JP2021114488A - LED package - Google Patents

Abstract

To provide an LED package capable of individually setting an irradiation range to an object in response to a plurality of lights having a different wavelength individually generated from a plurality of LED chips.SOLUTION: An LED package comprises: a supporting member 10 having a wiring 12; a plurality of LED chips 20 jointed to the wiring; a case 60 supported by the supporting member and surrounding the plurality of LED chips ; and a translucent member 70 supported by the case and blocking the plurality of LED chips. The plurality of LED chips contains a first chip 201 and a second chip 202, having a different wavelength of a light generated. The translucent member includes a plurality of lens parts 72 containing: a first lens part 721 distributing the light generated from the first chip; a second lens part 722 distributing the light generated from the second chip. The first and second lens parts are separately positioned each other, and a light distribution angle of the first lens is different from that of the second lens part.SELECTED DRAWING: Figure 9

Description

The present invention relates to an LED package including a plurality of LED chips mainly used for a human body information measurement module.

Patent Document 1 discloses an example of a human body information measurement module. The module is mounted, for example, on a wiring board of a wristwatch. The module includes a light emitting unit that irradiates an object with light and a light receiving unit that detects the light reflected by the object to be irradiated. The light emitting unit is an LED chip. The light receiving unit is a light receiving element such as a photodiode. In the module, the light emitting unit individually emits a plurality of lights having different wavelengths according to the human body information to be measured, and the light receiving unit individually detects a plurality of lights having different wavelengths reflected from the irradiation target object. For example, when the object to be irradiated is a blood vessel, the pulse wave of the human body can be measured by using green light. When the object to be irradiated is hemoglobin in the blood, the oxygen concentration in the blood of the human body can be measured by using red light and infrared rays.

As described above, in order to measure a plurality of human body information in the module, it is necessary to include a plurality of LED chips that individually emit a plurality of lights having different wavelengths. Here, it is desirable to individually set the irradiation range of light in order to improve the measurement accuracy according to the irradiation target for measuring human body information. When the object to be irradiated is a blood vessel, it is desirable that the irradiation range of light is wider in order to more accurately capture the movement of the blood vessel. On the other hand, when the object to be irradiated is hemoglobin in blood, it is desirable that the irradiation range of light is narrower because a relatively small object is captured.

Japanese Unexamined Patent Publication No. 2016-123715

In view of the above circumstances, the present invention provides an LED package capable of individually setting the irradiation range of an object for a plurality of lights having different wavelengths individually emitted from a plurality of LED chips. Make it an issue.

The LED package provided by the present invention includes a support member having wiring, a plurality of LED chips joined to the wiring and conductive to the wiring, and the plurality of LED chips on opposite sides in the thickness direction of each of the plurality of LED chips. A case in which the back surface is supported by the support member and surrounds the plurality of LED chips, and a translucent member that is supported by the top surface and closes the plurality of LED chips. The translucent member has a plurality of lens portions that individually distribute light emitted from each of the plurality of LED chips, and the plurality of LED chips emit light having different wavelengths. The plurality of lens units include a chip and a second chip, and the plurality of lens units include a first lens unit that distributes light emitted from the first chip and a second lens unit that distributes light emitted from the second chip. Including, the first lens portion and the second lens portion are located apart from each other, and the light distribution angle of the first lens portion is different from the light distribution angle of the second lens portion.

In carrying out the present invention, preferably, at least a part of the region surrounded by the support member, the case and the translucent member is hollow.

In the practice of the present invention, the translucent member preferably has an outer surface facing the same side as the top surface in the thickness direction and an inner surface facing the side opposite to the outer surface and facing the plurality of LED chips. , And the plurality of lens portions are formed on the outer surface.

In the practice of the present invention, each of the plurality of lens portions preferably forms a Fresnel lens.

In the practice of the present invention, preferably, the wavelength of the light emitted from the second chip is shorter than the wavelength of the light emitted from the first chip, and the light distribution angle of the second lens portion is the arrangement of the first lens portion. It is larger than the light angle.

In carrying out the present invention, it is preferable to further include a translucent resin in contact with the support member, and the translucent resin covers the plurality of LED chips and at least a part of the wiring.

In the practice of the present invention, the translucent resin is preferably connected in a series and in contact with the case.

In the practice of the present invention, the translucent resin preferably includes a plurality of regions located apart from each other, and the plurality of regions individually cover the plurality of LED chips.

In the practice of the present invention, preferably, the first chip forms a first group arranged at predetermined intervals, and the first lens portion forms the first group when viewed along the thickness direction. The second chip comprises a plurality of regions individually overlapping with respect to the first chip, the second chip forms a second group arranged at predetermined intervals, and the second lens portion is viewed along the thickness direction. It contains a plurality of regions that individually overlap with the second chip forming the second group.

In the practice of the present invention, preferably, the support member has a base material having a main surface facing the back surface, and the wiring is arranged on the main surface.

In the practice of the present invention, the base material preferably faces outward in a direction that is connected to the main surface and the bottom surface and is orthogonal to the thickness direction, and a bottom surface that faces the side opposite to the main surface. The support member has a plurality of terminals arranged on the bottom surface, which have a side surface and a plurality of penetrating portions that are recessed from the side surface toward the inside of the base material and are connected to the main surface and the bottom surface. And a plurality of side terminals individually arranged with respect to the plurality of through portions, and each of the plurality of side terminals conducts to the wiring and is connected to any of the plurality of terminals. ing.

In the practice of the present invention, preferably, a first resist layer arranged on the main surface and having electrical insulation is further provided, and the first resist layer is one of the thickness directions of the plurality of through portions. It's blocking the edge.

In the practice of the present invention, the first resist layer preferably includes a region located between the support member and the case in the thickness direction.

In the practice of the present invention, preferably, the support member has a heat radiating body arranged on the bottom surface, and the plurality of LED chips overlap the heat radiating body when viewed along the thickness direction.

In the practice of the present invention, it is preferable that a second resist layer arranged on the bottom surface and having electrical insulation is further provided, and the second resist layer is located between the plurality of terminals and the radiator. do.

According to the LED package according to the present invention, it is possible to individually set the irradiation range to the object for a plurality of lights having different wavelengths individually emitted from the plurality of LED chips.

Other features and advantages of the present invention will become more apparent with the detailed description given below based on the accompanying drawings.

It is a top view of the LED package which concerns on 1st Embodiment of this invention. It is a plan view corresponding to FIG. 1, and is transmitted through a translucent member. It is a plan view corresponding to FIG. 1, and the case and the translucent member are not shown. It is a top view which shows the structure in the intermediate layer of the base material among the support members of the LED package shown in FIG. It is a top view which shows the structure of the support member of the LED package shown in FIG. 1 in the lower layer of a base material. It is a bottom view of the LED package shown in FIG. It is a front view of the LED package shown in FIG. It is a right side view of the LED package shown in FIG. It is sectional drawing which follows the IX-IX line of FIG. It is sectional drawing explaining the operation of the LED package shown in FIG. It is sectional drawing which follows the XI-XI line of FIG. It is sectional drawing which follows the XII-XII line of FIG. It is a partially enlarged view of FIG. It is a partially enlarged view of FIG. It is a top view of the LED package which concerns on 2nd Embodiment of this invention, and is transmitted through a translucent member. It is sectional drawing which follows the XVI-XVI line of FIG. FIG. 5 is a cross-sectional view taken along the line XVII-XVII of FIG. It is sectional drawing explaining the operation of the LED package shown in FIG. It is a top view of the LED package which concerns on 3rd Embodiment of this invention, and is transmitted through a translucent member. FIG. 3 is a cross-sectional view taken along the line XX-XX of FIG. It is sectional drawing which follows the XXI-XXI line of FIG. It is sectional drawing explaining the operation of the LED package shown in FIG.

A mode for carrying out the present invention will be described with reference to the accompanying drawings.

[First Embodiment]
The LED package A10 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 14. The LED package A10 includes a support member 10, a plurality of LED chips 20, a plurality of wires 30, a resist layer 50, a case 60, and a translucent member 70. The LED package A10 shown in these figures is used in a human body information measurement module together with a plurality of light receiving elements such as a photodiode. Here, FIG. 2 transmits the light transmitting member 70 for convenience of understanding. In FIG. 2, each of the IX-IX line, the XI-XI line, and the XII-XII line is shown by a alternate long and short dash line. The cross-sectional positions and ranges of FIG. 10 correspond to those of FIG.

In the description of the LED package A10, the thickness direction of each of the plurality of LED chips 20 is referred to as "thickness direction z". The direction orthogonal to the thickness direction z is called the "first direction x". The direction orthogonal to both the thickness direction z and the first direction x is referred to as a "second direction y". As shown in FIG. 1, the LED package A10 has a rectangular shape when viewed along the thickness direction z. The first direction x corresponds to the longitudinal direction of the LED package A10. The second direction y corresponds to the lateral direction of the LED package A10.

As shown in FIGS. 2, 9, 11 and 12, a plurality of LED chips 20 are mounted on the support member 10. As shown in FIGS. 9, 11 and 12, the support member 10 includes a base material 11, wiring 12, a plurality of terminals 13, a plurality of side terminals 14, connecting wiring 15, a plurality of vias 16, and a radiator body 17. Have.

As shown in FIGS. 3 to 6, wiring 12, a plurality of terminals 13, a plurality of side terminals 14, a connecting wiring 15, a plurality of vias 16, and a radiator 17 are arranged on the base material 11. The base material 11 has electrical insulation. The base material 11 has a main surface 11A, a bottom surface 11B, a side surface 11C, and a plurality of penetrating portions 11D. The main surface 11A and the bottom surface 11B face opposite to each other in the thickness direction z. Of these, the main surface 11A faces the side where the plurality of LED chips 20 are located in the thickness direction z. The bottom surface 11B faces the wiring board when the LED package A10 is mounted on the wiring board. The side surface 11C is connected to the main surface 11A and the bottom surface 11B, and faces outward in a direction orthogonal to the thickness direction z. In the LED package A10, the side surface 11C includes a pair of regions facing outward in the first direction x and a pair of regions facing outward in the second direction y. Each of the plurality of penetrating portions 11D is recessed from the side surface 11C toward the inside of the base material 11 and is connected to the main surface 11A and the bottom surface 11B. In the LED package A10, each of the plurality of penetrating portions 11D is recessed inward of the base material 11 from any of a pair of regions of the side surface 11C facing outward in the first direction x. In each of the pair of regions, the plurality of penetrating portions 11D are arranged at predetermined intervals in the second direction y. Each of the plurality of penetrating portions 11D has a substantially semicircular shape when viewed along the thickness direction z.

As shown in FIGS. 9, 11 and 12, in the LED package A10, the base material 11 includes an upper layer 111, a lower layer 112 and an intermediate layer 113 laminated in the thickness direction z in its configuration. Therefore, the base material 11 has a multi-layer structure. The upper layer 111, the lower layer 112, and the intermediate layer 113 are all made of a material containing a glass epoxy resin. The upper layer 111 includes the main surface 11A. The lower layer 112 includes a bottom surface 11B. The intermediate layer 113 is sandwiched between the upper layer 111 and the lower layer 112. The base material 11 is integrated by thermocompression bonding the upper layer 111, the lower layer 112, and the intermediate layer 113 to each other.

As shown in FIG. 3, the wiring 12 is arranged on the main surface 11A of the base material 11 (upper layer 111). In the LED package A10, the wiring 12 is conductive between the plurality of LED chips 20 and the wiring board on which the LED package A10 is mounted, together with the plurality of terminals 13, the plurality of side terminals 14, the connecting wiring 15, and the plurality of vias 16. It is a route. In the LED package A10, the wiring 12 is composed of a plurality of metal layers. As an example of the plurality of metal layers, a copper (Cu) layer, a nickel (Ni) layer, and a gold (Au) layer are laminated in order from the main surface 11A. The wiring 12 is mainly formed by electrolytic plating. The wiring 12 includes a plurality of first pads 121, a plurality of second pads 122, and a plurality of third pads 123.

As shown in FIG. 3, a plurality of LED chips 20 are individually bonded to each of the plurality of first pads 121. In the LED package A10, the plurality of first pads 121 are arranged in three rows with respect to the first direction x. In each of these rows, a pair of the first pads 121 are arranged in the second direction y at predetermined intervals.

As shown in FIG. 3, each of the plurality of second pads 122 is adjacent to any of the plurality of first pads 121. Of the plurality of first pads 121 arranged in three rows with respect to the first direction x, in the two rows located on both sides of the first direction x, a plurality of first pads 121 are provided for each of the plurality of first pads 121. Any one of the two pads 122 is adjacent. Of the plurality of first pads 121 arranged in three rows with respect to the first direction x, in one row located between the two rows located on both sides of the first direction x, each of the plurality of first pads 121 On the other hand, any two of the plurality of second pads 122 are adjacent to each other so as to be located on both sides of the second direction y.

As shown in FIG. 3, the plurality of third pads 123 are individually arranged with respect to the plurality of penetrating portions 11D of the base material 11. Each of the plurality of third pads 123 has a band shape forming a substantially arc when viewed along the thickness direction z.

As shown in FIG. 6, the plurality of terminals 13 are arranged on the bottom surface 11B of the base material 11 (lower layer 112). The plurality of terminals 13 are individually arranged with respect to the plurality of penetrating portions 11D of the base material 11. When the LED package A10 is mounted on the wiring board, the plurality of terminals 13 are joined to the wiring board via solder. In the LED package A10, each of the plurality of terminals 13 is composed of a plurality of metal layers. The configuration of the plurality of metal layers is the same as the configuration of the plurality of metal layers forming the wiring 12.

As shown in FIGS. 4 to 6 and 9, the plurality of side surface terminals 14 are individually arranged with respect to the plurality of through portions 11D of the base material 11. Each of the plurality of side surface terminals 14 is formed along a region of the side surface 11C of the base material 11 that defines each of the plurality of penetration portions 11D. In each of the plurality of side terminals 14, one end of the thickness direction z is connected to any of the plurality of third pads 123. In addition, the other end in the thickness direction z is connected to any of the plurality of terminals 13.

As shown in FIGS. 4 and 5, the connecting wiring 15 is arranged in the lower layer 112 of the base material 11 and the intermediate layer 113 of the base material 11. The communication wiring 15 forms a conduction path between the wiring 12 (the plurality of first pads 121 and the plurality of second pads 122) and the plurality of side terminals 14 together with the plurality of vias 16. The connecting wiring 15 is made of, for example, copper. The connecting wiring 15 includes the first wiring 151 and the second wiring 152.

As shown in FIGS. 5, 9 and 11, the first wiring 151 is arranged on the lower layer 112 of the base material 11 on a surface facing the bottom surface 11B of the base material 11. The first wiring 151 includes a plurality of regions. Each of the plurality of regions is connected to any of the plurality of side terminals 14. The first wiring 151 is sandwiched between the lower layer 112 and the intermediate layer 113 of the base material 11.

As shown in FIGS. 4, 9 and 12, the second wiring 152 is arranged on the intermediate layer 113 of the base material 11 so as to face the same side as the main surface 11A of the base material 11. The second wiring 152 includes a plurality of regions. Each of the plurality of regions is connected to any of the plurality of side terminals 14. The second wiring 152 is sandwiched between the intermediate layer 113 and the upper layer 111 of the base material 11.

As shown in FIGS. 9, 11 and 12, the plurality of vias 16 are embedded in the base material 11. Each of the plurality of vias 16 is connected to any region of the connecting wiring 15. In addition, the plurality of vias 16 are individually connected to the plurality of first pads 121 and the plurality of second pads 122. The plurality of vias 16 have conductivity. Each of the plurality of vias 16 is a substantially columnar shape extending in the thickness direction z. Each of the plurality of vias 16 is made of, for example, copper. The plurality of vias 16 include a plurality of first vias 161 and a plurality of second vias 162.

As shown in FIGS. 9 and 11, each of the plurality of first vias 161 is embedded in the upper layer 111 of the base material 11 and the intermediate layer 113 of the base material 11. In each of the plurality of first vias 161 one end of the thickness direction z is connected to any region of the first wiring 151. In addition, the other end in the thickness direction z is connected to any of the plurality of first pads 121 and the plurality of second pads 122.

As shown in FIGS. 9 and 12, each of the plurality of second vias 162 is embedded in the upper layer 111 of the base material 11. Therefore, the length of each of the plurality of second vias 162 is smaller than the length of each of the plurality of first vias 161. In each of the plurality of second vias 162, one end of the thickness direction z is connected to any region of the second wiring 152. In addition, the other end in the thickness direction z is connected to any of the plurality of first pads 121 and the plurality of second pads 122.

As shown in FIG. 6, the heat radiating body 17 is arranged on the bottom surface 11B of the base material 11 (lower layer 112). In the first direction x, the radiator 17 is located between the plurality of terminals 13. When viewed along the thickness direction z, the plurality of LED chips 20 and at least a part of each of the plurality of first pads 121 overlap with the heat radiating body 17. Further, when viewed along the thickness direction z, the area of the radiator 17 is larger than the total area of the plurality of terminals 13. In the LED package A10, each of the plurality of terminals 13 is composed of a plurality of metal layers. The configuration of the plurality of metal layers is the same as the configuration of the plurality of metal layers forming the wiring 12.

As shown in FIG. 3, the plurality of LED chips 20 are individually bonded to the plurality of first pads 121 of the wiring 12. As a result, in the LED package A10, the plurality of LED chips 20 are arranged in three rows with respect to the first direction x. In each of these rows, a pair of the LED chips 20 are arranged in the second direction y at predetermined intervals, and the pair of LED chips 20 form a group in the LED package A10. The LED package A10 includes four first chips 201 and a pair of second chips 202. The wavelengths of light emitted from the first chip 201 and the second chip 202 are different from each other.

As shown in FIG. 3, the four first chips 201 form two rows located on both sides of the first direction x among the plurality of LED chips 20 arranged in three rows with respect to the first direction x. .. In each of these rows, a pair of first chips 201 form a group arranged in the second direction y at predetermined intervals. As shown in FIG. 2, for convenience, the pair of first chips 201 is referred to as a first group 20A. Of the first group 20A, one is a chip that emits red light and the other is a chip that emits infrared light. Group 1 20A is used to measure the blood oxygen concentration of the human body. More specifically, the chip that emits red light in the first group 20A is used to measure the total number of hemoglobin in blood per unit volume. In addition, the chip that emits infrared rays in the first group 20A is used to measure the total number of hemoglobins in the blood that do not carry oxygen among the hemoglobins in the blood per unit volume.

As shown in FIG. 13, each of the four first chips 201 has a first electrode 21 and a second electrode 22. The first electrode 21 is provided so as to face any of a plurality of first pads 121 of the wiring 12 to which the first chip 201 is joined. The first electrode 21 is the anode of the first chip 201. The first electrode 21 is bonded to the first pad 121 via the bonding layer 29. The bonding layer 29 has conductivity. The bonding layer 29 is made of a material containing, for example, silver (Ag) particles and an epoxy resin. As a result, the first electrode 21 of the first chip 201 is conducting to the first pad 121 via the bonding layer 29. The second electrode 22 is provided on the upper surface of the first chip 201. The second electrode 22 is the cathode of the first chip 201.

As shown in FIG. 3, the pair of second chips 202 are located between two rows of four first chips 201 among the plurality of LED chips 20 arranged in three rows in the first direction x. There is one row. In this one row, a pair of second chips 202 form a group arranged at predetermined intervals in the second direction y. As shown in FIG. 2, for convenience, the pair of second chips 202 is referred to as a second group 20B. In the first direction x, the second group 20B is located between the four first chips 201. The second group 20B emits green light having the same wavelength as each other. Therefore, the wavelength of the light emitted from each of the second group 20B is shorter than the wavelength of the light emitted from each of the four first chips 201. The second group 20B is used for measuring the pulse wave (pulsation of blood vessels) of the human body.

As shown in FIG. 14, each of the pair of second chips 202 has its lower surface joined to any of the first pads 121 of the wiring 12 via the joining layer 29. Each of the pair of second chips 202 has a first electrode 21 and a second electrode 22. The first electrode 21 is the anode of the second chip 202. The second electrode 22 is the cathode of the second chip 202. The first electrode 21 and the second electrode 22 are provided on the upper surface of the second chip 202.

In each of the pair of second chips 202, one of the four first chips 201 that emits red light is located on one side of the first direction x of the second chip 202. Of the four second chips 202, a chip that emits infrared rays is located on the other side of the second chip 202 in the first direction x.

As shown in FIG. 3, each of the plurality of wires 30 has one end bonded to one of the plurality of second pads 122 of the wiring 12, and the other end is any one of the plurality of LED chips 20. It is joined to. Each of the plurality of wires 30 is made of, for example, gold. The plurality of wires 30 include a plurality of first wires 301 and a plurality of second wires 302.

As shown in FIG. 3, each of the plurality of first wires 301 is located closest to the first electrode 21 of each of the pair of second chips 202 among the plurality of LED chips 20 and the first electrode 21. It is joined to any one of a plurality of second pads 122 of the wiring 12. As a result, each of the first electrodes 21 of the pair of second chips 202 is conducting to the second pad 122.

As shown in FIG. 3, each of the plurality of second wires 302 includes the second electrode 22 of each of the plurality of LED chips 20 and the second pad 122 of the wiring 12 located closest to the second electrode 22. It is joined to either. As a result, the second electrode 22 of each of the plurality of LED chips 20 is conducting to the second pad 122.

As shown in FIGS. 3 and 6 to 8, the resist layer 50 is arranged on the main surface 11A of the base material 11 (upper layer 111) and the bottom surface 11B of the base material 11 (lower layer 112). The resist layer 50 has electrical insulation. The resist layer 50 is, for example, a solder resist film. The resist layer 50 includes a first resist layer 51 and a second resist layer 52.

As shown in FIGS. 3, 7, and 8, the first resist layer 51 is arranged on the main surface 11A of the base material 11. When viewed along the thickness direction z, the first resist layer 51 has a frame shape arranged along the peripheral edge of the main surface 11A. A part of the region of the first resist layer 51 closes one end of each of the plurality of through portions 11D of the base material 11 in the thickness direction z from above, and covers the plurality of third pads 123 of the wiring 12. There is. Further, as shown in FIGS. 7 to 9, the first resist layer 51 includes a region located between the support member 10 and the case 60 in the thickness direction z.

As shown in FIGS. 6 to 8, the second resist layer 52 is arranged on the bottom surface 11B of the base material 11. The second resist layer 52 includes a pair of regions located apart from each other in the first direction x. Each of the pair of regions extends in the second direction y. Each of the pair of regions is located between a group of terminals 13 arranged in the second direction y and the radiator 17.

As shown in FIG. 2, the case 60 surrounds a plurality of LED chips 20. The case 60 has a frame shape when viewed along the thickness direction z. The case 60 is supported by the support member 10. The case 60 is made of a material containing, for example, polyphthalamide (PPA) or liquid crystal polymer (LCP). The material of the case 60 is not limited to these, and there are a wide variety of materials as long as they have relatively high mechanical strength and excellent heat resistance. As shown in FIGS. 9, 11 and 12, the case 60 has a top surface 60A, a back surface 60B, an outer surface 60C and an inner surface 60D.

As shown in FIGS. 9, 11 and 12, the top surface 60A faces the same side as the main surface 11A of the base material 11 (upper layer 111) in the thickness direction z. The back surface 60B faces the side opposite to the main surface 11A in the thickness direction z. The back surface 60B faces the main surface 11A. The back surface 60B is joined to the main surface 11A and the first resist layer 51 via an adhesive layer (not shown) located between the support member 10 and the case 60 in the thickness direction z. As a result, the case 60 has a configuration in which the back surface 60B is supported by the support member 10.

As shown in FIGS. 2, 9, 11 and 12, the outer surface 60C is connected to the top surface 60A and the back surface 60B and faces outward in a direction orthogonal to the thickness direction z. The outer side surface 60C includes a pair of regions facing the first direction x and a pair of regions facing the second direction y. Each of the plurality of regions included in the outer side surface 60C is flush with any of the plurality of regions included in the side surface 11C of the base material 11. As shown in FIGS. 2, 9, 11 and 12, the inner side surface 60D is connected to the top surface 60A and the back surface 60B and faces inward in a direction orthogonal to the thickness direction z. The inner side surface 60D faces the plurality of LED chips 20.

As shown in FIGS. 9, 11 and 12, the translucent member 70 is supported by the top surface 60A of the case 60 and closes the plurality of LED chips 20. The light transmitting member 70 transmits light emitted from a plurality of LED chips 20. The translucent member 70 is made of, for example, optical glass. In the LED package A10, the region surrounded by the support member 10, the case 60, and the translucent member 70 is hollow. The translucent member 70 has an outer surface 70A, an inner surface 70B, and a plurality of lens portions 72.

As shown in FIGS. 9, 11 and 12, the outer surface 70A faces the same side as the top surface 60A of the case 60 in the thickness direction z. The inner surface 70B faces the side opposite to the outer surface 70A and faces the plurality of LED chips 20. The inner surface 70B is joined to the top surface 60A via an adhesive. As a result, the translucent member 70 has a configuration in which the inner surface 70B is supported by the case 60.

As shown in FIGS. 1, 9, 11 and 12, the plurality of lens portions 72 individually overlap the plurality of LED chips 20 when viewed along the thickness direction z. The plurality of lens units 72 individually distribute the light emitted from each of the plurality of LED chips 20. Each of the plurality of lens portions 72 is located apart from all of the plurality of other lens portions 72 except the lens portion 72. The plurality of lens portions 72 are formed on the outer surface 70A of the translucent member 70. Each of the plurality of lens portions 72 forms a Fresnel lens.

As shown in FIG. 1, in the LED package A10, the plurality of lens units 72 include four first lens units 721 and a pair of second lens units 722. The four first lens units 721 individually distribute the light emitted from each of the four first chips 201. The pair of second lens units 722 individually distribute the light emitted from each of the pair of second chips 202.

As shown in FIG. 10, each light distribution angle θ2 of the pair of second lens portions 722 is larger than each light distribution angle θ1 of the four first lens portions 721. That is, the light distribution angle θ1 of each of the four first lens units 721 is different from the light distribution angle θ2 of each of the pair of second lens units 722. As a result, in the LED package A10, the light emitted from each of the pair of second chips 202 is irradiated to the object more widely than the light emitted from each of the four first chips 201. Each of these light distribution angles is determined by the shape of each of the plurality of lens portions 72 over the light distribution angle.

Next, the action and effect of the LED package A10 will be described.

The LED package A10 includes a translucent member 70 having a plurality of lens portions 72 that individually distribute light emitted from each of the plurality of LED chips 20. The plurality of LED chips 20 include a first chip 201 and a second chip 202 having different wavelengths of emitted light. The plurality of lens units 72 include a first lens unit 721 that distributes light emitted from the first chip 201 and a second lens unit 722 that distributes light emitted from the second chip 202. The first lens unit 721 and the second lens unit 722 are located apart from each other. As shown in FIG. 10, the light distribution angle θ1 of the first lens unit 721 is different from the light distribution angle θ2 of the second lens unit 722. As a result, the irradiation range of the light emitted from the first chip 201 with respect to the object is different from the irradiation range of the light emitted from the second chip 202. Therefore, according to the LED package A10, it is possible to individually set the irradiation range to the object for a plurality of lights having different wavelengths individually emitted from the plurality of LED chips 20.

The wavelength of the light emitted from the second chip 202 is shorter than the wavelength of the light emitted from the first chip 201. On the other hand, the light distribution angle θ2 of the second lens unit 722 is larger than the light distribution angle θ1 of the first lens unit 721. As a result, the irradiation range of the light emitted from the second chip 202 becomes wider than the irradiation range of the light emitted from the first chip 201. That is, when the LED package A10 is used for the human body information measurement module, the light emitted from the first chip 201 is applied for measuring the blood oxygen concentration of the human body, and the light emitted from the second chip 202 is applied for measuring the pulse wave of the human body. Therefore, the measurement accuracy of each of the plurality of human body information can be improved.

The plurality of lens portions 72 are formed on the outer surface 70A of the translucent member 70. Further, each of the plurality of lens portions 72 forms a Fresnel lens. As a result, the height of the plurality of lens portions 72 can be made as small as possible, so that the height of the LED package A10 can be reduced.

When the LED package A10 includes the case 60, when the LED package A10 is used for a human body information measurement module, it is possible to suppress light leakage to a component such as a light receiving element used in the module.

The base material 11 has a plurality of penetrating portions 11D that are recessed from the side surface 11C toward the inside of the base material 11 and are connected to the main surface 11A and the bottom surface 11B. The support member 10 has a plurality of terminals 13 arranged on the bottom surface 11B, and a plurality of side surface terminals 14 individually arranged with respect to the plurality of through portions 11D. Each of the plurality of side terminals 14 is conductive to the wiring 12 and is connected to any of the plurality of terminals 13. As a result, when the LED package A10 is mounted on the wiring board, solder adheres to the plurality of side terminals 14 in addition to the plurality of terminals 13. As a result, the mounting strength of the LED package A10 on the wiring board is improved. At the same time, by visually observing the shapes of the solders attached to the plurality of side terminals 14, the mounting state of the LED package A10 mounted on the wiring board can be easily confirmed.

The LED package A10 further includes a first resist layer 51 that is arranged on the main surface 11A of the base material 11 and has electrical insulation. The first resist layer 51 closes one end of each of the plurality of through portions 11D of the support member 10 in the thickness direction z. Further, the first resist layer 51 includes a region located between the support member 10 and the case 60 in the thickness direction z. As a result, even if the back surface 60B of the case 60 overlaps the plurality of penetrating portions 11D when viewed along the thickness direction z, it is possible to sufficiently secure the area of the back surface 60B to be joined to the support member 10. can.

The support member 10 has a radiator 17 arranged on the bottom surface 11B. The plurality of LED chips 20 overlap with the heat radiating body 17 when viewed along the thickness direction z. As a result, the heat generated from the plurality of LED chips 20 can be released to the outside more efficiently.

The LED package A10 further includes a second resist layer 52 that is arranged on the bottom surface 11B of the base material 11 and has electrical insulation. The second resist layer 52 is located between the plurality of terminals 13 and the heat radiating body 17. As a result, when the LED package A10 is mounted on the wiring board, it is possible to prevent the solder from adhering to the radiator body 17.

[Second Embodiment]
Next, the LED package A20 according to the second embodiment of the present invention will be described with reference to FIGS. 15 to 18. In these figures, elements that are the same as or similar to the LED package A10 described above are designated by the same reference numerals, and redundant description will be omitted. Here, FIG. 15 transmits the light transmitting member 70 for convenience of understanding. In FIG. 15, each of the XVI-XVI line and the XVII-XVII line is shown by a alternate long and short dash line. The cross-sectional positions and ranges of FIG. 18 correspond to those of FIG.

The LED package A20 is different from the LED package A10 described above in that the translucent resin 40 is further provided.

As shown in FIGS. 16 and 17, the translucent resin 40 is in contact with the support member 10. The translucent resin 40 transmits light emitted from a plurality of LED chips 20. The translucent resin 40 is made of, for example, a material containing an epoxy resin containing silicone. As shown in FIGS. 15 to 17, in the LED package A20, the translucent resin 40 includes a plurality of LED chips 20, a plurality of wires 30, and wiring 12 (a plurality of first pads 121, and a plurality of second pads). It covers the pad 122). Further, in the LED package A20, the translucent resin 40 is connected in a series and is in contact with the inner side surface 60D of the case 60.

Next, the action and effect of the LED package A20 will be described.

The LED package A20 includes a translucent member 70 having a plurality of lens portions 72 that individually distribute light emitted from each of the plurality of LED chips 20. The plurality of LED chips 20 include a first chip 201 and a second chip 202 having different wavelengths of emitted light. The plurality of lens units 72 include a first lens unit 721 that distributes light emitted from the first chip 201 and a second lens unit 722 that distributes light emitted from the second chip 202. The first lens unit 721 and the second lens unit 722 are located apart from each other. As shown in FIG. 18, the light distribution angle θ1 of the first lens unit 721 is different from the light distribution angle θ2 of the second lens unit 722. The light emitted from the first chip 201 passes through the translucent resin 40 and is then distributed by the first lens unit 721. At the same time, the light emitted from the second chip 202 is transmitted by the second lens unit 722 after passing through the translucent resin 40. Therefore, the LED package A20 also makes it possible to individually set the irradiation range for the object for a plurality of lights having different wavelengths individually emitted from the plurality of LED chips 20.

The LED package A20 further includes a translucent resin 40. The translucent resin 40 covers a plurality of LED chips 20. This makes it possible to improve the efficiency of extracting light emitted from each of the plurality of LED chips 20. Therefore, the luminous efficiency of the LED package A20 can be improved. Further, the translucent resin 40 can protect the plurality of LED chips 20.

[Third Embodiment]
Next, the LED package A30 according to the third embodiment of the present invention will be described with reference to FIGS. 19 to 22. In these figures, elements that are the same as or similar to the LED package A10 described above are designated by the same reference numerals, and redundant description will be omitted. Here, FIG. 19 transmits the light transmitting member 70 for convenience of understanding. In FIG. 19, each of the XX-XX line and the XXI-XXI line is shown by a alternate long and short dash line. The cross-sectional positions and ranges of FIG. 22 correspond to those of FIG.

In the LED package A30, the configuration of the translucent resin 40 is different from the configuration of the LED package A20 described above.

As shown in FIGS. 19 to 21, in the LED package A30, the translucent resin 40 includes a plurality of regions located apart from each other. The plurality of regions individually cover the plurality of LED chips 20. The plurality of regions are located apart from the inner surface 60D of the case 60. In the LED package A30, the translucent resin 40 includes a plurality of LED chips 20, a plurality of wires 30, and a part of the wiring 12 (a part of each of the plurality of first pads 121 and the plurality of second pads 122). ) And is covered.

Next, the action and effect of the LED package A30 will be described.

The LED package A30 includes a translucent member 70 having a plurality of lens portions 72 that individually distribute light emitted from each of the plurality of LED chips 20. The plurality of LED chips 20 include a first chip 201 and a second chip 202 having different wavelengths of emitted light. The plurality of lens units 72 include a first lens unit 721 that distributes light emitted from the first chip 201 and a second lens unit 722 that distributes light emitted from the second chip 202. The first lens unit 721 and the second lens unit 722 are located apart from each other. As shown in FIG. 22, the light distribution angle θ1 of the first lens unit 721 is different from the light distribution angle θ2 of the second lens unit 722. The light emitted from the first chip 201 passes through the region of the translucent resin 40 covering the first chip 201, and then is distributed by the first lens unit 721. At the same time, the light emitted from the second chip 202 is transmitted by the second lens unit 722 after passing through the region of the translucent resin 40 covering the second chip 202. Therefore, the LED package A30 also makes it possible to individually set the irradiation range for the object for a plurality of lights having different wavelengths individually emitted from the plurality of LED chips 20.

The LED package A20 further includes a translucent resin 40. The translucent resin 40 includes a plurality of regions located apart from each other. The plurality of regions individually cover the plurality of LED chips 20. This makes it possible to improve the efficiency of extracting light emitted from each of the plurality of LED chips 20. Therefore, the luminous efficiency of the LED package A20 can be improved. Further, unlike the case of the LED package A20, it is possible to prevent a part of the light emitted from the first chip 201 from reaching the second chip 202. Similarly, it is possible to prevent a part of the light emitted from the second chip 202 from reaching the first chip 201.

The wiring 12 according to the present invention is mainly composed of a plurality of metal layers formed by electrolytic plating. In addition to this, the wiring 12 may be formed from, for example, a lead frame.

The present invention is not limited to the embodiments described above. The specific configuration of each part of the present invention can be freely redesigned.

A10, A20, A30: LED package 10: Support member 11A: Main surface 11B: Bottom surface 11C: Side surface 11D: Penetration part 111: Upper layer 112: Lower layer 113: Intermediate layer 12: Wiring 121: First pad 122: Second pad 123 : 3rd pad 13: Terminal 14: Side terminal 15: Communication wiring 151: 1st wiring 152: 2nd wiring 16: Via 161: 1st via 162: 2nd via 17: Heat radiator 20: LED chip 201: 1st Chip 20A: 1st group 202: 2nd chip 20B: 2nd group 21: 1st electrode 22: 2nd electrode 29: Bonding layer 30: Wire 301: 1st wire 302: 2nd wire 40: Translucent resin 50: Resist layer 51: First resist layer 52: Second resist layer 60: Case 60A: Top surface 60B: Back surface 60C: Outer surface 60D: Inner surface 70: Translucent member 70A: Outer surface 70B: Inner surface 72: Lens portion 721: First 1 lens part 722: 2nd lens part θ1, θ2: light distribution angle z: thickness direction x: first direction y: second direction

Claims (15)

Support members with wiring and
A plurality of LED chips joined to the wiring and conductive to the wiring,
A case having a top surface and a back surface facing each other in the thickness direction of each of the plurality of LED chips, the back surface being supported by the support member, and surrounding the plurality of LED chips.
A translucent member that is supported on the top surface and closes the plurality of LED chips is provided.
The translucent member has a plurality of lens portions that individually distribute light emitted from each of the plurality of LED chips.
The plurality of LED chips include a first chip and a second chip in which the wavelengths of emitted light are different from each other.
The plurality of lens units include a first lens unit that distributes light emitted from the first chip and a second lens unit that distributes light emitted from the second chip.
The first lens portion and the second lens portion are located apart from each other.
An LED package characterized in that the light distribution angle of the first lens portion is different from the light distribution angle of the second lens portion. The LED package according to claim 1, wherein at least a part of the region surrounded by the support member, the case, and the translucent member is hollow. The translucent member has an outer surface that faces the same side as the top surface in the thickness direction, and an inner surface that faces the side opposite to the outer surface and faces the plurality of LED chips.
The LED package according to claim 2, wherein the plurality of lens portions are formed on the outer surface. The LED package according to claim 3, wherein each of the plurality of lens portions forms a Fresnel lens. The wavelength of the light emitted from the second chip is shorter than the wavelength of the light emitted from the first chip.
The LED package according to any one of claims 2 to 4, wherein the light distribution angle of the second lens portion is larger than the light distribution angle of the first lens portion. Further provided with a translucent resin in contact with the support member,
The LED package according to any one of claims 2 to 5, wherein the translucent resin covers the plurality of LED chips and at least a part of the wiring. The LED package according to claim 6, wherein the translucent resin is connected in a series and is in contact with the case. The translucent resin contains a plurality of regions located apart from each other.
The LED package according to claim 6, wherein the plurality of regions individually cover the plurality of LED chips. The first chip forms a first group arranged at predetermined intervals.
The first lens unit includes a plurality of regions that individually overlap with the first chip forming the first group when viewed along the thickness direction.
The second chip forms a second group arranged at predetermined intervals.
The LED according to any one of claims 2 to 8, wherein the second lens portion includes a plurality of regions that individually overlap with the second chip forming the second group when viewed along the thickness direction. package. The support member has a base material having a main surface facing the back surface, and the support member has a base material having a main surface facing the back surface.
The LED package according to any one of claims 2 to 9, wherein the wiring is arranged on the main surface. The base material has a bottom surface facing away from the main surface, a side surface connected to the main surface and the bottom surface and facing outward in a direction orthogonal to the thickness direction, and the base from the side surface. It has a plurality of penetrating portions that are recessed inward toward the material and are connected to the main surface and the bottom surface.
The support member has a plurality of terminals arranged on the bottom surface and a plurality of side surface terminals individually arranged with respect to the plurality of penetrating portions.
The LED package according to claim 10, wherein each of the plurality of side terminals is conductive to the wiring and is connected to any of the plurality of terminals. A first resist layer arranged on the main surface and having electrical insulation is further provided.
The LED package according to claim 11, wherein the first resist layer closes one end of each of the plurality of penetrating portions in the thickness direction. The LED package according to claim 12, wherein the first resist layer includes a region located between the support member and the case in the thickness direction. The support member has a radiator arranged on the bottom surface, and the support member has a radiator.
The LED package according to claim 12 or 13, wherein the plurality of LED chips are overlapped with the radiator when viewed along the thickness direction. A second resist layer arranged on the bottom surface and having electrical insulation is further provided.
The LED package according to claim 14, wherein the second resist layer is located between the plurality of terminals and the heat radiating body.

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