JP2021111643A - Method for manufacturing holding device - Google Patents

Abstract

To avoid generation of a gap in an adhesion part by suppressing a non-uniform thickness of the adhesion part.SOLUTION: A method for manufacturing a holding device comprises a first arranging step, a second arranging step, a first curing step, a cutting step, and a second curing step. The first arranging step arranges a first sheet-like adhesive on a second surface of a first plate-like member. The second arranging step arranges a second sheet-like adhesive on a third surface of a second plate-like member. The first curing step cures a second sheet-like adhesive after the second arranging step. In the first curing step, Shore hardness of the second sheet-like adhesive after curing is higher than Shore hardness of the first sheet-like adhesive, and less than 50. The cutting step cuts a surface of the second sheet-like adhesive after the first curing step. The second curing step forms an adhesion part by curing at least the first sheet-like adhesive with the second surface of the first plate-like member and the third surface of the second plate-like member bonded via the first sheet-like adhesive and the second sheet-like adhesive after the cutting step.SELECTED DRAWING: Figure 8

Description

The technology disclosed herein relates to a method of manufacturing a holding device for holding an object.

For example, an electrostatic chuck is used as a holding device for holding a wafer when manufacturing a semiconductor element. The electrostatic chuck includes, for example, a plate-shaped member formed of ceramics, a base member formed of metal, for example, an adhesive portion for adhering the plate-shaped member and the base member, and a chuck arranged inside the plate-shaped member. It is equipped with an electrode, and uses the electrostatic attraction generated by applying a voltage to the chuck electrode to attract and hold the wafer on the surface of the plate-shaped member (hereinafter referred to as the "adhesive surface"). ..

If the temperature of the wafer held on the suction surface of the electrostatic chuck does not reach the desired temperature, the accuracy of each process (deposition, etching, etc.) on the wafer may decrease. Therefore, the temperature of the wafer is applied to the electrostatic chuck. Performance to control the distribution is required. Therefore, for example, by cooling by supplying the refrigerant to the refrigerant flow path formed in the base member, the temperature distribution of the adsorption surface of the plate-shaped member is controlled (and by extension, the temperature distribution of the wafer held on the adsorption surface is controlled). Is done.

Local recesses may be present on the surface of the plate-shaped member or base member constituting the electrostatic chuck facing the adhesive portion (hereinafter, referred to as “adhesive surface”). Such a local concave portion is a place where the material constituting the adhesive portion is difficult to follow, unlike a local convex portion, a large concave portion, a continuous unevenness, and the like. Therefore, if there is a local recess on the adhesive surface of the plate-shaped member or the base member, when the adhesive portion for adhering the plate-shaped member and the base member is formed, the adhesive portion is formed due to the local recess. A gap (unbonded portion) may be generated, and the presence of the gap may cause non-uniform heat transfer between the plate-shaped member and the base member. If the heat transfer property between the plate-shaped member and the base member becomes non-uniform, the degree of cooling of the plate-shaped member at each position along the surface direction becomes non-uniform, and the controllability of the temperature distribution on the adsorption surface of the plate-shaped member becomes uncontrollable. There is a risk that the temperature distribution of the wafer held on the suction surface will be less controllable.

Conventionally, there has been known a technique for suppressing the formation of voids in the bonded portion by filling the voids with a paste-like adhesive when there are local recesses on the adhesive surface of the plate-shaped member or the base member. (See, for example, Patent Document 1). Further, when there is a local recess on the adhesive surface of the plate-shaped member or the base member, the adhesive portion is formed by using two sheet-like adhesives arranged on the adhesive surfaces of the plate-shaped member and the base member. There is known a technique for suppressing the formation of voids in the surface (see, for example, Patent Document 2).

JP-A-2017-112298 JP-A-2017-112299

However, in the technique described in Patent Document 1, since a paste-like adhesive is used, it is difficult to control the thickness of the bonded portion, and the plate-shaped member and the base member are caused by the non-uniform thickness of the bonded portion. It is not possible to suppress the non-uniformity of heat transfer between the two. Further, in the technique described in Patent Document 2, even if two sheet-shaped adhesives are used, each sheet-shaped adhesive cannot follow the local recesses on the adhesive surface, and there is still a gap (non-adhesive) in the adhesive portion. The part) is generated, and the heat transfer property between the plate-shaped member and the base member becomes non-uniform. As described above, the conventional method for manufacturing an electrostatic chuck has a problem that it is not possible to prevent the gap from being generated in the bonded portion while suppressing the thickness of the bonded portion from becoming uneven.

It should be noted that such a problem is not limited to the adhesive portion for adhering the plate-shaped member constituting the electrostatic chuck and the base member, but the first plate-shaped member and the second plate-shaped member constituting the holding member for holding the object. This is a common problem for the adhesive portion that adheres to the plate-shaped member.

This specification discloses a technique capable of solving the above-mentioned problems.

The techniques disclosed herein can be realized, for example, in the following forms.

(1) The method for manufacturing a holding device disclosed in the present specification includes a first plate-shaped member having a first surface and a second surface opposite to the first surface, and a first. It has a surface of 3 and a fourth surface opposite to the third surface so that the third surface is located on the second surface side of the first plate-like member. The first plate is arranged between the arranged second plate-shaped member and the second surface of the first plate-shaped member and the third surface of the second plate-shaped member. This is a method for manufacturing a holding device that includes an adhesive portion for adhering a shaped member and the second plate-shaped member, and holds an object. The method for manufacturing the holding device includes a first arrangement step of arranging the first sheet-like adhesive on the second surface of the first plate-shaped member, and the first arrangement step of the second plate-shaped member. A second arranging step of arranging the second sheet-like adhesive on the surface of No. 3 and a first curing step of curing the second sheet-like adhesive after the second arranging step. The first curing step and the first curing step in which the shore hardness of the second sheet-shaped adhesive after curing is higher than the shore hardness of the first sheet-shaped adhesive and less than 50. Later, a cutting step of cutting the surface of the second sheet-shaped adhesive, and after the cutting step, the second surface of the first plate-shaped member and the third of the second plate-shaped member. The bonded portion is formed by curing at least the first sheet-shaped adhesive in a state where the surface is bonded to the surface via the first sheet-shaped adhesive and the second sheet-shaped adhesive. A second curing step is provided.

As described above, in the method of manufacturing this holding device, it is easy to make the thickness of the adhesive portion for adhering the first plate-shaped member and the second plate-shaped member uniform as compared with the paste-like adhesive. Since it is formed by using the sheet-like adhesive (first sheet-like adhesive and second sheet-like adhesive), it is possible to prevent the thickness of the bonded portion from becoming uneven. Further, in the method for manufacturing the present holding device, the second sheet-like adhesive is arranged on the third surface of the second plate-like member, the second sheet-like adhesive is cured, and the second after curing is cured. The surface of the sheet adhesive is cut. Therefore, for example, due to the presence of local recesses on the third surface of the second plate-shaped member, the second sheet-like adhesion arranged on the third surface of the second plate-shaped member. Even when a local recess is formed on the surface of the agent, which is difficult for the material constituting the adhesive portion to follow, the local recess is removed by cutting the surface of the second sheet-like adhesive. It is possible to suppress the generation of voids in the bonded portion due to such local recesses. In the method for manufacturing this holding device, the shore hardness of the second sheet-shaped adhesive after curing is higher than the shore hardness of the first sheet-shaped adhesive, but it is less than 50, which is somewhat low. Therefore, for example, polishing. If the local recess is to be removed by processing, the second sheet-like adhesive may be peeled off, but since cutting processing is performed instead of polishing processing or the like, such a second sheet-like adhesive is performed. The local recesses can be removed while avoiding the occurrence of adhesive peeling. As described above, according to the method for manufacturing the holding device, the gaps in the adhesive portion are suppressed while suppressing the non-uniform thickness of the adhesive portion and suppressing the occurrence of peeling of the sheet-like adhesive. Can be avoided.

(2) In the method for manufacturing the holding device, the shore hardness of the second sheet-like adhesive after curing in the first curing step may be 30 or more. By doing so, since the hardness of the second sheet-like adhesive after curing is secured above a certain level, the surface of the second sheet-like adhesive can be cut more easily, and the second sheet-like adhesive can be cut. Local recesses on the surface of the sheet-like adhesive can be more reliably removed, and the generation of voids in the adhesive portion due to such local recesses can be effectively suppressed. ..

(3) In the method for manufacturing the holding device, the first sheet-shaped adhesive and the second sheet-shaped adhesive may be configured to contain a silicone resin. In this way, even if a sheet-like adhesive containing a relatively soft silicone resin is used for forming the adhesive portion, local recesses can be removed by cutting the surface of the second sheet-like adhesive. It is possible to prevent the formation of voids in the bonded portion.

(4) In the method for manufacturing the holding device, the holding device is further exposed to a chuck electrode arranged inside the first plate-shaped member and the third surface of the second plate-shaped member. It has a heater electrode formed by a resistance heating element and a fifth surface, so that the fifth surface is located on the fourth surface side of the second plate-shaped member. The second plate-shaped member is arranged between the base member having a refrigerant flow path formed therein and the fourth surface of the second plate-shaped member and the fifth surface of the base member. A device that includes a joint portion that joins a plate-shaped member and the base member, and holds the object on the first surface of the first plate-shaped member. Further, a first preparatory step for preparing a first structure including the first plate-shaped member and the chuck electrode, and a second structure including the second plate-shaped member and the heater electrode. A second preparation step for joining the second plate-shaped member and the base member constituting the second structure by the joint portion, and a refrigerant to the refrigerant flow path. Based on the measurement step of measuring the temperature distribution of the third surface of the second plate-shaped member and the measurement result of the temperature distribution, while supplying and supplying power to the heater electrode. The adjustment step of adjusting the calorific value of the heater electrode by grinding a part of the heater electrode exposed on the third surface of the plate-shaped member of the second plate-shaped member is provided, and the second arrangement step is the adjustment. The configuration may be executed after the process. In this way, after manufacturing the part of the holding device on the base member side from the heater electrode, the temperature distribution is measured under the same conditions as in actual use, and the heater electrode is measured based on the measurement result of the temperature distribution. Since the calorific value of the heater electrode can be adjusted with high accuracy, the controllability of the temperature distribution on the first surface of the first plate-shaped member is improved as a result. be able to. Further, in this way, there is a possibility that a local recess may be generated on the third surface of the second plate-shaped member due to the grinding of the heater electrode, so that the third surface of the second plate-shaped member may be formed. When the second sheet-like adhesive is placed on the surface of the second sheet-like adhesive, local recesses may be formed on the surface of the second sheet-like adhesive, but the second sheet-like adhesive is cured and the second sheet-like adhesive is cured. Since the surface of the sheet-like adhesive is cut, local recesses on the surface of the second sheet-like adhesive are removed, and as a result, voids (air gaps) in the adhesive portion due to the presence of the local recesses ( It is possible to avoid the occurrence of unbonded portions), and the presence of the voids causes heat transfer between both sides of the bonded portion (for example, a base cooled by supplying the refrigerant to the refrigerant flow path). It is possible to prevent the temperature distribution of the first surface of the first plate-shaped member from being lowered due to non-uniformity of heat attraction by the member).

(5) In the method for manufacturing the holding device, the second plate-shaped member has a substantially circular shape in a first directional view orthogonal to the third surface, and the holding device has a plurality of the heater electrodes. Each of the plurality of heater electrodes comprises at least one circular virtual dividing line concentric with the outer peripheral line of the second plate-shaped member in the first directional view of the second plate-shaped member. It may be configured so that it is arranged in each of the said segments when it is virtually divided into a plurality of segments. That is, each segment may be further not divided into a plurality of segments along the circumferential direction of the outer peripheral line of the second plate-shaped member. In such a configuration, the amount of heat generated in the heater electrodes arranged in each segment varies as compared with the configuration in which each segment is further divided into a plurality of segments along the circumferential direction of the outer peripheral line of the second plate-shaped member. Is difficult to correct by controlling the calorific value of the other heater electrodes, and the controllability of the temperature distribution on the first surface of the first plate-shaped member tends to decrease. According to the manufacturing method of the present holding device, even when such a segment form in which the controllability of the temperature distribution on the first surface of the first plate-shaped member tends to decrease is adopted, for example, of each heater electrode It is possible to correct the variation in the calorific value of each heater electrode due to the variation in shape, and it is possible to suppress a decrease in the controllability of the temperature distribution on the first surface of the first plate-shaped member.

The technique disclosed in the present specification can be realized in various forms, for example, a holding device, an electrostatic chuck, a method for manufacturing the same, and the like.

Perspective view schematically showing the appearance configuration of the electrostatic chuck 100 in this embodiment. Explanatory drawing schematically showing the XZ cross-sectional structure of the electrostatic chuck 100 in this embodiment. Explanatory drawing schematically showing the XY cross-sectional structure of the electrostatic chuck 100 in this embodiment. Explanatory drawing schematically showing the XY cross-sectional structure of the electrostatic chuck 100 in this embodiment. Flow chart showing the manufacturing method of the electrostatic chuck 100 in this embodiment Explanatory drawing which shows the outline of the manufacturing method of the electrostatic chuck 100 in this embodiment. Explanatory drawing which shows the outline of the manufacturing method of the electrostatic chuck 100 in this embodiment. Explanatory drawing which shows the outline of the manufacturing method of the electrostatic chuck 100 in this embodiment.

A. Embodiment:
A-1. Configuration of electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing an external configuration of the electrostatic chuck 100 in the present embodiment, and FIG. 2 is an explanatory view schematically showing an XZ cross-sectional configuration of the electrostatic chuck 100 in the present embodiment. 3 and 4 are explanatory views schematically showing the XY cross-sectional configuration of the electrostatic chuck 100 according to the present embodiment. FIG. 3 shows the XY cross-sectional configuration of the electrostatic chuck 100 at the position III-III of FIG. 2, and FIG. 4 shows the XY cross-sectional configuration of the electrostatic chuck 100 at the position IV-IV of FIG. It is shown. Each figure shows XYZ axes that are orthogonal to each other to identify the direction. In the present specification, for convenience, the Z-axis positive direction is referred to as an upward direction, and the Z-axis negative direction is referred to as a downward direction, but the electrostatic chuck 100 is actually installed in a direction different from such a direction. May be done. Further, in the present specification, the direction orthogonal to the Z-axis direction is referred to as a plane direction.

The electrostatic chuck 100 is a device that attracts and holds an object (for example, a wafer W) by electrostatic attraction, and is used, for example, for fixing a wafer W in a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 100 includes a ceramic member 10 and a base member 20 arranged side by side in a predetermined arrangement direction (in the present embodiment, the vertical direction (Z-axis direction)). The ceramic member 10 and the base member 20 are such that the lower surface S4 (see FIG. 2) of the ceramic member 10 and the upper surface S5 of the base member 20 face each other in the arrangement direction with the second adhesive portion 30 described later interposed therebetween. Be placed. That is, the base member 20 is arranged so that the upper surface S5 of the base member 20 is located on the lower surface S4 side of the ceramic member 10. The upper surface S5 of the base member 20 corresponds to the fifth surface in the claims.

The ceramic member 10 has a substantially circular planar upper surface (hereinafter, referred to as “adsorption surface”) S1 substantially orthogonal to the above-mentioned arrangement direction (Z-axis direction), and a lower surface S4 on the opposite side to the adsorption surface S1. It is a substantially disk-shaped member. In the present embodiment, the ceramic member 10 has a flange portion 109 projecting in the surface direction over the entire circumference of the outer circumference. Hereinafter, the portion of the ceramic member 10 excluding the flange portion 109 is referred to as a main body portion 108. The diameter of the main body 108 of the ceramic member 10 is, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the thickness of the ceramic member 10 is, for example, about 1 mm to 10 mm. The Z-axis direction corresponds to the first direction in the claims.

As shown in FIG. 2, in the present embodiment, the ceramic member 10 is composed of an upper ceramic portion 101, a lower ceramic portion 102, and a first adhesive portion 103. The upper ceramic portion 101 is a portion of the ceramic member 10 on the suction surface S1 side, and more specifically, a portion including the suction surface S1. That is, the upper surface of the upper ceramic portion 101 is the same as the upper surface (adsorption surface S1) of the ceramic member 10. The collar portion 109 is formed on the upper ceramic portion 101. The lower ceramic portion 102 is a portion of the ceramic member 10 on the lower surface S4 side, and more specifically, a portion including the lower surface S4. That is, the lower surface of the lower ceramic portion 102 is the same as the lower surface S4 of the ceramic member 10. The upper ceramic portion 101 and the lower ceramic portion 102 are arranged so that the lower surface S2 of the upper ceramic portion 101 and the upper surface S3 of the lower ceramic portion 102 face each other in the arrangement direction with the first adhesive portion 103 interposed therebetween. Will be done. That is, the lower ceramic portion 102 is arranged so that the upper surface S3 of the lower ceramic portion 102 is located on the lower surface S2 side of the upper ceramic portion 101. The upper ceramic portion 101 and the lower ceramic portion 102 are formed of ceramics (for example, alumina, aluminum nitride, etc.). As will be described later, the upper ceramic portion 101 and the lower ceramic portion 102 are fired bodies formed by firing. The upper ceramic portion 101 corresponds to the first plate-shaped member in the claims, the lower ceramic portion 102 corresponds to the second plate-shaped member in the claims, and the upper surface of the upper ceramic portion 101 ( That is, the suction surface S1) corresponds to the first surface in the claims, the lower surface S2 of the upper ceramic portion 101 corresponds to the second surface in the claims, and the upper surface of the lower ceramic portion 102. S3 corresponds to the third surface in the claims, and the lower surface S4 of the lower ceramic portion 102 corresponds to the fourth surface in the claims.

Further, the first adhesive portion 103 of the ceramic member 10 is arranged between the lower surface S2 of the upper ceramic portion 101 and the upper surface S3 of the lower ceramic portion 102, and adheres the upper ceramic portion 101 and the lower ceramic portion 102. do. The first adhesive portion 103 is made of an adhesive material such as a silicone resin, an acrylic resin, or an epoxy resin. The first adhesive portion 103 preferably contains a silicone resin. The first adhesive portion 103 may contain a filler such as ceramic powder. The thickness of the first adhesive portion 103 is, for example, about 0.1 mm to 1 mm. The first adhesive portion 103 corresponds to the adhesive portion within the scope of the claims. The ceramic member 10 includes a first adhesive portion 103 containing a resin adhesive, but since most of the ceramic member 10 is made of ceramics, the "ceramic" member 10 is used in the present specification for convenience. It shall be called.

As shown in FIG. 2, a chuck electrode 40 formed of a conductive material (for example, tungsten, molybdenum, platinum, etc.) is arranged inside the ceramic member 10. The shape of the chuck electrode 40 in the Z-axis direction is, for example, substantially circular. When a voltage is applied to the chuck electrode 40 from a power source (not shown), an electrostatic attraction is generated, and the wafer W is attracted and fixed to the suction surface S1 of the ceramic member 10 by this electrostatic attraction. In the present embodiment, the chuck electrode 40 is arranged inside the upper ceramic portion 101 constituting the ceramic member 10.

Further, inside the ceramic member 10, a plurality of heater electrodes 50 for controlling the temperature distribution of the suction surface S1 of the ceramic member 10 (that is, controlling the temperature distribution of the wafer W held on the suction surface S1) are provided. A configuration (driver electrode 60, etc.) for supplying power to each heater electrode 50 is arranged. These configurations will be described in detail later.

The base member 20 is, for example, a circular flat plate-shaped member having the same diameter as the main body 108 of the ceramic member 10 or a larger diameter than the main body 108 of the ceramic member 10, and is made of, for example, a metal (aluminum, aluminum alloy, etc.). It is formed. The diameter of the base member 20 is, for example, about 220 mm to 550 mm (usually 220 mm to 350 mm), and the thickness of the base member 20 is, for example, about 20 mm to 40 mm.

The base member 20 is joined to the ceramic member 10 by a second adhesive portion 30 arranged between the lower surface S4 of the ceramic member 10 and the upper surface S5 of the base member 20. The second adhesive portion 30 is made of an adhesive material such as a silicone resin, an acrylic resin, or an epoxy resin. The second adhesive portion 30 preferably contains a silicone resin. The second adhesive portion 30 may contain a filler such as ceramic powder. The thickness of the second adhesive portion 30 is, for example, about 0.1 mm to 1 mm. The second adhesive portion 30 corresponds to a joint portion within the scope of claims.

A refrigerant flow path 21 is formed inside the base member 20. When a refrigerant (for example, a fluorine-based inert liquid, water, etc.) is flowed through the refrigerant flow path 21, the base member 20 is cooled, and the base member 20 is placed between the base member 20 and the ceramic member 10 via the second adhesive portion 30. The ceramic member 10 is cooled by heat transfer (heat transfer), and the wafer W held on the suction surface S1 of the ceramic member 10 is cooled. As a result, the temperature distribution of the wafer W can be controlled.

Further, the electrostatic chuck 100 includes a substantially annular O-ring 90 formed so as to surround the outer periphery of the laminated body of the first adhesive portion 103, the lower ceramic portion 102, and the second adhesive portion 30. The O-ring 90 is formed of an insulator such as rubber. The O-ring 90 is in close contact with the lower surface of the flange portion 109 formed on the upper ceramic portion 101 and the upper surface S5 of the base member 20, and the second adhesive portion 30 and the first adhesive portion 103 are exposed to plasma or the like. Prevents deterioration due to being damaged.

A-2. Configuration of heater electrode 50, etc .:
Next, the configuration for supplying power to the heater electrode 50 and the heater electrode 50 will be described in detail. As described above, the electrostatic chuck 100 includes a plurality of heater electrodes 50 (more specifically, three heater electrodes 50A, 50B, 50C) (see FIG. 3). In the present embodiment, the plurality of heater electrodes 50 are arranged on the upper surface S3 of the lower ceramic portion 102 constituting the ceramic member 10. That is, the plurality of heater electrodes 50 are arranged at positions separated from the suction surface S1 from the chuck electrode 40. Actually, the first adhesive portion 103 is located on the upper surface S3 of the lower ceramic portion 102, and the plurality of heater electrodes 50 are covered with the first adhesive portion 103.

As shown in FIG. 3, in the electrostatic chuck 100 of the present embodiment, the lower ceramic portion 102 is virtually divided into three segments Z (Za, Zb, Zc) arranged in the plane direction. More specifically, the lower ceramic portion 102 is divided into three segments Z by two circular virtual dividing lines VL (VL1, VL2) concentric with the outer peripheral line of the lower ceramic portion 102 in the Z-axis direction. It is virtually divided. The shape of each segment Z in the Z-axis direction is substantially circular or substantially annular.

Each of the plurality of heater electrodes 50 is arranged in one of the plurality of segments Z set in the lower ceramic portion 102. Specifically, of the three heater electrodes 50, one heater electrode 50A is arranged in the segment Za located on the outermost side of the three segments Z, and the other heater electrode 50C is It is arranged in the segment Zc located on the side closest to the center of the three segments Z, and the remaining one heater electrode 50B is arranged in the segment Zb sandwiched between the segment Za and the segment Zc.

Each heater electrode 50 has a heater line portion 51 which is a linear resistance heating element in the Z-axis direction, and a heater pad portion 52 connected to both ends of the heater line portion 51. The heater line portion 51 and the heater pad portion 52 constituting the heater electrode 50 are made of a conductive material (for example, tungsten, molybdenum, platinum, etc.). In the present embodiment, the shape of the heater line portion 51 in the Z-axis direction is substantially circular or substantially spiral.

Further, the electrostatic chuck 100 has a configuration for supplying power to each heater electrode 50. Specifically, the electrostatic chuck 100 includes a plurality of driver electrodes 60 (more specifically, six driver electrodes 60) (see FIG. 4). Each driver electrode 60 has a conductor pattern having a predetermined shape parallel to the plane direction, and is made of a conductive material (for example, tungsten, molybdenum, platinum, etc.). In the present embodiment, the plurality of driver electrodes 60 are arranged inside the lower ceramic portion 102 constituting the ceramic member 10. Further, the plurality of driver electrodes 60 are arranged at the same positions as each other in the Z-axis direction. The driver electrode 60 is different from the heater electrode 50 in that it satisfies at least one of the following (1) and (2).
(1) The cross-sectional area of the driver electrode 60 in the direction perpendicular to the direction in which the current flows is five times or more the similar cross-sectional area of the heater electrode 50.
(2) The resistance between one via connected to the driver electrode 60 and the other via in the heater electrode 50 is the resistance between the via connected to the heater electrode 50 and the via connected to the feeding terminal 74 in the driver electrode 60. It is more than 5 times.

As shown in FIG. 4, in the present embodiment, the six driver electrodes 60 included in the electrostatic chuck 100 form three driver electrode pairs 600 (600A, 600B, 600C) each composed of a pair of driver electrodes 60. is doing. The three driver electrode pairs 600 correspond to the three heater electrodes 50 (50A, 50B, 50C). As shown in FIGS. 2 to 4, one of the pair of driver electrodes 60 constituting one driver electrode pair 600 (for example, driver electrode pair 600A) is interposed via a heater side via 71 formed of a conductive material. , Is electrically connected to one of the heater pad portions 52 of the corresponding heater electrode 50 (for example, the heater electrode 50A). Further, the other of the pair of driver electrodes 60 constituting the driver electrode pair 600 (for example, driver electrode pair 600A) is the other of the corresponding heater electrodes 50 (for example, heater electrode 50A) via the heater side via 71. It is electrically connected to the heater pad portion 52.

Further, as shown in FIG. 2, the electrostatic chuck 100 is formed with a plurality of terminal holes 110 extending from the lower surface S6 of the base member 20 to the inside of the ceramic member 10. Each terminal hole 110 has a through hole 22 that penetrates the base member 20 in the vertical direction, a through hole 32 that penetrates the second adhesive portion 30 in the vertical direction, and a recess formed on the lower surface S4 side of the ceramic member 10. 13 is an integral hole formed by communicating with each other.

Each terminal hole 110 accommodates a power supply terminal 74, which is a substantially columnar member formed of a conductive material. Further, a feeding electrode (electrode pad) 73 formed of a conductive material is arranged on the bottom surface of the recess 13 of the ceramic member 10 constituting each terminal hole 110. The upper end portion of the power feeding terminal 74 is joined to the power feeding electrode 73 by, for example, brazing.

Further, as shown in FIGS. 2 and 4, one of the pair of driver electrodes 60 constituting each driver electrode pair 600 is interposed via a feeding side via 72 extending from the driver electrode 60 to the lower surface S2 side of the ceramic member 10. It is electrically connected to one feeding electrode 73, and the other of the pair of driver electrodes 60 is electrically connected to the other feeding electrode 73 via the other feeding side via 72. ..

Each power supply terminal 74 is connected to a power source (not shown). The voltage from the power source is applied to each heater electrode 50 via the power supply terminal 74, the power supply electrode 73, the power supply side via 72, the driver electrode 60, and the heater side via 71. When a voltage is applied to each heater electrode 50, each heater electrode 50 generates heat to heat the ceramic member 10, thereby controlling the temperature distribution of the suction surface S1 of the ceramic member 10 (that is, holding the temperature distribution on the suction surface S1). Control of the temperature distribution of the wafer W) is realized.

In the electrostatic chuck 100 of the present embodiment, power is supplied to each heater electrode 50 and refrigerant is supplied to the refrigerant flow path 21, and the difference between the temperature of the heater electrode 50 and the temperature of the refrigerant is 50 ° C. or more. Occasionally, the difference between the maximum value and the minimum value of the temperature on the suction surface S1 of the ceramic member 10 is 3.5 ° C. or less. That is, the temperature difference at each position of the suction surface S1 of the ceramic member 10 is extremely small. Such a configuration can be realized, for example, by manufacturing the electrostatic chuck 100 according to the manufacturing method of the electrostatic chuck 100 of the present embodiment described below. The temperature at each position of the heater electrode and the suction surface S1 can be measured by using a temperature measuring device such as an IR camera.

A-3. Manufacturing method of electrostatic chuck 100:
Next, a method of manufacturing the electrostatic chuck 100 in this embodiment will be described. FIG. 5 is a flowchart showing a method of manufacturing the electrostatic chuck 100 according to the present embodiment. 6 to 8 are explanatory views showing an outline of a method for manufacturing the electrostatic chuck 100 according to the present embodiment.

First, an upper ceramic structure 11 including an upper ceramic portion 101a and a chuck electrode 40 arranged inside the upper ceramic portion 101a is manufactured (see S110, column A in FIG. 6). Here, the upper ceramic portion 101a is a structure that becomes the upper ceramic portion 101 in the electrostatic chuck 100 after the production is completed. The upper ceramic portion 101a may be completely the same as the upper ceramic portion 101, or may become the upper ceramic portion 101 as a result of various processing on the upper ceramic portion 101a. The step of S110 corresponds to the first preparatory step in the claims, and the upper ceramic structure 11 corresponds to the first structure.

The method for manufacturing the upper ceramic structure 11 is as follows, for example. First, a plurality of ceramic green sheets are produced, and a predetermined processing is performed on a predetermined ceramic green sheet. Predetermined processing includes, for example, printing of a metallized paste for forming the chuck electrode 40 and the like, drilling for forming various vias, filling of the metallized paste, and the like. A laminated body of ceramic green sheets is produced by laminating these ceramic green sheets, thermocompression bonding, and processing such as cutting. The upper ceramic structure 11 is obtained by firing the laminated body of the produced ceramic green sheet. If necessary, the upper ceramic structure 11 may be warped or the surface may be polished.

Further, a lower ceramic structure 12 including a lower ceramic portion 102a and a heater electrode 50 arranged so as to be exposed on the upper surface S3 of the lower ceramic portion 102a is manufactured (see S120, column B of FIG. 6). ). Here, the lower ceramic portion 102a is a structure that becomes the lower ceramic portion 102 in the electrostatic chuck 100 after the production is completed. The lower ceramic portion 102a may be completely the same as the lower ceramic portion 102, or may become the lower ceramic portion 102 as a result of various processing on the lower ceramic portion 102a. In the present embodiment, the lower ceramic structure 12 further includes a driver electrode 60, a feeding electrode 73, and various vias 71 and 72. The step of S120 corresponds to the second preparatory step in the claims, and the lower ceramic structure 12 corresponds to the second structure.

The method for producing the lower ceramic structure 12 is as follows, for example. First, a plurality of ceramic green sheets are produced, and a predetermined processing is performed on a predetermined ceramic green sheet. Predetermined processing includes, for example, printing of a metallized paste for forming a heater electrode 50, a driver electrode 60, a feeding electrode 73, etc., drilling for forming various vias, filling of a metallized paste, and the like. A laminated body of ceramic green sheets is produced by laminating these ceramic green sheets, thermocompression bonding, and processing such as cutting. The lower ceramic structure 12 is obtained by firing the laminated body of the produced ceramic green sheet. If necessary, the lower ceramic structure 12 may be warped or the surface (excluding the upper surface S3 where the heater electrode 50 is exposed) may be polished.

Next, the feeding terminal 74 is joined to the feeding electrode 73 formed in the lower ceramic structure 12 by, for example, brazing (see S130, column C in FIG. 6). Before joining the feeding terminal 74 to the feeding electrode 73, the surface of the feeding electrode 73 may be plated (for example, nickel-plated).

Next, the lower ceramic portion 102a constituting the lower ceramic structure 12 and the base member 20 are joined by the second adhesive portion 30 (see S140, column C in FIG. 6). More specifically, for example, a sheet-like adhesive is attached to each of the lower surface S4 of the lower ceramic portion 102a and the upper surface S5 of the base member 20, and the lower surface S4 of the lower ceramic portion 102a and the upper surface S5 of the base member 20 are attached. The second adhesive portion 30 is formed by performing a curing treatment for curing the two sheet-shaped adhesives in a state where the two sheets are bonded together via the two sheet-shaped adhesives. In the sheet-like adhesive, a powder component (for example, alumina, silica, silicon carbide, silicon nitride, etc.) is mixed with the adhesive component (for example, silicone resin, acrylic resin, epoxy resin, etc.) as necessary. The prepared paste is applied in the form of a film on, for example, a release sheet, and then semi-cured by a curing treatment to form a gel. The paste may contain additives such as a coupling agent. Since the sheet-like adhesive has a relatively high viscosity, it is easy to make the thickness uniform. The contents of the curing treatment for forming the sheet-shaped adhesive and the curing treatment for forming the second adhesive portion 30 differ depending on the type of the adhesive used, and are thermosetting type adhesives. If it is an agent, a treatment of applying heat is performed as a curing treatment, and if it is a moisture-curable adhesive, a treatment of applying water is performed as a curing treatment. Further, when the curing process for forming the second adhesive portion 30 is performed in a closed container in a vacuum state, air bubbles are less likely to be generated in the second adhesive portion 30 to be formed, which is preferable. The step of S140 corresponds to the joining step in the claims.

Next, while supplying the refrigerant to the refrigerant flow path 21 of the base member 20 and supplying power to each heater electrode 50 arranged so as to be exposed on the upper surface S3 of the lower ceramic portion 102a, the lower ceramic portion The temperature distribution of the upper surface S3 of 102a is measured (S150). The temperature distribution is measured, for example, by measuring the temperatures of a plurality of measurement points on the upper surface S3 of the lower ceramic portion 102a. The step of S150 corresponds to the measuring step in the claims.

Next, based on the measurement result of the temperature distribution of S150, the calorific value of the heater electrode 50 is adjusted by grinding a part of the heater electrode 50 arranged so as to be exposed on the upper surface S3 of the lower ceramic portion 102a ( S160, see column A in FIG. 7). When a part of the heater electrode 50 is ground, the cross-sectional area of the part of the heater electrode 50 becomes smaller, so that the electric resistance becomes larger and the amount of heat generated by the part of the heater electrode 50 increases. Therefore, for example, the temperature of the portion of the heater electrode 50 that was relatively low in the measurement result of the temperature distribution of S150 can be corrected to the high temperature side by grinding. The step of S160 corresponds to the adjustment step in the claims.

The heater electrode 50 is ground by, for example, arranging the mask MA in a portion other than the portion to be ground and projecting the blast material BM toward the upper surface S3 of the lower ceramic portion 102a by the shot blasting device BD. Be struck. By making the number of shot blasts performed on each part of the heater electrode 50 different, the amount of grinding of each part of the heater electrode 50 can be made different. Further, the grinding of the heater electrode 50 can also be realized by, for example, polishing with a machining device. Further, after adjusting the calorific value of the heater electrode 50 by grinding the heater electrode 50, the temperature distribution of the upper surface S3 of the lower ceramic portion 102a is measured again in the same manner as in the step of S150, and the calorific value of the heater electrode 50 is measured again. The adjustment result of the above may be confirmed, and it may be determined whether or not the heater electrode 50 needs to be ground again. Further, the presence or absence of adjustment of the calorific value of the heater electrode 50 can be confirmed by, for example, the presence or absence of a change in the resistance value of the heater electrode 50 or the presence or absence of a change in the image by the IR camera.

As shown in column A of FIG. 7, when the heater electrode 50 is ground, the portion around the heater electrode 50 on the upper surface S3 of the lower ceramic portion 102a is also ground, and as a result, the lower ceramic portion is ground. A local recess (for example, a recess having a diameter of 30 mm or less and a depth of 10 μm or more) may be formed on the upper surface S3 of the portion 102a.

Next, a sheet-like adhesive (hereinafter referred to as “upper sheet-like adhesive 81”) is placed on the lower surface S2 of the upper ceramic portion 101a constituting the upper ceramic structure 11 (see S170, column B in FIG. 7). ). The shore hardness of the upper sheet-like adhesive 81 to be arranged is, for example, less than 20. The step of S170 corresponds to the first arrangement step in the claims, and the upper sheet-like adhesive 81 corresponds to the first sheet-like adhesive in the claims.

Further, a sheet-like adhesive (hereinafter referred to as "lower sheet-like adhesive 82") is arranged on the upper surface S3 of the lower ceramic portion 102a constituting the lower ceramic structure 12 (S180, C in FIG. 7). See column). The shore hardness of the lower sheet-like adhesive 82 to be arranged is, for example, less than 20. The step of S180 corresponds to the second arrangement step in the claims, and the lower sheet-like adhesive 82 corresponds to the second sheet-like adhesive in the claims. As described above, when the local recess is formed on the upper surface S3 of the lower ceramic portion 102a, when the lower sheet-like adhesive 82 is arranged on the upper surface S3 of the lower ceramic portion 102a, the lower sheet is formed. Local recesses may also be formed on the upper surface S7 of the adhesive 82.

After the step (S180) of arranging the lower sheet-shaped adhesive 82 on the upper surface S3 of the lower ceramic portion 102a, the lower sheet-shaped adhesive 82 is cured (S190). The content of the treatment for curing the lower sheet-shaped adhesive 82 differs depending on the type of adhesive used, and if it is a thermosetting adhesive, a treatment for applying heat as a curing treatment is performed, and a moisture curing type is used. If it is an adhesive of, a treatment of adding water is performed as a curing treatment. The curing treatment of S190 is carried out so that the shore hardness of the lower sheet-shaped adhesive 82 after curing is higher than the shore hardness of the upper sheet-shaped adhesive 81 and is less than 50. The shore hardness of the lower sheet-like adhesive 82 after curing is preferably 30 or more. The curing treatment of the lower sheet-like adhesive 82 is performed, for example, under atmospheric pressure. The step of S190 corresponds to the first curing step in the claims.

After the step of curing the lower sheet-shaped adhesive 82 (S190), the upper surface S7 of the lower sheet-shaped adhesive 82 is cut (S200, see column A in FIG. 8). For cutting the upper surface S7 of the lower sheet-shaped adhesive 82, for example, a cutting tool TO such as a cutting tool is moved relative to the upper surface S7 of the lower sheet-shaped adhesive 82 in the surface direction, and the cutting tool TO lowers the cutting tool TO. This is done by cutting off the upper surface S7 of the side sheet-shaped adhesive 82. As described above, the lower sheet-like adhesive 82 has been subjected to a hardening treatment after being placed on the upper surface S3 of the lower ceramic portion 102a, and has a hardness of a certain level or higher. Therefore, such a cutting process is performed. Can be done. As described above, the upper surface S7 of the lower sheet-like adhesive 82 may have a local recess due to the local recess of the upper surface S3 of the lower ceramic portion 102a, but the lower sheet may be formed. By cutting the upper surface S7 of the adhesive 82, such local recesses are removed. When the upper surface S7 of the lower sheet-like adhesive 82 is cut, a groove-shaped mark may remain on the upper surface S7 along the moving path of the cutting tool TO. It is much shallower than the local recesses in question in the specification and is regularly formed over the entire upper surface S7, causing voids (unbonded portions) in the first bonded portion 103. It's not a thing. The process of S200 corresponds to the cutting process within the claims.

After the step (S200) of cutting the upper surface S7 of the lower sheet-like adhesive 82, the lower surface S2 of the upper ceramic portion 101a and the upper surface S3 of the lower ceramic portion 102a are combined with two sheet-like adhesives (upper sheet-like). The first adhesive portion 103 is formed by performing a curing treatment in a state of being bonded via the adhesive 81 and the lower sheet-like adhesive 82) (see S210, column B in FIG. 8). In the curing treatment for forming the first adhesive portion 103, at least the upper sheet-shaped adhesive 81 is cured, but the lower sheet-shaped adhesive 82 is further cured depending on the state before the curing treatment. Sometimes it doesn't cure much. The content of the curing process for forming the first adhesive portion 103 differs depending on the type of adhesive used, and if it is a thermosetting adhesive, a process of applying heat as a curing process is performed, and moisture is added. If it is a curable adhesive, a treatment of adding water is performed as a curing treatment. Further, when the curing process for forming the first adhesive portion 103 is performed in a closed container in a vacuum state, air bubbles are less likely to be generated in the first adhesive portion 103 to be formed, which is preferable. The step of S210 corresponds to the second curing step in the claims.

Next, the O-ring 90 is attached so as to surround the outer periphery of the laminate of the first adhesive portion 103, the lower ceramic portion 102a, and the second adhesive portion 30 (see S220, column B in FIG. 8). Mainly by the above steps, the electrostatic chuck 100 having the above-described configuration is manufactured.

A-4. Effect of this embodiment:
As described above, the electrostatic chuck 100 of the present embodiment includes an upper ceramic portion 101, a lower ceramic portion 102, and a first adhesive portion 103. The upper ceramic portion 101 is a plate-shaped member having a suction surface S1 and a lower surface S2 on the opposite side of the suction surface S1. The lower ceramic portion 102 is a plate-shaped member having an upper surface S3 and a lower surface S4 on the opposite side of the upper surface S3, and the upper surface S3 is arranged so as to be located on the lower surface S2 side of the upper ceramic portion 101. .. The first adhesive portion 103 is arranged between the lower surface S2 of the upper ceramic portion 101 and the upper surface S3 of the lower ceramic portion 102, and adheres the upper ceramic portion 101 and the lower ceramic portion 102.

Further, the method of manufacturing the electrostatic chuck 100 of the present embodiment includes a step (S170) of arranging the upper sheet-like adhesive 81 on the lower surface S2 of the upper ceramic portion 101a and a lower sheet on the upper surface S3 of the lower ceramic portion 102a. After the step of arranging the state adhesive 82 (S180) and the step of arranging the lower sheet-like adhesive 82 (S180), the step of curing the lower sheet-like adhesive 82 (S190) is provided. In the step (S190) of curing the lower sheet-shaped adhesive 82, the shore hardness of the lower sheet-shaped adhesive 82 after curing is higher than the shore hardness of the upper sheet-shaped adhesive 81 and less than 50. It is done like this. Further, the method for manufacturing the electrostatic chuck 100 of the present embodiment includes a step of curing the lower sheet-shaped adhesive 82 (S190) and then a step of cutting the upper surface S7 of the lower sheet-shaped adhesive 82 (S200). After that, the lower surface S2 of the upper ceramic portion 101a and the upper surface S3 of the lower ceramic portion 102a are bonded to each other via the upper sheet-like adhesive 81 and the lower sheet-like adhesive 82, and at least in the form of an upper sheet. A step (S210) of forming the first adhesive portion 103 by curing the adhesive 81 is provided.

As described above, in the method for manufacturing the electrostatic chuck 100 of the present embodiment, the thickness of the first adhesive portion 103 for adhering the upper ceramic portion 101a and the lower ceramic portion 102a is increased as compared with the paste-like adhesive. Since it is formed by using a sheet-like adhesive (upper sheet-like adhesive 81 and lower sheet-like adhesive 82) that can be easily made uniform, the thickness of the first adhesive portion 103 becomes non-uniform. The heat transfer property between the upper ceramic portion 101a and the lower ceramic portion 102a becomes non-uniform due to the non-uniform thickness of the first adhesive portion 103, and the suction surface of the ceramic member 10 becomes non-uniform. It is possible to suppress a decrease in the controllability of the temperature distribution of S1. Further, in the method for manufacturing the electrostatic chuck 100 of the present embodiment, the lower sheet-like adhesive 82 is arranged on the upper surface S3 of the lower ceramic portion 102a (S180), and the lower sheet-like adhesive 82 is cured (S190). ), After that, the upper surface S7 of the lower sheet-like adhesive 82 is cut (S200). Therefore, due to the presence of a local recess on the upper surface S3 of the lower ceramic portion 102a, it is localized on the upper surface S7 of the lower sheet-like adhesive 82 arranged on the upper surface S3 of the lower ceramic portion 102a. Even if there are recesses, the local recesses are removed by cutting the upper surface S7 of the lower sheet-like adhesive 82. When a local recess is present on the upper surface S7 of the lower sheet-like adhesive 82, the lower sheet-like adhesive 82 and the upper sheet-like adhesive 81 are subsequently bonded together to form the first adhesive portion 103. When formed, there is a possibility that a gap (unbonded portion) may be generated in the first bonded portion 103 due to the presence of the local recess. Since the method for manufacturing the electrostatic chuck 100 of the present embodiment includes a step (S200) of cutting the upper surface S7 of the lower sheet-like adhesive 82, the upper surface S7 of the lower sheet-like adhesive 82 is locally localized. It is possible to suppress the generation of voids in the first adhesive portion 103 due to the concave recesses, and the presence of the voids causes heat transferability between the upper ceramic portion 101a and the lower ceramic portion 102a. It becomes non-uniform, and it is possible to suppress deterioration of the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10. In the method for manufacturing the electrostatic chuck 100 of the present embodiment, the shore hardness of the lower sheet-shaped adhesive 82 after the curing step (S190) is higher than the shore hardness of the upper sheet-shaped adhesive 81, but it is 50. Since it is less than or equal to a certain degree, for example, when trying to remove the local recess by polishing, peeling of the lower sheet-like adhesive 82 may occur. However, in the method for manufacturing the electrostatic chuck 100 of the present embodiment, the upper surface S7 of the lower sheet-shaped adhesive 82 is not polished but cut, so that such a lower sheet-shaped adhesive is used. The local recess can be removed while avoiding the occurrence of peeling of 82. As described above, according to the method for manufacturing the electrostatic chuck 100 of the present embodiment, while suppressing the thickness of the first adhesive portion 103 from becoming non-uniform, the lower sheet-like adhesive 82 While suppressing the occurrence of peeling, it is possible to avoid the generation of voids in the first adhesive portion 103, and by extension, it is possible to suppress the deterioration of the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10. Can be done.

In the method for manufacturing the electrostatic chuck 100 of the present embodiment, the shore hardness of the lower sheet-like adhesive 82 after the curing step (S190) is preferably 30 or more. By doing so, since the hardness of the lower sheet-shaped adhesive 82 after curing is secured to a certain level or more, cutting (S200) of the upper surface S7 of the lower sheet-shaped adhesive 82 can be performed more easily. ..

Further, in the method for manufacturing the electrostatic chuck 100 of the present embodiment, it is preferable that both the upper sheet-shaped adhesive 81 and the lower sheet-shaped adhesive 82 contain a silicone resin. In this way, even if a sheet-like adhesive containing a relatively soft silicone resin is used for forming the first adhesive portion 103, the upper surface S7 of the lower sheet-like adhesive 82 is locally cut. It is possible to realize the removal of the recesses, and it is possible to avoid the generation of voids in the first adhesive portion 103.

Further, the electrostatic chuck 100 of the present embodiment further includes a chuck electrode 40, a heater electrode 50, a base member 20, and a second adhesive portion 30. The chuck electrode 40 is arranged inside the upper ceramic portion 101. The heater electrode 50 is arranged so as to be exposed on the upper surface S3 of the lower ceramic portion 102, and is formed by a resistance heating element. The base member 20 has an upper surface S5, is arranged so that the upper surface S5 is located on the lower surface S4 side of the lower ceramic portion 102, and a refrigerant flow path 21 is formed inside. The second adhesive portion 30 is arranged between the lower surface S4 of the lower ceramic portion 102 and the upper surface S5 of the base member 20 to join the lower ceramic portion 102 and the base member 20. Further, the method for manufacturing the electrostatic chuck 100 of the present embodiment further includes a step (S110) of preparing the upper ceramic structure 11 including the upper ceramic portion 101a and the chuck electrode 40, and the lower ceramic portion 102a and the heater electrode. A step of preparing the lower ceramic structure 12 including the 50 (S120) and a step of joining the lower ceramic portion 102a constituting the lower ceramic structure 12 and the base member 20 by the second bonding portion 30. (S140), a step (S150) of measuring the temperature distribution of the upper surface S3 of the lower ceramic portion 102a while supplying the refrigerant to the refrigerant flow path 21 and supplying power to the heater electrode 50, and measuring the temperature distribution. Based on the result, a step (S160) of adjusting the calorific value of the heater electrode 50 by grinding a part of the heater electrode 50 exposed on the upper surface S3 of the lower ceramic portion 102a is provided. Then, the step (S180) of arranging the lower sheet-like adhesive 82 on the upper surface S3 of the lower ceramic portion 102a described above is executed after the step (S160) of adjusting the calorific value of the heater electrode 50.

As described above, in the method for manufacturing the electrostatic chuck 100 of the present embodiment, the lower ceramics including the lower ceramic portion 102a and the heater electrode 50 arranged so as to be exposed on the upper surface S3 of the lower ceramic portion 102a. With the base member 20 joined to the structure 12, the temperature distribution of the upper surface S3 of the lower ceramic portion 102a is measured while supplying the refrigerant to the refrigerant flow path 21 and supplying power to the heater electrode 50. NS. Further, in the method for manufacturing the electrostatic chuck 100 of the present embodiment, the calorific value of the heater electrode 50 is generated by grinding a part of the heater electrode 50 exposed on the upper surface S3 of the lower ceramic portion 102a based on the measurement result of the temperature distribution. Is adjusted, the upper ceramic structure 11 including the upper ceramic portion 101a and the chuck electrode 40 arranged inside the upper ceramic portion 101a is adhered to the upper surface S3 side of the lower ceramic portion 102a. That is, in the method of manufacturing the electrostatic chuck 100 of the present embodiment, after the portion of the electrostatic chuck 100 on the base member 20 side of the heater electrode 50 is manufactured, the temperature distribution is measured under the same conditions as in actual use. The calorific value of the heater electrode 50 can be adjusted based on the measurement result of the temperature distribution. Therefore, in the method for manufacturing the electrostatic chuck 100 of the present embodiment, the calorific value of the heater electrode 50 can be adjusted with high accuracy, and as a result, the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 is improved. be able to. Further, in the method of manufacturing the electrostatic chuck 100 of the present embodiment, since there is a possibility that a local recess may be generated in the upper surface S3 of the lower ceramic portion 102a due to the grinding of the heater electrode 50, the lower ceramic portion 102a may be formed. When the lower sheet-like adhesive 82 is arranged on the upper surface S3, a local recess may be generated on the upper surface S7 of the lower sheet-like adhesive 82. However, in the method for manufacturing the electrostatic chuck 100 of the present embodiment, after the heater electrode 50 is ground, the lower sheet-like adhesive 82 is arranged on the upper surface S3 of the lower ceramic portion 102a, and the lower sheet-like adhesive 82 is arranged. Is cured and the upper surface S7 of the lower sheet-like adhesive 82 is cut, so that the local recess of the upper surface S7 of the lower sheet-like adhesive 82 is removed, and as a result, the presence of the local recess is present. It is possible to avoid the generation of voids (unbonded portions) in the first adhesive portion 103 due to the presence of the voids, and the transmission between both sides sandwiching the first adhesive portion 103 due to the presence of the voids. Suppressing that the thermal property (for example, the heat attractability of the base member 20 cooled by supplying the refrigerant to the refrigerant flow path 21) becomes non-uniform and the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 is lowered. Can be done.

Further, in the electrostatic chuck 100 of the present embodiment, the lower ceramic portion 102a is substantially circular in the Z-axis direction orthogonal to the upper surface S3. Further, the electrostatic chuck 100 of the present embodiment includes a plurality of heater electrodes 50, and each of the plurality of heater electrodes 50 has a lower ceramic portion 102a as an outer peripheral line of the lower ceramic portion 102a in a Z-axis direction. It is arranged in each segment Z when it is virtually divided into a plurality of segments Z by at least one circular virtual dividing line VL concentric with the above. That is, in the present embodiment, each segment Z is not further divided into a plurality of segments Z along the circumferential direction of the outer peripheral line of the lower ceramic portion 102a. As in the present embodiment, the lower ceramic portion 102a is virtually divided into a plurality of segments Z by at least one circular virtual dividing line VL concentric with the outer peripheral line of the lower ceramic portion 102a in the Z-axis direction. In the embodiment, the amount of heat generated in the heater electrodes 50 arranged in each segment Z is different from that in the configuration in which each segment Z is further divided into a plurality of segments Z along the circumferential direction of the outer peripheral line of the lower ceramic portion 102a. It is difficult to correct by controlling the calorific value of the other heater electrodes 50, and the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 tends to decrease. In the method for manufacturing the electrostatic chuck 100 of the present embodiment, for example, even when the form of the segment Z in which the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 tends to decrease is adopted, for example, each heater electrode 50 It is possible to correct the variation in the calorific value of each heater electrode 50 due to the variation in the shape of the ceramic member 10, and it is possible to suppress the deterioration of the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10.

As described above, the first adhesive portion 103 is formed of the upper sheet-like adhesive 81 and the lower sheet-like adhesive 82, but the curing treatment of S190 (the lower sheet-like adhesive 82 is cured). When the process of curing) is executed under atmospheric pressure and the curing process of S210 (mainly the process of curing the upper sheet-like adhesive 81) is executed in a vacuum state, among the first adhesive portions 103, The shore hardness of the portion formed from the lower sheet-shaped adhesive 82 is higher than the shore hardness of the portion formed from the upper sheet-shaped adhesive 81.

B. Modification example:
The technique disclosed in the present specification is not limited to the above-described embodiment, and can be transformed into various forms without departing from the gist thereof, and for example, the following modifications are also possible.

The configuration of the electrostatic chuck 100 in the above embodiment is merely an example and can be variously deformed. For example, the number of heater electrodes 50 in the above embodiment, the shape of each heater electrode 50, and the arrangement of each heater electrode 50 in the ceramic member 10 are merely examples and can be deformed in various ways. For example, the electrostatic chuck 100 of the above embodiment includes three heater electrodes 50, but the number of heater electrodes 50 included in the electrostatic chuck 100 may be two or less, or four or more. May be good. Similarly, the number of segments Z in the above embodiment, the shape of each segment Z, and the arrangement of each segment Z in the ceramic member 10 are merely examples and can be variously deformed. The method for manufacturing the electrostatic chuck 100 in the above embodiment is suitable for a form in which the number of segments Z is relatively small (for example, the number of segments Z is about 10 or less). Further, the segment Z may not be set on the ceramic member 10.

Further, the number of driver electrodes 60, the shape of each driver electrode 60, and the arrangement of each driver electrode 60 in the ceramic member 10 in the above embodiment are merely examples and can be deformed in various ways. Further, in the above embodiment, the electrostatic chuck 100 may not include the driver electrode 60. Further, in the above embodiment, each via may be composed of a single via or a group of a plurality of vias. Further, in the above embodiment, each via may have a single layer configuration consisting of only a via portion, or may have a multi-layer configuration (for example, a configuration in which a via portion, a pad portion, and a via portion are laminated). May be good. Further, in the above embodiment, the electrostatic chuck 100 may not include the O-ring 90. Further, in the above embodiment, the ceramic member 10 may not have the flange portion 109.

Further, in the above embodiment, a unipolar method in which one chuck electrode 40 is provided inside the ceramic member 10 is adopted, but a bipolar method in which a pair of chuck electrodes 40 are provided inside the ceramic member 10 is adopted. It may be adopted. Further, the material forming each member in the electrostatic chuck 100 of the above embodiment is merely an example, and each member may be formed of another material. Further, in the above embodiment, the upper ceramic portion 101 and the lower ceramic portion 102 may be formed of the same type of ceramic material, or may be formed of different types of ceramic materials.

Further, the method for manufacturing the electrostatic chuck 100 in the above embodiment (see FIG. 5 and the like) is merely an example and can be variously deformed. For example, in the above embodiment, the upper ceramic portion 101a and the lower ceramic portion 102a are produced by firing the ceramic green laminate, but at least one of the upper ceramic portion 101a and the lower ceramic portion 102a is another method. It may be produced by (for example, hot press firing). Further, the order of each step in the method for manufacturing the electrostatic chuck 100 of the above embodiment may be changed. For example, the step of arranging the upper sheet-like adhesive 81 on the lower surface S2 of the upper ceramic portion 101a constituting the upper ceramic structure 11 (S170) is the step of cutting the upper surface S7 of the lower sheet-like adhesive 82 (S200). After that, it may be executed before the step (S210) of forming the first adhesive portion 103.

Further, in the above embodiment, when the second adhesive portion 30 for adhering the ceramic member 10 and the base member 20 is formed, the same process as the formation of the first adhesive portion 103 may be performed. For example, the sheet-like adhesive is arranged on the lower surface S4 of the lower ceramic portion 102a constituting the ceramic member 10, and the sheet-like adhesive is arranged on the upper surface S5 of the base member 20. Then, after the sheet-like adhesive arranged on the upper surface S5 of the base member 20 is cured, the surface of the sheet-like adhesive is cut. After that, the lower surface S4 of the lower ceramic portion 102a and the upper surface S5 of the base member 20 are bonded to each other via two sheet-like adhesives, and a curing process is performed to form the second adhesive portion 30. Form. In this way, a local recess exists on the upper surface S5 of the base member 20, and as a result, a local recess exists on the upper surface of the sheet-like adhesive arranged on the upper surface S5 of the base member 20. Even in this case, since the local recesses are removed by cutting the upper surface of the sheet-like adhesive, the second adhesive portion 30 is caused by the local recesses on the upper surface of such a sheet-like adhesive. It is possible to suppress the generation of voids in the ceramic member 10, and due to the presence of the voids, the heat transfer property between the ceramic member 10 and the base member 20 becomes non-uniform, and the temperature distribution of the adsorption surface S1 of the ceramic member 10 becomes uneven. It is possible to suppress a decrease in controllability. If there is a local recess on the lower surface S4 of the lower ceramic portion 102a instead of the upper surface S5 of the base member 20, on the contrary, the sheet-like adhesive arranged on the lower surface S4 of the lower ceramic portion 102a. After curing, the surface of the sheet-like adhesive may be cut.

Further, the present invention is not limited to the electrostatic chuck 100 which includes the ceramic member 10 and the base member 20 and holds the wafer W by utilizing electrostatic attraction, but also has a first plate-shaped member and a second plate-shaped member. It is similarly applicable to other holding devices that include a member and an adhesive portion that adheres the first plate-shaped member and the second plate-shaped member to hold the object.

10: Ceramic member 11: Upper ceramic structure 12: Lower ceramic structure 13: Recess 20: Base member 21: Refrigerator flow path 22: Through hole 30: Second adhesive portion 32: Through hole 40: Chuck electrode 50: Heater electrode 51: Heater line 52: Heater pad 60: Driver electrode 71: Heater side via 72: Feed side via 73: Feed electrode 74: Feed terminal 81: Upper sheet adhesive 82: Lower sheet adhesive 90 : O-ring 100: Electrostatic chuck 101: Upper ceramic part 102: Lower ceramic part 103: First adhesive part 108: Main body part 109: Brim part 110: Terminal hole 600: Driver electrode pair

Claims (5)

A first plate-like member having a first surface and a second surface opposite to the first surface.
It has a third surface and a fourth surface opposite to the third surface, so that the third surface is located on the second surface side of the first plate-like member. The second plate-shaped member arranged in
The first plate-shaped member and the second plate-shaped member are arranged between the second surface of the first plate-shaped member and the third surface of the second plate-shaped member. Adhesive part and
In the method of manufacturing a holding device for holding an object,
A first arranging step of arranging the first sheet-like adhesive on the second surface of the first plate-shaped member, and
A second arrangement step of arranging the second sheet-like adhesive on the third surface of the second plate-like member, and
In the first curing step of curing the second sheet-like adhesive after the second placement step, the shore hardness of the second sheet-like adhesive after curing is the first sheet-like adhesive. The first curing step, which is higher than the shore hardness of the adhesive and less than 50,
After the first curing step, a cutting step of cutting the surface of the second sheet-like adhesive and a cutting step.
After the cutting step, the second surface of the first plate-shaped member and the third surface of the second plate-shaped member are combined with the first sheet-shaped adhesive and the second sheet-shaped member. A second curing step of forming the adhesive portion by curing at least the first sheet-like adhesive in a state of being bonded via an adhesive.
To prepare
A method for manufacturing a holding device. In the method for manufacturing a holding device according to claim 1,
The shore hardness of the second sheet-like adhesive after curing in the first curing step is 30 or more.
A method for manufacturing a holding device. In the method for manufacturing a holding device according to claim 1 or 2.
The first sheet-shaped adhesive and the second sheet-shaped adhesive contain a silicone resin.
A method for manufacturing a holding device. In the method for manufacturing a holding device according to any one of claims 1 to 3.
The holding device further
A chuck electrode arranged inside the first plate-shaped member and
A heater electrode arranged so as to be exposed on the third surface of the second plate-shaped member and formed by a resistance heating element, and a heater electrode.
A base member having a fifth surface, the fifth surface being arranged so as to be located on the fourth surface side of the second plate-shaped member, and a refrigerant flow path formed therein.
A joint portion arranged between the fourth surface of the second plate-shaped member and the fifth surface of the base member to join the second plate-shaped member and the base member, and
A device for holding the object on the first surface of the first plate-shaped member.
The method for manufacturing the holding device further describes.
A first preparation step for preparing a first structure including the first plate-shaped member and the chuck electrode, and
A second preparation step of preparing a second structure including the second plate-shaped member and the heater electrode, and
A joining step of joining the second plate-shaped member and the base member constituting the second structure by the joining portion.
A measurement step of measuring the temperature distribution of the third surface of the second plate-shaped member while supplying the refrigerant to the refrigerant flow path and supplying power to the heater electrode.
An adjustment step of adjusting the calorific value of the heater electrode by grinding a part of the heater electrode exposed on the third surface of the second plate-shaped member based on the measurement result of the temperature distribution.
With
The second placement step is performed after the adjustment step.
A method for manufacturing a holding device. In the method for manufacturing a holding device according to claim 4,
The second plate-shaped member is substantially circular in the first directional view orthogonal to the third surface.
The holding device includes a plurality of the heater electrodes.
Each of the plurality of heater electrodes has a plurality of the second plate-shaped member formed by at least one circular virtual dividing line concentric with the outer peripheral line of the second plate-shaped member in the first directional view. Arranged in each of the above segments when virtually divided into segments,
A method for manufacturing a holding device.

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