JP2002343831A - Bonding head and bonding apparatus having the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely connect a pad of a semiconductor chip to leads on a substrate by stabilizing a vibration of a bonding tool during connecting by suppressing a distortion vibration, a vertical vibration or the like of the tool. SOLUTION: A vibration transmission member has a quadrangular prismatic first vibration transmitter having a length of d at a position of λ/2 as a center in an advancing direction of an ultrasonic vibration, a second vibration transmitter coupled between the first transmitter and the vibrator and having a length of (λ-d)/2 in the advancing direction, and a third vibration transmitter coupled to other end of the first transmitter and having a length of (λ-d)/2 in the advancing direction. The first transmitter and the third transmitter each has a tapered surface which gradually becomes wider toward the first transmitter. Upper and lower surfaces of the second and third transmitters each has a tapering angle within 45 deg. to a central axis in a longitudinal direction of the vibrator and the transmitters.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a bonding head for bonding a surface electrode formed on a pad of a semiconductor chip to a wiring lead formed on a substrate, and a bonding apparatus having the same.

[0002]

2. Description of the Related Art FIG. 10 shows a conventional bonding apparatus for bonding a surface electrode formed on a pad of a semiconductor chip (for example, a flip chip) and a wiring lead formed on a substrate by ultrasonic vibration. A device using a bonding head is known. As shown in FIG. 10, a conventional bonding head includes an ultrasonic horn 51 connected to a vibrator 50 and a collet 52 as a bonding tool attached to a tip of the ultrasonic horn 51.
And a support member 53 for supporting the ultrasonic horn 51. The bonding head vacuum-adsorbs the semiconductor chip at the tip of the collet 52 and presses and bonds the semiconductor chip to a wiring lead formed on the substrate. At this time, an ultrasonic vibration is applied to the semiconductor chip by the collet 52. In some cases, bonding may be performed by applying heat or the like as necessary.

[0003]

As shown in FIG.
In a conventional bonding head, a collet 52 as a bonding tool is attached to the tip of an ultrasonic horn 51. Ultrasonic vibration is applied to the collet 52 by the ultrasonic horn 51 at the time of joining the semiconductor chip and the lead of the substrate, and at this time, the collet 52 applies the ultrasonic vibration in contact with the semiconductor chip. For this reason, if torsion or the like due to flexural vibration occurs in the collet 52 during the application of ultrasonic waves, the transmission of ultrasonic vibrations to the semiconductor chip becomes non-uniform, and an incompletely bonded electrode is generated, and the bonding state may vary. is there. Further, when vertical vibration occurs at a portion of the collet 52 that is in contact with the semiconductor chip, the semiconductor chip may be damaged by the vertical vibration of the collet 52 during joining.

Accordingly, the present invention has been made in an attempt to improve a conventional bonding head, and suppresses the bending vibration of the bonding tool to stabilize the vibration of the bonding tool during bonding, thereby providing a semiconductor chip. It is an object of the present invention to provide a bonding head capable of securely bonding a pad and a lead on a substrate, and a bonding apparatus having the bonding head.

[0005]

A bonding head according to the present invention is a bonding head for applying an ultrasonic vibration to join an object to be joined and a member to be joined, and a vibrator for generating the ultrasonic vibration; One wavelength of the ultrasonic vibration is λ
A first rectangular vibration transmitting section having a length d centered on the position of λ / 2 in the traveling direction of the ultrasonic vibration, and being coupled between the first vibration transmitting section and the vibrator. A second vibration transmitting portion having a length of (λ-d) / 2 in the traveling direction; and a second vibration transmitting portion coupled to the other end of the first vibration transmitting portion, and having a length of (λ-d) / 2 in the traveling direction. A vibration transmission member having a third vibration transmission portion having a length, a support member provided at a position of the ultrasonic vibration node of the second vibration transmission portion and the third vibration transmission portion, and a vibration transmission portion Is fixed.

Further, the first vibration transmitting portion of the bonding head according to the present invention has a pressing portion on its lower surface which comes into contact with and presses the object to be joined, and has an upper surface having a mass equivalent to the mass of the pressing portion. It has a balance part.

The second and third vibration transmitting portions of the bonding head according to the present invention have tapered surfaces that gradually become wider toward the first vibration transmitting portion.

Further, the upper and lower surfaces of the second and third vibration transmitting portions of the bonding head according to the present invention are within 45 degrees with respect to the central axis in the longitudinal direction of the vibrator and the vibration transmitting member. Having the following taper angle.

Further, the supporting member of the bonding head according to the present invention has a cylindrical shape, and is fitted and connected to the second vibration transmitting portion and the third vibration transmitting portion.

Further, the fixing member of the bonding head according to the present invention restrains the supporting member toward the central axis in the longitudinal direction of the vibrator and the vibration transmitting member, and fixes the vibration transmitting member to the fixing member. Things.

[0011] Further, at least one place where the fixing member of the bonding head according to the present invention and the supporting member are fitted and connected is at least one.

Further, the bonding apparatus according to the present invention comprises:
What is claimed is: 1. A bonding apparatus comprising: a bonding head configured to apply an ultrasonic vibration to join an object to be joined and a member to be joined, wherein the vibrator generates the ultrasonic vibration, and a wavelength of the ultrasonic vibration is λ. Λ in the traveling direction of the acoustic vibration
/ 2, a first rectangular vibration transmitting portion having a length of d centered on the position of / 2, and being coupled between the first vibration transmitting portion and the vibrator to be (λ-d) / A second vibration transmitting portion having a length of 2 and (λ-d) / 2 in the traveling direction coupled to the other end of the first vibration transmitting portion.
A vibration transmitting member having a third vibration transmitting portion having a length of, a support member provided at a node of the ultrasonic vibration of the second vibration transmitting portion and the third vibration transmitting portion; A bonding member comprising a fixing member for fixing the portion; a pressing mechanism for driving the bonding head; and control means for controlling the bonding head and the pressing mechanism.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a bonding head according to the present invention and a bonding apparatus having the same will be described with reference to FIGS.

FIG. 1 is a perspective view showing an embodiment of a bonding head 10 according to the present invention, FIG. 2 (a) is a plan view of the bonding head 10 shown in FIG. 1, and FIG.
FIG. 2C is a front view showing the bonding head 10 shown in FIG. 1, FIG. 2C is a diagram showing a vibration mode of the bonding head 10 shown in FIG. 1, and FIG. 3A is a dimension of the bonding head 10 shown in FIG. FIG. 4B is a front view showing dimensions of the bonding head 10 shown in FIG. 1, and FIGS. 4 and 5 are views showing fixing of the vibration transmitting member 1 of the bonding head 10 according to the present invention. FIG. 6 is a block diagram showing the configuration of an oscillator 18 for driving the vibrator 2 of the bonding head 10 according to the present invention, and FIG. 7 is a view showing a displacement state of the vibration transmitting member 1 of the bonding head 10 at the time of vibration. FIG. 8 is an enlarged view of the vicinity of the pressing portion 4 of the vibration transmitting member 1 shown in FIG. 7 and a diagram visually illustrating a displacement state during vibration, and FIG. 9 is a bonding head 10 according to the present invention. To Is a diagram showing a configuration of example was bonder.

As shown in FIG. 1, FIG. 2 (a) and FIG. 2 (b), the bonding head 10 has one vibrator 2 for generating ultrasonic vibration of a predetermined frequency, and is connected to the vibrator 2. A vibration transmitting member 1 for transmitting ultrasonic vibrations from the vibrator 2 to an object 22 (shown in FIG. 9), and a supporting member 3 for supporting and fixing the vibration transmitting member 1 (a first supporting member 3a, a second supporting member 3a). , A third support member 3c, and a fourth support member 3d). The fixing member 19 shown by a two-dot chain line in FIG. 1 is for fixing and supporting the press-contact mechanism 15 (shown in FIG. 9).

As shown in FIGS. 1 to 6, the vibrator 2 comprises:
For example, it is composed of a PZT (piezoelectric) element or the like, and a voltage of a predetermined frequency is applied from an oscillator 18 via a cable 14 to generate ultrasonic vibration. The total length of the vibrator 2 in the traveling direction u of the ultrasonic vibration is set to λ / 2 with respect to one wavelength λ of the ultrasonic vibration. The frequency of the voltage applied from the oscillator 18 is 15
A frequency of kHz to 200 kHz can be used. Thus, the present embodiment uses a high frequency of 60 kHz from 15 kHz to 200 kHz.

The surface member which comes into contact with the chip of the first vibration transmitting portion 1a is made of a material having excellent wear resistance, for example, a carbide, ceramic, tool steel, diamond or DLC (diamond-like carbon), brazed, welded or welded. Vapor deposition is possible. The vibration transmitting member 1 is made of a metal such as duralumin, stainless steel (SUS), aluminum, a titanium alloy, and a super hard metal. The total length of the vibration transmission member 1 is set to an integral multiple of the resonance length in the traveling direction u of the ultrasonic vibration generated by the vibrator 2, that is, an integral multiple of a half wavelength (λ / 2) of the ultrasonic vibration. In this case, the total length in the traveling direction u of the ultrasonic vibration generated by the vibrator 2 is λ, which is twice λ / 2.

As shown in FIGS. 2B and 2C,
The vibration transmitting member 1 has a λ in the traveling direction u of the ultrasonic vibration.
/ 2 (the antinode of the ultrasonic vibration) as a center, a first vibration transmitting portion 1a having a length d and a first vibration transmitting portion 1a
Traveling direction u of the ultrasonic vibration which is coupled between
And the other end of the first vibration transmitting unit 1a, that is, the end on the side opposite to the vibrator 2, and the ultrasonic wave. A third vibration transmission unit 1c whose length in the vibration traveling direction u is (λ-d) / 2.

The vibration transmitting member 1 including the first vibration transmitting portion 1a, the second vibration transmitting portion 1b, and the third vibration transmitting portion 1c is formed as an integral member.

FIGS. 3A and 3B show the dimensions of the first, second and third vibration transmitting portions 1a, 1b and 1c forming the vibration transmitting member 1. FIG. Indicates that
2 (a) and 2 (b), the first vibration transmitting portion 1a is formed in a quadrangular prism shape, the length of the ultrasonic vibration traveling direction u is d, and the width is m. , And the height is h.

As shown in FIGS. 3A and 3B, the second vibration transmitting section 1b and the third vibration transmitting section 1c
Of the ultrasonic vibration in the traveling direction u is (λ−d) /
2, the width of each surface of the second vibration transmission unit 1b and the third vibration transmission unit 1c coupled to the first vibration transmission unit 1a is:
M is the same as the width of the first vibration transmitting portion 1a, and the height is k.
It is. Further, the width of the surface of the second vibration transmitting portion 1b coupled to the vibrator 2 and the end surface (the surface at the position of λ) of the third vibration transmitting portion 1c are n, and the height is n of the same size as the width. It is. However, the width and height are defined so that n ≧ m and k> n. Further, the width m of the first vibration transmission unit 1a may be set to m = d.

The shape of the surface of the second vibration transmitting portion 1b is such that the surface coupled to the first vibration transmitting portion 1a is rectangular, the surface coupled to the vibrator 2 is square, and the other surface (FIG. 3).
(A), 1bs1, 1bs2, 1b shown in FIG.
t, 1bb) is a trapezoid or a rectangle (when n = m).

The surface of the third vibration transmitting portion 1c has a rectangular surface connected to the first vibration transmitting portion 1a, a square end surface, and other surfaces (FIGS. 3A and 3A).
(1cs1, 1cs2, 1ct, 1cb) shown in (b) are trapezoidal. The paired surfaces of the second vibration transmission unit 1b and the third vibration transmission unit 1c (FIGS. 3A and 3B)
1bs1 and 1bs2, 1bt and 1bb, 1cs1 shown in
And 1cs2, 1ct and 1cb) have the same shape.

As shown in FIGS. 2 (b) and 3 (b), a second vibration transmitting section 1b and a third vibration transmitting section 1c are provided.
(1bs1 and 1b shown in FIG. 3 (a) and FIG. 3 (b))
s2, 1cs1 and 1cs2) are the first vibration transmitting unit 1a
It has a tapered surface that gradually widens toward it.

As shown in FIG. 3B, the upper surfaces (1bt, 1c) of the second vibration transmitting portion 1b and the third vibration transmitting portion 1c are formed.
t) and the lower surface (1bb, 1cb) have a taper angle (θ) with respect to the central axis in the longitudinal direction of the vibrator 2 and the vibration transmitting member 1. Note that the taper angle (θ) is defined to be within 45 degrees.

As shown in FIGS. 3 (a) and 3 (b), the area of the surface of the second vibration transmitting portion 1b coupled to the vibrator 2 is m × k, The area of the surface connected to the portion 1a is n × n. The surface of the second vibration transmission unit 1b coupled to the vibrator 2 and the surface coupled to the first vibration transmission unit 1a have the same area. That is, the relationship is n × n = m × k. Thereby, the transformation ratio of the vibration (amplitude amplification ratio of the ultrasonic wave) of the vibration transmission unit 1 is 1. By changing the width m shown in FIG. 3A, the metamorphic ratio of the ultrasonic vibration can be changed.

As shown in FIG. 2B, a semiconductor chip (shown in FIG. 6) serving as a bonding object 22 is pressed against the lower surface of the first vibration transmitting section 1a, and the ultrasonic wave from the vibrator 2 is pressed. The pressing unit 4 is provided as a bonding tool that applies vibration to join the object 22 to be joined and a substrate (shown in FIG. 6) as the member 23 to be joined. The pressing portion 4 is formed in a substantially rectangular parallelepiped shape, and is provided at a position facing the joining object 22. The pressing portion 4 is attached to a position where the amplitude of the ultrasonic vibration in the first vibration transmitting portion 1a is maximized, as shown in FIG.

As shown in FIG. 2B, a balance portion 5 having a mass equivalent to the mass of the pressing portion 4 is provided on the upper surface of the first vibration transmitting portion 1a. The balance section 5 has a mass equivalent to the mass of the pressing section 4 to stabilize the vibration of the first vibration transmission section 1a.

Next, the bonding head 1 according to the present invention will be described.
Reference numeral 0 denotes a first support member 3a, a second support member 3b, a third support member 3c, and a fourth support member 3 as support members 3 for supporting and fixing the vibration transmission member 1, as shown in FIGS. The support member 3d is arranged within a range of the entire length (λ) of the vibration transmission member 1. As shown in FIGS. 2A and 2C,
The first support member 3a and the second support member 3b are positioned on both sides of the second vibration transmission portion 1b at a position (λ / 4) in the traveling direction of the ultrasonic vibration from the surface coupled to the vibrator 2. In addition, the third support member 3c and the fourth support member 3d are disposed on both side surfaces of the third vibration transmission portion 1c at λ /
4 (nodes of ultrasonic vibration). The first support member 3a, the second support member 3b, the third support member 3c, and the fourth support member 3d have a columnar shape, and are formed on both sides of the second vibration transmission unit 1b and the third support member 3d. Are fitted and connected to mounting holes provided on both side surfaces of the vibration transmitting portion 1c.

The pressing portion 4 is provided between the first support member 3a and the third support member 3c and the second support member 3b and the fourth support member 3d provided at a distance of λ / 2 from each other. , The pressing force applied to the joining object 22 is made uniform, and even when a high load is applied to the vibration transmitting member 1, the deflection or deformation of the vibration transmitting member 1 is suppressed, and Sound wave vibration can be applied with high efficiency.

The bonding head 10 according to the present invention comprises:
A fixing member 19 for applying a load from the pressing mechanism 15 (shown in FIG. 9) to the pressing portion 4 is provided. As shown in FIG. 4, the fixing member 19 includes a first fixing member 19a and a second fixing member 19a.
The vibrator 2 and the vibration transmitting member 1
The vibration transmitting member 1 is fixed to the fixing member 19 by restraining the supporting member 3 toward the central axis in the longitudinal direction. The first fixing member 19a is provided with a circular hole and a long hole for coupling with the support member 3. The depth of each hole is a dimension that does not contact the vibration transmitting member 1 when the fixing member 19 is connected. The circular hole is for fitting with the support member 3, and the elongated hole is in close contact with the support member 3 in the Z direction, and is free in the X direction. Further, the supporting member 3 is also provided on the second fixing member 19b.
A circular hole or a long hole is provided for coupling with the hole.
At least one place where the support member 3 is fitted to the fixing member 19 is provided. When the vibration transmitting member 1 is coupled to the fixed member 19, the vibration transmitting member 1 is not constrained in the traveling direction of the ultrasonic vibration, so that there is no change in the electrical impedance of the vibration transmitting member 1 and stable vibration is possible. FIG. 5 is a diagram showing an example in which the second fixing member 19b is divided and fixed using screws. As shown in FIG. 5, instead of the first support member 3a and the third support member 3c shown in FIG. 4, the third fixing member 19c and the fourth fixing member 19d are fixed by screws, and the tip of the screw vibrates. It is fitted and coupled with the transmission member 1.

As shown in FIG. 6, an oscillator 18 for driving the vibrator 2 includes an oscillation circuit 1 for oscillating a predetermined frequency.
8a, a driving circuit 18b driven by the frequency oscillated from the oscillation circuit 18a, an amplification circuit 18c for power amplifying the driving frequency of the driving circuit 18b, and a driving force to the vibrator 2 A tank circuit 18d for impedance matching, and an amplitude feedback circuit 18 for receiving an output of the tank circuit 18d and performing amplitude feedback to an oscillation circuit 18a.
e.

The bonding head 1 having the above configuration
FIG. 7 shows a visual representation of the displacement state of the vibration transmitting member 1 at the time of vibration 0. FIG. 8 is an enlarged view of the vicinity of the pressing portion 4 of the vibration transmitting member 1 to visually represent a displacement state during vibration. The two-dot chain line in FIG. 7 and FIG.
Indicates the position when not vibrating. The vibration transmitting member 1 indicated by a mesh (element) indicates a state of displacement of each part of the vibration transmitting member 1 during vibration. As shown in FIGS. 7 and 8, the pressing portion 4 of the vibration transmitting member 1 at the time of vibration is displaced in the X direction, and no displacement is observed in the Z direction. Also,
As shown in FIG. 7, the first vibration transmitting portion 1a of the vibration transmitting member 1 does not bend in the Z direction. This is because the longitudinal vibration in the vibration transmitting member 1 by the ultrasonic vibrator 2 and the bending vibration generated in the first vibration transmitting unit 1a are combined, so that vibration in only the X direction is generated. .

The bonding head 10 according to the first embodiment of the present invention has the following effects.

The traveling direction u of the ultrasonic vibration of the vibration transmitting member 1
Is set to λ, and the whole is downsized. The support member 3 and the pressing portion 4 for supporting and fixing the vibration transmitting member 1 are arranged within a range of the entire length (λ) of the vibration transmitting member 1, and the pressing portions 4 are provided at a distance of λ / 2 from each other. Since it is located between the first support member 3a and the second support member 3b, the pressing force applied to the joining object 22 is made uniform. Further, even when a high load is applied to the vibration transmitting member 1, the deflection or deformation of the vibration transmitting member 1 can be suppressed, and the ultrasonic vibration can be applied with high efficiency. The first support member 3a and the second support member 3b are provided at a nodal point which does not affect the propagation of the ultrasonic vibration, and are respectively separated from the both ends of the vibration transmission member 1 by an equal distance (λ / 4). Since the vibration transmitting member 1 is not provided in a cantilevered manner, the vibration transmitting member 1 is held in a well-balanced manner, and the pressing force against the joining object 22 can be made uniform. Further, the pressing portion 4 generates vibration only in the X direction as shown in FIGS. That is, since the vibration is performed in parallel with the bonding target 22, the bonding is performed uniformly.

Next, the bonding head 1 according to the present invention will be described.
A bonding apparatus provided with 0 will be described with reference to FIG.

As shown in FIG.
The mounting table 16 on which the joining object 22 and the member 23 to which the joining object 22 is joined are placed,
A bonding head 10 for applying a ultrasonic vibration to the bonding head 10 to bond a semiconductor chip as a bonding object 22 and a lead of a substrate as a member 23 to be bonded;
0, a load mechanism 15 for applying a pressing force to the bonding head 10, an oscillator 18, a control unit (CPU)
And 17.

Control unit (CPU) 17 as control means
Is constituted by a microcomputer or the like and controls the entire apparatus, and operates based on an operation command from an external operating means (not shown).

The mounting table 16 can position the member 23 to be transported by a transport means (not shown) at a predetermined position. Thus, the mounting table 16 may be movable in a two-dimensional direction in the directions of the arrows x and y (the direction perpendicular to the plane of FIG. 6) based on a control signal from the control unit 17.

The press-contact mechanism 15 includes a drive unit 15a having a motor and the like for moving the bonding head 10 up and down in the direction of arrow z to position the motor, an air cylinder, a hydraulic cylinder, and the like. And a load mechanism 15b that variably applies a pressing force to the bonding object 22 by the bonding head 10 via a fixing member 19 attached to the distal end. In addition, the moving amount of the driving unit 15a and the rod 1
The protrusion amount of 5c is controlled by the control unit (CPU) 17.

Next, the operation of the bonding apparatus 20 having the above configuration will be described. As shown in FIG. 6, when the object 22 and the member 23 are positioned on the mounting table 16, the driving unit 15a operates to lower the bonding head 10 in the direction of the arrow z to a predetermined height. Is positioned. Then, the pressing mechanism 4 of the bonding head 10 is brought into contact with the object 22 to be pressed by a certain pressure, and the ultrasonic vibration from the vibrator 2 is applied. And the member to be joined 23 are joined. Next, the drive unit 15a and the load mechanism unit 15b are operated to raise the bonding head 10 to a predetermined height to prepare for the next bonding connection. Then, the above operation is repeated to repeat the bonding connection between the joining object 22 and the member 23 to be joined.

As described above, the bonding head 10 according to the present invention and the bonding apparatus provided with the same are:
The pressing portion 4 oscillates in parallel with the IC chip as the object 22 to be joined, and there is no occurrence of flexural oscillation, so that stable bonding is possible. In the bonding head 10 according to the present invention, the bonding connection with the electronic component such as an IC chip as the bonding object 22 and the lead formed on the substrate as the bonding member 23 has been described. Alternatively, bonding connection of a metal or synthetic resin plate member or the like is also possible.

[0043]

As described above, according to the bonding head of the present invention, the pressing portion is provided between the first support member and the second support member provided at a distance of λ / 2 from each other. , The pressing force applied to the joining object is made uniform. In addition, even when a high load is applied to the vibration transmitting member, the deflection or deformation of the vibration transmitting member can be suppressed, and the ultrasonic vibration can be applied with high efficiency.

Further, since the pressing portion of the bonding head of the present invention vibrates in parallel with the object to be joined, the joining between the object to be joined and the member to be joined is reliably performed, so that the bonding quality is improved. Further, the bonding head according to the present invention allows the size of the bonding apparatus to be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a bonding head 10 according to the present invention.

2 is a plan view of the bonding head 10 shown in FIG. 1,
(B) is a front view showing the bonding head 10 shown in FIG. 1, and (c) is a bonding head 10 shown in FIG. 1.
FIG. 4 is a diagram showing a vibration mode of FIG.

FIG. 3A shows a bonding head 10 shown in FIG.
FIG. 2B is a front view showing the dimensions of the bonding head 10 shown in FIG.

FIG. 4 is a diagram showing fixing of the vibration transmitting member 1 of the bonding head 10 according to the present invention.

FIG. 5 is a view showing fixing of the vibration transmitting member 1 of the bonding head 10 according to the present invention.

FIG. 6 is a block diagram illustrating a configuration of an oscillator 18 that drives the vibrator 2 of the bonding head 10 according to the present invention.

FIG. 7 is a view visually illustrating a displacement state of the vibration transmitting member 1 of the bonding head 10 according to the present invention during vibration.

8 is an enlarged view of the vicinity of the pressing portion 4 of the vibration transmission member 1 shown in FIG. 7, and a visual representation of a displacement state during vibration.

FIG. 9 is a diagram showing a configuration of a bonding apparatus including a bonding head 10 according to the present invention.

FIG. 10 is a diagram showing a configuration of a conventional bonding head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Vibration transmitting member 1a First vibration transmitting portion 1b Second vibration transmitting portion 1bs1, 1bs2 Side surface of second vibration transmitting portion 1bt Upper surface of second vibration transmitting portion 1bb Lower surface of second vibration transmitting portion 1c Third 1cs1, 1cs2 Side surface of third vibration transmitting unit 1ct Upper surface of third vibration transmitting unit 1cb Lower surface of second vibration transmitting unit 2, 50 Vibrator 3 Support member 3a First support member 3b Second 3c Third support member 3d Fourth support member 4 Pressing part 5 Balance part 10 Bonding head 14 Cable 15 Pressure contact mechanism 15a Driving part 15b Load mechanism part 15c Rod 16 Placement table 17 Control part (CPU) 18 Oscillator 19 Fixing member 19a First fixing member 19b Second fixing member 19c Third fixing member 19d Fourth fixing member 20 Bonding device 22 Bonding pair Elephant (semiconductor chip) 23 Member to be joined 51 Ultrasonic horn 52 Collet 53 Support

Claims (8)

[Claims] 1. A bonding head for applying an ultrasonic vibration to join an object to be joined and a member to be joined, wherein a vibrator that generates the ultrasonic vibration, and one wavelength of the ultrasonic vibration is λ. A first quadrangular prism-shaped vibration transmitting portion having a length d centered on a position of λ / 2 in the traveling direction of the ultrasonic vibration; and a first vibration transmitting portion coupled between the first vibration transmitting portion and the vibrator. A second vibration transmitting portion having a length of (λ-d) / 2 in the direction, and a length of (λ-d) / 2 in the traveling direction coupled to the other end of the first vibration transmitting portion. A vibration transmitting member having a third vibration transmitting portion having: a supporting member provided at a position of a node of the ultrasonic vibration of the second vibration transmitting portion and the third vibration transmitting portion; and fixing the vibration transmitting portion. A bonding member comprising: 2. The first vibration transmitting section has a pressing section on the lower surface for abutting and pressing the object to be joined, and has a balance section on the upper surface having a mass equivalent to the mass of the pressing section. The bonding head according to claim 1, wherein: 3. The apparatus according to claim 1, wherein the second vibration transmitting section and the third vibration transmitting section have tapered surfaces that gradually become wider toward the first vibration transmitting section. The bonding head as described. 4. An upper surface and a lower surface of the second vibration transmitting portion and the third vibration transmitting portion have a taper angle within 45 degrees with respect to a central axis in a longitudinal direction of the vibrator and the vibration transmitting member. The bonding head according to claim 1, further comprising: 5. The device according to claim 1, wherein the support member has a cylindrical shape, and is fitted and connected to the second vibration transmission unit and the third vibration transmission unit. Bonding head. 6. The fixing member restrains a supporting member toward a central axis in a longitudinal direction of the vibrator and the vibration transmitting member, and fixes the vibration transmitting member to the fixing member. The bonding head according to claim 1. 7. The bonding head according to claim 1, wherein the fixing member and the supporting member are fitted and connected to at least one portion. 8. A bonding apparatus having a bonding head for applying ultrasonic vibration to join an object to be joined and a member to be joined, comprising: a vibrator for generating ultrasonic vibration; and one wavelength of the ultrasonic vibration. Λ, where λ is the center of the position of λ / 2 in the traveling direction of the ultrasonic vibration, and a quadrangular prism-shaped first vibration transmission unit having a length d is coupled between the first vibration transmission unit and the vibrator. And a second vibration transmitting portion having a length of (λ-d) / 2 in the traveling direction, and being coupled to the other end of the first vibration transmitting portion to have a length of (λ-d) / A vibration transmission member having a third vibration transmission portion having a length of 2, a support member provided at a position of a node of ultrasonic vibration of the second vibration transmission portion and the third vibration transmission portion, and vibration transmission. A bonding head having a fixing member for fixing the portion. Bonding apparatus characterized by comprising: a pressing mechanism for driving the bonding head, and control means for controlling the bonding head and the pressure-contacting mechanism.