JP2021057499A - Photoelectric conversion module - Google Patents

Abstract

To provide a photoelectric conversion module having a structure with higher fire resistance.SOLUTION: A photoelectric conversion module includes a photoelectric conversion element 10, a first substrate 600 provided on the first surface side of the photoelectric conversion element 10, and a protective material 900 that is provided on the second surface side opposite to the first substrate 600 with respect to the photoelectric conversion element 10, and covers the photoelectric conversion element 10. In the plane along the surface of the first substrate 600, the size of the first substrate 600 is larger than the size of the photoelectric conversion element 10. The edge of a protective material 900 is located inside the edge of the first substrate 600 in a direction along the surface of the first substrate 600.SELECTED DRAWING: Figure 2

Description

The present invention relates to a photoelectric conversion module.

A photoelectric conversion module provided with a photoelectric conversion panel, such as a solar cell module, is known (Patent Document 1 below). In Patent Document 1, the photoelectric conversion panel has a first substrate, a photoelectric conversion layer provided on the first substrate, and a second substrate covering the photoelectric conversion layer. The first substrate is a portion serving as a substrate for forming a photoelectric conversion layer. The second substrate is a transparent substrate such as glass.

Further, a surface sealing material for sealing the light receiving surface side of the photoelectric conversion layer is provided, and the second substrate is laminated on the surface sealing material. A back surface sealing material, which is an insulating member, is provided on the back surface side (non-light receiving surface side) of the first substrate. Further, the back sheet, which is a back surface protective material, covers the back surface side (the side opposite to the first substrate) of the back surface encapsulant.

JP-A-2018-98466

It is desired to improve the fire resistance of the photoelectric conversion module. For example, there is a safety standard regarding fire resistance in a solar cell module, and as an example of a fire test (propagation test), there is a test in which a flame is applied to the surface (light receiving surface) of the solar cell module to confirm whether or not the fire spreads. In such a fire test, the inventor of the present application has found that the flame applied to the front surface side of the photoelectric conversion module may affect the configuration of the back surface side of the photoelectric conversion module.

Against this background, a photoelectric conversion module having a structure with higher fire resistance is desired.

The photoelectric conversion module according to one aspect is provided on the photoelectric conversion element, the first substrate provided on the first surface side of the photoelectric conversion element, and the second surface side of the photoelectric conversion element opposite to the first substrate. It has a protective material that covers the photoelectric conversion element. In the plane along the surface of the first substrate, the size of the first substrate is larger than the size of the photoelectric conversion element. In the direction along the surface of the first substrate, the edge of the protective material is located inside the edge of the first substrate.

According to the above aspect, it is possible to provide a photoelectric conversion module having a structure having higher fire resistance.

It is a top view of the photoelectric conversion module which concerns on 1st Embodiment. It is a schematic cross-sectional view of the photoelectric conversion module along the line 2A-2A of FIG. It is an enlarged cross-sectional view around the region 3A of FIG. It is sectional drawing of the photoelectric conversion module which concerns on 2nd Embodiment.

Hereinafter, embodiments will be described with reference to the drawings. In the drawings below, the same or similar parts are designated by the same or similar reference numerals. However, it should be noted that the drawings are schematic and the ratio of each dimension may differ from the actual one.

(First Embodiment)
FIG. 1 is a plan view of the photoelectric conversion module according to the first embodiment. FIG. 2 is a schematic cross-sectional view of the photoelectric conversion module along the line 2A-2A of FIG. FIG. 3 is an enlarged cross-sectional view of the vicinity of the region 3A of FIG.

The photoelectric conversion module 1 may be a solar cell module that converts light energy into electrical energy. Instead, the photoelectric conversion module 1 may be a module that converts electrical energy into light energy. The photoelectric conversion module 1 may be, for example, an integrated photoelectric conversion module.

The photoelectric conversion module 1 may include a photoelectric conversion panel 100 including a photoelectric conversion element 10 and a frame 200 attached to the edge of the photoelectric conversion panel 100.

The photoelectric conversion panel 100 includes a photoelectric conversion element 10, a first substrate 600 provided on the first surface side (front surface side) of the photoelectric conversion element 10, and a photoelectric conversion element 10 on the opposite side (back surface side) of the first substrate 600. It has a sheet-shaped protective material 900 provided on the side).

Here, the "surface side" corresponds to the side where light is incident on the photoelectric conversion element 10 or the side where light is emitted from the photoelectric conversion element 10. Further, the "back surface side" corresponds to the surface opposite to the front surface side. For example, when the photoelectric conversion module 1 is a solar cell module, the "front surface side" corresponds to the light receiving surface side on which light is incident, and the "back surface side" corresponds to the non-light receiving surface side.

The first substrate 600 may be exposed on the surface side. The first substrate 600 may be a transparent or translucent substrate such as a resin substrate or a glass substrate. In the plane along the surface of the first substrate 600, the size of the first substrate 600 is larger than the size of the photoelectric conversion element 10 described later, more specifically, the size of the second substrate 20.

The photoelectric conversion panel 100 may have a first sealing layer 400 between the first substrate 600 and the photoelectric conversion element 10. The first sealing layer 400 may cover at least the surface side of the photoelectric conversion element 10.

The first sealing layer 400 may be composed of a transparent or translucent insulator. For example, the first sealing layer 400 may be formed of a synthetic resin. As such a synthetic resin, for example, EVA resin (ethylene / vinyl acetate copolymer resin), olefin resin, PVB (polyvinyl butyral) resin, ionomer resin or silicone resin, or a combination thereof can be used.

The photoelectric conversion element 10 may be provided in a layer on the second substrate 20. The photoelectric conversion element 10 may be formed over substantially the entire area of the second substrate 20. The second substrate 20 is a portion that serves as a substrate that forms the photoelectric conversion element 10. The second substrate 20 may be composed of, for example, a resin substrate, a glass substrate, or a metal substrate. An insulating layer (not shown) may be formed on the surface of the second substrate 20 on the photoelectric conversion element 10 side.

The photoelectric conversion panel 100 may have a second sealing layer 800 between the second substrate 20 and the protective material 900. The second sealing layer 800 may be formed of an insulator such as a synthetic resin. As such a synthetic resin, for example, EVA resin (ethylene / vinyl acetate copolymer resin), olefin resin, PVB (polyvinyl butyral) resin, ionomer resin or silicone resin, or a combination thereof can be used. The thickness of the second sealing layer 800 may be the same as or different from the thickness of the first sealing layer 400.

The protective material 900 may cover the photoelectric conversion element 10 and the second substrate 20 on the back surface side of the photoelectric conversion module 1. The size of the protective material 900 may be larger than the size of the second substrate 20 in the plane along the surface of the second substrate 20. The edge of the protective material 900 may extend to or near the back surface of the first substrate 600 at the side portion of the photoelectric conversion element 10.

At least a part of the protective material 900 may be exposed on the back surface side of the photoelectric conversion module 1. That is, at least a part of the protective material 900 may be located on the backmost side of the photoelectric conversion module 1.

The protective material 900 may contain at least a resin. The protective material 900 may be, for example, a laminated sheet in which a resin base material and an adhesive are laminated on each other. The protective material 900 may be composed of, for example, a PET resin, a PVF (polyvinyl fluoride) resin, a PVDF (polyvinylidene fluoride) resin, a nylon resin or a polyamide resin, or a combination thereof. When the second encapsulant 900 has a plurality of layers of base material, the base material of each layer may be made of the same material or may be made of different materials.

The photoelectric conversion module 1 may have a sealing material 500 on the side portion of the photoelectric conversion element 10. The sealing material 500 surrounds the peripheral edges of the photoelectric conversion element 10 and the second substrate 20, and may be attached to the back surface side of the first substrate 600. The sealing material 500 is inclined so as to gently connect one surface on the back surface side of the second sealing material 800 and one surface on the back surface side of the first substrate 600 in a cross section on a surface orthogonal to the front surface of the photoelectric conversion panel 100. It may be (Fig. 2). In this case, the protective material 900 can gently extend from the back surface side of the second sealing material 800 to the back surface side of the first substrate 600.

The sealing material 500 is preferably made of a material having higher moisture resistance than the material constituting the protective material 900. Examples of the material of such a sealing material 500 include polyisobutylene (PIB), butyl rubber or synthetic rubber, or a combination thereof. As a result, the intrusion of moisture from the side portion of the photoelectric conversion element 10 can be prevented, and deterioration of the photoelectric conversion element 10 can be suppressed.

The sealing material 500 may have a light-shielding property. The material of the sealing material 500 may be composed of, for example, polyisobutylene (PIB), butyl rubber or synthetic rubber, or a material containing a combination thereof. Further, the sealing material 500 may be made of black butyl rubber or the like containing carbon black.

At least a part of the region of the protective material 900 in which the photoelectric conversion module 1 protrudes from the photoelectric conversion element 10 may cover the sealing material 500. In other words, when viewed from the surface side of the photoelectric conversion module 1, the sealing material 500 may cover at least a part, preferably the entire region of the protective material 900 that protrudes from the photoelectric conversion element 10. When the sealing material 500 has a light-shielding property, the sealing material 500 suppresses the light incident from the first substrate 600 side from irradiating the protective material 900. As a result, even if the protective material 900 extends beyond the photoelectric conversion element 10, deterioration of the protective material 900 due to irradiation with ultraviolet rays can be suppressed.

In the present embodiment, the edge of the protective material 900 is located inside the edge of the first substrate 600. Here, in the flame test, when a flame is blown to the front surface side of the photoelectric conversion panel 100 to which the frame 200 is not attached, a part of the flame wraps around from the edge of the first substrate 600 to the back side, and the back side of the photoelectric conversion panel 100. May affect the vicinity of the edge of the. In the present embodiment, since the edge of the protective material 900 having a relatively weak resistance to fire is located inside the edge of the first substrate 600, the protective material 900 wraps around the back surface side of the photoelectric conversion panel 100. Less susceptible to flames. Therefore, it is possible to provide a structure having higher fire resistance as the structure on the back surface side of the photoelectric conversion module 1.

Further, the protective material 900 preferably has at least a non-conductive material. Specifically, the protective material 900 is preferably made of a resin sheet that does not contain a metal material. This makes it possible to prevent an electric discharge that may occur when the protective material 900 and the frame 200 are in close proximity to each other. Further, since the protective material 900 does not contain a metal material, the weight of the photoelectric conversion module 1 can be reduced.

The frame 200 is provided along the edge of the photoelectric conversion panel 100. The frame 200 may be arranged so as to substantially surround the edge of the photoelectric conversion panel 100. Each frame 200 may extend along the edge of the photoelectric conversion panel 100.

The frame 200 may have a receiving portion 210 formed by a substantially C-shaped wall portion in a cross section orthogonal to the extending direction (horizontal direction) of the frame 200. The edge of the photoelectric conversion panel 100 in the direction along the surface of the first substrate 600, specifically, the edge of the first substrate 600 is inserted into the receiving portion 210 formed by the substantially C-shaped wall portion. There is.

The photoelectric conversion module 1 may have the adhesive 250 at least in the receiving portion 210 of the frame 200. Specifically, the adhesive 250 may be provided on the back surface side of the photoelectric conversion panel 100 and between the photoelectric conversion panel 100 and the wall portion constituting the frame 200. The frame 200 is fixed to the photoelectric conversion panel 100 by the adhesive 250. Specifically, at least a part of the adhesive 250 may be in contact with at least both the photoelectric conversion panel 100 and the frame 200 in the receiving portion 210. As described above, the adhesive material 250 can both prevent the edge of the protective material 900 from curling up and adhere the frame 200 to the photoelectric conversion panel 100. The adhesive 250 is not particularly limited, but may be, for example, a silicone adhesive.

The adhesive material 250 is preferably provided on the back surface side of the first substrate 600 so as to straddle the edge of the protective material 900. That is, the adhesive 250 may be provided from the protective material 900 to the back surface side of the first substrate 600. As a result, it is possible to prevent the edge of the protective material 900 from being rolled up. In particular, the edge of the protective material 900 due to aged deterioration can be suppressed from curling. Further, in the manufacture of the photoelectric conversion module 1, the yield of the photoelectric conversion module 1 is increased by preventing the edge of the protective material 900 from curling up from the formation of the protective material 900 to the application of the adhesive material 250 or the curing of the adhesive material 250. It can also be improved. In this embodiment, since the edge of the protective material 900 is located inside the edge of the first substrate 600, the adhesive 250 can be provided across the edge of the protective material 900.

From the viewpoint of fire resistance and / or prevention of curling of the edge of the protective material 900, the distance L1 from the edge of the first substrate 600 to the edge of the protective material 900 is preferably 1.0 mm or more, more preferably 1.0 mm or more. It is 2.0 mm or more.

Further, the region of the protective material 900 exposed from the adhesive 250 is preferably located outside the receiving portion 210 of the frame 200. That is, it is preferable that a gap G exists between the portion of the protective material 900 exposed from the adhesive 250 and the receiving portion 210 of the frame 200. Even when the above-mentioned flame test is performed with the frame 200 attached, the protective material 900 is less susceptible to the flame wrapping around the back surface side of the photoelectric conversion module 1 due to the gap G. Therefore, as the structure on the back surface side of the photoelectric conversion module 1, a structure having higher fire resistance can be provided.

The photoelectric conversion module 1 may have a repeater (junction box) 700 on the back surface side of the protective material 900. The repeater 700 may be electrically connected to a pair of wires 50 routed from the photoelectric conversion element 10. Specifically, the pair of wirings 50 extend from the photoelectric conversion element 10 between the second substrate 20 and the second sealing layer 800, penetrate the second sealing layer 800 and the protective material 900, and relay. It may be connected to the container 700.

Hereinafter, the configuration of the photoelectric conversion element 10 provided on the photoelectric conversion panel 100 will be described in detail with reference to FIG. FIG. 3 shows a detailed cross section in which the vicinity of the region 3A of FIG. 2 is enlarged. It should be noted that FIG. 3 shows a region between the first substrate 600 and the second sealing layer 800 in the thickness direction of the photoelectric conversion element 10.

The photoelectric conversion element 10 may include a plurality of photoelectric conversion cells 12 integrated on the surface side of the second substrate 20. Each photoelectric conversion cell 12 may have a substantially band-like shape when viewed from the thickness direction of the photoelectric conversion element 10. Further, the plurality of photoelectric conversion cells 12 may be arranged in the X direction of FIG. The photoelectric conversion cells 12 adjacent to each other may be separated from each other by the dividing portion P3.

Each photoelectric conversion cell 12 may include at least a first electrode layer 22, a second electrode layer 24, and a photoelectric conversion layer 26. The photoelectric conversion layer 26 is provided between the first electrode layer 22 and the second electrode layer 24 in the thickness direction of the photoelectric conversion element 10. The first electrode layer 22 is provided between the photoelectric conversion layer 26 and the second substrate 20. The second electrode layer 24 is located on the opposite side of the photoelectric conversion layer 26 from the second substrate 20.

The second electrode layer 24 may be composed of a transparent electrode layer. When the second electrode layer 24 is composed of a transparent electrode layer, the light incident on the photoelectric conversion layer 26 or the light emitted from the photoelectric conversion layer 26 passes through the second electrode layer 24.

When the second electrode layer 24 is composed of a transparent electrode layer, the first electrode layer 22 may be composed of an opaque electrode layer or a transparent electrode layer. The first electrode layer 22 may be formed of, for example, a metal such as molybdenum, titanium or chromium.

In the present embodiment, as a preferable example, the second electrode layer 24 is formed of an n-type semiconductor, more specifically, a material having n-type conductivity, a wide bandgap, and a relatively low resistance. To. The second electrode layer 24 may be composed of, for example, zinc oxide (ZnO) to which a group III element is added or indium tin oxide (ITO). In this case, the second electrode layer 24 can have the functions of the n-type semiconductor and the transparent electrode layer.

The photoelectric conversion layer 26 may include, for example, a p-type semiconductor. In an example of the CIS-based photoelectric conversion module, the photoelectric conversion layer 26 is composed of Group I elements (Cu, Ag, Au, etc.), Group III elements (Al, Ga, In, etc.) and Group VI elements (O, S, Se, etc.). It is made of a compound semiconductor containing Te etc.). The photoelectric conversion layer 26 is not limited to the above-mentioned one, and may be made of any material that causes photoelectric conversion.

It should be noted that the configuration of the photoelectric conversion cell 12 is not limited to the above aspect and may take various aspects. For example, the photoelectric conversion cell 12 may have a configuration in which both the n-type semiconductor and the p-type semiconductor are sandwiched between the first electrode layer and the second electrode layer. In this case, the second electrode layer does not have to be composed of an n-type semiconductor. Further, the photoelectric conversion cell 12 is not limited to the pn-coupled structure, and has a p-n-coupled structure including an intrinsic semiconductor layer (i-type semiconductor) between the n-type semiconductor and the p-type semiconductor. You may have.

The photoelectric conversion cell 12 may have a buffer layer (not shown) between the photoelectric conversion layer 26 and the second electrode layer 24. In this case, the buffer layer may be a semiconductor material having the same conductive type as the second electrode layer 24, or may be a semiconductor material having a different conductive type. The buffer layer may be made of a material having a higher electrical resistance than the second electrode layer 24. The buffer layer may be, for example, a Zn-based buffer layer, a Cd-based buffer layer, or an In-based buffer layer.

The first electrode layer 22 of the photoelectric conversion cells 12 adjacent to each other is electrically separated from each other by the first dividing portion P1. Similarly, the second electrode layers 24 of the photoelectric conversion cells 12 adjacent to each other are electrically separated from each other by the third dividing portion P3. The photoelectric conversion layers 26 of the photoelectric conversion cells 12 adjacent to each other are separated from each other by the second division portion P2 and the third division portion P3.

The photoelectric conversion element 10 may have an electrical connection portion 34 between the photoelectric conversion cells 12 adjacent to each other. The electrical connection unit 34 electrically connects the photoelectric conversion cells 12 adjacent to each other in series. In the present embodiment, the electrical connection portion 34 is formed by a portion continuous from the second electrode layer 24. In this case, the electrical connection portion 34 may be made of the same material as the second electrode layer 24. Instead, the electrical connection portion 34 may be made of a conductive material different from that of the second electrode layer 24. The electrical connection portion 34 extends in the thickness direction of the photoelectric conversion element 10 at the second division portion P2, so that the first electrode layer 22 of one photoelectric conversion cell 12 and the second electrode layer 24 of the other photoelectric conversion cell 12 extend. And are electrically connected to each other.

When the photoelectric conversion module 1 is a solar cell module, an electromotive force is generated when the photoelectric conversion layer 26 of each photoelectric conversion cell 12 is irradiated with light, and the first electrode layer 22 and the second electrode layer 24 are positive electrodes and 24, respectively. It becomes the negative electrode. Therefore, some of the free electrons generated in a certain photoelectric conversion cell 12 move directly from the second electrode layer 24 to the first electrode layer 22 of the adjacent photoelectric conversion cell 12 through the electrical connection portion 34. In this way, the free electrons generated in the photoelectric conversion cells 12 flow through the plurality of photoelectric conversion cells 12 in the second direction.

The photoelectric conversion element 10 has a pair of wirings 50 electrically connected to the photoelectric conversion element 10. The pair of wirings 50 can supply electric power to the photoelectric conversion element 10 from the outside and can take out electric power from the photoelectric conversion element 10 to the outside. The pair of wirings 50 are provided between the second substrate 20 and the first substrate 600.

The pair of wirings 50 may be provided adjacent to the photoelectric conversion cell 12 located at the end of the photoelectric conversion element 10 in the X direction of FIG. The pair of wirings 50 are in contact with a portion (electrode layer) in which the first electrode layer 22 of the photoelectric conversion cell 12 located at the end of the photoelectric conversion cells 12 arranged in one direction extends and is exposed. As a result, the pair of wires 50 are electrically connected to the photoelectric conversion element 10.

Each of the pair of wirings 50 is routed to the back surface side at the edge of the second substrate 20, passes through the back side of the second substrate 20, and is connected to the repeater 700 as described above.

The sealing material 500 may be provided at a position that does not overlap the photoelectric conversion cell 12, specifically, the region where the photoelectric conversion is performed, when viewed from the thickness direction of the photoelectric conversion element 10. More specifically, the sealing material 500 may be provided in a region outside the photoelectric conversion cell 12 in the X direction of FIG. Further, the sealing material 500 may cover at least a part of the wiring 50 described above, or may be provided only outside the wiring 50.

(Second Embodiment)
Next, the photoelectric conversion module according to the second embodiment will be described with reference to FIG. FIG. 4 is a schematic cross-sectional view of the photoelectric conversion module according to the second embodiment.

It should be noted that in the second embodiment, the same or similar components as in the first embodiment are designated by the same reference numerals. Further, it should be noted that the description of the components similar to or similar to those of the first embodiment may be omitted.

In the first embodiment, the protective material 900 is gently bent from the back surface side of the second sealing material 800 to the back surface side of the first substrate 600 (see FIG. 2). In the second embodiment, the protective material 900 is formed in a flat plate shape on the back surface side of the second sealing material 800. The protective material 900 extends outward from the photoelectric conversion element 10, and a sealing material 500 may be provided between the protective material 900 and the first substrate 600. The sealing material 500 may play a role of joining the protective material 900 and the first substrate 600.

Also in the second embodiment, the edge of the protective material 900 is located inside the edge of the first substrate 600 (see FIG. 4). As a result, as in the first embodiment, when the flame is sprayed on the front surface side of the photoelectric conversion panel 100 to which the frame 200 is not attached in the flame test, the protective material 900 is placed around the back surface side of the photoelectric conversion panel 100. It is less susceptible to the flames that have entered.

In the second embodiment, the protective material 900 has a flat plate shape. Therefore, the protective material 900 may be made of a hard material as well as a material that can be flexibly bent. Specifically, the protective material 900 may be made of a material such as glass in addition to the material exemplified in the first embodiment.

Also in the second embodiment, it is preferable that the adhesive 250 is provided so as to straddle the edge of the protective material 900. Specifically, the adhesive 250 is provided so as to straddle the protective material 900 to the first substrate 600. As a result, it is possible to prevent the edge of the protective material 900 from being rolled up or the protective material 900 from being peeled off from the edge of the protective material 900.

Further, the protective material 900 may be composed of a transparent or translucent substrate such as a glass substrate. As a result, light can be transmitted from the back side of the photoelectric conversion panel 100 toward the photoelectric conversion element 10. In this case, it is preferable that the photoelectric conversion element 10 is configured so that it can be photoelectrically converted even by light entering from the back side. As a result, photoelectric conversion can be performed using both the light that has entered from the front side and the light that has entered from the back side, so that the efficiency of photoelectric conversion can be improved.

As mentioned above, although the content of the invention has been disclosed through embodiments, the statements and drawings that form part of this disclosure should not be understood to limit the invention. This disclosure reveals to those skilled in the art various alternative embodiments, examples and operational techniques. Therefore, the technical scope of the present invention is defined only by the matters specifying the invention relating to the reasonable claims from the above description.

1 Photoelectric conversion module 100 Photoelectric conversion panel 10 Photoelectric conversion element 20 Second substrate 200 Frame 210 Receiving part 250 Adhesive material 500 Sealing material 600 First substrate 900 Protective material

Claims (7)

Photoelectric conversion element and
A first substrate provided on the first surface side of the photoelectric conversion element and
The photoelectric conversion element is provided on the second surface side opposite to the first substrate, and has a protective material for covering the photoelectric conversion element.
In the plane along the surface of the first substrate, the size of the first substrate is larger than the size of the photoelectric conversion element.
A photoelectric conversion module in which the edge of the protective material is located inside the edge of the first substrate in a direction along the surface of the first substrate. The photoelectric conversion module according to claim 1, wherein the protective material has at least a non-conductive material. The photoelectric conversion module according to claim 1 or 2, wherein the protective material contains at least a resin. The photoelectric conversion module according to claim 1 or 2, wherein the protective material is made of a hard substrate. The photoelectric conversion module according to any one of claims 1 to 4, further comprising an adhesive provided on the second surface side of the first substrate so as to straddle the edge of the protective material. It has a frame provided with a receiving portion for receiving the edge of the first substrate in a direction along the surface of the first substrate.
The photoelectric conversion module according to claim 5, wherein the region of the protective material exposed from the adhesive is located outside the receiving portion of the frame. It has a frame provided with a receiving portion for receiving the edge of the first substrate in a direction along the surface of the first substrate.
The photoelectric of claim 5 or 6, wherein at least a part of the adhesive is in contact with both the photoelectric conversion panel including the photoelectric conversion element and the first substrate and the frame in the receiving portion. Conversion module.

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