JP2021151741A - Mold - Google Patents

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JP2021151741A
JP2021151741A JP2020052980A JP2020052980A JP2021151741A JP 2021151741 A JP2021151741 A JP 2021151741A JP 2020052980 A JP2020052980 A JP 2020052980A JP 2020052980 A JP2020052980 A JP 2020052980A JP 2021151741 A JP2021151741 A JP 2021151741A
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movable piece
mold
molding
base
piece
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JP7483439B2 (en
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晃 庭山
Akira Niwayama
晃 庭山
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Enplas Corp
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Enplas Corp
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Abstract

To provide a mold that can measure mold release resistance without using an ejector mechanism.SOLUTION: The present invention relates to a mold to be mounted on a base of a molding machine, the mold comprising: a plate-shaped movable piece having a base side facing the base and a molding side opposite the base side; a molding die disposed on the molding side of the movable piece so that an edge portion of the movable piece is exposed; a movable piece receiving body disposed opposite the molding side of the edge portion of the movable piece and mounted to the base; and a pressure sensor disposed between the edge portion of the movable piece and the movable piece receiving body. The movable piece is positioned on the base side during molding and is positioned on the movable piece receiving body during demolding.SELECTED DRAWING: Figure 1

Description

本発明は、金型に関する。 The present invention relates to a mold.

一般に、金型を用いて成形品を製造する際の離型性を評価するためには、金型から成形品を離型するときの離型抵抗を測定している。例えば、特許文献１には、金型から成形品を離型するときのエジェクタピンの突き出し力を離型抵抗として、圧力センサを用いて測定することが記載されている。 Generally, in order to evaluate the mold releasability when a molded product is manufactured using a mold, the mold releasability when the molded product is released from the mold is measured. For example, Patent Document 1 describes that the ejection force of an ejector pin when a molded product is released from a mold is measured as a mold release resistance by using a pressure sensor.

特開２０１５−０２５７６６号公報Japanese Unexamined Patent Publication No. 2015-0257666

しかし、エジェクタピンなどのエジェクタ機構を用いる離型方式では、離型時に成形品の機能面を破損させる虞があるため、成形品の機能面となる位置にエジェクタ機構を配置できず、離型抵抗を測定できない場合がある。
そこで本発明は、エジェクタ機構を用いずに離型抵抗を測定することができる金型の提供を目的とする。 However, in the mold release method using an ejector mechanism such as an ejector pin, the ejector mechanism cannot be arranged at a position that becomes the functional surface of the molded product because the functional surface of the molded product may be damaged at the time of mold release, and the mold release resistance. May not be measured.
Therefore, an object of the present invention is to provide a mold capable of measuring a mold release resistance without using an ejector mechanism.

上記の課題を解決するための、本発明に関する金型は、成形機の基台に取り付けられる金型であって、基台に対向する基台側面、及び前記基台側面と反対側の成形側面を有する板状の可動駒、前記可動駒の成形側面に、前記可動駒の縁部が露出するように配置されている成形型、前記可動駒の縁部の成形側面に対向するように配置され、かつ前記基台に取り付けられている可動駒受け体、並びに前記可動駒の縁部と前記可動駒受け体との間に配置されている圧力センサを備え、前記可動駒は、成形時に基台側に位置し、離型時に可動駒受け体側に位置する。 The mold according to the present invention for solving the above problems is a mold attached to a base of a molding machine, and is a base side surface facing the base and a molding side surface opposite to the base side surface. A plate-shaped movable piece having a It is provided with a movable piece receiver attached to the base and a pressure sensor arranged between the edge of the movable piece and the movable piece receiver, and the movable piece is located on the base side at the time of molding. , Located on the movable piece receiver side when the mold is released.

本発明の金型によれば、エジェクタ機構を用いずに離型抵抗を測定することができる。 According to the mold of the present invention, the mold release resistance can be measured without using the ejector mechanism.

図１は、本発明の実施の形態の金型の概略断面図であり、成形機の上基台に取り付けられているときの様子を示す図である。FIG. 1 is a schematic cross-sectional view of a mold according to an embodiment of the present invention, and is a view showing a state when the mold is attached to an upper base of a molding machine. 図２は、実施の形態の金型（上金型）の分解斜視図である。FIG. 2 is an exploded perspective view of the mold (upper mold) of the embodiment. 図３は、実施の形態の金型の概略断面図であり、（Ａ）は成形時の様子を示す図、（Ｂ）は離型時の様子を示す図である。3A and 3B are schematic cross-sectional views of the mold of the embodiment, FIG. 3A is a view showing a state at the time of molding, and FIG. 3B is a view showing a state at the time of mold release.

以下、本発明の実施の形態について、図面を参照して詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図１に示すように、実施の形態の金型１は、上金型として、上温調駒３ａ及び上金型取り付け駒５ａを介して、可動側基台である成形機の上基台７ａに取り付けられている。下金型９は、下温調駒３ｂ及び下金型取り付け駒５ｂを介して、固定側基台である成形機の下基台７ｂに取り付けられている。 As shown in FIG. 1, the mold 1 of the embodiment is an upper base 7a of a molding machine which is a movable side base via an upper temperature adjusting piece 3a and an upper mold mounting piece 5a as an upper mold. It is attached to. The lower mold 9 is attached to the lower base 7b of the molding machine, which is a fixed side base, via the lower temperature adjusting piece 3b and the lower mold mounting piece 5b.

上温調駒３ａ及び下温調駒３ｂは、電気加熱要素や冷却媒体など（図示せず）をそれぞれ備え、金型１及び下金型９を加熱又は冷却する。
上金型取り付け駒５ａ及び下金型取り付け駒５ｂは、例えば、成形品を製造する際の成形機からの荷重に耐え得る、炭素工具鋼、合金工具鋼、高速度工具鋼のような金属材料から形成されている。炭素工具鋼は、ＪＩＳ Ｇ４４０１ ２００９に規定され、合金工具鋼及び高速度工具鋼は、ＪＩＳ Ｇ４４０３ ２０１５にそれぞれ規定されている。 The upper temperature control piece 3a and the lower temperature control piece 3b are provided with an electric heating element, a cooling medium, and the like (not shown), respectively, and heat or cool the mold 1 and the lower mold 9.
The upper mold mounting piece 5a and the lower mold mounting piece 5b are metal materials such as carbon tool steel, alloy tool steel, and high-speed tool steel that can withstand a load from a molding machine when manufacturing a molded product, for example. Is formed from. Carbon tool steel is specified in JIS G4401 2009, and alloy tool steel and high speed tool steel are specified in JIS G4403 2015, respectively.

実施の形態の金型１である上金型は、板状の可動駒１１と、成形型１３と、可動駒受け体１５と、圧力センサ１７とを備えている。 The upper mold, which is the mold 1 of the embodiment, includes a plate-shaped movable piece 11, a molding mold 13, a movable piece receiver 15, and a pressure sensor 17.

板状の可動駒１１は、上基台７ａに対向する基台側面１９、及び基台側面１９と反対側の成形側面２１を有する。板状の可動駒１１のサイズは、例えば、１０ｍｍ〜３００ｍｍ×３０ｍｍ〜３００ｍｍ×１ｍｍ〜３０ｍｍ（縦×横×厚さ）である。可動駒１１は、例えば、上述したような金属材料から形成されている。 The plate-shaped movable piece 11 has a base side surface 19 facing the upper base 7a and a molding side surface 21 opposite to the base side surface 19. The size of the plate-shaped movable piece 11 is, for example, 10 mm to 300 mm × 30 mm to 300 mm × 1 mm to 30 mm (length × width × thickness). The movable piece 11 is formed of, for example, a metal material as described above.

可動駒１１の基台側面１９は、可動駒１１が後述する弾性部材（スプリング）２３によって上基台７ａ側に向けて持ち上げられているため、上金型取り付け駒５ａに接触している。 The base side surface 19 of the movable piece 11 is in contact with the upper mold mounting piece 5a because the movable piece 11 is lifted toward the upper base 7a side by an elastic member (spring) 23 described later.

可動駒１１の成形側面２１には、可動駒１１の縁部２５が露出するように成形型１３が配置されている。 A molding die 13 is arranged on the molding side surface 21 of the movable piece 11 so that the edge portion 25 of the movable piece 11 is exposed.

可動駒１１の縁部２５には、上基台７ａ側に向かって凹んでいる可動駒側位置決め溝２７が形成されている。可動駒側位置決め溝２７は、可動駒１１の基台側面１９と成形側面２１に平行な溝壁２７ａ、及び溝壁２７ａと可動駒１１の成形側面２１に垂直に交わる側壁２７ｂを有する。 The edge 25 of the movable piece 11 is formed with a movable piece side positioning groove 27 that is recessed toward the upper base 7a side. The movable piece side positioning groove 27 has a groove wall 27a parallel to the base side surface 19 of the movable piece 11 and the molding side surface 21, and a side wall 27b perpendicularly intersecting the groove wall 27a and the molding side surface 21 of the movable piece 11.

成形型１３は、上成形型として、上成形型本体２９と、成形型取り付け駒３１とを備えている。上成形型本体２９は、成形型取り付け駒３１によって、可動駒１１の成形側面２１に着脱自在に設けられている。上成形型本体２９の表面３３には、微細な凹凸を有する微細パターンが形成されている。微細な凹凸は、例えば、０．１μｍ〜１０００μｍの凹凸である。 The molding die 13 includes an upper molding die main body 29 and a molding die mounting piece 31 as the upper molding die. The upper molding mold main body 29 is detachably provided on the molding side surface 21 of the movable piece 11 by the molding mold mounting piece 31. A fine pattern having fine irregularities is formed on the surface 33 of the upper molding main body 29. The fine unevenness is, for example, an unevenness of 0.1 μm to 1000 μm.

可動駒受け体１５は、可動駒１１の縁部２５の成形側面２１に対向するように配置され、受け体取り付け部材３５、上金型取り付け駒５ａ、及び上温調駒３ａを介して上基台７ａに取り付けられている。具体的には、可動駒受け体１５は、上金型取り付け駒５ａに取り付けられた受け体取り付け部材３５に、可動駒受け体１５の下基台側面３７から、上基台７ａに向けてネジ止めすることによって、上基台７ａに取り付けられている。可動駒受け体１５は、例えば、上述したような金属材料から形成されている。 The movable piece receiving body 15 is arranged so as to face the molding side surface 21 of the edge portion 25 of the movable piece 11, and is placed on the upper base via the receiving body mounting member 35, the upper mold mounting piece 5a, and the upper temperature adjusting piece 3a. It is attached to the base 7a. Specifically, the movable piece receiver 15 is screwed onto the receiver mounting member 35 attached to the upper mold mounting piece 5a from the lower base side surface 37 of the movable piece receiver 15 toward the upper base 7a. By stopping, it is attached to the upper base 7a. The movable piece receiver 15 is formed of, for example, a metal material as described above.

可動駒受け体１５の上基台側面３９には、下基台７ｂ側に向かって凹んでいる受け体側位置決め溝４１が形成されている。受け体側位置決め溝４１は、可動駒受け体１５の上基台側面３９に平行な溝壁４１ａ、及び溝壁４１ａと可動駒受け体１５の上基台側面３９に垂直に交わる側壁４１ｂを有する。受け体側位置決め溝４１の溝壁４１ａは、可動駒側位置決め溝２７の溝壁２７ａと平行に位置しており、受け体側位置決め溝４１の側壁４１ｂは、可動駒側位置決め溝２７の側壁２７ｂの直線上に位置している。 On the upper base side surface 39 of the movable piece receiver 15, a receiver side positioning groove 41 that is recessed toward the lower base 7b side is formed. The receiving body side positioning groove 41 has a groove wall 41a parallel to the upper base side surface 39 of the movable piece receiver 15 and a side wall 41b perpendicularly intersecting the groove wall 41a and the upper base side surface 39 of the movable piece receiver 15. The groove wall 41a of the receiving side positioning groove 41 is located parallel to the groove wall 27a of the movable piece side positioning groove 27, and the side wall 41b of the receiving side positioning groove 41 is a straight line of the side wall 27b of the movable piece side positioning groove 27. Located on top.

圧力センサ１７は、可動駒１１の縁部２５と、可動駒受け体１５との間に配置されている。具体的には、圧力センサ１７は、可動駒受け体１５の受け体側位置決め溝４１の溝壁４１ａ上に配置されている。圧力センサ１７は、離型荷重に耐え得るセンサであり、例えば、ひずみゲージ式、金属ゲージ式、半導体ゲージ式、半導体隔膜式のような圧力センサである。圧力センサ１７は、検出した圧力信号を外部に出力するために、配線が上金型から外部に向かって延び出している（図２）。 The pressure sensor 17 is arranged between the edge portion 25 of the movable piece 11 and the movable piece receiver 15. Specifically, the pressure sensor 17 is arranged on the groove wall 41a of the receiving side positioning groove 41 of the movable piece receiving body 15. The pressure sensor 17 is a sensor that can withstand a release load, and is, for example, a pressure sensor such as a strain gauge type, a metal gauge type, a semiconductor gauge type, or a semiconductor diaphragm type. In the pressure sensor 17, the wiring extends outward from the upper mold in order to output the detected pressure signal to the outside (FIG. 2).

圧力センサ１７の上には、可動駒位置決め体４３が配置され、可動駒１１の可動駒側位置決め溝２７と、可動駒受け体１５の受け体側位置決め溝４１に挿入されている。
可動駒位置決め体４３は、断面視においてＨ字形状を有し、圧力センサ１７上に配置されているウェブ４５と、ウェブ４５の両端部から上基台７ａ及び下基台７ｂ側にそれぞれ延出している２つのフランジ４７とを有する。 A movable piece positioning body 43 is arranged on the pressure sensor 17, and is inserted into the movable piece side positioning groove 27 of the movable piece 11 and the receiver side positioning groove 41 of the movable piece receiver 15.
The movable piece positioning body 43 has an H-shape in cross-sectional view, and extends from both ends of the web 45 arranged on the pressure sensor 17 to the upper base 7a and the lower base 7b, respectively. It has two flanges 47 and 47.

可動駒位置決め体４３のウェブ４５は、圧力センサ１７に接触している。
可動駒位置決め体４３の２つのフランジ４７は、可動駒側位置決め溝２７の側壁２７ｂと受け体側位置決め溝４１の側壁４１ｂに沿って接触しているが、可動駒側位置決め溝２７の溝壁２７ａと、受け体側位置決め溝４１の溝壁４１ａには接触していない。 The web 45 of the movable piece positioning body 43 is in contact with the pressure sensor 17.
The two flanges 47 of the movable piece positioning body 43 are in contact with the side wall 27b of the movable piece side positioning groove 27 along the side wall 41b of the receiver side positioning groove 41, but are in contact with the groove wall 27a of the movable piece side positioning groove 27. , It is not in contact with the groove wall 41a of the receiving side positioning groove 41.

可動駒位置決め体４３は、圧力センサ１７に接触しているウェブ４５を有するため、可動駒１１から可動駒位置決め体４３に荷重が加えられた場合、その荷重を圧力センサ１７に伝えることができる。
また、可動駒位置決め体４３は、可動駒側位置決め溝２７の側壁２７ｂと受け体側位置決め溝４１の側壁４１ｂに沿って接触している２つのフランジ４７を有するため、可動駒１１が上基台７ａと平行方向にずれることを抑制又は防止して、成形不良の発生を抑制又は防止することができる。 Since the movable piece positioning body 43 has a web 45 in contact with the pressure sensor 17, when a load is applied from the movable piece 11 to the movable piece positioning body 43, the load can be transmitted to the pressure sensor 17.
Further, since the movable piece positioning body 43 has two flanges 47 that are in contact with each other along the side wall 27b of the movable piece side positioning groove 27 and the side wall 41b of the receiver side positioning groove 41, the movable piece 11 has an upper base 7a. It is possible to suppress or prevent the deviation in the direction parallel to the above, and to suppress or prevent the occurrence of molding defects.

可動駒位置決め体４３の２つのフランジ４７の可動駒１１側の間には、弾性部材であるスプリング２３が配置されている。スプリング２３は、可動駒１１の受け体側位置決め溝２７の溝壁２７ａと可動駒位置決め体４３のウェブ４５とに接触して、可動駒１１を上基台７ａ側に向けて持ち上げ、上金型取り付け駒５ａに接触させている。
スプリング２３は、可動駒１１を上基台７ａ側に向けて持ち上げ、上金型取り付け駒５ａに接触させることにより、可動駒１１が上金型取り付け駒５ａに接触していない場合と比較して、上温調駒３ａによる成形型１３の加熱又は冷却の際の温度ロスを低減させ、成形型１３の温度変化を短時間で行うことができるため、成形品の製造時間を短縮することができる。 A spring 23, which is an elastic member, is arranged between the movable piece 11 side of the two flanges 47 of the movable piece positioning body 43. The spring 23 comes into contact with the groove wall 27a of the receiving side positioning groove 27 of the movable piece 11 and the web 45 of the movable piece positioning body 43, lifts the movable piece 11 toward the upper base 7a side, and attaches the upper mold. It is in contact with the piece 5a.
The spring 23 lifts the movable piece 11 toward the upper base 7a side and brings it into contact with the upper mold mounting piece 5a, so that the movable piece 11 is not in contact with the upper mold mounting piece 5a as compared with the case where the movable piece 11 is not in contact with the upper mold mounting piece 5a. Since the temperature loss during heating or cooling of the molding die 13 by the upper temperature adjusting piece 3a can be reduced and the temperature of the molding die 13 can be changed in a short time, the manufacturing time of the molded product can be shortened. ..

下金型９は、下成形型として、下成形型本体４９と、成形型取り付け駒５１とを備えている。下成形型本体４９は、成形型取り付け駒５１によって、下金型取り付け駒５ｂ上に着脱自在に設けられている。下成形型本体４９の表面５３には、上成形型本体２９の表面３３の凹凸パターンに対応する微細パターンが形成されている。 The lower mold 9 includes a lower molding mold main body 49 and a molding mold mounting piece 51 as a lower molding mold. The lower mold main body 49 is detachably provided on the lower mold mounting piece 5b by the molding mold mounting piece 51. On the surface 53 of the lower molding main body 49, a fine pattern corresponding to the uneven pattern of the surface 33 of the upper molding main body 29 is formed.

このような実施の形態の金型１は、例えば、溶融微細転写プロセスに用いることができる。溶融微細転写プロセスに用いられる材料は、例えば、アクリル樹脂、ポリカーボネート（ＰＣ）、シクロオレフィンポリマー（ＣＯＰ）、ポリ塩化ビニル（ＰＶＣ）、ＡＢＳ樹脂のような熱可塑性樹脂である。 The mold 1 of such an embodiment can be used, for example, in a melt microtransfer process. Materials used in the melt microtransfer process are, for example, thermoplastic resins such as acrylic resins, polycarbonates (PCs), cycloolefin polymers (COPs), polyvinyl chlorides (PVCs), and ABS resins.

続いて、実施の形態の金型１の組み立てについて、図２を参照して説明する。
最初に、上金型取り付け駒５ａと、受け体取り付け部材３５を用意し、上金型取り付け駒５ａの長手方向の両端部に、受け体取り付け部材３５を取り付ける。 Subsequently, the assembly of the mold 1 of the embodiment will be described with reference to FIG.
First, the upper mold mounting piece 5a and the receiving body mounting member 35 are prepared, and the receiving body mounting members 35 are attached to both ends of the upper mold mounting piece 5a in the longitudinal direction.

次に、可動駒１１と、上成形型本体２９と、成形型取り付け駒３１を用意し、可動駒１１の成形側面２１に、上成形型本体２９を縁部２５が露出するように、成形型取り付け駒３１を用いて取り付ける。言い換えると、可動駒１１の成形側面２１に、縁部２５が露出するように成形型１３を取り付ける。 Next, the movable piece 11, the upper molding mold main body 29, and the molding mold mounting piece 31 are prepared, and the upper molding mold main body 29 is exposed on the molding side surface 21 of the movable piece 11 so that the edge portion 25 is exposed. It is attached using the attachment piece 31. In other words, the molding die 13 is attached to the molding side surface 21 of the movable piece 11 so that the edge portion 25 is exposed.

次に、成形型１３を取り付けた可動駒１１と、スプリング２３と、可動駒位置決め体４３と、圧力センサ１７と、可動駒受け体１５とを用意する。
可動駒１１の受け体側位置決め溝２７に、スプリング２３を配置し、可動駒位置決め体４３を挿入し、可動駒位置決め体４３の２つのフランジ４７の間に圧力センサ１７を配置する。続いて、可動駒受け体１５を、可動駒１１の受け体側位置決め溝２７に挿入した可動駒位置決め体４３が、可動駒受け体１５の受け体側位置決め溝４１（図２において図示せず）に挿入するように配置し、受け体取り付け部材３５を介して、上金型取り付け駒５ａに取り付ける。このようにして、実施の形態の金型１を組み立てることができる。
実施の形態の金型１は、上温調駒３ａを介して成形機の上基台７ａ（図２において図示せず）に取り付けられる。 Next, a movable piece 11 to which the molding die 13 is attached, a spring 23, a movable piece positioning body 43, a pressure sensor 17, and a movable piece receiver 15 are prepared.
The spring 23 is arranged in the receiving side positioning groove 27 of the movable piece 11, the movable piece positioning body 43 is inserted, and the pressure sensor 17 is arranged between the two flanges 47 of the movable piece positioning body 43. Subsequently, the movable piece positioning body 43 in which the movable piece receiving body 15 is inserted into the receiving side positioning groove 27 of the movable piece 11 is inserted into the receiving side positioning groove 41 (not shown in FIG. 2) of the movable piece receiving body 15. It is arranged so as to be attached to the upper mold mounting piece 5a via the receiving body mounting member 35. In this way, the mold 1 of the embodiment can be assembled.
The mold 1 of the embodiment is attached to the upper base 7a (not shown in FIG. 2) of the molding machine via the upper temperature control piece 3a.

以下に、実施の形態の金型１による成形品の離型抵抗の測定について、図３を参照して説明する。なお、図３は、溶融微細転写プロセスによって熱可塑性樹脂製の成形品を製造している。 The measurement of the mold release resistance of the molded product by the mold 1 of the embodiment will be described below with reference to FIG. In addition, FIG. 3 shows that a molded product made of a thermoplastic resin is manufactured by a melt fine transfer process.

最初に、図１に示すように、実施の形態の金型１を、上温調駒３ａ及び上金型取り付け駒５ａを介して成形機の上基台７ａに取り付け、下金型９を、下温調駒３ｂ及び下金型取り付け駒５ｂを介して成形機の下基台７ｂに取り付ける。 First, as shown in FIG. 1, the mold 1 of the embodiment is attached to the upper base 7a of the molding machine via the upper temperature adjusting piece 3a and the upper mold mounting piece 5a, and the lower mold 9 is attached. It is attached to the lower base 7b of the molding machine via the lower temperature control piece 3b and the lower mold mounting piece 5b.

次に、上温調駒３ａ及び下温調駒３ｂを用いて金型１及び下金型９を加温し、下金型９の下成形型本体４９の表面５３上に、熱可塑性樹脂をスクリュー等で可塑化した樹脂材料５５を塗布する。 Next, the mold 1 and the lower mold 9 are heated by using the upper temperature control piece 3a and the lower temperature control piece 3b, and the thermoplastic resin is put on the surface 53 of the lower mold main body 49 of the lower mold 9. The resin material 55 plasticized with a screw or the like is applied.

続いて、樹脂材料５５を成形するために、成形機の上基台７ａを下基台７ｂに向けて下降させ、上成形型本体２９の表面３３を樹脂材料５５に接触させると、成形型１３及び可動駒１１は、樹脂材料５５から上基台７ａ方向の力、すなわち反作用の力を受ける。このため、可動駒１１は、成形時に上基台７ａ側に位置する（図３（Ａ））。言い換えると、可動駒１１は、成形時にスプリング２３の有無によらず上基台７ａ側に位置している。
このとき、圧力センサ１７には、可動駒１１が上基台７ａ側に位置しているため、可動駒１１の縁部２５に形成されている可動駒側位置決め溝２７の溝壁２７ａに、可動駒位置決め体４３の２つのフランジ４７が接触せずに、可動駒位置決め体４３から圧力センサ１７に成形荷重５７が伝わらない。 Subsequently, in order to mold the resin material 55, the upper base 7a of the molding machine is lowered toward the lower base 7b, and the surface 33 of the upper molding main body 29 is brought into contact with the resin material 55. The movable piece 11 receives a force from the resin material 55 in the direction of the upper base 7a, that is, a reaction force. Therefore, the movable piece 11 is located on the upper base 7a side at the time of molding (FIG. 3 (A)). In other words, the movable piece 11 is located on the upper base 7a side regardless of the presence or absence of the spring 23 at the time of molding.
At this time, since the movable piece 11 is located on the upper base 7a side of the pressure sensor 17, it can be moved to the groove wall 27a of the movable piece side positioning groove 27 formed on the edge portion 25 of the movable piece 11. The molding load 57 is not transmitted from the movable piece positioning body 43 to the pressure sensor 17 without the two flanges 47 of the piece positioning body 43 coming into contact with each other.

一定時間経過後、上温調駒３ａ及び下温調駒３ｂを用いて金型１及び下金型９を冷却し、樹脂材料５５を固化して成形品５９を製造する。 After a lapse of a certain period of time, the upper mold 1 and the lower mold 9 are cooled by using the upper temperature control piece 3a and the lower temperature control piece 3b, and the resin material 55 is solidified to produce the molded product 59.

次に、成形品５９を離型するために、成形機の上基台７ａを上昇させると、可動駒１１と成形型１３はそのままに、上温調駒３ａ、上金型取り付け駒５ａ、可動駒受け体１５、圧力センサ１７、及び可動駒位置決め体４３が上基台７ａとともに上方に動く。すなわち、可動駒１１は、離型時に可動駒受け体１５側に位置する（図３（Ｂ））。
このとき、圧力センサ１７は、可動駒１１が可動駒受け体１５側に位置しているため、可動駒１１の縁部２５に形成されている可動駒側位置決め溝２７の溝壁２７ａに、可動駒位置決め体４３の２つのフランジ４７が接触して、可動駒位置決め体４３から圧力センサ１７に離型荷重６１が伝わる。この離型荷重６１を離型抵抗として圧力センサ１７で測定することによって、成形品５９の離型抵抗を測定することができる。 Next, when the upper base 7a of the molding machine is raised in order to release the molded product 59, the movable piece 11 and the molding die 13 remain as they are, and the upper temperature adjusting piece 3a, the upper mold mounting piece 5a, and the movable piece 5a are movable. The piece receiver 15, the pressure sensor 17, and the movable piece positioning body 43 move upward together with the upper base 7a. That is, the movable piece 11 is located on the movable piece receiver 15 side when the mold is released (FIG. 3 (B)).
At this time, since the movable piece 11 is located on the movable piece receiver 15 side, the pressure sensor 17 is movable on the groove wall 27a of the movable piece side positioning groove 27 formed on the edge portion 25 of the movable piece 11. The two flanges 47 of the piece positioning body 43 come into contact with each other, and the mold release load 61 is transmitted from the movable piece positioning body 43 to the pressure sensor 17. By measuring the mold release load 61 with the pressure sensor 17 as the mold release resistance, the mold release resistance of the molded product 59 can be measured.

したがって、実施の形態の金型１は、エジェクタピンなどのエジェクタ機構を用いずに離型抵抗を測定することができる。
また、実施の形態の金型１は、圧力センサ１７に成形荷重５７が伝わらないため、成形時に破損する虞がなく、長期間使用することができる。
このような実施の形態の金型１は、例えば、成形品の離型抵抗を経時的に測定することによって、成形品の製造プロセスの監視に使用することができる。 Therefore, the mold 1 of the embodiment can measure the mold release resistance without using an ejector mechanism such as an ejector pin.
Further, since the molding load 57 is not transmitted to the pressure sensor 17, the mold 1 of the embodiment can be used for a long period of time without being damaged during molding.
The mold 1 of such an embodiment can be used for monitoring the manufacturing process of a molded product, for example, by measuring the mold release resistance of the molded product over time.

［変形例］
本発明は、上述した実施の形態に限らず、本発明の要旨を逸脱しない範囲で種々変形可能である。
例えば、実施の形態の金型１を、下金型として、固定側基台である成形機の下基台７ｂに取り付け、下金型９を上金型として、可動側基台である成形機の上基台７ａに取り付けてもよい。 [Modification example]
The present invention is not limited to the above-described embodiment, and can be variously modified without departing from the gist of the present invention.
For example, the mold 1 of the embodiment is attached to the lower base 7b of the molding machine which is a fixed side base as a lower mold, and the lower mold 9 is used as an upper mold and is a molding machine which is a movable side base. It may be attached to the upper base 7a.

実施の形態の金型１は、上成形型のパターンを成形材料に転写するようなインプリント成形にも用いることができる。
また、実施の形態の金型１は、上成形型である成形型１３を下基台７ｂに向かって突出している成形型（コア）とし、下成形型本体４９を下基台７ｂに向かって凹んでいる成形型（キャビティ）として、射出成形にも用いることができる。
さらに、実施の形態の金型１は、可塑化用流体として二酸化炭素を用いて樹脂成形品の表面層を可塑化する転写成形方法にも用いることができる。この場合、上温調駒３ａ及び下温調駒３ｂは成形機の上基台７ａ及び下基台７ｂに取り付けられていなくてもよく、スプリング２３は配置されていなくてもよい。 The mold 1 of the embodiment can also be used for imprint molding in which the pattern of the upper molding mold is transferred to a molding material.
Further, in the mold 1 of the embodiment, the molding die 13 which is the upper molding die is a molding die (core) protruding toward the lower base 7b, and the lower molding die main body 49 is directed toward the lower base 7b. It can also be used for injection molding as a concave molding die (cavity).
Further, the mold 1 of the embodiment can also be used in a transfer molding method for plasticizing the surface layer of a resin molded product by using carbon dioxide as a plasticizing fluid. In this case, the upper temperature control piece 3a and the lower temperature control piece 3b may not be attached to the upper base 7a and the lower base 7b of the molding machine, and the spring 23 may not be arranged.

可動駒１１と成形型１３は、一体に形成されていてもよい。 The movable piece 11 and the molding die 13 may be integrally formed.

１ 金型
１１ 可動駒
１３ 成形型
１５ 可動駒受け体
１７ 圧力センサ 1 Mold 11 Movable piece 13 Molding mold 15 Movable piece receiver 17 Pressure sensor

Claims (3)

成形機の基台に取り付けられる金型であって、
基台に対向する基台側面、及び前記基台側面と反対側の成形側面を有する板状の可動駒、
前記可動駒の成形側面に、前記可動駒の縁部が露出するように配置されている成形型、
前記可動駒の縁部の成形側面に対向するように配置され、かつ前記基台に取り付けられている可動駒受け体、並びに
前記可動駒の縁部と前記可動駒受け体との間に配置されている圧力センサを備え、
前記可動駒は、成形時に基台側に位置し、離型時に可動駒受け体側に位置する金型。 A mold that can be attached to the base of a molding machine.
A plate-shaped movable piece having a base side surface facing the base and a molding side surface opposite to the base side surface.
A molding die, which is arranged so that the edge of the movable piece is exposed on the molding side surface of the movable piece.
The movable piece receiver is arranged so as to face the molding side surface of the edge portion of the movable piece and is attached to the base, and is arranged between the edge portion of the movable piece and the movable piece receiver. Equipped with a pressure sensor
The movable piece is a mold located on the base side at the time of molding and on the movable piece receiver side at the time of mold release. 前記可動駒の縁部の成形側面に形成されている可動駒側位置決め溝、前記可動駒受け体の基台側面に形成されている受け体側位置決め溝、及び前記可動駒側位置決め溝と前記受け体側位置決め溝に挿入されている可動駒位置決め体をさらに備え、
前記圧力センサは、前記可動駒位置決め体と前記可動駒受け体との間に配置されている請求項１に記載の金型。 The movable piece side positioning groove formed on the molded side surface of the edge portion of the movable piece, the receiver side positioning groove formed on the base side surface of the movable piece receiver, and the movable piece side positioning groove and the receiver side positioning. Further equipped with a movable piece positioning body inserted in the groove,
The mold according to claim 1, wherein the pressure sensor is arranged between the movable piece positioning body and the movable piece receiver. 前記基台と前記可動駒との間に配置されている温調駒、及び前記可動駒と前記可動駒受け体との間に配置されている弾性部材をさらに備える請求項１又は２に記載の金型。 The first or second claim, further comprising a temperature control piece arranged between the base and the movable piece, and an elastic member arranged between the movable piece and the movable piece receiver. Mold.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55169415U (en) * 1979-05-23 1980-12-05
JPS55169416U (en) * 1979-05-23 1980-12-05
JPH0238013A (en) * 1988-07-28 1990-02-07 Canon Inc Press cooling mechanism in rotary molding system
JPH09117941A (en) * 1995-10-25 1997-05-06 Hitachi Ltd Mold release force measuring device
JP2002001778A (en) * 2000-06-23 2002-01-08 Canon Inc Mold for measuring adhesion, implement for measuring adhesion, measuring method for adhesion, measuring method for lateral resisting force, and mold for measuring lateral resisting force
JP2017222060A (en) * 2016-06-14 2017-12-21 トヨタ自動車株式会社 Apparatus for measuring mold release force

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55169415U (en) * 1979-05-23 1980-12-05
JPS55169416U (en) * 1979-05-23 1980-12-05
JPH0238013A (en) * 1988-07-28 1990-02-07 Canon Inc Press cooling mechanism in rotary molding system
JPH09117941A (en) * 1995-10-25 1997-05-06 Hitachi Ltd Mold release force measuring device
JP2002001778A (en) * 2000-06-23 2002-01-08 Canon Inc Mold for measuring adhesion, implement for measuring adhesion, measuring method for adhesion, measuring method for lateral resisting force, and mold for measuring lateral resisting force
JP2017222060A (en) * 2016-06-14 2017-12-21 トヨタ自動車株式会社 Apparatus for measuring mold release force

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