JP2021150797A - Imaging apparatus - Google Patents

Abstract

To provide an imaging apparatus capable of obtaining excellent wireless communication performance, regardless of a distance between a substrate on which an imaging element is mounted and a substrate on which a control element is mounted and capable of preventing a noise influence caused by wireless from the outside, without providing an exclusive member.SOLUTION: The imaging apparatus includes a frame body which has conductivity, a first substrate which is fixed to the frame body and on which a first wireless communication device is mounted, a second substrate on which a second wireless communication device is mounted so as to face the first wireless communication device and to which the electric signal of the first substrate is transmitted through the first and second wireless communication devices, a metal plate which fixes the second substrate, and a third substrate on which the control element is mounted and which is electrically connected to the second substrate. The first and second wireless communication devices are shielded by the frame body and the metal plate.SELECTED DRAWING: Figure 4

Description

The present invention relates to an image pickup device, and more particularly to an image pickup device having a function of moving an image pickup device to perform shake correction.

In a conventional image pickup apparatus, a mechanism is known as an image shake correction mechanism in which an image sensor is moved to perform shake correction in order to suppress distortion of a captured image mainly due to camera shake of the photographer during shooting.

When performing image shake correction, connect the image sensor and the control board with a cable or flexible board of sufficient length in order to flexibly support the movement of the image sensor board on which the image sensor is mounted. There is a need.

FIG. 5 is a structural diagram of a conventional image pickup device 501, showing a cross section of the image pickup device 501 cut horizontally at the center of the optical axis. The lens unit 502 is an optical unit for collecting light from the subject, and is attached to the exterior cover 503. The image sensor 504 is an electric component that converts an image of light captured by the lens unit 502 into an electric signal, and is mounted on the image sensor substrate 505. The movable frame 508 holds the image sensor substrate 505, and is movably attached by a plurality of spheres 520 in a plane orthogonal to the optical axis in order to enable image shake correction. The control board 506 includes an image processing unit, a control unit for various systems, a power supply circuit unit, and the like, and is attached to an internal housing (not shown). The flexible board 530 is connected to the connector 531a mounted on the image pickup element board 505 and the connector 531b mounted on the control board 506, and the image pickup element board 505 and the control board 506 are in a state of being able to electrically communicate with each other. .. The flexible substrate 530 needs to be sufficiently long in order to reduce the load on the movable portion including the image sensor 504 and not hinder the movement of the movable portion. Therefore, a storage space for the flexible substrate 530 is required, which leads to an increase in the size of the image pickup apparatus. Further, the deflection of the flexible substrate 530 due to the movement of the image sensor 504 generates a movement load, which hinders the improvement of the accuracy of image shake correction.

Therefore, Patent Document 1 proposes a means for mounting a wireless communication means capable of transmitting and receiving each other on each of the image sensor substrate and the control substrate, minimizing the above-mentioned cable and flexible substrate, and reducing the load due to the deflection thereof. ..

Specifically, a method is disclosed in which signal transmission between a substrate on which an imaging element is mounted and a substrate on which a control element is mounted is performed by wireless communication provided with a millimeter-wave signal transmission path without using electrical wiring. There is.

Japanese Unexamined Patent Publication No. 2014-139692

However, in the prior art disclosed in Patent Document 1, a dedicated member is required to prevent the influence of noise on other radio signals from the inside and the outside of the image pickup apparatus, which leads to an increase in size of the image pickup apparatus. It ends up. Further, on the board on which the solid-state image sensor is mounted and the board on which the control element is mounted, in addition to the mounting parts used for signal transmission between the boards, high-height parts such as an inductor for a power supply circuit are also mounted. , The distance between these substrates becomes large. In that case, a predetermined distance for performing short-range wireless communication between the boards cannot be satisfied, and wireless communication between the boards cannot be established.

An object of the present invention is that good wireless communication performance can be obtained regardless of the distance between the substrate on which the solid-state image sensor is mounted and the substrate on which the control element is mounted, and that good wireless communication performance can be obtained without providing a dedicated member. It is to provide an image pickup apparatus which made it possible to prevent the influence of noise by radio.

The imaging device as one aspect of the present invention comprises a conductive frame, a first substrate fixed to the frame and on which a first wireless communication device is mounted, and the first wireless communication. A second substrate in which a second wireless communication device is mounted so as to face the device, and an electric signal of the first substrate is transmitted via the first and second wireless communication devices, and the second substrate. The first and second wireless communication devices include a metal plate for fixing the substrate and a third substrate on which a control element is mounted and electrically connected to the second substrate. Is shielded by the frame and the metal plate.

Other objects and features of the present invention will be described in the following examples.

According to the present invention, good wireless communication performance can be obtained regardless of the distance between the substrate on which the image sensor is mounted and the substrate on which the control element is mounted, and good wireless communication performance can be obtained without providing a dedicated member. It is possible to provide an image pickup device capable of preventing the influence of noise caused by radio.

It is an external view of a camera. It is a system diagram of a camera. (A) A perspective view of the camera with the exterior member removed, and (b) an exploded perspective view of the camera with the exterior member removed. It is sectional drawing around the short-range wireless communication device of a camera. It is a structural drawing of a conventional example.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is an external perspective view of the camera (imaging device) 100 as viewed from the front side.

The camera 100 is covered with an exterior member, a top cover 330, a front cover 302, and a back cover 303. The release button 306 provided on the top cover 330 is a button for issuing a shooting instruction to the camera 100, and by pressing the release button 306, each means in the camera 100 is driven to execute an imaging operation. The electronic dial 314 is a dial for setting the shooting of the camera 100, and by operating the electronic dial 314, it is possible to set arbitrary shooting parameters such as exposure setting. The grip 304 is a portion that grips the camera 100 when the photographer shoots a subject. A lens (not shown) is attached to the mount 320. Reference numeral 305 is a mode dial for changing the shooting mode.

FIG. 2 is a system diagram of the camera 100.

The CPU (Central Processing Unit) 310 controls the operation of the entire camera 100, and executes various processes and instructions to each circuit unit. The CPU 310 is a control element that generates heat. The third substrate 301 is a printed wiring board (PWB: Printed Wild Board), and many of the various electric circuits shown in FIG. 2 including a camera microcomputer are mounted on the third substrate 301. The CPU 310 controls each functional block of the camera 100 and performs necessary calculations for that purpose according to a computer program loaded from the memory.

The power supply 311 supplies electric power to each circuit unit in the camera 100.

The image sensor 102 is composed of a CCD or a CMOS sensor, and converts an optical image of a subject captured by the image sensor 102 into an image signal. The image signal obtained by the image sensor 102 is converted into image data by the image processing unit 313 and output to the CPU 310.

A shutter 314 is arranged on the front surface of the image sensor 102 to adjust the exposure time of the image sensor 102. The shutter control unit 315 drives the shutter 314 based on the signal input from the CPU 310.

When the operation member 316 is pressed by the user, the operation detection unit 317 outputs a signal to the CPU 310, and the CPU 310 changes the shooting conditions such as exposure and shutter speed.

The first short-range wireless communication device (first wireless communication device) 103 provided on the first board 101 is a second short-range wireless communication device (second wireless communication device) provided on the second board 201. ) 203, signals such as image data can be transmitted and received by wireless communication.

When the operation member 316 is operated by the user, the operation detection unit 317 outputs a signal to the CPU 310, and the CPU 310 transmits the image sensor via the first short-range wireless communication device 103 and the second short-range wireless communication device 203. The shooting conditions such as the exposure of 102 are changed.

Next, a detailed configuration of the present embodiment will be described with reference to FIGS. 3 and 4.

FIG. 3A is a perspective view of the camera 100 excluding the exterior member, and FIG. 3B is an exploded perspective view of FIG. 3A. Further, FIG. 4 is a cross-sectional view of the camera 100 in the Y direction.

The main base 400 is a member that serves as a skeleton of the camera 100, and the material is made of resin or the like. A sensor plate 104, which is a conductive metal frame for mounting the first substrate 101 on which the image sensor 102 is mounted, is fixed to the main base 400. The image sensor 102 is fixed so that the XY plane is the image pickup surface. A first short-range wireless communication device 103 is provided on the back surface (−Z direction) side of the camera 100 of the first substrate 101. At this time, the first short-range wireless communication device 103 is arranged so as to be covered with the sensor plate 104 (accommodated inside the sensor plate 104).

The sensor plate 104 is a metal frame and yoke included in the image shake correction mechanism (not shown), and coils 404a, 404b, and 404c, which are a part of the image shake correction mechanism (not shown), are fixed to the sensor plate 104. Will be done. The image shake correction mechanism is driven by energizing these coils 404a, 404b, and 404c from the power supply 311. Further, the coils 404a, 404b, and 404c are energized by non-contact power supply. As a result, it is not necessary to connect with a cable or a flexible substrate as shown in the above-mentioned conventional example, and the accuracy of image shake correction due to the deflection of the flexible substrate is not deteriorated. Since the non-contact power supply system is a known technique, detailed description thereof will be omitted.

A wireless device 312 for performing wireless communication such as image data between the camera 100 and various external devices (not shown) is fixed to the main base 400.

The second substrate 201 is a flexible printed wiring board, and the second short-range wireless communication device 203 is mounted at a position facing the first short-range wireless communication device 103 on the optical axis O. The second substrate 201 is fixed to a metal fixing plate (metal plate) 401. The fixed plate 401 is provided with a convex portion 403 facing the first short-range wireless communication device 103, and the second substrate 201 is provided so that the second short-range wireless communication device 203 is placed on the convex portion 403. Is fixed to the fixing plate 401. As a result, the distance between the first short-range wireless communication device 103 and the second short-range wireless communication device 203 is fixed so as to be a distance of several mm to several cm, and short-range wireless communication becomes possible.

The fixed plate 401 is provided with an opening 402, and a part of the second substrate 201 passes through the opening 402 and is electrically connected to the third substrate 301 via the connector 408. With this configuration, the electric signal of the image sensor 102 mounted on the first substrate 101 is transmitted to the second substrate 201 via the first short-range wireless communication device 103 and the second short-range wireless communication device 203. NS. Further, the electric signal of the image sensor 102 is transmitted to the third substrate 301 via the connection between the second substrate 201 and the connector 408. As a result, image data obtained by the image sensor 102 can be exchanged between the first substrate 101 and the third substrate 301 without directly connecting a cable or a flexible substrate.

A heat transfer member 405 is provided between the fixed plate 401 and the third substrate 301.

When the fixed plate 401 and the third substrate 301 come into contact with each other via the heat transfer member 405, the heat generated by the CPU 310 mounted on the third substrate 301 is transferred to the fixed plate 401. As a result, the heat of the CPU 310 generated during the shooting operation of the camera 100 is less likely to be transmitted to the exterior member of the camera 100, so that the photographer does not feel uncomfortable.

The fixed plate 401 is provided with a plurality of bent portions 406 and 407 that cover the outside of the sensor plate 104, and these bent portions allow the fixed plate 401 and the sensor plate 104 to overlap each other by a distance D in the Z direction. There is. As a result, the first short-range wireless communication device 103 and the second short-range wireless communication device 203 are covered with a metal member and shielded. Therefore, the radio wave when the wireless device 312 is wirelessly communicating with an external device (not shown) interferes with the wireless communication between the first short-range wireless communication device 103 and the second short-range wireless communication device 203. It is configured not to. Further, the opening 402 provided in the fixed plate 401 is provided with respect to the first short-range wireless communication device 103 and the second short-range wireless communication device 203 in the XZ plane (in the plane orthogonal to the photographing optical axis). It is provided on the opposite side of the wireless device 312. Further, the opening 402 is provided in a region outside the sensor plate 104 (in a plane orthogonal to the photographing optical axis) in the XZ plane. As a result, the distance between the opening 402 and the wireless device 312 can be increased, and the configuration is such that it is not easily affected by the radio waves of the wireless device 312 described above.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and modifications can be made within the scope of the gist thereof.

100 camera (imaging device)
101 First board 103 First wireless communication device 104 Frame (sensor plate)
201 Second board 203 Second wireless communication device 301 Third board 401 Metal plate

Claims (13)

With a conductive frame
A first substrate fixed to the frame and on which the first wireless communication device is mounted,
A second wireless communication device is mounted so as to face the first wireless communication device, and an electric signal of the first substrate is transmitted via the first and second wireless communication devices. With the board
A metal plate for fixing the second substrate and
A control element is mounted, and a third substrate that is electrically connected to the second substrate is provided.
The first and second wireless communication devices are image pickup devices that are shielded by the frame and the metal plate. The imaging device according to claim 1, wherein the first wireless communication device is housed inside the frame. The image pickup apparatus according to claim 1 or 2, wherein an image pickup device is mounted on the first substrate. The imaging device according to any one of claims 1 to 3, wherein the second substrate is a flexible printed wiring board. The imaging apparatus according to any one of claims 1 to 4, wherein the first substrate and the second substrate face each other in the direction of the photographing optical axis. The imaging device according to any one of claims 1 to 5, wherein the frame is a metal frame and a yoke included in the image shake correction mechanism. The imaging device according to any one of claims 1 to 6, wherein the metal plate is in contact with the third substrate via a heat transfer member. The metal plate has an opening and
The imaging apparatus according to any one of claims 1 to 7, wherein the second substrate is electrically connected to the third substrate through the opening. The imaging device according to claim 8, wherein the opening is provided in a region outside the frame in a plane orthogonal to the optical axis for photographing. The opening is characterized in that it is provided on a plane orthogonal to the optical axis of photography on the side opposite to the wireless device that performs wireless communication with an external device with the first and second wireless communication devices interposed therebetween. The imaging device according to claim 8 or 9. The imaging apparatus according to any one of claims 1 to 10, wherein the metal plate has a bent portion that covers the outside of the frame. The metal plate is provided with a convex portion toward the first wireless communication device.
The invention according to any one of claims 1 to 11, wherein the second substrate is fixed to the metal plate so that the second wireless communication device is arranged on the convex portion. Imaging device. The imaging device according to any one of claims 1 to 12, wherein the coil included in the image shake correction mechanism is energized by non-contact power feeding.

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