JP2021145039A - Wiring board, mounting board, and inverter device - Google Patents

Abstract

To provide a wiring board and a mounting board that can effectively take EMC countermeasures without a large space compared to a case of providing wiring (coil) and a core that go around the outside of a substrate, and an inverter device with excellent characteristics and prevention of upsizing.SOLUTION: A wiring board 1 includes a board body 2, at least one wire 3, and a recess 5, and wiring 3 and the recess 5 are provided in the board body 2, and the wiring 3 is continuous in the thickness direction of the board body 2 and orbits once or more with the thickness direction of the board body 2 as the axial direction. The recess 5 is recessed from the upper surface (one surface) of the board body 2 toward the lower surface (the other surface), and the recess 5 is provided inside the wiring 3 that has been orbited once or more.SELECTED DRAWING: Figure 1

Description

The present invention relates to a wiring board, a mounting board, and an inverter device.

With the recent shift to electric vehicles (EV), it is desired to reduce the size of the inverter housing and the number of necessary parts around the EV drive motor. Further, in EV, since a large current is input to the drive motor, the electromagnetic field noise in the inverter also increases. Therefore, it is necessary to apply a noise suppression member.
As an EMC (Electromagunetic Compatibility) measure, it is common to bundle harnesses connected to an inverter and insert them into a ferrite core (see, for example, Patent Document 1). Further, a configuration in which a magnetic core is provided in a connector (male connector) to which a harness is connected is also disclosed (see, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2013-37526 Japanese Unexamined Patent Publication No. 2016-722374

When the distance between the core and the circuit board is large, the core and the connector accommodating the core occupy a large space in the inverter housing, which is disadvantageous for miniaturization. The present invention has been made in view of the above problems, and an object of the present invention is that an EMC countermeasure can be effectively taken without requiring a large space as compared with the case where a wiring (coil) or a core circulating outside the substrate is provided. It is an object of the present invention to provide a wiring board and a mounting board, and an inverter device which is hard to malfunction and prevents an increase in size.

An exemplary invention of the present application comprises a substrate body, at least one wiring, and a recess, wherein the wiring and the recess are provided in the substrate body, and the wiring is the substrate body. It is continuous in the thickness direction and orbits once or more with the thickness direction of the substrate body as the axial direction, and the recessed portion is recessed from one surface of the substrate body toward the other surface. The recessed portion is a wiring board characterized in that it is provided inside the wiring that has been revolved once or more.
Further, another exemplary invention of the present application includes the wiring board and electronic components, and the electronic components are mounted on one surface of the substrate body of the wiring board. It is a mounting board.
Further, another exemplary invention of the present invention is an inverter device including the above-mentioned mounting board.

According to the exemplary invention of the present application, a wiring board and a mounting board that do not require a large space as compared with the case where a wiring (coil) or a core that circulates outside the board is provided, and can effectively take EMC countermeasures, and an error. It is possible to provide an inverter device that is difficult to operate and is prevented from being enlarged.

FIG. 1 is a schematic view ((a) cross-sectional view, (b) to (d) top view) showing a first embodiment of the wiring board of the present invention. FIG. 2 is a cross-sectional view showing a second embodiment of the wiring board of the present invention. FIG. 3 is a cross-sectional view showing a third embodiment of the wiring board of the present invention. FIG. 4 is a schematic view ((a) cross-sectional view, (b) to (d) top view) showing a fourth embodiment of the wiring board of the present invention. FIG. 5 is a schematic view ((a) cross-sectional view, (b) to (d) top view) showing a fifth embodiment of the wiring board of the present invention. FIG. 6 is a schematic view ((a) cross-sectional view, (b) to (d) top view) showing a sixth embodiment of the wiring board of the present invention. FIG. 7 is a schematic view ((a) cross-sectional view, (b) to (d) top view) showing a seventh embodiment of the wiring board of the present invention. FIG. 8 is a schematic view ((a) cross-sectional view, (b) to (d) top view) showing an eighth embodiment of the wiring board of the present invention. FIG. 9 is a cross-sectional view showing an assembly process of the wiring board shown in FIG. FIG. 10 is a schematic view ((a) cross-sectional view, (b) to (d) top view) showing a tenth embodiment of the wiring board of the present invention. FIG. 11 is a schematic view ((a) cross-sectional view, (b) to (g) top view) showing an eleventh embodiment of the wiring board of the present invention. FIG. 12 is a cross-sectional view showing a twelfth embodiment of the wiring board of the present invention. FIG. 13 is a schematic side view showing an embodiment of the mounting substrate of the present invention.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings.
[Wiring board]
<First Embodiment>
First, the first embodiment of the wiring board of the present invention will be described.
FIG. 1 is a schematic view ((a) cross-sectional view, (b) to (d) top view) showing a first embodiment of the wiring board of the present invention. Hereinafter, in FIG. 1A, the upper side is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower". Further, in FIGS. 1 (b) to 1 (d), the front side of the paper surface is referred to as "upper" or "upper", and the back side of the paper surface is referred to as "lower" or "lower".

The wiring board 1 shown in FIG. 1 has a board main body 2, a wiring 3 provided in the board main body 2, and a recessed portion 5.
The substrate main body 2 is composed of a laminated body including a plurality of laminated (three in this embodiment) insulating plates 21 to 23. Each of the insulating plates 21 to 23 is made of, for example, polyamide or polyimide.
The insulating plate 21, the insulating plate 22, and the insulating plate 23 are arranged in order from the upper side.

The wiring 3 is a connection wiring that electrically connects the three wiring patterns 31 to 33 formed on each of the three insulating plates 21 to 23 and the wiring patterns 31 to 33 adjacent to each other in the thickness direction of the substrate main body 2. It is equipped with 412 and 423.
The wiring patterns 31 to 33 can be formed, for example, by processing a metal foil, using a conductor paste, or the like. Further, the connection wirings 412 and 423 are through holes or via holes. The through hole here means that a conductor is present in a hole that penetrates the insulating plates 21 to 23 in the thickness direction. Further, the via hole is a hole in which a conductor is present in a hole penetrating any one or two of the insulating plates 21 to 23. The conductors of the through holes and the via holes are plated or applied to the inner walls of the holes by an electrolytic plating method, an electroless plating method, the use of a conductor paste, or the like.

The wiring pattern 31 is electrically connected to another member (for example, a connector) surface-mounted on the substrate main body 2 on the insulating plate 21, and is around the recess 5 with the thickness direction of the substrate main body 2 as the axial direction. Orbits counterclockwise for about 1.25 laps. After that, the wiring pattern 31 is electrically connected to the wiring pattern 32 via the connection wiring 412.
The wiring pattern 32 goes around the recessed portion 5 counterclockwise about once on the insulating plate 22 with the thickness direction of the substrate body 2 as the axial direction. After that, the wiring pattern 32 is electrically connected to the wiring pattern 33 via the connection wiring 423.
The wiring pattern 33 orbits the insulating plate 23 counterclockwise by about 0.75 turns around the recessed portion 5 with the thickness direction of the substrate body 2 as the axial direction.

According to such a configuration, for example, the current from the connector flows in the order of the wiring pattern 31, the wiring pattern 32, and the wiring pattern 33 while rotating counterclockwise with respect to the recessed portion 5.
Further, in the present embodiment, the case where a current flows from the connector to the wiring pattern 31 has been described as an example, but the present invention is not limited to this. For example, a current may flow from another member to the wiring pattern 33, and a current may flow in the order of the wiring pattern 33, the wiring pattern 32, and the wiring pattern 31.
Further, a case where the current flow circulates counterclockwise with respect to the recessed portion 5 is given as an example, but in some cases it is clockwise, and a recess is formed between the wiring pattern 31, the wiring pattern 32, and the wiring pattern 33. This includes the case where the orbital direction with respect to the portion 5 is different.

As a result, the wiring 3 is formed in a shape that is continuous in the thickness direction of the substrate main body 2 and circulates around the thickness direction as the axial direction. In other words, the wiring 3 is formed in a shape that can be said to be coiled (spiral).
In the following, "circling around the thickness direction of the substrate body 2 as an axial direction" is also simply described as "circling".
Since the wiring 3 and the core 6 are provided inside the substrate main body 2, a large space is not required as compared with the case where the wiring (coil) or the core circulating outside the substrate is provided. Further, since the wiring 3 is provided in the substrate main body 2, it is easy to increase the number of laps thereof. Therefore, effective EMC countermeasures can be taken by efficiently converting a part of the electromagnetic field noise into thermal energy.
In particular, the wiring pattern 31 makes one or more laps (about 1.5 laps), and the entire wiring 3 makes about three laps. As a result, the above effect is further improved.

Further, the recessed portion 5 is located inside the wiring 3 and is recessed from the upper surface (one surface) to the lower surface (the other surface) of the substrate main body 2. In the present embodiment, the recessed portion 5 is composed of a recessed portion 51 that does not open to the lower surface of the substrate main body 2.
The recess 51 (recess 5) can be formed by, for example, laser machining, drilling, etching using a photolithography method, or the like.

<Second Embodiment>
Next, a second embodiment of the wiring board of the present invention will be described.
FIG. 2 is a cross-sectional view showing a third embodiment of the wiring board of the present invention. Hereinafter, in FIGS. 2A and 2B, the upper side is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower".
Hereinafter, the wiring board 1 of the second embodiment will be described mainly on the differences from the wiring board 1 of the first embodiment, and the same matters will be omitted.
The wiring board 1 of the second embodiment is the same as the wiring board 1 of the first embodiment except that it further has a core 6 containing a magnetic material.
Here, examples of the magnetic material include ferrite, magnetite, hematite and the like.

The core 6 has a rod shape and is inserted into the recess 51.
The lower end of the core 6 (the lower end of the substrate body 2) may be in contact with the bottom surface of the recess 51 (recess 5) (see FIG. 2A), and the shaft of the recess 51. It may be located in the middle of the direction (see FIG. 2B).
Further, the core 6 may protrude from the upper surface of the substrate main body 2 (see FIG. 2A).
The second embodiment having such a configuration also has the same actions and effects as those of the first embodiment. In particular, the presence of the core 6 in the recess 51 (recess 5) further improves the EMC countermeasure effect.

<Third Embodiment>
Next, a third embodiment of the wiring board of the present invention will be described.
FIG. 3 is a cross-sectional view showing a third embodiment of the wiring board of the present invention. Hereinafter, in FIGS. 3A to 3C, the upper side is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower".
Hereinafter, the wiring board 1 of the third embodiment will be described mainly on the differences from the wiring board 1 of the first to second embodiments, and the same matters will be omitted.
The wiring board 1 of the third embodiment is the same as the wiring board 1 of the second embodiment except that the configuration of the recessed portion 5 is different.

The recessed portion 5 of the third embodiment is composed of a through hole 52 that opens to the lower surface of the substrate main body 2.
The lower end of the core 6 may coincide with the lower surface of the substrate body 2 (see FIG. 3A), or the core 6 may be located in the middle of the through hole 52 in the axial direction (FIG. 3B). ), It may protrude from the lower surface of the substrate body 2 (see FIG. 3C).
Further, the core 6 may protrude from the upper surface of the substrate main body 2 (see FIGS. 3 (a) and 3 (c)).
The same actions and effects as those of the first to second embodiments can be obtained by the third embodiment having such a configuration.

<Fourth Embodiment>
Next, a fourth embodiment of the wiring board of the present invention will be described.
FIG. 4 is a schematic view ((a) cross-sectional view, (b) to (d) top view) showing a fourth embodiment of the wiring board of the present invention. Hereinafter, in FIG. 4A, the upper side is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower". Further, in FIGS. 4 (b) to 4 (d), the front side of the paper surface is referred to as "upper" or "upper", and the back side of the paper surface is referred to as "lower" or "lower".

Hereinafter, the wiring board 1 of the fourth embodiment will be described mainly on the differences from the wiring board 1 of the first to third embodiments, and the same matters will be omitted.
The wiring board 1 of the fourth embodiment is the same as the wiring board 1 of the second embodiment except that the number and shape of the wirings 3 and the shape of the core 6 are different.
In the fourth embodiment, the two wirings 3 are arranged on the substrate main body 2, and recesses 51 (recessed portions 5) are provided inside the two wirings 3, respectively. Further, the core 6 is inserted into each of the recesses 51. According to such a configuration, EMC countermeasures can be taken separately for each wiring 3.

In the fourth embodiment, the wiring pattern 31 is electrically connected to another member (for example, a connector) surface-mounted on the substrate body 2 on the insulating plate 21, and is axially oriented in the thickness direction of the substrate body 2. As a result, the core 6 is orbited clockwise (or counterclockwise) by about 1.25 laps. After that, the wiring pattern 31 is electrically connected to the wiring pattern 32 via the connection wiring 412.
The wiring pattern 32 orbits the insulating plate 22 clockwise (or counterclockwise) about once around the core 6 with the thickness direction of the substrate body 2 as the axial direction. After that, the wiring pattern 32 is electrically connected to the wiring pattern 33 via the connection wiring 423.
The wiring pattern 33 orbits the insulating plate 23 clockwise (or counterclockwise) about 0.25 turns around the core 6 with the thickness direction of the substrate body 2 as the axial direction.

In such a configuration, the wiring 3 circulates clockwise (or counterclockwise) with respect to the core 6 about 2.5 laps as a whole.
As in the first embodiment, in the fourth embodiment, the direction in which the current flows may be, for example, the wiring pattern 31, the wiring pattern 32, and the wiring pattern 33, or vice versa. ..

Further, each of the two cores 6 is provided with a first protruding portion 61 projecting from the upper surface of the substrate main body 2, and the first protruding portions 61 are connected to each other by a first connecting portion 7 containing a magnetic material.
The fourth embodiment having such a configuration also has the same actions and effects as those of the first to third embodiments.
In particular, since the two cores 6 are connected by the first connecting portion 7, more effective EMC countermeasures can be taken than the rod-shaped core 6, and the mechanical strength can be increased.

<Fifth Embodiment>
Next, a fifth embodiment of the wiring board of the present invention will be described.
FIG. 5 is a schematic view ((a) cross-sectional view, (b) to (d) top view) showing a fifth embodiment of the wiring board of the present invention. Hereinafter, in FIG. 5A, the upper side is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”. Further, in FIGS. 5 (b) to 5 (d), the front side of the paper surface is referred to as "upper" or "upper", and the back side of the paper surface is referred to as "lower" or "lower".

Hereinafter, the wiring board 1 of the fifth embodiment will be described mainly on the differences from the wiring board 1 of the first to fourth embodiments, and the same matters will be omitted.
The wiring board 1 of the fifth embodiment is the same as the wiring board 1 of the fourth embodiment except that the numbers of the recesses 51 and the cores 6 are different.
In the sixth embodiment, a recess 51 is further provided between the two cores 6 arranged inside the two wirings 3, and the core 6 is also inserted into the recess 51. Further, the core 6 also includes a first protruding portion 61 protruding from the upper surface of the substrate main body 2, and is connected to the first connecting portion 7 at the first protruding portion 61.

Even with the fifth embodiment of such a configuration, the same actions and effects as those of the first to fourth embodiments can be obtained.
In particular, since the three cores 6 are connected by the first connecting portion 7, the mechanical strength can be increased.

<Sixth Embodiment>
Next, a sixth embodiment of the wiring board of the present invention will be described.
FIG. 6 is a schematic view ((a) cross-sectional view, (b) to (d) top view) showing a sixth embodiment of the wiring board of the present invention. Hereinafter, in FIG. 6A, the upper side is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”. Further, in FIGS. 6 (b) to 6 (d), the front side of the paper surface is referred to as "upper" or "upper", and the back side of the paper surface is referred to as "lower" or "lower".

Hereinafter, the wiring board 1 of the sixth embodiment will be described mainly on the differences from the wiring board 1 of the first to fifth embodiments, and the same matters will be omitted.
The wiring board 1 of the sixth embodiment is the same as the wiring board 1 of the fourth embodiment except that the configurations of the wiring 3 and the recessed portion 5 are different.
Each of the two recessed portions 5 is composed of a through hole 52 that opens to the lower surface of the substrate main body 2.
Further, each core 6 projects from the lower surface of the substrate main body 2.

In the sixth embodiment, the wiring pattern 33 is electrically connected to another member (for example, a connector) surface-mounted on the substrate body 2 on the insulating plate 23, and is axially oriented in the thickness direction of the substrate body 2. As a result, the core 6 is orbited clockwise (or counterclockwise) by about 0.75 laps. After that, the wiring pattern 33 is electrically connected to the wiring pattern 32 via the connection wiring 423.
The wiring pattern 32 orbits the insulating plate 22 clockwise (or counterclockwise) about once around the core 6 with the thickness direction of the substrate body 2 as the axial direction. After that, the wiring pattern 32 is electrically connected to the wiring pattern 31 via the connection wiring 412.
The wiring pattern 31 orbits around one core 6 clockwise (or counterclockwise) about 0.5 times on the insulating plate 21 with the thickness direction of the substrate body 2 as the axial direction, and then the other core. Orbit around 6 times clockwise (or counterclockwise) for about 0.5 laps.

That is, the two wirings 3 (see FIGS. 6C and 6D) that are adjacent to each other in the in-plane direction of the substrate body 2 are electrically connected to each other to form one wiring. (See FIG. 6 (b))
In this case, the current flows from the other member in the order of, for example, one wiring pattern 33, one wiring pattern 32, wiring pattern 31, the other wiring pattern 32, and the other wiring pattern 33.
The sixth embodiment having such a configuration also has the same actions and effects as those of the first to fifth embodiments.
In particular, when the two wirings 3 are electrically connected to each other to form one wiring, the one wiring orbits about 4.5 times, so that the EMC countermeasure effect is further improved.

<7th Embodiment>
Next, a seventh embodiment of the wiring board of the present invention will be described.
FIG. 7 is a schematic view ((a) cross-sectional view, (b) to (d) top view) showing a seventh embodiment of the wiring board of the present invention. Hereinafter, in FIG. 7A, the upper side is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”. Further, in FIGS. 7 (b) to 7 (d), the front side of the paper surface is referred to as "upper" or "upper", and the back side of the paper surface is referred to as "lower" or "lower".

Hereinafter, the wiring board 1 of the seventh embodiment will be described mainly on the differences from the wiring board 1 of the first to sixth embodiments, and the same matters will be omitted.
The wiring board 1 of the seventh embodiment is the same as the wiring board 1 of the fifth embodiment except that the configuration of the recessed portion 5 is different.
Each of the two recessed portions 5 is composed of a through hole 52 that opens to the lower surface of the substrate main body 2. Further, each core 6 is located in the middle of the through hole 52 in the axial direction.
Even with the seventh embodiment having such a configuration, the same actions and effects as those of the first to sixth embodiments can be obtained.

<8th Embodiment>
Next, an eighth embodiment of the wiring board of the present invention will be described.
FIG. 8 is a schematic view showing an eighth embodiment of the wiring board of the present invention ((a) cross-sectional view, (b) to (d) top view), and FIG. 9 shows an assembly process of the wiring board shown in FIG. It is sectional drawing which shows. Hereinafter, in FIGS. 8A and 9, the upper side is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”. Further, in FIGS. 8 (b) to 8 (d), the front side of the paper surface is referred to as "upper" or "upper", and the back side of the paper surface is referred to as "lower" or "lower".

Hereinafter, the wiring board 1 of the eighth embodiment will be described mainly on the differences from the wiring board 1 of the first to seventh embodiments, and the same matters will be omitted.
The wiring board 1 of the eighth embodiment is the same as the wiring board 1 of the sixth embodiment except that the configuration of the core 6 is different.
The two cores 6 each include a first projecting portion 61 projecting from the upper surface of the substrate body 2, and the first projecting portions 61 are connected to each other by a first connecting portion 7 containing a magnetic material. On the other hand, the two cores 6 each include a second protruding portion 62 projecting from the lower surface of the substrate main body 2, and the second protruding portions 62 are connected to each other by a second connecting portion 8 containing a magnetic material. As a result, the two cores 6, the first connecting portion 7 and the second connecting portion 8 form one annular core.
The annular core in the present embodiment is not limited to a ring, and may be a cylinder or a prism.

Such a wiring board 1 can be assembled as follows.
First, a first core member 67 including a part of the two cores 6 and the first connecting portion 7 and a second core member 68 including the remaining portion of the two cores 6 and the second connecting portion 8 are prepared ( (See FIG. 9 (a)).
Next, the first core member 67 is brought closer to the substrate main body 2 from the upper surface side, the portion to be the core 6 is inserted into the through hole 52, and the second core member 68 is brought closer to the substrate main body 2 from the lower surface side. The portion to be the core 6 is inserted into the through hole 52 (see FIG. 9B).
After that, the first core member 67 and the second core member 68 are brought close to each other and attached to the substrate main body 2. As a result, the wiring board 1 is obtained.
That is, the annular core is composed of an assembly of the first core member 67 and the second core member 68.

The eighth embodiment having such a configuration also has the same actions and effects as those of the first to seventh embodiments.
In particular, by providing the annular core penetrating the substrate main body 2, the EMC countermeasure effect is further improved.
Further, according to the above method, the assembly workability when the annular core is attached to the substrate main body 2 is improved.

<9th embodiment>
Next, a ninth embodiment of the wiring board of the present invention will be described.
FIG. 10 is a schematic view ((a) cross-sectional view, (b) to (d) top view) showing a ninth embodiment of the wiring board of the present invention. Hereinafter, in FIG. 10A, the upper side is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”. Further, in FIGS. 10 (b) to 10 (d), the front side of the paper surface is referred to as "upper" or "upper", and the back side of the paper surface is referred to as "lower" or "lower".

Hereinafter, the wiring board 1 of the ninth embodiment will be described mainly on the differences from the wiring board 1 of the first to eighth embodiments, and the same matters will be omitted.
The wiring board 1 of the ninth embodiment is the same as the wiring board 1 of the fifth embodiment except that the configuration of the wiring pattern 33 and the configuration and number of the recesses 5 are different.
The wiring pattern 33 starts from the lower end of the connection wiring 423 on the insulating plate 23 and goes around about 0.75 times. As a result, the entire wiring 3 goes around three times.

Each of the three recessed portions 5 is composed of a through hole 52 that opens to the lower surface of the substrate main body 2. Further, each of the three cores 6 is provided with a second protruding portion 62 projecting from the lower surface of the substrate main body 2, and the second protruding portions 62 are connected to each other by a second connecting portion 8 containing a magnetic material. As a result, the three cores 6, the first connecting portion 7 and the second connecting portion 8 form one annular core.
The ninth embodiment having such a configuration also has the same actions and effects as those of the first to eighth embodiments.
In particular, by providing the annular core penetrating the substrate main body 2, the EMC countermeasure effect is further improved.

<10th Embodiment>
Next, a tenth embodiment of the wiring board of the present invention will be described.
FIG. 11 is a schematic view ((a) cross-sectional view, (b) to (g) top view) showing a tenth embodiment of the wiring board of the present invention. Hereinafter, in FIG. 11A, the upper side is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”. Further, in FIGS. 11 (b) to 11 (g), the front side of the paper surface is referred to as "upper" or "upper", and the back side of the paper surface is referred to as "lower" or "lower".

Hereinafter, the wiring board 1 of the tenth embodiment will be described mainly on the differences from the wiring board 1 of the first to ninth embodiments, and the same matters will be omitted.
The wiring board 1 of the tenth embodiment is the same as the wiring board 1 of the eighth embodiment except that the configurations of the board main body 2 and the wiring 3 are different.
The substrate main body 2 is composed of a laminated body including six laminated insulating plates 21 to 26. Then, the insulating plate 21, the insulating plate 22, the insulating plate 23, the insulating plate 24, the insulating plate 25, and the insulating plate 26 are arranged in order from the upper side.

In the tenth embodiment, the wiring pattern 31 is electrically connected to another member (for example, a connector) surface-mounted on the substrate main body 2 on the insulating plate 21, and is axially oriented in the thickness direction of the substrate main body 2. As a result, the core 6 is orbited counterclockwise (or clockwise) by about 1.25 laps. After that, the wiring pattern 31 is electrically connected to the wiring pattern 32 via the connection wiring 412.
The wiring pattern 32 orbits the insulating plate 22 counterclockwise (or clockwise) about once around the core 6 with the thickness direction of the substrate body 2 as the axial direction. After that, the wiring pattern 32 is electrically connected to the wiring pattern 33 via the connection wiring 423.
The wiring pattern 33 orbits the insulating plate 23 counterclockwise (or clockwise) about once around the core 6 with the thickness direction of the substrate body 2 as the axial direction. After that, the wiring pattern 33 is electrically connected to the wiring pattern 35 via the connection wirings 434 and 435.
The wiring pattern 35 goes around the core 6 counterclockwise (or clockwise) about once on the insulating plate 25 with the thickness direction of the substrate body 2 as the axial direction. After that, the wiring pattern 35 is electrically connected to the wiring pattern 36 via the connection wiring 456.
Further, the wiring pattern 36 orbits the insulating plate 36 counterclockwise (or clockwise) about once around the core 6 with the thickness direction of the substrate body 2 as the axial direction.

The insulating plate 24 is not provided with a wiring pattern, and connection wiring 445 is arranged along the thickness direction thereof.
The tenth embodiment having such a configuration also has the same actions and effects as those of the first to ninth embodiments.
In particular, by increasing the number of insulating plates constituting the substrate main body 2 and increasing the number of times the wiring goes around, the effect of EMC countermeasures is further improved.

<11th Embodiment>
Next, the eleventh embodiment of the wiring board of the present invention will be described.
FIG. 12 is a cross-sectional view showing an eleventh embodiment of the wiring board of the present invention. Hereinafter, in FIG. 12, the upper side is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower".
Hereinafter, the wiring board 1 of the eleventh embodiment will be described mainly on the differences from the wiring board 1 of the first to tenth embodiments, and the same matters will be omitted.
The wiring board 1 of the eleventh embodiment is the same as the wiring board 1 of the first embodiment except that the recessed portion 5 is omitted.

Even with the eleventh embodiment having such a configuration, the same actions and effects as those of the first embodiment can be obtained.
That is, since the wiring 3 and the core 6 are provided inside the substrate main body 2, a large space is not required as compared with the case where the wiring (coil) or the core circulating outside the substrate is provided. Further, since the wiring 3 is provided in the substrate main body 2, it is easy to increase the number of laps thereof. Therefore, effective EMC countermeasures can be taken by efficiently converting a part of the electromagnetic field noise into thermal energy.

[Mounting board]
By using the wiring board 1 as described above, the mounting board of the present invention can be obtained.
FIG. 13 is a schematic side view showing an embodiment of the mounting substrate of the present invention. Hereinafter, in FIG. 12, the upper side is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower".
The mounting board 100 shown in FIG. 13 includes the wiring board 1 and the electronic component 10 described above, and the electronic component 10 is mounted on the upper surface (one surface) of the board body 2 of the wiring board 1.
According to this configuration, since the wiring board 1 is provided with EMC countermeasures, the mounting board 100 in which the electronic component 10 is unlikely to malfunction can be obtained. In addition, it is possible to prevent the mounting board 100 from becoming large in size.

Further, as shown in FIGS. 4 to 11, a recessed portion 5 located inside the wiring 3 and recessed from the upper surface (one surface) to the lower surface (the other surface) of the substrate main body 2 and the recessed portion 5 When the core 6 inserted into the core 6 is provided, the protrusion length L from the upper surface of the core 6 is designed to be smaller than the maximum height H of the electronic component 10. This makes it possible to take EMC countermeasures while preventing the mounting substrate 100 from becoming thick.

[Inverter device]
The inverter device of the present invention includes a power module unit that supplies drive power to an electric motor, a power module control unit that outputs a drive signal to the power module unit, an inverter control unit that outputs a control signal to the power module control unit, and the like. It has a smoothing capacitor unit.
The power module unit includes, for example, a mounting board 100 on which an IGBT (Insulated Gate Bipolar Transistor) is mounted as an electronic component 10.
According to such a configuration, the entire inverter device can be made smaller.

The wiring board, mounting board, and inverter device of the present invention have been described above based on preferred embodiments, but the present invention is not limited thereto.
For example, any configuration in the first to twelfth embodiments may be combined as appropriate.
Further, although the substrate main body is composed of a laminated body including a plurality of insulating plates, the substrate main body may be composed of a single insulating plate, and three to five or seven or more laminated bodies may be formed. It may be composed of a laminated body including an insulating plate.
Further, although the wiring extends continuously in the thickness direction of the substrate body, the wiring may be arranged only on the surface of the substrate body and may not extend continuously in the thickness direction of the substrate body.
Further, the wiring board may have three or more wirings.

1 Wiring board 2 Board body 21, 22, 23 Insulation board 24, 25, 26 Insulation board 3 Wiring 31, 32, 33 Wiring pattern 35, 36 Wiring pattern 412, 423, 434 Connection wiring 445, 456 Connection wiring 5 Recessed part 51 Recess 52 Through hole 6 Core 61 1st protruding part 62 2nd protruding part 67 1st core member 68 2nd core member 7 1st connecting part 8 2nd connecting part 10 Electronic component 100 Mounting board L Protruding length H Maximum height

Claims (18)

With the board body
With at least one wire
Indentation and
Have,
The wiring and the recess are provided in the substrate body.
The wiring is continuous in the thickness direction of the substrate body and orbits once or more with the thickness direction of the substrate body as the axial direction.
The recessed portion is recessed from one surface of the substrate body toward the other surface.
A wiring board characterized in that the recessed portion is provided inside the wiring that has been revolved once or more. The wiring board according to claim 1, further comprising a core inserted into the recess and containing a magnetic material. The wiring board according to claim 2, wherein the core projects from one surface of the board body. The wiring board according to claim 2 or 3, wherein the core is an end portion of the board body on the other side of the board body located in the middle of the recessed portion in the axial direction. The wiring board according to any one of claims 1 to 4, wherein the recessed portion is a through hole opened to the other surface of the board body. The wiring board according to claim 5, wherein the core protrudes from the other surface of the board body. The wiring board according to any one of claims 1 to 4, wherein the recess is a recess that does not open to the other surface of the board body. The at least one wiring includes a plurality of the wirings.
The wiring board according to any one of claims 1 to 7, wherein the recessed portion is provided inside each of the plurality of wirings. Further, it has a core that is inserted into each of the plurality of recesses and contains a magnetic material.
The eighth aspect of the present invention, wherein each of the plurality of cores includes a first protruding portion protruding from the one surface of the substrate main body, and the first protruding portions are connected to each other by a first connecting portion containing a magnetic material. Wiring board. Each of the plurality of recesses is a through hole that opens to the other surface of the substrate body.
Each of the plurality of cores includes a second protruding portion protruding from the other surface of the substrate body, and the second protruding portions are connected to each other by a second connecting portion containing a magnetic material to form one annular core. The wiring board according to claim 9. The annular core includes a first core member including the first connecting portion and a second core member including the second connecting portion, and the first core member is viewed from the one surface side of the second core. The wiring board according to claim 10, which is an assembly in which a member is attached to the board body from the other surface side. The wiring board according to any one of claims 8 to 11, wherein the two wirings adjacent to each other in the in-plane direction of the substrate body are electrically connected to each other. The substrate body is composed of a laminated body including two laminated insulating plates.
The wiring according to any one of claims 1 to 12, wherein the wiring includes two wiring patterns provided on the two insulating plates, and connection wiring for electrically connecting the two wiring patterns to each other. Wiring board. The wiring board according to claim 13, wherein at least one of the two wiring patterns circulates once or more with the thickness direction of the board body as the axial direction. A substrate body composed of a laminated body including two laminated insulating plates,
With at least one wire
Have,
The wiring includes two wiring patterns provided on the two insulating plates, and connection wiring for electrically connecting the two wiring patterns.
The wiring board is a wiring board characterized in that it orbits once or more with the thickness direction of the board body as an axial direction. The wiring board according to any one of claims 1 to 15.
With electronic components
With
A mounting board characterized in that the electronic component is mounted on one surface of the board body of the wiring board. Further, it is provided with a recessed portion located inside the wiring and recessed from one surface of the substrate body toward the other surface, and a core inserted into the recessed portion and containing a magnetic material.
The mounting substrate according to claim 16, wherein the protrusion length of the core from one surface is smaller than the maximum height of the electronic component. An inverter device comprising the mounting board according to claim 16 or 17.

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