JP2021132059A - Multilayer ceramic electronic component, tape packaging body and circuit board - Google Patents

Abstract

To provide a multilayer ceramic electronic component capable of preventing a mounting defect, a circuit board with the same, etc.SOLUTION: A multilayer ceramic electronic component comprises a ceramic element assembly and an external electrode. The ceramic element assembly includes a principal surface oriented in a first axial direction, an end face oriented in a second axial direction, and a side face oriented in a third axial direction. The external electrode covers the end face and extends to the principal surface and the side face. The external electrode includes: a first electrode principal surface and a second electrode principal surface which are oriented in the first axial direction; an electrode end face oriented in the second axial direction; and a first electrode side face and a second electrode side face which are oriented in the third axial direction. At least one of the first electrode side face and the second electrode side face is formed in a groove shape which is recessed inward in the third axial direction and includes a recess which reaches at least one of the electrode end face and the second electrode principal surface.SELECTED DRAWING: Figure 1

Description

The present invention relates to a laminated ceramic electronic component, and a tape package and a circuit board including the same.

A laminated ceramic electronic component such as a laminated ceramic capacitor includes a ceramic element (laminated body) including a plurality of laminated internal electrodes, and a pair of external electrodes covering an end portion of the ceramic element. In monolithic ceramic electronic components, the external electrodes are typically connected to the land of the circuit board by soldering or the like.

For example, when soldering an external electrode to a circuit board by the reflow method, as described in paragraph 0005 and FIG. 9 of Patent Document 1, forces of different magnitudes are applied to the two external electrodes, and the laminated ceramic electronic component Sometimes lost balance. As a result, a so-called Manhattan phenomenon may occur in which one of the external electrodes is separated from the circuit board and the monolithic ceramic capacitor rises.

Patent Document 1 describes a laminated ceramic component formed so that the pull-out width dimension of the internal electrode and the external electrode connected to the internal electrode are gradually reduced from the lower stage to the upper stage from the viewpoint of preventing the Manhattan phenomenon.

Japanese Unexamined Patent Publication No. 2000-68148

However, in the laminated ceramic component of Patent Document 1, it is difficult to control the shape of the external electrodes, and when the shapes of the pair of external electrodes are different, it is difficult to prevent mounting defects such as the Manhattan phenomenon.

In view of the above circumstances, an object of the present invention is to provide a laminated ceramic electronic component capable of preventing mounting defects, and a tape package and a circuit board provided with the laminated ceramic electronic component.

In order to achieve the above object, the laminated ceramic electronic component according to one embodiment of the present invention includes a ceramic body, a first external electrode, and a second external electrode.
The ceramic element body includes a first main surface and a second main surface oriented in the first axial direction, a first end surface and a second end surface oriented in the second axial direction orthogonal to the first axis, and the first. A plurality of internal electrodes drawn out to the first end surface or the second end surface and laminated in the first axis direction, and the first side surface and the second side surface oriented in the third axis direction orthogonal to the axis and the second axis. And have.
The first external electrode covers the first end surface and extends to the first main surface and the second main surface, and the first side surface and the second side surface.
The second external electrode covers the second end surface and extends to the first main surface and the second main surface, and the first side surface and the second side surface.
The first external electrode and the second external electrode are respectively
The first electrode main surface and the second electrode main surface facing the first axial direction,
The electrode end face facing the second axis direction and
It has a first electrode side surface and a second electrode side surface facing in the third axial direction.
At least one of the first electrode side surface and the second electrode side surface
It is formed in a groove shape that is recessed inward in the third axial direction, and includes a recess that reaches at least one of the electrode end surface and the second electrode main surface.

In this configuration, for example, the second electrode main surface is arranged so as to face the mounting substrate, and the second electrode main surface and the electrode end surface are connected to the mounting substrate by soldering. At this time, since at least one of the side surface of the first electrode or the side surface of the second electrode has the recess, the side surface of the first electrode and / or the first surface along the recess from at least one of the end surface of the electrode or the main surface of the second electrode. The solder can be sufficiently wetted on the side surfaces of the two electrodes. As a result, the side surface of the first electrode and / or the side surface of the second electrode are sufficiently bonded to the solder. Therefore, it is possible to suppress the Manhattan phenomenon caused by the difference in the wetting of the solder on the electrode end faces of the first external electrode and the second external electrode, and it is possible to prevent mounting defects.

At least one of the first electrode side surface and the second electrode side surface
It may include a plurality of recesses each formed in a groove shape that is recessed inward in the third axial direction and reaches at least one of the electrode end surface and the second electrode main surface.
As a result, the solder spreads over a wider area on the side surface of the first electrode and / or the side surface of the second electrode along the plurality of recesses, and the Manhattan phenomenon can be more reliably suppressed.

The recess may be recessed inward in the third axial direction at a depth of 1 μm or more and 50 μm or less.
As a result, the effect of inducing the solder by the recesses can be more reliably exerted.

The width orthogonal to the extending direction of the recess may be 10 μm or more and 50 μm or less.
As a result, the effect of inducing the solder by the recesses can be more reliably exerted.

For example, the dimension of the laminated ceramic electronic component in the first axial direction may be larger than the dimension of the laminated ceramic electronic component in the third axial direction.
With the above ceramic body, the balance is particularly liable to be lost at the time of mounting, and mounting defects such as the Manhattan phenomenon are liable to occur. By providing the recesses on at least one of the side surface of the first electrode or the side surface of the second electrode of the multilayer ceramic capacitor provided with the ceramic element, mounting defects can be effectively suppressed.

The tape package according to another embodiment of the present invention includes a laminated ceramic electronic component, a carrier tape, and a cover tape.
The carrier tape has a component accommodating portion for accommodating the laminated ceramic electronic component.
The cover tape is attached to the carrier tape so as to cover the component housing portion.
The laminated ceramic electronic component has a ceramic body, a first external electrode, and a second external electrode.
The ceramic element body includes a first main surface and a second main surface oriented in the first axial direction, a first end surface and a second end surface oriented in the second axial direction orthogonal to the first axis, and the first. A plurality of internal electrodes drawn out to the first end surface or the second end surface and laminated in the first axis direction, and the first side surface and the second side surface oriented in the third axis direction orthogonal to the axis and the second axis. And have.
The first external electrode covers the first end surface and extends to the first main surface and the second main surface, and the first side surface and the second side surface.
The second external electrode covers the second end surface and extends to the first main surface and the second main surface, and the first side surface and the second side surface.
The first external electrode and the second external electrode are respectively
The first electrode main surface and the second electrode main surface facing the first axial direction,
The electrode end face facing the second axis direction and
It has a first electrode side surface and a second electrode side surface facing in the third axial direction.
At least one of the first electrode side surface and the second electrode side surface
It is formed in a groove shape that is recessed inward in the third axial direction, and includes a recess that reaches at least one of the electrode end surface and the second electrode main surface.
The component accommodating portion includes a bottom surface in contact with the main surface of the second electrode.

The circuit board according to still another embodiment of the present invention includes a mounting board, a laminated ceramic electronic component, and first solder and second solder.
The laminated ceramic electronic component has a ceramic body, a first external electrode, and a second external electrode, and is arranged so that the second main surface faces the mounting substrate.
The ceramic element body includes a first main surface and a second main surface oriented in the first axial direction, a first end surface and a second end surface oriented in the second axial direction orthogonal to the first axis, and the first. A plurality of internal electrodes drawn out to the first end surface or the second end surface and laminated in the first axis direction, and the first side surface and the second side surface oriented in the third axis direction orthogonal to the axis and the second axis. And have.
The first external electrode covers the first end surface and extends to the first main surface and the second main surface, and the first side surface and the second side surface.
The second external electrode covers the second end surface and extends to the first main surface and the second main surface, and the first side surface and the second side surface.
The first solder and the second solder connect the first external electrode, the second external electrode, and the mounting substrate, respectively.
The first external electrode and the second external electrode are respectively
The first electrode main surface and the second electrode main surface facing the first axial direction,
The electrode end face facing the second axis direction and
It has a first electrode side surface and a second electrode side surface facing in the third axial direction.
At least one of the first electrode side surface and the second electrode side surface
It is formed in a groove shape that is recessed inward in the third axial direction, and includes a recess that reaches at least one of the electrode end surface and the second electrode main surface.
The first solder and the second solder are each
It is joined to the electrode end surface and the second electrode main surface, and extends along the recess to at least one of the first electrode side surface and the second electrode side surface.

As described above, according to the present invention, it is possible to provide a laminated ceramic electronic component capable of preventing mounting defects, and a tape package and a circuit board provided with the laminated ceramic electronic component.

It is a perspective view of the multilayer ceramic capacitor which concerns on 1st Embodiment of this invention. It is sectional drawing along the AA'line of the multilayer ceramic capacitor. It is sectional drawing along the BB'line of the multilayer ceramic capacitor. It is sectional drawing along the CC'line of the multilayer ceramic capacitor. It is a side view which shows the circuit board which provided the said multilayer ceramic capacitor. It is sectional drawing which shows the tape package with the said multilayer ceramic capacitor. It is a side view which shows the circuit board which concerns on the comparative example of the said embodiment. It is a side view which shows the circuit board which concerns on the comparative example of the said Embodiment, and is the figure for demonstrating the Manhattan phenomenon. It is a flowchart which shows the manufacturing method of the said monolithic ceramic capacitor. It is a perspective view which shows the manufacturing process of the said monolithic ceramic capacitor. It is a side view which shows the manufacturing process of the said monolithic ceramic capacitor. It is a side view which shows the cutting edge used in the manufacturing process of the said monolithic ceramic capacitor. It is a perspective view of the multilayer ceramic capacitor which concerns on 2nd Embodiment of this invention. A is a cross-sectional view taken along the DD'line of the monolithic ceramic capacitor, and B is a cross-sectional view taken along the E-E'line of the monolithic ceramic capacitor. It is a side view which shows the circuit board which provided the said multilayer ceramic capacitor. It is a side view of the multilayer ceramic capacitor which concerns on 3rd Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the drawings, the X-axis, Y-axis, and Z-axis that are orthogonal to each other are appropriately shown. The X-axis, Y-axis, and Z-axis are common to all drawings.

<First Embodiment>
[Overall configuration of multilayer ceramic capacitors]
1 to 3 are views showing the multilayer ceramic capacitor 10 according to the first embodiment of the present invention. FIG. 1 is a perspective view of the multilayer ceramic capacitor 10. FIG. 2 is a cross-sectional view of the monolithic ceramic capacitor 10 along the AA'line of FIG. FIG. 3 is a cross-sectional view of the monolithic ceramic capacitor 10 along the line BB'of FIG. FIG. 4 is a cross-sectional view of the monolithic ceramic capacitor 10 along the CC'line of FIG.

The multilayer ceramic capacitor 10 includes a ceramic body 11, a first external electrode 14, and a second external electrode 15. The external electrodes 14 and 15 are formed on the surface of the ceramic body 11, respectively.

The ceramic body 11 has a substantially rectangular parallelepiped shape. That is, the ceramic body 11 has a first end surface 11a and a second end surface 11b facing the X-axis direction, a first side surface 11c and a second side surface 11d facing the Y-axis direction, and a first side surface facing the Z-axis direction. The main surface 11e and the second main surface 11f are included. The end faces 11a and 11b extend along the Y-axis direction and the Z-axis direction. The side surfaces 11c and 11d extend along the Z-axis direction and the X-axis direction. The main surfaces 11e and 11f extend along the X-axis direction and the Y-axis direction.

The end faces 11a and 11b, the side surfaces 11c and 11d, and the main faces 11e and 11f of the ceramic body 11 are all configured as flat surfaces. The flat surface according to the present embodiment does not have to be strictly a flat surface as long as it is a surface that is recognized as flat when viewed as a whole. A surface having a gently curved shape or the like is also included. For example, the ridge portion connecting each surface of the ceramic element 11 may be chamfered.

The ceramic body 11 has a capacitance forming portion 16 and a protective portion 17. The capacitance forming portion 16 has a plurality of ceramic layers 18, a plurality of first internal electrodes 12, and a plurality of second internal electrodes 13, and has a structure in which these are laminated. The protective portion 17 covers the entire region of both main surfaces of the capacitance forming portion 16 facing the Z-axis direction and the entire region of both side surfaces facing the Y-axis direction, respectively.

The internal electrodes 12 and 13 are alternately laminated along the Z-axis direction between the plurality of ceramic layers 18 laminated in the Z-axis direction. The first internal electrode 12 is drawn out to the first end surface 11a and is separated from the second end surface 11b. The second internal electrode 13 is drawn out to the second end surface 11b and is separated from the first end surface 11a.

Nickel (Ni) is typically mentioned as a good electric conductor forming the internal electrodes 12 and 13, and in addition to this, copper (Cu), palladium (Pd), platinum (Pt), silver (Ag), and the like. Examples thereof include metals or alloys containing gold (Au) or the like as a main component. The main component is a component that occupies 50% or more of the composition ratio.

The ceramic layer 18 is formed of dielectric ceramics. The ceramic layer 18 is formed of a dielectric ceramic having a high dielectric constant in order to increase the capacitance in the capacitance forming portion 16. As the dielectric ceramic having a high dielectric constant, _{a polycrystal of barium titanate (BaTIO 3} ) -based material, that is, a polycrystal having a perovskite structure containing barium (Ba) and titanium (Ti) is used. As a result, a large-capacity multilayer ceramic capacitor 10 can be obtained.

The ceramic layer 18 is composed of strontium titanate (SrTIO ₃ ) -based, calcium titanate (CaTIO ₃ ) -based, magnesium titanate (MgTIO ₃ ) -based, calcium zirconate (CaZrO ₃ ) -based, and calcium zirconate titanate (Ca). It may be formed of (Zr, Ti) O ₃ ) system, barium zirconate (BaZrO ₃ ) system, titanium oxide (TIO ₂ ) system and the like.

The protective portion 17 is also made of dielectric ceramics. The material forming the protective portion 17 may be insulating ceramics, but by using the same dielectric ceramics as the ceramic layer 18, the internal stress in the ceramic element 11 is suppressed. The protective portion 17 covers surfaces of the capacitance forming portion 16 other than both end faces in the X-axis direction. The protective portion 17 mainly has a function of protecting the periphery of the capacitance forming portion 16 and ensuring the insulating properties of the internal electrodes 12 and 13. Hereinafter, the areas on both main surfaces 11e and 11f of the protective portion 17 are referred to as cover areas, and the areas on both side surfaces 11c and 11d are referred to as side margin areas.

The first external electrode 14 covers the first end surface 11a and extends to the first main surface 11e and the second main surface 11f, and the first side surface 11c and the second side surface 11d. The first external electrode 14 is connected to the first internal electrode 12 drawn out from the first end surface 11a.

The second external electrode 15 covers the second end surface 11b and extends to the first main surface 11e and the second main surface 11f, and the first side surface 11c and the second side surface 11d. The second external electrode 15 is connected to the second internal electrode 13 drawn out from the second end surface 11b.

[Detailed configuration of external electrodes]
As shown in FIGS. 2 and 4, the first external electrode 14 has an electrode end surface 14a oriented in the X-axis direction, a first electrode side surface 14c and a second electrode side surface 14d oriented in the Y-axis direction, and a Z-axis direction. It has a first electrode main surface 14e and a second electrode main surface 14f facing toward the surface. Similarly, the second external electrode 15 includes an electrode end surface 15a facing the X-axis direction, a first electrode side surface 15c and a second electrode side surface 15d facing the Y-axis direction, and a first electrode main body facing the Z-axis direction. It has a surface 15e and a second electrode main surface 15f.

As shown in FIG. 4, the external electrodes 14 and 15 each include a recess 19. In the first external electrode 14, at least one of the first electrode side surface 14c and the second electrode side surface 14d includes a recess 19. In the second external electrode 15, at least one of the first electrode side surface 15c and the second electrode side surface 15d includes the recess 19. In the present embodiment, each of the first electrode side surfaces 14c and 15c and the second electrode side surfaces 14d and 15d includes a plurality of recesses 19.

The recess 19 is recessed inward in the Y-axis direction and is formed in a groove shape, for example. Each recess 19 includes, for example, a pair of outer edge portions located on the outermost side in the Y-axis direction and a bottom portion located on the innermost side in the Y-axis direction between the outer edge portions, and these are arranged in a predetermined extending direction. It extends along. The recess 19 extends, for example, in a direction containing at least one vector component in the Z-axis direction or the X-axis direction. In the examples shown in FIGS. 1 and 4, the recess 19 extends in the Z-axis direction, but may extend in a direction intersecting the Z-axis direction. Further, the recess 19 is not limited to the mode in which it extends linearly, and may extend in a curved shape.

In the example shown in FIG. 4, the concave portion 19 is composed of a curved surface that is recessed inward in the Y-axis direction as a whole, but the concave portion 19 may have a minute uneven shape on the surface. The minute unevenness referred to here means an unevenness in which the height (depth) dimension in the Y-axis direction is 10% or less of the depth D of the recess 19 described later.

As shown in FIG. 1, the recess 19 reaches at least one of the electrode end surfaces 14a and 15a or the second electrode main surfaces 14f and 15f. In the present embodiment, each recess 19 reaches the second electrode main surfaces 14f and 15f. In addition, "the recess 19 reaches the second electrode main surfaces 14f and 15f" means that the recess 19 is formed up to the ridge portion connecting the electrode side surfaces 14c, 14d, 15c and 15d and the second electrode main surfaces 14f and 15f. It means that it has been done. At this time, if the ridge portion is rounded, it means that the recess 19 is formed up to a position in contact with the roundness of the ridge portion.

In the example shown in FIGS. 1 and 4, the plurality of recesses 19 are arranged adjacent to each other, and the boundary portion between the plurality of recesses 19 is formed in a curved surface shape that is convex outward in the Y-axis direction. The present invention is not limited to this, and a flat surface may be formed between the plurality of recesses 19, and the plurality of recesses 19 may be arranged so as to be separated from each other via the flat surface.

The recess 19 may be recessed inward in the Y-axis direction at a depth D of 1 μm or more and 50 μm or less, for example. The "depth D of the recess 19" means a dimension along the Y-axis direction from the outer edge of the recess 19 to the bottom of the recess 19, and is, for example, the average value of the dimensions measured at five points for each recess 19. be able to. As a result, as will be described later, the effect of inducing the solder by the recesses 19 can be fully exerted.

The width W orthogonal to the extending direction of the recess 19 can be set according to the size of the multilayer ceramic capacitor 10, but can be, for example, 10 μm or more and 50 μm or less. The "width W of the recess 19" means the distance between the outer edges of the recess 19 in the direction orthogonal to the extending direction of the recess 19, and is, for example, the average value of the dimensions measured at five points for each recess 19. Can be done.

In the present embodiment, the external electrodes 14 and 15 have a base layer 20 formed on the ceramic body 11 and a plating layer 21 formed on the base layer 20. These detailed configurations will be described later.

Since the electrode side surfaces 14c, 14d, 15c, and 15d have recesses 19, it is possible to prevent mounting defects when the multilayer ceramic capacitor 10 is soldered to the mounting substrate S, as will be described later.

[Circuit board configuration]
FIG. 5 is a side view showing the circuit board 100 of the present embodiment.
The circuit board 100 includes a mounting board S, a multilayer ceramic capacitor 10, a first solder H11, and a second solder H12.

The mounting board S has a mounting surface Sa on which the multilayer ceramic capacitor 10 is mounted, and includes a circuit (not shown). The mounting surface Sa has a first land L1 connected to the first external electrode 14 and a second land L2 connected to the second external electrode 15.

The multilayer ceramic capacitor 10 is arranged so that the second main surface 11f faces the mounting substrate S. The second electrode main surface 14f of the first external electrode 14 faces the first land L1. The second electrode main surface 15f of the second external electrode 15 faces the second land L2.

The first solder H11 connects the first external electrode 14 and the mounting substrate S, and is formed on the first land L1. The first solder H11 is joined to the electrode end surface 14a and the second electrode main surface 14f, and extends along the recess 19 to at least one of the first electrode side surface 14c and the second electrode side surface 14d. In the present embodiment, since the recess 19 is formed on both the first electrode side surface 14c and the second electrode side surface 14d, the first solder H11 is transferred from the second electrode main surface 14f to the first electrode side surface along the recess 19. It extends to both 14c and the side surface 14d of the second electrode.

The second solder H12 connects the second external electrode 15 and the mounting substrate S, and is formed on the second land L2. The second solder H12 is joined to the electrode end surface 15a and the second electrode main surface 15f, and extends along the recess 19 to at least one of the first electrode side surface 15c and the second electrode side surface 15d. In the present embodiment, since the recess 19 is formed on both the first electrode side surface 15c and the second electrode side surface 15d, the second solder H12 is transferred from the second electrode main surface 15f to the first electrode side surface along the recess 19. It extends to both the 15c and the second electrode side surface 15d.

The first solder H11 has a protruding portion H110 that is located on the recess 19 and protrudes in the extending direction of the recess 19. Similarly, the second solder H12 has a protruding portion H120 that is located on the recess 19 and protrudes in the extending direction of the recess 19.

The circuit board 100 is manufactured as follows. First, the solder paste is applied to the lands L1 and L2 of the mounting substrate S, and the second electrode main surfaces 14f and 15f of the external electrodes 14 and 15 of the multilayer ceramic capacitor 10 are arranged on the solder paste, respectively. As a result, the second electrode main surfaces 14f and 15f are in contact with the solder paste.

In this state, it is heated in the reflow furnace, and the solder paste on the lands L1 and L2 is heated and melted. As the solder paste melts, the monolithic ceramic capacitor 10 sinks to the lands L1 and L2. As a result, the solder paste on the lands L1 and L2 gets wet from the second electrode main surfaces 14f and 15f of the external electrodes 14 and 15 to the electrode end surfaces 14a and 15a.

The solder paste further wets from the second electrode main surface 15f to the electrode side surfaces 14c, 14d, 15c, 15d. At this time, the solder paste gets wet along the recess 19 reaching the second electrode main surface 15f. As a result, the protruding portions H110 and H120 of the solders H11 and H12 are formed.

After that, the solder paste is cooled and solidified to form solders H11 and H12 for connecting the external electrodes 14 and 15 and the mounting substrate S.

[Structure of tape packaging]
FIG. 6 is a cross-sectional view showing the tape package T of the present embodiment. The multilayer ceramic capacitor 10 of this embodiment is distributed and stored as a tape package T, and is used for manufacturing a circuit board 100 and the like.

The tape package T includes a laminated ceramic capacitor 10, a carrier tape T1 having a component accommodating portion T11 accommodating the monolithic ceramic capacitor 10, and a cover tape T2 attached to the carrier tape T1 so as to cover the component accommodating portion T11. , Equipped with. The carrier tape T1 has a length in the X-axis direction, for example, and a plurality of component accommodating portions T11 are arranged at intervals in the X-axis direction. The component accommodating portion T11 is configured as, for example, a recess having a depth in the Z-axis direction.

In the present embodiment, the component accommodating portion T11 includes a bottom surface T12 in which the second electrode main surfaces 14f and 15f of the multilayer ceramic capacitor 10 are in contact with each other. That is, the plurality of multilayer ceramic capacitors 10 are arranged in the component accommodating portions T11 in a state where the second electrode main surfaces 14f and 15f are aligned so as to be in contact with the bottom surface T12.

At the time of manufacturing the circuit board 100, for example, the cover tape T2 is peeled off from the carrier tape T1, and the multilayer ceramic capacitor 10 is sucked by the suction pad from the opening side of the component housing portion T11. At this time, since the first electrode main surfaces 14e and 15e face the opening side, the suction pad attracts the first electrode main surfaces 14e and 15e and the second electrode main surface 14f is applied to the solder paste on the mounting substrate S. , 15f are arranged so that the multilayer ceramic capacitors 10 are in contact with each other.

Therefore, such a tape package T facilitates mounting the multilayer ceramic capacitor 10 so that the solders H11 and H12 are joined to the second electrode main surfaces 14f and 15f.

[Action and effect of this embodiment]
FIG. 7 is a side view showing the circuit board 300 according to the comparative example of the present embodiment. In the following description, the same reference numerals will be given to the same configurations as those of the circuit board 100 described above, and the description thereof will be omitted.

The circuit board 300 includes a mounting board S, a multilayer ceramic capacitor 30, a first solder H31, and a second solder H32. The multilayer ceramic capacitor 30 includes a ceramic body 11, a first external electrode 34, and a second external electrode 35. None of the electrode side surfaces 34c, 34d, 35c, 35d of the external electrodes 34, 35 facing the Y-axis direction has a recess. Therefore, the solders H31 and H32 also do not have protrusions.

The solders H31 and H32 connect the lands L1 and L2 to the external electrodes 34 and 35. As described above, the solders H31 and H32 are formed by the solder paste arranged on the lands L1 and L2 getting wet on the electrode end faces 34a and 35a and the electrode side surfaces 34c, 34d, 35c and 35d.

The solder paste that wets the electrode end faces 34a and 35a in the Z-axis direction exerts an external force downward on the electrode end faces 34a and 35a in the Z-axis direction. If the magnitude of this external force differs between the first external electrode 14 and the second external electrode 15, a rotational moment around the Y axis is added to the multilayer ceramic capacitor 30.

The solder paste forming the solders H31 and H32 is likely to get wet on the electrode end faces 34a and 35a arranged on the center side of the paste, and is not sufficiently wet on the electrode side surfaces arranged on the peripheral edge of the paste. Therefore, the external force applied to the monolithic ceramic capacitor 30 at the time of soldering is dominated by the external force applied to the electrode end faces 34a and 35a in the downward direction in the Z-axis direction, and is easily affected by the rotational moment. As a result, as shown in FIG. 8, one of the external electrodes 34 and 35 of the multilayer ceramic capacitor 30 rises upward in the Z-axis direction, and a so-called Manhattan phenomenon occurs.

On the other hand, in the multilayer ceramic capacitor 10 of the present embodiment, as shown in FIGS. 4 and 5, the electrode side surfaces 14c, 14d, 15c, and 15d include the recess 19. As a result, the solder paste is likely to get wet not only on the electrode end faces 14a and 15a but also on the electrode side surfaces 14c, 14d, 15c and 15d along the recess 19. As a result, an external force is likely to be applied to the electrode side surfaces 14c, 14d, 15c, and 15d by the solder paste, and it is suppressed that the external force on the electrode end faces 14a, 15a side becomes dominant.

Further, due to the anchor effect of the recess 19, the bonding strength between the electrode side surfaces 14c, 14d, 15c, 15d and the solder paste is increased. This also prevents the external force on the electrode end faces 14a and 15a from becoming dominant. Therefore, the Manhattan phenomenon due to the rotational moment applied to the electrode end faces 14a and 15a can be suppressed, and the mounting failure of the multilayer ceramic capacitor 10 can be prevented.

Further, since each of the electrode side surfaces 14c, 14d, 15c, and 15d has a plurality of recesses 19, wetting of the solder paste to the electrode side surfaces 14c, 14d, 15c, and 15d is further promoted, and the solder paste and the electrode side surface 14c, The bonding strength with 14d, 15c, and 15d is further increased. As a result, the Manhattan phenomenon can be suppressed more reliably, and mounting defects of the multilayer ceramic capacitor 10 can be more reliably prevented.

[Manufacturing method of multilayer ceramic capacitors]
FIG. 9 is a flowchart showing a method of manufacturing the monolithic ceramic capacitor 10. 10 to 11 are views showing a manufacturing process of the monolithic ceramic capacitor 10. Hereinafter, a method for manufacturing the monolithic ceramic capacitor 10 will be described with reference to FIGS. 10 to 11 as appropriate with reference to FIG. 9.

(Step S01: Lamination)
In step S01, the first ceramic sheet 101 and the second ceramic sheet 102 for forming the capacitance forming portion 16 and the third ceramic sheet 103 for forming the cover region of the protective portion 17 are prepared. Then, as shown in FIG. 10, these ceramic sheets 101, 102, and 103 are laminated to prepare a laminated sheet 104. In each of the ceramic sheets 101, 102, 103, cutting lines Lx, Ly for individualizing a plurality of ceramic elements from the laminated sheet 104 are set.

The ceramic sheets 101, 102, and 103 are configured as an unfired dielectric green sheet containing dielectric ceramics as a main component. An unfired first internal electrode pattern 112 corresponding to the first internal electrode 12 is formed on the first ceramic sheet 101, and an unfired second internal electrode corresponding to the second internal electrode 13 is formed on the second ceramic sheet 102. The pattern 113 is formed. The internal electrode pattern is not formed on the third ceramic sheet 103.

Each of the internal electrode patterns 112 and 113 is formed in a rectangular shape extending across one cutting line Ly. However, the second internal electrode pattern 113 is formed so as to be offset from the first internal electrode pattern 112 by one chip in the X-axis direction or the Y-axis direction.

In the ceramic sheets 101 and 102, the Y-axis direction peripheral edges of the internal electrode patterns 112 and 113 are provided with a region corresponding to the side margin region of the protective portion 17 in which the internal electrode patterns 112 and 113 are not formed. A cutting line Lx is arranged in this region.

In the laminated sheet 104 shown in FIG. 10, ceramic sheets 101 and 102 are alternately laminated, and a third ceramic sheet 103 corresponding to the cover region of the protective portion 17 is laminated on the upper and lower surfaces in the Z-axis direction. These ceramic sheets 101, 102, 103 are integrated by being crimped. The number of ceramic sheets 101, 102, 103 is not limited to the example shown in FIG.

(Step S02: Cutting)
In step S02, the laminated sheet 104 is cut along the cutting lines Lx and Ly to produce the unfired ceramic element 111 shown in the side view of FIG.

FIG. 12 is a schematic side view of the cutting blade N used in the present embodiment. The cutting blade is configured as, for example, a push cutting blade. The cutting blade N is inserted into the laminated sheet 104 in the Z-axis direction, for example, so as to penetrate from the upper surface of the laminated sheet 104 in the Z-axis direction (first main surface 111e side) to the lower surface in the Z-axis direction (second main surface 111f side). Will be done. The cut surface formed by the cutting line Lx constitutes the first side surface 111c and the second side surface 111d of the ceramic body 111. The cut surface formed by the cutting line Ly constitutes the first end surface 111a and the second end surface 111b of the ceramic element 111.

In the present embodiment, a film body having lipophilicity (hereinafter referred to as lipophilic film P') is applied to the blade surface N1 of the cutting blade N for cutting the cutting line Lx, and the side surfaces 111c and 111d of the ceramic element 111 are parented. Transfer the oil film P. In FIG. 12, for the sake of explanation, the lipophilic film P'is shown by hatching with diagonal lines. The lipophilic film P'is formed of a lipophilic coating agent and contains, for example, resin materials such as epoxy resin, acrylic resin, vinyl chloride, polyolefin and silicone resin, higher fatty acids, higher alcohols, fats and oils.

In the present embodiment, the blade surface N1 of the cutting blade N has a plurality of strip-shaped lipophilic films P'. The extending direction of the lipophilic film P'may coincide with the insertion direction of the cutting blade N, and may be, for example, the Z-axis direction. Each base oil film P'extends to, for example, the tip portion N2 of the cutting blade N.

By inserting the cutting blade N along the cutting line Lx in the Z-axis direction, the lipophilic film P'of the cutting blade N adheres to the cut surface of the laminated sheet 104. As a result, a strip-shaped lipophilic film P extending in the Z-axis direction is formed on the side surfaces 111c and 111d corresponding to the cut surface.

The cutting blade N has, for example, a base oil film P'on both of the two blade surfaces N1, but may have a base oil film P'on one of the blade surfaces N1. When the two blade surfaces N1 have the lipophilic film P', the lipophilic film P can be formed on both the side surfaces 111c and 111d. When the base oil film P'is provided on one blade surface N1, the base oil film P can be formed on one of the side surfaces 111c and 111d.

As shown in FIG. 11, the side surfaces 111c and 111d include, for example, a plurality of strip-shaped lipophilic films P that are arranged at intervals in the X-axis direction and extend along the Z-axis direction. In FIG. 11, for the sake of explanation, the lipophilic film P is shown by hatching with diagonal lines. When the side surfaces 111c and 111d include the base oil film P, the conductive paste described later is easily wetted on the base oil film P, and the thickness of the conductive paste can be controlled. The lipophilic film P is formed at a position corresponding to the outer edge of each recess 19, for example. The lipophilic film P may be formed not only on the coating regions of the conductive paste on the side surfaces 111c and 111d, but also on the entire side surfaces 111c and 111d as shown in FIG.

(Step S03: Conductive paste application)
In step S03, the conductive paste is applied to the unfired ceramic body 111. As a result, the base layer 20 of the unfired external electrodes 14 and 15 is formed.

The conductive paste includes, for example, metal powders such as copper, nickel, silver and palladium, organic binders and other additives. Since the conductive paste contains an organic binder, it has high wettability with respect to the lipophilic film P.

The conductive paste is applied, for example, by a dip method. In this case, for example, the end faces 111a and 111b of the ceramic element 111 are immersed in a dip tank filled with a conductive paste, respectively. As a result, the conductive paste gets wet from the end faces 111a and 111b to both main faces 111e and 111f and both side faces 111c and 111d. As a result, the conductive paste is applied so as to cover the end faces 111a and 111b and extend to both main faces 111e and 111f and both side faces 111c and 111d. The viscosity of the conductive paste can be, for example, 0.3 to 30 Pa · s.

On the side surfaces 111c and 111d, the wettability of the conductive paste is higher on the base oil film P than on the non-formed region of the base oil film P. As a result, the conductive paste flows from the non-formed region of the lipophilic film P onto the captive oil film P, and the conductive paste is formed on the captive oil film P thicker than on the non-formed region. Therefore, unevenness is formed on the conductive paste on the side surfaces 111c and 111d.

(Step S04: Baking)
In step S04, the unfired ceramic body 111 coated with the conductive paste is sintered. As a result, the ceramic element 11 on which the base layer 20 of the external electrodes 14 and 15 is formed is produced. The firing temperature can be determined based on the sintering temperature of the ceramic body 111. For example, when a barium titanate-based material is used as the dielectric ceramic, the firing temperature can be set to about 1000 to 1300 ° C. Further, the calcination can be performed, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere.

In the present embodiment, irregularities are formed in the regions on the side surfaces 111c and 111d of the conductive paste applied in step S03. As a result, as shown in FIG. 4, a recess is formed in the base layer 20 of the external electrodes 14 and 15 after firing.

(Step S05: External electrode formation)
In step S05, the external electrodes 14 and 15 are formed by forming the plating layer 21, and the multilayer ceramic capacitors 10 shown in FIGS. 1 to 4 are manufactured.

In this step, the plating layer 21 is formed on the base layer 20 by, for example, an electrolytic plating method, using the base layer 20 as a base. The plating layer 21 contains, for example, copper, nickel, tin (Sn), platinum, palladium, gold and the like as main components. The plating layer 21 may include a plurality of layers containing different materials as main components.

The plating layer 21 is formed in a shape that follows the surface shape of the base layer 20. As a result, unevenness due to the unevenness of the base layer 20 is also formed on the surface of the plating layer 21. Therefore, recesses 19 are formed on the electrode side surfaces 14c, 14d, 15c, and 15d.

The width W of the recess 19 can be controlled by the width of each base oil film P formed on the side surfaces 111c and 111d of the unfired ceramic body 111, the distance between adjacent base oil films P, and the like. Further, the depth D of the recess 19 can be controlled by the concentration and physical properties of the lipophilic material in the lipophilic film P.

As described above, the external electrodes 14 and 15 including the recess 19 can be formed by the above manufacturing method.

<Second Embodiment>
13 and 14 are views showing the multilayer ceramic capacitor 40 according to the second embodiment of the present invention. FIG. 13 is a perspective view of the multilayer ceramic capacitor 40. FIG. 14A is a cross-sectional view of the monolithic ceramic capacitor 40 along the DD'line of FIG. FIG. 14B is a cross-sectional view of the monolithic ceramic capacitor 40 along the line EE'of FIG. In the present embodiment, the same components as those in the above-described first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

The multilayer ceramic capacitor 40 includes a ceramic body 11, a first external electrode 44, and a second external electrode 45.

The first external electrode 44 includes an electrode end surface 44a facing the X-axis direction, a first electrode side surface 44c and a second electrode side surface 44d facing the Y-axis direction, a first electrode main surface 44e facing the Z-axis direction, and the like. It has a second electrode main surface 44f and.

The second external electrode 45 includes an electrode end surface 45a facing the X-axis direction, a first electrode side surface 45c and a second electrode side surface 45d facing the Y-axis direction, a first electrode main surface 45e facing the Z-axis direction, and the like. It has a second electrode main surface 45f.

As shown in FIGS. 14A and 14B, in the present embodiment, each of the first electrode side surfaces 44c and 45c and the second electrode side surfaces 44d and 45d includes a plurality of recesses 49.

The recess 49 is formed in a groove shape like, for example, the recess 19, but extends in a direction different from that of the recess 19, for example, extending in the X-axis direction. The recess 49 reaches the electrode end faces 44a and 45a in the present embodiment. “The recess 49 reaches the electrode end faces 44a, 45a” means that the recess 49 is formed up to a ridge portion connecting the electrode side surfaces 44c, 44d, 45c, 45d and the electrode end faces 44a, 45a.

The external electrodes 44 and 45 have a base layer 50 formed on the ceramic body 11 and a plating layer 51 formed on the base layer 50. The base layer 50 has recesses on the surfaces on the side surfaces 11c and 11d, similarly to the base layer 20 of the first embodiment. Similar to the plating layer 21 of the first embodiment, the plating layer 51 has a recess having a shape that resembles the recess of the base layer 20. As a result, the recess 49 is formed.

Similar to the recess 19 of the first embodiment, the recess 49 forms a lipophilic film on the side surface of the unfired ceramic body, thereby controlling the wettability of the conductive paste forming the base layer 50. It is formed by imparting unevenness to the base layer 50. The lipophilic film may be formed, for example, by applying a lipophilic coating agent to the side surface by a printing method or the like.

FIG. 15 is a cross-sectional view showing the circuit board 400 of the present embodiment.
As shown in FIG. 15, the circuit board 400 includes a mounting board S, a multilayer ceramic capacitor 40, and a first solder H41 and a second solder H42.

The first solder H41 connects the first external electrode 44 and the mounting substrate S, and is formed on the first land L1. The first solder H41 is joined to the electrode end surface 44a and the second electrode main surface 44f, and extends along the recess 49 to both the first electrode side surface 44c and the second electrode side surface 44d.

The second solder H42 connects the second external electrode 45 and the mounting substrate S, and is formed on the second land L2. The second solder H42 is joined to the electrode end surface 45a and the second electrode main surface 45f, and extends along the recess 49 to both the first electrode side surface 45c and the second electrode side surface 45d.

The first solder H41 has a protruding portion H410 that is located on the recess 49 and protrudes in the extending direction (for example, the X-axis direction) of the recess 49. Similarly, the second solder H42 has a protruding portion H420 that is located on the recess 49 and protrudes in the extending direction (for example, the X-axis direction) of the recess 49.

In the multilayer ceramic capacitor 40 of the present embodiment, the electrode side surfaces 44c, 44d, 45c, 45d include recesses 49 that reach the electrode end surfaces 44a, 45a. As a result, the solder paste wetted on the electrode end faces 44a and 45a easily wets and spreads on the electrode side surfaces 44c, 44d, 45c and 45d along the recess 49. Further, the anchor effect sufficiently joins the recess 49 and the solder paste. Therefore, the Manhattan phenomenon can be effectively suppressed, and a mounting defect of the multilayer ceramic capacitor 40 can be prevented.

<Third Embodiment>
FIG. 16 is a side view showing the multilayer ceramic capacitor 60 according to the third embodiment of the present invention. In the present embodiment, the same components as those in the above-described first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

The multilayer ceramic capacitor 60 includes a ceramic body 11, a first external electrode 64, and a second external electrode 65.

The first external electrode 64 includes an electrode end surface 64a facing the X-axis direction, a first electrode side surface 64c and a second electrode side surface 64d facing the Y-axis direction, a first electrode main surface 64e facing the Z-axis direction, and the like. It has a second electrode main surface 64f.

The second external electrode 65 includes an electrode end surface 65a facing the X-axis direction, a first electrode side surface 65c and a second electrode side surface 65d facing the Y-axis direction, a first electrode main surface 65e facing the Z-axis direction, and the like. It has a second electrode main surface 65f.

In the present embodiment, at least one of the first electrode side surfaces 64c and 65c or the second electrode side surfaces 64d and 65d includes a plurality of recesses 69. The recess 69 extends in a direction including vector components in the Z-axis direction and the X-axis direction, and extends in a direction that intersects the Z-axis direction and the X-axis direction at a sharp angle, for example. Each of the electrode side surfaces 64c, 64d, 65c, 65d includes, for example, both a recess 69 reaching the electrode end faces 64a, 65a and a recess 69 reaching the second electrode main surfaces 64f, 65f.

Similar to the recess 19 of the first embodiment, such a recess 69 is a conductive paste that forms a lipophilic film on the side surface of the unfired ceramic body, thereby forming a base layer for the external electrodes 64 and 65. It is formed by controlling the wettability to give unevenness to the base layer. Such a lipophilic film is formed, for example, by inserting the cutting edge N in a direction intersecting the extending direction of the lipophilic film P'of the cutting blade N in step S02 and cutting the laminated sheet 104. .. Alternatively, the oil base oil film is formed by using a rotary blade as the cutting blade in step S02, forming the oil base oil film on the peripheral surface (blade surface) of the rotary blade, and adhering the oil base oil film to the cut surface at the time of cutting. ..

Even in the multilayer ceramic capacitor 60 of the present embodiment, the solder paste easily wets and spreads from the second electrode main surfaces 64f, 65f and the electrode end surfaces 64a, 65a through the recesses 69 to the electrode side surfaces 64c, 64d, 65c, 65d. Further, the anchor effect sufficiently joins the recess 69 and the solder paste. As a result, the Manhattan phenomenon is effectively suppressed. Therefore, also in this embodiment, it is possible to prevent a mounting defect of the multilayer ceramic capacitor 60.

Although each embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

The recesses are formed on both the first external electrode and the second external electrode, but the recesses of each external electrode may be formed only on one of the side surface of the first electrode and the side surface of the second electrode. Further, each electrode side surface may have one recess.

In the above-described embodiment, a method of applying a lipophilic film to the side surface of the unfired ceramic body, then applying a conductive paste for forming the base layer, and firing the ceramic body and the base layer at the same time has been described. However, it is not limited to this. For example, after firing the ceramic element, a strip-shaped pattern of a lipophilic film may be applied to the side surface thereof. After that, the conductive paste is applied to the region including the coating region of the lipophilic film, and the conductive paste is baked to form the base layer including the recesses.

Further, as the film for controlling the wettability of the side surface of the ceramic body with respect to the conductive paste, a lipophilic film having lipophilicity has been mentioned in each of the above embodiments, but the present invention is not limited thereto. For example, as the film for controlling the wettability, an oil-repellent film having an oil-repellent property can be used. In this case, by applying the oil-repellent film to the region of the above side surface corresponding to the bottom of the recess, the conductive paste is less likely to get wet in the region corresponding to the bottom, and the surface of the conductive paste is provided with irregularities. NS. As a result, a recess is formed on the surface of the base layer, and a recess can be formed on the side surface of the electrode. The oil-repellent film may contain, for example, an oil-repellent material such as fluorine-based or paraffin-based.

The ceramic element body may be configured such that the height dimension in the Z-axis direction is larger than the width dimension in the Y-axis direction. With such a ceramic body, the balance is particularly liable to be lost at the time of mounting, and mounting defects such as the Manhattan phenomenon are liable to occur. By providing the recess on the side surface of the electrode of the multilayer ceramic capacitor provided with such a ceramic body, mounting defects can be effectively suppressed. The height dimension of the ceramic element body in the Z-axis direction means the dimension of the portion of the ceramic element body that is maximum in the Z-axis direction. The width dimension of the ceramic element body in the Y-axis direction means the dimension of the portion of the ceramic element body that is maximum in the Y-axis direction.

In the above embodiment, the multilayer ceramic capacitor has been described as an example of the multilayer ceramic electronic component, but the present invention can be applied to all multilayer ceramic electronic components having a pair of external electrodes. Examples of such multilayer ceramic electronic components include chip varistor, chip thermistor, and multilayer inductor.

10, 40, 60 ... Multilayer ceramic capacitors (multilayer ceramic electronic components)
11 ... Ceramic element 12, 13 ... Internal electrode 14, 44, 64 ... First external electrode 15, 45, 65 ... Second external electrode 14a, 15a, 44a, 45a, 64a, 65a ... Electrode end face 14c, 15c, 44c , 45c, 64c, 65c ... 1st electrode side surface 14d, 15d, 44d, 45d, 64d, 65d ... 2nd electrode side surface 14e, 15e, 44e, 45e, 64e, 65e ... 1st electrode main surface 14f, 15f, 44f, 45f, 64f, 65f ... Second electrode main surface 19, 49, 69 ... Recessed 100, 400 ... Circuit board S ... Mounting board H11, H41 ... First solder H12, H42 ... Second solder

Claims (7)

The first main surface and the second main surface facing the first axis direction, the first end face and the second end face facing the second axis direction orthogonal to the first axis, and the first axis and the second axis. A ceramic element having a first side surface and a second side surface oriented in the third axial direction orthogonal to the first side surface, and a plurality of internal electrodes drawn out to the first end surface or the second end surface and laminated in the first axis direction. With the body
A first external electrode that covers the first end surface and extends to the first main surface, the second main surface, the first side surface, and the second side surface.
A second external electrode that covers the second end surface and extends to the first main surface, the second main surface, the first side surface, and the second side surface.
Equipped with
The first external electrode and the second external electrode are respectively
The first electrode main surface and the second electrode main surface facing the first axial direction,
The electrode end face facing the second axial direction and
It has a first electrode side surface and a second electrode side surface facing in the third axial direction.
At least one of the first electrode side surface and the second electrode side surface is
A laminated ceramic electronic component that is formed in a groove shape that is recessed inward in the third axial direction and includes a recess that reaches at least one of the electrode end surface and the second electrode main surface. The laminated ceramic electronic component according to claim 1.
At least one of the first electrode side surface and the second electrode side surface is
A laminated ceramic electronic component that is formed in a groove shape that is recessed inward in the third axial direction and includes a plurality of recesses that reach at least one of the electrode end surface and the second electrode main surface. The laminated ceramic electronic component according to claim 1 or 2.
The recess is a laminated ceramic electronic component that is recessed inward in the third axial direction at a depth of 1 μm or more and 50 μm or less. The laminated ceramic electronic component according to claim 2 or 3.
A laminated ceramic electronic component having a width orthogonal to the extending direction of the concave portion of 10 μm or more and 50 μm or less. The laminated ceramic electronic component according to any one of claims 1 to 3.
A laminated ceramic electronic component whose first axial dimension is larger than the third axial dimension of the laminated ceramic electronic component. Multilayer ceramic electronic components and
A carrier tape having a component accommodating portion for accommodating the laminated ceramic electronic component,
A cover tape attached to the carrier tape so as to cover the component housing portion,
It is a tape packaging body provided with
The laminated ceramic electronic component is
The first main surface and the second main surface facing the first axis direction, the first end face and the second end face facing the second axis direction orthogonal to the first axis, and the first axis and the second axis. A ceramic element having a first side surface and a second side surface oriented in the third axial direction orthogonal to the first side surface, and a plurality of internal electrodes drawn out to the first end surface or the second end surface and laminated in the first axis direction. With the body
A first external electrode that covers the first end surface and extends to the first main surface, the second main surface, the first side surface, and the second side surface.
A second external electrode that covers the second end surface and extends to the first main surface, the second main surface, the first side surface, and the second side surface.
Have,
The first external electrode and the second external electrode are respectively
The first electrode main surface and the second electrode main surface facing the first axial direction,
The electrode end face facing the second axial direction and
It has a first electrode side surface and a second electrode side surface facing in the third axial direction.
At least one of the first electrode side surface and the second electrode side surface is
It is formed in a groove shape that is recessed inward in the third axial direction, and includes a recess that reaches at least one of the electrode end surface and the second electrode main surface.
The component accommodating portion is a tape package including a bottom surface in contact with the main surface of the second electrode. Mounting board and
The first main surface and the second main surface facing the first axis direction, the first end face and the second end face facing the second axis direction orthogonal to the first axis, and the first axis and the second axis. A ceramic element having a first side surface and a second side surface oriented in the third axial direction orthogonal to the first side surface, and a plurality of internal electrodes drawn out to the first end surface or the second end surface and laminated in the first axis direction. With the body
A first external electrode that covers the first end surface and extends to the first main surface, the second main surface, the first side surface, and the second side surface.
A second external electrode that covers the second end surface and extends to the first main surface, the second main surface, the first side surface, and the second side surface.
And the laminated ceramic electronic component arranged so that the second main surface faces the mounting substrate.
The first solder and the second solder that connect the first external electrode, the second external electrode, and the mounting substrate, respectively,
Equipped with
The first external electrode and the second external electrode are respectively
The first electrode main surface and the second electrode main surface facing the first axial direction,
The electrode end face facing the second axial direction and
It has a first electrode side surface and a second electrode side surface facing in the third axial direction.
At least one of the first electrode side surface and the second electrode side surface is
It is formed in a groove shape that is recessed inward in the third axial direction, and includes a recess that reaches at least one of the electrode end surface and the second electrode main surface.
The first solder and the second solder are each
A circuit board that is joined to the electrode end surface and the second electrode main surface and extends along the recess to at least one of the first electrode side surface or the second electrode side surface.

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