JP2021086759A - Wiring device - Google Patents

Wiring device Download PDF

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JP2021086759A
JP2021086759A JP2019215522A JP2019215522A JP2021086759A JP 2021086759 A JP2021086759 A JP 2021086759A JP 2019215522 A JP2019215522 A JP 2019215522A JP 2019215522 A JP2019215522 A JP 2019215522A JP 2021086759 A JP2021086759 A JP 2021086759A
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heat sink
heat
main body
radiating plate
wiring
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JP7464901B2 (en
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拓也 宮内
Takuya Miyauchi
拓也 宮内
禎治 鎌田
Sadaharu Kamata
禎治 鎌田
寛成 鳥居
Hironari Torii
寛成 鳥居
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Abstract

To provide a wiring device that can improve heat dissipation performance of a power control element.SOLUTION: A wiring device 12 comprises a power board 50 that is a printed wiring board on which a power control element 55 is mounted, a first heat dissipation plate 52 for dissipating heat of the power control element 55, a second heat dissipation plate 53 combined with the first heat dissipation plate 52, and a case 20 comprising a housing part 29 housing the power board 50, the first heat dissipation plate 52, and the second heat dissipation plate 53. The case 20 comprises a protruding part 41 protruding into the housing 29 toward a direction in which the second heat dissipation plate 53 is combined with the first heat dissipation plate 52.SELECTED DRAWING: Figure 7

Description

本発明の実施形態は、電力制御素子を備える配線器具に関する。 An embodiment of the present invention relates to a wiring device including a power control element.

従来、例えば調光器や人感スイッチ等の配線器具では、電力制御素子を含む回路構成を備えているものがある。電力制御素子は、発熱部品であり、負荷電流が大きい場合には発生する熱量も大きくなるため、電力制御素子を備える配線器具では放熱板を用いて電力制御素子が発生する熱を放熱している。 Conventionally, some wiring appliances such as dimmers and human sensor switches have a circuit configuration including a power control element. The power control element is a heat generating component, and when the load current is large, the amount of heat generated is also large. Therefore, in the wiring equipment provided with the power control element, the heat generated by the power control element is dissipated by using a heat sink. ..

配線器具は、規格化された取付枠に取り付けられる等の関係上、放熱板を大型化することが困難であることが多い。そこで、電力制御素子の放熱性の向上のために複数の放熱板を組み合わせて用いることが考えられるが、組み合わせる部品の位置等のばらつきに対応するためにはクリアランスを確保しておく必要があるため、放熱板同士を確実に接触させることができず、電力制御素子の放熱性の向上が十分にできない場合がある。 It is often difficult to increase the size of the heat sink of the wiring device because it is attached to a standardized mounting frame. Therefore, it is conceivable to use a combination of a plurality of heat sinks in order to improve the heat dissipation of the power control element, but it is necessary to secure a clearance in order to cope with variations in the positions of the parts to be combined. In some cases, the heat sinks cannot be reliably brought into contact with each other, and the heat dissipation of the power control element cannot be sufficiently improved.

特開2011−154870号公報Japanese Unexamined Patent Publication No. 2011-154870

本発明は、電力制御素子の放熱性を向上できる配線器具を提供することを目的とする。 An object of the present invention is to provide a wiring device capable of improving heat dissipation of a power control element.

実施形態の配線器具は、電力制御素子が実装されたプリント配線基板と、電力制御素子の熱を放熱する第1の放熱板と、第1の放熱板に組み合わされる第2の放熱板と、プリント配線基板、第1の放熱板および第2の放熱板を収納する収納部を有する筐体とを備える。筐体は、第2の放熱板が第1の放熱板に組み合わされる方向に向けて収納部内に突出する突部を有する。 The wiring fixture of the embodiment includes a printed wiring board on which a power control element is mounted, a first heat sink that dissipates heat from the power control element, a second heat sink that is combined with the first heat sink, and a print. It includes a wiring board, a housing having a storage portion for accommodating a first heat sink and a second heat sink. The housing has a protrusion that projects into the storage portion in the direction in which the second heat sink is combined with the first heat sink.

実施形態の配線器具によれば、電力制御素子の放熱性を向上させることが期待できる。 According to the wiring device of the embodiment, it can be expected to improve the heat dissipation of the power control element.

一実施形態を示す配線器具を用いた配線器具ユニットの斜視図である。It is a perspective view of the wiring equipment unit using the wiring equipment which shows one Embodiment. 同上配線器具である調光器の斜視図である。It is a perspective view of the dimmer which is the wiring fixture as above. 同上調光器のカバーを外した斜視図である。It is the perspective view which removed the cover of the dimmer of the same as above. 同上調光器の電源部を示す斜視図である。It is a perspective view which shows the power-source part of the dimmer of the same as above. 同上調光器の本体と電源部と第2放熱板との分解状態の前面側の斜視図である。It is the perspective view of the front side of the main body of the dimmer, the power-source part, and the 2nd heat sink in the disassembled state. 同上調光器の本体と電源部と第2放熱板との分解状態の背面側の斜視図である。It is the perspective view of the back side of the main body of the dimmer, the power-source part, and the 2nd heat radiating plate in the disassembled state. 同上調光器の図2A−A視の断面図である。It is sectional drawing of FIG. 2AA of the dimmer of the same as above. 同上調光器の図2B−B視の断面図である。It is sectional drawing of FIG. 2BB of the same dimmer.

以下、一実施形態を、図面を参照して説明する。 Hereinafter, one embodiment will be described with reference to the drawings.

図1に配線器具ユニット10を示す。配線器具ユニット10は照明負荷とともに照明システムを構成する。照明システムでは、交流電源に対して照明負荷および配線器具ユニット10が直列に接続され、配線器具ユニット10によって照明負荷の点灯、消灯、および調光を制御する。 FIG. 1 shows the wiring equipment unit 10. The wiring fixture unit 10 constitutes a lighting system together with a lighting load. In the lighting system, the lighting load and the wiring fixture unit 10 are connected in series to the AC power supply, and the wiring fixture unit 10 controls lighting, extinguishing, and dimming of the lighting load.

配線器具ユニット10は、壁面の内側または外側に設置される配線ボックスに取り付けられ、配線器具ユニット10の前面側周囲を覆うプレートが取り付けられる。配線器具ユニット10は、配線ボックスに取り付けるためのサポートである取付枠11、この取付枠11にそれぞれ取り付けられた配線器具12,13を備えている。 The wiring equipment unit 10 is attached to a wiring box installed inside or outside the wall surface, and a plate covering the front side periphery of the wiring equipment unit 10 is attached. The wiring device unit 10 includes a mounting frame 11 that is a support for mounting on the wiring box, and wiring devices 12 and 13 mounted on the mounting frame 11, respectively.

配線器具12は、JIS規格により規格化された大角連用形2個モジュールサイズに設けられている。配線器具12は、交流電源に対して配線器具13および照明負荷に直列に接続され、調光度に応じて交流電圧の導通角を可変制御する位相制御方式を採用した調光器である。配線器具12の前面側には、取付枠11の前側に配置される前面カバー14が取り付けられているとともに、この前面カバー14を挿通する摘み部15が配置されている。摘み部15の回動操作にて調光度が調整される。 The wiring fixture 12 is provided in a large-angle conjunctive two-module size standardized by the JIS standard. The wiring fixture 12 is a dimmer that is connected in series with the wiring fixture 13 and the lighting load to the AC power supply and employs a phase control method that variably controls the conduction angle of the AC voltage according to the dimming degree. On the front side of the wiring device 12, a front cover 14 arranged on the front side of the mounting frame 11 is attached, and a knob portion 15 through which the front cover 14 is inserted is arranged. The luminous intensity is adjusted by rotating the knob 15.

配線器具13は、JIS規格により規格化された大角連用形1個モジュールサイズに設けられている。配線器具13は、配線器具12と照明負荷との間に直列に接続され、配線器具12と照明負荷との間の電路を開閉するスイッチである。配線器具13の前面側には、配線器具13による電路の開閉を切換操作するためのスイッチカバー16が取り付けられている。 The wiring fixture 13 is provided in a large-angle conjunctive single module size standardized by the JIS standard. The wiring fixture 13 is a switch that is connected in series between the wiring fixture 12 and the lighting load and opens and closes an electric circuit between the wiring fixture 12 and the lighting load. A switch cover 16 for switching the opening and closing of the electric circuit by the wiring device 13 is attached to the front side of the wiring device 13.

また、照明負荷は、半導体発光素子等の光源、およびこの光源を点灯させるための電力変換部を有している。電力変換部は、配線器具12によって導通角が制御された交流電圧を入力し、その交流電圧を直流電圧に変換して光源に供給し、設定された調光度で光源を点灯させるか、あるいは、入力された交流電圧の導通角から調光度を検出し、検出された調光度に応じ交流電圧を直流電圧に変換して光源に供給し、設定された調光度で光源を点灯させる。 Further, the illumination load has a light source such as a semiconductor light emitting element and a power conversion unit for lighting the light source. The power conversion unit inputs an AC voltage whose conduction angle is controlled by the wiring fixture 12, converts the AC voltage into a DC voltage and supplies it to the light source, and turns on the light source at the set dimming degree, or The dimming degree is detected from the conduction angle of the input AC voltage, the AC voltage is converted into a DC voltage according to the detected dimming degree and supplied to the light source, and the light source is turned on at the set dimming degree.

次に、図2ないし図8に配線器具12を示す。 Next, FIG. 2 to FIG. 8 show the wiring device 12.

配線器具12は、筐体20、この筐体20内に収納される電源基板部21および制御基板部22、これら電源基板部21と制御基板部22を電気的に接続するリボン状のケーブル23、電源基板部21と制御基板部22の間に介在される絶縁紙24、および調光度を調整操作する摘み部15等を備えている。 The wiring fixture 12 includes a housing 20, a power supply board 21 and a control board 22 housed in the housing 20, and a ribbon-shaped cable 23 that electrically connects the power supply board 21 and the control board 22. It includes an insulating paper 24 interposed between the power supply board section 21 and the control board section 22, and a knob section 15 for adjusting the dimming degree.

筐体20は、絶縁性を有する樹脂製である。筐体20は、本体27と、この本体27の前面側に組み合わせて取り付けられるカバー28を有している。本体27は、前面側が開口された箱状に設けられている。カバー28は、背面側が開口された箱状に形成されている。本体27とカバー28とが組み合わされて形成される内部空間に、電源基板部21および制御基板部22が収納される収納部29が形成されている。本体27の上下面側に複数の爪部30が突設され、カバー28の上下面側に複数の引掛部31が設けられ、カバー28の引掛部31が本体27の爪部30に引っ掛けられることにより、本体27とカバー28とが組み合わされた状態で固定されている。 The housing 20 is made of an insulating resin. The housing 20 has a main body 27 and a cover 28 that is attached to the front side of the main body 27 in combination. The main body 27 is provided in a box shape with an opening on the front side. The cover 28 is formed in a box shape with the back side open. In the internal space formed by combining the main body 27 and the cover 28, a storage portion 29 in which the power supply board portion 21 and the control board portion 22 are housed is formed. A plurality of claws 30 are projected on the upper and lower surfaces of the main body 27, a plurality of hooks 31 are provided on the upper and lower surfaces of the cover 28, and the hooks 31 of the cover 28 are hooked on the claws 30 of the main body 27. The main body 27 and the cover 28 are fixed in a combined state.

本体27は、背面部33、上面部34、下面部35、および左右の側面部36a,36bを有し、前面側が開口された箱状に形成されている。 The main body 27 has a back surface portion 33, an upper surface portion 34, a lower surface portion 35, and left and right side surface portions 36a and 36b, and is formed in a box shape with the front side open.

本体27内の前面側には、本体27内に挿入される電源基板部21(電源基板)の挿入位置を位置決め規制する複数の規制部37が設けられている。 On the front side of the main body 27, a plurality of regulation parts 37 for positioning and restricting the insertion position of the power supply board part 21 (power supply board) to be inserted into the main body 27 are provided.

本体27内の左下側には、前面側に開口する端子収納部38が設けられている。端子収納部38内の背面側には2つの電線挿入孔39が設けられている。 On the lower left side of the main body 27, a terminal storage portion 38 that opens to the front side is provided. Two electric wire insertion holes 39 are provided on the back side of the terminal accommodating portion 38.

本体27の上面部34および下面部35には、前後方向に長いスリット状の通気溝40が左右方向に複数並んで設けられている。 A plurality of slit-shaped ventilation grooves 40 long in the front-rear direction are provided side by side in the left-right direction on the upper surface portion 34 and the lower surface portion 35 of the main body 27.

本体27の背面部33の前面側には、前方へ向けて、つまり収納部29内に向けて突出する突部41が設けられている。突部41は、本体27の上面部34、下面部35および左右の側面部36a,36bのそれぞれから離反した背面部33の中央域に位置されている。突部41は、例えば直径2.5mm、高さ0.9mmの円柱状に形成されている。なお、突部41は、円柱状に限らず、四角柱状、長方形状、あるいは球面状等のいずれでもよい。さらに、突部41は、本体27に一体に形成されているが、別体に設けて本体27に取り付けるようにしてもよい。 On the front side of the back surface 33 of the main body 27, a protrusion 41 is provided so as to project forward, that is, toward the inside of the storage unit 29. The protrusion 41 is located in the central region of the back surface portion 33 separated from the upper surface portion 34, the lower surface portion 35, and the left and right side surface portions 36a and 36b of the main body 27. The protrusion 41 is formed in a columnar shape having, for example, a diameter of 2.5 mm and a height of 0.9 mm. The protrusion 41 is not limited to a columnar shape, but may be a square columnar shape, a rectangular shape, a spherical shape, or the like. Further, although the protrusion 41 is integrally formed with the main body 27, it may be provided separately and attached to the main body 27.

カバー28の左右両側には、取付枠11に取り付けるための取付部43が設けられている。カバー28の前面側には、摘み部15を回動可能に保持するホルダ板44が取り付けられている。カバー28の前面側には、通常は前面カバー14で覆われていて前面カバー14を取り外すことによって露出する下限設定スイッチ用の窓部45が設けられている。カバー28の背面側には、本体27内に配置される電源基板部21(電源基板)の周辺部に当接し、電源基板部21を後方へ向けて、つまり本体27内に向けて押圧する複数の押圧部46が突設されている。カバー28の背面側には、制御基板部22(制御基板)をねじ47によって固定するためのボス48が設けられている。 Mounting portions 43 for mounting on the mounting frame 11 are provided on both the left and right sides of the cover 28. A holder plate 44 that rotatably holds the grip portion 15 is attached to the front surface side of the cover 28. On the front side of the cover 28, a window portion 45 for a lower limit setting switch, which is normally covered with the front cover 14 and is exposed by removing the front cover 14, is provided. On the back side of the cover 28, a plurality of units that abut against the peripheral portion of the power supply board portion 21 (power supply board) arranged in the main body 27 and press the power supply board portion 21 backward, that is, toward the inside of the main body 27. The pressing portion 46 of the above is projected. On the back side of the cover 28, a boss 48 for fixing the control board portion 22 (control board) with screws 47 is provided.

また、電源基板部21は、調光度に応じて交流電圧の導通角を可変制御する位相制御回路を備えている。電源基板部21は、プリント配線基板である電源基板50、この電源基板50に実装された位相制御回路の複数の電源部品51、電源部品51の中の発熱部品が発生する熱を放熱する第1の放熱板52および第2の放熱板53を備えている。 Further, the power supply board unit 21 includes a phase control circuit that variably controls the conduction angle of the AC voltage according to the dimming degree. The power supply board portion 21 is a first that dissipates heat generated by a power supply board 50 which is a printed wiring board, a plurality of power supply components 51 of a phase control circuit mounted on the power supply board 50, and heat generating components in the power supply component 51. The heat radiating plate 52 and the second heat radiating plate 53 are provided.

電源基板50は、四角形状で、本体27内に前面側から挿入配置可能とする外形に形成されている。電源基板50は、一面側である前面側に配線パターンが形成され、他面側である背面側に電源部品51が配置され、電源部品51のリードが電源基板50を挿通して配線パターンにはんだ付け接続されている。 The power supply board 50 has a quadrangular shape and is formed in an outer shape that can be inserted and arranged in the main body 27 from the front side. In the power supply board 50, a wiring pattern is formed on the front side, which is one side, the power supply component 51 is arranged on the back side, which is the other side, and the leads of the power supply component 51 insert the power supply board 50 and solder to the wiring pattern. Soldering is connected.

電源部品51には、位相制御回路を構成する2つの電力制御素子55、コンデンサおよび抵抗等が含まれている。電力制御素子55は、例えばMOSFETである。電力制御素子55は、電力ロスによって熱が発生する発熱部品である。電力制御素子55は、絶縁性を有する樹脂製のパッケージ56内に素子本体が収容され、素子本体に接続されたゲート、ドレインおよびソースの3つのリード57がパッケージ56の端部から突出されている。パッケージ56には、挿通孔を有するねじ止め部58が設けられている。リード57は、電源基板50を挿通されて配線パターンにはんだ付け接続されている。ねじ止め部58は、挿通孔を挿通するねじ59によって第1の放熱板52に取り付けられている。ねじ59の締め付けによってパッケージ56の一面が第1の放熱板52に面接触されている。 The power supply component 51 includes two power control elements 55, a capacitor, a resistor, and the like that form a phase control circuit. The power control element 55 is, for example, a MOSFET. The power control element 55 is a heat generating component that generates heat due to power loss. In the power control element 55, the element body is housed in a resin package 56 having an insulating property, and three leads 57 of a gate, a drain, and a source connected to the element body are projected from the end of the package 56. .. The package 56 is provided with a screwed portion 58 having an insertion hole. The lead 57 is inserted through the power supply board 50 and soldered to the wiring pattern. The screwed portion 58 is attached to the first heat sink 52 by a screw 59 through which the insertion hole is inserted. By tightening the screw 59, one surface of the package 56 is in surface contact with the first heat sink 52.

電源部品51には、本体27の端子収納部38に配置されるように電源基板50に実装された2つの端子60(図8参照)が含まれている。この端子60は、板ばねを組み合わせて本体27の端子収納部38に配置され、電線挿入孔39から挿入される電線が電気的に接続される。一方の端子60には配線器具13と接続するための渡り配線が接続され、他方の端子60には交流電源を供給する一対の電源線のうちの一方が接続される。 The power supply component 51 includes two terminals 60 (see FIG. 8) mounted on the power supply board 50 so as to be arranged in the terminal storage portion 38 of the main body 27. The terminal 60 is arranged in the terminal storage portion 38 of the main body 27 in combination with a leaf spring, and the electric wire inserted from the electric wire insertion hole 39 is electrically connected. A crossover wiring for connecting to the wiring device 13 is connected to one terminal 60, and one of a pair of power supply lines for supplying AC power is connected to the other terminal 60.

第1の放熱板52は、放熱性に優れた例えばアルミニウム等の金属材料によって形成されている。第1の放熱板52は、素子取付放熱板部61、この素子取付放熱板部61の両端から折曲して設けられた上側放熱板部62および下側放熱板部63を有する断面略コ字形に形成されている。第1の放熱板52の素子取付放熱板部61に電力制御素子55のねじ止め部58を挿通するねじ59が螺着され、ねじ59の締め付けによって素子取付放熱板部61に電力制御素子55のパッケージ56が面接触された状態に取り付けられている。 The first heat radiating plate 52 is made of a metal material such as aluminum, which has excellent heat radiating properties. The first heat sink 52 has a substantially U-shaped cross section having an element mounting heat sink 61, an upper heat sink 62 provided by bending from both ends of the element mounting heat sink 61, and a lower heat sink 63. Is formed in. A screw 59 for inserting the screwed portion 58 of the power control element 55 is screwed into the element mounting heat sink portion 61 of the first heat sink 52, and by tightening the screw 59, the power control element 55 is attached to the element mounting heat sink portion 61. Package 56 is mounted in surface contact.

第1の放熱板52は、電源基板50の周辺部に沿って配置されている。素子取付放熱板部61が電源基板50の一側辺に沿って配置され、上側放熱板部62が電源基板50の上辺に沿って配置され、下側放熱板部63が電源基板50の下辺に沿って配置されている。そのため、電源基板部21が本体27内に収納された状態では、素子取付放熱板部61が本体27の一側の側面部36bに所定の間隙をあけて対向され、上側放熱板部62が本体27の上面部34に所定の間隙をあけて対向され、下側放熱板部63が本体27の下面部35に所定の間隙をあけて対向される。上側放熱板部62および下側放熱板部63には、本体27に設けられた通気溝40と同様に、前後方向に長いスリット状の通気溝64が左右方向に複数並んで形成されている。上側放熱板部62および下側放熱板部63の通気溝64の開口位置は、本体27の通気溝40の開口位置に対して左右方向にずらして配置され、内部への埃の進入防止と、対流による空気の流れが第1の放熱板52に作用しやすくすることによる放熱性の向上が図られている。 The first heat radiating plate 52 is arranged along the peripheral portion of the power supply board 50. The element mounting heat sink portion 61 is arranged along one side of the power supply board 50, the upper heat sink portion 62 is arranged along the upper side of the power supply board 50, and the lower heat sink portion 63 is arranged on the lower side of the power supply board 50. It is arranged along. Therefore, when the power supply board portion 21 is housed in the main body 27, the element mounting heat sink portion 61 faces the side surface portion 36b on one side of the main body 27 with a predetermined gap, and the upper heat sink portion 62 is the main body. The upper surface portion 34 of 27 is opposed to the lower surface portion 34 with a predetermined gap, and the lower heat sink portion 63 is opposed to the lower surface portion 35 of the main body 27 with a predetermined gap. Similar to the ventilation groove 40 provided in the main body 27, a plurality of slit-shaped ventilation grooves 64 long in the front-rear direction are formed side by side in the left-right direction in the upper heat-dissipating plate portion 62 and the lower heat-dissipating plate portion 63. The opening positions of the ventilation grooves 64 of the upper heat sink 62 and the lower heat sink 63 are arranged so as to be offset in the left-right direction with respect to the opening positions of the ventilation grooves 40 of the main body 27 to prevent dust from entering the inside. The heat dissipation is improved by making it easier for the air flow due to convection to act on the first heat sink 52.

第1の放熱板52は、電力制御素子55によって電源基板50に支持されている。そのため、第1の放熱板52は、電力制御素子55の電源基板50に対する実装ばらつきによって、電源基板50の面に接触していたり離れていたりというように、電源基板50の面に対して垂直な方向の位置にばらつきが生じる場合がある。 The first heat sink 52 is supported by the power supply board 50 by the power control element 55. Therefore, the first heat sink 52 is perpendicular to the surface of the power supply board 50, such as being in contact with or away from the surface of the power supply board 50 due to variations in mounting of the power control element 55 with respect to the power supply board 50. The position in the direction may vary.

第2の放熱板53は、第1の放熱板52よりも板厚が薄く、ばね性を有している。第2の放熱板53は、放熱性に優れた金属製であって、例えば0.3mmの銅板によって形成されている。第2の放熱板53は、折曲部65を介して折曲形成された一端側放熱板部66および他端側放熱板部67を有している。一端側放熱板部66と他端側放熱板部67とのなす角度θは、90°よりも大きく、例えば100°程度になっている。 The second heat radiating plate 53 is thinner than the first heat radiating plate 52 and has a spring property. The second heat radiating plate 53 is made of metal having excellent heat radiating properties, and is formed of, for example, a 0.3 mm copper plate. The second heat radiating plate 53 has one end side heat radiating plate portion 66 and the other end side radiating plate portion 67 which are bent and formed via the bent portion 65. The angle θ formed by the heat radiating plate portion 66 on the one end side and the heat radiating plate portion 67 on the other end side is larger than 90 °, for example, about 100 °.

第2の放熱板53は、第1の放熱板52に組み合わされている。第2の放熱板53の一端側放熱板部66は第1の放熱板52の背面側に組み合わされ、他端側放熱板部67は第1の放熱板52の素子取付放熱板部61の外側に組み合わされている。 The second heat sink 53 is combined with the first heat sink 52. One end side heat sink 66 of the second heat sink 53 is combined with the back side of the first heat sink 52, and the other end heat sink 67 is outside the element mounting heat sink 61 of the first heat sink 52. Is combined with.

第2の放熱板53は、第1の放熱板52と組み合わされて本体27内に配置されている。第2の放熱板53の一端側放熱板部66は、本体27の背面部33に沿って配置されるとともに、第1の放熱板52の背面側と本体27の背面部33(突部41)の前面側との間に挟まれた状態に配置される。他端側放熱板部67は、本体27の一側の側面部36bに沿って配置されるとともに、第1の放熱板52の素子取付放熱板部61と本体27の一側の側面部36bとの間に挟まれた状態に配置される。 The second heat sink 53 is arranged in the main body 27 in combination with the first heat sink 52. The heat sink 66 on one end side of the second heat sink 53 is arranged along the back 33 of the main body 27, and the back side of the first heat sink 52 and the back 33 of the main body 27 (protrusion 41). It is placed so that it is sandwiched between the front side and the front side of the. The heat sink portion 67 on the other end side is arranged along the side surface portion 36b on one side of the main body 27, and also includes the element mounting heat sink portion 61 of the first heat sink plate 52 and the side surface portion 36b on one side of the main body 27. It is placed in a state of being sandwiched between.

一端側放熱板部66は、本体27の背面部33の形状に対応して、本体27の端子収納部38に対応する位置が切欠部68を有する形状に形成されている。一端側放熱板部66の上下方向の幅第1の放熱板52の上側放熱板部62と下側放熱板部63との間の間隔よりも広く、一端側放熱板部66の上下の縁部66a,66aが上側放熱板部62および下側放熱板部63の背面側に接触可能とする形状寸法に形成されている。 The heat sink portion 66 on one end side is formed in a shape having a notch 68 at a position corresponding to the terminal accommodating portion 38 of the main body 27, corresponding to the shape of the back surface portion 33 of the main body 27. Vertical width of one end side heat sink 66 Wider than the distance between the upper heat sink 62 and the lower heat sink 63 of the first heat sink 52, the upper and lower edges of the one end heat sink 66 66a and 66a are formed in a shape dimension that allows contact with the back side of the upper heat sink portion 62 and the lower heat sink portion 63.

他端側放熱板部67は、一端側放熱板部66に対する角度θが90°よりも大きいことにより、本体27内に挿入された際に他端側放熱板部67の先端側が本体27の一側の側面部36bに接触される。 Since the angle θ of the heat sink portion 67 on the other end side with respect to the heat sink portion 66 on the one end side is larger than 90 °, the tip end side of the heat sink portion 67 on the other end side is one of the main bodies 27 when inserted into the main body 27. It is in contact with the side side surface 36b.

また、制御基板部22は、摘み部15によって調整操作される調光度に応じて電源基板部21の位相制御回路の電力制御素子55を制御する調光制御回路を備えている。制御基板部22は、プリント配線基板である制御基板70、およびこの制御基板70に実装された調光制御回路の制御部品71を備えている。制御基板70は、カバー28の内側に配置され、カバー28のボス48に螺着されるねじ47によってカバー28に取り付けられている。 Further, the control board unit 22 includes a dimming control circuit that controls the power control element 55 of the phase control circuit of the power supply board unit 21 according to the dimming degree adjusted and operated by the knob unit 15. The control board unit 22 includes a control board 70 which is a printed wiring board, and a control component 71 of a dimming control circuit mounted on the control board 70. The control board 70 is arranged inside the cover 28 and is attached to the cover 28 by a screw 47 screwed onto the boss 48 of the cover 28.

制御部品71には、ボリューム72および下限設定スイッチ73等が含まれている。ボリューム72は、制御基板70に実装されるボリューム本体74、およびこのボリューム本体74の前面側から突出する調整軸75を有し、調整軸75の先端に摘み部が連結される。下限設定スイッチ73は、操作部分がカバー28の窓部45から前面側に突出され、調光値の下限を設定するかしないかの設定を切り換えるものである。 The control component 71 includes a volume 72, a lower limit setting switch 73, and the like. The volume 72 has a volume body 74 mounted on the control board 70 and an adjustment shaft 75 projecting from the front side of the volume body 74, and a knob is connected to the tip of the adjustment shaft 75. The lower limit setting switch 73 projects the operation portion from the window portion 45 of the cover 28 to the front side, and switches the setting of whether or not to set the lower limit of the dimming value.

そして、配線器具12を組み立てる場合には、まず、制御基板部22をカバー28の背面側に組み込み、ねじ47で制御基板70をカバー28に取り付ける。カバー28の前面側から突出するボリューム72の調整軸75に摘み部15を嵌合し、ホルダ板44によって摘み部15を回動可能にカバー28に取り付ける。なお、先に摘み部15をカバー28に取り付け、このカバー28に制御基板部22を組み合わせるようにしてもよい。 When assembling the wiring device 12, first, the control board portion 22 is assembled on the back side of the cover 28, and the control board 70 is attached to the cover 28 with screws 47. The knob portion 15 is fitted to the adjusting shaft 75 of the volume 72 protruding from the front side of the cover 28, and the knob portion 15 is rotatably attached to the cover 28 by the holder plate 44. The knob portion 15 may be attached to the cover 28 first, and the control board portion 22 may be combined with the cover 28.

電源基板部21を本体27内に挿入配置する。この場合、本体27内に、第2の放熱板53を先に挿入してから第1の放熱板52を有する電源基板50を挿入するか、あるいは、本体27内に、第2の放熱板53を第1の放熱板52に組み合わせた状態で電源基板50を挿入する。このとき、電源基板50と制御基板70とがケーブル23で接続されている状態で作業する。 The power supply board portion 21 is inserted and arranged in the main body 27. In this case, the second heat sink 53 is inserted into the main body 27 first, and then the power supply board 50 having the first heat sink 52 is inserted, or the second heat sink 53 is inserted into the main body 27. Is inserted into the power supply board 50 in a state where the above is combined with the first heat sink 52. At this time, work is performed in a state where the power supply board 50 and the control board 70 are connected by the cable 23.

カバー28を本体27の前面側に被せて取り付ける。 Cover the cover 28 on the front side of the main body 27 and attach it.

また、配線器具12の組立状態では、第2の放熱板53の一端側放熱板部66が第1の放熱板52の背面側と本体27の背面部33(突部41)の前面側との間に配置され、他端側放熱板部67が第1の放熱板52の素子取付放熱板部61と本体27の一側の側面部36bとの間に配置されている。さらに、電源基板50が本体27の規制部37とカバー28の押圧部46との間に挟まれた状態で筐体20内に位置決め保持されている。 Further, in the assembled state of the wiring fixture 12, the heat sink 66 on one end side of the second heat sink 53 is formed between the back side of the first heat sink 52 and the front side of the back 33 (protrusion 41) of the main body 27. The heat sink portion 67 on the other end side is arranged between the element mounting heat sink portion 61 of the first heat sink 52 and the side surface portion 36b on one side of the main body 27. Further, the power supply board 50 is positioned and held in the housing 20 in a state of being sandwiched between the regulating portion 37 of the main body 27 and the pressing portion 46 of the cover 28.

上述したように電力制御素子55によって電源基板50に支持されている第1の放熱板52は電源基板50の面に対して垂直な方向の位置にばらつきが生じる場合があるので、このばらつきを吸収するために第1の放熱板52の背面側と本体27の背面部33との間には所定の間隙が設けられており、第1の放熱板52の背面側が本体27の背面部33に接触することはない。 As described above, the first heat sink 52 supported by the power supply board 50 by the power control element 55 may have a variation in the position in the direction perpendicular to the surface of the power supply substrate 50, and thus absorbs this variation. A predetermined gap is provided between the back side of the first heat radiating plate 52 and the back side 33 of the main body 27, and the back side of the first heat radiating plate 52 contacts the back side 33 of the main body 27. There is nothing to do.

第1の放熱板52の背面側の位置は、第1の放熱板52の位置のばらつきにかかわらず、本体27の背面部33から突出する突部41の前面側の位置よりも後方に配置されている。 The position on the back side of the first heat radiating plate 52 is arranged behind the position on the front side of the protrusion 41 protruding from the back side 33 of the main body 27 regardless of the variation in the position of the first heat radiating plate 52. ing.

そのため、第1の放熱板52の背面側と本体27の突部41との間に配置される第2の放熱板53の一端側放熱板部66は、本体27の突部41と第1の放熱板52の背面側との間に挟まれ、一端側放熱板部66の背面側中央域が本体27の突部41に接触するとともに、一端側放熱板部66の前面側周辺部が第1の放熱板52の背面側に接触し、一端側放熱板部66の中央域が前方へ向けて凸湾曲状となるように撓んだ状態となり、一端側放熱板部66の周辺部が第1の放熱板52の背面側に接触するとともに、撓んだ一端側放熱板部66のばね力によって一端側放熱板部66の周辺部が第1の放熱板52の背面側に向けて押圧される。したがって、第1の放熱板52と第2の放熱板53とが確実に接触されている。 Therefore, the heat sink 66 on one end side of the second heat sink 53, which is arranged between the back surface side of the first heat sink 52 and the protrusion 41 of the main body 27, is the first heat sink 41 of the main body 27. It is sandwiched between the heat sink 52 and the back side, and the central region on the back side of the heat sink 66 on one end contacts the protrusion 41 of the main body 27, and the peripheral portion on the front side of the heat sink 66 on one end is the first. In contact with the back side of the heat sink 52 of the above, the central region of the heat sink 66 on one end is bent so as to be convexly curved toward the front, and the peripheral portion of the heat sink 66 on one end is the first. In addition to contacting the back side of the heat sink 52, the peripheral portion of the heat sink 66 on one end is pressed toward the back side of the first heat sink 52 by the spring force of the heat sink 66 on one end. .. Therefore, the first heat sink 52 and the second heat sink 53 are surely in contact with each other.

さらに、第1の放熱板52が本体27内に挿入できるように、第1の放熱板52の素子取付放熱板部61と本体27の一側の側面部36bとの間には所定の間隙が設けられている。第1の放熱板52の素子取付放熱板部61と本体27の一側の側面部36bとの間に配置される第2の放熱板53の他端側放熱板部67は、一端側放熱板部66に対する角度θが90°よりも大きいため、本体27内に挿入された際に他端側放熱板部67の先端側が本体27の一側の側面部36bに接触し、他端側放熱板部67の先端側に対して反対側である反先端側(一端側放熱板部66に連なる基端側)および一端側放熱板部66を本体27の一側の側面部36bから離反する方向に向けてばね力が生じる。これによって、少なくとも他端側放熱板部67の反先端側が第1の放熱板52の素子取付放熱板部61に押し付けられ、少なくとも他端側放熱板部67の反先端側が第1の放熱板52の素子取付放熱板部61に確実に接触されている。なお、他端側放熱板部67は、第1の放熱板52の素子取付放熱板部61を貫通したねじ59のねじ部先端側に当接する場合もある。 Further, a predetermined gap is provided between the element mounting heat sink portion 61 of the first heat sink 52 and the side surface portion 36b on one side of the main body 27 so that the first heat sink 52 can be inserted into the main body 27. It is provided. The other end side heat sink 67 of the second heat sink 53, which is arranged between the element mounting heat sink 61 of the first heat sink 52 and the side surface 36b on one side of the main body 27, is one end side heat sink. Since the angle θ with respect to the portion 66 is larger than 90 °, the tip end side of the other end side heat sink portion 67 contacts the side surface portion 36b on one side of the main body 27 when inserted into the main body 27, and the other end side heat sink plate The opposite end side (the base end side connected to the one end side heat sink 66) and the one end side heat sink 66, which are opposite to the tip side of the portion 67, are separated from the side surface 36b on one side of the main body 27. A spring force is generated toward it. As a result, at least the opposite end side of the other end side heat sink 67 is pressed against the element mounting heat sink 61 of the first heat sink 52, and at least the opposite end side of the other end heat sink 67 is the first heat sink 52. It is surely in contact with the element mounting heat sink portion 61 of. The heat sink portion 67 on the other end may come into contact with the tip end side of the screw portion 59 that penetrates the element mounting heat sink portion 61 of the first heat sink 52.

そして、配線器具ユニット10は、交流電源に対して照明負荷とともに直列に配線され、壁面の配線ボックスに取り付けられる。配線器具13のスイッチのオンにより、配線器具12と照明負荷との間の電路が閉成され、配線器具12の調光器によって調整される調光度で照明負荷が調光される。 Then, the wiring fixture unit 10 is wired in series with the AC power supply together with the lighting load, and is attached to the wiring box on the wall surface. When the switch of the wiring fixture 13 is turned on, the electric circuit between the wiring fixture 12 and the lighting load is closed, and the lighting load is dimmed with the dimming intensity adjusted by the dimmer of the wiring fixture 12.

配線器具12は、摘み部15の回動操作による調光度に応じて電力制御素子55を制御し、照明負荷に供給する交流電圧の導通角を可変制御する。電力制御素子55は交流電圧の導通角を可変制御することに伴う電力ロスによって発熱する。電力制御素子55の熱は、第1の放熱板52に伝達され、さらに第1の放熱板52から第2の放熱板53に伝達され、これら第1の放熱板52および第2の放熱板53から本体27内の空気中に放熱される。 The wiring fixture 12 controls the power control element 55 according to the dimming degree by the rotation operation of the knob 15, and variably controls the conduction angle of the AC voltage supplied to the lighting load. The power control element 55 generates heat due to power loss associated with variable control of the conduction angle of the AC voltage. The heat of the power control element 55 is transferred to the first heat sink 52, further transferred from the first heat sink 52 to the second heat sink 53, and these first heat sink 52 and second heat sink 53. Heat is dissipated into the air inside the main body 27.

本体27の上下面には複数の通気溝40が設けられているため、本体27内で暖められた空気が上昇して本体27の上面側の通気溝40から外部に排出されるとともに、本体27内の温度に比べて温度の低い外気が本体27の下面側の通気溝40から本体27内に流入されるという対流が生じ、電力制御素子55の熱が放熱される。 Since a plurality of ventilation grooves 40 are provided on the upper and lower surfaces of the main body 27, the air warmed in the main body 27 rises and is discharged to the outside from the ventilation grooves 40 on the upper surface side of the main body 27, and the main body 27 Convection occurs in which outside air, which is cooler than the inside temperature, flows into the main body 27 from the ventilation groove 40 on the lower surface side of the main body 27, and the heat of the power control element 55 is dissipated.

このとき、電力制御素子55の熱は、第1の放熱板52およびこの第1の放熱板52に接触された第2の放熱板53から効率よく放熱されるため、負荷電流が大きく、電力制御素子55の発熱量が増加した場合でも確実に放熱することができる。 At this time, the heat of the power control element 55 is efficiently dissipated from the first heat sink 52 and the second heat sink 53 in contact with the first heat sink 52, so that the load current is large and the power is controlled. Even if the amount of heat generated by the element 55 increases, heat can be reliably dissipated.

このように構成された配線器具12によれば、筐体20の収納部29に、第2の放熱板53が第1の放熱板52に組み合わされる方向に向けて突出する突部41を有するため、第2の放熱板53を第1の放熱板52に確実に接触させ、電力制御素子55の放熱性を向上できる。 According to the wiring device 12 configured in this way, the storage portion 29 of the housing 20 has a protrusion 41 that protrudes in the direction in which the second heat radiating plate 53 is combined with the first heat radiating plate 52. , The second heat radiating plate 53 can be surely brought into contact with the first heat radiating plate 52, and the heat radiating property of the power control element 55 can be improved.

さらに、第2の放熱板53は突部41によって撓んだ状態で第1の放熱板52に接触するため、第2の放熱板53を第1の放熱板52に確実に接触させ、放熱性を向上できる。 Further, since the second heat radiating plate 53 comes into contact with the first heat radiating plate 52 in a state of being bent by the protrusion 41, the second heat radiating plate 53 is surely brought into contact with the first heat radiating plate 52, and the heat radiating property is improved. Can be improved.

また、第2の放熱板53は、第1の放熱板52と突部41との間に配置される一端側放熱板部66、およびこの一端側放熱板部66から折曲され第1の放熱板52に接触する他端側放熱板部67を有するため、より放熱性を向上できる。 Further, the second heat sink 53 is bent from one end side heat sink 66 arranged between the first heat sink 52 and the protrusion 41 and the one end side heat sink 66 to dissipate the first heat. Since it has the heat radiating plate portion 67 on the other end side that contacts the plate 52, the heat radiating property can be further improved.

また、配線器具12の構成は、電力制御素子55を用いて照明負荷に入力される交流電圧の導通角を位相制御する調光器に適用できる。 Further, the configuration of the wiring fixture 12 can be applied to a dimmer that phase-controls the conduction angle of the AC voltage input to the lighting load by using the power control element 55.

なお、第2の放熱板53は、少なくとも一端側放熱板部66を備えていればよく、他端側放熱板部67を備えていなくても構わない。 The second heat radiating plate 53 may be provided with at least one end side radiating plate portion 66, and may not be provided with the other end side radiating plate portion 67.

また、突部41は、例えば第2の放熱板53の一部を切り起して設けてもよいが、本体27に一体成形することで容易に設けることができる。 Further, the protrusion 41 may be provided by cutting out a part of the second heat radiating plate 53, for example, but can be easily provided by integrally molding the main body 27.

また、配線器具は、発熱部品である電力制御素子を備えた配線器具であれば、調光器に限らず、例えば人感センサ等でもよい。 Further, the wiring device is not limited to the dimmer as long as it is a wiring device provided with a power control element which is a heat generating component, and may be, for example, a motion sensor or the like.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。 Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

12 配線器具
20 筐体
29 収納部
41 突部
50 プリント配線基板である電源基板
52 第1の放熱板
53 第2の放熱板
55 電力制御素子
66 一端側放熱板部
67 他端側放熱板部
12 Wiring equipment
20 chassis
29 Storage
41 ridge
50 Power supply board, which is a printed wiring board
52 First heat sink
53 Second heat sink
55 Power control element
66 One end side heat sink
67 Heat sink on the other end

Claims (5)

電力制御素子が実装されたプリント配線基板と;
前記電力制御素子の熱を放熱する第1の放熱板と;
前記第1の放熱板に組み合わされる第2の放熱板と;
前記プリント配線基板、前記第1の放熱板および前記第2の放熱板を収納する収納部、および前記第2の放熱板が前記第1の放熱板に組み合わされる方向に向けて前記収納部内に突出する突部を有する筐体と;
を備えることを特徴とする配線器具。
With a printed wiring board on which a power control element is mounted;
With the first heat sink that dissipates the heat of the power control element;
With a second heat sink combined with the first heat sink;
The printed wiring board, the storage portion for storing the first heat sink and the second heat sink, and the second heat sink project into the storage portion in a direction in which the second heat sink is combined with the first heat sink. With a housing having a heat sink;
Wiring equipment characterized by being equipped with.
前記突部によって前記第2の放熱板が前記第1の放熱板と接触する
ことを特徴とする請求項1記載の配線器具。
The wiring device according to claim 1, wherein the second heat sink comes into contact with the first heat sink by the protrusion.
前記第2の放熱板は、ばね性を有し、前記突部によって撓んだ状態で前記第1の放熱板に接触する
ことを特徴とする請求項2記載の配線器具。
The wiring device according to claim 2, wherein the second heat radiating plate has a spring property and comes into contact with the first heat radiating plate in a state of being bent by the protrusion.
前記第2の放熱板は、前記第1の放熱板と前記突部との間に配置される一端側放熱板部、およびこの一端側放熱板部から折曲され前記第1の放熱板に接触する他端側放熱板部を有する
ことを特徴とする請求項1ないし3いずれか一記載の配線器具。
The second heat radiating plate is bent from one end side heat radiating plate portion arranged between the first radiating plate and the protrusion and the one end side radiating plate portion to come into contact with the first heat radiating plate. The wiring device according to any one of claims 1 to 3, further comprising a heat sink portion on the other end side.
前記電力制御素子を用いて照明負荷に入力される交流電圧の導通角を位相制御する調光器である
ことを特徴とする請求項1ないし4いずれか一記載の配線器具。
The wiring device according to any one of claims 1 to 4, wherein the dimmer is a dimmer that phase-controls the conduction angle of an AC voltage input to a lighting load by using the power control element.
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1196830A (en) * 1997-09-17 1999-04-09 Kuroi Electric Co Ltd Dimmer for luminaire

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1196830A (en) * 1997-09-17 1999-04-09 Kuroi Electric Co Ltd Dimmer for luminaire

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