JP2021048200A5

JP2021048200A5 - Resistivity measuring instrument, semiconductor device manufacturing method, and resistivity measuring method

Info

Publication number: JP2021048200A5
Application number: JP2019168864A
Authority: JP
Filing date: 2019-09-17
Publication date: 2022-09-28
Anticipated expiration: 2039-09-17

Claims

a table on which the object to be measured is placed;
a probe that brings a plurality of probes into contact with the object to be measured;
a horizontal driving unit for horizontally moving the probe;
a vertical driving unit that vertically moves the probe;
a displacement meter that measures the amount of pushing of the object to be measured and the probe;
The horizontal driving unit moves the probe to the measurement position of the object to be measured, the vertical driving unit brings the probe into contact with the object to be measured, and the amount by which the probe is pushed into the object to be measured by the displacement gauge is measured, the measured value is compared with an arbitrary set value, and if the error is outside the threshold, the control unit controls to correct the error;
A resistivity meter with

The controller controls the measurement position as a reference according to a voltage value between a first probe out of the plurality of probes and a second probe out of the plurality of probes. 2. The resistivity meter of claim 1, wherein the resistivity meter is configured to determine position.

3. The resistivity measuring instrument according to claim 2, wherein said control unit is configured to set said measurement position to a reference position if the voltage value between said first probe and said second probe is within a threshold value. .

3. The resistivity measurement according to claim 2, wherein the control unit is configured to re-execute the descent of the probe if the voltage value between the first probe and the second probe is outside the threshold value. vessel.

The control unit is configured to stop the resistivity measurement if the voltage value between the probes is outside the threshold value even if the downward movement of the probe is re-executed a predetermined number of times. 5. The resistivity measuring instrument of claim 4.

2. The resistivity measuring instrument according to claim 1, wherein the control unit is configured to move the vertical driving unit up and down to adjust the pushing amount.

2. The resistivity measuring instrument according to claim 1, wherein the vertical drive section includes at least a probe attachment section having a predetermined weight, a motor section, a vertical drive cam section, and a cam receiving section.

8. The resistivity measuring instrument according to claim 7, wherein the control section is configured to adjust the rotation angle of the vertical drive cam section.

Furthermore, a display unit is provided,
8. The resistivity measuring instrument according to claim 7, wherein the control section is configured to adjust the rotation angle of the vertical drive cam section.

2. A resistivity measuring instrument according to claim 1, wherein said object to be measured is a wafer including a silicon wafer.

The control unit controls the resistivity of a silicon wafer, the resistivity of an epitaxial wafer formed on the wafer surface, the sheet resistance of a diffusion layer or an injection layer when impurities are diffused or implanted from the surface, or the sheet resistance of a metal film formed on the surface. 2. The resistivity measuring instrument according to claim 1, which is configured to be able to measure at least one of

A table on which an object to be measured is placed, a probe for bringing a plurality of probes into contact with the object to be measured, a horizontal driving section for horizontally moving the probe, and a vertical driving section for vertically moving the probe. a displacement gauge for measuring the amount of pushing of the object to be measured and the probe; and the horizontal drive unit moving the probe to a measurement position on the object to be measured, and the vertical drive unit moving the probe to the object to be measured. , the displacement gauge actually measures the amount by which the probe is pushed into the object to be measured, compares this measured value with an arbitrary set value, and if the error is outside the threshold, corrects the error a step of measuring the resistivity or sheet resistance of the object to be measured by a resistivity measuring instrument comprising a control unit for controlling;
setting process conditions of a semiconductor manufacturing apparatus based on the measured resistivity or sheet resistance;
processing a semiconductor wafer based on set process conditions;
A method of manufacturing a semiconductor device comprising

A table on which an object to be measured is placed, a probe for bringing a plurality of probes into contact with the object to be measured, a horizontal driving section for horizontally moving the probe, and a vertical driving section for vertically moving the probe. a displacement gauge for measuring the amount of pushing of the object to be measured and the probe; and the horizontal drive unit moving the probe to a measurement position on the object to be measured, and the vertical drive unit moving the probe to the object to be measured. , the displacement gauge actually measures the amount by which the probe is pushed into the object to be measured, compares this measured value with an arbitrary set value, and if the error is outside the threshold, corrects the error a step of measuring the resistivity or sheet resistance of the object to be measured by a resistivity measuring instrument comprising a control unit for controlling;
A resistivity measurement method having