JP2021158195A - Signal transmission circuit and printed circuit board - Google Patents

Abstract

To provide a signal transmission circuit and a printed circuit board which are capable of reducing crosstalk noise in a signal transmission path.SOLUTION: A signal transmission circuit includes: a signal transmission path for transmitting a signal on a surface layer of a printed circuit board; a signal line through hole for connecting the signal transmission path to a signal layer arranged in an inner layer of the printed circuit board; a ground layer of the inner layer of the printed circuit board that forms a return current transmission path for the signal transmission path; and a grand through hole that is adjacent to the signal line through hole and is connected to the ground layer. On both sides of the signal transmission path, a ground pattern is disposed including ground areas disposed with a certain distance therebetween and a side ground area coupled to at least one end side of the ground areas. The ground through hole is disposed so as to couple the ground pattern to the ground layer.SELECTED DRAWING: Figure 1

Description

The present invention relates to a signal transmission circuit and a printed circuit board.

The progress of data communication has been remarkable in recent years, and the transmission speed has been rapidly increased. For example, in the PCI Express standard known as the standard specification of expansion buses, PCI Express 4.0 (Gen4) formulated in 2017 sets the physical bandwidth per lane to 16 GT / s in one direction. Furthermore, in PCI Express 5.0 (Gen5), which was standardized in 2019, the speed is 32 GT / s in one direction, which is twice the speed of PCI Express 4.0 (Gen4).

In order to realize such high-speed transmission (increasing the signal transmission speed) in signal transmission on the printed circuit board, it is formed in the inner layer of the printed circuit board in which the return current flows with respect to the signal transmission path provided on the surface layer of the substrate. It is effective to shorten the return current path of the ground layer to be formed. By shortening the return current path, an appropriate impedance is obtained, and the electromagnetic coupling between the signal transmission path and the return current path is controlled to realize signal transmission with less noise. As a general noise countermeasure in this type of high-speed transmission line, a certain width is provided on both sides of the signal transmission line (consisting of a pair of signal lines in the case of the differential method) with a predetermined distance from the signal transmission line. The ground wire to be provided is arranged, and the ground wire is connected to the ground layer of the inner layer by a ground through hole to form a return current path. Connection means an electrical connection. This technique is referred to as "Conventional Example 1" for convenience of the following description. In this description, "ground" may be abbreviated as "GND". According to the technique of the conventional example 1, the loop between the signal and the ground layer (GND layer) can be reduced, and the return current path can be provided. Further, as a technique for further evolving such noise countermeasures, the technique described in WO2015 / 068225 (Patent Document 1) is known.

This Patent Document 1 has an object of improving signal transmission characteristics by shortening the length of a return current bypass path, and has a return current transmission path for a signal transmission path for transmitting a signal. The signal transmission path includes a signal pad formed on the substrate surface layer and a signal line through hole formed in the substrate surface layer and the substrate inner layer and connected to the signal pad, and the return current transmission path is a substrate surface layer. Each GND through hole includes a GND pad (ground pad) formed on the substrate and a plurality of GND through holes formed on the substrate surface layer and the substrate inner layer and connected to the GND pad and the GND layer in the substrate. , Discloses a configuration in which the GND pad is separately arranged on both sides. Hereinafter, the technique of Patent Document 1 will be referred to as "conventional example 2".

WO2015 / 068225

By the way, in the case of high-speed transmission, a differential signal transmission line is usually adopted in which two paired signal lines are arranged and signals of opposite phases are added to the two signal lines for transmission. Has been done. The signal transmission line of the differential transmission method can increase the data transmission speed because the signal amplitude can be reduced as compared with the case of single transmission. Also, in the differential transmission method, the same common noise (common mode noise) is superimposed on signals of opposite phase, so the effect can be offset when the difference between the signal line pairs is taken at the receiving end, so noise countermeasures can be taken. It is convenient in terms of aspects. Many of the recent input / output interfaces such as PCI Express, Serial ATA, and HDMI (registered trademark) use the differential transmission method.

In the signal transmission path based on such a differential transmission method, a return current is generated between the differential current path (P) and GND and between the differential current path (N) and GND, but the direction of this current is Since it is the opposite, it is offset in the inner ground layer (GND layer). In the case of the above-mentioned conventional example 2 (Patent Document 1), in order to strengthen the path of the return current, leader wires (wiring) are provided on both sides of the ground wire (GND wire), and the inner layer is provided through the leader wire. A GND through hole is provided to connect to the GND layer of the above. As a result, a return current path with few detour paths is formed, and the impedance of the GND layer is reduced.

However, even in the technique of the conventional example 2, since the return current is canceled by the GND layer provided in the inner layer of the printed circuit board, the adjacent signal transmission line is used until the return current is canceled by the GND layer. Energy is superimposed on the ground, and crosstalk noise may occur. Therefore, even the technique of the conventional example 2 is not sufficient for suppressing the generation of crosstalk noise.

Therefore, an object of the present invention is to provide a signal transmission circuit and a printed circuit board capable of reducing crosstalk noise in a signal transmission line.

In order to achieve the above-mentioned object, the present invention gives, for example, a signal connecting a signal transmission line for transmitting a signal and the signal transmission line and a signal layer arranged in an inner layer of a printed substrate. A line through hole and a ground through hole connected to the ground layer of the inner layer of the printed substrate forming a return current transmission path for the signal transmission line adjacent to the signal line through hole are formed on the surface layer of the printed substrate. A ground pattern having a ground area provided on both sides of the signal transmission line at a certain distance and having a side ground area connected to at least one end side of the ground area. It is a signal transmission circuit provided and the ground through hole is provided so as to connect the ground pattern and the ground layer.

Further, to give another example of the present invention, a signal transmission line for transmitting a signal, a signal line through hole provided for connecting one end of the signal transmission line and an inner signal layer, and the signal line through hole. A printed circuit board provided on the surface layer with a ground through hole provided for connecting to a ground layer forming a return current circuit adjacent to the hole, and provided on both sides of the signal transmission line at a fixed distance. A ground pattern having a ground area and a side ground area connected to at least one end side of the ground area is provided, and the ground through hole is provided so as to connect the ground pattern and the ground layer. It is a printed circuit board.

According to the present invention, the return current can be canceled by the ground pattern provided on the surface layer of the printed circuit board, and the crosstalk noise can be effectively reduced.

It is a main part plan view of the printed circuit board on which the connector in Example 1 is mounted. FIG. 5 is an enlarged perspective view showing a connection portion between a connector and a printed circuit board in the first embodiment. It is a figure for demonstrating the GND pattern. It is a comparative characteristic diagram which compared the characteristic of the near-end crosstalk (NEXT) in Example 1 and the conventional example. FIG. 5 is a comparative characteristic diagram comparing the characteristics of far-end crosstalk (FEXT) in Example 1 and the conventional example. It is a figure which shows the dimension of each component used for obtaining the characteristic of Example 1. FIG. It is a main part plan view of the printed circuit board on which the connector in Example 2 is mounted. It is a comparative characteristic diagram which compared the characteristic of the near-end crosstalk (NEXT) in Example 2 and the conventional example. FIG. 5 is a comparative characteristic diagram comparing the characteristics of far-end crosstalk (FEXT) in Example 2 and the conventional example. It is a main part plan view of the printed circuit board on which the connector in Example 3 is mounted. It is a comparative characteristic diagram which compared the characteristic of the near-end crosstalk (NEXT) in Example 3 and the prior art example. FIG. 5 is a comparative characteristic diagram comparing the characteristics of far-end crosstalk (FEXT) in Example 3 and the conventional example. It is a main part plan view of the printed circuit board on which the connector in Example 4 is mounted. It is a comparative characteristic diagram which compared the characteristic of the near-end crosstalk (NEXT) in Example 4 and the conventional example. FIG. 5 is a comparative characteristic diagram comparing the characteristics of far-end crosstalk (FEXT) in Example 4 and the conventional example. It is a main part plan view of the printed circuit board on which the connector in Example 5 is mounted. It is a main part plan view of the printed circuit board on which the connector in Example 6 is mounted. 6 is a comparative characteristic diagram comparing the characteristics of near-end crosstalk (NEXT) in Example 6 and the conventional example. 6 is a comparative characteristic diagram comparing the characteristics of far-end crosstalk (FEXT) in Example 6 and the conventional example. It is a main part plan view of the printed circuit board on which the connector in Example 7 is mounted. It is a main part plan view of the printed circuit board on which the connector in Example 8 is mounted. It is a main part plan view of the printed circuit board on which the connector in Example 9 is mounted. It is a main part plan view of the printed circuit board on which the connector in Example 10 is mounted. It is a main part plan view of the printed circuit board on which the connector in Example 11 is mounted. It is a figure explaining the width of the GND pattern in an Example, and the gap between a GND pattern and a signal line.

Hereinafter, embodiments for carrying out the present invention will be described in detail. The present invention is not limited to the examples described below. Further, in each figure used in the following description, the same device and the same operation process are assigned the same number and reference numeral, and in principle, the description of the device already described will be omitted. This reduces duplicate explanations. In the examples described below, a connector having a large number of pins is connected to a printed circuit board having a signal transmission path, but the present invention is not limited to such a configuration. Further, in all the examples described below, an example of a signal transmission line of a differential signal system in which two signal lines are set as a signal path is shown, but the present invention regardless of the differential system or the single system. Can be applied.

<< Example 1 >>
First, Example 1 of the present invention will be described with reference to FIGS. 1 to 4B and 20. FIG. 1 is a view showing the first embodiment and is a plan view of a main part of a printed circuit board on which a connector is mounted. FIG. 2 is an enlarged perspective view showing a connection portion between the connector and the printed circuit board in the first embodiment. FIG. 3 is a diagram for explaining a GND pattern (ground pattern). 4A and 4B are comparative characteristic diagrams comparing the crosstalk characteristics of Example 1 of the present invention and Conventional Examples (Conventional Example 1 and Conventional Example 2). FIG. 4A shows the comparative characteristics of the near end crosstalk (NEXT), and FIG. 4B shows the comparative characteristics of the far end crosstalk (FEXT). FIG. 20 is a diagram illustrating the width of the GND pattern and the gap between the GND pattern and the signal line in the embodiment of the present invention.

In FIGS. 1 and 2, the printed circuit board 100 has a plurality of signal transmission lines 1 and 2, and solders a connector 50 having a large number of pins 51 to 57 provided at the ends of the other printed circuit boards 200. It is configured to be connected by soldering. In FIG. 1, pins 51 to 57 of the connector 50 are shown by alternate long and short dash lines.

The signal transmission line 1 in the first embodiment is composed of a set of signal lines (signal pads) 1a and 1b, and constitutes a differential type signal transmission line. Similarly, the signal transmission line 2 is composed of a set of signal lines (signal pads) 2a and 2b, and constitutes a differential type signal transmission line. The ends (the right end in FIG. 1) located opposite to the position where the connector 50 of the signal lines 1a and 1b and the signal lines 2a and 2b are connected are connected to the wirings 41, 42, 43 and 44, respectively. The end portions of each signal line are connected to a signal layer (not shown) arranged in the inner layer of the printed circuit board 100 by signal line through holes 1A, 1B, 2A, and 2B, respectively. In FIG. 1, d indicates the distance between the pin center and the GND through holes 31 to 33 provided on the connector side when the GND pins 55, 56, 57 of the connector 50 are connected to the GND pattern 10. .. In the case of FIG. 1, the positions of the GND through holes 31 to 33 are located further to the left side of the left end of the GND line area (GND pad area) 11 to 13. Further, in FIG. 2, the arrow N indicates the NEXT direction. The arrow F indicates the NEXT direction. The arrow L is the direction of the aggressor.

In the first embodiment, as is clear from FIG. 1, the peripheral portions of the signal transmission lines 1 and 2 are surrounded by the GND pattern 10. That is, the signal transmission lines 1 and 2 formed on the surface layer of the printed circuit board 100 are configured to be surrounded on four sides by the GND pattern 10 having a rectangular space. In other words, the GND pattern 10 has a solid shape in which the portions of the signal transmission lines 1 and 2 are hollowed out in a rectangular shape with a certain gap from the signal line. The GND pattern 10 includes GND line areas 11 to 13 which are areas provided in parallel with the signal line at a certain distance, and GND pins 55 to 57 are connected in this area. Note that the GND line areas 11 to 13 only show a part of the GND pattern 10, and do not perform any special processing or the like. Therefore, the GND line areas 11 to 13 are indicated by broken lines. Further, each signal line 1a, 1b, 2a, 2b is connected to the signal pins 51, 52, 53, 54 of the connector 50.

Here, the configuration of the GND pattern 10 will be described in more detail with reference to FIG. The GND pattern 10 in the first embodiment includes the GND line areas 11 to 13 described above, and includes GND areas 101 to 103 having a wider area than the GND line areas 11 to 13. In other words, it is a solid area in which a conductive film is uniformly formed. The GND areas 101 to 103 are arranged on both sides of the signal transmission lines 1 and 2. Further, the GND pattern 10 in FIG. 3 includes a side GND area 104 which is a ground area on the signal line through hole (1A, 1B, 2A, 2B) side and a side GND area 105 on the opposite side (connector connection side). I have. That is, the GND pattern 10 has side ground areas 104 and 105 integrally connected to the ends of the ground areas 101 to 103 provided adjacent to the signal transmission line.

The GND pattern 10 in Example 1 has both a side GND area 104 and a side GND area 105. However, the GND pattern 10 in the present invention is not limited to such a shape. The GND pattern 10 in the present invention may have a configuration having at least one side GND area among the side GND areas 104 and 105 in addition to the GND areas 101 to 103. The GND pattern 10 used in some of the examples described later has a configuration having one of the side GND areas.

Now, returning to FIGS. 1 and 2, the first embodiment will be described. In FIG. 1, GND through holes 21 to 23 are provided on both sides of the signal line through holes (1A, 1B, 2A, 2B) so as to be connected (connected) to the GND layer (not shown) of the inner layer of the printed circuit board. ing. Further, GND through holes 31 to 33 are also provided on the side of the GND pattern 10 opposite to the signal line through hole side (connector 50 connection side) so as to be connected to the inner GND layer. That is, in the first embodiment, the GND through holes are provided on the upper surface of the GND pattern 10 adjacent to both ends of the signal line.

As shown in FIG. 20, the pattern width dp of the GND pattern 10 in Example 1 is 250 μm or more. This is because when the pattern width is small, the impedance between the signal and GND becomes large and a sufficient effect cannot be obtained. The gap width dg between the inner end of the GND pattern 10 and the end of the signal line is 300 μm or more. This is because if the gap width dg is small, the capacitance of the signal line increases, which causes deterioration of signal characteristics other than crosstalk noise. The numerical values of the pattern width dp and the gap width dg are the same in other examples described later.

With such a configuration, the signal of the signal transmission line 1 has a return current flowing through the common ground of the GND pattern 10 of the surface layer, and the signal of the signal transmission line 2 also has a return current flowing through the common ground of the GND pattern 10 of the surface layer. Flow, and they are canceled out, so that the return current of one signal transmission line is not superimposed on the signal of the other signal transmission line. That is, the crosstalk noise in each signal transmission line is reduced. Further, in this embodiment, since the GND through holes 21 to 23 and the GND through holes 31 to 33 communicate with the GND layer of the inner layer, the signal fluctuation due to the bypass of the return current path can be reduced. The differential signal transmission characteristics can be improved. In this way, crosstalk in the signal transmission line can be reliably reduced even in high-speed transmission.

The reduction in crosstalk noise in Example 1 of the present invention is also clear from the characteristic diagrams shown in FIGS. 4A and 4B. 4A and 4B are characteristic diagrams in which crosstalk noise is obtained by simulation. In FIGS. 4A and 4B, the characteristic of C1 shows the characteristic according to the configuration of the conventional example 1, and the characteristic of C2 shows the characteristic according to the configuration of the conventional example 2. And I1 shows the characteristic in the structure of Example 1 of this invention. In both the NEXT characteristic (FIG. 4A) and the FIX characteristic (FIG. 4B), it can be seen that the characteristic I1 of the present invention has less crosstalk than the characteristics of the conventional example (C1, C2).

The characteristics shown in FIGS. 4A and 4B are obtained by simulation, but the characteristics by this simulation are obtained by setting the dimensions shown in FIG. That is, the length of the signal line is 1.6 mm, the width of the signal line is 0.35 mm, the distance between the GND pattern and the signal line is 0.25 mm, and the diameters of the GND through hole and the signal line through hole are 0. 5 mm, the distance between the outer edge of the GND pattern and the GND through hole is 1.25 mm, and so on. Other dimensions are as shown in FIG. The conductivity of the conductors that make up the signal line and GND is 5.8e-7 (S / m), the dielectric constant of the dielectric material of the printed circuit board is 4.1, and the dielectric loss tangent is 0.015. bottom. Under such conditions, the characteristic I1 is the crosstalk characteristic of the first embodiment of the present invention obtained by simulation. Further, in the conventional examples 1 and 2, the GND line (ground pad) is used instead of the GND pattern 10, but the crosstalk characteristics are simulated in the same manner as in the case of FIG. 5 under the conditions such as other dimensions. Seeking by. In the case of the figure showing the crosstalk noise characteristics of the other examples described below, the simulation results obtained under the same conditions are also shown.

As described above, in the first embodiment, the GND pattern 10 is provided so as to surround the signal transmission line (see FIG. 3), and both sides of the GND pattern 10 are connected to the lower GND layer by GND through holes. Therefore, crosstalk noise can be reduced. Further, since it can be realized with a simple configuration, the printed circuit board can be easily manufactured, and the crosstalk of the signal transmission line can be surely reduced without incurring a cost.

<< Example 2 >>
Next, Example 2 of the present invention will be described with reference to FIGS. 6, 7A, and 7B. FIG. 6 is a view showing the second embodiment, and is a plan view of a main part of the printed circuit board on which the connector is mounted. FIG. 7A is a comparative characteristic diagram comparing the near-end crosstalk (NEXT) in the second embodiment and the conventional example. FIG. 7B is a comparative characteristic diagram comparing the far-end crosstalk (FEXT) of Example 2 and the conventional example.

As is clear from FIG. 6, the configuration of FIG. 6 and the configuration of FIG. 1 (Example 1) are almost the same. In FIG. 1, the GND through holes 31 to 33 are installed at positions on the side GND area 105, which is an area to the right of the GND line areas 11 to 13. On the other hand, in FIG. 6 of the second embodiment, the positions where the GND through holes 31 to 33 are installed are different in that they are installed at positions within the GND line areas 11 to 13 included in the GND area. .. Also in the configuration of FIG. 6, the noise reduction effect on the high frequency component of the return current can be enhanced, and the crosstalk noise can be reliably reduced.

The reduction in crosstalk noise in Example 2 of the present invention is also clear from the characteristic diagrams shown in FIGS. 7A and 7B. In FIGS. 7A and 7B, the characteristic of C1 shows the characteristic according to the configuration of the conventional example 1, and the characteristic of C2 shows the characteristic according to the configuration of the conventional example 2. I2 shows the characteristics in the configuration of Example 2. In FIGS. 7A and 7B, the characteristic I1 of the first embodiment is also described in order to compare the degree of reduction of the crosstalk noise of the second embodiment and the first embodiment. In both the NEXT characteristic (FIG. 7A) and the FIX characteristic (FIG. 7B), it can be seen that the characteristic I2 of the second embodiment has less crosstalk noise than the characteristic of the conventional example (C1, C2). Further, it can be seen that the characteristic I2 of the second embodiment is more excellent in the effect of reducing crosstalk noise than the characteristic I1 of the first embodiment. In the case of the second embodiment, since GND through holes 31 to 33 are provided at the pin connection positions, pad-on vias are applied for connecting the pins of the connector 50 and the GND through holes. Therefore, the number of steps is increased as compared with the case of the first embodiment. The conditions (dimensions, materials) for obtaining the characteristics of FIGS. 7A and 7B are the same as those described in the first embodiment (see FIG. 5).

As described above, in the second embodiment, the GND pattern 10 is provided so as to surround the signal transmission line (see FIG. 3), and both sides of the GND pattern 10 are connected to the lower GND layer by GND through holes. Crosstalk noise can be reliably reduced by the configuration. Further, in the second embodiment, the crosstalk noise can be further reduced as compared with the case of the first embodiment.

<< Example 3 >>
Next, Example 3 of the present invention will be described with reference to FIGS. 8, 9A, and 9B. FIG. 8 is a view showing the third embodiment and is a plan view of a main part of the printed circuit board on which the connector is mounted. FIG. 9A is a characteristic diagram showing a comparison of near-end crosstalk (NEXT) between Example 3 and the conventional example. FIG. 9B is a characteristic diagram showing a comparison of far-end crosstalk (FEXT) between Example 3 and the conventional example.

In FIG. 8, the difference between the configuration of FIG. 8 and the configuration of FIG. 1 (Example 1) is whether or not a part of the GND through holes is installed, and the other configurations are the same. That is, in FIG. 1, the GND through holes 31 to 33 were installed at positions outside the GND line areas 11 to 13. On the other hand, FIG. 8 of the third embodiment is different in that the GND through holes 31 to 33 are not installed.

The effects of the examples shown in FIG. 8 are basically the same as those of the above-mentioned Example 1, and the description thereof will be omitted. Also in the configuration of FIG. 8, the noise reduction effect on the high frequency component of the return current can be enhanced, and the crosstalk noise can be reliably reduced.

The crosstalk noise reduction characteristics in Example 3 (FIG. 8) are shown in FIGS. 9A and 9B. In FIGS. 9A and 9B, the characteristics of C1 show the characteristics according to the configuration of the conventional example 1, and the characteristics of C2 show the characteristics according to the configuration of the conventional example 2. I3 shows the characteristics of Example 3. The conditions (dimensions, materials) for obtaining the characteristics of FIGS. 9A and 9B are the same as those described in the first embodiment. In both the NEXT characteristic (FIG. 9A) and the NEXT characteristic (FIG. 9B), it can be seen that the characteristic I3 of Example 3 has less crosstalk than the characteristics of the conventional example (C1, C2). In the third embodiment, the effect of reducing crosstalk noise is inferior to that of the first embodiment, but the structure is simpler because the GND through holes 31 to 33 are not provided.

As described above, according to the third embodiment of the present invention, there is an effect of reducing crosstalk noise in the signal transmission line. In addition, it is easy to manufacture and the cost can be reduced.

<< Example 4 >>
Next, Example 4 of the present invention will be described with reference to FIGS. 10, 11A, and 11B. FIG. 10 is a view showing the fourth embodiment and is a plan view of a main part of a printed circuit board on which a connector is mounted. FIG. 11A is a characteristic diagram showing a comparison of near-end crosstalk (NEXT) between Example 4 and the conventional example. FIG. 11B is a characteristic diagram showing a comparison of far-end crosstalk (FEXT) between Example 4 and the conventional example.

In FIG. 10, the configuration is the same as that in FIG. 1 (Example 1) except that the shape of the GND pattern 10 is different. That is, the GND pattern 10 in FIG. 1 has a shape in which the entire periphery of the signal transmission lines 1 and 2 is surrounded by a conductive film. On the other hand, in the GND pattern 10 in FIG. 10, the side GND area 105 on the connector connection side of the signal transmission lines 1 and 2 exists, but the side GND area 104 on the signal line through hole side of the signal transmission lines 1 and 2 is present. Does not exist (see Figure 3). That is, the GND pattern 10 in FIG. 10 has a shape that surrounds the signal transmission lines 1 and 2 on three sides.

The effects of the examples shown in FIG. 10 are almost the same as those of the above-mentioned Example 1, and the description thereof will be omitted. Also in the configuration of FIG. 10, the noise reduction effect on the high frequency component of the return current can be enhanced, and the crosstalk noise can be reliably reduced.

The crosstalk noise reduction characteristics in Example 4 (FIG. 10) are shown in FIGS. 11A and 11B. In FIGS. 11A and 11B, the characteristic of C1 shows the characteristic according to the configuration of the conventional example 1, and the characteristic of C2 shows the characteristic according to the configuration of the conventional example 2. I4 shows the characteristics of Example 4. In both the NEXT characteristic (FIG. 11A) and the FIX characteristic (FIG. 11B), it can be seen that the characteristic I4 of Example 4 has less crosstalk than the characteristics of the conventional example (C1 and C2). The conditions (dimensions, materials) for obtaining the characteristics of FIGS. 11A and 11B are the same as those described in the first embodiment.

As described above, the fourth embodiment has the effect of reducing crosstalk noise in the signal transmission line. In addition, it is easy to manufacture and the cost can be reduced.

<< Example 5 >>
Next, Example 5 of the present invention will be described with reference to FIG. FIG. 12 is a view showing the fifth embodiment and is a plan view of a main part of the printed circuit board on which the connector is mounted.

The difference between the configuration in FIG. 12 and the configuration in FIG. 10 (Example 4) is that the connection method between the GND through holes 21 to 23 and the GND pattern 10 is different. That is, in FIG. 10, the GND through holes 21 to 23 for connecting the GND pattern 10 and the lower GND layer are provided in the GND pattern 10 and directly connect the GND pattern 10 and the lower GND layer. On the other hand, in FIG. 12 (Example 5), the ends of the GND pattern 10 and the GND through holes 21 to 23 are indirectly connected by providing wirings 45 to 47, respectively.

The action and effect in Example 5 shown in FIG. 12 are almost the same as those in Example 1 described above, and the description thereof will be omitted. Also in the configuration of FIG. 12, the noise reduction effect on the high frequency component of the return current can be enhanced, and the crosstalk noise can be reliably reduced. Although the description of the comparative characteristics with the characteristics of the prior art in Example 5 is omitted, the characteristics in the case of Example 5 are the same as those in the case of Example 4 (see FIGS. 11A and 11B).

<< Example 6 >>
Next, Example 6 of the present invention will be described with reference to FIGS. 13, 14A, and 14B. FIG. 13 is a view showing the sixth embodiment and is a plan view of a main part of the printed circuit board on which the connector is mounted. FIG. 14A is a characteristic diagram showing a comparison of near-end crosstalk (NEXT) in Examples 6, Examples 1, and Conventional Examples 1 and 2. FIG. 14B is a characteristic diagram showing a comparison of far-end crosstalk (FEXT) in Example 6, Example 1, and Conventional Examples 1 and 2.

The configuration in FIG. 13 is almost the same as that in FIG. 10 (Example 4). That is, in FIG. 10, the installation positions of the GND through holes 31 to 33 were installed at positions outside the GND line areas 11 to 13. On the other hand, in FIG. 13 of the sixth embodiment, the GND through holes 31 to 33 are not installed. Other configurations are the same.

The action and effect of Example 6 shown in FIG. 13 is almost the same as that of Example 4 described above, and the description thereof will be omitted. As shown in FIGS. 14A and 14B, it can be seen that in the sixth embodiment, the crosstalk noise is reduced as compared with the characteristics C1 and C2 of the conventional example in a certain frequency range (12 GHZ or less). However, the reduction of crosstalk noise is small as compared with the characteristic I1 of the first embodiment.

As described above, even in the configuration of FIG. 13, the noise reduction effect on the high frequency component of the return current can be enhanced and the crosstalk noise can be reliably reduced in a certain frequency range.

<< Example 7 >>
Next, Example 7 of the present invention will be described with reference to FIG. FIG. 15 is a view showing the seventh embodiment and is a plan view of a main part of the printed circuit board on which the connector is mounted.

The configuration in FIG. 15 is almost the same as that in FIG. 13 (Example 6). The difference is that the connection method between the GND through holes 21 to 23 and the GND pattern 10 is different. That is, in FIG. 13, the GND through holes 21 to 23 for connecting the GND pattern 10 and the lower GND layer are provided in the GND pattern 10 and directly connect the GND pattern 10 and the lower GND layer. On the other hand, in FIG. 15 (Example 7), the ends of the GND pattern 10 and the GND through holes 21 to 23 are indirectly connected by providing wirings 45 to 47, respectively.

The action and effect in Example 7 shown in FIG. 15 are almost the same as those in Example 1 described above, and the description thereof will be omitted. Also in the configuration of FIG. 15, in a certain frequency range, the noise reduction effect on the high frequency component of the return current can be enhanced, and the crosstalk noise can be reliably reduced. Although the description of the comparative characteristics with the characteristics of the prior art in Example 7 will be omitted, the characteristics in the case of Example 7 will be the same as those in the case of Example 6 (see FIGS. 14A and 14B).

<< Example 8 >>
Next, Example 8 of the present invention will be described with reference to FIG. FIG. 16 is a view showing the eighth embodiment and is a plan view of a main part of the printed circuit board on which the connector is mounted.

The configuration of FIG. 16 is almost the same as that of FIG. 10 (Example 4). The difference is that in FIG. 10, the GND through holes 31 to 33 are installed at positions on the side GND area 105, which is an area to the right of the GND line areas 11 to 13. On the other hand, in FIG. 16, the positions where the GND through holes 31 to 33 are installed are located within the GND line areas 11 to 13 included in the GND area.

The action and effect in Example 8 shown in FIG. 16 are substantially the same as in the case of Example 4 described above, and the description thereof will be omitted. Also in the configuration of FIG. 16, the noise reduction effect on the high frequency component of the return current can be enhanced, and the crosstalk noise can be reliably reduced.

<< Example 9 >>
Next, Example 9 of the present invention will be described with reference to FIG. FIG. 17 is a view showing the ninth embodiment and is a plan view of a main part of the printed circuit board on which the connector is mounted.

The difference between the configuration in FIG. 17 and the configuration in FIG. 16 (Example 8) is that the connection method between the GND through holes 21 to 23 and the GND pattern 10 is different. That is, in FIG. 16, the GND through holes 21 to 23 for connecting the GND pattern 10 and the lower GND layer are provided in the GND pattern, and the GND pattern 10 and the lower GND layer are directly connected. On the other hand, in FIG. 17 (Example 9), the ends of the GND pattern 10 and the GND through holes 21 to 23 are indirectly connected by providing wirings 45 to 47, respectively.

Also in the ninth embodiment shown in FIG. 17, the noise reduction effect on the high frequency component of the return current can be enhanced, and the crosstalk noise can be reliably reduced.

<< Example 10 >>
Next, Example 10 of the present invention will be described with reference to FIG. FIG. 18 is a view showing the tenth embodiment and is a plan view of a main part of a printed circuit board on which a connector is mounted.

In FIG. 18, the configuration is the same as that in FIG. 6 (Example 2) except that the shape of the GND pattern 10 is different. That is, in the case of FIG. 6, the GND pattern 10 of the surface layer has a shape that surrounds the entire periphery of the signal transmission line. On the other hand, in the GND pattern 10 in FIG. 18, the side GND area 104 on the signal line through hole side of the signal transmission lines 1 and 2 exists, but the Sai GND area 105 on the connector connection side of the signal transmission lines 1 and 2 ( (See Figure 3) does not exist.

The action and effect in Example 10 shown in FIG. 18 are basically the same as in the case of Example 2 described above. Also in the configuration of FIG. 18, the noise reduction effect on the high frequency component of the return current can be enhanced, and the crosstalk noise can be reliably reduced.

<< Example 11 >>
Next, Example 11 of the present invention will be described with reference to FIG. FIG. 19 is a view showing the eleventh embodiment and is a plan view of a main part of a printed circuit board on which a connector is mounted.

There is almost no difference between the configuration of FIG. 19 and the configuration of FIG. 18 (Example 10) except for the presence or absence of some GND through holes. That is, in FIG. 18, the GND through holes 31 to 33 on the connector side are provided, whereas in FIG. 19, these GND through holes 31 to 33 are not provided.
Also in the embodiment shown in FIG. 19, the noise reduction effect on the high frequency component of the return current can be enhanced, and the crosstalk noise can be reliably reduced.

<< Other Examples >>
The present invention is not limited to the above-described embodiment of the present invention, and includes modified examples in which the configuration is modified without departing from the technical idea and purpose of the present invention. Further, the above-described examples are described in detail for facilitating the understanding of the present invention, and the present invention is not limited to those having all the configurations described. Further, it is possible to add / delete / replace a part of the configuration of the embodiment with another configuration.

1 ... Signal transmission line, 1a ... Signal line (signal pad), 1b ... Signal line (signal pad), 2 ... Signal transmission line, 2a ... Signal line (signal pad), 2b ... Signal line (signal pad), 1A ... Signal line through hole, 1B ... Signal line through hole, 2A ... Signal line through hole, 2B ... Signal line through hole, 10 ... Ground pattern (GND pattern), 11-13 ... Ground line area (GND line area, GND pad area) ), 21-23 ... ground through-hole (GND through-hole), 31-33 ... ground through-hole (GND through-hole), 41-47 ... wiring, 50 ... connector, 51-54 ... signal pin, 55-57 ... ground Pin (GND pin), 100 ... Printed circuit board, 101-103 ... Ground area (GND area), 104 ... Side ground area (side GND area), 105 ... Side ground area (side GND area), 200 ... Printed circuit board

Claims (15)

A signal line through hole for connecting a signal transmission line for transmitting a signal, the signal transmission line and a signal layer arranged in an inner layer of a printed circuit board, and a signal transmission line adjacent to the signal line through hole for the signal transmission line. A signal transmission circuit in which a ground through hole connected to a ground layer in the inner layer of the printed substrate forming a return current transmission path is formed in the surface layer of the printed substrate.
A ground pattern having ground areas provided on both sides of the signal transmission line at a certain distance and having side ground areas connected to at least one end side of the ground area is provided, and the ground pattern and the ground layer are provided. A signal transmission circuit provided with the ground through hole so as to connect the two. In the signal transmission circuit according to claim 1,
The ground pattern is a signal transmission circuit having the side ground area connected to both ends of the ground area. In the signal transmission circuit according to claim 2,
The signal transmission circuit is characterized in that the ground through hole is installed at a position adjacent to the signal line through hole of the ground pattern and at a position of the side ground area opposite to the signal line through hole. In the signal transmission circuit according to claim 2,
The ground through hole is a signal line through hole from a position adjacent to the signal line through hole at the upper part of the ground pattern and a position opposite to the signal line through hole from the side ground area. A signal transmission circuit characterized by being installed at a position on the side. In the signal transmission circuit according to claim 1,
The ground pattern is a signal transmission circuit characterized in that the side ground area is provided at an end of the ground area opposite to the signal line through hole. In the signal transmission circuit according to claim 5,
The signal transmission circuit is characterized in that the ground through hole is installed at a position adjacent to the signal line through hole of the ground pattern and at a position of the side ground area. In the signal transmission circuit according to claim 5,
The ground through hole is closer to the signal line through hole than the side ground area connected to a position adjacent to the signal line through hole of the ground pattern and a position opposite to the signal line through hole. A signal transmission circuit characterized by being installed at a position. In the signal transmission circuit according to claim 1,
The ground pattern is a signal transmission circuit characterized in that the side ground area is provided at an end of the ground area on the signal line through-hole side. In the signal transmission circuit according to claim 8,
The signal transmission circuit is characterized in that the ground through hole is installed at a position adjacent to the signal line through hole of the ground pattern and at an end of a position opposite to the signal line through hole. A signal line through hole connecting a plurality of signal transmission lines for transmitting signals, a signal transmission line and a signal layer arranged in the inner layer of the printed board, and the signal line through hole on the surface layer of the printed substrate. It has a ground-through hole that connects to the ground layer of the inner layer of the printed substrate that forms a return current transmission line for the signal transmission line adjacent to the hole.
A ground pattern having a plurality of ground areas provided at a certain distance between the plurality of signal transmission lines and having a side ground area connected to at least one end side of the plurality of ground areas is provided. A signal transmission circuit in which the ground through hole is provided so as to connect the ground pattern and the ground layer. A signal transmission line for transmitting a signal, a signal line through hole provided for connecting one end of the signal transmission line and an inner signal layer, and a ground forming a return current circuit adjacent to the signal line through hole. A printed substrate having a ground through hole provided for connecting to a layer on the surface layer.
A ground pattern having ground areas provided on both sides of the signal transmission line at a certain distance and having side ground areas connected to at least one end side of the ground area is provided.
A printed circuit board provided with the ground through hole so as to connect the ground pattern and the ground layer. In the printed circuit board according to claim 11.
The printed circuit board is characterized in that the ground pattern is provided with the side ground areas that are connected to both ends of the ground area. In the printed circuit board according to claim 11.
The printed circuit board is characterized in that the ground through hole is installed at a position adjacent to the signal line through hole and at a position of the side ground area opposite to the signal line through hole. In the printed circuit board according to claim 11.
The printed circuit board is characterized in that the ground pattern is provided with the side ground area at an end of the ground area on the signal line through-hole side. In the printed circuit board according to claim 14.
The printed circuit board is characterized in that the ground through hole is provided at an end portion of the ground area on the signal line through hole side and an end portion of the ground area opposite to the signal line through hole.

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