JP2021072327A - Joint part structure of printed wiring board - Google Patents

Joint part structure of printed wiring board Download PDF

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Publication number
JP2021072327A
JP2021072327A JP2019196932A JP2019196932A JP2021072327A JP 2021072327 A JP2021072327 A JP 2021072327A JP 2019196932 A JP2019196932 A JP 2019196932A JP 2019196932 A JP2019196932 A JP 2019196932A JP 2021072327 A JP2021072327 A JP 2021072327A
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Prior art keywords
substrate
printed wiring
wiring board
wiring pattern
joint
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JP2019196932A
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JP7325299B2 (en
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祐士 増山
Yuji Masuyama
祐士 増山
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2019196932A priority Critical patent/JP7325299B2/en
Priority to CN202011138850.XA priority patent/CN112752392A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

To provide a joint part structure of a printed wiring board that enables not only avoidance of breakage of a printed wiring board and strength deterioration of a joint part but also a reduction in thickness.SOLUTION: A joint part structure of a printed wiring board comprises: a first substrate 1 provided with a first wiring pattern 2; a second substrate 3 provided with a second wiring pattern 4 and including two overhanging parts 6 in a bent state; a first joint part 7 in which a second connection terminal 4a provided for an end part of the second wiring pattern 4 positioned between the two overhanging parts 6 of the second substrate 3 and a first connection terminal 2a provided for an end part of the first wiring pattern 2 face each other, wherein the second connection terminal 4a and the first connection terminal 2a are jointed in such a manner that they overlap each other; and a second joint part 8 in which the two overhanging parts 6 in the bent state are jointed to side surfaces at both end parts of the first substrate 1. This improves joint strength and achieves a reduction in thickness of the joint part structure.SELECTED DRAWING: Figure 1

Description

本願は、プリント配線基板の接合部構造に関する。 The present application relates to a joint structure of a printed wiring board.

硬質であるリジッド基板及び可撓性であるフレキシブル基板等のプリント配線板同士の接合において、通常、プリント配線基板は他の部材への接合のためのフォーミングおよび上記二つの基板を含む電子機器の実使用時の振動・衝撃により、プリント配線基板端部に応力が集中し、破断する場合がある。 In joining printed wiring boards such as rigid rigid boards and flexible flexible boards, the printed wiring boards are usually formed for joining to other members and are actually electronic devices including the above two boards. Due to vibration and impact during use, stress may be concentrated on the edge of the printed wiring board and it may break.

そこで、特許文献１には、二つのプリント配線基板の接合部構造において、一のプリント配線基板の端部が他のプリント配線基板の裏面の一部まで達し、抱え込むように折り曲げられて、接続強度を向上させる接合部補強構造が開示されている。 Therefore, in Patent Document 1, in the joint structure of two printed wiring boards, the end portion of one printed wiring board reaches a part of the back surface of the other printed wiring board and is bent so as to hold it, so that the connection strength is increased. A joint reinforcement structure for improving the above is disclosed.

特開２００７−２５８６１８号公報（段落００１１、図１）JP-A-2007-258618 (paragraph 0011, FIG. 1)

しかしながら、特許文献１の場合、プリント配線基板を裏面側まで曲げて接合する必要があり、接合部構造を薄型化できないという問題があった。また、曲げる部分の面積が大きく、プリント基板を製造する際に、同一面積からの取れ数が少なく、低コスト化に問題があった。 However, in the case of Patent Document 1, it is necessary to bend the printed wiring board to the back surface side for joining, and there is a problem that the joint structure cannot be made thinner. In addition, the area of the bent portion is large, and when manufacturing a printed circuit board, the number of sheets that can be taken from the same area is small, which causes a problem in cost reduction.

本願は、上記のような課題を解決するための技術を開示するものであり、プリント基板を小面積化することで低コスト化を可能にし、プリント配線基板の破断、接合部分の強度劣化を回避するだけでなく、薄型化が可能なプリント配線基板の接合部構造を提供すること目的とする。 The present application discloses a technique for solving the above-mentioned problems, enables cost reduction by reducing the area of the printed circuit board, and avoids breakage of the printed wiring board and deterioration of the strength of the joint portion. It is an object of the present invention to provide a joint structure of a printed wiring board that can be made thinner as well as thinned.

本願に開示されるプリント配線基板の接合部構造は、第１の配線パターンが設けられた第１の基板と、第２の配線パターンが設けられ、折り曲げられた状態の二つの張り出し部を有する第２の基板と、前記第２の基板の二つの張り出し部の間に位置する前記第２の配線パターンの端部に設けられた第２の接続端子と前記第１の配線パターンの端部に設けられた第１の接続端子とが対向し、前記第２の接続端子と前記第１の接続端子が重なって接合された第１の接合部と、前記折り曲げられた状態の二つの張り出し部が、前記第１の基板の両端部側面に接合された第２の接合部とを備えたことを特徴とする。 The joint structure of the printed wiring board disclosed in the present application has a first substrate provided with a first wiring pattern and a second overhanging portion provided with a second wiring pattern and in a bent state. Provided at the end of the second wiring pattern and the second connection terminal provided at the end of the second wiring pattern located between the second substrate and the two overhanging portions of the second substrate. The first joint portion in which the first connection terminal is opposed to each other and the second connection terminal and the first connection terminal are overlapped and joined, and the two overhanging portions in the bent state are formed. It is characterized in that it is provided with a second joint portion joined to the side surfaces of both end portions of the first substrate.

本願によれば、折り曲げる前の第２の基板を小面積化することで低コスト化を可能にする。また、プリント配線基板間の接合強度が向上し、接続面積を拡大することなく、接合部構造の強度劣化を回避することができるだけでなく、接合部構造の薄型化を図ることができる。 According to the present application, it is possible to reduce the cost by reducing the area of the second substrate before bending. Further, the joint strength between the printed wiring boards is improved, and it is possible not only to avoid deterioration of the strength of the joint structure without expanding the connection area, but also to reduce the thickness of the joint structure.

実施の形態１に係るプリント配線基板の接合部構造を示す図である。It is a figure which shows the joint structure of the printed wiring board which concerns on Embodiment 1. FIG. 実施の形態２に係るプリント配線基板の接合部構造における接合前の状態を示す図である。It is a figure which shows the state before joining in the joint part structure of the printed wiring board which concerns on Embodiment 2. FIG. 実施の形態２に係るプリント配線基板の接合部構造における接合前の状態を示す他の図である。It is another figure which shows the state before joining in the joint part structure of the printed wiring board which concerns on Embodiment 2. FIG. 実施の形態３に係るプリント配線基板の接合部構造を示す図である。It is a figure which shows the joint structure of the printed wiring board which concerns on Embodiment 3. 実施の形態４に係るプリント配線基板の接合部構造を示す図である。It is a figure which shows the joint structure of the printed wiring board which concerns on Embodiment 4. FIG.

実施の形態１
図１は、実施の形態１に係るプリント配線基板の接合部構造１０１の構成を示す図である。図１（ａ）は、プリント配線基板の接合部構造の平面図である。図１（ｂ）は、図１（ａ）のＡＡ矢視断面図である。図１（ｃ）は、プリント配線基板の接合前の状態を示す平面図である。 Embodiment 1
FIG. 1 is a diagram showing a configuration of a joint structure 101 of a printed wiring board according to a first embodiment. FIG. 1A is a plan view of the joint structure of the printed wiring board. FIG. 1B is a cross-sectional view taken along the line AA of FIG. 1A. FIG. 1C is a plan view showing a state before joining the printed wiring board.

図１（ａ）、図１（ｂ）および図１（ｃ）に示すように、この実施の形態１のプリント配線基板の接合部構造１０１は、第１の接続端子２ａを有する第１の配線パターン２が表面に設けられた第１の基板１と、第１の接続端子２ａと接合した第２の接続端子４ａを有する第２の配線パターン４が裏面に設けられ、端部が幅方向から第１の基板１を挟んで接合された第２の基板３とを備える。 As shown in FIGS. 1 (a), 1 (b) and 1 (c), the joint structure 101 of the printed wiring board of the first embodiment is a first wiring having a first connection terminal 2a. A second wiring pattern 4 having a first substrate 1 on which the pattern 2 is provided on the front surface and a second connection terminal 4a joined to the first connection terminal 2a is provided on the back surface, and the ends are provided from the width direction. A second substrate 3 joined with the first substrate 1 interposed therebetween is provided.

第２の基板３の基板接合部側には、図１（ｃ）に示す矩形の張り出し部６が両側に備えられており、この張り出し部６の基板の幅方向のＸ方向は、第１の基板１の幅より長く、かつ張り出し部６を第１の基板１の基板のＸ方向の両端で第１の基板１を挟むように折り曲げた際に、第１の基板１の両側面を概ね覆う長さがあり、さらに基板長手方向のＹ方向の長さＬ２は第１の基板１と第２の基板３の基板長手方向の接続長さＬ１よりも長くなっている。 The rectangular overhanging portion 6 shown in FIG. 1C is provided on both sides of the wafer bonding portion side of the second substrate 3, and the X direction in the width direction of the substrate of the overhanging portion 6 is the first. It is longer than the width of the substrate 1, and when the overhanging portion 6 is bent so as to sandwich the first substrate 1 at both ends of the substrate of the first substrate 1 in the X direction, it substantially covers both side surfaces of the first substrate 1. Further, the length L2 in the Y direction in the longitudinal direction of the substrate is longer than the connection length L1 in the longitudinal direction of the first substrate 1 and the second substrate 3.

プリント配線基板の接合部構造１０１は、第１の接合部７により、第１の基板１上の第１の配線パターン２と第２の基板３下の第２の配線パターン４を、所定の接続長さ、すなわち第１の基板１と第２の基板３の基板長手方向の接続長さＬ１で接合する。さらに第２の基板３の２か所の張り出し部６を、第１の基板１の基板のＸ方向の両端で第１の基板１を挟むように折り曲げ、第１の基板１の側面と第２の基板３の張り出し部６の内側を第２の接合部８を用いて接合することで構成する。 The joint structure 101 of the printed wiring board connects the first wiring pattern 2 on the first board 1 and the second wiring pattern 4 under the second board 3 by the first joint 7 in a predetermined manner. The first substrate 1 and the second substrate 3 are joined by the length, that is, the connection length L1 in the longitudinal direction of the substrate. Further, the two overhanging portions 6 of the second substrate 3 are bent so as to sandwich the first substrate 1 at both ends of the substrate of the first substrate 1 in the X direction, and the side surface of the first substrate 1 and the second substrate 1 are bent. The inside of the overhanging portion 6 of the substrate 3 is joined by using the second joining portion 8.

上記の説明では、先に第１の基板１と第２の基板３を第１の接合部７で接合し、その後に第２の基板３の張り出し部を折り曲げる手順としたが、先に第２の基板３の張り出し部６を折り曲げて、その後の第１の基板１と第２の基板３を第１の接合部７で接合しても良い。 In the above description, the procedure is as follows in that the first substrate 1 and the second substrate 3 are first joined at the first joint portion 7, and then the overhanging portion of the second substrate 3 is bent. The overhanging portion 6 of the substrate 3 may be bent, and then the first substrate 1 and the second substrate 3 may be joined at the first joint portion 7.

第１の基板１としては、例えばガラスエポキシ基板、ガラスコンポジット基板、紙エポキシ基板、セラミック基板等の硬質のリジッド基板を用いることができる。また、例えばポリイミド基板、ポリエチレンテレフタレート（ＰＥＴ）基板、ポリエチレンナフタレート（ＰＥＮ）基板等の可撓性を有するフレキシブル基板を用いてもよい。第２の基板３としては、例えばフレキシブル基板を用いる。 As the first substrate 1, for example, a hard rigid substrate such as a glass epoxy substrate, a glass composite substrate, a paper epoxy substrate, or a ceramic substrate can be used. Further, a flexible substrate having flexibility such as a polyimide substrate, a polyethylene terephthalate (PET) substrate, or a polyethylene naphthalate (PEN) substrate may be used. As the second substrate 3, for example, a flexible substrate is used.

第１の配線パターン２は、第１の基板１の表面上に設計された導体の回路パターンである。同様に、第２の配線パターン４は、第２の基板３に設計された導体の回路パターンである。第１の配線パターン２と第２の配線パターン４は、第１の基板１及び第２の基板３上に圧延銅箔または電解銅箔等によりパターン加工して形成される。第１の配線パターン２及び第２の配線パターン４には、銅箔以外の金属箔を導体として使うことも可能である。 The first wiring pattern 2 is a circuit pattern of a conductor designed on the surface of the first substrate 1. Similarly, the second wiring pattern 4 is a circuit pattern of a conductor designed on the second substrate 3. The first wiring pattern 2 and the second wiring pattern 4 are formed by pattern processing on the first substrate 1 and the second substrate 3 with rolled copper foil, electrolytic copper foil, or the like. For the first wiring pattern 2 and the second wiring pattern 4, a metal foil other than the copper foil can be used as a conductor.

第１の接合部７と第２の接合部８は、異なる接合材料であっても良いし、同一の接合材料でも良い。接合材料の種類としては、はんだ、樹脂等があるが、第１の接合部７としてははんだまたは導電性の樹脂が用いられ、第２の接合部８としては、樹脂全般が用いられる。 The first joint portion 7 and the second joint portion 8 may be made of different joint materials or may be the same joint material. The types of bonding materials include solder, resin, and the like. Solder or conductive resin is used as the first bonding portion 7, and resin in general is used as the second bonding portion 8.

以上のように、実施の形態１に係るプリント配線基板の接合部構造１０１によれば、第１の配線パターン２が設けられた第１の基板１と、第２の配線パターン４が設けられ、折り曲げられた状態の二つの張り出し部６を有する第２の基板３と、第２の基板３の二つの張り出し部６の間に位置する第２の配線パターン４の端部に設けられた第２の接続端子４ａと第１の配線パターン２の端部に設けられた第１の接続端子２ａとが対向し、第２の接続端子４ａと第１の接続端子２ａが重なって接合された第１の接合部７と、折り曲げられた状態の二つの張り出し部６が、第１の基板１の両端部側面に接合された第２の接合部８とを備えるようにしたので、第２の基板の断面をコの字状とし、かつ、張り出し部の基板長手方向（Ｙ方向）の長さを、第１の基板１と第２の基板３の基板長手方向の接続長さＬ１よりも長くすることで、プリント配線基板間の接合強度が向上し、プリント配線基板間の接続部分の面積を大きくすることなく、基板の接合部、及びフレキシブル基板の破断、接合部構造の強度劣化を回避することができるだけでなく、接合部構造の薄型化を図ることができる。また、これにより例えば、第２の基板を他の部材へ接合するためのフォーミングおよび第１の基板及び第２の基板が実装された電子機器の実使用時の振動・衝撃により、第１の基板と第２の基板の接続部分、特に第２の基板の第１の基板の接続端面付近への応力集中を緩和することができる。また、図１（ｃ）に示す第２の基板のＸ方向の長さは第１の基板の裏面側まで回り込む必要がないため、折り曲げ前の面積の小型化が可能となり、これにより低コスト化が可能となる。 As described above, according to the joint structure 101 of the printed wiring board according to the first embodiment, the first board 1 provided with the first wiring pattern 2 and the second wiring pattern 4 are provided. A second substrate 3 having two overhangs 6 in a bent state and a second substrate 3 provided at the end of a second wiring pattern 4 located between the two overhangs 6 of the second substrate 3. The first connection terminal 4a and the first connection terminal 2a provided at the end of the first wiring pattern 2 face each other, and the second connection terminal 4a and the first connection terminal 2a are overlapped and joined. The joint portion 7 and the two overhanging portions 6 in the bent state are provided with the second joint portion 8 joined to the side surfaces of both ends of the first substrate 1, so that the second substrate can be used. The cross section is U-shaped, and the length of the overhanging portion in the board longitudinal direction (Y direction) is longer than the connection length L1 of the first board 1 and the second board 3 in the board length direction. Therefore, the joint strength between the printed wiring boards is improved, and it is possible to avoid breakage of the joint portion of the substrate and the flexible substrate, and deterioration of the strength of the joint structure without increasing the area of the connection portion between the printed wiring boards. Not only that, the thickness of the joint structure can be reduced. Further, as a result, for example, due to the forming for joining the second substrate to another member and the vibration / impact during actual use of the electronic device on which the first substrate and the second substrate are mounted, the first substrate is formed. It is possible to relax the stress concentration in the connection portion between the second substrate and the second substrate, particularly in the vicinity of the connection end face of the first substrate of the second substrate. Further, since the length of the second substrate shown in FIG. 1C in the X direction does not need to wrap around to the back surface side of the first substrate, the area before bending can be reduced, thereby reducing the cost. Is possible.

実施の形態２．
実施の形態１では、第２の基板３において矩形の張り出し部６を用いた場合を示したが、実施の形態２では、台形の張り出し部を用いた場合について説明する。 Embodiment 2.
In the first embodiment, the case where the rectangular overhanging portion 6 is used in the second substrate 3 is shown, but in the second embodiment, the case where the trapezoidal overhanging portion is used will be described.

図２は、実施の形態２に係るプリント配線基板の接合部構造１０１における接合前の状態を示す図である。図２に示すように、この実施の形態２のプリント配線基板の接合部構造１０１では、第２の基板３の基板接合部側には、台形の張り出し部２２が両側に備えられており、この張り出し部２２の基板の幅方向（Ｘ方向）は、第１の基板１の幅より長く、かつ張り出し部２２を第１の基板１の基板の幅方向（Ｘ方向）の両端で第１の基板１を挟むように折り曲げた際に、第１の基板１の両側面を概ね覆う長さがあり、さらに台形の張り出し部２２の台形の下底の基板長手方向（Ｙ方向）の長さＬ３は、第１の基板１と第２の基板３の基板長手方向の接続長さＬ１よりも長くなっている。実施の形態２によるプリント配線基板の接合部構造１０１のその他の構成については、実施の形態１のプリント配線基板の接合部構造１０１と同様であり、対応する部分には同符号を付してその説明を省略する。 FIG. 2 is a diagram showing a state before joining in the joint structure 101 of the printed wiring board according to the second embodiment. As shown in FIG. 2, in the joint portion structure 101 of the printed wiring board of the second embodiment, trapezoidal overhanging portions 22 are provided on both sides of the substrate joint portion side of the second substrate 3. The width direction (X direction) of the substrate of the overhanging portion 22 is longer than the width of the first substrate 1, and the overhanging portion 22 is the first substrate at both ends in the width direction (X direction) of the substrate of the first substrate 1. When bent so as to sandwich 1, there is a length that substantially covers both side surfaces of the first substrate 1, and the length L3 of the trapezoidal overhanging portion 22 of the trapezoidal lower bottom in the substrate longitudinal direction (Y direction) is , The connection length L1 of the first substrate 1 and the second substrate 3 in the longitudinal direction of the substrate is longer than that of L1. Other configurations of the joint structure 101 of the printed wiring board according to the second embodiment are the same as those of the joint structure 101 of the printed wiring board of the first embodiment, and the corresponding portions are designated by the same reference numerals. The explanation is omitted.

以上のように、実施の形態２に係るプリント配線基板の接合部構造１０１によれば、張り出し部２２を台形の形状にしたので、実施の形態１の効果に加えて、さらに接合部構造を補強することができる。 As described above, according to the joint structure 101 of the printed wiring board according to the second embodiment, the overhanging portion 22 has a trapezoidal shape. Therefore, in addition to the effect of the first embodiment, the joint structure is further reinforced. can do.

なお、実施の形態２では、張り出し部２２を台形としたが、これに限るものではない。例えば、図３に示すように、第２の基板３の張り出し部３２が疑似台形（疑似台形の下底の基板長手方向（Ｙ方向）の長さＬ４）であってもよい。この場合も、同様の効果を得ることができる。 In the second embodiment, the overhanging portion 22 is trapezoidal, but the present invention is not limited to this. For example, as shown in FIG. 3, the overhanging portion 32 of the second substrate 3 may have a pseudo trapezoid (length L4 in the longitudinal direction (Y direction) of the lower bottom of the pseudo trapezoid). In this case as well, the same effect can be obtained.

実施の形態３．
実施の形態１では、基板３の張り出し部６の内側を第２の接合部８のみを用いて接合した場合を示したが、実施の形態３では、張り出し部にも配線パターンを設けた場合について説明する。 Embodiment 3.
In the first embodiment, the case where the inside of the overhanging portion 6 of the substrate 3 is joined using only the second joining portion 8 is shown, but in the third embodiment, the case where the wiring pattern is also provided in the overhanging portion explain.

図４は、実施の形態３に係るプリント配線基板の接合部構造１０１の構成を示す図である。図４（ａ）は、プリント配線基板の接合部構造の平面図である。図４（ｂ）は、図４（ａ）のＢＢ矢視断面図である。図４（ｃ）は、プリント配線基板の接合前の状態を示す平面図である。 FIG. 4 is a diagram showing the configuration of the joint structure 101 of the printed wiring board according to the third embodiment. FIG. 4A is a plan view of the joint structure of the printed wiring board. FIG. 4B is a cross-sectional view taken along the line BB of FIG. 4A. FIG. 4C is a plan view showing a state before joining the printed wiring board.

図４（ａ）、図４（ｂ）および図４（ｃ）に示すように、この実施の形態３のプリント配線基板の接合部構造１０１では、第１の基板１には表面に第１の配線パターン２だけではなく、側面に第３の配線パターン４２が設けられており、また第２の基板３には裏面に第２の配線パターン４だけではなく、第２の基板３の張り出し部６の内側に第４の配線パターン４３が設けられている。 As shown in FIGS. 4 (a), 4 (b), and 4 (c), in the joint structure 101 of the printed wiring board of the third embodiment, the first board 1 has a first surface on the surface. Not only the wiring pattern 2 but also the third wiring pattern 42 is provided on the side surface, and the second substrate 3 has not only the second wiring pattern 4 but also the overhanging portion 6 of the second substrate 3 on the back surface. A fourth wiring pattern 43 is provided inside the.

第１の基板１上の第１の配線パターン２と第２の基板３下の第２の配線パターン４を第１の接合部７を用いて、接続長さＬ１で接合するとともに、第１の基板１側面の第３の配線パターン４２と第２の基板３の張り出し部６内側の第４の配線パターン４３は、第２の接合部８を用いて接合されている。実施の形態３によるプリント配線基板の接合部構造１０１のその他の構成については、実施の形態１のプリント配線基板の接合部構造１０１と同様であり、対応する部分には同符号を付してその説明を省略する。 The first wiring pattern 2 on the first substrate 1 and the second wiring pattern 4 under the second substrate 3 are joined by the first joining portion 7 with a connection length L1 and the first The third wiring pattern 42 on the side surface of the substrate 1 and the fourth wiring pattern 43 inside the overhanging portion 6 of the second substrate 3 are joined by using the second joining portion 8. Other configurations of the joint structure 101 of the printed wiring board according to the third embodiment are the same as those of the joint structure 101 of the printed wiring board of the first embodiment, and the corresponding portions are designated by the same reference numerals. The explanation is omitted.

第１の基板１の側面に設けた第３の配線パターン４２と第２の基板３の張り出し部６の内側に設けた第４の配線パターン４３は導体のパターンではあるが、電気信号用の配線パターンとして使用しても、単に補強用ランドとしての他から独立した配線パターンであっても良い。 The third wiring pattern 42 provided on the side surface of the first substrate 1 and the fourth wiring pattern 43 provided inside the overhanging portion 6 of the second substrate 3 are conductor patterns, but are wiring for electric signals. It may be used as a pattern or may be a wiring pattern that is independent of the others as a reinforcing land.

本実施の形態３の第１の接合部７および第２の接合部８としては、はんだまたは導電性の樹脂が用いられ、第２の接合部８としては、樹脂全般が用いられる。第１の接合部７と第２の接合部８は、異なる接合材料であっても良いし、同一の接合材料でも良い。 Solder or conductive resin is used as the first joint portion 7 and the second joint portion 8 of the third embodiment, and resin in general is used as the second joint portion 8. The first joint portion 7 and the second joint portion 8 may be made of different joint materials or may be the same joint material.

以上のように、実施の形態３に係るプリント配線基板の接合部構造１０１によれば、張り出し部２２を、第１の基板１の側面に設けられた第３の配線パターン４２と第２の基板３の張り出し部内側に設けられた第４の配線パターン４３とを介して接合するようにしたので、実施の形態１の効果に加えて、張り出し部との接合領域である第１の基板の側面を配線パターンに利用することにより、プリント配線基板の面積を縮小できる。 As described above, according to the joint structure 101 of the printed wiring board according to the third embodiment, the overhanging portion 22 is provided on the side surface of the first substrate 1 with the third wiring pattern 42 and the second substrate. Since the connection is made via the fourth wiring pattern 43 provided inside the overhanging portion of 3, in addition to the effect of the first embodiment, the side surface of the first substrate which is the joining region with the overhanging portion is formed. Can be used for the wiring pattern to reduce the area of the printed wiring board.

実施の形態４．
実施の形態１では、第１の基板１の側面と第２の基板３の張り出し部６をそのまま第２の接合部８を用いて接合する場合を示したが、実施の形態４では、張り出し部の接合部分にスルーホールを形成した場合について説明する。 Embodiment 4.
In the first embodiment, the case where the side surface of the first substrate 1 and the overhanging portion 6 of the second substrate 3 are joined as they are by using the second joining portion 8 is shown, but in the fourth embodiment, the overhanging portion is used. A case where a through hole is formed in the joint portion of the above will be described.

図５は、実施の形態４に係るプリント配線基板の接合部構造１０１の構成を示す図である。図５（ａ）は、プリント配線基板の接合部構造の平面図である。図５（ｂ）は、図５（ａ）のＣＣ矢視断面図である。図５（ｃ）は、プリント配線基板の接合前の状態を示す平面図である。 FIG. 5 is a diagram showing the configuration of the joint structure 101 of the printed wiring board according to the fourth embodiment. FIG. 5A is a plan view of the joint structure of the printed wiring board. 5 (b) is a cross-sectional view taken along the line CC of FIG. 5 (a). FIG. 5C is a plan view showing a state before joining the printed wiring board.

図５（ａ）、図５（ｂ）および図５（ｃ）に示すように、この実施の形態４のプリント配線基板の接合部構造１０１では、第２の基板３の張り出し部６の第１の基板１の側面と接合する位置に、スルーホール６１が形成されている。この構成により、第１の基板１の側面と第２の基板３の張り出し部６を第２の接合部８を用いて接合する際に、スルーホール６１の円筒内壁と第１の基板１の側面間でフィレット８ａが形成される。なお、第２の接合部８にはんだを使用する際は、通常、スルーホール６１の内壁前面と、スルーホール６１の表面と裏面の開口部周縁に金属めっきが施される。 As shown in FIGS. 5 (a), 5 (b) and 5 (c), in the joint structure 101 of the printed wiring board of the fourth embodiment, the first of the overhanging portions 6 of the second substrate 3 A through hole 61 is formed at a position where the substrate 1 is joined to the side surface of the substrate 1. With this configuration, when the side surface of the first substrate 1 and the overhanging portion 6 of the second substrate 3 are joined by using the second joint portion 8, the inner wall of the cylinder of the through hole 61 and the side surface of the first substrate 1 are joined. Fillets 8a are formed between them. When solder is used for the second joint portion 8, metal plating is usually applied to the front surface of the inner wall of the through hole 61 and the peripheral edges of the openings on the front and back surfaces of the through hole 61.

以上のように、実施の形態４に係るプリント配線基板の接合部構造１０１によれば、第２の基板３の張り出し部６の第１の基板１の側面と接合する位置に、スルーホール６１を形成したので、実施の形態１の効果に加えて、接合時に形成されるフィレットにより、接合強度の向上を図ることができる。また、スルーホールから接合面の濡れの状態を容易に確認することができる。 As described above, according to the joint portion structure 101 of the printed wiring board according to the fourth embodiment, the through hole 61 is provided at a position where the overhanging portion 6 of the second substrate 3 is joined to the side surface of the first substrate 1. Since it is formed, in addition to the effect of the first embodiment, the fillet formed at the time of joining can improve the joining strength. In addition, the wet state of the joint surface can be easily confirmed from the through hole.

なお、本実施の形態４では、各張り出し部６にスルーホール１個を形成したが、これに限るものではなく、複数のスルーホールを形成しても良い。この場合も、同様の効果を得ることができる。 In the fourth embodiment, one through hole is formed in each overhanging portion 6, but the present invention is not limited to this, and a plurality of through holes may be formed. In this case as well, the same effect can be obtained.

本願は、様々な例示的な実施の形態及び実施例が記載されているが、１つ、または複数の実施の形態に記載された様々な特徴、態様、及び機能は特定の実施の形態の適用に限られるのではなく、単独で、または様々な組み合わせで実施の形態に適用可能である。従って、例示されていない無数の変形例が、本願明細書に開示される技術の範囲内において想定される。例えば、少なくとも１つの構成要素を変形する場合、追加する場合または省略する場合、さらには、少なくとも１つの構成要素を抽出し、他の実施の形態の構成要素と組み合わせる場合が含まれるものとする。 Although the present application describes various exemplary embodiments and examples, the various features, embodiments, and functions described in one or more embodiments are applications of a particular embodiment. It is not limited to, but can be applied to embodiments alone or in various combinations. Therefore, innumerable variations not illustrated are envisioned within the scope of the techniques disclosed herein. For example, it is assumed that at least one component is modified, added or omitted, and further, at least one component is extracted and combined with the components of other embodiments.

１ 第１の基板、２ 第１の配線パターン、２ａ 第１の接続端子、３ 第２の基板、４ 第２の配線パターン、４ａ 第２の接続端子、６ 張り出し部、７ 第１の接合部、８ 第２の接合部、１０１ プリント配線基板の接合部構造。 1 1st board, 2 1st wiring pattern, 2a 1st connection terminal, 3 2nd board, 4 2nd wiring pattern, 4a 2nd connection terminal, 6 overhang, 7 1st joint , 8 Second joint, 101 Printed wiring board joint structure.

Claims (7)

第１の配線パターンが設けられた第１の基板と、
第２の配線パターンが設けられ、折り曲げられた状態の二つの張り出し部を有する第２の基板と、
前記第２の基板の二つの張り出し部の間に位置する前記第２の配線パターンの端部に設けられた第２の接続端子と前記第１の配線パターンの端部に設けられた第１の接続端子とが対向し、前記第２の接続端子と前記第１の接続端子が重なって接合された第１の接合部と、
前記折り曲げられた状態の二つの張り出し部が、前記第１の基板の両端部側面に接合された第２の接合部と
を備えたことを特徴とするプリント配線基板の接合部構造。 The first board provided with the first wiring pattern and
A second substrate provided with a second wiring pattern and having two overhangs in a folded state,
A second connection terminal provided at the end of the second wiring pattern located between two overhangs of the second substrate and a first provided at the end of the first wiring pattern. A first joint portion in which the connection terminals face each other and the second connection terminal and the first connection terminal are overlapped and joined.
A joint structure of a printed wiring board, characterized in that the two overhangs in a bent state are provided with second joints joined to the side surfaces of both ends of the first board. 前記第１の基板は、リジット基板であることを特徴とする請求項１に記載のプリント配線基板の接合部構造。 The joint structure of a printed wiring board according to claim 1, wherein the first substrate is a rigid substrate. 前記第２の基板は、フレキシブル基板であることを特徴とする請求項１または請求項２に記載のプリント配線基板の接合部構造。 The joint structure of a printed wiring board according to claim 1 or 2, wherein the second substrate is a flexible substrate. 前記張り出し部は、前記第２の基板の長手方向の前記張り出し部の長さが、前記第１の基板と前記第２の基板の接続長さよりも長いことを特徴とする請求項１から請求項３のいずれか１項に記載のプリント配線基板の接合部構造。 Claims 1 to claim that the overhanging portion is characterized in that the length of the overhanging portion in the longitudinal direction of the second substrate is longer than the connection length between the first substrate and the second substrate. The joint structure of the printed wiring board according to any one of 3. 前記張り出し部は、台形または疑似台形であることを特徴とする請求項１から請求項４のいずれか１項に記載のプリント配線基板の接合部構造。 The joint structure of a printed wiring board according to any one of claims 1 to 4, wherein the overhanging portion is trapezoidal or pseudo-trapezoidal. 前記張り出し部は、前記第１の基板の側面に設けられた第３の配線パターンと前記第２の基板の張り出し部に設けられた第４の配線パターンとを介して接合されたことを特徴とする請求項１から請求項５のいずれか１項に記載のプリント配線基板の接合部構造。 The overhanging portion is characterized in that it is joined via a third wiring pattern provided on the side surface of the first substrate and a fourth wiring pattern provided on the overhanging portion of the second substrate. The joint structure of the printed wiring board according to any one of claims 1 to 5. 前記張り出し部は、前記第１の基板の側面と接合する位置にスルーホールが形成されたことを特徴とする請求項１から請求項６のいずれか１項に記載のプリント配線基板の接合部構造。 The joint structure of a printed wiring board according to any one of claims 1 to 6, wherein a through hole is formed at a position where the overhanging portion is joined to the side surface of the first substrate. ..
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Citations (3)

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JPH0590748A (en) * 1991-09-27 1993-04-09 Canon Inc Method for connecting printed circuit boards
JP2007258618A (en) * 2006-03-24 2007-10-04 Fujikura Ltd Connection part reinforcing structure, printed wiring board and connection part reinforcing structure forming method
JP2008091797A (en) * 2006-10-04 2008-04-17 Olympus Corp Jointing device of flexible substrate

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JP4554873B2 (en) * 2002-04-22 2010-09-29 日本電気株式会社 Wiring board, electronic device, electronic component mounting method and manufacturing method
JP2005032815A (en) * 2003-07-08 2005-02-03 Alps Electric Co Ltd Flexible wiring board and its manufacturing method

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Publication number Priority date Publication date Assignee Title
JPH0590748A (en) * 1991-09-27 1993-04-09 Canon Inc Method for connecting printed circuit boards
JP2007258618A (en) * 2006-03-24 2007-10-04 Fujikura Ltd Connection part reinforcing structure, printed wiring board and connection part reinforcing structure forming method
JP2008091797A (en) * 2006-10-04 2008-04-17 Olympus Corp Jointing device of flexible substrate

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