JP2021147192A - Transport separation device - Google Patents

Abstract

To provide a transport separation device that can adjust an interval between components which are continuously transported.SOLUTION: A transport separation device 1 includes: a transport mechanism 10 including a transport surface 11 that passes through a transport route and continuously travels; and a speed reduction mechanism 20 disposed so as to be opposed to the transport surface 11 and causing force to act on a component 100 so as to reduce a travel speed of the component 100 on the transport surface 11 more than a drive speed of the transport mechanism 10 in an intermediate region of the transport route.SELECTED DRAWING: Figure 1

Description

The present invention relates to a transport separation device.

As a device for separating parts such as electronic parts that are continuously conveyed, Patent Document 1 includes a chute that conveys chip parts and a rotating disk that receives chip parts that are sequentially supplied from the chute. Disclosed is a chip component supply separation device characterized in that a stopper means for pressing and stopping a chip component next to the chip component sequentially supplied from the chip component is provided. Patent Document 1 describes, as an embodiment, a chute composed of a linear feed portion of a vibrating parts feeder.

Further, as a device for discharging the supplied parts in a line-arranged state and supplying the supplied parts to another external device, Patent Document 2 describes a rotating plate, a support plate for supporting the lower surface of the rotating plate, and a support plate. A rotation drive mechanism for rotating the rotary plate, a guide member having a guide surface intersecting the rotation direction of the rotary plate, a guide support member for supporting the guide member, and an alignment object aligned by the guide member. Disclosed is an aligned supply device including a discharge mechanism that guides the rotary plate to the outside. In the alignment supply device described in Patent Document 2, the alignment target objects put on the rotating plate are aligned while being guided toward the peripheral edge of the rotating plate by the guide surface.

Japanese Unexamined Patent Publication No. 2005-350184 Japanese Patent No. 5972103

In the supply separation device described in Patent Document 1, chip parts to be transported are continuously conveyed, and the second component from the beginning is stopped by a stopper means for a certain period of time to bring the components one by one. Can be separated and supplied individually. On the other hand, in the alignment supply device described in Patent Document 2, since the parts are placed on the rotating plate, it is difficult to use the stopper means for the purpose of separating the parts to be continuously conveyed. Therefore, as the supply amount of the transported parts increases, the distance between the adjacent parts becomes narrower, and it becomes difficult to separate the parts. In the alignment supply device described in Patent Document 2, for example, it is conceivable to increase the rotation speed of the rotating plate to increase the distance between the parts, but since the rotation speed is limited, the distance between the parts is adjusted. Is difficult.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a transport separation device capable of adjusting the interval between parts to be continuously transported.

The transport separation device of the present invention has a transport mechanism having a transport surface that continuously moves through the transport path, and in an intermediate region of the transport path, the moving speed of parts on the transport surface is higher than the drive speed of the transport mechanism. It is provided with a speed reduction mechanism arranged so as to face the transport surface, which exerts a force on the component so as to delay the speed.

According to the present invention, it is possible to provide a transport separation device capable of adjusting the interval between parts to be continuously transported.

FIG. 1 is a plan view schematically showing an example of the transport separation device of the present invention. FIG. 2 is a perspective view schematically showing an example of an electronic component. FIG. 3 is a cross-sectional view schematically showing an example of the direction in which the gas is blown. FIG. 4 is a cross-sectional view schematically showing another example of the direction in which the gas is blown. FIG. 5 is a plan view schematically showing another example of the transport separation device of the present invention.

Hereinafter, the transport separation device of the present invention will be described.
However, the present invention is not limited to the following configurations, and can be appropriately modified and applied without changing the gist of the present invention. It should be noted that a combination of two or more of the individual desirable configurations described below is also the present invention.

The transport / separation device of the present invention is attached to a device such as an inspection device or a packaging device, and can transport parts such as electronic parts to the device which is the next process.

In the following example, as an embodiment of the transport / separation device of the present invention, a case where electronic components are transported and separated will be described with reference to the drawings. Each figure shows the outline of the transport separation device of the present invention, and schematically shows the electronic parts which are examples of parts, the dimensions and scale of the transport separation device, and the like.

In one embodiment of the transport separation device of the present invention, the component to be transported is a rectangular parallelepiped electronic component as a preferred embodiment, but the shape of the component is not necessarily limited to the rectangular parallelepiped shape.

FIG. 1 is a plan view schematically showing an example of the transport separation device of the present invention. FIG. 2 is a perspective view schematically showing an example of an electronic component.

The transport separation device 1 shown in FIG. 1 includes a transport disk 10 which is a transport mechanism, a speed reduction mechanism 20, and a discharge mechanism 30.

As shown in FIG. 2, the electronic component 100 conveyed by the transfer separation device 1 is a rectangular parallelepiped chip-type electronic component. The electronic component 100 has a first main surface 111 and a second main surface 112 that face each other in the height direction (H direction), and a first side surface 113 and a second side surface that face each other in the width direction (W direction) that is orthogonal to the height direction. It has a side surface 114 and a first end surface 115 and a second end surface 116 facing each other in the length direction (L direction) orthogonal to the height direction and the width direction. A first external electrode 121 and a second external electrode 122 are formed on the first end surface 115 and the second end surface 116 of the electronic component 100, respectively. The dimensions of the electronic component 100 in the length direction, the width direction, and the height direction are not particularly limited, but the dimensions in the length direction are preferably larger than the dimensions in the width direction and the dimensions in the height direction. The dimensions in the width direction are preferably about the same as the dimensions in the height direction.

The transport disk 10 has a transport surface 11 on its upper surface that continuously moves through a transport path. In the example shown in FIG. 1, the transport path has an arc shape. Therefore, the transport surface 11 moves in an arc trajectory.

Although not shown, the rotating shaft R of the transport disc 10 is connected to a drive unit such as a motor. As a result, the transport surface 11 continuously rotates around the rotation axis R in the direction indicated by the arrow A.

The transport disk 10 transports the electronic component 100 supplied on the transport disk 10 to the speed reduction mechanism 20 in the direction indicated by the arrow A. The transport disk 10 is configured so that the drive speed does not change before and after the speed reduction mechanism 20.

As shown in FIG. 1, the alignment guides 41 and 42 for aligning the electronic components 100 along the transport path provided on the transport disk 10 are arranged along the outer peripheral peripheral edge of the transport path. preferable. The alignment guides 41 and 42 are arranged so as to face the transport surface 11. The alignment guides 41 and 42 are preferably arranged at a location where the speed reduction mechanism 20 does not exist (specifically, a location where the pressing guide 21 described later does not exist).

The alignment guides 41 and 42 are preferably arranged with a gap between them and the transport surface 11. In this case, the height of the gap between the alignment guide 41 or 42 and the transport surface 11 in the normal direction of the transport surface 11 is preferably lower than the height of the electronic component 100. Specifically, the height of the gap between the alignment guide 41 or 42 and the transport surface 11 is preferably 0.5 mm or less. On the other hand, the height of the gap between the alignment guide 41 or 42 and the transport surface 11 is, for example, 0.1 mm or more.

The speed reduction mechanism 20 is arranged so as to face the transport surface 11. In the example shown in FIG. 1, the speed reduction mechanism 20 has a pressing guide 21, an auxiliary guide 22, a guide support member 23, and a pressing portion 24. As will be described later, the speed reduction mechanism 20 forces the electronic component 100 to slow down the moving speed of the electronic component 100 on the transport surface 11 from the drive speed of the transport disk 10 which is the transport mechanism in the intermediate region of the transport path. To act.

The pressing guide 21 is arranged along the outer peripheral peripheral edge of the transport path provided on the transport disk 10. The auxiliary guide 22 is arranged along the outer peripheral peripheral edge of the transport path provided on the transport disk 10 with a space between the auxiliary guide 22 and the pressing guide 21 so that the electronic component 100 can pass through. The pressing guide 21 and the auxiliary guide 22 are supported by the guide supporting member 23.

The pressing portion 24 presses the electronic component 100 toward the pressing guide 21. As shown in FIG. 1, it is preferable that the speed reduction mechanism 20 has an auxiliary guide 22 and the pressing portion 24 is provided on the auxiliary guide 22. In this case, it is preferable that the auxiliary guide 22 is arranged closer to the rotation axis R of the transport surface 11, that is, closer to the center of the transport disc 10 than the pressing guide 21.

In the example shown in FIG. 1, the pressing portion 24 has a gas blowing port 24a for blowing gas toward the pressing guide 21, and a regulator 24b for controlling the gas flow rate. It is preferable that the pressing portion 24 is configured to constantly blow gas while transporting the electronic component 100.

As shown in FIG. 1, the pressing portion 24 preferably has a plurality of gas blowing ports 24a along the transport path. In this case, the length from the gas blowing port 24a located on the most upstream side of the transport path to the gas blowing port 24a located on the most downstream side is equivalent to one electronic component 100 in the direction in which the electronic component 100 is transported. It is preferably longer than the dimensions. It is preferable that the plurality of gas blowing ports 24a are arranged at equal intervals.

FIG. 3 is a cross-sectional view schematically showing an example of the direction in which the gas is blown.
In FIG. 3, the pressing portion 24 sprays the gas G parallel to the conveying surface 11. As a result, the electronic component 100 is pressed against the pressing guide 21.

FIG. 4 is a cross-sectional view schematically showing another example of the direction in which the gas is blown.
In FIG. 4, the pressing portion 24 sprays the gas G diagonally downward with respect to the conveying surface 11. In this case, since the electronic component 100 is pressed against the transport surface 11, it is pressed against the pressing guide 21 in a stable state.

The blowing angle of the gas G with respect to the transport surface 11 (the angle indicated by θ in FIG. 4) is, for example, 0 degrees or more and 60 degrees or less.

Examples of the gas G include air, carbon dioxide, and an inert gas. Of these, air is preferably used.

As shown in FIGS. 3 and 4, the pressing guide 21 is preferably arranged with a gap between it and the conveying surface 11. In this case, the height of the gap between the pressing guide 21 and the transport surface 11 in the normal direction of the transport surface 11 is preferably lower than the height of the electronic component 100. Specifically, the height of the gap between the pressing guide 21 and the transport surface 11 is preferably 0.5 mm or less. On the other hand, the height of the gap between the pressing guide 21 and the transport surface 11 is, for example, 0.1 mm or more.

Similarly, it is preferable that the auxiliary guide 22 is arranged with a gap between it and the transport surface 11. In this case, the height of the gap between the auxiliary guide 22 and the transport surface 11 in the normal direction of the transport surface 11 is preferably lower than the height of the electronic component 100. Specifically, the height of the gap between the auxiliary guide 22 and the transport surface 11 is preferably 0.5 mm or less. On the other hand, the height of the gap between the auxiliary guide 22 and the transport surface 11 is, for example, 0.1 mm or more. The height of the gap between the auxiliary guide 22 and the transport surface 11 may be the same as or different from the height of the gap between the pressing guide 21 and the transport surface 11. Further, as in the example shown in FIG. 4, the height of the gap between the auxiliary guide 22 and the transport surface 11 may be higher than the height of the electronic component 100.

The electronic component 100 that has passed through the speed reduction mechanism 20 is conveyed to the discharge mechanism 30. In the example shown in FIG. 1, the discharge mechanism 30 has a first discharge guide 31 and a second discharge guide 32. The discharge mechanism 30 guides the electronic component 100 that has passed through the speed reduction mechanism 20 from the transport disk 10 that is the transport mechanism to the outside thereof.

The first discharge guide 31 is arranged along the rotation tangential direction of the transport disc 10. The second discharge guide 32 is parallel to the first discharge guide 31 and is spaced from the first discharge guide 31 so that the electronic component 100 can pass through, and is closer to the rotation axis R of the transport surface 11, that is, the transport disk. It is arranged near the center of 10.

Although not shown, a discharge conveyor is provided below the transport disk 10. The discharge conveyor is arranged so that its transport direction is along the longitudinal direction of the first discharge guide 31 and the second discharge guide 32, and the upper surface thereof abuts on the lower surface of the transport disk 10.

Hereinafter, an example of the overall operation of the transport separation device 1 will be described.

First, the transport disk 10 is continuously rotated in the transport surface 11 in the direction indicated by the arrow A.

When the transport disk 10 is rotated, a plurality of electronic components 100 are manually or via a feeding device to be loaded into the loading unit set on the transport disk 10 on the upstream side in the rotation direction. The transport disc 10 may be rotated after the plurality of electronic components 100 are inserted.

The electronic component 100 supplied on the transport disc 10 moves in the same rotation direction as the transport disc 10 due to the rotation of the transport disc 10, and is transported on the transport surface 11 along the alignment guide 41.

The pressing portion 24 of the speed reduction mechanism 20 constantly blows a small amount of air whose flow rate is adjusted by the regulator 24b from the gas blowing port 24a provided on the auxiliary guide 22 toward the pressing guide 21.

The electronic component 100 passing between the pressing guide 21 and the auxiliary guide 22 is pressed against the pressing guide 21 by a weak force by air, and the moving speed is temporarily reduced. On the other hand, the electronic component 100 that has passed between the pressing guide 21 and the auxiliary guide 22 is conveyed at a speed substantially equal to the rotation speed of the conveying disk 10.

In this way, due to the difference in the moving speeds of the electronic components 100 that occur during and after the passage of the speed reduction mechanism 20, the distance between the plurality of electronic components 100 that are continuously conveyed is widened to a certain size. Can be separated. As a result, the intermittent supply of the electronic component 100 becomes easy.

Further, when a gas such as air is blown onto the pressing guide 21, the size of the distance between the plurality of electronic components 100 that are continuously conveyed can be adjusted by adjusting the gas flow rate. Further, the electronic component 100 having an unstable shape that easily rotates during transportation can be transported while correcting the posture.

FIG. 5 is a plan view schematically showing another example of the transport separation device of the present invention.

The transfer separation device 1A shown in FIG. 5 includes a conveyor 10A which is a transfer mechanism and a speed reduction mechanism 20. Although not shown, the transport separation device 1A further includes a discharge mechanism.

The conveyor 10A has a conveyor surface 11A on its upper surface that continuously moves through the conveyor path. In the example shown in FIG. 5, the transport path has a linear shape. Therefore, the transport surface 11A moves in a straight line orbit.

The conveyor 10A conveys the electronic component 100 supplied on the conveyor 10A to the speed reduction mechanism 20 in the direction indicated by the arrow B. The conveyor 10A is configured so that the drive speed does not change before and after the speed reduction mechanism 20.

The transport separation device 1A shown in FIG. 5 has the same configuration as the transport separation device 1 shown in FIG. 1, except that the transport mechanism is a conveyor 10A.

As shown in FIG. 5, it is preferable that the alignment guides 41 and 42 for aligning the electronic components 100 along the transport path provided on the conveyor 10A are arranged along the peripheral edge of the transport path.

In the transfer / separation device 1A shown in FIG. 5, as in the transfer / separation device 1 shown in FIG. 1, the transfer / separation device 1A is continuously conveyed due to the difference in the moving speed of the electronic component 100 that occurs during and after the passage of the speed reduction mechanism 20. The distance between the plurality of electronic components 100 can be widened to a certain size and separated. As a result, the intermittent supply of the electronic component 100 becomes easy.

The present invention is not limited to the above configuration, and various applications and modifications can be added within the scope of the present invention with respect to the configuration of the transport separation device, the configuration of parts, the method of transporting parts, and the like. Is.

In FIGS. 1 and 5, the alignment guide 41 is arranged on the upstream side of the speed reduction mechanism 20, and the alignment guide 42 is arranged on the downstream side of the speed reduction mechanism 20. It should be noted that either one of the alignment guides 41 and 42 may not be arranged. Further, both the alignment guides 41 and 42 may not be arranged. Further, at least one of the alignment guides 41 and 42 may be integrated with the pressing guide 21.

As shown in FIG. 5, when the transport mechanism is a conveyor, a conveyor for transporting parts to the speed reduction mechanism and a conveyor for transporting parts from the speed reduction mechanism may be separately provided. In that case, it is preferable that both conveyors are configured so that the difference in driving speed before and after the speed reduction mechanism becomes small.

1, 1A Conveying separation device 10 Conveying disk (conveying mechanism)
10A conveyor (conveyor mechanism)
11, 11A Transport surface 20 Speed reduction mechanism 21 Pushing guide 22 Auxiliary guide 23 Guide support member 24 Pushing part 24a Gas spray port 24b Regulator 30 Discharge mechanism 31 1st discharge guide 32 2nd discharge guide 41, 42 Alignment guide 100 Electronic Parts 111 1st main surface 112 2nd main surface 113 1st side surface 114 2nd side surface 115 1st end surface 116 2nd end surface 121 1st external electrode 122 2nd external electrode G Gas R Rotation axis θ Gas spray angle

Claims (20)

A transport mechanism having a transport surface that continuously moves through a transport path,
In the intermediate region of the transport path, a speed arranged so as to face the transport surface, which exerts a force on the component so as to slow the moving speed of the component on the transport surface from the drive speed of the transport mechanism. A transport separation device including a reduction mechanism. The transport separation device according to claim 1, further comprising a discharge mechanism for guiding the component that has passed through the speed reduction mechanism from the transport mechanism to the outside thereof. The transport separation device according to claim 1 or 2, wherein the transport path has an arc shape or a linear shape. 3. The transport separation device according to item 1. The transport separation device according to claim 4, wherein the pressing guide is arranged with a gap between the push guide and the transport surface. The transport separation device according to claim 5, wherein the height of the gap between the pressing guide and the transport surface is lower than the height of the component in the normal direction of the transport surface. The speed reduction mechanism further includes an auxiliary guide arranged along the transport path with a space between the push guide and the component so that the component can pass therethrough.
The transport separation device according to any one of claims 4 to 6, wherein the pressing portion is provided on the auxiliary guide. The transport surface continuously rotates around a rotation axis and moves.
The speed reduction mechanism includes a pressing guide arranged along the outer peripheral peripheral edge of the transport path, a pressing portion for pressing the component toward the pressing guide, and an outer peripheral peripheral edge of the transport path. Along the portion, there is an auxiliary guide which is arranged with a space between the pressing guide and the component so that the component can pass therethrough.
The pressing portion is provided on the auxiliary guide.
The transport separation device according to claim 1 or 2, wherein the auxiliary guide is arranged closer to the rotation axis of the transport surface than the pressing guide. The transport separation device according to claim 7 or 8, wherein the auxiliary guide is arranged with a gap between the auxiliary guide and the transport surface. The transport separation device according to claim 9, wherein the height of the gap between the auxiliary guide and the transport surface is lower than the height of the component in the normal direction of the transport surface. The transport separation device according to any one of claims 4 to 10, wherein the pressing portion has a gas blowing port for blowing gas toward the pressing guide. The transport separation device according to claim 11, wherein the pressing portion is configured to blow the gas parallel to the transport surface. The transport separation device according to claim 11, wherein the pressing portion is configured to blow the gas diagonally downward with respect to the transport surface. The transport separation device according to any one of claims 11 to 13, wherein the pressing portion is configured to constantly blow the gas while transporting the parts. The transport separation device according to any one of claims 11 to 14, wherein the pressing portion has a plurality of the gas blowing ports along the transport path. Claimed that the length from the gas blowing port located on the most upstream side of the transport path to the gas blowing port located on the most downstream side is longer than the dimension of one of the parts in the direction in which the parts are transported. Item 15. The transport separation device according to item 15. Any of claims 1 to 16, wherein the speed reduction mechanism is arranged so as to face the transport surface and further includes an alignment guide for aligning the parts along the transport path. The transport separation device according to item 1. The transfer separation device according to claim 17, wherein the alignment guide is arranged with a gap between the alignment guide and the transfer surface. The transport separation device according to claim 18, wherein the height of the gap between the alignment guide and the transport surface is lower than the height of the component in the normal direction of the transport surface. The transport separation device according to any one of claims 1 to 19, wherein the transport mechanism is configured so that the drive speed does not change before and after the speed reduction mechanism.

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