JP2021091595A - Copper/ceramic assembly, insulation circuit board, method for manufacturing copper/ceramic assembly, and method for manufacturing insulation circuit board - Google Patents

Abstract

To provide a copper/ceramic assembly which can suppress occurrence of cracking of a ceramic substrate and is excellent in cooling/heating cycle reliability even when severe cooling/heating cycle load is performed, an insulation circuit board, a method for manufacturing a copper/ceramic assembly, and a method for manufacturing an insulation circuit board.SOLUTION: A copper/ceramic assembly is constituted by joining a copper member 12 composed of copper or a copper alloy and a ceramic member 11 composed of nitrogen-containing ceramic. An active metal nitride layer 41 containing a nitride of one or two or more kinds of active metal selected from Ti, Zr, Nb and Hf is formed on the side of the ceramic member 11 between the copper member 12 and the ceramic member 11. An Mg solid solution layer 45 in which Mg is solid-dissolved in a parent phase of Cu is formed between the active metal nitride layer 41 and the copper member 12, and Cu-containing particles 42 composed of either or both of Cu particles and compound particles of Cu and active metal are dispersed inside the active metal nitride layer 41.SELECTED DRAWING: Figure 3

Description

According to the present invention, a copper / ceramics junction in which a copper member made of copper or a copper alloy and a ceramics member made of nitrogen-containing ceramics are bonded, and a copper plate made of copper or a copper alloy on the surface of a ceramics substrate made of nitrogen-containing ceramics. The present invention relates to an insulating circuit board to which the copper / ceramics are bonded, a method for manufacturing a copper / ceramics bonded body, and a method for manufacturing an insulated circuit board.

The power module, LED module, and thermoelectric module have a structure in which a power semiconductor element, an LED element, and a thermoelectric element are bonded to an insulating circuit board in which a circuit layer made of a conductive material is formed on one surface of the insulating layer. ..
For example, a power semiconductor element for high power control used for controlling a wind power generation, an electric vehicle, a hybrid vehicle, etc. has a large amount of heat generation during operation. An insulated circuit board provided with a circuit layer formed by joining a metal plate having excellent conductivity to one surface of the ceramics substrate has been widely used conventionally. As the insulating circuit board, a circuit board in which a metal plate is joined to the other surface of a ceramics substrate to form a metal layer is also provided.

For example, Patent Document 1 proposes an insulating circuit board in which a circuit layer and a metal layer are formed by joining a copper plate to one surface and the other surface of a ceramic substrate. In Patent Document 1, a copper plate is arranged on one surface and the other surface of a ceramic substrate with an Ag-Cu-Ti brazing material interposed therebetween, and the copper plate is joined by heat treatment (so-called). Active metal brazing method). Since this active metal brazing method uses a brazing material containing Ti, which is an active metal, the wettability between the molten brazing material and the ceramic substrate is improved, and the ceramic substrate and the copper plate are satisfactorily bonded. It will be.

Further, Patent Document 2 proposes an insulating circuit board in which a ceramic substrate and a copper plate are bonded to each other by using a Cu-Mg-Ti-based brazing material.
In Patent Document 2, the bonding is performed by heating at 560 to 800 ° C. in a nitrogen gas atmosphere, and Mg in the Cu—Mg—Ti alloy is sublimated and does not remain at the bonding interface. Moreover, it is assumed that titanium nitride (TiN) is not substantially formed.

Japanese Patent No. 3211856 Japanese Patent No. 4375730

By the way, in a high temperature semiconductor device using SiC or the like, semiconductor elements may be mounted at a high density, and it is necessary to guarantee the operation at a higher temperature on the insulating circuit board used for this.
Therefore, it is necessary to suppress the occurrence of cracks in the ceramic substrate even when a colder heat cycle stricter than the conventional one is applied.

The present invention has been made in view of the above-mentioned circumstances, and is capable of suppressing the occurrence of cracks in the ceramic substrate even when a severe cold-heat cycle is applied, and is a copper / ceramics joint having excellent cold-heat cycle reliability. It is an object of the present invention to provide a method for manufacturing a body, an insulating circuit board, a copper / ceramics joint, and a method for manufacturing an insulated circuit board.

In order to solve the above-mentioned problems, the copper / ceramics joint of the present invention is a copper / ceramics joint in which a copper member made of copper or a copper alloy and a ceramics member made of nitrogen-containing ceramics are joined. Between the copper member and the ceramics member, an active metal nitride layer containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on the ceramics member side. An Mg solid-dissolved layer in which Mg is solid-dissolved in the matrix phase of Cu is formed between the active metal nitride layer and the copper member, and Cu particles and Cu are formed inside the active metal nitride layer. It is characterized in that Cu-containing particles composed of either one or both of the compound particles of the active metal are dispersed.

According to the copper / ceramics joint of the present invention, an active metal nitride layer containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on the ceramic member side, and this activity Since the Mg solid-dissolved layer in which Mg is solid-dissolved is formed between the metal nitride layer and the copper member in the matrix phase of Cu, the interfacial reaction is sufficiently progressing, and the copper member and the ceramic member Are firmly joined.
Since Cu-containing particles composed of Cu particles and one or both of Cu and active metal compound particles are dispersed inside the active metal nitride layer, hard active metal nitride is applied under a cold cycle load. The stress in the material layer can be relaxed, and the occurrence of cracks in the ceramic member adjacent to the active metal nitride layer can be suppressed.

Here, in the copper / ceramics bonded body of the present invention, it is preferable that the particle size of the Cu-containing particles is within the range of 10 nm or more and 100 nm or less.
In this case, since the particle size of the Cu-containing particles is within the range of 10 nm or more and 100 nm or less, the stress relaxation effect in the active metal nitride layer can be sufficiently exerted, and the Cu-containing particles are adjacent to the active metal nitride layer. It is possible to further suppress the occurrence of cracks in the ceramic member.

Further, in the copper / ceramics joint of the present invention, it is preferable that Mg is present inside the active metal nitride layer.
In this case, the Mg existing inside the active metal nitride layer can obtain a stress relaxation effect in the active metal nitride layer, further suppressing the occurrence of cracks in the ceramic member adjacent to the active metal nitride layer. can do.

Further, in the copper / ceramics joint of the present invention, the average copper concentration C1 (atomic%) in the region from the interface on the ceramic member side to the position of 25% of the total thickness of the active metal nitride layer and the copper member side. The ratio C2 / C1 to the average copper concentration C2 (atomic%) in the region from the interface to the 25% position of the total thickness of the active metal nitride layer is preferably 0.8 or less.
In this case, in the active metal nitride layer, the copper concentration on the ceramic member side is higher than the copper concentration on the copper member side, so that the interfacial reaction is sufficiently advanced and the copper member and the ceramic member are further strengthened. It is joined to.

The insulating circuit substrate of the present invention is an insulating circuit substrate in which a copper plate made of copper or a copper alloy is bonded to the surface of a ceramics substrate made of nitrogen-containing ceramics, and the copper plate and the ceramics substrate are interleaved with each other. An active metal nitride layer containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on the ceramic substrate side, and Cu is formed between the active metal nitride layer and the copper plate. An Mg solid-dissolved layer in which Mg is solid-dissolved is formed in the matrix phase of the above, and the Cu-containing particles and / or Cu-containing compound particles of Cu and the active metal are contained inside the active metal nitride layer. It is characterized in that the particles are dispersed.

According to the insulating circuit substrate of the present invention, an active metal nitride layer containing one or more active metal nitrides selected from Ti, Zr, Nb, and Hf is formed on the ceramic substrate side, and the active metal nitride is formed. Since an Mg solid solution layer in which Mg is solid-dissolved is formed between the material layer and the copper plate in the Cu matrix, the interfacial reaction is sufficiently advanced and the copper plate and the ceramic substrate are firmly bonded to each other. Has been done.
Since Cu-containing particles composed of Cu particles and one or both of Cu and active metal compound particles are dispersed inside the active metal nitride layer, hard active metal nitride is applied under a cold cycle load. The stress in the material layer can be relaxed, and the occurrence of cracks in the ceramic substrate adjacent to the active metal nitride layer can be suppressed.

Here, in the insulating circuit board of the present invention, it is preferable that the particle size of the Cu-containing particles is within the range of 10 nm or more and 100 nm or less.
In this case, since the particle size of the Cu-containing particles is within the range of 10 nm or more and 100 nm or less, the stress relaxation effect in the active metal nitride layer can be sufficiently exerted, and the Cu-containing particles are adjacent to the active metal nitride layer. It is possible to further suppress the occurrence of cracks in the ceramic substrate.

Further, in the insulating circuit board of the present invention, it is preferable that Mg is present inside the active metal nitride layer.
In this case, the Mg existing inside the active metal nitride layer can obtain a stress relaxation effect in the active metal nitride layer, further suppressing the occurrence of cracks in the ceramic substrate adjacent to the active metal nitride layer. can do.

Further, in the insulating circuit substrate of the present invention, the average copper concentration C1 (atomic%) in the region from the ceramic substrate side interface to the position of 25% of the total thickness of the active metal nitride layer and the copper plate side interface to the above. The ratio C2 / C1 to the average copper concentration C2 (atomic%) in the region up to the 25% position of the total thickness of the active metal nitride layer is preferably 0.8 or less.
In this case, in the active metal nitride layer, the copper concentration on the ceramic substrate side is higher than the copper concentration on the copper plate side, so that the interfacial reaction is sufficiently advanced and the copper plate and the ceramic substrate are more firmly bonded to each other. Has been done.

The method for producing a copper / ceramics joint of the present invention is a method for producing a copper / ceramics joint for producing the above-mentioned copper / ceramics joint, and Ti, Zr. , Nb, Hf, an active metal and Mg placement step of arranging one or more types of active metals and Mg, and a laminating step of laminating the copper member and the ceramics member via the active metal and Mg. It is provided with a joining step of heat-treating and joining the copper member and the ceramics member laminated via the active metal and Mg in a state of being pressurized in the stacking direction in a vacuum atmosphere. In the Mg placement step, the amount of active metal was set in ^{the range of 0.4 μmol / cm 2} or more and 18.8 μmol / cm ² or less, and the Mg amount was set in the range of 14 μmol / cm ² or more and 86 μmol / cm ² or less. It is characterized in that it is held at an intermediate temperature of 440 ° C. or higher and lower than 480 ° C. for 30 min or more and 150 min or less, and then held at a temperature of 700 ° C. or higher for 15 min or longer.

According to the method for producing a copper / ceramics conjugate having this configuration, in the active metal and Mg placement step, the amount of active metal is in ^{the range of 0.4 μmol / cm 2} or more and 18.8 μmol / cm ² or less, and the amount of Mg is 14 μmol. since / cm ² or more 86Myumol / cm ² is within the range, it is possible to obtain a liquid phase necessary for the interfacial reaction sufficiently. Therefore, the copper member and the ceramic member can be reliably joined.
In the joining step, the ceramics are held at an intermediate temperature of 440 ° C. or higher and lower than 480 ° C. for 30 min or more and 150 min or less. A liquid phase containing the above is generated, and Mg penetrates into the ceramic member.
Further, since it is held at an intermediate temperature and then held at a temperature of 700 ° C. or higher for 15 minutes or longer, an active metal nitride layer is formed. Further, inside the ceramic member, a Cu—Mg liquid phase is generated starting from the portion where Mg has penetrated, Cu penetrates inside the ceramic member, and Cu-containing particles are dispersed.

The method for manufacturing an insulated circuit board of the present invention is a method for manufacturing an insulated circuit board for manufacturing the above-mentioned insulated circuit board, and is selected from Ti, Zr, Nb, and Hf between the copper plate and the ceramics substrate. An active metal and Mg placement step of arranging one or more kinds of active metals and Mg, a laminating step of laminating the copper plate and the ceramics substrate via the active metal and Mg, and laminating via the active metal and Mg. It is provided with a joining step of heat-treating and joining the copper plate and the ceramics substrate in a state of being pressurized in the stacking direction in a vacuum atmosphere. In the active metal and Mg placement steps, the amount of active metal is provided. Is in the range of 0.4 μmol / cm ² or more and 18.8 μmol / cm ² or less, and the amount of Mg is in the range of 14 μmol / cm ² or more and 86 μmol / cm ² or less. It is characterized in that it is held at a temperature of 30 min or more and 150 min or less, and then held at a temperature of 700 ° C. or higher for 15 min or more.

According to the method for manufacturing an insulated circuit board having this configuration, in the active metal and Mg placement step, the amount of active metal is in ^{the range of 0.4 μmol / cm 2} or more and 18.8 μmol / cm ² or less, and the amount of Mg is 14 μmol / cm. ^{Since the range is 2} or more and 86 μmol / cm 2 or less, a sufficient liquid phase required for the interfacial reaction can be obtained. Therefore, the copper plate and the ceramic substrate can be reliably joined.
In the joining step, the ceramics are held at an intermediate temperature of 440 ° C. or higher and lower than 480 ° C. for 30 min or more and 150 min or less. A liquid phase containing the mixture is generated, and Mg penetrates into the ceramic substrate.
Further, since the mixture is held at an intermediate temperature and then held at a temperature of 700 ° C. or higher for 15 minutes or longer, a Cu—Mg liquid phase is generated starting from the portion where Mg has penetrated, and Cu penetrates into the ceramic substrate. Cu-containing particles will be dispersed.

According to the present invention, even when a severe cold-heat cycle is applied, the occurrence of cracks in the ceramic substrate can be suppressed, and the copper / ceramics junction, the insulating circuit board, and the copper / ceramics having excellent cold-heat cycle reliability can be suppressed. It is possible to provide a method for manufacturing a bonded body and a method for manufacturing an insulated circuit board.

It is the schematic explanatory drawing of the power module using the insulation circuit board which concerns on embodiment of this invention. It is an observation result of the junction interface between the circuit layer (metal layer) of the insulating circuit board which concerns on embodiment of this invention, and a ceramics substrate. It is an enlarged explanatory view of the bonding interface between the circuit layer (metal layer) of the insulating circuit board which concerns on embodiment of this invention, and a ceramics substrate. It is a flow chart of the manufacturing method of the insulation circuit board which concerns on embodiment of this invention. It is the schematic explanatory drawing of the manufacturing method of the insulation circuit board which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
The copper / ceramics joint according to the present embodiment includes a ceramics substrate 11 as a ceramics member made of ceramics, and a copper plate 22 (circuit layer 12) and a copper plate 23 (metal layer 13) as copper members made of copper or a copper alloy. Is an insulated circuit board 10 formed by joining. FIG. 1 shows a power module 1 provided with an insulated circuit board 10 according to the present embodiment.

The power module 1 is bonded to an insulating circuit board 10 in which a circuit layer 12 and a metal layer 13 are arranged on a ceramic substrate 11 and to one surface (upper surface in FIG. 1) of the circuit layer 12 via a bonding layer 2. The semiconductor element 3 is provided with a heat sink 30 arranged on the other side (lower side in FIG. 1) of the metal layer 13.

The semiconductor element 3 is made of a semiconductor material such as Si. The semiconductor element 3 and the circuit layer 12 are bonded via a bonding layer 2.
The bonding layer 2 is made of, for example, a Sn-Ag-based, Sn-In-based, or Sn-Ag-Cu-based solder material.

The heat sink 30 is for dissipating heat from the above-mentioned insulating circuit board 10. The heat sink 30 is made of Cu or a Cu alloy, and in this embodiment, it is made of phosphorylated copper. The heat sink 30 is provided with a flow path 31 for flowing a cooling fluid.
In this embodiment, the heat sink 30 and the metal layer 13 are joined by a solder layer 32 made of a solder material. The solder layer 32 is made of, for example, a Sn-Ag-based, Sn-In-based, or Sn-Ag-Cu-based solder material.

As shown in FIG. 1, the insulating circuit board 10 of the present embodiment includes a ceramic substrate 11, a circuit layer 12 disposed on one surface (upper surface in FIG. 1) of the ceramic substrate 11, and ceramics. It includes a metal layer 13 disposed on the other surface (lower surface in FIG. 1) of the substrate 11.

The ceramic substrate 11 is made of nitrogen-containing ceramics having excellent insulating properties and heat dissipation, and is made of aluminum nitride (AlN) in this embodiment. The thickness of the ceramic substrate 11 is set, for example, within the range of 0.2 mm or more and 1.5 mm or less, and in the present embodiment, it is set to 0.635 mm. Silicon nitride can also be used in addition to aluminum nitride (AlN).

As shown in FIG. 5, the circuit layer 12 is formed by joining a copper plate 22 made of copper or a copper alloy to one surface (upper surface in FIG. 5) of the ceramic substrate 11.
In the present embodiment, the circuit layer 12 is formed by joining a copper plate 22 made of a rolled plate of oxygen-free copper to a ceramic substrate 11.
The thickness of the copper plate 22 to be the circuit layer 12 is set within the range of 0.1 mm or more and 2.0 mm or less, and in this embodiment, it is set to 0.6 mm.

As shown in FIG. 5, the metal layer 13 is formed by joining a copper plate 23 made of copper or a copper alloy to the other surface (lower surface in FIG. 5) of the ceramic substrate 11.
In the present embodiment, the metal layer 13 is formed by joining a copper plate 23 made of a rolled plate of oxygen-free copper to a ceramic substrate 11.
The thickness of the copper plate 23 to be the metal layer 13 is set within the range of 0.1 mm or more and 2.0 mm or less, and in this embodiment, it is set to 0.6 mm.

At the bonding interface between the ceramic substrate 11 and the circuit layer 12 (metal layer 13), as shown in FIGS. 2 and 3, one or more types selected from Ti, Zr, Nb, and Hf are placed on the ceramic substrate 11 side. An active metal nitride layer 41 made of an active metal nitride is formed, and an Mg solid solution layer 45 is formed so as to be laminated on the active metal nitride layer 41.
The Mg solid solution layer 45 has a bonding interface between the circuit layer 12 (metal layer 13) and the ceramics substrate 11 under the conditions of a magnification of 2000 times and an acceleration voltage of 15 kV using an EPMA device (JXA-8539F manufactured by Nippon Denshi Co., Ltd.). Observe the region including the bonding interface (length 400 μm x width 600 μm), and perform quantitative analysis at 10 points at 10 μm intervals from the surface of the ceramic substrate 11 toward the circuit layer 12 (metal layer 13), and Cu concentration + Mg concentration = Assuming 100 atomic%, this is a region where the Mg concentration is 0.01 atomic% or more and 6.9 atomic% or less. The bonding interface is not measured. Therefore, the Mg solid solution layer 45 exists in a region separated by 10 μm or more from the surface of the ceramic substrate 11 toward the copper plate circuit layer 12 (metal layer 13) side.

In this embodiment, it is preferable to use Ti as the active metal. In this case, the active metal nitride layer 41 is made of titanium nitride (TiN).
Here, in the present embodiment, it is preferable that the thickness of the active metal nitride layer 41 is in the range of 50 nm or more and 1200 nm or less. The lower limit of the thickness of the active metal nitride layer 41 is more preferably 100 nm or more, and more preferably 150 nm or more. On the other hand, the upper limit of the thickness of the active metal nitride layer 41 is more preferably 800 nm or less, and more preferably 600 nm or less.

Inside the active metal nitride layer 41, Cu-containing particles 42 composed of Cu particles and one or both of Cu and active metal compound particles are dispersed.
The above-mentioned Cu-containing particles 42 are abundantly present on the ceramic substrate 11 side of the active metal nitride layer 41, and are located in the region near the interface of the active metal nitride layer 41 from the interface with the ceramic substrate 11 to 500 nm. , 65% or more (number basis) of the Cu-containing particles 42 observed in the active metal nitride layer 41 is distributed. The ratio of the Cu-containing particles 42 distributed in the region near the interface is more preferably 85% or more, further preferably 95% or more, and the upper limit is 100%.

Here, in the present embodiment, it is preferable that the Cu-containing particles 42 have a particle size in the range of 10 nm or more and 100 nm or less.
The equivalent circle diameter of the Cu-containing particles 42 dispersed inside the active metal nitride layer 41 is more preferably 15 nm or more, and even more preferably 20 nm or more. On the other hand, the equivalent circle diameter of the Cu-containing particles 42 is more preferably 70 nm or less, and more preferably 50 nm or less.
Further, in the present embodiment, Mg may be present inside the active metal nitride layer 41. In this case, the Mg existing inside the active metal nitride layer 41 can obtain a stress relaxation effect in the active metal nitride layer 41, and cracks in the ceramic substrate 11 adjacent to the active metal nitride layer 41 occur. Can be further suppressed.
Here, the presence of Mg means that the active metal nitride layer 41 is 0 when the Mg concentration is Cu + Mg + active metal (Ti, Zr, Nb, Hf) = 100 atomic% in STEM-EDX analysis. The case where the amount is 0.01 atomic% or more and 70 atomic% or less is defined as the presence of Mg.

Further, in the present embodiment, the average copper concentration C1 (atomic%) in the region from the interface on the ceramic substrate 11 side to the position of 25% of the total thickness of the active metal nitride layer 41 and the circuit layer 12 (metal layer 13) side. The ratio C2 / C1 to the average copper concentration C2 (atomic%) in the region from the interface to the 25% position of the total thickness of the active metal nitride layer 41 is preferably 0.8 or less.
The lower limit of the copper concentration ratio C2 / C1 described above is not particularly limited, but is preferably 0.01 or more.

Hereinafter, a method for manufacturing the insulated circuit board 10 according to the present embodiment will be described with reference to FIGS. 4 and 5.

(Active metal and Mg placement step S01)
First, a ceramic substrate 11 made of aluminum nitride (AlN) is prepared, and as shown in FIG. 5, between the copper plate 22 as the circuit layer 12 and the ceramic substrate 11, and between the copper plate 23 as the metal layer 13 and the ceramic substrate. One or more active metals and Mg selected from Ti, Zr, Nb, and Hf are arranged between 11 and 11, respectively.
In the present embodiment, the Mg foil 25 and the active metal foil 26 are arranged between the copper plate 22 serving as the circuit layer 12 and the ceramic substrate 11 and between the copper plate 23 serving as the metal layer 13 and the ceramic substrate 11. ing.

Here, in the active metal and Mg placement step S01, the amount of active metal to be placed is in ^{the range of 0.4 μmol / cm 2} or more and 18.8 μmol / cm ² or less, and the Mg amount is 14 μmol / cm ² or more and 86 μmol / cm ² or less. Within the range.
The active metal content of placing preferably be 0.9μmol / cm ² or more, and even more preferably from 2.8μmol / cm ² or more. On the other hand, the active metal content of placing preferably be 9.4μmol / cm ² or less, still more preferably 6.6μmol / cm ² or less.
Further, Mg amount disposing is preferably set to 21 [mu] mol / cm ² or more, still more preferably 28μmol / cm ² or more. On the other hand, Mg amount disposing is preferably set to 72μmol / cm ² or less, still more preferably 57μmol / cm ² or less.

(Laminating step S02)
Next, the copper plate 22 and the ceramic substrate 11 are laminated via the active metal foil 26 and the Mg foil 25, and the ceramic substrate 11 and the copper plate 23 are laminated via the active metal foil 26 and the Mg foil 25.

(Joining step S03)
Next, the laminated copper plate 22, the active metal foil 26, the Mg foil 25, the ceramic substrate 11, the Mg foil 25, the active metal foil 26, and the copper plate 23 are pressurized in the stacking direction and charged into the vacuum furnace. It is heated to join the copper plate 22, the ceramic substrate 11, and the copper plate 23.
Here, in the joining step S03, an intermediate holding step of holding at an intermediate temperature of 440 ° C. or higher and lower than 480 ° C. for 30 min or more and 150 min or less, and then a high temperature holding step of heating and holding at a temperature of 700 ° C. or higher for 15 min or more. It has.

By holding the Cu-Mg at an intermediate temperature lower than the eutectic temperature (484 ° C.), the ceramic substrate 11 and Mg react in a solid phase state at the bonding interface, the decomposition reaction of the ceramics proceeds, and Mg is locally produced. A liquid phase containing the mixture is generated, and Mg penetrates into the ceramic substrate 11.

Here, if the holding temperature in the intermediate holding step is less than 440 ° C., the reaction between the ceramic substrate 11 and the active metal may be insufficient. Further, when the holding temperature in the intermediate holding step is 480 ° C. or higher, a liquid phase is formed at the bonding interface, and the ceramic substrate 11 and Mg cannot be reacted in the solid phase state. The Cu-containing particles 42 may not be sufficiently dispersed inside the nitride layer 41.
Therefore, the holding temperature in the intermediate holding step is 440 ° C. or higher, preferably 445 ° C. or higher, and more preferably 450 ° C. or higher. On the other hand, the holding temperature in the intermediate holding step is less than 480 ° C, preferably 475 ° C or lower, and more preferably 470 ° C or lower.

Further, if the holding time in the intermediate holding step is less than 30 min, the reaction between the ceramic substrate 11 and the active metal may be insufficient. Further, if the holding time in the intermediate holding step exceeds 150 min or more, the reaction in the solid phase state may proceed excessively, and the copper plates 22 and 23 and the ceramic substrate 11 may not be bonded.
Therefore, the holding time in the intermediate holding step is 30 minutes or more, preferably 45 minutes or more, and more preferably 60 minutes or more. On the other hand, the holding time in the intermediate holding step is 150 min or less, preferably 120 min or less, and more preferably 90 min or less.

After the intermediate holding step, a liquid phase is formed at the bonding interface by a high temperature holding step of holding at a temperature of 700 ° C. or higher for 15 minutes or longer, an active metal nitride layer 41 is formed, and the ceramic substrate 11 and the copper plates 22 and 23 are formed. It will be firmly joined. Further, inside the ceramic substrate 11, a Cu—Mg liquid phase is generated starting from a portion where Mg has penetrated, Cu penetrates inside the ceramic substrate 11, and Cu-containing particles are dispersed.
Here, if the heating temperature in the high temperature holding step is less than 700 ° C., a sufficient liquid phase cannot be secured, and the ceramic substrate 11 and the copper plates 22 and 23 may not be firmly bonded.
Therefore, the heating temperature in the high temperature holding step is 700 ° C. or higher, preferably 730 ° C. or higher, and more preferably 750 ° C. or higher. The heating temperature in the high temperature holding step is preferably 850 ° C. or lower, more preferably 830 ° C. or lower.

Further, if the holding time in the high temperature holding step is less than 15 minutes, the ceramic substrate 11 and the copper plates 22 and 23 may not be firmly bonded.
Therefore, the holding time in the high temperature holding step is 15 minutes or more, preferably 30 minutes or more, and more preferably 45 minutes or more. The holding time in the high temperature holding step is preferably 150 min or less, and more preferably 120 min or less.

As described above, the insulating circuit board 10 according to the present embodiment is manufactured by the active metal and Mg arranging step S01, the laminating step S02, and the joining step S03.

(Heat sink joining step S04)
Next, the heat sink 30 is joined to the other surface side of the metal layer 13 of the insulating circuit board 10.
The insulating circuit board 10 and the heat sink 30 are laminated via a solder material and charged into a heating furnace, and the insulating circuit board 10 and the heat sink 30 are solder-bonded via the solder layer 32.

(Semiconductor element joining step S05)
Next, the semiconductor element 3 is soldered to one surface of the circuit layer 12 of the insulating circuit board 10.
The power module 1 shown in FIG. 1 is produced by the above-mentioned steps.

According to the insulating circuit substrate 10 (copper / ceramics bonded body) of the present embodiment having the above configuration, one or more active metals selected from Ti, Zr, Nb, and Hf are formed on the ceramics substrate 11 side. An active metal nitride layer 41 containing a nitride is formed, and an Mg solid solution layer 45 in which Mg is solid-solved in the matrix of Cu between the active metal nitride layer 41 and the circuit layer 12 (metal layer 13) is formed. Is formed, the interfacial reaction is sufficiently advanced, and the circuit layer 12 (metal layer 13) and the ceramics substrate 11 are firmly bonded to each other.

In the present embodiment, the Cu-containing particles 42 composed of Cu particles and one or both of Cu and active metal compound particles are dispersed inside the active metal nitride layer 41, so that a cold cycle load is applied. At times, the stress in the hard active metal nitride layer 41 can be relaxed, and the occurrence of cracks in the ceramic substrate 11 adjacent to the active metal nitride layer 41 can be suppressed.

Further, in the present embodiment, when the particle diameter of the Cu-containing particles 42 is within the range of 10 nm or more and 100 nm or less, the stress relaxation effect of the Cu-containing particles 42 in the active metal nitride layer 41 is sufficiently effective. This makes it possible to further suppress the occurrence of cracks in the ceramic substrate 11 adjacent to the active metal nitride layer 41.

Further, in the present embodiment, when Mg is present inside the active metal nitride layer 41, the stress relaxation effect in the active metal nitride layer 41 can be obtained by this Mg, and this active metal nitride layer can be obtained. The occurrence of cracks in the ceramic substrate 11 adjacent to 41 can be further suppressed.

Further, in the present embodiment, the average copper concentration C1 (atomic%) in the region from the interface on the ceramic substrate 11 side to the position of 25% of the total thickness of the active metal nitride layer 41 and the circuit layer 12 (metal layer 13) side. When the ratio C2 / C1 to the average copper concentration C2 (atomic%) in the region from the interface to the 25% position of the total thickness of the active metal nitride layer 41 is 0.8 or less, the active metal nitride layer 41 Since the copper concentration on the ceramic substrate 11 side is higher than the copper concentration on the circuit layer 12 (metal layer 13) side, the interfacial reaction is sufficiently progressing, and the circuit layer 12 (metal layer 13) and the ceramic substrate 11 Is more firmly joined.

According to the method for manufacturing an insulated circuit board according to the present embodiment, in the active metal and Mg placement step S01, the amount of active metal is in ^{the range of 0.4 μmol / cm 2} or more and 18.8 μmol / cm ² or less, and the amount of Mg is 14 μmol. since / cm ² or more 86Myumol / cm ² is within the range, it is possible to obtain a liquid phase necessary for the interfacial reaction sufficiently. Therefore, the copper plates 22 and 23 and the ceramic substrate 11 can be reliably joined.

Then, in the joining step S03, it is held at an intermediate temperature of 440 ° C. or higher and lower than 480 ° C. for 30 min or more and 150 min or less, and then held at a temperature of 700 ° C. or higher for 15 min or longer. The ceramic decomposition reaction proceeds in the solid phase state, a liquid phase containing Mg is locally generated, and Mg penetrates into the ceramic substrate 11.
Further, since it is held at an intermediate temperature and then held at a temperature of 700 ° C. or higher for 15 minutes or longer, the active metal nitride layer 41 is formed. Further, inside the ceramic substrate 11, a Cu—Mg liquid phase is generated starting from a portion where Mg has penetrated, Cu penetrates inside the ceramic substrate 11, and Cu-containing particles are dispersed.

Although the embodiments of the present invention have been described above, the present invention is not limited to this, and can be appropriately changed without departing from the technical idea of the invention.
For example, in the present embodiment, a semiconductor element is mounted on an insulating circuit board to form a power module, but the present embodiment is not limited to this. For example, an LED element may be mounted on the circuit layer of the insulated circuit board to form an LED module, or a thermoelectric element may be mounted on the circuit layer of the insulated circuit board to form a thermoelectric module.

Further, in the insulated circuit board of the present embodiment, it has been described that the circuit layer and the metal layer are both composed of a copper plate made of copper or a copper alloy, but the present invention is not limited to this.
For example, if the circuit layer and the ceramic substrate are composed of the copper / ceramics joint of the present invention, the material and joining method of the metal layer are not limited, and the metal layer may not be present, or the metal layer may be aluminum or It may be composed of an aluminum alloy or a laminate of copper and aluminum.
On the other hand, as long as the metal layer and the ceramic substrate are made of the copper / ceramics joint of the present invention, the material and joining method of the circuit layer are not limited, and the circuit layer may be made of aluminum or an aluminum alloy. , It may be composed of a laminate of copper and aluminum.

Further, in the present embodiment, the configuration has been described in which the active metal foil and the Mg foil are laminated between the copper plate and the ceramic substrate, but the present invention is not limited to this, and an alloy foil of Mg and the active metal is arranged. You may. Further, a thin film made of Mg, an active metal, an alloy of Mg and an active metal, or the like may be formed on the joint surface between the ceramic substrate and the copper plate by a sputtering method, a vapor deposition method, or the like. Further, a paste using Mg or MgH ₂ , a paste using an active metal or an active metal hydride, or a mixed paste thereof may be used.

In this embodiment, the pressurizing load in the joining step S03 is preferably in the range of 0.049 MPa or more and 3.4 MPa or less. Further, the degree of vacuum in the joining step S03 is preferably in the range of ^{1 × 10 −6} Pa or more and 5 × 10 − ^{2 Pa or less.}

The results of the confirmation experiment conducted to confirm the effect of the present invention will be described below.

(Example 1)
First, the ceramic substrates (40 mm × 40 mm) shown in Tables 1 and 2 were prepared. In Examples 1 to 4 of the present invention and Comparative Examples 1 to 5, aluminum nitride (AlN) having a thickness of 0.635 mm is used, and in Examples 11 to 14 of the present invention and Comparative Examples 11 to 15, the thickness is 0.32 mm. Silicon nitride (Si ₃ N ₄ ) was used.
A copper plate (37 mm × 37 mm × thickness 0.3 mm) made of oxygen-free copper was bonded to both sides of this ceramic substrate under the conditions shown in Tables 1 and 2 to obtain an insulating circuit substrate (copper / ceramics bonded body). The degree of vacuum of the vacuum furnace at the time of joining was set to 6 × 10 ^-3 Pa.

Regarding the obtained insulating circuit substrate (copper / ceramics bonded body), the presence or absence of a Mg solid solution layer at the bonding interface, Cu-containing particles (Cu particles and compound particles of Cu and active metal) in the active metal nitride layer, or one of them. The presence or absence of both), the equivalent circle diameter, the presence or absence of Mg in the active metal nitride layer, and the presence or absence of cracks in the ceramic substrate after loading with a thermal cycle were evaluated as follows.

(Mg solid solution layer)
Observe the bonding interface between the copper plate and the ceramic substrate using an EPMA device (JXA-8539F manufactured by Nippon Denshi Co., Ltd.) under the conditions of a magnification of 2000 times and an acceleration voltage of 15 kV (length 400 μm x width 600 μm). Then, quantitative analysis was performed at 10 points at 10 μm intervals from the surface of the ceramic substrate toward the copper plate side, and the region where the Mg concentration was 0.01 atomic% or more and 6.9 atomic% or less was defined as Cu concentration + Mg concentration = 100 atomic%. The Mg solid melt layer was used. The measurement was carried out in five fields of view, and the case where the Mg solid solution layer was observed even in one place was regarded as “Yes” and is shown in Tables 3 and 4.

(Active metal nitride layer)
The bonding interface between the copper plate and the ceramic substrate was observed using a scanning electron microscope (ULTRA55 manufactured by Carl Zeiss NTS) at a magnification of 15,000 times (measurement range: 6 μm × 8 μm) and a field number of 5, and the active metal nitride was observed. The presence or absence of the layer was confirmed, and the presence or absence of Cu-containing particles in the active metal nitride layer was confirmed. In addition, the circle-equivalent diameter of the observed Cu-containing particles was calculated.
Furthermore, the presence or absence of Mg in the active metal nitride layer was confirmed. The presence or absence of Mg in the active metal nitride layer was confirmed by the method described above. The measurement was performed in 5 fields of view, and the case where Mg was observed even in one place was regarded as “Yes” and is shown in Tables 3 and 4.

(Cracking of ceramic substrate)
After applying a cooling cycle of −78 ° C. × 2 min ← → 350 ° C. × 2 min, the joint interface between the copper plate and the ceramic substrate is inspected by SAT inspection, ceramic cracks are confirmed, and the number of cycles in which cracks are confirmed is evaluated. did.
In Examples 1 to 4 of the present invention and Comparative Examples 1 and 2 in which aluminum nitride (AlN) was used as the ceramic substrate, the above-mentioned cooling and heating cycles were carried out up to 10 cycles, and no cracks were confirmed after 10 cycles. ">10" was displayed.
Further, in Examples 11 to 14 of the present invention and Comparative Examples 11 and 12 in which silicon nitride (Si ₃ N ₄ ) was used as the ceramic substrate, the above-mentioned cooling and heating cycles were carried out up to 20 cycles, and no cracks were confirmed after 20 cycles. The one was displayed as ">20".

In Comparative Example 1 in which the intermediate temperature holding step was not carried out, Cu-containing particles were not present in the active metal nitride layer, and cracks occurred in the ceramic substrate after the cold-heat cycle load.
In Comparative Example 2 in which the holding temperature in the intermediate temperature holding step was as low as 200 ° C., Cu-containing particles were not present in the active metal nitride layer, and cracks occurred in the ceramic substrate after the cold cycle loading.
In Comparative Example 11 in which the holding time in the intermediate temperature holding step was as short as 5 min, Cu-containing particles were not present in the active metal nitride layer, and cracks occurred in the ceramic substrate after the cold cycle loading.
Comparative Example Mg amount is small and 7 [mu] mol / cm ² 3 and Comparative Example 13, the active metal content is 0.1 [mu] mol / cm ² and less Comparative Example 4, the holding temperature in the intermediate temperature hold step 520 ° C. and higher Comparative Example 5 and Comparative In Example 15, Comparative Example 12 in which the holding time in the intermediate temperature holding step was as long as 500 min, and ^{Comparative Example 14 in which the amount of active metal was as small as 0.2 μmol / cm 2} , the copper plate and the ceramic substrate could not be bonded. Therefore, the subsequent evaluation was stopped.

On the other hand, in Examples 1-4, 11-14 of the present invention in which Cu-containing particles were dispersed in the active metal nitride layer, no cracking of the ceramic substrate was confirmed after the cold-heat cycle load.

(Example 2)
Next, the ceramic substrates (40 mm × 40 mm) shown in Tables 5 and 6 were prepared. In the present invention example 21 to 28, using the aluminum nitride having a thickness of 0.635 mm (AlN), in the present invention examples 31 to 38 were used a silicon nitride having a thickness of 0.32mm _(Si 3 _{N 4)} ..
A copper plate (37 mm × 37 mm × thickness 0.3 mm) made of oxygen-free copper was bonded to both sides of the ceramic substrate under the conditions shown in Tables 5 and 6 to obtain an insulating circuit substrate (copper / ceramics bonded body). The degree of vacuum of the vacuum furnace at the time of joining was set to 6 × 10 ^-3 Pa.

With respect to the obtained insulating circuit substrate (copper / ceramics bonded body), the presence or absence of an Mg solid solution layer at the bonding interface, and Cu-containing particles (Cu particles and compound particles of Cu and active metal) in the active metal nitride layer. The presence or absence of either one or both) was evaluated by the method described in Example 1. In addition, the copper concentration in the active metal nitride layer and the presence or absence of cracks in the ceramic substrate after loading with a cold cycle were evaluated as follows.

(Copper concentration in active metal nitride layer)
Using a scanning transmission electron microscope (Titan ChemiSTEM manufactured by FEI), the bonding interface between the copper plate and the ceramic substrate is accelerating voltage 200 kV, magnification 20,000 to 200,000 times, Cu, Mg, N and active metal in the thickness direction. A line analysis of (Ti, Zr, Nb, Hf) was performed. Then, a graph was created with the vertical axis representing the copper concentration (copper concentration when the total amount of Cu, Mg, N, and active metal was 100 atomic%) and the horizontal axis representing the measurement position.

The interface position of the active metal nitride layer was defined as the position where the nitride-forming element was 10 atomic% or more for the first time when viewed from the ceramic substrate or the copper plate. Then, the average value of the copper concentration in the region from the interface on the ceramic substrate side to the 25% position of the total thickness of the active metal nitride layer is C1, and the copper in the region from the interface on the copper plate side to the 25% position of the total thickness of the active metal nitride layer. The average value of the concentrations was C2, and the concentration ratio C2 / C1 was calculated. The measurement was carried out in 5 fields and 1 line each, and the average value of the obtained concentration ratios C2 / C1 was obtained and shown in Tables 7 and 8.

(Cracking of ceramic substrate)
After applying a cooling cycle of −78 ° C. × 5 min ← → 350 ° C. × 5 min, the joint interface between the copper plate and the ceramic substrate is inspected by SAT inspection, ceramic cracks are confirmed, and the number of cycles in which cracks are confirmed is evaluated. did.
In Examples 21 to 28 of the present invention using aluminum nitride (AlN) as the ceramic substrate, the above-mentioned cooling and heating cycles were carried out up to 8 cycles, and those in which no crack was confirmed after 8 cycles were indicated as ">8". did.
_{Further, in Examples 31 to} 38 of the present invention in which silicon nitride (Si 3 N ₄ ) was used as the ceramic substrate, the above-mentioned cooling and heating cycles were carried out up to 16 cycles, and those in which no crack was confirmed after 16 cycles were “> 16”. Was displayed.

In Examples 21 to 27 of the present invention in which the ratio C2 / C1 of the copper concentration in the active metal nitride layer is 0.8 or less, compared with Example 28 of the present invention in which the above-mentioned ratio C2 / C1 of the copper concentration exceeds 0.8. It was confirmed that the occurrence of cracks under the load of a cold cycle can be suppressed.
Further, in Examples 31 to 38 of the present invention, when the same active elements are compared, the smaller the ratio C2 / C1 of the copper concentration in the active metal nitride layer, the more the occurrence of cracks at the time of loading the thermal cycle can be suppressed. Was confirmed.

As a result of the above, according to the example of the present invention, even when a severe cold-heat cycle is applied, the occurrence of cracks in the ceramic substrate can be suppressed, and the copper / ceramic joint, the insulating circuit board, which has excellent cold-heat cycle reliability. It was also confirmed that it is possible to provide a method for manufacturing a copper / ceramics joint and a method for manufacturing an insulated circuit board.

10 Insulated circuit board (copper / ceramic joint)
11 Ceramic substrate (ceramic member)
12 Circuit layer (copper member)
13 Metal layer (copper member)
41 Active metal nitride layer 42 Cu-containing particles (Cu particles and compound particles of Cu and active metal)
45 Mg solid solution layer

In order to solve the above-mentioned problems, the copper / ceramics joint of the present invention is a copper / ceramics joint in which a copper member made of copper or a copper alloy and a ceramics member made of nitrogen-containing ceramics are joined. Between the copper member and the ceramics member, an active metal nitride layer containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on the ceramics member side. An Mg solid-dissolved layer in which Mg is solid-dissolved in the matrix phase of Cu is formed between the active metal nitride layer and the copper member, and Cu particles and Cu are formed inside the active metal nitride layer. Cu-containing particles composed of either or both of the active metal compound particles are dispersed, and the average copper concentration C1 in the region from the ceramic member side interface to the 25% position of the total thickness of the active metal nitride layer ( The ratio C2 / C1 of (atomic%) to the average copper concentration C2 (atomic%) in the region from the copper member side interface to the 25% position of the total thickness of the active metal nitride layer is 0.8 or less. It is characterized by.

According to the copper / ceramics joint of the present invention, an active metal nitride layer containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on the ceramic member side, and this activity Since the Mg solid-dissolved layer in which Mg is solid-dissolved is formed between the metal nitride layer and the copper member in the matrix phase of Cu, the interfacial reaction is sufficiently progressing, and the copper member and the ceramic member Are firmly joined.
Since Cu-containing particles composed of Cu particles and one or both of Cu and active metal compound particles are dispersed inside the active metal nitride layer, hard active metal nitride is applied under a cold cycle load. The stress in the material layer can be relaxed, and the occurrence of cracks in the ceramic member adjacent to the active metal nitride layer can be suppressed.
Further, in the active metal nitride layer, since the copper concentration on the ceramic member side is higher than the copper concentration on the copper member side, the interfacial reaction is sufficiently progressing, and the copper member and the ceramic member are further strengthened. It is joined.

The insulating circuit substrate of the present invention is an insulating circuit substrate in which a copper plate made of copper or a copper alloy is bonded to the surface of a ceramics substrate made of nitrogen-containing ceramics, and the copper plate and the ceramics substrate are interleaved with each other. An active metal nitride layer containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on the ceramic substrate side, and Cu is formed between the active metal nitride layer and the copper plate. An Mg solid-dissolved layer in which Mg is solid-dissolved is formed in the matrix phase of the above, and the Cu-containing particles and / or Cu-containing compound particles of Cu and the active metal are contained inside the active metal nitride layer. The particles are dispersed, and the average copper concentration C1 (atomic%) in the region from the interface on the ceramic substrate side to the position of 25% of the total thickness of the active metal nitride layer and the active metal nitride from the interface on the copper plate side. It is characterized in that the ratio C2 / C1 to the average copper concentration C2 (atomic%) in the region up to the 25% position of the total thickness of the layer is 0.8 or less.

According to the insulating circuit substrate of the present invention, an active metal nitride layer containing one or more active metal nitrides selected from Ti, Zr, Nb, and Hf is formed on the ceramic substrate side, and the active metal nitride is formed. Since an Mg solid solution layer in which Mg is solid-dissolved is formed between the material layer and the copper plate in the Cu matrix, the interfacial reaction is sufficiently advanced and the copper plate and the ceramic substrate are firmly bonded to each other. Has been done.
Since Cu-containing particles composed of Cu particles and one or both of Cu and active metal compound particles are dispersed inside the active metal nitride layer, hard active metal nitride is applied under a cold cycle load. The stress in the material layer can be relaxed, and the occurrence of cracks in the ceramic substrate adjacent to the active metal nitride layer can be suppressed.
Further, in the active metal nitride layer, since the copper concentration on the ceramic substrate side is higher than the copper concentration on the copper plate side, the interfacial reaction has sufficiently proceeded, and the copper plate and the ceramic substrate are more firmly bonded to each other. ing.

Claims (10)

A copper / ceramic joint formed by joining a copper member made of copper or a copper alloy and a ceramic member made of nitrogen-containing ceramics.
Between the copper member and the ceramic member, an active metal nitride layer containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on the ceramic member side. An Mg solid solution layer in which Mg is solid-solved in the matrix phase of Cu is formed between the active metal nitride layer and the copper member.
A copper / ceramics conjugate in which Cu-containing particles composed of Cu particles and / or both of Cu and a compound particle of an active metal are dispersed inside the active metal nitride layer. The copper / ceramics conjugate according to claim 1, wherein the Cu-containing particles have a particle size in the range of 10 nm or more and 100 nm or less. The copper / ceramics conjugate according to claim 1 or 2, wherein Mg is present inside the active metal nitride layer. The average copper concentration C1 (atomic%) in the region from the ceramic member side interface to the position of 25% of the total thickness of the active metal nitride layer and 25 of the total thickness of the active metal nitride layer from the copper member side interface. The copper / ceramics according to any one of claims 1 to 3, wherein the ratio C2 / C1 to the average copper concentration C2 (atomic%) in the region up to the% position is 0.8 or less. Joined body. An insulating circuit board in which a copper plate made of copper or a copper alloy is bonded to the surface of a ceramic substrate made of nitrogen-containing ceramics.
Between the copper plate and the ceramic substrate, an active metal nitride layer containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on the ceramic substrate side, and this activity An Mg solid solution layer in which Mg is solid-solved is formed in the matrix phase of Cu between the metal nitride layer and the copper plate.
An insulating circuit substrate characterized in that Cu-containing particles composed of Cu particles and / or both of Cu and a compound particle of an active metal are dispersed inside the active metal nitride layer. The insulating circuit board according to claim 5, wherein the particle size of the Cu-containing particles is in the range of 10 nm or more and 100 nm or less. The insulating circuit board according to claim 5 or 6, wherein Mg is present inside the active metal nitride layer. The average copper concentration C1 (atomic%) in the region from the ceramic substrate side interface to the 25% position of the total thickness of the active metal nitride layer and 25% of the total thickness of the active metal nitride layer from the copper plate side interface. The insulating circuit substrate according to any one of claims 5 to 7, wherein the ratio C2 / C1 to the average copper concentration C2 (atomic%) in the region up to the position is 0.8 or less. The method for manufacturing a copper / ceramics joint according to any one of claims 1 to 4, wherein the copper / ceramics joint is manufactured.
An active metal and Mg arranging step of arranging one or more active metals and Mg selected from Ti, Zr, Nb, and Hf between the copper member and the ceramics member.
A laminating step of laminating the copper member and the ceramic member via an active metal and Mg,
A joining step in which the copper member and the ceramic member laminated via the active metal and Mg are joined by heat treatment in a vacuum atmosphere while being pressurized in the stacking direction.
Is equipped with
In the active metal and Mg placement step, the amount of active metal is set ^{within the range of 0.4 μmol / cm 2} or more and 18.8 μmol / cm ² or less, and the amount of Mg is set within the range of 14 μmol / cm ² or more and 86 μmol / cm ² or less.
A method for producing a copper / ceramics bonded body, which comprises holding at an intermediate temperature of 440 ° C. or higher and lower than 480 ° C. for 30 min or more and 150 min or less, and then holding at a temperature of 700 ° C. or higher for 15 min or more. The method for manufacturing an insulated circuit board according to any one of claims 5 to 8.
An active metal and Mg placement step of placing one or more active metals and Mg selected from Ti, Zr, Nb, and Hf between the copper plate and the ceramic substrate.
A laminating step of laminating the copper plate and the ceramic substrate via an active metal and Mg, and
A joining step in which the copper plate laminated via the active metal and Mg and the ceramic substrate are joined by heat treatment in a vacuum atmosphere while being pressurized in the stacking direction.
Is equipped with
In the active metal and Mg placement step, the amount of active metal is set ^{within the range of 0.4 μmol / cm 2} or more and 18.8 μmol / cm ² or less, and the amount of Mg is set within the range of 14 μmol / cm ² or more and 86 μmol / cm ² or less.
A method for manufacturing an insulated circuit board, which comprises holding 30 min or more and 150 min or less at an intermediate temperature of 440 ° C. or higher and lower than 480 ° C., and then holding 15 min or more at a temperature of 700 ° C. or higher in the joining step.

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