JP2021141297A - Electronic control unit - Google Patents

Abstract

To provide an electronic control unit capable of improving the heat dissipation of an electronic circuit unit while suppressing an increase in the size of the electronic control unit in a saddle-riding vehicle.SOLUTION: An electronic control unit (5) for a saddle-riding vehicle according to the present invention includes an electronic circuit unit (53) that includes a board (531) and an electronic component (532) mounted on wiring of the board (531), a metal component, and a perche element (55), and the electronic component (532) is thermally conductively connected to the metal member via the perche element (55).SELECTED DRAWING: Figure 3

Description

This disclosure relates to an electronic control unit capable of improving heat dissipation of an electronic circuit unit while suppressing an increase in the size of the electronic control unit in a saddle-riding vehicle.

Saddle-type vehicles such as motorcycles are equipped with various electronic control units that control the operation of each device. For example, Patent Document 1 discloses a hydraulic pressure control unit for controlling a braking force for braking a wheel of a motorcycle as an electronic control unit mounted on a motorcycle.

JP-A-2018-8674

The electronic control unit is provided with an electronic circuit unit including a substrate and electronic components mounted on the wiring of the substrate. In order to operate the electronic control unit stably, it is necessary to dissipate the heat generated from the electronic circuit unit to the outside. Therefore, it is conceivable to provide the electronic control unit with various members for improving the heat dissipation of the electronic circuit unit. However, in a saddle-riding vehicle, the mounting space of the device is limited, so it is necessary to improve the heat dissipation of the electronic circuit unit while suppressing the increase in size of the electronic control unit.

The present invention has been made against the background of the above-mentioned problems, and obtains an electronic control unit capable of improving heat dissipation of an electronic circuit unit while suppressing an increase in size of the electronic control unit in a saddle-riding vehicle. It is a thing.

The electronic control unit according to the present invention is an electronic control unit for a saddle-mounted vehicle, and includes an electronic circuit unit including a substrate, electronic components mounted on the wiring of the substrate, a metal member, and a Perche element. , The electronic component is thermally conductively connected to the metal member via the Perche element.

In the electronic control unit according to the present invention, electronic components mounted on the wiring of the substrate of the electronic circuit unit are thermally conductively connected to the metal member via a Pelche element. As a result, in the saddle-riding vehicle, the limited mounting space can be effectively utilized to dissipate the heat generated from the electronic circuit unit to the outside. Therefore, in a saddle-riding vehicle, it is possible to improve the heat dissipation of the electronic circuit unit while suppressing the increase in size of the electronic control unit.

It is a schematic diagram which shows the schematic structure of the motorcycle which mounts the brake system which concerns on embodiment of this invention. It is a schematic diagram which shows the schematic structure of the brake system which concerns on embodiment of this invention. It is a schematic cross-sectional view which shows the hydraulic pressure control unit which concerns on embodiment of this invention. It is a schematic configuration of the electronic circuit of the hydraulic pressure control unit according to the embodiment of the present invention. It is a schematic diagram which shows the operation example of the electronic circuit when the temperature of an electronic component is lower than the reference temperature during operation of the motorcycle which concerns on embodiment of this invention. It is a schematic diagram which shows the operation example of the electronic circuit when the temperature of an electronic component is higher than a reference temperature during operation of the motorcycle which concerns on embodiment of this invention. It is a schematic diagram which shows the operation example of the electronic circuit when the power generation voltage of a perche element is lower than a reference voltage while the motorcycle which concerns on embodiment of this invention is stopped. It is a schematic diagram which shows the operation example of the electronic circuit when the power generation voltage of a perche element is higher than a reference voltage while the motorcycle which concerns on embodiment of this invention is stopped.

Hereinafter, the electronic control unit according to the present invention will be described with reference to the drawings. In the following, the hydraulic pressure control unit of the brake system for a two-wheeled motorcycle will be described, but the electronic control unit according to the present invention is a saddle-riding vehicle other than a two-wheeled motorcycle (for example, a three-wheeled vehicle). It may be used for motorcycles, buggy cars, bicycles, etc.). The saddle-riding type vehicle means a vehicle on which a rider straddles and rides, and includes a scooter and the like. Further, the electronic control unit according to the present invention may be an electronic control unit other than the hydraulic pressure control unit (for example, an engine control unit, a suspension control unit, etc.).

Further, although the case where each of the front wheel braking mechanism and the rear wheel braking mechanism is one is described below, at least one of the front wheel braking mechanism and the rear wheel braking mechanism may be plural, and there may be a plurality of the front wheel braking mechanism and the rear wheel braking mechanism. One of the front wheel braking mechanism and the rear wheel braking mechanism may not be provided. Further, although the case where the main flow path, the sub flow path and the supply flow path are provided in each braking mechanism is described below, the supply flow path may be omitted from the flow path of each braking mechanism.

Further, the configuration and the like described below are examples, and the electronic control unit according to the present invention is not limited to such a configuration and the like.

Further, in the following, the same or similar description is appropriately simplified or omitted. Further, in each figure, the same or similar members or parts are omitted or given the same reference numerals. Further, for the detailed structure, the illustration is simplified or omitted as appropriate.

<Brake system configuration>
A schematic configuration of the brake system 10 according to the embodiment of the present invention will be described with reference to FIGS. 1 and 2.

FIG. 1 is a schematic view showing a schematic configuration of a motorcycle 100 on which a brake system 10 is mounted. FIG. 2 is a schematic view showing a schematic configuration of the brake system 10.

As shown in FIGS. 1 and 2, the brake system 10 is mounted on the motorcycle 100. The motorcycle 100 is rotatably held by the fuselage 1, the handlebar 2 rotatably held by the fuselage 1, the front wheel 3 rotatably held by the fuselage 1 together with the handlebar 2, and the fuselage 1. It is equipped with a rear wheel 4. The motorcycle 100 includes, for example, an engine (not shown), and travels using the power output from the engine. The motorcycle 100 may travel using the power output from the motor.

The brake system 10 includes a first brake operation unit 11, a front wheel braking mechanism 12 that brakes the front wheels 3 in conjunction with at least the first brake operation unit 11, a second brake operation unit 13, and at least the second brake operation unit 13. A rear wheel braking mechanism 14 that brakes the rear wheels 4 in conjunction with the above is provided. Further, the brake system 10 includes a hydraulic pressure control unit 5, and a part of the front wheel braking mechanism 12 and a part of the rear wheel braking mechanism 14 are included in the hydraulic pressure control unit 5. The hydraulic pressure control unit 5 is an electronic control unit having a function of controlling the braking force applied to the front wheels 3 by the front wheel braking mechanism 12 and the braking force applied to the rear wheels 4 by the rear wheel braking mechanism 14.

The first brake operation unit 11 is provided on the handle 2 and is operated by the rider's hand. The first brake operation unit 11 is, for example, a brake lever. The second brake operating unit 13 is provided at the lower part of the body 1 and is operated by the foot of the rider. The second brake operation unit 13 is, for example, a brake pedal.

Each of the front wheel braking mechanism 12 and the rear wheel braking mechanism 14 is held by a master cylinder 21 having a built-in piston (not shown), a reservoir 22 attached to the master cylinder 21, and a brake pad (not shown). A brake caliper 23 having (not shown), a wheel cylinder 24 provided on the brake caliper 23, a main flow path 25 for circulating the brake liquid of the master cylinder 21 to the wheel cylinder 24, and a brake liquid of the wheel cylinder 24. A sub-flow path 26 for releasing the brake liquid and a supply flow path 27 for supplying the brake liquid of the master cylinder 21 to the sub-flow path 26 are provided.

A filling valve (EV) 31 is provided in the main flow path 25. The sub-flow path 26 bypasses between the wheel cylinder 24 side and the master cylinder 21 side of the main flow path 25 with respect to the filling valve 31. The auxiliary flow path 26 is provided with a release valve (AV) 32, an accumulator 33, and a pump 34 in this order from the upstream side. A first valve (USV) 35 is provided between the end of the main flow path 25 on the master cylinder 21 side and the point where the downstream end of the sub flow path 26 is connected. The supply flow path 27 communicates between the master cylinder 21 and the suction side of the pump 34 in the sub flow path 26. The supply flow path 27 is provided with a second valve (HSV) 36. Further, the hydraulic pressure control unit 5 is provided with a motor 37 for driving the pump 34. When the motor 37 is rotationally driven, the plunger (not shown) of the pump 34 is pressed, and the pump 34 sucks and discharges the brake fluid.

The filling valve 31 is, for example, a solenoid valve that opens in a non-energized state and closes in an energized state. The loosening valve 32 is, for example, a solenoid valve that closes in a non-energized state and opens in an energized state. The first valve 35 is, for example, a solenoid valve that opens in a non-energized state and closes in an energized state. The second valve 36 is, for example, a solenoid valve that closes in a non-energized state and opens in an energized state.

The main flow path 25, the sub flow path 26, and the supply flow path 27 are formed inside the substrate 511. The filling valve 31, the loosening valve 32, the accumulator 33, the pump 34, the first valve 35, and the second valve 36 correspond to components for controlling the brake fluid pressure generated in the motorcycle 100, and are incorporated in the base 511. .. The substrate 511 and the above-mentioned components incorporated in the substrate 511 are included in the hydraulic pressure control mechanism 51 of the hydraulic pressure control unit 5. The operation of the hydraulic pressure control mechanism 51 is controlled by the electronic circuit unit 53 described later. As a result, the braking force applied to the front wheels 3 by the front wheel braking mechanism 12 and the braking force applied to the rear wheels 4 by the rear wheel braking mechanism 14 are controlled.

In a normal state (that is, a state in which the ABS operation or the automatic braking operation described later is not executed), the filling valve 31 is opened, the loosening valve 32 is closed, the first valve 35 is opened, and the second valve 36 is opened. It will be closed. As a result, the brake fluid flows from the master cylinder 21 to the wheel cylinder 24 through the main flow path 25 without passing through the sub flow path 26 and the supply flow path 27. When the first brake operation unit 11 is operated in this state, the piston (not shown) of the master cylinder 21 is pushed in the front wheel braking mechanism 12, the hydraulic fluid pressure of the wheel cylinder 24 increases, and the brake caliper A brake pad (not shown) of 23 is pressed against the rotor 3a of the front wheel 3, and a braking force is applied to the front wheel 3. When the second brake operating unit 13 is operated, the piston (not shown) of the master cylinder 21 is pushed into the rear wheel braking mechanism 14, the hydraulic fluid pressure of the wheel cylinder 24 increases, and the brake caliper 23 The brake pad (not shown) is pressed against the rotor 4a of the rear wheel 4, and a braking force is applied to the rear wheel 4.

The ABS operation is executed, for example, when the wheels (specifically, the front wheels 3 or the rear wheels 4) are locked or there is a possibility of locking, and the braking force applied to the wheels is applied to the brake operation unit (specifically, the brake operation unit by the rider). Specifically, it is an operation of reducing the operation regardless of the operation of the first brake operation unit 11 or the second brake operation unit 13).

For example, in the state where the ABS operation is being executed, first, the filling valve 31 is closed, the loosening valve 32 is opened, the first valve 35 is opened, and the second valve 36 is closed. As a result, the flow of the brake fluid between the main flow path 25 and the wheel cylinder 24 is stopped, and the brake fluid can flow from the wheel cylinder 24 to the sub flow path 26. Therefore, the brake fluid flows from the wheel cylinder 24 to the accumulator 33, the hydraulic pressure of the brake fluid of the wheel cylinder 24 decreases, and the braking force applied to the wheels decreases. The brake fluid that has flowed into the accumulator 33 is returned to the main flow path 25 via the sub-flow path 26 by driving the pump 34.

Then, when both the filling valve 31 and the loosening valve 32 are closed from the above state, the flow of the brake fluid between the main flow path 25 and the sub flow path 26 and the wheel cylinder 24 is stopped, and the wheel cylinder The hydraulic pressure of the brake fluid of 24 is maintained, and the braking force applied to the wheels is maintained. After that, the filling valve 31 is opened and the loosening valve 32 is closed, so that the flow of the brake fluid between the main flow path 25 and the wheel cylinder 24 is restarted, and the hydraulic pressure of the brake fluid in the wheel cylinder 24 is increased. It increases and the braking force applied to the wheels increases.

The automatic braking operation is executed when it becomes necessary to stabilize the posture of the motorcycle 100, for example, when the motorcycle 100 is turning, and is applied to the wheels (specifically, the front wheels 3 or the rear wheels 4). This is an operation in which the braking force is generated regardless of the operation of the brake operating unit (specifically, the first brake operating unit 11 or the second brake operating unit 13) by the rider.

For example, in the state where the automatic braking operation is being executed, the filling valve 31 is opened, the loosening valve 32 is closed, the first valve 35 is closed, and the second valve 36 is opened. As a result, the brake fluid flows from the master cylinder 21 to the wheel cylinder 24 via the supply flow path 27 and the sub flow path 26. By driving the pump 34 in this state, the hydraulic pressure of the brake fluid of the wheel cylinder 24 increases, and a braking force for braking the wheels is generated.

<Structure of hydraulic pressure control unit>
The configuration of the hydraulic pressure control unit 5 according to the embodiment of the present invention will be described in more detail with reference to FIG.

FIG. 3 is a schematic cross-sectional view showing the hydraulic pressure control unit 5.

As shown in FIG. 3, the hydraulic pressure control unit 5 includes a hydraulic pressure control mechanism 51, a resin housing 52, and an electronic circuit unit 53.

As described above, the hydraulic pressure control mechanism 51 includes a metal base 511 and components incorporated in the base 511 (specifically, a filling valve 31, a loosening valve 32, an accumulator 33, a pump 34, and a first valve. 35 and a second valve 36 (see FIG. 2)). Further, a main flow path 25, a sub flow path 26, and a supply flow path 27 (see FIG. 2) are formed inside the substrate 511.

The substrate 511 is made of a metal material and has, for example, a substantially rectangular parallelepiped shape. A plurality of ports (not shown) communicating with each flow path are formed on the outer surface of the base 511 (specifically, the surface not covered by the housing 52), and each port has a master cylinder. A brake fluid pipe connected to 21 or a wheel cylinder 24 (see FIG. 2) is attached.

The substrate 511 is provided with a motor 37 and a plurality of drive coils 38 as control targets of the electronic circuit unit 53. The drive coil 38 drives each solenoid valve of the filling valve 31, the loosening valve 32, the first valve 35, and the second valve 36 incorporated in the base 511.

The substrate 511 may be formed of one member or may be formed of a plurality of members. Further, when the substrate 511 is formed of a plurality of members, each component may be separately provided as a member different from each other.

The housing 52 is made of a resin material and has, for example, a hollow substantially rectangular parallelepiped shape. The housing 52 is attached to the base 511 and houses the electronic circuit unit 53.

The housing 52 includes a main body portion 521 and a lid portion 522. The main body 521 is fixed to the base 511 by bolts 54, and the lid 522 is attached to the main body 521. The electronic circuit unit 53 is housed in the space defined by the main body portion 521 and the lid portion 522.

Specifically, the main body portion 521 is formed in a square tubular shape having a bottom portion on the side opposite to the substrate 511 side and opening on the substrate 511 side. A through hole 523 is formed at the bottom of the main body 521. Although the two through holes 523a and 523b are shown as examples of the through holes 523 in FIG. 3, the number of the through holes 523 may be other than 2. The substrate 511 is formed with screw holes 512 (specifically, screw holes 512a provided for through holes 523a and screw holes 512b provided for through holes 523b) coaxially with each through hole 523. Has been done. The bolt 54a is inserted into the through hole 523a of the main body 521 and screwed into the screw hole 512a of the base 511, and the bolt 54b is inserted into the through hole 523b of the main body 521 and screwed into the screw hole 512b of the base 511. There is. As a result, the main body portion 521 is fixed to the substrate 511. A part of the motor 37 provided on the base 511 and a part of each drive coil 38 are covered with the main body portion 521 of the housing 52.

Further, the lid portion 522 is formed in a square tubular shape having a bottom portion on the opposite side to the main body portion 521 side and opening to the main body portion 521 side. The opening of the lid portion 522 is attached to the bottom portion of the main body portion 521. As a result, a space for accommodating the electronic circuit unit 53 is formed between the main body portion 521 and the lid portion 522. The head 541 of each bolt 54 that fixes the main body 521 to the base 511 is in contact with the bottom of the main body 521 in the space between the main body 521 and the lid 522.

The electronic circuit unit 53 includes a substrate 531 and a plurality of electronic components 532 mounted on the wiring of the substrate 531. In FIG. 3, two electronic components 532a and 532b are shown as examples of electronic components 532, but in reality, more electronic components 532 are mounted on the substrate 531.

The substrate 531 is a printed circuit board, and includes a flat plate-shaped member of an insulator and wiring (pattern) of a conductor applied to the flat plate-shaped member. The electronic components 532a and 532b are electrically connected to the lands provided on the wiring of the substrate 531 by soldering or the like, and form an electronic circuit together with the wiring of the substrate 531. The electronic component 532 may be any component that forms an electronic circuit, and may be an active element, a passive element, or other component. The electronic component 532a is mounted on the surface of the substrate 531 on the substrate 511 side. The electronic component 532b is mounted on the surface of the substrate 531 opposite to the substrate 511 side. Further, the terminal 371 of the motor 37 and the terminal 381 of each drive coil 38 are electrically connected to the substrate 531.

In the hydraulic pressure control unit 5 according to the present embodiment, the electronic component 532 is thermally conductively connected to the substrate 511, which is a metal member, via the Pelche element 55. The perche element 55 can transfer heat from one surface of the perche element 55 to the other surface. The heat transfer by the Perche element 55 is generated by supplying electric power to the Perche element 55. The effect of heat transfer in this way is called the Perche effect. By utilizing the Perche effect, heat can be transferred from the electronic component 532 to the substrate 511 via the Perche element 55. Since the Pelche element 55 is smaller than other members for heat dissipation (for example, heat dissipation fins, etc.), the electronic circuit unit 53 can effectively utilize the limited mounting space in the motorcycle 100. The generated heat can be dissipated to the outside.

In the hydraulic pressure control unit 5, specifically, the perche element 55 is provided for each of the electronic components 532a and 532b, and the perche element 55 and the base 511 can conduct heat via the bolt 54. It is connected.

The electronic component 532a is adhered to one surface of the Perche element 55a (specifically, the surface opposite to the surface 511 side of the substrate) by a heat conductive adhesive. The thermally conductive adhesive is an adhesive for heat dissipation having a relatively high thermal conductivity. The other surface of the Pelche element 55a (specifically, the surface on the substrate 511 side) is adhered to the head portion 541a of the bolt 54a by a heat conductive adhesive. Therefore, the heat generated from the electronic component 532a is transferred to the substrate 511 through the perche element 55a and the bolt 54a.

The electronic component 532b can conduct heat with the Pelche element 55b via a heat radiating via 533 formed in a portion of the substrate 531 on which the electronic component 532b is mounted (specifically, a portion facing the electronic component 532b). It is connected. The heat radiating via 533 is a via penetrating the substrate 531 (that is, a hole in which a metal portion is formed from one surface to the other surface of the substrate 531), similarly to the conduction via. However, the heat dissipation via 533 is provided for heat dissipation of the electronic circuit unit 53, unlike the conduction via provided for conduction. From the viewpoint of effectively improving the heat dissipation of the electronic circuit unit 53, it is preferable that the cross-sectional area of the metal portion of the heat-dissipating via 533 is larger than the cross-sectional area of the metal portion of the conduction via. For example, in the heat dissipation via 533, it is preferable that the through hole formed in the substrate 531 is filled with a metal such as copper.

Of the portion of the substrate 531 on which the heat dissipation via 533 is formed, the surface opposite to the surface on which the electronic component 532b is mounted (specifically, the surface on the substrate 511 side) is one surface of the Perche element 55b. (Specifically, the surface opposite to the side of the substrate 511) is adhered with a heat conductive adhesive. A metal spacer 56 is interposed between the perche element 55b and the head portion 541b of the bolt 54b. The other surface of the Pelche element 55b (specifically, the surface on the substrate 511 side) is adhered to the spacer 56 by a heat conductive adhesive. The spacer 56 is adhered to the head portion 541b of the bolt 54b by a heat conductive adhesive. Therefore, the heat generated from the electronic component 532b is transferred to the substrate 511 through the perche element 55b, the spacer 56 and the bolt 54b.

In the above, an example of the heat transfer path between the electronic component 532 and the substrate 511 has been described with reference to FIG. 3, but the heat transfer path between the electronic component 532 and the substrate 511 is described in the above example. Not limited. Specifically, among the members forming the heat transfer path between the electronic component 532 and the substrate 511 in the above example, another member may be added between the adjacent members. For example, a metal member may be added between the electronic component 532a and the perche element 55a, or between the perche element 55a and the bolt 54a. Further, in the above example, some members of the members forming the heat transfer path between the electronic component 532 and the substrate 511 may be omitted. For example, the spacer 56 between the Perche element 55b and the bolt 54b may be omitted, and the Perche element 55b and the bolt 54b may be bonded by a heat conductive adhesive.

Further, although the configuration of the hydraulic pressure control unit 5 has been described above with reference to FIG. 3, the hydraulic pressure control unit according to the present invention is not limited to the example of FIG. For example, the hydraulic pressure control unit according to the present invention has components added to the hydraulic pressure control unit 5 shown in FIG. 3 (for example, a unit in which heat radiation fins are provided on the outer surface of the substrate 511, etc.). ) May be.

<Operation of hydraulic pressure control unit>
The operation of the hydraulic pressure control unit 5 according to the embodiment of the present invention will be described with reference to FIGS. 4 to 8.

FIG. 4 is a schematic configuration of an electronic circuit of the hydraulic pressure control unit 5.

As shown in FIG. 4, the hydraulic pressure control unit 5 includes a Perche element 55, an ASIC (Application Specific Integrated Circuit) 101, a microcontroller 102, a temperature sensor 103, an AND circuit 104, and an OR circuit 105. Including, it is connected to the external battery 6 of the hydraulic pressure control unit 5. Note that, in FIG. 4, for ease of understanding, only one block showing the perche element 55 is shown. For example, each perche element 55 is connected in series with each other. The microcontroller 102 corresponds to an example of the control unit according to the present invention. Hereinafter, an example in which the voltage of the battery 6 is 12 [V] will be described, but the voltage of the battery 6 is not limited to this example.

The ASIC 101 is connected to the battery 6 via the wiring L1 and the wiring L2. Therefore, power is supplied to the ASIC 101 via the wiring L1. The wiring L2 is provided with a switch S1. The switch S1 opens and closes according to the operation of the ignition switch. Specifically, the switch S1 closes when the ignition switch is ON, and the switch S1 opens when the ignition switch is OFF. The ASIC 101 supplies electric power to the microcontroller 102 via the wiring L3. The ASIC 101 has a function of suppressing the current flowing from the wiring L1 to the wiring L2 and the current flowing from the wiring L2 to the wiring L1. The ASIC 101 supplies electric power to the temperature sensor 103 via the wiring L4 connected to the wiring L3.

The temperature sensor 103 detects the temperature of the electronic component 532. The physical quantity detected by the temperature sensor 103 may be a physical quantity corresponding to a typical temperature of the electronic component 532. For example, the temperature of any one of the plurality of electronic components 532 and the temperature of each electronic component 532. It may be an average value, or the temperature of a portion of the electronic circuit unit 53 in the vicinity of the electronic component 532. The temperature sensor 103 outputs the detection result to the microcontroller 102 via the wiring L5.

The microcontroller 102 outputs a signal Tempout that changes according to the temperature of the electronic component 532 to the OR circuit 105 via the wiring L6. Further, the microcontroller 102 outputs a signal Vaout, which changes according to the voltage Va described later, to the AND circuit 104 via the wiring L7.

The wiring L8 is connected to the portion of the wiring L2 between the switch S1 and the ASIC 101. The wiring L8 is connected to the AND circuit 104. The output of the AND circuit 104 is input to the OR circuit 105 via the wiring L9.

Wiring L10 is connected to wiring L1. The wiring L10 is connected to the Pelche element 55. The wiring L10 is provided with a switch S2. The switch S2 opens and closes according to the output of the OR circuit 105. A resistor R1 and a resistor R2 are connected to a portion of the wiring L10 between the Perche element 55 and the switch S2. The resistor R1 and the resistor R2 are connected in series with each other. The generated voltage Vp of the Pelche element 55 becomes a voltage Va at the connection portion between the resistor R1 and the resistor R2 due to the resistance division of the resistor R1 and the resistor R2.

For example, when the resistor R1 is 600 [kΩ] and the resistor R2 is 100 [kΩ], the voltage Va is one-seventh (that is, one-seventh) of the generated voltage Vp. Therefore, when the generated voltage Vp is 10 [V], the voltage Va is about 1.4 [V], and when the generated voltage Vp is 15 [V], the voltage Va is about 2.1 [V]. Hereinafter, an example in which the resistor R1 is 600 [kΩ] and the resistor R2 is 100 [kΩ] will be described, but the resistance values of the resistors R1 and R2 are not limited to this example.

The voltage Va of the connection portion between the resistor R1 and the resistor R2 is input to the OR circuit 105 via the wiring L11. Further, the voltage Va of the connection portion between the resistor R1 and the resistor R2 is input to the microcontroller 102 via the wiring L12 connected to the wiring L11.

Hereinafter, the input / output voltages in the AND circuit 104 and the OR circuit 105 will be described by classifying them into two values, a high voltage (1) and a low voltage (0). High voltage means a voltage higher than the reference value, and low voltage means a voltage lower than the reference value. Hereinafter, an example in which the reference value is 2 [V] will be described, but the reference value is not limited to this example.

The AND circuit 104 outputs a high voltage to the OR circuit 105 when both the input voltage from the wiring L7 and the input voltage from the wiring L8 are high voltages. On the other hand, the AND circuit 104 outputs a low voltage to the OR circuit 105 when at least one of the input voltage from the wiring L7 and the input voltage from the wiring L8 is a low voltage.

The OR circuit 105 outputs a high voltage to the switch S2 when at least one of the input voltage from the wiring L6, the input voltage from the wiring L9, and the input voltage from the wiring L11 is a high voltage. On the other hand, the OR circuit 105 outputs a low voltage to the switch S2 when all of the input voltage from the wiring L6, the input voltage from the wiring L9, and the input voltage from the wiring L11 are low voltages. When a high voltage is input to the switch S2, the switch S2 closes, and when a low voltage is input to the switch S2, the switch S2 opens.

The microcontroller 102 controls the operation of the AND circuit 104 and the OR circuit 105 to open and close the switch S2 to control the operation of the perche element 55.

As described above, the microcontroller 102 outputs a signal Tempout to the OR circuit 105. The signal Tempout becomes a high voltage when the temperature of the electronic component 532 is higher than the reference temperature, and becomes a low voltage when the temperature of the electronic component 532 is lower than the reference temperature. The reference temperature is high enough that the electronic component 532 needs to be cooled.

As described above, the microcontroller 102 outputs a signal vaout to the AND circuit 104. The signal Vaout becomes a high voltage when the voltage Va is higher than the threshold value, and becomes a low voltage when the voltage Va is lower than the threshold value. The threshold value is set to a value at which it can be determined that the generated voltage Vp of the Pelche element 55 is lower than the voltage of the battery 6 but is likely to reach the voltage of the battery 6. When the generated voltage Vp is 12 [V], which is the voltage of the battery 6, the voltage Va is about 1.7 [V]. Therefore, the threshold value is, for example, a value lower than 1.7 [V], but such that the generated voltage Vp is more likely to reach the voltage of the battery 6 (for example, 1.5 [V]). Hereinafter, an example in which the threshold value is 1.5 [V] will be described, but the threshold value is not limited to this example.

The microcontroller 102 can execute heat transfer control and power supply control by performing the above processing.

The heat transfer control is a control in which electric power is supplied to the Pelche element 55 to transfer heat in the direction from the electronic component 532 to the substrate 511. Specifically, the heat transfer control is executed when the temperature of the electronic component 532 is higher than the reference temperature during the operation of the motorcycle 100.

The power supply control is a control for supplying the generated power of the Pelche element 55 to the power supply target (specifically, the microcontroller 102 and the battery 6). In the perche element 55, an electromotive force is generated when a temperature difference occurs between one surface and the other surface of the perche element 55. The effect of generating an electromotive force due to the temperature difference in this way is called the Seebeck effect. During the operation of the motorcycle 100, the temperature difference between one surface and the other surface of the Perche element 55 is relatively small. On the other hand, while the motorcycle 100 is stopped, for example, due to the influence of direct sunlight, the temperature difference between one surface and the other surface of the Pelche element 55 may become relatively large. Therefore, specifically, when the power generation voltage Vp of the Pelche element 55 is higher than the reference voltage while the motorcycle 100 is stopped, the power supply control is executed. The reference voltage is a voltage high enough to stably supply the generated power to the power supply target, and is, for example, a value higher than the voltage of the battery 6 (for example, about 14.5 V). Hereinafter, an example in which the reference voltage is 14.5 [V] will be described, but the reference voltage is not limited to this example.

FIG. 5 is a schematic view showing an operation example of an electronic circuit when the temperature of the electronic component 532 is lower than the reference temperature during the operation of the motorcycle 100.

As shown in FIG. 5, since the ignition switch is ON during the operation of the motorcycle 100, the switch S1 is closed. Further, during the operation of the motorcycle 100, as described above, the temperature difference between one surface and the other surface of the Perche element 55 is relatively small. Therefore, the generated voltage Vp is, for example, about 2 [V], and the voltage Va is about 0.3 [V]. Therefore, although the input voltage from the wiring L8 to the AND circuit 104 is a high voltage, the input voltage from the wiring L7 to the AND circuit 104 (that is, the voltage of the signal Vaout) is a low voltage. As a result, the output of the AND circuit 104 becomes a low voltage. That is, the input voltage from the wiring L9 to the OR circuit 105 is a low voltage. Further, since the voltage Va is about 0.3 [V], which is lower than the threshold value (that is, 1.5 [V]), the input voltage from the wiring L11 to the OR circuit 105 becomes a low voltage.

Here, since the temperature of the electronic component 532 is lower than the reference temperature, the input voltage from the wiring L6 to the OR circuit 105 (that is, the voltage of the signal Tempout) becomes a low voltage. Therefore, the input voltage from the wiring L6 to the OR circuit 105, the input voltage from the wiring L9 to the OR circuit 105, and the input voltage from the wiring L11 to the OR circuit 105 are all low voltages, so that the OR circuit 105 A low voltage is output to the switch S2. Therefore, the switch S2 is in the open state.

As described above, when the temperature of the electronic component 532 is lower than the reference temperature during the operation of the motorcycle 100, the switch S2 is in the open state. Further, as shown by an arrow in FIG. 5, power is supplied from the battery 6 to the microcontroller 102 and the temperature sensor 103.

FIG. 6 is a schematic view showing an operation example of an electronic circuit when the temperature of the electronic component 532 is higher than the reference temperature during the operation of the motorcycle 100.

In the example shown in FIG. 6, the motorcycle 100 is in operation, and the ignition switch is ON as in the example shown in FIG. 5, so that the switch S1 is closed. Further, as in the example shown in FIG. 5, the voltage Va is about 0.3 [V], which is lower than the threshold value (that is, 1.5 [V]), so that the input voltage from the wiring L8 to the AND circuit 104 is high. Although it is a voltage, the voltage of the signal Vaout becomes a low voltage. As a result, the output of the AND circuit 104 becomes a low voltage, and the input voltage from the wiring L9 to the OR circuit 105 becomes a low voltage. Further, since the voltage Va is about 0.3 [V], the input voltage from the wiring L11 to the OR circuit 105 is a low voltage.

Here, unlike the example shown in FIG. 5, since the temperature of the electronic component 532 is higher than the reference temperature, the input voltage from the wiring L6 to the OR circuit 105 (that is, the voltage of the signal Tempout) becomes a high voltage. Therefore, of the input voltage from the wiring L6 to the OR circuit 105, the input voltage from the wiring L9 to the OR circuit 105, and the input voltage from the wiring L11 to the OR circuit 105, the input voltage from the wiring L6 becomes the higher voltage. Therefore, a high voltage is output from the OR circuit 105 to the switch S2. Therefore, the switch S2 is in the closed state.

As described above, when the temperature of the electronic component 532 is higher than the reference temperature during the operation of the motorcycle 100, the switch S2 is in the closed state. Further, the generated voltage Vp of the Pelche element 55 is lower than the voltage of the battery 6. Therefore, as indicated by the arrows in FIG. 6, in addition to power being supplied from the battery 6 to the microcontroller 102 and the temperature sensor 103, power is also supplied from the battery 6 to the perche element 55 (that is, transmission). Thermal control is performed). As a result, heat transfer occurs in the direction from the electronic component 532 toward the substrate 511, and the heat generated from the electronic circuit unit 53 is dissipated to the outside. Therefore, the electronic component 532 is cooled.

Here, in heat transfer control, the larger the electric power supplied to the Pelche element 55, the larger the amount of heat per unit time transported via the Pelche element 55. That is, the heat dissipation of the electronic circuit unit 53 can be improved. Therefore, from the viewpoint of appropriately changing the heat dissipation property of the electronic circuit unit 53 according to the temperature of the electronic component 532, the microcontroller 102 supplies the perche element 55 as the temperature of the electronic component 532 increases in the heat transfer control. It is preferable to increase the power.

FIG. 7 is a schematic diagram showing an operation example of an electronic circuit when the generated voltage Vp of the Pelche element 55 is lower than the reference voltage while the motorcycle 100 is stopped.

As shown in FIG. 7, since the ignition switch is OFF while the motorcycle 100 is stopped, the switch S1 is open. Therefore, the input voltage from the wiring L8 to the AND circuit 104 is low, and the output of the AND circuit 104 is low. That is, the input voltage from the wiring L9 to the OR circuit 105 is a low voltage. Further, when the motorcycle 100 is stopped, the temperature of the electronic component 532 is basically lower than the reference temperature, so that the input voltage from the wiring L6 to the OR circuit 105 (that is, the voltage of the signal Tempout) becomes a low voltage. ..

Here, in the example shown in FIG. 7, the generated voltage Vp is lower than the reference voltage (that is, 14.5 [V]), for example, about 10 [V]. In this case, since the voltage Va is about 1.4 [V], the input voltage from the wiring L11 to the OR circuit 105 is a low voltage. Therefore, the input voltage from the wiring L6 to the OR circuit 105, the input voltage from the wiring L9 to the OR circuit 105, and the input voltage from the wiring L11 to the OR circuit 105 are all low voltages, so that the OR circuit 105 A low voltage is output to the switch S2. Therefore, the switch S2 is in the open state.

As described above, when the generated voltage Vp of the Pelche element 55 is lower than the reference voltage while the motorcycle 100 is stopped, the switch S2 is in an open state. Further, as shown by an arrow in FIG. 7, power is supplied from the battery 6 to the microcontroller 102 and the temperature sensor 103.

FIG. 8 is a schematic diagram showing an operation example of an electronic circuit when the generated voltage Vp of the Pelche element 55 is higher than the reference voltage while the motorcycle 100 is stopped.

In the example shown in FIG. 8, since the motorcycle 100 is stopped, the ignition switch is turned off, so that the switch S1 is open, as in the example shown in FIG. 7. Therefore, the input voltage from the wiring L8 to the AND circuit 104 is low, and the output of the AND circuit 104 is low. That is, the input voltage from the wiring L9 to the OR circuit 105 is a low voltage. Further, when the motorcycle 100 is stopped, the temperature of the electronic component 532 is basically lower than the reference temperature, so that the input voltage from the wiring L6 to the OR circuit 105 (that is, the voltage of the signal Tempout) becomes a low voltage. ..

Here, in the example shown in FIG. 8, unlike the example shown in FIG. 7, the generated voltage Vp is higher than the reference voltage (that is, 14.5 [V]), for example, about 15 [V]. .. In this case, since the voltage Va is about 2.1 [V], the input voltage from the wiring L11 to the OR circuit 105 becomes a high voltage. Therefore, of the input voltage from the wiring L6 to the OR circuit 105, the input voltage from the wiring L9 to the OR circuit 105, and the input voltage from the wiring L11 to the OR circuit 105, the input voltage from the wiring L11 becomes the higher voltage. Therefore, a high voltage is output from the OR circuit 105 to the switch S2. Therefore, the switch S2 is in the closed state.

As described above, when the generated voltage Vp of the Perche element 55 is higher than the reference voltage while the motorcycle 100 is stopped, the switch S2 is closed. Further, the generated voltage Vp of the Pelche element 55 is higher than the voltage of the battery 6. Therefore, as shown by the arrow in FIG. 8, the generated power of the Pelche element 55 is supplied from the Pelche element 55 to the microcontroller 102 and the battery 6 which are the power supply targets (that is, the power supply control is executed). As a result, the power consumption of the microcontroller 102 can be covered without using the power of the battery 6, and the battery 6 can be charged.

By the way, it is conceivable that the generated voltage Vp exceeds the voltage of the battery 6 due to the increase in the temperature difference between one surface and the other surface of the Perche element 55 during the operation of the motorcycle 100. Here, during the operation of the motorcycle 100, it becomes necessary to supply electric power to a supply destination (for example, the motor 37 and the drive coil 38) to which electric power is not supplied while the motorcycle 100 is stopped. Therefore, the power consumption of the microcontroller 102 is larger than that when the motorcycle 100 is stopped. Therefore, if the power supply control is executed when the generated voltage Vp exceeds the voltage of the battery 6, the generated power of the Pelche element 55 may be insufficient with respect to the power consumption of the microcontroller 102. Therefore, from the viewpoint of suppressing the shortage of the electric power supplied to the microcontroller 102, it is preferable that the microcontroller 102 prohibits the power supply control during the operation of the motorcycle 100.

For example, even when the temperature of the electronic component 532 is lower than the reference temperature during the operation of the motorcycle 100, when the generated voltage Vp rises to about 11 [V] near the voltage of the battery 6. The electronic circuit of the hydraulic pressure control unit 5 is in the same state as in FIG. Specifically, since the motorcycle 100 is in operation, the ignition switch is ON, so the switch S1 is closed. Therefore, the input voltage from the wiring L8 to the AND circuit 104 becomes a high voltage.

Here, since the generated voltage Vp is about 11 [V], the voltage Va is about 1.6 [V]. Therefore, since the voltage Va is higher than the threshold value of the voltage Va (that is, 1.5 [V]), the voltage of the signal Vaout becomes a high voltage. As a result, both the input voltage from the wiring L7 to the AND circuit 104 and the input voltage from the wiring L8 to the AND circuit 104 become high voltages, so that the output of the AND circuit 104 becomes a high voltage. Therefore, of the input voltage from the wiring L6 to the OR circuit 105, the input voltage from the wiring L9 to the OR circuit 105, and the input voltage from the wiring L11 to the OR circuit 105, the input voltage from the wiring L9 becomes the higher voltage. Therefore, a high voltage is output from the OR circuit 105 to the switch S2. Therefore, the switch S2 is in the closed state.

As described above, even when the temperature of the electronic component 532 is lower than the reference temperature during the operation of the motorcycle 100, the generated voltage Vp rises to about 11 [V] near the voltage of the battery 6. (Specifically, when the generated voltage Vp is higher than the threshold value), the switch S2 is in the closed state. As a result, power is supplied from the battery 6 to the Pelche element 55 (that is, heat transfer control is executed). As a result, it is suppressed that the generated voltage Vp exceeds the voltage of the battery 6, so that the generated power of the Pelche element 55 is suppressed from being supplied to the microcontroller 102. In this case, the heat transfer in the direction from the electronic component 532 to the substrate 511 occurs to a small extent as compared with the example shown in FIG.

In the above description, an example in which the microcontroller 102 is provided as the control unit according to the present invention has been described, but a part or all of the control unit according to the present invention may be configured by an updatable device such as firmware. , A program module or the like executed by a command from a CPU or the like. The control unit according to the present invention may be, for example, one or may be divided into a plurality of control units.

<Effect of hydraulic pressure control unit>
The effect of the hydraulic pressure control unit 5 according to the embodiment of the present invention will be described.

In the hydraulic pressure control unit 5, the electronic component 532 is thermally conductively connected to a metal member (for example, the substrate 511) via the Pelche element 55. As a result, in the motorcycle 100, the heat generated from the electronic circuit unit 53 can be dissipated to the outside by effectively utilizing the limited mounting space. Therefore, in the motorcycle 100, it is possible to improve the heat dissipation of the electronic circuit unit 53 while suppressing the increase in size of the hydraulic pressure control unit 5.

Preferably, in the hydraulic pressure control unit 5, the resin housing 52 accommodating the electronic circuit unit 53 and the housing 52 are attached, and the control target of the electronic circuit unit 53 (for example, the motor 37 and the drive coil 38) is set. The metal base 511 provided is provided, and the above-mentioned metal member is the base 511. As a result, the heat generated from the electronic circuit unit 53 can be transferred to the metal substrate 511 and dissipated to the outside from the substrate 511.

The metal member in the hydraulic pressure control unit according to the present invention (that is, a metal member that is thermally conductively connected to the electronic component 532 via the Pelche element 55) may be a member other than the substrate 511. .. For example, in the hydraulic pressure control unit according to the present invention, even if the housing 52 is made of metal, the heat generated from the electronic circuit unit 53 is transferred to the housing 52 and radiated to the outside from the housing 52. good. In such a case, the substrate 511 and the housing 52 may be separated from each other, and the electronic circuit unit 53 may be housed in the housing 52.

Preferably, in the hydraulic pressure control unit 5, the housing 52 is formed with a through hole 523, the substrate 511 is formed with a screw hole 512, and the housing 52 is inserted through the through hole 523. It is fixed to the base 511 by a bolt 54 screwed into the screw hole 512, and the Perche element 55 and the base 511 are electrically conductively connected to each other via the bolt 54. Thereby, the heat generated from the electronic component 532 can be transferred to the substrate 511 through the perche element 55 and the bolt 54. Therefore, it is possible to appropriately dissipate the heat generated from the electronic circuit unit 53 from the substrate 511 to the outside.

Preferably, in the hydraulic pressure control unit 5, a heat radiating via 533 penetrating the board 531 is provided in a portion of the substrate 531 on which the electronic component 532b is mounted, and the electronic component 532b and the Pelche element 55b dissipate heat. It is heat conductively connected via a via 533. Thereby, it is possible to appropriately realize that the heat generated from the electronic component 532b mounted on the surface of the substrate 531 opposite to the substrate 511 side is dissipated from the substrate 511 to the outside.

Preferably, in the hydraulic pressure control unit 5, the cross-sectional area of the metal portion of the heat dissipation via 533 is larger than the cross-sectional area of the metal portion of the conduction via of the substrate 531. Thereby, the thermal resistance in the heat radiating via 533 can be reduced. Therefore, heat conduction in the heat dissipation via 533 can be promoted. Therefore, the heat dissipation of the electronic circuit unit 53 is effectively improved.

Preferably, the hydraulic pressure control unit 5 includes a microcontroller 102 as a control unit that controls the operation of the Perche element 55, and the microcontroller 102 supplies power to the Perche element 55 from the electronic component 532 to the metal member. Performs heat transfer control that transfers heat in the direction of the direction. Thereby, the heat generated from the electronic circuit unit 53 can be appropriately dissipated to the outside by using the Pelche element 55.

Preferably, in the hydraulic pressure control unit 5, the microcontroller 102 as a control unit executes heat transfer control when the temperature of the electronic component 532 is higher than the reference temperature during the operation of the motorcycle 100. Thereby, the heat transfer control can be appropriately executed depending on whether or not the electronic component 532 needs to be cooled.

Preferably, in the hydraulic pressure control unit 5, the microcontroller 102 as a control unit increases the power supplied to the perche element 55 as the temperature of the electronic component 532 increases in the heat transfer control. Thereby, the amount of heat per unit time transported via the Perche element 55 can be changed according to the temperature of the electronic component 532. Therefore, the heat dissipation of the electronic circuit unit 53 can be appropriately changed according to the temperature of the electronic component 532.

Preferably, in the hydraulic pressure control unit 5, the microcontroller 102 as a control unit executes power supply control for supplying the generated power of the Pelche element 55 to the power supply target (for example, the microcontroller 102 and the battery 6). As a result, the generated power of the Perche element 55 generated due to the temperature difference in the Perche element 55 can be effectively used. Therefore, the electricity cost can be improved.

Preferably, in the hydraulic pressure control unit 5, the microcontroller 102 as a control unit executes power supply control when the generated voltage of the Pelche element 55 is higher than the reference voltage while the motorcycle 100 is stopped. As a result, the power supply control can be executed when the generated power of the Pelche element 55 can be stably supplied to the power supply target.

Preferably, in the hydraulic pressure control unit 5, the microcontroller 102 as a control unit prohibits power supply control during the operation of the motorcycle 100. As a result, it is possible to suppress the supply of the generated power of the Pelche element 55 to the microcontroller 102 during the operation of the motorcycle 100, so that it is possible to suppress the shortage of the power supplied to the microcontroller 102. Can be done.

Preferably, in the hydraulic pressure control unit 5, the power supply target includes the microcontroller 102 as a control unit. As a result, the power consumption of the microcontroller 102 can be covered by the generated power of the Pelche element 55 without using the power of the battery 6.

Preferably, in the hydraulic pressure control unit 5, the power supply target includes the battery 6 outside the hydraulic pressure control unit 5. As a result, the battery 6 can be charged by the generated power of the Pelche element 55.

The present invention is not limited to the description of embodiments. For example, only some of the embodiments may be implemented.

1 Body, 2 Handles, 3 Front Wheels, 3a Rotor, 4 Rear Wheels, 4a Rotor, 5 Hydraulic Control Unit, 6 Battery, 10 Brake System, 11 1st Brake Operation Unit, 12 Front Wheel Braking Mechanism, 13 2nd Brake Operation Unit , 14 Rear wheel braking mechanism, 21 Master cylinder, 22 Reservoir, 23 Brake caliper, 24 Wheel cylinder, 25 Main flow path, 26 Sub flow path, 27 Supply flow path, 31 Fill valve, 32 Loosening valve, 33 Accumulator, 34 Pump , 35 1st valve, 36 2nd valve, 37 motor, 38 drive coil, 51 hydraulic control mechanism, 52 housing, 53 electronic circuit unit, 54 volt, 54a volt, 54b volt, 55 pelche element, 55a pelche element, 55b Perche element, 56 spacer, 100 motorcycle, 101 ASIC, microcontroller, 103 temperature sensor, 104 AND circuit, 105 OR circuit, 371 terminal, 381 terminal, 511 substrate, 512 screw hole, 512a screw hole, 512b screw hole, 521 Main body, 522 lid, 523 through hole, 523a through hole, 523b through hole, 513 board, 532 electronic component, 532a electronic component, 532b electronic component, 533 heat dissipation via, 541 head, 541a head, 541b head Parts, L1 wiring, L2 wiring, L3 wiring, L4 wiring, L5 wiring, L6 wiring, L7 wiring, L8 wiring, L9 wiring, L10 wiring, L11 wiring, L12 wiring, R1 resistance, R2 resistance, S1 switch, S2 switch.

Claims (14)

It is an electronic control unit (5) of a saddle-riding vehicle (100).
An electronic circuit unit (53) including a substrate (531) and an electronic component (532) mounted on the wiring of the substrate (531).
With metal members (511, 52),
With the Perche element (55),
With
The electronic component (532) is thermally conductively connected to the metal member (511, 52) via the Perche element (55).
Electronic control unit. A resin housing (52) accommodating the electronic circuit unit (53) and
A metal substrate (511) to which the housing (52) is attached and a control target (37, 38) of the electronic circuit unit (53) is provided.
With
The metal member is the substrate (511).
The electronic control unit according to claim 1. A through hole (523) is formed in the housing (52).
A screw hole (512) is formed in the substrate (511).
The housing (52) is fixed to the substrate (511) by a bolt (54) that is inserted into the through hole (523) and screwed into the screw hole (512).
The perche element (55) and the substrate (511) are thermally conductively connected via the bolt (54).
The electronic control unit according to claim 2. A metal housing (52) for accommodating the electronic circuit unit (53) is provided.
The metal member is the housing (52).
The electronic control unit according to claim 1. A heat radiating via (533) penetrating the substrate (531) is provided at a portion of the substrate (531) on which the electronic component (532b) is mounted.
The electronic component (532b) and the Perche element (55b) are thermally conductively connected via the heat dissipation via (533).
The electronic control unit according to any one of claims 1 to 4. The cross-sectional area of the metal portion of the heat-dissipating via (533) is larger than the cross-sectional area of the metal portion of the conduction via of the substrate (531).
The electronic control unit according to claim 5. A control unit (102) for controlling the operation of the perche element (55) is provided.
The control unit (102) executes heat transfer control in which heat is transferred from the electronic component (532) toward the metal member (511, 52) by supplying electric power to the perche element (55).
The electronic control unit according to any one of claims 1 to 6. The control unit (102) executes the heat transfer control when the temperature of the electronic component (532) is higher than the reference temperature during the operation of the saddle-riding vehicle (100).
The electronic control unit according to claim 7. In the heat transfer control, the control unit (102) increases the power supplied to the perche element (55) as the temperature of the electronic component (532) increases.
The electronic control unit according to claim 7 or 8. The control unit (102) executes power supply control for supplying the generated power of the Pelche element (55) to the power supply target (102, 6).
The electronic control unit according to any one of claims 7 to 9. The control unit (102) executes the power supply control when the generated voltage of the perche element (55) is higher than the reference voltage while the saddle-riding vehicle (100) is stopped.
The electronic control unit according to claim 10. The control unit (102) prohibits the power supply control while the saddle-riding vehicle (100) is in operation.
The electronic control unit according to claim 10 or 11. The power supply target includes the control unit (102).
The electronic control unit according to any one of claims 10 to 12. The power supply target includes a battery (6) external to the electronic control unit (5).
The electronic control unit according to any one of claims 10 to 13.

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