JP2021163941A - Light-emitting element chip, led head and image formation apparatus - Google Patents

Abstract

To improve blade cutting and reduce a stress in the blade cutting imposed on an LED when a user wants to cut an LED chip by combining etching processing with blade processing.SOLUTION: A light-emitting element chip comprises: an LED region 10a in which a plurality of LEDs 11 are arrayed in the long direction in the short direction orthogonal to the long direction of the surface of an LED chip 10; and a rear end side region 10b in which the LEDs 11 are not arrayed. The light-emitting element chip, on a left side end 15 in the long direction of the LED chip 10, comprises: a first counter portion 15a formed with etching processing in the LED region 10a; and a reference cut position 15f which is formed with blade processing in the rear end side region 10b and protrudes by a protrusion amount h1 from the first counter portion 15a. A first cross section (15d, 15h, 15m) excluding a portion subjected to etching processing of the left side end 15 is formed with blade processing.SELECTED DRAWING: Figure 3

Description

The present invention relates to an LED chip including a light emitting element, an LED head using the LED chip, and an image forming apparatus, and particularly to the structure of the LED chip.

Conventionally, in the process of forming an LED chip in which light emitting elements are arranged, there has been a step of cutting the LED chip by blade processing (see, for example, Patent Document 1).

JP-A-2018-134759 (page 11, FIGS. 4, 5)

In such an LED chip, there is a case where it is desired to cut the LED chip by combining etching processing and blade processing. In such a case, improvement of cutting accuracy by blade cutting and stress at the time of blade cutting on the LED are performed. It is required to reduce the amount of light.

The light emitting element chip according to the present invention is a light emitting element chip in which a plurality of light emitting elements are arranged in the longitudinal direction.
In the lateral direction orthogonal to the longitudinal direction of the surface of the light emitting element chip, the plurality of light emitting elements have a first region in which the plurality of light emitting elements are arranged in the longitudinal direction and a second region in which the light emitting elements are not arranged. ,
At one end of the light emitting element chip in the longitudinal direction, a first side formed by etching in the first region and a blade formed in the second region are formed in the longitudinal direction. It has a second side that protrudes from the first side by a first distance, and has a second side.
A first cross section of the one end portion excluding the etched portion is formed by the blade processing.

According to the present invention, it is possible to provide an LED chip in which the excellent characteristics of the etching process are not impaired even when the LED chip is cut by combining the etching process and the blade process.

It is a top view of the LED unit using the LED chip of Embodiment 1 by this invention. It is a partially enlarged view of FIG. 1 which shows the relative arrangement relationship between adjacent LED chips. FIG. 2 is a cross-sectional view taken along the line AA shown in FIG. FIG. 2 is a cross-sectional view taken along the line BB shown in FIG. FIG. 2 is a cross-sectional view taken along the line CC shown in FIG. FIG. 5 is a plan view showing a stage in which etching processing is completed during a series of steps for individually separating LED chips formed by arranging them on a wafer by dicing. (A) is a cross-sectional view taken along the line DD of FIG. 6, FIG. 6B is a cross-sectional view taken along the line EE of FIG. 6, and FIG. 6C is a cross-sectional view taken along the line FF of FIG. It is a figure which provides the explanation of the positional relationship between a blade and the left side end part when the left side end part of the area corresponding to the LED area of an LED chip is separated by blade processing. It is a top view which shows the relative arrangement relation between adjacent LED chips of Embodiment 2 based on this invention. It is a figure which shows the LED print head of Embodiment 3 based on the LED head of this invention. It is a main part composition diagram which shows typically the main part structure of the image forming apparatus of Embodiment 6 based on the image forming apparatus of this invention. This is a cut monitor setting example shown as a comparative example.

Embodiment 1.
FIG. 1 is a plan view of an LED unit 101 using the LED chip 10 of the first embodiment according to the present invention, and FIG. 2 is a partially enlarged view of FIG. 1 showing a relative arrangement relationship between adjacent LED chips 10. 3 is a cross-sectional view taken along the line AA shown in FIG. 2, FIG. 4 is a cross-sectional view taken along the line BB shown in FIG. 2, and FIG. 5 is a cross-sectional view taken along the line CC shown in FIG. be.

As shown in FIG. 1, a plurality of LED chips 10 described later are arranged along the longitudinal direction on the mounting substrate 101d. In addition, electronic components for driving and controlling the LED chip 10 are arranged on the mounting board 101d to form wiring. Areas 101a and 101b for mounting, wiring and connecting electronic components, and control signals from the outside. A connector 101c or the like for supplying power or the like is provided.

As shown in FIG. 2, on the surface of each LED chip 10 as a light emitting element chip, a plurality of LEDs 11 as a light emitting element (see FIG. 2) arranged in a straight line along the longitudinal direction thereof are formed on a GaAs epi substrate. , Etching, electrode formation, protective film formation, etc. The interval ΔE of each LED 11 is about 42.3 um in the case of 600 dpi and about 21.7 um in the case of 1200 dpi. The size of the LED chip 10 is generally about 1 mm (width of the short side w) × 8 mm (length l of the long side), and about several hundred LEDs 11 are formed on one LED chip 10. ing.

The adjacent LED chips 10 are mounted on the mounting substrate 101d so that the distance between the LEDs 11 at the opposite ends is the same as the distance ΔE between the LEDs 11 in the same chip. Therefore, the processing accuracy and mounting accuracy of the short side of the LED chip 10 are required to be very high.

As shown in FIG. 2, since the plurality of LED chips 10 arranged in a row are formed in the same shape, here, mainly in FIG. 2, the longitudinal direction (the direction in which the LEDs 11 are arranged and the arrow E). The shape of the (N) th LED chip 10 located in the center of the direction) will be mainly described, and the (N-1) th and (N + 1) th LED chips 10 arranged adjacent to each other on the left and right as necessary. The shape of is also described. Further, in order to facilitate the explanation, the front / rear, the left / right, and the top / bottom may be specified when viewed from the direction of the arrow D in FIG.

Here, for convenience, the LED chip 10 is placed in three regions adjacent to each other in the lateral direction (the longitudinal direction and the direction orthogonal to the optical axis direction of the LED 11 and the arrow D direction), that is, the third region of the central portion where the LED 11 is formed. In the LED region 10a as one region, the left end portion 15 as one end portion, the rear end side region 10b as a second region protruding to the left from the LED region 10a, and the left end portion 15 The description may be divided into a front end side region 10c as a third region recessed to the right of the LED region 10a.

As shown in the cross-sectional view of FIG. 3, the left end portion 15 of the LED chip 10 in the LED region 10a is a first facing portion 15a as a first side that slightly protrudes from the end LED 11 and extends in the lateral direction. Is formed by a first inclined portion 15b and a melting bottom portion 15c that are precisely processed into an overhang shape by an etching process described later, and a second inclined portion 15d formed by a flading process described later.

In the longitudinal direction (arrow E direction), the second inclined portion 15d is specifically formed so that the second inclined portion 15e, which is the uppermost portion of the second inclined portion 15d, does not protrude from the first opposed portion 15a. It is formed so as to be recessed to the right side of the first facing portion 15a in the longitudinal direction (direction of arrow E).

A cut monitor 15g, which will be described later, is formed on a part of the surface of the left end portion 15 of the rear end side region 10b of the LED chip 10, and the cross-sectional view of FIG. 4 shows a cross section of this portion. .. As shown in the figure, in this region, the reference cut position 15f as the second side corresponding to the end portion of the cut monitor 15g is set as the uppermost portion, and the end is formed only by the continuous inclined portion 15h formed by the blade processing described later. The part is formed.

As shown in the cross-sectional view of FIG. 5, the left end portion 15 in the front end side region 10c of the LED chip 10 is recessed (on the right side) from the first facing portion 15a (shown by the dotted line in the figure). With the evacuation facing portion 15i as the uppermost portion, the evacuation inclined portion 15j processed into an overhang shape by the etching process described later, the melting bottom portion 15k, and the evacuation inclined portion 15m formed by the blade processing described later are formed. There is.

The second inclined portion 15d of the LED region 10a, the continuous inclined portion 15h of the rear end side region 10b, and the retracted inclined portion 15m of the front end side region 10c correspond to the first cross section, and as will be described later, at the same time by blade processing. Since they are formed, these inclined surfaces are flush with each other.

In each LED chip 10, for example, the (N) th LED chip 10, the shape of each end of the left end portion 15 and the right end portion 16 is 180, for example, with the vertical virtual axis center passing through the plane center as the rotation center. There is a two-fold symmetric relationship that overlaps when rotated by a degree.

Therefore, the right end portion 16 of the (N-1) th LED chip 10 having the same shape as the (N) th LED chip 10 and adjacent to the (N) th LED chip 10 shows the AA cross section of FIG. In the cross-sectional view of, the first facing portion 16a, the first inclined portion 16b, the melting bottom portion 16c, and the second inclined portion 16d as the fourth side thereof are the left end portion 15 of the (N) th LED chip 10. It is plane-symmetrical with the first facing portion 15a, the first inclined portion 15b, the melting bottom portion 15c, and the second inclined portion 15d.

Similarly, the right end portion 16 of the (N-1) th LED chip 10 is a retract facing portion 16i and a retracted inclined portion 16j as the fifth side thereof in the cross-sectional view of FIG. 4 showing the BB cross section of FIG. , The melted bottom portion 16k and the retracted inclined portion 16 m are the retracted facing portion 15i, the retracted inclined portion 15j, and the melted bottom portion 15k of the (N) th LED chip 10 in the cross-sectional view of FIG. 5 showing the CC cross section of FIG. And, it is plane-symmetrical with the evacuation inclined portion 15 m.

Similarly, the right end portion 16 of the (N-1) th LED chip 10 has a reference cut position 16f as its sixth side and a cut monitor 16g in the cross-sectional view of FIG. 5 showing the CC cross section of FIG. And the continuous inclined portion 16h is the reference cut position 15f of the (N) th LED chip 10 in the BB sectional view of FIG. 4 showing the BB cross section of FIG. 2, the cut monitor 15 g, and the continuous inclined portion 15h. It is plane symmetric. Further, since the right end portion 16 of the (N) th LED chip 10 has the same shape as the right end portion 16 of the (N-1) th LED chip 10, the right end portion 16 as the other end portion of the LED chip 10 The detailed description of the part 16 will be omitted.

The second inclined portion 16d, the continuous inclined portion 16h, and the retracted inclined portion 16m correspond to the second cross section.

As shown in FIG. 2, the LED chips 10 do not come into contact with each other when they are arranged adjacent to each other so that the distance between the LEDs 11 at the opposite ends is the same as the distance ΔE between the LEDs in the chip. Is taken into account.

Therefore, the width w1 of the reference cut position 15f in the lateral direction (arrow D) is formed to be narrower (w1 <w2) than the width w2 of the retractable facing portion 15i. Further, in the longitudinal direction (direction of arrow E), the protrusion amount h1 as the first distance of the reference cut position 15f with respect to the first facing portion 15a is also used as the second distance of the retracting facing portion 15i with respect to the first facing portion 15a. The amount of retreat is set to be smaller than h2 (h1 <h2).

Next, a method of manufacturing the LED chip 10 will be described. FIG. 6 is a plan view showing a stage in which the etching process is completed during a series of steps for individually separating the LED chips 210 formed by arranging them on the wafer 200 by dicing, and FIG. 7A is a plan view. 6 is a cross-sectional view taken along the line DD, FIG. 7B is a cross-sectional view taken along the line EE of FIG. 6, and FIG. 7C is a cross-sectional view taken along the line FF of FIG. As shown in FIGS. 6 and 7, the LED chip 210 before separation and the LED chip 10 after separation are distinguished by changing the reference numerals.

FIG. 6 is a plan view showing a part of six LED chips 210 among the plurality of LED chips 210 formed on the wafer 200 together with the discard area 201. As shown in the figure, each LED chip 210 is shown. Are arranged adjacent to each other through a predetermined gap in the lateral direction, and are arranged adjacent to each other so as to secure a necessary gap through the discard area 201 in the longitudinal direction. In FIG. 6, the virtual outer shapes of the LED chip 210 and the discard area 201 are shown by dotted lines. Further, in FIGS. 6 and 7, the LED chip 210 is formed by epitaxially growing GaAs, AlGaAs, etc. on the wafer 200, but detailed description thereof will be omitted here.

As shown in FIGS. 6 and 7, when the etching process is completed, among the LED chips 210 adjacent in the longitudinal direction, between the left end portion 15 of the right LED chip 210 and the discard area 201, and the LED on the left side. An etching processing portion (shading portion) 203 is formed between the right end portion 16 of the chip 210 and the discard region 201.

In etching processing, high-precision processing can be realized by photolithography and etching condition management. The processed end shape becomes an overhang shape by anisotropic etching with an etching solution of a phosphoric acid superwater system. The processing depth D at this time is about 20 μm.

In this etching process, in the region corresponding to the LED region 10a (see FIG. 2) of the LED chip 210, the DD cross section of FIG. 6 which is the cross section thereof has the shape shown in the cross section of FIG. 7 (a). It is done in. That is, the left end portion 15 of the LED chip 210 on the right side is formed with the first facing portion 15a, the first inclined portion 15b, and the melting bottom portion 15k, and the right end portion 16 of the LED chip 210 on the left side is also the first. 1 Opposing portion 16a, first inclined portion 16b, and melting bottom portion 16k are formed.

Here, the inclination angles θ1 of the first inclined portions 15b and 16b are about 25 degrees, and the processing depth D of the melted bottom portions 15k and 16k is about 20 μm. The inclination angle θ1 here corresponds to an angle formed by a surface perpendicular to the chip surface on which the LED 11 is arranged and parallel to the lateral direction.

Similarly, by this etching process, in the region corresponding to the rear end side region 10b (see FIG. 2) of the LED chip 210, the EE cross section of FIG. 6 is the shape shown in the cross-sectional view of FIG. 7 (b). It is processed so as to be. That is, the etching process is not performed on the left end portion 15 of the right LED chip 210 in which the cut monitor 15 g described later is formed in advance at a predetermined position on the surface, while the right end portion 16 of the left LED chip 210 is formed. A retract facing portion 16i, a retracted inclined portion 16j, and a melting bottom portion 16k are formed.

The retractable inclined portion 16j is positioned so that the retractable facing portion 16i is retracted by the amount of retreat h2 (see FIG. 2) from the first opposed portion 16a of the LED region 10a virtually shown by the dotted line in FIG. 7 (b). It is formed, and its inclination angle θ1 is formed to be substantially the same as that of the first inclined portion 16b. The processing depth D of the melted bottom portion 16k here is also about 20 μm.

Similarly, by this etching process, in the region corresponding to the front end side region 10c (see FIG. 2) of the LED chip 210, the FF cross section of FIG. It is processed so as to be. That is, the etching process is not performed on the right end portion 16 of the left LED chip 210 in which the cut monitor 16 g described later is formed in advance at a predetermined position on the surface, while the left end portion 15 of the right LED chip 210 is subjected to the etching process. A retract facing portion 15i, a retracted inclined portion 15j, and a melting bottom portion 15k are formed.

The retracted inclined portion 15j is positioned so that the retracted facing portion 15i is retracted by the amount of retreat h2 (see FIG. 2) from the first opposed portion 15a of the LED region 10a virtually shown by the dotted line in FIG. 7 (c). It is formed, and its inclination angle θ1 is formed to be substantially the same as that of the first inclined portion 15b. The processing depth of the melting bottom portion 15k here is also about 20 μm.

Next, the cut monitors 15 g and 16 g and blade processing, which is the next step of etching processing in dicing, will be described.

In each cross-sectional view of FIG. 7, the separation points separated by blade processing are virtually shown by separation lines (dotted lines). Therefore, the separation lines of the left end portion 15 of the right LED chip 210 in each of the drawings (a), (b), and (c) are simultaneously separated by blade processing, and the second inclined portion 15d formed by this separation, The inclined surfaces of the continuous inclined portion 15h and the retracting inclined portion 15m are formed parallel to each other in the lateral direction and are flush with each other.

FIG. 8 provides an explanation of the positional relationship between the blade 220 and the left end portion 15 when the left end portion 15 of the region corresponding to the LED region 10a (see FIG. 2) of the LED chip 210 is separated by blade processing. It is a figure.

As shown in the figure, the blade 220 whose cutting edge extends in the lateral direction advances in the inclination direction at an inclination angle θ2 and abuts on the melting bottom portion 15k (see FIG. 7A), and further in the same direction. It cuts so as to form the second inclined portion 15d. At this time, the blade 220 does not touch the first facing portion 15a of the LED chip 210, and the second facing portion 15e corresponding to the upper end of the second inclined portion 15d is in the longitudinal direction of the LED chip 210 (arrow E in FIG. 2). It is formed so as to be recessed toward the main body (right side) from the first facing portion 15a (corresponding to the direction).

Here, the cutting angle of the blade 220 is a common inclination angle θ2 of the continuous inclined portion 15h, the second inclined portion 15d, and the retracted inclined portion 15 m, and the position of the surface of the LED chip 210 first cut by the blade 220. Is the reference cut position 15f (indicated by a dotted line in the figure) that protrudes from the first facing portion 15a by the amount of protrusion h1. When the processing depths of the melted bottoms 15k and 16k are D (about 20 μm) and the pull-in amount of the second facing portion 15e with respect to the first facing portion 15a is ΔX.
h1 = D · tan (θ2) −ΔX (1)
Will be.

Therefore, here, the numerical value of each part is set so that at least the protrusion amount h1 and the pull-in amount ΔX are both positive numbers.

The cut monitor 15g serves as a mark indicating the cutting position on the surface of the LED chip 210 by the blade 220 at the time of blade processing, and may be any as long as the reference cut position 15f having a protrusion amount h1 can be secured. Here, as shown in FIG. 6 and the cross-sectional view of FIG. 7B showing the EE cross section thereof, the left side of the cut monitor 15g is formed so as to coincide with the reference cut position 15f.

Here, the SiN film which is the surface layer of the LED chip 210 is dry-etched to form a rectangular cut monitor 15 g.

With reference to FIG. 8, the blade processing by the blade 220 has been described by taking the left end portion 15 of the LED chip 210 as an example. However, even if the right end portion 16 of the LED chip 210 is referred to, the cutting angle of the blade 220 is changed. (Displace by 2 × θ2 in the clockwise direction), and the same is performed with 16 g of the cut monitor as a guide.

Here, in the right end portion 16 of the LED chip 10, the amount of retreat of the rear end side region 10b is set to h2, and the amount of protrusion of the front end side region 10c is set to h1 (h1 <h2), but the present invention is limited to this. The retreat amount of the rear end side region 10b is the retreat amount h4 (h4> h1) as the fourth distance, and the protrusion amount of the front end side region 10c is the protrusion amount h3 (h2> h3) as the third distance. ) Can also be set.

As described above, according to the LED chip 10 of the present embodiment, the following effects can be obtained.
(1) Since the first facing portions 15a and 16a of the LED region 10a are formed by etching processing capable of high-precision processing during dicing, damage to the LED 11 is suppressed and LED chips arranged adjacent to each other are suppressed. The spacing between the 10 LEDs 11 can be accurately arranged.
(2) Since the blade 220 is processed without touching the vicinity of the LED 11 during the dying blade processing, damage to the LED 11 due to vibration or heat can be eliminated.
(3) Since the second facing portions 15e and 16e are formed by being retracted toward the main body side from the first facing portions 15a and 16a during blade processing, when they are arranged close to each other on the mounting substrate 101d (FIG. 1), they are formed. The left and right second facing portions 15e and 16e do not collide with each other.
(4) Since the cut monitors 15g and 16g are provided at each of the left and right end portions 15 and 16 of the LED chip 210 so that the reference cut positions 15f and 16f protruding from the first facing portions 15a and 16a can be specified. , The influence of processing variation due to blade meandering during blade processing can be suppressed.
FIG. 12 is a cut monitor setting example shown as a comparative example. As shown in the figure, a plurality of dummy chips 501 are provided in the wafer 500, and a cut monitor is arranged on the same chips. In the case of such an arrangement, it is possible to confirm that the blade processing at the cut monitor portion is performed well. However, the processing state of each LED chip 502 arranged at a position away from the cut monitor cannot be guaranteed against processing variations due to blade meandering during processing.
(5) Reference cut positions 15f and 16f protruding from the first facing portions 15a and 16a are provided, but the retracting facing portions 15i and 16i are formed with a retreat amount h2 larger than the protruding amount h1. When arranged close to each other on the mounting substrate 101d, the opposing reference cut positions 15f and 16f and the retracted facing portions 15i and 16i do not collide with each other.
(6) Since the left and right end shapes of the LED chip 10 are symmetrical twice, the left-right directionality does not matter when the LED chip 10 is placed on the mounting board 101d, so that the degree of freedom in the placement work can be improved. ..
(7) When processing the blade, even if the second facing portion 15e cannot be seen from above the wafer 200 because it is hidden behind the first facing portion 15a, the blade can be accurately mounted by using the cut monitor 15g as a reference. It can be applied to the second facing portion.

Embodiment 2.
FIG. 9 is a plan view showing the relative arrangement relationship between the adjacent LED chips 60 of the second embodiment based on the present invention.

The main difference between the LED chip 60 as the light emitting element chip and the LED chip 10 of the first embodiment shown in FIG. 2 is that the LED region 60a as the first region (the LED region 10a of the LED chip 10). (Corresponding), the central region 60b as the second region (corresponding to the rear end region 10b of the LED chip 10), and the front end region 60c as the third region (corresponding to the front end region 10c of the LED chip 10). Corresponding), the positional relationship is different.

Therefore, the parts of the LED unit using the LED chip 60 that are common to the LED unit 101 (FIG. 1) of the first embodiment are designated by the same reference numerals, or the drawings are omitted to omit the description. The differences will be explained with emphasis. Since the main part configuration of the LED unit of the present embodiment is common to the main part configuration of the LED unit 101 of the first embodiment shown in FIG. 1 except for the LED chip 60 shown in FIG. 9, FIG. Refer to 1.

As shown in FIG. 9, in the LED chip 60 of the present embodiment, the LED 11 is formed, and the first facing portion 65a as the first side of the left end portion 65 as one end portion of the LED chip 60 is formed. The LED region 60a as the formed first region is arranged on the rear end side, and the left end portion 65 of the LED chip 60 protrudes in front of the LED region 60a by the amount of protrusion h1 from the first facing portion 65a. A central region 60b in which a reference cut position 65f is formed as a second side is arranged, and in front of the central region 60b (front end side), the left end portion 65 of the LED chip 60 is retracted by an amount h2 from the first facing portion 65a. A front end side region 60c in which a retractable facing portion 65i is formed as a retracted third side is arranged.

Here, the retreat amount h2 is set to be larger than the protrusion amount h1, and a cut monitor 65g serving as a mark of the reference cut position 65f is formed in the vicinity of the reference cut position 65f.

On the other hand, in the right end portion 66 as the other end portion of the LED chip 60, a first facing portion 66a as a fourth side is formed in the LED region 60a, and a first facing portion 66a is formed in the central portion region 60b. A retractable facing portion 66i is formed as a fifth side recessed by a receding amount h2 from 66a, and a sixth protruding portion h1 (h1 <h2) more than the first facing portion 66a in the front end side region 60c. A reference cut position 66f as a side is formed. A cut monitor 66g, which serves as a mark of the reference cut position 66f, is formed in the vicinity of the reference cut position 66f.

Further, the width wa1 of the reference cut position 65f of the left end portion 65 in the lateral direction is smaller than the width wb1 of the retract facing portion 66i of the right end portion 66 (wa1 <wb1) and is within the range of the retract facing portion 66i. It is set so as to fit, and the width wa2 of the retracting facing portion of the left end portion 65 is set to be larger than the width wb2 of the reference cut position 66f of the right end portion 66 (wa2> wb2).

Here, a method of manufacturing the LED chip 60 will be described. The LED chips 60 here are also formed by arranging them on a wafer in the same manner as the LED chips 210 shown in FIG. 6, and are individually separated by dicing. Similar to the dicing method described in the first embodiment, the first facing portions 65a and 66a and the retracted facing portions 65i and 66i are first formed by etching, and then the reference cutting is performed by the subsequent blade processing with reference to the cut monitor 66g. The blade inclined at an inclination angle θ2 (see FIG. 8 and equation (1)) is cut down in the inclined direction so that the positions 65f and 66f remain, and both ends of the LED chip 60 are cut.

Here, in the right end portion 66 of the LED chip 60, the retreat amount of the central portion region 60b is set to h2, and the protrusion amount of the front end side region 60c is set to h1 (h1 <h2), but the present invention is limited to this. Instead, the retreat amount of the central region 60b is the retreat amount h4 (h4> h1) as the fourth distance, and the protrusion amount of the front end side region 60c is the protrusion amount h3 (h2> h3) as the third distance. It is also possible to set.

Therefore, as shown in FIG. 9, when a plurality of LEDs 11 are arranged adjacent to each other in the longitudinal direction thereof, the following effects can be obtained as in the case of the first embodiment.
(1) Since the first facing portions 65a and 66a of the LED region 60a are formed by etching processing capable of high-precision processing during dicing, damage to the LED 11 is suppressed and the LED chips arranged adjacent to each other are suppressed. The spacing between the 60 LEDs 11 can be accurately arranged.
(2) Since the blade is processed without touching the vicinity of the LED 11 during the dying blade processing, damage to the LED 11 due to vibration or heat can be eliminated.
(3) Since the portion protruding from the main body side of the first facing portions 65a and 66a is eliminated during blade processing, the end portion of the LED chip 60 is arranged close to the mounting substrate 101d (FIG. 1). They do not collide with each other.
(4) Since the cut monitors 65g and 66g are provided at each of the left and right end portions 65 and 66 of the LED chip 60 so that the reference cut positions 15f and 16f protruding from the first facing portions 65a and 66a can be specified. , The influence of processing variation due to blade meandering during blade processing can be suppressed.
(5) Reference cut positions 65f and 66f protruding from the first facing portions 65a and 66a are provided, but the retracting facing portions 65i and 66i are formed with a retreat amount h2 larger than the protruding amount h1. When arranged close to each other on the mounting substrate 101d, the opposing reference cut positions 65f and 66f and the retracted facing portions 65i and 66i do not collide with each other.

Embodiment 3.
FIG. 10 is a diagram showing the LED print head 1200 of the third embodiment based on the LED head of the present invention.

As shown in the figure, the LED unit 101 is mounted on the base member 1201. As shown in FIG. 1, the LED unit 101 here is an array of the LED chips 10 described in the first embodiment, but instead of the LED chips 10, the second embodiment has been described. The LED chips 60 may be arranged.

Above the light emitting portion of the LED chip 10, a rod lens array 1203 as an optical element that collects the light emitted from the light emitting portion is arranged. The rod lens array 1203 has a large number of columnar optical lenses arranged along a linearly arranged light emitting portion of the LED chip 10 (here, the arrangement of the LEDs 11 in FIG. 2), and corresponds to an optical element holder. It is held in place by the lens holder 1204.

As shown in the figure, the lens holder 1204 is formed so as to cover the base member 1201 and the LED unit 101. The base member 1201, the LED unit 101, and the lens holder 1204 are integrally sandwiched by the clampers 1205 arranged via the openings 1201a and 1204a formed in the base member 1201 and the lens holder 1204. Therefore, the light generated by the LED unit 101 is applied to a predetermined external member through the rod lens array 1203. The LED print head 1200 is used as an exposure apparatus such as an electrophotographic printer or an electrophotographic copying apparatus.

As described above, according to the LED print head 1200 of the present embodiment, since the LED chip 10 of the first embodiment or the LED chip 60 of the second embodiment is used, the accuracy of the arrangement interval of the LEDs 11 is maintained. , High precision LED print head 1200 can be provided.

Embodiment 4.
FIG. 11 is a main part configuration diagram schematically showing a main part configuration of the image forming apparatus 1300 of the sixth embodiment based on the image forming apparatus of the present invention.

As shown in the figure, in the image forming apparatus 1300, four process units 1301 to 1304 forming images of each color of yellow, magenta, cyan, and black are formed along a transport path 1320 of the recording medium 1305. They are arranged in order from the upstream side. Since the internal configurations of these process units 1301 to 1304 are common, for example, the cyan process unit 1303 will be taken as an example to explain these internal configurations.

A photoconductor drum 1303a is rotatably arranged in the process unit 1303 as an image carrier in the direction of the arrow, and electricity is supplied to the surface of the photoconductor drum 1303a in order from the upstream side in the rotation direction around the photoconductor drum 1303a. A charging device 1303b for charging the charged photoconductor 1303b and an exposure device 1303c for selectively irradiating the surface of the charged photoconductor drum 1303a with light to form an electrostatic latent image are arranged. Further, the developing apparatus 1303d that generates a manifestation by adhering toner of a predetermined color (cyan) to the surface of the photoconductor drum 1303a on which the electrostatic latent image is formed, and the toner remaining on the surface of the photoconductor drum 1303a are applied. A cleaning device 1303e to be removed is arranged. The drum or roller used in each of these devices is rotated by a drive source and gear (not shown).

Further, in the image forming apparatus 1300, a paper cassette 1306 for storing a recording medium 1305 such as paper in a stacked state is mounted on the lower portion thereof, and the recording medium 1305 is separated and conveyed one by one above the paper cassette 1306. A hopping roller 1307 is arranged. Further, by sandwiching the recording medium 1305 together with the pinch rollers 1308 and 1309 on the downstream side of the hopping roller 1307 in the transport direction of the recording medium 1305, the skew of the recording medium 1305 is corrected, and the process units 1301 to 1304 are corrected. The resist rollers 1310 and 1311 to be conveyed to the above are arranged. These hopping rollers 1307 and resist rollers 1310 and 1311 are interlocked and rotated by a drive source and gears (not shown).

Transfer rollers 1312 formed of semi-conductive rubber or the like are arranged at positions of the process units 1301 to 1304 facing each photoconductor drum. Then, in order to transfer the toner on the photoconductor drums 1301a to 1304a to the recording medium 1305, a predetermined potential difference is generated between the surface of the photoconductor drums 1301a to 1304a and the surface of each of these transfer rollers 1312. Has been done.

The fixing device 1313 has a heating roller and a backup roller, and fixes the toner transferred onto the recording medium 1305 by pressurizing and heating the toner. Further, the discharge rollers 1314 and 1315 sandwich the recording medium 1305 discharged from the fixing device 1313 together with the pinch rollers 1316 and 1317 of the discharge unit, and convey the recording medium 1305 to the recording medium stacker unit 1318. The discharge rollers 1314 and 1315 are interlocked and rotated by a drive source and a gear (not shown). As the exposure apparatus 1303c used here, the LED print head 1200 described in the third embodiment is used.

Next, the operation of the image forming apparatus having the above configuration will be described.
First, the recording medium 1305 stored in the paper cassette 1306 in a state of being deposited is separated and conveyed one by one from the top by the hopping roller 1307. Subsequently, the recording medium 1305 is sandwiched between the resist rollers 1310 and 1311 and the pinch rollers 1308 and 1309, and is conveyed to the photoconductor drum 1301a and the transfer roller 1312 of the process unit 1301. After that, the recording medium 1305 is sandwiched between the photoconductor drum 1301a and the transfer roller 1312, and at the same time the toner image is transferred to the recording screen, the recording medium 1305 is conveyed by the rotation of the photoconductor drum 1301a.

Similarly, the recording medium 1305 sequentially passes through the process units 1302 to 1304, and in the process of passing through the process units 1301c to 1304c, the electrostatic latent images formed by the exposure devices 1301c to 1304c are developed by the developing devices 1301d to 1304d for each color. The toner image is sequentially superimposed on the recording screen and transferred. After that, the recording medium 1305 on which the toner image is fixed by the fixing device 1313 is sandwiched between the discharge rollers 1314 and 1315 and the pinch rollers 1316 and 1317, and is discharged to the external recording medium stacker unit 1318 of the image forming device 1300. Through the above process, a color image is formed on the recording medium 1305.

As described above, according to the image forming apparatus of the present embodiment, since the LED print head 1200 described in the above-described third embodiment is adopted, high-quality printing becomes possible.

Further, in the above-mentioned claims and embodiments, the terms "upper" and "lower" are used, but these are for convenience and are in absolute positional relationship in the state where each device is arranged. Is not limited to.

In the present embodiment, a color printer has been described as an image forming apparatus, but the present invention can also be applied to a monochromatic printer, a copying machine, a fax machine, a multifunction device in which these are combined, and the like.

10 LED chip, 10a LED area, 10b rear end side area, 10c front end side area, 11 LED, 15 left end part, 15a first facing part, 15b first inclined part, 15c melting bottom part, 15d second inclined part, 15e 2nd facing part, 15f reference cut position, 15g cut monitor, 15h continuous inclined part, 15i retracting facing part, 15j retracting inclined part, 15k melting bottom part, 15m retracting inclined part, 16 right end part, 16a 1st facing part, 16b 1st inclined part, 16c molten bottom part, 16d 2nd inclined part, 16e 2nd facing part, 16f reference cut position, 16g cut monitor, 16h continuous inclined part, 16i retract facing part, 16j retracted inclined part, 16k dissolved bottom, 16m Retracted inclined part, 60 LED chip, 60a LED area, 60b central part area, 60c front end side area, 65 left end part, 65a first facing part, 65f reference cut position, 65g cut monitor, 65i retracted facing part, 66 right end Part, 66a 1st facing part, 66f reference cut position, 66g cut monitor, 66i retracting facing part, 101 LED unit, 101a area, 101b area, 101c connector, 101d mounting board, 200 wafers, 201 discard area, 203 etching processing part , 210 LED Chip, 220 Blade, 1200 LED Printhead, 1201 Base Member, 1203 Rod Lens Array, 1204 Lens Holder, 1205 Clamper, 1300 Image Former, 1301, 1302, 1303, 1304 Process Unit, 1301a ~ 1304a Photoreceptor Drum , 1303b charging device, 1303c exposure device, 1303d developing device, 1303e cleaning device, 1305 recording medium, 1306 paper cassette, 1307 hopping roller, 1308, 1309 pinch roller, 1310, 1311 Resist roller, 1312 transfer roller, 1313 fixing device, 1314, 1315 discharge roller, 1316, 1317 pinch roller, 1318 recording medium stacker section.

Claims (13)

In a light emitting element chip in which a plurality of light emitting elements are arranged in the longitudinal direction,
In the lateral direction orthogonal to the longitudinal direction of the surface of the light emitting element chip,
A first region in which the plurality of light emitting elements are arranged in the longitudinal direction,
It has a second region in which the light emitting elements are not arranged, and has a second region.
At one end of the light emitting element chip in the longitudinal direction
The first side formed by etching in the first region and
It has a second side formed by blade processing in the second region and protrudes by a first distance from the first side in the longitudinal direction.
A light emitting element chip characterized in that a first cross section of one end thereof excluding the etched portion is formed by the blade processing. It has a third region that is different from the second region in which the light emitting elements are not arranged.
At the one end of the light emitting element chip in the longitudinal direction.
It has a third side formed by the etching process in the third region and retracts by a second distance from the first side in the longitudinal direction.
The light emitting element chip according to claim 1, wherein the second distance is larger than the first distance. The light emitting element chip according to claim 1 or 2, wherein in the longitudinal direction, the first cross section is inclined with respect to the longitudinal direction so as not to protrude from the first side. At the other end of the light emitting element chip in the longitudinal direction.
With the fourth side formed by the etching process in the first region,
A fifth side formed by the etching process in the second region and retracting by a fourth distance from the fourth side in the longitudinal direction,
It has a sixth side formed by the blade processing in the third region and protrudes from the fourth side by a third distance in the longitudinal direction.
(4th distance)> (1st distance), (2nd distance)> (3rd distance)
The light emitting element chip according to claim 2, wherein a second cross section of the other end portion excluding the etched portion is formed by the blade processing. The light emitting element chip according to claim 4, wherein the second distance and the fourth distance are equal, and the first distance and the third distance are equal. The light emitting element chip according to claim 4 or 5, wherein in the longitudinal direction, the second cross section is inclined with respect to the longitudinal direction so as not to protrude from the fourth side. The light emitting element according to any one of claims 4 to 6, wherein the second region and the third region are arranged via the first region in the lateral direction. Tip. The light emitting element chip according to claim 5, wherein the shape of the one end portion and the shape of the other end portion have a two-fold symmetrical relationship. The light emitting element chip according to any one of claims 4 to 6, wherein the second region and the third region are arranged adjacent to each other in the lateral direction. The width of the fifth side in the lateral direction is larger than the width of the second side, and the width of the third side is larger than the width of the sixth side. The light emitting element chip according to any one of claims 4 to 9. 4. The fourth aspect of the light emitting element chip surface is characterized in that a cut monitor that serves as an index of a blade start position is formed in the vicinity of the second side and the sixth side during the blade processing. The light emitting element chip according to any one of 1 to 10. An LED head comprising a plurality of light emitting element chips according to any one of claims 1 to 11. An image forming apparatus according to claim 12, wherein the LED head is used.

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