JP2021091967A - Magnetron sputtering film forming device - Google Patents

Abstract

To provide a magnetron sputtering film forming device that can prevent a first rotary target and a second rotary target from becoming thin ununiformly in an axis direction, and can produce a sputtering film with uniform thickness in the axis direction.SOLUTION: The present disclosure provides a magnetron sputtering film forming device. In a first direction from a second axis A2 of a first rotary target 13 toward a first axis A1 of a film forming roll 52, a distance L1 from a first magnet portion 15 to the first rotary target 13 is longer toward one side of an axis A direction. In a second direction from a third axis A3 of a second rotary target 33 toward the first axis A1 of the film forming roll 52, a distance L2 from a second magnet portion 35 to the second rotary target 33 is longer toward the other side of the axis A direction.SELECTED DRAWING: Figure 2

Description

The present invention relates to a magnetron sputtering film forming apparatus.

Conventionally, there is known a dual type magnetron sputtering film forming apparatus in which two magnetron sputtering units adjacent to each other are arranged to face each other on a film forming roll (see, for example, Patent Document 1 below). Each of the two magnetron sputtering units comprises a rotary target and a magnet housed therein.

"Reactive Sputter Deposition", Published by Springer, p346, 2008

When the magnetron sputtering film forming apparatus of Non-Patent Document 1 is driven, the electron density in the vicinity of one end in the longitudinal direction of one rotary target becomes higher than the electron density in the vicinity of the middle portion in the longitudinal direction and the other end. On the other hand, the electron density near the other end in the longitudinal direction of the other rotary target is higher than the electron density near the middle and one end in the longitudinal direction.

The above phenomenon is peculiar to the dual type magnetron sputtering film forming apparatus, and the interaction of plasma generated for each target generates an asymmetrical and strongly inclined electric field inside the two targets arranged opposite to each other. Due to the fact that

Then, one end of the rotary target in the longitudinal direction has a higher frequency of collision with ions generated by electrons than the middle and other ends. Therefore, one end portion in the longitudinal direction of one rotary target is sputtered more than the middle portion and the other end portion of one rotary target, and thus becomes thinner. Then, since such one rotary target needs to be replaced at an early stage, there is a problem that the usage period of one rotary target is shortened. For other rotary targets as well, one end in the longitudinal direction of one rotary target is due to the high frequency of collisions between the other end in the longitudinal direction (the portion facing the region with high electron density) and the ions generated by the electrons. It causes the same trouble as the department.

Further, in the sputtering film manufactured by the magnetron sputtering film forming apparatus, the portion of one rotary target facing the longitudinal end portion is thicker than the portion facing the middle portion and the other end portion of the rotary target. As a result, there is a problem that the sputtering film having a uniform thickness in the axial direction cannot be obtained. The sputtering film facing the other rotary target also causes the same problems as the sputtering film facing the one rotary target described above.

Therefore, it is tentatively proposed that the magnet at one end of one magnetron sputtering unit is a magnet with a weak magnetic force, and the magnets at the middle and the other ends are magnets with a strong magnetic force (first tentative plan). It is also tentative to partially eliminate the magnet at one end of one magnetron sputtering unit (second tentative plan). For other magnetron sputtering units, the same tentative plan as above will be considered.

However, in the first tentative plan, a discontinuous portion of the magnetic force is generated at the boundary between magnets having different magnetic forces, so that the electron density becomes non-uniform, and the thickness of the sputtering film cannot be made uniform in the axial direction. is there. Further, in the second tentative plan, a non-uniform portion of the magnetic force is generated depending on the presence or absence of the magnet, so that the non-uniform electron density is generated, and by extension, the thickness of the sputtering film cannot be made uniform in the axial direction. is there.

The present invention provides a magnetron sputtering film forming apparatus capable of suppressing uneven thinning of the first rotary target and the second rotary target in the axial direction and producing a sputtering film having a uniform thickness in the axial direction. ..

In the present invention (1), the film forming roll, the first magnetron plasma unit which is arranged to face the film forming roll and extends along the axis of the film forming roll, and the first magnetron plasma unit which is arranged to face the film forming roll. The first magnetron plasma unit includes a second magnetron plasma unit that is arranged adjacent to the magnetron plasma unit and extends along the axis of the film forming roll, and the first magnetron plasma unit has a first axis extending in the same direction as the axis of the film forming roll. A rotary target, a first yoke arranged radially inside the first rotary target, and a first magnet portion arranged on the surface of the first yoke inside the first rotary target radially are provided. The second magnetron plasma unit includes a second rotary target whose axis extends in the same direction as the axis of the first rotary target, a second yoke arranged inside the second rotary target in the radial direction, and the second. A magnetron that is provided with a second magnet portion arranged on the surface of the second yoke inside the rotary target in the radial direction and satisfies at least one of the following conditions [1] to [3]. Includes sputtering film deposition equipment.

Condition [1]: In the first direction from the axis of the first rotary target to the axis of the film forming roll, the distance from the first magnet portion to the first rotary target is one of the axial directions of the film forming roll. The distance from the second magnet portion to the second rotary target is the axial direction of the film forming roll in the second direction from the axis of the second rotary target toward the axis of the film forming roll. Longer towards the other side.

Condition [2]: The first magnet portion becomes thinner toward one side in the axial direction of the film forming roll, and the second magnet portion becomes thinner toward the other side in the axial direction of the film forming roll.

Condition [3]: The first yoke becomes thinner toward one side in the axial direction of the film forming roll, and the second yoke becomes thinner toward the other side in the axial direction of the film forming roll.

This magnetron sputtering film forming apparatus satisfies at least one of the conditions [1] to [3].

Therefore, the collision frequency between the ion at one end in the axial direction of the first rotary target is the same as the collision frequency between the middle portion and the other end in the axial direction of the first rotary target and the ion. Further, the collision frequency with ions becomes uniform from the other end in the axial direction to one end of the first rotary target. Therefore, it is possible to prevent the first rotary target from being excessively thinned only at one end in the axial direction, and it is possible to prevent the first rotary target from being unevenly thinned along the axial direction.

Further, the collision frequency between the other end in the axial direction of the second rotary target and the ion is the same as the collision frequency between the intermediate portion and one end in the axial direction of the second rotary target and the ion. Further, the collision frequency with ions becomes uniform from one end to the other end in the axial direction. Therefore, it is possible to prevent only the other end of the second rotary target in the axial direction from becoming excessively thin, and it is possible to prevent the second rotary target from becoming unevenly thin in the axial direction.

Therefore, it is possible to prevent the both ends of the sputtering film from becoming extremely thick in the axial direction, and further, the thickness of the sputtering film can be made uniform over the axial direction.

In the present invention (2), the magnetic field strength between the first rotary target and the film forming roll decreases toward one side in the axial direction, and the magnetic field strength between the second rotary target and the film forming roll is high. Includes the magnetron sputtering film forming apparatus according to (1), which is lower toward the other side in the axial direction.

In this magnetron sputtering film forming apparatus, the magnetic field strength between the first rotary target and the film forming roll can further suppress the non-uniform thinning of the first rotary target in the axial direction. Further, since the magnetic field strength between the second rotary target and the film forming roll decreases toward the other side in the axial direction, it is possible to further suppress the second rotary target from becoming unevenly thin in the axial direction.

In the present invention (3), the condition [1] is satisfied, and the thickness of the first magnet portion and the thickness of the second magnet portion are the same over the axial direction of the film forming roll. The magnetron sputtering film forming apparatus according to (1) or (2), wherein the thickness of the first yoke and the thickness of the second yoke are the same over the axial direction of the film forming roll.

In this magnetron sputtering film forming apparatus, the first magnet portion having the same thickness in the axial direction is arranged in the first yoke having the same thickness in the axial direction.
Then, if these are arranged so as to be inclined with respect to the axis, the first magnetron plasma unit can be easily configured. Therefore, the simple structure of the first magnetron plasma unit can prevent one end of the first rotary target from becoming excessively thin in the axial direction, and can prevent the first rotary target from becoming unevenly thin in the axial direction.

Further, the second magnet portion having the same thickness in the axial direction is arranged in the second yoke having the same thickness in the axial direction. Then, if these are arranged so as to be inclined with respect to the axis, the second magnetron plasma unit can be easily configured. Therefore, the second magnetron plasma unit having a simple structure can prevent the other end of the second rotary target from becoming excessively thin in the axial direction, and can prevent the second rotary target from becoming unevenly thin in the axial direction. ..

The present invention (4) satisfies the condition [1] and the condition [2], the distance from the first yoke to the first rotary target in the first direction, and the first in the second direction. 2 The magnetron sputtering film forming apparatus according to (1) or (2), wherein each of the distances from the yoke to the second rotary target is the same over the axial direction of the film forming roll.

In this magnetron sputtering film forming apparatus, the thickness is the same in the axial direction, and the first magnet portion that gradually becomes thinner toward one side in the axial direction is arranged in the first yoke that is arranged along the axial direction. The first magnetron plasma unit can be easily configured. Therefore, the simple structure of the first magnetron plasma unit can prevent one end of the first rotary target from becoming excessively thin in the axial direction, and can prevent the first rotary target from becoming unevenly thin in the axial direction.

Further, since the second magnet portion having the same thickness in the axial direction and gradually becoming thinner toward the other side in the axial direction is arranged in the second yoke arranged along the axial direction, the second magnetron plasma unit can be used. It can be easily configured. Therefore, the second magnetron plasma unit having a simple structure can prevent the other end of the second rotary target from becoming excessively thin in the axial direction, and can prevent the second rotary target from becoming unevenly thin in the axial direction. ..

The present invention (5) satisfies the condition [3], the distance from the first yoke to the first rotary target in the first direction, and the second yoke to the second in the second direction. The magnetron sputtering film forming apparatus according to (1) or (2), wherein each of the distances to the rotary target is the same over the axial direction of the film forming roll.

In this magnetron sputtering film forming apparatus, the thickness is the same in the axial direction, and the first magnet portion along the axial direction is arranged in the first yoke that gradually becomes thinner toward one side in the axial direction. Therefore, the first magnetron plasma The unit can be easily configured. Therefore, the simple structure of the first magnetron plasma unit can prevent one end of the first rotary target from becoming excessively thin in the axial direction, and can prevent the first rotary target from becoming unevenly thin in the axial direction.

Further, since the thickness is the same in the axial direction and the second magnet portion along the axial direction is arranged in the second yoke which gradually becomes thinner toward the other side in the axial direction, the second magnetron plasma unit can be easily configured. .. Therefore, the second magnetron plasma unit having a simple structure can prevent the other end of the second rotary target from becoming excessively thin in the axial direction, and can prevent the second rotary target from becoming unevenly thin in the axial direction. ..

The magnetron sputtering film forming apparatus of the present invention can produce a sputtering film in which the first rotary target and the second rotary target are uniformly thinned in the axial direction and the thickness is uniform in the axial direction.

FIG. 1 is a cross-sectional view of a first embodiment of the magnetron sputtering film forming apparatus of the present invention. FIG. 2 is an enlarged cross-sectional view of a magnetron sputtering portion provided in the magnetron sputtering film forming apparatus of FIG. 3A and 3B respectively show cross-sectional views of the first rotary target and the second rotary target of the magnetron sputtering section shown in FIG. 4A and 4B respectively show cross-sectional views of the first rotary target and the second rotary target of the magnetron sputtering portion of the magnetron sputtering film forming apparatus of the second embodiment. 5A and 5B respectively show cross-sectional views of the first rotary target and the second rotary target of the magnetron sputtering portion of the magnetron sputtering film forming apparatus of the third embodiment. 6A and 6B respectively show cross-sectional views of the first rotary target and the second rotary target of the magnetron sputtering portion of the magnetron sputtering film forming apparatus of the first modification. 7A and 7B respectively show cross-sectional views of the first rotary target and the second rotary target of the magnetron sputtering portion of the magnetron sputtering film forming apparatus of the second modification. 8A and 8B respectively show cross-sectional views of the first rotary target and the second rotary target of the magnetron sputtering portion of the magnetron sputtering film forming apparatus of the third modification. 9A and 9B respectively show cross-sectional views of the first rotary target and the second rotary target of the magnetron sputtering portion of the magnetron sputtering film forming apparatus of the fourth modification. 10A and 10B respectively show cross-sectional views of the first rotary target and the second rotary target of the magnetron sputtering portion of the magnetron sputtering film forming apparatus of Comparative Examples 1 and 2, respectively. 11A to 11D are the measurement results of Comparative Example 1, FIG. 11A is the amount of wear of the first rotary target, FIG. 11B is the thickness of the first film, FIG. 11C is the amount of wear of the second rotary target, and FIG. 11D is. The thickness of the second film is shown. 12A to 12D are the measurement results of the first embodiment, FIG. 12A is a radial component of the magnetic flux density of the first rotary target, FIG. 12B is the thickness of the first film, and FIG. 12C is the magnetic flux density of the second rotary target. The radial component of FIG. 12D, FIG. 12D, shows the thickness of the second film. FIG. 13 shows the measurement results of the radial component of the magnetic flux density of the first rotary target of the second embodiment. FIG. 14 shows the measurement results of the radial component of the magnetic flux density of the first rotary target of the third embodiment. 15A to 15D are the measurement results of Comparative Example 3, FIG. 15A is the value obtained by dividing the wear amount of the first rotary target by the average, FIG. 15B is the value obtained by dividing the thickness of the first film by the average, and FIG. 15C. Shows the value obtained by dividing the amount of wear of the second rotary target by the average, and FIG. 15D shows the value obtained by dividing the thickness of the second film by the average. 16A to 16D are the measurement results of Example 4, FIG. 16A is the value obtained by dividing the wear amount of the first rotary target by the average, FIG. 16B is the value obtained by dividing the thickness of the first film by the average, and FIG. 16C. Shows the value obtained by dividing the amount of wear of the second rotary target by the average, and FIG. 16D shows the value obtained by dividing the thickness of the second film by the average.

The first embodiment of the magnetron plasma film forming apparatus of the present invention will be described with reference to FIGS. 1 to 3B.

As shown in FIG. 1, the magnetron sputtering film forming apparatus 1 is a roll-to-roll type film forming apparatus that forms (deposits) a film 92 on the base material 91 while conveying the base material 91. The magnetron sputtering film forming apparatus 1 includes a conveying section 2 and a film forming section 3.

The transport unit 2 includes a transport casing 4, a delivery roll 5, a take-up roll 6, a guide roll 7, and a vacuum pump 8.

The transport casing 4 has a substantially box shape extending along the transport direction. The transport casing 4 houses the delivery roll 5, the take-up roll 6, and the guide roll 7.

Each of the delivery roll 5 and the take-up roll 6 is arranged at each of the upstream side end portion and the downstream side end portion in the transport direction in the transport casing 4.

A plurality of guide rolls 7 are arranged between the delivery roll 5 and the take-up roll 6. The plurality of guide rolls 7 are arranged so that the base material 91 is wound around the film forming roll 52.

The vacuum pump 8 is provided in the transport casing 4.

The film forming section 3 includes a film forming casing 51, a film forming roll 52, and a plurality of (for example, three) magnetron sputtering sections 10.

The film-forming casing 51 communicates with the transport casing 4, and together with the transport casing 4, constitutes a vacuum chamber. The film-forming casing 51 has a substantially box shape. The film-forming casing 51 has a plurality of partition walls 53. The plurality of partition walls 53 extend toward the film forming roll 52. The film-forming casing 51 is provided with a sputter gas supply device (not shown). The film-forming casing 51 accommodates the film-forming roll 52 and the plurality of magnetron sputtering units 10.

The axis A1 of the film forming roll 52 is along the width direction orthogonal to the transport direction and the thickness direction of the base material 91. Hereinafter, the axis A1 of the film forming roll 52 is referred to as a first axis A1 in order to distinguish it from other axes.

The plurality of magnetron sputtering portions 10 are arranged so as to face each other on the radial outer side of the film forming roll 52. The plurality of magnetron sputtering portions 10 are arranged at intervals along the circumferential direction of the film forming roll 52.

The magnetron sputtering portion 10 adjacent to each other in the circumferential direction is partitioned by a partition wall 53. The space partitioned by the partition wall 53 constitutes the film forming chamber 9. A plurality of film forming chambers 9 are partitioned in the film forming casing 51 (vacuum chamber). One magnetron sputtering unit 10 is provided in one film forming chamber 9. Each of the plurality of magnetron sputtering units 10 includes a plasma casing 20, a first magnetron plasma unit 11, and a second magnetron plasma unit 12.

As shown in FIG. 2, the plasma casing 20 has a substantially box shape with one side open toward the film forming roll 52. The plasma casing 20 extends along the first axis A1 of the film forming roll 52. The plasma casing 20 accommodates the first magnetron plasma unit 11 and the second magnetron plasma unit 12.

The first magnetron plasma unit 11 and the second magnetron plasma unit 12 are arranged to face the film forming roll 52. The first magnetron plasma unit 11 and the second magnetron plasma unit 12 are arranged adjacent to each other at intervals along the circumferential direction of the film forming roll 52. The first magnetron plasma unit 11 and the second magnetron plasma unit 12 extend along the first axis A1 of the film forming roll 52. The first magnetron plasma unit 11 and the second magnetron plasma unit 12 face the film forming roll 52 through the opening of the plasma casing 20.

As shown in FIGS. 2 and 3A, the first magnetron plasma unit 11 includes a first rotary target 13 and a first magnet unit 31.

The first rotary target 13 has a cylindrical shape. The first rotary target 13 has an axis A2 parallel to the first axis A1 of the film forming roll 52. Hereinafter, the axis A2 of the first rotary target 13 will be referred to as a second axis A2 in order to distinguish it from other axes. The second axis A2 of the first rotary target 13 extends in the same direction as the first axis A1 of the film forming roll 52. The first rotary target 13 can rotate (circulate) in the direction opposite to the rotation direction of the film forming roll 52, for example. The first rotary target 13 is electrically connected to a cathode source (not shown), which allows it to act as a cathode.

The material of the first rotary target 13 is a material for forming the film 92. As such a material, for example, at least one selected from the group consisting of In, Sn, Zn, Ga, Sb, Nb, Ti, Si, Zr, Mg, Al, Au, Ag, Cu, Pd, and W. Examples include metal oxides containing the above metals. Specific examples thereof include indium-containing oxides such as indium tin oxide composite oxide (ITO), and antimony-containing oxides such as antimony tin composite oxide (ATO).

The first magnet unit 31 is housed (arranged) inside the first rotary target 13 in the radial direction. The first magnet unit 31 has a flat plate shape extending in the longitudinal direction. The first magnet unit 31 has the same thickness in the longitudinal direction. The longitudinal direction of the first magnet unit 31 is inclined with respect to the second axis A2.

The first magnet unit 31 directs the first yoke 14 and the first magnet portion 15 from the second axis A2 of the first rotary target 13 toward the first axis A1 of the film forming roll 52. Prepare in order. Preferably, the first magnet unit 31 includes only the first yoke 14 and the first magnet portion 15.

The first yoke 14 has a flat plate shape extending in the longitudinal direction. As shown in FIG. 3A, the first yoke 14 includes a front surface 23 and a back surface 24. The surface 23 faces the film forming roll 52. The back surface 24 is located on the opposite side of the film forming roll 52 with respect to the front surface 23. The back surface 24 is parallel to the front surface 23. Therefore, the first yoke 14 has the same thickness in the longitudinal direction. Examples of the material of the first yoke 14 include high magnetic permeability materials having a relative magnetic permeability of 10 or more, further 50 or more, and specific examples thereof include metals such as iron and stainless steel.

The first magnet portion 15 has a flat plate shape extending in the longitudinal direction. The first magnet portion 15 is fixed (arranged) on the surface 23 of the first yoke 14. The first magnet portion 15 has a front surface 27 and a back surface 28. The surface 27 faces the film forming roll 52. The back surface 28 is located on the opposite side of the film forming roll 52 with respect to the front surface 27. The back surface 28 is parallel to the front surface 27. Therefore, the first magnet portion 15 has the same thickness in the longitudinal direction. In this first embodiment, as shown in FIG. 2, the first magnet portion 15 is composed of two first magnets 21 and a second magnet 22 sandwiched between the two first magnets 21 (divided). For example, the surface 27 of the first magnet 21 has an N pole, and the surface 27 of the second magnet 22 has an S pole.

Then, as shown in FIG. 3A, in the first magnet unit 31, the first magnet portion 15 having the same thickness in the longitudinal direction is arranged on the first yoke 14 having the same thickness in the longitudinal direction. The first magnet unit 31 (both of the first yoke 14 and the first magnet portion 15) is inclined with respect to the second axis A2. Specifically, in the first direction, the distance L1 from the first magnet portion 15 to the first rotary target 13 becomes longer toward one side in the axis A direction. As a result, the first half of the following condition [1] is satisfied.

Condition [1]: In the first direction, the distance L1 from the first magnet portion 15 to the first rotary target 13 becomes longer toward one side in the axis A direction (first half portion).

The distance L1 from the first magnet portion 15 to the first rotary target 13 is, for example, 0.01 mm or more longer, preferably 0.1 mm or more longer, and longer when moving 100 mm to one side in the axis A direction. The upper limit of the amount is, for example, 10 mm.

As shown in FIGS. 2 and 3B, the second magnetron plasma unit 12 includes a second rotary target 33 and a second magnet unit 32. The configuration of the second magnetron plasma unit 12 is substantially the same as the configuration of the first magnetron plasma unit 11 except that the inclination of the second magnet unit 32 with respect to the axis A is opposite to the inclination of the first magnet unit 31 with respect to the axis A. Is similar to. Hereinafter, the configuration of the second magnetron plasma unit 12 different from that of the first magnetron plasma unit 11 will be described.

The second rotary target 33 has an axis A3 parallel to the first axis A1 of the film forming roll 52. Hereinafter, the axis A3 of the second rotary target 33 will be referred to as a third axis A3 in order to distinguish it from other axes. The third axis A3 of the second rotary target 33 extends in the same direction as the first axis A1 of the film forming roll 52. The second rotary target 33 can rotate (rotate around) in the same direction as the rotation direction of the film forming roll 52, for example.

The second magnet unit 32 sequentially moves the second yoke 34 and the second magnet portion 35 from the third axis A3 of the second rotary target 33 toward the first axis A1 of the film forming roll 52. Be prepared.

In the second direction, the distance L2 from the second magnet portion 35 to the second rotary target 33 becomes longer toward the other side in the axis A direction.

This satisfies the latter half of the condition [1].

Condition [1]: In the second direction, the distance L2 from the second magnet portion 35 to the second rotary target 33 becomes longer toward the other side in the axis A direction (second half portion).

The degree to which the distance L2 becomes long is the same as the degree to which the above-mentioned distance L1 becomes long.

Since the magnetron sputtering film forming apparatus 1 satisfies at least one of the above-mentioned conditions [1] to [3], that is, between the first rotary target 13 and the film forming roll 52. The magnetic field strength of is lower toward one side in the axis A direction, and the magnetic field strength between the second rotary target 33 and the film forming roll 52 is lower toward the other side in the axis A direction.

In order to prepare the magnetron sputtering film forming apparatus 1 shown in FIG. 1, first, each of the first magnetron plasma unit 11 and the second magnetron plasma unit 12 is prepared, and these are provided in the magnetron sputtering unit 10.

To prepare the first magnetron plasma unit 11, for example, the first magnet portion 15 having the same thickness in the longitudinal direction is fixed to the first yoke 14 having the same thickness in the longitudinal direction to fix the first magnet. Prepare the unit 31. Subsequently, the first magnet unit 31 is housed in the first rotary target 13. At that time, as shown in FIG. 3A, the first magnet unit 31 is tilted with respect to the second axis A2. As a result, the first magnet unit 31 is installed on the first rotary target 13 to prepare the first magnetron plasma unit 11.

Further, similarly to the installation of the first magnet unit 31 on the first rotary target 13, the second magnet unit 32 is installed on the second rotary target 33 to prepare the second magnetron plasma unit 12.

Next, a method of forming (depositing) a film 92 on the base material 91 using this magnetron sputtering film forming apparatus 1 will be described.

First, the long base material 91 is set in the magnetron sputtering film forming apparatus 1. The base material 91 is not particularly limited, and examples thereof include a polymer film (PET film and the like) and a glass film (thin film glass).

Subsequently, the vacuum pump 8 is driven to evacuate the film forming chamber 9. At the same time, the sputtering gas is supplied to the film forming chamber 9 from a sputtering gas supply device (not shown). Examples of the sputter gas include an inert gas such as argon, for example, a reactive gas further containing oxygen.

Subsequently, while moving the base material 91 with respect to the film forming roll 52, each of the first rotary target 13 and the second rotary target 33 is rotated and a cathode voltage is applied.

As a result, electrons are emitted from each of the first rotary target 13 and the second rotary target 33.

Further, ions derived from the sputter gas (specifically, argon ions) collide with the first rotary target 13 and the second rotary target 33, respectively, thereby causing the first rotary target 13 and the second rotary target 33. The particles of the material are sequentially attached to the base material 91 on the outer peripheral surface of the film forming roll 52. As a result, the film 92 is formed (filmed) on the surface of the base material 91.

(Action and effect of the first embodiment)
The magnetron sputtering film forming apparatus 1 satisfies the condition [1].

Therefore, the collision frequency of the ion with one end of the first rotary target 13 in the axis A direction is the same as the collision frequency of the ion with the middle portion and the other end of the first rotary target 13 in the axis A direction. The collision frequency between the first rotary target 13 and the ions becomes uniform from the other end to one end in the axis A direction. Therefore, excessive wear (biased wear) at one end of the first rotary target 13 in the axis A direction can be suppressed, and uneven thinning of the first rotary target 13 after wear can be suppressed in the axis A direction.

Further, the collision frequency between the other end of the second rotary target 33 in the axis A direction and the ion is the same as the collision frequency between the middle portion and one end of the second rotary target 33 in the axis A direction and the ion. Further, the collision frequency between the second rotary target 33 and the ions becomes uniform from one end to the other end in the axis A direction. Therefore, excessive wear (unbalanced wear) at the other end of the second rotary target 33 in the axis A direction can be suppressed, and the second rotary target 33 after wear can be prevented from becoming unevenly thin in the third axis A3 direction. it can.

Therefore, it is possible to prevent both ends of the film 92 from becoming extremely thick in the axial direction (direction orthogonal to the elongated direction and the thickness direction) (corresponding to the width direction of the base material 91), and further, the thickness of the film 92 is set to the axis A. Can be uniform over the direction.

Further, in the magnetron sputtering film forming apparatus 1, the magnetic field strength between the first rotary target 13 and the film forming roll 52 becomes lower toward one side in the axis A direction, and is between the second rotary target 33 and the film forming roll 52. The magnetic field strength decreases toward the other side in the A direction of the axis.

In this magnetron sputtering film forming apparatus 1, the magnetic field strength between the first rotary target 13 and the film forming roll 52 decreases toward one side in the axis A direction, so that the first rotary target 13 becomes unevenly thin in the axis direction. That can be further suppressed. Further, since the magnetic field strength between the second rotary target 33 and the film forming roll 52 decreases toward the other side in the axis A direction, it is further suppressed that the second rotary target 33 becomes unevenly thin in the axis A direction. it can.

Further, in the first magnet unit 31 of the first embodiment, the first magnet portion 15 having the same thickness in the axis A direction is arranged on the first yoke 14 having the same thickness in the axis A direction. Since the first magnet unit 31 is arranged so as to be inclined with respect to the axis A, the first magnetron plasma unit 11 can be easily configured. Therefore, the simple structure of the first magnetron plasma unit 11 can prevent one end of the first rotary target 13 in the axis A direction from becoming excessively thin, and the first rotary target 13 becomes unevenly thin in the axis A direction. Can be suppressed.

Further, in the second magnet unit 32, the second magnet portion 35 having the same thickness in the axis A direction is arranged on the second yoke 34 having the same thickness in the axis A direction.
Since these are arranged so as to be inclined with respect to the axis A, the second magnetron plasma unit 12 can be easily configured. Therefore, the second magnetron plasma unit 12 having a simple structure can prevent the other end of the second rotary target 33 from becoming excessively thin in the axis A direction, and the second rotary target 33 becomes unevenly thin in the axis A direction. It can be suppressed.

<Second Embodiment>
In the second embodiment, the same members and processes as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted. In addition, the second embodiment can exhibit the same effects as those of the first embodiment, except for special mention. Further, the first embodiment and the second embodiment can be combined as appropriate.

In the second embodiment, as shown in FIGS. 4A to 4B, the following condition [2] is satisfied in addition to the above condition [1].

Condition [2]: The first magnet portion 15 becomes thinner toward one side in the axis A direction. The second magnet portion 35 becomes thinner toward the other side in the axis A direction.

Specifically, when the first magnet portion 15 moves 100 mm to one side in the axis A direction, for example, it is thinned by 0.01 mm or more, preferably 0.1 mm or more, and the upper limit of the amount of thinning is set. For example, it is 10 mm. The degree to which the second magnet portion 35 becomes thin is the same as the degree to which the first magnet portion 15 described above becomes thin.

Each of the first yoke 14 and the second yoke 34 extends parallel to each of the second axis A2 and the third axis A3 without being inclined with respect to each of the second axis A2 and the third axis A3.

In the first magnet unit 31, the first magnet portion 15 having the same thickness in the axis A direction and gradually becoming thinner toward one side in the axis A direction is provided on the first yoke 14 arranged along the axis A. Have been placed. The first magnet portion 15 is formed by cutting the front surface 27 and / or the back surface 28 so that the cutting amount gradually increases toward one side in the longitudinal direction.

In the second magnet unit 32, a second magnet portion 35 having the same thickness in the axis A direction and gradually becoming thinner toward the other side in the axis A direction is arranged in the second yoke 34 arranged along the axis A. ing. The second magnet portion 35 is formed by cutting the front surface and / or the back surface so that the cutting amount gradually increases toward one side in the longitudinal direction.

(Action and effect of the second embodiment)
In the first magnet unit 31 of the second embodiment, in the first magnet unit 31, the thickness is the same along the axis A direction, and the first yoke 14 arranged along the axis A faces one side in the axis A direction. A first magnet portion 15 that gradually becomes thinner is arranged. Therefore, the first magnetron plasma unit 11 including the first magnet unit 31 described above can be easily configured. Therefore, the simple structure of the first magnetron plasma unit 11 can prevent one end of the first rotary target 13 in the axis A direction from becoming excessively thin, and the first rotary target 13 becomes unevenly thin in the axis A direction. Can be suppressed.

Further, in the second magnet unit 32, a second magnet portion 35 having the same thickness in the axis A direction and gradually becoming thinner toward the other side in the axis A direction is provided on the second yoke 34 arranged along the axis A. Have been placed. Therefore, the second magnetron plasma unit 12 including the second magnet unit 32 described above can be easily configured. Therefore, the second magnetron plasma unit 12 having a simple structure can prevent the other end of the second rotary target 33 from becoming excessively thin in the axis A direction, and the second rotary target 33 becomes unevenly thin in the axis A direction. It can be suppressed.

<Third Embodiment>
In the third embodiment, the same members and processes as those in the first to second embodiments described above are designated by the same reference numerals, and detailed description thereof will be omitted. Further, the third embodiment can exhibit the same effects as those of the first embodiment to the second embodiment, except for special mention. Further, the first to third embodiments can be combined as appropriate.

As shown in FIGS. 5A to 5B, in the third embodiment, the thicknesses of the first magnet portion 15 and the second magnet portion 35 are not changed and have the same thickness in the direction of the axis A, while the thickness of the first yoke is the same. This is the same as that of the second embodiment except that the thicknesses of the 14 and the second yoke 34 are varied. Specifically, the third embodiment satisfies the following condition [3].

Condition [3]: The first yoke 14 becomes thinner toward one side in the axis A direction. The second yoke 34 becomes thinner toward the other side in the axis A direction.

The first yoke 14 is thin by, for example, 0.01 mm or more, preferably 0.1 mm or more, and the upper limit of the amount of thinning is, for example, 10 mm when moving 100 mm to one side in the axis A direction. The degree to which the second yoke 34 becomes thin is the same as the degree to which the first yoke 14 described above becomes thin.

The first yoke 14 is formed by cutting the front surface 23 and / or the back surface 24 so that the cutting amount gradually increases toward the other side in the longitudinal direction. The second yoke 34 is formed by cutting the front surface 23 and / or the back surface 24 so that the cutting amount gradually increases toward one side in the longitudinal direction.

(Action and effect of the third embodiment)
According to the third embodiment, the thickness is the same over the axis A direction, and the first magnet portion 15 along the axis A is arranged on the first yoke 14 that gradually becomes thinner toward one side in the thickness direction. The first magnetron plasma unit 11 can be easily configured. Therefore, the simple structure of the first magnetron plasma unit 11 can prevent one end of the first rotary target 13 in the axis A direction from becoming excessively thin, and the first rotary target 13 becomes unevenly thin in the axis A direction. Can be suppressed.

Further, in the second magnet unit 32, the thickness is the same along the axis A direction, and the second magnet portion 35 along the axis A is arranged on the second yoke 34 which gradually becomes thinner toward the other side in the thickness direction. , The second magnetron plasma unit 12 can be easily configured. Therefore, the second magnetron plasma unit 12 having a simple structure can prevent the other end of the axis A of the second rotary target 33 from becoming excessively thin, and the second rotary target 33 becomes unevenly thin in the direction of the axis A. Can be suppressed.

(1st modified example to 3rd modified example)
In each of the following modifications, the same reference numerals will be given to the same members and processes as those in the first to third embodiments described above, and detailed description thereof will be omitted. In addition, each modification can exhibit the same effects as those of the first embodiment to the third embodiment, unless otherwise specified.
Further, the first embodiment to the third embodiment and each modification can be appropriately combined.

The first embodiment satisfies the condition [1], the second embodiment satisfies the condition [1] and the condition [2], and the third embodiment satisfies the condition [3].

The present invention only needs to satisfy at least one of the conditions [1] to [3], and aspects other than the above-mentioned first to third embodiments, specifically, the following. As shown in Table 1, a first modification satisfying the condition [2] (see FIGS. 6A to 6B) and a second modification satisfying both the conditions [1] to [3] (FIGS. 7A to 7A). FIG. 7B), a third modification satisfying the condition [1] and the condition [3] (see FIGS. 8A to 8B), and a fourth modification satisfying the condition [2] and the condition [3] (FIGS. 9A to 9A). (See FIG. 9B) is also included in the present invention. Table 1 shows the correspondence between each embodiment to each modification and the conditions [1] to [3]. Also, the conditions [1] to [3] are posted below.

Condition [1]: In the first direction, the distance L1 from the first magnet portion 15 to the first rotary target 13 becomes longer toward one side in the axis A direction. In the second direction, the distance L2 from the second magnet portion 35 to the second rotary target 33 becomes longer toward the other side in the axis A direction.

Condition [2]: The first magnet portion 15 becomes thinner toward one side in the axis A direction. The second magnet portion 35 becomes thinner toward the other side in the axis A direction.

Condition [3]: The first yoke 14 becomes thinner toward one side in the axis A direction. The second yoke 34 becomes thinner toward the other side in the axis A direction.

Of the first embodiment to the third embodiment and the first modification to the fourth modification, the first embodiment is preferably from the viewpoint of simplicity of configuration of the first magnetron plasma unit 11 and the second magnetron plasma unit 12. Embodiments to the third embodiment can be mentioned. That is, the first embodiment is a simple configuration in which the first magnet unit 31 including the first yoke 14 and the first magnet portion 15 having the same thickness in the axis A direction is inclined toward the axis A, and the second embodiment is A simple configuration in which the first magnet portion 15 having the same thickness in the axis A direction and gradually becoming thinner is arranged on the first yoke 14 along the axis A. The third embodiment has the same thickness in the axis A direction. This is a simple configuration in which the first magnet portion 15 along the axis A is arranged on the first yoke 14, which gradually becomes thinner. The simplicity of the configuration of the second yoke 34 and the second magnet portion 35 in the first to third embodiments is the same as the simplicity of the configuration of the first yoke 14 and the first magnet portion 15 described above. The first embodiment to the third embodiment have a simpler configuration than the first modified example to the fourth modified example.

<Other variants>
The surface 27 of the first magnet 21 may have an S pole, and the surface 27 of the second magnet 22 may have an N pole.

Examples and comparative examples are shown below, and the present invention will be described in more detail. The present invention is not limited to Examples and Comparative Examples. In addition, specific numerical values such as the compounding ratio (ratio), physical property values, and parameters used in the following description are the compounding ratios (ratio) corresponding to those described in the above-mentioned "Form for carrying out the invention". ), Physical property values, parameters, etc. can be replaced with the upper limit (numerical value defined as "less than or equal to" or "less than") or the lower limit (numerical value defined as "greater than or equal to" or "excess").

(Comparative Example 1)
The first magnetron plasma unit 11 and the second magnetron plasma unit 12 shown in FIGS. 10A to 10B were prepared.

In the first magnet unit 31, the flat plate-shaped first magnet portion 15 is arranged on the flat plate-shaped first yoke 14. The first magnet unit 31 is along the axis A. In the second magnet unit 32, the flat plate-shaped second magnet portion 35 is arranged on the flat plate-shaped second yoke 34. The second magnet unit 32 is along the axis A. Comparative Example 1 does not satisfy any of the conditions [1] to [3]. The first yoke 14 and the second yoke 34 are made of iron. The first rotary target 13 and the second rotary target 33 are made of ITO.

While introducing argon gas into the film forming chamber 9, the vacuum pump 8 is driven to set the internal pressure in the film forming chamber 9 to 0.5 Pa, and 12 kW is applied to each of the first rotary target 13 and the second rotary target 33. Magnetron sputtering was carried out for 100 hours by applying the voltage of. At this time, the base material 91 was not conveyed from the delivery roll 5 toward the take-up roll 6 and was immovable with respect to the magnetron sputtering section 10. However, the base material 91 is present on the outer periphery of the film forming roll 52.

After that, the first rotary target 13, the first film facing the first rotary target 13, the second rotary target 33, and the second film facing the first rotary target 13 were observed.

The relationship between the amount of wear of the first rotary target 13 and the position in the axis A direction is shown in FIG. 11A. The relationship between the thickness of the first film and the position in the axis A direction on the first film is shown in FIG. 11B. The relationship between the amount of wear of the second rotary target 33 and the position in the axis A direction is shown in FIG. 11C. The relationship between the thickness of the second film and the position of the axis A on the second film is shown in FIG. 11D.

(Consideration for Comparative Example 1)
As shown in FIGS. 11A to 11B, the behaviors of the wear amount of the first rotary target 13 and the thickness of the first film in the axis A direction are the same. Therefore, it is presumed that their behaviors match in each of the subsequent examples.

As shown in FIGS. 11C to 11D, the behaviors of the wear amount of the second rotary target 33 and the thickness of the second film in the axis A direction are the same. Therefore, it is presumed that their behaviors match in each of the subsequent examples.

(Example 1)
As shown in FIGS. 1 to 3B, the magnetron sputtering film forming apparatus 1 of the first embodiment described above was prepared.

Specifically, in the first magnet unit 31, the flat plate-shaped first magnet portion 15 having a thickness of 24 mm is arranged on the flat plate-shaped first yoke 14 having a thickness of 10 mm. The first magnet unit 31 is inclined along the axis A. The distance L1 from the first magnet portion 15 to the first rotary target 13 is 0.33 mm longer when it moves 100 mm to one side in the axis A direction.

In the second magnet unit 32, the flat plate-shaped second magnet portion 35 having a thickness of 24 mm is arranged on the flat plate-shaped second yoke 34 having a thickness of 10 mm. The second magnet unit 32 is inclined along the axis A. The distance L2 from the second magnet portion 35 to the second rotary target 33 is 0.33 mm longer when it moves 100 mm to the other side in the axis A direction.

Then, the radial component of the magnetic flux density in the region facing the first magnet portion 15 was measured between the first rotary target 13 and the film forming roll 52. The result is shown by the solid line in FIG. 12A. The thickness of the first film facing the first rotary target 13 was measured. The result is shown by the solid line in FIG. 12B.

The radial component of the magnetic flux density in the region facing the fourth magnet 44 was measured between the second rotary target 33 and the film forming roll 52. The result is shown by the solid line in FIG. 12C. The thickness of the second film facing the second rotary target 33 was measured. The result is shown by the solid line in FIG. 12D.

(Comparative Example 2)
The treatment was carried out in the same manner as in Example 1 except that each of the first magnet unit 31 and the second magnet unit 32 was not inclined with respect to the axis A and was aligned with the axis A. The measurement results of Comparative Example 2 are shown by the broken lines in FIGS. 12A to 12D.

(Consideration for Example 1)
As can be seen from FIG. 12A, in Example 1, the magnetic flux density at one end in the axis A direction is reduced between the first rotary target 13 and the film forming roll 52 as compared with Comparative Example 2, and the first It is presumed that the collision frequency between one end of the rotary target 13 in the axis A direction and the ion is the same as the collision frequency between the middle portion and the other end of the first rotary target 13 in the axis A direction and the ion. Further, in the first embodiment, the magnetic flux density gradually decreases from the other end in the axis A direction to one end, and the collision frequency between the first rotary target 13 and the ion is from the other end to one end in the axis A direction. , It is presumed that it will be uniform. As can be seen from FIG. 12B, the first embodiment suppresses the thickening of one end of the first film. Then, based on the consideration of Comparative Example 1, it is presumed that Example 1 suppresses the uneven thinning of the first rotary target 13 after wear.

As can be seen from FIG. 12C, the magnetic flux density at the other end in the axis A direction is reduced between the second rotary target 33 and the film forming roll 52, and the magnetic flux density at the other end in the axis A direction of the second rotary target 33 is reduced. It is presumed that the collision frequency with the ions is the same as the collision frequency with the ions at the middle portion and one end portion in the A-direction of the first rotary target 13. Further, the magnetic flux density gradually decreases from one end to the other end of the axis A direction, and the collision frequency between the second rotary target 33 and the ion becomes uniform from one end to the other end in the axis A direction. It is speculated. As can be seen from FIG. 12D, the first embodiment suppresses the thickening of the other end of the second film. Then, based on the consideration of Comparative Example 1, it is presumed that Example 1 suppresses the non-uniform thinning of the second rotary target 33 after wear.

Based on the above results, it is presumed that if the base material 91 is transported by the transport portion 2 of the magnetron sputtering film forming apparatus 1, a film 92 having a uniform thickness along the axis A direction can be formed.

(Example 2)
As shown in FIGS. 4A to 4B, the magnetron sputtering film forming apparatus 1 of the second embodiment described above was prepared.

Specifically, the same processing as in Comparative Example 1 was performed except that the following points were changed.

The surface 27 of the first magnet portion 15 is cut so that the cutting amount gradually increases toward one side in the longitudinal direction, and the first magnet unit 31 is set as the first rotary target so that the first yoke 14 is along the axis A. It was housed in 13. The first magnet portion 15 is 0.33 mm thinner when moved 100 mm to one side in the axis A direction.

The surface of the second magnet portion 35 is cut so that the cutting amount gradually increases toward the other side in the axis A direction, and the second magnet unit 32 is set as the second rotary target so that the second yoke 34 is along the axis A. It was housed in 33. The second magnet portion 35 is 0.33 mm thinner when it moves 100 mm to the other side in the axis A direction.

Then, the radial component of the magnetic flux density in the region facing the first magnet portion 15 was calculated between the first rotary target 13 and the film forming roll 52. Specifically, the magnetic flux density was calculated by performing a magnetic field simulation based on the following software and calculation method.
Software name: JMAG (manufactured by JSOL)
Calculation method: Finite element method The results are shown in FIG.

(Consideration for Example 2)
As can be seen from FIG. 13, in Example 2, the magnetic flux density at one end in the axis A direction is reduced between the first rotary target 13 and the film forming roll 52 as compared with Comparative Example 2, and the first It is presumed that the collision frequency between one end of the rotary target 13 in the axis A direction and the ion is the same as the collision frequency between the middle portion and the other end of the first rotary target 13 in the axis A direction and the ion. Then, it is presumed that the second embodiment suppresses the uneven wear of one end of the first rotary target 13 in the axis A direction.

(Example 3)
As shown in FIGS. 5A to 5B, the magnetron sputtering film forming apparatus 1 of the third embodiment described above was prepared.

Specifically, the thicknesses of the first magnet portion 15 and the second magnet portion 35 are kept the same over the axis A direction, while the thicknesses of the first yoke 14 and the second yoke 34 are set to be the same. The treatment was carried out in the same manner as in Example 2 except that it was changed.

Specifically, the back surface 24 of the first yoke 14 is cut so that the cutting amount gradually increases toward one side in the axis A direction, and the first magnet unit 31 is cut so that the first magnet portion 15 is along the axis A. It was housed in the first rotary target 13. The first yoke 14 is 0.33 mm thinner when moved 100 mm to one side in the A direction of the axis.

The back surface of the second yoke 34 is cut so that the amount of cutting gradually increases toward the other side in the longitudinal direction, and the second magnet unit 32 is placed on the second rotary target 33 so that the second magnet portion 35 is along the axis A. Contained inside. The second yoke 34 is 0.33 mm thinner when it moves 100 mm to the other side in the axis A direction.

Then, the radial component of the magnetic flux density in the region facing the first magnet portion 15 was calculated between the first rotary target 13 and the film forming roll 52. Specifically, the magnetic flux density was calculated by performing a magnetic field simulation based on the following software and calculation method.
Software name: JMAG (manufactured by JSOL)
Calculation method: Finite element method The result is shown in FIG.

(Consideration for Example 3)
As can be seen from FIG. 14, in Example 3, the magnetic flux density at one end in the axis A direction is reduced between the first rotary target 13 and the film forming roll 52 as compared with Comparative Example 2, and the first It is presumed that the collision frequency between one end of the rotary target 13 in the axis A direction and the ion is the same as the collision frequency between the middle portion and the other end of the first rotary target 13 in the axis A direction and the ion. Then, it is presumed that the second embodiment suppresses the uneven wear of one end of the first rotary target 13 in the axis A direction.

<Abrasion test and film formation test>
(Comparative Example 3)
The first film and the second film were formed by magnetron sputtering in the same manner as in Comparative Example 1 by the same magnetron sputtering film forming apparatus 1 as in Comparative Example 1. However, the first rotary target 13 and the second rotary target 33 were not rotated. Therefore, in both the first rotary target 13 and the second rotary target 33, erosion marks are formed in a part of the circumferential direction along the axis A direction.

The amount of wear of the first rotary target 13 and the amount of wear of the second rotary target 33 were measured with a laser displacement meter. The thickness of the first film and the thickness of the second film were measured by a crystal vibration type film thickness meter.

FIG. 15A shows the relationship between the value obtained by dividing the amount of wear of the first rotary target 13 by the average and the position in the axis A direction. FIG. 15B shows the relationship between the value obtained by dividing the thickness of the first film by the average and the position of the first film in the axis A direction. FIG. 15C shows the relationship between the value obtained by dividing the amount of wear of the second rotary target 33 by the average and the position in the axis A direction. The relationship between the value obtained by dividing the thickness of the second film by the average and the position of the axis A on the second film is shown in FIG. 15D.

The vertical axis of FIGS. 15A and 15C described above is a value obtained by dividing the amount of wear at the position of the axis A by the average amount of wear in the direction of the axis A. The vertical axis of FIG. 15B is a value obtained by dividing the thickness of the first film at the position of the axis A by the average thickness of the first film in the direction of the axis A. The vertical axis of FIG. 15D is a value obtained by dividing the thickness of the second film at the position of the axis A by the average thickness of the second film in the direction of the axis A.

(Example 4)
The first film and the second film were formed by magnetron sputtering in the same manner as in Example 1 by the same magnetron sputtering film forming apparatus 1 as in Example 1. However, the first rotary target 13 and the second rotary target 33 were not rotated. Therefore, in both the first rotary target 13 and the second rotary target 33, erosion marks are formed in a part of the circumferential direction along the axis A direction.

The amount of wear of the first rotary target 13 and the amount of wear of the second rotary target 33 were measured with a laser displacement meter. The thickness of the first film and the thickness of the second film were measured by a crystal vibration type film thickness meter.

FIG. 16A shows the relationship between the value obtained by dividing the amount of wear of the first rotary target 13 by the average and the position in the axis A direction. FIG. 16B shows the relationship between the value obtained by dividing the thickness of the first film by the average and the position of the first film in the axis A direction. FIG. 16C shows the relationship between the value obtained by dividing the amount of wear of the second rotary target 33 by the average and the position in the axis A direction. The relationship between the value obtained by dividing the thickness of the second film by the average and the position of the axis A on the second film is shown in FIG. 16D.

The vertical axis of FIGS. 16A and 16C described above is a value obtained by dividing the amount of wear at the position of the axis A by the average amount of wear in the direction of the axis A. The vertical axis of FIG. 16B is a value obtained by dividing the thickness of the first film at the position of the axis A by the average thickness of the first film in the direction of the axis A. The vertical axis of FIG. 16D is a value obtained by dividing the thickness of the second film at the position of the axis A by the average thickness of the second film in the direction of the axis A.

(Comparison between Example 4 and Comparative Example 3)
As can be seen from FIGS. 15A and 16A, the fourth embodiment can suppress excessive wear (biased wear) at one end of the first rotary target 13 in the axial direction A direction as compared with the third comparative example, and the second after wear. 1 It can be seen that the rotary target 13 was prevented from becoming unevenly thinned along the axis A direction. Then, as can be seen from FIGS. 15B and 16B, it can be seen that the thickening of one end of the first film was suppressed.

As can be seen from FIGS. 15C and 16C, the fourth embodiment can suppress excessive wear (biased wear) at one end of the second rotary target 33 in the axis A direction as compared with the third comparative example, and the second after wear. 2 It can be seen that the rotary target 33 was prevented from becoming unevenly thinned along the axis A direction. Then, as can be seen from FIGS. 15D and 16D, it can be seen that the thickening of the other end of the second film was suppressed.

1 Magnetron sputtering film forming apparatus 11 1st magnetron plasma unit 12 2nd magnetron plasma unit 13 1st rotary target 14 1st yoke 15 1st magnet part 23 Surface 33 2nd rotary target 34 2nd yoke 35 2nd magnet part 52 formation Membrane roll A Axis A1 1st Axis A2 2nd Axis A3 3rd Axis L1 Distance (distance from the 1st magnet part to the 1st rotary target)
L2 distance (distance from the 2nd magnet part to the 2nd rotary target)

Claims (5)

Film formation roll and
A first magnetron plasma unit that is arranged to face the film forming roll and extends along the axis of the film forming roll.
It is provided with a second magnetron plasma unit which is arranged to face the film forming roll, is arranged adjacent to the first magnetron plasma unit, and extends along the axis of the film forming roll.
The first magnetron plasma unit is
A first rotary target whose axis extends in the same direction as the axis of the film forming roll,
A first yoke arranged radially inside the first rotary target,
A first magnet portion arranged on the surface of the first yoke is provided inside the first rotary target in the radial direction.
The second magnetron plasma unit is
A second rotary target whose axis extends in the same direction as the axis of the first rotary target,
A second yoke arranged radially inside the second rotary target,
A second magnet portion arranged on the surface of the second yoke is provided inside the second rotary target in the radial direction.
A magnetron sputtering film forming apparatus, which satisfies at least one of the following conditions [1] to [3].
Condition [1]: In the first direction from the axis of the first rotary target to the axis of the film forming roll, the distance from the first magnet portion to the first rotary target is one of the axial directions of the film forming roll. The distance from the second magnet portion to the second rotary target is the axial direction of the film forming roll in the second direction from the axis of the second rotary target toward the axis of the film forming roll. Longer towards the other side.
Condition [2]: The first magnet portion becomes thinner toward one side in the axial direction of the film forming roll, and the second magnet portion becomes thinner toward the other side in the axial direction of the film forming roll.
Condition [3]: The first yoke becomes thinner toward one side in the axial direction of the film forming roll, and the second yoke becomes thinner toward the other side in the axial direction of the film forming roll. The magnetic field strength between the first rotary target and the film forming roll decreases toward one side in the axial direction, and the magnetic field strength between the second rotary target and the film forming roll becomes lower toward the other side in the axial direction. The magnetron sputtering film forming apparatus according to claim 1, wherein the value decreases toward the distance. Satisfying the above condition [1]
The thickness of the first magnet portion and the thickness of the second magnet portion are the same over the axial direction of the film forming roll.
The magnetron sputtering film forming apparatus according to claim 1 or 2, wherein each of the thickness of the first yoke and the thickness of the second yoke are the same in the axial direction of the film forming roll. Satisfying the above-mentioned condition [1] and the above-mentioned condition [2],
The distance from the first yoke to the first rotary target in the first direction and the distance from the second yoke to the second rotary target in the second direction are the axial directions of the film forming roll. The magnetron sputtering film forming apparatus according to claim 1 or 2, wherein the magnetron sputtering film forming apparatus is the same. Satisfying the above condition [3]
The distance from the first yoke to the first rotary target in the first direction and the distance from the second yoke to the second rotary target in the second direction are the axial directions of the film forming roll. The magnetron sputtering film forming apparatus according to claim 1 or 2, wherein the magnetron sputtering film forming apparatus is the same.

Images