JP2021105699A - Wavelength conversion member, light emitting device and manufacturing method for wavelength conversion member - Google Patents

Abstract

To provide a wavelength conversion member capable of reducing the possibility that peeling from a heat radiation component of a wavelength conversion layer may occur, a manufacturing method for the wavelength conversion member, and a light emitting device.SOLUTION: A wavelength conversion member comprises: a heat radiation component with a screw hole; a wavelength conversion layer arranged on the heat radiation component, having a heat conductive part and a phosphor-containing part in contact with the heat conductive part, and having a through hole; and a screw. The wavelength conversion layer is screwed and fixed to the heat radiation component by the screw fitted in the through hole and the screw hole. A light emitting device comprises the wavelength conversion member, and a light source that irradiates the phosphor-containing part of the wavelength conversion member with light.SELECTED DRAWING: Figure 1A

Description

The present disclosure relates to a wavelength conversion member, a light emitting device, and a method for manufacturing the wavelength conversion member.

Conventionally, a light emitting device using a semiconductor light emitting element has been known. In such a light emitting device, a structure has been proposed in which a heat radiating member is thermally connected to a wavelength conversion member having a phosphor layer to be irradiated with light (see, for example, Patent Documents 1 and 2).

Japanese Unexamined Patent Publication No. 2011-028972 Japanese Unexamined Patent Publication No. 2016-058624

However, depending on the fixed form of the heat radiating member and the wavelength conversion member, peeling of both may occur.
The present disclosure has been made in view of the above problems, and of the wavelength conversion member, the light emitting device, and the wavelength conversion member capable of reducing the possibility of peeling of the wavelength conversion layer having a phosphor-containing portion from the heat radiating component. It is an object of the present invention to provide a manufacturing method.

The present application includes the following inventions.
(1) Heat dissipation parts with screw holes and
A wavelength conversion layer arranged on the heat radiating component, having a heat conductive portion and a phosphor-containing portion in contact with the heat conductive portion, and having through holes.
Equipped with screws,
A wavelength conversion member in which the wavelength conversion layer is screwed and fixed to the heat radiating component by the through hole and the screw fitted in the screw hole.
(2) A light emitting device including the wavelength conversion member described above and a light source that irradiates the phosphor-containing portion of the wavelength conversion member with light.
(3) A step of forming a wavelength conversion layer by integrally sintering the heat conductive portion and the phosphor-containing portion in contact with the heat conductive portion.
The step of forming a through hole in the wavelength conversion layer and
The process of preparing heat-dissipating parts with screw holes and
A method for manufacturing a wavelength conversion member, which comprises a step of fitting a screw into the through hole and the screw hole of the heat radiating component and fixing the wavelength conversion layer with a screw.

According to the wavelength conversion member, the light emitting device, and the method for manufacturing the wavelength conversion member described above, it is possible to reduce the possibility that the wavelength conversion layer is peeled off from the heat radiating component.

It is a schematic plan view which shows the structure of the wavelength conversion member of Embodiment 1 of this invention. FIG. 3 is a schematic cross-sectional view taken along the line IB-IB of FIG. 1A. It is schematic cross-sectional view which shows the modification of the wavelength conversion member of Embodiment 1. FIG. It is schematic cross-sectional view which shows another modification of the wavelength conversion member of Embodiment 1. FIG. It is a schematic plan view which shows the structure of the wavelength conversion member of Embodiment 2 of this invention. FIG. 2 is a schematic cross-sectional view taken along the line IIB-IIB of FIG. 2A. It is a schematic plan view which shows the structure of the wavelength conversion member of Embodiment 3 of this invention. FIG. 3A is a schematic cross-sectional view taken along the line IIIB-IIIB of FIG. 3A. It is a schematic plan view which shows the structure of the wavelength conversion member of Embodiment 4 of this invention. FIG. 6 is a schematic cross-sectional view taken along the line IVB-IVB of FIG. 4A. It is a schematic perspective view which shows the structure of the light emitting device of Embodiment 5 of this invention. It is a schematic perspective view which shows the manufacturing method of the wavelength conversion member of FIG. 3A. It is a schematic plan view which shows the manufacturing method of the wavelength conversion member of FIG. 3A. It is a schematic cross-sectional view in the line VIIB-VIIB of FIG. 7A. It is a schematic plan view which shows another manufacturing method of the wavelength conversion member of FIG. 3A of this invention. FIG. 6 is a schematic cross-sectional view taken along the line VIID-VIID of FIG. 7C. It is a schematic plan view which shows the manufacturing method of the wavelength conversion member of FIG. 4A. It is a schematic cross-sectional view in line VIIIB-VIIIB of FIG. 8A. It is a schematic plan view which shows another manufacturing method of the wavelength conversion member of FIG. 3A. 9 is a schematic cross-sectional view taken along the line IXB-IXB of FIG. 9A. It is a schematic plan view which shows another manufacturing method of the wavelength conversion member of FIG. 3A. FIG. 5 is a schematic cross-sectional view taken along the line XB-XB of FIG. 10A. FIG. 3 is a schematic cross-sectional view showing another manufacturing method of the wavelength conversion member of FIG. 3A. FIG. 3 is a schematic cross-sectional view showing another manufacturing method of the wavelength conversion member of FIG. 3A.

Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the embodiments described below are for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. The size and positional relationship of the members shown in each drawing may be exaggerated for the sake of clarity. Further, the members using the same names as the other embodiments in each embodiment represent the same or corresponding members. Unless otherwise specified, such members may use the materials, sizes, and the like mentioned in other embodiments.

Embodiment 1: Wavelength conversion member 10
The wavelength conversion member 10 of the first embodiment includes, for example, a heat radiating component 11, a wavelength conversion layer 14, and a screw 15, as shown in FIGS. 1A and 1B. The heat radiating component 11 has a screw hole 11a. The wavelength conversion layer 14 has a heat conductive portion 12 and a phosphor-containing portion 13. The heat conductive portion 12 is arranged on the heat radiating component 11. The phosphor-containing portion 13 is arranged in contact with the heat conductive portion 12. The wavelength conversion layer 14 has a through hole 14a. The screw 15 is fitted into the through hole 14a and the screw hole 11a, and the wavelength conversion layer 14 is screwed and fixed to the heat radiating component 11 by the screw 15.
As described above, the wavelength conversion member 10 has a configuration in which the heat conductive portion 12 and the phosphor-containing portion 13 are mechanically fixed to the heat radiating component 11 by screws. As a result, even if there is a difference in the coefficient of thermal expansion between the heat conductive portion 12, the phosphor-containing portion 13 and the heat radiating component 11, it is possible to reduce the possibility that the thermal expansion of each of these members affects the fixing strength. If these members are fixed by an adhesive, a bonding layer, or the like, the coefficient of thermal expansion of each member when the heat generated by irradiating the phosphor-containing portion 13 with light and the cooling by stopping the irradiation are repeated. Due to the difference, cracks may occur in the adhesive, the bonding layer, and the like. Since it is fixed by screws instead of being fixed by an adhesive or a bonding layer, the fixing strength does not decrease due to such cracks, so that the phosphor-containing portion 13 may be detached from the heat conductive portion 12. Can be reduced. Further, since there is no other member such as an adhesive or a bonding layer between the phosphor-containing portion 13 and the heat conductive portion 12, the phosphor-containing portion 13 has a phosphor-containing portion 13 when light is irradiated to the phosphor-containing portion 13. Since the heat generated can be dissipated directly to the heat conductive portion 12, efficient heat dissipation can be expected. As a result, it is possible to obtain a highly reliable wavelength conversion member 10.

[Wavelength conversion layer 14]
The wavelength conversion layer 14 is composed of a heat conductive portion 12 and a phosphor-containing portion 13. The wavelength conversion layer 14 may include members other than these. Since the wavelength conversion function of the wavelength conversion layer 14 is achieved by the presence of the phosphor-containing portion 13, the heat conduction portion 12 may be omitted. From the viewpoint of improving heat dissipation, it is preferable that the wavelength conversion layer 14 has not only the phosphor-containing portion 13 but also the heat conductive portion 12 that does not contain the phosphor. The heat conductive portion 12 and the phosphor-containing portion 13 are arranged so that the heat conductive portion 12 and the phosphor-containing portion 13 are in contact with each other in this order from the side of the heat radiating component 11 described later. preferable. As a result, efficient heat dissipation can be expected.
The wavelength conversion layer 14 is a direct bonding layer or an integrally sintered layer between the heat conductive portion 12 and the phosphor-containing portion 13. Here, the direct bonding layer refers to a layer bonded without using an adhesive, and is formed by various direct bonding methods. The integrally sintered layer refers to a layer in which sintered bodies (ceramics) are integrated without using an adhesive, and is formed by integrally sintering.

(Heat conduction part 12)
The heat conductive portion 12 may be a member that constitutes a part of the wavelength conversion layer 14 and can hold the phosphor-containing portion 13. The heat conductive portion 12 is preferably made of a heat-resistant material in consideration of the influence of heat generation of the phosphor-containing portion 13. Further, the heat conductive portion 12 is preferably formed of a material having a small difference in thermal expansion coefficient from the phosphor-containing portion 13. Further, the heat conductive portion 12 is preferably a light-reflecting member. As a result, the light in the phosphor-containing portion 13 is reflected by the heat conductive portion 12, and it is possible to prevent the main light from reaching the heat radiating component 11 from the phosphor-containing portion 13. As a result, it is possible to suppress a decrease in luminous efficiency due to light being absorbed by the heat radiating component 11.
The heat conductive portion 12 can be formed of, for example, a metal, ceramics, resin, glass, or a composite material including one or more of these. Among them, the heat conductive portion 12 is preferably formed of ceramics such as aluminum oxide, aluminum nitride, silicon nitride, and silicon carbide. As a result, a material that can be easily formed integrally with the phosphor-containing portion 13 and has a relatively high thermal conductivity can be used. The heat conductive portion 12 may be used as a light-reflecting material by, for example, containing a material having a higher refractive index than those materials as an additive in the ceramic material. Examples of the material having a high refractive index include those having a refractive index of 1.8 or more or 2.0 or more. The difference in refractive index from the ceramic material is, for example, 0.4 or more or 0.7 or more. Examples of the additive include voids filled with a gas such as air, titanium oxide, aluminum oxide, zirconium oxide, yttrium oxide, zirconium oxide, boron nitride, lutetium oxide, lanthanum oxide and the like.
Further, when the heat conductive portion 12 is made of ceramics, the light reflectivity and the heat conductivity can be controlled by adjusting the degree of the density of the internal voids. The density of the voids can be adjusted by changing the degree of pressing of the ceramic material. For example, it is preferable that there are relatively few voids below the phosphor-containing portion 13 in order to ensure heat dissipation. The voids can be recognized, for example, by observing the cross section of the object to be observed with a scanning electron microscope (SEM).

The heat conductive portion 12 may have a shape that can hold the phosphor-containing portion 13. Examples of the shape of the heat conductive portion 12 include a plate-shaped member having a flat surface. The heat conductive portion 12 has, for example, an upper surface, a lower surface, and a side surface, and the upper and lower surfaces thereof may be parallel to each other. Having parallel upper and lower surfaces facilitates attachment to other members constituting the wavelength conversion member 10. Further, as a result, the wavelength conversion member 10 can be easily attached to a light emitting device or the like, and the accuracy of light extraction or the like can be improved. The side surface of the heat conductive portion 12 may be perpendicular to the upper surface, may be inclined so as to spread outward or inward, or may be a curved surface.
The planar shape of the heat conductive portion 12 can be appropriately set depending on the shape of the light emitting device to be applied, and various shapes such as a polygon such as a circle, an ellipse, or a quadrangle can be mentioned. The size of the heat conductive portion 12 is, for example, 1 mm to 50 mm on one side or diameter in a planar shape.
Considering the strength, the thickness of the heat conductive portion 12 is, for example, 0.2 mm or more. The thickness of the heat conductive portion 12 is preferably 2.0 mm or less in order to suppress an increase in cost and thickness.
As shown in FIG. 1B, the upper surface of the heat conductive portion 12 may coincide with the lower surface of the phosphor-containing portion 13 described later.

(Fluorescent material-containing part 13)
The phosphor-containing portion 13 contains a phosphor. The phosphor-containing portion 13 is preferably made of a ceramic containing a phosphor or a single crystal of the phosphor. With such a configuration, the heat resistance is higher than that of the member using the resin containing a phosphor, so that it can be used for a relatively long period of time for laser light irradiation. For example, when ceramics is used as the phosphor-containing portion 13, a phosphor and _{a translucent material such as aluminum oxide (Al 2} O ₃ , melting point: about 1900 ° C to 2100 ° C) may be sintered. .. The content of the phosphor is 0.05% by volume to 50% by volume with respect to the total volume of the ceramics. Further, it may be obtained by sintering ceramics substantially composed of only a phosphor.
As the fluorescent substance contained in the fluorescent substance-containing portion 13, any fluorescent substance known in the art may be used. For example, cerium-activated yttrium aluminum garnet (YAG) phosphor, cerium-activated lutetium aluminum garnet (LAG) phosphor, europium-activated silicate phosphor, α-sialone phosphor, β-sialon. Examples thereof include phosphors and KSF phosphors. Of these, it is preferable to use a YAG phosphor, which is a phosphor having good heat resistance.

The phosphor-containing portion 13 may have a shape that allows all or part of the phosphor-containing portion 13 to be placed on the heat conductive portion 12. Examples of the shape of the phosphor-containing portion 13 include a plate-shaped member having a flat surface. For example, it may have a shape having an upper surface, a lower surface, and a side surface, and these upper and lower surfaces are parallel to each other. By having the parallel upper and lower surfaces, the distribution of the wavelength conversion light in the wavelength conversion member 10 can be made uniform. It is preferable that the entire lower surface of the phosphor-containing portion 13 is arranged on the upper surface of the heat conductive portion 12. As a result, the heat of the phosphor-containing portion 13 can be efficiently dissipated to the heat conductive portion 12. The side surface of the phosphor-containing portion 13 may be perpendicular to the upper surface thereof, or may be inclined so as to spread outward or inward.
The planar shape of the phosphor-containing portion 13 can be appropriately set depending on the shape of the light emitting device to be applied, and various shapes such as a polygon such as a circle, an ellipse, or a quadrangle can be mentioned. The phosphor-containing portion 13 may have a planar shape that is the same as or smaller than that of the heat conductive portion 12. The size of the phosphor-containing portion 13, for example, in a planar shape, has a side or diameter of 0.4 mm to 55 mm. Among them, it is preferable that the entire outer edge of the phosphor-containing portion 13 coincides with the outer edge of the heat conductive portion 12 or is arranged inside the outer edge of the heat conductive portion 12 in a plan view. Thereby, the entire lower surface of the phosphor-containing portion 13 can be arranged on the upper surface of the heat conductive portion 12.
Considering the physical strength, the thickness of the phosphor-containing portion 13 is, for example, 0.2 mm or more. The thickness of the phosphor-containing portion 13 is preferably 5.0 mm or less in order to suppress an increase in cost and height and to an appropriate degree of wavelength conversion.

(Through hole 14a)
The wavelength conversion layer 14 has a through hole 14a. The through holes 14a are formed in both the heat conductive portion 12 and the phosphor-containing portion 13 in FIGS. 1A and 1B. Further, the through hole 14a is formed in a region where the phosphor-containing portion 13 and the heat-conducting portion 12 are arranged, from the upper surface to the lower surface of the wavelength conversion layer 14, that is, from the upper surface of the phosphor-containing portion 13 to the lower surface of the heat-conducting portion 12. Is formed over. The through hole 14a may have the same cross-sectional shape from the top to the bottom, and may be widened in the entire length or a part of the through hole 14a from the top to the bottom, upward, downward, vertical, or central. It may have a diameter or an expanding shape. The through hole 14a accommodates, for example, the screw head of the screw 15 described later, and is screwed so that the upper surface of the wavelength conversion layer 14 and the screw head are flush with each other or on the heat radiation component 11 side of the upper surface of the wavelength conversion layer 14. It is preferable that the wavelength conversion layer 14 has a shape (FIG. 1B or the like) whose diameter is increased toward the upper surface in the vicinity of the upper surface so that the head can be accommodated. This makes it possible to prevent the screw head from hindering light extraction.
The number of through holes 14a can be arbitrarily set and may be one, but two or more are preferable. The shape of the through hole 14a includes various shapes such as a polygon such as a circle, an ellipse, or a quadrangle in a plan view, and a shape in which these are combined. The position of the through hole 14a can be arranged at an arbitrary position in a plan view. Above all, in the wavelength conversion layer 14, it is preferable to arrange the wavelength conversion layer 14 outside the region to be irradiated with light. The region to be irradiated with light is a region to be irradiated with excitation light that excites the phosphor of the phosphor-containing portion 13. The region to be irradiated with light can be made slightly larger than the size of the excitation light actually irradiated. The region to be irradiated with light can be appropriately set depending on the type of light source and the like, and the planar shape thereof includes various shapes such as a polygon such as a circle, an ellipse or a quadrangle. The region to be irradiated with light in the wavelength conversion layer 14, for example, regions of 0.4mm~2mm × 0.4mm~2mm, it includes areas of 0.16 mm ² to 4 mm ² in other words. Specifically, when the light for wavelength conversion is laser light, the size of one side or diameter can be 100 μm to 3000 μm. The through hole 14a can be arranged on the outer periphery of the wavelength conversion layer 14, for example. The outer circumference of the wavelength conversion layer 14 refers to a region that does not include the above-mentioned region for irradiating light, and examples thereof include a region from the outer edge of the wavelength conversion layer 14 to 20 mm.

The size of the through hole 14a can be appropriately set depending on the size of the screw to be used, the size of the wavelength conversion layer 14, the thickness, and the like. The size of the through hole 14a is, for example, one side or a diameter of the through hole 14a of 0.1 mm to 16 mm. One side or diameter of the through hole 14a may be 12 mm or less. As shown in FIG. 1C, the through hole 14a may have a size such that a gap is arranged between the through hole 14a and the screw 15 described later so that the cushioning material 16 can be embedded. By arranging the cushioning material 16 in this way, it is possible to reduce or avoid damage to the wavelength conversion layer due to the stress of screwing while fixing the wavelength conversion layer 14 to the heat radiating component 11 more firmly. The cushioning material 16 may be a material softer than the screw 15 and the wavelength conversion layer 14, and examples thereof include a resin.
The through hole 14a can be formed by a method known in the art. For example, sandblasting, etching, cutting, laser machining and the like can be mentioned. In addition to this, when the wavelength conversion layer 14 is formed of ceramics, the through holes can be easily formed into a desired shape and size by molding a material such as a green sheet before firing.

[Heat dissipation component 11]
The heat radiating component 11 is arranged below the wavelength conversion layer 14, that is, on the lower surface side of the heat conductive portion 12. Further, it is preferable that the heat radiating component 11 is arranged in contact with the lower surface of the heat conductive portion 12. Through such contact, the heat of the phosphor-containing portion 13 and the heat conductive portion 12 can be directly and efficiently dissipated to the heat radiating component 11.
Examples of the heat radiating component 11 include those made of a material having a better thermal conductivity than the material constituting the heat conductive portion 12. The heat radiating component 11 can be formed of a light-transmitting material, a light-reflecting material, or the like. Here, the translucency refers to a material capable of transmitting the light irradiated to the wavelength conversion member 10, for example, a material having a transmittance of 70% or more, a material having a transmittance of 80% or more, and a material having a transmittance of 90% or more. Things can be mentioned. When the heat conductive portion 12 and the heat radiating component 11 are formed of a translucent material, the excitation light can be taken out from the heat radiating component side. The heat radiating component 11 can be formed of, for example, metal, ceramics, a single crystal, or the like. Examples of the metal include copper, aluminum, a copper alloy, an aluminum alloy, and the like in consideration of high thermal conductivity. When the heat radiating component 11 is used as a light reflecting member, silver or the like may be used in order to increase the reflectance. An insulating material of ceramics such as aluminum nitride having a small coefficient of thermal expansion and a high thermal conductivity may be used. In this case, the surface may be coated with a metal material such as silver in order to increase the reflectance. Examples of the single crystal include sapphire and the like. The heat radiating component 11 may have a laminated structure of two or more layers, for example, as shown in FIG. 1D. As a result, light reflectivity, heat dissipation, and the like can be ensured by combining various materials. In FIG. 1D, a metal substrate 112 mainly made of a metal such as copper is arranged on the upper layer, that is, the side in contact with the lower surface of the heat conductive portion 12, and the heat sink 111 is arranged on the lower layer. Examples of the heat sink include those formed by using a metal such as copper, aluminum, a copper alloy, or an aluminum alloy as a main material. The heat sink alone may be used as the heat radiating component 11.

The heat radiating component 11 may have the same shape and size as the outer edge of the lower surface of the wavelength conversion layer 14, particularly the heat conductive portion 12, in a plan view, and may be slightly larger or smaller. Among them, it is preferable that the entire outer edge of the heat radiating component 11 is arranged outside the outer edge of the lower surface of the heat conductive portion 12 in a plan view.
The thickness of the heat radiating component 11 is, for example, 0.1 mm to 5 mm, preferably 0.3 mm to 3 mm. As a result, the strength of the heat radiating component 11 can be ensured, and the heat radiating property can be improved. Further, it is preferable that the volume of the heat radiating component 11 is larger than the volume of the wavelength conversion layer 14. As a result, the heat of the wavelength conversion layer 14 can be efficiently dissipated to the heat radiating component 11.
The heat radiating component 11 has a screw hole 11a. The screw holes 11a are for fixing the wavelength conversion layer 14 with screws, and the number, size, position, etc. of the through holes 14a of the wavelength conversion layer 14 are appropriately set according to the number, size, position, and the like. be able to. That is, when the wavelength conversion layer 14 is arranged at an appropriate position on the heat radiating component 11, the same size and the same number can be arranged at a position overlapping the through hole 14a of the wavelength conversion layer 14. When the cushioning material 16 is embedded between the through hole 14a and the screw 15, the size of the screw hole 11a is preferably smaller than the size of the through hole 14a. As a result, the screw hole 11a and the screw 15 can be more reliably aligned. For example, no cushioning material is arranged between the screw hole 11a and the screw 15. The depth of the screw hole 11a may be set as long as the screw can be inserted into the through hole 14a and the screw hole 11a and fixed, and can be appropriately set depending on the length of the screw or the like.
When the wavelength conversion layer 14 is screwed to the heat radiating component 11, a soft member such as heat radiating grease may be provided between the wavelength conversion layer 14 and the heat radiating component 11. By filling the gap with such a member, heat dissipation can be further improved. Further, by providing the soft member, the possibility that the wavelength conversion layer 14 and the like are cracked by thermal shock can be reduced.

[Screw 15]
The screw 15 is used for fixing the wavelength conversion layer 14 to the heat radiating component 11, and may be any as long as the wavelength conversion layer 14 can be fixed to the heat radiating component 11.
The length of the screw 15 can be appropriately set in a range longer than the total length of the through hole 14a in the wavelength conversion layer 14 and shorter than the total length of the total length and the depth of the screw hole 11a of the heat radiating component 11.
The thickness of the screw 15 can be set according to the size of the through hole 14a in the wavelength conversion layer 14 in a plan view and the size of the screw hole 11a in a plan view.
By fitting such a screw 15 into the through hole 14a and the screw hole 11a, the wavelength conversion layer 14 can be screwed and fixed to the heat radiating component 11. In such fixing, the wavelength conversion layer 14 is a heat radiating component as compared with a method of fixing the wavelength conversion layer and the heat radiating component by using a bonding layer such as eutectic bonding in which a eutectic metal is melted and bonded. It is considered that the possibility of peeling from 11 can be reduced. Even if there is a difference in the coefficient of thermal expansion between the wavelength conversion layer 14 and the heat radiating component 11, and even if the wavelength conversion layer 14 is subjected to a thermal cycle due to the irradiation of light and the stop of irradiation of light, the wavelength conversion layer 14 remains. The possibility of detaching from the heat radiating component 11 can be reduced. As a result, the heat generated in the wavelength conversion layer can be directly dissipated to the heat radiating component, so that efficient heat radiating and, by extension, the highly reliable wavelength conversion member 10 can be provided.
The screw 15 can be formed of a metal such as SUS, a ceramic such as aluminum nitride, or the like. When there is a possibility that the screw 15 is irradiated with light, for example, the screw 15 may be formed of a material that does not easily absorb the light irradiated to the wavelength conversion layer 14.

Embodiment 2: Wavelength conversion member 20
The wavelength conversion member 20 of the second embodiment includes, for example, a heat radiating component 11, a wavelength conversion layer 24, and a screw 15, as shown in FIGS. 2A and 2B.
The wavelength conversion layer 24 has a heat conductive portion 12 and a phosphor-containing portion 23. The entire lower surface of the phosphor-containing portion 23 is arranged in contact with the heat conductive portion 12, and the entire outer edge of the phosphor-containing portion 23 is arranged inside the outer edge of the heat conductive portion 12 in a plan view. ing. The phosphor-containing portion 23 can be arranged in a flat area of 50% to 90% of the flat area of the heat conductive portion 12. In this case, a part of the upper surface of the wavelength conversion layer 24 coincides with the entire lower surface of the phosphor-containing portion 23.
The wavelength conversion layer 24 has a through hole 24a, but the through hole 24a is arranged only in the portion of the heat conductive portion 12 where the phosphor-containing portion 23 is not arranged.
Other than the above-described configuration, it may have the same configuration as the wavelength conversion member of the first embodiment described above. Therefore, it has the same effect as the wavelength conversion member of the first embodiment described above.
Further, since the phosphor-containing portion 23 is not provided with a through hole for screwing, the phosphor-containing portion 23 is not loaded by screwing. Thereby, the possibility that the phosphor-containing portion 23 is damaged can be reduced. Further, by not providing the through hole in the phosphor-containing portion 23, the uniformity of the light extracted from the phosphor-containing portion 23 can be improved.
A plurality of phosphor-containing parts 23 may be arranged in one wavelength conversion member 20.

Embodiment 3: Wavelength conversion member 30
The wavelength conversion member 30 of the third embodiment includes, for example, a heat radiating component 11, a wavelength conversion layer 34, and a screw 15, as shown in FIGS. 3A and 3B.
The wavelength conversion layer 34 has a heat conductive portion 32 and a phosphor-containing portion 33. As shown in FIG. 3A, in a plan view, the entire outer edge of the phosphor-containing portion 33 is arranged inside the outer edge of the heat conductive portion 32. As shown in FIG. 3B, in a cross-sectional view, the entire lower surface of the phosphor-containing portion 33 is arranged in contact with the heat conductive portion 32, and the lower surface and side surfaces of the phosphor-containing portion 33 are heat. It is surrounded by a conductive portion 32 so as to be in contact with each other. In a plan view, the phosphor-containing portion 33 can be arranged in a flat area of 50% to 90% of the flat area of the heat conductive portion 32. The upper surface of the phosphor-containing portion 33 may be arranged below or above the upper surface of the heat conductive portion 32, but here, the upper surface of the phosphor-containing portion 33 and the upper surface of the heat conductive portion 32 coincide with each other. That is, the upper surface of the phosphor-containing portion 33 is flush with the upper surface of the heat conductive portion 32. The wavelength conversion layer 34 having such a shape can be obtained by integrally forming the phosphor-containing portion 33 and the heat conductive portion 32. In this case, for example, the maximum thickness of the heat conductive portion 32 can be 10 mm or less, and the minimum thickness can be 0.1 mm or more. It should be noted that the fact that their upper surfaces are flush with each other or coincide with each other means that the upper surfaces thereof are exactly on the same plane and within a range of 10% or less of the thickness of the phosphor-containing portion 33. It shall also include the state of being out of alignment with. The same applies to other embodiments.
The wavelength conversion layer 34 has a through hole 34a, but the through hole 34a is arranged only in the heat conductive portion 32 in which the phosphor-containing portion 33 is not arranged.
As described above, when the heat conductive portion 32 is made of ceramics, the light reflectivity and the heat conductivity can be controlled by adjusting the degree of the density of the internal voids. In the heat conductive portion 32, the density of the internal voids may be different depending on the portion. For example, the porosity (porosity) of the lower portion of the phosphor-containing portion 33 can be made lower than the porosity of the lateral portion of the phosphor-containing portion 33. As a result, heat dissipation can be improved below the phosphor-containing portion 33, and light reflectivity can be improved on the side of the phosphor-containing portion 33.
Other than the above-described configuration, it can have the same configuration as the wavelength conversion member of the second embodiment described above. Therefore, it has the same effect as the wavelength conversion member of the second embodiment described above.
Further, when the heat conductive portion 32 has light reflectivity, the emission of light in the lateral direction from the phosphor-containing portion 33 can be reduced or prevented, so that the light from the upper surface of the phosphor-containing portion 33 can be reduced or prevented. The extraction efficiency can be improved.

Embodiment 4: Wavelength conversion member 40
The wavelength conversion member 40 of the fourth embodiment includes, for example, a heat radiating component 11, a wavelength conversion layer 44, and a screw 15, as shown in FIGS. 4A and 4B.
The wavelength conversion layer 44 has a heat conductive portion 42 and a phosphor-containing portion 43. A plurality of phosphor-containing parts 43 are arranged in one wavelength conversion member 40. Each phosphor-containing portion 43 may have the same area as the area irradiated with light, or may have a larger area or a smaller area. Further, the planar shape of each phosphor-containing portion 43 can be various shapes as described above. The heat conductive portion 42 is arranged so as to surround each phosphor-containing portion 43. Therefore, in a plan view, the entire outer edge of each phosphor-containing portion 43 is arranged inside the outer edge of the heat conductive portion 42, respectively. As shown in FIG. 4B, in cross-sectional view, the heat conductive portion 42 is arranged so as to surround the side surface of each phosphor-containing portion 43.
The upper surface of the phosphor-containing portion 43 may be arranged above or below the upper surface of the heat conductive portion 42, but here, the upper surface of the phosphor-containing portion 43 and the upper surface of the heat conductive portion 42 coincide with each other. In this case, the maximum thickness of the heat conductive portion 42 can be 10 mm or less, and the minimum thickness can be 0.2 mm or more.
The wavelength conversion layer 44 has a through hole 44a, but the through hole 44a is arranged only in the heat conductive portion 42 in which the phosphor-containing portion 43 is not arranged.
The wavelength conversion member 40 of the fourth embodiment may have the same configuration as the wavelength conversion member of the third embodiment, except for the above-described configuration. Therefore, it has the same effect as the wavelength conversion member of the third embodiment described above. Further, in the wavelength conversion member 40 of the fourth embodiment, since a plurality of phosphor-containing parts 43 are arranged in one wavelength conversion member 40, one or more of these phosphor-containing parts 43 are made to emit light independently. Is possible.

Embodiment 5: Light emitting device 50
The light emitting device 50 of the fifth embodiment includes, for example, a wavelength conversion member 10 and a light source 60 that irradiates a phosphor-containing portion of the wavelength conversion member 10 with light.
In such a light emitting device 50, the light emitted from the light source 60 and passing through the wavelength conversion member 10 can be emitted to the outside through an optical member 52 capable of changing the desired light distribution or the like. Further, in order to incident the light emitted from the light source 60, for example, the laser light, at a specific angle, the spatial light modulator 53 may be arranged between the light source 60 and the wavelength conversion member 10.
With such a configuration, almost all of the main portion of the light from the light source 60 is incident on the wavelength conversion member 10 as designed. Then, a part of the light is wavelength-converted by the phosphor in the phosphor-containing portion of the wavelength conversion member 10, or the other part is reflected, and the light goes to the outside. These wavelength-converted light and light that has not been wavelength-converted are mixed and can be emitted to the outside as, for example, white light. Then, the heat radiating component arranged below the wavelength conversion layer effectively dissipates the heat generated by the light irradiation, and the function as a light emitting device can be maintained for a long period of time.

Examples of the light source 60 include a light emitting diode (LED) and a semiconductor laser element, or a device in which these are enclosed in a package or the like, and a semiconductor laser device is preferable. By using the semiconductor laser device, the area of the light incident surface of the phosphor-containing portion can be reduced as compared with the case of using the LED, so that the size of the light emitting device 50 can be reduced. In addition, the heat dissipation effect can be efficiently ensured by the heat conductive portion and the heat radiating component.
As the spatial light modulator 53, those known in the art such as MEMS (Micro Electro Mechanical Systems) can be used.

Embodiment 6: Manufacturing method of wavelength conversion member The manufacturing method of the wavelength conversion member of Embodiment 6 is a wavelength conversion layer by integrally sintering a heat conductive part and a phosphor-containing part in contact with the heat conductive part. The process of forming a through hole, the process of forming a through hole in the wavelength conversion layer, the process of preparing a heat radiation component having a screw hole, and the process of fitting a screw into the through hole and the screw hole to screw the wavelength conversion layer into the heat radiation component. Includes a step of stopping and fixing.
By such a manufacturing method, a wavelength conversion member capable of efficiently dissipating the heat of the wavelength conversion member to the heat radiating component by reducing the possibility of peeling of the wavelength conversion member from the heat radiating component is manufactured. The cost can be reduced and the product can be easily manufactured.

The steps of forming the wavelength conversion layer include a step of preparing the phosphor-containing portion having an upper surface, a lower surface and a side surface, and a step of preparing the phosphor-containing portion from an inorganic material laterally and below the phosphor-containing portion so as to surround the phosphor-containing portion. It is preferable to include a step of forming a molded body containing the powder and a step of integrally sintering the molded body.
Further, in this step, a through hole may be formed in the one piece in contact with the heat conductive portion and the heat conductive portion before sintering, and then sintered.
By such a method of manufacturing a wavelength conversion member, a heat conductive part and a phosphor-containing part are integrally formed without using an adhesive or a bonding layer, and they are mechanically fixed to heat-dissipating parts with screws. can do. Therefore, even if there is a difference in the coefficient of thermal expansion of each member, it is unlikely to affect the fixing strength. That is, the possibility that the phosphor-containing portion is separated from the heat conductive portion can be reduced. Further, since the heat generated by the phosphor-containing portion when the phosphor-containing portion is irradiated with light can be directly dissipated to the heat conductive portion, efficient heat dissipation can be expected. As a result, it is possible to obtain a highly reliable wavelength conversion member. Each step will be described in detail below.

[Preparation of wavelength conversion layer]
First, a wavelength conversion layer is prepared.
The wavelength conversion layer can be formed by sintering a material obtained by integrally molding a phosphor-containing portion made of a molded body such as ceramics and a material for a heat conductive portion of powder particles. Alternatively, it can be formed by sintering a material obtained by integrally molding a material of a phosphor-containing portion of powder particles and a heat conductive portion made of a molded product.
The molded body can be molded by using a slip casting method, a doctor blade method (sheet molding method), a dry molding method, or the like. For sintering, a discharge plasma sintering method (SPS method: spark plasma sintering method), a hot pressing sintering method (HPS method: hot pressing sintering method), or the like can be used. As these methods, for example, the methods described in JP-A-2017-149929 can be used. Further, CIP (Cold Isostatic Pressing), HIP (Hot Isostatic Pressing) and the like can be used for producing the phosphor-containing portion.

For example, the wavelength conversion layer can be produced by the following method or, for example, a method according to the description of JP-A-2019-9406.
(1) A fluorescent member containing a phosphor in which a plurality of convex portions are provided on the surface side is prepared, a powdery light reflecting member is prepared, and powdery light is prepared between the plurality of convex portions in the fluorescent member. A step of arranging the reflective members, a step of sintering them to obtain a sintered body (ceramics) in which the fluorescent member and the light reflecting member are integrally formed, and at least one of the front surface side and the back surface side of the fluorescent member. A manufacturing method including a step of removing a part of a sintered body from the side. In addition, instead of the powder-like light-reflecting member, a slurry containing a powder-like light-reflecting member may be used.
(2) A step of preparing a light reflecting member provided with a plurality of recesses on the surface side, preparing a powdered fluorescent member containing a phosphor, and arranging the powdered fluorescent member in the plurality of recesses of the light reflecting member. A step of sintering these to obtain a sintered body in which a light reflecting member and a fluorescent member are integrally formed, and a step of removing at least a part of the sintered body from the back surface side of the light reflecting member. Manufacturing method to have.
(3) A light reflecting member provided with a plurality of through holes penetrating the first main surface and the second main surface on opposite sides is prepared, and a powdery fluorescent member containing a phosphor is prepared, and a plurality of light reflecting members are prepared. A step of arranging a powdery fluorescent member in the through hole, a step of sintering these to obtain a sintered body in which the light reflecting member and the fluorescent member are integrally formed, and a step of obtaining a sintered body on the front surface side or the back surface side of the fluorescent member. A manufacturing method comprising a step of removing a part of a sintered body from at least one side of the above. The sintered body here means a sintered body in which a fluorescent member and a support are integrally sintered. Sintering can be performed in the temperature range of 1100 ° C to 1800 ° C. After obtaining the sintered body, heat treatment may be performed in a temperature range of 1000 ° C. to 1500 ° C. Examples of the method for removing a part of the sintered body include grinding, polishing, and chemical mechanical polishing.

The wavelength conversion layer may be manufactured by a method in which a plurality of phosphor-containing portions are first prepared and then a heat conductive portion surrounding them is formed by sintering. Specifically, when manufacturing the wavelength conversion layer 34 shown in FIG. 3A, first, as shown in FIG. 6, a plurality of phosphor-containing portions 33 having an upper surface, a lower surface, and a side surface are prepared. As the phosphor-containing portion 33, one molded from a material known in the art can be used. By preparing a plurality of wavelength conversion layers, a plurality of wavelength conversion layers can be manufactured by one sintering, so that mass productivity can be improved.
Next, as shown in FIGS. 7A and 7B, a support 36 is prepared in which one recess 31 is provided and a plurality of protrusions 35 corresponding to through holes are arranged in a matrix in the recess 31.
Then, the phosphor-containing portion 33 is arranged in the recess 31, and is made of an inorganic material for forming a heat conductive portion on the side and above of the phosphor-containing portion 33 so as to surround the phosphor-containing portion 33. The powder 322 is placed to form a molded product. The plurality of phosphor-containing portions 33 are arranged, for example, between a pair of protrusions 35. The powder 322 is arranged so as to surround the side surface of the protrusion 35.
Then, the molded product is integrally sintered by the method as described above.
Subsequently, the heat conductive portion 32 is divided together with the support 36 along the broken line X shown in FIGS. 7A and 7B to obtain one wavelength conversion layer 34. As a result, as shown in FIG. 3A, the heat conductive portion 32 is arranged around the phosphor-containing portion 33, and a wavelength conversion layer 34 having a through hole 34a and having a desired size can be obtained.
For the division, a method known in the art such as scribe, dicing and the like may be used. Further, the division is performed, for example, after removing the obtained sintered body (ceramics) from the support 36.

When one wavelength conversion layer is obtained, instead of the support 36 shown in FIGS. 7A and 7B, one recess 31 having a size corresponding to one wavelength conversion layer as shown in FIGS. 7C and 7D is used. A support 36A similar to the support 36 shown in FIGS. 7A and 7B may be used except that it has a pair of protrusions 35.
When the wavelength conversion layer 44 shown in FIGS. 4A and 4B is manufactured as the wavelength conversion layer, the support 46 shown in FIGS. 8A and 8B may be used instead of the support 36 shown in FIGS. 7A and 7B. .. Using this support 46, a plurality of fluorescent material-containing portions 43 are arranged between a pair of protrusions 45 in one recess 41, for example, eight at equal intervals, and are made of an inorganic material for forming a heat conductive portion. By arranging, sintering, and dividing the powder 422, the wavelength conversion layer 44 of a desired size in which the heat conductive portion 42 is arranged around the phosphor-containing portion 43 shown in FIGS. 4A and 4B is formed. Obtainable.

Further, as another method for manufacturing the wavelength conversion layer 34 shown in FIG. 3A, first, as shown in FIG. 6, a plurality of phosphor-containing portions 33 having an upper surface, a lower surface, and a side surface are prepared.
Next, as shown in FIGS. 9A and 9B, the phosphor-containing portions 33 are arranged in a matrix on the flat plate-shaped support member 80 and temporarily fixed. Considering workability, it is preferable to use the support member 80, but the support member 80 may not be used. In addition, in order to utilize the slip casting method (slurry casting molding method), for example, gypsum can be used as the support member 80.
Subsequently, as shown in FIGS. 10A and 10B, a molded product 38 containing a light-reflecting powder made of an inorganic material is formed so that the phosphor-containing portion 33 surrounds the sides and the upper side of the phosphor-containing portion 33. The molded body 38 can be molded by using a slip casting method, a doctor blade method (sheet molding method), a dry molding method, or the like. Before forming the molded body 38, a frame body may be formed in a region to be the outer periphery of the molded body 38, and the molded body 38 may be filled in the frame body and molded.
After that, the support member 80 is removed, and optionally, in order to remove organic substances and the like contained in the molded body 38, the molded body 38 is heated at a temperature lower than the sintering temperature to degreas.
Next, the molded body 38 is main-sintered in, for example, an air atmosphere, and the phosphor-containing portion 33 and the heat conductive portion 32 are integrally sintered.
FIG. 3A is obtained by arbitrarily polishing the heat conductive portion 32 from the heat conductive portion 32 side to make it thin, dividing it by the heat conductive portion 32, and forming a through hole in the heat conductive portion 32 by using, for example, a drill or the like. As shown in 3B, it is possible to obtain a wavelength conversion layer 34 having a desired size in which the heat conductive portion 32 is arranged around the phosphor-containing portion 33.

[Preparation of heat dissipation component 11]
As shown in FIG. 11A, a flat plate-shaped heat radiating component having a screw hole 11a is prepared as the heat radiating component 11. The screw hole 11a can be formed by a method known in the art, depending on the material of the heat radiating component. For example, a method using a drill or the like can be mentioned.

[Screw]
As shown in FIG. 11B, the wavelength conversion layer 34 is placed on the heat radiating component 11, the through hole 34a of the wavelength conversion layer 34 and the screw hole 11a of the heat radiating component 11 are aligned, and the through hole 34a and the screw hole 11a are formed. The screw 15 is fitted, and the wavelength conversion layer 34 is screwed and fixed to the heat radiating component 11.
At the time of screwing, heat-dissipating grease or the like may be arranged between the heat-dissipating component 11 and the wavelength conversion layer 34.
As a result, the entire lower surface of the heat conductive portion 32 can be brought into contact with the heat radiating component 11, and the wavelength conversion member 30 capable of efficiently drawing heat can be manufactured.
Further, as shown in FIG. 1C, after fitting the screw 15 into the screw hole 11a, the cushioning material 16 may be injected into the gap between the screw 15 and the wavelength conversion layer 14.

10, 20, 30, 40 Wavelength conversion member 11 Heat sink 11a Screw holes 12, 32, 42 Heat conduction parts 13, 23, 33, 43 Fluorescent material containing parts 14, 24, 34, 44 Wavelength conversion layers 14a, 24a, 34a , 44a Through hole 15 Thread 16 Cushioning material 31 Recess 35, 45 Protrusion 36, 36A Support 38 Molded body 41 Recess 46 Support 50 Light emitting device 52 Optical member 53 Spatial light modulator 60 Light source 80 Support member 111 Heat sink 112 Metal substrate 322 422 powder

Claims (12)

Heat dissipation parts with screw holes and
A wavelength conversion layer arranged on the heat radiating component, having a heat conductive portion and a phosphor-containing portion in contact with the heat conductive portion, and having through holes.
Equipped with screws,
A wavelength conversion member in which the wavelength conversion layer is screwed and fixed to the heat radiating component by the through hole and the screw fitted in the screw hole. The wavelength conversion member according to claim 1, wherein the wavelength conversion layer is a direct bonding layer or an integrally sintered layer between the heat conductive portion and the phosphor-containing portion. The wavelength conversion member according to claim 1 or 2, wherein the heat conductive portion is made of ceramics. The wavelength conversion layer has the heat conductive portion and the phosphor-containing portion in this order from the side of the heat radiating component.
The wavelength conversion member according to any one of claims 1 to 3, wherein the through holes are arranged in the phosphor-containing portion and the heat conductive portion. The invention according to any one of claims 1 to 3, wherein in a plan view, the outer edge of the phosphor-containing portion is arranged inside the outer edge of the heat conductive portion, and the through hole is arranged only in the heat conductive portion. Wavelength conversion member. The wavelength conversion according to claim 5, wherein the phosphor-containing portion and the heat conductive portion have upper surfaces, lower surfaces, and side surfaces, respectively, and the upper surface of the phosphor-containing portion is flush with the upper surface of the heat conductive portion. Element. The wavelength conversion member according to any one of claims 1 to 6, wherein the screw has a screw head, and the screw head is flush with the upper surface of the wavelength conversion layer or is closer to the heat radiating component side from the upper surface. The wavelength conversion member according to any one of claims 1 to 7, wherein the heat conductive portion is a light-reflecting member. The wavelength conversion member according to any one of claims 1 to 8, wherein the through hole has a gap between the screw and the screw, and a cushioning material is embedded in the gap. The wavelength conversion member according to any one of claims 1 to 9,
A light emitting device including a light source that irradiates the phosphor-containing portion of the wavelength conversion member with light. A step of forming a wavelength conversion layer by integrally sintering a heat conductive portion and a phosphor-containing portion in contact with the heat conductive portion, and
The step of forming a through hole in the wavelength conversion layer and
The process of preparing heat-dissipating parts with screw holes and
A method for manufacturing a wavelength conversion member, which comprises a step of fitting a screw into the through hole and the screw hole and screwing and fixing the wavelength conversion layer to the heat radiating component. The step of forming the wavelength conversion layer is
A step of preparing the phosphor-containing portion having an upper surface, a lower surface and a side surface, and
A step of forming a molded product containing a powder made of an inorganic material on the sides and below the phosphor-containing portion so as to surround the phosphor-containing portion.
The method for manufacturing a wavelength conversion member according to claim 11, which includes a step of integrally sintering the molded body.

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