JP2021077836A - 光学部品及びアイソレータ - Google Patents
光学部品及びアイソレータ Download PDFInfo
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- JP2021077836A JP2021077836A JP2019205843A JP2019205843A JP2021077836A JP 2021077836 A JP2021077836 A JP 2021077836A JP 2019205843 A JP2019205843 A JP 2019205843A JP 2019205843 A JP2019205843 A JP 2019205843A JP 2021077836 A JP2021077836 A JP 2021077836A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 152
- 239000000758 substrate Substances 0.000 claims description 47
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000006854 communication Effects 0.000 abstract description 9
- 238000009413 insulation Methods 0.000 abstract description 6
- 230000007175 bidirectional communication Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
- H04B10/802—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections for isolation, e.g. using optocouplers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0239—Combinations of electrical or optical elements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Optical Couplings Of Light Guides (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
2 基板
2A 第1の領域
2B 第2の領域
3 レーザ(第1の投光手段,投光手段)
4 レーザ(第2の投光手段)
5 フォトダイオード(第1の受光手段,受光手段)
6 フォトダイオード(第2の受光手段)
7 光学部品
71 第1のレンズ部
72 第2のレンズ部
73 反射部
74 連結部
740 対向面
741 凸部
742 凹部
8A,8B パッド
D1 第1の方向
D2 第2の方向
Claims (5)
- 電気的に絶縁するアイソレータに対で用いられる光学部品であって、
互いに異なる光路上に配置され、第1の方向の光を透過させる複数の第1のレンズ部と、
互いに異なる光路上に配置され、前記第1の方向に直交する第2の方向の光を透過させる複数の第2のレンズ部と、
前記第1のレンズ部を透過した前記第1の方向の光を前記第2の方向に反射させて前記第2のレンズ部に導き、又は、前記第2のレンズ部を透過した前記第2の方向の光を前記第1の方向に反射させて前記第1のレンズ部に導く反射部と、を備え、
対の一方の光学部品が備えている前記第2のレンズ部と、対の他方の光学部品が備えている前記第2のレンズ部と、が互いに間隔を空けて対向するように配置されることを特徴とする
光学部品。 - 樹脂で一体に成型されていることを特徴とする
請求項1に記載の光学部品。 - 対の双方の互いに対向する対向面同士を突き当てて用いられる光学部品であって、
前記対向面に設けられた凸部と、
前記対向面に設けられた凹部と、を備え、
対の一方の光学部品が備えている前記凸部が対の他方の光学部品が備えている前記凹部に挿入されると共に、対の一方の光学部品が備えている前記凹部に対の他方の光学部品が備えている前記凸部が挿入されることで、対の双方の光学部品が互いに連結されることを特徴とする
請求項2に記載の光学部品。 - 請求項1〜3のいずれかに記載の対の光学部品と、
第1の領域と、前記第1の領域と電気的に絶縁されている第2の領域と、を有している基板と、
前記第1の領域に配置され、対の一方の光学部品が備えている前記第1のレンズ部に向けて前記第1の方向の光を照射する第1の投光手段と、
前記第2の領域に配置され、対の他方の光学部品が備えていて且つ前記第1の投光手段と同一の光路上に配置されている前記第1のレンズ部を透過した前記第1の方向の光を入射する第1の受光手段と、
前記第2の領域に配置され、対の他方の光学部品が備えていて且つ前記第1の投光手段と異なる光路上に配置されている前記第1のレンズ部に向けて前記第1の方向の光を照射する第2の投光手段と、
前記第1の領域に配置され、対の一方の光学部品が備えていて且つ前記第2の投光手段と同一の光路上に配置されている前記第1のレンズ部を透過した前記第1の方向の光を入射する第2の受光手段と、を備えていることを特徴とする
アイソレータ。 - 請求項1〜3のいずれかに記載の対の光学部品と、
第1の領域と、前記第1の領域と電気的に絶縁されている第2の領域と、を有している基板と、
前記第1の領域に配置され、対の一方の光学部品が備えている前記第1のレンズ部に向けて前記第1の方向の光を照射する投光手段と、
前記第2の領域に配置され、対の他方の光学部品が備えていて且つ前記投光手段と同一の光路上に配置されている前記第1のレンズ部を透過した前記第1の方向の光を入射する受光手段と、を備えていることを特徴とする
アイソレータ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019205843A JP6675701B1 (ja) | 2019-11-13 | 2019-11-13 | 光学部品及びアイソレータ |
PCT/JP2020/036752 WO2021095378A1 (ja) | 2019-11-13 | 2020-09-29 | 光学部品及びアイソレータ |
CN202080069600.7A CN114616493B (zh) | 2019-11-13 | 2020-09-29 | 光学部件以及隔离器 |
US17/765,863 US11688822B2 (en) | 2019-11-13 | 2020-09-29 | Optical component and isolator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019205843A JP6675701B1 (ja) | 2019-11-13 | 2019-11-13 | 光学部品及びアイソレータ |
Publications (2)
Publication Number | Publication Date |
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JP6675701B1 JP6675701B1 (ja) | 2020-04-01 |
JP2021077836A true JP2021077836A (ja) | 2021-05-20 |
Family
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JP2019205843A Active JP6675701B1 (ja) | 2019-11-13 | 2019-11-13 | 光学部品及びアイソレータ |
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US (1) | US11688822B2 (ja) |
JP (1) | JP6675701B1 (ja) |
CN (1) | CN114616493B (ja) |
WO (1) | WO2021095378A1 (ja) |
Families Citing this family (1)
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WO2021054803A1 (ko) * | 2019-09-20 | 2021-03-25 | 주식회사 라이팩 | 초소형 광송신 모듈 및 반도체 패키징 방식을 이용한 그의 제조방법 |
Family Cites Families (18)
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JPH01220482A (ja) | 1988-02-29 | 1989-09-04 | Iwasaki Electric Co Ltd | オプトアイソレータ |
JPH02161782A (ja) | 1988-12-14 | 1990-06-21 | Nec Corp | 光センサ |
KR20010030946A (ko) * | 1998-08-07 | 2001-04-16 | 오카야마 노리오 | 광 커넥터용 페룰, 그 성형용 금형, 광 커넥터용 페룰의제조 방법 및, 광 커넥터용 페룰의 검사 방법 |
US7835410B2 (en) * | 2007-02-07 | 2010-11-16 | Finisar Corporation | Opto-isolator including a vertical cavity surface emitting laser |
CN101339277A (zh) * | 2007-07-04 | 2009-01-07 | 珠海保税区光联通讯技术有限公司 | 单个无源光学器件的封装方法 |
US8785897B2 (en) | 2007-09-05 | 2014-07-22 | Finisar Corporation | Monolithic opto-isolators |
JP5416639B2 (ja) * | 2010-04-01 | 2014-02-12 | ファイベスト株式会社 | 半導体レーザ装置 |
US9465170B1 (en) * | 2010-10-19 | 2016-10-11 | US Conec, Ltd | Unitary multi-fiber optical ferrule with integrated lenses |
WO2012159168A1 (en) | 2011-05-25 | 2012-11-29 | The Silanna Group Pty Ltd | Usb isolator integrated circuit with usb 2.0 high speed mode and automatic speed detection |
JP6089354B2 (ja) | 2011-10-25 | 2017-03-08 | 株式会社エンプラス | レンズアレイおよびその製造方法 |
TW201423187A (zh) | 2012-12-03 | 2014-06-16 | Hon Hai Prec Ind Co Ltd | 光電轉換裝置 |
US10075246B2 (en) | 2013-09-26 | 2018-09-11 | Micro Motion, Inc. | Optical isolator mounted in printed circuit board recess |
JP6359848B2 (ja) | 2014-03-18 | 2018-07-18 | 株式会社エンプラス | 光レセプタクルおよびこれを備えた光モジュール |
WO2016058135A1 (en) * | 2014-10-14 | 2016-04-21 | Source Photonics (Chengdu) Co., Ltd. | Optical transmitter and method of transmitting an optical signal |
JP6821402B2 (ja) * | 2016-11-15 | 2021-01-27 | 株式会社エンプラス | 光学部品、光学部品の射出成形金型、及び光学部品の射出成形方法 |
CN111355533B (zh) * | 2018-12-20 | 2022-06-28 | 福州高意光学有限公司 | 基于vcsel的自由空间有源光学收发组件 |
JP7396304B2 (ja) * | 2019-01-24 | 2023-12-12 | ソニーグループ株式会社 | 光通信装置、光通信方法および光通信システム |
WO2021103958A1 (zh) * | 2019-11-25 | 2021-06-03 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
-
2019
- 2019-11-13 JP JP2019205843A patent/JP6675701B1/ja active Active
-
2020
- 2020-09-29 WO PCT/JP2020/036752 patent/WO2021095378A1/ja active Application Filing
- 2020-09-29 CN CN202080069600.7A patent/CN114616493B/zh active Active
- 2020-09-29 US US17/765,863 patent/US11688822B2/en active Active
Also Published As
Publication number | Publication date |
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CN114616493B (zh) | 2023-11-14 |
US20220328712A1 (en) | 2022-10-13 |
CN114616493A (zh) | 2022-06-10 |
WO2021095378A1 (ja) | 2021-05-20 |
JP6675701B1 (ja) | 2020-04-01 |
US11688822B2 (en) | 2023-06-27 |
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