JP2021070059A - Soldering tip cleaner - Google Patents

Abstract

To provide a soldering iron cleaner that efficiently removes excess solder and the like from a soldering tip and that does not adversely affect adjacently-put electronic equipment during removal.SOLUTION: A material 5 for a soldering tip cleaner, which is made of metallic narrow belt-like pieces entangled with elasticity, a washing wire and the like, is stored in a container 1. A lower end of a horn part 6, which is extended toward the outside of the container 1 from an opening end 4 so as to form a bulkhead, is connected to an opening 3 of the container 1. Scattering of soldering particles and the like, which are scattered when a soldering tip of a soldering iron 8 to be cleaned is ejected or retracted while being rubbed against a soldering tip cleaner material, is prevented by making the horn part 6 serve as the bulkhead, and they are not scattered to the outside of the horn part 6.SELECTED DRAWING: Figure 1

Description

The present invention relates to a soldering iron tip cleaner suitable for removing stains such as protective solder and solder residue adhering to the tip of a soldering iron and preventing scattering of solder particles and the like during removal.

When soldering work is performed using a soldering iron, the solder is left attached to the soldering iron tip to prevent corrosion of the soldering iron tip during non-working. Then, dirt such as so-called protective solder and flux adhering to the tip of the trowel at the start of work is removed.

As a soldering iron cleaner for removing such protective solder and the like, there is one having the configuration shown in Patent Document 1. As a material, this soldering iron cleaner is composed of metal strips made of thin pieces of soft metal such as brass and copper, which have heat resistance and elasticity and are irregularly entwined. On the surface of this metal strip-like piece, the oxide on the surface of the molten solder is melted or peeled off by a method such as vapor deposition to increase the fluidity and improve the wettability with other metals, and the surface of the metal to be heated. A film of solder flux having an effect of preventing the metal from being oxidized is formed.

When the soldering iron tip to which the solder is attached is inserted into this soldering iron cleaner material, the soldering iron cleaner material is irregularly entangled to divide the space, so it is inserted into the divided space. The soldering iron tip is surrounded by a material for a soldering iron cleaner. In this state, the film of flux for solder formed on the surface of the metal strip-shaped piece comes into contact with the solder at the tip of the soldering iron and dissolves or peels off the oxide on the surface to improve the wettability with the surface of the metal strip-shaped piece. Not only does it prevent the metal strips that are heated in contact with the soldering iron tip from oxidizing, so the solder can be transferred from the soldering iron tip to the metal strips without damaging the surface of the soldering iron tip. Can be removed.

The removed molten solder is cooled as it travels along the wet metal strips, solidifies when the temperature drops to the solder solidification temperature, and in the middle of the irregularly entangled metal strips. Since all of the solder is retained, it is possible to prevent the solidified solder from falling downward and soiling the work surface. For this reason, not only does it take less time to process the removed solder, but also when using the material for the soldering iron tip cleaner, it is possible to omit the use of the container that houses the material for the soldering iron tip cleaner.

Patent Document 2 describes a soldering iron tip cleaner having the following configuration.
This soldering iron tip cleaner is provided with a wiping part (wiper) on the upper part of the excess solder stocker that wipes the soldering iron tip that is made of a material such as heat-resistant rubber that has heat resistance and elasticity. The wiper is further provided with a metal having solder affinity or a surplus solder trapping chip made of a heat-resistant material that has been surface-treated to have solder affinity.

When wiping off the excess solder adhering to the tip of the soldering iron, the soldering iron is operated so as to scrape off the excess solder with the excess solder capturing tip. The heat capacity of the excess solder capturing chip is set so that the temperature rises rapidly due to the heat supplied from the soldering iron tip and exceeds the melting point of the solder.

Further, the surplus solder capturing tip is made of a material having good solder affinity. Therefore, the excess solder adhering to the soldering iron tip smoothly moves to the excess solder capturing chip. The surplus solder accumulated in the surplus solder capturing chip hangs down due to its own weight in the molten state, and when the self-weight of the surplus solder exceeds the surface tension of the solder, it falls like the removed surplus solder and is dropped like a surplus solder stocker. Is accumulated in.

Since the accumulated excess solder is granular, it is extremely easy to recycle it as solder or separate and collect it as lead waste. In addition, by making the wiper circular, it is possible to maintain an almost uniform angle and tension over the entire circumference, so by changing the position of use in sequence, the wiping function can be maintained for a long period of time. Can be done.

Patent Document 3 describes a cleaning wire wound in a metal coil for removing dirt on the soldering iron tip, a wire stand for holding the cleaning wire, and a cleaning wire connected to the cleaning wire by a cleaning wire connecting wire. A soldering iron tip cleaner configured with a leak inspector is listed.

Jitsufuku No. 2-16859 Japanese Unexamined Patent Publication No. 2000-317628 Japanese Unexamined Patent Publication No. 2008-254057

According to the conventional soldering iron tip cleaner described above, the soldering iron tip is entangled in the pressing container and is housed in a metal strip shape or a metal strip shape by the force of piercing or rubbing the cleaning wire placed on the wire stand. Protective solder, solder debris, and solder flux adhering to the surface of the soldering iron tip are scattered by the restoring force when the piece or cleaning wire is deformed and pulled out or rubbed, and on the table T near the soldering iron tip cleaner. Soldering irons, solder particles, flux, etc. as shown in FIG. 5 may fall on the electronic device E, the printed substrate, or the electronic component E on which the soldering iron is mounted.

That is, in the soldering iron tip cleaner described in Patent Document 1, the removed molten solder is cooled while moving along a well-wet metal strip, and the temperature drops to the solidification temperature of the solder. Since all of the solidified and irregularly entwined metal strips are held in the middle, the solidified solder can be prevented from falling downward and soiling the work surface, and the use of soldering iron tip cleaner material. In this case, it is said that the use of a container for storing the material for the soldering iron cleaner can be omitted, but in reality, the elastic restoring force of the metal strip-shaped piece is unexpectedly large, so the protective solder for the soldering iron tip and the surplus The solder is blown off by this elastic restoring force, and the solder particles and the like scatter and fall far before the temperature drops to the solidification temperature. Therefore, it was found that even if the material for the soldering iron tip cleaner is housed in the cylindrical container drawn as the conventional drawing, the solder particles and the like are scattered outside the cylindrical container.

Further, the soldering iron tip cleaner described in Patent Document 2 is a heat-resistant rubber having heat resistance and elasticity on the upper part of a surplus solder stocker shaped like an inverted bowl so that the central portion is hollowed out and surrounded toward the central portion. Since a wiper is provided to wipe the soldering iron tip formed in a circumferential shape with a material such as, a repulsive force is generated in proportion to the pressing force when the soldering iron tip is rubbed against this elastic heat-resistant rubber. Before supplementing the excess solder with the supplementary chip, the tip of the wiper flicks the excess solder outward from the hollowed-out circumferential end, so that the solder particles and the like scatter and the excess solder is scattered as in Patent Document 1. It may fall around the stocker and adversely affect the electronic equipment to be soldered.

As with Patent Document 1 and Patent Document 2, it is clear that the cleaning wire of the soldering iron tip cleaner described in Patent Document 3 has elasticity, and the soldering iron tip is pressed against the cleaning wire to press the soldering iron tip. Due to the repulsive restoring force proportional to the pressing force when removing excess solder and dirt, the excess solder may become particles around and scatter, which may adversely affect the electronic equipment to be soldered.

With such a conventional soldering iron tip cleaner, there was a risk of shipping as a product without noticing that scattered protective solder, solder residue, and solder flux had adhered to the printed circuit board and parts, but this was not noticed and caused various failures. Even if it is, it seems that the cause has been dismissed as unknown.

However, in recent years, since the collection density between electric circuits in printed circuit boards and components has improved remarkably, in the past, sufficient space between each circuit was secured, so that solder particles of invisible size, etc., which did not cause a short circuit, etc. However, it has been found that when a printed circuit board or component is impacted or subjected to a temperature impact, it has an adverse effect as a cause of a short circuit between circuits.

Therefore, the soldering work should be performed at a place sufficiently spaced from the soldering iron tip cleaner, or an L-shaped strut should be provided between the soldering iron tip cleaner and the work place so that scattered solder particles and the like can be found in the work place. It is possible to prevent the soldering iron from reaching the limit, but every time the soldering iron tip is cleaned, it takes extra time to move the soldering iron to the location of the printed circuit board or parts, and due to the existence of the thruster, This is not preferable because it causes a new problem of poor work efficiency.

An object of the present invention is to solve the technical problems of these conventional techniques, and to efficiently remove a solder slag composed of protective solder, excess solder, solder flux, etc. from the tip of a soldering iron. At the same time as removing, a horn part is continuously provided at the opening of the container, and the horn part serves as a partition wall. The purpose is to provide a soldering iron tip cleaner that does not have a risk of adverse effects.

In the present invention, a container provided with an opening for inserting and removing the soldering iron tip, and a material for a soldering iron tip cleaner composed of metal strip-shaped pieces, cleaning wires, etc., which are housed in the container and entangled with elasticity. Provided is a soldering iron tip cleaner provided, wherein the soldering iron tip cleaner is provided with a horn portion extending from an open end of the container toward the outside of the container to form a partition wall.

Further, both the shape of the opening of the container and the shape of the opening of the horn may be circular and extend outward from the opening end of the container to form a partition wall.

Further, the shape of the opening of the container may be circular, the shape of the opening of the horn portion may be quadrangular, and a partition wall may be formed by extending outward from the opening end of the container.

Further, the horn portion may be configured to extend outward by 35 mm to 100 mm from the open end of the container to form a partition wall.

In addition, the outer dimension of the container on the open end side is smaller than the maximum outer dimension of the container, and the outer dimension of the open end of the horn is larger than the outer dimension of the lower end of the horn connected to the open end of the container. It may be configured to open toward the end.

According to the present invention, the protective solder at the tip of the soldering iron, the solder slag consisting of excess solder, solder flux, etc. are efficiently removed, and at the time of removal, the solder particles and the like are scattered around by the horn portion forming the partition wall. , There is no risk of adversely affecting the electronic devices to be soldered placed in close proximity.

Conventional soldering iron tip cleaners use metal strips or cleaning wires to remove dirt from the soldering iron tip as the soldering iron cleaner material, but these soldering iron cleaner materials have elasticity. , The tip of the soldering iron is pressed against these soldering iron cleaner materials, and the repulsive restoring force of the soldering iron cleaner material generated against the pressing force when the soldering iron is inserted causes the solder particles, etc. to scatter and solder placed in close proximity. Although there is a risk of adversely affecting the electronic device to be worked on, it is provided with a horn portion that extends from the open end of the container containing the soldering iron cleaner material according to the present invention toward the outside of the container to form a partition wall. Therefore, the solder particles and the like that are blown off by the repulsive restoring force of the soldering iron cleaner material are blocked in the traveling direction by the horn portion that forms the partition wall and do not scatter around the outside of the horn portion, and the electronic devices are close to each other. There is no risk of adverse effects even if placed.

In addition, since the horn portion that forms the partition wall is open toward the end, when returning the soldering iron tip to the soldering iron tip cleaner after the soldering work, visually position each soldering iron tip accurately and then position the soldering iron tip. There is no need to insert it into the soldering iron tip cleaner. Moreover, if you roughly put it back in the position you think it is around here, the horn part will serve as a guide for inserting the soldering iron tip, guide the soldering iron tip to the soldering iron tip cleaner material, and you can quickly clean the soldering iron tip. It also helps to reduce the time required for cleaning work.

In addition, the outer dimension on the open end side of the container is smaller than the maximum outer dimension at the center of the container base, and the outer dimension of the upper end of the horn is larger than the outer dimension of the lower end of the horn connected to the open end of the container. Since the structure is such that the opening is widened toward the end, the opening end side of the container first exists in a direction that hinders the scattering direction of the solder particles and the like that are blown off by the repulsive restoring force of the soldering iron cleaner material contained in the container, and the solder is soldered. Even if particles or the like pass through the opening, the horn portion exists as a partition wall so as to obstruct the traveling direction of the solder particles or the like, so even if the electronic device is placed close to the left or right, the solder particles or the like reach the electronic device. It does not scatter at all and there is no risk of adverse effects.

The schematic diagram which shows the use state of the soldering iron tip cleaner of this invention. The front view of the soldering iron tip cleaner which shows Example 1 of this invention. FIG. 5 is a cross-sectional view of a soldering iron tip cleaner showing Example 1 of the present invention. The perspective view of the soldering iron tip cleaner which shows Example 2 of this invention. An enlarged photograph showing the shape of solder particles scattered around when the tip of the soldering iron is rubbed with a conventional soldering iron tip cleaner for cleaning. An enlarged photograph showing the shape of solder particles and the like adhering to the partition wall in the horn portion of the soldering iron tip cleaner according to the first embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 6.
1 to 3 show a schematic view showing a usage state of the soldering iron tip cleaner of the present invention as Example 1. FIG. 2 shows a front view of the soldering iron tip cleaner, and FIG. 3 shows a cross-sectional view taken along the line AA of FIG. The container 1 has an inverted bowl shape, but may have another shape. The size of the base 2 of the container 1 is preferably 50 mm to 90 mm. It has a circular opening 3 diagonally above the container 1. The size of the upper opening end 4 of the opening 3 is preferably 45 mm to 50 mm in diameter. The diameter of the opening end 4 is smaller than the maximum external dimension of the base 2 because the diameter of the opening end 4 is narrowed as it goes above the container 1 from the maximum external dimension of the base 2. As shown in the cross-sectional view of FIG. 3, the soldering iron tip cleaner material 5 is housed in the container 1, and a part of the soldering iron tip cleaner material 5 is visible from the opening 3 of the container 1.

The lower end of the divergent conical horn portion 6 forming the partition wall is connected to the opening end 4 of the opening 3 of the container 1. The diameter of the opening 7 on the upper end side forming the partition wall of the conical horn portion 6 is preferably 50 mm to 70 mm, and the dimension from the lower end to the upper end of the horn portion 6 is 35 mm to 100 mm outward. It extends to form a partition wall. If the size of the partition wall of the horn portion is as small as 20 mm or less, the function of the partition wall of the horn portion is impaired, and solder particles or the like may pop out from the opening of the horn portion and scatter to the left and right outside the horn portion. There is. Further, if the size of the partition wall of the horn portion exceeds 100 mm, it becomes difficult for the soldering iron tip to reach the soldering iron tip cleaner material 5, and workability is significantly reduced. The desired dimension is 60 mm. The material of the horn portion 6 is preferably a metal having heat resistance such as iron, aluminum, and brass. The container 1 and the horn portion 6 may be joined by making a notch in the lower end side of the horn portion 6 and bending them alternately and pressing and holding the container 1 against the open end 4 of the container 1, or by welding, adhesive, or the like. May be joined by the means of. Alternatively, the container 1 and the horn portion 6 may be integrally formed of the same material.

As for the angle of the horn portion 6 with respect to the container 1, the angle formed by the central vertical line of the container 1 and the center line of the horn portion 6 may be inclined by about 40 to 60 degrees, and the working angle preferred by the operator is Although it is different, about 45 degrees is desirable on average. The height dimension, the diameter dimension, and the attachment angle of the partition wall of the horn portion 6 to the container 1 are selected according to the length and thickness of the soldering iron 8 used for the soldering work, and the preference of the operator.

When cleaning the soldering iron tip 9 of the soldering iron 8, first, hold the soldering iron 8 and insert the soldering iron 9 into the opening 7 of the horn portion 6, and then insert the soldering iron tip cleaner material 5 contained in the container 1 into the soldering iron tip cleaner material 5. Stick the soldering iron 9. When the tip 9 of the soldering iron 8 comes into contact with the partition wall on the lower side of the horn portion 6 when the tip 9 is inserted, the horn portion 6 serves as a guide for inserting the tip 9 and serves as a positioning role for moving the tip 9. Since it is in charge, if the soldering iron 8 is moved with a rough idea, the soldering iron tip 9 will always pierce the soldering iron tip cleaner material 5.

By rubbing the tip 9 of the soldering iron 8 against the solder tip cleaner material 5 housed in the container 1 and moving it back and forth, the tip 9 is a clean solder surface from which protective solder, solder slag, and flux are removed. It becomes. At this time, even if the soldering iron tip cleaner material 5 is deformed by the pressing force of the soldering iron 8 and the solder particles or the like are scattered due to the restoring repulsive force, the horn portion 6 exists as a partition wall in the scattering direction and scatters. Therefore, even if the electronic devices to be soldered are placed close to each other on the outside of the horn portion 6 so as to be adjacent to each other, the scattered solder particles and the like do not fly down on the electronic devices at all.

As a second embodiment of the present invention, as shown in FIG. 4, the shape of the opening 10 of the container 1 of the soldering iron tip cleaner is circular. The size of the opening 10 is 45 mm to 50 mm in diameter as in the first embodiment, but the horn portion 12 connected to the opening end 11 of the container 1 has a quadrangular shape of the opening 13. The vertical dimension is 50 mm to 70 mm, and the horizontal dimension is 50 mm to 70 mm.

In the second embodiment, when cleaning the tip 9 of the soldering iron 8, as in the case of the first embodiment, first, the soldering iron 8 is held and the tip 9 is inserted into the opening 13 of the horn portion 12 having a quadrangular pyramid shape. , The soldering iron tip 9 is pierced into the soldering iron tip cleaner material 5 housed in the container 1. If the tip 9 of the soldering iron 8 comes into contact with the partition wall of the horn portion 12 when the tip 9 is inserted, the horn portion 12 serves as a guide for inserting the tip 9 and serves as a positioning role for moving the tip 9. Therefore, if the soldering iron 8 is moved with a rough idea, the soldering iron tip 9 will always pierce the soldering iron tip cleaner material 5. In the case of the horn portion 12 having a quadrangular pyramid shape, the lower side of the opening 13 of the horn portion 12 is flat, so that the tip 9 of the soldering iron 8 can be easily moved to the left or right.

When the soldering iron tip is cleaned with a conventional soldering iron tip cleaner as shown in Patent Document 1, the shapes of the scattered solder particles and the like are various, and the scattered solder particles and the like are enlarged photographs (1) of the solder particles and the like shown in FIG. It was found that solder particles having various shapes of 0.05 mm or less, which are invisible to the naked eye, are scattered when the scale is as large as 1 mm) and 1 mm to 3 mm.

When the soldering iron tip is cleaned using the soldering iron tip cleaner according to the present invention, the horn portion acts as a partition even if the electronic devices to be soldered are placed on the left and right sides of the container 1 of the soldering iron tip cleaner. Therefore, there is no risk of scattered solder falling onto the electronic device. When the inside of the partition wall of the horn portion after cleaning the soldering iron tip is examined, this anti-scattering effect can be obtained in various shapes (large) as shown in the enlarged photograph (minimum 1 scale 1 mm) of solder particles and the like in FIG. Scattered solder particles of 1 mm to 2 mm and 0.1 mm to 0.05 mm of small particles were concentrated and adhered to 30 mm or less from the opening end of the opening of the container 1 on the inner side wall. It was proved that solder particles and the like did not scatter on the left and right outside the horn portion having a partition wall length of 35 mm or more.

1: Container 2: Base 3: Opening 4: Opening end 5: Soldering iron tip cleaner material, 6: Horn part, 7: Opening, 8: Soldering iron, 9: Soldering iron tip, 10: Opening Part, 11: Open end, 12: Horn part, 13: Opening, 14: Open end

The present invention relates to a soldering iron tip cleaner suitable for removing stains such as protective solder and solder residue adhering to the tip of a soldering iron and preventing scattering of solder particles and the like during removal.

When soldering work is performed using a soldering iron, the solder is left attached to the soldering iron tip to prevent corrosion of the soldering iron tip during non-working. Then, dirt such as so-called protective solder and flux adhering to the tip of the trowel at the start of work is removed.

As a soldering iron cleaner for removing such protective solder and the like, there is one having the configuration shown in Patent Document 1. As a material, this soldering iron cleaner is composed of metal strips made of thin pieces of soft metal such as brass and copper, which have heat resistance and elasticity and are irregularly entwined. On the surface of this metal strip-like piece, the oxide on the surface of the molten solder is melted or peeled off by a method such as vapor deposition to increase the fluidity and improve the wettability with other metals, and the surface of the metal to be heated. A film of solder flux having an effect of preventing the metal from being oxidized is formed.

When the soldering iron tip to which the solder is attached is inserted into this soldering iron cleaner material, the soldering iron cleaner material is irregularly entangled to divide the space, so it is inserted into the divided space. The soldering iron tip is surrounded by a material for a soldering iron cleaner. In this state, the film of flux for solder formed on the surface of the metal strip-shaped piece comes into contact with the solder at the tip of the soldering iron and dissolves or peels off the oxide on the surface to improve the wettability with the surface of the metal strip-shaped piece. Not only does it prevent the metal strips that are heated in contact with the soldering iron tip from oxidizing, so the solder can be transferred from the soldering iron tip to the metal strips without damaging the surface of the soldering iron tip. Can be removed.

The removed molten solder is cooled as it travels along the wet metal strips, solidifies when the temperature drops to the solder solidification temperature, and in the middle of the irregularly entangled metal strips. Since all of the solder is retained, it is possible to prevent the solidified solder from falling downward and soiling the work surface. For this reason, not only does it take less time to process the removed solder, but also when using the material for the soldering iron tip cleaner, it is possible to omit the use of the container that houses the material for the soldering iron tip cleaner.

Patent Document 2 describes a soldering iron tip cleaner having the following configuration. This soldering iron tip cleaner is provided with a wiping part (wiper) on the upper part of the excess solder stocker that wipes the soldering iron tip that is made of a material such as heat-resistant rubber that has heat resistance and elasticity. The wiper is further provided with a metal having solder affinity or a surplus solder trapping chip made of a heat-resistant material that has been surface-treated to have solder affinity.

When wiping off the excess solder adhering to the tip of the soldering iron, the soldering iron is operated so as to scrape off the excess solder with the excess solder capturing tip. The heat capacity of the excess solder capturing chip is set so that the temperature rises rapidly due to the heat supplied from the soldering iron tip and exceeds the melting point of the solder.

Further, the surplus solder capturing tip is made of a material having good solder affinity. Therefore, the excess solder adhering to the soldering iron tip smoothly moves to the excess solder capturing chip. The surplus solder accumulated in the surplus solder capturing chip hangs down due to its own weight in the molten state, and when the self-weight of the surplus solder exceeds the surface tension of the solder, it falls like the removed surplus solder and is dropped like a surplus solder stocker. Is accumulated in.

Since the accumulated excess solder is granular, it is extremely easy to recycle it as solder or separate and collect it as lead waste. In addition, by making the wiper circular, it is possible to maintain an almost uniform angle and tension over the entire circumference, so by changing the position of use in sequence, the wiping function can be maintained for a long period of time. Can be done.

Patent Document 3 describes a cleaning wire wound in a metal coil for removing dirt on the soldering iron tip, a wire stand for holding the cleaning wire, and a cleaning wire connected to the cleaning wire by a cleaning wire connecting wire. A soldering iron tip cleaner configured with a leak inspector is listed.

Jitsufuku No. 2-16859 Japanese Unexamined Patent Publication No. 2000-317628 Japanese Unexamined Patent Publication No. 2008-254057

According to the conventional soldering iron tip cleaner described above, the soldering iron tip is entangled in the pressing container and is housed in a metal strip shape or a metal strip shape by the force of piercing or rubbing the cleaning wire placed on the wire stand. Protective solder, solder debris, and solder flux adhering to the surface of the soldering iron tip are scattered by the restoring force when the piece or cleaning wire is deformed and pulled out or rubbed, and on the table T near the soldering iron tip cleaner. Soldering irons, solder particles, flux, etc. as shown in FIG. 5 may fall on the electronic device E, the printed substrate, or the electronic component E on which the soldering iron is mounted.

That is, in the soldering iron tip cleaner described in Patent Document 1, the removed molten solder is cooled while moving along a well-wet metal strip, and the temperature drops to the solidification temperature of the solder. Since all of the solidified and irregularly entwined metal strips are held in the middle, the solidified solder can be prevented from falling downward and soiling the work surface, and the use of soldering iron tip cleaner material. In this case, it is said that the use of a container for storing the material for the soldering iron cleaner can be omitted, but in reality, the elastic restoring force of the metal strip-shaped piece is unexpectedly large, so the protective solder for the soldering iron tip and the surplus The solder is blown off by this elastic restoring force, and the solder particles and the like scatter and fall far before the temperature drops to the solidification temperature. Therefore, it was found that even if the material for the soldering iron tip cleaner is housed in the cylindrical container drawn as the conventional drawing, the solder particles and the like are scattered outside the cylindrical container.

Further, the soldering iron tip cleaner described in Patent Document 2 is a heat-resistant rubber having heat resistance and elasticity on the upper part of a surplus solder stocker shaped like an inverted bowl so that the central portion is hollowed out and surrounded toward the central portion. Since a wiper is provided to wipe the soldering iron tip formed in a circumferential shape with a material such as, a repulsive force is generated in proportion to the pressing force when the soldering iron tip is rubbed against this elastic heat-resistant rubber. Before supplementing the excess solder with the supplementary chip, the tip of the wiper flicks the excess solder outward from the hollowed-out circumferential end, so that the solder particles and the like scatter and the excess solder is scattered as in Patent Document 1. It may fall around the stocker and adversely affect the electronic equipment to be soldered.

As with Patent Document 1 and Patent Document 2, it is clear that the cleaning wire of the soldering iron tip cleaner described in Patent Document 3 has elasticity, and the soldering iron tip is pressed against the cleaning wire to press the soldering iron tip. Due to the repulsive restoring force proportional to the pressing force when removing excess solder and dirt, the excess solder may become particles around and scatter, which may adversely affect the electronic equipment to be soldered.

With such a conventional soldering iron tip cleaner, there was a risk of shipping as a product without noticing that scattered protective solder, solder residue, and solder flux had adhered to the printed circuit board and parts, but this was not noticed and caused various failures. Even if it is, it seems that the cause has been dismissed as unknown.

However, in recent years, since the collection density between electric circuits in printed circuit boards and components has improved remarkably, in the past, sufficient space between each circuit was secured, so that solder particles of invisible size, etc., which did not cause a short circuit, etc. However, it has been found that when a printed circuit board or component is impacted or subjected to a temperature impact, it has an adverse effect as a cause of a short circuit between circuits.

Therefore, the soldering work should be performed at a place sufficiently spaced from the soldering iron tip cleaner, or an L-shaped strut should be provided between the soldering iron tip cleaner and the work place so that scattered solder particles and the like can be found in the work place. It is possible to prevent the soldering iron from reaching the limit, but every time the soldering iron tip is cleaned, it takes extra time to move the soldering iron to the location of the printed circuit board or parts, and due to the existence of the thruster, This is not preferable because it causes a new problem of poor work efficiency.

An object of the present invention is to solve the technical problems of these conventional techniques, and to efficiently remove a solder slag composed of protective solder, excess solder, solder flux, etc. from the tip of a soldering iron. At the same time as removing, a horn part is continuously provided at the opening of the container, and the horn part serves as a partition wall. The purpose is to provide a soldering iron tip cleaner that does not have a risk of adverse effects.

The present invention comprises a container (1) provided with openings (3, 10) for inserting and removing the soldering iron tip, a metal strip-shaped piece housed in the container and entangled with elasticity, a cleaning wire, and the like. In the soldering iron tip cleaner provided with the soldering iron tip cleaner material (5), the outer diameter of the container is 50 mm to 90 mm, and the opening ends (4, 11) of the opening provided diagonally above the container. The inner diameter of the solder powder is 45 mm to 50 mm in diameter, and has an open end extending outward from the opening end of the container opening toward the outside of the container by 35 mm to 100 mm outward from the opening end of the solder powder. A horn portion (6, 12) that forms a partition wall that prevents scattering to the outside is provided, and the soldering iron tip is taken in and out of the horn portion, and the material for the soldering iron tip cleaner and the soldering iron contained in the container are provided. The contact state with the tip is made visible from the outside of the horn portion .

Further, both the shape of the opening of the container and the shape of the opening of the horn may be circular and extend outward from the opening end of the container to form a partition wall.

Further, the shape of the opening of the container may be circular, the shape of the opening of the horn portion may be quadrangular, and a partition wall may be formed by extending outward from the opening end of the container.

Further, the horn portion may be configured to extend outward by 35 mm to 100 mm from the open end of the container to form a partition wall.

In addition, the outer dimension of the container on the open end side is smaller than the maximum outer dimension of the container, and the outer dimension of the open end of the horn is larger than the outer dimension of the lower end of the horn connected to the open end of the container. It may be configured to open toward the end.

According to the present invention, the protective solder at the tip of the soldering iron, the solder slag consisting of excess solder, solder flux, etc. are efficiently removed, and at the time of removal, the solder particles and the like are scattered around by the horn portion forming the partition wall. , There is no risk of adversely affecting the electronic devices to be soldered placed in close proximity.

Conventional soldering iron tip cleaners use metal strips or cleaning wires to remove dirt from the soldering iron tip as the soldering iron cleaner material, but these soldering iron cleaner materials have elasticity. , The tip of the soldering iron is pressed against these soldering iron cleaner materials, and the repulsive restoring force of the soldering iron cleaner material generated against the pressing force when the soldering iron is inserted causes the solder particles, etc. to scatter and solder placed in close proximity. Although there is a risk of adversely affecting the electronic device to be worked on, it is provided with a horn portion that extends from the open end of the container containing the soldering iron cleaner material according to the present invention toward the outside of the container to form a partition wall. Therefore, the solder particles and the like that are blown off by the repulsive restoring force of the soldering iron cleaner material are blocked in the traveling direction by the horn portion that forms the partition wall and do not scatter around the outside of the horn portion, and the electronic devices are close to each other. There is no risk of adverse effects even if placed.

In addition, since the horn portion that forms the partition wall is open toward the end, when returning the soldering iron tip to the soldering iron tip cleaner after the soldering work, visually position each soldering iron tip accurately and then position the soldering iron tip. There is no need to insert it into the soldering iron tip cleaner. Moreover, if you roughly put it back in the position you think it is around here, the horn part will serve as a guide for inserting the soldering iron tip, guide the soldering iron tip to the soldering iron tip cleaner material, and you can quickly clean the soldering iron tip. It also helps to reduce the time required for cleaning work.

In addition, the outer dimension on the open end side of the container is smaller than the maximum outer dimension at the center of the container base, and the outer dimension of the upper end of the horn is larger than the outer dimension of the lower end of the horn connected to the open end of the container. Since the structure is such that the opening is widened toward the end, the opening end side of the container first exists in a direction that hinders the scattering direction of the solder particles and the like that are blown off by the repulsive restoring force of the soldering iron cleaner material contained in the container, and the solder is soldered. Even if particles or the like pass through the opening, the horn portion exists as a partition wall so as to obstruct the traveling direction of the solder particles or the like, so even if the electronic device is placed close to the left or right, the solder particles or the like reach the electronic device. It does not scatter at all and there is no risk of adverse effects.

The schematic diagram which shows the use state of the soldering iron tip cleaner of this invention. The front view of the soldering iron tip cleaner which shows Example 1 of this invention. FIG. 5 is a cross-sectional view of a soldering iron tip cleaner showing Example 1 of the present invention. The perspective view of the soldering iron tip cleaner which shows Example 2 of this invention. An enlarged photograph showing the shape of solder particles scattered around when the tip of the soldering iron is rubbed with a conventional soldering iron tip cleaner for cleaning. An enlarged photograph showing the shape of solder particles and the like adhering to the partition wall in the horn portion of the soldering iron tip cleaner according to the first embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 6.
1 to 3 show a schematic view showing a usage state of the soldering iron tip cleaner of the present invention as Example 1. FIG. 2 shows a front view of the soldering iron tip cleaner, and FIG. 3 shows a cross-sectional view taken along the line AA of FIG. The container 1 has an inverted bowl shape, but may have another shape. The size of the base 2 of the container 1 is preferably 50 mm to 90 mm. It has a circular opening 3 diagonally above the container 1. The size of the upper opening end 4 of the opening 3 is preferably 45 mm to 50 mm in diameter. The diameter of the opening end 4 is smaller than the maximum external dimension of the base 2 because the diameter of the opening end 4 is narrowed as it goes above the container 1 from the maximum external dimension of the base 2. As shown in the cross-sectional view of FIG. 3, the soldering iron tip cleaner material 5 is housed in the container 1, and a part of the soldering iron tip cleaner material 5 is visible from the opening 3 of the container 1.

The lower end of the divergent conical horn portion 6 forming the partition wall is connected to the opening end 4 of the opening 3 of the container 1. The diameter of the opening 7 on the upper end side forming the partition wall of the conical horn portion 6 is preferably 50 mm to 70 mm, and the dimension from the lower end to the upper end of the horn portion 6 is 35 mm to 100 mm outward. It extends to form a partition wall. If the size of the partition wall of the horn portion is as small as 20 mm or less, the function of the partition wall of the horn portion is impaired, and solder particles or the like may pop out from the opening of the horn portion and scatter to the left and right outside the horn portion. There is. Further, if the size of the partition wall of the horn portion exceeds 100 mm, it becomes difficult for the soldering iron tip to reach the soldering iron tip cleaner material 5, and workability is significantly reduced. The desired dimension is 60 mm. The material of the horn portion 6 is preferably a metal having heat resistance such as iron, aluminum, and brass. The container 1 and the horn portion 6 may be joined by making a notch in the lower end side of the horn portion 6 and bending them alternately and pressing and holding the container 1 against the open end 4 of the container 1, or by welding, adhesive, or the like. May be joined by the means of. Alternatively, the container 1 and the horn portion 6 may be integrally formed of the same material.

As for the angle of the horn portion 6 with respect to the container 1, the angle formed by the central vertical line of the container 1 and the center line of the horn portion 6 may be inclined by about 40 to 60 degrees, and the working angle preferred by the operator is Although it is different, about 45 degrees is desirable on average. The height dimension, the diameter dimension, and the attachment angle of the partition wall of the horn portion 6 to the container 1 are selected according to the length and thickness of the soldering iron 8 used for the soldering work, and the preference of the operator.

When cleaning the soldering iron tip 9 of the soldering iron 8, first, hold the soldering iron 8 and insert the soldering iron 9 into the opening 7 of the horn portion 6, and then insert the soldering iron tip cleaner material 5 contained in the container 1 into the soldering iron tip cleaner material 5. Stick the soldering iron 9. When the tip 9 of the soldering iron 8 comes into contact with the partition wall on the lower side of the horn portion 6 when the tip 9 is inserted, the horn portion 6 serves as a guide for inserting the tip 9 and serves as a positioning role for moving the tip 9. Since it is in charge, if the soldering iron 8 is moved with a rough idea, the soldering iron tip 9 will always pierce the soldering iron tip cleaner material 5.

By rubbing the tip 9 of the soldering iron 8 against the solder tip cleaner material 5 housed in the container 1 and moving it back and forth, the tip 9 is a clean solder surface from which protective solder, solder slag, and flux are removed. It becomes. At this time, even if the soldering iron tip cleaner material 5 is deformed by the pressing force of the soldering iron 8 and the solder particles or the like are scattered due to the restoring repulsive force, the horn portion 6 exists as a partition wall in the scattering direction and scatters. Therefore, even if the electronic devices to be soldered are placed close to each other on the outside of the horn portion 6 so as to be adjacent to each other, the scattered solder particles and the like do not fly down on the electronic devices at all.

As a second embodiment of the present invention, as shown in FIG. 4, the shape of the opening 10 of the container 1 of the soldering iron tip cleaner is circular. The size of the opening 10 is 45 mm to 50 mm in diameter as in the first embodiment, but the horn portion 12 connected to the opening end 11 of the container 1 has a quadrangular shape of the opening 13. The vertical dimension is 50 mm to 70 mm, and the horizontal dimension is 50 mm to 70 mm.

In the second embodiment, when cleaning the tip 9 of the soldering iron 8, as in the case of the first embodiment, first, the soldering iron 8 is held and the tip 9 is inserted into the opening 13 of the horn portion 12 having a quadrangular pyramid shape. , The soldering iron tip 9 is pierced into the soldering iron tip cleaner material 5 housed in the container 1. If the tip 9 of the soldering iron 8 comes into contact with the partition wall of the horn portion 12 when the tip 9 is inserted, the horn portion 12 serves as a guide for inserting the tip 9 and serves as a positioning role for moving the tip 9. Therefore, if the soldering iron 8 is moved with a rough idea, the soldering iron tip 9 will always pierce the soldering iron tip cleaner material 5. In the case of the horn portion 12 having a quadrangular pyramid shape, the lower side of the opening 13 of the horn portion 12 is flat, so that the tip 9 of the soldering iron 8 can be easily moved to the left or right.

When the soldering iron tip is cleaned with a conventional soldering iron tip cleaner as shown in Patent Document 1, the shapes of the scattered solder particles and the like are various, and the scattered solder particles and the like are enlarged photographs (1) of the solder particles and the like shown in FIG. It was found that solder particles having various shapes of 0.05 mm or less, which are invisible to the naked eye, are scattered when the scale is as large as 1 mm) and 1 mm to 3 mm.

When the soldering iron tip is cleaned using the soldering iron tip cleaner according to the present invention, the horn portion acts as a partition even if the electronic devices to be soldered are placed on the left and right sides of the container 1 of the soldering iron tip cleaner. Therefore, there is no risk of scattered solder falling onto the electronic device. When the inside of the partition wall of the horn portion after cleaning the soldering iron tip is examined, this anti-scattering effect can be obtained in various shapes (large) as shown in the enlarged photograph (minimum 1 scale 1 mm) of solder particles and the like in FIG. Scattered solder particles of 1 mm to 2 mm and 0.1 mm to 0.05 mm of small particles were concentrated and adhered to 30 mm or less from the opening end of the opening of the container 1 on the inner side wall. It was proved that solder particles and the like did not scatter on the left and right outside the horn portion having a partition wall length of 35 mm or more.

1: Container 2: Base 3: Opening 4: Opening end 5: Soldering iron tip cleaner material, 6: Horn part, 7: Opening, 8: Soldering iron, 9: Soldering iron tip, 10: Opening Part, 11: Open end, 12: Horn part, 13: Opening, 14: Open end

Claims (5)

A container (1) provided with openings (3, 10) for inserting and removing the soldering iron tip, and a soldering iron tip cleaner consisting of metal strips and cleaning wires housed in this container and entwined with elasticity. In a soldering iron tip cleaner provided with a material (5), a horn portion (6, 12) extending from the opening end (4, 11) of the container opening toward the outside of the container to form a partition wall is provided. A soldering iron tip cleaner that features this. The shape of the opening (3) of the container is circular, and the shape of the opening (7) of the horn portion (6) is also circular, extending outward from the opening end of the container to form a partition wall. The soldering iron tip cleaner according to claim 1, wherein the soldering iron tip cleaner is provided. The shape of the opening (10) of the container is circular, the shape of the opening (13) of the horn portion (12) is quadrangular, and the partition wall extends outward from the opening end of the container. The soldering iron tip cleaner according to claim 1, wherein the soldering iron tip cleaner is formed. The soldering iron tip cleaner according to claim 1 or 2, wherein the horn portions (6, 12) extend outward by 35 mm to 100 mm from the open end of the container to form a partition wall. .. The outer dimension of the container on the open end side is smaller than the maximum outer dimension of the container, and the outer dimension of the horn portion on the open end side is larger than the outer dimension of the lower end of the horn portion connected to the open end of the container. The soldering iron tip cleaner according to any one of claims 1 to 4, wherein the soldering iron tip cleaner has an open end.

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