JP2021109984A - Device of treating substrate, and method of treating substrate - Google Patents

Abstract

To provide a device and a method of treating a substrate, capable of accurately positioning a substrate relative to a substrate holder.SOLUTION: An arrangement adjusting mechanism is controlled so as to adjust an arrangement of a substrate according to the detection by a first sensor, and a second sensor is controlled so as to detect a characteristic point formed beforehand on a board surface of the substrate whose arrangement has been adjusted according to the detection by the first sensor. Confirming whether or not a position of the characteristic point detected by the second sensor is within an acceptable range, the arrangement adjusting mechanism is controlled so to adjust the arrangement of the substrate according to the detection by the second sensor when the position of the characteristic point detected by the second sensor is within the acceptable range, and a substrate attaching/detaching mechanism is controlled so as to attach the substrate to a substrate holder, subsequent to adjusting the arrangement of the substrate according to the detection by the second sensor.SELECTED DRAWING: Figure 14

Description

The present invention relates to a substrate processing apparatus and a substrate processing method.

Conventionally, as an example of a substrate processing apparatus, a plating apparatus that performs a plating process on a substrate is known. Generally, in such a plating apparatus, a substrate on which a pattern such as a hole or a mask is formed in advance is put into the plating apparatus. Then, in the plating apparatus, the substrate is attached to the substrate holder through the transfer by the transfer apparatus, and the substrate is plated while being attached to the substrate holder. At this time, it is not always possible for the transport device for transporting the substrate to always hold the substrate at the same position and angle to transport the substrate. Therefore, when the board is mounted on the board holder, the board may be displaced from a predetermined correct position. If the substrate is misaligned with respect to the substrate holder, the substrate may be damaged or the substrate may not be processed correctly.

In order to deal with such a problem, a substrate processing device has been proposed in which an image sensor detects the positions of two corners of a substrate and determines the position of the substrate when the substrate is conveyed to a predetermined position. (See, for example, Patent Document 1). This substrate processing apparatus accurately detects the corners of the substrate by irradiating the substrate from the side opposite to the image sensor by the illumination device.

JP-A-2018-168432

In the method described in Patent Document 1, the positions of two corners of the substrate are detected by an image sensor, and the positions and angles of the substrate are corrected. However, when the warp of the substrate is large, the position and angle of the substrate may not be corrected with sufficient accuracy. Further, depending on the material of the substrate, light may pass through the substrate and the positions of the two corners of the substrate may not be detected.

The present invention has been made in view of the above circumstances, and one of the objects of the present invention is to propose a substrate processing apparatus and method capable of accurately positioning and holding a substrate with respect to a substrate holder.

According to one embodiment of the present invention, a substrate processing apparatus is proposed, wherein the substrate processing apparatus includes a substrate holder for holding a substrate, a substrate attachment / detachment mechanism for attaching the substrate to the substrate holder, and an outer shape of the substrate. The first sensor for detecting the arrangement of the substrate, the second sensor for detecting the feature points formed in advance on the plate surface of the substrate, and the arrangement of the substrate are adjusted based on the above. It has an arrangement adjusting mechanism and a control unit, the control unit controls the arrangement adjustment mechanism so as to adjust the arrangement of the substrate based on the detection by the first sensor, and the control unit controls the arrangement adjustment mechanism. The second sensor is controlled so as to detect the feature points formed in advance on the plate surface of the substrate whose arrangement is adjusted based on the detection by the first sensor, and the control unit is detected by the second sensor. After confirming whether or not the position of the feature point is within the permissible range, the control unit detects the feature point detected by the second sensor when the position of the feature point is within the permissible range. The arrangement adjustment mechanism is controlled so as to adjust the arrangement of the substrate based on the above, and the control unit attaches the substrate to the substrate holder after adjusting the arrangement of the substrate based on the detection by the second sensor. As described above, the substrate attachment / detachment mechanism is controlled.

According to another embodiment of the present invention, a substrate holder for holding a substrate, a substrate attachment / detachment mechanism for attaching the substrate to the substrate holder, and an arrangement adjustment mechanism configured to adjust the arrangement of the substrates. A substrate processing method in a substrate processing apparatus comprising the above is proposed, and the substrate processing method is based on a first detection step of detecting the arrangement of the substrate based on the outer shape of the substrate and a detection by the first detection step. A first arrangement adjustment step for controlling the arrangement adjustment mechanism so as to adjust the arrangement of the substrate, and a second for detecting feature points formed in advance on the plate surface of the substrate whose arrangement has been adjusted in the first arrangement adjustment step. It is confirmed whether or not the positions of the feature points detected in the second detection step and the second detection step are within the permissible range, and when the positions of the detected feature points are within the permissible range, the second detection step is performed. A second arrangement adjustment step that controls the arrangement adjustment mechanism so as to adjust the arrangement of the substrate based on the detection by the detection step, and after the second arrangement adjustment step, the substrate is attached and detached so as to attach the substrate to the substrate holder. Includes a board mounting step to control the mechanism.

FIG. 1 is an overall layout diagram of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic plan view illustrating a substrate arrangement adjusting mechanism according to the first embodiment. FIG. 3 is a schematic side view for explaining the substrate arrangement adjusting mechanism according to the first embodiment. FIG. 4 is a diagram corresponding to FIG. 2 in a state where the substrate is placed on the temporary substrate stand by the substrate transport device. FIG. 5 is a diagram corresponding to FIG. 3 in a state where the substrate is placed on the temporary substrate stand by the substrate transport device. FIG. 6 is a diagram corresponding to FIG. 4 for explaining the transfer of the substrate from the temporary substrate stand to the handling stage. FIG. 7 is a diagram corresponding to FIG. 4 for explaining the movement of the substrate to the arrangement adjustment location by the handling stage. FIG. 8 is a diagram corresponding to FIG. 3 for explaining the arrangement adjustment of the substrate by the handling stage. FIG. 9 is a diagram for explaining the arrangement adjustment of the base S in the substrate attachment / detachment mechanism. FIG. 10 is a schematic view showing an example of a plan view of the substrate. FIG. 11 is a diagram for explaining the rotation angle of the substrate. FIG. 12 is a diagram for explaining the imaging position of the second sensor. FIG. 13 is a diagram for explaining the imaging position of the second sensor. FIG. 14 is a flowchart showing an example of a substrate arrangement adjustment process executed by each controller in the substrate processing apparatus. FIG. 15 is a schematic view for explaining the arrangement adjustment of the substrate in the second embodiment. FIG. 16 is an explanatory diagram illustrating the imaging positions of the first sensor and the second sensor in the second embodiment. FIG. 17 is a flowchart showing an example of the process of adjusting the arrangement of the substrates in the second embodiment. FIG. 18 is a schematic view for explaining the arrangement adjustment of the substrate in the third embodiment.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the drawings used are schematic views. Therefore, the size, position, shape, and the like of the illustrated parts may differ from the size, position, shape, and the like in an actual device. Further, in the following description and the drawings used in the following description, the same reference numerals are used for parts that can be configured in the same manner, and duplicate description is omitted.

(First Embodiment)
FIG. 1 is an overall layout view of a substrate processing apparatus 100 according to an embodiment of the present invention. In this example, the substrate processing apparatus 100 is an electrolytic plating apparatus. Here, the electrolytic plating apparatus will be described as an example, but the present invention can be applied to other substrate processing apparatus such as an arbitrary plating apparatus, a polishing apparatus, a grinding apparatus, a film forming apparatus, and an etching apparatus.

The substrate processing apparatus 100 processes the substrate S and the load / unload unit 110 for loading the substrate (object to be processed) into the substrate holder 11 (not shown in FIG. 1) or unloading the substrate from the substrate holder 11. It is roughly divided into a processing unit 120 and a cleaning unit 50a. The processing unit 120 further includes a pretreatment / posttreatment unit 120A that performs pretreatment and posttreatment of the substrate, and a plating processing unit 120B that performs a plating treatment on the substrate. The substrate S includes a square substrate and a circular substrate. Further, the square substrate includes a polygonal glass substrate such as a rectangle, a liquid crystal substrate, a printed circuit board, and other polygonal objects to be processed. The circular substrate includes a semiconductor wafer, a glass substrate, and other circular objects to be processed.

The load / unload unit 110 includes a substrate arrangement adjustment mechanism 26, a substrate transfer device 27, and a substrate attachment / detachment mechanism 29. As an example, in the present embodiment, the load / unload unit 110 includes a board arrangement adjustment mechanism 26A for loading that handles the substrate S before processing, and a substrate arrangement adjustment mechanism 26B for unloading that handles the substrate S after processing. It has two board arrangement adjustment mechanisms 26. In the present embodiment, the board arrangement adjusting mechanism 26A for loading and the substrate arrangement adjusting mechanism 26B for unloading have the same configuration, but are arranged 180 ° differently from each other. The substrate arrangement adjusting mechanism 26 is not limited to the one provided with the substrate arrangement adjusting mechanisms 26A and 26B for loading and unloading, and may be used without distinguishing between loading and unloading, respectively. Further, in the present embodiment, the load / unload unit 110 has two substrate attachment / detachment mechanisms 29. The two substrate attachment / detachment mechanisms 29 are the same mechanism, and the vacant one (the one that does not handle the substrate S) is used. The substrate arrangement adjustment mechanism 26 and the substrate attachment / detachment mechanism 29 may be provided with one or three or more depending on the space in the substrate processing device 100.

In the substrate arrangement adjusting mechanism 26 (board arrangement adjusting mechanism 26A for loading), the substrate S is conveyed from a plurality of (three in FIG. 1 as an example) cassette tables 25 through the robot 24. The cassette table 25 includes a cassette 25a in which the substrate S is housed. The cassette is, for example, a hoop. The substrate arrangement adjusting mechanism 26 is configured to adjust (align) the position and orientation of the mounted substrate S. The substrate attachment / detachment device 290 is arranged in the substrate attachment / detachment mechanism 29, and is configured to attach / detach the substrate S to / from the substrate holder 11. The substrate attachment / detachment mechanism 29 includes a control device 29a. The control device 29a communicates with the controller 175 of the board processing device 100 and controls the operation of the board attachment / detachment mechanism 29. A substrate transfer device 27 including a transfer robot (board transfer machine) 270 that transfers a substrate between these units is arranged between the substrate arrangement adjustment mechanism 26 and the substrate attachment / detachment mechanism 29. The board transfer device 27 includes a controller 27a. The controller 27a communicates with the controller 175 of the board processing device 100 and controls the operation of the board transfer device 27.

The cleaning unit 50a has a cleaning device 50 that cleans and dries the substrate after the plating treatment. The substrate transport device 27 is configured to transport the plated substrate to the cleaning device 50 and take out the cleaned substrate from the cleaning device 50. Then, the cleaned substrate is passed to the substrate arrangement adjustment mechanism 26 (board arrangement adjustment mechanism 26B for unloading) by the substrate transfer device 27, and is returned to the cassette 25a through the robot 24.

The pretreatment / posttreatment section 120A includes a pre-wet tank 32, a pre-soak tank 33, a pre-rinse tank 34, a blow tank 35, and a rinse tank 36. In the pre-wet tank 32, the substrate is immersed in pure water. In the pre-soak tank 33, the oxide film on the surface of the conductive layer such as the seed layer formed on the surface of the substrate is removed by etching. In the prerinsing tank 34, the substrate after pre-soaking is cleaned together with the substrate holder with a cleaning liquid (pure water or the like). In the blow tank 35, the substrate is drained after cleaning. In the rinse tank 36, the plated substrate is washed with a cleaning liquid together with the substrate holder. The configuration of the pre-treatment / post-processing unit 120A of the substrate processing device 100 is an example, and the configuration of the pre-processing / post-processing unit 120A of the substrate processing device 100 is not limited, and other configurations can be adopted. Is.

The plating processing unit 120B has a plurality of plating tanks 39 including an overflow tank 38. Each plating tank 39 houses one substrate inside, and the substrate is immersed in the plating solution held inside to perform plating such as copper plating on the surface of the substrate. Here, the type of plating solution is not particularly limited, and various plating solutions are used depending on the application.

The substrate processing device 100 is located on the side of each of these devices, and has a substrate holder transport device 37 that transports the substrate holder together with the substrate between the devices, for example, a substrate holder transfer device 37 that employs a linear motor system. The substrate holder transfer device 37 conveys the substrate holder 11 between the substrate attachment / detachment mechanism 29, the pre-wet tank 32, the pre-soak tank 33, the pre-rinse tank 34, the blow tank 35, the rinse tank 36, and the plating tank 39. It is composed.

The plating processing system including the substrate processing apparatus 100 configured as described above has a controller 175 configured to control each of the above-mentioned parts. The controller 175 has a memory 175B that stores various setting data and various programs, a CPU 175A that executes the program of the memory 175B, and a control unit 175C that is realized by the CPU 175A executing the program. The recording medium constituting the memory 175B may include one or more of arbitrary recording media such as ROM, RAM, hard disk, CD-ROM, DVD-ROM, and flexible disk. The programs stored in the memory 175A include, for example, a program for controlling the board arrangement adjusting mechanism 26, a program for controlling the transfer of the board transfer device 27, and a program for controlling the attachment / detachment of the board to / from the board holder 11 in the board attachment / detachment mechanism 29. A program for controlling the transfer of the substrate holder transfer device 37 and a program for controlling the plating process in each plating tank 39 are included. Further, the controller 175 is configured to be communicable with a higher-level controller (not shown) that controls the board processing device 100 and other related devices in an integrated manner, and can exchange data with the database of the higher-level controller.

The substrate arrangement adjusting mechanism 26 will be described in detail. As described above, in the present embodiment, the board arrangement adjustment mechanism 26A for loading and the substrate arrangement adjustment mechanism 26B for unloading are arranged 180 ° differently from each other, but have the same configuration. , The substrate arrangement adjusting mechanism 26 will be collectively described. 2 and 3 are schematic views for explaining the substrate arrangement adjusting mechanism 26 according to the first embodiment, FIG. 2 is a plan view, and FIG. 3 is a view in the F3-F3 direction (along the y direction) in FIG. It is a side view. In addition, in FIG. 2 and FIG. 3, the substrate S is shown by a alternate long and short dash line. Further, in the following description, the vertical direction of FIG. 2 will be referred to as the “x direction”, the horizontal direction of FIGS. 2 and 3 will be referred to as the “y direction”, and the vertical direction (vertical direction) of FIG. 3 will be referred to as the “z direction”. In the present embodiment, as shown in FIGS. 2 and 3, the case where the first sensor 61 (61A to 61E) is provided in the substrate arrangement adjusting mechanism 26 will be described as an example.

As shown in FIG. 2, the substrate arrangement adjusting mechanism 26 includes a substrate temporary placing table 261 and a handling stage 265 (stage, first arrangement adjusting mechanism). The substrate S is taken out from the cassette 25a by the robot 24 and conveyed onto the substrate temporary stand 261. Board temporary stand 2
The 61 is configured so that the substrate S can be moved in the z direction (vertical direction) on the upper surface. In the present embodiment, the mounting surfaces of the substrate S on the temporary substrate stand 261 and the handling stage 265 are defined horizontally, that is, along the x-direction and the y-direction, but the present invention is not limited to these examples. In the example shown in FIG. 2, the substrate temporary stand 261 has three support portions 262, 263, and 264 that are separated from each other and support the substrate S mounted on the upper surface. The board temporary stand 261 includes a controller 261a (see FIG. 3). The controller 261a communicates with the controller 175 (see FIG. 1) of the board processing apparatus and controls the operation of the board temporary stand 261.

The handling stage 265 is configured to receive the substrate S mounted on the temporary substrate stand 261 and to adjust the position and orientation of the substrate S. The handling stage 265 has two support portions 266 and 267 separated from each other to support the substrate S mounted on the upper surface. Here, in the present embodiment, the support portions 262 to 264 of the substrate temporary stand 261 and the support portions 266 and 267 of the handling stage 265 are configured to support different regions of the substrate S. In other words, the substrate temporary stand 261 is configured to support the first region of the substrate S, and the handling stage 265 is configured to support a second region different from the first region of the substrate S. Further, the handling stage 265 is configured so as not to overlap with a predetermined corner portion of the substrate S in the vertical direction (z direction). The handling stage 265 is configured so that the substrate S can be moved in the x direction and the y direction, and the substrate S can be rotated in the θ direction around the z direction. The handling stage 265 includes a controller 265a (see FIG. 3). The controller 265a communicates with the controller 175 (see FIG. 1) of the substrate processing apparatus to control the operation of the handling stage 265.

4 and 5 show diagrams corresponding to FIGS. 2 and 3, respectively, in a state where the substrate S is placed on the substrate temporary stand 261 by the substrate transfer device 27. As shown in FIGS. 4 and 5, when the substrate S is placed on the substrate temporary stand 261 by the robot 24, the handling stage 265 subsequently moves directly below the substrate temporary stand 261. The handling stage 265 may be moved directly under the board temporary stand 261 before or at the same time that the board S is mounted on the board temporary stand 261.

Subsequently, as shown in FIG. 6, the substrate temporary stand 261 moves downward (z direction), and the substrate S is placed on the handling stage 265. As described above, the substrate temporary stand 261 and the handling stage 265 are configured to support different regions of the substrate S from each other. Therefore, by moving the board temporary stand 261 downward, the board S is delivered without the support portions 262 to 264 of the board temporary stand 261 and the support portions 266 and 267 of the handling stage 265 interfering with each other. Can be done.

Next, as shown in FIG. 7, the handling stage 265 moves in the y direction, and the arrangement adjustment place (robot delivery position) which is a predetermined place for adjusting the arrangement of the board from directly below the board temporary placement table 261. Move to. As shown in FIG. 7, the first sensor is arranged at the arrangement adjustment place. In the examples shown in FIGS. 2 to 8, the first sensor 61 (61A to 61E) is fixed at the arrangement adjustment location regardless of the position of the handling stage 265. However, the present invention is not limited to these examples, and the first sensor 61 may move integrally with the handling stage 265.

Then, as shown in FIG. 8, the handling stage 265 adjusts the positions of the substrate S in the x-direction and the y-direction and the rotation angle θ (direction) at the arrangement adjustment location. Here, the rotation angle θ of the substrate S is defined as an angle in which the side of the substrate S along the x-axis (or y-axis) is tilted with respect to the x-axis (or y-axis) in the xy plane. Further, if desired, the handling stage 265 may change the orientation of the substrate S by 90 degrees or 180 degrees. After the arrangement of the substrate S is adjusted by the handling stage 265, the substrate S is then conveyed to the substrate attachment / detachment device 290 by the substrate transfer device 27.

See again FIGS. 2 and 3. In this embodiment, the first sensor 61 (61A to 61E) is provided in the substrate arrangement adjusting mechanism 26. The first sensors 61 (61A to 61E) are arranged at positions where the outer shape of the substrate S can be detected when the substrate S is transported to a predetermined transport position (robot transport position) by the handling stage 265. In the present embodiment, a plurality of (five as an example) laser sensors 61A to 61E are adopted as the first sensor 61. As an example, each of the laser sensors 61A to 61E has a light projecting body 62a in which a plurality of laser light projecting elements are arranged on a line, and a light receiving body 62b in which a plurality of light receiving elements are arranged on a line. The laser sensors 61A to 61E determine the incoming / light-shielding in each light-receiving element by comparing the amount of light received by the light-receiving body 62b with a predetermined binarization level, and measure the edge of the substrate S. can do. As such laser sensors 61A to 61E, for example, Keyence's IG series (as an example, IG-028) can be used. In particular, by using such a laser sensor, the outer shape of the substrate S can be accurately measured regardless of the translucency of the substrate S. The first sensor 61 may be one to four or six or more sensors as long as it can measure the outer shape of the substrate S in order to adjust the position of the substrate S. Further, the first sensor is not limited to the laser sensor 61, and various sensors such as a mechanical switch or a pressure sensor that involves mechanical contact with the substrate S, an image sensor, or an ultrasonic sensor can be adopted. can.

In the present embodiment, the substrate S is a substantially rectangular rectangular substrate, and has four sides L1, L2, L3, L4 and four corners P1, P2, P3, P4 (FIG. 10). reference). Further, the center Pa0 of the substrate S can be defined as an intersection of two diagonal lines. Then, in the present embodiment, as shown in FIG. 2, as the first sensor 61, the laser sensors 61A and 61B for measuring the positions of the first facing edges (L1, L3) on the substrate S and the substrate. Laser sensors 61C and 61D for measuring the positions of the second facing edges (L2 and L4) in S, and laser sensors 61E for measuring the rotation angle θ together with any of the laser sensors 61A to 61D. A total of five laser sensors are used. The five laser sensors 61A to 61E are fixed to a frame (not shown) in the substrate processing apparatus 100, and their respective positions are calibrated in advance. In the first sensor 61, the dimensions in the first direction (y direction) and the center position (ya0) in the first direction (y direction) are based on the detection of the positions of the first facing edges by the laser sensors 61A and 61B. And are measured. Further, based on the detection of the position of the second opposite edge portion by the laser sensors 61C and 61D, the dimension in the second direction (x direction) and the center position (xa0) in the second direction (x direction) are measured. NS. Further, the rotation angle θa0 of the substrate S is measured based on the detection of any of the laser sensors 61A to 61D (for example, the laser sensor 61A) and the laser sensor 61E. Then, the handling stage 265 is positioned in the x-direction and the y-direction of the substrate S so that the substrate S is arranged at a predetermined target installation position (first target installation position) based on the measurement position of the substrate S. , And the rotation angle θ (direction). In the present embodiment, when the substrate S is arranged at the arrangement adjustment location by the handling stage 265, the correct position where the substrate S should be located is defined as the “target installation position (first target installation position)”. Although not limited, when the orientation of the substrate S is changed by a handling stage 265, for example, 90 degrees or 180 degrees, the target installation position is the position of the substrate S after the orientation change. It should be in the correct position. In the present embodiment, the target center position (xat, yat) at the center of the substrate S and the target rotation angle θat of the substrate S are used as reference values corresponding to the first target installation position.

In the board arrangement adjustment mechanism 26A for loading, when the arrangement of the substrate S is adjusted by the handling stage 265 (first arrangement adjustment mechanism), the substrate S is conveyed to the substrate attachment / detachment mechanism 29 by the transfer robot 270. In the substrate arrangement adjusting mechanism 26A for unloading, when the arrangement of the substrate S is adjusted by the handling stage 265, the substrate S is returned to the cassette 25a by the robot 24. As a result, the substrate W can be returned to the cassette 25a with the arrangement adjusted.

FIG. 9 is a diagram for explaining the arrangement adjustment of the substrate S in the substrate attachment / detachment mechanism 29. Although FIG. 9 shows an example of the substrate attachment / detachment mechanism 29, the substrate attachment / detachment mechanism is not limited to such an example. For example, as the substrate attachment / detachment mechanism, the substrate attachment / detachment device described in Japanese Patent Application No. 2018-190116 can also be used. In the example shown in FIG. 9, the substrate attachment / detachment mechanism 29 includes a substrate attachment / detachment device 290 having a swivel device 1200. A second holding member 400 of the substrate holder 11 is mounted on the swivel device 1200. In this state, the substrate S is attached to the second holding member 400. The substrate S is conveyed onto the second holding member 400 by the transfer robot 270. The substrate holder 11 further has a first holding member (not shown), and is a member that sandwiches and holds the substrate S between the first holding member and the second holding member 400.

The transfer robot 270 includes a robot main body 271, a robot hand 272 attached to the robot main body 271, and a controller 270a. The operation of the robot hand 272 is controlled by the controller 270a. The robot hand 272 can hold the substrate S in contact or non-contact. The robot hand 272 holds the substrate S in a non-contact manner by, for example, a Bernoulli chuck. It is desirable that the robot hand 272 also has a chuck that regulates the position of the substrate in the XY plane with respect to the robot hand. The transfer robot 270 is a multi-axis robot, and the position of the substrate S held by the robot hand 272 can be moved in the x, y, z directions, and the rotation direction (θ direction). The x, y, and z axes are defined in the directions shown in FIG. The x-axis and y-axis are parallel to the installation surface 800, and the z-axis is orthogonal to the installation surface 800. In addition, two or more robot hands may be provided.

In the present embodiment, the transfer robot 270 corresponds to the second arrangement adjustment mechanism, and the arrangement of the substrate S is further adjusted by the transfer robot 270 in the substrate attachment / detachment mechanism 29 before the substrate S is installed in the substrate attachment / detachment device 290. In the present embodiment, when the substrate S is installed on the substrate attachment / detachment device 290 by the transfer robot 270, the correct position where the substrate S should be located is defined as a “target installation position (second target installation position)”.

The substrate attachment / detachment mechanism 29 is provided with a second sensor 71. The second sensor 71 is a sensor capable of detecting a feature point (for example, a predetermined alignment mark or a pattern such as a recess or a mask) formed in advance on the plate surface of the substrate S, and is, for example, an image sensor. Further, in the example shown in FIG. 9, the second lighting device 72 (72a, 72b) is provided on the same side as the second sensor 71 (71a, 71b) of the substrate S. In the example shown in FIG. 9, the second sensor 71 and the second lighting device 72 are both provided above the substrate S. The second lighting device 72 is a top light made of, for example, an LED. Although not limited, the second illuminating device 72 is placed on the plate surface of the substrate S so that the irradiation light from the second illuminating device 72 does not directly reflect and enter the second sensor 71. On the other hand, it is preferable that the arrangement is inclined. When the plate surface of the substrate S is photographed by the second sensor 71, the feature points formed in advance on the plate surface of the substrate S can be clarified by irradiating the substrate S with the second lighting device 72. However, the substrate processing device 100 does not have to include such a lighting device 72.

Subsequently, the imaging position of the substrate S by the second sensor 71 and the target installation position (second target installation position) of the substrate S in the substrate attachment / detachment mechanism 29 will be described in detail. FIG. 10 is a diagram schematically showing an example of a plan view of the substrate S. FIG. 11 is a diagram for explaining the rotation angle of the substrate S. As described above, in the present embodiment, the substrate S is a substantially rectangular rectangular substrate, and has four sides L1, L2, L3, L4 and four corners P1, P2, P3, P4. ing. Further, as shown in FIGS. 10 and 11, in the present embodiment, the alignment mark 73 is formed in advance on the substrate S. The alignment mark 73 is formed in advance before the substrate S is put into the substrate processing apparatus 100 as a feature point for detection by the second sensor 71. The alignment mark 73 is preferably formed together with a pattern such as a recess or a mask formed on the substrate S before being put into the substrate processing apparatus 100. The alignment mark 73 may have any shape and dimensions as long as the position can be detected by the second sensor 71. Then, the place where the feature point on the substrate S should be formed is stored in advance in any of the controllers of the substrate processing apparatus 100. Specifically, in the present embodiment, the target position (xbt, ybt) at the midpoint of the alignment mark 73 and the target inclination angle θbt are stored in advance as reference values corresponding to the second target installation position. Although not limited, the alignment mark 73 is preferably provided in the vicinity of at least two corners P1 to P4 of the substrate S. In particular, the alignment mark 73 may be provided in the vicinity of the two diagonal corners of the substrate S. As an example, in the present embodiment, the alignment mark 73 is provided in the vicinity of the two corners P1 and P3. Further, although not limited to this, in the present embodiment, when there is no misalignment, the two alignment marks 73 are provided at positions symmetrical with respect to the center of the substrate S, and the midpoint Pb0 of the two alignment marks 73 is It corresponds to the center Pa0 of the substrate S. In the present embodiment, two alignment marks 73 are formed as feature points on the substrate S, but one or three or more alignment marks 73 may be formed. Further, instead of or in addition to the alignment mark 73, a pattern such as a recess or a mask previously formed on the plate surface of the substrate S may be used as a feature point previously formed on the plate surface of the substrate S.

12 and 13 are diagrams for explaining the imaging position by the second sensors 71a and 71b. Each of the second sensors 71a and 71b is a substrate so that the alignment mark 73 can be photographed when the substrate S is conveyed to the assumed position (second target installation position) in the substrate attachment / detachment device 290 by the transfer robot 270. It is fixed to a frame (not shown) in the processing device 100. In the present embodiment, as shown in FIGS. 12 and 13, it is assumed that the center C2 of the imaging unit (for example, the lens) of the second sensors 71a and 71b is the substrate S in the substrate attachment / detachment mechanism 29 in a plan view. It is provided so as to be arranged at a position corresponding to the center of the alignment mark 73 of the substrate S when it is arranged at the position (directly above the second holding member 400, the second target installation position). In addition, in FIGS. 12 and 13, an example in which the alignment mark 73 is located at the assumed position (center C2 of the imaging unit) is shown by a broken line, and the position of the alignment mark 73 is deviated from the center C2 of the imaging unit. Is shown by a solid line.

In such a second sensor 71, the midpoint position (xb0, yb0) and the inclination angle θb0 of the line connecting the two are set based on the positions of the alignment marks 73 measured by the two second sensors 71a and 71b, respectively. , Is calculated. The controller may perform image processing on the entire imaging area by the second sensor 71 in order to detect the position of the alignment mark 73, or may be near the assumed position of the alignment mark 73 (center C2 of the imaging unit). The region (region 71a1 in FIG. 12) may be image-processed. Further, in the present embodiment, the target midpoint position (xbt, ybt) and the target inclination angle θbt are used as reference values corresponding to the second target installation position. Then, the transfer robot 270 moves the substrate S in the horizontal direction so that the midpoint position (xb0, yb0) of the alignment mark 73 by the second sensor 71 and the inclination angle θb0 approach the reference value at the second target installation position. The position of the substrate S is adjusted by moving it in the (x direction and y direction) and the rotation direction.

Next, the arrangement adjustment of the substrate S in the substrate processing apparatus 100 described above will be described with reference to the flowchart. FIG. 14 is a flowchart showing an example of a process of adjusting the arrangement of the substrate S executed by at least one of various controllers (simply referred to as “controller”) in the substrate processing apparatus 100. This process is started when the substrate S is placed on the substrate arrangement adjusting mechanism 26 (board arrangement adjusting mechanism 26A for loading) by the robot 24.

First, the substrate S is delivered from the temporary substrate stand 261 to the handling stage 265, and the substrate S is transported to the robot delivery position by the handling stage 265 (step S12). The process of this step S12 has been described above with reference to FIGS. 2-FIG. 7 and the like. When the substrate S is rotated by 90 degrees or 180 degrees in the handling stage 265, the controller rotates the substrate S. However, the rotation of the substrate S may be performed after the measurement by the first sensor 61 described below. Further, the controller may determine whether or not to rotate the substrate S based on the measurement by the first sensor 61.

Subsequently, the outer shape of the substrate S is measured by the first sensor 61 (step S16). As a result, the dimensions, position, and rotation angle of the substrate S are calculated. Then, the controller determines whether or not the outer shape (dimensions) of the substrate S is within the reference range (step S18). The reference range may be a predetermined range, for example, an error of several percent with respect to the desired substrate dimensions. In step S18, for example, when the warp of the substrate S is large, it is determined that the outer shape of the substrate S is out of the reference range. Then, when the outer shape of the substrate S is not within the reference range (outside the reference range) (step S18: No), the controller executes a predetermined abnormality determination process (step S38), and ends the arrangement adjustment process. do. As the abnormality determination processing, for example, the controller returns the substrate S to the cassette 25a (by controlling the substrate processing device 100) without performing subsequent processing on the substrate S. Alternatively, the substrate S may be transported to a predetermined location different from the normal transport location. Further, the abnormality determination process may include notifying an abnormality such as issuing an alarm in the substrate processing device 100 or transmitting an abnormality signal from the substrate processing device 100 to the outside. As a result, the administrator of the substrate processing apparatus 100 and the like can recognize that the abnormality of the substrate S has been determined.

Next, the coordinates (xa0, ya0) of the center position of the substrate S and the rotation angle θa0 calculated from the measurement by the first sensor 61, and the reference value corresponding to the first target installation position (target center position (xat, yat)). ) And the angle of rotation θat = 0) are determined to be within a predetermined range (step S20). Here, as the predetermined range, a predetermined range based on the accuracy of the arrangement adjustment by the handling stage 265 or the like can be used. Then, if the error between the calculated center position coordinates (xa0, ya0) and the rotation angle θa0 and the target center position and the rotation angle is out of the predetermined range (step S20: No), the error amount is used. , The handling stage 265 is moved in the x direction, the y direction, and / or the rotation direction θ in the xy plane so that the arrangement of the substrate S approaches the target installation position (first target installation position). The arrangement of the substrate S is adjusted (step S22). After that, the processes of steps S16, S20, and S22 are performed until the error between the coordinates and the rotation angle of the center position of the substrate S calculated from the measurement by the first sensor 61 and the target center position and the rotation angle is within a predetermined range. Is repeated. Then, when the error between the coordinates and the rotation angle of the center position of the substrate S calculated from the first sensor 61 and the target center position and the rotation angle is within a predetermined range (step S20: Yes), the following description will be given. The process proceeds to the process of step S24. In this way, by detecting the outer shape of the substrate S by the first sensor 61 and adjusting the arrangement of the substrate S based on the detection result, the arrangement of the substrate S can be adjusted accurately.

In the present embodiment, the arrangement adjustment of the substrate S by the handling stage 265 can be performed with high accuracy, and usually, the substrate S is set to the target installation position (first target installation position) by one arrangement adjustment (step S22). It is installed within the specified range. Therefore, after adjusting the arrangement of the substrate S in the handling stage 265 in the processing of step S22, the substrate processing apparatus 100 proceeds to the processing of step S24 and subsequent steps without returning to the processing of step S16. May be good. Further, in the process shown in FIG. 14, the substrate processing apparatus 100 determines that the error is out of the predetermined range for the same substrate S a plurality of times (for example, two times, three times, etc.) in step S20. May determine that an abnormality has occurred in the handling stage 265 or the first sensor 61.

When the arrangement of the substrate S is adjusted within a predetermined range with respect to the first target installation position based on the measurement by the first sensor 61, the controller conveys the substrate S to the substrate attachment / detachment device 290 by the transfer robot 270 ( Step S24). The transfer robot 270 is preliminarily adjusted so as to transfer the substrate S to an assumed position (second target installation position) in the substrate attachment / detachment device 290. In step S24, the substrate S remains held by the hand of the transfer robot 270. In the present embodiment, the transfer robot 270 can transfer the substrate S with high accuracy, and the arrangement adjustment by the handling stage 265 is maintained, and the substrate S is transferred to the substrate attachment / detachment device 290.

Subsequently, in the substrate attachment / detachment device 290, the feature point (alignment mark 73 in this embodiment) of the substrate S is imaged by the second sensor 71 (step S26). From this image, the coordinates (xb0, yb0) of the midpoint position of the feature points and the inclination angle θb0 of the line connecting the feature points are calculated.

Next, the controller uses the calculated midpoint coordinates (xb0, yb0) and tilt angle θb, and reference values corresponding to the second target installation position (target midpoint position (xbt, ybt) and target tilt angle θbt). It is determined whether or not the error with the above is within a predetermined allowable range (step S28). In addition, although step S28 of FIG. 14 is a determination of "whether or not the feature point position is within the permissible range", it is comprehensively described for convenience of illustration and in terms of the concept of the invention. In the present embodiment, the determination in step S28 is performed based on the positional relationship between the two alignment marks 73 as feature points. Here, the permissible range includes the accuracy of the arrangement adjustment of the handling stage 265 and the transfer robot 270 as the range for determining the abnormality of the board S, and the position of the board permissible when the board S is held in the board holder. A predetermined range based on the deviation range or the like can be used. The arrangement of the substrate S is adjusted by the handling stage 265 based on the measurement of the outer shape by the first sensor 61, and the position of the feature point calculated from the measurement by the second sensor 71 is usually the second target installation position. It is within the permissible range for the reference value corresponding to. Then, when the position of the feature point calculated from the measurement by the second sensor 71 is within the permissible range (step S28: Yes), the controller determines whether or not the position of the feature point calculated subsequently is within the predetermined range. (Step S30). In the present embodiment, the process of step S30 is the same as the process of step S28, in that the calculated midpoint coordinates (xb0, yb0) and the inclination angle θb and the reference value corresponding to the second target installation position (in the target). It is determined whether or not the error between the point (xbt, ybt) and the target inclination angle θbt) is within a predetermined range. Here, as a predetermined range, as a range for determining whether or not to arrange and adjust the substrate S, a range of the displacement of the substrate allowed for the uniformity of plating, and a transfer robot 270 or a substrate attachment / detachment mechanism. A predetermined range based on the accuracy of delivery of the substrate S to the substrate holder 11 by 29 can be used. Further, the predetermined range in step S30 is a range smaller than the allowable range in step S28. When the calculated feature point position is not within the predetermined range (outside the predetermined range) (step S30: No), the transfer robot is based on the error between the calculated feature point position and the second target installation position. The hand of 270 is moved in the x direction, the y direction, and / or the rotation direction θ in the xy plane, and the arrangement of the substrate S is adjusted so that the substrate S approaches the second target installation position (step S32). ). After that, steps S26, S30, and S32 until the error between the midpoint position and inclination angle of the feature point calculated from the measurement by the second sensor 71 and the reference value corresponding to the second target installation position is within a predetermined range. Repeat the process of.

When the position of the feature point calculated from the measurement by the second sensor 71 is within the predetermined range (step S30: Yes), the controller causes the transfer robot 270 to install the substrate S on the substrate attachment / detachment mechanism 29 (step S34). Then, the controller controls the substrate attachment / detachment mechanism 29 so that the substrate S is attached to the substrate holder 11 (step S36), and ends this process. Alternatively, the transfer robot 270 may directly deliver the substrate S to the second holding member 400 of the substrate holder 11. As described above, in the present embodiment, the feature points of the substrate S are measured by the second sensor 71, the arrangement of the substrate S is adjusted based on the measurement result, and the substrate S is attached to the substrate holder 11. As a result, even if the substrate S is warped or the substrate S is a transparent substrate and the substrate alignment cannot be performed based on the external shape using a camera, the substrate S can be placed at an appropriate position in the substrate holder 11. Can be retained, and the subsequent processing can be performed more preferably.

On the other hand, in step S28, if the error between the coordinates (xb0, yb0) and the inclination angle θb calculated from the measurement by the second sensor 71 and the reference value corresponding to the second target installation position is out of the permissible range ( Step S28: No), the controller determines that the position of the feature point on the substrate S is abnormal, and proceeds to the predetermined error determination processing (step S38). Again, in the determination of step S28, the arrangement of the substrate S is adjusted in advance based on the calculated value from the measurement by the first sensor 61. Therefore, when the position of the feature point measured by the second sensor 71 is significantly deviated from the place where the feature point should be formed (reference value at the second target installation position), the controller of the substrate S. It is determined that an abnormality has occurred in the substrate S, such as a large deviation in the pattern or a chipped outer shape of the substrate S. By such a determination, the abnormality of the substrate S can be accurately determined. As an abnormality determination process when it is determined that an abnormality has occurred in the substrate S, for example, the controller cassettes the substrate S (by controlling the substrate processing device 100) without performing subsequent processing on the substrate S. Return to 25a. Alternatively, the substrate S may be transported to a predetermined location different from the normal transport location. Further, the abnormality determination process may include notifying an abnormality such as issuing an alarm in the substrate processing device 100 or transmitting an abnormality signal from the substrate processing device 100 to the outside. As a result, the administrator of the substrate processing apparatus 100 and the like can recognize that the abnormality of the substrate S has been determined. If the pattern of the substrate S is significantly deviated, it can be considered that the product is defective in many cases. According to this embodiment, a defective substrate can be excluded from the production line without plating. Further, when the pattern of the substrate S is deviated, if the alignment of the substrate is performed with reference to the feature point, the position of the substrate itself is adjusted with a large displacement. In that case, there is a possibility that the substrate S rides on the substrate holder 11 or the contacts of the substrate holder 11 do not come into contact with each other at the correct position, and the substrate S cannot be properly held by the substrate holder 11. According to this embodiment, it is possible to avoid the problem due to the deviation of the pattern of the substrate S, align the substrate with reference to the feature point, and hold the substrate S in the substrate holder 11.

(Second Embodiment)
FIG. 15 is a schematic view for explaining the arrangement adjustment of the substrate S in the second embodiment. In the substrate processing apparatus of the second embodiment, the first sensor and the second sensor 71 are provided in the substrate attachment / detachment mechanism 29. Specifically, in the second embodiment, a plurality of (two as an example) image sensors 161a and 161b are provided as the first sensor 161 fixedly to a frame (not shown) of the substrate attachment / detachment mechanism 29. Further, in the second embodiment, the first lighting device 162 (162a, 162b) is provided on the opposite side of the substrate S from the first sensor 161 (161a, 161b). In the example shown in FIG. 15, the first sensor 161 is provided above the substrate S, and the first lighting device 162 is provided below the substrate S. The first lighting device 62 is arranged so as to irradiate a corner portion of the substrate S from the side opposite to the first sensor 61. The first lighting device 162 is a backlight made of, for example, an LED. When the first sensor 161 irradiates the substrate S from the opposite side with the first lighting device 162 at the time of photographing the corner portion of the substrate S, the background of the substrate S becomes white and the outline of the substrate S can be clarified.

The first lighting device 62 is configured to be movable between a shooting position, which is a position corresponding to the first sensor 61, and a retracted position moved outward from the shooting position. This is because the robot hand 272 does not interfere with the transport path of the substrate S to the second holding member 400. As a mechanism for moving the first lighting device 62, a mechanism using various power sources such as a motor, a solenoid, or a pneumatic actuator can be adopted.

FIG. 16 is an explanatory diagram illustrating the imaging positions of the first sensor 161 and the second sensor 71 in the second embodiment. Here, since the imaging position of the second sensor 71 is the same as that of the first embodiment, the description thereof will be omitted. As shown in FIG. 16, the center C1 of the imaging unit (for example, the lens) of the first sensor 161 is rotated by 90 ° or 180 ° from the assumed position (target installation position or target installation position) in a plan view. The first sensor 161 is provided so as to be arranged at a position displaced inward by a predetermined distance Δx, Δy in the x, y direction from the corners P1, P3 of the substrate S placed at the position). That is, the center C1 of the first sensors 161a and 161b corresponds to the position inside the substrate S rather than the position of the corner (vertex) of the substrate S. According to this configuration, the first sensor 161 can capture a wider range in the vicinity of the corners P1 and P3 of the substrate S, and can improve the detection accuracy of the position of the corner. For example, a longer range of two adjacent sides (adjacent two sides (L1-L4, L2-L3)) can be photographed at each corner, and the positions of the corners P1 and P3 as the revolutions of the two adjacent sides can be photographed. It is possible to improve the calculation accuracy and the calculation accuracy of the rotation angle θ of the substrate S calculated from the inclination of at least one of the two adjacent sides. The distance for displacing the center C1 of the first sensors 161a and 161b inside the substrate S may be different for each sensor. Further, the center C1 of the imaging unit may be displaced inward only for some sensors. In other embodiments, the center C1 of the imaging unit of some or all of the first sensors 161 may coincide with the position of the corners of the substrate in plan view, or may match the position of the corners of the substrate rather than the position of the corners of the substrate. It may be on the outside of. In the example shown in FIG. 16, the imaging position of the first sensor 161 is near the corner where the alignment mark 73 is provided, but the present invention is not limited to such an example. Further, in the second embodiment, the imaging positions of the first sensor 161 and the second sensor 71 are different, but at least a part of them may overlap.

In the second embodiment, the controller detects the position and inclination θa of the side by image processing from the image information around the corner imaged by the first sensor 161. The controller may perform image processing on the entire imaging area by the first sensor 161 in order to detect the position and inclination θa of the side, or the area near the assumed position of the side (area 161a1 in FIG. 16). ) May be image-processed. Further, as an example, the controller calculates the intersection of two adjacent sides as the position of the corner of the substrate S. By calculating the position of the corner as the intersection of two adjacent sides, the position of the corner can be accurately calculated even when there is an R in the corner or the position of the apex is not clear. Then, the controller calculates the center position (xa0, ya0) of the substrate S based on the calculated corner position.

Next, the arrangement adjustment of the substrate S in the second embodiment will be described with reference to the flowchart. FIG. 17 is a flowchart showing an example of the process of adjusting the arrangement of the substrate S in the second embodiment. In FIG. 17, the same reference numerals are given to the same processes as those in the first embodiment shown in FIG. Hereinafter, the description overlapping with the processing in the first embodiment will be omitted.

The process shown in FIG. 17 is started when the substrate S is conveyed to the substrate attachment / detachment mechanism 29 by the robot hand 272. First, the controller transfers the substrate S to a predetermined position of the substrate attachment / detachment mechanism 29 by the transfer robot 270 (step S12A). The transfer robot 270 is preliminarily adjusted so as to transfer the substrate S to an assumed position (first target installation position) in the substrate attachment / detachment device 290. In step S12A, the substrate S remains held by the hand of the transfer robot 270. Subsequently, the controller measures the outer shape of the substrate S with the first sensor 161 (step S16). Further, the controller may move the first lighting device (backlight) 162 from the retracted position to the photographing position prior to the process of step S16, and illuminate the corner portion of the substrate S with the first lighting device 162. Subsequently, the controller confirms whether or not the outer shape of the substrate S is within the reference range (step S18), and determines that the outer shape of the substrate S is out of the reference range, as in the first embodiment. Executes the abnormality determination processing (step S38). When the controller determines that the outer shape of the substrate S is within the reference range, the controller targets the position of the substrate S based on the calculated coordinates (xa0, ya0) using the first sensor 161 and the rotation angle θa. The position of the substrate S is adjusted by the transfer robot 270 so as to be within a predetermined range with respect to the installation position (first target installation position) (steps S20 and S22A). Here, the first target installation position can be the same as the target installation position of the substrate S in the substrate attachment / detachment mechanism 29, that is, the second target installation position. However, the present invention is not limited to these examples, and the first target installation position may be a position different from the second target installation position. In this way, by detecting the outer shape of the substrate S by the first sensor 161 and adjusting the arrangement of the substrate S based on the detection result, the arrangement of the substrate S can be adjusted accurately.

Then, when the arrangement of the substrate S is adjusted based on the detection by the first sensor 161, the controller adjusts the arrangement of the substrate S based on the detection by the second sensor 71 as in the first embodiment (steps S26 to S26 to). S32). As a result, the substrate S can be held by the substrate holder 11 at a portion more suitable for the pattern formed on the substrate S (step S36), and the subsequent processing can be performed more preferably. The controller photographs the first lighting device 162 after adjusting the arrangement of the substrate S based on the detection by the first sensor 161 or after adjusting the arrangement of the substrate S based on the detection by the second sensor 71. It is good to move from the position to the retracted position.

(Third Embodiment)
FIG. 18 is a schematic view illustrating the arrangement adjustment of the substrate S in the third embodiment. In the substrate processing apparatus of the third embodiment, the first sensor 61 and the second sensor 71 are provided in the substrate arrangement adjusting mechanism 26. Although the second lighting device 72 is not shown in FIG. 18, the substrate arrangement adjusting mechanism 26 may be provided with the second lighting device 72 for the second sensor 71. In the third embodiment, the controller adjusts the arrangement of the substrate S by the handling stage 265 based on the measurement of the outer shape of the substrate S by the first sensor 61, as in the first embodiment. Then, the controller adjusts the arrangement of the substrate S by the handling stage 265 based on the detection of the feature points by the second sensor 71. Also in such a third embodiment, since the substrate S is subsequently arranged on the substrate attachment / detachment device 290 by the transfer robot 270, it is more suitable for the pattern formed on the substrate S as in the first and second embodiments. The substrate S can be held by the substrate holder 11 at the site. In the third embodiment, the second sensor 71 may be provided only in the loading board arrangement adjusting mechanism 26A and not in the unloading board arrangement adjusting mechanism 26B.

(Modification example)
In the first to third embodiments described above, as an example of the substrate processing apparatus, a plating apparatus for immersing the substrate S in the plating solution has been described. However, the substrate processing apparatus is not limited to such a plating apparatus, and for example, an apparatus that performs surface treatment of a substrate by pouring a processing liquid such as a plating solution onto the substrate may be used. Such an apparatus may include a plurality of linearly arranged treatment units such as a water washing treatment unit, a desmear treatment unit, and an electroless plating treatment unit. Further, the substrate processing apparatus is not limited to the plating apparatus, and may be any other apparatus such as a plating apparatus, a polishing apparatus, a grinding apparatus, a film forming apparatus, and an etching apparatus.

In the first to third embodiments, the alignment is finally performed based on the position of the feature point measured by the second sensor 71. However, the detection of the feature points by the second sensor 71 may be used only for detecting the deviation of the pattern of the substrate S, and the positioning of the substrate S with respect to the substrate holder may be performed only by detecting the outer shape by the first sensor. Even in this case, the defective substrate can be excluded from the production line without plating.

The present embodiment described above can also be described as the following embodiment. [Form 1] According to Form 1, a substrate processing apparatus is proposed, and the substrate processing apparatus includes a substrate holder for holding a substrate, a substrate attachment / detachment mechanism for attaching the substrate to the substrate holder, and an outer shape of the substrate. The first sensor for detecting the arrangement of the substrate, the second sensor for detecting the feature points formed in advance on the plate surface of the substrate, and the arrangement of the substrate are adjusted based on the above. It has an arrangement adjusting mechanism and a control unit, the control unit controls the arrangement adjustment mechanism so as to adjust the arrangement of the substrate based on the detection by the first sensor, and the control unit controls the arrangement adjustment mechanism. The second sensor is controlled so as to detect the feature points formed in advance on the plate surface of the substrate whose arrangement is adjusted based on the detection by the first sensor, and the control unit is detected by the second sensor. After confirming whether or not the position of the feature point is within the permissible range, the control unit detects the feature point detected by the second sensor when the position of the feature point is within the permissible range. The arrangement adjustment mechanism is controlled so as to adjust the arrangement of the substrate based on the above, and the control unit attaches the substrate to the substrate holder after adjusting the arrangement of the substrate based on the detection by the second sensor. As described above, the substrate attachment / detachment mechanism is controlled.
According to the first embodiment, the substrate can be accurately positioned and held with respect to the substrate holder.

[Form 2] According to the second form, in the first form, when the position of the feature point detected by the second sensor is out of the permissible range, the control unit sets the substrate different from the holder. Transport to a location. According to the second embodiment, it is possible to sort the substrates whose feature point positions are out of the permissible range.

[Form 3] According to the third form, in the first or second form, when the size of the substrate obtained from the detection by the first sensor is out of the predetermined reference range, the control unit uses the substrate as the substrate holder. Is transported to a different predetermined place. According to the third embodiment, the substrates whose dimensions are outside the predetermined reference range can be sorted.

[Form 4] According to the fourth form, in the second or third form, there is a cassette for accommodating the substrate and a substrate transport device for transporting the substrate accommodated in the cassette to the arrangement adjustment mechanism. However, the predetermined place is the cassette. According to the fourth embodiment, the substrate can be sorted into cassettes.

[Form 5] According to the fifth form, in the first to fourth forms, the arrangement adjusting mechanism includes a first arrangement adjusting mechanism for adjusting the arrangement of the substrate based on the detection by the first sensor, and the second arrangement adjusting mechanism. It includes a second arrangement adjusting mechanism for adjusting the arrangement of the substrate based on the detection by the sensor.

[Form 6] According to Form 6, in Form 5, the second arrangement adjusting mechanism is a substrate carrier that holds and conveys the substrate between the first arrangement adjusting mechanism and the substrate attachment / detachment mechanism. ..

[Form 7] According to Form 7, in Forms 1 to 5, the arrangement adjusting mechanism includes a substrate carrier that holds and conveys the substrate.

[Form 8] According to Form 8, in Form 6 or 7, the second sensor is provided in the substrate attachment / detachment mechanism, and the control unit detects the feature point of the substrate held by the substrate carrier. The second sensor is controlled so as to do so. According to the eighth embodiment, the arrangement of the substrate can be adjusted immediately before the substrate is attached to the substrate holder by the substrate attachment / detachment mechanism.

[Form 9] According to Form 9, in Forms 1 to 8, the arrangement adjusting mechanism has a stage configured to allow horizontal movement and / or rotational movement of the mounted substrate. According to the ninth aspect, the arrangement of the substrate can be adjusted by using the stage.

[Form 10] According to Form 10, the first sensor is a laser sensor. As the laser sensor, in particular, a sensor in which a plurality of laser light emitting elements and light receiving elements are arranged on a line can be used.

[Form 11] The substrate processing apparatus according to any one of claims 1 to 10, wherein the second sensor is an image sensor. As the image sensor, for example, a black-and-white camera or a color camera can be adopted.

[Form 12] According to the form 12, in the first to eleventh forms, the control unit notifies an abnormality when the position of the feature point detected by the second sensor is out of the permissible range. According to the morphology 12, it is possible to notify that the position of the feature point is determined to be out of the permissible range.

[Form 13] According to Form 13, a substrate holder for holding a substrate, a substrate attachment / detachment mechanism for attaching the substrate to the substrate holder, and an arrangement adjustment mechanism configured to adjust the arrangement of the substrates are provided. A substrate processing method for a substrate processing apparatus including A first arrangement adjustment step that controls the arrangement adjustment mechanism so as to adjust the arrangement, and a second detection that detects feature points formed in advance on the plate surface of the substrate whose arrangement has been adjusted in the first arrangement adjustment step. It is confirmed whether or not the position of the feature point detected in the step and the second detection step is within the permissible range, and if the position of the detected feature point is within the permissible range, the second detection step is performed. A second arrangement adjustment step for controlling the arrangement adjustment mechanism so as to adjust the arrangement of the substrate based on the detection by the above, and a substrate attachment / detachment mechanism for attaching the substrate to the substrate holder after the second arrangement adjustment step. Includes a board mounting step to control.
According to the thirteenth aspect, the substrate can be accurately positioned and held with respect to the substrate holder.

Although some embodiments of the present invention have been described above, the above-described embodiments of the present invention are for facilitating the understanding of the present invention and do not limit the present invention. The present invention can be modified and improved without departing from the spirit thereof, and it goes without saying that the present invention includes an equivalent thereof. In addition, any combination or omission of the claims and the components described in the specification is possible within the range in which at least a part of the above-mentioned problems can be solved, or in the range in which at least a part of the effect is exhibited. Is.

11 ... Board holder 25 ... Cassette table 25a ... Cassette 26 ... Board placement adjustment mechanism 261 ... Board temporary stand 265 ... Handling stage (first placement adjustment mechanism)
27 ... Substrate transfer device 270 ... Transfer robot (second arrangement adjustment mechanism)
270a ... Controller 28 ... Travel mechanism 29 ... Board attachment / detachment mechanism 290 ... Board attachment / detachment device 32 ... Pre-wet tank 33 ... Pre-soak tank 34 ... Pre-rinse tank 35 ... Blow tank 36 ... Rinse tank 37 ... Board holder transfer device 38 ... Overflow tank 39 ... Plating tank 50 ... Cleaning device 50a ... Cleaning unit 61, 61A to 61E ... First sensor 62a ... Floodlight 62b ... Receiver 71, 71a, 71b ... Second sensor 72, 72a, 72b ... Second lighting device 100 ... Board processing device 110 ... Unloading unit 120 ... Processing unit 120A ... Pre-processing / post-processing unit 120B ... Processing unit 161, 161a, 161b ... First sensor 162, 162a, 162b ... First lighting device 175 ... Controller 175A ... CPU
175B ... Memory 175C ... Control unit 271 ... Robot body 272, 273 ... Robot hand

Claims (13)

A board holder for holding the board and
A board attachment / detachment mechanism for attaching the board to the board holder,
A first sensor for detecting the arrangement of the board based on the outer shape of the board, and
A second sensor for detecting feature points formed in advance on the plate surface of the substrate, and
An arrangement adjustment mechanism configured to adjust the arrangement of the board,
Has a control unit,
The control unit controls the arrangement adjusting mechanism so as to adjust the arrangement of the substrate based on the detection by the first sensor.
The control unit controls the second sensor so as to detect feature points formed in advance on the plate surface of the substrate whose arrangement has been adjusted based on the detection by the first sensor.
The control unit confirms whether or not the position of the feature point detected by the second sensor is within the permissible range, and confirms whether or not the position is within the permissible range.
When the position of the feature point detected by the second sensor is within the permissible range, the control unit adjusts the arrangement of the substrate based on the detection by the second sensor. Control and
The control unit adjusts the arrangement of the substrate based on the detection by the second sensor, and then controls the substrate attachment / detachment mechanism so as to attach the substrate to the substrate holder.
Board processing equipment. The substrate processing apparatus according to claim 1, wherein the control unit conveys the substrate to a predetermined place different from the holder when the position of the feature point detected by the second sensor is out of the permissible range. .. The control unit according to claim 1 or 2, wherein when the size of the substrate obtained from the detection by the first sensor is out of the predetermined reference range, the control unit conveys the substrate to a predetermined place different from the substrate holder. Board processing equipment. A cassette for accommodating the substrate and
A substrate transfer device for transporting the substrate housed in the cassette to the arrangement adjustment mechanism, and
Have,
The predetermined place is the cassette.
The substrate processing apparatus according to claim 2 or 3. The arrangement adjusting mechanism includes a first arrangement adjusting mechanism for adjusting the arrangement of the substrate based on the detection by the first sensor, and a first arrangement adjusting mechanism for adjusting the arrangement of the substrate based on the detection by the second sensor. 2. The substrate processing apparatus according to any one of claims 1 to 4, which includes an arrangement adjusting mechanism. The substrate processing device according to claim 5, wherein the second arrangement adjustment mechanism is a substrate transfer machine that holds and conveys the substrate between the first arrangement adjustment mechanism and the substrate attachment / detachment mechanism. The substrate processing apparatus according to any one of claims 1 to 5, wherein the arrangement adjusting mechanism includes a substrate carrier that holds and conveys the substrate. The second sensor is provided in the substrate attachment / detachment mechanism.
The control unit controls the second sensor so as to detect the feature point of the substrate held by the substrate carrier.
The substrate processing apparatus according to claim 6 or 7. The substrate processing apparatus according to any one of claims 1 to 8, wherein the arrangement adjusting mechanism has a stage configured to allow horizontal movement and / or rotational movement of the mounted substrate. The substrate processing apparatus according to any one of claims 1 to 9, wherein the first sensor is a laser sensor. The substrate processing apparatus according to any one of claims 1 to 10, wherein the second sensor is an image sensor. The substrate processing apparatus according to any one of claims 1 to 11, wherein the control unit notifies an abnormality when the position of the feature point detected by the second sensor is out of the permissible range. A substrate processing method in a substrate processing apparatus including a substrate holder for holding a substrate, a substrate attachment / detachment mechanism for attaching the substrate to the substrate holder, and an arrangement adjustment mechanism configured to adjust the arrangement of the substrates. There,
The first detection step of detecting the arrangement of the substrate based on the outer shape of the substrate, and
A first arrangement adjustment step that controls the arrangement adjustment mechanism so as to adjust the arrangement of the substrate based on the detection by the first detection step.
A second detection step for detecting feature points formed in advance on the plate surface of the substrate whose arrangement has been adjusted in the first arrangement adjustment step, and a second detection step.
It is confirmed whether or not the position of the feature point detected in the second detection step is within the permissible range, and if the position of the detected feature point is within the permissible range, the detection by the second detection step is performed. A second arrangement adjustment step that controls the arrangement adjustment mechanism so as to adjust the arrangement of the substrate based on
After the second arrangement adjustment step, a board mounting step that controls the board attachment / detachment mechanism so that the board is mounted on the board holder,
Substrate processing method including.

Images