JP2021018116A5 - - Google Patents
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- JP2021018116A5 JP2021018116A5 JP2019133078A JP2019133078A JP2021018116A5 JP 2021018116 A5 JP2021018116 A5 JP 2021018116A5 JP 2019133078 A JP2019133078 A JP 2019133078A JP 2019133078 A JP2019133078 A JP 2019133078A JP 2021018116 A5 JP2021018116 A5 JP 2021018116A5
- Authority
- JP
- Japan
- Prior art keywords
- area
- work
- seat
- opening
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003384 imaging method Methods 0.000 description 5
- 238000002788 crimping Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Description
また、図3(B)に示すように、検査対象Tにおいて、加熱圧着された領域を圧着領域PAと呼ぶ。圧着領域PAは、少なくともリード11及びリード21がACF3を介して圧着された領域である。なお、圧着領域PAに、第1のワーク1及び第2のワーク2に設けられたアライメントマークが含まれていてもよい。また、加熱圧着により、樹脂製の第1のワーク1には、凹部1bが形成される。つまり、加熱圧着する部材との接触と圧力によって、樹脂が圧縮され熱変形し、加熱圧着されていない部分と比べて薄くなることにより、凹んだ部分が発生する。なお、検査は、第1のワーク1の凹部1bを、後述する突出部513に載せて、撮像部52とリード11、21との距離を保つため、加熱圧着によって第2のワーク2が凹んでも影響はほとんどない。また、第2のワーク2が、例えば、ポリイミドなどの耐熱性樹脂である場合、例えば、ポリエチレンテレフタラート等の第1のワーク1に比べて、熱変形は少ない。 Further, as shown in FIG. 3(B), in the inspection object T, the area that is heat-pressed is called a press-bonded area PA. The crimping area PA is an area where at least the leads 11 and 21 are crimped via the ACF 3 . Note that the compression area PA may include alignment marks provided on the first work 1 and the second work 2 . Moreover, the recessed part 1b is formed in the resin-made 1st workpiece|work 1 by thermocompression-bonding. That is, the resin is compressed and thermally deformed by the contact and pressure with the member to be thermocompression-bonded, and becomes thinner than the non-thermal-compression-bonded portion, resulting in a recessed portion. In the inspection, the concave portion 1b of the first work 1 is placed on a protruding portion 513, which will be described later, and the distance between the imaging portion 52 and the leads 11 and 21 is maintained. But it has little effect. Moreover, when the second work 2 is made of a heat-resistant resin such as polyimide, the heat deformation is less than that of the first work 1 made of polyethylene terephthalate.
本実施形態では、突出部513をステージ51に設置するために、開口512に突出部513を載せる座512aが設けられている。座512aは、開口512の内側に突出し、支持面510と平行な平面を有する。この座512aの平面に、開口512に挿入された突出部513が載置されている。開口512は、座512aによって一旦狭められてから、下方、つまり撮像部52に向かって広がっている。突出部513の接触面513aと反対側の面が、座512aによって狭められた開口512から露出しており、この露出部分の面積が、突出部513を透して撮像される撮像視野の最大となる。傾斜面513cによる面取り部分は、その撮像視野外になるよう設けられている。例えば、傾斜面513cの下方における座512aの水平方向(y方向)の長さを、傾斜面513cの水平方向(y方向)の長さ以上とする。撮像されるリード11、21は、圧着領域PAの端まで達しているので、面取りを施すことで、凹部1bの圧着領域PAから加熱圧着していない部分への立ち上がり部分が突出部513に接触して、第1のワーク1が浮き上がること無く、圧着領域PAを撮像視野内に載置できる。
In this embodiment, the opening 512 is provided with a seat 512 a on which the protrusion 513 is placed in order to install the protrusion 513 on the stage 51 . The seat 512 a protrudes inside the opening 512 and has a plane parallel to the support surface 510 . A protrusion 513 inserted into the opening 512 is placed on the plane of the seat 512a. The opening 512 is once narrowed by a seat 512 a and then widens downward, that is, toward the imaging section 52 . The surface of the protruding portion 513 opposite to the contact surface 513a is exposed from the opening 512 narrowed by the seat 512a , and the area of this exposed portion is the maximum imaging field of view captured through the protruding portion 513. becomes. The chamfered portion by the inclined surface 513c is provided so as to be outside the imaging field of view. For example, the horizontal (y-direction) length of the seat 512a below the inclined surface 513c is made equal to or greater than the horizontal (y-direction) length of the inclined surface 513c. Since the leads 11 and 21 to be imaged reach the end of the crimping area PA, the rising portion of the concave portion 1b from the crimping area PA to the portion not thermally crimped contacts the projecting portion 513 by chamfering. Therefore, the pressure-bonding area PA can be placed within the imaging field without the first work 1 floating up.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019133078A JP7265949B2 (en) | 2019-07-18 | 2019-07-18 | Indentation inspection device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019133078A JP7265949B2 (en) | 2019-07-18 | 2019-07-18 | Indentation inspection device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021018116A JP2021018116A (en) | 2021-02-15 |
JP2021018116A5 true JP2021018116A5 (en) | 2022-07-25 |
JP7265949B2 JP7265949B2 (en) | 2023-04-27 |
Family
ID=74563573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019133078A Active JP7265949B2 (en) | 2019-07-18 | 2019-07-18 | Indentation inspection device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP7265949B2 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3165215B2 (en) * | 1992-02-14 | 2001-05-14 | 松下電器産業株式会社 | LCD panel component mounting equipment |
JP2006186179A (en) * | 2004-12-28 | 2006-07-13 | Matsushita Electric Ind Co Ltd | Electronic component compression bonding device, electronic component compression bonding inspecting device, and electronic component compression bonding inspection method |
JP4711859B2 (en) * | 2006-03-02 | 2011-06-29 | パナソニック株式会社 | Component joining method and component joining apparatus |
JP6413078B2 (en) * | 2014-10-20 | 2018-10-31 | パナソニックIpマネジメント株式会社 | Component mounting device |
-
2019
- 2019-07-18 JP JP2019133078A patent/JP7265949B2/en active Active
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