JP2021120947A5 - Plasma processing equipment - Google Patents

Plasma processing equipment Download PDF

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Publication number
JP2021120947A5
JP2021120947A5 JP2021065271A JP2021065271A JP2021120947A5 JP 2021120947 A5 JP2021120947 A5 JP 2021120947A5 JP 2021065271 A JP2021065271 A JP 2021065271A JP 2021065271 A JP2021065271 A JP 2021065271A JP 2021120947 A5 JP2021120947 A5 JP 2021120947A5
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plasma
generating
electrode
processing apparatus
transport path
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JP2021065271A
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JP2021120947A (en
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Priority claimed from JP2019217955A external-priority patent/JP6871556B2/en
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Description

本発明は、処理対象をプラズマによって処理するプラズマ処理装置に関する。 The present invention relates to the processing target in the plasma processing equipment for processing by the plasma.

従来のプラズマ処理装置においては、処理対象へのプラズマ照射の効率の向上が求められていた。 Oite the conventional plasma treatment equipment is increased efficiency of the plasma irradiation of the processing target has been demanded.

本発明は、上記事情に鑑みてなされたもので、処理対象へのプラズマ照射の効率の向上が可能なプラズマ処理装置の提供を目的とする。 The present invention has been made in view of the above circumstances, and an object thereof is to provide a possible plasma processing equipment improved efficiency of the plasma irradiation to be processed.

上記目的を達成するためになされた請求項１の発明は、輸送路内に収容された処理対象を流圧により輸送するための輸送ガスを供給するガス供給手段と、前記輸送路の少なくとも一部で、輸送中の処理対象にプラズマを照射するプラズマ生成手段と、を備えるプラズマ処理装置である。 The invention of claim 1 made in order to achieve the above object is a gas supply means for supplying a transport gas for transporting a processing target housed in a transport path by flow pressure, and at least a part of the transport path. The plasma processing apparatus includes a plasma generating means for irradiating the processing target being transported with plasma .

Claims (9)

輸送路内に収容された処理対象を流圧により輸送するための輸送ガスを供給するガス供給手段と、A gas supply means for supplying transportation gas for transporting a processing target housed in a transportation channel by flow pressure, and
前記輸送路の少なくとも一部で、輸送中の処理対象にプラズマを照射するプラズマ生成手段と、を備えるプラズマ処理装置。A plasma processing apparatus including a plasma generating means for irradiating a processing target being transported with plasma in at least a part of the transportation path. 前記輸送路を挟んで対向し、前記輸送路内にプラズマを発生させる前記プラズマ生成手段としての第１及び第２のプラズマ生成電極を備え、A first and second plasma generation electrodes as the plasma generation means for generating plasma in the transportation path facing each other across the transportation path are provided.
前記ガス供給手段は、前記輸送ガスとしてプラズマ生成ガスを供給する請求項１に記載のプラズマ処理装置。The plasma processing apparatus according to claim 1, wherein the gas supply means supplies a plasma-generating gas as the transport gas. 前記輸送路を内側に有する中空絶縁部材と、A hollow insulating member having the transportation path inside,
前記中空絶縁部材を間に挟んで対向配置される前記第１と第２のプラズマ生成電極と、The first and second plasma generation electrodes arranged so as to face each other with the hollow insulating member sandwiched between them.
前記中空絶縁部材を構成する絶縁壁に埋設されて外部から絶縁され、前記第１プラズマ生成電極と前記第２プラズマ生成電極との間に位置する中継電極とを備える請求項２に記載のプラズマ処理装置。The plasma treatment according to claim 2, further comprising a relay electrode embedded in an insulating wall constituting the hollow insulating member, insulated from the outside, and located between the first plasma generating electrode and the second plasma generating electrode. Device. 前記中空絶縁部材は、筒状をなし、The hollow insulating member has a cylindrical shape and has a cylindrical shape.
前記中継電極は、前記中空絶縁部材の軸方向に延びた線状をなしている請求項３に記載のプラズマ処理装置。The plasma processing apparatus according to claim 3, wherein the relay electrode has a linear shape extending in the axial direction of the hollow insulating member. 前記輸送路は、下方へ延びたのち横方向へ屈曲した屈曲部を有し、The transport path has a bend that extends downward and then bends laterally.
前記プラズマ生成手段は、前記屈曲部を通過する処理対象にプラズマを照射する請求項１から４の何れか１の請求項に記載のプラズマ処理装置。The plasma processing apparatus according to any one of claims 1 to 4, wherein the plasma generating means irradiates a processing target passing through the bent portion with plasma. 前記輸送路を内側に有する輸送配管が同軸上に巻き付けられた螺旋状をなす螺旋ループ配管と、A spiral loop pipe in which the transport pipe having the transport path inside is coaxially wound into a spiral shape, and
前記螺旋ループ配管の内外にそれぞれ接し、前記輸送路内にプラズマを発生させる前記プラズマ生成手段としての内側及び外側の円筒電極と、を備える請求項１から５の何れか１の請求項に記載のプラズマ処理装置。The invention according to any one of claims 1 to 5, further comprising inner and outer cylindrical electrodes as the plasma generating means for generating plasma in the transport path, which are in contact with each other inside and outside the spiral loop pipe. Plasma processing equipment. 前記第１プラズマ生成電極と前記第２プラズマ生成電極とは、互いに対向する平板状をなし、The first plasma generation electrode and the second plasma generation electrode form flat plates facing each other.
前記輸送路は、前記第１プラズマ生成電極と前記第２プラズマ生成電極との間の扁平空間内で、渦巻き状に巻かれるか又は蛇行している請求項２又は３に記載のプラズマ処理装置。The plasma processing apparatus according to claim 2 or 3, wherein the transport path is spirally wound or meandered in a flat space between the first plasma generation electrode and the second plasma generation electrode. 前記輸送路が偏平空間内で渦巻き状に巻かれた渦巻き部を複数段並べて備える請求項１から７の何れか１の請求項に記載のプラズマ処理装置。The plasma processing apparatus according to any one of claims 1 to 7, wherein the transport path is provided with a plurality of stages of spiral portions wound in a spiral shape in a flat space. 絶縁性の筒体と、筒体内を複数の前記輸送路に分割する絶縁性の分割壁と、を備え、It is provided with an insulating cylinder and an insulating dividing wall that divides the cylinder into a plurality of the transport paths.
前記筒体と、前記分割壁と、には、前記輸送路内にプラズマを発生させる前記プラズマ生成手段としての第１及び第２のプラズマ生成電極が埋設されている請求項１又は２に記載のプラズマ処理装置。The first or second plasma generating electrode as the plasma generating means for generating plasma in the transport path is embedded in the cylinder and the dividing wall according to claim 1 or 2. Plasma processing equipment.
JP2021065271A 2019-12-02 2021-04-07 Plasma processing device and plasma torch Pending JP2021120947A (en)

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KR102279175B1 (en) 2020-10-30 2021-07-19 주식회사 비츠로넥스텍 Tungsten rod insertion type plasma torch
KR102311871B1 (en) * 2021-02-16 2021-10-14 주식회사 파인텍 Edge and Terminal Part Pressing System Using Plasma Irradiation for Attaching the Insulation Tape of Battery Cell
CN113101850B (en) * 2021-02-27 2024-05-17 广州财盟科技有限公司 Emulsifying pot for manufacturing dairy cosmetics and emulsifying method thereof
JP7013062B1 (en) * 2021-10-14 2022-01-31 株式会社クリエイティブコーティングス Powder film formation method and equipment
CN116110764B (en) * 2023-04-11 2023-07-07 苏州迈微能等离子科技有限公司 Microwave plasma etching equipment and etching method

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JPH10199697A (en) * 1997-01-10 1998-07-31 Pearl Kogyo Kk Surface treatment device by atmospheric pressure plasma
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