JP2021178449A - Exposure device, image formation device and method for manufacturing exposure device, and light-receiving device, reading device and method for manufacturing light-receiving device - Google Patents

Abstract

To maintain strength.SOLUTION: An LED head 16 includes a holder 51 for holding a substrate 55 and a rod lens array 53, and an irradiation direction side adhesive 58 and a counter irradiation direction side adhesive 60 cured so as to partially cover an end part in a shorter direction of the substrate 55. The holder 51 has: a holder bottom surface 51BS opposite to an LED array arrangement surface 55B in which an LED array 56 is arranged; a holder inner wall surface 51WS extending in a direction different from the holder bottom surface 51BS; a mounting part 51C that is provided on the holder inner wall surface 51WS and on which the irradiation direction side adhesive 58 is mounted; a through hole 51T2 for ultraviolet light irradiation formed in the holder bottom surface 51BS corresponding to the mounting part 51C concerning a position in a longer direction; and a silicon resin 64 shielding the through hole 51T2 for ultraviolet light irradiation.SELECTED DRAWING: Figure 5

Description

The present invention relates to an exposure apparatus, an image forming apparatus and an exposure apparatus manufacturing method, and a light receiving device, a reading device and a light receiving apparatus manufacturing method, and is suitable for application to, for example, an exposure apparatus mounted on an electrophotographic image forming apparatus. ..

Conventionally, as an image forming apparatus, an exposure device that emits light for exposure irradiates the surface of the photoconductor drum with light to form an electrostatic latent image on the surface of the photoconductor drum, and further, the electrostatic latent image is formed. An image is widely used for printing an image by adhering toner to the image and developing a toner image. As this exposure apparatus, for example, there is an LED head that uses light emitted from an LED (Light Emitting Diode) that is a light emitting element.

The LED head includes, for example, a substrate on which an LED array in which a plurality of LEDs are arranged linearly is mounted, a convergent lens in which a plurality of lenses for condensing light emitted from each LED are arranged, and a substrate and a substrate. Some have a holder that holds the convergent lens. Then, the light radiated from the LED array mounted on the substrate passes through the convergent lens and is converged, and is exposed to the surface of the photoconductor drum arranged at the imaging position of the convergent lens to obtain an electrostatic latent image. Is formed.

Some such LED heads are assembled by pressing the substrate against an adhesive applied to the contact surface formed on the holder and fixing the substrate. In the side plate of the holder, which is a sheet metal, the LED head is cut so that three sides of each of the plurality of squares penetrate the side plate, and the remaining one side is bent toward the inside of the holder to form a plate. In some cases, a portion was formed, and the upper surface of the bent portion was used as a contact surface. In that case, a plurality of quadrangular openings are formed in the side plate of the holder (see, for example, Patent Document 1).

JP-A-2017-119374

However, such an LED head needs to be provided with an opening in order to provide a bent portion in a holder which is a thick sheet metal. As described above, in the conventional LED head, since the side plate of the holder has a plurality of openings for bending the sheet metal to form a bent portion, the strength of the holder is lowered and the rigidity of the LED head is lowered. There was a possibility that it would end up.

The present invention has been made in consideration of the above points, and an object of the present invention is to propose an exposure device, an image forming device, a method for manufacturing an exposure device, and a light receiving device, a reading device, and a method for manufacturing a light receiving device, which can maintain the intensity.

In order to solve such a problem, in the exposure apparatus of the present invention, a substrate in which a plurality of light emitting elements are arranged in the longitudinal direction and a focusing lens extending in the longitudinal direction and converging light emitted from the plurality of light emitting elements. A holding member for holding the substrate and the focusing lens, and a cured body cured so as to partially cover the lateral end of the substrate are provided, and the holding member is a substrate surface on which a plurality of light emitting elements are arranged. The first surface facing each other, the second surface extending in a direction different from the first surface, the mounting portion provided on the second surface on which the cured product is placed, and the position in the longitudinal direction are mounted. It has an opening formed on the first surface so as to correspond to the placement portion, and a shielding portion that shields the opening.

Further, in the image forming apparatus of the present invention, the above-mentioned exposure apparatus is provided.

Further, in the exposure apparatus manufacturing method of the present invention, a substrate on which a plurality of light emitting elements are arranged in the longitudinal direction and a convergent lens extending in the longitudinal direction and converging light emitted from the plurality of light emitting elements are held. In the holding member, the cured body on the irradiation direction side is mounted on a mounting portion provided on a second surface extending in a direction different from the first surface facing the substrate surface on which a plurality of light emitting elements are arranged. A step for mounting the cured body on the irradiation direction side, a step for pressing the substrate to press the substrate toward the cured body on the irradiation direction side, and a first surface formed on the first surface so as to correspond to the mounting portion with respect to the position in the longitudinal direction of the holding member. It has an irradiation direction side curing body curing step of irradiating ultraviolet light from the opening to partially cover the lateral end of the substrate and a shielding step of shielding the opening. I made it.

Further, in the light receiving device of the present invention, a substrate in which a plurality of light receiving elements are arranged in the longitudinal direction, a convergent lens extending in the longitudinal direction and converging light radiated to the plurality of light receiving elements, a substrate and a convergent lens. A holding member for holding the lens and a cured body cured so as to partially cover the lateral end portion of the substrate are provided, and the holding member is a first unit facing the substrate surface on which a plurality of light receiving elements are arranged. A surface, a second surface extending in a direction different from the first surface, a mounting portion provided on the second surface on which the cured product is placed, and a mounting portion corresponding to a position in the longitudinal direction. It has an opening formed on the first surface and a shielding portion that shields the opening.

Further, in the reading device of the present invention, the above-mentioned light receiving device is provided.

Further, in the method for manufacturing a light receiving device of the present invention, a substrate on which a plurality of light receiving elements are arranged in the longitudinal direction and a convergent lens extending in the longitudinal direction and converging the light radiated to the plurality of light receiving elements are held. In the holding member, the cured body on the irradiation direction side is mounted on a mounting portion provided on a second surface extending in a direction different from the first surface facing the substrate surface on which a plurality of light receiving elements are arranged. A step for mounting the cured body on the irradiation direction side, a step for pressing the substrate to press the substrate toward the cured body on the irradiation direction side, and a first surface formed on the first surface so as to correspond to the mounting portion with respect to the position in the longitudinal direction of the holding member. It has an irradiation direction side curing body curing step of irradiating ultraviolet light from the opening to partially cover the lateral end of the substrate and a shielding step of shielding the opening. I made it.

According to the present invention, the cured body placed on the mounting portion is irradiated with light from the outside of the holding member through the opening to cure the cured body, so that the cured body can hold the substrate on the holding member.

According to the present invention, it is possible to realize an exposure device, an image forming device, a method for manufacturing an exposure device, and a light receiving device, a reading device, and a method for manufacturing a light receiving device, which can maintain the intensity.

It is a left side view which shows the structure of a color printer. It is a left side view which shows the structure of an image formation unit. The configuration (1) of the LED head is shown, (A) is a perspective view seen from the lower front side, and (B) is a perspective view seen from the upper front side. The configuration of the substrate is shown, (A) is a perspective view seen from the lower front side, and (B) is a perspective view seen from the upper front side. The configuration (2) of the LED head is shown, and it is the XX arrow cross-sectional view in FIG. 3 (B). It is a flowchart which shows the LED head manufacturing processing procedure. The manufacturing process (1) of the LED head is shown, and it is the XX arrow cross-sectional view in FIG. 3 (B). The manufacturing process (2) of the LED head is shown, and it is the XX arrow cross-sectional view in FIG. 3 (B). The manufacturing process (3) of the LED head is shown, and it is the XX arrow cross-sectional view in FIG. 3 (B). The manufacturing process (4) of the LED head is shown, and it is the XX arrow cross-sectional view in FIG. 3 (B). The manufacturing process (5) of the LED head is shown, and it is the XX arrow cross-sectional view in FIG. 3 (B). It is a side view which shows the structure of the scanner by 2nd Embodiment.

Hereinafter, embodiments for carrying out the invention (hereinafter referred to as embodiments) will be described with reference to the drawings.

[1. First Embodiment]
[1-1. Color printer configuration]
As shown in the left side view in FIG. 1, the color printer 1 is a color electrophotographic printer, and prints a desired color image on a paper P having a size such as A3 size or A4 size. In the color printer 1 as an image forming apparatus, various parts are arranged inside a printer housing 2 formed in a substantially box shape. Incidentally, in the following description, the right end portion in FIG. 1 is the front surface of the color printer 1, and the vertical direction, the horizontal direction, and the front-rear direction when viewed facing the front surface are defined and described. The color printer 1 is controlled as a whole by the control unit 3. The control unit 3 is wirelessly or wiredly connected to a host device (not shown) such as a personal computer via a communication processing unit (not shown). The control unit 3 executes a printing process for forming a printed image on the surface of the paper P when an image data representing a color image to be printed is given from a higher-level device and a printing of the color image is instructed.

At the bottom of the printer housing 2, the paper storage cassette 4 for storing the paper P and the paper P stored in the paper storage cassette 4 are separated and fed one by one. A section 5 is provided. The paper feed unit 5 is located above the front end of the paper storage cassette 4, and is provided above the front end of the paper storage cassette 4 and above the hopping roller 7 with the central axis oriented in the left-right direction and above the hopping roller 7. In addition to a plurality of rollers such as the resist roller 8 provided, it is composed of a guide or the like for guiding the paper P.

The paper feeding unit 5 rotates the hopping roller 7, the resist roller 8, and the like under the control of the control unit 3, separates and takes in the paper P stored in the paper storage cassette 4 one by one, and also takes in the taken-in paper. After the P is advanced forward and upward, it is advanced so as to be folded back at a position substantially centered on the upper and lower sides in the vicinity of the front end in the printer housing 2.

Above the paper storage cassette 4 in the printer housing 2, a transfer belt unit 10 is provided so as to largely cross the inside of the printer housing 2 in the front-rear direction. In the transfer belt unit 10, one elongated cylindrical roller 11 whose central axis is oriented in the left-right direction is arranged in the front-rear direction, and the transfer belt 12 is stretched so as to orbit the front-rear roller 11. .. The transfer belt 12 has a wide width in the left-right direction and is formed as an endless belt, and travels with the rotation of the roller 11. The transfer belt unit 10 runs the transfer belt 12 by rotating the roller 11 under the control of the control unit 3, and puts the paper P delivered from the paper feed unit 5 on the upper surface of the transfer belt 12 afterwards. Transport in the direction.

On the other hand, on the upper side of the transfer belt unit 10, that is, above the center of the printer housing 2, the four image forming units 15C, 15M, 15Y and 15K shown in FIG. 2 (hereinafter, these are collectively image forming units). 15) are arranged in order from the rear side to the front side. That is, the image forming units 15 of each color are arranged in a so-called tandem system. The image forming units 15C, 15M, 15Y and 15K correspond to each color of cyan (C), magenta (M), yellow (Y) and black (K), respectively. Further, the image forming units 15C, 15M, 15Y and 15K are configured in the same manner as each other, and only the colors of the corresponding toners are different from each other. The image forming unit 15 is formed in a substantially box shape that is relatively long in the left-right direction in order to correspond to the left-right width of the paper P.

Further, in the printer housing 2, LED heads 16C, 16M, 16Y and 16K (hereinafter collectively referred to as LED heads 16) are provided so as to correspond to the image forming units 15C, 15M, 15Y and 15K, respectively. It is provided. The LED head 16 is formed in a rectangular parallelepiped shape elongated in the left-right direction, and a plurality of LEDs are arranged so as to be arranged along the left-right direction inside the LED head 16 according to the image data supplied from the control unit 3. Each LED is made to emit light by a light emission pattern. When the image forming unit 15 is mounted on the printer housing 2, it is extremely close to the LED head 16, and the exposure process is performed by the light from the LED head 16.

Further, the toner cartridges 18C, 18M, 18Y and 18K (hereinafter, collectively referred to as a toner cartridge 18) are connected to the upper portions of the image forming units 15C, 15M, 15Y and 15K, respectively. The toner cartridge 18 is a hollow container that is long in the left-right direction, contains powdery toner of each color, and incorporates a predetermined stirring mechanism. Incidentally, the transfer belt unit 10 has transfer rollers 13C, 13M, 13Y and 13K (hereinafter, collectively referred to as transfer rollers 13) at four locations directly below each image forming unit 15 between the front and rear rollers 11. ) Is provided. That is, each image forming unit 15 sandwiches the upper portion of the transfer belt 12 with each transfer roller 13. Incidentally, the transfer roller 13 is configured to be charged.

The control unit 3 supplies toner from the toner cartridge 18 to the image forming unit 15. At the same time, the control unit 3 causes the LED head 16 to emit light so as to form a light emission pattern corresponding to the image data supplied from the host device (not shown). In response to this, each image forming unit 15 uses the toner supplied from the toner cartridge 18 to form a toner image corresponding to the light emission pattern of the LED head 16, and transfers the toner image to the paper P (for details, in detail). Will be described later). As a result, the four-color toner images corresponding to the image data are sequentially transferred onto the paper P conveyed by the transfer belt unit 10.

A fixing unit 20 is provided behind the transfer belt unit 10, that is, near the upper and lower centers near the rear end of the printer housing 2. The fixing unit 20 is composed of a heating roller 21 and a pressure roller 22. The heating roller 21 is formed in a cylindrical shape with the central axis oriented in the left-right direction, and is provided with a heater inside. The pressure roller 22 is formed in the same cylindrical shape as the heating roller 21, and the upper surface is pressed against the lower surface of the heating roller 21 with a predetermined pressing force. The fixing unit 20 heats the heating roller 21 and rotates the heating roller 21 and the pressure roller 22 in predetermined directions under the control of the control unit 3. As a result, the fixing unit 20 applies heat and pressure to the paper P delivered from the transfer belt unit 10, that is, the paper P on which the four-color toner images are superimposed to fix the toner, and further receives the toner upward. hand over.

A paper ejection unit 24 is arranged above the rear of the fixing unit 20. The paper ejection unit 24 is composed of a combination of a plurality of rollers (not shown) with the central axis oriented in the left-right direction, a guide for guiding the paper, and the like. The paper ejection unit 24 appropriately rotates each roller according to the control of the control unit 3 to convey the paper P delivered from the fixing unit 20 backward and upward and then fold it forward to obtain the printer housing 2. Discharge to the discharge tray 2T formed on the upper surface.

As described above, when the color printer 1 executes the printing process, the LED head 16 emits light to form a toner image by the image forming unit 15 of each color, and the toner image is sequentially transferred to the paper P.

[1-2. Image formation unit configuration]
Next, the configuration of the image forming unit 15 will be described. As shown in FIG. 2, the image forming unit 15 closes most of the outer periphery thereof by the frame 31, and forms a relatively large space inside the image forming unit 15.

A photoconductor drum 35 is provided near the center of the image forming unit 15. The photoconductor drum 35 is formed in a cylindrical shape with the central axis oriented in the left-right direction, and is rotatably supported by the frame 31 about the central axis. Incidentally, the photoconductor drum 35 rotates in the direction of arrow R1 by transmitting a driving force from a motor (not shown).

The lower surface portion of the photoconductor drum 35 in the frame 31 is open over a relatively wide range. Therefore, when the image forming unit 15 is attached to the printer housing 2 (FIG. 1), the lower surface of the photoconductor drum 35 is brought into contact with the transfer belt 12 or the paper P placed on the transfer belt 12. Further, an elongated exposure hole in the left-right direction is formed in a portion of the frame 31 directly above the photoconductor drum 35.

A cylindrical charging roller 36 having a diameter smaller than that of the photoconductor drum 35 is provided above the rear of the photoconductor drum 35. The charging roller 36 is made of, for example, a semi-conductive elastic material, and its peripheral side surface is brought into contact with the peripheral side surface 35S of the photoconductor drum 35, so that the contact portion of the peripheral side surface 35S is uniformly charged. Let me.

Above the front of the photoconductor drum 35, a developing roller 38 having a cylindrical shape having a diameter smaller than that of the photoconductor drum 35 is provided. The developing roller 38 is made of a semi-conductive urethane rubber in which a conductive substance such as carbon is added to a urethane rubber material and whose electric resistance is appropriately adjusted, and can be charged. The peripheral side surface of the developing roller 38 is brought into contact with the peripheral side surface 35S of the photoconductor drum 35 on the rear side, and the peripheral side thereof is peripheral to a supply roller 39 having a cylindrical shape slightly smaller in diameter than the developing roller 38 on the front side. The sides are in contact. The supply roller 39 is made of, for example, a semi-conductive foamed silicone sponge.

A thin plate-shaped developing blade 40 is provided above the rear of the developing roller 38. The developing blade 40 is made of a metal such as stainless steel or phosphor bronze, or a rubber material such as silicon rubber. The rear upper end of the developing blade 40 is fixed in the frame 31, and a slight gap is formed between the front lower end thereof and the peripheral side surface of the developing roller 38.

Further, spacers 45 are provided on both the left and right sides above the photoconductor drum 35. The size of the spacer 45, the mounting position with respect to the frame 31, and the like are optimized, and by abutting the lower surface of the LED head 16 on the upper surface thereof, the peripheral side surface 35S of the photoconductor drum 35 and the LED head 16 are brought into contact with each other. Adjust the spacing to the desired length.

In such a configuration, when printing an image on the paper P, the image forming unit 15 rotates the photoconductor drum 35 in the direction of arrow R1 under the control of the control unit 3, and also causes the charging roller 36, the developing roller 38, and the supply roller 39. Is rotated in the direction of arrow R2 to further charge the charging roller 36 and the developing roller 38.

In the photoconductor drum 35, first, the rear upper portion of the peripheral side surface 35S is uniformly charged by the charging roller 36, and the charged portion is brought to the vicinity of the upper end by rotation in the direction of the arrow R1 to face the LED head 16. At this time, the peripheral side surface 35S of the photoconductor drum 35 is exposed by irradiating the LED head 16 with light having a light emission pattern corresponding to the image data, and an electrostatic latent image corresponding to the image data is formed.

On the other hand, in the developing roller 38 that rotates in the direction of arrow R2, the toner supplied from the toner cartridge 18 adheres to the peripheral side surface by the supply roller 39, and then the excess toner is scraped off by the developing blade 40, so that the peripheral side surface is covered. Toner adheres to a uniform thin film.

By further rotating the photoconductor drum 35 in the direction of arrow R1, the toner formed in a thin film on the peripheral side surface of the developing roller 38 in the vicinity of the front end in contact with the developing roller 38 is subjected to an electrostatic latent image. Only the spots are attached to the peripheral side surface 35S. As a result, a toner image corresponding to the image data is formed on the peripheral side surface 35S of the photoconductor drum 35. Incidentally, the toner image formed on the peripheral side surface 35S at this time is only a component of one color (that is, either cyan, magenta, yellow or black) in charge of the image forming unit 15 among the images to be finally printed. It is an image showing.

After that, the photoconductor drum 35 further rotates in the direction of the arrow R1 to bring the toner image to the vicinity of the lower end. At this time, the control unit 3 causes the paper P to reach the lower side of the image forming unit 15 by the transfer belt unit 10 (FIG. 1), and charges the transfer roller 13 with the characteristics opposite to those of the toner. Therefore, the image forming unit 15 sandwiches the paper P between the portion of the photoconductor drum 35 on which the toner image is formed and the charged transfer roller 13, and transfers the toner image to the paper P. .. Incidentally, when the toner remains on the peripheral side surface 35S of the photoconductor drum 35 after the toner image is transferred to the paper P, the toner is removed by a cleaning device (not shown).

Thus, the image forming unit 15 faces the LED head 16 in the vicinity of the photoconductor drum 35, and forms a toner image on the peripheral side surface 35S by the exposure action of the LED head 16.

[1-3. LED head configuration]
Next, the configuration of the LED head 16 will be described. As shown in FIGS. 3 and 5, the LED head 16 is formed as a rectangular parallelepiped elongated in the left-right direction as a whole, and various parts are attached to the holder 51.

[1-3-1. Holder configuration]
As shown in FIG. 5, the holder 51 is manufactured so as to have a predetermined wall thickness by, for example, sheet metal stamping, and has a holder internal space 51IS which is an internal space formed along the left-right direction as a whole. The shape is such that the side surface on the counter-illumination direction side is removed from the hollow square pillar, and its cross section is shaped like the English capital "U". Further, the holder 51 is formed around a plate-shaped bottom portion 51B that is elongated in the left-right direction and thin in the up-down direction. Further, the holder 51 is extended upward from both front and rear sides of the bottom portion 51B so as to be orthogonal to the bottom portion 51B, so that elongated plate-shaped side portions 51W elongated in the left-right direction and thin in the front-rear direction are parallel to each other. A holder opening 51A that opens at the upper end is formed.

A rod lens array hole portion 51H as a slit-shaped convergent lens hole portion elongated in the left-right direction is bored in the bottom portion 51B substantially in the center in the front-rear direction so as to penetrate in the vertical direction. Further, on the counter-irradiation direction side, which is the upper surface of the bottom portion 51B, a holder bottom surface 51BS, which is a flat surface extending along the front-rear direction and the left-right direction, is formed.

The surface of the holder internal space 51IS side in the pair of front and rear side portions 51W, that is, the rear surface of the front side portion 51W and the front surface of the rear side portion 51W are planes extending in the vertical and horizontal directions. The inner wall surface 51WS of the holder is formed. Further, the side portion 51W is directed from the holder inner wall surface 51WS toward the holder internal space 51IS, that is, from the holder inner wall surface 51WS of the front side portion 51W to the rear side, and from the holder inner wall surface 51WS of the rear side portion 51W to the front side. The mounting portion 51C protrudes toward the direction. The mounting portion 51C has a substantially rectangular parallelepiped shape as a whole, and its lower end surface is formed in the vicinity of the lower end portion of the side portion 51W so as to leave a slight gap between the mounting portion 51C and the holder bottom surface 51BS. Further, the mounting portion 51C on the front side portion 51W and the mounting portion 51C on the rear side portion 51W are arranged so that their positions in the left-right direction coincide with each other.

Further, the mounting portion 51C is provided on each of the front and rear side portions 51W at a predetermined interval from the right end portion to the left end portion of the holder inner wall surface 51WS in the front-rear and left-right directions. Has a predetermined length. The mounting portion 51C is formed by extruding the side portion 51W from the outer surface side in the front-rear direction of the side portion 51W toward the holder internal space 51IS side in the manufacturing process of the holder 51 by the mold. Will be done. Specifically, the length of the mounting portion 51C in the longitudinal direction (left-right direction) is, for example, 10 [mm] or less, and the length in the lateral direction (front-back direction) is the front-rear direction of the side portion 51W. It is more than the thickness and less than twice the thickness of the side portion 51W in the front-rear direction.

On the anti-irradiation direction side, which is the upper surface of the mounting portion 51C, a mounting portion contact surface 51CS1 which is a flat surface extending along the front-rear direction and the left-right direction and serves as a base on which the irradiation direction side adhesive 58 is applied is formed. Has been done. The irradiation direction side adhesive 58 is applied to the mounting portion contact surface 51CS1. Further, on the holder internal space 51IS side of the mounting portion 51C, an inner side surface 51CS2 of the mounting portion, which is a plane extending in the vertical direction and the horizontal direction, is formed. The irradiation direction side adhesive 58 is an ultraviolet curable adhesive that is cured by being irradiated with UV (Ultraviolet) light (ultraviolet light). Further, the irradiation direction side adhesive 58 as the irradiation direction side curing body is a weakly adhesive ultraviolet curable adhesive having almost no adhesive force. The irradiation direction side adhesive 58 is coated with a size and amount that can secure the strength with the mounting portion 51C and can function as a contact surface. Specifically, the length of the irradiation direction side adhesive 58 in the left-right direction is equal to or less than the mounting portion contact surface 51CS1, and the length in the front-rear direction is the length of the bottom surface of the irradiation direction side adhesive 58 at the time of application. More than 1/2 of the distance in the front-rear direction is formed on the mounting portion contact surface 51CS1.

On the side portion 51W, the side portion 51W is located above the mounting portion 51C and above the electronic component arranging surface 55A, which is the upper surface of the substrate 55, so as to align with the mounting portion 51C in the left-right direction. Cylindrical anchor through holes 51T1 drilled so as to penetrate the front side and the rear side are provided at regular intervals along the left-right direction. The anchor through hole 51T1 is filled with the anti-irradiation direction side adhesive 60. The anti-irradiation direction side adhesive 60 as the anti-irradiation direction side curing body is an ultraviolet curable adhesive having the same members as the irradiation direction side adhesive 58.

A cylindrical ultraviolet light irradiation through hole is formed in the bottom portion 51B so as to align with the mounting portion 51C in the left-right direction and penetrate the upper side and the lower side of the bottom portion 51B, and the silicon resin 64 is injected. 51T2 are provided at regular intervals along the left-right direction. Further, the ultraviolet light irradiation through hole 51T2 is formed between the rod lens array hole portion 51H and the holder inner wall surface 51WS in the front-rear direction which is a direction orthogonal to the left-right direction. After the ultraviolet light irradiation through hole 51T2 is irradiated from the irradiation direction side of the bottom portion 51B toward the irradiation direction side adhesive 58 through the ultraviolet light irradiation through hole 51T2 in the manufacturing process of the LED head 16. , Silicon resin 64 is filled. As a result, the LED head 16 seals the ultraviolet light irradiation through hole 51T2 that irradiates the ultraviolet light to the irradiation direction side adhesive 58, and is surrounded by the bottom portion 51B of the holder 51, the front and rear side portions 51W, and the lower surface of the substrate 55. The space is almost sealed to prevent light and foreign matter from entering this space. Further, as a result, the light emitted from the LED array 56 leaks to the outside of the holder 51 through the ultraviolet light irradiation through hole 51T2, and the LED head 16 irradiates a portion other than the portion to be exposed on the photoconductor drum 35. It is prevented from being done.

As described above, the LED head 16 has a set of mounting portions 51C on the front side portion 51W, an irradiation direction side adhesive 58, an anti-irradiation direction side adhesive 60, an anchor through hole 51T1, and an ultraviolet light irradiation through hole 51T2. And silicon resin 64, a set of mounting portions 51C on the rear side portion 51W, irradiation direction side adhesive 58, anti-irradiation direction side adhesive 60, anchor through hole 51T1, ultraviolet light irradiation through hole 51T2 and The silicon resin 64 and the silicon resin 64 are arranged so that their positions in the left-right direction coincide with each other.

Further, the rod lens array 53 is inserted and attached to the rod lens array hole portion 51H. As a result, the rod lens array 53 is supported by the holder 51. The rod lens array 53 is formed as a rectangular parallelepiped elongated in the left-right direction as a whole, and holds a large number of minute lenses arranged along the left-right direction. This lens has optical characteristics such as converging the light emitted from the LED array 56 described later. In the rod lens array 53, the incident distance between the upper surface, which is the end surface of the rod lens array 53 to which light is incident, and the lower surface, which is the surface of the LED array 56, becomes an optimum value in terms of the characteristics of the rod lens array 53. It is fixed to the holder 51 so as to be in a proper position.

The gap between the bottom portion 51B of the holder 51 and the rod lens array 53 is filled with a silicone resin 62 as an adhesive member so as to fill the gap. As a result, the LED head 16 seals the gap between the holder 51 and the rod lens array 53, and substantially seals the space surrounded by the bottom portion 51B of the holder 51, the front and rear side portions 51W, and the lower surface of the substrate 55. It prevents light and foreign matter from entering the space. The silicon resin 64 is the same member as the silicon resin 62.

Further, the holder 51 is brought into contact with the rod lens array 53 above the rod lens array 53 so as to be sandwiched between the irradiation direction side adhesive 58 and the anti-irradiation direction side adhesive 60 from the vertical direction so as to be sandwiched in the longitudinal direction in the left-right direction. Along with this, the substrate 55 shown in FIG. 4 is attached. The substrate 55 is a so-called glass epoxy substrate, and is formed in the shape of a thin plate elongated in the left-right direction and thin in the up-down direction, and has a configuration in which a plurality of wiring layers having a predetermined wiring pattern formed are laminated in the up-down direction.

[1-3-2. Board configuration]
On the LED array arrangement surface 55B, which is the lower surface of the substrate 55, the LED array 56 is mounted along the longitudinal direction of the substrate 55 so as to face the rod lens array 53 at substantially the center in the front-rear direction. In the LED array 56, light emitting points that emit light downward are arranged at predetermined minute intervals along the left-right direction. Various electronic components (not shown) for driving the LED head 16 are mounted on the upper surface of the substrate 55, that is, the electronic component arranging surface 55A which is the back surface of the LED array arranging surface 55B.

The length of the substrate 55 in the front-rear direction is shorter than the distance between the side portions 51W in the holder 51. Specifically, the substrate 55 has a length of 224.6 [mm] in the left-right direction (longitudinal direction) and a thickness of 1 [mm] in the vertical direction.

The irradiation direction side adhesive 58 is applied between the LED array arrangement surface 55B and the front and rear side surfaces of the substrate 55 and the mounting portion contact surface 51CS1 of the holder 51 and the holder inner wall surface 51WS. The substrate contact surface 58S is formed at a position where the irradiation direction side adhesive 58 abuts on the LED array arrangement surface 55B. As a result, the LED array arrangement surface 55B of the substrate 55 is fixed to the holder 51 via the substrate contact surface 58S of the irradiation direction side adhesive 58. The substrate contact surface 58S is a plane extending along the front-rear direction and the left-right direction, and has a high flatness with respect to the horizontal direction.

The anti-irradiation direction side adhesive 60 is applied between the electronic component arranging surface 55A of the substrate 55 and the holder inner wall surface 51WS of the holder 51. As a result, in the substrate 55, the electronic component arranging surface 55A is fixed to the holder 51.

Hereinafter, the portion of the anti-irradiation direction side adhesive 60 that comes into contact with the electronic component placement surface 55A and the holder inner wall surface 51WS and restricts the movement of the substrate 55 toward the anti-irradiation direction side is also referred to as a substrate contact portion 60A. Further, the portion of the anti-irradiation direction side adhesive 60 that protrudes from the substrate contact portion 60A toward the front-rear and outer sides of the side portion 51W and is filled in the anchor through hole 51T1 is also referred to as a hole filling portion 60B.

The hole filling portion 60B is configured so that the substrate contact portion 60A integrated with the hole filling portion 60B does not move in the vertical and horizontal directions by being filled in the anchor through hole 51T1 and cured. ing. As described above, the anti-irradiation direction side adhesive 60 is configured so that the hole filling portion 60B, which is a part thereof, is filled in the anchor through hole 51T1 and cured so as not to move in the vertical and horizontal directions.

Therefore, even if the anti-irradiation direction side adhesive 60 is peeled off from the electronic component arranging surface 55A and the holder inner wall surface 51WS by hooking the hole filling portion 60B on the anchor through hole 51T1, the LED head 16 is anti-irradiated. It is possible to prevent the irradiation direction side adhesive 60 from coming off from the anchor through hole 51T1.

Further, the LED head 16 can restrict the movement of the substrate 55 to the anti-irradiation direction side by bringing the substrate contact portion 60A of the anti-irradiation direction side adhesive 60 into contact with the electronic component arrangement surface 55A of the substrate 55, and the holes can be formed. The portion filling portion 60B can be made to function like an anchor.

Further, in the LED head 16, when the substrate 55 is replaced, if the hole filling portion 60B of the anti-irradiation direction side adhesive 60 is pushed from the outside of the side portion 51W in the front-rear direction toward the holder internal space 51IS, The hole filling portion 60B will be disengaged from the anchor through hole 51T1 toward the holder internal space 51IS side. Therefore, the LED head 16 can easily remove the adhesive 60 on the anti-irradiation direction side, and the substrate 55 can be easily attached to and detached from the holder 51 and replaced to improve maintainability.

Further, in the LED head 16, when the anti-illumination direction side adhesive 60 is cured, ultraviolet light is emitted from the holder internal space 51IS side to the substrate contact portion 60A of the anti-illumination direction side adhesive 60. Ultraviolet light can also be applied to the hole filling portion 60B of the anti-irradiation direction side adhesive 60 from the outside in the front-rear direction of the side portion 51W toward the holder internal space 51IS, and the position of the light source for irradiating the ultraviolet light can be determined. The possible range can be increased.

Further, in the LED head 16, when the anti-irradiation direction side adhesive 60 is cured, ultraviolet light is emitted from the holder internal space 51IS side to the substrate contact portion 60A of the anti-irradiation direction side adhesive 60. By irradiating the hole filling portion 60B of the anti-irradiation direction side adhesive 60 with ultraviolet light from the outside in the front-rear direction of the side portion 51W, the ultraviolet light is emitted only from the holder internal space 51IS side of the anti-irradiation direction side adhesive 60. The anti-irradiation direction side adhesive 60 can be cured in a short time as compared with the case of being irradiated with.

[1-4. Manufacture of LED heads]
Next, the manufacturing process of the LED head 16 will be described. The LED head 16 is manufactured according to the LED head manufacturing processing procedure RT1 shown in FIG. In this LED head manufacturing processing procedure RT1, the holder 51 is fixed to the holder 51 at an optimum vertical position with respect to the mounting portion contact surface 51CS1 with the rod lens array 53. Further, on the substrate 55, electronic components are mounted on the electronic component arranging surface 55A, and the LED array 56 is mounted on the LED array arranging surface 55B.

In the LED head manufacturing processing procedure RT1, in step SP1, as shown in FIGS. 7 and 8, the adhesive on the irradiation direction side is applied to the mounting portion contact surface 51CS1 of all the mounting portions 51C from the holder internal space 51IS side. 58 is applied. The amount of the adhesive 58 on the irradiation direction side is set so that the degree of adhesion to the mounting portion 51C can be ensured and the size can function as a contact surface.

Next, in the LED head manufacturing processing procedure RT1, in the subsequent step SP2, as shown in FIG. 9, the substrate 55 is pressed downward against the irradiation direction side adhesive 58 by a jig (not shown), and the irradiation direction side adhesive 58 is pressed. The shape is adjusted so that the shape is suitable for the substrate 55. Specifically, the substrate 55 is pressed downward from above the electronic component placement surface 55A by a jig (not shown) in a state where the LED array placement surface 55B is in contact with the irradiation direction side adhesive 58, and the vertical position is adjusted. .. At this time, the substrate 55 is held in a state of high flatness with respect to the horizontal direction by adsorbing the electronic component arrangement surface 55A with a jig having high flatness with respect to the horizontal direction, and the state is maintained. It is pressed against the irradiation direction side adhesive 58. At this time, the substrate 55 is adjusted to a position (upper and lower position) in the optical axis direction so that the light collected by the rod lens array 53 is imaged on the photoconductor drum 35 with a desired intensity.

Next, in the LED head manufacturing processing procedure RT1, after adjusting the position of the substrate 55 in the optical axis direction, in the subsequent step SP3, as shown in FIG. 9, the substrate 55 is held by the irradiation direction side adhesive 58 and the jig. Then, ultraviolet light is irradiated from below the bottom portion 51B through the ultraviolet light irradiation through hole 51T2, and the irradiation direction side adhesive 58 is cured at a desired position. By this step, the substrate contact surface 58S having a high flatness with respect to the horizontal direction is formed on the irradiation direction side adhesive 58.

Next, in the LED head manufacturing processing procedure RT1, in the subsequent step SP4, as shown in FIG. 10, the substrate 55 is pressed against the substrate contact surface 58S by a jig, and the substrate 55 is pressed at both front and rear ends of the electronic component arrangement surface 55A. , The side portion 51W from the holder internal space 51IS so as to close the gap between the substrate 55 and the holder 51 at a position opposite to the substrate contact surface 58S with the substrate 55 in the vertical direction (anti-irradiation direction side). The anti-irradiation direction side adhesive 60 is applied toward the outside. At this time, the anti-irradiation direction side adhesive 60 is applied so as to enter between the substrate 55 and the holder 51 and also enter the anchor through hole 51T1 to fill the anchor through hole 51T1.

Next, in the LED head manufacturing processing procedure RT1, in the subsequent step SP5, as shown in FIG. 10, the substrate 55 is pressed against the substrate contact surface 58S by the jig, and the substrate 55 faces downward from the holder opening 51A side. The ultraviolet light is irradiated to cure the anti-irradiation direction side adhesive 60. As a result, the LED head 16 sandwiches the substrate 55 from above and below by the substrate contact surface 58S of the irradiation direction side adhesive 58 formed in step SP3 and the anti-irradiation direction side adhesive 60 cured in step SP5. It will be in a state of holding. Here, since the anti-irradiation direction side adhesive 60 is cured in a state where the hole filling portion 60B is inserted into the anchor through hole 51T1, it is held so as to restrict the movement of the substrate 55 to the anti-irradiation direction side. It is fixed with.

Next, in the LED head manufacturing processing procedure RT1, in the following step SP6, as shown in FIG. 11, the lower surface of the bottom portion 51B opposite to the holder bottom surface 51BS so as to close the gap between the rod lens array 53 and the holder 51. The silicon resin 62 is applied to the outer surface portion, and the space between the rod lens array 53 and the holder 51 is sealed by the silicon resin 62.

Next, in the LED head manufacturing processing procedure RT1, in the subsequent step SP7, as shown in FIG. 11, the ultraviolet light irradiation through hole 51T2 is sealed with the silicon resin 64 so as to close the space between the ultraviolet light irradiation through holes 51T2. Then, the process proceeds to step SP8. In this way, the LED head 16 is sealed with the ultraviolet light irradiation through hole 51T2 in addition to the gap between the rod lens array 53 and the holder 51, so that foreign matter and light from the outside are mixed inside the holder 51. In addition to preventing this, it is possible to prevent the light emitted from the LED array 56 from leaking to the outside of the holder 51 through the through hole 51T2 for ultraviolet light irradiation.

[1-5. Operation and effect]
In the above configuration, in the LED head 16, the mounting portion 51C, which is the base for applying the irradiation direction side adhesive 58, is formed in the sheet metal of the side portion 51W of the holder 51 like a conventional LED head. Then, instead of bending the inside to the holder internal space 51IS side, it was formed by embossing a sheet metal.

Further, the LED head 16 is coated with an irradiation direction side adhesive 58 whose shape can be changed until it is cured, and the substrate 55 is pressed against the irradiation direction side adhesive 58. Ultraviolet light is irradiated from the outside of the holder 51 through the light irradiation through hole 51T2 to cure the adhesive 58 on the irradiation direction side, so that the light of the substrate 55 is formed on the substrate contact surface 58S having high flatness along the horizontal direction. Positioning in the axial direction was performed, and the LED array arrangement surface 55B of the substrate 55 was held by the holder 51 with the adhesive 58 on the irradiation direction side.

Therefore, the LED head 16 is applied to the mounting portion 51C in the irradiation direction without forming an opening for providing a bent portion to be the mounting portion 51C in the sheet metal of the side portion 51W of the holder 51. The substrate 55 can be held by the side adhesive 58. As a result, the LED head 16 can maintain the strength of the holder 51 and the rigidity of the entire LED head 16.

Further, in the conventional LED head, foreign matter is mixed from the outside to the inside of the holder through a large opening for the bent portion, and the light emitted from the LED array is emitted from the outside of the holder 51 through the opening. In order to prevent leakage to the LED, a member for closing the opening is required, which complicates the configuration, increases the cost of the member, and increases the work process.

On the other hand, since the LED head 16 does not need to provide a large opening on the side portion 51W of the holder 51, a member for closing the large opening unlike the conventional LED head is not required, and the complexity of the configuration is prevented. It is possible to prevent the member cost from increasing and prevent the work process from increasing.

Further, the LED head 16 is coated with an irradiation direction side adhesive 58 whose shape can be changed until it is cured, and the substrate 55 is pressed against the irradiation direction side adhesive 58, and the ultraviolet light is emitted. Ultraviolet light is irradiated from the outside of the holder 51 through the irradiation through hole 51T2 so that the adhesive 58 on the irradiation direction side is cured. Therefore, the LED head 16 abuts the substrate 55 on the substrate contact surface 58S having a flatness higher than the horizontal flatness on the mounting portion contact surface 51CS1 of the mounting portion 51C, and is in contact with the optical axis direction. After adjusting the position of the substrate 55, the adhesive 58 on the irradiation direction side can be cured to position the substrate 55. As a result, the LED head 16 greatly improves the position accuracy in the optical axis direction and significantly shortens the time required for the position adjustment as compared with the case where the board 55 is directly brought into contact with the mounting portion 51C. Can be positioned.

Further, the LED head 16 holds the substrate 55 from the anti-irradiation direction side by the anti-irradiation direction side adhesive 60 which is a weakly adhesive ultraviolet curable adhesive. Therefore, in the LED head 16, the hole filling portion 60B of the anti-irradiation direction side adhesive 60 is simply pushed from the outside in the front-rear direction of the side portion 51W toward the holder internal space 51IS, and the hole filling portion 60B is used for anchoring. By detaching from the through hole 51T1 to the holder internal space 51IS side, the adhesive 60 on the anti-irradiation direction side can be easily removed, the substrate 55 can be easily attached to and detached from the holder 51, and the substrate 55 can be easily replaced for maintainability. Can be improved.

Here, since the adhesiveness of the anti-irradiation direction side adhesive 60 is lowered, if the hole filling portion 60B is not provided, the anti-irradiation direction side adhesive 60 easily moves to the anti-irradiation direction side and is inside the holder. It will be separated from the wall surface 51WS and the electronic component placement surface 55A, and the substrate 55 cannot be held by the anti-irradiation direction side adhesive 60.

On the other hand, in the LED head 16, the anchor through hole 51T1 is formed slightly on the anti-irradiation direction side of the electronic component arrangement surface 55A of the substrate 55, and the anti-irradiation direction side adhesive 60 that holds the substrate 55 from the anti-irradiation direction side. Was applied to the inner wall surface 51WS of the holder and the electronic component placement surface 55A, and was also filled in the through hole 51T1 for the anchor. Therefore, the LED head 16 projects the hole filling portion 60B from the substrate contact portion 60A toward the front-rear direction orthogonal to the vertical direction, which is the attachment / detachment direction of the substrate 55, and locks the LED head 16 to the anchor through hole 51T1. Can be done. As a result, the LED head 16 can be restricted from moving upward by the anti-irradiation direction side adhesive 60 by the hole filling portion 60B.

As a result, the LED head 16 restricts the movement of the substrate 55 toward the anti-irradiation direction while maintaining the ease of attachment / detachment of the substrate 55 to the holder 51, and keeps the position of the substrate 55 in the optical axis direction. Can be held in.

According to the above configuration, the LED head 16 of the color printer 1 extends in the longitudinal direction with the substrate 55 on which the LED array 56 as a plurality of light emitting elements is arranged in the longitudinal direction, and the light emitted from the LED array 56. The rod lens array 53 for converging the light, the holder 51 for holding the substrate 55 and the rod lens array 53, the irradiation direction side adhesive 58 cured so as to partially cover the lateral end portion of the substrate 55, and anti-irradiation. A directional adhesive 60 is provided, and the holder 51 is located in a direction different from the holder bottom surface 51BS facing the LED array arrangement surface 55B as the substrate surface on which the LED array 56 is arranged and the holder bottom surface 51BS along the front-rear direction. The holder inner wall surface 51WS extending in the direction, the mounting portion 51C provided on the holder inner wall surface 51WS and on which the irradiation direction side adhesive 58 is placed, and the holder bottom surface corresponding to the mounting portion 51C in terms of the position in the longitudinal direction. It has a through hole 51T2 for ultraviolet light irradiation formed in 51BS and a silicon resin 64 for shielding the through hole 51T2 for ultraviolet light irradiation.

As a result, the LED head 16 cures the irradiation direction side adhesive 58 by irradiating the irradiation direction side adhesive 58 mounted on the mounting portion 51C with ultraviolet light from the outside of the holder 51 via the ultraviolet light irradiation through hole 51T2. By doing so, the substrate 55 can be held in the holder 51 by the irradiation direction side adhesive 58.

[2. Second Embodiment]
[2-1. Scanner configuration]
As shown in the side view in FIG. 12, the scanner 82 is a document reading device, and reads the document M as a medium having a size such as A3 size or A4 size to generate electronic data. The scanner 82 as a reading device includes a reading head 83, a lamp 84, a document base 85, a rail 86, a drive belt 87, a motor 88, and the like. The lamp 84 is arranged so that the irradiated light is reflected by the surface of the document M as a light source and taken into the reading head 83. The platen 85 is made of a material that transmits visible light, and the document M is placed on the platen 85. The rail 86 is arranged below the platen 85 and movably supports the reading head 83. A part of the reading head 83 as a light receiving device is connected to a drive belt 87 stretched by a plurality of pulleys 90, and is configured to be movable on a rail 86 by the drive belt 87 driven by the motor 88. ing. The reading head 83 takes in the light rays irradiated by the lamp 84 and reflected on the surface of the document M and converts them into electronic data.

[2-2. Read head configuration]
As a whole, the reading head 83 has a line sensor 94, which is a detector, in place of the LED array 56 (FIG. 5) of the LED head 16, and a document M, which is a subject, in place of the photoconductor drum 35 (FIG. 2). It has the following structure. The reading head 83 includes a lens unit 92, a mirror 93, and a line sensor 94. The lens unit 92 is configured in the same manner as the rod lens array 53 (FIG. 5) according to the first embodiment. The mirror 93 bends the optical path of the light beam reflected by the document M and causes the mirror 93 to enter the lens unit 92. In the line sensor 94, a plurality of light receiving elements are arranged on a straight line at predetermined intervals, and the image formation of the original image formed by the lens unit 92 is converted into an electric signal. In the present embodiment, since the line sensor 94 has a resolution of 600 [dpi], 600 light receiving elements are arranged per inch. That is, the light receiving elements are arranged with an interval of 0.0423 [mm] in the X direction.

In such a configuration, the scanner 82 turns on the lamp 84 to irradiate the surface of the document M with light, and captures the light rays reflected by the surface of the document M into the reading head 83. The scanner 82 drives the drive belt 87 by the motor 88 to move the reading head 83 and the lamp 84 in the left-right direction of the paper surface in FIG. 12, and captures the light rays reflected from the entire surface of the document M into the reading head 83.

At this time, the light rays reflected by the document M pass through the document table 85, the optical path is bent by the mirror 93, and the light rays are incident on the lens unit 92. The image of the original image formed by the lens unit 92 is formed on the line sensor 94, and the line sensor 94 converts the formed image of the original image into an electric signal to generate electronic data.

Others The scanner 82 having the reading head 83 according to the second embodiment can have substantially the same effect as the color printer 1 having the LED head 16 according to the first embodiment.

[3. Other embodiments]
In the first embodiment described above, the case where the holder 51 is manufactured by sheet metal press processing has been described. The present invention is not limited to this, for example, it is manufactured by mold molding of a liquid crystal polymer, manufactured by various other resins, cut, manufactured by aluminum die casting, or resin is outsert molded into a sheet metal. The holder 51 may be manufactured by various manufacturing methods, such as by manufacturing the holder 51. The same applies to the second embodiment.

Further, in the first embodiment described above, the length in the longitudinal direction of the mounting portions 51C located at both ends in the longitudinal direction is made larger than the length in the longitudinal direction of the mounting portions 51C near the center in the left-right direction. It is not necessary for all the mounting portions 51C formed along the left-right direction to have the same length in the longitudinal direction. The same applies to the second embodiment.

Further, in the first embodiment described above, it is not necessary to make the lengths in the lateral direction the same in all the mounting portions 51C formed along the left-right direction. The same applies to the second embodiment.

Further, in the first embodiment described above, the case where the length of the mounting portion 51C in the longitudinal direction is 10 [mm] or less and a plurality of the mounting portions 51C are discretely formed along the left-right direction in the holder 51 has been described. .. The present invention is not limited to this, and if the rigidity of the holder 51 can be secured, the length of the mounting portion 51C in the longitudinal direction can be set to various other lengths larger than 10 [mm], for example, from the right end portion of the holder 51. It may be formed continuously up to the left end. Even if the length of the mounting portion 51C in the longitudinal direction is lengthened or the holder 51 is continuously formed from the right end portion to the left end portion, the anchor through hole 51T1 can be continuously formed in the left-right direction. Instead, it is desirable to form them discretely to the extent that they can retain their function as anchors. As a result, it is possible to prevent the anchor through hole 51T1 from becoming unnecessarily large and maintain the strength of the holder 51. The same applies to the second embodiment.

Further, in the first embodiment described above, the length of the mounting portion 51C in the lateral direction is set to be equal to or greater than the thickness of the side portion 51W in the front-rear direction and not more than twice the thickness of the side portion 51W in the front-rear direction. I mentioned the case of doing so. The present invention is not limited to this, and if the rigidity of the holder 51 can be ensured, the length of the mounting portion 51C in the lateral direction may be various other lengths. The same applies to the second embodiment.

Further, in the first embodiment described above, a plurality of mounting portions 51C are not arranged at equal intervals along the left-right direction, for example, avoiding a place where an electronic component or the like is mounted on the electronic component arranging surface 55A. May be. The same applies to the second embodiment.

Further, in the first embodiment described above, a case where at least two mounting portions 51C are arranged on the front and rear side portions 51W has been described. The present invention is not limited to this, and various numbers of mounting portions 51C may be arranged on the front and rear side portions 51W according to the thickness of the substrate 55 (that is, the rigidity of the substrate 55).

Further, in the first embodiment described above, a set of mounting portions 51C on the front side portion 51W, an irradiation direction side adhesive 58, a counter-irradiation direction side adhesive 60, an anchor through hole 51T1, and ultraviolet light irradiation. Through hole 51T2 and silicone resin 64, a set of mounting portions 51C on the rear side portion 51W, irradiation direction side adhesive 58, anti-irradiation direction side adhesive 60, anchor through hole 51T1, for ultraviolet light irradiation. The case where the through hole 51T2 and the silicon resin 64 are arranged so as to coincide with each other in the left-right direction has been described. The present invention is not limited to this, and the present invention is not limited to this, and a set of mounting portions 51C in the front side portion 51W, irradiation direction side adhesive 58, anti-irradiation direction side adhesive 60, anchor through hole 51T1, ultraviolet light irradiation through hole 51T2. And silicon resin 64, a set of mounting portions 51C on the rear side portion 51W, irradiation direction side adhesive 58, anti-irradiation direction side adhesive 60, anchor through hole 51T1, ultraviolet light irradiation through hole 51T2 and The silicon resin 64 and the silicon resin 64 may be arranged so that their positions in the left-right direction do not match. In that case, for example, when viewed from the anti-irradiation direction side, a set of mounting portions 51C on the front side portion 51W, an irradiation direction side adhesive 58, an anti-irradiation direction side adhesive 60, an anchor through hole 51T1, and ultraviolet light. Irradiation through hole 51T2 and silicon resin 64, a set of mounting portions 51C on the rear side portion 51W, irradiation direction side adhesive 58, anti-irradiation direction side adhesive 60, anchor through hole 51T1, ultraviolet light irradiation. The through holes 51T2 and the silicon resin 64 may be arranged in a staggered arrangement along the left-right direction. The same applies to the second embodiment.

Further, in the first embodiment described above, the case where the irradiation direction side adhesive 58 and the anti-irradiation direction side adhesive 60 are composed of the ultraviolet curable adhesive has been described. The present invention is not limited to this, and the present invention is limited to an adhesive that cures with an accelerator, an adhesive that cures over time, an adhesive that cures with temperature changes, an adhesive that cures when air is blocked and comes into contact with a metal, and the like. The irradiation direction side adhesive 58 and the anti-irradiation direction side adhesive 60 may be formed by various other members such as a mixed type adhesive. The same applies to the second embodiment.

Further, in the first embodiment described above, the case where the irradiation direction side adhesive 58 and the anti-irradiation direction side adhesive 60 are the same member has been described. The present invention is not limited to this, and the irradiation direction side adhesive 58 and the anti-irradiation direction side adhesive 60 may be different members from each other. The same applies to the second embodiment.

Further, in the first embodiment described above, the through hole 51T2 for ultraviolet light irradiation is made of the silicon resin 64 which is the same member as the silicon resin 62 filled so as to fill the gap between the bottom portion 51B of the holder 51 and the rod lens array 53. The case of filling is described. The present invention is not limited to this, and various other members other than the silicon resin 62 may be filled or attached to the ultraviolet light irradiation through hole 51T2 to shield the ultraviolet light irradiation through hole 51T2. In short, the LED array 56 light is emitted from the holder internal space 51IS to the outside through the ultraviolet light irradiation through hole 51T2 while preventing foreign matter from entering the holder internal space 51IS through the ultraviolet light irradiation through hole 51T2. You just have to prevent it from leaking. The same applies to the second embodiment.

Further, in the first embodiment described above, the case where the gap between the holder 51 and the rod lens array 53 is filled with the silicon resin 62 has been described. The present invention is not limited to this, and the gap between the holder 51 and the rod lens array 53 may be filled with a member made of various other materials. The same applies to the second embodiment.

Further, in the first embodiment described above, as shown in FIG. 6, the anti-irradiation direction side adhesive coating treatment (step SP4), the anti-irradiation direction side adhesive curing treatment (step SP5), and the lens array sealing are performed. The case where the treatment is performed in the order of the treatment (step SP6) and the through-hole sealing treatment for ultraviolet light irradiation (step SP7) has been described. The present invention is not limited to this, for example, the order of the lens array sealing treatment, the through-hole sealing treatment for ultraviolet light irradiation, the anti-irradiation direction side adhesive coating treatment and the anti-irradiation direction side adhesive curing treatment, and the anti-irradiation direction. The treatment may be performed in various orders such as a side adhesive coating treatment, a lens array sealing treatment, a through-hole sealing treatment for ultraviolet light irradiation, and a counter-irradiation direction side adhesive curing treatment. The same applies to the second embodiment.

Further, in the first embodiment described above, in the tandem color printer 1, the present invention is applied to the image forming units 15 of each color arranged in series along the front-rear direction and the LED heads 16 of each color corresponding to each. I mentioned the case of doing. The present invention is not limited to this, and may be applied to LED heads mounted on various other color printers such as a 4-cycle system. The same applies to the second embodiment.

Further, in the first embodiment described above, a case where four LED heads 16 corresponding to each color of yellow, magenta, cyan, and black are attached to the printer housing 2 of the color printer 1 that performs color printing will be described. rice field. The present invention is not limited to this, and for example, three or less or five or more LED heads 16 may be attached to the printer housing 2 depending on the number of colors of the toner used in the color printer, and monochrome. One LED head 16 may be attached to a monochrome printer for printing.

Further, in the first embodiment described above, the present invention is applied to the color printer 1, but the present invention is not limited to this, and any device having the LED head 16 similar to the color printer 1 can be a facsimile or an MFP (MultiFunction Printer: The present invention may be applied to devices such as multifunction devices) and copiers.

Further, in the second embodiment described above, the case where the present invention is applied to the scanner 82 has been described. The present invention is not limited to this, and even if the present invention is applied to sensors and switches that convert optical signals into electrical signals, input / output devices using them, biometric authentication devices, communication devices, dimension measuring devices, and the like. good.

Furthermore, the present invention is not limited to the above-described embodiments and other embodiments. That is, the present invention has an applicable scope to an embodiment in which each of the above-described embodiments and a part or all of the above-mentioned other embodiments are arbitrarily combined, and an embodiment in which a part is extracted. Is.

Further, in the first embodiment described above, the substrate 55 as a substrate, the rod lens array 53 as a convergent lens, the holder 51 as a holding member, the irradiation direction side adhesive 58 as a cured product, and anti-irradiation The directional adhesive 60 constitutes an LED head 16 as an exposure device, and a color printer 1 as an image forming device having the LED head 16; the holding member includes a holder bottom surface 51BS as a first surface and a holder bottom surface 51BS. The case where the holder inner wall surface 51WS as the second surface, the mounting portion 51C as the mounting portion, the through hole 51T2 for ultraviolet light irradiation as the opening, and the silicon resin 64 as the shielding portion are described. .. The present invention is not limited to this, and an exposure apparatus is configured by a substrate having various other configurations, a focusing lens, a holding member, and a cured body, and an image forming apparatus having the exposure apparatus is configured. It may have a first surface, a second surface, a mounting portion, an opening portion, and a shielding portion having various other configurations.

The present invention can be used, for example, in an LED head mounted on an electrophotographic printer.

1 ... Color printer, 2 ... Printer housing, 2T ... Discharge tray, 3 ... Control unit, 4 ... Paper storage cassette, 5 ... Paper feed unit, 7 ... Hopping roller, 8 ... Resist roller 10 ... Transfer belt unit, 11 ... Roller, 12 ... Transfer belt, 13 ... Transfer roller, 15 ... Image formation unit, 16 ... LED head, 18 ... Toner cartridge, 20 ... Fixing unit, 21 ... Heating roller, 22 ... Pressurized roller, 24 ... Paper ejection part, 31 ... Frame, 35 ... Photoreceptor drum, 35S ... Peripheral side surface, 36 ... Charging roller, 38 ... Developing roller, 39 ... Supply roller, 40 ... Development blade, 45 ... Spacer, 51 ... Holder, 51IS ... Holder internal space, 51B ... Bottom, 51BS ... Holder bottom, 51W ... Side, 51WS ... Holder Inner wall surface, 51H ... Rod lens array hole, 51A ... Holder opening, 51C ... Mounting part, 51CS1 ... Mounting part contact surface, 51CS2 ... Mounting part inner surface, 51T1 ... Anchor penetration Hole, 51T2 ... Through hole for ultraviolet light irradiation, 51BS ... Holder bottom surface, 51WS ... Holder inner wall surface, 53 ... Rod lens array, 55 ... Board, 55A ... Electronic component placement surface, 55B ... LED array Arrangement surface, 56 ... LED array, 58 ... Irradiation direction side adhesive, 58S ... Board contact surface, 60 ... Anti-irradiation direction side adhesive, 60A ... Board contact part, 60B ... Hole filling Parts, 62, 64 ... Silicon resin, 82 ... Scanner, 83 ... Reading head, 84 ... Lamp, 85 ... Document stand, 86 ... Rail, 87 ... Drive belt, 88 ... Motor, 90 ... ... Slider, 92 ... Lens unit, 93 ... Mirror, 94 ... Line sensor, P ... Paper.

Claims (15)

A substrate in which multiple light emitting elements are arranged in the longitudinal direction,
A condensing lens that extends in the longitudinal direction and converges the light emitted from the plurality of light emitting elements.
A holding member that holds the substrate and the condensing lens, and
It has a cured body that is cured so as to partially cover the lateral end of the substrate.
The holding member is
A first surface facing the substrate surface on which the plurality of light emitting elements are arranged, and
A second surface extending in a direction different from that of the first surface,
A mounting portion provided on the second surface and on which the cured product is placed, and a mounting portion.
An opening formed in the first surface so as to correspond to the previously described placement with respect to the longitudinal position.
An exposure apparatus having a shielding portion that shields the opening. The exposure apparatus according to claim 1, wherein the holding member is formed on the first surface, extends in the longitudinal direction, and further has a convergent lens hole portion for holding the convergent lens. The exposure apparatus according to claim 2, wherein the opening is formed between the convergent lens hole and the second surface in a direction orthogonal to the longitudinal direction. The exposure apparatus according to any one of claims 1 to 3, wherein the holding member further has a hole in the second surface into which the cured product is inserted. The holding member is coated with an adhesive member for fixing the condensing lens on an outer surface portion of the first surface opposite to the substrate.
The exposure apparatus according to any one of claims 1 to 4, wherein the opening is shielded by the adhesive member which is the shielding portion. The exposure apparatus according to any one of claims 1 to 5, wherein the shielding unit shields light emitted from the plurality of light emitting elements. The cured product is
An irradiation direction side cured body that abuts on the substrate surface of the substrate and holds the substrate,
The exposure apparatus according to any one of claims 1 to 6, wherein the exposure apparatus is composed of a cured body on the counter-irradiation direction side that abuts on a surface opposite to the substrate surface and holds the substrate. The exposure apparatus according to claim 7, wherein the irradiation-direction-side cured product and the anti-irradiation-direction-side cured product are weakly adhesive adhesives having low adhesive strength. The exposure apparatus according to any one of claims 1 to 8, wherein the second surface is orthogonal to the substrate surface. An image forming apparatus comprising the exposure apparatus according to any one of claims 1 to 9. In a holding member that holds a substrate on which a plurality of light emitting elements are arranged in the longitudinal direction and a converging lens extending in the longitudinal direction and converging light emitted from the plurality of light emitting elements, the plurality of light emitting elements in the substrate. The irradiation direction side curing body is mounted on the mounting portion provided on the second surface extending in a direction different from the first surface facing the substrate surface on which the light emitting elements are arranged. Placement step and
A substrate pressing step of pressing the substrate toward the cured body on the irradiation direction side,
The holding member is irradiated with ultraviolet light from an opening formed in the first surface so as to correspond to the above-described mounting portion with respect to the position in the longitudinal direction, and partially covers the lateral end portion of the substrate. The irradiation direction side curing body curing step and the irradiation direction side curing body curing body,
A method for manufacturing an exposure apparatus, which comprises a shielding step for shielding the opening. After the irradiation direction side curing body curing step,
The anti-irradiation direction side curing body mounting step of applying the anti-irradiation direction side curing body to the surface opposite to the substrate surface, and
The exposure apparatus manufacturing method according to claim 11, further comprising a step of curing the anti-irradiation direction side cured body by irradiating with ultraviolet rays to cure the anti-irradiation direction side cured body. A substrate in which multiple light receiving elements are arranged in the longitudinal direction,
A condensing lens that extends in the longitudinal direction and converges the light radiated to the plurality of light receiving elements.
A holding member that holds the substrate and the condensing lens, and
It has a cured body that is cured so as to partially cover the lateral end of the substrate.
The holding member is
A first surface facing the substrate surface on which the plurality of light receiving elements are arranged, and
A second surface extending in a direction different from that of the first surface,
A mounting portion provided on the second surface and on which the cured product is placed, and a mounting portion.
An opening formed in the first surface so as to correspond to the previously described placement with respect to the longitudinal position.
A light receiving device having a shielding portion that shields the opening. A reading device comprising the light receiving device according to claim 13. In a holding member that holds a substrate on which a plurality of light receiving elements are arranged in the longitudinal direction and a converging lens extending in the longitudinal direction and converging light emitted from the plurality of light receiving elements, the plurality of light receiving elements in the substrate. The irradiation direction side curing body is mounted on the mounting portion provided on the second surface extending in a direction different from the first surface facing the substrate surface on which the light receiving elements are arranged. Placement step and
A substrate pressing step of pressing the substrate toward the cured body on the irradiation direction side,
The holding member is irradiated with ultraviolet light from an opening formed in the first surface so as to correspond to the above-described mounting portion with respect to the position in the longitudinal direction, and partially covers the lateral end portion of the substrate. The irradiation direction side curing body curing step and the irradiation direction side curing body curing body,
A method for manufacturing a light receiving device, which comprises a shielding step for shielding the opening.

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