び0.8mmの金属箔張積層板を得た。得られた金属箔張積層板を用いて、下記ガラス転移温度(Tg)線熱膨張係数、銅箔ピール強度の測定を実施した。
[Manufacturing of metal foil-clad laminate]
The resulting prepreg, electrolytic copper foil of 12μm thick four or eight overlapping each disposed (3EC-VLP, Mitsui Mining & Smelting Co., Ltd.) in a vertical, pressure 30 kgf / cm 2, at a temperature 220 ° C. 120 Lamination molding was carried out for 1 minute to obtain metal foil-clad laminates having an insulating layer thickness of 0.4 mm and 0.8 mm. Using the obtained metal foil-clad laminate, the following glass transition temperature (Tg) linear thermal expansion coefficient and copper foil peel strength were measured.
〔銅箔ピール強度〕
得られた金属箔張積層板(絶縁層厚さ0.8mm)を用い、JIS C6481に準じて、銅箔ピール強度(kg/cm)を測定した。
[Copper foil peel strength]
Using the obtained metal foil-clad laminate (insulation layer thickness 0.8 mm), the copper foil peel strength (kg / cm) was measured according to JIS C6481.
〔めっきピール強度〕
得られた金属箔張積層板(絶縁層厚さ0.4mm)の表層銅箔をエッチングにより除去し、上村工業製の無電解銅めっきプロセス(使用薬液名:MCD−PL、MDP−2、MAT−SP、MAB−4−C、MEL−3−APEA ver.2)にて、約0.5μmの無電解銅めっきを施し、130℃で1時間の乾燥を行った。続いて、電解銅めっきをめっき銅の厚みが18μmになるように施し、180℃で1時間の乾燥を行った。こうして、厚さ0.4mmの絶縁層上に厚さ18μmの導体層(めっき銅)が形成されたプリント配線板サンプルを作製した。上記手順により作製された絶縁層厚さ0.4mmのプリント配線板サンプルを用い、めっき銅の接着力をJIS C6481に準じて3回測定し、その平均値(kg/cm)を求めた。
[Plating peel strength]
The surface copper foil of the obtained metal foil-clad laminate (insulation layer thickness 0.4 mm) is removed by etching, and an electroless copper plating process manufactured by Uemura Kogyo (chemical solution names: MCD-PL, MDP-2, MAT). -SP, MAB-4-C, MEL-3-APEA ver. 2) was used for electroless copper plating of about 0.5 μm, and dried at 130 ° C. for 1 hour. Subsequently, electrolytic copper plating was applied so that the thickness of the plated copper was 18 μm, and the product was dried at 180 ° C. for 1 hour. In this way, a printed wiring board sample in which a conductor layer (plated copper) having a thickness of 18 μm was formed on an insulating layer having a thickness of 0.4 mm was produced. Using a printed wiring board sample having an insulating layer thickness of 0.4 mm produced by the above procedure, the adhesive strength of plated copper was measured three times according to JIS C6481, and the average value (kg / cm) was obtained.
〔ガラス転移温度(Tg)〕
得られた金属箔張積層板(絶縁層厚さ0.8mm)をダイシングソーでサイズ12.7×2.5mmに切断後、表面の銅箔をエッチングにより除去し、測定用サンプルを得た。この測定用サンプルを用い、JIS C6481に準拠して動的粘弾性分析装置(TAインスツルメント製)でDMA法によりガラス転移温度を測定した(n=3の平均値)。
[Glass transition temperature (Tg)]
The obtained metal foil-clad laminate (insulation layer thickness 0.8 mm) was cut to a size of 12.7 × 2.5 mm with a dicing saw, and the copper foil on the surface was removed by etching to obtain a sample for measurement. Using this measurement sample, the glass transition temperature was measured by the DMA method with a dynamic viscoelastic analyzer (manufactured by TA Instruments) in accordance with JIS C6481 (average value of n = 3).
〔弾性率維持率〕
得られた金属箔張積層板(絶縁層厚さ0.8mm)から銅箔を除去したものを試料として用い、JIS C 6481に規定される方法に準じて、オートグラフ((株)島津製作所製AG−Xplus)にて、それぞれ27℃、260℃で曲げ弾性率を測定した。上記によって測定された27℃の曲げ弾性率(a)と260℃の熱時曲げ弾性率(b)とから、下記式によって弾性率維持率を算出した。
弾性率維持率=(b)/(a)×100
[Elastic modulus maintenance rate]
Using the obtained metal foil-clad laminate (insulation layer thickness 0.8 mm) from which the copper foil was removed as a sample, according to the method specified in JIS C 6481, Autograph Co., Ltd., manufactured by Shimadzu Corporation. The flexural modulus was measured at 27 ° C. and 260 ° C., respectively, with AG-Xplus). From the bending elastic modulus (a) at 27 ° C. and the thermal flexural modulus (b) at 260 ° C. measured as described above, the elastic modulus maintenance rate was calculated by the following formula.
Elastic modulus maintenance rate = (b) / (a) × 100
〔可撓性〕
得られたプリプレグを、所定直径の棒に巻きつけて180°に折り曲げ、プリプレグの折り曲げ部を観察し、プリプレグに破損が発生したばあいを破損あり、破損が発生しない場合を破損なしとすることで評価を行った。
A:3mmφでプリプレグに破損なし。
B:5mmφでプリプレグに破損なし。
C:10mmφでプリプレグに破損なし。
D:10mmφでプリプレグに破損あり。
[Flexibility]
Wrap the obtained prepreg around a rod of a predetermined diameter and bend it to 180 °. Observe the bent part of the prepreg. It was evaluated at.
A: 3mmφ with no damage to the prepreg.
B: No damage to the prepreg at 5 mmφ.
C: 10 mmφ with no damage to the prepreg.
D: There is damage to the prepreg at 10 mmφ.
本出願は、2016年5月2日に日本国特許庁へ出願された日本特許出願(特願2016−92758)に基づくものであり、その内容はここに参照として取り込まれる。 This application is based on a Japanese patent application (Japanese Patent Application No. 2016-92758) filed with the Japan Patent Office on May 2, 2016, the contents of which are incorporated herein by reference.
本発明の樹脂組成物は、プリプレグ、樹脂シート、積層樹脂シート、金属箔張積層板、及びプリント配線板の材料として産業上の利用可能性を有する。 The resin composition of the present invention has industrial applicability as a material for prepregs, resin sheets, laminated resin sheets, metal foil-clad laminated boards, and printed wiring boards.
Claims (16)
該マレイミド化合物(B)のマレイミド基量(β)に対する前記シアン酸エステル化合物(A)のシアン酸エステル基量(α)の比(〔α/β〕)が、0.30以上である、
樹脂組成物。 It contains a cyanide ester compound (A) and a maleimide compound (B).
The ratio ([α / β]) of the cyanic acid ester group amount (α) of the cyanic acid ester compound (A) to the maleimide group amount (β) of the maleimide compound (B) is 0.30 or more.
Resin composition.
請求項1に記載の樹脂組成物。
(式(2)中、R3は、各々独立して、水素原子又は炭素数1〜4のアルキル基を表し、n2は1以上の整数である。) The cyanide ester compound (A) contains a compound represented by the following general formula (1) and / or the following general formula (2).
The resin composition according to claim 1.
(In the formula (2), R 3 independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and n 2 is an integer of 1 or more.)
請求項1又は2に記載の樹脂組成物。 The cyanate ester group equivalent of the cyanate ester compound (A) is 100 to 220 g / eq. Is,
The resin composition according to claim 1 or 2.
請求項1〜3のいずれかに記載の樹脂組成物。
The resin composition according to any one of claims 1 to 3.
請求項1〜4のいずれかに記載の樹脂組成物。
The resin composition according to any one of claims 1 to 4.
請求項1〜5のいずれかに記載の樹脂組成物。
The resin composition according to any one of claims 1 to 5.
請求項1〜6のいずれかに記載の樹脂組成物。 The ratio ([α / β]) is 0.45 to 1.0.
The resin composition according to any one of claims 1 to 6.
請求項1〜7のいずれかに記載の樹脂組成物。 Further containing the inorganic filler (C),
The resin composition according to any one of claims 1 to 7.
請求項8に記載の樹脂組成物。 The content of the inorganic filler (C) is 25 to 700 parts by mass with respect to 100 parts by mass of the resin solid content.
The resin composition according to claim 8.
請求項8又は9に記載の樹脂組成物。 The inorganic filler (C) comprises at least one selected from the group consisting of silica, boehmite, and alumina.
The resin composition according to claim 8 or 9.
該基材に含浸又は塗布された請求項1〜10のいずれか一項に記載の樹脂組成物と、を有する、
プリプレグ。 With the base material
The resin composition according to any one of claims 1 to 10 impregnated or coated on the substrate.
Pre-preg.
樹脂シート。 The resin composition according to any one of claims 1 to 10 is formed in the form of a sheet.
Resin sheet.
積層樹脂シート。 It has a sheet base material and the resin composition according to any one of claims 1 to 10 arranged on one side or both sides of the sheet base material.
Laminated resin sheet.
積層板。 It has at least one selected from the group consisting of the prepreg according to claim 11, the resin sheet according to claim 12, and the laminated resin sheet according to claim 13.
Laminated board.
前記プリプレグ、前記樹脂シート、及び前記積層樹脂シートの片面又は両面に配された金属箔と、を有する、
金属箔張積層板。 At least one selected from the group consisting of the prepreg according to claim 11, the resin sheet according to claim 12, and the laminated resin sheet according to claim 13.
It has the prepreg, the resin sheet, and a metal foil arranged on one side or both sides of the laminated resin sheet.
Metal foil-clad laminate.
前記絶縁層が、請求項1〜10のいずれか一項に記載の樹脂組成物を含む、
プリント配線板。 It has an insulating layer and a conductor layer formed on one side or both sides of the insulating layer.
The insulating layer contains the resin composition according to any one of claims 1 to 10.
Printed wiring board.
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JP7154475B2 (en) * | 2017-03-29 | 2022-10-18 | 三菱瓦斯化学株式会社 | Resin composition for printed wiring board, prepreg, metal foil clad laminate, resin sheet and printed wiring board |
JP6994174B2 (en) * | 2017-11-14 | 2022-01-14 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
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US20210267052A1 (en) | 2018-07-18 | 2021-08-26 | Showa Denko Materials Co., Ltd. | Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate |
JP7243077B2 (en) * | 2018-08-10 | 2023-03-22 | 株式会社レゾナック | Prepregs, cured prepregs, laminates, printed wiring boards and semiconductor packages |
JP6746106B2 (en) * | 2018-08-30 | 2020-08-26 | 三菱瓦斯化学株式会社 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device |
JP7148859B2 (en) * | 2018-08-31 | 2022-10-06 | 三菱瓦斯化学株式会社 | Mixture of cyanate ester compound and curable composition |
KR102479615B1 (en) * | 2019-12-11 | 2022-12-20 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device |
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JP2014084452A (en) * | 2012-10-26 | 2014-05-12 | Hitachi Chemical Co Ltd | Thermosetting resin composition, prepreg, laminate and printed wiring board |
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CN113845772A (en) | 2021-12-28 |
KR102418675B1 (en) | 2022-07-07 |
CN108137800A (en) | 2018-06-08 |
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JP6924388B2 (en) | 2021-08-25 |
TWI731072B (en) | 2021-06-21 |
JPWO2017191771A1 (en) | 2019-03-07 |
WO2017191771A1 (en) | 2017-11-09 |
JP7121354B2 (en) | 2022-08-18 |
KR20210111320A (en) | 2021-09-10 |
KR20190004698A (en) | 2019-01-14 |
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CN108137800B (en) | 2021-09-07 |
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