JP2021120160A - Laser machining device and laser machining method - Google Patents

Abstract

To provide a laser processing device capable of suppressing influences of working slug on machining quality.SOLUTION: A laser processing device includes: a laser oscillation unit 12 emitting laser beam P for machining a plurality of objects on a machining surface 8 of an object 7 to be machined; a galvano-scanner 18 which irradiates laser beam P to the machining surface 8 and scans it; and a CPU (Central Processing Unit). The CPU sets a machining area on the machining surface 8 with respect to respective objects included in the plurality of objects, identifies a position in the gravity direction DG of the machining area with respect to the respective objects, sets a machining order of each object in a first order in which positions in the gravity direction DG of the machining area are arranged in an ascending order, controls the laser oscillation unit 12 and the galvano-scanner 18, and performs marking (printing) machining of the plurality of objects on the machining surface 8 in the machining order set in second setting machining.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to a laser processing apparatus and a laser processing method for processing a plurality of objects on a processed surface of an object to be processed by laser light.

Conventionally, for example, as in the technique described in Patent Document 1 below, it is possible to process a desired processing pattern by irradiating a processing target surface of a processing object arranged in a work area with a laser beam. Laser processing equipment is known.

Japanese Unexamined Patent Publication No. 2008-6468

In the above laser processing apparatus, when processing is actually performed and processing residue is generated from a laser beam irradiation portion on the surface to be processed, the processing residue may prevent irradiation of another portion with laser light. there were.

Therefore, the present disclosure has been made in view of the above-mentioned points, and provides a laser processing apparatus and a laser processing method capable of suppressing the influence of processing residue on processing quality.

In the present specification, a laser light emitting unit that emits a laser beam for processing a plurality of objects on a machined surface of a machined object, a scanning unit that irradiates and scans the laser light toward the machined surface, and a control unit. The control unit is provided with a first setting process for setting a machining area on a machining surface for each object included in a plurality of objects, and a gravity direction of the machining area for each object. The first specifying process for specifying the position of the object, the second setting process for setting the processing order of each object in the first order in which the position of the processing area in the gravity direction is from bottom to top, and the laser light emitting unit and Disclosed is a laser processing apparatus characterized by controlling a scanning unit to perform a processing process of processing a plurality of objects on a processed surface in a processing order set in the second setting process.

Further, the present specification is a laser processing method in which a plurality of objects are processed into a processed surface by irradiating a laser beam emitted from a laser light emitting unit toward a processed surface of a processing object by the scanning unit and scanning the object. Therefore, there is a setting process for setting a processing area on the processing surface for each object included in a plurality of objects, a specific process for specifying the position of the processing area in the gravity direction for each object, and processing. It is characterized by including a processing step of processing each object in the order of the position of the region in the direction of gravity from the bottom to the top.

According to the present disclosure, the laser processing apparatus and the laser processing method can suppress the influence of the processing residue on the processing quality.

It is a figure which showed the schematic structure of the laser processing apparatus of this embodiment. It is a block diagram which showed the electrical structure of the laser processing apparatus. It is a figure which showed the schematic structure of the laser processing apparatus. It is the figure which showed the space between the fθ lens and the machined surface of a work object. It is a flowchart showing each process executed by the laser processing apparatus. It is a flowchart which showed the setting process of a scanning order. It is a flowchart which represented the 2nd setting process. It is the figure which showed the setting screen. It is a figure which represented the list box for selecting the material of the processing object. It is a figure which showed the calculation point of the coordinate which shows the processing area of an object. It is a perspective view which showed the machined surface of the slanted machined object which set the machined area of an object. It is a perspective view which showed the machined surface of the step-like machined object which set the machined area of an object. It is a figure which showed the 1st scan order or 2nd scan order of a laser beam. It is the figure which showed the data table of the laser processing apparatus. It is a perspective view which showed the processing surface of the trapezoidal processing object in which the processing area of an object is set. It is a top view which shows the processing surface of the processing object of FIG. It is the figure which showed the modification example of the laser processing apparatus.

Hereinafter, the laser processing apparatus of the present disclosure will be described with reference to the drawings based on the embodied embodiment. In FIGS. 1 to 3 and 17 used in the following description, a part of the basic configuration is omitted, and the dimensional ratios of the drawn parts are not always accurate. In the following description, the vertical direction is as shown in FIGS. 1, 3, 4, 11, 12, 15, and 17, and is parallel to the gravity direction DG. The directions of the axes of the XY coordinate system are as shown in FIGS. 10 and 16. The directions of each axis of the XYZ coordinate system are as shown in FIGS. 11, 12, and 15. That is, the direction of the Z axis of the XYZ coordinate system is parallel to the gravitational direction DG (vertical direction).

First, a schematic configuration of the laser processing apparatus 1 of the present embodiment will be described with reference to FIGS. 1 and 2. The laser processing apparatus 1 of the present embodiment includes a print information creating unit 2 and a laser processing unit 3. The print information creation unit 2 is composed of a personal computer or the like.

The laser processing unit 3 performs marking (printing) processing by two-dimensionally scanning the laser beam P on the processing surface 8 of the processing object 7. The laser processing unit 3 includes a laser controller 6.

The laser controller 6 is composed of a computer and is connected to the print information creation unit 2 so as to be capable of bidirectional communication. The laser controller 6 drives and controls the laser processing unit 3 based on the print information, control parameters, various instruction information, and the like transmitted from the print information creation unit 2.

The schematic configuration of the laser processing unit 3 will be described. The laser processing unit 3 includes a laser oscillation unit 12, a guide light unit 15, a first dichroic mirror 101, an optical system 70, a TOF (Time of Flight) sensor 103, a second dichroic mirror 105, a galvano scanner 18, an fθ lens 19, and the like. It is covered with a housing cover having a substantially rectangular shape (not shown).

The laser oscillation unit 12 is composed of a laser oscillator 21 and the like. The laser oscillator 21 is composed of a CO2 laser, a YAG laser, and the like, and emits a laser beam P. The light diameter of the laser beam P is adjusted (for example, enlarged) by a beam expander (not shown).

The guide light unit 15 is composed of a visible semiconductor laser 28 or the like. The visible semiconductor laser 28 emits visible laser light Q, which is visible interference light, for example, red laser light. The visible laser light Q is made into parallel light by a lens group (not shown), and for example, an object of a print pattern to be marked (printed) by the laser light P or a rectangular object surrounding the object is processed as an object 7. It is projected onto the machined surface 8 of the above. In the present embodiment, the print pattern means a processing area of an object, or simply a processing area.

The wavelength of the visible laser beam Q is different from the wavelength of the laser beam P. In the present embodiment, for example, the wavelength of the laser beam P is 1064 nm, and the wavelength of the visible laser beam Q is 650 nm.

In the first dichroic mirror 101, almost all of the incident laser beam P is transmitted. Further, in the first dichroic mirror 101, the visible laser light Q is incident at an incident angle of 45 degrees at a substantially central position through which the laser light P is transmitted, and is reflected on the optical path of the laser light P at a reflection angle of 45 degrees. NS. The reflectance of the first dichroic mirror 101 has wavelength dependence. Specifically, the first dichroic mirror 101 is surface-treated with a multilayer structure of a dielectric layer and a metal layer, has a high reflectance with respect to the wavelength of visible laser light Q, and other than that. It is configured to transmit most (99%) of the wavelength of light.

The alternate long and short dash line in FIG. 1 indicates the optical axis 10 of the laser beam P and the visible laser beam Q. The direction of the optical axis 10 indicates the path directions of the laser beam P and the visible laser beam Q.

The optical system 70 includes a first lens 72, a second lens 74, and a moving mechanism 76. In the optical system 70, the laser beam P and the visible laser beam Q that have passed through the first dichroic mirror 101 enter the first lens 72 and pass therethrough. At that time, the first lens 72 reduces the respective light diameters of the laser beam P and the visible laser beam Q. Further, the laser beam P and the visible laser beam Q that have passed through the first lens 72 enter the second lens 74 and pass therethrough. At that time, the second lens 74 makes the laser beam P and the visible laser beam Q parallel. The moving mechanism 76 includes an optical system motor 80, a rack and pinion (not shown) that converts the rotational motion of the optical system motor 80 into linear motion, and the like, and is second by controlling the rotation of the optical system motor 80. The lens 74 is moved in the path direction of the laser light P and the visible laser light Q.

The moving mechanism 76 may be configured to move the first lens 72 instead of the second lens 74, or the first lens so that the distance between the first lens 72 and the second lens 74 changes. Both the 72 and the second lens 74 may be moved.

The TOF sensor 103 is a TOF type sensor that measures the time until the emitted ranging laser beam returns and converts the measured time into a distance. In the second dichroic mirror 105, almost all of the incident laser beam P and visible laser beam Q are transmitted. A detailed description of the TOF sensor 103 and the second dichroic mirror 105 will be described later.

The galvano scanner 18 two-dimensionally scans the laser beam P and the visible laser beam Q that have passed through the second dichroic mirror 105, and is arranged above the DG in the gravity direction with respect to the object 7 to be processed. In the galvano scanner 18, the galvano X-axis motor 31 and the galvano Y-axis motor 32 are attached so that their respective motor axes are orthogonal to each other, and the scanning mirrors 18X and 18Y attached to the tips of the respective motor axes are inside. They are facing each other. Then, the laser light P and the visible laser light Q are two-dimensionally scanned by rotating the scanning mirrors 18X and 18Y under the rotation control of the motors 31 and 32. At that time, the laser beam P and the visible laser beam Q are reflected by the scanning mirror 18X and the scanning mirror 18Y in the order of description, and are irradiated from the upper side to the lower side in the gravitational direction DG. This two-dimensional scanning direction is the direction of the X-axis and the direction of the Y-axis that define the XY coordinate system perpendicular to the gravitational direction DG.

The fθ lens 19 is installed so that its main axis is parallel to the DG in the direction of gravity, so that the laser beam P and the visible laser beam Q two-dimensionally scanned by the galvano scanner 18 are combined with the processed surface 8 of the object 7 to be processed. It focuses on the top. Therefore, the laser beam P and the visible laser beam Q are two-dimensionally scanned in the X-axis direction and the Y-axis direction on the machining surface 8 of the machining object 7 by the rotation control of the motors 31 and 32, respectively.

Next, the circuit configurations of the print information creating unit 2 and the laser processing unit 3 constituting the laser processing apparatus 1 will be described with reference to FIG. First, the circuit configuration of the laser processing unit 3 will be described.

As shown in FIG. 2, the laser processing unit 3 is composed of a laser controller 6, a galvano controller 35, a galvano driver 36, a laser driver 37, a semiconductor laser driver 38, an optical system driver 78, a TOF sensor 103, and the like. There is. The laser controller 6 controls the entire laser processing unit 3. A galvano controller 35, a laser driver 37, a semiconductor laser driver 38, an optical system driver 78, a TOF sensor 103, and the like are electrically connected to the laser controller 6. Further, an external print information creation unit 2 is connected to the laser controller 6 so as to be capable of bidirectional communication, and each information transmitted from the print information creation unit 2 (for example, print information and control parameters for the laser processing unit 3). , Various instruction information from the user, etc.) can be received.

The laser controller 6 includes a CPU 41, a RAM 42, a ROM 43, and the like. The CPU 41 is an arithmetic unit and a control device that controls the entire laser processing unit 3. The CPU 41, the RAM 42, and the ROM 43 are connected to each other by a bus line (not shown), and data is exchanged with each other.

The RAM 42 is for temporarily storing various calculation results calculated by the CPU 41, data of print patterns (XY coordinates for setting), and the like.

The ROM 43 stores various programs. For example, a program that calculates the XY coordinates of a print pattern based on the print information transmitted from the print information creation unit 2 and stores it in the RAM 42 is stored. .. The XY coordinates are represented by the above-mentioned XY coordinate system. In addition to the above-mentioned programs, various programs include, for example, the thickness, depth and number of print patterns corresponding to the print information input from the print information creation unit 2, the laser output of the laser oscillator 21, and the laser beam. There is a program that stores various control parameters indicating the laser pulse width of P, the speed at which the laser beam P is scanned by the galvano scanner 18, and the like in the RAM 42. Further, the ROM 43 stores data such as a start point, an end point, a focal point, and a curvature of the font of each character composed of a straight line and an elliptical arc for each type of font.

The CPU 41 performs various calculations and controls based on various programs stored in the ROM 43.

The CPU 41 uses the galvano controller 35 to provide XY coordinates of the print pattern calculated based on the print information input from the print information creation unit 2, galvano scanning speed information indicating the speed at which the laser beam P is scanned by the galvano scanner 18, and the like. Output to. Further, the CPU 41 outputs to the laser driver 37 the laser output of the laser oscillator 21 set based on the print information input from the print information creation unit 2, and the laser drive information indicating the laser pulse width of the laser beam P and the like. ..

The CPU 41 outputs an on signal instructing the start of lighting of the visible semiconductor laser 28 or an off signal instructing the extinguishing of the visible semiconductor laser 28 to the semiconductor laser driver 38.

The galvano controller 35 has a drive angle and a rotation speed of the galvano X-axis motor 31 and the galvano Y-axis motor 32 based on each information (for example, XY coordinates of the print pattern, galvano scanning speed information, etc.) input from the laser controller 6. Etc. are calculated, and the motor drive information indicating the drive angle and the rotation speed is output to the galvano driver 36. The galvano driver 36 drives and controls the galvano X-axis motor 31 and the galvano Y-axis motor 32 based on the motor drive information input from the galvano controller 35, and scans the laser beam P and the visible laser beam Q in two dimensions.

The laser driver 37 drives the laser oscillator 21 based on the laser output of the laser oscillator 21 input from the laser controller 6, the laser drive information indicating the laser pulse width of the laser beam P, and the like. The semiconductor laser driver 38 turns on or turns off the visible semiconductor laser 28 based on the on signal or off signal input from the laser controller 6.

The optical system driver 78 drives and controls the optical system motor 80 based on the second lens position information described later, which is input from the laser controller 6, to move the second lens 74.

Next, the circuit configuration of the print information creation unit 2 will be described. The print information creation unit 2 includes a control unit 51, an input operation unit 55, a liquid crystal display (LCD) 56, a CD-ROM drive 58, and the like. An input operation unit 55, a liquid crystal display 56, a CD-ROM drive 58, and the like are connected to the control unit 51 via an input / output interface (not shown).

The input operation unit 55 is composed of a mouse, a keyboard, and the like (not shown), and is used, for example, when the user inputs various instruction information.

The CD-ROM drive 58 reads various data, various application software, and the like from the CD-ROM 57.

The control unit 51 controls the entire print information creation unit 2, and includes a CPU 61, a RAM 62, a ROM 63, a hard disk drive (hereinafter, referred to as “HDD”) 66, and the like. The CPU 61 is an arithmetic unit and a control device that controls the entire print information creation unit 2. The CPU 61, RAM 62, and ROM 63 are connected to each other by a bus line (not shown), and data is exchanged with each other. Further, the CPU 61 and the HDD 66 are connected via an input / output interface (not shown), and data is exchanged with each other.

The RAM 62 is for temporarily storing various calculation results and the like calculated by the CPU 61. The ROM 63 stores various programs, a data table 150 and the like shown in FIG. 14 which will be described later.

Various application software programs, various data files, and the like are stored in the HDD 66.

Next, the focal position of the laser beam P and its correction will be described.

As shown in FIG. 1, the laser beam P is emitted from the laser oscillation unit 12. The emitted laser beam P passes through the first dichroic mirror 101. The transmitted laser beam P passes through the first lens 72 and the second lens 74 in the optical system 70. The passed laser beam P passes through the second dichroic mirror 105. The transmitted laser beam P is two-dimensionally scanned by the scanning mirrors 18X and 18Y of the galvano scanner 18. The two-dimensionally scanned laser beam P is incident on the fθ lens 19. The incident laser beam P is focused by the fθ lens 19 and emitted from the fθ lens 19. The emitted laser beam P irradiates the processed surface 8 of the processed object 7.

Hereinafter, the position where the laser beam P should be irradiated on the machined surface 8 of the object 7 to be machined is referred to as a “scheduled irradiation point”.

If the machined surface 8 of the machined object 7 is a plane perpendicular to the gravity direction DG (that is, parallel to the horizontal direction), the laser beam P is directed to the galvano scanner 18 at any position on the machined surface 8 of the machined object 7. Even if it is two-dimensionally scanned by the fθ lens 19, it is focused on the machined surface 8 of the object 7 to be machined. However, as shown in FIG. 1, if the machined surface 8 of the object to be machined 7 is tilted with respect to the horizontal direction even if it is flat, the reference position related to the position of the fθ lens 19 to the planned irradiation point. Depends on the position of the object to be machined 7 on the machined surface 8. Therefore, depending on the position of the object to be processed 7 on the processing surface 8, the laser beam P is focused at a position deviated from that position in the vertical direction. Therefore, the laser processing apparatus 1 of the present embodiment corrects the focal position of the laser beam P so that it is on the processing surface 8 of the processing object 7 by moving it in the vertical direction by the optical system 70. This point is the same even if the processed surface 8 of the object to be processed 7 has a stepped shape (see, for example, FIG. 12 described later).

In FIG. 1, when the laser beam P is vertically incident on the fθ lens 19 (hereinafter, referred to as “vertically incident”), the first lens 72 to the second lens 74 in the optical system 70. The distance is adjusted to the second distance A2. As a result, the second focal position F2 of the laser beam P is placed on the machined surface 8 of the machined object 7.

On the other hand, when the distance from the reference position related to the position of the fθ lens 19 to the scheduled irradiation point is longer than that in the case of vertical incident, the distance from the first lens 72 to the second lens 74 in the optical system 70 is increased. It is adjusted to be longer than the second distance A2. As a result, the focal position of the laser beam P is corrected so that it moves downward and is placed on the machined surface 8 of the machined object 7. In FIG. 1, in the optical system 70, the distance from the first lens 72 to the second lens 74 is adjusted from the second distance A2 to the first distance A1 which is longer than the second distance A2. As a result, the focal position of the laser beam P moves from the second focal position F2 to the first focal position F1 below the second focal position F2, and is placed on the processed surface 8 of the workpiece 7. Corrected to be placed.

On the other hand, when the distance from the reference position related to the position of the fθ lens 19 to the planned irradiation point is shorter than that in the case of vertical incident, in the optical system 70, the first lens 72 to the second lens 74 The distance is adjusted to be shorter than the second distance A2. As a result, the focal position of the laser beam P is corrected so that it moves upward and is placed on the machined surface 8 of the machined object 7. In FIG. 1, in the optical system 70, the distance from the first lens 72 to the second lens 74 is adjusted from the second distance A2 to the third distance A3, which is shorter than the second distance A2. As a result, the focal position of the laser beam P moves from the second focal position F2 to the third focal position F3, which is upward from the second focal position F2, and is placed on the machined surface 8 of the machining object 7. Corrected to be placed.

Hereinafter, when the first focal position F1, the second focal position F2, and the third focal position F3 are not distinguished and the focal positions of the laser beam P are generically described, they are referred to as "focal position F".

Further, the laser processing apparatus 1 of the present embodiment measures the distance between the TOF sensor 103 and the planned irradiation point with the TOF sensor 103 in order to perform such correction.

As shown in FIG. 3, in the TOF sensor 103, the distance measuring laser beam R is emitted toward the second dichroic mirror 105. In the second dichroic mirror 105, the distance measuring laser beam R is incident at an incident angle of 45 degrees and reflected on the optical path of the laser beam P at a reflection angle of 45 degrees. At that time, the optical axis of the distance measuring laser beam R coincides with the optical axis 10 of the laser beam P, but may be parallel to each other. The reflectance of the second dichroic mirror 105 has a wavelength dependence similar to that of the first dichroic mirror 101. Specifically, the second dichroic mirror 105 is surface-treated with a multilayer structure of a dielectric layer and a metal layer, and has a high reflectance with respect to the wavelength of the ranging laser beam R. It is configured to transmit most (99%) of light of wavelengths other than.

The range-finding laser beam R reflected by the second dichroic mirror 105 is incident on the scanning mirrors 18X and 18Y of the galvano scanner 18. The incident distance-finding laser beam R is reflected by the scanning mirrors 18X and 18Y of the galvano scanner 18, and is incident on the fθ lens 19. The incident distance-finding laser beam R is focused by the fθ lens 19 and emitted from the fθ lens 19. The emitted distance-finding laser beam R is incident on the machined surface 8 of the machined object 7. The incident distance-finding laser beam R is reflected by the processed surface 8 of the object to be processed 7, follows the above-mentioned path in the opposite direction, and is received by the TOF sensor 103.

Hereinafter, the position where the distance measuring laser beam R is reflected on the processed surface 8 of the object to be processed 7 is referred to as a “reflection point”.

The TOF sensor 103 measures the time from when the distance measuring laser beam R is emitted until when it is received, and the measured time is converted into a distance. The converted distance is a reciprocating distance between the TOF sensor 103 and the reflection point. Therefore, the distance between the TOF sensor 103 and the reflection point is measured by the TOF sensor 103 by halving the converted distance. Further, when the distance measuring laser beam R is emitted from the TOF sensor 103, if the reflection point is matched with the planned irradiation point by the two-dimensional scanning of the galvano scanner 18, the distance between the TOF sensor 103 and the planned irradiation point is reached. The distance is measured by the TOF sensor 103.

In FIG. 3, the reflection points (scheduled irradiation points) corresponding to the respective focal positions F1, F2, and F3 in FIG. 1 are represented by the first measurement point MP1, the second measurement point MP2, and the third measurement point MP3.

Hereinafter, when the first measurement point MP1, the second measurement point MP2, and the third measurement point MP3 are not distinguished, or when the positions where the distance is measured by the TOF sensor 103 are collectively described, "measurement point MP" is used. Is written.

Therefore, in FIG. 3, the distance between the TOF sensor 103 and the planned irradiation point measured by the TOF sensor 103 means the distance between the TOF sensor 103 and the measurement point MP.

Further, in the laser processing apparatus 1 of the present embodiment, the distance between the reference position and the measurement point MP related to the position of the fθ lens 19 is calculated from the distance between the TOF sensor 103 and the measurement point MP. In the specific example shown in FIG. 4, the distance between the reference position related to the position of the fθ lens 19 and the measurement point MP is the distance from the lower surface of the fθ lens 19 to the measurement point MP (so-called working distance, which is a so-called working distance. Hereinafter, "distance from fθ lens 19 to measurement point MP") is shown. In addition to the lower surface of the fθ lens 19, the reference position related to the position of the fθ lens 19 includes, for example, the upper surface of the fθ lens 19 or the center of the fθ lens 19 in the vertical direction.

The distance from the fθ lens 19 to the measurement point MP is, for example, the distance between the TOF sensor 103 and the measurement point MP minus the distance from the TOF sensor 103 to the fθ lens 19 (a known value required by design). It is calculated by a simple calculation. In this way, the first working distance L1 is calculated as the distance from the fθ lens 19 to the first measurement point MP1. The second working distance L2 is calculated as the distance from the fθ lens 19 to the second measurement point MP2. The third working distance L3 is calculated as the distance from the fθ lens 19 to the third measurement point MP3. The distance from the fθ lens 19 to the measurement point MP (that is, each working distance L1, L2, L3) may be calculated by an accurate calculation using a trigonometric function or the like.

From the above, in the laser processing apparatus 1 of the present embodiment, the focal position F of the laser beam P moves to, for example, the first focal position F1, the second focal position F2, and the third focal position F3 in the order of description thereof. First, the measurement points MP1, MP2, and MP3 are set on the machined surface 8 of the machined object 7. The setting is made based on the print pattern to be marked (printed). As a result, each measurement point MP1, MP2, MP3 is set to coincide with the scheduled irradiation point on the processing surface 8 of the processing object 7. After that, for each measurement point MP1, MP2, MP3, each working distance L1, L2, L3 is calculated based on the distance between the TOF sensor 103 and the measurement point MP measured by the TOF sensor 103.

Further, in the laser controller 6, the second lens position information is created based on the XY coordinates of the print pattern, the XY coordinates of each measurement point MP1, MP2, MP3, the working distances L1, L2, L3, and the like. Will be done. The second lens position information is a control parameter related to the distance from the first lens 72 to the second lens 74 in the optical system 70, and is for placing the focus of the laser beam P on the machined surface 8 of the machined object 7. , Is a command value for the optical system driver 78.

Next, when the laser beam P is two-dimensionally scanned on the machined surface 8 of the object 7 to be machined based on the print pattern of the object to be marked (printed), the optical system motor is based on the second lens position information. By driving and controlling the 80, the distances between the first lens 72 and the second lens 74 in the optical system 70 are in the order of description in the first distance A1, the second distance A2, and the third distance A3. It is adjusted with. Therefore, the focal position F of the laser beam P moves to the first focal position F1, the second focal position F2, and the third focal position F3 in the order described. As a result, the focal position F of the laser beam P is sequentially moved upward and corrected so as to be on the machined surface 8 of the machined object 7.

Hereinafter, during the marking (printing) processing, the correction that the focal position F of the laser beam P is corrected so as to be on the machined surface 8 of the machining object 7 is referred to as "correction of the focal position F of the laser beam P". do. Further, when the distance from the fθ lens 19 to the measurement point MP is generically described, it is referred to as “working distance L”.

Next, the control flow of the laser processing apparatus 1 of the present embodiment will be described. The program of the laser processing method 200 represented by the flowcharts of FIGS. 5 to 7 is stored in the ROM 63 of the control unit 51, and when the marking (printing) processing by the laser beam P is performed, the CPU 61 of the control unit 51 Is executed by. Therefore, in the processing described later, when the control target is a component of the laser processing unit 3, the control is performed via the laser controller 6.

In the program represented by the flowchart of FIG. 5, first, the first setting process is performed in step 10 (hereinafter, simply referred to as “S”) 10. In this process, information about an object to be marked (printed), a material of the object 7 to be processed, and the like are set. A GUI (Graphical User Interface) is used for the setting. Specifically, in the print information creation unit 2, the setting screen 110 shown in FIG. 8 is displayed on the liquid crystal display 56, and the user operates the input operation unit 55 to perform the first setting process S10.

The layout area 112, the input box 114, the OK button 116, the selection buttons 118A and 118B, the list box 120, the setting end button 122, and the pointer 124 are displayed on the setting screen 110. The pointer 124 is displayed on the setting screen 110 according to the position of the mouse of the input operation unit 55.

The layout area 112 represents the machined surface 8 of the machined object 7. The right direction of the layout area 112 is parallel to the X-axis direction, and the upward direction is parallel to the Y-axis direction. An object to be marked (printed) is input to the input box 114. A detailed description of the object input will be described later.

The selection buttons 118A and 118B are buttons for selecting a fill or a line for the object type. When the mouse of the input operation unit 55 is clicked while the selection button 118A is pointed to by the pointer 124, the fill is selected. On the other hand, when the mouse of the input operation unit 55 is clicked while the selection button 118B is pointed to by the pointer 124, the line is selected.

In the list box 120, the material of the object to be processed 7 is selected. When the mouse of the input operation unit 55 is clicked while the list box 120 is pointed to by the pointer 124, aluminum is displayed in the list box 120 as a material of the object 7 to be processed, as shown in FIG. , Stainless steel, brass, vinyl chloride, paper, etc. are listed. Further, when the mouse of the input operation unit 55 is clicked while any one of the items listed in the list box 120 is pointed to by the pointer 124, the item pointed to by the pointer 124 is displayed. The material is selected. The material of the object to be processed 7 may be selected by inputting the desired material with the keyboard or the like of the input operation unit 55.

When an object is input, the mouse of the input operation unit 55 is clicked with the desired position pointed to by the pointer 124 on the layout area 112. As a result, the position on the layout area 112 is selected. Further, a desired character / symbol or the like is input to the input box 114 by the keyboard or the like of the input operation unit 55. After that, the mouse of the input operation unit 55 is clicked while the OK button 116 is pointed to by the pointer 124. As a result, the input desired characters / symbols and the like are arranged as objects at desired positions on the layout area 112. In FIG. 8, the object OB1 of the English character “A” is arranged at a desired position on the layout area 112, and the English character “B” is input to the input box 114.

In this embodiment, a plurality of characters, symbols, etc. are input, but one input character, symbol, etc. corresponds to one object. Further, in the following, when the object OB1 and the objects OB2 to OB6 described later are not distinguished, or when the objects are collectively described, they are referred to as "object OB".

Then, when the mouse of the input operation unit 55 is clicked while the setting end button 122 is pointed to by the pointer 124, the information regarding the selection / arrangement performed as described above is printed information or the information from the user. Various instruction information is transmitted from the print information creation unit 2 to the laser processing unit 3. This sets the selected fill or line to the object OB type. Further, the selected material is set as the material of the object to be processed 7.

Further, the XY coordinates of the print pattern to be marked (printed) are calculated. In this calculation, a plurality of XY coordinates are obtained for one object OB. The processing area of the one object OB on the processing surface 8 of the processing object 7 is set by the obtained plurality of XY coordinates. Such a setting is made for each object OB. For example, as shown in FIG. 10, for the object OB1 of the English character "A", the XY coordinates at 11 calculation points C1 to C11 where the contour line of the processing area OR1 is bent are obtained, respectively. The processing area OR1 of the object OB1 of the English character "A" on the processing surface 8 of the processing object 7 is set by the 11 XY coordinates obtained in this way. Therefore, the shape of the object OB1 of the English character "A" can be specified by the obtained 11 XY coordinates.

In the following, when the machining area OR1 and the respective machining areas OR2 to OR6 described later are not distinguished, or when the machining areas are generically described, they are referred to as "machining area OR".

Further, the selection / setting of the material of the object 7 to be processed may be performed in a process other than the first setting process (S10) before the execution of the second specific process (S18) described later. Further, the selection / setting of the type of the object OB may be performed in a process other than the first setting process (S10) before the execution of the third specific process (S20) described later.

In this way, when the information about the object OB to be marked (printed) processed, the material of the object to be processed 7, and the like are set, the distance measuring process (S12) is performed. In this process, the working distance L is measured. In the measurement, each measurement point MP is set at each position indicated by a plurality of XY coordinates obtained for one object OB. As a result, for example, in the object OB1 of the alphabetic character "A" shown in FIG. 10, the working distance L at the 11 XY coordinates indicating the positions of the calculation points C1 to C11 is measured. That is, in the object OB1 of the English character "A", 11 working distances L are measured. The measurement of such working distance L is performed for each object OB.

Subsequently, the first specific process (S14) is performed. In this process, the position of the gravitational direction DG of the processing region OR of the object OB is specified based on the working distance L. Specifically, for example, in the object OB1 of the English letter "A" shown in FIG. 10, the positions of the gravity direction DG of the processing area OR1 are 11 measured by the distance measuring process (S12). It is obtained for each calculation point C1 to C11 based on the working distance L. Further, among the 11 positions of the gravity direction DG thus obtained, the lowest position (hereinafter, referred to as "bottom position") is the gravity direction of the processing region OR1 of the object OB1 of the alphabetic character "A". Identified to the location of the DG. Such identification is done for each object OB.

The position of the gravity direction DG of the processing region OR of the object OB is represented by the Z coordinate of the XYZ coordinate system in which the Z axis parallel to the gravity direction DG is added to the above-mentioned XY coordinate system. Further, the position of the gravity direction DG of the processing area OR of the object OB may be specified by averaging the positions of a plurality of gravity direction DGs obtained for the processing area OR of the object OB.

Subsequently, the scanning order setting process (S16) is performed. In this process, as shown in FIG. 6, it is first determined whether or not all the objects OB have been specified (S30). This determination is made based on the processing content of S32 described later. Here, when there is an unspecified object OB (S30: NO), the object OB is specified (S32). In this process, one object OB that has not been specified is specified among all the object OBs.

When one object OB is specified, it is determined that the processing region OR of the one object OB has the width of the gravity direction DG (S34). Here, the fact that the processing region OR of the one object OB has the width of the gravity direction DG means that the processing region OR of the one object OB has a plurality of gravitational forces obtained in the first specific process (S14). It means that there is one or more positions having different Z coordinates among the positions of the direction DG.

Specifically, for example, as in the machined object 7 shown in FIG. 11, on a flat machined surface 8 inclined with respect to the horizontal direction perpendicular to the gravitational direction DG, the English letter "A" is used. When the processing area OR1 of the object OB1 is set, it is determined that the processing area OR1 of the object OB1 of the alphabetic character "A" has the width of the gravity direction DG. On the other hand, for example, as shown in FIG. 12, of the machined surface 8 of the stepped object 7 to be machined, the object OB1 of the English letter "A" is placed on the machined surface 8 parallel to the horizontal direction. When the processing area OR1 is set, it is determined that the processing area OR1 of the object OB1 of the alphabetic character "A" does not have the width of the gravity direction DG.

Here, when the processing region OR of the one object OB does not have a width in the gravity direction DG (S34: NO), the second scanning order described later is set (S38). On the other hand, when the processing region OR of the one object OB has a width in the gravity direction DG (S34: YES), the processing region OR of the one object OB is subjected to the above-mentioned first specific processing (S14). It is determined whether the difference between the highest position (hereinafter referred to as "top position") and the lowest position among the obtained positions of the plurality of DGs in the gravity direction is larger than the depth of focus of the laser beam P (S36). ). The depth of focus of the laser beam P is stored in the ROM 43.

Specifically, for example, with respect to the processing region OR1 of the object OB1 of the alphabetic character "A" shown in FIG. 11, the position of the gravity direction DG at the calculation point C8 is the highest position, and the position at the calculation point C3 is the highest position. The position of the DG in the direction of gravity is the lowest position, and the difference LD between the highest position and the lowest position is compared with the depth of focus FD of the laser beam P.

Here, when the difference LD between the uppermost position and the lowest position is larger than the depth of focus FD of the laser beam P for the processing region OR of the one object OB (S36: YES), the first scanning order is set. (S38). In this process, for example, the first scanning order 140 shown in FIG. 13A is set for the one object OB. The first scanning order 140 will be described later. On the other hand, when the difference LD between the uppermost position and the lowest position is equal to or less than the depth of focus FD of the laser beam P for the processing region OR of the one object OB (S36: NO), the second scanning order is set. Is performed (S38). In this process, the second scanning order 142 shown in FIG. 13B is set for the one object OB. Even when the processing region OR of the one object OB does not have a width in the gravity direction DG (S34: NO), the second scanning order is set (S38).

The first scanning order 140 and the second scanning order 142 define the scanning mode of the laser beam P by the galvano scanner 18. The first scanning order 140 refers to a scanning mode in which the scanning of the laser beam P traveling in one side along the horizontal direction moves from the lower side to the upper side in the gravitational direction DG. On the other hand, the second scanning order 142 refers to a scanning mode in which the scanning of the laser beam P traveling in one side along the horizontal direction moves from the upper side to the lower side in the gravitational direction DG.

The first scanning order 144 shown in FIG. 13C may be set instead of the first scanning order 140, and the first scanning order 144 is shown in FIG. 13D instead of the second scanning order 142. The second scanning order 146 may be set. The first scanning order 144 means that the scanning of the laser beam P traveling in the horizontal direction to one side and the scanning of the laser beam P traveling in the horizontal direction to the other side are alternately switched in the gravity direction DG. A scanning mode that moves from the lower side to the upper side. On the other hand, in the second scanning order 146, the scanning of the laser beam P traveling in the horizontal direction to one side and the scanning of the laser beam P traveling in the horizontal direction to the other side are alternately switched. , Refers to a scanning mode in which the DG moves from the upper side to the lower side in the gravity direction DG.

When the first scanning order is set (S38) or the second scanning order is set (S40) in this way, the above-described processes after S30 are repeated. As a result, when the first scanning order 140 or the second scanning order 142 is set for all the objects OB (S30: YES), the second specific processing (S18) shown in FIG. 5 is performed.

In this process, the type of the object to be processed 7 is specified. The identification is performed based on the material of the work target 7 set in the first setting process (S10) and the data table 150 shown in FIG. In the data table 150, aluminum, stainless steel, brass and the like are associated with the first type, and vinyl chloride, paper and the like are associated with the second type. Therefore, if any of aluminum, stainless steel, and brass is set in the first setting process (S10), the first type is specified as the type of the object to be processed 7. On the other hand, when vinyl chloride or paper is set in the first setting process (S10), the second type is specified as the type of the object to be processed 7.

When the marking (printing) process of each object OB is performed by so-called black marking, even if any of aluminum, stainless steel, and brass is set in the above first setting process (S10), A second type is specified as the type of the object to be processed 7.

Subsequently, the third specific process (S20) is performed. In this process, the type of object OB is specified. This identification is performed based on the type of the object OB set in the first setting process (S10). Therefore, if the fill is set in the first setting process (S10), the fill is specified as the type of the object OB. On the other hand, if a line is set in the first setting process (S10), the line is specified as the type of the object OB.

After that, the second setting process (S22) is performed. In this process, as shown in FIG. 7, first, it is determined whether the type of the work object 7 specified in the second specific process (S18) is the first type (S50). Here, when the type of the object to be processed 7 is the second type (S50: NO), the second processing order setting process described later is performed (S60). On the other hand, when the type of the object to be processed 7 is the first type (S50: YES), it is further determined whether the type of the object OB specified in the third specific process (S20) is filled. (S52).

Here, when the type of the object OB is fill (S52: YES), the first machining order setting process described later is performed (S58). On the other hand, when the type of the object OB is a line (S52: NO), it is determined whether the separation distance in the gravity direction DG of the processing region OR of the two adjacent objects OB is smaller than the first threshold value (S52: NO). S54). This determination is made for all object OBs based on the Z coordinate indicating the position of the gravitational direction DG of the processing region OR of the object OB specified in the first specific processing (S14).

Specifically, for example, the stepped object 7 shown in FIG. 12 described above has two processing surfaces 8 parallel to each other in the horizontal direction and having a height difference, and is on the lower side of the gravity direction DG. The processing area OR1 of the object OB1 of the English letter "A" is set on the processing surface 8 of the above, and the processing area OR2 of the object OB2 of the English character "B" is set on the processing surface 8 on the upper side of the gravity direction DG. Is set. In such a case, the processing area OR1 of the object OB1 of the English character "A" and the processing area OR2 of the object OB2 of the English character "B" are adjacent to each other, and the separation distance LG in the gravity direction DG is the first. Compared to the threshold. For the first threshold value, for example, the depth of focus FD of the laser beam P is used.

Here, when the separation distance LG in the gravity direction DG of the processing region OR of the two adjacent objects OB is smaller than the first threshold value (S54: YES), the first processing order setting process described later is performed (S58). .. On the other hand, when the separation distance LG in the gravity direction DG of the processing area OR of the two adjacent objects OB is equal to or greater than the first threshold value (S52: NO), the horizontal direction of the processing area OR of the two adjacent objects OB. It is determined whether the separation distance in is smaller than the second threshold value (S56). This determination is performed for all object OBs based on the XY coordinates indicating the position of the processing area OR of the object OBs set in the first setting process (S10).

Specifically, for example, in the case of the stepped object 7 shown in FIG. 12 described above, the processing area OR1 of the object OB1 having the English character “A” to the processing area OR2 of the object OB2 having the English character “B” The horizontal separation distance LH, which is the shortest horizontal distance to, is compared with the second threshold value.

Here, when the separation distance LH in the horizontal direction of the processing region OR of the two adjacent objects OB is smaller than the second threshold value (S56: YES), the first processing order setting process is performed (S58). In this process, the first order is set as the order of marking (printing) processing. The first order refers to a procedure in which marking (printing) processing of all object OBs is performed in the order in which the positions of the DGs in the gravity direction of the processing area OR are from bottom to top. In other words, the first order is that the object OB in which the position of the gravity direction DG of the processing region OR is located lower is the order in which the marking process is performed before the object OB located above. When the type of the object OB is filled (S52: YES), or when the separation distance LG in the gravity direction DG of the processing region OR of two adjacent objects OB is smaller than the first threshold value (S54: YES). Also, the first machining order setting process is performed (S58).

On the other hand, when the separation distance LH in the horizontal direction of the processing region OR of the two adjacent objects OB is equal to or greater than the second threshold value (S56: NO), the second processing order setting process is performed (S60). In this process, a second order is set as the order of marking (printing) processing. The second order refers to a procedure in which marking (printing) processing of all object OBs is performed in an order different from the first order described above (here, the default is the input order of object OBs). Even when the type of the object to be processed 7 is the second type (S50: NO), the second processing order setting process is performed (S60).

When the first machining order setting process (S58) or the second machining order setting process (S60) is performed, the machining process (S24) shown in FIG. 5 is performed. In this process, the marking (printing) processing of each object OB is performed in the order (first order or second order) set in the first processing order setting process (S58) or the second processing order setting process (S60). It is done in. At that time, the scanning of the laser beam P is performed by the first scanning order setting process (S38) or the second scanning order setting process (S40) for the object OB for each marking (printing) process of each object OB. It is performed in the set first scanning order 140 or the second scanning order 142.

Hereinafter, the order (first order or second order) in the processing (S24) in the specific examples shown in FIGS. 15 and 16 will be described. However, in this specific example, it is assumed that the separation distance LG in each gravity direction DG is equal to or greater than the first threshold value (S54: NO).

The trapezoidal machined object 7 shown in FIGS. 15 and 16 has a flat machined surface 8 parallel to the horizontal direction and two slanted planes 8 from both sides in the direction of gravity DG. Have. Of the two inclined flat processing surfaces 8, on one processing surface 8, the processing area OR1 of the object OB1 of the English character "A", the processing area OR2 of the object OB2 of the English character "B", and the English The processing area OR3 of the object OB3 of the character "C" is set. Further, on the other processing surface 8, the processing area OR4 of the object OB4 of the English character "D", the processing area OR5 of the object OB5 of the English character "E", and the processing area OR6 of the object OB6 of the English character "F" Is set. In such a case, the separation distances LH1 to LH5 in each horizontal direction are compared with the second threshold value (S56).

The horizontal separation distance LH1 means the shortest horizontal distance from the processing area OR1 of the object OB1 of the English character "A" to the processing area OR2 of the object OB2 of the English character "B". The horizontal separation distance LH2 means the shortest horizontal distance from the processing area OR2 of the object OB2 of the English character "B" to the processing area OR3 of the object OB3 of the English character "C".

The horizontal separation distance LH3 means the shortest horizontal distance from the processing area OR4 of the object OB4 of the English character "D" to the processing area OR5 of the object OB5 of the English character "E". The horizontal separation distance LH4 means the shortest horizontal distance from the processing area OR5 of the object OB5 of the English character "E" to the processing area OR6 of the object OB6 of the English character "F". The horizontal separation distance LH5 means the shortest horizontal distance from the processing area OR3 of the object OB3 of the English character "C" to the processing area OR6 of the object OB6 of the English character "F".

Here, each object OB is input in alphabetical order, and among the separation distances LH1 to LH5 in each horizontal direction, the separation distances LH1 to LH4 are equal to or less than the second threshold value, and the separation distance LH5 is larger than the second threshold value. Then, the object OB1 of the English character "A", the object OB2 of the English character "B", the object OB3 of the English character "C", the object OB4 of the English character "D", the object OB5 of the English character "E", and the English character Each object OB is marked (printed) in the order of description of the "F" object OB6.

When marking (printing) each object OB, the focal position F of the laser beam P described above is corrected, and the working distance L required for the correction is the distance measuring process (S12) described above. The measured one may be diverted. When the machining process (S24) is performed, the program of the laser machining method 200 shown in the flowcharts of FIGS. 5 to 7 ends.

As described in detail above, in the laser machining apparatus 1 and the laser machining method 200 of the present embodiment, the machining region OR on the machining surface 8 of the machining object 7 is set for each object OB (S10). The position of the gravitational direction DG of the machining region OR is specified for each object OB (S14). Further, when the machining order of each object OB is set in the first order in which the position of the gravity direction DG of the machining region OR is in the order from the bottom to the top (S22, S58), the laser oscillation unit 12 and the galvano scanner 18 are controlled. Then, each object OB is marked (printed) on the machined surface 8 of the machined object 7 in the first order (S24).

Therefore, in the laser processing apparatus 1 and the laser processing method 200 of the present embodiment, the marking (printing) processing of each object OB is performed on the processing surface 8 of the processing object 7 by the processing residue generated by the marking (printing) processing. Since the laser travels in the direction opposite to the direction of gravity acting on the machine, that is, from the bottom to the top of the gravity direction DG, it is possible to suppress the influence of the processing residue on the processing quality.

Further, in the laser processing apparatus 1 of the present embodiment, the galvano scanner 18 is arranged on the upper side of the DG in the direction of gravity with respect to the object to be processed 7, and each of them is determined by the working distance L measured by the TOF sensor 103. The position of the gravitational direction DG of the processing region OR of the object OB is accurately specified (S12, S14).

Further, in the laser processing apparatus 1 of the present embodiment, the shape of each object OB is specified by a plurality of coordinates defined in the XY coordinate system perpendicular to the gravity direction DG, and the gravity direction DG of the processing region OR of each object OB is specified. When the position of is specified, the working distance L is measured by TOF103 for each coordinate included in the plurality of coordinates (S12, S14). Therefore, the position of the gravitational direction DG of the processing region OR of each object OB is specified according to the shape of each object OB.

Further, in the laser processing apparatus 1 of the present embodiment, the lowest position of the object OB in the processing region OR in the gravity direction DG is specified as the position of the object OB processing region OR in the gravity direction DG, and the identification is specified for each object. It is performed for each OB (S14). Therefore, each object OB is marked (printed) on the machined surface 8 of the machined object 7 with priority given to the object OB whose lowermost end of the machined area OR (gravity direction DG) is located lower. S24).

Further, in the laser processing apparatus 1 of the present embodiment, when the processing region OR of one object OB has a width in the gravity direction DG among the plurality of object OBs (S34: YES), the galvano scanner is in the first scanning order 140. By controlling 18 (S38), the one object OB is marked (printed) on the machined surface 8 of the machined object 7 (S24). As a result, the scanning of the laser beam P proceeds in the direction opposite to the direction of gravity acting on the processing residue generated in the marking (printing) process, that is, from the lower side to the upper side in the gravity direction DG. Therefore, when the marking (printing) processing of one object OB whose processing region OR has a width in the gravity direction DG is performed, the influence of the processing residue on the processing quality of the other object OB can be suppressed, and in addition, the influence of the processing residue on the processing quality of the other object OB can be suppressed. The influence of the processing residue on the processing quality of the one object OB can be suppressed.

Further, in the laser processing apparatus 1 of the present embodiment, the difference LD between the lowest position and the uppermost position in the gravity direction DG in the processing region OR of one object OB among the plurality of objects OB is the depth of focus of the laser beam P. When it is larger than FD (S36: YES), the galvano scanner 18 is controlled in the first scanning order 140 (S38), so that the one object OB is marked (printed) on the machined surface 8 of the object 7 to be machined. (S24). As a result, the scanning of the laser beam P proceeds in the direction opposite to the direction of gravity acting on the processing residue generated in the marking (printing) process, that is, from the lower side to the upper side in the gravity direction DG. Therefore, when the marking (printing) processing of the one object OB is performed, the influence of the processing residue on the processing quality of the other object OB can be suppressed, and in addition, the processing quality of the one object OB itself is affected. The influence of processing residue can be suppressed.

On the other hand, when the difference LD between the lowest position and the highest position in the gravity direction DG in the processing region OR of one object OB is equal to or less than the depth of focus FD of the laser beam P (S36: NO), the one object The influence of the processing residue generated during the marking (printing) processing of the object OB on the processing quality of the one object OB itself is suppressed by the depth of focus FD of the laser beam P. In such a case, in the laser processing apparatus 1 of the present embodiment, the galvano scanner 18 is controlled in the second scanning order 142 different from the first scanning order 140 (S40), so that the one object OB is processed. Marking (printing) processing is performed on the processed surface 8 of the object 7 (S24).

Further, in the laser processing apparatus 1 of the present embodiment, when the separation distance LG in the gravity direction DG of the processing region OR of the two adjacent objects OB is smaller than the first threshold value (S54: YES), the two adjacent objects OB The machining order of is set to the first order (S58). As a result, the marking (printing) processing (S24) of the two adjacent objects OB is in the direction opposite to the direction of gravity acting on the processing residue generated by the marking (printing) processing, that is, from below the gravity direction DG. Since it is advanced upward, the influence of the processing residue on the processing quality is suppressed.

On the other hand, when the separation distance LG in the gravity direction DG of the processing region OR of two adjacent objects OB is equal to or greater than the first threshold value (S54: NO), the processing that occurs during the marking (printing) processing of one object OB. The influence of the residue on the processing quality of the other object OB is weakened by the distance between both object OBs in the gravity direction DG (that is, the separation distance LG). In such a case, in the laser machining apparatus 1 of the present embodiment, the machining order of two adjacent objects OB can be set to a second order (default which is the input order of the objects OB) different from the first order (default). S60).

Further, in the laser machining apparatus 1 of the present embodiment, when the type of the machining object 7 is the first type (S50: YES), the machining order of each object OB can be set to the first order (S58). As a result, the marking (printing) processing (S24) of each object OB proceeds in the direction opposite to the direction of gravity acting on the processing residue generated by the marking (printing) processing, that is, from the bottom to the top of the gravity direction DG. When this is done, the influence of the processing residue on the processing quality is suppressed.

On the other hand, when the type of the object to be processed 7 is the second type (S50: NO), the processing residue generated during the marking (printing) processing of one object OB is relative to the processing quality of the other object OB. The effect is weakened by the fact that the type of the object to be processed 7 is the second type. In such a case, in the laser processing apparatus 1 of the present embodiment, the processing order of each object OB is set to a second order (default which is the input order of the object OB) different from the first order (S60).

In the present embodiment, the first type and the second type are classified into a metallic type (aluminum, stainless steel, brass, ...) And a non-metallic type (vinyl chloride, paper, ...) According to the data table 150 of FIG. Has been done. However, the first type and the second type may be classified by, for example, the melting point of the processing object 7 from the viewpoint of the ease of scattering of the processing waste, and a trial is made to evaluate the influence of the processing waste on the processing quality. It may be classified from the result of marking (printing) processing to be performed. Specifically, it is preferable that the processing object 7 in which the processing residue is easily scattered is classified into the first type.

Further, in the laser machining apparatus 1 of the present embodiment, when the type of the object OB is fill (S52: YES), the machining order of each object OB is set to the first order (S58). As a result, the marking (printing) processing (S24) of each object OB proceeds in the direction opposite to the direction of gravity acting on the processing residue generated by the marking (printing) processing, that is, from the bottom to the top of the gravity direction DG. Therefore, the influence of the processing residue on the processing quality is suppressed.

On the other hand, when the type of the object OB is a line (S52: NO), the processing residue generated during the marking (printing) processing of one object OB has an influence on the processing quality of the other object OB. , It becomes weak because the type of object OB is a line. In such a case, in the laser processing apparatus 1 of the present embodiment, the processing order of each object OB may be set to a second order (default which is the input order of the object OB) different from the first order (S60).

Further, in the laser machining apparatus 1 of the present embodiment, when the separation distance LH in the horizontal direction of the machining region OR of the two adjacent objects OB is smaller than the second threshold value (S56: YES), the two adjacent objects OB The machining order is set to the first order (S58). As a result, the marking (printing) processing (S24) of the two adjacent objects OB is in the direction opposite to the direction of gravity acting on the processing residue generated by the marking (printing) processing, that is, from below the gravity direction DG. Since it is advanced upward, the influence of the processing residue on the processing quality can be suppressed.

On the other hand, when the separation distance LH in the horizontal direction of the processing area OR of two adjacent objects OB is equal to or greater than the second threshold value (S56: NO), processing residue generated during marking (printing) processing of one object OB is generated. However, the influence on the processing quality of the other object OB is weakened by the distance between both object OBs in the horizontal direction (that is, the separation distance LH). In such a case, in the laser machining apparatus 1 of the present embodiment, the machining order of two adjacent objects OB is set to a second order (default which is the input order of the objects OB) different from the first order (default). S60).

Incidentally, in the present embodiment, the laser oscillation unit 12 is an example of the “laser beam emission unit”. The galvano scanner 18 is an example of a “scanning unit”. The CPU 61 and ROM 63 are examples of "control units". The TOF sensor 103 is an example of a “distance measuring unit”. The working distance L is an example of "distance to the machined surface". The XY coordinate system is an example of a "two-dimensional coordinate system". The first setting process S10 is an example of the “setting process”. The first specific process S14 is an example of the “specific process”. The processing process S24 is an example of a “processing process”.

The present disclosure is not limited to the present embodiment, and various changes can be made without departing from the spirit of the present embodiment.
For example, the processing area OR of the object OB on the processing surface 8 of the processing object 7 may be set by an image processing technique or the like.

Further, the laser processing apparatus 1 of the present embodiment may be one in which the laser beam P from the galvano scanner 18 is irradiated from the lower side to the upper side in the gravity direction DG. Further, as shown in FIG. 17, the fθ lens 19 may be arranged so that its main axis is perpendicular to the gravity direction DG (that is, parallel to the horizontal direction). In such a case, the laser beam P from the galvano scanner 18 is irradiated along the horizontal direction perpendicular to the gravity direction DG, and the workpiece 7 is positioned so as to face the galvano scanner 18 and the fθ lens 19 in the horizontal direction. Is placed in.

Further, the laser processing device 1 of the present embodiment may measure the working distance L by a camera, a pointer light emitter, a contact type sensor, or the like instead of the TOF sensor sensor 13.

Further, in the program of the laser machining method 200 shown by the flowcharts of FIGS. 5 to 7, the first setting process (S10), the distance measurement process (S12), the first specific process (S14), and the first processing sequence are performed. Any step may be omitted except for the setting process (S58).

Further, in the scanning order setting process (S16) shown in FIG. 6, any one of the determination processes S34 and S36 may be omitted.

Further, in the second setting process (S22) shown in FIG. 7, any of the determination processes of S50, S52, S54, and S56 may be omitted except for at least one.

1: Laser processing device, 7: Processing object, 8: Processing surface, 12: Laser oscillation unit, 18: Galvano scanner, 61: CPU, 63: ROM, 103: TOF sensor, 140: First scanning order, 142: Second scanning order, 200: Laser processing method, DG: Gravity direction, FD: Focus depth, L: Working distance, LD: Difference between the lowest position and the highest position in the gravity direction in the processing area, LG: In the gravity direction Separation distance, LH: Separation distance in the horizontal direction, OB: Object, OR: Processing area, P: Laser light, S10: First setting process, S14: First specific process, S18: Second specific process, S20: Third Specific processing, S22: Second setting processing, S24: Machining processing

Claims (11)

A laser beam emitting unit that emits a laser beam for processing a plurality of objects on the processed surface of the object to be processed, and a laser beam emitting unit.
A scanning unit that irradiates the processed surface with the laser beam and scans the surface.
With a control unit,
The control unit is
The first setting process of setting a machining area on the machining surface for each object included in the plurality of objects, and
The first specific process of specifying the position of the processing region in the gravity direction for each of the objects, and
The second setting process of setting the machining order of each object in the first order in which the positions of the machining areas in the gravity direction are in the order from bottom to top, and
A laser characterized by controlling the laser beam emitting unit and the scanning unit to perform a processing process of processing the plurality of objects on the processed surface in a processing order set in the second setting process. Processing equipment. The laser machining apparatus includes a ranging unit that measures the distance to the machined surface.
The scanning unit is arranged on the upper side in the direction of gravity with respect to the object to be processed.
The first aspect of the present invention, wherein the control unit specifies the position of the processing region in the gravity direction based on the distance measured by the distance measuring unit when executing the first specific processing. Laser processing equipment. Each shape of each of the objects is specified by a plurality of coordinates defined in a two-dimensional coordinate system perpendicular to the direction of gravity.
The laser processing according to claim 2, wherein the control unit measures the distance for each coordinate included in the plurality of coordinates by the distance measuring unit when executing the first specific process. Device. The control unit is characterized in that, when executing the first specific process, the lowest position in the machining region in the gravity direction is specified as the position in the gravity direction of the machining region for each of the objects. The laser processing apparatus according to any one of claims 1 to 3. When the control unit executes the machining process, for one object whose machining region has a width in the gravity direction among the objects, the laser beam is downward on the machining surface in the gravity direction. The laser processing apparatus according to claim 4, wherein the scanning unit is controlled in the first scanning order of scanning from the side to the upper side. When the control unit executes the processing, the difference between the lowest position and the highest position in the processing region in the gravity direction of the one object is larger than the depth of focus of the laser beam. A claim characterized in that the scanning unit is controlled in the first scanning order, while the scanning unit is controlled in a second scanning order different from the first scanning order when the difference is equal to or less than the depth of focus. Item 5. The laser processing apparatus according to Item 5. When the control unit executes the second setting process, if the separation distance of the two adjacent objects in the gravity direction of the processing region is smaller than the first threshold value, the processing order of the two adjacent objects is small. Is set in the first order, while the separation distance in the gravity direction is equal to or greater than the first threshold value, the processing order of the two adjacent objects is set in a second order different from the first order. The laser processing apparatus according to any one of claims 1 to 6, wherein the laser processing apparatus is characterized. The control unit is
The second specific process for specifying the type of the object to be processed is executed.
When the type is specified to be the first type by executing the second setting process, the processing order of the plurality of objects is set to the first order, while the type is other than the first type. The laser according to any one of claims 1 to 6, wherein the processing order of the plurality of objects is set to a second order different from the first order when it is specified to be present. Processing equipment. The control unit is
The third specific process for specifying the types of the plurality of objects is executed, and
When the type is specified to be filled by executing the second setting process, the processing order of the plurality of objects is set to the first order, while the type is specified to be a line. The laser processing apparatus according to any one of claims 1 to 6, wherein the processing order of the plurality of objects is set to a second order different from the first order. When the control unit executes the second setting process, if the separation distance of the two adjacent objects in the horizontal direction in the horizontal direction is smaller than the second threshold value, the processing order of the two adjacent objects is small. Is set in the first order, while the separation distance in the horizontal direction is equal to or greater than the second threshold value, the processing order of the two adjacent objects is set in a second order different from the first order. The laser processing apparatus according to any one of claims 1 to 6, wherein the laser processing apparatus is characterized. A laser processing method in which a plurality of objects are machined on the machined surface by irradiating the machined surface of the object to be machined with the laser light emitted from the laser light emitting unit and scanning the scanning unit.
A setting process for setting a machining area on the machining surface for each object included in the plurality of objects, and a setting step.
A specific step of specifying the position of the processing region in the gravity direction for each of the objects, and
A laser machining method comprising a machining step of machining each of the objects in the order in which the position of the machining region in the gravity direction is from bottom to top.

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