JP2021152207A - Method for manufacturing thixomolding material - Google Patents

Abstract

To coat a magnesium alloy material with an increased amount of additive.SOLUTION: A method for manufacturing a thixomolding material for thixomolding includes a drying step of heating a mixture containing a first powder that contains Mg as a main component, a second powder, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a method for producing a material for thixomolding.

In recent years, parts made of magnesium alloy have been used in products such as automobiles, aircrafts, mobile phones, and laptop computers. Since magnesium has a higher specific strength than iron, aluminum, and the like, parts manufactured using a magnesium alloy can be lightweight and have high strength. Magnesium is also abundant near the surface of the earth, so it has an advantage in terms of resource availability.

Thixomolding is known as one of the methods for manufacturing parts made of magnesium. In thixomolding, a material whose fluidity has been increased by heating and shearing is injected into the mold, so that it is possible to mold thinner parts and parts with complicated shapes compared to the die casting method. Further, since the material is injected into the mold without coming into contact with the atmosphere, there is an advantage that the molded product can be molded without using a flame-retardant gas such as SF6.

For example, Patent Document 1 discloses a technique of coating the surface of a magnesium alloy material with carbon powder in order to improve the bending characteristics and tensile strength of a molded product by thixomolding. In Patent Document 1, 100 g, that is, 0.1% by mass of carbon black is added to 100 kg of magnesium alloy chips, and the two are mixed with a mixer to coat the surface of the magnesium alloy chips with carbon powder. ..

International Publication No. 2012/137907

The amount of additives such as carbon powder that coats the magnesium alloy material is preferably an amount that can realize the characteristics of the desired molded product. Therefore, it may be desired to coat the magnesium alloy material with more additives in order to achieve the desired molded product properties.

According to the first aspect of the present disclosure, a method for producing a material for thixomolding is provided. This production method is a drying step of heating a mixture containing a first powder containing Mg as a main component, a second powder, a binder, and an organic solvent to dry the organic solvent contained in the mixture. And a stirring step of stirring the mixture heated in the drying step.

It is the schematic which shows an example of the structure of an injection molding machine. It is a process drawing which shows the manufacturing method of the material for thixomolding. It is a figure which shows the evaluation result of the material for thixomolding.

A. Embodiment:
FIG. 1 is a schematic view showing an example of the configuration of an injection molding machine 1 used for thixomolding. Thixomolding is a method in which a material such as a chip-shaped material or powder is slurried by heating and shearing, and the slurry is injected without being exposed to the atmosphere to obtain a molded product having a desired shape. In thixomolding, the molded product is generally molded at a lower temperature than the die casting method or the like, and the structure of the molded product is likely to be uniformized. Therefore, molding a molded product by thixomolding can improve the mechanical strength and dimensional accuracy of the molded product. In addition, in this specification, when we simply say "molded article", we mean the article molded by thixomolding.

Molded products by thixomolding are used for parts and the like that make up various products. Molded products include, for example, parts for transportation equipment such as automobile parts, railroad vehicle parts, marine parts, and aircraft parts, as well as personal computer parts, mobile phone terminal parts, smartphone parts, and tablet terminal parts. , Used for various structures such as parts for wearable devices, parts for electronic devices such as parts for cameras, ornaments, artificial bones, and artificial tooth roots.

As shown in FIG. 1, the injection molding machine 1 includes a mold 2 for forming a cavity Cv, a hopper 5, a heating cylinder 7 having a heater 6, a screw 8, and a nozzle 9. When thixomolding is performed in the injection molding machine 1, the material is first charged into the hopper 5. The charged material is supplied from the hopper 5 to the heating cylinder 7. The material supplied to the heating cylinder 7 is sheared while being transferred by the screw 8 while being heated in the heating cylinder 7 by the heater 6 to form a slurry. The slurry is ejected through the nozzle 9 into the cavity Cv in the mold 2 without coming into contact with the atmosphere.

FIG. 2 is a process diagram showing a method for producing a thixomolding material in the present embodiment. The thixomolding material of the present embodiment is used as the above-mentioned thixomolding material.

First, in step S100, a mixture is produced. In step S100, a mixture containing magnesium (Mg) as a main component is produced by mixing the first powder, the second powder, the binder, and the organic solvent. The main component refers to the substance having the highest content among the substances contained in the first powder and the second powder.

The first powder refers to metal particles of an Mg alloy having a substantially spherical or scaly shape. The first powder is preferably produced by an atomizing method, and more preferably produced by a high-speed rotating water flow atomizing method. Examples of the atomizing method include a water atomizing method, a gas atomizing method, and the like, in addition to the high-speed rotating water flow atomizing method. Further, the first powder may be produced by a method other than the atomization method, and may be produced by, for example, a reduction method, a carbonyl method, or the like.

In the high-speed rotating water flow atomizing method, first, a coolant is ejected and supplied along the inner peripheral surface of the cooling cylinder, and then swirled along the inner peripheral surface of the cooling cylinder to form a coolant layer on the inner peripheral surface. do. Further, the raw material of the Mg alloy is melted, and the obtained molten metal is naturally dropped while a liquid or gas jet is sprayed onto the molten metal. As a result, the molten metal is scattered and miniaturized, and at the same time, it is blown off to the coolant layer and incorporated into the coolant layer. As a result, the scattered and micronized molten metal is rapidly cooled and solidified to obtain an Mg alloy powder. In the high-speed rotating water flow atomizing method, the raw material in the molten state is rapidly cooled in a short time, so that the crystal structure of the material becomes finer. As a result, a powder capable of molding a molded product having excellent mechanical properties can be obtained.

The pressure at the time of ejecting the coolant supplied to the cooling cylinder is preferably 50 MPa or more and 200 MPa or less. The temperature of the coolant is preferably −10 ° C. or higher and 40 ° C. or lower. As a result, the scattered molten metal is cooled appropriately and evenly in the coolant layer.

The melting temperature for melting the raw material of the Mg alloy is preferably set to Tm + 20 ° C. or higher and Tm + 200 ° C. or lower, and more preferably Tm + 50 ° C. or higher and Tm + 150 ° C. or lower with respect to the melting point Tm of the Mg alloy. As a result, the variation in characteristics among the particles constituting the Mg alloy powder can be suppressed to be particularly small.

In the high-speed rotating water flow atomizing method, for example, the particle size, tap density, average DAS, etc. of the produced Mg alloy powder can be adjusted by adjusting various conditions. "Average DAS" refers to the average dendrite secondary arm spacing. For example, the average DAS can be reduced by increasing the flow velocity or flow rate of the coolant. In addition, by adjusting the flow rate of the molten metal, the flow velocity of the jet of liquid or gas, or the flow velocity and flow rate of the coolant, the particle size, shape, thickness of the oxide layer, and tap density of the Mg alloy powder can be adjusted. Can be adjusted.

In the high-speed rotating water flow atomizing method, the molten metal may reach the cooling layer directly without using a liquid or gas jet. In this case, for example, the cooling housing is arranged so as to be inclined with respect to the direction of free fall of the molten metal. As a result, the molten metal reaches the coolant layer by free fall and is incorporated into the coolant layer. In the case of such a configuration, the molten metal is miniaturized by the flow of the coolant layer and is cooled and solidified to obtain an Mg alloy powder having a relatively large particle size.

The first powder may contain various additive components in addition to Mg which is the main component. The first powder may contain, for example, calcium (Ca) as an additive component. The inclusion of Ca in the first powder raises the ignition temperature of the first powder. Further, the first powder may contain aluminum (Al) as an additive component, for example. The addition of Al to the first powder lowers the melting point of the first powder.

The first powder may contain other components as additive components in addition to the above-mentioned Ca and Al. Examples of other components include rare earth elements such as lithium, beryllium, silicon, manganese, iron, nickel, copper, zinc, strontium, yttrium, zirconium, silver, tin, gold, and cerium. One or more of them may be added. As the other component, it is more preferable that at least one selected from the group consisting of manganese, yttrium, strontium, and rare earth elements is used. By adding these additive components to the Mg chip, the mechanical properties, corrosion resistance, abrasion resistance and thermal conductivity of the Mg chip can be improved.

The above-mentioned additive component may exist in the state of a simple substance, an oxide, an intermetallic compound or the like in, for example, a first powder or a material for thixomolding. Further, the additive component may be segregated at the grain boundaries of a metal structure such as Mg or Mg alloy in the first powder or thixomolding material, or may be uniformly dispersed.

A section obtained by cutting or cutting an Mg alloy cast in a mold or the like with respect to the above-mentioned first powder may be referred to as a chip. Examples of the chip include a 4 mm × 2 mm × 2 mm chip of AZ91D manufactured by STU, Ltd. This chip is an Mg alloy chip containing 9% by weight Al and 1% by weight Zn. The chips are sometimes called pellets.

In this embodiment, Tokai Carbon Co., Ltd.'s Seest "116" is used as the second powder. Seest "116" is a carbon black having an arithmetic mean particle size of 38 nm. The second powder may be, for example, other carbon black, ceramic powder, metal powder, or the like.

In this embodiment, Nippon Seiro paraffin wax "115" is used as the binder. As the binder, an organic binder other than paraffin wax "115" may be used. In this case, for example, a hydrocarbon resin-based hot melt adhesive may be used, or another type of organic binder may be used. Further, as the binder, an inorganic binder such as a binder containing an inorganic polymer such as an alkali silicate may be used.

In this embodiment, isopropanol (IPA) is used as the organic solvent. As the organic solvent, an organic solvent other than IPA may be used. In that case, it is preferable to use an organic solvent suitable for dispersing the organic binder. As the organic solvent, for example, acetone or the like can be used.

In the production of the thixomolding material, step S100 may be omitted. For example, the above-mentioned mixture in which the first powder, the second powder, the organic binder, and the organic solvent are mixed in advance may be prepared in advance, and the prepared mixture may be used in step S110 or later.

In step S110, the first drying step is performed. The drying step is a step of heating the mixture to dry the organic solvent contained in the mixture. The first drying step refers to the first drying step in the production of the thixomolding material of the present embodiment. The second drying step, the third drying step, and the fourth drying step, which will be described later, also refer to the second, third, and fourth drying steps, respectively.

In step S120, the first stirring step is performed. The stirring step is a step of stirring the mixture heated in the drying step. The first stirring step refers to the first stirring step in the production of the thixomolding material of the present embodiment. The second stirring step, the third stirring step, and the fourth stirring step, which will be described later, also refer to the second, third, and fourth stirring steps, respectively. In the stirring step, for example, the mixture may be directly stirred with a stirring rod, a stirrer, or the like, or the mixture in the container may be stirred by shaking the container containing the mixture.

In step S130, a second drying step is performed, and in step S140, a second stirring step is performed. Subsequently, in step S150, a third drying step is performed, and in step S160, a third stirring step is performed. Further, in step S170, a fourth drying step is performed, and in step S180, a fourth stirring step is performed.

By performing the above-mentioned first drying step to the fourth drying step and the first stirring step to the fourth stirring step, the second powder adheres to the first powder. The "adhesion" includes a state in which the second powder is directly attached to the first powder and a state in which the second powder is attached to the first powder via another element such as a binder. .. Further, the second powder may be adhered to the first powder in multiple layers. In the present embodiment, the second powder not only adheres directly to the first powder, but also adheres to the first powder via the binder, so that the second powder adheres to the first powder as compared with the case where the binder is not used. The amount of powder is improved. The state in which the second powder is attached to the first powder may be referred to as the state in which the second powder modifies the first powder. Further, the state in which the second powder is attached to the first powder may be referred to as the state in which the second powder covers the first powder.

In the present embodiment, as described above, the drying step and the stirring step are alternately performed a plurality of times. This makes it easier for the second powder to adhere to the first powder in multiple layers.

In step S190, a degreasing step is performed. The degreasing step is a step of heating the mixture to remove at least a part of the organic binder contained in the mixture. In the present embodiment, in the degreasing step, the mixture is heated at a degreasing temperature of 250 ° C. or higher and 450 ° C. or lower.

According to the method for producing a thixomolding material of the present embodiment described above, a stirring step of stirring a mixture containing a first powder, a second powder, a binder, and an organic solvent, and heating of the mixture are performed. A drying step of drying the organic solvent contained in the mixture is provided. Therefore, the amount of the second powder that modifies the first powder is improved as compared with the case where the binder is not used.

Further, in the present embodiment, the stirring step and the drying step are alternately performed a plurality of times. Therefore, the second powder is likely to adhere to the first powder in multiple layers, and the amount of the second powder that modifies the first powder is stable.

Further, in the present embodiment, the degreasing step is performed after the stirring step and the drying step are completed. Therefore, at the time of molding, the generation of gas derived from the binder from the thixomolding material is suppressed, and the molding accuracy of the molded product is improved.

Further, in the present embodiment, in the degreasing step, the mixture is heated at a temperature of 250 ° C. or higher and 450 ° C. or lower. As a result, in the degreasing step, the mixture is heated at a temperature lower than the melting point of Mg, so that the binder is effectively degreased and the thermal effect on the first powder is suppressed.

In another embodiment, in the production of the thixomolding material, the drying step and the stirring step do not have to be alternately performed four times. For example, the drying step and the stirring step may be performed once. Further, the number of drying steps and stirring steps may be 2 or 3 times, respectively, or 5 times or more. The number of times the drying step and the stirring step are repeated may be referred to as the number of repetitions. In the manufacturing method shown in FIG. 2, the number of repetitions is four. Further, for example, the drying step and the stirring step may be performed at the same time, and the stirring step may be performed a plurality of times or once while the drying step is continuously performed. Further, the timing of performing the stirring step may be determined experimentally.

In another embodiment, the degreasing temperature may be less than 250 ° C. or higher than 450 ° C. In this case, the degreasing temperature is preferably a temperature lower than the melting point of Mg. Further, for example, the degreasing step may not be performed. Even in this case, the amount of the second powder that modifies the surface of the first powder is improved as compared with the case where the binder is not used.

B. Evaluation results:
FIG. 3 is a diagram showing the evaluation results of the thixomolding material produced according to the production method shown in FIG. FIG. 3 shows the amount of the binder added and the amount of the second powder added in the mixing step, the drying temperature and the drying time in the drying step, and the stirring step and the drying step when the material for thixomolding as a sample was produced. The number of repetitions of the above, and the degreasing temperature and degreasing time in the degreasing step are shown. Further, FIG. 3 shows the adhesion amount of the second powder, the adhesion ratio of the second powder, and the residual binder weight in the produced thixomolding material. Details of the adhesion amount, adhesion ratio, and residual binder weight of the second powder will be described later.

Samples 1 to 8 were produced according to the production method shown in FIG. Samples having a number of repetitions other than 4 were also produced through the same steps as the production method shown in FIG. 2, except that the number of repetitions was different. First, in the mixing step of step S100, the mixture is charged by putting 500 g of the first powder, the second powder, and a binder dispersed in 35 ml of an organic solvent into a container with a lid that has been kept warm at the mixing temperature by a constant temperature bath. Generated. The input amounts of the second powder and the binder are shown in FIG. 3 as a ratio to the first powder for each sample. For example, in sample 1, since the amount of the second powder added is 10%, the mass of the added second powder is 50 g.

The first powder was obtained by melting the raw material in a high-frequency induction furnace and pulverizing it by a high-speed rotating water flow atomizing method. At this time, the ejection pressure of the coolant was 100 MPa, the temperature of the coolant was 30 ° C, and the temperature of the molten metal was the melting point of the raw material + 20 ° C. The obtained first powder contained 9.5% by mass of aluminum, 0.25% by mass of calcium, and Mg as a main component in the balance. As the second powder, a sheath manufactured by Tokai Carbon Co., Ltd. and "116" were used. As the binder, Nippon Seiro paraffin wax "115" was used. IPA was used as the organic solvent.

Next, as steps corresponding to steps S110 to S180 shown in FIG. 2, a drying step and a stirring step were performed. Specifically, in the drying step, the organic solvent of the mixture is dried by keeping the temperature of the mixture at the drying temperature and allowing the drying time to elapse while the lid of the container with a lid placed in the constant temperature bath is opened. I let you. In the drying step, the time per drying step was determined by dividing the time of each drying step by the number of repetitions. For example, in sample 1, since the number of repetitions is 4, each time from the first drying step to the fourth drying step is set to one-fourth of the drying time in the entire drying step. Specifically, in sample 1, since the drying time is 120 minutes, each time of the first drying step to the fourth drying step is 30 minutes. In sample 5, the drying time is 240 minutes and the number of repetitions is 6, so that each time from the first drying step to the sixth drying step is 40 minutes. The drying time and drying temperature in the entire drying process are shown in FIG. 3 for each sample.

Further, as a stirring step, a stirring step was performed as many times as the number of repetitions. Specifically, in the sample having the number of repetitions of 2 or more, each of the stirring steps was performed after each of the drying steps was completed. For example, in sample 1, after each of the first drying step to the fourth drying step was completed, each of the first stirring step to the fourth stirring step was performed. In Sample 5, after each of the first drying step to the sixth drying step was completed, each of the first stirring step to the sixth stirring step was performed. In the stirring step, the mixture in the container with the lid was stirred by closing the lid of the container with the lid and shaking the container with the lid.

In the production of the sample shown in FIG. 3 in which the number of repetitions was one, the drying step and the stirring step were performed at the same time. For example, in sample 4, while one 120-minute drying step was continuously performed, one 120-minute stirring step was continuously performed.

Further, after the drying step and the stirring step were completed, the same degreasing step as in step S190 was performed. Specifically, in the degreasing step, the sample was degreased by heating it in an electric furnace. The degreasing temperature and degreasing time in the degreasing step are shown in FIG. 3 for each sample. In the production of sample 3, the degreasing step was not executed after the drying step and the stirring step were completed.

Samples 9 to 12 were produced without using a binder. That is, in the production of Samples 9 to 12, as a step corresponding to step S100 in FIG. 2, a step of mixing only the first powder, the second powder, and the organic solvent was performed. After that, the steps after step S110 were carried out in the same manner as in the case of producing the sample 8 from the sample 1 to obtain the sample 12 from the sample 9. In the production of sample 10, the degreasing step was not executed after the drying step and the stirring step were completed.

The adhering amount of the second powder in FIG. 3 refers to the ratio of the mass of the second powder adhering to the first powder to the mass Mp1 of the charged first powder. The adhesion ratio of the second powder refers to the ratio of the mass of the second powder adhered to the first powder to the mass Mp2 of the charged second powder.

The adhering amount and adhering ratio of the second powder were evaluated by measuring the mass of the thixomolding material before and after washing. Specifically, first, the mass of the thixomolding material immediately after being manufactured according to the above-mentioned manufacturing method was measured as the mass M1 before cleaning. Then, the thixomolding material was impregnated with acetone, washed with an ultrasonic cleaner for 10 minutes, dried, and then the mass of the thixomolding material was measured, and this mass was defined as the mass M2 after washing. At this time, the amount of the second powder adhered is represented by (M2-M1) / Mp1 × 100%. The adhesion ratio of the second powder is represented by (M2-M1) / Mp2 × 100%. For example, when an organic binder other than paraffin wax "115" is used for producing the sample, the cleaning agent for cleaning the sample does not have to be acetone. In this case, as the cleaning agent, a cleaning agent capable of cleaning the binder and the second powder without reacting with the first powder is used.

As shown in FIG. 3, comparing Samples 1 to 6 and Samples 9 to 12 in which the input amount of the second powder is 10% by mass, the adhesion amount and the adhesion ratio in Samples 1 to 6 are compared. Was larger than the adhesion amount and adhesion ratio in Samples 9 to 12. Further, when comparing the sample 7 and the sample 12 in which the input amount of the second powder was 20% by mass, the adhesion amount and the adhesion ratio in the sample 7 were larger than the adhesion amount and the adhesion ratio in the sample 12. Further, the input amount of the second powder in the sample 8 is larger than the input amount of the second powder in the samples 9 to 12, but the adhesion amount and the adhesion ratio in the sample 8 are the adhesion amount and the adhesion in the samples 9 to 12. It was greater than the percentage. Further, when the samples 1 to 8 were compared, the adhesion amount of 92% or more was realized even when the input amount of the second powder was increased.

In Samples 1 to 8, it is presumed that the adhesion amount and the adhesion ratio became larger than the adhesion amount and the adhesion ratio in Samples 9 to 12 because the second powder adhered to the first powder via the binder. ..

From the above experimental results, in the sample produced according to the production method of the above embodiment, the amount of the second powder that modifies the surface of the first powder is improved as compared with the sample produced by the method without using the binder. Was confirmed.

The residual binder weight in FIG. 3 was evaluated by measuring the thermogravimetric change of the first powder to which the second powder was attached. Specifically, the weight of the thixomolding material immediately after being produced according to the above-mentioned production method was measured while heating the material. A differential thermal / thermogravimetric simultaneous measuring device (TGA / DSC1LF manufactured by METTLER TOLEDO was used, and the temperature rising rate was 10 [° C./sec] for heating and measuring the weight of the thixomolding material. The gas derived from the binder contained in the thixomolding material is generated, and the weight of the thixomolding material is reduced. When the thixomolding material is further heated, the oxidation of the first powder is started and the weight is increased. The difference between the weight when heated at 200 ° C. and the minimum weight when heated at 400 ° C. to 450 ° C. was defined as the residual binder weight. In FIG. 3, the residual binder weight is 3% or less of the weight of the thixomolding material before heating. The case was judged as "A", and the case exceeding 3% was judged as "B".

Comparing Samples 1 to 8 to which the binder was added as shown in FIG. 3, Samples 1 and 2 in which the degreasing step was performed, and Samples 4 to 8 in which the degreasing step was not performed were found in Sample 3 in which the degreasing step was not performed. In comparison, it was confirmed that the amount of residual binder was low.

In Sample 1, Sample 2, and Samples 4 to 8, it is presumed that the amount of gas generated by heating the thixomolding material was reduced by performing the degreasing step at a degreasing temperature of 250 ° C. or higher. ..

The thixomolding material is charged into the injection molding machine 1, and the chips are melted in the injection molding machine. If the generation of gas derived from the binder can be suppressed as described above, it is possible to suppress the increase in pressure in the injection molding machine such as the heating cylinder 7.

C. Other forms:
The present disclosure is not limited to the above-described embodiment, and can be realized in various forms without departing from the spirit thereof. For example, the present disclosure can also be realized in the following forms. The technical features in each of the embodiments described below correspond to the technical features in the above embodiments in order to solve some or all of the problems of the present disclosure, or some or all of the effects of the present disclosure. It is possible to replace or combine as appropriate to achieve the above. Further, if the technical feature is not described as essential in the present specification, it can be deleted as appropriate.

(1) According to the first aspect of the present disclosure, a method for producing a material for thixomolding is provided. In this method for producing a thixomolding material, a mixture containing a first powder containing Mg as a main component, a second powder, a binder, and an organic solvent is heated, and the organic solvent contained in the mixture is heated. It is provided with a drying step of drying the mixture and a stirring step of stirring the mixture heated in the drying step.
According to such a form, the amount of the second powder that modifies the surface of the first powder is improved as compared with the case where the organic binder is not used.

(2) In the method for producing a thixomolding material of the above embodiment, the second powder may contain C as a main component. According to such a form, even when the second powder contains C as a main component, the amount of the second powder that modifies the surface of the first powder is improved.

(3) In the method for producing a thixomolding material of the above embodiment, the drying step and the stirring step may be alternately performed a plurality of times. According to such a form, the second powder is likely to adhere to the first powder in multiple layers, and the amount of the second powder that modifies the first powder is stable.

(4) In the method for producing a thixomolding material of the above embodiment, the drying step and the stirring step may be performed at the same time. According to such a form, the drying step and the stirring step can be efficiently performed by a simple method, so that the thixomolding material in which the amount of the second powder that modifies the surface of the first powder is improved can be efficiently used. Can be manufactured in.

(5) In the method for producing a thixomolding material of the above embodiment, after the completion of the stirring step and the drying step, a degreasing step of heating the mixture to remove at least a part of the binder contained in the mixture is performed. You may go. According to such a form, the generation of gas derived from the binder from the thixomolding material is suppressed at the time of molding, and the molding accuracy of the molded product is improved. Further, when the powder-modified magnesium alloy chip of the above form is used for a molded product manufactured by an injection molding method, it is derived from a binder in an injection molding machine such as a heating cylinder 7 in a step of melting the chip in the injection molding machine. It is possible to suppress the generation of gas. In this case, it is possible to prevent the pressure inside the injection molding machine from rising due to the generation of gas.

(6) In the method for producing a thixomolding material of the above embodiment, the mixture may be heated at a temperature of 250 ° C. or higher and 450 ° C. or lower in the degreasing step. According to such a form, since the mixture is heated at a temperature lower than the melting point of Mg, the binder is effectively degreased and the thermal effect on the first powder is suppressed.

The present disclosure is not limited to the above-mentioned mixed materials for thixomolding, and can be realized in various aspects. For example, it can be realized in the form of a molded product containing a mixed material for thixomolding.

1 ... injection molding machine, 2 ... mold, 5 ... hopper, 6 ... heater, 7 ... heating cylinder, 8 ... screw, 9 ... nozzle.

Claims (6)

A method of manufacturing materials for thixomolding,
A drying step of heating a mixture containing a first powder containing Mg as a main component, a second powder, a binder, and an organic solvent to dry the organic solvent contained in the mixture.
A stirring step of stirring the mixture heated in the drying step, and a stirring step of stirring the mixture.
A degreasing step of removing at least a part of the binder contained in the mixture is provided.
A method for manufacturing materials for thixomolding. The method for producing a thixomolding material according to claim 1.
The second powder is a method for producing a material for thixomolding, which contains C as a main component. The method for producing a thixomolding material according to claim 1 or 2.
A method for producing a material for thixomolding, in which the drying step and the stirring step are alternately performed a plurality of times. The method for producing a thixomolding material according to claim 1 or 2.
A method for producing a material for thixomolding, in which the drying step and the stirring step are performed at the same time. The method for producing a thixomolding material according to any one of claims 1 to 4.
A method for producing a material for thixomolding, in which the mixture is heated at a temperature of 250 ° C. or higher in the degreasing step. The method for producing a thixomolding material according to claim 5.
A method for producing a material for thixomolding, in which the mixture is heated at a temperature of 450 ° C. or lower in the degreasing step.

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