JP2021025817A - Sensor device - Google Patents

Abstract

To provide a sensor device that can be prevented from being deformed by a resin pressure at the time of molding the outer case.SOLUTION: A sensor device 100 is covered by a resin outer case 9 formed by molding on the outside, and includes: a first magnetic sensor 51 and a second magnetic sensor 52 for measuring the physical amount of a detection target; a substrate 6 equipped with the first and second magnetic sensors 51 and 52; and a substrate containing unit 81 for containing the substrate 6. The substrate containing unit 81 includes a first containing unit 31 covering a front surface 60a of the substrate 6 and a second containing unit 41 covering a back surface 60b of the substrate 6. The first containing unit 31 has a first bending unit 310 bending into a protrusion in a direction away from the substrate 6 in the thickness direction of the substrate 6.SELECTED DRAWING: Figure 1

Description

The present invention relates to a sensor device.

Conventionally, a sensor device including a sensor for measuring a physical quantity to be detected, a substrate on which the sensor is mounted, and a resin substrate accommodating portion for accommodating the substrate by sandwiching it in the plate thickness direction is known (for example). , Patent Document 1).

JP-A-2018-017595

By the way, in this kind of sensor device, the outer case may be molded by molding the outside of the substrate accommodating portion. In this case, the substrate accommodating portion is arranged in a mold to inject and mold the molten resin, but the substrate accommodating portion may be deformed by the resin pressure during this injection molding.

Therefore, an object of the present invention is to provide a sensor device capable of suppressing deformation due to resin pressure during molding of an outer case.

The present invention is a sensor device covered with a resin outer case formed by molding, for the purpose of solving the above problems, and a sensor for measuring a physical quantity to be detected and the sensor are mounted. A first case including a substrate and a resin inner case for accommodating the substrate, the outside of the inner case is surrounded by the outer case, and the inner case covers one surface of the substrate. And a second case that covers the other surface of the substrate, and at least one of the first case and the second case faces the direction away from the substrate in the plate thickness direction of the substrate. Provided is a sensor device including a curved portion formed in a curved shape so as to be convex.

According to the sensor device according to the present invention, it is possible to suppress deformation due to resin pressure during molding of the outer case.

(A) and (b) are perspective views which show the appearance of the sensor device which concerns on this embodiment. It is an exploded perspective view which shows the structure of the torque detection device. It is a perspective view which shows the structure of the 2nd accommodating part of the 2nd holder in the state which a substrate is mounted. It is a perspective view which shows the structure of the 2nd accommodating part of the 2nd holder in the state which the substrate is removed from the 2nd holder. It is a perspective view which shows the structure of the 1st accommodating part of 1st holder. It is a perspective view which shows the cross section along the line BB in FIG. 1A. (A) is a cross-sectional view taken along the line AA in FIG. 1 (a), and (b) is an enlarged view of a main part of (a). It is sectional drawing which shows the structure of the substrate accommodating part in the molding process of molding an outer case. It is explanatory drawing which showed typically the displacement of the 1st accommodating part in a molding process. (A) and (b) are perspective views which show the structure of a connector.

[Embodiment]
The sensor device according to the present embodiment will be described with reference to FIGS. 1 to 8. Hereinafter, the case where the sensor device of the present invention is used for the torque detection device will be described as an example, but the application of the sensor device is not limited to this.

(Torque detector)
1A and 1B are perspective views showing the appearance of the sensor device 100 according to the present embodiment. FIG. 2 is an exploded perspective view showing the configuration of the torque detection device 101.

As shown in FIG. 2, the torque detection device 101 according to the present embodiment includes a ring-shaped permanent magnet 10 and first and second yokes 11 and 12 that form a magnetic path of the magnetic force generated by the permanent magnet 10. , A sensor device 100 for detecting a change in magnetic flux in the first and second yokes 11 and 12.

The sensor device 100 is a resin collection that holds the first and second magnetic collection rings 21 and 22 and the first and second magnetic collection rings 21 and 22 that collect the magnetic paths of the first and second yokes 11 and 12. It includes a magnetic holder 8 and first and second magnetic sensors 51 and 52 housed in the magnetic collecting holder 8 and detecting the strength of the magnetic field between the first and second magnetic collecting rings 21 and 22. The outside of the sensor device 100 is surrounded by a resin outer case 9 (shown in FIG. 7A described later) formed by molding.

The permanent magnet 10 has a plurality of magnetic poles having different magnetisms formed along the circumferential direction centered on the rotation axis O. In the present embodiment, eight magnetic poles including four N poles and four S poles are formed on the permanent magnet 10. Hereinafter, for convenience of explanation, the direction parallel to the rotation axis O is simply referred to as an axial direction.

The first and second yokes 11 and 12 are formed in an annular shape, and are arranged with a predetermined gap on the outer circumference of the permanent magnet 10. The first and second yokes 11 and 12 are held by holding members (not shown) made of resin or the like.

The first and second magnetic collecting rings 21 and 22 are arranged coaxially with the permanent magnet 10 and are arranged so as to cover the periphery of the first and second yokes 11 and 12, and the annular portions 210 and 220 and the annular portions. It has protruding portions 211 and 221 (protruding portions 211 are shown in FIG. 3 to be described later), which are provided so as to project outward from 210 and 220 in the radial direction. The first and second magnetic sensors 51 and 52 are arranged between the protruding portion 211 of the first magnetic collecting ring 21 and the protruding portion 221 of the second magnetic collecting ring 22.

The first and second magnetic sensors 51 and 52 are Hall ICs that detect the strength of the magnetic field by using, for example, the Hall effect. In the present embodiment, the first and second magnetic sensors 51 and 52 are similar sensors, and two are provided for redundancy.

The sensor device 100 applies torque acting on the torsion bar based on the twist of the torsion bar connecting the input shaft connected to the permanent magnet 10 and the output shaft connected to the first and second yokes 11 and 12. To detect. When the torsion bar is twisted, the relative positional relationship between the permanent magnet 10 and the first and second yokes 11 and 12 changes, and the change in magnetic flux caused by this change is measured by the first and second magnetic sensors 51. , 52 detect. The permanent magnet 10 corresponds to the detection target in the present invention, and the magnitude of the magnetic field based on the permanent magnet 10 corresponds to the "physical quantity of the detection target" in the present invention.

(Magnetic collector holder)
The magnetic collection holder 8 accommodates a substantially rectangular substrate that accommodates a ring portion 80 that holds the first and second magnetic collection rings 21 and 22 and a substrate 6 on which the first and second magnetic sensors 51 and 52 are mounted. It has a part 81. The magnetic collecting holder 8 is composed of a first holder 3 and a second holder 4 which are divided into two in the axial direction.

In the following description, for convenience of explanation, the arrangement direction (Y direction shown in FIG. 1A) of the ring portion 80 and the substrate accommodating portion 81 of the magnetic collecting holder 8 is referred to as a front-rear direction, and is orthogonal to the front-rear direction and the axial direction. The direction (X direction shown in FIG. 1A) is called the width direction. Further, in the front-rear direction, the ring portion 80 side of the magnetic collecting holder 8 is the front side, and the substrate accommodating portion 81 side is the rear side.

The first holder 3 is made of resin and integrally has a first ring portion 30 for holding the first magnetic collecting ring 21 and a first accommodating portion 31 for covering the surface 60a of the substrate 6. A curved metal plate 14 is attached to the first accommodating portion 31.

The metal plate 14 has a main body portion 140 curved in an arc shape, and first and second side portions 141 and 142 located at both ends of the main body portion 140 in the bending direction.

The second holder 4 is made of resin and protrudes from the lower end of the second ring portion 40 that holds the second magnetic collecting ring 22, the second accommodating portion 41 that covers the back surface 60b of the substrate 6, and the second accommodating portion 41. The first to fourth legs 421 to 424 are integrally provided.

A connector 7 having a plurality of terminals 71 and a support 70 for supporting the plurality of terminals 71 is attached to the second accommodating portion 41. The first accommodating portion 31 and the second accommodating portion 41 are overlapped in the axial direction and sandwich the substrate 6 in the plate thickness direction.

The first ring portion 30 of the first holder 3 and the second ring portion 40 of the second holder 4 form the ring portion 80 of the magnetic collecting holder 8, and the first accommodating portion 31 and the second holder 4 of the first holder 3 The second accommodating portion 41 constitutes the substrate accommodating portion 81 of the magnetic collecting holder 8. The substrate accommodating portion 81 corresponds to the "inner case" in the present invention, the first accommodating portion 31 corresponds to the "first case" in the present invention, and the second accommodating portion 41 corresponds to the "second case" in the present invention. Corresponds to.

A magnetic shield 13 for blocking magnetism is provided on the outer periphery of the first ring portion 30 and the second ring portion 40. The magnetic shield 13 is formed by bending a metal plate member in a C shape, and is located on the outer periphery of the first and second magnetic collecting rings 21 and 22.

(Board accommodating part)
Next, the substrate accommodating portion 81 of the magnetic collecting holder 8 will be described in detail with reference to FIGS. 3 to 7. FIG. 3 is a perspective view showing the configuration of the second accommodating portion 41 and the substrate 6 of the second holder 4 in a state where the substrate 6 is mounted. FIG. 4 is a perspective view showing the configuration of the second accommodating portion 41 and the substrate 6 in a state where the substrate 6 is removed from the second accommodating portion 41 of the second holder 4. FIG. 5 is a perspective view showing the configuration of the first accommodating portion 31 of the first holder 3. FIG. 6 is a perspective view showing a cross section taken along the line BB in FIG. 1 (a). 7 (a) is a cross-sectional view taken along the line AA in FIG. 1 (a), and FIG. 7 (b) is an enlarged view of a main part of FIG. 7 (a).

(2nd accommodation)
As shown in FIGS. 3 and 4, the second accommodating portion 41 of the second holder 4 has a bottom portion 411 facing the back surface 60b of the substrate 6 and a second curved portion 412 provided on the front side of the bottom portion 411 (FIG. 1). (Shown in) and.

The bottom portion 411 includes a mounting portion 410 on which the substrate 6 is mounted, and the mounting portion 410 has a substantially rectangular shape with a hollow shape when viewed along the axial direction. The outer edge of the back surface 60b of the substrate 6 is in contact with the mounting portion 410. The second curved portion 412 is formed to be curved so as to be convex toward the direction away from the substrate 6.

The second accommodating portion 41 is provided with first to seventh columns 413 to 419 protruding toward the first accommodating portion 31 side in the axial direction.

The first to third columns 413 to 415 are arranged along the front-rear direction at the central position of the bottom portion 411, and the first column 413, the second column 414, and the second column 414 are arranged from the rear side to the front side in the front-rear direction. The third columns 414 are arranged in parallel in this order. In the present embodiment, the heights of the first to third columns 413 to 415 in the axial direction are the same.

The fourth and fifth columns 416 and 417 are parallel to each other along the width direction at positions sandwiching the first column 413 in the center, and the sixth and seventh columns 418 and 419 are the fourth and fifth columns. It is arranged in parallel along the width direction at a position rearward from the columns 416 and 417. The sixth and seventh columns 418 and 419 are located slightly outside the width direction of the fourth and fifth columns 416 and 417, respectively. In the present embodiment, the fourth to seventh columns 416 to 419 all have the same shape, and therefore, the fourth column 416 will be described as an example below.

As shown in FIGS. 6 and 7A, the fourth support column 416 has a shaft portion 416b and a tip portion 416a formed having a diameter larger than that of the shaft portion 416b. The tip portion 416a of the fourth support column 416 is formed as an enormous portion having an outer diameter larger than the inner diameter of the fourth through hole 6d of the substrate 6 described later, and the tip portion 416a is formed as, for example, a resin cylinder. It can be formed by inserting the member 416A (shown in FIG. 4) into the fourth through hole 6d of the substrate 6 and heat-clamping the tip exposed from the through hole 6d.

In the present embodiment, the shape of the tip portion 416a of the fourth support column 416 is circular, but the shape is not limited to this, and the shape seen along the axial direction of the tip portion 416a may be polygonal or elliptical. Good.

Since the fourth to seventh columns 416 to 419 are provided with the tip portions 416a to 419a, respectively, the substrate 6 is prevented from coming off from the second accommodating portion 41 in the plate thickness direction. Further, in the assembly process described later, in order to increase the mounting strength of the substrate 6 with respect to the second accommodating portion 41, the tips of the first to third columns 413 to 415 are also formed as enormous portions by heat heating. You may. Note that FIGS. 2 and 4 show cylindrical members 416A to 419A before the fourth to seventh columns 416 to 419 are heat-clamped.

The bottom portion 411 of the second accommodating portion 41 is formed with first and second recesses 411a and 411b recessed downward in the axial direction. The first and second recesses 411a and 411b are provided at positions sandwiching the second and third columns 414 and 415. The bottom surfaces of the first and second recesses 411a and 411b are formed as a part of the inner surface of the second curved portion 412, and are curved so as to be convex downward in the axial direction.

Since the first and second recesses 411a and 411b are formed in the bottom portion 411 of the second accommodating portion 41, a space can be provided in a portion where the substrate 6 and the bottom portion 411 face each other, and the electrons mounted on the substrate 6 can be provided. The mountability of the circuit is improved.

On the rear side of the bottom portion 411 of the second accommodating portion 41, a fitting hole 411c into which the support 70 of the connector 7 is fitted is formed so as to penetrate in the axial direction. Further, the bottom portion 411 is formed with four fitting holes 411d into which the four protrusions 31c provided in the first accommodating portion 31 are fitted. As a result, the first accommodating portion 31 and the second accommodating portion 41 are positioned.

(substrate)
The substrate 6 is formed with first to seventh through holes 6a to 6g penetrating the front surface 60a and the back surface 60b. The first to third columns 413 to 415 of the second accommodating portion 41 penetrate through the first to third through holes 6a to 6c, respectively. The fourth to seventh columns 416 to 419 of the second accommodating portion 41 penetrate through the fourth to seventh through holes 6d to 6g, respectively. Further, the substrate 6 is formed with a plurality of connection holes 600 to which the plurality of terminals 71 are electrically connected. The plurality of connection holes 600 are formed so as to penetrate in the plate thickness direction of the substrate 6. It is preferable that the first to seventh columns 413 to 419 are arranged at positions close to the plurality of connection holes 600 of the substrate 6.

(1st containment unit)
As shown in FIGS. 5 to 7, the first accommodating portion 31 includes a first curved portion 310 formed in an arch shape, and first and second supporting portions 311, 312 that support the first curved portion 310. It has first to seventh contact portions 313 to 319 that come into contact with the tip portions of the first to seventh columns 413 to 419 of the second accommodating portion 41, respectively.

The first curved portion 310 is formed in a curved shape that becomes convex in the plate thickness direction of the substrate 6 in the direction away from the substrate 6. The first and second support portions 311, 312 are located at one end and the other end of the first curved portion 310 in the bending direction, respectively, and are in contact with the bottom portion 411.

The metal plate 14 is made of a metal material such as iron, and its main body 140 is curved along the curvature of the outer surface 310a of the first curved portion 310 and is in contact with the outer surface 310a. Further, the first and second side portions 141 and 142 of the metal plate 14 are in contact with the first and second support portions 311, 312 of the first accommodating portion 31, but are not in contact with the second accommodating portion 41. It is a contact. As a result, for example, when the resin pressure when molding the outer case 9, which will be described later, acts on the metal plate, the first and second side portions 141 and 142 of the metal plate 14 press the second accommodating portion 41. Since there is no such thing, the load on the second accommodating portion 41 is reduced.

The metal plate 14 is formed with an insertion hole 14a through which a protrusion 310b provided on the outer surface 310a of the first curved portion 310 is inserted. As a result, the metal plate 14 can be positioned with respect to the first accommodating portion 31. The thickness of the metal plate 14 is, for example, 0.7 to 0.9 mm.

The first to third contact portions 313 to 315 are arranged in parallel along the front-rear direction on the protruding portion 31d protruding from the back surface of the first curved portion 310 toward the substrate 6. The protruding portion 31d extends in the front-rear direction at the center of the first accommodating portion 31. First and second recesses 31a and 31b recessed upward in the axial direction are formed at positions sandwiching the protrusion 31d in the width direction. The protruding portion 31d itself may be provided as a contact portion that comes into contact with the first to third columns 413 to 415.

The bottom surfaces of the first and second recesses 31a and 31b are formed as a part of the inner surface of the first curved portion 310. Since the first and second recesses 31a and 31b are formed in the first accommodating portion 31, a space can be provided between the portion where the substrate 6 and the first accommodating portion 31 face each other, and the substrate 6 can be provided with a space. The mountability of the electronic circuit to be mounted is improved.

The fourth to seventh contact portions 316 to 319 are formed in a columnar shape in which the first curved portion 310 protrudes from the surface facing the substrate 6, and the fourth to seventh columns 416 of the second accommodating portion 41 are formed. It comes into contact with the tip portions 416a to 419a of ~ 419, respectively. The shape of the fourth to seventh contact portions is not limited to this, and for example, the shape seen along the axial direction may be a polygonal shape or an elliptical shape.

In the present embodiment, the first column 413 and the fourth to seventh columns 416 to 419 are arranged at positions surrounding the plurality of connection holes 600. As a result, it is possible to reduce the influence of vibration in the vehicle on the connection portion between the substrate 6 and the plurality of terminals 71, and it is possible to improve the reliability of the connection portion between the substrate 6 and the plurality of terminals 71. It will be possible.

(1st to 4th legs)
As shown in FIG. 1B, the first to fourth leg portions 421 to 424 are provided so that the bottom portion 411 of the second accommodating portion 41 projects from the outer surface 411e on the side opposite to the surface facing the substrate 6. There is. The first to fourth legs 421 to 424 are each formed in a columnar shape. In the present embodiment, four legs having a common shape are provided, but the number of legs is not limited to this, and may be two or eight.

The first and second legs 421 and 422 are arranged along the front-rear direction, and the third and fourth legs 423 and 424 are also arranged along the front-rear direction. The first and second legs 421 and 422 and the third and fourth legs 423 and 424 are provided at positions that sandwich the connector 7 in the center in the width direction.

As shown in FIGS. 7A and 7B, the second and fourth legs 422 and 424 are provided at positions symmetrical with respect to the central axis S. The second leg portion 422 is provided at a position biased toward the central axis S side, which is the central portion of the bottom portion 411, with respect to the side surface 810 of the substrate accommodating portion 81. Similarly, the fourth leg portion 424 is provided at a position biased toward the central axis S side, which is the central portion of the bottom portion 411, with respect to the side surface 810 of the substrate accommodating portion 81. The same applies to the first and third legs 421 and 423.

The tip surfaces 422a and 424a of the second and fourth legs 422 and 424 are exposed to the outside from the outer case 9. That is, the tip surfaces 422a and 424a provided at the tip portions of the second and fourth leg portions 422 and 424 are formed as exposed surfaces that are exposed from the outer case 9 and face the outside. The same applies to the first and third legs 421 and 423. The central axis S is a line obtained by bisecting the bottom portion 411 in the width direction in the direction along the axial direction.

As shown in FIG. 7B, a seam 8a between the first accommodating portion 31 and the second accommodating portion 41 is formed on the side surface 810 of the substrate accommodating portion 81, and this side surface 810 is covered with the outer case 9. ing. Here, as will be described later, the outer case 9 is formed by overmolding the periphery of the first and second accommodating portions 31, 41. At this time, there is a possibility that a slight gap may be interposed between the outer case 9, the side surface 810, and the side surface 41a of the second accommodating portion 41, and there is a concern that the waterproof property may be deteriorated.

Therefore, in the present embodiment, the second leg portion 422 is provided at a position biased toward the central axis S side, which is the central portion of the bottom portion 411, with respect to the side surface 810 of the substrate accommodating portion 81, thereby providing the side surface of the substrate accommodating portion 81. The path P (arrow-dashed line arrow shown in FIG. 7B) formed by the boundary line between the 810 and the side surface 41a of the second accommodating portion 41 is curved. That is, a part of the side surface 810 of the substrate accommodating portion 81 facing the outer case 9 is curved with respect to the plate thickness direction of the substrate 6. As a result, the path through which water can enter becomes longer than when the path P is not curved, so that inundation can be prevented more reliably. In FIG. 7B, the second leg portion 422 has been described as an example, but the same applies to the first and third and fourth leg portions 421, 423, 424.

(Manufacturing method of sensor device)
Next, a method of manufacturing the sensor device 100 will be described with reference to FIGS. 8 and 9. 8 and 9 show a manufacturing process of the substrate accommodating portion 81 and the outer case 9 among the manufacturing methods of the sensor device 100. FIG. 8 is a cross-sectional view showing the configuration of the substrate accommodating portion 81 in the molding step of molding the outer case 9. FIG. 9 is an explanatory diagram schematically showing a state of the first accommodating portion 31 in the molding process.

The manufacturing process of the sensor device 100 includes an assembly step of assembling the substrate accommodating portion 81 by combining the first accommodating portion 31 and the second accommodating portion 41, and installing the substrate accommodating portion 81 in the mold 900 after the assembling step. It has a molding step of overmolding the outer case 9 by injection molding the molten resin R in the space between the 900 and the substrate accommodating portion 81. The first to fourth legs 421 to 424 are in contact with the mold 900.

As shown in FIG. 8, in the molding process, the resin pressure (filling pressure) in the mold 900 by injection molding acts on the entire circumference of the substrate accommodating portion 81, and particularly the first accommodating portion 31 is axially oriented. A force (large down arrow shown in FIG. 8) that pushes downward toward the second accommodating portion 41 acts strongly.

At this time, since the first curved portion 310 is formed in the first accommodating portion 31, the resin pressure is dispersed by the force in the bending direction (small arrow shown in FIG. 8). Here, for example, when the first curved portion 310 is flat in the width direction, the amount of deformation of the first accommodating portion 31 due to the resin pressure increases, and the substrate 6 and the electronic components mounted on the substrate 6 are damaged. There is a risk of On the other hand, in the present embodiment, by providing the first curved portion 310 in the first accommodating portion 31, the amount of deformation of the first accommodating portion 31 due to the resin pressure is reduced. As a result, deformation of the substrate accommodating portion 81 and the substrate 6 due to the resin pressure during molding of the outer case 9 is suppressed.

Further, since the resin pressure on the first accommodating portion 31 side acts upward in the axial direction on the second accommodating portion 41 as well as the first accommodating portion 31, the second curved portion 412 (shown in FIG. 1). Also contributes to the suppression of deformation of the substrate accommodating portion 81 and the substrate 6.

Further, in the present embodiment, since the metal plate 14 is provided in the first accommodating portion 31, the rigidity of the first curved portion 310 of the first accommodating portion 31 is improved, and the substrate accommodating portion 81 due to the resin pressure described above is improved. In addition, the effect of suppressing the deformation of the substrate 6 is increased.

Further, in the present embodiment, since the first to seventh contact portions 313 to 319 of the first accommodating portion that come into contact with the tips of the first to seventh columns 413 to 419 of the second accommodating portion 41 are provided. , The resin pressure can be received by the first to seventh contact portions 313 to 319, and the deformation of the first accommodating portion 31 is suppressed.

Further, in the present embodiment, since the first to fourth leg portions 421 to 424 are provided in the second accommodating portion 41, the substrate accommodating portion 81 is set to the first to fourth legs when the resin pressure is applied. It can be supported by the legs 421 to 424 of the. As a result, deformation of the substrate accommodating portion 81 and the substrate 6 is suppressed. The effect of suppressing the deformation of the substrate accommodating portion 81 increases as the positions of the first to fourth leg portions 421 to 424 move away from the central axis S, respectively.

Further, in the present embodiment, the first and second side portions 141 and 142 thereof are the first and second support portions of the first accommodating portion 31 so that the metal plate 14 is not in contact with the second accommodating portion 41. Since it is supported by 311, 312, it is prevented that the metal plate 14 comes into contact with the second accommodating portion 41 when the resin pressure acts on the substrate accommodating portion 81. As a result, even if the metal plate 14 is deformed by the resin pressure, it is prevented that the metal plate 14 presses the second accommodating portion 41 and the second accommodating portion 41 is deformed.

Here, as shown in FIG. 9, the substrate accommodating portion 81 has a fourth contact portion 316 of the first accommodating portion 31 and a fourth strut of the second accommodating portion 41 after the assembly step and before the molding step. A predetermined gap C is provided between the tip portion 416a of the 416 and the tip portion 416a. In FIG. 9, for convenience of explanation, the fourth column 416 of the second accommodating portion 41 and the fourth contact portion 316 of the first accommodating portion 31 will be described as an example.

When the outer case 9 is overmolded in the molding process, the resin pressure acts on the substrate accommodating portion 81 and the first accommodating portion 31 is pressed against the second accommodating portion 41, so that the fourth accommodating portion 31 is the fourth. The contact portion 316 is slightly displaced so as to approach the fourth support column 416 of the second accommodating portion 41. Then, the tip surface 416c of the tip portion 416a of the fourth support column 416 of the second housing portion 41 and the tip surface 316a of the fourth contact portion 316 of the first housing portion 31 come into contact with each other.

That is, in the present embodiment, the displacement amount of the fourth contact portion 316 in the first accommodating portion 31 due to the resin pressure is predicted in advance, and the gap C corresponding to this displacement amount is provided to provide the first accommodating portion. The force of the portion 31 pressing against the second accommodating portion 41 is suppressed. As a result, deformation and breakage of the substrate 6 are suppressed. Further, by using the tip portion 416a of the fourth support column 416 as a support portion for supporting the fourth contact portion 316, it is not necessary to provide another support portion, and the sensor device can be further miniaturized. .. It is preferable that the tip portion 416a is formed as an enormous portion by heat-clamping so that the tip surface 416c of the fourth support column 416 is made larger than the tip surface 316a of the fourth contact portion 316.

Next, the positioning method of the connector 7 will be described with reference to FIGS. 1, 2, and 10. 10 (a) and 10 (b) are perspective views showing the configuration of the connector 7.

If the positions of the plurality of terminals 71 of the connector 7 are not accurate, it will be troublesome to connect the plurality of terminals 71 to the plurality of connection holes 600 of the board 6 and to connect the female connector to which the connector 7 is connected. It may take. Therefore, in the present embodiment, the positioning accuracy of the connector 7 is improved by providing positioning holes (first positioning holes 72a and second positioning holes 72b, which will be described later) in the support 70 of the connector 7.

As shown in FIGS. 1 (b), 2 and 10 (a) and 10 (b), three first positioning holes are formed in the upper surface 70a of the support 70 of the connector 7 facing the substrate 6 in the axial direction. 72a is provided. Further, three second positioning holes 72b are provided on the lower surface 70b on the side opposite to the upper surface 70a of the support 70. The number of the first and second holes 72a and 72b is not limited to this, and may be, for example, two or four.

When attaching the connector 7 to the second holder 4 in the assembly process, first, the connector 7 is arranged in the mold used in the assembly process. At this time, at least one of the first positioning hole 72a and the second positioning hole 72b of the connector 7 is fixed to the protrusion provided on the mold, and the connector 7 is integrated with the second accommodating portion 41 by molding. A second holder 4 is formed. As a result, the positions of the plurality of terminals 71 of the connector 7 with respect to the substrate 6 are accurately determined.

Next, in the molding step, the substrate 6 is mounted on the second holder 4, the first holder 3 is attached, and then the outer case 9 is overmolded. At this time, the second positioning hole 72b on the lower surface 70b of the support 70 is fixed to a protrusion provided on the mold used in the molding process, and overmolded. As a result, the positions of the plurality of terminals 71 of the connector 7 with respect to the female connector are accurately determined. As a method of positioning the connector 7, it is possible to fix a plurality of terminals 71 to the mold and perform molding, but in this case, the plurality of terminals 71 may be damaged. On the other hand, in the present invention, since the first and second positioning holes 72a and 72b are fixed to the mold for molding, the terminal 71 can be positioned accurately without damaging the terminal 71. It is possible.

(Summary of embodiments)
Next, the technical idea grasped from the above-described embodiment will be described with reference to the reference numerals and the like in the embodiment. However, the respective symbols and the like in the following description are not limited to the members and the like in which the components in the claims are specifically shown in the embodiment.

[1] A sensor device covered with a resin outer case (9) formed by molding, the sensor (51, 52) for measuring the physical quantity of the detection target (10), and the sensor (51, 52). ) Is mounted and a resin inner case (81) for accommodating the substrate (6) is provided, and the outside of the inner case (81) is surrounded by the outer case (9). The inner case (81) is a first case (31) that covers one surface (60a) of the substrate (6) and a second case (41) that covers the other surface (60b) of the substrate. ), And at least one of the first case (31) and the second case (41) is directed away from the substrate (6) in the thickness direction of the substrate (6). A sensor device (100) including a curved portion (310, 412) formed in a curved shape so as to be convex.

[2] The sensor device (100) according to the above [1], further comprising a metal plate (14) provided curved along the outer surface of the curved portion (310, 412).

[3] The second case (41) is provided with columns (413 to 419) inserted into through holes (6a to 6 g) penetrating the substrate (6), and the first case (31). ) Is provided with contact portions (313 to 319) that come into contact with the tips of the columns (413 to 413) of the second case (41), according to the above [1] or [2]. Device (100).

[4] A connection hole (600) to which the terminal (71) of the connector (7) is connected is formed in the substrate (6) so as to penetrate in the plate thickness direction, and the second case (41) is described. The sensor device (100) according to the above [3], wherein the plurality of columns (413,416 to 419) inserted through the through holes (6a to 6g) are arranged at positions surrounding the connection holes (600). ).

[5] The metal plate (14) is a main body portion (310, 412) arranged along the curved portion (310, 412) of either one of the first case (31) and the second case (41). 140) and the first and second side portions (141, 142) located at both ends of the main body portion (140) in the bending direction, and the first and second sides of the metal plate (14). The sensor device (100) according to any one of [2] to [4] above, wherein the portions (141, 142) do not come into contact with the other case different from the one case.

Although the embodiments of the present invention have been described above, the embodiments described above do not limit the invention according to the claims. For example, in the present embodiment, the connector 7 is attached to the magnetic collecting holder 8 in the axial direction, but the connector 7 may be attached to the magnetic collecting holder 8 in the front-rear direction. In this case, a plurality of terminals 71 are provided so as to project from the rear end surface of the substrate accommodating portion 81. As a result, the entire region of the outer surface 411e of the bottom portion 411 of the second accommodating portion 41 can be provided as a curved curved portion, and the effect of suppressing the deformation of the substrate accommodating portion 81 due to the resin pressure can be increased.

It should also be noted that not all combinations of features described in the embodiments are essential to the means for solving the problems of the invention. The present invention can be appropriately modified and implemented without departing from the spirit of the present invention.

3 ... 1st holder 4 ... 2nd holder 6 ... Substrate 6a-6g ... 1st to 7th through holes 7 ... Connector 8 ... Magnetic collecting holder 9 ... Outer case 14 ... Metal plate 31 ... 1st accommodating part 41 ... 1st 2 Accommodating portion 51 ... First magnetic sensor 52 ... Second magnetic sensor 60a ... Front surface 60b ... Back surface 71 ... Terminal 81 ... Board accommodating portion 100 ... Sensor device 101 ... Torque detection device 140 ... Main body portion 141 ... First side portion 142 ... Second side portion 310 ... First curved portion 310a ... Outer surface
313 to 319 ... 1st to 7th contact portions 413 to 419 ... 1st to 7th columns 416a to 419a ... Tip portions 421 to 424 ... First to 4th legs 411 ... Bottom 412 ... Second curved portion 810 ... Side

Claims (5)

A sensor device covered with a resin outer case formed by molding.
A sensor that measures the physical quantity to be detected and
The board on which the sensor is mounted and
A resin inner case for accommodating the substrate is provided.
The outside of the inner case is surrounded by the outer case.
The inner case has a first case that covers one surface of the substrate and a second case that covers the other surface of the substrate.
At least one of the first case and the second case includes a curved portion formed in a curved shape that is convex in the plate thickness direction of the substrate in the direction away from the substrate.
Sensor device. Further provided with a metal plate curved along the outer surface of the curved portion.
The sensor device according to claim 1. The second case is provided with a support column inserted through a through hole penetrating the substrate.
The first case is provided with a contact portion that comes into contact with the tip of the support column of the second case.
The sensor device according to claim 1 or 2. A connection hole to which the terminal of the connector is connected is formed in the substrate through the plate thickness direction.
The plurality of columns inserted through the through holes of the second case are arranged at positions surrounding the connection holes.
The sensor device according to claim 3. The metal plate has a main body portion arranged along the curved portion of one of the first case and the second case, and first and first portions located at both ends of the main body portion in the bending direction. Has two sides and
The first and second side portions of the metal plate do not come into contact with the other case, which is different from the one case.
The sensor device according to any one of claims 2 to 4.