JP2021109010A - Base material for endosseous implant material, endosseous implant material and method for producing base material for endosseous implant material - Google Patents

Abstract

To provide a base material for an endosseous implant material which can enhance adhesive strength of a bone material such as hydroxyapatite formed on a surface of a metal base material, an endosseous implant material having the same, and a method for producing the base material for the endosseous implant material.SOLUTION: A base material 10 for an endosseous implant material includes a metal base material 11, and a fine crystal layer 12. The metal base material 11 contains titanium or a titanium alloy. The fine crystal layer 12 is provided on at least a part of a surface of the metal base material 11, and contains a fine crystal of titanium or a titanium alloy. In the base material 10 for the endosseous implant material, a crystallite size of the fine crystal layer 12 is 4.0×10-5 mm or less.SELECTED DRAWING: Figure 4

Description

The present invention relates to a base material for an intraosseous implant material, an intraosseous implant material having the same, and a method for producing a base material for an intraosseous implant material.

Intraosseous implant materials are used as medical biomaterials such as artificial bones, artificial joint materials, artificial teeth, and artificial tooth roots. Such an intraosseous implant material can be used in a form similar to that of a natural bone or tooth by joining or transplanting it to the remaining bone or the like when the bone or tooth is lost. ..

As the base material of such an intraosseous implant material, a metal material such as titanium having a high affinity with a living body is used. In addition, some intraosseous implant materials have a metal base material such as titanium coated with a calcium phosphate compound such as hydroxyapatite (also referred to as HAp). HAp is the main component of bones and teeth and has high biocompatibility, so it has been widely used as a medical biomaterial in recent years.

Patent Document 1 discloses a calcium phosphate compound-coated composite material that can be used as an intraosseous implant material for artificial bones, teeth, tooth roots, and the like. This calcium phosphate compound-coated composite material forms a calcium phosphate compound layer on a metal base material via a calcium titanate / amorphous carbon composite layer.

JP-A-2007-75486

By forming a calcium phosphate compound layer on the metal base material via an intermediate layer such as a calcium titanate / amorphous carbon composite layer, the metal base material and the calcium phosphate compound are firmly adhered and peeled off. It can be suppressed. However, even when the intermediate layer as described above is provided, the adhesive force between the bone material such as hydroxyapatite formed on the metal base material and the metal base material may be insufficient. For example, if there is a portion on the surface of the metal base material where the intermediate layer is not formed, the adhesion strength between the bone material and the metal base material is lowered.

Therefore, in the present invention, a base material for an intraosseous implant material capable of increasing the adhesion strength of an bone material such as hydroxyapatite formed on the surface of a metal base material, an intraosseous implant material having the same, and an intraosseous implant material. It is an object of the present invention to provide a method for producing a base material for use.

The base material for an intraosseous implant material according to one aspect of the present invention is provided on a metal base material containing titanium or a titanium alloy and at least a part of the surface of the metal base material, and is made of the titanium or the titanium alloy. It includes a fine crystal layer containing fine crystals. In this base material for an intraosseous implant material, the crystallite size of the fine crystal layer is 4.0 × ^10-5 mm or less.

According to the above configuration, since ^{the fine crystal layer having a crystallite size of 4.0 × 10-5} mm or less is provided, an intermediate layer containing calcium titanate or the like is provided on the base material for the intraosseous implant material. Can be formed on one side (that is, without exposed areas). As a result, the adhesion strength of the bone material layer such as hydroxyapatite formed on the intermediate layer can be increased.

Further, the intraosseous implant material according to the other aspect of the present invention has the base material for the intraosseous implant material according to the above-mentioned one aspect of the present invention. In this intraosseous implant material, at least a part of the surface of the fine crystal layer is provided with an intermediate layer containing calcium titanate and an bone material layer containing a calcium phosphate compound and laminated on the intermediate layer. ing.

According to the above configuration, an intermediate layer can be interposed between the fine crystal layer and the bone material layer. As a result, it is possible to obtain an intraosseous implant material in which the bone material layer is difficult to peel off.

Further, the method for producing a base material for an intraosseous implant material according to another aspect of the present invention is a method for producing a base material for an intraosseous implant material having a metal base material containing titanium or a titanium alloy. This production method includes a step of forming a fine crystal layer of titanium or a titanium alloy by subjecting at least a part of the surface of the metal base material to a shot peening treatment.

According to the above manufacturing method, by applying a shot peening treatment to at least a part of the surface of the metal substrate, fine crystals ^{having a crystallite size of 4.0 × 10-5 mm or less are applied to the treated region.} Layers can be formed. By forming the bone material layer on the base material for the intraosseous implant material provided with such a fine crystal layer via an intermediate layer containing calcium titanate or the like, the adhesion strength of the bone material layer can be enhanced. .. As a result, it is possible to obtain an intraosseous implant material in which the bone material layer is difficult to peel off.

According to the base material for an intraosseous implant material according to one aspect of the present invention, the adhesion strength of the bone material such as hydroxyapatite formed on the base material can be increased by providing the fine crystal layer. .. Further, according to the method for producing a base material for an intraosseous implant material according to another aspect of the present invention, ^{a fine crystal layer having a crystallite size of 4.0 × 10-5} mm or less can be formed. By forming the intraosseous implant material from the base material for the intraosseous implant material, it is possible to obtain the intraosseous implant material in which the bone material layer is difficult to peel off.

It is sectional drawing which shows the structure of the base material for an intraosseous implant material which concerns on one Embodiment of this invention. It is sectional drawing which shows the structure of the intraosseous implant material which concerns on one Embodiment of this invention. It is sectional drawing which shows the structure of the intermediate obtained in the process of manufacturing the intraosseous implant material shown in FIG. 2 from the base material for an intraosseous implant material shown in FIG. It is a schematic diagram which shows the manufacturing process of the intraosseous implant material which concerns on one Embodiment of this invention. It is a schematic diagram which shows the manufacturing process of the intraosseous implant material which concerns on a comparative example. It is an SEM photograph which photographed the state of the intermediate layer of the intraosseous implant material of Example 1-1. It is an SEM photograph which photographed the state of the intermediate layer of the intraosseous implant material of Example 2-1. It is an SEM photograph which photographed the state of the intermediate layer of the intraosseous implant material of Comparative Example 1. It is an SEM photograph which photographed the state of the intermediate layer of the intraosseous implant material of the comparative example 2.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, the base material 10 for an intraosseous implant material, which is an example of the base material for an intraosseous implant material according to the present invention, will be described as an example. Further, in the present embodiment, the intraosseous implant material 20, which is an example of the intraosseous implant material according to the present invention, will be described as an example.

(Composition of base material for intraosseous implant material)
The base material 10 for an intraosseous implant material is used as a material for an intraosseous implant material used as a biomaterial such as an artificial bone. FIG. 1 shows a cross-sectional structure of the base material 10 for an intraosseous implant material. The base material 10 for an intraosseous implant material has a metal base material 11 and a fine crystal layer 12. The fine crystal layer 12 is laminated on the metal base material 11.

The metal base material 11 is made of a metal material containing titanium or a titanium alloy. Specifically, the metal base material 11 is formed of pure titanium (Ti) or a titanium alloy such as a Ti-6Al-4V alloy. Since the metal base material 11 is made of such a metal material, it can maintain a stable state in the living body. The shape of the metal base material 11 can be appropriately changed depending on the use of the base material 10 for the intraosseous implant material. The shape of the metal base material 11 can be, for example, a plate shape, a rod shape, or the like. The thickness of the metal base material 11 can be, for example, 0.5 to 5.0 mm or more.

The fine crystal layer 12 contains fine crystals of titanium or a titanium alloy forming the metal base material 11. As will be described later, the fine crystal layer 12 is formed by subjecting the surface of the metal base material 11 to a shot peening treatment. The fine crystal layer 12 may be formed in the entire surface region of the metal substrate 11, or may be formed in a predetermined region on the surface of the metal substrate 11. Here, the predetermined region is, for example, a region for forming the bone material layer 14 in the step of manufacturing the intraosseous implant material from the base material 10 for the intraosseous implant material.

In this fine crystal layer 12, the crystallite size of the metal is 4.0 × ^10-5 mm (400 Å) or less. The crystallite size referred to here means an average value of crystallite sizes of fine crystals formed per unit area.

Since the crystallite size of the fine crystal layer 12 is 4.0 × 10 ^-5 mm or less, the intermediate layer 13 containing calcium titanate is placed on the fine crystal layer 12 on one surface (that is, without exposed parts or It can be formed (all over). As a result, the adhesion strength of the bone material layer 14 laminated on the intermediate layer 13 can be increased.

Further, when the crystallite size of the fine crystal layer 12 is 4.0 × 10 ^-5 mm or less, the surface of the metal base material 11 is activated, so that the bone component can be easily adhered onto the fine crystal layer 12. can do.

The lower limit of the crystallite size of the fine crystal layer 12 is not particularly limited, but may be, for example, 1.0 × ^10-5 mm (100 Å).

The thickness of the fine crystal layer 12 can be, for example, in the range of 8 μm or more and 50 μm or less. By performing the shot peening treatment described later, the fine crystal layer 12 having a layer thickness in such a numerical range can be formed.

As described above, the base material 10 for an intraosseous implant material according to the present embodiment includes a metal base material 11 and a fine crystal layer 12. The metal base material 11 contains titanium or a titanium alloy. The fine crystal layer 12 is provided on at least a part of the surface of the metal base material 11, and contains fine crystals of titanium or a titanium alloy. In the base material 10 for an intraosseous implant material, the crystallite size of the fine crystal layer 12 is 4.0 × ^10-5 mm or less.

An intermediate layer 13 containing calcium titanate or the like can be formed on one surface (that is, so that there is no exposed portion) on the fine crystal layer 12 having a crystallite size of 4.0 × ^{10-5 mm or less.} As a result, the adhesion strength of the bone material layer 14 such as hydroxyapatite formed on the intermediate layer 13 can be increased.

(Composition of intraosseous implant material)
Subsequently, the configuration of the intraosseous implant material 20 will be described. The intraosseous implant material 20 is used as a biomaterial such as artificial bone. The intraosseous implant material 20 can be produced from the base material 10 for the intraosseous implant material.

FIG. 2 shows the cross-sectional structure of the intraosseous implant material 20. The intraosseous implant material 20 has a metal base material 11, a fine crystal layer 12, an intermediate layer 13, and an bone material layer 14.

The metal base material 11 and the fine crystal layer 12 have the same configurations as the metal base material 11 and the fine crystal layer 12 constituting the base material 10 for an intraosseous implant material. That is, the intraosseous implant material 20 has the base material 10 for the intraosseous implant material as a part of the composition.

The intermediate layer 13 _{contains calcium titanate (CaTIO 3} ). The intermediate layer 13 containing calcium titanate is formed on the base material 10 for an intraosseous implant material. That is, the intermediate layer 13 is provided so as to cover the fine crystal layer 12 provided on the surface of the base material 10 for the intraosseous implant material.

The bone material layer 14 contains a calcium phosphate compound. Here, examples of the calcium phosphate compound include hydroxyapatite (Ca ₁₀ (PO ₄ ) ₆ (OH) ₂ ) (HAp), tricalcium phosphate (Ca ₃ (PO ₄ ) ₂ ) and the like. Among these, the calcium phosphate compound is preferably HAp.

The bone material layer 14 is laminated on the intermediate layer 13.

The intermediate layer 13 may be formed in the entire surface region of the fine crystal layer 12, or may be formed in a predetermined region on the surface of the fine crystal layer 12. Here, the predetermined region is a region where the bone material layer 14 is formed later.

That is, it is preferable to form at least the intermediate layer 13 in the region where the bone material layer 14 is formed. As a result, in the intraosseous implant material 20, the intermediate layer 13 can always be present between the fine crystal layer 12 and the bone material layer 14, and the adhesion of the bone material layer 14 can be enhanced. can.

(Material for intraosseous implant material and method for manufacturing intraosseous implant material)
Subsequently, a method for manufacturing the base material 10 for the intraosseous implant material and the intraosseous implant material 20 will be described. FIG. 4 shows in order the manufacturing process of the base material 10 for the intraosseous implant material and the intraosseous implant material 20.

First, a base material 10 for an intraosseous implant material, which is a material for the intraosseous implant material 20, is manufactured. A metal base material 11 is prepared for producing the base material 10 for an intraosseous implant material. The metal base material 11 is obtained by molding a metal material containing titanium or a titanium alloy into a predetermined shape. More specifically, the metal base material 11 can be formed of pure titanium (Ti) or a titanium alloy such as a Ti-6Al-4V alloy.

Shot peening treatment is applied to at least a part of the surface of the metal base material 11. Shot peening treatment is a kind of surface modification treatment for metal materials. In the shot peening process, innumerable small abrasive grains (shots) of steel or non-ferrous metal are collided with the metal material to be processed at high speed by centrifugal force or air pressure. As a result, it is possible to impart durability against metal fatigue, work hardening due to plastic deformation, compressive residual stress, and the like to the metal material to be treated.

By performing such a shot peening treatment, the structure of the surface layer portion of the metal base material 11 is changed (specifically, the crystal grains of the metal are made finer), and the metal material contained in the metal base material 11 (that is, that is, A fine crystal layer 12 of titanium or a titanium alloy) is formed on the surface layer portion. As a result, the base material 10 for the intraosseous implant material is obtained (see step “1” in FIG. 4). The shot peening treatment may be performed on the entire surface of the metal base material 11 or only on a predetermined region on the surface of the metal base material 11. When the shot peening treatment is performed on a predetermined region, the fine crystal layer 12 is formed only in the region.

Examples of the abrasive grains used in the shot peening treatment include glass, zirconia, and stainless steel. The size of the abrasive grains can be, for example, 65 μm or more and 850 μm or less. The crystallite size of the fine crystal layer 12 can be appropriately adjusted by changing the material of the base material to be treated and the shot peening conditions (for example, abrasive grain size, abrasive grain material, processing mound pressure, processing time, etc.). Is.

Next, the obtained base material 10 for an intraosseous implant material is subjected to hydrothermal treatment. Before the hydrothermal treatment, the cleaning treatment may be performed using an organic solvent such as acetone or ethanol, water or the like.

In one example of hydrothermal treatment, a compound-containing solution obtained by dissolving a compound such as calcium nitrate, triethyl phosphate, EDTA, and potassium hydroxide in water is used. The compound-containing solution and the base material 10 for an intraosseous implant material are placed in a closed container and heated. The heating temperature at this time is not particularly limited, but is preferably 160 ° C. or higher and 250 ° C. or lower, more preferably 170 ° C. or higher and 230 ° C. or lower, and further preferably 180 ° C. or higher and 220 ° C. or lower. The temperature rising time in the hydrothermal treatment is not particularly limited, but is preferably 6 hours or more and 20 hours or less, more preferably 8 hours or more and 16 hours, from the viewpoint that the intermediate layer 13 covers the entire surface of the base material. It is less than or equal to, more preferably 10 hours or more and 14 hours or less. The reaction time in the hydrothermal treatment is not particularly limited, but is preferably 7 hours or more and 19 hours or less, and more preferably 9 hours or more and 15 hours or less, from the viewpoint that the intermediate layer 13 covers the entire surface of the base material. It is more preferably 11 hours or more and 13 hours or less.

_{By performing this hydrothermal treatment, an intermediate layer 13 containing calcium titanate (CaTIO 3} ) is first formed on the surface of the base material 10 for an intraosseous implant material (see step “2” in FIG. 4). The intermediate layer 13 is formed when the temperature of the compound-containing solution is relatively low (for example, 180 ° C. or lower). The base material 10 for an intraosseous implant material in this state is called an intermediate 10a. FIG. 3 shows the cross-sectional structure of the intermediate 10a. As shown in FIG. 3, the intermediate 10a has an intermediate layer 13 formed on one surface (without exposed parts and without any areas) on the fine crystal layer 12. That is, the entire fine crystal layer 12 is covered with the intermediate layer 13.

Then, in the latter half of the hydrothermal treatment (that is, after the temperature of the compound-containing solution rises to, for example, 180 ° C. or higher), an bone material layer 14 containing a calcium phosphate compound such as HAp is formed on the intermediate layer 13, and the bone is formed. The internal implant material 20 is obtained (see step “3” in FIG. 4).

Here, for comparison, FIG. 5 shows a manufacturing process of the intraosseous implant material 920 using a conventional manufacturing method. In the production method shown in FIG. 5, shot peening treatment is not performed on the surface of the metal base material 11, and hydrothermal treatment is performed on the metal base material 11 that does not have the fine crystal layer 12. As a result, calcium titanate crystals (CaTIO ₃ crystals) 913 are formed on the metal base material 11. The base material 910 for the intraosseous implant material in this state is called an intermediate 910a.

As shown in FIG. 5, in the intermediate 910a, the CaTIO ₃ crystal 913 is not formed on the entire surface of the metal base material 11, and there are exposed parts of the metal base material 11 in some places. That is, the CaTIO ₃ crystal 913 is formed in a state of having unevenness on the surface of the metal base material 11.

After that, the bone material layer 14 containing a calcium phosphate compound such as HAp is formed on the metal base material 11 on which _{the CaTIO 3 crystal 913 is formed.} As a result, the intraosseous implant material 920 is obtained (see step “3” in FIG. 5).

In this intraosseous implant material 920, CaTIO ₃ crystals 913 are not formed in places on the metal base material 11, and exposed parts of the metal base material 11 are present. When the bone material layer 14 is formed on the metal base material 11 in such a state, the bone material layer 14 may be peeled off from a portion where _{the CaTIO 3 crystal 913 is not formed.}

On the other hand, according to the method for producing a base material for an intraosseous implant material according to the present embodiment, a fine crystal layer 12 is formed on the surface layer portion of the metal base material 11 by subjecting the surface of the metal base material 11 to a shot peening treatment. can do. By providing the fine crystal layer 12, the intermediate layer 13 to be formed later can be formed on one surface (that is, without an exposed portion). Then, by forming the bone material layer 14 on the intermediate layer 13 formed on one surface, the adhesion of the bone material layer 14 can be enhanced. As a result, it is possible to obtain an intraosseous implant material in which the bone material layer 14 is difficult to peel off.

〔Example〕
In this example, an intraosseous implant material was produced using the following two types of metal materials as the metal base material.
(Metal base material used)
Example 1: Pure titanium (length 15 mm x width 15 mm x thickness 1 mm)
Example 2: Ti-6Al-4V alloy (length 15 mm x width 15 mm x thickness 1 mm)

(Manufacturing method of intraosseous implant material)
1. 1. Surface Treatment Shot peening treatment was performed on the metal substrates of Examples 1 and 2 described above. For the shot peening treatment, abrasive grains of two kinds of materials, glass and zirconia, were used. In addition, the abrasive grains used were of two sizes, large and small.

In Examples 1-1 and 2-1 large-sized glass beads were used as abrasive grains. In Examples 1-2 and 2-2, small-sized glass beads were used as abrasive grains. In Examples 1-3 and 2-3, large-sized zirconia beads were used as abrasive grains. In Examples 1-4 and 2-4, small-sized zirconia beads were used as abrasive grains.

2. Cleaning process 1. The metal substrate of each example to which the surface treatment of the above was performed was subjected to ultrasonic cleaning treatment. In this cleaning treatment, acetone, ethanol, and pure water were used as solvents. Then, each solvent was ultrasonically cleaned for 5 minutes.

3. 3. Hydrothermal treatment 1. The metal base material of each example to which the surface treatment of the above was performed was subjected to hydrothermal treatment according to the following procedure to form an intermediate layer of calcium titanate and an aggregate layer of HAp.

109.58 g of calcium nitrate, 68.12 g of triethyl phosphate, 135.68 g of EDTA, and 207.84 g of potassium hydroxide were dissolved in 2000 g of pure water, and a synthetic solution (compound-containing solution) of the intermediate layer and the bone material layer was dissolved. ) Was prepared. This synthetic solution and the metal base material of each example were placed in a pressure-resistant reaction vessel having a Teflon (registered trademark) inner cylinder vessel and heated to 200 ° C. The temperature rising time at this time was 12 hours. Further, after raising the temperature to 200 ° C., the temperature was maintained at this temperature for 12 hours.

By the above treatment, an intraosseous implant material was produced from the metal base material of each example.

(Comparison example)
For comparison, an intraosseous implant material was produced using a metal base material formed of the following two types of metal materials without performing a shot peening treatment.
(Metal base material used)
Comparative Example 1: Pure titanium (length 15 mm x width 15 mm x thickness 1 mm)
Comparative Example 2: Ti-6Al-4V alloy (length 15 mm x width 15 mm x thickness 1 mm)

(Manufacturing method of intraosseous implant material)
Above 1. Intraosseous implant materials were produced from the metal substrates of Comparative Examples 1 and 2 by the same method as in each example except that the surface treatment of the above was not performed.

(Evaluation of intraosseous implant materials in Examples and Comparative Examples)
1. 1. XRD measurement For the metal substrates of each example and each comparative example before hydrothermal treatment, an X-ray diffractometer (XRD) (manufactured by Rigaku Co., Ltd., model: SmartLab 9 kW) was used to scan at a scan speed of 4.00 deg / min. The surface condition was evaluated under the condition of step 0.0100 deg. Specifically, the crystallite size of the fine crystal layer formed on the metal substrate was measured.

2. SEM observation The intraosseous implant materials of each Example and each Comparative Example after hydrothermal treatment were immersed in a 3.5% aqueous hydrochloric acid solution to remove the bone material layer and expose the intermediate layer. Then, using a scanning electron microscope (SEM) (manufactured by KEYENCE CORPORATION, model: VE-8800), the crystal state _{of the intermediate layer (CaTIO 3) in the intraosseous implant material of each example was observed under the condition of a voltage of 15 kV.} did.

FIG. 6 shows an SEM photograph (1000 times) of the state of the intermediate layer of the intraosseous implant material of Example 1-1. FIG. 7 shows an SEM photograph (1000 times) of the state of the intermediate layer of the intraosseous implant material of Example 2-1.

FIG. 8 shows an SEM photograph (1000 times) of the intermediate layer of the intraosseous implant material of Comparative Example 1. FIG. 9 shows an SEM photograph (1000 times) of the state of the intermediate layer of the intraosseous implant material of Comparative Example 2.

Table 1 below summarizes the results of Examples 1-1 to 1-4 and Comparative Example 1. In addition, Table 2 below summarizes the results of Examples 2-1 to 2-4 and Comparative Example 2.

In Tables 1 and 2, the criteria for evaluating the fine crystallization of the surface of the metal substrate are as follows.
〇: Crystallite size is 4.0 × ^10-5 mm or less.
X: The crystallite size is larger than ^{4.0 × 10-5 mm.}

Further, in Tables 1 and 2, the evaluation criteria for the coating state of the intermediate layer are as follows.
〇: There are no exposed parts of the metal base material, and the intermediate layer is entirely covered.
X: There is unevenness in the formed portion of the intermediate layer, and there is an exposed portion of the metal base material.

From the above results, in the intraosseous implant material according to each example, a fine crystal layer having ^{a crystallite size of 4.0 × 10-5 mm or less is formed on the metal substrate by performing the shot peening treatment.} It was confirmed that it was done. On the other hand, in the intraosseous implant material of each comparative example not subjected to the shot peening treatment, it was confirmed that ^{the crystallite size on the surface of the metal base material greatly exceeded 4.0 × 10-5 mm.} Was done. That is, it was confirmed that no fine crystal layer was formed in the intraosseous implant material according to each comparative example.

Further, it was confirmed that in the intraosseous implant material according to each example, an intermediate layer can be formed on the metal base material without any exposed portion. For example, the intra-osseous implant material according to Example 1-1, it was confirmed that the intermediate layer formed of CaTiO ₃ crystal is formed on one surface (see FIG. 6). Similarly, the intra-osseous implant material according to Example 2-1, it was confirmed that the intermediate layer formed of CaTiO ₃ crystal is formed on one surface (see FIG. 7).

The _{intermediate layer formed of CaTIO 3} crystals greatly contributes to the adhesion strength between the metal base material and the bone material layer. Therefore, in the intraosseous implant member according to each embodiment in which the intermediate layer is formed on the entire surface of the metal base material, the adhesion strength between the metal base material and the bone material layer is improved.

On the other hand, in the intraosseous implant material according to Comparative Example 1, it was confirmed that an exposed portion (for example, a portion surrounded by a broken line in FIG. 8) in which an intermediate layer was not formed was formed in some places (for example, a portion surrounded by a broken line in FIG. 8). (See FIG. 8). Similarly, in the intraosseous implant material according to Comparative Example 2, it was confirmed that an exposed portion (for example, a portion surrounded by a broken line in FIG. 9) in which an intermediate layer was not formed was formed in some places (FIG. 9). reference). As described above, _{in a state where the intermediate layer formed of the CaTIO 3} crystal is unevenly formed (that is, there is an exposed portion of the base material), the bone material layer is likely to be peeled off from the exposed portion. Therefore, the stability of the adhesion strength between the metal base material and the bone material layer is lowered.

From the above results, it is considered that the intraosseous implant material according to each example has a structure in which the intermediate layer and the bone material layer formed on the intermediate layer are less likely to be peeled off as compared with the intraosseous implant material according to the comparative example. I can say.

As described above, it was confirmed that the intraosseous implant material according to each example can enhance the adhesion strength of the intermediate layer and the bone material layer formed on the intermediate layer.

It should be considered that the embodiments disclosed this time are exemplary in all respects and not restrictive. The scope of the present invention is shown by the scope of claims rather than the above description, and it is intended to include all modifications within the meaning and scope equivalent to the scope of claims. In addition, a configuration obtained by combining the configurations of different embodiments described in the present specification with each other is also included in the scope of the present invention.

10: Base material for intraosseous implant material 11: Metal base material 12: Fine crystal layer 13: Intermediate layer 14: Bone material layer 20: Intraosseous implant material

Claims (3)

With a metal substrate containing titanium or a titanium alloy,
It is provided on at least a part of the surface of the metal base material, and includes a fine crystal layer containing fine crystals of the titanium or the titanium alloy.
The crystallite size of the fine crystal layer is 4.0 × ^10-5 mm or less.
Substrate for intraosseous implant material. An intraosseous implant material having the base material for the intraosseous implant material according to claim 1.
At least a part of the surface of the fine crystal layer
An intermediate layer containing calcium titanate and
An intraosseous implant material containing a calcium phosphate compound and provided with an bone material layer laminated on the intermediate layer. A method for producing a base material for an intraosseous implant material having a metal base material containing titanium or a titanium alloy.
A method for producing a base material for an intraosseous implant material, which comprises a step of forming a fine crystal layer of titanium or a titanium alloy by subjecting at least a part of the surface of the metal base material to a shot peening treatment.

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