JP2021003850A - Molding apparatus and method for manufacturing base material - Google Patents

Molding apparatus and method for manufacturing base material Download PDF

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JP2021003850A
JP2021003850A JP2019119320A JP2019119320A JP2021003850A JP 2021003850 A JP2021003850 A JP 2021003850A JP 2019119320 A JP2019119320 A JP 2019119320A JP 2019119320 A JP2019119320 A JP 2019119320A JP 2021003850 A JP2021003850 A JP 2021003850A
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mold
resin
passage portion
uncured resin
lower mold
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JP7226138B2 (en
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茂則 廣田
Shigenori Hirota
茂則 廣田
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Toyota Boshoku Corp
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Abstract

To provide a molding apparatus capable of favorably mixing resin, and a method for manufacturing a base material.SOLUTION: A molding apparatus 20 is provided with: a mold 21 comprising an upper mold 30 and a lower mold 40 disposed at a position opposite to the upper mold 30; and a resin feeding device 22 for feeding an uncured resin into a cavity C surrounded with an upper mold 30 and a lower mold 40 in a closed mold state. In the molding apparatus, the mold 21 is provided with runners 31 and 41 being the runners 31 and 41 provided on the upper mold 30 and the lower mold 40, and connecting the cavity C and the resin feeding device 22 to allow the uncured resin to pass therethrough. The runners 31 and 41 are provided with obstructive parts 25, 26, and 27 for obstructing the flow of the uncured resin.SELECTED DRAWING: Figure 4

Description

本発明は、成形装置及び基材の製造方法に関する。 The present invention relates to a molding apparatus and a method for producing a base material.

従来、基材として、カーボン繊維やガラス繊維等の補強繊維材で剛性等が強化されたものが広く用いられている。このような基材の一例として、発泡樹脂からなるコア材の表裏面にシート状の補強繊維材が重ねられた積層体を、熱硬化性樹脂で固めて得られる樹脂成形体が知られている(例えば、特許文献1参照)。この種の樹脂成形体は、RTM(Resin Transfer Molding)法を利用して成形されている。具体的には、成形型のキャビティに上記積層体をセットした状態で、キャビティに未硬化の熱硬化性樹脂を注入し、その樹脂が前記積層体の補強繊維材等に含浸した状態で熱硬化することにより、上記樹脂成形体を得る。 Conventionally, as a base material, a reinforcing fiber material such as carbon fiber or glass fiber whose rigidity is reinforced is widely used. As an example of such a base material, a resin molded body obtained by solidifying a laminate in which a sheet-shaped reinforcing fiber material is laminated on the front and back surfaces of a core material made of a foamed resin with a thermosetting resin is known. (See, for example, Patent Document 1). This type of resin molded body is molded by using an RTM (Resin Transfer Molding) method. Specifically, with the laminate set in the cavity of the molding die, an uncured thermosetting resin is injected into the cavity, and the resin is impregnated into the reinforcing fiber material of the laminate and then thermoset. By doing so, the above resin molded product is obtained.

熱硬化性樹脂としては、例えば、主剤と硬化剤からなる二液混合型のエポキシ樹脂が利用される。このような二液混合型の熱硬化性樹脂は、ミキシングヘッドを備えた樹脂供給装置を利用して、主剤と硬化剤とを衝突混合させながら成形型内に供給される。 As the thermosetting resin, for example, a two-component mixed type epoxy resin composed of a main agent and a curing agent is used. Such a two-component mixed type thermosetting resin is supplied into the molding mold while colliding and mixing the main agent and the curing agent by using a resin supply device provided with a mixing head.

特開平04−224915号公報Japanese Unexamined Patent Publication No. 04-224915

この種の基材(樹脂成形体)の製造工程では、未硬化の樹脂(熱硬化性樹脂)を供給する圧力が高いと積層物のコア材が潰れる虞があるため、比較的低い圧力で樹脂が供給されることが望ましい。しかしながら、樹脂の供給圧力を低く設定した場合、流量が低下し、主剤と硬化剤とが互いに衝突しにくくなることで混ざりにくくなるという問題があった。また、未硬化の樹脂がうまく混合されないと、積層体への含浸と硬化が好適に進行せず、基材の品質の低下につながる。 In the manufacturing process of this type of base material (resin molded product), if the pressure to supply the uncured resin (thermosetting resin) is high, the core material of the laminate may be crushed, so the resin is applied at a relatively low pressure. Is desirable to be supplied. However, when the supply pressure of the resin is set low, there is a problem that the flow rate is lowered and the main agent and the curing agent are less likely to collide with each other, so that they are less likely to be mixed. Further, if the uncured resin is not mixed well, impregnation and curing of the laminate do not proceed favorably, leading to deterioration of the quality of the base material.

本発明は上記のような事情に基づいて完成されたものであって、樹脂を好適に混合可能な成形装置及び基材の製造方法を提供することを目的とする。 The present invention has been completed based on the above circumstances, and an object of the present invention is to provide a molding apparatus capable of preferably mixing a resin and a method for producing a base material.

本発明は、上型と前記上型に対向する位置に配された下型とからなる成形型と、型閉じ状態において前記上型と前記下型とで囲まれたキャビティに未硬化の樹脂を供給する樹脂供給装置と、を備える成形装置において、前記成形型は、前記上型及び前記下型のうち少なくとも一方に設けられる通路部であって、前記キャビティと前記樹脂供給装置とを繋いで前記未硬化の樹脂を通す通路部を備え、前記通路部は、前記未硬化の樹脂の流れを阻害する阻害部を備えることに特徴を有する。 In the present invention, an uncured resin is placed in a molding die composed of an upper die and a lower die arranged at a position facing the upper die, and a cavity surrounded by the upper die and the lower die in a closed state. In a molding device including a resin supply device for supplying, the molding die is a passage portion provided in at least one of the upper die and the lower die, and the cavity and the resin supply device are connected to each other. The passage portion is provided with a passage portion through which the uncured resin is passed, and the passage portion is characterized by including an inhibition portion that obstructs the flow of the uncured resin.

このような成形装置によると、樹脂供給装置から未硬化の樹脂を供給して通路部に通すときに、阻害部によって未硬化の樹脂の流れを阻害することで、未硬化の樹脂を通路部において撹拌させることができる。これにより、例えば、未硬化の樹脂が主剤と硬化剤とからなるものである場合、これらを通路部の阻害部によって互いに衝突させて混合させることができる。 According to such a molding apparatus, when the uncured resin is supplied from the resin supply device and passed through the passage portion, the uncured resin is transferred to the passage portion by obstructing the flow of the uncured resin by the obstructing portion. It can be agitated. Thereby, for example, when the uncured resin is composed of the main agent and the curing agent, these can be mixed by colliding with each other by the obstructing portion of the passage portion.

上記構成において、前記通路部は、前記上型に設けられる上型通路部と、前記下型に設けられ、前記上型通路部と平面視重ならない位置に設けられる下型通路部と、前記上型および前記下型に設けられ、前記上型通路部と前記下型通路部とを繋ぐ上下通路部と、を備え、前記阻害部は、前記上下通路部であることとすることができる。 In the above configuration, the passage portion includes an upper mold passage portion provided on the upper mold, a lower mold passage portion provided on the lower mold and provided at a position not overlapping with the upper mold passage portion in a plan view, and the upper mold portion. The mold and the upper and lower passages provided on the lower mold and connecting the upper passage and the lower passage can be provided, and the obstruction can be the upper and lower passages.

このような成形装置によると、樹脂供給装置から供給される未硬化の樹脂が上下通路部を通ることで、当該未硬化の樹脂が、上型通路部から下型通路部へ、又は下型通路部から上型通路部へ、流動することができる。そして、未硬化の樹脂の流れが上下方向に変更されるとともに、互いに平面視重ならない位置に設けられる上型通路部と下型通路部とを未硬化の樹脂が流動することで、当該未硬化の樹脂が好適に撹拌される。 According to such a molding device, the uncured resin supplied from the resin supply device passes through the upper and lower passage portions, so that the uncured resin is transferred from the upper mold passage portion to the lower mold passage portion or the lower mold passage portion. It can flow from the section to the upper passage section. Then, the flow of the uncured resin is changed in the vertical direction, and the uncured resin flows through the upper mold passage portion and the lower mold passage portion provided at positions where they do not overlap each other in a plan view, so that the uncured resin flows. Resin is preferably stirred.

前記通路部は、前記上型及び前記下型のうち少なくとも一方において、前記未硬化の樹脂が通る距離が最短となる経路から曲がる形で迂回する迂回部を備え、前記阻害部は、前記迂回部であることとすることができる。 The passage portion includes, in at least one of the upper mold and the lower mold, a detour portion that detours in a form that bends from the path that the uncured resin passes the shortest distance, and the obstruction portion is the detour portion. Can be.

このような成形装置によると、樹脂供給装置から供給される未硬化の樹脂が、最短経路から曲がる形の迂回部を通ることで、迂回部の内側を流れる未硬化の樹脂と、迂回部の外側を流れる未硬化の樹脂とで、例えば流速の差が生じることで、当該未硬化の樹脂を撹拌することができる。 According to such a molding device, the uncured resin supplied from the resin supply device passes through the detour portion that bends from the shortest path, so that the uncured resin flows inside the detour portion and the outside of the detour portion. The uncured resin can be agitated by causing a difference in flow velocity between the uncured resin and the uncured resin.

また、本発明は、コア材と、前記コア材の表裏面にそれぞれ重ねられる一対の補強繊維材と、を備える積層体に、前記未硬化の樹脂を含浸させた後、前記未硬化の樹脂を硬化させてなる基材を、上記に記載の成形装置で製造する基材の製造方法であって、前記キャビティに前記積層体が収容される形で前記上型と前記下型とを型閉じする型閉じ工程と、前記積層体が収容された前記キャビティに、前記樹脂供給装置から前記未硬化の樹脂を供給する樹脂供給工程と、を含み、前記樹脂供給工程では、前記通路部に前記未硬化の樹脂を通し、当該未硬化の樹脂の流れを前記阻害部によって阻害することに特徴を有する。 Further, in the present invention, a laminate comprising a core material and a pair of reinforcing fiber materials to be laminated on the front and back surfaces of the core material is impregnated with the uncured resin, and then the uncured resin is applied. A method for producing a base material in which a cured base material is produced by the molding apparatus described above, wherein the upper mold and the lower mold are closed in a form in which the laminate is accommodated in the cavity. The mold closing step and the resin supply step of supplying the uncured resin from the resin supply device to the cavity in which the laminate is housed are included. In the resin supply step, the uncured passage portion is covered with the uncured resin. It is characterized in that the flow of the uncured resin is blocked by the blocking portion through the resin.

このような基材の製造方法によると、樹脂供給装置から供給された未硬化の樹脂の流れを阻害部によって阻害することで、未硬化の樹脂を通路部において撹拌させることができる。これにより、積層体に未硬化の樹脂をムラなく含浸させ、硬化させることができ、基材の品質を向上させることができる。 According to such a method for producing a base material, the uncured resin can be agitated in the passage portion by inhibiting the flow of the uncured resin supplied from the resin supply device by the obstructing portion. As a result, the laminate can be evenly impregnated with the uncured resin and cured, and the quality of the base material can be improved.

本発明によれば、樹脂を好適に混合する成形装置及び基材の製造方法を提供することが可能となる。 According to the present invention, it is possible to provide a molding apparatus for suitably mixing resins and a method for producing a base material.

実施形態1に係る基材を示す断面図Sectional drawing which shows the base material which concerns on Embodiment 1. 成形装置の通路部付近を示す断面図Cross-sectional view showing the vicinity of the passage portion of the molding apparatus 下型に設けられた通路部付近を上方から視た図View from above near the passage provided in the lower mold 成形装置の通路部付近を示す斜視透過図Perspective transmission view showing the vicinity of the passage portion of the molding apparatus 成形装置に、コア材と一対の補強繊維基材からなる積層体がセットされる工程を示す説明図Explanatory drawing which shows the process of setting the laminate composed of a core material and a pair of reinforcing fiber base materials in a molding apparatus. 型開き状態の成形型を示す説明図Explanatory drawing showing a molding mold in a mold open state 型閉じ状態において、樹脂供給装置から樹脂を供給する様子を示す説明図Explanatory drawing showing how resin is supplied from a resin supply device in a mold closed state. キャビティに樹脂が充満した様子を示す説明図Explanatory drawing showing how the cavity is filled with resin 成形型から成形品を取り外す様子を示す説明図Explanatory drawing showing how to remove a molded product from a molding mold 実施形態2に係る下型において、阻害部を示す拡大図An enlarged view showing an inhibitory portion in the lower mold according to the second embodiment. 実施形態3に係る下型において、阻害部を示す拡大図Enlarged view showing the inhibitory portion in the lower mold according to the third embodiment.

<実施形態1>
本発明の実施形態1を図1から図9によって説明する。本実施形態では、RTM法を用いて繊維強化樹脂成形品(基材)10を製造する成形装置20、及び繊維強化樹脂成形品10の製造方法について例示する。尚、成形装置20の断面を示す図2を基準として、左右方向をX方向、紙面手前奥方向をY方向、これらX方向及びY方向がなす平面に直交する方向をZ方向とする。X方向及びY方向は水平方向であり、Z方向は鉛直方向である。これらX方向、Y方向及びZ方向は、各図面で共通している。まず、図1を参照しつつ、成形装置20で製造される繊維強化樹脂成形品10について説明する。
<Embodiment 1>
Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 9. In this embodiment, a molding apparatus 20 for manufacturing a fiber-reinforced resin molded product (base material) 10 by using the RTM method, and a method for manufacturing the fiber-reinforced resin molded product 10 will be exemplified. With reference to FIG. 2 showing the cross section of the molding apparatus 20, the left-right direction is the X direction, the front-back direction of the paper surface is the Y direction, and the direction orthogonal to the plane formed by these X-direction and Y-direction is the Z-direction. The X and Y directions are horizontal, and the Z direction is vertical. These X, Y, and Z directions are common to each drawing. First, the fiber-reinforced resin molded product 10 manufactured by the molding apparatus 20 will be described with reference to FIG.

図1は、繊維強化樹脂成形品(以下、基材)10の断面構成を模式的に表した説明図である。基材10は、軽量かつ高剛性であり、車両用シートの一部(例えば、バックボード)として利用される。このような基材10は、コア材11と、コア材11の表裏面にそれぞれ重ねられるシート状の補強繊維材12,12と、補強繊維材12,12に含浸して硬化した熱硬化性樹脂からなる樹脂部13とを備えている。尚、樹脂部13の熱硬化性樹脂としては、RTM法で一般的に用いられるもの(例えば、二液混合型のエポキシ樹脂)を採用することができる。 FIG. 1 is an explanatory view schematically showing a cross-sectional structure of a fiber-reinforced resin molded product (hereinafter, base material) 10. The base material 10 is lightweight and has high rigidity, and is used as a part of a vehicle seat (for example, a backboard). Such a base material 10 is a thermosetting resin obtained by impregnating and curing the core material 11, the sheet-shaped reinforcing fiber materials 12 and 12 which are laminated on the front and back surfaces of the core material 11, and the reinforcing fiber materials 12 and 12, respectively. It is provided with a resin portion 13 made of. As the thermosetting resin of the resin portion 13, a resin generally used in the RTM method (for example, a two-component mixed type epoxy resin) can be adopted.

コア材11は、独立気泡構造を有する合成樹脂製(所謂、発泡樹脂製)の板状体であり、補強繊維材12よりも厚みの大きな板状(層状)をなしている。コア材11の素材としては、アクリル樹脂等の合成樹脂を採用することができる。尚、コア材11は、1つの層(単層)からなるものであるが、これに限られず、複数のコア材11が積層された多層構造からなるものとしてもよい。 The core material 11 is a plate-like body made of synthetic resin (so-called foamed resin) having a closed cell structure, and has a plate-like shape (layered shape) having a thickness larger than that of the reinforcing fiber material 12. As the material of the core material 11, a synthetic resin such as an acrylic resin can be adopted. The core material 11 is composed of one layer (single layer), but is not limited to this, and may be composed of a multilayer structure in which a plurality of core materials 11 are laminated.

補強繊維材12は、シート状に加工されたカーボン繊維(炭素繊維)の織物からなる。他にも、補強繊維材12の素材としては、ガラス繊維を採用することができる。便宜上、コア材11の表側(上側)に重ねられる補強繊維材12を、補強繊維材12Aと表し、コア材11の裏側(下側)に重ねられる補強繊維材12を、補強繊維材12Bと表す場合がある。表側の補強繊維材12Aの厚みは、裏側の補強繊維材12Bの厚みと等しい。コア材11は、一対の補強繊維材12A,12Bによって表裏面側から挟まれたサンドイッチ構造をなしている。 The reinforcing fiber material 12 is made of a woven fabric of carbon fibers (carbon fibers) processed into a sheet shape. In addition, glass fiber can be adopted as the material of the reinforcing fiber material 12. For convenience, the reinforcing fiber material 12 laminated on the front side (upper side) of the core material 11 is referred to as a reinforcing fiber material 12A, and the reinforcing fiber material 12 laminated on the back side (lower side) of the core material 11 is referred to as a reinforcing fiber material 12B. In some cases. The thickness of the reinforcing fiber material 12A on the front side is equal to the thickness of the reinforcing fiber material 12B on the back side. The core material 11 has a sandwich structure sandwiched from the front and back sides by a pair of reinforcing fiber materials 12A and 12B.

基材10において、樹脂部13を構成する熱硬化性樹脂の硬化物は、補強繊維材12の内部のみならず、補強繊維材12の表面を覆うように形成される。そのため、基材10において、樹脂部13は、コア材11と一対の補強繊維材12A,12Bとからなる積層体の全体を包み込むように形成されている。これにより、積層体の表面に平滑性を付与することができる。また、基材10は、コア材11を含むため、軽量性、及び高剛性を維持しつつ、比較的高価である補強繊維材12(特に、カーボン繊維)の使用量を低減することができる。 In the base material 10, the cured product of the thermosetting resin constituting the resin portion 13 is formed so as to cover not only the inside of the reinforcing fiber material 12 but also the surface of the reinforcing fiber material 12. Therefore, in the base material 10, the resin portion 13 is formed so as to wrap the entire laminate composed of the core material 11 and the pair of reinforcing fiber materials 12A and 12B. Thereby, smoothness can be imparted to the surface of the laminated body. Further, since the base material 10 contains the core material 11, it is possible to reduce the amount of the reinforcing fiber material 12 (particularly carbon fiber) used, which is relatively expensive, while maintaining light weight and high rigidity.

続いて、図2から図7を用いて、基材10を成形する成形装置20について説明する。 図2に示すように、成形装置20は、上型30と上型30に対向するように下方に配置された下型40とからなる成形型21と、型閉じ状態において上型30と下型40とで囲まれた空間であるキャビティCに未硬化の樹脂を供給する樹脂供給装置22と、を備える。成形型21は、一方の分割金型である固定金型としての下型40と、他方の分割金型である可動金型としての上型30とからなる。下型40は、基材10の表側を成形する成形面40Aを備える。一方、上型30は、基材10の裏側を成形する成形面30Aを備える。上型30は、油圧シリンダ等の昇降機構(往復機構)により、下型40に対し近接又は離間する形で昇降駆動する。 Subsequently, the molding apparatus 20 for molding the base material 10 will be described with reference to FIGS. 2 to 7. As shown in FIG. 2, the molding apparatus 20 includes a molding die 21 including an upper die 30 and a lower die 40 arranged downward so as to face the upper die 30, and an upper die 30 and a lower die in a mold closed state. A resin supply device 22 for supplying an uncured resin to the cavity C, which is a space surrounded by 40, is provided. The molding die 21 includes a lower die 40 as a fixed die, which is one split die, and an upper die 30 as a movable die, which is the other split die. The lower mold 40 includes a molding surface 40A for molding the front side of the base material 10. On the other hand, the upper mold 30 includes a molding surface 30A for molding the back side of the base material 10. The upper die 30 is driven up and down in a manner close to or separated from the lower die 40 by an elevating mechanism (reciprocating mechanism) such as a hydraulic cylinder.

図6に示すように、上型30が下型40に対して離間した位置に配されている状態を型開き状態と呼ぶ。そして、図2及び図7示すように、上型30が下型40に対して近接した位置に配されて閉じた状態を型閉じ状態と呼ぶ。型閉じ状態の成形型21において、上型30の成形面30Aと、下型40の成形面40Aで囲まれた空間が、成形型21のキャビティCとなる。 As shown in FIG. 6, a state in which the upper mold 30 is arranged at a position separated from the lower mold 40 is called a mold opening state. Then, as shown in FIGS. 2 and 7, a state in which the upper mold 30 is arranged and closed at a position close to the lower mold 40 is called a mold closed state. In the mold 21 in the mold closed state, the space surrounded by the molding surface 30A of the upper mold 30 and the molding surface 40A of the lower mold 40 is the cavity C of the molding mold 21.

図7に示すように、上型30の水平方向における端部には、シール部33が設けられている。型閉じ状態では、シール部33が下型40と上型30との間で挟まれることで、未硬化の樹脂がキャビティCや後述するランナー31,41等からシール部33を超えて外側に漏れてしまうことを防止している。 As shown in FIG. 7, a seal portion 33 is provided at an end portion of the upper mold 30 in the horizontal direction. In the mold closed state, the seal portion 33 is sandwiched between the lower mold 40 and the upper mold 30, so that the uncured resin leaks to the outside from the cavity C and the runners 31, 41 and the like described later beyond the seal portion 33. It is prevented from being lost.

樹脂供給装置22は、型閉じ状態においてキャビティCに未硬化の熱硬化性樹脂Rを供給する装置である。本実施形態の樹脂供給装置22は、主剤と硬化剤からなる二液混合型のエポキシ樹脂を成形型21内に供給する。樹脂供給装置22は、主剤と硬化剤とを成形型21側へ吐出するミキシングヘッドを備えている。主剤と硬化剤は、それぞれ所定のタンク内に収容されており、各々の圧送ポンプによって所定の配合比でミキシングヘッドに送られる。そして、主剤と硬化剤の混合物からなる未硬化の樹脂Rが、ミキシングヘッドの先端にあるノズル23から吐出される。ノズル23から吐出された樹脂Rは、スプルー32、ランナー(通路部)31,41、及びゲート42を介してキャビティCに供給される。 The resin supply device 22 is a device that supplies the uncured thermosetting resin R to the cavity C in the closed state. The resin supply device 22 of the present embodiment supplies a two-component mixed epoxy resin composed of a main agent and a curing agent into the molding mold 21. The resin supply device 22 includes a mixing head that discharges the main agent and the curing agent to the molding die 21 side. The main agent and the curing agent are each housed in a predetermined tank, and are sent to the mixing head in a predetermined mixing ratio by each pump. Then, the uncured resin R composed of a mixture of the main agent and the curing agent is discharged from the nozzle 23 at the tip of the mixing head. The resin R discharged from the nozzle 23 is supplied to the cavity C via the sprue 32, the runners (passage portions) 31, 41, and the gate 42.

図2に示すように、成形型21は、キャビティCの右側において、樹脂供給装置22から供給される未硬化の樹脂を成形型21内に注入するための注入孔としてのスプルー32と、スプルー32から流動した樹脂をキャビティC側へ通すランナー(通路部)31,41と、ランナー31,41から流動した樹脂がキャビティCに注入される入り口となるゲート42と、を備える。スプルー32は、上型30を貫通する形で設けられており、ランナー41に連通している。スプルー32の上端には、樹脂供給装置22のノズル23が挿し込まれる形で取り付けられている。ゲート42は、下型40においてX方向に延びる溝状をなし、ランナー31,41に比してY方向における幅が小さく、Z方向における深さが浅くなるように設けられている。 As shown in FIG. 2, the molding die 21 has a sprue 32 and a sprue 32 as injection holes for injecting the uncured resin supplied from the resin supply device 22 into the molding die 21 on the right side of the cavity C. Runners (passage portions) 31, 41 for passing the resin flowing from the runners 31 and 41 to the cavity C side, and a gate 42 serving as an entrance for injecting the resin flowing from the runners 31, 41 into the cavity C are provided. The sprue 32 is provided so as to penetrate the upper mold 30 and communicates with the runner 41. A nozzle 23 of the resin supply device 22 is inserted into the upper end of the sprue 32. The gate 42 has a groove shape extending in the X direction in the lower mold 40, is provided so that the width in the Y direction is smaller and the depth in the Z direction is shallower than those of the runners 31 and 41.

ランナー31,41は、スプルー32とゲート42とを介することで、樹脂供給装置22とキャビティCとを繋いで未硬化の樹脂をキャビティC側へ通す通路とされる。ランナー31,41は、未硬化の樹脂の流れを阻害する阻害部(後述する上下通路部25,26及び迂回部27)を備える。具体的には、図2から図4に示すように、ランナー31,41は、上型30において、下型40に対向する面側に溝状に設けられた上型通路部31と、下型40において、上型30に対向する面側に溝状に設けられた下型通路部41と、上型30及び下型40に設けられ、上型通路部31と下型通路部41と上下方向に繋ぐ上下通路部(阻害部)25,26と、を備える。図2では、上型通路部31のうち、後述する縦第2通路部31Dを点線で示し、図4では、上型通路部31,下型通路部41,及び上下通路部25,26を点線で示している。また、図3は、下型40を上方から視た図(下型40の平面視の図)であり、下型通路部41を実線で示し、型閉じ状態のときに、下型40に上方から重畳する上型通路部31を2点鎖線で示している。下型通路部41は、上型通路部31に対し平面視重ならない位置に設けられている。 The runners 31 and 41 are passages that connect the resin supply device 22 and the cavity C and allow the uncured resin to pass to the cavity C side via the sprue 32 and the gate 42. The runners 31 and 41 are provided with blocking portions (upper and lower passage portions 25 and 26 and bypass portions 27, which will be described later) that obstruct the flow of the uncured resin. Specifically, as shown in FIGS. 2 to 4, the runners 31 and 41 are the upper die 30 and the upper die passage portion 31 provided in a groove shape on the surface side facing the lower die 40 and the lower die. In the 40, the lower mold passage portion 41 provided in a groove shape on the surface side facing the upper mold 30, and the upper mold 30 and the lower mold 40 provided in the upper mold passage portion 31 and the lower mold passage portion 41 in the vertical direction. The upper and lower passage portions (inhibition portions) 25 and 26 connected to the above are provided. In FIG. 2, the vertical second passage portion 31D, which will be described later, is shown by a dotted line among the upper passage portions 31, and in FIG. 4, the upper passage portion 31, the lower passage portion 41, and the upper and lower passage portions 25 and 26 are shown by dotted lines. It is shown by. Further, FIG. 3 is a view of the lower mold 40 viewed from above (a plan view of the lower mold 40), the lower mold passage portion 41 is shown by a solid line, and when the mold is closed, the lower mold 40 is moved upward. The upper die passage portion 31 superimposed from is shown by a two-dot chain line. The lower passage portion 41 is provided at a position where it does not overlap with the upper passage portion 31 in a plan view.

下型通路部41は、X方向に延在し、スプルー32の下端(下型40側に開口した開口縁)32Aと上下通路部25とを繋ぐ縦第1通路部41Cと、X方向に延在し、上下通路部26とゲート42とを繋ぐ縦第3通路部41Dとを備える。スプルー32の下端32Aとゲート42とを結ぶ直線上には、縦第1通路部41C、上下通路部25,26、及び縦第3通路部41Dが並んでいる。縦第1通路部41C及び上下通路部25と、縦第3通路部41D及び上下通路部26とは、下型40に設けられた隔部43によって隔てられている。 The lower passage portion 41 extends in the X direction, and extends in the X direction with the vertical first passage portion 41C that connects the lower end (opening edge opened toward the lower mold 40 side) 32A of the sprue 32 and the upper and lower passage portions 25. It is present and includes a vertical third passage portion 41D that connects the upper and lower passage portions 26 and the gate 42. A vertical first passage portion 41C, a vertical passage portion 25, 26, and a vertical third passage portion 41D are lined up on a straight line connecting the lower end 32A of the sprue 32 and the gate 42. The vertical first passage portion 41C and the vertical passage portion 25, and the vertical third passage portion 41D and the vertical passage portion 26 are separated by a separation portion 43 provided in the lower mold 40.

上型通路部31は、Y方向に延在し、上下通路部25に繋がる横第1通路部31Cと、X方向に延在し、横第1通路部31Cに繋がる縦第2通路部31Dと、Y方向に延在し、縦第2通路部31Dと上下通路部26とを繋ぐ横第2通路部31Eと、を備える。横第1通路部31Cは、縦第1通路部41Cに対し上下通路部25を角として平面視直角に曲がった通路である。横第2通路部31Eは、縦第3通路部41Dに対し上下通路部26を角として平面視直角に曲がった通路である。縦第2通路部31Dは、横第1通路部31Cと横第2通路部31Eとに対し直交する形で繋がった通路である。 The upper type passage portion 31 extends in the Y direction and connects to the upper and lower passage portions 25 with a horizontal first passage portion 31C and a vertical second passage portion 31D extending in the X direction and connecting to the horizontal first passage portion 31C. , A horizontal second passage portion 31E extending in the Y direction and connecting the vertical second passage portion 31D and the upper and lower passage portions 26 is provided. The horizontal first passage portion 31C is a passage that is bent at a right angle in a plan view with the upper and lower passage portions 25 as corners with respect to the vertical first passage portion 41C. The horizontal second passage portion 31E is a passage that is bent at a right angle in a plan view with the upper and lower passage portions 26 as corners with respect to the vertical third passage portion 41D. The vertical second passage portion 31D is a passage that is connected to the horizontal first passage portion 31C and the horizontal second passage portion 31E in a form orthogonal to each other.

ここで、仮に縦第1通路部41Cと縦第3通路部41Dとが互いに近づく方向に延伸して繋がった場合の経路は、スプルー32から流動する未硬化の樹脂がゲート42に向けて通る距離が最短となる経路となる。しかし、本実施形態においては、隔部43によって縦第1通路部41Cと、縦第3通路部41Dとが隔てられており、隔部43を迂回するように、上型通路部31が設けられている。従って、上型通路部31は、スプルー32から流動する未硬化の樹脂がゲート42に向けて通る距離が最短となる経路を、正面視コの字状に迂回する通路としての迂回部27である。 Here, if the vertical first passage portion 41C and the vertical third passage portion 41D are stretched and connected in a direction approaching each other, the path is the distance through which the uncured resin flowing from the sprue 32 passes toward the gate 42. Is the shortest route. However, in the present embodiment, the vertical first passage portion 41C and the vertical third passage portion 41D are separated by the separation portion 43, and the upper type passage portion 31 is provided so as to bypass the separation portion 43. ing. Therefore, the upper type passage portion 31 is a detour portion 27 as a passage that circumvents the path in which the uncured resin flowing from the sprue 32 has the shortest distance toward the gate 42 in a U-shape in front view. ..

続いて、成形装置20による基材10の製造方法を説明する。基材10の製造方法は、大別すると、キャビティCに積層体Pが収容される形で上型30と下型40とを型閉じする型閉じ工程と、積層体Pが収容されたキャビティCに、樹脂供給装置22から未硬化の樹脂を供給する樹脂供給工程と、を含む。 Subsequently, a method of manufacturing the base material 10 by the molding apparatus 20 will be described. The method for producing the base material 10 is roughly divided into a mold closing step of closing the upper mold 30 and the lower mold 40 in a form in which the laminated body P is housed in the cavity C, and a cavity C in which the laminated body P is housed. Includes a resin supply step of supplying the uncured resin from the resin supply device 22.

型閉じ工程では、図5に示すように、型開き状態の成形装置20の下型40に、コア材11とコア材11の表裏面にそれぞれ重ねられる一対の補強繊維材12A,12Bとからなる積層体Pをセットする。積層体Pは、補強繊維材12A,12Bよりも小さいコア材11が、補強繊維材12A,12Bの内側に配された状態で、下型40の成形面40Aに載置される。補強繊維材12A,12Bの周縁同士は、コア材11を介さずに重なった状態となる。積層体Pは、成形面40Aの形状に倣った状態(周縁部が立ち上がった状態)で、下型40の成形面40A上にセットされる。積層体Pは、予め成形面40Aの形に倣った形状に成形(プリフォーム)されている。積層体Pを構成する補強繊維材12A,12Bには、予めバインダ(例えば、粉末状の接着剤)が付与されており、そのバインダの作用で、積層体Pが所定形状に保たれている。尚、成形面40Aに積層体Pを押し付ける等、成形面40Aを利用して積層体Pを賦形してもよい。 In the mold closing step, as shown in FIG. 5, the lower mold 40 of the molding apparatus 20 in the mold open state is composed of a core material 11 and a pair of reinforcing fiber materials 12A and 12B which are laminated on the front and back surfaces of the core material 11, respectively. The laminate P is set. The laminate P is placed on the molding surface 40A of the lower mold 40 in a state where the core material 11 smaller than the reinforcing fiber materials 12A and 12B is arranged inside the reinforcing fiber materials 12A and 12B. The peripheral edges of the reinforcing fiber materials 12A and 12B are overlapped with each other without the core material 11. The laminate P is set on the molding surface 40A of the lower mold 40 in a state of following the shape of the molding surface 40A (a state in which the peripheral edge portion is raised). The laminate P is previously molded (preformed) into a shape that follows the shape of the molding surface 40A. A binder (for example, a powdery adhesive) is previously applied to the reinforcing fiber materials 12A and 12B constituting the laminated body P, and the laminated body P is kept in a predetermined shape by the action of the binder. The laminated body P may be shaped by using the molded surface 40A, such as pressing the laminated body P against the molded surface 40A.

図6に示すように、積層体Pを下型40の成形面40A上にセットした後、上型30を下型40に対して近接させる。そして、図7に示すように、上型30を下型40及び積層体Pに当接させて、成形型21を型閉じ状態にする。成形型21が型閉じされると、下型40の成形面40Aと、上型30の成形面30Aとで囲まれた空間がキャビティCとなる。型閉じされた成形型21のキャビティCには、積層体Pが収容されている。 As shown in FIG. 6, after the laminated body P is set on the molding surface 40A of the lower mold 40, the upper mold 30 is brought close to the lower mold 40. Then, as shown in FIG. 7, the upper mold 30 is brought into contact with the lower mold 40 and the laminate P to bring the molding mold 21 into a mold closed state. When the molding die 21 is closed, the space surrounded by the molding surface 40A of the lower mold 40 and the molding surface 30A of the upper mold 30 becomes the cavity C. The laminated body P is housed in the cavity C of the molded mold 21 that is closed.

樹脂供給工程では、成形型21を型閉じすることで、キャビティCを気密状態に保つ。その後、樹脂供給装置22が、主剤と硬化剤とからなる未硬化の樹脂Rをノズル23を介してスプルー32に供給する。スプルー32に供給された未硬化の樹脂Rは、ランナー31,41及びゲート42を流通してキャビティCに供給される。 In the resin supply step, the cavity C is kept in an airtight state by closing the molding die 21. After that, the resin supply device 22 supplies the uncured resin R composed of the main agent and the curing agent to the sprue 32 via the nozzle 23. The uncured resin R supplied to the sprue 32 passes through the runners 31, 41 and the gate 42 and is supplied to the cavity C.

ランナー31,41においては、阻害部25,26,27が、未硬化の樹脂Rの流れの方向を変更することで、その流れを阻害する。具体的には、縦第1通路部41CをX方向に流動する未硬化の樹脂Rが上下通路部25に到達すると、未硬化の樹脂Rの流れがX方向からZ方向に変更され、上型30側に上昇する。上下通路部25にて上昇した未硬化の樹脂Rは、横第1通路部31C(図3及び図4参照)に向かうことで、その流れがZ方向からY方向に変更される。横第1通路部31Cを流動する未硬化の樹脂Rは、縦第2通路部31D及び横第2通路部31Eを通ることで、隔部43を平面視反時計回りに迂回する。 In the runners 31, 41, the inhibiting portions 25, 26, 27 inhibit the flow of the uncured resin R by changing the flow direction. Specifically, when the uncured resin R flowing in the vertical first passage portion 41C in the X direction reaches the upper and lower passage portions 25, the flow of the uncured resin R is changed from the X direction to the Z direction, and the upper mold is used. It rises to the 30 side. The flow of the uncured resin R that has risen in the upper and lower passage portions 25 is changed from the Z direction to the Y direction by heading toward the lateral first passage portion 31C (see FIGS. 3 and 4). The uncured resin R flowing through the horizontal first passage portion 31C bypasses the partition portion 43 counterclockwise in a plan view by passing through the vertical second passage portion 31D and the horizontal second passage portion 31E.

横第2通路部31EをY方向に流動する未硬化の樹脂Rが上下通路部26に到達すると、未硬化の樹脂Rの流れがY方向からZ方向に変更され、下型40側に下降する。上下通路部26にて下降した未硬化の樹脂Rは、縦第3通路部41Dに向かうことで、その流れがZ方向からX方向に変更される。そして、未硬化の樹脂Rは、ゲート42を通り、キャビティCに流動する。 When the uncured resin R flowing in the horizontal second passage portion 31E in the Y direction reaches the upper and lower passage portions 26, the flow of the uncured resin R is changed from the Y direction to the Z direction and descends to the lower mold 40 side. .. The flow of the uncured resin R lowered in the upper and lower passage portions 26 is changed from the Z direction to the X direction by heading toward the vertical third passage portion 41D. Then, the uncured resin R passes through the gate 42 and flows into the cavity C.

図8に示すように、キャビティCに供給された未硬化の樹脂Rは、補強繊維材12の内部を含浸したり、補強繊維材12の表面に沿って流動したりすることで、キャビティCの隅々まで供給される。キャビティCに未硬化の樹脂Rが充満した後に、キャビティCの圧力を所定時間一定の値で保持する(保圧する)。これにより、未硬化の樹脂R内に存在する小さな気泡が膨張及び集合して、硬化後の樹脂の表面に、視認可能な大きさの気泡が発生してしまうことを抑制することができる。そして、キャビティCを保圧した状態で、成形型21を所定温度に昇温し、キャビティCを加熱することで、未硬化の樹脂Rを硬化させる。未硬化の樹脂Rの硬化後、上型30を上昇させ、型開き状態にする。そして、図9に示すように、成形物を下型40から取り外すことで、基材10を得る。 As shown in FIG. 8, the uncured resin R supplied to the cavity C impregnates the inside of the reinforcing fiber material 12 or flows along the surface of the reinforcing fiber material 12 to form the cavity C. It is supplied to every corner. After the cavity C is filled with the uncured resin R, the pressure in the cavity C is maintained (held) at a constant value for a predetermined time. As a result, it is possible to prevent small bubbles existing in the uncured resin R from expanding and gathering to generate visible bubbles on the surface of the cured resin. Then, while the cavity C is held in pressure, the molding die 21 is heated to a predetermined temperature and the cavity C is heated to cure the uncured resin R. After the uncured resin R is cured, the upper mold 30 is raised to open the mold. Then, as shown in FIG. 9, the base material 10 is obtained by removing the molded product from the lower mold 40.

続いて、本実施形態の効果について説明する。本実施形態では、上型30と上型30に対向する位置に配された下型40とからなる成形型21と、型閉じ状態において上型30と下型40とで囲まれたキャビティCに未硬化の樹脂を供給する樹脂供給装置22と、を備える成形装置20において、成形型21は、上型30及び下型40に設けられるランナー31,41であって、キャビティCと樹脂供給装置22とを繋いで未硬化の樹脂を通すランナー31,41を備え、ランナー31,41は、未硬化の樹脂の流れを阻害する阻害部25,26,27を備える成形装置20を示した。 Subsequently, the effect of this embodiment will be described. In the present embodiment, the molding die 21 including the upper die 30 and the lower die 40 arranged at a position facing the upper die 30 and the cavity C surrounded by the upper die 30 and the lower die 40 in the mold closed state. In the molding device 20 including the resin supply device 22 for supplying the uncured resin, the molding mold 21 is the runners 31 and 41 provided in the upper mold 30 and the lower mold 40, and the cavity C and the resin supply device 22. The molding apparatus 20 is provided with runners 31 and 41 for passing the uncured resin through the uncured resin, and the runners 31 and 41 are provided with blocking portions 25, 26 and 27 that obstruct the flow of the uncured resin.

このような成形装置20によると、樹脂供給装置22から未硬化の樹脂を供給してランナー31,41に通すときに、阻害部25,26,27によって未硬化の樹脂の流れを阻害することで、未硬化の樹脂をランナー31,41において撹拌させることができる。これにより、例えば、未硬化の樹脂が主剤と硬化剤とからなるものである場合、これらをランナー31,41の阻害部25,26,27によって互いに衝突させて混合させることができる。 According to such a molding apparatus 20, when the uncured resin is supplied from the resin supply apparatus 22 and passed through the runners 31 and 41, the blocking portions 25, 26 and 27 obstruct the flow of the uncured resin. , The uncured resin can be agitated in the runners 31 and 41. Thereby, for example, when the uncured resin is composed of the main agent and the curing agent, these can be mixed by colliding with each other by the inhibitory portions 25, 26 and 27 of the runners 31 and 41.

また、ランナー31,41は、上型30に設けられる上型通路部31と、下型40に設けられ、上型通路部31と平面視重ならない位置に設けられる下型通路部41と、上型30および下型40に設けられ、上型通路部31と下型通路部41とを繋ぐ上下通路部25,26と、を備え、上下通路部25,26は、阻害部25,26,27の一つである。 Further, the runners 31 and 41 are provided on the upper mold passage portion 31 provided in the upper mold 30 and the lower mold passage portion 41 provided in the lower mold 40 at a position not overlapping with the upper mold passage portion 31 in a plan view. The upper and lower passage portions 25, 26 provided in the mold 30 and the lower mold 40 and connecting the upper mold passage portion 31 and the lower mold passage portion 41 are provided, and the upper and lower passage portions 25, 26 are obstructed portions 25, 26, 27. one of.

このような成形装置20によると、樹脂供給装置22から供給される未硬化の樹脂が上下通路部25,26を通ることで、当該未硬化の樹脂が、上型通路部31から下型通路部41へ、又は下型通路部41から上型通路部31へ、流動することができる。そして、未硬化の樹脂の流れが上下方向に変更されるとともに、互いに平面視重ならない位置に設けられる上型通路部31と下型通路部41とを未硬化の樹脂が流動することで、当該未硬化の樹脂が好適に撹拌される。 According to such a molding apparatus 20, the uncured resin supplied from the resin supply apparatus 22 passes through the upper and lower passage portions 25 and 26, so that the uncured resin is transferred from the upper mold passage portion 31 to the lower mold passage portion 31. It can flow to 41, or from the lower passage portion 41 to the upper passage portion 31. Then, the flow of the uncured resin is changed in the vertical direction, and the uncured resin flows through the upper mold passage portion 31 and the lower mold passage portion 41 provided at positions where they do not overlap each other in a plan view. The uncured resin is preferably stirred.

また、ランナー31は、上型30において、未硬化の樹脂が通る距離が最短となる経路から曲がる形で迂回する迂回部27を備え、迂回部27は、阻害部25,26,27の一つである。 Further, the runner 31 includes a detour portion 27 that detours in the upper mold 30 in a curved manner from the path that the uncured resin passes through at the shortest distance, and the detour portion 27 is one of the obstructing portions 25, 26, 27. Is.

このような成形装置20によると、樹脂供給装置22から供給される未硬化の樹脂が、最短経路から曲がる形の迂回部27を通ることで、迂回部27の内側を流れる未硬化の樹脂と、迂回部27の外側を流れる未硬化の樹脂とで、例えば流速の差が生じることで、当該未硬化の樹脂を撹拌することができる。 According to such a molding apparatus 20, the uncured resin supplied from the resin supply apparatus 22 passes through the detour portion 27 which is curved from the shortest path, so that the uncured resin flows inside the detour portion 27. The uncured resin can be agitated by, for example, a difference in flow velocity between the uncured resin flowing outside the bypass portion 27 and the uncured resin.

また、本実施形態では、コア材11と、コア材11の表裏面にそれぞれ重ねられる一対の補強繊維材12と、を備える積層体Pに、未硬化の樹脂を含浸させた後、未硬化の樹脂を硬化させてなる基材10を、上記に記載の成形装置20で製造する基材10の製造方法であって、キャビティCに積層体Pが収容される形で上型30と下型40とを型閉じする型閉じ工程と、積層体Pが収容されたキャビティCに、樹脂供給装置22から未硬化の樹脂を供給する樹脂供給工程と、を含み、樹脂供給工程では、ランナー31,41に未硬化の樹脂を通し、当該未硬化の樹脂の流れを阻害部25,26,27によって阻害することを示した。 Further, in the present embodiment, the laminate P including the core material 11 and the pair of reinforcing fiber materials 12 to be laminated on the front and back surfaces of the core material 11 is impregnated with the uncured resin and then uncured. A method for producing a base material 10 in which the base material 10 obtained by curing a resin is manufactured by the molding apparatus 20 described above, wherein the upper mold 30 and the lower mold 40 are accommodated in a cavity C. In the resin supply step, the runners 31 and 41 include a mold closing step of closing the mold and a resin supply step of supplying the uncured resin from the resin supply device 22 to the cavity C in which the laminated body P is housed. It was shown that the uncured resin was passed through and the flow of the uncured resin was inhibited by the inhibiting portions 25, 26 and 27.

このような基材10の製造方法によると、樹脂供給装置22から供給された未硬化の樹脂の流れを阻害部25,26,27によって阻害することで、未硬化の樹脂をランナー31,41において撹拌させることができる。これにより、積層体Pに未硬化の樹脂をムラなく含浸させ、硬化させることができ、基材10の品質を向上させることができる。 According to the method for producing the base material 10, the uncured resin is transferred to the runners 31 and 41 by inhibiting the flow of the uncured resin supplied from the resin supply device 22 by the blocking portions 25, 26 and 27. It can be agitated. As a result, the laminate P can be evenly impregnated with the uncured resin and cured, and the quality of the base material 10 can be improved.

<実施形態2>
次に、本発明の実施形態2を図10によって説明する。本実施形態では、実施形態1とは下型通路部の構成が異なる成形装置及び基材の製造方法を例示する。なお、本実施形態では、上記実施形態と同じ部位には、同一の符号を用い、構造、作用、製造工程及び効果について重複する説明は省略する。
<Embodiment 2>
Next, Embodiment 2 of the present invention will be described with reference to FIG. In the present embodiment, a molding apparatus and a method for manufacturing a base material having a structure of a lower mold passage portion different from that of the first embodiment are illustrated. In the present embodiment, the same reference numerals are used for the same parts as those in the above embodiment, and duplicate description of the structure, action, manufacturing process and effect will be omitted.

下型240において、下型通路部241は、X方向に延在し、上下通路部26とゲート42とを繋ぐ縦第3通路部241Dを備える。縦第3通路部241Dは、X方向における中央部において、幅方向(Y方向)内側に突出した2つの凸部(阻害部)244を備える。縦第3通路部241Dは、2つの凸部244を備えることで、樹脂の流路の幅が途中で狭くなるようにくびれた形をなしている。 In the lower mold 240, the lower mold passage portion 241 extends in the X direction and includes a vertical third passage portion 241D that connects the upper and lower passage portions 26 and the gate 42. The vertical third passage portion 241D includes two convex portions (inhibiting portions) 244 protruding inward in the width direction (Y direction) at the central portion in the X direction. The vertical third passage portion 241D is provided with two convex portions 244, and thus has a constricted shape so that the width of the resin flow path is narrowed in the middle.

樹脂供給装置から供給された未硬化の樹脂(図7参照)は、上下通路部26にて下降し、縦第3通路部241Dに向かうことで、その流れがZ方向からX方向に変更される。縦第3通路部241Dにおいては、2つの凸部244によって未硬化の樹脂の流れに渦や乱流等が生じ、未硬化の樹脂が撹拌される。その後、未硬化の樹脂はゲート42を通りキャビティCに流動する。 The uncured resin supplied from the resin supply device (see FIG. 7) descends in the upper and lower passages 26 and heads toward the vertical third passage 241D, so that the flow is changed from the Z direction to the X direction. .. In the vertical third passage portion 241D, the two convex portions 244 generate vortices, turbulent flows, and the like in the flow of the uncured resin, and the uncured resin is agitated. After that, the uncured resin flows through the gate 42 into the cavity C.

<実施形態3>
次に、本発明の実施形態3を図11によって説明する。本実施形態では、上記実施形態とは下型通路部の構成が異なる成形装置及び基材の製造方法を例示する。なお、本実施形態では、上記実施形態と同じ部位には、同一の符号を用い、構造、作用、製造工程及び効果について重複する説明は省略する。
<Embodiment 3>
Next, Embodiment 3 of the present invention will be described with reference to FIG. In this embodiment, a molding apparatus and a method for manufacturing a base material having a structure of a lower mold passage portion different from that of the above embodiment are illustrated. In the present embodiment, the same reference numerals are used for the same parts as those in the above embodiment, and duplicate description of the structure, action, manufacturing process and effect will be omitted.

下型340において、下型通路部341は、X方向に延在し、上下通路部26とゲート42とを繋ぐ縦第3通路部341Dを備える。縦第3通路部341Dは、X方向における中央部において、Z方向を高さ方向として立設した三角柱状の柱状部(阻害部)344を備える。柱状部344は、角をなす角部344Fが樹脂供給装置側(図7参照)、角部344Fに対向する辺をなす辺部344GがキャビティC側となるように配されている。縦第3通路部341Dは、柱状部344を備えることで、樹脂の流路の幅が途中で徐々に狭くなる形をなしている。 In the lower mold 340, the lower mold passage portion 341 extends in the X direction and includes a vertical third passage portion 341D that connects the upper and lower passage portions 26 and the gate 42. The vertical third passage portion 341D includes a triangular columnar columnar portion (inhibiting portion) 344 erected in the Z direction as the height direction in the central portion in the X direction. The columnar portion 344 is arranged so that the corner portion 344F forming the corner is on the resin supply device side (see FIG. 7) and the side portion 344G forming the side facing the corner portion 344F is on the cavity C side. The vertical third passage portion 341D is provided with the columnar portion 344, so that the width of the resin flow path is gradually narrowed in the middle.

樹脂供給装置から供給された未硬化の樹脂(図7参照)は、上下通路部26にて下降し、縦第3通路部341Dに向かうことで、その流れがZ方向からX方向に変更される。縦第3通路部341Dにおいては、柱状部344によって未硬化の樹脂の流れに渦や乱流等が生じ、未硬化の樹脂が撹拌される。その後、未硬化の樹脂はゲート42を通りキャビティCに流動する。 The uncured resin supplied from the resin supply device (see FIG. 7) descends in the upper and lower passages 26 and heads toward the vertical third passage 341D, so that the flow is changed from the Z direction to the X direction. .. In the vertical third passage portion 341D, the columnar portion 344 causes a vortex, a turbulent flow, or the like in the flow of the uncured resin, and the uncured resin is agitated. After that, the uncured resin flows through the gate 42 into the cavity C.

<他の実施形態>
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれ、さらに、下記以外にも要旨を逸脱しない範囲内で種々変更して実施することができる。
<Other embodiments>
The present invention is not limited to the embodiments described by the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not deviating from the gist other than the following. It can be implemented with various changes.

(1)上記実施形態以外にも、通路部の構成は適宜変更可能である。上記実施形態では、通路部は、上型及び下型の両方に設けられるものとしたが、これに限られない。例えば、通路部は、上型のみに設けられていてもよく、下型のみに設けられていてもよい。 (1) In addition to the above embodiment, the configuration of the passage portion can be changed as appropriate. In the above embodiment, the passage portion is provided in both the upper mold and the lower mold, but the present invention is not limited to this. For example, the passage portion may be provided only on the upper mold, or may be provided only on the lower mold.

(2)上記実施形態以外にも、迂回部は適宜変更可能である。上記実施形態では、迂回部は、上型に設けられるものとしたが、これに限られない。例えば、迂回部は、下型に設けられていてもよく、上型及び下型の両方に設けられていてもよい。また、迂回部の形は、コの字状に限らず、曲線状、ジグザグ状等であってもよい。 (2) In addition to the above embodiment, the detour portion can be changed as appropriate. In the above embodiment, the detour portion is provided on the upper mold, but the present invention is not limited to this. For example, the detour portion may be provided on the lower mold, or may be provided on both the upper mold and the lower mold. Further, the shape of the detour portion is not limited to the U-shape, but may be a curved shape, a zigzag shape, or the like.

(3)上記実施形態以外にも、阻害部の数は適宜変更可能である。すなわち、上下通路部や迂回部の数は、特に限定されるものではない。例えば、阻害部は、2つの上下通路部のみからなるものや、1つの迂回部のみからなるものであってもよく、4つ以上の上下通路部や2つ以上の迂回部からなるものであってもよい。 (3) In addition to the above embodiment, the number of inhibitory portions can be changed as appropriate. That is, the number of upper and lower passages and detours is not particularly limited. For example, the obstruction portion may be composed of only two upper and lower passage portions or only one detour portion, or may be composed of four or more upper and lower passage portions or two or more detour portions. You may.

(4)上記実施形態で例示した基材は、車両用シートに提供されるものに限られず、種々の乗物の内装材(ドアトリム、サイドボード、天井材等)において提供されるものであってもよい。例えば、地上の乗物としての列車や遊戯用車両、飛行用乗物としての飛行機やヘリコプター、海上や海中用乗物としての船舶や潜水艇などの乗物の内装材に上記基材を適用することができる。 (4) The base material exemplified in the above embodiment is not limited to that provided for vehicle seats, and may be provided for interior materials (door trims, sideboards, ceiling materials, etc.) of various vehicles. Good. For example, the above base material can be applied to interior materials of vehicles such as trains and amusement vehicles as ground vehicles, airplanes and helicopters as flight vehicles, and ships and submersibles as marine and underwater vehicles.

10…繊維強化樹脂成形品(基材)、11…コア材、12…補強繊維材、20…成形装置、21…成形型、22…樹脂供給装置、25,26…上下通路部(阻害部)、27…迂回部(阻害部)、30…上型、31,41…ランナー(通路部)、40…下型、43…隔部、C…キャビティ、P…積層体 10 ... Fiber reinforced resin molded product (base material), 11 ... Core material, 12 ... Reinforcing fiber material, 20 ... Molding device, 21 ... Molding mold, 22 ... Resin supply device, 25, 26 ... Vertical passage (inhibition part) , 27 ... detour part (inhibition part), 30 ... upper mold, 31, 41 ... runner (passage part), 40 ... lower mold, 43 ... separation part, C ... cavity, P ... laminated body

Claims (4)

上型と前記上型に対向する位置に配された下型とからなる成形型と、
型閉じ状態において前記上型と前記下型とで囲まれたキャビティに未硬化の樹脂を供給する樹脂供給装置と、を備える成形装置において、
前記成形型は、前記上型及び前記下型のうち少なくとも一方に設けられる通路部であって、前記キャビティと前記樹脂供給装置とを繋いで前記未硬化の樹脂を通す通路部を備え、
前記通路部は、前記未硬化の樹脂の流れを阻害する阻害部を備えることを特徴とする成形装置。
A molding mold consisting of an upper mold and a lower mold arranged at a position facing the upper mold,
In a molding apparatus provided with a resin supply device for supplying uncured resin to a cavity surrounded by the upper mold and the lower mold in a mold closed state.
The molding die is a passage portion provided in at least one of the upper mold and the lower mold, and includes a passage portion that connects the cavity and the resin supply device and allows the uncured resin to pass through.
The molding apparatus, wherein the passage portion includes an obstructing portion that obstructs the flow of the uncured resin.
前記通路部は、前記上型に設けられる上型通路部と、前記下型に設けられ、前記上型通路部と平面視重ならない位置に設けられる下型通路部と、前記上型および前記下型に設けられ、前記上型通路部と前記下型通路部とを繋ぐ上下通路部と、を備え、
前記阻害部は、前記上下通路部であることを特徴とする請求項1に記載の成形装置。
The passage portion includes an upper mold passage portion provided on the upper mold, a lower mold passage portion provided on the lower mold and provided at a position not overlapping with the upper mold passage portion in a plan view, and the upper mold and the lower mold. The mold is provided with an upper and lower passage portion that connects the upper mold passage portion and the lower mold passage portion.
The molding apparatus according to claim 1, wherein the blocking portion is the upper and lower passage portions.
前記通路部は、前記上型及び前記下型のうち少なくとも一方において、前記未硬化の樹脂が通る距離が最短となる経路から曲がる形で迂回する迂回部を備え、
前記阻害部は、前記迂回部であることを特徴とする請求項1または請求項2に記載の成形装置。
The passage portion includes, in at least one of the upper mold and the lower mold, a detour portion that detours in a curved manner from the path in which the uncured resin passes the shortest distance.
The molding apparatus according to claim 1 or 2, wherein the obstructing portion is the detour portion.
コア材と、前記コア材の表裏面にそれぞれ重ねられる一対の補強繊維材と、を備える積層体に、前記未硬化の樹脂を含浸させた後、前記未硬化の樹脂を硬化させてなる基材を、請求項1から請求項3のいずれか1項に記載の成形装置で製造する基材の製造方法であって、
前記キャビティに前記積層体が収容される形で前記上型と前記下型とを型閉じする型閉じ工程と、
前記積層体が収容された前記キャビティに、前記樹脂供給装置から前記未硬化の樹脂を供給する樹脂供給工程と、を含み、
前記樹脂供給工程では、前記通路部に前記未硬化の樹脂を通し、当該未硬化の樹脂の流れを前記阻害部によって阻害することを特徴とする基材の製造方法。
A base material formed by impregnating a laminate comprising a core material and a pair of reinforcing fiber materials laminated on the front and back surfaces of the core material with the uncured resin and then curing the uncured resin. Is a method for producing a base material, which is produced by the molding apparatus according to any one of claims 1 to 3.
A mold closing step of closing the upper mold and the lower mold with the laminated body accommodated in the cavity.
A resin supply step of supplying the uncured resin from the resin supply device to the cavity in which the laminate is housed is included.
A method for producing a base material, which comprises passing the uncured resin through the passage portion and obstructing the flow of the uncured resin by the obstructing portion in the resin supply step.
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