JP2021090983A - Ultrasonic bonding apparatus - Google Patents

Abstract

To provide an ultrasonic bonding apparatus which prevents a horn from deflecting in high-output ultrasonic bonding, and allows ultrasonic bonding of high accuracy to be performed.SOLUTION: An ultrasonic bonding apparatus 100 applies load to a bonding target site, and further, applies ultrasonic oscillation in a lateral direction from an ultrasonic horn 20 to the bonding target site. The ultrasonic bonding apparatus is equipped with a pair of nodal rods 22a and 22b that press a portion being a node of ultrasonic oscillation of the ultrasonic horn 20 from a right and left direction crossing a longitudinal direction of the ultrasonic horn 20.SELECTED DRAWING: Figure 1

Description

The present invention relates to an ultrasonic bonding device for bonding by applying lateral ultrasonic vibration to a bonding target portion, and more particularly to an ultrasonic bonding device capable of supporting high-power ultrasonic bonding.

As an ultrasonic bonding apparatus for bonding by applying lateral ultrasonic vibration to a bonding target portion, the one disclosed in Patent Document 1 is known.

The ultrasonic bonding apparatus disclosed in Patent Document 1 includes an ultrasonic horn 12 which is preset to a length of one wavelength of the ultrasonic frequency and has maximum vibration amplitude points at both ends and the central portion in the longitudinal direction. A bonding action portion 12b provided at the maximum vibration amplitude point at the center of the ultrasonic horn 12 in the longitudinal direction, an ultrasonic vibrator 32 that vibrates the ultrasonic horn 12 laterally, and a support in which the ultrasonic horn 12 is detachably fixed and fixed. A member 26 and a pressurizing means for pressurizing the ultrasonic horn 12 are provided, and insertion holes 31 are formed at two nodal point positions of the ultrasonic horn 12, and the ultrasonic horn 12 at the center of the insertion hole 31 is provided. A fixing bolt 30 is fastened to the center of the cross section of the above to support the ultrasonic horn 12.

The ultrasonic bonding apparatus disclosed in Patent Document 2 uses a so-called one-wavelength horn as the ultrasonic horn 12, and when this one-wavelength horn is used, a portion of the ultrasonic horn that becomes a node of ultrasonic vibration. There are two (nodal points), which causes problems that manufacturing is difficult, costly, and it is not easy for the user to replace them.

Therefore, an ultrasonic bonding device using a half-wavelength horn in which one end is connected to an ultrasonic cone and the other end is provided with a bonding action portion (ultrasonic bonding head) has been proposed. In an ultrasonic bonding device using this half-wavelength horn, if a load of several thousand N or more is applied to the tip of the horn, the horn will bend, so a nodal rod that presses the part that becomes the node of ultrasonic vibration of the horn from above. (Upward holding member) is provided to prevent upward bending.

However, even in the above configuration, when joining at a high output (5000 W or more), the horn may bend to the left and right, and in this case, there is a problem that high-precision joining cannot be performed.

Japanese Unexamined Patent Publication No. 2006-315002

Therefore, an object of the present invention is to provide an ultrasonic bonding apparatus that prevents bending of a horn in high-power ultrasonic bonding and enables high-precision ultrasonic bonding.

In order to achieve the above object, the invention of claim 1 applies a weight to the bonding target portion and applies lateral ultrasonic vibration from the ultrasonic horn to the bonding target portion to obtain the bonding target portion. It is an ultrasonic bonding device for bonding, and includes a pair of left-right direction pressing members that press the portion of the ultrasonic horn that becomes a node of ultrasonic vibration from the left-right direction orthogonal to the longitudinal direction of the ultrasonic horn. It is characterized by.

A second aspect of the present invention is the invention according to the first aspect, wherein the pair of left-right pressing members are formed of pressing rods that face each other and are provided coaxially with each other.

The invention of claim 3 is the invention according to claim 1 or 2, wherein the ultrasonic horn comprises a half-wavelength horn having one end connected to an ultrasonic cone and the other end provided with an ultrasonic bonding head. It is characterized by.

The invention of claim 4 includes, in the invention of claims 1 to 3, an upward pressing member that presses a portion of the ultrasonic horn that becomes a node of ultrasonic vibration from above of the ultrasonic horn. It is characterized by being.

According to the present invention, an ultrasonic bonding apparatus for bonding a bonding target portion by applying a load to the bonding target portion and applying lateral ultrasonic vibration to the bonding target portion, wherein the ultrasonic waves are formed. Since it is configured to include a pair of left-right direction pressing members that press the section of the horn that becomes a node of ultrasonic vibration from the left-right direction orthogonal to the longitudinal direction of the ultrasonic horn, the horn in high-power ultrasonic bonding is provided. It has the effect of providing an ultrasonic bonding device that prevents bending and enables high-precision ultrasonic bonding.

FIG. 1 is a front view of an embodiment of an ultrasonic bonding device according to the present invention. FIG. 2 is a top view of the ultrasonic bonding device shown in FIG. FIG. 3 is a side view of the ultrasonic bonding device shown in FIG. FIG. 4 is an explanatory diagram illustrating a half-wavelength horn of the ultrasonic bonding device according to the present invention.

Hereinafter, examples for carrying out the present invention will be described in detail with reference to the attached drawings.

FIG. 1 is a front view of an embodiment of an ultrasonic bonding device according to the present invention, FIG. 2 is a top view of the ultrasonic bonding device shown in FIG. 1, and FIG. 3 is shown in FIG. It is a side view of the ultrasonic bonding apparatus.

In FIGS. 1 to 3, the ultrasonic joining device 100 according to the present invention is configured by mounting the device main body 10 on a base 11, and the device main body 10 has an ultrasonic horn (hereinafter, hereinafter) on the upper portion thereof. , The ultrasonic cone (hereinafter, simply referred to as a cone) 30 that transmits ultrasonic vibration to the horn 20, and the ultrasonic vibrator (hereinafter, simply referred to as a cone) that generates the transmission vibration to the cone 30. An ultrasonic application means including (called a vibrator) 40 is mounted.

Here, the horn 20 has four head portions 21a, 21b, 21c, and 21d arranged on the peripheral edge of the tip thereof, and the reason why the four head portions 21a to 21d are provided is that the horn 20 is provided. This is because the four head portions 21a to 21d can be switched and used without exchanging the horn 20 by rotating them by 90 degrees.

By the way, the horn 20 of this embodiment is composed of a so-called half-wavelength horn, and an upward pressing member for suppressing the upward deflection of the horn 20 at a portion of the horn 20 serving as a node of ultrasonic vibration (hereinafter referred to as an upward pressing member). 22c (simply called a nodal stick) is provided. The details of the half-wavelength horn will be described later with reference to FIG.

In the horn 20 of the ultrasonic joining device 100 according to the present invention, in order to suppress the deflection of the horn 20 in the left-right direction, a portion of the horn 20 serving as a node of ultrasonic vibration is provided in the left-right direction (in the longitudinal direction of the horn 20). A pair of left-right direction pressing members (hereinafter, simply referred to as nodal rods) 22a and 22b for pressing from the right-right directions) are provided.

Here, the reason why the nodal rods 22a and 22b are provided at the portions of the horn 20 that are the nodes of the ultrasonic vibration is that when the output of the ultrasonic bonding device 100 is a high output of 5000 W or more, the horn 20 is located in the left-right direction. This is because bending occurs and high-precision bonding cannot be achieved simply by providing the nodal rod 22c for suppressing the upward bending of the horn 20.

According to the ultrasonic bonding device 100 according to the present invention, the ultrasonic bonding device 100 is provided by providing nodal rods 22a and 22b which face each other and are provided coaxially with each other at a portion of the horn 20 which is a node of ultrasonic vibration. Even when the output of the horn 20 is set to a high output of 5000 W or more, the deflection of the horn 20 in the left-right direction is suppressed, which enables high-precision bonding.

The nodal rods 22a and 22b that suppress the lateral deflection of the horn 20 and the nodal rod 22c that suppresses the upward deflection of the horn 20 are frames arranged so as to surround a portion of the horn 20 that becomes a node of ultrasonic vibration. It is attached to the body 23 and is screwed to the frame 23 so that the amount of protrusion in the direction of the horn 20 can be adjusted.

A horn 20 is attached to one end of the cone 30, and a vibrator 40 is attached to the other end, and ultrasonic vibration generated from the vibrator 40 is transmitted to the horn 20.

The vibrator 40 generates lateral ultrasonic vibration used for bonding a portion to be bonded by the ultrasonic bonding device 100, and the ultrasonic vibration generated by the vibrator 40 is a cone 30, a horn 20, and a horn. It is applied to the bonding target portion via the heads 21a to 21d of 20.

In the ultrasonic bonding apparatus 100 of this embodiment, a work having a head of a horn 20, for example, a base 11 below a portion where the head 21a is arranged, has a bonding target portion whose upper surface is close to the head 21a. An anvil (not shown) is provided, and an ultrasonic wave applying means composed of a horn 20, a cone 30, and a vibrator 40 is subducted downward in the main body 10 of the apparatus, thereby giving a load to a portion to be bonded. ing.

Here, the downward subduction drive of the ultrasonic wave applying means including the horn 20, the cone 30, and the vibrator 40 in the apparatus main body 10 can be performed by using a well-known driving means, for example, an air cylinder. The regulator 50 for pressurization adjustment adjusts the application of load to the joint target portion when the above air cylinder is used.

The weighting is not limited to the above configuration, but a pressurizing means is provided above the ultrasonic wave applying means including the horn 20, the cone 30, and the vibrator 40, and the joining target portion is subjected to the pressurizing means. A well-known configuration that gives a weight to the corn may be used, and in this case as well, the same configuration can be used.

4A and 4B are explanatory views for explaining a half-wavelength horn of the ultrasonic bonding apparatus according to the present invention, FIG. 4A is a view in which a portion of the horn 20 is extracted, and FIG. 4B is a horn. It shows the magnitude of the vibration of each part of the ultrasonic vibration transmitted through 20.

As shown in FIG. 4, the ultrasonic bonding apparatus 100 according to the present invention uses a half-wavelength horn, so that the length of the horn 20 in the longitudinal direction is half of the ultrasonic vibration generated from the vibrator 40. The length is set to correspond to the wavelength.

When this half-wavelength horn is used, the portion (nodal point) P0 where the ultrasonic vibration transmitted from the vibrator 40 is minimized is one location as shown in FIG. 4 (B).

As shown in FIGS. 4A and 4B, in the ultrasonic bonding apparatus 100 of this embodiment using a half-wave horn, the point Pa at which the ultrasonic vibration transmitted from the vibrator 40 is maximized is the horn. The point Pb that corresponds to the position of the tip of 20 and also maximizes the ultrasonic vibration corresponds to the connection position between the horn 20 and the cone 30, and the portion where the ultrasonic vibration transmitted from the vibrator 40 is minimized, that is, The nodal rods 22a and 22b where the portion (nodal point) P0 that becomes the node of the ultrasonic vibration transmitted from the vibrator 40 suppresses the lateral deflection of the horn 20 and the nodal rod that suppresses the upward deflection of the horn 20. Corresponds to the arrangement position of 22c.

That is, nodal rods 22a and 22b are provided at positions in the left-right direction of the portion (nodal point) P0 that becomes a node of the ultrasonic vibration transmitted from the vibrator 40, and the ultrasonic vibration transmitted from the vibrator 40 is also provided. A nodal rod 22c is provided at an upward position of the knot portion (nodal point) P0, the lateral deflection of the horn 20 is suppressed by the nodal rods 22a and 22b, and the nodal rod 22c suppresses the lateral deflection of the horn 20. Deflection is suppressed.

By suppressing the lateral deflection of the horn 20 by the nodal rods 22a and 22b and the upward deflection of the horn 20 by the nodal rod 22c, the height of the bonding target portion is high even when bonding at a high output, for example, 5000 W or more. Accurate ultrasonic bonding is possible.

Here, since the nodal rods 22a and 22b and the nodal rods 22c are provided at the node portion (nodal point) P0 of the ultrasonic vibration that minimizes the ultrasonic vibration of the horn 20, the nodal rods are provided. The presence of 22a, 22b and the nodal rod 22c hardly adversely affects the ultrasonic vibration transmitted to the head 21a of the horn 20 via the cone 30 and the horn 20, and causes the ultrasonic vibration from the vibrator 40. , The cone 30, the horn 20, and the head 21a of the horn 20, can be effectively applied to the joint target portion.

The present invention is not limited to the above-described embodiment, and many modifications can be made by ordinary creative abilities of those skilled in the art within the scope of the technical idea of the present invention.

10 ... Device main body 11 ... Base 20 ... Ultrasonic horn 21a, 21b, 21c, 21d ... Head portion 22a, 22b ... Left and right direction holding member (nodal rod)
22c ... Upward holding member (nodal rod)
23 ... Frame 30 ... Ultrasonic cone 40 ... Ultrasonic transducer 50 ... Regulator for pressure adjustment

Claims (4)

An ultrasonic bonding device that applies a load to a bonding target site and applies lateral ultrasonic vibration to the bonding target site from an ultrasonic horn to bond the bonding target site.
A pair of left-right direction pressing members that press the portion of the ultrasonic horn that becomes a node of ultrasonic vibration from the left-right direction orthogonal to the longitudinal direction of the ultrasonic horn.
An ultrasonic bonding device comprising. The ultrasonic bonding apparatus according to claim 1, wherein the pair of left-right pressing members are formed of pressing rods that face each other and are provided coaxially with each other. The ultrasonic horn
The ultrasonic bonding apparatus according to claim 1 or 2, wherein one end is connected to an ultrasonic cone and the other end is a half-wavelength horn provided with an ultrasonic bonding head. An upward pressing member that presses a portion of the ultrasonic horn that becomes a node of ultrasonic vibration from above the ultrasonic horn.
The ultrasonic bonding apparatus according to claim 1 to 3, wherein the ultrasonic bonding apparatus is provided.

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