JP2021125653A - Electronic circuit device - Google Patents

Abstract

To provide an electronic circuit device that can efficiently cool a circuit board while securing the sealability of a coolant passage.SOLUTION: An electronic circuit device 1 includes a circuit board 10 where a wiring layer 12 is formed, a conductor 20 electrically connected to the wiring layer 12, a passage formation body 50 forming a passage of a coolant 51 flowing in contact with the circuit substrate 10 together with the circuit board 10, a fastening member 30 that fastens the circuit board 10 and the conductor 20, and a sealing member 40 for sealing the passage of the coolant 51. In the circuit board 10, a penetration hole 14 penetrating between a cooling surface where the passage of the coolant 51 is formed and a back surface on the opposite side of the cooling surface is formed. In the conductor 20, a penetration hole 21 communicating with the penetration hole 14 is formed. Since the fastening member 30 fastens the circuit board 10 and the conductor 20 through the penetration hole 14 and the penetration hole 21, the sealing member 40 closes the penetration hole 14 and the passage of the coolant 51 is sealed.SELECTED DRAWING: Figure 6

Description

The present invention relates to an electronic circuit device.

In recent years, in industrial machines and vehicles (for example, automobiles and railroad vehicles), the electrification and electronic control of power sources have been rapidly progressing from the viewpoint of energy saving and precise operation control. The importance of a power conversion device equipped with a power module for performing power control and an electronic circuit device for controlling the power module is increasing. A motor driven by using AC power generated by converting DC power of a battery by such a power conversion device functions as a driving device of a vehicle.

In an electric vehicle equipped with the above-mentioned power converter, battery and motor, it is desired to reduce the thickness of the power converter in order to expand the space inside the vehicle. In order to reduce the thickness of the power conversion device, an efficient cooling means is required as a countermeasure against heat generated by the electronic circuit device.

As an attempt to efficiently cool a heating element of an electronic device, for example, the electronic device described in Patent Document 1 is known. In Patent Document 1, a first main surface is attached so as to seal the heating element and the refrigerant between the circuit board on which the heating element is attached and the first main surface of the circuit board. An electronic device including a housing and a deformation suppressing portion that suppresses deformation of the circuit board and confining a heating element and a refrigerant in a space surrounded by the circuit board and the housing is disclosed.

Japanese Unexamined Patent Publication No. 2019-145749

In the electronic circuit device mounted on the power conversion device, a large amount of electric power for driving the motor is energized in the wiring mounted on the surface or inside of the circuit board. If this wiring is made thin, the cross-sectional area becomes small and the electric resistance becomes large, so that the amount of heat generated increases, so that it is necessary to cool the circuit board. In particular, since the current is concentrated in the portion where the input / output terminals for connecting the wiring and the external conductor are provided, the need for cooling increases. However, since the input / output terminals are effective for strong fastening with screws due to their size, it is necessary to provide a through hole for passing the screw through the circuit board, and the refrigerant leaks from this through hole, so that forced cooling with the refrigerant is not possible. .. That is, in the electronic circuit device mounted on the conventional power conversion device, the circuit board needs to be cooled by the refrigerant in order to reduce the thickness, but the seal of the refrigerant flow path provided in contact with the circuit board in which the through hole is formed is provided. Since the property is low, there is a problem that the refrigerant leaks.

Therefore, an object of the present invention is to provide an electronic circuit device capable of efficiently cooling a circuit board while ensuring a sealing property of a refrigerant flow path.

The electronic circuit device according to the present invention forms a circuit board on which a wiring layer is formed, a conductor electrically connected to the wiring board, and a flow path of a refrigerant that flows in contact with the circuit board together with the circuit board. A flow path forming body, a fastening member for fastening the circuit board and the conductor, and a sealing member for sealing the flow path are provided, and the flow path is formed on the circuit board. A first through hole is formed between the cooling surface and the back surface opposite to the cooling surface, and the conductor is formed with a second through hole that communicates with the first through hole. The fastening member fastens the circuit board and the conductor through the first through hole and the second through hole, and the fastening member fastens the circuit board and the conductor. The sealing member closes the first through hole to seal the flow path.

According to the present invention, it is possible to provide an electronic circuit device capable of efficiently cooling a circuit board while ensuring a sealing property of a refrigerant flow path.

It is an exploded perspective view of an inverter. It is a top view of the inverter. It is sectional drawing of an inverter. It is sectional drawing which showed an example of the structure of the circuit board in the electronic circuit apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing which showed an example of the structure which attached the conductor to the circuit board in the electronic circuit apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing which shows the structure of the electronic circuit apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing which shows the structure of the electronic circuit apparatus which concerns on 2nd Embodiment of this invention. It is sectional drawing which showed an example of the structure which attached the conductor to the circuit board in the electronic circuit apparatus which concerns on 3rd Embodiment of this invention. It is sectional drawing which shows the structure of the electronic circuit apparatus which concerns on 3rd Embodiment of this invention. It is sectional drawing which showed an example of the structure of the circuit board and the flow path forming body in the electronic circuit apparatus which concerns on 4th Embodiment of this invention. It is sectional drawing which shows the structure of the electronic circuit apparatus which concerns on 4th Embodiment of this invention. It is sectional drawing which shows the structure of the electronic circuit apparatus which concerns on 5th Embodiment of this invention. It is sectional drawing which shows the structure of the electronic circuit apparatus which concerns on 6th Embodiment of this invention.

[Inverter configuration]
Hereinafter, the configuration of the inverter 100 including the electronic circuit device according to the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is an exploded perspective view of the inverter 100. The inverter 100 is used in combination with an in-wheel type motor installed in the wheel of an electric vehicle such as an electric vehicle, and converts DC power supplied from a battery (not shown) into AC power and outputs it to the motor. do.

As shown in FIG. 1, the inverter 100 includes a stator case 70 having a cylindrical shape, an electronic circuit device 1 arranged on the bottom surface of the stator case 70, and a flow path forming body arranged so as to cover the electronic circuit device 1. It is configured with 50. A stator constituting a motor (not shown) is arranged inside the stator case 70, and three recesses 71 recessed from other portions are formed on the bottom surface of the stator case 70. Further, a hole for passing an axle is formed in the center of the stator case 70. The electric vehicle travels by driving the motor to rotate around the axle inserted in the hole.

In the electronic circuit device 1, three power modules 60 are mounted on the circuit board 10. When the electronic circuit device 1 is installed at a predetermined position with respect to the bottom surface of the stator case 70, each power module 60 is arranged at a position overlapping the recess 71 of the stator case 70. As a result, a flow path of the refrigerant for cooling each power module 60 is formed between the flow path forming body 50 and the recess 71. The flow path forming body 50 is provided with an inflow port 55 for inflowing the refrigerant 50.

A large amount of DC power is supplied to each power module 60 from a battery (not shown) via a conductor 20 provided in the electronic circuit device 1. Each power module 60 corresponds to each of the three-phase legs of the inverter 100, and has a switching element for the upper arm and a switching element for the lower arm, respectively. Each switching element converts DC power into AC power of each phase by switching and driving according to a gate drive signal input from a control device (not shown). The switching element is configured by using a semiconductor element such as an IGBT or MOSFET.

FIG. 2 is a plan view of the inverter 100. In FIG. 2, in order to show the structure of the inverter 100 in an easy-to-understand manner, the flow path forming body 50 is not shown. In FIG. 2, the dotted line 56 shows the flow path of the refrigerant flowing on the circuit board 10. As shown in FIG. 2, the refrigerant flowing in from the inflow port 55 (see FIG. 1) reaches each power module 60 through the flow path shown by the dotted line 56, cools each power module 60, and is a circuit board. It reaches the back side of the circuit board 10 through the openings 15a and 15b provided in 10. After that, it flows out to the motor side through an outlet (not shown) provided on the back side of the circuit board 10.

A through hole 14 for connecting the conductor 20 is formed in the circuit board 10. The conductor 20 is attached to the circuit board 10 with a structure as described below so that the refrigerant flowing in the flow path does not leak from the through hole 14.

FIG. 3 is a cross-sectional view of the inverter 100 in the cross section AA of FIG. As shown in FIG. 3, a flow path 51 is formed between the circuit board 10 and the flow path forming body 50. The refrigerant flowing in from the inflow port 55 flows in the flow path 51. A cavity 72 is formed in the stator case 70.

A fastening member 30 is attached to the through hole 14 of the circuit board 10 via a sealing member 40 for preventing leakage of the refrigerant, and the conductor 20 is connected by the fastening member 30. In each of the following embodiments, the details of the fastening member 30 and the sealing member 40 will be described.

[First Embodiment]
FIG. 4 is a cross-sectional view showing an example of the structure of a circuit board in the electronic circuit device according to the first embodiment of the present invention. In the circuit board 10 shown in FIG. 4, a wiring layer 12 such as a copper foil is formed in the insulator 11. The circuit board 10 may be formed by embedding the wiring layer 12 inside the insulator 11, or the circuit board 10 may be formed by superimposing the layer of the insulator 11 and the wiring layer 12.

An insulating film 13 for protecting the wiring layer 12 is provided on the surface of the circuit board 10. In the example of FIG. 4, the entire surface of the circuit board 10 is covered with the insulating film 13, but only a part of the surface of the circuit board 10 may be covered with the insulating film 13 or the insulating film 13 is not provided. You may.

The circuit board 10 is formed with a through hole 14 penetrating between both sides. The wiring layer 12 is exposed inside and around the through hole 14.

FIG. 5 is a cross-sectional view showing an example of a structure in which a conductor is attached to a circuit board in the electronic circuit device according to the first embodiment of the present invention. A conductor 20 is attached to the circuit board 10 shown in FIG. 4 by using a fastening member 30. The fastening member 30 is composed of a bolt 31 and a nut 32, and a through hole 21 is formed in the conductor 20. As shown in FIG. 5, the circuit board 10 and the conductor 20 are arranged at positions where the through holes 14 of the circuit board 10 and the through holes 21 of the conductor 20 communicate with each other, and bolts are provided through these through holes 14 and 21. By screwing the nut 32 into 31, the circuit board 10 and the conductor 20 are fastened to each other. As a result, the wiring layer 12 of the circuit board 10 and the conductor 20 are joined and electrically connected.

A seal member 40 configured by using an elastic member such as a washer with rubber is arranged between the circuit board 10 and the bolt 31. The seal member 40 is arranged around the through hole 14 in a state of being sandwiched between the head 33 of the bolt 31 and the circuit board 10. Therefore, the fastening member 30 (bolts 31 and nuts 32) fastens the circuit board 10 and the conductor 20, so that the sealing member 40 is brought into close contact with the circuit board 10. As a result, the gap between the seal member 40 and the circuit board 10 is filled and the through hole 14 is closed.

An external battery (not shown) or a load device such as a winding of a motor (not shown) is connected to the conductor 20. By attaching the conductor 20 to the circuit board 10 as described above, these load devices and the wiring layer 12 of the circuit board 10 are connected via the conductor 20, and a large amount of electric power is input to and output from the wiring layer 12 for wiring. Heat is generated in the layer 12. In particular, since electric power is concentrated near the through hole 14, the temperature tends to be higher than that of other parts. Therefore, it is necessary to efficiently cool the circuit board 10.

FIG. 6 is a cross-sectional view showing the structure of the electronic circuit device according to the first embodiment of the present invention. The electronic circuit device 1 shown in FIG. 6 is configured by further combining the flow path forming body 50 with the combination of the circuit board 10, the conductor 20, the fastening member 30, and the sealing member 40 described with reference to FIG.

The flow path forming body 50 forms a flow path of the refrigerant 51 for cooling the circuit board 10 together with the circuit board 10. In order to prevent the leakage of the refrigerant 51, the flow path forming body 50 is brought into close contact with the circuit board 10 by a well-known method such as sandwiching an O-ring in between. In the space sealed by the circuit board 10 and the flow path forming body 50 in this way, for example, by flowing the refrigerant 51 in the direction from the front side to the back side of the paper surface, the circuit board 10 is caused by the refrigerant 51 flowing in contact with the circuit board 10. It can be forcibly cooled.

In the circuit board 10, as the wiring layer 12 becomes thinner, the electric resistance of the wiring layer 12 increases and the amount of heat generated when energized increases. However, in the electronic circuit device of the present embodiment, the circuit board 10 is cooled by forced cooling using the refrigerant 51, particularly the peripheral portion of the through hole 14 to which the conductor 20 is attached via the bolt 31. The temperature of the wiring layer 12 in the substrate 10 can be efficiently lowered. Therefore, even if the circuit board 10 is made thin, the function of the wiring layer 12 can be maintained.

Further, in a state where the contact surface between the surface of the circuit board 10 and the head 33 of the bolt 31 is not smooth, the surface on which the flow path of the refrigerant 51 is formed in the circuit board 10, that is, the upper surface of FIG. 6 (hereinafter, “cooling surface”). The bolt 31 is passed between the surface opposite to the cooling surface (hereinafter referred to as the “back surface”), and the nut 32 is screwed to fasten the circuit board 10 and the conductor 20. In this case, since a gap is formed in the contact surface between the circuit board 10 and the head 33 of the bolt 31, the refrigerant 51 may leak out through the through hole 14. Therefore, in the present embodiment, the seal member 40 is arranged between the circuit board 10 and the head 33 of the bolt 31, and the through hole 14 is closed and sealed by the seal member 40. As a result, the space surrounded by the circuit board 10 and the flow path forming body 50 is used as the flow path of the refrigerant 51, and the refrigerant 51 is sealed in the flow path to prevent the refrigerant 51 from leaking to the outside.

As described above, in the electronic circuit device 1 of the present embodiment, efficient cooling of the circuit board 10 and prevention of leakage of the refrigerant 51 can be achieved at the same time, so that a thin electronic circuit device can be constructed.

According to the first embodiment of the present invention, the following effects are exhibited.

(1) The electronic circuit device 1 circuits a circuit board 10 on which a wiring layer 12 is formed, a conductor 20 electrically connected to the wiring layer 12, and a flow path of a refrigerant 51 that flows in contact with the circuit board 10. A flow path forming body 50 formed together with the substrate 10, a fastening member 30 for fastening the circuit board 10 and the conductor 20, and a sealing member 40 for sealing the flow path of the refrigerant 51 are provided. The circuit board 10 is formed with a through hole 14 penetrating between the cooling surface on which the flow path of the refrigerant 51 is formed and the back surface opposite to the cooling surface. The conductor 20 is formed with a through hole 21 that communicates with the through hole 14. The fastening member 30 fastens the circuit board 10 and the conductor 20 via the through hole 14 and the through hole 21. When the fastening member 30 fastens the circuit board 10 and the conductor 20, the sealing member 40 closes the through hole 14 to seal the flow path of the refrigerant 51. Therefore, it is possible to provide the electronic circuit device 1 capable of efficiently cooling the circuit board 10 while ensuring the sealing property of the refrigerant flow path.

(2) The fastening member 30 is screwed with a bolt 31 having a head 33 arranged on the cooling surface side of the circuit board 10 and penetrating the through hole 14 and the through hole 21 and a bolt 31 arranged on the conductor 20 side. It has a nut 32 and the like. The seal member 40 is arranged so as to be sandwiched between the circuit board 10 and the head 33. Since this is done, the through hole 14 can be reliably closed and the sealing property of the refrigerant flow path can be ensured.

[Second Embodiment]
FIG. 7 is a cross-sectional view showing the structure of the electronic circuit device according to the second embodiment of the present invention. Similar to the electronic circuit device 1 shown in FIG. 6, the electronic circuit device 1a shown in FIG. 7 forms a space when the flow path forming body 50 and the circuit board 10 are in close contact with each other, and this space is used as a flow path. The circuit board 10 is cooled by the flow of the refrigerant 51. The difference between the electronic circuit device 1a of the present embodiment and the electronic circuit device 1 described in the first embodiment is that the nut 32 and the seal member 40 in FIG. 6 are replaced with the nut 32a and the seal member 40a in FIG. 7, respectively. It is a point that has been done.

The nut 32a is a bag nut in which the screw hole for attaching the bolt 31 is closed without penetrating. The seal member 40a is arranged on the conductor 20 side, and has a convex portion inserted into the through hole 21 of the conductor 20 and in contact with the back surface of the circuit board 10, and a base portion sandwiched between the conductor 20 and the nut 32a. Has. The convex portion of the sealing member 40a is thicker and more elastic than the conductor 20.

If there is a gap between the bolt 31 and the circuit board 10 or between the conductor 20 and the circuit board 10, the refrigerant 51 may leak out from the flow path through these gaps and the through hole 14. Therefore, in the present embodiment, a sealing member 40a having a convex portion which is thicker than the conductor 20 but has elasticity so as to be thinner than the conductor 20 when pressure is applied is arranged between the conductor 20 and the nut 32a. With the convex portion inserted into the through hole 21 of the conductor 20, the nut 32a is screwed into the bolt 31 and tightened. As a result, while the conductor 20 and the circuit board 10 are fastened by the fastening member 30a composed of the bolt 31 and the nut 32a, the convex portion of the sealing member 40a is compressed by the nut 32a and the circuit board 10 to reduce the thickness. As a result, the gap between the conductor 20 and the circuit board 10 is filled by the convex portion of the sealing member 40a, so that the through hole 14 is closed and sealed.

In the electronic circuit device 1a of the present embodiment, the space surrounded by the circuit board 10 and the flow path forming body 50 is used as the flow path of the refrigerant 51 by the above structure, and the refrigerant 51 is sealed in the flow path. It is possible to prevent the refrigerant 51 from leaking to the outside. Therefore, as in the first embodiment, efficient cooling of the circuit board 10 and prevention of leakage of the refrigerant 51 can be achieved at the same time, so that a thin electronic circuit device can be constructed.

According to the second embodiment of the present invention, the same effects as those of the first embodiment are obtained. Further, the fastening member 30a is screwed with a bolt 31 having a head 33 arranged on the cooling surface side of the circuit board 10 and penetrating the through hole 14 and the through hole 21 and a bolt 31 arranged on the conductor 20 side. It has a nut 32a. The seal member 40a is thicker and more elastic than the conductor 20, and has a convex portion penetrating the through hole 21 and a base portion sandwiched between the conductor 20 and the nut 32a. Since this is done, the through hole 14 can be reliably closed to ensure the sealing property of the refrigerant flow path.

[Third Embodiment]
FIG. 8 is a cross-sectional view showing an example of a structure in which a conductor is attached to a circuit board in the electronic circuit device according to the third embodiment of the present invention. The electronic circuit device of the present embodiment has the same configuration as the electronic circuit device 1a described in the second embodiment, and has the structure shown in FIG. 8 and the structure described in the second embodiment. The difference is the orientation of the fastening member 30a and the structure of the sealing member. Specifically, in the present embodiment, as shown in FIG. 8, the head 33 of the bolt 31 is arranged on the conductor 20 side, the nut 32a is arranged on the cooling surface side of the circuit board 10, and as shown in FIG. A seal member 40b having a unique shape is arranged around the through hole 14 in a state of being sandwiched between the circuit board 10 and the nut 32a. The seal member 40b is configured by using an elastic member such as rubber.

When the fastening member 30a (bolt 31 and nut 32a) fastens the circuit board 10 and the conductor 20, the sealing member 40b is compressed and brought into close contact with the circuit board 10. As a result, as in the first embodiment, the gap between the seal member 40b and the circuit board 10 is filled and the through hole 14 is closed.

FIG. 9 is a cross-sectional view showing the structure of the electronic circuit device according to the third embodiment of the present invention. The electronic circuit device 1b shown in FIG. 9 is configured by combining the circuit board 10, the conductor 20, the fastening member 30a, and the sealing member 40b described in FIG. 8 with the flow path forming body 50. In the present embodiment, the seal member 40b is arranged so as to be sandwiched between the circuit board 10 and the nut 32a, and the through hole 14 is closed and sealed by the seal member 40b. As a result, the space surrounded by the circuit board 10 and the flow path forming body 50 is used as the flow path of the refrigerant 51, and the refrigerant 51 is sealed in the flow path to prevent the refrigerant 51 from leaking to the outside. Therefore, as in the first and second embodiments, efficient cooling of the circuit board 10 and prevention of leakage of the refrigerant 51 can be achieved at the same time, so that a thin electronic circuit device can be constructed.

According to the third embodiment of the present invention, the same effects as those of the first embodiment are obtained. Further, the fastening member 30a is screwed with a bolt 31 having a head 33 arranged on the conductor 20 side and penetrating the through hole 21 and the through hole 14 and a bolt 31 arranged on the cooling surface side of the circuit board 10. It has a nut 32a. The seal member 40b is arranged so as to be sandwiched between the circuit board 10 and the nut 32a. Since this is done, the through hole 14 can be reliably closed to ensure the sealing property of the refrigerant flow path.

[Fourth Embodiment]
FIG. 10 is a cross-sectional view showing an example of the structure of the circuit board and the flow path forming body in the electronic circuit device according to the fourth embodiment of the present invention. The electronic circuit device of the present embodiment includes a circuit board 10 having the same structure as that described in the first to third embodiments, and a flow path forming body 50a. The flow path forming body 50a has a protruding portion 52 protruding toward the cooling surface of the circuit board 10, and the protruding portion 52 has a screw hole 53 at a position corresponding to the through hole 14 of the circuit board 10. It is formed. The flow path forming body 50a forms a flow path of the refrigerant 51 for cooling the circuit board 10 together with the circuit board 10, similarly to the flow path forming body 50 in the first to third embodiments. In order to prevent leakage of the refrigerant 51, the refrigerant 51 is brought into close contact with the circuit board 10 by a well-known method such as sandwiching an O-ring in between.

FIG. 11 is a cross-sectional view showing the structure of the electronic circuit device according to the fourth embodiment of the present invention. The electronic circuit device 1c shown in FIG. 11 is configured by further combining a conductor 20 and a bolt 31 in addition to the combination of the circuit board 10 and the flow path forming body 50a described in FIG. In the present embodiment, the bolt 31 which is a fastening member penetrates the through hole 21 of the conductor 20 and the through hole 14 of the circuit board 10 from the conductor 20 side, and is provided in the protruding portion 52 of the flow path forming body 50a. It is screwed into the hole 53. As a result, the circuit board 10 and the conductor 20 are fastened with the through hole 14 covered by the protrusion 52. Therefore, the protrusion 52 can function as a sealing member to close and seal the through hole 14. can.

According to the above structure, although the flow of the refrigerant 51 is divided by the protrusion 52, the space surrounded by the circuit board 10 and the flow path forming body 50a is used as the flow path of the refrigerant 51, and the refrigerant 51 is formed in the flow path. Can be sealed to prevent the refrigerant 51 from leaking to the outside. Therefore, as in the first to third embodiments, efficient cooling of the circuit board 10 and prevention of leakage of the refrigerant 51 can be achieved at the same time, so that a thin electronic circuit device can be constructed. Further, since a part of the fastening member for fastening the circuit board 10 and the conductor 20 can also be used as the protruding portion 52 of the flow path forming body 50a, the number of parts of the electronic circuit device can be reduced. Further, since the conductor 20 can be removed by removing the bolt 31 in the state where the flow path forming body 50a and the circuit board 10 are combined, the conductor 20 can be easily replaced and maintainability can be improved.

According to the fourth embodiment of the present invention, the same effects as those of the first embodiment are obtained. Further, the flow path forming body 50a has a protruding portion 52 protruding toward the cooling surface of the circuit board 10, and the flow path forming body 50a forms a flow path of the refrigerant 51 together with the circuit board 10 so that the protruding portion is formed. 52 is arranged so as to cover the through hole 14. The bolt 31 which is a fastening member penetrates the through hole 21 and the through hole 14 from the conductor 20 side, and is screwed into the screw hole 53 provided in the protruding portion 52 of the flow path forming body 50a. When the bolt 31 is screwed into the screw hole 53, the protruding portion 52 functions as a sealing member. Since this is done, it is possible to surely close the through hole 14 and secure the sealing property of the refrigerant flow path while reducing the number of parts.

[Fifth Embodiment]
FIG. 12 is a cross-sectional view showing the structure of the electronic circuit device according to the fifth embodiment of the present invention. In the electronic circuit device 1d shown in FIG. 12, similarly to the electronic circuit device 1c shown in FIG. 11, the bolt 31 which is a fastening member penetrates the through hole 21 and the through hole 14 from the conductor 20 side and flows through the flow path. The flow path of the refrigerant 51 is formed by being screwed into the screw hole 53 provided in the protruding portion 52 of the forming body 50a. The difference between the electronic circuit device 1d of the present embodiment and the electronic circuit device 1c described in the fourth embodiment is that the seal member 40 described in the first embodiment is located between the circuit board 10 and the protrusion 52. It is a point that is sandwiched and arranged.

In the present embodiment, the seal member 40 is arranged around the through hole 14 in a state of being sandwiched between the circuit board 10 and the protrusion 52. Therefore, the bolt 31 which is a fastening member fastens the circuit board 10 and the conductor 20, so that the sealing member 40 is brought into close contact with the circuit board 10 and the protruding portion 52, respectively. As a result, the gap between the seal member 40 and the circuit board 10 is filled and the through hole 14 is closed. Therefore, as compared with the case where the protruding portion 52 functions as a sealing member as in the fourth embodiment, the refrigerant flow path can be provided without providing the insulating film 13 around the through hole 14 on the cooling surface of the circuit board 10. It is possible to secure the sealing property. Further, since the dimensional accuracy of the protruding portion 52 in the height direction and the surface roughness of the protruding portion 52 on the contact surface with the circuit board 10 do not affect the sealing property, the manufacturing cost can be reduced.

According to the above structure, as in the first to fourth embodiments, efficient cooling of the circuit board 10 and prevention of leakage of the refrigerant 51 can be achieved at the same time, so that a thin electronic circuit device can be constructed. Further, as in the fourth embodiment, a part of the fastening member for fastening the circuit board 10 and the conductor 20 can also be used as the protruding portion 52 of the flow path forming body 50a, so that the number of parts of the electronic circuit device can be reduced. Is possible. Further, since the conductor 20 can be removed by removing the bolt 31 in the state where the flow path forming body 50a and the circuit board 10 are combined, the conductor 20 can be easily replaced and maintainability can be improved.

According to the fifth embodiment of the present invention, the same effects as those of the first embodiment are obtained. Further, the flow path forming body 50a has a protruding portion 52 protruding toward the cooling surface of the circuit board 10, and the flow path forming body 50a forms a flow path of the refrigerant 51 together with the circuit board 10 so that the protruding portion is formed. 52 is arranged so as to cover the through hole 14. The bolt 31 which is a fastening member penetrates the through hole 21 and the through hole 14 from the conductor 20 side, and is screwed into the screw hole 53 provided in the protruding portion 52 of the flow path forming body 50a. The seal member 40 is arranged so as to be sandwiched between the circuit board 10 and the protrusion 52. Since this is done, it is possible to surely close the through hole 14 and secure the sealing property of the refrigerant flow path while reducing the number of parts.

[Sixth Embodiment]
FIG. 13 is a cross-sectional view showing the structure of the electronic circuit device according to the sixth embodiment of the present invention. The main difference between the electronic circuit device 1e shown in FIG. 13 and the electronic circuit device 1 described in the first embodiment is that the bolt 31 described in the first embodiment shares the head 33a. The point is that 31a and 31b are replaced with bolt members on both sides formed at both ends.

The head 33a of the bolt members on both sides is arranged in the flow path of the refrigerant 51 formed by the circuit board 10 and the flow path forming body 50b. One bolt portion 31a extending downward from the head 33a penetrates the through hole 14 of the circuit board 10 and the through hole 21 of the conductor 20. Further, the other bolt portion 31b extending upward from the head 33a penetrates the through hole 54 formed in the flow path forming body 50b. A nut 32 arranged on the conductor 20 side is screwed into the bolt portion 31a, and the bolt portion 31b is on the outer surface side of the flow path forming body 50b, that is, on the side opposite to the flow path surface on which the flow path is formed. The nuts 32 arranged on the surface are screwed together. In the present embodiment, in this way, the circuit board 10 and the conductor are formed by the fastening member 30b composed of the two bolt portions 31a and 31b sharing the head 33a and the two nuts 32 corresponding to these bolt portions. 20 is concluded.

Further, in the present embodiment, the seal member 40 described in the first embodiment is arranged around the through hole 14 of the circuit board 10 in a state of being sandwiched between the circuit board 10 and the head 33a. It is also arranged around the through hole 54 of the flow path forming body 50b in a state of being sandwiched between the flow path forming body 50b and the head 33a. Therefore, when the fastening member 30b fastens the circuit board 10 and the conductor 20, one of the sealing members 40 is brought into close contact with the circuit board 10, and the fastening member 30b fastens the circuit board 10 and the flow path forming body 50b. By doing so, the other sealing member 40 is brought into close contact with the flow path forming body 50b. As a result, the gap between the seal member 40 and the circuit board 10 and the gap between the seal member 40 and the flow path forming body 50b are filled, and the through hole 14 and the through hole 54 are closed.

In the electronic circuit device 1e of the present embodiment, the space surrounded by the circuit board 10 and the flow path forming body 50b is used as the flow path of the refrigerant 51 by the above structure, and the refrigerant 51 is sealed in the flow path. It is possible to prevent the refrigerant 51 from leaking to the outside. Therefore, as in the first to fifth embodiments, efficient cooling of the circuit board 10 and prevention of leakage of the refrigerant 51 can be achieved at the same time, so that a thin electronic circuit device can be constructed.

According to the sixth embodiment of the present invention, the same effects as those of the first embodiment are obtained. Further, the flow path forming body 50b is formed with a through hole 54 penetrating between the flow path surface on which the flow path of the refrigerant 51 is formed and the outer surface on the side opposite to the flow path surface. The fastening member 30b includes a head 33a arranged in the flow path of the refrigerant 51, a bolt portion 31a extending from the head 33a and penetrating the through hole 14 and the through hole 21, and a through hole 54 extending from the head 33a. A bolt portion 31b penetrating the bolt portion 31b, a nut 32 arranged on the conductor 20 side and screwed with the bolt portion 31a, and a nut 32 arranged on the outer surface side of the flow path forming body 50b and screwed with the bolt portion 31b. And have. The seal member 40 has one that is sandwiched between the circuit board 10 and the head 33a and one that is sandwiched and arranged between the flow path forming body 50b and the head 33a. Since this is done, the through hole 14 can be reliably closed and the sealing property of the refrigerant flow path can be ensured.

It should be noted that the various embodiments described above have been described for the purpose of assisting the understanding of the present invention, and the present invention is not limited to the specific configurations described. For example, it is possible to replace a part of the configuration of the embodiment with the configuration of the common general technical knowledge of those skilled in the art, and it is also possible to add the configuration of the common general technical knowledge of the person skilled in the art to the configuration of the embodiment. That is, the present invention can delete, replace with another configuration, or add another configuration to a part of the configuration of the embodiment of the present specification without departing from the technical idea of the invention. ..

The embodiments and modifications described above are merely examples, and the present invention is not limited to these contents as long as the features of the invention are not impaired. Moreover, although various embodiments and modifications have been described above, the present invention is not limited to these contents. Other aspects conceivable within the scope of the technical idea of the present invention are also included within the scope of the present invention.

1,1a, 1b, 1c, 1d, 1e ... Electronic circuit device 10 ... Circuit board 11 ... Insulator 12 ... Wiring layer 13 ... Insulation film 14 ... Through hole 20 ...・ Conductor 21 ・ ・ ・ Through holes 30, 30a, 30b ・ ・ ・ Fastening member 31 ・ ・ ・ Bolt 31a, 31b ・ ・ ・ Bolt part 32, 32a ・ ・ ・ Nut 33, 33a ・ ・ ・ Head 40, 40a, 40b ... Seal member 50, 50a, 50b ... Flow path forming body 51 ... Coolant 52 ... Protruding part 53 ... Screw hole 54 ... Through hole

Claims (7)

The circuit board on which the wiring layer is formed and
A conductor that is electrically connected to the wiring layer,
A flow path forming body that forms a flow path of the refrigerant that flows in contact with the circuit board together with the circuit board.
A fastening member for fastening the circuit board and the conductor,
A sealing member for sealing the flow path is provided.
The circuit board is formed with a first through hole that penetrates between the cooling surface on which the flow path is formed and the back surface opposite to the cooling surface.
A second through hole communicating with the first through hole is formed in the conductor.
The fastening member fastens the circuit board and the conductor through the first through hole and the second through hole.
An electronic circuit device in which the sealing member closes the first through hole and the flow path is sealed by the fastening member fastening the circuit board and the conductor. In the electronic circuit device according to claim 1,
The fastening member includes a bolt whose head is arranged on the cooling surface side of the circuit board and penetrates the first through hole and the second through hole, and the bolt and screw which are arranged on the conductor side. With nuts to be fitted,
The seal member is an electronic circuit device that is sandwiched between the circuit board and the head. In the electronic circuit device according to claim 1,
The fastening member includes a bolt whose head is arranged on the cooling surface side of the circuit board and penetrates the first through hole and the second through hole, and the bolt and screw which are arranged on the conductor side. With nuts to be fitted,
The sealing member is an electronic circuit that is thicker and more elastic than the conductor and has a convex portion penetrating the second through hole and a base portion sandwiched between the conductor and the nut. Device. In the electronic circuit device according to claim 1,
The fastening member includes a bolt whose head is arranged on the conductor side and penetrates the second through hole and the first through hole, and the bolt and screw which are arranged on the cooling surface side of the circuit board. With nuts to be fitted,
The seal member is an electronic circuit device that is sandwiched between the circuit board and the nut. In the electronic circuit apparatus according to claim 1,
The flow path forming body has a protruding portion protruding toward the cooling surface of the circuit board.
The flow path forming body forms the flow path together with the circuit board, so that the protrusion is arranged so as to cover the first through hole.
The fastening member is screwed into a screw hole provided in the protruding portion of the flow path forming body through the second through hole and the first through hole from the conductor side.
An electronic circuit device in which the protruding portion functions as the sealing member by screwing the fastening member into the screw hole. In the electronic circuit device according to claim 1,
The flow path forming body has a protruding portion protruding toward the cooling surface of the circuit board.
By forming the flow path together with the circuit board, the flow path forming body is arranged so that the protrusion covers the first through hole.
The fastening member is screwed into a screw hole provided in the protruding portion of the flow path forming body through the second through hole and the first through hole from the conductor side.
The seal member is an electronic circuit device that is sandwiched between the circuit board and the protrusion. In the electronic circuit device according to claim 1,
The flow path forming body is formed with a third through hole that penetrates between the flow path surface on which the flow path is formed and the outer surface on the side opposite to the flow path surface.
The fastening member is provided from a head portion arranged in the flow path, a first bolt portion extending from the head and penetrating the first through hole and the second through hole, and the head portion. A second bolt portion that extends and penetrates the third through hole, a first nut that is arranged on the conductor side and is screwed with the first bolt portion, and the outer surface of the flow path forming body. It has a second nut, which is arranged on the side and screwed with the second bolt portion.
The seal member includes a first seal member sandwiched between the circuit board and the head, and a second seal sandwiched between the flow path forming body and the head. An electronic circuit device having a member and.

Images