JP2021129092A - Light emitting device - Google Patents

Abstract

To provide a light-emitting device that reduces a mounting space and improves color mixing.SOLUTION: A light-emitting device according to an embodiment of the present disclosure is a side-emitting type light-emitting device, characterized in that the light emitting device has a first light-emitting element that emits white light, a second light-emitting element that emits red light, a third light-emitting element that emits green light, a fourth light-emitting element that emits blue light, a substrate on which the first to fourth light-emitting elements are mounted, and an encapsulating resin that is placed on the substrate and encapsulates the first to fourth light-emitting elements.SELECTED DRAWING: Figure 3

Description

The present invention relates to a light emitting device.

A so-called side-view type LED module, which is mounted on a circuit board or the like with a surface below the substrate extending in the longitudinal direction of the substrate as a mounting surface, is known (for example, Patent Document 1). The side-view type LED module disclosed in Patent Document 1 includes three LED chips that emit blue light, red light, and green light.

However, when the three-color (RGB) LED chip described in Patent Document 1 is packaged, there is a problem that the brightness is insufficient as compared with the case where only the white LED chip is used to express white. ..

In order to solve this problem, it is conceivable to combine the RGB LED package with a separate white LED package, but there is a problem that the mounting area increases. Further, there is also a problem that the color mixing property when white and each RBG color are combined is low.

Japanese Unexamined Patent Publication No. 2012-169326

An object of the present invention is to provide a light emitting device that realizes reduction of mounting space and improvement of color mixing property.

The light emitting device according to the embodiment of the present disclosure is a side light emitting device, which emits a first light emitting element that emits white light, a second light emitting element that emits red light, and green light. A third light emitting element, a fourth light emitting element that emits blue light, a substrate on which a first light emitting element to a fourth light emitting element are mounted, and a substrate on which the first light emitting element to the fourth light emitting element are mounted. It is characterized by having a sealing resin for sealing the light emitting element of No. 4.

In the light emitting device according to the embodiment of the present disclosure, the first light emitting element includes an LED die and a phosphor layer containing a phosphor that converts the wavelength of light emitted from the LED die, and the second light emitting element. , The third light emitting element and the fourth light emitting element are preferably arranged apart from each other in the longitudinal direction of the substrate.

In the light emitting device according to the embodiment of the present disclosure, the first light emitting element is arranged on the substrate so as to be parallel to at least one of the second light emitting element, the third light emitting element, and the fourth light emitting element. It is preferable that it is.

In the light emitting device according to the embodiment of the present disclosure, it is preferable that the second light emitting element, the third light emitting element, and the fourth light emitting element are each provided with a transparent sheet on the upper part thereof.

In the light emitting device according to the embodiment of the present disclosure, it is preferable that the phosphor layer is exposed on the surface of the sealing resin.

In the light emitting device according to the embodiment of the present disclosure, it is preferable that the transparent sheet is exposed on the surface of the sealing resin.

In the light emitting device according to the embodiment of the present disclosure, the substrate is provided with electrodes for electrically connecting the second light emitting element, the third light emitting element, and the fourth light emitting element through the substrate. It is preferable that it is provided.

In the light emitting device according to the embodiment of the present disclosure, the length of the sealing resin in the longitudinal direction is shorter than the length in the longitudinal direction of the substrate, and the sealing resin is not formed on both ends of the substrate in the longitudinal direction. It is preferable that the portion is formed.

In the light emitting device according to the embodiment of the present disclosure, it is preferable that U-shaped electrodes for conducting the front surface of the substrate and the back surface of the substrate are formed at both ends in the longitudinal direction of the substrate.

In the light emitting device according to the embodiment of the present disclosure, the sealing resin is preferably a white or translucent resin.

In the light emitting device according to the embodiment of the present disclosure, the emission surfaces of the first light emitting element, the second light emitting element, the third light emitting element, and the fourth light emitting element are the first light emitting element and the second light emitting element, respectively. It is preferable that the size is substantially the same as that of the light emitting element, the third light emitting element, and the fourth light emitting element.

According to the light emitting device according to the embodiment of the present disclosure, it is possible to reduce the mounting space and improve the color mixing property.

It is an exploded perspective view of the light emitting module which constitutes the rear light emitting type keyboard using the light emitting device which concerns on embodiment of this disclosure. It is sectional drawing of the light emitting module in line AA of FIG. This is an example of a front perspective view of the light emitting device according to the embodiment of the present disclosure. This is an example of a rear perspective view of the light emitting device according to the embodiment of the present disclosure. It is the back perspective view of the light emitting device which concerns on embodiment of this disclosure, and is the figure which inverted the top surface and the bottom surface of the light emitting device shown in FIG. This is another example of a front perspective view of the light emitting device according to the embodiment of the present disclosure. It is an equivalent circuit diagram of the light emitting device which concerns on embodiment of this disclosure. It is a top view of the light emitting device which concerns on embodiment of this disclosure. It is sectional drawing of the light emitting device in line BB of FIG. It is sectional drawing of the light emitting device in line CC of FIG. (A) to (c) are diagrams showing a part of the manufacturing process of the light emitting device according to the embodiment of the present disclosure. (A) and (b) are diagrams showing another part of the manufacturing process of the light emitting device according to the embodiment of the present disclosure. (A) and (b) are diagrams showing still another part of the manufacturing process of the light emitting device according to the embodiment of the present disclosure. FIG. 5 is a top view of the light emitting device according to the embodiment of the present disclosure, including a wiring pattern. It is a figure which shows the thickness of the 1st light emitting element and the 2nd to 4th light emitting elements of the light emitting device which concerns on embodiment of this disclosure.

Hereinafter, the light emitting device according to the present invention will be described with reference to the drawings. However, it should be noted that the technical scope of the present invention is not limited to those embodiments and extends to the inventions described in the claims and their equivalents.

FIG. 1 shows an exploded perspective view of a light emitting module 1000 constituting a rear light emitting keyboard using the light emitting device 100 according to the embodiment of the present disclosure. The light emitting module 1000 includes a flexible (FPC) substrate 200 on which a plurality of light emitting devices 100 are mounted, a light guide sheet 300, a reflector 400, and a mask 500. In the example shown in FIG. 1, the FPC substrate 200 is arranged on both the left and right sides of the light guide sheet 300, and 10 light emitting devices 100 are mounted on each FPC substrate 200. A circuit is formed in the FPC substrate 200, and supplies the electric power required for the light emitting device 100 to emit light.

The light emitted from the light emitting device 100 is incident on the side surface of the light guide sheet 300, diffused by the light guide sheet 300, and emitted as uniform light on the mask 500 side. The reflector 400 reflects the light directed to the side opposite to the mask 500 in the light guide sheet 300 to the mask 500 side to improve the light utilization efficiency.

The mask 500 is formed with a plurality of openings 501 corresponding to the positions of the keys of the keyboard. By using a translucent material for the keys, each key can emit light.

FIG. 2 shows a cross-sectional view of the light emitting module 1000 in line AA of FIG. FIG. 3 shows an example of a front perspective view of the light emitting device 100 according to the embodiment of the present disclosure. The light emitting device 100 is a side light emitting device, and is a first light emitting element 1 that emits white light, a second light emitting element 2 that emits red light, and a third light emitting device that emits green light. The element 3, the fourth light emitting element 4 that emits blue light, the substrate 5 on which the first light emitting element 1 to the fourth light emitting element 4 are mounted, and the first light emitting element arranged on the substrate 5. It has a sealing resin 6 for sealing the first to fourth light emitting elements 4. FIG. 2 shows a cross-sectional view of the AA line passing through the third light emitting element 3. The light emitting device 100 emits light L1 from the first light emitting element 1 and light L2 from the third light emitting element 3 in the lateral direction with respect to the FPC board 200 which is a mounting board. However, although not shown in FIG. 2, light is also emitted from the second light emitting element 2 and the fourth light emitting element 4.

The first to fourth light emitting elements (1 to 4) have a structure in which a p-type semiconductor layer, an active layer, and an n-type semiconductor layer are laminated. The first light emitting element 1 includes an LED die 10 and a phosphor layer 12 including a phosphor that converts the wavelength of light emitted from the LED die 10. The first light emitting element 1 is, for example, a blue light emitting element that emits blue light having a size of 150 [μm] × 1080 [μm] and a emission wavelength peak value of about 450 to 460 [nm] when viewed in a plan view. be. The phosphor layer 12 is a resin layer containing a phosphor. The size of the phosphor layer 12 when viewed in a plan view is preferably 150 [μm] × 1080 [μm], which is the same size as the first light emitting element 1. The size of the light emitting surface from the first light emitting element 1 is defined by the size of the phosphor layer 12 surrounded by the sealing resin 6. The size of the phosphor layer 12 is preferably such that the light emitting surface from the first light emitting element 1 has substantially the same size as the first light emitting element 1. This is because when the size of the light emitting surface from the first light emitting element 1 is smaller than the size of the first light emitting element 1, the light from the first light emitting element 1 is blocked by the sealing resin 6 and becomes dark. .. Further, for example, the size of the first light emitting element 1 may be 180 [μm] × 1110 [μm] or 210 [μm] × 1140 [μm]. When the phosphor layer 12 is arranged, even if there is a deviation of 15 [μm] or 30 [μm] on one side, the upper surface of the first light emitting element 1 is entirely covered with the phosphor layer 12, so that it does not become dark. When the transparent sheet (20, 30, 40) comes into contact with the adjacent phosphor layer 12, for example, the fourth light emitting element 4 causes the first light emitting element 1 to illuminate. When the distance between the light emitting elements is set to, for example, 100 [μm] in order to avoid contact, the short side of the phosphor layer 12 is preferably 250 [μm] or less, and when the distance between the light emitting elements is 50 [μm], the fluorescence The short side of the body layer 12 is preferably 200 [μm] or less. As the phosphor, for example, a yellow phosphor such as YAG (yttrium aluminum garnet) is used. The first light emitting element 1 emits white light by combining blue light and yellow light generated by exciting a yellow phosphor in the phosphor layer 12 with the blue light.

The phosphor layer 12 may contain a plurality of types of phosphors such as a green phosphor and a red phosphor instead of the yellow phosphor. The green phosphor is a particulate phosphor material such as _{(BaSr) 2} SiO ₄ : Eu ²⁺ , which absorbs the blue light emitted by the first light emitting element 1 and converts the wavelength into green light. The red phosphor is a particulate phosphor material such as _{CaAlSiN 3} : Eu ²⁺ that absorbs the blue light emitted by the first light emitting element 1 and converts the wavelength into red light. In this case, the first light emitting element 1 emits white light obtained by mixing blue light with green light and red light obtained by exciting a green phosphor and a red phosphor with the blue light.

Alternatively, instead of the first light emitting element 1 and the phosphor layer 12, for example, a blue light emitting element whose upper surface and side surfaces are covered with a resin layer containing a yellow phosphor and which emits white light by itself may be provided. ..

The second light emitting element 2 is, for example, a red light emitting element that emits red light having a size of 130 [μm] × 240 [μm] and an emission wavelength peak value of about 620 to 660 [nm] when viewed in a plan view. .. Alternatively, for example, it may be a phosphor layer containing a blue light emitting element and a red phosphor that emits blue light having an emission wavelength peak value of about 450 to 460 [nm]. The third light emitting element 3 is, for example, a green light emitting element that emits green light having a size of 130 [μm] × 240 [μm] and an emission wavelength peak value of about 510 to 530 [nm] when viewed in a plan view. .. Alternatively, for example, it may be a phosphor layer containing a blue light emitting element and a green phosphor that emits blue light having an emission wavelength peak value of about 450 to 460 [nm]. The fourth light emitting element 4 has, for example, a size of 130 [μm] × 240 [μm] when viewed in a plan view, and has an emission wavelength peak value of about 450 to 460 [nm] like the first light emitting element 1. It is a blue light emitting element that emits blue light. The first light emitting element 1 and the fourth light emitting element 4 may have the same characteristics, or may have different characteristics such as, for example, an emission wavelength peak value of 460 to 470 nm. Alternatively, for example, a phosphor layer containing a blue light emitting element that emits blue light having a emission wavelength peak value of about 450 to 460 [nm] and a blue phosphor or a green phosphor may be used. In the present embodiment, the first to fourth light emitting elements are flip chips, but wire bonding specifications may be used.

The light (L1, L2) emitted from the light emitting device 100 is incident from the side surface of the light guide sheet 300, diffused by the light guide sheet 300, and is uniform as shown by the arrow L3 through the opening 501 provided in the mask 500. It is emitted as a bright light.

As shown in FIG. 3, each of the second light emitting element 2, the third light emitting element 3, and the fourth light emitting element 4 are arranged apart from each other in the longitudinal direction of the substrate 5. On the other hand, the first light emitting element 1 is arranged on the substrate 5 so as to be parallel to the second light emitting element 2, the third light emitting element 3, and the fourth light emitting element 4. Since the light emitting centers of the first to fourth light emitting elements (2 to 4) are closer to each other as compared with the case where the first to fourth light emitting elements (2 to 4) are arranged in a horizontal row, the color mixing property is improved and the color unevenness can be suppressed. Further, the first to fourth light emitting elements (2 to 4) are preferably rectangular in shape when viewed from the light emitting surface, in which the longitudinal direction of the substrate 5 is long and the lateral direction of the substrate 5 is short. When the light emitting elements are arranged in parallel, the length of the substrate 5 in the lateral direction can be suppressed, so that the size of the product can be suppressed. That is, the distance between the two sides of the first light emitting element 1 facing the longitudinal direction of the substrate 5 and the distance between the two sides of the second and fourth light emitting elements (2 to 4) facing the longitudinal direction of the substrate 5 are added. The distance is shorter than the short distance of the substrate 5. The second to fourth light emitting elements (2 to 4) may have a square shape when viewed from the light emitting surface, but when it is desired to reduce the lateral direction of the substrate 5, the second to fourth light emitting elements (2 to 4) emit light. The area of the elements (2 to 4) is also reduced. Since the light emitting output is almost proportional to the area of the light emitting element, there is a concern that the light emitting output may decrease. Therefore, when arranging them in parallel, make the second to fourth light emitting elements (2 to 4) rectangular and increase the area. Is preferable. Further, by making the first light emitting element 1 larger than the fourth light emitting element 4, the white light can be increased. A plurality of small light emitting elements may be arranged in the first light emitting element 1. At this time, if a plurality of light emitting elements are connected in series, the number of terminals on the substrate does not need to be increased, and the product does not become large.

A transparent sheet (20, 30, 40) is provided on each of the second light emitting element 2, the third light emitting element 3, and the fourth light emitting element 4. Further, the phosphor layer 12 is preferably exposed on the surface of the sealing resin 6. Further, the transparent sheet (20 to 40) is preferably exposed on the surface of the sealing resin 6. With such a configuration, the light of the light emitting element can be efficiently output. The transparent sheet may change the content of the diffusing material according to the wavelength of the element. For example, the light output can be controlled by reducing the diffusion content of the transparent sheet because blue light is difficult to transmit light, and increasing the diffuser content of the transparent sheet because red light easily transmits light. Reference numeral 7 denotes a prepreg (PP) which is an insulating layer.

The size of the light emitting surface from the second to fourth light emitting elements (2 to 4) is defined by the size of the transparent sheet (20 to 40) surrounded by the sealing resin 6. The size of the transparent sheet (20 to 40) is such that the light emitting surface from the second to fourth light emitting elements (2 to 4) is substantially the same size as the second to fourth light emitting elements (2 to 4). Is preferable. When the size of the light emitting surface from the second to fourth light emitting elements (2 to 4) is smaller than the size of the second to fourth light emitting elements (2 to 4), the second to fourth light emitting elements (2 to 4) This is because the light from the light is blocked by the sealing resin 6 and thus becomes dark.

FIG. 4 shows an example of a rear perspective view of the light emitting device 100 according to the embodiment of the present disclosure. FIG. 5 shows a view in which the upper surface and the bottom surface of the light emitting device 100 shown in FIG. 4 are inverted. Electrodes (21, 31, 41) for electrically connecting the second light emitting element 2, the third light emitting element 3, and the fourth light emitting element 4 to the substrate 5 through the substrate 5. Is provided. In FIGS. 4 to 6, the FPC substrate is omitted.

FIG. 6 shows another example of a front perspective view of the light emitting device 100 according to the embodiment of the present disclosure. In the example shown in FIG. 3, the second light emitting element 2, the third light emitting element 3, and the fourth light emitting element 4 are arranged on the lower side, and the first light emitting element 1 is arranged on the upper side. However, as shown in FIG. 6, the second light emitting element 2, the third light emitting element 3, and the fourth light emitting element 4 are arranged on the upper side, and the first light emitting element 1 is arranged. May be placed on the lower side.

The sealing resin 6 is a white or translucent resin. Examples of the white resin include epoxy resin and silicone resin containing titanium oxide. By making the sealing resin 6 white and blocking the light emission in the side surface direction of each element, for example, the phosphor layer 12 arranged on the upper part of the first light emitting element 1 due to the light emission of the fourth light emitting element 4. Can be suppressed from emitting light. The sealing resin 6 may be transparent or may contain a diffusing material or the like. The length d1 in the longitudinal direction of the sealing resin 6 is shorter than the length d2 in the longitudinal direction of the substrate 5, and the sealing resin 6 is not formed on both ends (53, 54) in the longitudinal direction of the substrate 5. An exposed portion is formed. At both ends (53, 54) in the longitudinal direction of the substrate 5, U-shaped electrodes (11, 51) that conduct the front surface 52 of the substrate 5 and the back surface 55 of the substrate 5 are formed.

FIG. 7 shows an equivalent circuit diagram of the light emitting device 100 according to the embodiment of the present disclosure. The electrodes (11, 21, 31, 41, 51) are connected to the wiring on the FPC substrate 200, and power is supplied to each of the first to fourth light emitting elements (1 to 4). The electrodes 51 are connected to the respective anodes of the first to fourth light emitting elements (1 to 4), and the electrodes (11, 21, 31, 41) are connected to the first to fourth light emitting elements (1 to 4). It is connected to each cathode. In the present embodiment, the anode is a common electrode, but the cathode may be a common electrode. The product can be made smaller than wiring the anode and cathode individually. In addition, a component other than the light emitting element, such as a Zener diode for protecting the light emitting element, may be mounted.

FIG. 8 shows a top view of the light emitting device 100 according to the embodiment of the present disclosure. FIG. 9 shows a cross-sectional view of the light emitting device 100 in line BB of FIG. FIG. 10 shows a cross-sectional view of the light emitting device 100 in line CC of FIG. A wiring pattern 8 is formed on the prepreg 7. The wiring pattern 8 is wiring for supplying electric power to the first to fourth light emitting elements (1 to 4). A part of the wiring pattern 8 is connected to the electrodes (11, 21, 31, 41, 51) via the through electrodes 9. The wiring pattern 8 and the first to fourth light emitting elements (1 to 4) are bonded by a bonding pad 13 made of a conductive adhesive material containing a metal such as sintered silver in solder, epoxy resin, or silicone resin. Will be done.

In order to fill the space between the first to fourth light emitting elements (1 to 4) and the wiring pattern 8, underfill 14 which is a white resin containing titanium oxide in an epoxy resin or a silicone resin is injected. .. The underfill 14 may be black in order to prevent light leakage from the prepreg 7 side of the light emitting element, and may be shielded from light. White is preferable because it can block light and reflect light, prevent light leakage, and increase light in the exit direction.

Between the first light emitting element 1 and the phosphor layer 12, and between the second to fourth light emitting elements (2 to 4) and the transparent sheet (20, 30, 40), respectively, from a silicone resin. The spare resin 15 is formed, and the first light emitting element 1 and the phosphor layer 12, and the second to fourth light emitting elements (2 to 4) and the transparent sheet (20, 30, 40) are firmly adhered to each other. ing. The spare resin 15 may cover a part or all of the side surface of the light emitting element. Light in the side surface direction of the light emitting element can be efficiently extracted.

Next, the manufacturing process of the light emitting device 100 according to the embodiment of the present disclosure will be described with reference to FIGS. 11 to 13. First, as shown in FIG. 11A, the wiring pattern 8 is patterned on the substrate 5 on which the prepreg 7 is formed, and then the bonding pad 13 is transferred onto the wiring pattern 8 (first step).

Next, as shown in FIG. 11B, the LED die 10 of the first light emitting element 1 is die-bonded onto the bonding pad 13 (second step).

Next, as shown in FIG. 11C, the spare resin 15 is applied onto the LED die 10 (third step).

Next, as shown in FIG. 12A, the phosphor layer 12 is mounted on the spare resin 15 (fourth step).

Next, as shown in FIG. 12B, the underfill 14 is applied to the space formed between the first light emitting element 1 and the prepreg 7 using the first dispenser 16 to perform temporary curing. (Fifth step).

Next, as shown in FIG. 13A, the frame resin sheet 17 is mounted on the phosphor layer 12 so as to cover the phosphor layer 12, and then sealed using the second dispenser 18. Resin 6 is injected and temporary curing is performed (sixth step).

Next, as shown in FIG. 13B, the frame resin sheet 17 is peeled off to perform this cure (7th step).

As described above, the first light emitting element 1 is formed. What is the method for manufacturing the second to fourth light emitting elements (2 to 4)? Since it is the same as the manufacturing method of the first light emitting element 1 except that transparent sheets (20, 30, 40) are used instead of the phosphor layer 12, the method is omitted.

FIG. 14 shows a top view of the light emitting device 100 according to the embodiment of the present disclosure, including the wiring pattern 8. The anode of the first light emitting element 1 is connected to the anode pattern 81a via three anode bonding pads 1a. The anode pattern 81a is connected to the electrode 51 via the anode through electrode 91a. The cathode of the first light emitting element 1 is connected to the cathode pattern 81c via three cathode bonding pads 1c. The cathode pattern 81c is connected to the electrode 11 via the cathode through electrode 91c.

The anode of the second light emitting element 2 is connected to the anode pattern 82a via the anode bonding pad 2a. The anode pattern 82a is connected to the electrode 51 via the anode through electrode 92a. The cathode of the second light emitting element 2 is connected to the cathode pattern 82c via the cathode bonding pad 2c. The cathode pattern 82c is connected to the electrode 21 via the cathode through electrode 92c.

The anode of the third light emitting element 3 is connected to the anode pattern 83a via the anode bonding pad 3a. The anode pattern 83a is connected to the electrode 51 via the anode through electrode 92a. The cathode of the third light emitting element 3 is connected to the cathode pattern 83c via the cathode bonding pad 3c. The cathode pattern 83c is connected to the electrode 31 via the cathode through electrode 93c.

The anode of the fourth light emitting element 4 is connected to the anode pattern 84a via the anode bonding pad 4a. The anode pattern 84a is connected to the electrode 51 via the anode through electrode 94a. The cathode of the fourth light emitting element 4 is connected to the cathode pattern 84c via the cathode bonding pad 4c. The cathode pattern 84c is connected to the electrode 41 via the cathode through electrode 94c.

The circuit arrangement shown in FIG. 14 is an example, and other circuit arrangements can be adopted. The wiring pattern 8 is not exposed in the longitudinal direction and the lateral direction of the substrate 5. Since the sealing resin 6 and the prepreg 7 have stronger adhesion than the sealing resin 6 and the wiring pattern 8, they are less likely to be peeled off when an external force is applied to the sealing resin 6. Since the adhesion becomes stronger when the area in which the sealing resin 6 and the prepreg 7 are in direct contact with each other is increased, it is preferable that the area of the prepreg 7 is larger than that of the wiring pattern 8 in the sealing resin 6.

FIG. 15 shows the thicknesses of the first light emitting element 1 and the second to fourth light emitting elements (2 to 4) of the light emitting device 100 according to the embodiment of the present disclosure. The thickness of the LED die (B element) 10 of the first light emitting element 1 composed of the blue light emitting element is, for example, 120 [μm], and the thickness of the phosphor layer 12 is, for example, 50 [μm]. Therefore, the thickness of the first light emitting element 1 is, for example, 170 [μm].

On the other hand, the thickness of the second to fourth light emitting elements (2 to 4), which are the red light emitting element, the green light emitting element, and the blue light emitting element (R / G / B element), is, for example, 100 [μm]. The thickness of the transparent sheet (20, 30, 40) is, for example, 70 [μm]. Therefore, the total thickness of the second to fourth light emitting elements (2 to 4) and the thickness of the transparent sheets (20, 30, 40) is, for example, 170 [μm].

Here, the thickness of the sealing resin 6 is the thickness of the first light emitting element 1, the thickness of the second to fourth light emitting elements (2 to 4), and the thickness of the transparent sheet (20, 30, 40). By setting 170 [μm], which is the same as the total of, the frame resin sheet 17 does not tilt when placed, and there is no gap between the phosphor layer 12 and the transparent sheet (20, 30, 40). It is possible to prevent the resin 6 from being formed, and it is possible to suppress the decrease in brightness due to the sealing resin 6.

In the above description, the second light emitting element, the third light emitting element, and the fourth light emitting element each include an LED die and a phosphor layer containing a phosphor that converts the wavelength of light emitted from the LED die. May be included.

1 1st light emitting element 2 2nd light emitting element 3 3rd light emitting element 4 4th light emitting element 5 Substrate 6 Encapsulating resin 7 Prepreg 8 Wiring pattern 9 Through electrode 10 LED die 12 Fluorescent layer 13 Bonding pad 14 Under Fill 15 Spare resin 16 1st dispenser 17 Frame resin sheet 18 2nd dispenser 20 Transparent sheet 30 Transparent sheet 40 Transparent sheet 100 Light emitting device 200 FPC board 300 Light guide sheet 400 Reflector plate 500 Mask 1000 Light emitting module

Claims (11)

It is a side-emitting type light emitting device.
The first light emitting element that emits white light and
A second light emitting element that emits red light,
A third light emitting element that emits green light,
A fourth light emitting element that emits blue light,
A substrate on which the fourth light emitting element is mounted from the first light emitting element, and
A light emitting device which is arranged on the substrate and has a sealing resin for sealing the fourth light emitting element from the first light emitting element. The first light emitting element includes an LED die and a phosphor layer containing a phosphor that converts the wavelength of light emitted from the LED die.
The second light emitting element, the third light emitting element, and the fourth light emitting element are arranged apart from each other in the longitudinal direction of the substrate.
The light emitting device according to claim 1. The first light emitting element is arranged on the substrate so as to be parallel to at least one of the second light emitting element, the third light emitting element, and the fourth light emitting element. The light emitting device according to 1 or 2. The light emitting device according to any one of claims 1 to 3, wherein the second light emitting element, the third light emitting element, and the fourth light emitting element are each provided with a transparent sheet. .. The light emitting device according to claim 2, wherein the phosphor layer is exposed on the surface of the sealing resin. The light emitting device according to claim 4, wherein the transparent sheet is exposed on the surface of the sealing resin. The substrate is provided with electrodes for electrically connecting each of the second light emitting element, the third light emitting element, and the fourth light emitting element through the substrate. Item 6. The light emitting device according to any one of Items 1 to 6. The length of the sealing resin in the longitudinal direction is shorter than the length of the substrate in the longitudinal direction.
Exposed portions on which the sealing resin is not formed are formed on both ends in the longitudinal direction of the substrate.
The light emitting device according to any one of claims 1 to 7. The light emitting device according to claim 8, wherein U-shaped electrodes are formed at both ends of the substrate in the longitudinal direction to conduct the front surface of the substrate and the back surface of the substrate. The light emitting device according to any one of claims 1 to 9, wherein the sealing resin is a white or translucent resin. The emission surfaces of the first light emitting element, the second light emitting element, the third light emitting element, and the fourth light emitting element are the first light emitting element, the second light emitting element, and the first light emitting element, respectively. The light emitting device according to any one of claims 1 to 10, which has substantially the same size as the light emitting element 3 and the fourth light emitting element.

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